JP2017045811A - Electromagnetic wave shield product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve electromagnetic wave shield effect on an electromagnetic wave shield product using a composite of an insulation layer and a metal layer.SOLUTION: The electromagnetic wave shield product includes: an inner space for housing an electromagnetic wave radiation source; and a shield wall having an inner surface being in contact with the inner space and an outer surface being in contact with an outer space and for defining a boundary of the inner space and the outer space. The shield wall is constituted of a compact having a structure in which two or more metal foils are laminated through a solid-like insulation layer. The innermost layer of the compact forming the inner surface of the shield wall and the outermost layer of the compact forming the outer surface of the shield wall are both constituted of a metal foil. The outermost layer is at least connected to the ground.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electromagnetic wave shielding product. In particular, the present invention relates to an electromagnetic wave shielding product used as a coating material or exterior material for electric / electronic devices.

  In recent years, interest in global environmental issues has increased worldwide, and the spread of environmentally friendly vehicles equipped with secondary batteries such as electric vehicles and hybrid vehicles is progressing. Many of these automobiles employ a method of obtaining a driving force by converting a direct current generated from a mounted secondary battery into an alternating current through an inverter and then supplying necessary power to the alternating current motor. Electromagnetic waves are generated due to the switching operation of the inverter. Since electromagnetic waves interfere with the reception of in-vehicle acoustic devices and wireless devices, measures have been taken to shield the electromagnetic waves by housing a battery, a motor or the like together with an inverter or an inverter in a metal case (Japanese Patent Laid-Open No. 2003). -285002).

  Moreover, electromagnetic waves are radiated not only from automobiles but also from many electric / electronic devices including communication devices, displays, and medical devices. Electromagnetic waves can cause malfunction of precision equipment, and there is also concern about the effects on the human body. For this reason, various techniques for reducing the influence of electromagnetic waves using electromagnetic shielding materials have been developed. For example, a copper foil composite formed by laminating a copper foil and a resin film is used as an electromagnetic shielding material (Japanese Patent Laid-Open No. 7-290449). The copper foil has electromagnetic shielding properties, and the resin film is laminated for reinforcing the copper foil. There is also known an electromagnetic wave shield structure in which metal layers are laminated on the inner side and the outer side of an intermediate layer made of an insulating material (Japanese Patent No. 4602680). An electromagnetic wave shielding optical member comprising: a base substrate; and a laminated member formed on one surface of the base substrate and including a plurality of repeating unit films including a metal layer and a high refractive index layer (niobium pentoxide). Is also known (Japanese Patent Laid-Open No. 2008-21979).

  In addition, when two metal foils are stacked to form an air layer between the two metal foils, the shielding effect is greater than when only one metal foil having a thickness obtained by adding the thicknesses of both metal foils is used. As an improvement, a metal foil composed of a conductive metal, a laminated sheet in which a thermoplastic resin layer is stacked on a conductive metal layer, and two sheets of other electromagnetic shielding sheets stacked with a gap therebetween There is also known an electromagnetic wave shielding case comprising a sheet covering the inner or outer surface of a resin case body and having an earth terminal portion for grounding the conductive metal of each electromagnetic wave shielding sheet (Japanese Patent Laid-Open No. 2013-2013). 149887).

JP 2003-285002 A JP 7-290449 A Japanese Patent No. 4602680 JP 2008-21979 A JP 2013-149887 A

  In automobiles, weight reduction has become a major issue from the viewpoint of improving fuel efficiency, and the switch from metal materials to resin materials and carbon fiber materials is also under investigation. However, the resin material and the carbon fiber material cannot be expected to have an electromagnetic wave shielding effect. However, if the thickness of the metallic electromagnetic shielding material is made too small, an excellent shielding effect (for example, 36 dB or more at 1 MHz to 1000 MHz) cannot be obtained. The techniques described in JP-A-7-290449, JP-A-4602680, and JP-A-2008-21979 are aimed at a shielding effect with a composite of an insulating layer and a metal layer, and a certain weight reduction is achieved. Although it is possible, there is still room for improvement in shielding effectiveness. The technique described in Japanese Patent Application Laid-Open No. 2013-149887 discloses that a conductive metal of an electromagnetic wave shielding sheet is grounded. Although the shielding effect can be expected to be improved to some extent by connecting to the ground, it is desirable to obtain a larger shielding effect.

  The present invention was created in view of the above circumstances, and an object of the present invention is to improve the electromagnetic shielding effect in an electromagnetic shielding product using a composite of an insulating layer and a metal layer.

  The present inventor has made extensive studies to solve the above problems, and applied a composite foil formed by laminating two or more metal foils via an insulating layer to a shield wall to provide an electromagnetic shielding case or the like. When forming an electromagnetic shielding product, a solid insulating layer is adopted, and the innermost layer of the molded body that forms the inner surface of the shield wall and the outermost layer of the molded body that forms the outer surface of the shield wall are both made of metal foil. It has been found that it is advantageous to enhance the electromagnetic wave shielding effect by configuring and connecting both the innermost layer and the outermost layer to ground. This invention is completed based on the said knowledge, and can be specified as follows.

  In one aspect, the present invention includes an internal space for accommodating an electromagnetic wave radiation source, a shield wall having an inner surface in contact with the inner space and an outer surface in contact with the outer space, and defining a boundary between the inner space and the outer space. The electromagnetic wave shielding product, wherein the shielding wall is composed of a molded body having a structure in which two or more metal foils are laminated via a solid insulating layer, and forms the inner surface of the shielding wall. The innermost layer of the molded body and the outermost layer of the molded body forming the outer surface of the shield wall are both made of metal foil, and the outermost layer is an electromagnetic wave shield product connected to at least ground.

  In one embodiment of the electromagnetic wave shielding product according to the present invention, all of the two or more metal foils constituting the shielding wall are electrically connected.

  In another embodiment of the electromagnetic wave shielding product according to the present invention, among the metal foils constituting the shield wall, at least two metal foils each have a portion that protrudes outward from the side edge of the insulating layer. The protruding portions are in contact with each other so that the at least two metal foils are electrically connected.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, all the metal foils constituting the shielding wall each have a portion that protrudes outward from the side edge of the insulating layer, and the protrusion protruded. All the metal foils are electrically connected by contacting the parts.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, all insulating layers constituting the shield wall are sealed with a conductive material.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, all insulating layers constituting the shield wall are sealed with two or more metal foils constituting the shield wall.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, there is no electrical gap on at least one of the inner surface and the outer surface.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, at least one insulating layer constituting the shield wall has a hole penetrating in the thickness direction, and two upper and lower layers of the insulating layer are provided. The metal foil is electrically connected via a conductive material disposed inside the hole.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, the shielding wall has a structure in which at least three metal foils are laminated via an insulating layer.

In still another embodiment of the electromagnetic wave shielding product according to the present invention, all combinations of the metal foil and the insulating layer constituting the shielding wall satisfy σ _M × d _M × d _R ≧ 3 × 10 ⁻³ . .
However, the symbol in a formula shows the following.
σ _M : conductivity of metal foil at 20 ° C. (S / m)
d _M : Metal foil thickness (m)
d _R : thickness of insulating layer (m)

In still another embodiment of the electromagnetic wave shielding product according to the present invention, the electric conductivity at 20 ° C. of each metal foil constituting the shielding wall is 1.0 × 10 ⁶ S / m or more.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, the thickness of each metal foil constituting the shielding wall is 4 to 100 μm.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, the relative dielectric constant at 20 ° C. of each insulating layer constituting the shielding wall is 2.0 to 10.0.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, the thickness of each insulating layer constituting the shield wall is 4 to 500 μm.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, the total thickness of the metal foils constituting the shielding wall is 15 to 150 μm.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, in each metal foil constituting the shield wall, assuming that the maximum thickness is A and the minimum thickness is B, in any metal foil, B / A ≧ 0.5.

