JP2017078152A - Heat-resistant synthetic resin microporous film and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-resistant synthetic resin microporous film excellent in both of heat resistance and meltdown resistance and a method of producing the same.SOLUTION: A heat-resistant synthetic resin microporous film has a maximum thermal shrinkage in TMA measurement of 25% or less, has a film fusing temperature in TMA measurement of 190°C or more, and preferably, includes a synthetic resin microporous film and a coating layer formed on at least part of the surface of the synthetic resin microporous film. Since the coating layer includes a polymer of a polymerizable compound, the heat-resistant synthetic resin microporous film has excellent heat resistance and meltdown resistance.SELECTED DRAWING: None

Description

  The present invention relates to a heat-resistant synthetic resin microporous film and a method for producing the same.

  Conventionally, lithium ion secondary batteries have been used as batteries for portable electronic devices. This lithium ion secondary battery is generally configured by disposing a positive electrode, a negative electrode, and a separator in an electrolytic solution. The positive electrode is formed by applying lithium cobalt oxide or lithium manganate to the surface of the aluminum foil. The negative electrode is formed by applying carbon to the surface of the copper foil. And the separator is arrange | positioned so that a positive electrode and a negative electrode may be partitioned off, and the electrical short circuit between electrodes is prevented.

  When the lithium ion secondary battery is charged, lithium ions are released from the positive electrode and move into the negative electrode. On the other hand, when the lithium ion secondary battery is discharged, lithium ions are released from the negative electrode and move into the positive electrode. Therefore, the separator is required to have ion permeability such as lithium ions.

  As the separator, a synthetic resin microporous film is used because it is excellent in insulation and cost. The synthetic resin microporous film contains a synthetic resin such as a propylene resin.

  And the synthetic resin microporous film is manufactured by extending | stretching a synthetic resin film. The synthetic resin microporous film produced by the stretching method generates high residual stress due to stretching. Therefore, it has been pointed out that such a synthetic resin microporous film thermally contracts at a high temperature, and as a result, the positive electrode and the negative electrode may be short-circuited. Therefore, it is desired to ensure the safety of the lithium ion secondary battery by improving the heat resistance of the synthetic resin microporous film.

  Patent Document 1 discloses a synthetic resin microporous film processed by electron beam irradiation and having a thermomechanical analysis (TMA) value at 100 ° C. of 0% to −1% as a separator for a lithium ion secondary battery. ing.

JP 2003-22793 A

  However, the heat resistance of the synthetic resin microporous film is insufficient only by the treatment by electron beam irradiation, and when the inside of the battery becomes high temperature, the synthetic resin microporous film melts by heat and penetrates into the electrode, Short circuit between the positive electrode and the negative electrode cannot be prevented, and the safety of the lithium ion secondary battery may be lowered. Therefore, there is a need for a separator that is excellent in heat resistance and that is not easily melted even at an abnormally high temperature and has excellent melt-down resistance.

  Then, this invention provides the heat resistant synthetic resin microporous film excellent in heat resistance and meltdown resistance, and its manufacturing method.

The heat-resistant synthetic resin microporous film of the present invention is
The maximum heat shrinkage rate in TMA measurement is 25% or less, and the film fusing temperature in TMA measurement is 190 ° C. or more.

In addition, the method for producing the heat-resistant synthetic resin microporous film of the present invention,
An irradiation step of irradiating the synthetic resin microporous film with active energy rays;
A heating step of heat-treating the synthetic resin microporous film irradiated with the active energy ray,
It is characterized by having.

  ADVANTAGE OF THE INVENTION According to this invention, the heat resistant synthetic resin microporous film excellent in heat resistance and meltdown resistance, and its manufacturing method can be provided.

(Heat-resistant synthetic resin microporous film)
The heat-resistant synthetic resin microporous film of the present invention is characterized in that the maximum heat shrinkage rate in TMA measurement is 25% or less and the film fusing temperature in TMA measurement is 190 ° C. or higher.

  The maximum heat shrinkage rate of the heat-resistant synthetic resin microporous film in TMA measurement is 25% or less, preferably 5 to 20%, more preferably 8 to 13%. The heat-resistant synthetic resin microporous film has excellent heat resistance because thermal shrinkage at high temperatures is reduced by the coating layer. Therefore, the maximum heat shrinkage rate of the heat resistant synthetic resin microporous film can be 25% or less.

In addition, the measurement of the maximum heat shrinkage rate in TMA measurement of a heat resistant synthetic resin microporous film can be performed as follows. First, a flat rectangular test piece (width 3 mm × length 30 mm) is obtained by cutting the heat-resistant synthetic resin microporous film. At this time, it adjusts so that the length direction of a heat-resistant synthetic resin microporous film may turn into a measurement direction. The both ends of the length direction of a test piece are gripped with a gripper, and attached to a TMA measuring apparatus (for example, trade name “TMA-SS6000” manufactured by Seiko Instruments Inc.). At this time, the distance between the gripping tools is set to 10 mm, and the gripping tools can be moved along with the thermal contraction of the test piece. The test piece was heated in air from 25 ° C. to 250 ° C. at a heating rate of 5 ° C./min with a tension of 19.6 mN (2 gf) applied to the test piece in the length direction. Measure the distance L (mm) between the gripping tools, calculate the thermal contraction rate based on the following formula, and set the maximum value as the maximum thermal contraction rate.
Thermal contraction rate (%) = 100 × (10−L) / 10

  Although the air permeability of a heat resistant synthetic resin microporous film is not specifically limited, 50-600 sec / 100 mL is preferable and 100-300 sec / 100 mL is more preferable. As described above, in the heat-resistant synthetic resin microporous film, the clogging of the micropores of the synthetic resin microporous film is reduced by the formation of the coating layer, and the decrease in air permeability due to the formation of the coating layer is reduced. Therefore, the air permeability of the heat resistant synthetic resin microporous film can be within the above range. A heat-resistant synthetic resin microporous film having an air permeability within the above range is excellent in ion permeability.

  In addition, as a measuring method of the air permeability of a heat resistant synthetic resin microporous film, the same method as the measuring method mentioned later of the air permeability of a synthetic resin microporous film is used.

  The surface opening ratio of the heat-resistant synthetic resin microporous film is not particularly limited, but is preferably 30 to 55%, more preferably 30 to 50%. As described above, the clogging of the micropores of the synthetic resin microporous film is reduced by the formation of the coating layer, whereby the surface opening ratio of the heat resistant synthetic resin microporous film can be within the above range. A heat-resistant synthetic resin microporous film having a surface opening ratio within the above range is excellent in both mechanical strength and ion permeability.

  As a method for measuring the surface opening ratio of the synthetic resin microporous film, the same method as the measuring method described later for the surface opening ratio of the synthetic resin microporous film is used.

  In the heat-resistant synthetic resin microporous film, the film fusing temperature in TMA measurement is 190 ° C or higher, preferably 200 ° C or higher, more preferably 210 ° C or higher, and particularly preferably 210 to 250 ° C. When the film fusing temperature is within the above range, the shape stability at high temperature is improved, and the film does not melt even under abnormal heat generation in the battery, and a heat-resistant synthetic resin microporous film that suppresses short circuit between the electrodes is obtained. be able to.

In the heat resistant synthetic resin microporous film, the film fusing temperature in the TMA measurement is measured as follows. First, a flat rectangular test piece (width 3 mm × length 30 mm) is obtained by cutting the heat-resistant synthetic resin microporous film. At this time, the length direction (extrusion direction) of the heat-resistant synthetic resin microporous film and the length direction of the test piece are made parallel. The both ends of the length direction of a test piece are gripped with a gripper, and attached to a TMA measuring apparatus (for example, trade name “TMA-SS6000” manufactured by Seiko Instruments Inc.). At this time, the distance between the gripping tools is set to 10 mm, and the gripping tools can be moved along with the thermal contraction of the test piece. And each temperature which heats a test piece from 25 degreeC to 250 degreeC with the temperature increase rate of 5 degree-C / min in the state which added the tension | tensile_strength of 19.6mN (2gf) to the length direction to the test piece. The distance L (mm) between the gripping tools is measured and the heat shrinkage rate is calculated based on the following formula.
Thermal contraction rate (%) = 100 × (10−L) / 10

  When the test piece contracts as the temperature rises, the thermal contraction rate increases. However, when the test piece is heated above a certain temperature, the test piece starts to soften and expands due to tension. That is, the thermal contraction rate decreases and eventually blows and the TMA measurement ends. When the thermal contraction rate exceeds 0% at the end of the TMA measurement, the temperature at the end of the TMA measurement is set as the film fusing temperature. On the other hand, when the shrinkage rate is 0% or less at the time when the TMA measurement is completed, the temperature at which the shrinkage rate becomes 0% is set as the film fusing temperature.

The radical amount of the heat-resistant synthetic resin microporous film is preferably 2.0 × 10 ¹⁶ spins / 100 mg or less, more preferably 2.0 × 10 ^{14 to} 2.0 × 10 ¹⁶ spins / 100 mg, and 2.0 × 10 6. ^{14 to} 2.0 × 10 ¹⁵ spins / 100 mg is particularly preferred. By reducing the amount of radicals, it is possible to reduce a decrease in mechanical strength over time of the heat-resistant synthetic resin microporous film due to residual radicals.

