JP2017068184A - Image pick-up element holding mechanism for imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress an amount of protrusion of a fixation part with respect to an image pick-up element of an image pick-up element holding member, and to provide a holding structure that can secure fixation strength of the image pick-up element and strength of the image pick-up element holding member.SOLUTION: An image pick-up element holding structure comprises: an image pick-up element 33; a substrate 700 that is connected to the image pick-up element 33; and an image pick-up element holding member 510 that holds the image pick-up element 33, in which the image pick-up element 33 includes attachment parts 33a that are arranged at the opposing two sides. In the image pick-up element holding structure allowing a fixation member 600 to fix the image pick-up element 33 to the image pick-up element holding member 510, an opposing distance C of the attachment part 33a is shorter than a diagonal length D of an opening part of the image pick-up element holding member 510, and an outer shape of the substrate 700 is smaller than opening part dimensions of the image pick-up element holding member 510 in a range having a distance B equal to or more than a thickness A of the image pick-up element holding member 510 taken from a one-sided end part 33b of an attachment surface 33a in the two sides where the attachment part 33a is present, and at least residual one side of the two sides is also made smaller than the image pick-up element holding member 510.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a digital single-lens reflex camera, and more particularly to a holding configuration of an image sensor.

  In an imaging device such as a digital camera that converts an image signal into an electrical signal and captures an image, the imaging light beam is received by an imaging device such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) and output from the imaging device. The photoelectric conversion signal is converted into image data and recorded on a recording medium such as a memory card.

  In such an image pickup apparatus, the image pickup element is generally fixed to the image pickup element holding member, and is fixed to the camera body by adjusting the image pickup surface so as to have a predetermined distance and parallel to a predetermined reference. Is.

  In addition, a shutter unit, a main base, and the like are disposed between the image sensor holding member and the camera body. Here, if the fixing surface of the image sensor holding member protrudes toward the camera body in the optical axis direction with respect to the image sensor, it becomes impossible to secure the adjustment amount for fixing as described above.

  For this reason, Patent Document 1 discloses a configuration in which a protruding amount of the fixing surface of the image sensor holding member with respect to the image sensor is reduced by injecting and fixing an adhesive into a gap between the outer periphery of the image sensor and the inner periphery of the image sensor holding member. Has been proposed.

JP 2008-205723 A

  However, this configuration has a problem that it is vulnerable to an impact such as a drop when the size and weight of the image sensor increase.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an image sensor holding configuration capable of suppressing the protrusion amount of the fixing portion of the image sensor holding member with respect to the image sensor and ensuring the fixing strength of the image sensor and the strength of the image sensor holding member. There is to do.

In order to achieve the above object, an image sensor holding configuration according to the present invention includes:
An image sensor (33), a substrate (700) connected to the image sensor (33), and an image sensor holding member (510) having a substantially rectangular opening for holding the image sensor (33);
The image sensor (33) has attachment portions (33a) to the image sensor holding member (510) disposed on two opposite sides of the image sensor (33), and holds the image sensor (33). In the image sensor holding configuration that is fixed to the member (510) by the fixing member (600),
The distance (C) from the opposite end of the mounting portion (33a) is shorter than the diagonal length (D) of the opening of the image sensor holding member (510) and is connected to the image sensor (33). The outer shape of the substrate (700) is equal to or greater than the thickness (A) of the image sensor holding member (510) from the end (33b) on one side of the mounting surface (33a) on the two sides with the mounting portion (33a). That the distance (B) is smaller than the size of the opening of the image sensor holding member (510), and at least one of the remaining two sides is smaller than the image sensor holding member (510). Features.

  According to the image sensor holding configuration according to the present invention, while maintaining the mounting area of the substrate connected to the image sensor, the strength of the image sensor holding member is maintained while keeping the opening size of the image sensor holding member to a minimum. The image sensor can be attached by the fixing member from the fixing surface side to the main body of the image sensor holding member. Thereby, while suppressing the protrusion amount of the fixing | fixed part of the holding member of an image pick-up element, the fixed intensity | strength of an image pick-up element and the intensity | strength of an image pick-up element holding member are securable.