  In still another embodiment of the electromagnetic wave shielding product according to the present invention, in each insulating layer constituting the shield wall, assuming that the maximum thickness is C and the minimum thickness is D, in any insulating layer, D / C ≧ 0.5.

  In another aspect, the present invention is an electric / electronic device housed in the electromagnetic wave shielding product according to the present invention.

  In the electromagnetic wave shielding product according to the present invention, a shield wall is constituted by a composite foil molded body in which two or more metal foils are laminated under a predetermined condition through an insulating layer, and the shield wall is grounded under a predetermined condition. By doing so, it is possible to obtain an electromagnetic wave shielding effect superior to that of using a composite foil molded body obtained by simply laminating a metal foil and an insulating layer as a shield wall. Moreover, the electromagnetic wave shielding material according to the present invention can be constructed with a simple configuration of a metal foil and an insulating layer, and is excellent in economic efficiency.

The laminated structure of the electromagnetic wave shielding material of Comparative Example 1-1 is shown. The laminated structure of the electromagnetic wave shielding material of Comparative Example 1-2 is shown. The laminated structure of the electromagnetic wave shielding material of Example 1-1 and Example 1-3 is shown. The laminated structure of the electromagnetic wave shielding material of Example 1-2 is shown. The result of the magnetic field shield effect evaluation test in Test Example 1 is shown. The result of the magnetic field shield effect evaluation test in Test Example 2 is shown. The laminated structure of the electromagnetic shielding material (a)-(d) used for the magnetic field shield effect evaluation test in Test Example 3 is shown. The laminated structure of the electromagnetic shielding material (e)-(i) used for the magnetic field shield effect evaluation test in Test Example 3 is shown. The laminated structure of electromagnetic wave shielding material (j)-(m) used for the magnetic field shield effect evaluation test in Test Example 3 is shown. The result of the magnetic field shielding effect evaluation test in Test Example 3 is shown ((a) to (d)). The result of the magnetic field shield effect evaluation test in Test Example 3 is shown ((e) to (i)). The result of the magnetic field shield effect evaluation test in Test Example 3 is shown (comparison of (a), (b), (e), and (f)). The result of the magnetic field shielding effect evaluation test in Test Example 3 is shown ((j) to (m)). It is a schematic cross section which shows the structural example of the electromagnetic wave shield goods which concern on this invention.

(Metal foil)
Although there is no restriction | limiting in particular as a metal foil material used for the shield wall of the electromagnetic wave shield goods which concern on this invention, From a viewpoint of improving the shield characteristic with respect to an alternating current magnetic field or an alternating electric field, it is set as the metal material excellent in electroconductivity. preferable. Specifically, it is preferably formed of a metal having an electrical conductivity of 1.0 × 10 ⁶ S / m (a value at 20 ° C., the same shall apply hereinafter), and the electrical conductivity of the metal is 10.0 × 10 ⁶ S / m. m is more preferably 30.0 × 10 ⁶ S / m or more, and most preferably 50.0 × 10 ⁶ S / m or more. Such metals include iron conductivity of about 9.9 × 10 ⁶ S / m, the conductivity of about 14.5 × 10 ⁶ S / m of nickel, the conductivity of about 39.6 × 10 ⁶ S Aluminum having a conductivity of about 58.0 × 10 ⁶ S / m, and silver having a conductivity of about 61.4 × 10 ⁶ S / m. Considering both conductivity and cost, it is preferable in practical use to use aluminum or copper. The metal foil used for the shield wall according to the present invention may all be the same metal, or a different metal may be used for each layer. Moreover, the metal alloy mentioned above can also be used. Various surface treatment layers for the purpose of adhesion promotion, environmental resistance, heat resistance and rust prevention may be formed on the surface of the metal foil.

  For example, Au plating, Ag plating, Sn plating, Ni plating, Zn plating, Sn alloy plating (Sn-Ag) for the purpose of enhancing the environmental resistance and heat resistance required when the metal surface is the outermost layer. , Sn-Ni, Sn-Cu, etc.), chromate treatment, and the like. These processes may be combined. From the viewpoint of cost, Sn plating or Sn alloy plating is preferable.

  Further, for the purpose of improving the adhesion between the metal foil and the insulating layer, chromate treatment, roughening treatment, Ni plating and the like can be performed. These processes may be combined. Roughening treatment is preferable because adhesion can be easily obtained.

  In addition, a metal layer having a high relative permeability can be provided for the purpose of enhancing the shielding effect against a DC magnetic field. Examples of the metal layer having a high relative magnetic permeability include Fe—Ni alloy plating and Ni plating.

  When using copper foil, since a shield performance improves, a thing with high purity is preferable, and purity is preferably 99.5 mass% or more, More preferably, it is 99.8 mass% or more. As the copper foil, a rolled copper foil, an electrolytic copper foil, a copper foil by metallization, or the like can be used, and a rolled copper foil excellent in flexibility and moldability is preferable. When alloy elements are added to the copper foil to obtain a copper alloy foil, the total content of these elements and inevitable impurities may be less than 0.5% by mass. In particular, when the copper foil contains at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si, and Ag in a total amount of 200 to 2000 ppm by mass, pure copper foil having the same thickness This is preferable because the elongation is further improved.

  The thickness of the metal foil used for the shield wall according to the present invention is preferably 4 μm or more per sheet. If it is less than 4 μm, the ductility of the metal foil is remarkably lowered, and the molding processability of the shield wall may be insufficient. Further, if the thickness of the foil per sheet is less than 4 μm, it is necessary to laminate a large number of metal foils in order to obtain an excellent electromagnetic wave shielding effect, which causes a problem that the manufacturing cost increases. From such a viewpoint, the thickness of the metal foil is more preferably 10 μm or more, still more preferably 15 μm or more, still more preferably 20 μm or more, and further preferably 25 μm or more. More preferably, it is 30 μm or more. On the other hand, the thickness of the foil is preferably 100 μm or less, more preferably 50 μm or less, and more preferably 45 μm because the moldability deteriorates even if the thickness of the foil per sheet exceeds 100 μm. It is still more preferable that it is below, and it is still more preferable that it is 40 micrometers or less.

  The shield wall according to the present invention is characterized in that at least two of the outermost layer and the innermost layer are made of metal foil. For this reason, if there are at least two layers of metal foil, the effects of the present invention can be achieved. However, if there are two metal foil layers, the total thickness of the metal foil required to obtain a magnetic field shielding characteristic of 30 dB or more in a low frequency region with a frequency of about 1 MHz will increase. Since the thickness of the foil is increased, the moldability is adversely affected. For this reason, it is preferable to laminate three or more metal foils from the viewpoint of ensuring excellent electromagnetic wave shielding characteristics while reducing the total thickness of the metal foil. By laminating three or more metal foils, even when the total thickness of the metal foils is the same, the shielding effect is remarkably improved as compared with the case where the metal foil is a single layer or when two metal foils are laminated. However, although the electromagnetic shielding characteristics are improved when the number of laminated metal foils is increased, increasing the number of laminated layers increases the number of lamination processes, leading to an increase in manufacturing costs, and the effect of improving the shield tends to be saturated. The number of metal foils in the wall is preferably 5 or less, more preferably 4 or less.

  Therefore, in one embodiment of the shield wall according to the present invention, the total thickness of the metal foil can be 15 to 150 μm, can be 100 μm or less, can be 80 μm or less, and can be 60 μm or less. You can also

  Considering the stability and reliability of the shielding effect, it is preferable that the thickness of each metal foil has little variation. This is because if the thickness of the metal foil varies depending on the location, the shielding effect varies from location to location. Specifically, in each metal foil constituting the shield wall, assuming that the maximum thickness is A and the minimum thickness is B, in any metal foil, it is preferable that B / A ≧ 0.5, and B / A More preferably, ≧ 0.75, even more preferably B / A ≧ 0.85, still more preferably B / A ≧ 0.95, and B / A≈1. Most preferred.

