JP2017059588A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To withstand a breaking phenomenon of a solder joint such as a creep phenomenon even when being a compact electronic part.SOLUTION: In a smartphone 1 provided with a circuit board 5 soldered with a connector 30 having a spring contact 30a, a load reducing component 31 is fixed to the circuit board 5, and the load reducing component 31 receives a reactive force of the spring contact 30a applied to the connector 30 and reduces an influence of the load applied to a solder.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device including a circuit board on which electronic components such as a connector having a spring and a switch component are soldered, and particularly relates to a countermeasure against a breakdown phenomenon that occurs in a soldered portion of a mounted component due to an external load.

  2. Description of the Related Art Conventionally, as in Patent Document 1, for example, a connector that is mounted on a substrate and is electrically connected by pressing a spring contact that operates in the surface direction of the substrate against the other party is known. This connector is usually electrically connected to the substrate by soldering. Since the main purpose of soldering is electrical connection, it has low mechanical strength and is sensitive to temperature, so it tends to creep even at room temperature. Creep refers to a phenomenon in which when a metal or plastic material is subjected to stress or high temperature for a long time, it undergoes permanent deformation and eventually breaks.

  In the connector of Patent Document 1, a peg is provided on the connector in order to prevent the connector from being displaced due to a creep phenomenon caused by a spring load, thereby obtaining a high fixing strength with the substrate.

JP 2010-170748 A

  By the way, in the case of a connector that has become large due to the large number of terminals and large current that flows, not only the pegs, but also the lower end of the contact is fixed to the board by soldering, and the fixed part is enlarged to make the total By increasing the soldering area, high fixing strength is ensured.

  However, a connector that is small due to a small number of terminals or a small current has a problem that even if a peg is provided, the total soldering area is small and sufficient fixing strength cannot be obtained.

  The present invention has been made in view of such points, and the object of the present invention is to solder a mounting component by an external load such as a creep phenomenon even in an electronic component such as a small connector or a switch component. It is to be able to withstand the destruction that occurs in the part.

  In order to achieve the above object, in the present invention, a component for reducing the influence of an external load on the soldering portion is provided.

Specifically, in the present invention, on the premise of an electronic device including a circuit board to which an electronic component having a spring is soldered,
A load reducing component that receives a reaction force of a spring applied to the electronic component and reduces an influence of a load applied to the soldering portion is fixed to the circuit board.

  According to the above configuration, the reaction force of the spring is not received by the soldering, but the spring reaction force is received by the load reducing component, so that a creep rupture or the like does not occur in the soldering portion as in the prior art.

  As described above, according to the present invention, the circuit board is subjected to the reaction force of the spring applied to the electronic component, and the load reducing component that reduces the influence of the load applied to the soldering is fixed. Even so, it can withstand the breakage that occurs in the soldered part.

FIG. 3 is an enlarged cross-sectional view taken along line II in FIG. 2. It is a perspective view which shows the smart phone which concerns on embodiment of this invention. It is a disassembled perspective view which shows a smart phone. It is the front view which made the circuit board visible, and its partially expanded front view. It is a front view which expands and shows a connector, load reduction components, and its periphery. It is a perspective view which expands and shows a connector, load reduction components, and its periphery. It is a front view which shows the case where a connector and load reduction components can be assembled. It is the VIII-VIII line expanded sectional view of FIG. It is a front view which shows the case where a connector and load reduction components cannot be assembled. FIG. 10 is an enlarged sectional view taken along line XX in FIG. 9. FIG. 3 is a view corresponding to FIG. 1 according to Embodiment 2 of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
1 to 3 show a smartphone 1 as an electronic apparatus according to Embodiment 1 of the present invention. The smartphone 1 includes, for example, a housing 3 that houses a display unit 2 including a touch screen on the front side, and a back side thereof. A circuit board 5 housed on the back side of the sheet metal 3a insert-molded in the housing 3, a rechargeable battery 6 on the back side, and a main antenna assembly 7 on the lower side. ing. For example, a terminal cover 8 made of an detachable elastomer is provided on the left side surface of the smartphone 1.

  And as shown in FIG. 4, the decoration member 3b is provided in the surface side of the right-and-left side surface of the housing | casing 3, and the electrostatic sensor 9 is provided in the back surface side. A shield component 10 is provided on the front side of the circuit board 5 to prevent noise from being generated from a plurality of mounted electronic components (not shown). The shield component 10 is configured by, for example, a stainless thin plate folding structure.

