JP2017073243A - Manufacturing method for electronic component and manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component in which a first metal plate made from a first metal strip having a contact (a corresponding part line) is efficiently positioned and connected onto a second metal strip having a pair of fixed tabs (the corresponding part line), thereby improving a production rate.SOLUTION: A manufacturing method for an electronic component according to the present invention comprises: a first conveying line L1 which conveys a first metal stripe 30 for forming a contact; and a second conveying line L2 which conveys a second metal stripe 50 for forming a fixed tab. In the first conveying line L1, a first step S100 of forming a first penetration hole 36 to the first metal stripe 30 and a second step S101 of obtaining a first metal plate 37 by cutting the first metal stripe 30 in each contact corresponding part group 35 are executed. In the second conveying line L2, at least a third step S102 for forming a tongue-shaped piece part 54 to the second metal stripe 50 is executed. After that, at least a forth step S103 in which the first metal plate 37 is moved up to a connection position of the second metal stripe 50 and subsequently a temporal caulking processing is executed and a fifth step S104 for executing a main caulking processing are executed.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a first metal plate having a contact (corresponding portion) group consisting of a required number of contacts (corresponding portions), which is obtained by cutting the first metal strip and transported by the first transport line. The present invention relates to a method and an apparatus for manufacturing an electronic component that are efficiently positioned and connected on a second metal strip having a pair of fixed tabs (corresponding portions) that are transported by a transport line to improve the production speed.

  As a method of manufacturing an electronic component, for example, a connector, which includes a resin body and a contact group including a required number of metal contacts disposed on the body at a predetermined pitch, a method of manufacturing by insert molding It has been known.

As a manufacturing method of such a connector, it is disclosed by patent document 1, for example.
In the method for manufacturing a connector described in Patent Document 1, a plurality of contacts are supplied in a state of being connected to a metal carrier in parallel, and a plurality of resin body bases are provided, and the contacts are disposed in the vicinity of the body bases. And a resin carrier having a contact temporary fixing portion for temporarily fixing the metal carrier so as to be disposed at a predetermined position, and by temporarily fixing the metal carrier to the contact temporary fixing portion of the resin carrier The contact is arranged at a predetermined position of the body base, the body base and the contact in this arrangement state are positioned in a cavity of a mold, and molten resin is injected into the cavity to be integrated with the body base. A connector is manufactured by insert-molding a body fixing portion constituting a part of the body. A method, it is possible to increase the production rate of the connectors, it is an object to provide a method of producing a connector which can be used without waste contact (corresponding part).

  However, the method described in Patent Document 1 further includes a step of resin-molding a body base portion constituting a skeleton of a resin body in advance and a step of integrally connecting the body base portion to a resin carrier before insert molding. There is a problem that the production speed of the connector cannot be increased sufficiently because it is necessary and the number of steps for manufacturing increases.

  In addition, the connector of the usage mode that is mounted by soldering the contact connection part to the printed circuit board may have a large force acting on the connector due to a twist or the like that is likely to occur at the time of connection or separation with the counterpart connector, In such a case, contact failure or peeling tends to occur at the soldered portion of the contact. Therefore, in order to improve the soldering strength when the connector is mounted on the printed circuit board, for example, a pair of metal fixing tabs are provided at both end portions of the resin body sandwiching the contact group, and these fixing tabs are provided. In many cases, a structure for soldering to a printed circuit board is employed.

  However, since the manufacturing method described in Patent Document 1 does not disclose any step of providing a fixing tab, in such a manufacturing method, a connector in which both a contact group and a fixing tab are disposed on a resinous body is formed by insert molding. There is a problem that the manufacturing process becomes complicated even if it can be manufactured.

International Publication No. 2009/001436 Pamphlet

  An object of the present invention is to convey a first conveyance line for conveying a first metal strip for forming a contact and a second metal strip for forming a fixing tab in parallel with the first conveyance line at an interval. A second transport line, and by carrying out an appropriate process in each of the first and second transport lines, the required number of transported by the first transport line and obtained by cutting the first metal strip. A first metal plate having a contact (corresponding portion) group of contacts (corresponding portions) is efficiently transferred onto a second metal strip having a pair of fixing tabs (corresponding portions) conveyed by the second conveying line. An object of the present invention is to provide an electronic component manufacturing method and a manufacturing apparatus that are positioned and connected to improve production speed.

In order to achieve the above object, the gist of the present invention is as follows.
(1) A resin body, a contact group composed of a required number of metal contacts arranged at a predetermined arrangement pitch on the body, and arranged on both ends of the body across the contact group. A method of manufacturing an electronic component including a pair of metal fixing tabs provided, wherein one side end portion has a contact equivalent portion row in which a plurality of contact equivalent portions are aligned, and the contact equivalent portion A portion other than the row is configured as a metal strip portion, and a first transport line for transporting the first metal strip for contact formation and a pair of fixed tab equivalent portions on one surface are spaced apart from each other by a predetermined distance. And a second transport line for transporting a second metal strip for forming a fixed tab, which has a portion corresponding to the fixed tab to be aligned, in parallel with the first transport line, and the first transport line. Then, before configuring the first metal strip A first step of forming a first through hole in a region of the metal strip portion divided for each contact equivalent portion group corresponding to the contact group constituting the electronic component; and the first metal strip plate, Cutting at each contact equivalent portion group to obtain at least a second step of obtaining the first metal plate having the contact equivalent portion group and the first through hole, and in the second transport line, the second metal strip plate A tongue-like piece portion cut and raised on the one surface side is formed by cutting and bending at least one side end portion located between the pair of fixed tab corresponding portions of the one surface At least the third step, and after performing all of the first to third steps, the first metal plate obtained in the first transfer line is placed on the second transfer line. The first metal is disposed on the tongue-shaped piece of the metal strip. Is moved to the connecting position on the one surface of the second metal strip so that the first through hole is inserted, and then temporarily crimped on the tongue-like piece of the second metal strip. A fourth step of temporarily fixing the first metal plate to the second metal strip, and subjecting the tongue-like piece portion of the second metal strip to a caulking process, thereby providing the first metal plate. At least a fifth step of permanently fixing the metal plate to the second metal strip.

