JP2017033633A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus which can suppress an incidence of malfunction or breakdown in the electronic apparatus by reducing voltage fluctuation due to a secondary discharge when the secondary discharge occurs.SOLUTION: An electronic apparatus comprises a rotatable operation member (300); a holding member (310) which holds the operation member (300) in a rotatable manner; ungrounded floating metals (311, 312) arranged between the operation member (300) and the holding member (310); a first ground member (320) fixed and grounded to the holding member (310); a rotor (330) which is fixed to and integrally rotates with the operation member (300); and a rotation detection substrate (340) for detecting the rotation of the operation member (300). The rotor (330) is arranged between the rotation detection substrate (340) and the first ground member (320), and a second ground member (380) is arranged between the floating metals (311, 312) and the first ground member (320).SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic device, and more particularly to an electronic device that employs a capacitance detection method for operation detection.

  2. Description of the Related Art Conventionally, there is an electronic apparatus having a capacitance detection type operation member, and its detailed configuration is disclosed.

  In Patent Document 1, a dielectric is disposed between an electrode pattern provided on a substrate and a metal part grounded at a position facing the electrode pattern provided on the substrate, and the dielectric rotates. An operation member is disclosed that uses, as an input, an operation in which a user rotates a dial by detecting a change in capacitance.

JP2013-131421A

  However, in the conventional technique disclosed in Patent Document 1 described above, the metal member for generating the click feeling of the rotation operation member is not grounded but is a floating metal. In addition, since a grounded metal member is disposed in the vicinity of the floating metal, when static noise is generated in the vicinity of the floating metal, a secondary discharge is generated from the floating metal to the nearby grounded metal member. May occur. If the floating metal can be grounded, secondary discharge due to electrostatic noise will not occur, but it may be difficult to ground the floating metal to ground due to the component configuration. Therefore, when a secondary discharge occurs, depending on the magnitude of the voltage generated by the secondary discharge, there is a risk of causing malfunction of an electronic device or destruction of an electrical component.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic device in which the occurrence rate of malfunction and destruction phenomenon of the electronic device is suppressed by reducing voltage fluctuation due to the secondary discharge when secondary discharge due to electrostatic noise occurs. It is in.

In order to achieve the above object, an electronic apparatus according to the present invention provides:
An operation member (300) capable of rotating operation;
A holding member (310) for rotatably holding the operation member (300);
Non-grounded floating metals (311 312) disposed between the operating member (300) and the holding member (310);
A first ground member (320) fixed to the holding member (310) and grounded;
A rotating body (330) fixed to the operating member (300) and integrally rotating;
A rotation detection board (340) for detecting the rotation operation;
The rotating body (330) is disposed between the rotation detection board (340) and the first ground member (320),
A second ground member (380) is disposed between the floating metal (311 and 312) and the first ground member (320).

  According to the present invention, it is possible to provide an electronic device in which the occurrence rate of malfunction and destruction phenomenon of an electronic device is suppressed by reducing voltage fluctuation due to the secondary discharge even when secondary discharge due to electrostatic noise occurs. it can.

Configuration diagram of an electronic apparatus according to an embodiment of the present invention 1 is an external view of an electronic apparatus according to an embodiment of the present invention. The block diagram of the operation part which concerns on embodiment of this invention Operation detection method of an operation unit according to an embodiment of the present invention Detailed view of flexible substrate according to an embodiment of the present invention The block diagram of the operation part which concerns on embodiment of this invention The block diagram of the operation part which concerns on embodiment of this invention Detailed view of conductor according to an embodiment of the present invention Simplified view of conductor according to an embodiment of the present invention

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an electronic apparatus according to an embodiment of the present invention.

  Hereinafter, an electronic apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2, a case where the present invention is applied to an imaging device will be described as an example of an electronic device.

  FIG. 1 is a system block diagram of the imaging apparatus 100. FIG. 2 is an external view of the imaging apparatus 100.

  Reference numeral 101 denotes a nonvolatile memory. Stores a program when the CPU 160 described later performs an operation. Further, it is used for storing a reference value, a threshold value and the like of the capacitance sensor IC 120 described later. In this embodiment, the description will be made as a Flash-ROM, but this is an example, and other memories can be applied as long as they are nonvolatile memories.

  Reference numeral 102 denotes a RAM used as a work memory when the CPU 160 (to be described later) operates, and a function of a storage unit for temporarily storing an image buffer photographed by the imaging apparatus 100 and image processed image data. . In the present embodiment, these functions are performed by the RAM. However, other memories may be applied as long as the access speed is a level that does not cause a problem.

  Reference numeral 103 denotes a display unit that displays captured still images, moving images, live views, menus, and the like. Includes backside TFT and viewfinder.

  Reference numeral 105 denotes a power supply unit of the imaging apparatus 100. The power supply unit 105 includes a battery, an AC adapter, and the like, and supplies power to each block of the imaging apparatus 100 directly or through a DC-DC converter (not illustrated).

