JP2017041153A - Touch panel and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel which can improve the appearance of a decorative layer, while preventing the decorative layer from peeling, and a method of manufacturing the touch panel.SOLUTION: A touch panel 100 or 100A includes: an upper transparent substrate 110; a lower transparent substrate 103 arranged facing the upper transparent substrate 110; an upper transparent conductive film 109 which is formed on a lower surface of the upper transparent substrate 110 and formed by removing a part included in a decorative area 101; a conductive decorative layer 108 formed on lower surfaces of the upper transparent substrate 110 and the upper transparent conductive film 109, included in the decorative area 101; and an electric wiring pattern 107 formed on a lower surface of the decorative layer 108.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a touch panel and a method for manufacturing a touch panel.

  Conventionally, a touch panel including a decoration layer in a decoration area that does not accept an input operation is known (see, for example, Patent Document 1).

  1A and 1B show the structure of a conventional resistive film type touch panel. In FIG. 1A, the decorative layer is formed on the upper substrate by printing. In FIG. 1B, a decorative layer is formed under the upper transparent conductive film. In addition, the decoration area | region in which a decoration layer is formed is a non-operation area | region formed in the outer periphery of a touch panel, and is an area | region for concealing electrode wiring in a touch panel, etc. from an operator's eyes | visual_axis.

JP 2012-208620 A

  As shown to FIG. 1 (A), when forming a decoration layer on an upper board | substrate, there exists a problem that the adhesiveness of a decoration layer is bad and a decoration layer tends to peel. This is because the upper surface of the upper substrate is generally hard-coated. Moreover, since a level | step difference is formed between a decoration layer and the upper surface of an upper board | substrate, there exists a problem that the appearance of a decoration layer worsens.

  As shown in FIG. 1B, when the decorative layer is formed under the upper transparent conductive film, the antireflection layer is added to the color of the decorative layer itself when the decorative region is viewed from above. In addition, there is a problem in that the colors of the upper transparent conductive film overlap and the decorative layer looks worse.

  An object of this invention is to provide the manufacturing method of a touch panel and touch panel which can improve the appearance of a decoration layer, without a decoration layer peeling.

  In order to achieve the above object, a touch panel disclosed in the specification is a touch panel having an operation region that accepts an operation input and a non-operation region that does not accept the operation input, and includes a first substrate and the first substrate. A second conductive substrate, a transparent conductive film formed on one surface of the first substrate facing the second substrate and partially removed from the non-operation region, and the non-operation A conductive decorative layer formed on the one surface of the first substrate included in the region and on the surface of the transparent conductive film included in the non-operation region; and formed on the surface of the decorative layer. Wiring pattern.

  The touch panel disclosed in the specification is a touch panel having an operation region that accepts an operation input and a non-operation region that does not accept the operation input, and is a second substrate disposed opposite to the first substrate and the first substrate. A substrate, a transparent conductive film formed on one surface of the first substrate facing the second substrate and partially removed from the non-operation region, and the first conductive film included in the non-operation region. A non-conductive decorative layer formed on the one surface of the substrate; a first portion formed on the surface of the decorative layer; and a non-operation extending from the first portion in a vertical direction. A wiring pattern including a second portion connected to the transparent conductive film included in the region.

  A touch panel manufacturing method disclosed in the specification is a touch panel manufacturing method having an operation region that accepts an operation input and a non-operation region that does not accept the operation input, and a first transparent conductive film is formed on a first substrate. And removing a part of the first transparent conductive film included in the non-operation region, and forming a conductive decorative layer on the first substrate and the first transparent conductive film included in the non-operation region. Forming a first wiring pattern on the decorative layer, forming a second transparent conductive film on a second substrate disposed to face the first substrate, and being included in the non-operation region A second wiring pattern is formed on the second transparent conductive film, and the first substrate on which the first wiring pattern, the decorative layer, and the first transparent conductive film are stacked is turned over, and the second wiring pattern is Paste to.

  The manufacturing method of a touch panel disclosed in the specification is a touch panel having an operation region that receives an operation input and a non-operation region that does not receive the operation input, and forms a first transparent conductive film on a first substrate, A part of the first transparent conductive film included in the non-operation region is removed, a non-conductive decoration layer is formed on the first substrate included in the non-operation region, and an upper surface of the decoration layer And a first wiring pattern extending along the side surface and connected to the first transparent conductive film included in the non-operation region, and formed on a second substrate opposed to the first substrate A second transparent conductive film is formed, a second wiring pattern is formed on the second transparent conductive film included in the non-operation region, and the first wiring pattern, the decorative layer, and the first transparent conductive film are formed Turn over the stacked first substrate Bonded on the second wiring pattern.