(2) There are two first metal strips for contact formation to be transported by the first transport line, and the two first metal strips are the contact equivalent portions located at one side end of each. In a state in which the rows are in close proximity to each other and maintained in a facing relationship, the first transport lines are transported in parallel in pairs, and in the first step, each of the two first metal strips is A first through hole is formed in a region of the metal strip portion constituting the region divided for each contact equivalent portion group corresponding to the contact group constituting the electronic component, and in the second step, the two pieces are formed. The first metal strip is cut into each contact equivalent portion group to form a pair of first metal plates having the contact equivalent portion group and the first through hole. In the third step, The one surface of the second metal strip, A tongue-like piece portion cut and raised on the one surface side by cutting and bending is formed on both side end portions located between the corresponding portions of the fixed tabs. In the fourth step, the first step After performing all of the third steps, the second transport of the pair of first metal plates obtained in the first transport line is maintained in a positional relationship in which the contact-corresponding portion groups face each other. The one of the second metal strips so that each of the first through holes of the pair of first metal plates is fitted into the tongue-like piece of the second metal strip on the line And then temporarily crimping the tongue-shaped piece of the second metal strip to temporarily fix the pair of first metal plates to the second metal strip. In the fifth step, the caulking process is applied to the tongue-shaped piece of the second metal strip, and the pair of The first metal plate to the fixed to the second metal strip, method for manufacturing the electronic component according to the above (1).

(3) A resin body, a contact group comprising a required number of metal contacts arranged at a predetermined arrangement pitch on the body, and arranged on both ends of the body across the contact group. An electronic component manufacturing apparatus comprising a pair of metal fixing tabs provided, and having a contact equivalent portion row in which a plurality of contact equivalent portions are aligned at one side end portion, and the contact equivalent portions A portion other than the row is configured as a metal strip portion, and a first transport line for transporting the first metal strip for contact formation and a pair of fixed tab equivalent portions on one surface are spaced apart from each other by a predetermined distance. And a second transport line for transporting a second metal strip for forming a fixed tab, which has a portion corresponding to the fixed tab to be aligned, in parallel with the first transport line, and the first transport line. Before configuring the first metal strip A first mold for forming a first through hole in a region of the metal strip portion divided for each contact equivalent portion group corresponding to the contact group constituting the electronic component, and the first metal strip plate A second mold that cuts each contact equivalent portion group to obtain a first metal plate having the contact equivalent portion group and the first through hole, and the second transport line includes the second mold. A tongue-like piece cut and raised on one surface side of the one surface of the metal band plate by cutting and bending at least one side end portion located between the pair of fixed tab corresponding portions. A third mold that forms a portion, and a fourth mold that permanently fixes the first metal plate to the second metal strip, and straddles the first transfer line and the second transfer line. In the region, the first mold obtained by the second mold located in the first transfer line Adsorbing a plate, the first metal plate on the one surface of the second metal strip on the second conveying line, upstream of the fourth mold, in the adsorbed state A rotationally movable member configured to be rotatable so that it can be moved to a coupling position and having a pressing portion that is vertically movable for temporarily fixing the first metal plate to the second metal strip. An electronic component manufacturing apparatus.

(4) The first metal strips for contact formation to be transported by the first transport line are two, and the two first metal strips are the contact equivalent portions located at the respective one side end portions. In a state in which the rows are in close proximity to each other and maintained in an opposing relationship, the pair is transported in parallel on the first transport line, and the first mold is formed by each of the two first metal strips. A first through hole is formed in a region of each of the metal strips constituting the contact portion group corresponding to the contact group constituting the electronic component, and the second gold The mold is configured to cut the two first metal strips for each of the contact equivalent portion groups to obtain a pair of first metal plates having the contact equivalent portion groups and the first through holes. The third mold is in front of the second metal strip. On one surface, both side end portions located between the pair of fixed tab equivalent portions are cut and bent to form a tongue-shaped piece portion cut and raised on the one surface side, The fourth mold is configured to permanently fix the pair of first metal plates to the second metal strip, and the rotationally moving member is the second mold located in the first transport line. The pair of first metal plates obtained are adsorbed, and the pair of first metal plates are arranged upstream of the fourth mold on the second transport line while maintaining the arrangement relationship in the adsorption state. The second metal strip is configured to be rotatable so that it can be moved to a connection position on the one surface of the second metal strip, and the pair of first metal plates is temporarily attached to the second metal strip. The electronic component manufacturing apparatus according to (3), further including a pressing portion that is movable up and down for fixing.

(5) When the first metal strip is cut by the second mold for each contact-corresponding portion group to obtain the first metal plate, of the contact equivalent portions constituting the first metal strip The above (3) or (4), further comprising a fifth mold in the first transfer line for cutting out one contact equivalent portion present at a position to be cut for each contact group constituting the electronic component. The electronic component manufacturing apparatus described in 1.