The radical amount of the heat-resistant synthetic resin microporous film is a value measured by an electron spin resonance (ESR) method. The radical amount of the heat-resistant synthetic resin microporous film can be measured as follows. First, 80 mg of heat-resistant synthetic resin microporous film was used as a sample, and this sample was put into a quartz sample tube (length 10 cm, diameter 4 mm) for X-band measurement. Then, the sample is measured at room temperature using an electron spin resonance (ESR) measuring apparatus (for example, trade name “FA-200” manufactured by JEOL Ltd.). Confirm the microwave resonance dip of the sample and observe the signal. The measurement is performed under the following conditions.
Output: 1.01mW
Center magnetic field: 336mT
Sweep width: ± 10mT
Sweep time: 4min
Modulation width (FMW): 0.6mT
Gain: × 20
Time constant: 0.03sec
Total number of times: 1 Number of data points: 8192
Mn2 + digital marker setting: 850
Standard substance: TEMPOL (4-hydroxy-2,2,6,6-tetramethyl piperidine-1-oxyl)
<Data processing conditions>
Baseline correction: Correction by Mn2 + 3rd and 4th signal 2 Signal wave height ratio: Mn2 + (3rd signal) overlaps with the sample signal, so the reference Mn2 + (4th signal) wave height is used, and the sample signal Displayed as a ratio of wave height to wave height. After obtaining the signal wave height ratio (S) of the sample, the signal wave height ratio (corrected signal wave height ratio) when the sample weight is set to 100 mg is obtained from the following formula (1) from the weight (Ws) of the sample measured in advance. .
Correction signal wave height ratio = S × (100 / Ws) (1)
Spin number: TEMPOL is used as a standard substance, and the spin number of the third signal of Mn2 + when the Mn2 + digital marker is set to 850 is obtained. The number of spins of the sample is calculated from the relative intensity of the third signal of Mn2 + to the signal of the measurement sample. The number of spins per 100 mg of sample is also shown.
g value: The g value is calculated by a calculation program from the g value of the third and fourth signals of Mn2 +, the magnetic field interval, and the central magnetic field of the sample signal.

  The gel fraction of the heat-resistant synthetic resin microporous film is not particularly limited, but is preferably 40% by mass or more, more preferably 60% by mass or more, and particularly preferably 80% by mass or more. When the gel fraction of the coating layer is 40% by mass or more, the heat resistance and meltdown resistance of the heat resistant synthetic resin microporous film are improved.

The gel fraction of the heat resistant synthetic resin microporous film is measured as follows. A heat-resistant synthetic resin microporous film is cut into a strip having a width of 5 mm to produce about 0.1 g of a test piece. After measuring the initial weight W ₀ of the test piece, the test piece is put into a test tube. Xylene is put in the test tube, and the test tube is immersed in an oil bath heated to 130 ° C. for 16 hours. A 200 mesh wire mesh is prepared, and the weight W ₁ of the wire mesh is measured. The hot xylene solution in the test tube is filtered through a 200 mesh wire net to separate the gel. After the gel content on the wire mesh is dried under reduced pressure at 80 ° C. for 8 hours, the total weight W ₂ of the wire mesh and the gel content is measured. The gel fraction of the heat resistant synthetic resin microporous film is calculated based on the following formula.
Gel fraction (%) = 100 × (W ₂ −W ₁ ) / W ₀

In addition, according to this invention, even if it does not contain an inorganic particle, the heat resistance of the heat resistant synthetic resin microporous film and meltdown resistance can be improved. Therefore, it is preferable that the heat resistant synthetic resin microporous film does not contain inorganic particles. However, the heat-resistant synthetic resin microporous film may contain inorganic particles on one side or both sides as necessary. Examples of the inorganic particles include inorganic particles generally used for heat resistant porous layers. Examples of the material constituting the inorganic particles include Al ₂ O ₃ , SiO ₂ , TiO ₂ , and MgO.

  The heat-resistant synthetic resin microporous film of the present invention includes a synthetic resin microporous film.

(Synthetic resin microporous film)
The synthetic resin microporous film can be used without particular limitation as long as it is a microporous film used as a separator in a conventional secondary battery such as a lithium ion secondary battery. As the synthetic resin microporous film, an olefin resin microporous film is preferable.

  The olefin resin microporous film contains an olefin resin. As the olefin resin, ethylene resin and propylene resin are preferable, and propylene resin is more preferable.

  Examples of the propylene-based resin include homopolypropylene and copolymers of propylene and other olefins. When a synthetic resin microporous film is produced by the stretching method, homopolypropylene is preferable. Propylene-type resin may be used independently, or 2 or more types may be used together. The copolymer of propylene and another olefin may be a block copolymer or a random copolymer. The content of the propylene component in the propylene-based resin is preferably 50% by mass or more, and more preferably 80% by mass or more.

  Examples of the olefin copolymerized with propylene include α such as ethylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-nonene and 1-decene. -An olefin etc. are mentioned, Ethylene is preferable.

  Examples of the ethylene-based resin include ultra-low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra high density polyethylene, and an ethylene-propylene copolymer. Further, the ethylene-based resin microporous film may contain other olefin-based resin as long as it contains an ethylene-based resin. The content of the ethylene component in the ethylene-based resin is preferably more than 50% by mass, more preferably 80% by mass or more.

  The weight average molecular weight of the olefin resin is preferably 30,000 to 7 million, more preferably 50,000 to 3 million. The weight average molecular weight of the propylene-based resin is preferably 250,000 to 500,000, and more preferably 280,000 to 480,000. The weight average molecular weight of the ethylene-based resin is preferably 30,000 to 250,000, and more preferably 50,000 to 200,000. As the ethylene-based resin, ultrahigh molecular weight polyethylene having a weight average molecular weight of 300,000 to 7,000,000, more preferably 400,000 to 3,000,000 can be used. According to the olefin resin having a weight average molecular weight within the above range, it is possible to provide an olefin resin microporous film having excellent film-forming stability and having uniform micropores.

  The molecular weight distribution (weight average molecular weight Mw / number average molecular weight Mn) of the olefin resin is preferably 5.0 to 30, and more preferably 7.5 to 25. The molecular weight distribution of the propylene-based resin is preferably 7.5 to 12, and more preferably 8 to 11. The molecular weight distribution of the ethylene-based resin is preferably 5.0 to 30, and more preferably 8.0 to 25. According to the olefin resin having a molecular weight distribution within the above range, an olefin resin microporous film having a high surface opening ratio can be provided.

  Here, the weight average molecular weight and number average molecular weight of the olefin resin are polystyrene-converted values measured by a GPC (gel permeation chromatography) method. Specifically, 6 to 7 mg of an olefin resin is sampled, the collected olefin resin is supplied to a test tube, and 0.05% by mass of BHT (dibutylhydroxytoluene) is contained in the test tube. A diluted solution is prepared by adding a DCB (orthodichlorobenzene) solution and diluting the olefin-based resin concentration to 1 mg / mL.

  The dilution liquid is shaken for 1 hour at 145 ° C. and a rotation speed of 25 rpm using a dissolution filter, and the olefin resin is dissolved in the o-DCB solution to obtain a measurement sample. Using this measurement sample, the weight average molecular weight and number average molecular weight of the olefin resin can be measured by the GPC method.

The weight average molecular weight and the number average molecular weight in the olefin resin can be measured, for example, with the following measuring apparatus and measurement conditions.
Product name "HLC-8121GPC / HT" manufactured by TOSOH
Measurement conditions Column: TSKgelGMHHR-H (20) HT x 3
TSKguardcolumn-HHR (30) HT x 1
Mobile phase: o-DCB 1.0 mL / min
Sample concentration: 1 mg / mL
Detector: Bryce refractometer
Reference material: Polystyrene (Molecular weight: 500-8420000, manufactured by TOSOH)
Elution conditions: 145 ° C
SEC temperature: 145 ° C

  130-170 degreeC is preferable and, as for melting | fusing point of olefin resin, 133-165 degreeC is more preferable. 160-170 degreeC is preferable and, as for melting | fusing point of propylene-type resin, 160-165 degreeC is more preferable. The melting point of the ethylene resin is preferably 130 to 140 ° C, more preferably 133 to 139 ° C. According to the olefin resin having a melting point within the above range, it is possible to provide an olefin resin microporous film excellent in film forming stability and meltdown resistance.

  In the present invention, the melting point of the olefin-based resin can be measured using a differential scanning calorimeter (for example, a device name “DSC220C”, manufactured by Seiko Instruments Inc.) according to the following procedure. First, 10 mg of an olefin resin is heated from 25 ° C. to 250 ° C. at a heating rate of 10 ° C./min, and held at 250 ° C. for 3 minutes. Next, the olefin-based resin is cooled from 250 ° C. to 25 ° C. at a temperature decrease rate of 10 ° C./min, and held at 25 ° C. for 3 minutes. Subsequently, the olefin resin is reheated from 25 ° C. to 250 ° C. at a rate of temperature increase of 10 ° C./min, and the temperature at the top of the endothermic peak in this reheating step is defined as the melting point of the olefin resin.

  The synthetic resin microporous film includes micropores. It is preferable that the micropore part penetrates in the film thickness direction, and this can impart excellent air permeability to the heat resistant synthetic resin microporous film. Such a heat-resistant synthetic resin microporous film can transmit ions such as lithium ions in the thickness direction.

  The air permeability of the synthetic resin microporous film is preferably 50 to 600 sec / 100 mL, and more preferably 100 to 300 sec / 100 mL. According to the synthetic resin microporous film having an air permeability within the above range, a heat-resistant synthetic resin microporous film having excellent ion permeability can be provided.

  The air permeability of the synthetic resin microporous film was measured at 10 points at 10 cm intervals in the length direction of the synthetic resin microporous film in accordance with JIS P8117 in an atmosphere of a temperature of 23 ° C. and a relative humidity of 65%. The value obtained by calculating the arithmetic mean value is used.