  According to the present invention, the decorative layer is not peeled off, and the appearance of the decorative layer can be improved.

(A) And (B) is a figure which shows the structure of the conventional resistive film type touch panel. It is an external view of the touch panel 100 which concerns on this Embodiment. (A) is sectional drawing of the touch panel 100 in the AA line of FIG. FIG. 3B is an enlarged view of a region X in FIG. (A) is sectional drawing of the touchscreen 100A which is the 1st modification of the touchscreen 100. FIG. FIG. 4B is an enlarged view of a region X in FIG. (A) is sectional drawing of the touch panel 100B which is the 2nd modification of the touch panel 100. FIG. FIG. 5B is an enlarged view of a region X in FIG. (A) is sectional drawing of the touchscreen 100C which is the 3rd modification of the touchscreen 100. FIG. FIG. 6B is an enlarged view of a region X in FIG. It is a flowchart which shows the manufacturing method of the touch panel 100 of FIG. It is a flowchart which shows the manufacturing method of 100 A of touchscreens of FIG. It is a flowchart which shows the manufacturing method of the touchscreen 100B of FIG. 5 (A). It is a flowchart which shows the manufacturing method of the touchscreen 100C of FIG. 6 (A).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 2 is an external view of the touch panel 100 according to the present embodiment. FIG. 3A is a cross-sectional view of the touch panel 100 taken along line AA in FIG. FIG. 3B is an enlarged view of a region X in FIG.

  The touch panel 100 according to the present embodiment is a resistive film type touch panel. The touch panel 100 is a four-wire touch panel, but may be a five-wire or seven-wire touch panel. As shown in FIG. 2, the touch panel 100 includes an opaque decoration area 101 on the outer periphery and a transparent operation area 102 in the center. The operation area 102 is an area for accepting an input operation with a finger or a pen. The decoration area 101 is formed in a non-operation area where an input operation with a finger or a pen is not accepted, and is an area for hiding the electric wiring pattern, the spacer, and the like from the operator's view. The touch panel 100 is mounted on a mobile phone or a tablet terminal.

  As shown in FIG. 3A, the touch panel 100 includes, in order from the bottom, a lower transparent substrate 103 (second substrate), a lower transparent conductive film 104 (second transparent conductive film), and an electric wiring pattern 105 (second wiring pattern). ), A spacer 106, an electric wiring pattern 107 (wiring pattern or first wiring pattern), a decorative layer 108, an upper transparent conductive film 109 (first transparent conductive film), and an upper transparent substrate 110 (first substrate). . The lower transparent substrate 103 is made of glass or the like, and the lower transparent conductive film 104 is made of indium tin oxide (ITO) or the like. The lower transparent conductive film 104 is formed on the lower transparent substrate 103 by, for example, sputtering.

  On the outer periphery (decorative region 101) of the upper surface of the lower transparent conductive film 104, an electrical wiring pattern 105 for connecting the lower transparent conductive film 104 and an external circuit (not shown) is formed. The electrical wiring pattern 105 is made of silver paste, and is formed on the lower transparent conductive film 104 by inkjet printing or silk printing. Spacers 106 are formed so as to cover the upper and side surfaces of the electric wiring pattern 105 and the lower and side surfaces of the electric wiring pattern 107. The spacer 106 is an acrylic or epoxy insulating adhesive, but may be, for example, a PET (polyethylene terephthalate) film in which a double-sided tape is attached to the upper and lower surfaces. The spacer 106 electrically insulates the electric wiring pattern 107 from the electric wiring pattern 105.

  A decorative layer 108 is formed on the spacer 106 and the electric wiring pattern 107. The decorative layer 108 is made of a conductive material containing a light-shielding material, for example, a carbon-based ink. The decorative layer 108 is formed by inkjet printing or silk printing. The decorative layer 108 has a thickness on the order of microns, for example, a thickness of 1 to 10 μm. As shown in FIG. 3B, the decorative layer 108 includes an overlapping portion 120 that overlaps the upper transparent conductive film 109 in the vertical direction. The width of the overlapping part 120 is, for example, 0.5 to 5 mm. The overlapping portion 120 has a role of electrically connecting the decorative layer 108 and the upper transparent conductive film 109. Therefore, the decorative layer 108 is electrically connected to the upper transparent conductive film 109 and the electric wiring pattern 107.