1 is a perspective view showing an external appearance of a digital single-lens reflex camera according to an embodiment of the present invention, and is a perspective view seen from the front side of the camera. It is a back perspective view showing the appearance of the digital single-lens reflex camera concerning an embodiment of the invention. It is a block diagram which shows the main electrical structures of the digital single-lens reflex camera which concerns on this Embodiment. It is a disassembled perspective view which shows schematic structure inside a camera for showing the holding structure around an image pick-up element. (A) is a perspective view showing a state before the image pickup device 33, the substrate 700, and the image pickup device holding member 510 become the image pickup device unit 500, and (b) is a rear view showing a dimensional relationship among the image pickup device, the substrate, and the image pickup device holding member. FIG. 4C is a rear view illustrating a state in which the imaging element, the substrate, and the imaging element holding member are fastened. It is a perspective view showing the incorporation procedure to an image sensor holding member of an image sensor and a substrate. (A) is a perspective view which shows the state before the image pick-up element 33 and board | substrate 700 and image pick-up element holding member 510 in 2nd Embodiment become the image pick-up element unit 500, (b) is an image pick-up element in 2nd Embodiment, The rear view showing the dimensional relationship of a board | substrate and an image pick-up element holding member, (c) is a rear view showing the state which fastened the image pick-up element, board | substrate, and image pick-up element holding member in 2nd Embodiment. It is a perspective view showing the incorporating procedure to the image sensor holding member of the image sensor and board | substrate in 2nd embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the present invention according to the claims, and all combinations of features described in the present embodiments are essential to the solution means of the present invention. Not exclusively.

[Embodiment 1]
1 and 2 are perspective views showing the appearance of the digital single-lens reflex camera according to the first embodiment of the present invention. Specifically, FIG. 1 is a perspective view seen from the front side of the camera, showing a state in which the taking lens unit is removed, and FIG. 2 is a perspective view seen from the back side of the camera.

  In FIG. 1, reference numeral 1 denotes a camera body, which is provided with a grip portion 1a that protrudes forward so that a user can easily hold the camera stably during shooting. Reference numeral 2 denotes a mount unit that fixes a detachable photographic lens unit (not shown) to the camera body 1. The mount contact 21 has a function of exchanging control signals, status signals, data signals, and the like between the camera body 1 and the photographing lens unit and supplying power to the photographing lens unit. Further, the mount contact 21 may be configured to allow not only electrical communication but also optical communication, voice communication, and the like.

  Reference numeral 4 denotes a lens lock release button that is pushed in when removing the photographing lens unit. Reference numeral 5 denotes a mirror box disposed in the camera housing, and the photographic light flux that has passed through the photographic lens is guided here. A quick return mirror unit 900 is disposed inside the mirror box 5. The quick return mirror unit 900 is held at an angle of 45 ° with respect to the photographing optical axis to guide the photographing light flux in the direction of the pentaprism 22 (FIG. 3) and in the direction of the image sensor 33 (FIG. 3). In order to guide, it can be in a state of being held at a position retracted from the photographing light flux.

  On the grip side of the upper part of the camera, a shutter button 7 as a start switch for starting shooting, a main operation dial 8 for setting a shutter speed and a lens aperture value according to an operation mode at the time of shooting, and an operation mode of the shooting system A setting button 10 is arranged. Some of the operation results of these operation members are displayed on the LCD display panel 9.

  The shutter button 7 is configured such that the switch SW1 (7a in FIG. 3 to be described later) is turned on by the first stroke (half press) and the switch SW2 (7b in FIG. 3 to be described later) is turned on in the second stroke (full press). ing.

  The operation mode setting button 10 is used to set whether the continuous shooting or only one frame shooting is performed when the shutter button 7 is pressed once, the self shooting mode setting, and the like. 9 shows the setting status.

  A flash unit 11 that pops up with respect to the camera body, a shoe groove 12 for attaching a flash, and a flash contact 13 are arranged at the upper center of the camera, and a shooting mode setting dial 14 is arranged at the upper right side of FIG. ing.