  The thickness of the metal foil can be measured by observing the cross section with an SEM or the like. For example, when the observation magnification is 1000, a range of 100 μm length perpendicular to the thickness direction can be observed. In the present invention, 10 cross sections arbitrarily selected are observed, the maximum and minimum values of the thickness of the metal foil reflected in the range of the length of 100 μm are measured for each cross section, and the maximum of 10 cross sections is measured. The value is A and the minimum value is B.

(Insulating layer)
The remarkable improvement of the electromagnetic wave shielding effect by laminating a plurality of metal foils can be obtained by sandwiching a solid insulating layer between the metal foils. If the insulating layer is composed of a gas such as an air layer or a liquid such as an organic solvent, it is difficult to keep the gap between the metal foils constant, and it is difficult to satisfy D / C ≧ 0.5 described later. Even if the metal foils are directly stacked, the shielding effect is improved by increasing the total thickness of the metal foils, but a remarkable improvement effect cannot be obtained. This is presumably because the presence of the insulating layer between the metal foils increases the number of reflections of the electromagnetic wave and attenuates the electromagnetic wave.

  A solid insulating layer having a larger impedance difference from the metal foil is preferable for obtaining an excellent electromagnetic shielding effect. In order to cause a large difference in impedance, it is necessary that the dielectric constant of the insulating layer is small. Specifically, it is preferably 10 or less (the value at 20 ° C., the same shall apply hereinafter) or less, and 5.0 or less. Is more preferable, and it is still more preferable that it is 3.5 or less. In principle, the dielectric constant is never less than 1.0. Generally, it is about 2.0 at least for materials that can be obtained, and even if it is further lowered and approaches 1.0, the increase in shielding effect is limited, but the material itself becomes special and expensive. It becomes. Considering the balance between cost and action, the relative dielectric constant is preferably 2.0 or more, and more preferably 2.2 or more.

  Specifically, examples of the material constituting the insulating layer include glass, metal oxide, paper, natural resin, and synthetic resin. Synthetic resin is preferable from the viewpoint of workability. These materials can be mixed with fiber reinforcing materials such as carbon fiber, glass fiber and aramid fiber. Synthetic resins include polyesters such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate) and PBT (polybutylene terephthalate), olefinic resins such as polyethylene and polypropylene, polyamides, from the viewpoint of availability and processability. Polyimide, liquid crystal polymer, polyacetal, fluorine resin, polyurethane, acrylic resin, epoxy resin, silicone resin, phenol resin, melamine resin, ABS resin, polyvinyl alcohol, urea resin, polyvinyl chloride, polycarbonate, polystyrene, styrene butadiene rubber, etc. Of these, PET, PEN, polyamide, and polyimide are preferred for reasons of processability and cost. The synthetic resin may be an elastomer such as urethane rubber, chloroprene rubber, silicone rubber, fluoro rubber, styrene, olefin, vinyl chloride, urethane, and amide. Further, the synthetic resin itself may serve as an adhesive, and in this case, a structure in which metal foils are laminated via the adhesive is obtained. The adhesive is not particularly limited, but acrylic resin, epoxy resin, urethane, polyester, silicone resin, vinyl acetate, styrene butadiene rubber, nitrile rubber, phenol resin, cyanoacrylate, etc. For reasons of ease of production and cost, urethane, polyester, and vinyl acetate are preferred.

  The resin material can be laminated in the form of a film or fiber. Further, the resin layer may be formed by applying an uncured resin composition to the metal foil and then curing the resin composition, but it is preferable to make a resin film that can be applied to the metal foil for ease of manufacture. In particular, a PET film can be suitably used. In particular, the strength of the shield material can be increased by using a biaxially stretched film as the PET film.

  The thickness of the insulating layer is not particularly limited, but if the thickness per sheet is less than 4 μm, the (elongation) breaking strain of the shield material tends to decrease, so the thickness per insulating layer is 4 μm or more. It is preferably 7 μm or more, more preferably 10 μm or more, even more preferably 20 μm or more, still more preferably 40 μm or more, and further preferably 80 μm or more. And more preferably 100 μm or more. On the other hand, even if the thickness per sheet exceeds 600 μm, the (elongation) breaking strain of the shielding material tends to decrease. Therefore, the thickness per insulating layer is preferably 600 μm or less, and more preferably 500 μm or less.

  Considering the stability and reliability of the shielding effect, it is preferable that the thickness of each insulating layer has little variation. This is because if the thickness of the insulating layer varies from place to place, the shielding effect changes from place to place. Specifically, in each insulating layer constituting the shield wall, when the maximum thickness is C and the minimum thickness is D, it is preferable that D / C ≧ 0.5 in any insulating layer. More preferably, ≧ 0.75, even more preferably D / C ≧ 0.85, still more preferably D / C ≧ 0.95, and D / C≈1. Most preferred.

  The thickness of the insulating layer can be measured by observing the cross section with an SEM or the like. For example, when the observation magnification is 500 times, a length range of 200 μm perpendicular to the thickness direction can be observed. In the present invention, 10 arbitrarily selected cross sections are observed, and the maximum and minimum values of the thickness of the insulating layer reflected in the range of the length of 200 μm are measured for each cross section. The value is C and the minimum value is D.

(Electromagnetic wave shield product)
The electromagnetic wave shielding product according to the present invention can be manufactured by molding a composite foil obtained by laminating the metal foil and the insulating layer described above, and connecting the predetermined metal foil to the ground. The electromagnetic wave shielding product can be provided in the form of a covering material or an exterior material such as an electromagnetic wave shielding case of an electric / electronic device. In one embodiment, the electromagnetic wave shielding product according to the present invention has an internal space for accommodating an electromagnetic wave radiation source, an inner surface in contact with the inner space, and an outer surface in contact with the outer space, and defines a boundary between the inner space and the outer space. A shield wall.

The shield wall can be composed of a molded body having a structure in which two or more metal foils are laminated via an insulating layer, and the innermost layer of the molded body forming the inner surface of the shield wall and the outer surface of the shield wall In order to obtain an excellent shielding effect, it is desirable that both outermost layers of the molded body forming the material are made of metal foil. Furthermore, from the viewpoint of the electromagnetic wave shielding effect, the shield wall preferably has a structure in which at least three metal foils are laminated via an insulating layer. Examples of the laminated structure of the shield wall having these requirements include the following.
(1) Metal foil (outermost layer) / insulating layer / metal foil (innermost layer)
(2) Metal foil (outermost layer) / insulating layer / metal foil / insulating layer / metal layer (innermost layer)
(3) Metal foil (outermost layer) / insulating layer / metal foil / insulating layer / metal foil / insulating layer / metal foil (innermost layer)
In (1) to (3), one “metal foil” can be formed by laminating a plurality of metal foils without using an insulating layer, and one “insulating layer” can also be used without using a metal foil. A plurality of insulating layers can be stacked. That is, a plurality of metal foils laminated without an insulating layer can be regarded as a single metal foil, and a plurality of insulating layers laminated without a metal foil can be regarded as a single insulating layer. it can. Moreover, layers other than an insulating layer and metal foil can also be provided.