(6) The electronic component manufacturing apparatus according to (5), wherein the fifth mold is configured as a single composite mold together with the first mold.

(7) The first and second transport lines are respectively provided with first and second guide rails for guiding the transport of the first and second metal strips, and the first and second metal strips in the transport direction. The electronic component manufacturing apparatus according to any one of (3) to (6), wherein the electronic component manufacturing apparatus includes a first feeding device and a second feeding device.

(8) The electronic component manufacturing apparatus according to any one of (3) to (7), wherein the rotation moving member is configured as a disk-shaped rotation unit that rotates at 90 ° intervals.

  The electronic component manufacturing method of the present invention includes a resin body, a contact group including a required number of metal contacts disposed on the body at a predetermined pitch, and the body sandwiching the contact group. A pair of metal fixing tabs disposed at both ends of the electronic component manufacturing method, wherein a contact equivalent portion row in which a plurality of contact equivalent portions are aligned on one side end portion A first transport line for transporting a first metal strip for contact formation formed by forming a portion other than the contact-corresponding portion row as a metal strip, and corresponding to a pair of fixing tabs on one surface A second transport line for transporting a second metal strip for forming a fixed tab having a portion corresponding to a fixed tab aligned at a predetermined interval, in parallel with the first transport line. And in the first transfer line, A first step of forming a first through-hole in a region of the metal band portion constituting one metal band plate divided for each contact equivalent portion group corresponding to the contact group constituting the electronic component; Cutting the first metal strip into each contact equivalent portion group to obtain at least a second step of obtaining the first metal plate having the contact equivalent portion group and the first through hole, and the second transport line. Then, at least one side end portion located between the pair of fixing tabs corresponding to the one surface of the second metal strip is cut and cut to the one surface side. After performing at least the third step of forming the raised tongue-shaped piece portion and performing all of the first to third steps, the first metal plate obtained in the first transfer line is transferred to the second transfer. The tongue of the second metal strip on line After the first metal plate is moved to the connecting position on the one surface of the second metal strip so that the first through hole of the first metal plate is fitted into one piece, the second metal strip A fourth step of temporarily crimping the tongue-shaped piece portion to temporarily fix the first metal plate to the second metal strip plate; and a main crimping process on the tongue-shaped piece portion of the second metal strip plate. And by performing at least a fifth step of permanently fixing the first metal plate to the second metal strip, the first metal strip is transported and obtained by cutting the first metal strip. On the second metal strip having a pair of fixed tabs (corresponding portions), the first metal plate having a contact (corresponding portion) group consisting of a required number of contacts (corresponding portions) being transported by the second transport line. It has become possible to improve the production speed of electronic parts by positioning and connecting to each other efficiently.

  The electronic component manufacturing apparatus according to the present invention sandwiches the contact group, which includes a resin body, a contact group including a predetermined number of metal contacts disposed on the body at a predetermined pitch. An apparatus for manufacturing an electronic component comprising a pair of metal fixing tabs disposed on both side end portions of the body, wherein a plurality of contact equivalent portions are aligned on one side end portion. A first transport line for transporting a first metal strip for contact formation, and a pair of fixing tabs on one surface. A second transport line for transporting a second metal strip for forming a fixed tab parallel to the first transport line, the second metal strip for forming the fixed tab having an array of fixed tabs corresponding to the corresponding portion aligned at a predetermined interval; The first transport line includes A first gold that forms a first through hole in a region of the metal strip that constitutes the first metal strip and is divided for each contact equivalent portion group that corresponds to the contact group that constitutes the electronic component. A mold and a second mold for cutting the first metal strip for each contact-corresponding portion group to obtain a first metal plate having the contact-corresponding portion group and the first through hole, The second transport line is formed by cutting and bending at least one side end portion of the one surface of the second metal band plate located between the pair of fixed tab equivalent portions. And a fourth mold for permanently fixing the first metal plate to the second metal strip, the first conveying line. And in the region straddling above the second transport line, the position located in the first transport line The first metal plate obtained by the two molds is adsorbed, and the first metal plate is in the adsorbed state and on the second transfer line on the upstream side of the fourth mold. It is comprised so that it can move to the connection position on said one surface of 2 metal strips, and it can move up and down for temporarily fixing the 1st metal plate to the 2nd metal strip By having a rotationally moving member having a pressing portion, it has a contact (corresponding portion) group consisting of a required number of contacts (corresponding portions) which is transported on the first transport line and obtained by cutting the first metal strip. Efficiently positioning and connecting the first metal plate on the second metal band plate having a pair of fixed tabs (corresponding portions) conveyed by the second conveyance line to improve the production speed of electronic components. Became possible.

FIG. 1 is a perspective view of a typical electronic component manufacturing apparatus according to the present invention. FIG. 2 is an enlarged perspective view of an electronic component as a final product manufactured through a post-process such as resin molding by producing an intermediate processed strip using the manufacturing apparatus of FIG. 1. FIG. 3 is a schematic image diagram for explaining the flow until the electronic component of the present invention is manufactured. FIG. 4 is an enlarged plan view showing a transport state of two first metal strips transported in parallel on the first transport line. FIG. 5 is an enlarged plan view of the second metal strip. FIG. 6 is an enlarged plan view of the manufacturing apparatus shown in FIG. FIG. 7 is an enlarged front view of the manufacturing apparatus shown in FIG. 1 when viewed from the second transport line side. FIG. 8 is an enlarged rear view of the manufacturing apparatus shown in FIG. 1 when viewed from the first transport line side. FIG. 9 is an enlarged perspective view showing the layout of the first and second transport lines and the rotationally moving member before the installation of a mold or the like in the manufacturing apparatus shown in FIG. FIG. 10 is an enlarged perspective view of the main part of the manufacturing apparatus shown in FIG. FIG. 11 is a manufacturing flow diagram in a representative method for manufacturing an electronic component according to the present invention.