  An external terminal lid 15 that can be opened and closed is provided on the side opposite to the grip side. Inside the external terminal lid 15, a video signal output jack 16 and a USB output connector are provided as external interfaces. 17 is stored.

  In FIG. 2, a viewfinder eyepiece window 18 is provided on the back side of the camera, and a color liquid crystal monitor 19 capable of displaying an image is provided near the center of the back side. The sub operation dial 20 arranged beside the color liquid crystal monitor 19 has an auxiliary role for the function of the main operation dial 8. For example, in the AE mode of the camera, it is used to set an exposure correction amount for an appropriate exposure value calculated by an automatic exposure device. Alternatively, in the manual mode in which each of the shutter speed and the lens aperture value is set according to the user's will, the main operation dial 8 is used to set the shutter speed and the sub operation dial 20 is used to set the lens aperture value. The The sub operation dial 20 is also used to select display of a captured image displayed on the color liquid crystal monitor 19. Reference numeral 43 denotes a main switch for starting or stopping the operation of the camera. Reference numeral 44 denotes a cleaning instruction member for operating the cleaning mode, which is used to instruct an operation of sieving foreign matters such as dust attached on the optical filter.

  FIG. 3 is a block diagram showing the main electrical configuration of the digital single-lens reflex camera according to the present embodiment. In addition, the part which is common in the above-mentioned drawing is shown with the same symbol.

  Reference numeral 100 denotes a central processing unit (hereinafter referred to as MPU) which is a microcomputer built in the camera body. The MPU 100 controls the operation of the camera, and executes various processes and instructions for each element. Reference numeral 100a denotes an EEPROM built in the MPU 100, which can store time information of the time measuring circuit 109 and other information.

  Connected to the MPU 100 are a mirror drive circuit 101, a focus drive circuit 102, a shutter drive circuit 103, a video signal processing circuit 104, a switch sense circuit 105, and a photometric circuit 106. A liquid crystal display drive circuit 107, a battery check circuit 108, a time measurement circuit 109, a power supply circuit 110, and a piezoelectric element drive circuit 111 are also connected. These circuits operate under the control of the MPU 100.

  Further, the MPU 100 communicates with the lens control circuit 201 disposed in the photographing lens unit via the mount contact 21. The mount contact 21 also has a function of transmitting a signal to the MPU 100 when the photographing lens unit is connected. Thereby, the lens control circuit 201 can communicate with the MPU 100 and drive the photographing lens 200 and the diaphragm 204 in the photographing lens unit via the AF driving circuit 202 and the diaphragm driving circuit 203. Become. In the present embodiment, the photographic lens 200 is shown as a single lens for convenience, but actually includes a large number of lens groups.

  The AF drive circuit 202 is configured by, for example, a stepping motor, and adjusts the imaging light flux to be focused on the image sensor 33 by changing the focus lens position in the imaging lens 200 under the control of the lens control circuit 201. The aperture drive circuit 203 is configured by, for example, auto iris, and is configured to change the aperture 204 by the lens control circuit 201 to obtain an optical aperture value.

  The quick return mirror unit 900 guides the photographic light beam passing through the photographic lens 200 to the pentaprism 22, and transmits a part of the photographic light beam to the pentaprism 22, and the sub mirror 30 that guides the transmitted photographic light beam to the focus detection sensor unit 31. It is configured.

  The mirror drive circuit 101 drives the quick return mirror unit 900 to a position where the subject image can be observed by the finder and a position where the subject image is retracted from the photographing light flux. Simultaneously with this operation, the sub mirror 30 is driven to a position for guiding the photographing light beam to the focus detection sensor unit 31 and a position for retracting from the photographing light beam. Specifically, for example, a DC motor and a gear train are included.