  Reference numeral 106 denotes a power switch (hereinafter referred to as power supply SW) of the imaging apparatus 100. In the present embodiment, as shown in FIG. 2, a description will be given of a structure having a mechanical on / off position, but the present invention is not limited to this, and it may be configured by a push switch, an electrical switch, or the like. In a state where the power SW 106 is off, even if the battery 105 is inserted in the imaging device 100, the imaging device 100 does not function as an imaging device and maintains a low power consumption state. When the battery 105 is inserted while the power SW 106 is on, the imaging device 100 functions as an imaging device. In the present embodiment, the operation unit 140 of the capacitance detection method to be described later will be described with a configuration that functions when the power supply SW 106 is on. However, the present invention is not limited to this and functions even when the power supply SW 106 is off. It may be a configuration.

  Reference numeral 160 denotes a CPU that comprehensively controls the imaging apparatus 100. An imaging function which is a basic function as an imaging apparatus is realized. Further, mode switching of the imaging apparatus 100, display update of the display 103, and the like are performed in accordance with a detection result of an operation unit 140 of a capacitance detection method described later.

  161 is a timer function capable of measuring an arbitrary time. In FIG. 1, the configuration built in the CPU 160 will be described. However, an external configuration may be used. It has a function of starting time measurement in accordance with an instruction from the CPU 160 and ending time measurement in accordance with an instruction from the CPU 160. In addition, the CPU 160 has a function of continuously operating the timer and periodically generating an interrupt to the CPU 160 at predetermined time intervals.

  Reference numeral 162 denotes a counter function for counting the number of operations of the operation unit 140 described later. In FIG. 1, the configuration built in the CPU 160 will be described. However, an external configuration may be used. In FIG. 1, the configuration is described in which the number of operations of the operation unit 140 is counted. However, the number of operations of an arbitrary operation unit can be counted.

  Reference numeral 120 denotes a capacitance sensor IC capable of detecting a capacitance value of a detection electrode described later. In FIG. 1, a description is given of a configuration externally attached to the CPU 160, but a configuration built in the CPU 160 may be used. In general, the capacitance sensor IC can calculate a capacitance value with respect to the ground, and can detect a touch operation by a user or the like. This embodiment will be described in detail with reference to FIG. 3, and is configured to detect the movement of the rotating body that moves integrally with the operation unit 140 described later and the touch of the user.

  The capacitance sensor IC 120 can set an arbitrary reference value and threshold value by the CPU 160, and when a capacitance value detected by a detection electrode described later exceeds the threshold value based on the reference value, Alternatively, an interrupt can be generated when it falls below. Further, it is possible to read the capacitance value of an arbitrary detection electrode at an arbitrary timing in accordance with an instruction from the CPU 160.

  Reference numeral 130 denotes a detection electrode connected to the capacitance sensor IC 120. In FIG. 1, the description will be made with a configuration in which the three detection electrodes 130a, 130b, and 130c are connected to the capacitance sensor IC 120, but the number of detection electrodes is not limited to this. In FIG. 1, there are a plurality of detection electrodes 130a, 130b, and 130c. Details will be described with reference to FIG. Three detection electrodes are connected to the capacitance sensor IC 120, each detection electrode further has a plurality of branch shapes, and the respective detection electrodes are alternately arranged.

  150, like 130, is a detection electrode connected to the capacitance sensor IC 120. In FIG. 1, the description will be made with a configuration in which four detection electrodes 150a, 150b, 150c, and 150d are connected to the capacitance sensor IC 120, but the number of detection electrodes is not limited to this. The detection electrode 150 is disposed on the back surface of the operation unit 140 described later, and serves as a detection electrode for detecting a user's touch input. The detection electrodes 150a, 150b, 150c, and 150d are used for detecting user operation inputs as, for example, upward, rightward, downward, and leftward touch inputs.

  Reference numeral 140 denotes an operation unit of the imaging apparatus 100. The operation unit 140 is disposed on the back cover 110 of the imaging apparatus 100 and is applied to various operations such as mode operation, distance measurement point selection, image reproduction selection, menu operation, and the like. The operation unit 140 can detect a rotation operation around an axis parallel to the optical axis of the imaging apparatus 100 and a photographer's contact operation on the surface of the operation unit 140. 3 and 4, the capacitance sensor IC 120 detects the movement of the dielectric that rotates integrally with the operation unit 140 and the contact of the human body with the surface of the operation unit 140. .

  Hereinafter, the basic configuration of the operation unit 140 will be described with reference to FIG.

  FIG. 3 is an exploded perspective view showing an example of the structure of the rotary dial 140 part. In order to explain the detailed configuration, a diagram viewed from two different directions is shown.

  A user operation unit 300 of the operation unit 140 is a rotation operation member. Further, as will be described later, it is also possible to perform an operation by contact with the surface of the rotation operation member 300.

  Reference numeral 310 denotes a base member that holds the rotation operation member 300 in a rotatable manner. The base member 310 is fixed to the back cover 110 (not shown in FIG. 3) of the imaging device 100 by three fixing portions 310a, b, and c.