  The surface opening ratio of the synthetic resin microporous film is preferably 25 to 55%, more preferably 30 to 50%. According to the synthetic resin microporous film having a surface opening ratio within the above range, a heat-resistant synthetic resin microporous film having excellent ion permeability can be provided.

  The surface opening ratio of the synthetic resin microporous film can be measured in the following manner. First, in an arbitrary portion of the surface of the synthetic resin microporous film, a measurement portion having a plane rectangular shape of 9.6 μm in length and 12.8 μm in width is determined, and this measurement portion is photographed at a magnification of 10,000 times.

Next, each micropore formed in the measurement part is surrounded by a rectangle whose long side or short side is parallel to the length direction (stretching direction) of the synthetic resin microporous film. The rectangle is adjusted so that both the long side and the short side have the minimum dimension. The rectangular area is defined as the opening area of each microhole. The total opening area S (μm ² ) of the micropores is calculated by summing the opening areas of the micropores. This is the total opening area S of the minute hole ([mu] m ²⁾ of 122.88μm ² (9.6μm × 12.8μm) surface porosity values multiplied by 100 and divided by the (%). In addition, about the micropore part which exists across the measurement part and the part which is not a measurement part, only the part which exists in a measurement part among micropores is set as a measuring object.

  5-100 micrometers is preferable and, as for the thickness of a synthetic resin microporous film, 10-50 micrometers is more preferable.

  In the present invention, the thickness of the synthetic resin microporous film can be measured according to the following procedure. That is, arbitrary 10 places of a synthetic resin microporous film are measured using a dial gauge, and the arithmetic mean value is defined as the thickness of the synthetic resin microporous film.

  As a synthetic resin microporous film, the olefin resin microporous film manufactured by the extending | stretching method is more preferable. The olefin-based resin microporous film produced by the stretching method is particularly susceptible to thermal shrinkage at high temperatures due to residual strain generated by stretching. On the other hand, according to the coating layer of the present invention, the thermal shrinkage of the olefin-based resin microporous film can be reduced, and therefore the effects of the present invention can be particularly exhibited.

As a method for producing an olefin resin microporous film by a stretching method, specifically,
(1) A process of obtaining an olefin resin film by extruding an olefin resin, a process of generating and growing lamella crystals in the olefin resin film, and stretching the olefin resin film to separate the lamella crystals. And a step of obtaining an olefin resin microporous film in which micropores are formed;
(2) A step of obtaining an olefinic resin film by extruding an olefinic resin composition containing an olefinic resin and a filler, and an olefinic resin by uniaxially stretching or biaxially stretching the olefinic resin film. And (3) an olefinic resin and an extractable material (for example, filler or plastic), and a step of obtaining an olefinic resin microporous film in which micropores are formed by peeling the interface with the filler; A step of obtaining an olefin-based resin film by extruding an olefin-based resin composition containing an agent and the like, a step of forming a micropore by extracting an extractable material from the olefin-based resin film with a solvent, By stretching the olefin resin film before forming the micropores or after forming the micropores, And a method having a step of obtaining a fine resin-based microporous film.

  Among these, the method (1) is preferable because an olefin-based resin microporous film in which a large number of micropores are uniformly formed is obtained.

(Coating layer)
The heat-resistant synthetic resin microporous film of the present invention preferably has a coating layer formed on at least a part of the surface of the synthetic resin microporous film. This coating layer contains a polymer of a polymerizable compound. This polymer preferably contains a polymer of a polymerizable compound having two or more radically polymerizable functional groups in one molecule. The coating layer containing such a polymer has high hardness and moderate elasticity and elongation. Therefore, a heat-resistant synthetic resin microporous film excellent in both heat resistance and melt-down resistance can be provided by using a coating layer containing the polymer.

  The coating layer may be formed on at least a part of the surface of the synthetic resin microporous film, but is preferably formed on the entire surface of the synthetic resin microporous film, and the surface of the synthetic resin microporous film, and It is more preferable to form also on the wall surface of the micropore part which continues from the surface of a synthetic resin microporous film.

  Further, by using a polymerizable compound, a coating layer can be formed on the surface of the synthetic resin microporous film so as not to block the micropores of the synthetic resin microporous film. Thereby, it is possible to provide a heat-resistant synthetic resin microporous film in which excellent air permeability and ion permeability are ensured.

  The polymerizable compound has two or more radically polymerizable functional groups in one molecule. The radical polymerizable functional group is a functional group containing a radical polymerizable unsaturated bond that can be radically polymerized by irradiation with active energy rays. Although it does not restrict | limit especially as a radically polymerizable functional group, For example, a (meth) acryloyl group, a vinyl group, etc. are mentioned, A (meth) acryloyl group is preferable.

  As the polymerizable compound, a polyfunctional acrylic monomer having two or more radical polymerizable functional groups in one molecule, a vinyl oligomer having two or more radical polymerizable functional groups in one molecule, Modified polyfunctional (meth) acrylate having two or more (meth) acryloyl groups, dendritic polymer having two or more (meth) acryloyl groups, and urethane (meth) acrylate oligomer having two or more (meth) acryloyl groups Is mentioned.

  In the present invention, (meth) acrylate means acrylate or methacrylate. (Meth) acryloyl means acryloyl or methacryloyl. Moreover, (meth) acrylic acid means acrylic acid or methacrylic acid.

  The polyfunctional acrylic monomer only needs to have two or more radical polymerizable functional groups in one molecule, but it has three or more functional groups having three or more radical polymerizable functional groups in one molecule. A polyfunctional acrylic monomer is preferable, and a trifunctional to hexafunctional polyfunctional acrylic monomer having 3 to 6 radical polymerizable functional groups in one molecule is more preferable.

As a polyfunctional acrylic monomer,
1,9-nonanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, tripropylene glycol di (meth) acrylate, 2-hydroxy-3 -Acryloyloxypropyl di (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, 1,10-decandiol di (meth) acrylate, neopentyl glycol Bifunctional polyfunctional acrylic monomers such as di (meth) acrylate, glycerin di (meth) acrylate, and tricyclodecane dimethanol di (meth) acrylate;
Trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated isocyanuric acid tri (meth) acrylate, ε-caprolactone modified tris- (2-acryloxyethyl) isocyanurate, and ethoxylated glycerol tri (meth) ) A trifunctional or higher functional acrylic monomer such as acrylate;
Tetrafunctional polyfunctional acrylic monomers such as pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and ethoxylated pentaerythritol tetra (meth) acrylate;
Pentafunctional polyfunctional acrylic monomers such as dipentaerythritol penta (meth) acrylate;
6-functional polyfunctional acrylic monomers such as dipentaerythritol hexa (meth) acrylate;
Etc. can be illustrated.

  It does not specifically limit as a vinyl-type oligomer, For example, a polybutadiene-type oligomer etc. can be illustrated. The polybutadiene oligomer means an oligomer having a butadiene skeleton. Examples of the polybutadiene oligomer include a polymer containing a butadiene component as a monomer component. Examples of the monomer component of the polybutadiene oligomer include a 1,2-butadiene component and a 1,3-butadiene component. Of these, a 1,2-butadiene component is preferred.

  The vinyl oligomer may have a hydrogen atom at both ends of the main chain, and the terminal hydrogen atom is substituted with a hydroxyalkyl group such as a hydroxy group, a carboxy group, a cyano group, or a hydroxyethyl group. It may be a thing. Moreover, as a vinyl-type oligomer, you may have radically polymerizable functional groups, such as an epoxy group, a (meth) acryloyl group, and a vinyl group, in the side chain or terminal of a molecular chain.

As polybutadiene oligomer,
Polybutadiene oligomers such as poly (1,2-butadiene) oligomers and poly (1,3-butadiene) oligomers;
An epoxidized polybutadiene oligomer in which an epoxy group is introduced into the molecule by epoxidizing at least a part of the carbon-carbon double bond contained in the butadiene skeleton;
A polybutadiene (meth) acrylate oligomer having a butadiene skeleton and having a (meth) acryloyl group at a side chain or a terminal of the main chain;
Etc. can be illustrated.

  A commercially available product can be used as the polybutadiene oligomer. Examples of the poly (1,2-butadiene) oligomer include “B-1000”, “B-2000”, and “B-3000” manufactured by Nippon Soda Co., Ltd. Examples of the polybutadiene oligomer having a hydroxyl group at both ends of the main chain include trade names “G-1000”, “G-2000”, and “G-3000” manufactured by Nippon Soda Co., Ltd. As the epoxidized polybutadiene oligomer, trade names “JP-100” and “JP-200” manufactured by Nippon Soda Co., Ltd. can be exemplified. Examples of the polybutadiene (meth) acrylate oligomer include “TE-2000”, “EA-3000”, and “EMA-3000” manufactured by Nippon Soda Co., Ltd.

  The polyfunctional (meth) acrylate modified product only needs to have two or more radical polymerizable functional groups in one molecule, but has three or more radical polymerizable functional groups in one molecule. A polyfunctional (meth) acrylate modified product having a functionality or higher is preferable, and a trifunctional to 6 functional polyfunctional (meth) acrylate modified product having 3 to 6 radical polymerizable functional groups in one molecule is more preferable. preferable.

  Preferred examples of the modified polyfunctional (meth) acrylate include an alkylene oxide modified product of a polyfunctional (meth) acrylate and a caprolactone modified product of a polyfunctional (meth) acrylate.