  The focus detection sensor unit 31 is a known phase difference composed of a field lens, a reflection mirror, a secondary imaging lens, a diaphragm, a line sensor composed of a plurality of CCDs, and the like disposed in the vicinity of an imaging surface (not shown). This is a focus detection sensor unit of the type. The signal output from the focus detection sensor unit 31 is supplied to the focus drive circuit 102, converted into a subject image signal, and then transmitted to the MPU 100. The MPU 100 performs a focus detection calculation by the phase difference detection method based on the subject image signal. Then, the defocus amount and the defocus direction are obtained, and based on this, the focus lens in the photographing lens 200 is driven to the in-focus position via the lens control circuit 201 and the AF drive circuit 202.

  The pentaprism 22 is an optical member that converts and reflects the photographing light beam reflected by the main mirror 6 into an erect image. The user can observe the subject image from the viewfinder eyepiece window 18 through the viewfinder optical system. The pentaprism 22 also guides a part of the photographing light flux to the photometric sensor 370. The photometric circuit 106 obtains the output of the photometric sensor 370, converts it into a luminance signal for each area on the observation surface, and outputs it to the MPU 100. The MPU 100 calculates an exposure value from the luminance signal thus obtained.

  Reference numeral 32 denotes a shutter unit that blocks a photographing light beam when a user observes a subject image with a viewfinder. In addition, it is a mechanical focal plane shutter that is configured to obtain a desired exposure time based on a time difference between a front blade group and a rear blade group (not shown) in response to a release signal during imaging. The shutter unit 32 is controlled by the shutter drive circuit 103 that has received an instruction from the MPU 100. Reference numeral 33 denotes an image sensor that converts an optical image of a subject into an electrical signal. For example, a CMOS that is an image pickup device is used. There are various types of imaging devices such as a CCD type, a CMOS type, and a CID type, and any type of imaging device may be adopted. Reference numeral 34 denotes a clamp / CDS (correlated double sampling) circuit, which performs basic analog processing before A / D conversion and can also change the clamp level. Reference numeral 35 denotes an AGC (automatic gain adjustment circuit) which performs basic analog processing before A / D conversion and can change the AGC basic level. Reference numeral 36 denotes an A / D converter that converts an analog output signal of the image sensor 33 into a digital signal.

  Reference numeral 410 denotes an infrared cut filter whose surface is covered with a conductive substance in order to prevent the adhesion of foreign matters. An optical low-pass filter 420 is formed by laminating a plurality of birefringent plates and phase plates made of quartz or the like. The optical low-pass filter 420 separates the light beam incident on the image sensor 33 into a plurality of light beams, and effectively reduces the generation of false resolution signals and false color signals.

  Reference numeral 430 denotes a vibration unit that applies vibration to the optical low-pass filter 420 and uses a piezoelectric element. It is configured to vibrate integrally with the infrared cut filter 410 by being vibrated by a piezoelectric element driving circuit 111 that has received a command from the MPU 100. Reference numeral 400 denotes an imaging unit unitized with the infrared cut filter 410, the piezoelectric element 430, the imaging element 33, and other components described later.

  The video signal processing circuit 104 performs overall image processing by hardware such as gamma / knee processing, filter processing, and information synthesis processing for monitor display on the digitized image data. The image data for monitor display from the video signal processing circuit 104 is displayed on the color liquid crystal monitor 19 via the color liquid crystal drive circuit 112. The video signal processing circuit 104 can also store image data in the buffer memory 37 through the memory controller 38 in accordance with an instruction from the MPU 100. Further, the video signal processing circuit 104 has a function of performing image data compression processing such as JPEG. When continuous shooting is performed, such as continuous shooting, image data can be temporarily stored in the buffer memory 37 and unprocessed image data can be sequentially read out through the memory controller 38. Thus, the video signal processing circuit 104 can sequentially perform image processing and compression processing regardless of the speed of the image data input from the A / D converter 36.

  The memory controller 38 has a function of storing image data input from the external interface 40 (corresponding to the video signal output jack 16 and the USB output connector 17 in FIG. 1) in the memory 39. In addition, it has a function of outputting image data stored in the memory 39 from the external interface 40. The memory 39 is a flash memory that can be attached to and detached from the camera body 1.