  Next, embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view of a typical electronic component manufacturing apparatus according to the present invention, and FIG. 2 is a final product manufactured through a post-process such as resin molding by producing an intermediate processing strip using the manufacturing apparatus of FIG. 3 is an enlarged perspective view of the electronic component, FIG. 3 is a schematic image view for explaining the flow until the electronic component of the present invention is manufactured, FIG. 4 is an enlarged plan view of the first metal strip, and FIG. FIG. 6 is an enlarged plan view of the manufacturing apparatus shown in FIG. 1, and FIG. 7 is an enlarged front view of the manufacturing apparatus shown in FIG. 1 when viewed from the second transport line side. 8 is an enlarged rear view of the manufacturing apparatus shown in FIG. 1 when viewed from the first transfer line side. FIG. 9 is a schematic view of the first and second transfer lines in the manufacturing apparatus shown in FIG. In order to understand the layout of the members, an enlarged perspective view excluding the mold and the like, and FIG. Vinegar production apparatus is an enlarged perspective view of a main part around the rotation movement member.

  The manufacturing apparatus 1 shown in FIG. 1 includes an electronic component, for example, a resin body 106 as shown in FIG. 2, and a required number of metal contacts 108 arranged on the body 106 at a predetermined arrangement pitch. An apparatus for manufacturing an electronic component 100 including a contact group 110 and a pair of metal fixing tabs 112 and 112 disposed at both ends 104 and 104 of the body 106 sandwiching the contact group 110 It is.

  An electronic component 100 shown in FIG. 2 is a plug connector configured to be insertable / removable for electrical connection with a mating receptacle connector (not shown), and resin bodies 106 are arranged to face each other with a space therebetween. It has a pair of long side wall portions 102 and 102 and a pair of short side wall portions 104 and 104 connecting the pair of long side wall portions 102 and 102, and the pair of long side wall portions 102. , 102 and the pair of short side wall portions 104, 104 constitute a rectangular frame having a substantially rectangular planar shape, and has a bottom surface portion 114 at one end side of the rectangular frame, and at the other end side, A fitting port is formed in which the mating receptacle connector is inserted and fitted and connected.

  Further, the body 106 of the connector 10 shown in FIG. 2 has two rows of contacts, each consisting of 11 signal contacts 108 on each long side wall 102 and a total of 22 signal contacts 108 on both long side walls 102 and 102. The groups 110, 110 are arranged, and a pair of fixing tabs 112, 112 are provided on the ends (a pair of short side wall portions) 104, 104 on both sides of the body 106 sandwiching the contact groups 110, 110. It is arranged.

  Note that the electronic component 100 manufactured using the manufacturing apparatus 1 of the present invention is not limited to the plug connector as shown in FIG. 2, but includes various connectors such as a receptacle connector and a connector in which only one row of contact groups 110 are arranged. Includes electronic components.

  And the manufacturing apparatus 1 of this invention is equipped with the 1st conveyance line L1 and the 2nd conveyance line L2 which are two conveyance lines, and the 1st metal mold | die 2, the 2nd metal mold | die 3, the 3rd metal mold | die 4 and The fourth mold 5 is mainly composed of four molds 2 to 5 and a rotationally moving member 6.

  The first transport line L1 is a production line for transporting the first metal strip 30 serving as a base material for forming the contact 108 of the electronic component 100. The first metal strip 30 for forming a contact is: As shown in an enlarged view in FIG. 4, one side end portion 31 has a contact equivalent portion row 33 in which a plurality of contact equivalent portions 32 are aligned, and a portion other than the contact equivalent portion row 33 is a metal strip portion 34. Can be configured. In the first transport line L1, the “upstream side” is the side (left side in FIG. 3) located in the direction in which the first metal strip 30 is transported, and the “downstream side” is the first metal strip. It means the side (right side in FIG. 3) located in the direction in which the plate 30 is conveyed.

  The second transport line L2 is a production line for transporting the second metal strip 50, which is a base material for forming the fixed tab 112, in parallel with the first transport line L1, with a fixed tab. As shown in an enlarged view in FIG. 5, the second metal strip 50 for forming is equivalent to a fixing tab in which a pair of fixing tab equivalent portions 51, 51 are aligned with a predetermined interval x on one surface 50 a. As shown in FIG. 1, the second transport line L <b> 2 has a partial row 52, and is configured to be transported in parallel with the first transport line L <b> 1. In the second transport line L2, the “upstream side” is the side (left side in FIG. 3) located in the direction in which the second metal strip 50 is transported, and the “downstream side” is the second metal strip. It means the side (right side in FIG. 3) located in the direction in which the plate 50 is conveyed.