  Thus, by alternately laminating the metal foil and the insulating layer, a remarkable improvement in the electromagnetic wave shielding effect can be seen, but at least two of the two or more metal foils laminated via the insulating layer are used. Further improvement of the electromagnetic shielding effect can be achieved by electrical connection. Although not intended to limit the invention by theory, it is believed that this is due to the following reasons. Since the shielded electromagnetic wave becomes a current in the metal foil, the shielding effect increases as the electric capacity of the metal foil increases. On the other hand, the electric capacity increases as the conductivity increases and the metal foil increases in thickness. However, when the metal foil is electrically connected, the electric capacity can be increased. For example, two metal foils are laminated via an insulating layer. When two metal foils are electrically connected, the electric capacity of each metal foil is apparently increased (for two metal foils). Of electrical capacity). The shielding effect is improved by the mechanism as described above.

  Although any metal foil constituting the shield wall is electrically connected to each other, an improvement effect can be seen, but among the metal foils constituting the shield wall, the outermost metal foil and the innermost metal foil are at least electrically It is preferable that it is connected to. Furthermore, it is more preferable that all the metal foils constituting the shield wall are electrically connected.

  The method of electrically connecting metal foils is not particularly limited, but a method of contacting parts of the metal foils with each other, a method of connecting via an external conductive material such as metal, and the like are combined. A method is mentioned. As a method of bringing a part of the metal foil itself into contact with each other, at least two pieces of metal foil are provided with a portion that protrudes outside the side edge of the insulating layer, and the protruding portions are brought into contact with each other to provide the at least two pieces. There is a method of electrically connecting the metal foils. When the metal foil is rectangular in plan view, one side may protrude, two sides may protrude, three sides may protrude, or all four sides may protrude. As a method of connecting via an external conductive material such as metal, a method of connecting a conductive material such as a metal wire or solder to a metal foil, a method of plating the side surface in the thickness direction of the laminated structure of the shield wall, and A method of forming a hole through the insulating layer in the thickness direction, arranging a conductive material inside the hole by through-hole plating, etc., and electrically connecting the upper and lower metal foils of the insulating layer is given. It is done.

  When the metal foils are electrically connected to each other, the shielding effect is improved as the contact resistance at the direct or indirect contact surface between the metal foils is lower. The contact resistance decreases as the contact area increases, but becomes constant when the contact area exceeds a certain area. From such a viewpoint, the contact area on the contact surface is preferably 0.05% or more, more preferably 0.1% or more, and further preferably 0.2% or more of the area of one side of each metal foil. However, if the contact area becomes too large, the effect of improving the forming processability by using the insulating layer is reduced. Therefore, the contact area on the contact surface is preferably 50% or less of the area of one side of each metal foil. % Or less is more preferable, and 30% or less is even more preferable.

  From the viewpoint of enhancing the electromagnetic wave shielding effect, it is preferable to connect the metal foil constituting the shield wall to the ground. In particular, it is preferable to connect the outermost layer of the molded body forming the outer surface of the shield wall to the ground. Since the electromagnetic wave shielding effect is improved with an increase in the number of metal foils connected to the ground, it is preferable to connect 50% or more of the metal foils constituting the shield wall to the ground, and 75% or more. It is more preferable to connect the number of sheets to the ground, and it is even more preferable to connect all the numbers to the ground. There is no particular limitation on the method of connecting each metal foil constituting the shield wall to the ground, but a method of providing a ground connection on each metal foil, a ground connection on some metal foils, Examples include a method of electrical connection, a method of connecting all metal foils to a predetermined metal fitting, and a method of connecting the metal fitting to ground.

From the viewpoint of enhancing the electromagnetic wave shielding effect, it is preferable that all the insulating layers are sealed with a conductive material. Thereby, since the electrical gap by an insulating layer is sealed, the electromagnetic wave shielding effect improves. Although there is no restriction | limiting in particular as a method of sealing an insulating layer with an electroconductive material, For example, the following method is mentioned.
One method is a method in which all insulating layers constituting the shield wall are sealed with two or more metal foils constituting the molded body. A specific example of the method is a method in which at least two metal foils protrude from the side edge of the insulating layer over the entire periphery, and the protruding portions are metal-bonded over the entire periphery. The at least two metal foils can be a metal foil constituting the outermost layer and a metal foil constituting the innermost layer. In order to improve the sealing performance of the insulating layer, it is preferable that all the metal foils protrude from the side edges of the insulating layer over the entire circumference, and the protruding portions are metal-bonded over the entire periphery. Examples of the metal bonding method include, but are not limited to, various welding methods such as fusion welding, pressure welding, and brazing (soldering), and ultrasonic metal bonding. The second method includes a method of plating and concealing the insulating layer exposed on the side surface in the thickness direction of the laminated structure of the shield wall. In order to improve the sealing performance, the entire side surface in the thickness direction of the laminated structure of the shield wall can be plated.

  From the viewpoint of enhancing the electromagnetic shielding effect, it is preferable that there is no electrical gap on at least one of the inner surface and the outer surface of the shield wall, and it is more preferable that there is no electrical gap on both the inner surface and the outer surface of the shield wall. Specifically, at least one of the inner surface and the outer surface of the shield wall is preferably made entirely of a conductive material, and both the inner surface and the outer surface of the shield wall are made of a conductive material. preferable. Examples of the conductive material include metal, and this includes metal parts such as wiring, bolts and nuts, and plating layers in addition to the metal foil constituting the shield wall.

14 is a schematic cross-sectional view showing some configuration examples of the electromagnetic wave shielding product according to the present invention.
In (i), the outermost layer 205 and innermost layer 203 of the molded body constituting the shield wall are made of metal foil, and the molded body obtained by molding two composite foils in which the intermediate layer 204 is made of an insulating layer is moved up and down. The electromagnetic shielding product is formed by bonding. The left and right ends of the molded body are in close contact with the innermost layer 203 by metal bonding, and no electrical gap exists on the inner surface of the shield wall. Further, by covering the left and right ends of the molded body with the U-shaped metal fitting 202 having a cross-sectional view, there is no electrical gap on the outer surface of the shield wall. The metal foils 203 and 205 constituting the shield wall are in contact with the metal fitting 202 and are electrically connected via the metal fitting 202 and also connected to the ground 201. Although only the cross-sectional shape parallel to the paper surface is shown in the figure, the cross-sectional shape is the same in the direction perpendicular to the paper surface.
(Ii) is different from (i) in the method of connecting the ground. In (ii), the metal foils 203 and 205 constituting the shield wall are electrically connected by a bolt-shaped metal fitting 206 penetrating the left and right ends of the molded body, and are connected to the ground 201.
(Iii) is different from (i) in that the shield wall is formed by a molded body obtained by molding one composite foil. In (iii), there are no electrical gaps on the inner surface of the shield wall because the innermost layers 203 are in close contact with each other at both ends in the direction perpendicular to the paper surface from above and below by metal bonding.
(Iv) is different from (i) in that a metal fitting for electrically connecting metal foils is not provided separately. Further, (iv) has a structure in which molded bodies 301 and 302 of bottomed rectangular tube-shaped composite foils having different sizes are superposed from above and below, and the outer side surface of the smaller molded body 301 and the larger one Since the inner surface of the molded body 302 is in close contact, there is no electrical gap. The upper end of the innermost layer of the smaller molded body 301 is in contact with the innermost layer of the larger molded body 302. The outermost layer of the smaller molded body 301 is connected to the ground 201, and the innermost layer of the outer molded body 302 and the innermost layer of the inner molded body 301 that are electrically connected to this are also grounded.

It is also possible to select the metal foil and the insulating layer so that all combinations of the metal foil and the insulating layer constituting the electromagnetic wave shielding material satisfy σ _M × d _M × d _R ≧ 3 × 10 ^−3. It is preferable from the viewpoint of remarkably enhancing the shielding effect.