  The switch sense circuit 105 transmits an input signal to the MPU 100 according to the operation state of each switch. 7a is a switch SW1 that is turned on by the first stroke (half-press) of the shutter button 7. Reference numeral 7b denotes a switch SW2 that is turned on by the second stroke (fully pressed) of the shutter button 7. When the switch SW2 is turned on, the MPU 100 is instructed to start shooting. Further, the main operation dial 8, the sub operation dial 20, the photographing mode setting dial 14, the main switch 43, and the cleaning instruction member 44 are connected.

  The liquid crystal display driving circuit 107 drives the external LCD display panel 9 and the in-finder liquid crystal display 41 in accordance with an instruction from the MPU 100.

  A battery check circuit 108 performs a battery check for a predetermined time in accordance with a signal from the MPU 100 and sends the detection result to the MPU 100. A power supply unit 42 supplies necessary power to each element of the camera.

  The time measuring circuit 109 measures the time and date from when the main switch 43 is turned off until it is turned on, and can transmit the measurement result to the MPU 100 according to a command from the MPU 100.

  FIG. 4 is an exploded perspective view showing a schematic configuration inside the camera for explaining a holding configuration around the imaging unit 400.

  A mirror box 5 and a shutter unit 32 are arranged in this order from the subject side on the subject side of the main body chassis 300 that is a skeleton of the camera body. A quick return mirror unit 900 (not shown) is incorporated in the mirror box 5. ing. An imaging unit 400 is disposed on the photographer side of the main body chassis 300. In particular, the imaging unit 400 reduces the dimensional error of components so that the imaging surface of the imaging element 33 is spaced a predetermined distance and parallel to the mounting surface of the mount 2 that is a reference for mounting the photographic lens unit. It is adjusted by the adjusting spring 601 for absorbing and fixed to the mirror box 5.

  The imaging unit 400 includes a vibration unit 470 and an imaging element unit 500. The vibration unit 470 is fixed to the image sensor unit 500 with an elastic member interposed therebetween, but the detailed configuration is omitted by a known technique.

  The image sensor unit 500 includes at least an image sensor 33, a substrate 700 electrically connected to the image sensor, and an image sensor holding member 510.

  The substrate 700 is configured by a rigid substrate, a flexible substrate, or a rigid flexible substrate.

  FIG. 5A is a perspective view showing a state before the image pickup element 33, the substrate 700, and the image pickup element holding member become the image pickup element unit 500, and FIG. 5B is a rear view showing the dimensional relationship of each. c) is a rear view illustrating a state in which the imaging element 33, the substrate 700, and the imaging element holding member 510 are fastened together.

  Hereinafter, the configuration of the image sensor unit 500 will be described in detail.

  Attachment portions 33a to the image sensor holding member 510 are vertically arranged in the image sensor 33, and the substrate 700 is electrically connected in advance by solder or the like. Here, the distance C from the opposite end of the mounting portion 33 a is configured to be shorter than the diagonal length D of the opening of the image sensor holding member 510. Further, the outer shape of the substrate 700 is an opening of the image sensor holding member 510 in a range where a distance B equal to or greater than the thickness A of the image sensor holding member 510 is taken from one end portion 33b of the mounting surface 33a on two sides where the mounting portion 33a is present. It is smaller than the part size, and at least one of the remaining two sides is configured to be smaller than the image sensor holding member 510.

  Next, a procedure for assembling the imaging element 33 and the substrate 700 configured as described above to the imaging element holding member 510 will be described with reference to FIGS.

First, the image sensor 33 and the substrate 700 are inserted along the diagonal of the opening of the image sensor holding member 510 (FIGS. 6A to 6C).
The image sensor holding member 510 is rotated at the place where the image sensor mounting portion 33a has passed through the image sensor holding member 510 (FIGS. 6C to 6D).
The image sensor holding member 510 is moved as it is until the image sensor 33 and the substrate 700 come to the vicinity of the short side of the opening of the image sensor holding member 510 (FIGS. 6D to 6E).
The image sensor holding member 510 is tilted in the direction of the image sensor mounting portion 33a so that the image sensor mounting portion 33a and the image sensor holding member 510 are in contact with each other (FIGS. 6E to 6G).
The imaging element holding member 510 is fixed by the fixing member 600 from the fixing surface side to the mirror box 5.