  In the 1st conveyance line L1, the 1st guide rail 8 for guiding conveyance of the 1st metal strip 30, and the 1st feeder 9 for moving the 1st metal strip 30 in the conveyance direction T1 are arranged. In addition, a second guide rail 10 for guiding the transport of the second metal strip 50 and a second feed for moving the second metal strip 50 in the transport direction T2 are provided in the second transport line L2. It is preferable to arrange the device 11 (see FIGS. 3 and 6). For example, as shown in FIG. 9, the first guide rail 8 is configured by a member divided into a plurality of parts in order to dispose the first mold 2 and the second mold 3 in the first transport line L1. The first feeding device 9 has a plurality of sprocket teeth provided at regular intervals on the metal band portion 34 of the first metal band plate 30 when a sprocket provided at the tip of the drive shaft rotates at a constant angular velocity. Although it is preferable to be configured to engage with the positioning hole 38 (see FIG. 4), it is not limited to this configuration. For example, as shown in FIG. 9, the second guide rail 10 is configured by a member divided into a plurality of parts in order to dispose the third mold 4 and the fourth mold 5 in the second transport line L2. In the second feeder 11, a sprocket provided at the tip of the drive shaft rotates at a constant angular velocity, and a plurality of sprocket teeth are provided on the metal strip 34 of the second metal strip 50 at regular intervals. Although it is preferable to be configured to engage with the positioning hole 39 (see FIG. 5), it is not limited to this configuration.

  In the manufacturing apparatus of FIG. 1, the first metal strip plate 30 transported by the first transport line L <b> 1 is defined as two first metal strip plates 30, 30, and the two first metal strip plates 30, 30. In the state in which the contact corresponding portion rows 33 and 33 located at the respective one side end portions 31 are in close proximity to each other as shown in an enlarged view in FIG. Although the case where L1 is configured to be transported in parallel in pairs is shown, only one first metal strip 30 may be transported depending on the type of connector.

A first mold 2 and a second mold 3 are arranged on the first transfer line 30.
The first mold 2 has the first metal band plate 34 constituting the first metal band plate 30 in a region divided for each contact equivalent portion group 35 corresponding to the contact group 20 constituting the electronic component 10. In the through hole, in FIG. 3, the two first through holes 36 are formed on the first transport line L1.

  The second mold 3 is formed by cutting the first metal strip 30 for each contact equivalent portion group 35 to form a first metal plate having a contact equivalent portion group 35 and a first through hole 36, a pair of first metal plates in FIG. In order to obtain one metal plate 37, 37, it is disposed on the first conveying line L 1 and on the downstream side of the first mold 2.

  On the other hand, the 3rd metal mold 4 and the 4th metal mold 5 are arranged in the 2nd conveyance line L2.

  The third mold 4 is a portion of at least one side end located between the pair of fixing tab equivalent portions 51, 51 on one surface 50a of the second metal strip 50, in FIG. In order to form a pair of tongue-like piece portions 54 and 54 (see FIG. 11) which are cut and raised on one surface 50a side by cutting and bending at each of the two portions 53 and 53, the second transport line Arranged on L2.

  The fourth mold 5 is arranged on the second transport line L <b> 2 and downstream of the third mold 4 in order to permanently fix the first metal plate 37 to the second metal strip 50.

  Further, a rotationally moving member 6 is disposed in a region straddling above the first transport line L1 and the second transport line L2.

  As shown in FIG. 3, the rotationally moving member 6 sucks the first metal plate 37 obtained by the second mold 3 located on the first transport line L1, and keeps the first metal plate 37 in the sucked state. The second metal strip 50 on the second transport line L2 is configured to be rotatable so that it can be moved to a connection position on one surface 50a of the second metal strip 50 on the upstream side of the fourth mold 5. . In addition, the rotationally moving member 6 has a pressing part 7 that can be moved up and down for temporarily fixing the first metal plate 37 to the second metal band plate 50, and four pressing parts 7 at 90 ° intervals in FIG. ing. Moreover, it is preferable that the rotationally moving member 6 is configured as a disk-shaped rotating unit that rotates at 90 ° intervals. For example, as shown in FIG. 3, after performing the main caulking process with the fourth mold 5, it is inspected whether the first metal plate 37 is normally connected on one surface 50 a of the second metal strip 50. Therefore, the second detection means 14 such as a camera is provided on the downstream side of the fourth mold 5, or after the main caulking process in the fourth mold 5 is completed, the pressing portion of the rotary moving member 6 7, the first metal plate 37 is attracted to the pressing portion 7 at a position in the middle of returning to the position of the second mold 3, in FIG. 3, at a position rotated 90 ° counterclockwise from the position of the fourth mold 5. It is also possible to provide third detection means 15 such as a camera for detecting whether or not it remains. In the embodiment shown in FIGS. 9 and 10, in the rotationally moving member 6, when four round holes 17 are formed in the disk-shaped rotating base material constituting the rotationally moving member 6 in order to reduce the weight. However, the round hole 17 can be appropriately provided as necessary.

  In FIG. 1, the first metal strip 30 for contact formation transported by the first transport line L <b> 1 is defined as two first metal strips 30, 30, and the two first metal strips 30, 30. In the state where the contact-corresponding portion rows 33 and 33 located at the respective one side end portions 31 are kept close to each other and face each other, they are parallelly transported in pairs on the first transport line L1. The case where it makes it show is shown.

  In this case, as shown in FIG. 3, the first mold 2 forms a first through hole 36 in the region of the metal strip 34 constituting each of the two first metal strips 30, 30. The second mold 3 has a contact equivalent portion group 35 and a first through hole 36 by cutting the two first metal strips 30 and 30 into contact equivalent portion groups 35 respectively. A pair of first metal plates 37 and 37 are configured to be obtained, and the fourth mold 5 is configured to permanently fix the pair of first metal plates 37 and 37 to the second metal strip 50 and rotate. The moving member 6 adsorbs the pair of first metal plates 37, 37 obtained by the second mold 3 located in the first transport line L1, and adsorbs the pair of first metal plates 37, 37 in the adsorbing state. One surface 50 of the second metal strip 50 on the upstream side of the fourth mold 5 on the second conveyance line L2 with the arrangement relationship of Only to be rotatable configured to be moved to the connecting position of the upper.