  The alkylene oxide modified product of polyfunctional (meth) acrylate is preferably obtained by esterifying an adduct of polyhydric alcohol and alkylene oxide with (meth) acrylic acid. The polyfunctional (meth) acrylate-modified caprolactone is preferably obtained by esterifying an adduct of a polyhydric alcohol and caprolactone with (meth) acrylic acid.

  Examples of the polyhydric alcohol in the alkylene oxide modified product and the caprolactone modified product include trimethylolpropane, glycerol, pentaerythritol, ditrimethylolpropane, and tris (2-hydroxyethyl) isocyanuric acid.

  Examples of the alkylene oxide in the modified alkylene oxide include ethylene oxide, propylene oxide, isopropylene oxide, and butylene oxide.

  Examples of caprolactone in the modified caprolactone include ε-caprolactone, δ-caprolactone, and γ-caprolactone.

  In the alkylene oxide modified product of polyfunctional (meth) acrylate, the average addition mole number of alkylene oxide may be 1 mol or more per radical polymerizable functional group. The average added mole number of alkylene oxide is preferably 1 mol or more and 4 mol or less, more preferably 1 mol or more and 3 mol or less per radical polymerizable functional group.

As a trifunctional polyfunctional (meth) acrylate modified product,
Trimethylolpropane tri (meth) acrylate modified with ethylene oxide, trimethylolpropane tri (meth) acrylate modified with propylene oxide, trimethylolpropane tri (meth) acrylate modified with isopropylene oxide, trimethylolpropane tri (meth) Of butylene oxide modified by acrylate, and trimethylolpropane tri (meth) acrylate modified by alkylene oxide such as ethylene oxide / propylene oxide modified by trimethylolpropane tri (meth) acrylate, and trimethylolpropane tri (meth) acrylate Modified caprolactone;
Glyceryl tri (meth) acrylate modified with ethylene oxide, glyceryl tri (meth) acrylate modified with propylene oxide, glyceryl tri (meth) acrylate modified with isopropylene oxide, glyceryl tri (meth) acrylate modified with butylene oxide, and An alkylene oxide modified product of glyceryl tri (meth) acrylate such as ethylene oxide / propylene oxide modified product of glyceryl tri (meth) acrylate, and a caprolactone modified product of glyceryl tri (meth) acrylate;
Pentaerythritol tri (meth) acrylate modified with ethylene oxide, pentaerythritol tri (meth) acrylate modified with propylene oxide, pentaerythritol tri (meth) acrylate modified with propylene oxide, pentaerythritol tri (meth) acrylate butylene oxide A modified product, and an alkylene oxide modified product of pentaerythritol tri (meth) acrylate, such as an ethylene oxide / propylene oxide modified product of pentaerythritol tri (meth) acrylate, and a caprolactone modified product of pentaerythritol tri (meth) acrylate;
Tris- (2-acryloxyethyl) isocyanurate modified with ethylene oxide, Tris- (2-acryloxyethyl) isocyanurate modified with propylene oxide, Tris- (2-acryloxyethyl) isocyanurate modified with isopropylene oxide , Tris- (2-acryloxyethyl) isocyanurate modified with butylene oxide, and tris- (2-acryloxyethyl) isocyanurate modified with ethylene oxide / propylene oxide, tris- (2-acryloxyethyl) The alkylene oxide modified product of isocyanurate, the caprolactone modified product of tris- (2-acryloxyethyl) isocyanurate, and the like can be mentioned.

As a tetrafunctional polyfunctional (meth) acrylate modified product,
Pentaerythritol tetra (meth) acrylate modified with ethylene oxide, pentaerythritol tetra (meth) acrylate modified with propylene oxide, pentaerythritol tetra (meth) acrylate modified with propylene oxide, pentaerythritol tetra (meth) acrylate butylene oxide Modified products, and alkylene oxide modified products of pentaerythritol tetra (meth) acrylates such as ethylene oxide / propylene oxide modified products of pentaerythritol tetra (meth) acrylate, and caprolactone modified products of pentaerythritol tetra (meth) acrylate; and ditrimethylol Propane tetra (meth) acrylate modified with ethylene oxide, ditrimethylolprop Of propylene oxide of tetra- (meth) acrylate, isopropylene oxide of ditrimethylolpropane tetra (meth) acrylate, butylene oxide of ditrimethylolpropane tetra (meth) acrylate, and ditrimethylolpropane tetra (meth) acrylate Examples thereof include alkylene oxide modified products of ditrimethylolpropane tetra (meth) acrylate such as ethylene oxide / propylene oxide modified products, and caprolactone modified products of ditrimethylolpropane tetra (meth) acrylate.

As a polyfunctional (meth) acrylate modified product of 5 or more functions, specifically,
Dipentaerythritol poly (meth) acrylate modified with ethylene oxide, dipentaerythritol poly (meth) acrylate modified with propylene oxide, dipentaerythritol poly (meth) acrylate modified with propylene oxide, dipentaerythritol poly (meth) Butylene oxide modified products of acrylate, and alkylene oxide modified products of dipentaerythritol poly (meth) acrylate such as ethylene oxide / propylene oxide modified product of dipentaerythritol poly (meth) acrylate, and dipentaerythritol poly (meth) acrylate And caprolactone-modified products.

  Commercially available products can also be used as the modified polyfunctional (meth) acrylate.

  Examples of the modified ethylene oxide of trimethylolpropane tri (meth) acrylate include trade names “SR454”, “SR499” and “SR502” manufactured by Sartomer, trade names “Biscoat # 360” manufactured by Osaka Organic Chemical Co., Ltd., and Miwon. Examples include trade names “Miramer M3130”, “Miramer M3160”, and “Miramer M3190” manufactured by the company. Examples of the modified propylene oxide of trimethylolpropane tri (meth) acrylate include trade names “SR492” and “CD501” manufactured by Sartomer, and “Miramer M360” manufactured by Miwon. As an isopropylene oxide modified product of trimethylolpropane tri (meth) acrylate, trade name “TPA-330” manufactured by Nippon Kayaku Co., Ltd. may be mentioned.

  Examples of the ethylene oxide modified product of glyceryl tri (meth) acrylate include trade names “A-GYL-3E” and “A-GYL-9E” manufactured by Shin-Nakamura Chemical Co., Ltd. Examples of the propylene oxide-modified product of glyceryl tri (meth) acrylate include trade names “SR9020” and “CD9021” manufactured by Sartomer. Examples of the glyceryl tri (meth) acrylate modified isopropylene oxide include trade name “GPO-303” manufactured by Nippon Kayaku Co., Ltd.

  Examples of the caprolactone-modified product of tris- (2-acryloxyethyl) isocyanurate include trade names “A-9300-1CL” and “A-9300-3CL” manufactured by Shin-Nakamura Chemical Co., Ltd.

  Examples of the modified ethylene oxide of pentaerythritol tetra (meth) acrylate include “Miramer M4004” manufactured by Miwon. Examples of the ethylene oxide modified product of ditrimethylolpropane tetra (meth) acrylate include trade name “AD-TMP-4E” manufactured by Shin-Nakamura Chemical Co., Ltd.

  Examples of the ethylene oxide-modified product of dipentaerythritol polyacrylate include “A-DPH-12E” manufactured by Shin-Nakamura Chemical Co., Ltd. As an isopropylene oxide modified product of dipentaerythritol polyacrylate, trade name “A-DPH-6P” manufactured by Shin-Nakamura Chemical Co., Ltd. may be mentioned.

  The dendritic polymer having two or more (meth) acryloyl groups in one molecule means a spherical macromolecule in which branch molecules having (meth) acryloyl groups are radially assembled.

  The dendritic polymer having a (meth) acryloyl group includes a dendrimer having two or more (meth) acryloyl groups in one molecule, and a hyperbranched polymer having two or more (meth) acryloyl groups in one molecule. Can be mentioned.

  A dendrimer means a spherical polymer obtained by integrating (meth) acrylates in a spherical shape with (meth) acrylates as branch molecules.

  The dendrimer may have two or more (meth) acryloyl groups in one molecule, but a trifunctional or more functional dendrimer having three or more (meth) acryloyl groups in one molecule is preferable. A polyfunctional dendrimer having 5 to 20 (meth) acryloyl groups in one molecule is more preferable.

  The weight average molecular weight of the dendrimer is preferably 1000 to 50000, more preferably 1500 to 25000. By setting the weight average molecular weight of the dendrimer within the above range, the bond density in the dendrimer molecule and the bond density between the dendrimer molecules become “dense” and “coarse”. A film layer having excellent elasticity and elongation can be formed.

  In addition, let the weight average molecular weight of a dendrimer be the value converted with polystyrene using the gel permeation chromatography (GPC).

  As a dendritic polymer having two or more (meth) acryloyl groups in one molecule, a commercially available product can be used. As dendrimers having two or more (meth) acryloyl groups in one molecule, trade names “CN2302”, “CN2303” and “CN2304” manufactured by Sartomer, and trade names “V1000” and “SUBARU” manufactured by Osaka Organic Chemical Co., Ltd. -501 "," SIRIUS-501 ", and trade name" A-HBR-5 "manufactured by Shin-Nakamura Chemical Co., Ltd.

  A hyperbranched polymer having two or more (meth) acryloyl groups in one molecule is an ABx type polyfunctional monomer (where A and B are functional groups that react with each other, and the number X of B is 2 or more). It means a spherical polymer obtained by modifying the surface and the inside of a hyperbranched structure having an irregular branch structure obtained by polymerization with a (meth) acryloyl group.

  The urethane (meth) acrylate oligomer having a (meth) acryloyl group has two or more (meth) acryloyl groups in one molecule.