  The lower surface of the upper transparent conductive film 109 included in the decoration region 101 is connected to the decoration layer 108 through the overlapping portion 120. The upper transparent conductive film 109 is made of indium tin oxide (ITO) or the like. The thickness of the upper transparent conductive film 109 is, for example, 50 nm. The upper transparent conductive film 109 is formed under the upper transparent substrate 110 by, for example, sputtering. The upper transparent substrate 110 is made of, for example, a PET film.

  The decorative layer 108 is formed on the lower surfaces of the upper transparent substrate 110 and the upper transparent conductive film 109 included in the decorative region 101. The upper transparent conductive film 109 included in the decoration region 101 is removed by etching except for a portion overlapping the overlapping portion 120 of the decoration layer 108 in the vertical direction. In other words, in the decoration region 101 excluding the portion of the upper transparent conductive film 109 that overlaps the overlapping portion 120 in the vertical direction, the decoration layer 108 is formed immediately below the upper transparent substrate 110. Thereby, it is suppressed that the color of the upper transparent conductive film 109 overlaps the color of the decoration layer 108, and the appearance of the decoration layer 108 improves.

  A gap 111 is formed in the operation region 102 between the upper transparent conductive film 109 and the lower transparent conductive film 104.

  FIG. 4A is a cross-sectional view of a touch panel 100 </ b> A that is a first modification of the touch panel 100. FIG. 4B is an enlarged view of a region X in FIG. The same components as those in FIG. 3A are denoted by the same reference numerals, and description thereof is omitted.

  4A is different from the touch panel 100 of FIG. 3A in that an antireflection layer 112 is provided. The antireflection layer 112 is a layer that suppresses surface reflection of the touch panel. The antireflection layer 112 is formed between the upper transparent substrate 110 and the upper transparent conductive film 109. The antireflection layer 112 is formed by sputtering under the upper transparent substrate 110, and the upper transparent conductive film 109 is formed by sputtering under the antireflection layer 112.

  As shown in FIG. 4B, the antireflection layer 112 and the upper transparent conductive film 109 included in the decorative region 101 are removed by etching except for a portion overlapping the overlapping portion 120 of the decorative layer 108 in the vertical direction. ing. In other words, in the decorative region 101 excluding the portions of the antireflection layer 112 and the upper transparent conductive film 109 that overlap the overlapping portion 120 in the vertical direction, the decorative layer 108 is formed directly below the upper transparent substrate 110. Thereby, it is suppressed that the color of the anti-reflective layer 112 and the upper transparent conductive film 109 overlaps the color of the decorating layer 108, and the appearance of the decorating layer 108 improves.

  FIG. 5A is a cross-sectional view of a touch panel 100 </ b> B that is a second modification of the touch panel 100. FIG. 5B is an enlarged view of a region X in FIG. The same components as those in FIG. 3A are denoted by the same reference numerals, and description thereof is omitted.

  The touch panel 100B of FIG. 5A is different from that of FIG. 3A in that the decorative layer 108A is used instead of the decorative layer 108 and the electric wiring pattern 107A is used instead of the electric wiring pattern 107. Different from the touch panel 100.

  The decorative layer 108A is made of a non-conductive material containing a light-shielding material, for example, an acrylic-based thermosetting resin. The decorative layer 108A has a thickness on the order of microns, for example, a thickness of 1 to 10 μm. The electrical wiring pattern 107A is formed in an L shape or an inverted L shape along the lower surface and side surface of the decorative layer 108A. That is, the electrical wiring pattern 107A includes a first portion 121 extending in the horizontal direction along the lower surface of the decorative layer 108A, and a second portion 122 extending in the vertical direction along the side surface of the decorative layer 108A. It has.

  As shown in FIG. 5B, the second portion 122 overlaps the upper transparent conductive film 109 in the vertical direction. The width of the second portion 122 is, for example, 0.5 to 5 mm. The second portion 122 has a role of electrically connecting the first portion 121 and the upper transparent conductive film 109. Since the decorative layer 108A is made of a non-conductive material, the first portion 121 is electrically connected to the upper transparent conductive film 109 and the first portion 121 disposed under the decorative layer 108A. A second portion 122 formed integrally with 121 is formed so as to overlap the upper transparent conductive film 109 in the vertical direction.