  Furthermore, as another embodiment of the present invention, the first metal strip 30 is obtained by cutting the first metal strip 30 by the second mold 3 for each contact equivalent portion group 35 to obtain the first metal plate 37. A fifth mold for cutting one contact equivalent portion 32 present at a position to be cut for each contact group 110 constituting the electronic component 100 among the contact equivalent portions 32 constituting the first transfer line L1. It is preferable to dispose further. In FIG. 3, the case where the fifth mold is configured as a single composite mold 12 together with the first mold 2 is alternatively shown. 6 and 8, the first metal strip 30 is set on the first transport line L <b> 1 and extended to the position downstream of the second mold 3. After that, when cutting of the first metal strip 30 is started, when the extended portion of the first metal strip 30 set below the second mold 3 obtains the first metal plate 37 FIG. 2 shows a case where a metal scrap collection box 16 for collecting metal scrap (scrap) remaining on the first conveying line L1 as a cut end is disposed. It can arrange | position suitably.

Next, a representative method for manufacturing an electronic component according to the present invention will be described.
FIG. 11 is a manufacturing flowchart for explaining the main steps of a method for manufacturing a representative electronic component according to the present invention.

  The manufacturing method of the present invention includes first and second transport lines L1 and L2, and performs at least the first to fifth steps.

  In the 1st conveyance line L1, the 1st metal strip 30 is first guided and conveyed by the 1st guide rail 8 by the 1st feeder 9, and the metal strip 34 which constitutes the 1st metal strip 30, A first step S100 for forming the first through hole 36 in a region divided for each contact corresponding portion group 35 corresponding to the contact group 110 constituting the electronic component 100 is performed.

  In the first step S100, not only the first through hole 36 is formed in the first metal strip 30 by the first mold 2, but the first mold 2 is changed to the composite mold 12 as necessary. As shown in FIG. 3, among the contact equivalent parts 32 constituting the first metal strip 30, one contact equivalent part existing at a position to be cut for each contact group 110 constituting the electronic component 100. Or a slit for facilitating cutting for each contact group 110 may be formed in the next step.

  After performing 1st process S100, the 1st metal strip 30 is cut | disconnected for every contact equivalent part group 35 next, and the 1st metal plate 37 which has the contact equivalent part group 35 and the 1st through-hole 36 is obtained. The second step S101 is performed.

  On the other hand, in the 2nd conveyance line L2, the 2nd metal strip 50 is guided and conveyed by the 2nd guide rail 10 by the 2nd feeder 11, and 1 side 50a of the 2nd metal strip 50 is 1 At least one side end portion 53, 53 located between the pair of fixed tab equivalent portions 51, 51 is cut and bent to form a tongue-like piece portion 54 cut and raised on one surface 50 a side. At least three steps S102 are performed. In FIG. 11, the tongue-like pieces 54 and 54 show a case where the tongue-shaped pieces 54 and 54 are cut and raised to a position perpendicular to the second metal strip 50 (an angle of 90 °).

  And after performing all 1st process S100, 2nd process S101, and 3rd process S102, the press part 7 of the rotational movement member 6 uses the 1st metal plate 37 obtained by the 1st conveyance line L1. By adsorbing and then rotating 90 ° counterclockwise in FIG. 3, the first detecting means 13 such as a camera detects whether the first metal plate 37 is present in the normal adsorbing state on the pressing portion 7. Then, the first through hole 36 of the first metal plate 37 is formed in the tongue-like piece portion 54 of the second metal strip 50 on the second transport line L2 by further rotating counterclockwise by 90 °. The fourth step of temporarily fixing the first metal plate to the second metal strip plate by moving the tongue-shaped piece portion 54 of the second metal strip plate 50 to the connecting position to be inserted and then temporarily crimping. S103 is performed.

  The pressing part 7 moves the adsorbed first metal plate 37 upward on the second metal band plate 50 in the adsorbed state, and then moves the pressing part 7 to the first through hole of the first metal plate 37. 36 is lowered to a connecting position where it is inserted into the tongue-like piece portion 54 of the second metal strip 50, and the pair of tongue-like pieces 54, 54 of the second metal strip 50 are deformed in the direction of expanding. In the fourth step of 11, a pair of tongue-shaped piece portions 54 </ b> A and 54 </ b> A as enlarged and shown by a circular frame are released, and at the same time, the adhering state of the pressing portion 7 with the first metal plate 37 is released, thereby temporarily crimping Can be done.

  Thereafter, the second metal strip 50 is moved to the fourth mold 5 located downstream of the second transport line L2 by the second feeding device 11, and the second metal strip 50 is moved by the fourth mold 5. The tongue-like piece portions 54A and 54A are pressed, and the tongue-like piece portions 54A and 54A are deformed into a pair of tongue-like piece portions 54B and 54B as shown enlarged in a circular frame in the fifth step of FIG. The first metal plate 37 is connected by caulking on one surface 50 a of the second metal strip 50.

  Moreover, in FIG. 11, the case where the 1st metal strip 30 conveyed by the 1st conveyance line L1 is made into the 2nd 1st metal strip 30,30 is shown. Even in this case, the manufacturing method of the electronic component of the present invention is basically the same as that of the first metal strip 30 described above.