  The urethane acrylate oligomer is obtained, for example, by reacting a polyisocyanate compound, a (meth) acrylate having a hydroxyl group or an isocyanate group, and a polyol compound.

  Examples of the urethane acrylate oligomer include (1) a urethane acrylate obtained by further reacting a hydroxyl group-containing (meth) acrylate with a terminal isocyanate group-containing urethane prepolymer obtained by reacting a polyol compound and a polyisocyanate compound. And (2) urethane acrylate oligomers obtained by further reacting a (meth) acrylate having an isocyanate group with a terminal hydroxyl group-containing urethane prepolymer obtained by reacting a polyol compound and a polyisocyanate compound.

  Examples of the polyisocyanate compound include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, and diphenylmethane-4,4 ′. -Diisocyanate etc. are mentioned.

  Examples of the (meth) acrylate having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and Examples include polyethylene glycol (meth) acrylate. Examples of the (meth) acrylate having an isocyanate group include methacryloyloxyethyl isocyanate.

  As a polyol compound, polyol compounds, such as an alkylene type, a polycarbonate type, a polyester type, or a polyether type, are mentioned, for example. Specific examples include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polycarbonate diol, polyester diol, and polyether diol.

  Commercially available products can also be used as urethane (meth) acrylate oligomers having two or more (meth) acryloyl groups in one molecule. For example, product name “UA-122P” manufactured by Shin-Nakamura Chemical Co., Ltd., product name “UF-8001G” manufactured by Kyoeisha Chemical Co., Ltd., product names “CN977”, “CN999”, “CN963”, “CN985” manufactured by Sartomer Company. , “CN970”, “CN133”, “CN975” and “CN997”, trade names “IRR214-K” manufactured by Daicel Ornex, and trade names “UX-5000”, “UX-5102D” manufactured by Nippon Kayaku Co., Ltd. -M20 "," UX-5005 ", and" DPHA-40H ". Further, as the polymerizable compound, an aliphatic special oligomer such as a trade name “CN113” manufactured by Sartomer Co., Ltd. may be used.

  In the present invention, among the polymerizable compounds described above, a polyfunctional acrylic monomer is preferable, and trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol. Hexa (meth) acrylate and ditrimethylolpropane tetra (meth) acrylate are preferred. According to these, excellent heat resistance and meltdown resistance can be imparted to the heat resistant synthetic resin microporous film.

  When a polyfunctional acrylic monomer is used as the polymerizable compound, the content of the polyfunctional acrylic monomer in the polymerizable compound is preferably 30% by mass or more, more preferably 80% by mass or more, and particularly preferably 100% by mass. preferable. By using a polymerizable compound containing 30% by mass or more of a polyfunctional acrylic monomer, the resulting heat resistant synthetic resin microporous film has excellent heat resistance and meltdown resistance without reducing air permeability. Can be granted.

  In the present invention, as the polymerizable compound, only one kind of the above-described polymerizable compounds may be used, or two or more kinds of polymerizable compounds may be used in combination.

  The coating layer contains a polymer of the polymerizable compound described above. This polymer is preferably a polymer obtained by polymerizing a polymerizable compound by irradiation with active energy rays. That is, the polymer is preferably a polymer of a polymerizable compound by irradiation with active energy rays. The coating layer containing such a polymer has a high hardness, thereby reducing the heat shrinkage of the heat-resistant synthetic resin microporous film at a high temperature and improving the heat resistance.

  The active energy ray is not particularly limited, and examples thereof include an electron beam, plasma, ultraviolet rays, α rays, β rays, and γ rays. Of these, electron beams and ultraviolet rays are preferable, and electron beams are more preferable.

  It is preferable that a part of the polymer in the coating layer and a part of the synthetic resin in the synthetic resin microporous film are chemically bonded. By using a coating layer containing such a polymer, as described above, heat shrinkage at high temperatures is reduced, heat resistance is reduced, and heat resistance synthetic resin microporous material having excellent meltdown resistance A film can be provided. The chemical bond is not particularly limited, and examples thereof include a covalent bond, an ionic bond, and an intermolecular bond.

  The content of the coating layer in the heat-resistant synthetic resin microporous film is preferably 5 to 80 parts by mass, more preferably 5 to 60 parts by mass, and 10 to 40 parts by mass with respect to 100 parts by mass of the synthetic resin microporous film. Is particularly preferred. By setting the content of the coating layer within the above range, the coating layer can be uniformly formed without blocking the micropores on the surface of the synthetic resin microporous film. Thereby, the heat resistant synthetic resin microporous film with improved heat resistance and meltdown resistance can be provided without reducing air permeability.

  The thickness of the coating layer is not particularly limited, but is preferably 1 to 100 nm, and more preferably 5 to 50 nm. By setting the thickness of the coating layer within the above range, the coating layer can be formed uniformly without blocking the micropores on the surface of the synthetic resin microporous film. Thereby, the heat resistant synthetic resin microporous film with improved heat resistance and meltdown resistance can be provided without reducing air permeability.

(Method for producing heat-resistant synthetic resin microporous film)
The method for producing the heat-resistant synthetic resin microporous film of the present invention comprises the following steps:
An application step of applying a polymerizable compound to at least a part of the surface of the synthetic resin microporous film;
An irradiation step of irradiating the synthetic resin microporous film coated with the polymerizable compound with active energy rays;
A heating step of heat-treating the synthetic resin microporous film irradiated with the active energy ray;
It is characterized by having.

(Coating process)
In the method of the present invention, first, an application step of applying a polymerizable compound having two or more radical polymerizable functional groups in one molecule to at least a part of the surface of the synthetic resin microporous film is performed.

  By applying the polymerizable compound to the surface of the synthetic resin microporous film, the polymerizable compound can be attached to the surface of the synthetic resin microporous film. At this time, the polymerizable compound may be directly applied to the surface of the synthetic resin microporous film. However, it is preferable to disperse or dissolve the polymerizable compound in a solvent to obtain a coating solution, and to apply this coating solution to the surface of the synthetic resin microporous film. By using the polymerizable compound as the coating liquid in this way, the polymerizable compound can be uniformly attached to the surface of the synthetic resin microporous film while reducing the blockage of the micropores. This makes it possible to produce a heat-resistant synthetic resin microporous film having a uniform coating layer and improved heat resistance and melt-down resistance without reducing air permeability.

  Furthermore, the coating liquid can smoothly flow on the wall surface of the microporous part in the synthetic resin microporous film, thereby not only the surface of the synthetic resin microporous film but also the open end of the microporous part continuous to this surface. A coating layer can also be formed on the wall surface of the part. Thereby, a membrane | film | coat layer can be firmly integrated with the surface of a synthetic resin microporous film.

  In addition, since the polymerizable compound having a radical polymerizable functional group having two or more functional groups is excellent in compatibility with the synthetic resin microporous film, the polymerizable compound can be used without blocking the micropores in the synthetic resin microporous film. Can be applied. Thereby, the membrane | film | coat layer which has the through-hole penetrated in the thickness direction can be formed in the location corresponding to the micropore part of a synthetic resin microporous film. Therefore, according to such a coating layer, it is possible to provide a heat-resistant synthetic resin microporous film having improved heat resistance and meltdown resistance without reducing air permeability.

  The solvent used in the coating solution is not particularly limited as long as it can dissolve or disperse the polymerizable compound. For example, alcohols such as methanol, ethanol, propanol, isopropyl alcohol, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc. Examples include ketones, ethers such as tetrahydrofuran and dioxane, ethyl acetate, and chloroform. Of these, ethyl acetate, ethanol, methanol, and acetone are preferable. These solvents can be removed smoothly after the coating solution is applied to the surface of the synthetic resin microporous film. Furthermore, the solvent has low reactivity with an electrolyte solution constituting a secondary battery such as a lithium ion secondary battery, and is excellent in safety.

  3-20 mass% is preferable and, as for content of the polymeric compound in a coating liquid, 5-15 mass% is more preferable. By setting the content of the polymerizable compound within the above range, a coating layer can be uniformly formed on the surface of the synthetic resin microporous film without clogging the micropores, and thus without reducing the air permeability. A heat-resistant synthetic resin microporous film having improved heat resistance and melt-down resistance can be produced.

  The method for applying the polymerizable compound to the surface of the synthetic resin microporous film is not particularly limited. For example, (1) a method of applying the polymerizable compound to the surface of the synthetic resin microporous film; A method in which a synthetic resin microporous film is immersed and a polymerizable compound is applied to the surface of the synthetic resin microporous film; (3) A coating solution is prepared by dissolving or dispersing the polymerizable compound in a solvent. A method of heating the synthetic resin microporous film after coating on the surface of the synthetic resin microporous film and removing the solvent; and (4) preparing a coating solution by dissolving or dispersing the polymerizable compound in the solvent. A method of immersing the synthetic resin microporous film in the coating solution and applying the coating solution in the synthetic resin microporous film is followed by heating the synthetic resin microporous film to remove the solvent. Of these, the methods (3) and (4) are preferred. According to these methods, the polymerizable compound can be uniformly applied to the surface of the synthetic resin microporous film.

  In the methods (3) and (4) above, the heating temperature of the synthetic resin microporous film for removing the solvent can be set according to the type and boiling point of the solvent used. The heating temperature of the synthetic resin microporous film for removing the solvent is preferably 50 to 140 ° C, more preferably 70 to 130 ° C. By setting the heating temperature within the above range, the applied solvent can be efficiently removed while reducing thermal shrinkage of the synthetic resin microporous film and blockage of the micropores.