  Further, as shown in FIG. 5B, the upper transparent conductive film 109 included in the decorative region 101 is removed by etching except for a portion overlapping the second portion 122 in the vertical direction. In other words, in the decoration region 101 that does not overlap the upper transparent conductive film 109 in the vertical direction (that is, the decoration region 101 excluding the portion of the upper transparent conductive film 109 that overlaps the second portion 122 in the vertical direction), the decoration layer 108 </ b> A is formed immediately below the upper transparent substrate 110. Thereby, the color of the upper transparent conductive film 109 is suppressed from overlapping the color of the decorative layer 108A, and the appearance of the decorative layer 108A is improved.

  FIG. 6A is a cross-sectional view of a touch panel 100 </ b> C that is a third modification of the touch panel 100. FIG. 6B is an enlarged view of a region X in FIG. The same components as those in FIGS. 3A and 4A are denoted by the same reference numerals, and description thereof is omitted.

  6A is different from the touch panel 100B in FIG. 5A in that an antireflection layer 112 is provided. The antireflection layer 112 is a layer that suppresses surface reflection of the touch panel. The antireflection layer 112 is formed between the upper transparent substrate 110 and the upper transparent conductive film 109. The antireflection layer 112 is formed by sputtering under the upper transparent substrate 110, and the upper transparent conductive film 109 is formed by sputtering under the antireflection layer 112. The electrical wiring pattern 107A includes a first portion 121 that extends in the horizontal direction along the lower surface of the decorative layer 108A and a second portion 122 that extends in the vertical direction along the side surface of the decorative layer 108A. ing.

  As shown in FIG. 6B, the second portion 122 overlaps the upper transparent conductive film 109 in the vertical direction. The second portion 122 has a role of electrically connecting the first portion 121 and the upper transparent conductive film 109. Since the decorative layer 108A is made of a non-conductive material, the first portion 121 is electrically connected to the upper transparent conductive film 109 and the first portion 121 disposed under the decorative layer 108A. A second portion 122 formed integrally with 121 is formed so as to overlap the upper transparent conductive film 109 in the vertical direction.

  Further, as shown in FIG. 6B, the antireflection layer 112 and the upper transparent conductive film 109 included in the decorative region 101 are removed by etching except for a portion overlapping the second portion 122 in the vertical direction. . In other words, in the decorative region 101 that does not overlap the antireflection layer 112 and the upper transparent conductive film 109 in the vertical direction, the decorative layer 108A is formed immediately below the upper transparent substrate 110. Thereby, it is suppressed that the color of the antireflection layer 112 and the upper transparent conductive film 109 overlaps the color of the decorative layer 108A, and the appearance of the decorative layer 108A is improved.

  FIG. 7 is a flowchart showing a manufacturing method of the touch panel 100 of FIG. A known apparatus is used as a manufacturing apparatus of the touch panel 100.

  First, the upper transparent substrate 110 is prepared (step S1), and the upper transparent conductive film 109 is formed on the upper transparent substrate 110 by sputtering and heat treatment (step S2). At this time, the upper transparent substrate 110 is disposed such that the upper transparent conductive film 109 is positioned on the upper transparent substrate 110. After step S2, the upper transparent conductive film 109 included in the decorative region 101 is removed by etching except for a portion (a portion overlapping the overlapping portion 120 of the decorative layer 108 in the vertical direction) (step S3). Thereafter, the decoration layer 108 is formed by ink jet printing or silk printing on a part of the upper transparent substrate 110 and the upper transparent conductive film 109 included in the decoration region 101 (part not etched away) (step S4). . Furthermore, the electrical wiring pattern 107 is formed on the decorative layer 108 by pattern printing (step S5).

  Similarly, the lower transparent substrate 103 is prepared (step S6), and the lower transparent conductive film 104 is formed on the lower transparent substrate 103 by sputtering and heat treatment (step S7). At this time, the lower transparent substrate 103 is disposed so that the lower transparent conductive film 104 is positioned on the lower transparent substrate 103. Furthermore, the electrical wiring pattern 105 is formed on the outer periphery (decorative region 101) of the lower transparent conductive film 104 by pattern printing (step S8). Next, a spacer 106 is formed so as to cover the upper surface and side surfaces of the electric wiring pattern 105 (step S9).