Various symbols used in this specification are defined as follows including the above-mentioned σ _M , d _M , and d _R.
σ _M : conductivity of metal foil at 20 ° C. (S / m)
d _M : Metal foil thickness (m)
Z _R : impedance of insulating layer (Ω) = Z ₀ × √ (1 / ε _R )
ε _R : dielectric constant of insulating layer at 20 ° C. γ _R : propagation constant = j × 2π√ (ε _R / λ); j is imaginary unit λ: wavelength (m): 300 m at 1 MHz
d _R : thickness of insulating layer (m)
Z ₀ : Impedance of vacuum = 377Ω

The shield characteristic can be expressed by the following relationship using a four-terminal matrix, where the electric field of the incident wave is E _x ⁱ , the magnetic field is H _x ⁱ , the electric field of the transmitted wave is E _x ^t , and the magnetic field is H _x ^t. it can.

In this case, the shield effect (SE) can be expressed by the following equation using the Schelkunoff equation.

When a metal foil is used as a shielding material, a = 1, b = 0, c = σ _M × d _M , and d = 1. Substituting this into equation 1, the following equation is obtained.

When using an insulating layer as a shield material can be _{a = 1, b = Z R} × γ R × d R, c = γ R × d R / Z R, and d = 1 to. Substituting this into equation 1, the following equation is obtained.

Further, the shield characteristic when the shield materials are laminated is theoretically obtained by the product of the four-terminal matrix corresponding to each layer. For example, an incident wave and a transmitted wave when a shield material is configured by a laminated structure of metal (M1) / resin (R1) / metal (M2) can be expressed by the following equations.

In addition, the incident wave and the transmitted wave when the shield material is configured by a laminated structure of metal (M1) / resin (R1) / metal (M2) / resin (R2) / metal (M3) can be expressed by the following equations. it can.

When this is expanded, the following equation is obtained.
Here, A, B, C and D are as follows.
_{A = 1 + Z R1 γ R1} d R1 σ M2 d M2 + Z R2 γ R2 d R2 σ M3 d M3 + Z R1 γ R1 d R1 σ M3 d M3 + Z R1 γ R1 d R1 Z R2 γ R2 d R2 σ M2 d M2 σ M3 d _{M3
B = Z R2 γ R2 d R2} + Z R1 γ R1 d R1 Z R2 γ R2 d R2 σ M2 d M2 + Z R1 γ R1 d R1
_{C = σ M1 d M1 + σ} M2 d M2 + σ M3 d M3 + γ R1 d R1 / Z R1 + γ R2 d R2 / Z R2 + Z R1 γ R1 d R1 σ M1 d M1 + Z R1 γ R1 d R1 σ M1 d M1 σ M3 _{d M3 + Z R1 γ R1 d} R1 Z R2 γ R2 d R2 σ M1 d M1 σ M2 d M2 σ M3 d M3 + Z R2 γ R2 d R2 σ M2 d M2 σ M3 d M3 + Z R2 γ R2 d R2 σ M3 d M3 γ _R1 d _R1 / Z _{R1
D = Z R2 γ R2 d R2} σ M1 d M1 + Z R2 γ R2 d R2 σ M1 d M1 σ M2 d M2 + Z R2 γ R2 d R2 σ M2 d M2 + Z R1 γ R1 d R1 σ M1 d M1 + Z R2 γ R2 d _R2 γ _R1 d _R1 / Z _R1

From the above illustration, the shielding effect in the laminate of the metal foil and the insulating layer is obtained by increasing σ _M × d _M × Z _R × γ _R × d _R for all combinations of the metal foil and the insulating layer to be used. It can be theoretically understood that it can be improved. However, as described in, for example, “Kenichi Hatakeyama,“ Electromagnetic shielding course for the first time ”Science Information Publishing (2013), p. 56”, conventionally (Z _R × γ _R × d _R ) is in the low frequency range. Therefore, according to this concept, σ _M × d _M × Z _R × γ _R × d _R is also a parameter that can be approximated to 0. By adjusting d _R , σ _M, and d _M by combining an appropriate metal foil and an insulating layer, σ _M × d _M × Z _R × γ _R × d _R becomes a large value that cannot be approximated to 0, and is low. It was found that there was a significant effect even in the frequency domain.

The present inventor repeats the experiment of the shielding effect in the laminate of the metal foil and the insulating layer, and that σ _M × d _M × d _R has a significant influence even in a low frequency region of about 1 MHz. The shielding effect is that the metal foil and the insulating layer are selected so that all combinations of the metal foil and the insulating layer constituting the heading and the electromagnetic wave shielding material satisfy σ _M × d _M × d _R ≧ 3 × 10 ^−3. It was found to be extremely effective in increasing It is preferable that all combinations of the metal foil and the insulating layer constituting the electromagnetic wave shielding material satisfy σ _M × d _M × d _R ≧ 1 × 10 ⁻² , and σ _M × d _M × d _R ≧ 4 × 10 ^{−. 2} is more preferable, σ _M × d _M × d _R ≧ 8 × 10 ⁻² is still more preferable, and σ _M × d _M × d _R ≧ 1 × 10 ⁻¹ is even more preferable. preferable.

No particular upper limit is set for σ _M × d _M × d _R , but usually σ _M × for all combinations of the metal foil and the insulating layer constituting the electromagnetic wave shielding material in consideration of the thickness and the material used. d _M × d _R ≦ 10, typically σ _M × d _M × d _R ≦ 1.

  As a method for laminating the insulating layer and the metal foil, an adhesive may be used between the insulating layer and the metal foil, or the insulating layer may be thermocompression bonded to the metal foil without using the adhesive. It is possible to simply overlap without using an adhesive, but considering the integrity of the electromagnetic shielding material, at least the edges (for example, each side when the shielding material is a square) should be joined with an adhesive or by thermocompression bonding. Is preferred. However, it is preferable to use an adhesive from the viewpoint of not applying excessive heat to the insulating layer. The adhesive is the same as described above, and there is no particular limitation, but acrylic resin, epoxy resin, urethane, polyester, silicone resin, vinyl acetate, styrene butadiene rubber, nitrile rubber, phenol Resin-based, cyanoacrylate-based and the like can be mentioned, and urethane-based, polyester-based, and vinyl acetate-based are preferable for ease of production and cost.

  The thickness of the adhesive layer is preferably 6 μm or less. When the thickness of the adhesive layer exceeds 6 μm, only the metal foil is easily broken after being laminated on the metal foil composite. However, when the adhesive layer as described above also serves as the insulating layer, the thickness is not limited to this, and the thickness described in the description of the insulating layer can be used.

  In one embodiment of the electromagnetic wave shielding material according to the present invention, the total thickness of the electromagnetic wave shielding material can be 50 to 1500 μm, can be 1000 μm or less, can be 600 μm or less, and can be 400 μm or less. It can also be 200 micrometers or less.

  The electromagnetic wave shielding material according to the present invention is particularly used for electric / electronic devices (for example, inverters, communication devices, resonators, electron tubes / discharge lamps, electric heating devices, electric motors, generators, electronic components, printed circuits, medical devices, etc.). Used for various electromagnetic shielding applications such as coating materials or exterior materials, harnesses and communication cable coating materials connected to electrical / electronic devices, electromagnetic shielding sheets, electromagnetic shielding panels, electromagnetic shielding bags, electromagnetic shielding boxes, electromagnetic shielding rooms, etc. It is possible.

  According to one embodiment of the electromagnetic wave shielding material according to the present invention, it is possible to have a magnetic field shielding characteristic of 36 dB or more (how much the signal is attenuated on the receiving side) at 1 MHz, and preferably a magnetic field shielding characteristic of 40 dB or more. More preferably 50 dB or more, even more preferably 60 dB or more, even more preferably 70 dB or more. For example, it can have a magnetic field shielding characteristic of 36 to 90 dB. In the present invention, the magnetic field shield characteristic is measured by the KEC method. The KEC method refers to the “electromagnetic shielding characteristic measurement method” at the Kansai Electronics Industry Promotion Center.