  In the methods (3) and (4) above, the heating time of the synthetic resin microporous film for removing the solvent is not particularly limited, and can be set according to the type and boiling point of the solvent used. The heating time of the synthetic resin microporous film for removing the solvent is preferably 0.02 to 60 minutes, more preferably 0.1 to 30 minutes.

  As above-mentioned, a polymeric compound can be made to adhere to a synthetic resin microporous film surface by apply | coating a polymeric compound or a coating liquid to the synthetic resin microporous film surface.

(Irradiation process)
In the method of the present invention, next, an irradiation step of irradiating the synthetic resin microporous film coated with the polymerizable compound with active energy rays is performed. Thereby, the polymerizable compound is polymerized, and the coating layer containing the polymer of the polymerizable compound can be integrally formed on at least a part of the surface of the synthetic resin microporous film, preferably the entire surface.

  By irradiating the active energy ray, a part of the synthetic resin contained in the synthetic resin microporous film may be decomposed, and the meltdown resistance of the synthetic resin microporous film may be lowered. However, according to the coating layer containing the polymer of the polymerizable compound, as described above, the decrease in the meltdown resistance of the synthetic resin microporous film can be compensated for, thereby improving both the heat resistance and the meltdown resistance. It is possible to provide an excellent heat-resistant synthetic resin microporous film.

  When the synthetic resin microporous film contains a propylene-based resin, the irradiation dose of active energy rays for the synthetic resin microporous film is preferably 20 to 100 kGy, more preferably 30 to 80 kGy, and particularly preferably 40 to 70 kGy. Moreover, when a synthetic resin microporous film contains ethylene-type resin, 40-300 kGy is preferable, 60-200 kGy is more preferable, and 80-200 kGy is especially preferable. By setting the irradiation dose of the active energy ray within the above range, the polymerizable compound can be polymerized while reducing the deterioration of the synthetic resin in the synthetic resin microporous film, thereby improving the heat resistance and the meltdown resistance. A heat-resistant synthetic resin microporous film excellent in both can be provided.

  The active energy ray is not particularly limited, and examples thereof include an electron beam, plasma, ultraviolet rays, α rays, β rays, and γ rays. Of these, electron beams and ultraviolet rays are preferable, and electron beams are more preferable.

  When an electron beam is used as the active energy ray, the acceleration voltage of the electron beam with respect to the synthetic resin microporous film is not particularly limited, but is preferably 50 to 300 kV, and more preferably 100 to 250 kV. By setting the acceleration voltage of the electron beam within the above range, the coating layer can be formed while reducing deterioration of the synthetic resin in the synthetic resin microporous film.

When using ultraviolet rays as the active energy ray, the accumulated light quantity of ultraviolet to the synthetic resin microporous film is preferably 1000~5000mJ / cm ^2, more preferably ^{1000~4000mJ / cm 2, 1500~3700mJ / cm} 2 is particularly preferred. In addition, when using an ultraviolet-ray as an active energy ray, it is preferable that the photoinitiator is contained in the said coating liquid. Examples of the photopolymerization initiator include benzophenone, benzyl, methyl-o-benzoylbenzoate, and anthraquinone.

When using a plasma as the active energy rays, plasma energy density to a synthetic resin microporous film is not particularly limited, but is preferably 5~50J / cm ^2, more preferably ^{10~45J / cm 2, 20~45J / cm} 2 Is particularly preferred.

  In the irradiation step, it is preferable to irradiate an active energy ray to the synthetic resin microporous film coated with the polymerizable compound in an atmosphere having an oxygen concentration of 10 ppm or less. The oxygen concentration in the atmosphere in the irradiation step is preferably 10 ppm or less, more preferably 8 to 0 ppm, and particularly preferably 5 to 0 ppm. By carrying out the irradiation step in an atmosphere having such an oxygen concentration, the oxidation deterioration of the synthetic resin contained in the synthetic resin microporous film can be reduced in the irradiation step, and the crosslinking density of the coating layer can be reduced. Can be high. Thereby, the heat resistance and meltdown resistance of a heat resistant synthetic resin microporous film can be improved.

  The irradiation step is preferably performed in an inert gas atmosphere. Thereby, the oxygen concentration in the atmosphere in the irradiation process can be easily adjusted. The inert gas is not particularly limited, and examples thereof include nitrogen, helium, neon, argon, krypton, xenon, radon, and a mixed gas thereof.

(Heating process)
Next, in the method of the present invention, it is preferable to carry out a heating process in which the synthetic resin microporous film irradiated with active energy rays is subjected to a heat treatment in an atmosphere having an oxygen concentration of 10 ppm or less. According to the heating step, the polymerization of the polymerizable compound can be promoted based on the residual radical remaining in the irradiation step described above, and the remaining radical can be deactivated also by the acceleration of the polymerization of the polymerizable compound. it can. Thereby, the heat resistance and meltdown resistance of the heat resistant synthetic resin microporous film can be improved.

  In the heating step, the synthetic resin microporous film irradiated with active energy rays is preferably heat-treated at 90 to 150 ° C, more preferably 110 to 150 ° C, and particularly preferably 130 to 150 ° C. By setting the heat treatment temperature of the synthetic resin microporous film within the above range, the polymerization of the polymerizable compound based on the residual radical remaining in the irradiation step is promoted, and the synthetic resin in the synthetic resin microporous film is deteriorated. Remaining radicals can also be deactivated by promoting the polymerization of the polymerizable compound while reducing the above.

  In the heating step, the heat treatment time of the synthetic resin microporous film irradiated with active energy rays is preferably 2 minutes to 3 hours, and more preferably 20 minutes to 3 hours. By setting the heat treatment time of the synthetic resin microporous film within the above range, the polymerization of the polymerizable compound based on the residual radical remaining in the irradiation step is promoted, and the synthetic resin in the synthetic resin microporous film is deteriorated. Remaining radicals can also be deactivated by promoting the polymerization of the polymerizable compound while reducing the above.

  In the heating step, it is preferable to heat-treat the synthetic resin microporous film irradiated with active energy rays in an atmosphere having an oxygen concentration of 10 ppm or less. Although the oxygen concentration in the atmosphere in a heating process is 10 ppm or less, 8-0 ppm is preferable and 5-0 ppm is more preferable. By carrying out the heating step in such an oxygen concentration atmosphere, the oxidation degradation of the synthetic resin contained in the synthetic resin microporous film can be reduced in the heating step, and the crosslinking density of the coating layer can be reduced. Can be high. Thereby, the heat resistance and meltdown resistance of a heat resistant synthetic resin microporous film can be improved.

  The heating step is preferably performed in an inert gas atmosphere. Thereby, the oxygen concentration in the atmosphere in the heating process can be easily adjusted. The inert gas is not particularly limited, and examples thereof include nitrogen, helium, neon, argon, krypton, xenon, radon, and a mixed gas thereof.

(Second manufacturing method of heat-resistant synthetic resin microporous film)
Another method for producing a heat-resistant synthetic resin microporous film is a method for producing a heat-resistant synthetic resin microporous film without forming a coating layer on the synthetic resin microporous film. In particular,
The second production method of the heat-resistant synthetic resin microporous film of the present invention includes the following steps:
An irradiation step of irradiating the synthetic resin microporous film with active energy rays;
A heating step of heat-treating the synthetic resin microporous film irradiated with the active energy ray;
It is characterized by having.

(Irradiation process)
In the method of the present invention, an irradiation step of irradiating the synthetic resin microporous film with active energy rays is performed. Thereby, especially when the synthetic resin microporous film contains an ethylene-based resin, the crosslink density of the synthetic resin microporous film increases, thereby improving the heat resistance and meltdown resistance of the heat resistant synthetic resin microporous film. be able to.

  When the synthetic resin microporous film contains an ethylene-based resin, the irradiation dose of active energy rays on the synthetic resin microporous film is preferably 150 kGy or more, more preferably 150 to 300 kGy, and particularly preferably 200 to 300 kGy. By setting the irradiation dose of active energy rays within the above range, a heat-resistant synthetic resin microporous film excellent in both heat resistance and meltdown resistance can be provided.

  The active energy ray is not particularly limited, and examples thereof include an electron beam, plasma, ultraviolet rays, α rays, β rays, and γ rays. Of these, electron beams and ultraviolet rays are preferable, and electron beams are more preferable.

  When an electron beam is used as the active energy ray, the acceleration voltage of the electron beam with respect to the synthetic resin microporous film is not particularly limited, but is preferably 50 to 300 kV, and more preferably 100 to 250 kV. By setting the acceleration voltage of the electron beam within the above range, a heat-resistant synthetic resin microporous film excellent in both heat resistance and meltdown resistance can be provided.

  In the irradiation step, the oxygen concentration is not particularly limited, but it is preferable to irradiate the synthetic resin microporous film with active energy rays in an atmosphere of 10 ppm or less. The oxygen concentration in the atmosphere in the irradiation step is preferably 10 ppm or less, more preferably 8 to 0 ppm, and particularly preferably 5 to 0 ppm. By performing the irradiation step in an atmosphere having such an oxygen concentration, oxidative degradation of the synthetic resin contained in the synthetic resin microporous film can be reduced in the irradiation step. Thereby, the heat resistance and meltdown resistance of a heat resistant synthetic resin microporous film can be improved.

  The irradiation step is preferably performed in an inert gas atmosphere. Thereby, the oxygen concentration in the atmosphere in the irradiation process can be easily adjusted. The inert gas is not particularly limited, and examples thereof include nitrogen, helium, neon, argon, krypton, xenon, radon, and a mixed gas thereof.