  Finally, the upper transparent substrate 110 on which the electric wiring pattern 107, the decorative layer 108, and the upper transparent conductive film 109 are stacked is turned upside down, and the electric wiring pattern 107 is bonded onto the spacer 106 (step S10). The touch panel 100 shown in FIG. 3A is formed by the steps S1 to S10.

  FIG. 8 is a flowchart showing a manufacturing method of the touch panel 100A of FIG. A known apparatus is used as a manufacturing apparatus of the touch panel 100A. The same processing as in FIG. 7 is denoted by the same step number, and the description thereof is omitted.

  After step S1, an antireflection layer 112 is formed on the upper transparent substrate 110 by sputtering and heat treatment (step S11). Further, the upper transparent conductive film 109 is formed on the antireflection layer 112 by sputtering and heat treatment (step S12). After step S12, the antireflection layer 112 and the upper transparent conductive film 109 included in the decorative region 101 are removed by etching except for a portion (a portion overlapping the overlapping portion 120 of the decorative layer 108 in the vertical direction) (step S12). S13). Thereafter, the process of step S4 is executed. The touch panel 100A shown in FIG. 4A is formed by steps S1 and S4 to S13.

  FIG. 9 is a flowchart showing a manufacturing method of the touch panel 100B of FIG. A known apparatus is used as the manufacturing apparatus of the touch panel 100B. The same processing as in FIG. 7 is denoted by the same step number, and the description thereof is omitted.

  After step S3, a decorative layer 108A is formed on the decorative region 101 that does not overlap the upper transparent conductive film 109 in the vertical direction by ink jet printing or silk printing (step S21). Furthermore, the electrical wiring pattern 107A is formed on the upper transparent conductive film 109 and the decorative layer 108A included in the decorative region 101 (step S22). The wiring pattern 107A extends along the side surfaces of the first portion 121 and the decorative layer 108A that extend in the horizontal direction along the upper surface of the decorative layer 108A (the lower surface of the decorative layer 108A in FIG. 5B). And a second portion 122 extending in the vertical direction. The touch panel 100B of FIG. 5A is formed by the steps S1 to S3, S6 to S10, S21, and S22.

  FIG. 10 is a flowchart showing a method for manufacturing the touch panel 100C of FIG. A known apparatus is used as the manufacturing apparatus for the touch panel 100C. The same processing as in FIG. 7 is denoted by the same step number, and the description thereof is omitted.

  After step S1, an antireflection layer 112 is formed on the upper transparent substrate 110 by sputtering and heat treatment (step S11). Further, the upper transparent conductive film 109 is formed on the antireflection layer 112 by sputtering and heat treatment (step S12). After step S12, the antireflection layer 112 and the upper transparent conductive film 109 included in the decorative region 101 are removed by etching except for a part (a portion overlapping the overlapping portion 120 of the decorative layer 108A in the vertical direction) (step S12). S13). Thereafter, the decorative layer 108A is formed on the decorative region 101 that does not overlap the upper transparent conductive film 109 in the vertical direction by ink jet printing or silk printing (step S21). Furthermore, the electrical wiring pattern 107A is formed on the upper transparent conductive film 109 and the decorative layer 108A included in the decorative region 101 (step S22). The touch panel 100C shown in FIG. 6A is formed by steps S1, S6 to S13, S21, and S22.

  As described above, according to the present embodiment, the touch panel 100 or 100A is provided on the upper transparent substrate 110, the lower transparent substrate 103 disposed to face the upper transparent substrate 110, and the lower surface of the upper transparent substrate 110. The upper transparent conductive film 109 formed and partially removed from the decoration region 101, and the conductive film formed on the lower surface of the upper transparent substrate 110 and the upper transparent conductive film 109 included in the decoration region 101 are formed. The decorative layer 108A and the electric wiring pattern 107A formed on the lower surface of the decorative layer 108A are provided. Therefore, the decorative layer 108A is not formed on the upper transparent substrate 110, and the decorative layer 108A is not peeled off. Furthermore, since a part of the upper transparent conductive film 109 included in the decoration region 101 is removed, the color of the upper transparent conductive film 109 is suppressed from overlapping with the color of the decoration layer 108A, and the decoration layer 108A. The appearance of is improved.