  With such a configuration, the image sensor 33 and the substrate 700 are held from the fixed surface side to the mirror box 5 of the image sensor holding member 510 while keeping the aperture size of the image sensor holding member 510 to a minimum and ensuring the strength. The fixing member 600 can be attached.

  Thereby, while suppressing the protrusion amount of the fixed surface of the image sensor holding member 510, the holding strength of the image sensor 33 and the strength of the image sensor holding member 510 can be ensured.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

[Embodiment 2]
Next, a second embodiment of the present invention will be described. The second embodiment is a modified configuration of the image sensor unit 500 of the first embodiment, and the basic configuration of the camera is the same as that described above, and thus detailed description thereof is omitted.

  FIG. 7A is a perspective view showing a state before the image pickup device 330, the substrate 701, and the image pickup device holding member 511 become the image pickup device unit 500, and FIG. 7B is a rear view showing the dimensional relationship between them. FIG. 6C is a rear view illustrating a state in which the image sensor 330, the substrate 701, and the image sensor holding member 511 are fastened.

  Hereinafter, the configuration of the image sensor unit 500 will be described in detail.

  Attachment portions 330a, 330b, and 330c to the image sensor holding member 511 are respectively arranged on the image sensor 330 on the left and right sides in the short direction, and the substrate 701 is electrically connected in advance by solder or the like. Here, the distance E between the ends of the mounting portions 330 a, 330 b, and 330 c and the image sensor 330 facing each other is configured to be shorter than the diagonal length F of the opening of the image sensor holding member 511. Further, the outer shape of the substrate 701 has a distance G equal to or greater than the thickness A of the image sensor holding member 511 from the end portion 330d of the mounting surface 330a or the end portion 330e on one side of the mounting surface 330a on two sides of the mounting portions 330a, 330b, and 330c. In the range taken, it is smaller than the opening size of the image sensor holding member 511, and at least one of the remaining two sides is also smaller than the image sensor holding member 511.

  Next, the procedure for assembling the imaging device 330 and the substrate 701 configured as described above to the imaging device holding member 511 will be described with reference to FIGS.

First, the image sensor 330 and the substrate 701 are inserted along the diagonal of the opening of the image sensor holding member 511 (FIGS. 8A to 8B).
The image sensor holding member 511 is moved in the direction of the mounting portion 330c when the image sensor mounting portion 330a is removed from the image sensor holding member 511 (FIGS. 8B to 8C).
Next, the attachment portion 330c is further inserted until it passes through the image sensor holding member 511 (FIGS. 8C to 8D).
The image sensor holding member 511 is moved in the direction of the mounting portion 330b when the image sensor mounting portion 330c is removed (FIGS. 8D to 8E).
Next, it is further inserted until the attachment portion 330b passes through the image sensor holding member 511 (FIGS. 8E to 8F).
The image pickup device holding member 511 is rotated when the image pickup device attaching portion 330b is removed from the image pickup device holding member 511. The holding member 511 is moved (FIGS. 8F to 8G).
The image sensor holding member 511 is tilted in the direction of the image sensor mounting portions 330a, 330b, 330c so that the image sensor mounting portions 330a, 330b, 330c and the image sensor holding member 511 are in contact with each other (FIGS. 8G to 8G). i)),
The imaging element holding member 511 is fixed by the fixing member 600 from the fixing surface side to the mirror box 5.

  With such a configuration, the image sensor 330 and the substrate 701 are held from the fixed surface side to the mirror box 5 of the image sensor holding member 511 while keeping the opening size of the image sensor holding member 511 to a minimum and ensuring the strength. The fixing member 600 can be attached.