  A connector 30 as an electronic component having a spring contact as a spring is mounted on the circuit board 5 so as to correspond to the left and right electrostatic sensors 9. Specifically, the connector 30 is provided on a pair of opposing peripheral edges of the circuit board 5. For this reason, since the position of the circuit board 5 is optimized by the spring loads on both the left and right sides, the spring pressure is stabilized.

  As shown in FIGS. 4 to 6, the connector 30 is electrically connected and fixed to the circuit board 5 by soldering, and a spring contact 30 a having an elastic force that urges left and right is protruding. 5 and 6, a part of the housing 3 and the electrostatic sensor 9 are omitted for easy viewing. The load reducing component 31 covers the opposite side of the spring contact 30a. The load reducing component 31 is made of, for example, a resin molded product that is an insulator, and includes a protrusion 31 a that abuts against a surface of the connector 30 opposite to the spring contact 30 a. The protrusion 31a is, for example, hemispherical, and is in contact with the connector 30 without a gap. In FIG. 1, for convenience, the spring contact 30 a bites into the electrostatic sensor 9. Actually, the spring contact 30 a is pushed into the electrostatic sensor 9 and enters the connector 30, and the apex of the spring contact 30 a contacts the surface of the electrostatic sensor 9.

  The load reducing component 31 has a pair of hook portions 31b that are hooked on the periphery of the circuit board 5, and is configured to receive the reaction force of the spring contact 30a by these hook portions 31b. The load reducing component 31 is fixed to the circuit board 5 with a double-sided tape, for example. The load reducing component 31 may be fixed to the circuit board 5 by a claw structure or a board insertion structure instead of the double-sided tape. The load reducing component 31 is preferably made of a resin material such as polycarbonate or ABS, but may be made of a sheet metal material such as stainless steel. The height H2 in the thickness direction of the housing 3 of the load reducing component 31 is set to be higher than the height H1 of the connector 30 (H2> H1).

  Here, if the main body of the connector 30 is made of a conductive material and is electrically connected to the spring contact 30a, a short circuit may occur when the main body and surrounding electrical components come into contact with each other. However, in this embodiment, the load reducing component 31 formed of a resin molded product that is an insulator surrounds the connector 30 and prevents contact with the components surrounding the connector 30, thereby further reducing the possibility of short-circuiting. It is effective.

  The peripheral edge of the circuit board 5 has a notch 5a cut inward from the periphery. The notch 5 a is formed at a position facing the electrostatic sensor 9, and the connector 30 is mounted inside the left and right sides of the circuit board 5 by the amount of the notch 5 a.

  In the present embodiment, with this configuration, the urging force of the spring contact 30a receives a reaction force that causes the connector 30 to move to the left and right, but in reality, the load reducing component 31 receives the reaction force. The connector 30 does not move on the circuit board 5. That is, since the hook portion 31b of the load reducing component 31 is hooked on the periphery of the notch 5a of the circuit board 5 and receives a load, the soldering portion between the connector 30 and the circuit board 5 is damaged by an external load such as a creep phenomenon. Can be prevented.

  Further, the protruding portion 31a is in contact with the connector 30 without a gap, and the protruding portion 31a supports the connector 30 with a limited area rather than a wide area. When the protrusion 31a and the connector 30 are in contact with each other without any gap, the creep phenomenon or the like can be effectively suppressed. However, when configured in this way, the contact area between the spring contact 30a and the load reducing component 31 is too large. If there is a slight deformation or inclination of each part, there is a possibility that it cannot be incorporated. However, in the present embodiment, since the protrusion 31a is formed in a spherical shape, there is no problem in assembling even if the component has some deformation or inclination. Specifically, as shown in FIG. 7 and FIG. 8, the presence of the protrusion 31a makes it possible to reduce the load even if the shape of the load reducing component 31 is slightly deformed from the regular shape as shown in FIG. The inner surface of the reduction component 31 and the connector 30 do not interfere with each other and can be assembled. However, as shown in FIGS. 9 and 10, if the load reducing component 31 ′ has no protrusion 31a, the inner surface of the load reducing component 31 ′ may interfere with the load reducing component 31 ′ if the shape of the load reducing component 31 ′ is deformed. So it can't be integrated.

  In addition, by providing a notch 5a that cuts out the periphery of the circuit board 5 to the back side, the spring contact 30a is too close to the side wall of the housing 3 when the circuit board 5 is fitted into the housing 3. The excessive pushing displacement of 30a can be prevented, and the spring contact 30a can be prevented from being damaged.

  Further, by making the height H2 of the load reducing component 31 slightly higher than the height H1 of the connector 30, the load reducing component 31 receives the compressive load generated between the circuit board 5 and the sheet metal 3a. 30 is not damaged.