  In other words, the two first metal strips 30 and 30 are in a state in which the contact-corresponding portion rows 33 and 33 located at the respective one side end portions 31 and 31 are maintained close to each other and face each other. In the first step S100, the electronic component 100 of the metal strip portion 34 that constitutes each of the two first metal strip plates 30 and 30 is configured in the first transport line L1 in parallel. A first through hole 36 is formed in a region divided for each contact-corresponding portion group 35 corresponding to the contact group 110. In the second step S101, the two first metal strips 30 and 30 are respectively equivalent to contacts. A pair of first metal plates 37, 37 each having a contact-corresponding portion group 35 and a first through hole 36 are formed by cutting each portion group 35. In a fourth step S103, the first to third steps S100 are performed. ~ Of S102 After performing the above, the pair of first metal plates 37, 37 obtained in the first transport line L1 is placed in the second transport line L2 with the contact corresponding portion groups 35, 35 facing each other. The second metal strip so that the first through holes 36 and 36 of the pair of first metal plates 37 and 37 are fitted into the tongue-like pieces 54 and 54 of the second metal strip 50 on the upper side. After moving to the connecting position on one surface 50a of the plate 50, the tongue shape of the second metal strip 50 protruding upward through the first through holes 36, 36 of the pair of first metal plates 37, 37. The pair of first metal plates 37, 37 are temporarily fixed to the second metal strip 50 by temporarily crimping the pieces 54, 54. Thereafter, in the fifth step S104, the second metal strip 50 is The tongue-shaped piece portions 54, 54 are subjected to a caulking process so that a pair of first metal plates 37, 37 And the fixed to the metal strip 50, it can be positioned connecting the first metal plate 37, 37 of the pair on the second metal strip 50.

  Then, after the pair of first metal plates 37 and 37 are permanently fixed to the second metal band plate 50, a part of the contact equivalent portion 32 and the fixing tab equivalent portion 51 are partly formed by resin molding such as insert molding. An electronic component equivalent portion embedded in the equivalent portion and integrally molded is formed, and then the electronic component equivalent portion is cut and separated from the second metal strip 50 to manufacture the electronic component 100. it can.

  In addition, the place mentioned above only illustrated embodiment of this invention, and can add a various change in a claim.

  According to the present invention, a first metal plate having a contact (corresponding portion) group consisting of a required number of contacts (corresponding portions), which is obtained by cutting the first metal strip and being transported by the first transport line, It has become possible to improve the production speed of electronic parts by efficiently positioning and connecting on a second metal strip having a pair of fixed tabs (corresponding parts) conveyed by the second conveyance line.

DESCRIPTION OF SYMBOLS 1 Electronic component manufacturing apparatus 2 1st metal mold | die 3 2nd metal mold | die 4 3rd metal mold | die 5 4th metal mold | die 6 Rotation moving member 7 Pressing part 8 1st guide rail 9 1st feeder 10 2nd guide rail 11 1st 2 feeding device 12 composite mold 13 first detection means 14 second detection means 15 third detection means 16 metal scrap collection box 17 round hole 30 first metal strip 31 first side end of first metal strip 32 contact Corresponding portion 33 Contact equivalent portion row 34 Metal strip portion 35 Contact equivalent portion group 36 First through hole 37 First metal plate 38 First positioning hole 39 Second positioning hole 50 Second metal strip plate 51 Fixing tab equivalent portion 52 Fixing tab Corresponding part row 54, 54A, 54B Tongue piece part 100 Electronic component 102 Long side wall part of body 104 Short side wall part of body (or both side edge parts of body)
106 Body 108 Contact (or signal contact)
110 Contact Group 112 Fixing Tab 114 Bottom Portion L1 First Transport Line L2 Second Transport Line T1 Transport Direction of the First Metal Band T2 Transport Direction of the Second Metal Band

Claims (8)