  Examples of the present invention are shown below together with comparative examples, which are provided for a better understanding of the present invention and its advantages, and are not intended to limit the invention.

<Test example 1: The innermost layer and the outermost layer of the electromagnetic wave shielding material are metal foils, and verification of the effect of grounding these metal foils together>
Metal foil and an insulating film (insulating layer) were laminated without using an adhesive to produce an electromagnetic wave shielding material having each laminated structure shown in FIGS. Here, a rolled copper foil having a rectangular shape in plan view having a thickness of 17 μm as a metal foil (conductivity at 20 ° C .: 58.0 × 10 ⁶ S / m), and PET: polyethylene having a rectangular shape in plan view having a thickness of 100 μm as an insulating film. A terephthalate film (relative permittivity at 20 ° C .: 3.2) was used. The conductivity was measured by the double bridge method of JIS C2525: 1999. The relative dielectric constant was measured by the B method described in JIS C 2151: 2006.

The thickness uniformity of the used metal foil and insulating film is as shown in Table 1, and varies depending on the test number. The laminated structure of Example 1-3 has the same laminated structure as Example 1-1 except that the variation in the thickness of the insulating layer is large in that D / C is 0.28. The thickness uniformity (B / A and D / C) of the metal foil and the insulating layer was measured according to the method described above under the following measurement conditions.
Measuring instrument: SEM (S-3400N, manufactured by Hitachi High-Technologies Corporation)
Acceleration voltage: 15 kV
Observation magnification: 1000 times for metal foil and 500 times for insulating layer

  Each of the above electromagnetic shielding materials was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and magnetic field shielding effects at various frequencies were evaluated under the condition of 20 ° C. by the KEC method. The magnetic field shield test was performed by receiving the magnetic field signal from the lower transmitting antenna 103 by the upper receiving antenna 104 as shown in FIGS. The uppermost layer and the lowermost layer of the electromagnetic wave shielding material are each connected to the ground 105. The uppermost layer of the electromagnetic wave shielding material imitates the outermost layer of the shield wall, and the lowermost layer of the electromagnetic wave shielding material imitates the innermost layer of the shield wall.

  In Comparative Example 1-1 (FIG. 1) and Comparative Example 1-2 (FIG. 2), the lowermost layer is composed of the insulating film 102, and the uppermost layer is composed of the metal foil 101. Moreover, in the comparative example 1-1, since the insulating film 102 is larger than the metal foil 101 and the four sides of the insulating film 102 protrude from the metal foil 101, the metal foils 101 are not in contact with each other. For this reason, in Comparative Example 1-1, only the uppermost metal foil of the metal foil 101 constituting the electromagnetic wave shielding material is connected to the ground. In Comparative Example 1-2, the metal foil 101 is larger than the insulating film 102, and the four sides of the metal foil 101 protrude beyond the insulating film 102, so the metal foils 101 are in contact with each other. For this reason, in Comparative Example 1-2, all the metal foils 101 constituting the electromagnetic wave shielding material are electrically connected and connected to the ground 105. In Comparative Example 1-2, the metal foils 101 are all in close contact with each other by soldering, so that the insulating film 102 is all sealed with the metal foil 101. In Comparative Example 1-2, the area of the contact surface where the metal foils are in contact with each other at the protruding portion is about 10 to 15% of the area of one side of the metal foil.

  On the other hand, in Example 1-1, Example 1-3 (FIG. 3), and Example 1-2 (FIG. 4), the lowermost layer and the uppermost layer are both composed of the metal foil 101. Moreover, in Example 1-1, since the insulating film 102 is larger than the metal foil 101 and the four sides of the insulating film 102 protrude from the metal foil 101, the metal foils 101 are not in contact with each other. For this reason, in Example 1-1, only the lowermost layer and the uppermost layer metal foil 101 among the metal foils 101 constituting the electromagnetic wave shielding material are connected to the ground 105. In Example 1-2, since the metal foil 101 is larger than the insulating film 102 and the four sides of the metal foil 101 protrude beyond the insulating film 102, the metal foils 101 are in contact with each other. For this reason, in Example 1-2, all the metal foils 101 constituting the electromagnetic wave shielding material are electrically connected and connected to the ground 105. In Example 1-2, the metal foils 101 are all in close contact with each other by soldering, so that the insulating film 102 is all sealed with the metal foil 101. In Example 1-2, the area of the contact surface where the metal foils are in contact with each other at the protruding portion is about 10 to 15% of the area of one side of the metal foil.

  The results are shown in FIG. In Comparative Example 1-1 and Comparative Example 1-2, since the lowermost layer was made of an insulating film, an electrical gap was generated between the magnetic field source and the electromagnetic shielding material. In Examples 1-3 and 1-2, since the lowermost layer was made of a metal foil, no electrical gap was generated between the magnetic field source and the electromagnetic shielding material. Thereby, in Example 1-1, Example 1-3, and Example 1-2, the magnetic field shielding effect raised significantly compared with Comparative Example 1-1 and Comparative Example 1-2. Moreover, it turns out from the comparison of Example 1-1 and Example 1-2 that the magnetic field shielding effect is higher when the metal foils are electrically connected to each other. In particular, the improvement of the magnetic field shielding effect due to the electrical connection between the metal foils was remarkable in the frequency range of 1 to 100 MHz. Moreover, it can be seen from the comparison between Comparative Example 1-1 and Comparative Example 1-2 that the more the grounded metal foil, the higher the magnetic field shielding effect. Furthermore, from comparison between Example 1-1 and Example 1-3, it can be seen that reducing the variation in the thickness of the insulating layer has a higher magnetic field shielding effect.

  In addition, although the difference between Example 1-1 and Example 1-2 seems to be small, it is because the magnetic field shielding effect of Example 1-2 has reached the measurement limit, and the difference in the actual magnetic field shielding effect is more It seems big.

<Test Example 2: Investigation of magnetic shielding effect in a single layer>
The magnetic shielding effect of a single layer was investigated for various metals. The metal materials used are as follows.
(1) Rolled copper foil (thickness: 280 μm)
(2) Rolled copper foil (thickness: 150 μm)
(3) Zn-plated steel plate (thickness: 270 μm)
(4) Silicon steel plate (thickness: 330 μm)
(5) SUS304 (thickness: 330 μm)
(6) SUS430 (thickness: 150 μm)
(7) Aluminum (thickness: 300 μm)
The prepared metal material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated by the KEC method under room temperature (25 ° C.) conditions. At this time, the frequency was changed from 0.1 MHz to 1000 MHz, and the transition of the magnetic field shielding effect with respect to the change in frequency was investigated.

  The results are shown in FIG. It can be seen that copper having higher conductivity than the iron-based material gives a higher shielding effect if the thickness is the same. Moreover, if the same material is used, it can be seen that the greater the thickness, the higher the shielding effect. Among these materials, only the rolled copper foil having a thickness of 280 μm and the aluminum having a thickness of 300 μm were able to achieve a magnetic field shielding characteristic of 36 dB or more in the entire region of 1 MHz to 1000 MHz. As can be seen from these results, it is necessary to considerably increase the thickness in order to obtain an excellent magnetic field shielding effect with the metal material alone. Such a thick metal foil is inferior in moldability and heavy, and thus cannot be said to be highly practical.