  For example, when an impact load is applied to the rear panel 4 from the outside, the circuit board 5 is pushed in the direction of the sheet metal 3a from the rear panel 4 via an internal component (the rechargeable battery 6 or the like). Due to this load, the circuit board 5 tries to bend so that the distance from the sheet metal 3a is narrow. However, since the load reducing component 31 having a height higher than that of the connector 30 exists, the sheet metal 3a and the connector 30 are not in contact with each other. Therefore, damage to the connector 30 can be prevented.

  Therefore, according to the smartphone 1 according to the present embodiment, even the small connector 30 can reliably withstand the creep phenomenon.

(Embodiment 2)
FIG. 11 shows Embodiment 2 of the present invention, which is different from Embodiment 1 in that the shape of the electrostatic sensor 9 is different. In the present embodiment, the same portions as those in FIGS. 1 to 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

  That is, in this embodiment, the chamfer 9a is formed at the corner of the electrostatic sensor 9 on the spring contact 30a side. The chamfer 9a may be a C chamfer or a round chamfer.

  That is, in the structure in which the spring contact 30a is applied to the electrostatic sensor 9 provided on the inner wall of the housing 3 as in the present embodiment, the mounting direction of the circuit board 5 to the housing 3 (downward in FIG. 11) and the spring contact Since the urging direction of 30a (the left-right direction in FIG. 11) intersects, there is a problem that the spring contact 30a is easily damaged at the time of mounting.

  However, in this embodiment, since the chamfer 9a is formed on the electrostatic sensor 9, even when the circuit board 5 is mounted on the housing 3, the chamfer 9a is smooth even if the spring contact 30a and the electrostatic sensor 9 come into contact with each other. Thus, it is possible to reliably prevent the impact load from being pushed back.

  In the present embodiment, the load reducing component 31 is in contact with another component that receives the reaction force of the spring contact 30a on the opposite side of the spring contact 30a. Specifically, the shield component 10 provided on the circuit board 5 receives the reaction force of the load reducing component 31. If it carries out like this, the load added to the hook part 31b can be reduced, and it will become unnecessary to provide the hook part 31b depending on the case.

(Other embodiments)
The present invention may be configured as follows with respect to the above embodiment.

  That is, in the above-described embodiment, the connectors 30 are provided on the left and right opposing sides of the circuit board 5, but the upper and lower opposing sides may be provided, may be provided on non-opposing sides, or may be provided on the same side. Good. Furthermore, the connector 30 may be provided independently.

  Although the example of the spring contact 30a is shown as a spring in the said embodiment, the case where this spring itself does not have a function of a contact is also included. For example, any structure may be used as long as a load is applied to the electronic component by a spring structure having no contact function.

  In the above embodiment, the electronic device is the smartphone 1, but a mobile phone, a tablet terminal, a PHS (Personal Handy-phone System), a PDA (Personal Digital Assistant), a personal computer, a mobile phone provided with the connector 30 having the spring contact 30a. A tool, a wearable terminal, an electronic dictionary, a calculator, a game machine, etc. may be sufficient, and a small liquid crystal display, a liquid crystal television, a Blu-ray disc recorder, a DVD recorder, etc. may be sufficient.

  In addition, the above embodiment is an essentially preferable illustration, Comprising: It does not intend restrict | limiting the range of this invention, its application thing, or a use. The technical features described in each embodiment can be combined with each other, and a new technical feature can be formed by combining them.

1 Smartphone (electronic equipment)
2 display section
3 Case
3a Sheet metal
3b Decorative member
4 Back panel
5 Circuit board
5a Notch
6 Rechargeable battery
7 Main antenna assembly
8 Terminal cover
9 Electrostatic sensor
10 Shield parts (separate parts)
30 Connector (electronic component)
30a Spring contact (spring)
31 Load reduction parts
31a Protrusion
31b Hook

Claims (5)

In an electronic device including a circuit board to which an electronic component having a spring is soldered,
An electronic device, wherein a load reducing component that receives a reaction force of a spring applied to the electronic component and reduces an influence of a load applied to the soldering portion is fixed to the circuit board. The electronic device according to claim 1,
The electronic device according to claim 1, wherein the load reducing component has a hook portion that is hooked on a peripheral edge of the circuit board, and is configured to receive a reaction force of the spring at the hook portion. The electronic device according to claim 1 or 2,
The electronic device according to claim 1, wherein the load reducing component has a protrusion that abuts against a surface of the electronic component opposite to the spring. The electronic device according to any one of claims 1 to 3,
The load reducing component is an electronic device comprising a resin molded product which is an insulator. In the electronic device according to any one of claims 1 to 4,
The electronic device is provided on a pair of opposing peripheral edges of the circuit board.