A resin body;
A contact group comprising a required number of metal contacts disposed on the body at a predetermined pitch;
A method of manufacturing an electronic component comprising a pair of metal fixing tabs disposed at both ends of the body across the contact group,
A first metal band plate for contact formation, which has a contact-corresponding part row in which a plurality of contact-corresponding parts are aligned at one side end, and a part other than the contact-corresponding part row is configured as a metal strip part A first conveying line for conveying
A second metal strip for forming a fixing tab having a row of fixing tabs corresponding to a pair of fixing tabs arranged at a predetermined interval on one surface is spaced from the first transport line. A second transfer line for parallel transfer at the same time,
In the first transfer line,
A first step of forming a first through hole in a region of the metal band portion constituting the first metal band plate divided for each contact equivalent portion group corresponding to the contact group constituting the electronic component. When,
A second step of cutting the first metal strip for each contact equivalent portion group to obtain a first metal plate having the contact equivalent portion group and the first through hole;
At least
In the second transfer line,
At least one side end portion located between the pair of fixed tabs corresponding to the one surface of the second metal strip was cut and raised to the one surface side. A third step of forming a tongue-shaped piece,
At least
After performing all of the first to third steps, the first metal plate obtained in the first transport line is replaced with the tongue-shaped piece portion of the second metal strip on the second transport line. The first metal plate is moved to a connecting position on the one surface of the second metal strip so that the first through hole of the first metal plate is inserted, and then the tongue of the second metal strip is A fourth step of temporarily fixing the first metal plate to the second metal strip by applying temporary caulking to the shape piece portion;
An electronic component comprising: performing at least a fifth step of subjecting the tongue-shaped piece portion of the second metal strip to a final caulking process and finally fixing the first metal plate to the second metal strip. Manufacturing method. Two first metal strips for contact formation to be transported by the first transport line are formed, and the first metal strips of the two sheets are arranged in such a manner that the contact corresponding portion rows located at one side end portion of each of the two first metal strips are arranged. In a state where the arrangement relationship facing each other is maintained, the first conveyance line is paired and conveyed in parallel on the first conveyance line,
In the first step, within the region of each of the metal strips that constitute each of the two first metal strips, divided into contact equivalent portion groups that correspond to the contact groups that constitute the electronic component. Forming a first through hole;
In the second step, the two first metal strips are cut for each contact equivalent portion group to form a pair of first metal plates having the contact equivalent portion group and the first through hole. And
In the third step, both side end portions of the one surface of the second metal band plate located between the pair of fixing tab equivalent portions are subjected to cutting and bending to the one surface side. Forming a tongue-like piece cut and raised in
In the fourth step, after performing all of the first to third steps, the contact-corresponding portion groups of the pair of first metal plates obtained in the first transfer line face each other. While maintaining the positional relationship, the first through holes of the pair of first metal plates are fitted and inserted into the tongue-shaped piece portions of the second metal strip on the second transport line. After the second metal strip is moved to the connection position on the one surface, the tongue-shaped piece of the second metal strip is subjected to temporary caulking, and the pair of first metal plates is Temporarily fixed to the second metal strip,
The said 5th process WHEREIN: This crimping process is performed to the said tongue-shaped piece part of the said 2nd metal strip, The said 1st pair of 1st metal plates are finally fixed to the said 2nd metal strip. The manufacturing method of the electronic component of description. A resin body;
A contact group comprising a required number of metal contacts disposed on the body at a predetermined pitch;
An electronic component manufacturing apparatus comprising a pair of metal fixing tabs disposed at both ends of the body across the contact group,
A first metal band plate for contact formation, which has a contact-corresponding part row in which a plurality of contact-corresponding parts are aligned at one side end, and a part other than the contact-corresponding part row is configured as a metal strip part A first conveying line for conveying
A second metal strip for forming a fixing tab having a row of fixing tabs corresponding to a pair of fixing tabs arranged at a predetermined interval on one surface is spaced from the first transport line. A second transport line that transports in parallel,
With
In the first transfer line,
A first gold that forms a first through hole in a region of the metal strip that constitutes the first metal strip and is divided for each contact equivalent portion group that corresponds to the contact group that constitutes the electronic component. Type,
A second mold for cutting the first metal strip for each contact equivalent portion group to obtain a first metal plate having the contact equivalent portion group and the first through hole;
Have
The second transport line includes
At least one side end portion located between the pair of fixed tabs corresponding to the one surface of the second metal strip was cut and raised to the one surface side. A third mold forming a tongue-shaped piece;
A fourth mold for permanently fixing the first metal plate to the second metal strip;
Have
In the region straddling above the first transport line and the second transport line,
Adsorbing the first metal plate obtained by the second mold located in the first conveyance line, the fourth metal on the second conveyance line in the adsorption state, the fourth metal, The second metal strip is configured to be rotatable so that it can be moved to a connection position on the one surface of the second metal strip on the upstream side of the mold. A rotationally movable member having a pressing part capable of moving up and down for temporary fixing to
An electronic component manufacturing apparatus comprising: Two first metal strips for contact formation to be transported by the first transport line are formed, and the first metal strips of the two sheets are arranged in such a manner that the contact corresponding portion rows located at one side end portion of each of the two first metal strips are arranged. In a state where the arrangement relationship facing each other is maintained, the first conveyance line is paired and conveyed in parallel on the first conveyance line,
The first mold is in an area separated for each contact equivalent portion group corresponding to the contact group constituting the electronic component of the metal strip portion constituting each of the two first metal strip plates. Are configured to form a first through hole,
The second mold includes a pair of first metal plates each having the contact equivalent portion group and the first through hole by cutting the two first metal strips for each contact equivalent portion group. Configured to get and
The third mold is formed by cutting and bending both side end portions of the one surface of the second metal band plate located between the pair of fixed tab equivalent portions. To form a tongue-shaped piece cut and raised on the surface side,
The fourth mold is configured to permanently fix the pair of first metal plates to the second metal strip,
The rotationally moving member sucks the pair of first metal plates obtained by the second mold located in the first transport line, and places the pair of first metal plates in the sucked state. While maintaining the relationship, it is configured to be rotatable so that it can be moved to the connection position on the one surface of the second metal strip on the second conveying line and upstream of the fourth mold. The electronic component manufacturing apparatus according to claim 3, further comprising a pressing portion that is vertically movable for temporarily fixing the pair of first metal plates to the second metal strip.   In obtaining the first metal plate by cutting the first metal strip for each contact equivalent portion group with the second mold, the electron corresponding to the contact equivalent portion constituting the first metal strip is formed. 5. The electronic component according to claim 3, further comprising a fifth mold in the first transport line that cuts out one contact equivalent portion that exists at a position to be cut for each of the contact groups constituting the component. manufacturing device.   The electronic component manufacturing apparatus according to claim 5, wherein the fifth mold is configured as a single composite mold together with the first mold.   The first and second transport lines move the first and second metal strips in the transport direction, and the first and second guide rails for guiding the transport of the first and second metal strips, respectively. The apparatus for manufacturing an electronic component according to any one of claims 3 to 6, further comprising a first feeding device and a second feeding device.   The electronic component manufacturing apparatus according to claim 3, wherein the rotation moving member is configured as a disk-shaped rotation unit that rotates at 90 ° intervals.

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