(Heating process)
Next, in the method of the present invention, a heating step of heat-treating the synthetic resin microporous film irradiated with active energy rays is performed. According to the heating step, residual radicals remaining in the irradiation step described above can be deactivated. Thereby, the heat resistance and meltdown resistance of the heat resistant synthetic resin microporous film can be improved.

  In the heating step, the synthetic resin microporous film irradiated with active energy rays is preferably heat-treated at 90 to 150 ° C, more preferably 110 to 150 ° C, and particularly preferably 130 to 150 ° C. By setting the heat treatment temperature of the synthetic resin microporous film within the above range, the remaining radicals can be deactivated while reducing the deterioration of the synthetic resin in the synthetic resin microporous film.

  In the heating step, the heat treatment time of the synthetic resin microporous film irradiated with active energy rays is preferably 2 minutes to 3 hours, and more preferably 20 minutes to 3 hours. By setting the heat treatment time of the synthetic resin microporous film within the above range, the remaining radicals can be deactivated.

  In the heating step, the oxygen concentration is not particularly limited, but it is preferable to heat-treat the synthetic resin microporous film irradiated with active energy rays in an atmosphere of 10 ppm or less. The oxygen concentration in the atmosphere in the heating step is preferably 10 ppm or less, more preferably 8 to 0 ppm, and particularly preferably 5 to 0 ppm. By carrying out the heating step in such an oxygen concentration atmosphere, it is possible to reduce the oxidative deterioration of the synthetic resin contained in the synthetic resin microporous film in the heating step. Thereby, the heat resistance and meltdown resistance of a heat resistant synthetic resin microporous film can be improved.

  The heating step is preferably performed in an inert gas atmosphere. Thereby, the oxygen concentration in the atmosphere in the heating process can be easily adjusted. The inert gas is not particularly limited, and examples thereof include nitrogen, helium, neon, argon, krypton, xenon, radon, and a mixed gas thereof.

  The heat-resistant synthetic resin microporous film of the present invention is suitably used as a separator for non-aqueous electrolyte secondary batteries. Examples of the non-aqueous electrolyte secondary battery include a lithium ion secondary battery. Since the heat-resistant synthetic resin microporous film of the present invention is excellent in heat resistance and meltdown resistance, by using such a heat-resistant synthetic resin microporous film, the inside of the battery is, for example, 100 to 150 ° C, In particular, even when the temperature becomes 130 to 150 ° C., electrical short circuit between the electrodes due to shrinkage and melting of the heat-resistant synthetic resin microporous film can be reduced.

  The non-aqueous electrolyte secondary battery is not particularly limited as long as it includes the heat-resistant synthetic resin microporous film of the present invention as a separator, and includes a positive electrode, a negative electrode, a separator including a heat-resistant synthetic resin microporous film, Contains water electrolyte. The heat-resistant synthetic resin microporous film is disposed between the positive electrode and the negative electrode, thereby preventing an electrical short circuit between the electrodes. In addition, the nonaqueous electrolytic solution is filled at least in the micropores of the heat-resistant synthetic resin microporous film, so that lithium ions can move between the electrodes during charging and discharging.

  The positive electrode is not particularly limited, but preferably includes a positive electrode current collector and a positive electrode active material layer formed on at least one surface of the positive electrode current collector. The positive electrode active material layer preferably includes a positive electrode active material and voids formed between the positive electrode active materials. When the positive electrode active material layer includes voids, the voids are also filled with the non-aqueous electrolyte. The positive electrode active material is a material capable of occluding and releasing lithium ions, and examples of the positive electrode active material include lithium cobaltate and lithium manganate. Examples of the current collector used for the positive electrode include aluminum foil, nickel foil, and stainless steel foil. The positive electrode active material layer may further contain a binder, a conductive auxiliary agent, and the like.

  The negative electrode is not particularly limited, but preferably includes a negative electrode current collector and a negative electrode active material layer formed on at least one surface of the negative electrode current collector. The negative electrode active material layer preferably includes a negative electrode active material and voids formed between the negative electrode active materials. When the negative electrode active material layer contains voids, the voids are also filled with the non-aqueous electrolyte. The negative electrode active material is a material capable of occluding and releasing lithium ions. Examples of the negative electrode active material include graphite, carbon black, acetylene black, and ketjen black. Examples of the current collector used for the negative electrode include copper foil, nickel foil, and stainless steel foil. The negative electrode active material layer may further contain a binder, a conductive auxiliary agent, and the like.

A nonaqueous electrolytic solution is an electrolytic solution in which an electrolyte salt is dissolved in a solvent that does not contain water. Examples of the non-aqueous electrolyte used in the lithium ion secondary battery include a non-aqueous electrolyte obtained by dissolving a lithium salt in an aprotic organic solvent. Examples of the aprotic organic solvent include a mixed solvent of a cyclic carbonate such as propylene carbonate and ethylene carbonate and a chain carbonate such as diethyl carbonate, methyl ethyl carbonate, and dimethyl carbonate. Examples of the lithium salt include LiPF ₆ , LiBF ₄ , LiClO ₄ , and LiN (SO ₂ CF ₃ ) ₂ .

  Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.

[Example 1]
(Extrusion process)
Homopolypropylene (PP, weight average molecular weight 413000, molecular weight distribution 9.3, melting point 163 ° C., heat of fusion 96 mJ / mg) is supplied to the extruder, melt kneaded at a resin temperature of 200 ° C., and attached to the tip of the extruder. A homopolypropylene film (thickness: 30 μm) was obtained by extruding into a film from a T-die and cooling until the surface temperature reached 30 ° C. The extrusion rate was 9 kg / hour, the film formation rate was 22 m / min, and the draw ratio was 83.

(Curing process)
The obtained homopolypropylene film was allowed to stand for 24 hours in an oven at 150 ° C. and cured.

(First stretching step)
The homopolypropylene film after curing was cut into strips of 300 mm in the extrusion direction (length direction) and 160 mm in the width direction. This homopolypropylene film was uniaxially stretched only in the extrusion direction at a stretching ratio of 1.20 times at a stretching rate of 50% / min using a uniaxial stretching apparatus so that the surface temperature was 23 ° C.

(Second stretching step)
Subsequently, the homopolypropylene film was uniaxially stretched only in the extrusion direction at a stretch ratio of 2 times at a stretch rate of 42% / min so that the surface temperature was 120 ° C. using a uniaxial stretcher.

(Annealing process)
Thereafter, the homopolypropylene film was allowed to stand for 10 minutes so that its surface temperature was 130 ° C. and no tension was applied to the homopolypropylene film, and the homopolypropylene film was annealed. This obtained the homopolypropylene microporous film (thickness 25 micrometers) which has a micropore part. The shrinkage ratio of the homopolypropylene film during annealing was 20%.

The obtained homopolypropylene microporous film has an air permeability of 110 sec / 100 mL, a surface opening ratio of 40%, a maximum major axis of the opening end of the micropore portion of 600 nm, and an opening end of the micropore portion. The average major axis was 360 nm and the pore density was 30 / μm ² .

(Coating process)
A coating solution containing 90% by mass of ethyl acetate as a solvent and 10% by mass of trimethylolpropane triacrylate (TMPTA, trade name “Light Acrylate TMP-A” manufactured by Kyoei Chemical Co., Ltd.) as a polymerizable compound was prepared. Next, after coating the coating solution on the surface of the homopolypropylene microporous film, the solvent was removed by heating the homopolypropylene microporous film at 80 ° C. for 2 minutes. Thereby, the polymerizable compound was adhered to the entire surface of the homopolypropylene microporous film.

(Irradiation process)
Next, the homopolypropylene microporous film to which the polymerizable compound is adhered is put in a bag made of a polyethylene terephthalate film (thickness 25 μm) in a glove box (“Labmaster 130” manufactured by M Braun) adjusted to an oxygen concentration of 10 ppm or less. The bag opening was hermetically sealed. The oxygen concentration in the sealed bag was 10 ppm or less. The homopolypropylene microporous film contained in the sealed bag was irradiated with an electron beam at an acceleration voltage of 110 kV and an absorbed dose of 50 kGy, to polymerize the polymerizable compound.

(Heating process)
Subsequently, the homopolypropylene microporous film placed in a sealed bag and having a polymer of a polymerizable compound adhered thereto was heated in an oven at 120 ° C. for 1 hour. The oxygen concentration in the sealed bag was 10 ppm or less. As a result, a heat-resistant homopolypropylene microporous film in which a film layer containing a polymer of a polymerizable compound is formed on the surface of the homopolypropylene microporous film and the wall surface of the opening end of the micropores continuous with the surface is obtained. It was.

[Example 2]
A heat-resistant homopolypropylene microporous film was obtained in the same manner as in Example 1 except that dipentaerythritol hexaacrylate (DPHA) was used as the polymerizable compound.

[Example 3]
(Extrusion process)
Homopolyethylene (PE, weight average molecular weight 143000, molecular weight distribution 20.5, melting point 136 ° C., heat of fusion 225 mJ / mg) is supplied to the extruder, melt kneaded at a resin temperature of 200 ° C., and attached to the tip of the extruder. The film was extruded from a T-die into a film and cooled to a surface temperature of 30 ° C. to obtain a homopolyethylene film (thickness 25 μm). The extrusion rate was 6 kg / hour, the film formation rate was 16 m / min, and the draw ratio was 90.

(Curing process)
The obtained homopolyethylene film was allowed to stand for 24 hours in a hot air oven having an atmospheric temperature of 125 ° C. and cured.