<Test Example 3: Relationship between the number of laminated metal foils and the magnetic shielding effect>
A polyethylene terephthalate (PET) film having a thickness of 12 μm (relative dielectric constant: 3.2 at 25 ° C.) was used as the insulating layer, and a rolled copper foil having a thickness of 17 μm, 33 μm or 68 μm as the metal foil (conductivity at 20 ° C .: 58. 0 × 10 ⁶ Ω · m) and 30 μm or 60 μm thick aluminum foil (conductivity at 20 ° C .: 39.6 × 10 ⁶ Ω · m), FIGS. 7 to 9 (a) to (m) Each of the electromagnetic shielding materials having the laminated structure shown in FIG. In these electromagnetic wave shielding materials, metal foils laminated via an insulating layer are not electrically connected. The conductivity was measured by the double bridge method of JIS C2525: 1999 for both copper foil and aluminum foil. About the interface which laminated | stacked metal foil and PET film through the adhesive agent, it has displayed as "the adhesive agent" in FIGS. As the adhesive, a urethane adhesive of Adlock RU-80 / H-5 manufactured by Rock Paint Co., Ltd. was used, and the thickness was about 3 μm. For the interface not labeled as an adhesive, the copper foil and the PET film are simply laminated. With respect to each electromagnetic shielding material, it installed in the magnetic field shielding effect evaluation apparatus (Techno Science Japan company type | model TSES-KEC), and evaluated the magnetic field shielding effect by the method similar to the test example 2. FIG.

  The results are shown in FIGS. It can be seen that when the metal foils are stacked, the magnetic field shielding effect is improved regardless of whether or not the PET film is stacked between the metal foils. And it turns out that a magnetic field shielding effect improves notably by laminating | stacking PET film between metal foil. Moreover, by comparing (g) and (f) in FIG. 11, it can be seen that the magnetic field shielding effect is enhanced even when the total thickness of the copper foil is small when laminating via a PET film. In addition, when (b) and (f) are compared in FIG. 12, (b) is a laminated structure of three copper foils (total thickness of copper foil is 51 μm), whereas (f) is two copper foils. Since the total thickness of the copper foil is 66 μm, the total thickness of the copper foil is larger in (f), but (b) shows an excellent magnetic field shielding effect. In addition, when (b) and (e) are compared in FIG. 12, both have a laminated structure of three copper foils, but show almost the same shielding effect in the high frequency region, while each copper in the low frequency region. The magnetic field shielding effect of (e) with a large foil thickness was excellent. From FIG. 13, the magnetic field shielding effect by laminating | stacking 3 or more sheets similarly through a PET film similarly in aluminum foil can be confirmed.

  Table 2 shows the magnetic field shielding characteristics at 1 MHz for the test examples (a) to (m). In Test Example 3, (a), (b), (e), (i), (j), and (k) were able to achieve a magnetic field shield characteristic of 36 dB or more in the entire region of 1 MHz to 1000 MHz. )Met. In (a), the total thickness of the copper foil is only 68 μm, which is only about ¼ of the thickness of the 280 μm copper foil that achieved this characteristic in Test Example 2. In (j), the total thickness of the aluminum foil is only 90 μm, which is only 3/10 of the 300 μm aluminum foil that achieved the characteristics in Test Example 2. It can be seen that even if the weight of PET is taken into consideration, the weight can be significantly reduced. In (i) and (k), the target characteristics can be achieved, but the workability cannot be ensured because the thickness per metal foil is too large.

<Test Example 4: Verification of influence of σ _M × d _M × d _R on magnetic field shielding effect>
Each metal foil and insulating film described in Table 3 were prepared, and electromagnetic shielding materials of Examples and Comparative Examples were prepared. Each symbol described in Table 3 indicates the following.
Cu: rolled copper foil (conductivity at 20 ° C .: 58.0 × 10 ⁶ S / m)
Al: Aluminum foil (conductivity at 20 ° C .: 39.6 × 10 ⁶ S / m)
Electrolytic Cu: electrolytic copper foil (conductivity at 20 ° C .: 56.0 × 10 ⁶ S / m)
Ni: nickel foil (conductivity at 20 ° C .: 14.5 × 10 ⁶ S / m)
Fe: soft iron foil (conductivity at 20 ° C .: 9.9 × 10 ⁶ S / m)
sus: stainless steel foil (conductivity at 20 ° C .: 1.4 × 10 ⁶ S / m)
PI: polyimide film (relative permittivity at 20 ° C .: 3.5)
PET: Polyethylene terephthalate film (relative permittivity at 20 ° C .: 3.0)
PTFE: polytetrafluoroethylene film (relative permittivity at 20 ° C .: 2.1)
PA: Polyamide film (relative permittivity at 20 ° C .: 6.0)
Air gap: Metal foils were separated by air (relative permittivity at 20 ° C .: 1.0)

(Comparative Examples 4-1 to 4-2: Magnetic shielding effect of one metal foil)
With respect to the rolled copper foil (thickness: 150 μm) and the aluminum foil (thickness: 300 μm), the magnetic field shielding effect in a single layer was investigated. The prepared metal material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd., model TSES-KEC), and the magnetic field shielding effect was evaluated by the KEC method at a frequency of 1 MHz and 20 ° C.

(Comparative Example 4-3: Magnetic field shielding effect when three metal foils are laminated)
Comparative Example 4 was prepared by preparing three rolled copper foils (thickness: 33 μm), simply laminating them without using an adhesive, and installing them on a magnetic field shielding effect evaluation device (Techno Science Japan Co., Ltd., model TSES-KEC). The magnetic field shielding effect was evaluated by the same method as -1.

(Comparative Example 4-4: Magnetic field shielding effect when two metal foils are laminated via an insulating layer)
By using a polyethylene terephthalate (PET) film having a thickness of 250 μm as an insulating layer, a rolled copper foil having a thickness of 7 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Comparative Example 4-5: Magnetic field shielding effect when two metal foils are laminated via an insulating layer)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 8 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Comparative Example 4-6: Magnetic field shielding effect when two metal foils are installed via an air layer)
Air was used as the insulating layer, and aluminum foils with thicknesses of 6 μm and 30 μm were used as the metal foils, and electromagnetic wave shielding materials having the laminated structure shown in Table 3 were produced. In this example, the two aluminum foils were arranged in parallel at intervals of 50 μm in air with a copper plate having a large square opening at the center. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Comparative Example 4-7: Magnetic field shielding effect when three metal foils are laminated via an insulating layer: σ _M × d _M × d _R <3 × 10 ⁻³ )
An electromagnetic wave shield having a laminated structure described in Table 3 by using a polyimide (PI) film having a thickness of 9 μm as an insulating layer, an aluminum foil having a thickness of 6 μm as a metal foil, and simply laminating without using an adhesive. A material was prepared. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-1)
By using a polyimide (PI) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 17 μm as a metal foil, and simply laminating without using an adhesive, an electromagnetic wave having a laminated structure described in Table 3 A shield material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-2)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, an aluminum foil having a thickness of 20 μm as a metal foil, and simply laminating without using an adhesive, an electromagnetic wave having a laminated structure shown in Table 3 A shield material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-3)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, an electrolytic copper foil having a thickness of 30 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-4)
An electromagnetic wave having a laminated structure described in Table 3 by using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a nickel foil having a thickness of 50 μm as a metal foil, and simply laminating without using an adhesive. A shield material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-5)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a soft iron foil having a thickness of 50 μm as a metal foil, and simply laminating without using an adhesive, an electromagnetic wave having a laminated structure described in Table 3 A shield material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-6)
By using a polytetrafluoroethylene (PTFE) film having a thickness of 500 μm as an insulating layer, a stainless steel foil having a thickness of 50 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic wave shielding material having the same was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-7)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 6 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-8)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 17 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-9)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 33 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-10)
By using a polyethylene terephthalate (PET) film having a thickness of 9 μm as an insulating layer, a rolled copper foil having a thickness of 7 μm and 33 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure described in Table 3 An electromagnetic shielding material having a thickness of 10 was prepared. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-11)
By using a polyethylene terephthalate (PET) film having a thickness of 500 μm as an insulating layer, a rolled copper foil having a thickness of 17 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-12)
Using a polytetrafluoroethylene (PTFE) film having a thickness of 100 μm as an insulating layer, using a rolled copper foil having a thickness of 17 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure described in Table 3 An electromagnetic shielding material having a thickness of 10 was prepared. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-13)
By using a polyamide (PA) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 17 μm as a metal foil, and simply laminating without using an adhesive, an electromagnetic wave having a laminated structure described in Table 3 A shield material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-14)
By using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 33 μm and a nickel foil having a thickness of 30 μm as a metal foil, and simply laminating without using an adhesive, Table 3 An electromagnetic shielding material having the described laminated structure was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-15)
By using a polyethylene terephthalate (PET) film having a thickness of 12 μm as the insulating layer, a rolled copper foil having a thickness of 12 μm and a rolled copper foil having a thickness of 17 μm as the metal foil, and simply laminating without using an adhesive, Table 3 An electromagnetic shielding material having the laminated structure described in 1 was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-16)
Using a polyethylene terephthalate (PET) film having a thickness of 100 μm as an insulating layer, a rolled copper foil having a thickness of 12 μm as a metal foil, and simply laminating without using an adhesive, the laminated structure shown in Table 3 is obtained. An electromagnetic shielding material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