  Thereby, while suppressing the protrusion amount of the fixed surface of the image sensor holding member 511, the holding strength of the image sensor 330 and the strength of the image sensor holding member 511 can be secured.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

1 camera body, 2 mount, 5 mirror box, 19 color LCD monitor,
32 Shutter unit, 33, 330 Image sensor,
33a, 330a, 330b, 330c Image sensor fixing portion,
33b, 330d, 330e Ends of the image sensor fixing part, 300 main body chassis,
400 imaging unit, 410 infrared cut filter, 430 piezoelectric element,
450 elastic member, 460 urging member, 470 vibration unit,
500 image sensor unit, 510, 511 image sensor holding member, 600 fixing member,
700,701 substrate

Claims (12)

An image sensor (33), a substrate (700) connected to the image sensor (33), and an image sensor holding member (510) having a rectangular opening for holding the image sensor (33);
The image pickup element (33) has attachment portions (33a) to the image pickup element holding member disposed on two opposite sides of the image pickup element (33), and the image pickup element (33) is connected to the image pickup element holding member (510). In the image sensor holding configuration that is fixed to the) by the fixing member (600),
The distance (C) from the opposite end of the mounting portion (33a) is shorter than the diagonal length (D) of the opening of the image sensor holding member (510) and is connected to the image sensor (33). The outer shape of the substrate (700) thus obtained is a distance equal to or greater than the thickness (A) of the image sensor holding member (510) from one end (33b) of the attachment surface (33a) on the two sides with the attachment portion (33a) (B) is smaller than the opening size of the image sensor holding member (510), and at least one of the remaining two sides is smaller than the image sensor holding member (510). An image sensor holding configuration of the image pickup apparatus. The imaging device holding configuration of the imaging apparatus according to claim 1, wherein a projected area of the substrate (700) is larger than that of the imaging device (33). The imaging device according to claim 1 or 2, wherein the imaging device (33) is fastened to the imaging device holding member (510) by a fixing member (600) from the subject side in the optical axis direction. Image pickup element holding configuration. The imaging device holding structure of the imaging device according to any one of claims 1 to 3, wherein the substrate (700) is a rigid substrate. The imaging device holding structure of the imaging device according to any one of claims 1 to 3, wherein the substrate (700) is a flexible substrate. The imaging device holding structure of the imaging device according to any one of claims 1 to 3, wherein the substrate (700) is a rigid flexible substrate. An image sensor (330), a substrate (701) connected to the image sensor (330), and an image sensor holding member (511) having a rectangular opening for holding the image sensor (330);
The image pickup device (330) has at least two attachment sides (330a) and (330b) to the image pickup device holding member arranged at least two on one side and one on the other side on two opposite sides of the image pickup device (330). And (330c), in which the imaging element (330) is fixed to the imaging element holding member (511) by the fixing member (600).
The distance (E) to the end of the image sensor (330) facing each of the three attachment parts (330a), (330b), and (330c) is a pair of openings of the image sensor holding member (511). The outer shape of the substrate (701), which is shorter than the angular length (F) and connected to the image sensor (330), is attached on two sides with three attachment portions (330a), (330b), and (330c). In a range where a distance (G) equal to or larger than the thickness (A) of the image sensor holding member (511) is taken from one end (330d) of the surface (330a) or one end (330e) of the mounting surface (330b). An imaging device characterized in that it is smaller than the size of the opening of the image sensor holding member (511) and at least one of the remaining two sides is smaller than the image sensor holding member (511). Child holding configuration. The imaging device holding configuration of the imaging apparatus according to claim 7, wherein a projected area of the substrate (701) is larger than that of the imaging device (330). The image pickup device according to claim 7 or 8, wherein the image pickup device (330) is fastened to the image pickup device holding member (511) by a fixing member (600) from the subject side in the optical axis direction. Image pickup element holding configuration. The imaging device holding configuration of the imaging device according to any one of claims 7 to 9, wherein the substrate (701) is a rigid substrate. The imaging device holding configuration of the imaging device according to any one of claims 7 to 10, wherein the substrate (701) is a flexible substrate. The imaging device holding structure of the imaging device according to any one of claims 7 to 11, wherein the substrate (701) is a rigid flexible substrate.