  The touch panel 100 </ b> B or 100 </ b> C is formed on the upper transparent substrate 110, the lower transparent substrate 103 disposed to face the upper transparent substrate 110, and the lower surface of the upper transparent substrate 110, and a part included in the decoration region 101. Formed on the lower surface of the decorative layer 108A and the non-conductive decorative layer 108A formed on the lower surface of the upper transparent substrate 110 included in the decorative region 101. An electrical wiring pattern 107A including a first portion 121 and a second portion 122 extending from the first portion 121 in the vertical direction and connected to the upper transparent conductive film 109 included in the decoration region 101 is provided. . Therefore, the decorative layer 108A is not formed on the upper transparent substrate 110, and the decorative layer 108A is not peeled off. Furthermore, since a part of the upper transparent conductive film 109 included in the decoration region 101 is removed, the color of the upper transparent conductive film 109 is suppressed from overlapping with the color of the decoration layer 108A, and the decoration layer 108A. The appearance of is improved.

  In addition, when the touch panel includes the antireflection layer 112 between the upper transparent substrate 110 and the upper transparent conductive film 109, a part of the antireflection layer 112 that overlaps the removed portion of the upper transparent conductive film 109 in the vertical direction. Removed. Therefore, the color of the antireflection layer 112 and the upper transparent conductive film 109 is suppressed from overlapping the color of the decorative layer 108A, and the appearance of the decorative layer 108A is improved.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications within a range not departing from the gist thereof.

DESCRIPTION OF SYMBOLS 100-100C Touch panel 101 Decorating area 102 Operation area 103 Lower transparent substrate 104 Lower transparent conductive film 105,107,107A Electrical wiring pattern 106 Spacer 108,108A Decorating layer 109 Upper transparent conductive film 110 Upper transparent substrate

Claims (4)

A touch panel having an operation area that accepts an operation input and a non-operation area that does not accept the operation input,
A first substrate;
A second substrate disposed opposite to the first substrate;
A transparent conductive film formed on one surface of the first substrate opposite to the second substrate, wherein a part of the non-operation region is removed;
A conductive decorative layer formed on the one surface of the first substrate included in the non-operation region and on the surface of the transparent conductive film included in the non-operation region;
A touch panel comprising: a wiring pattern formed on a surface of the decorative layer. A touch panel having an operation area that accepts an operation input and a non-operation area that does not accept the operation input,
A first substrate;
A second substrate disposed opposite to the first substrate;
A transparent conductive film formed on one surface of the first substrate opposite to the second substrate, wherein a part of the non-operation region is removed;
A non-conductive decorative layer formed on the one surface of the first substrate included in the non-operation region;
A wiring including a first portion formed on the surface of the decorative layer, and a second portion extending in the vertical direction from the first portion and connected to the transparent conductive film included in the non-operation region. A touch panel comprising a pattern. A method of manufacturing a touch panel having an operation area that accepts an operation input and a non-operation area that does not accept the operation input,
Forming a first transparent conductive film on the first substrate;
Removing a part of the first transparent conductive film included in the non-operation region;
Forming a conductive decorative layer on the first substrate and the first transparent conductive film included in the non-operation region;
Forming a first wiring pattern on the decorative layer;
Forming a second transparent conductive film on a second substrate disposed opposite to the first substrate;
Forming a second wiring pattern on the second transparent conductive film included in the non-operation region;
A method for manufacturing a touch panel, wherein the first substrate on which the first wiring pattern, the decorative layer, and the first transparent conductive film are laminated is turned over and bonded onto the second wiring pattern. A touch panel having an operation area that accepts an operation input and a non-operation area that does not accept the operation input,
Forming a first transparent conductive film on the first substrate;
Removing a part of the first transparent conductive film included in the non-operation region;
Forming a non-conductive decorative layer on the first substrate included in the non-operation area;
Forming a first wiring pattern extending along an upper surface and a side surface of the decorative layer and connected to the first transparent conductive film included in the non-operation region;
Forming a second transparent conductive film on a second substrate disposed opposite to the first substrate;
Forming a second wiring pattern on the second transparent conductive film included in the non-operation region;
A method for manufacturing a touch panel, wherein the first substrate on which the first wiring pattern, the decorative layer, and the first transparent conductive film are laminated is turned over and bonded onto the second wiring pattern.

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