(Example 4-17)
By using a polyethylene terephthalate (PET) film having a thickness of 9 μm as an insulating layer, an aluminum foil having a thickness of 20 μm as a metal foil, and simply laminating without using an adhesive, an electromagnetic wave having a laminated structure described in Table 3 A shield material was produced. This electromagnetic wave shielding material was installed in a magnetic field shielding effect evaluation apparatus (Techno Science Japan Co., Ltd. Model TSES-KEC), and the magnetic field shielding effect was evaluated in the same manner as in Comparative Example 4-1.

  In addition, in said evaluation, the electrical conductivity of metal foil was measured by the double-brich method of JISC2525: 1999. The relative dielectric constant was measured by the B method described in JIS C 2151: 2006.

The results are shown in Table 3. “Minimum σ _M d _M d _R ” in Table 3 is the insulation with the metal foil having the smallest σ _M × d _M × d _R among all combinations of the metal foil and the insulating layer used in each test example. Values for layer combinations. As can be understood from the results of Comparative Examples 4-1 and 4-2, even if the thickness of the metal foil is more than 100 μm, only about 31 to 33 dB of shielding effect can be obtained. As can be understood from the results of Comparative Example 4-3, no significant improvement in the shielding effect is observed even when only the metal foil is laminated. As can be understood from the results of Comparative Examples 4-4 to 4-6, the same applies even when two metal foils are laminated via an insulating layer. Moreover, even when three metal foils are laminated through an insulating layer from the results of Comparative Example 4-7, it is understood that the improvement of the shielding effect is limited if σ _M × d _M × d _R is insufficient. .

On the other hand, Examples 4-1 in which three metal foils are laminated via an insulating layer, and σ _M × d _M × d _R is 3 × 10 ⁻³ or more for all combinations of the metal foil and the insulating layer. In 4-17, it can be understood that the shielding effect is remarkably excellent. For example, in contrast to Comparative Example 4-1, which required a thickness of 150 μm to obtain a shielding effect of 31.1 dB with a single copper foil, Example 4-1 has a copper foil having a thickness of about 1/3. Although it is only used, the shielding effect is improved by about 26 dB. Further, in contrast to Comparative Example 4-2 in which a thickness of 300 μm was necessary to obtain a shielding effect of 33.1 dB with one aluminum foil, in Example 4-2, only an aluminum foil having a thickness of 1/5 was used. Even though it is not used, the shielding effect is improved by about 19 dB.

Among the examples, the minimum sigma _M d _M d prefer _R is higher in the combination of the metal foil and the insulating layer, it can understand that a high shielding effect while reducing the total thickness of the metal foil can be obtained. For example, in all of Examples 4-11 to 4-13, the total thickness of the copper foil is 51 μm, but it can be seen that there is a large difference in the shielding effect due to the difference in the minimum σ _M d _M d _R.

101 Metal foil 102 Insulating film 103 Transmitting antenna 104 Receiving antenna 105 Ground

Claims (18)

  An electromagnetic shielding product comprising an inner space for accommodating an electromagnetic radiation source, an inner surface in contact with the inner space, and an outer surface in contact with the outer space, and a shield wall that delimits the boundary between the inner space and the outer space. The shield wall is composed of a molded body having a structure in which two or more metal foils are laminated via a solid insulating layer, and the innermost layer of the molded body forming the inner surface of the shield wall and the The outermost layer of the molded body forming the outer surface of the shield wall is made of a metal foil, and the outermost layer is at least an electromagnetic wave shield product connected to the ground.   The electromagnetic wave shielding product according to claim 1, wherein all of the two or more metal foils constituting the shielding wall are electrically connected.   Of the metal foils constituting the shield wall, at least two metal foils each have a portion protruding outside the side edge of the insulating layer, and the protruding portions are in contact with each other so that the at least two metal foils are in contact with each other. The electromagnetic wave shielding product according to claim 1 or 2, wherein the metal foils are electrically connected.   All the metal foils constituting the shield wall each have a portion protruding outside the side edge of the insulating layer, and all the metal foils are electrically connected by contacting the protruding portions. The electromagnetic shielding product according to claim 1 or 2.   The electromagnetic wave shielding product according to any one of claims 1 to 4, wherein all insulating layers constituting the shield wall are sealed with a conductive material.   The electromagnetic wave shielding product according to any one of claims 1 to 5, wherein all insulating layers constituting the shield wall are sealed with two or more metal foils constituting the shield wall.   The electromagnetic wave shielding product according to any one of claims 1 to 6, wherein there is no electrical gap on at least one of the inner surface and the outer surface.   At least one insulating layer constituting the shield wall has a hole penetrating in the thickness direction, and two metal foils on the upper and lower sides of the insulating layer are interposed through a conductive material disposed inside the hole. The electromagnetic wave shielding product according to any one of claims 1 to 7, which is electrically connected.   The electromagnetic shielding product according to any one of claims 1 to 8, wherein the shield wall has a structure in which at least three metal foils are laminated via an insulating layer. The electromagnetic wave shield product according to any one of claims 1 to 9, wherein all combinations of the metal foil and the insulating layer constituting the shield wall satisfy σ _M × d _M × d _R ≧ 3 × 10 ⁻³ .
However, the symbol in a formula shows the following.
σ _M : conductivity of metal foil at 20 ° C. (S / m)
d _M : Metal foil thickness (m)
d _R : thickness of insulating layer (m) 11. The electromagnetic wave shielding product according to claim 1, wherein the conductivity of each metal foil constituting the shielding wall at 20 ° C. is 1.0 × 10 ⁶ S / m or more.   The thickness of each metal foil which comprises the said shield wall is 4-100 micrometers, The electromagnetic wave shield goods as described in any one of Claims 1-11.   The electromagnetic shielding product according to any one of claims 1 to 12, wherein each insulating layer constituting the shield wall has a relative dielectric constant at 20 ° C of 2.0 to 10.0.   The electromagnetic wave shielding product according to any one of claims 1 to 13, wherein a thickness of each insulating layer constituting the shield wall is 4 to 500 µm.   The total thickness of the metal foil which comprises the said shield wall is 15-150 micrometers, The electromagnetic wave shield goods as described in any one of Claims 1-14.   In each metal foil which comprises the said shield wall, when the maximum thickness is set to A and the minimum thickness is set to B, in any metal foil, it is B / A> = 0.5. The electromagnetic wave shielding product described.   In each insulating layer which comprises the said shield wall, when the maximum thickness is set to C and the minimum thickness is set to D, in any insulating layer, it is D / C> = 0.5. The electromagnetic wave shielding product described.   The electrical / electronic device accommodated in the electromagnetic wave shield product as described in any one of Claims 1-17.