(First stretching step)
The homopolyethylene film after curing was cut into strips of 300 mm in the extrusion direction (length direction) and 160 mm in the width direction. This homopolyethylene film was uniaxially stretched only in the extrusion direction at a stretching ratio of 1.20 times at a stretching rate of 50% / min using a uniaxial stretching apparatus so that the surface temperature was 23 ° C.

(Second stretching step)
Subsequently, the homopolyethylene film was uniaxially stretched only in the extrusion direction at a stretching ratio of 2 times at a stretching rate of 42% / min using a uniaxial stretching apparatus so that the surface temperature was 90 ° C.

(Annealing process)
Thereafter, the homopolyethylene film was allowed to stand for 10 minutes so that its surface temperature was 120 ° C. and no tension was applied to the homopolyethylene film, and the homopolyethylene film was annealed. This obtained the homopolyethylene microporous film (thickness 20 micrometers) which has a micropore part. The shrinkage ratio of the homopolyethylene film during annealing was set to 25%.

The obtained homopolyethylene microporous film has an air permeability of 150 sec / 100 mL, a surface opening ratio of 38%, a maximum major axis of the opening end of the micropores of 500 nm, and an opening end of the micropores. The average major axis was 330 nm and the pore density was 35 / μm ² .

  A coating process, an irradiation process, and a heating process were performed in the same manner as in Example 1 except that the absorbed dose of the electron beam was adjusted to 200 kGy in the irradiation process to obtain a heat-resistant homopolyethylene microporous film.

[Example 4]
(Extrusion process)
35 parts by mass of ultrahigh molecular weight polyethylene (weight average molecular weight 500,000, molecular weight distribution 7.8, melting point 135 ° C.) and 65 parts by mass of liquid paraffin are supplied to a twin screw extruder using a side feeder, and the resin temperature is 165 ° C. Melted and kneaded, extruded from a T-die attached to the tip of the extruder into a film, taken up with a cooling roll whose surface temperature was set to 25 ° C., and cooled to obtain a gel sheet (thickness 950 μm) of ultrahigh molecular weight polyethylene It was. The film forming speed was 5 m / min and the draw ratio was 3.

(Stretching process)
The gel sheet of ultrahigh molecular weight polyethylene was cut into a square of 70 mm in the extrusion direction (length direction) and 70 mm in the width direction. The gel-like sheet was simultaneously biaxially stretched so that the surface temperature was 115 ° C. and the stretching ratio was 5 times in the extrusion direction and the width direction using a biaxial stretching apparatus.

(Washing process)
Next, the stretched sheet was fixed to a 20 cm × 20 cm aluminum frame and immersed in a methylene chloride washing bath controlled at 25 ° C. for 3 minutes to remove liquid paraffin. The washed gel sheet was air-dried at room temperature to produce a dry film.

(Annealing process)
Next, the dried film was fixed to a biaxial stretching apparatus and heat-fixed at 115 ° C. for 10 minutes to obtain an ultrahigh molecular weight polyethylene microporous film (thickness 20 μm).

  The obtained ultrahigh molecular weight polyethylene microporous film had an air permeability of 156 sec / 100 mL and a porosity of 49%.

(Coating process)
In the same manner as in Example 1, TMPTA was adhered to the entire surface of the ultrahigh molecular weight polyethylene microporous film.

(Irradiation process)
Next, an ultra-high molecular weight polyethylene microporous film having a polymerizable compound attached thereto was irradiated with an electron beam in the same manner as in Example 1 except that the absorbed dose of the electron beam was adjusted to 200 kGy. The active compound was polymerized.

(Heating process)
A heating step is performed in the same manner as in Example 1, and a coating layer containing a polymer of a polymerizable compound is formed on the surface of the ultrahigh molecular weight polyethylene microporous film and on the wall surface of the open end of the micropore continuous with the surface. A heat-resistant ultra-high molecular weight polyethylene microporous film was obtained.

[Example 5]
A heat resistant ultra high molecular weight polyethylene microporous film was obtained in the same manner as in Example 4 except that dipentaerythritol hexaacrylate (DPHA) was used as the polymerizable compound.

[Example 6]
A heat resistant ultra high molecular weight polyethylene microporous film was obtained in the same manner as in Example 5 except that the irradiation step and the heating step were performed as follows.

(Irradiation process)
An ultra high molecular weight polyethylene microporous film is placed in a bag made of polyethylene terephthalate film (thickness 25 μm) in a glove box (“Labmaster 130” manufactured by M Braun) adjusted to an oxygen concentration of 100 ppm, and the opening of the bag is airtight. Sealed. The oxygen concentration in the sealed bag was 100 ppm. The ultrahigh molecular weight polyethylene microporous film placed in the sealed bag was irradiated with an electron beam at an acceleration voltage of 110 kV and an absorbed dose of 200 kGy to polymerize the polymerizable compound.

(Heating process)
Subsequently, the ultrahigh molecular weight polyethylene microporous film taken out of the bag was heated in an oven at 120 ° C. for 1 hour. At this time, air was circulated in the oven so that the oxygen concentration in the oven was 2.1 × 10 ⁵ ppm. As a result, the heat-resistant ultrahigh molecular weight polyethylene fine film in which a film layer containing a polymer of a polymerizable compound is formed on the surface of the ultrahigh molecular weight polyethylene microporous film and the wall surface of the open end of the micropores continuous with the surface. A porous film was obtained.

[Example 7]
In the same manner as in Example 4, an ultrahigh molecular weight polyethylene microporous film was obtained. The polymerizable compound was not applied to the surface of the ultrahigh molecular weight polyethylene microporous film. Subsequently, an ultrahigh molecular weight polyethylene microporous film not coated with a polymerizable compound was irradiated with an electron beam under the same conditions as in the irradiation step of Example 4. Next, the ultrahigh molecular weight polyethylene microporous film was subjected to a heating step in the same manner as in Example 1 to obtain a heat resistant ultrahigh molecular weight polyethylene microporous film.

[Example 8]
In the same manner as in Example 4, an ultrahigh molecular weight polyethylene microporous film was obtained. The polymerizable compound was not applied to the surface of the ultrahigh molecular weight polyethylene microporous film. Subsequently, an irradiation step and a heating step were performed in the same manner as in Example 6 using an ultrahigh molecular weight polyethylene microporous film not coated with a polymerizable compound, to obtain a heat resistant ultrahigh molecular weight polyethylene microporous film.

[Comparative Example 1]
A heat resistant homopolypropylene microporous film was obtained in the same manner as in Example 1 except that the irradiation step and the heating step were performed as follows.

(Irradiation process)
Homopolypropylene microporous film is put in a bag made of polyethylene terephthalate film (thickness 25 μm) in a glove box (“Labmaster 130” manufactured by M Braun) adjusted to an oxygen concentration of 100 ppm, and the opening of the bag is hermetically sealed. did. The oxygen concentration in the sealed bag was 100 ppm. The homopolypropylene microporous film contained in the sealed bag was irradiated with an electron beam at an acceleration voltage of 110 kV and an absorbed dose of 50 kGy, to polymerize the polymerizable compound.

(Heating process)
Subsequently, the homopolypropylene microporous film taken out from the bag was heated in an oven at 120 ° C. for 1 hour. At this time, air was circulated in the oven so that the oxygen concentration in the oven was 2.1 × 10 ⁵ ppm. As a result, a heat-resistant homopolypropylene microporous film in which a film layer containing a polymer of a polymerizable compound is formed on the surface of the homopolypropylene microporous film and the wall surface of the opening end of the micropores continuous with the surface is obtained. It was.

[Comparative Example 2]
A homopolypropylene microporous film was obtained in the same manner as in Example 1. The surface of the homopolypropylene microporous film was not coated with a polymerizable compound and irradiated with an electron beam.

[Evaluation]
With respect to the heat-resistant synthetic resin microporous film and the homopolypropylene microporous film, the maximum heat shrinkage and the film fusing temperature in the extrusion direction (MD) and the direction orthogonal to the extrusion direction (TD) in TMA measurement were measured according to the above-described procedure. The gel fraction of the heat resistant synthetic resin microporous film was measured according to the procedure described above. These results are shown in Tables 1 and 2.

  The heat-resistant synthetic resin microporous film of the present invention is excellent in both heat resistance and meltdown resistance. Therefore, this heat-resistant synthetic resin microporous film is suitably used as a separator for non-aqueous electrolyte secondary batteries.

Claims (7)

  A heat-resistant synthetic resin microporous film having a maximum heat shrinkage of 25% or less in TMA measurement and a film fusing temperature in TMA measurement of 190 ° C or higher. A synthetic resin microporous film, and a coating layer formed on at least a part of the surface of the synthetic resin microporous film,
The heat-resistant synthetic resin microporous film according to claim 1, wherein the coating layer contains a polymer of a polymerizable compound.   The heat-resistant synthetic resin microporous film according to claim 2, wherein the coating layer contains a polymer of a polymerizable compound having two or more radically polymerizable functional groups in one molecule.   The heat resistant synthetic resin microporous film according to any one of claims 1 to 3, wherein the gel fraction of the heat resistant synthetic resin microporous film is 40% by mass or more. An irradiation step of irradiating the synthetic resin microporous film with active energy rays;
A heating step of heat-treating the synthetic resin microporous film irradiated with the active energy ray,
A method for producing a heat-resistant synthetic resin microporous film, comprising:   6. The method for producing a heat-resistant synthetic resin microporous film according to claim 5, further comprising a coating step of coating a polymerizable compound on at least a part of the surface of the synthetic resin microporous film.   The method for producing a heat-resistant synthetic resin microporous film according to claim 5 or 6, wherein the irradiation step and / or the heating step is performed in an atmosphere having an oxygen concentration of 10 ppm or less.