  Reference numeral 311 denotes a ball member that moves in a shape that follows the concave-convex shape 310 f of the inner periphery of 310. The ball member 311 is biased by the spring member 312 to the uneven shape 310f. The spring member 311 and the ball member 312 are incorporated in the rotation operation member 300 and move integrally with the rotation operation member 300. When the ball member 311 moves along a concavo-convex shape 310f provided on the inner peripheral portion of the base member 310, the rotating portion 300 can obtain a click feeling. The ball member 311 and the spring member 312 are made of metal and are floating metal that is not grounded to the ground potential.

  320 is a conductor having a ground potential. The conductor 320 is fixed to the base member 310 at three attachment portions 320a, b, and c. A ground electrode of a substrate 340, which will be described later, is in contact with the attachment portions 320a, b, and c of the conductor 320, and the conductor 320 is electrically equal to the ground potential of the capacitance sensor IC 120.

  380 is a conductor having a ground potential, and is disposed between the ball member 311 and the spring member 312 and the conductor 320. The conductor 380 is fixed to the base member 310d by a single attachment portion 380a so as to be sandwiched between metal members (not shown). In addition, a metal member (not shown) is in contact with a ground electrode of a substrate 340 to be described later, and the conductor 380 is electrically equal to the ground potential of the capacitance sensor IC 120.

  Reference numeral 330 denotes a rotating body that moves integrally with the rotation operation member 300. It is fixed to the rotary operation member 300 by a screw (not shown). The rotating body 330 is made of a dielectric material, and in this embodiment, ceramic powder is mixed with resin to increase the relative dielectric constant. The material of the rotating body 330 is not limited to this, and a dielectric material such as resin or ceramics may be used alone.

  Reference numeral 340 denotes a substrate on which a plurality of detection electrodes 130 are arranged. The board 340 is provided with three attachment portions 340a, b, c, which are fixed at the same positions as the attachment portions 320a, b, c of the conductor 320 and the fixing portions 310a, b, c of the base member 310. . The three members are fixed by fastening the screws 360a, b, and c to the back cover 110 while sandwiching the three members. A capacitance sensor IC 120 is mounted on the substrate 340, and the capacitance of the detection electrode 130 can be detected. Ground electrodes are disposed on the mounting portions 340a, b, and c of the substrate 340, and are fixed in contact with the mounting portions 320a, b, and c of the conductor 320, so that the ground potential and the conductor of the capacitance sensor IC 120 are fixed. 320 has the same potential.

  With this configuration, when the rotator 330 is positioned between the detection electrode 130 and the conductor 320, the capacitance of the rotator 330 can be detected. As shown in FIG. 3, the rotating body 330 is provided with notches at predetermined intervals in the rotation direction. For this reason, when the rotating body 330 rotates, the electrostatic capacitance detected by the detection electrode 130 changes periodically. By detecting this change by the capacitance sensor IC 120, the rotation of the rotation operation member 300 can be detected.

  Here, the details of the detection method of the operation unit 140 will be described with reference to FIG.

  FIG. 4A shows a substrate 340 on which a plurality of detection electrodes 130 are arranged. The dotted line portion represents the rotator 330 and represents the degree of overlap between the rotator 330 and each detection electrode 130. The protruding portion of the rotating body 330 faces one detection electrode (130a in FIG. 4A). The detection electrode 130 has a configuration in which electrodes 130a, 130b, and 130c (abbreviated as a, b, and c in the figure, respectively) are alternately arranged, and are electrically connected on the substrate and connected to the IC 120. Is done. The number of clicks per round can be increased by branching one detection electrode into a plurality. Although the detection electrodes 130a, 130b, and 130c are branched into a plurality of electrode shapes, the capacitance value detected by the IC 120 is the sum of the capacitances detected by the plurality of electrodes, and high detection sensitivity is obtained. It is the structure obtained. Here, the configuration in which the three electrodes are divided into a plurality of parts has been described, but the number of electrodes and the number of divisions are not necessarily limited.

  FIG. 4B is a diagram illustrating the overlapping state of the rotating body 330 and the substrate 340. FIG. 4C shows the capacitance change of each of the detection electrodes 130a, 130b, and 130c when the rotating body 330 is rotated.

  First, the rotating body 330 represents the state facing the electrode 130a, and the capacitance value of the electrode 130a detects a value higher than the reference value. From this state, when the operation unit 140 is rotated by one click, the rotating body 330 is rotated by one click, and the capacitance value of the electrode 130a decreases to the reference value, while the capacitance value of the electrode 130b becomes the reference value. On the other hand, a high value is detected. Similarly, by rotating, it is possible to detect the direction of rotation from an electrode having a reduced capacitance to an electrode having an increased capacitance.

  In FIGS. 3 and 4, 340 is described as a configuration using a substrate. However, the configuration is not limited to the substrate, and any configuration may be used as long as the detection electrode can be arranged. For example, a configuration using flexible cable or the like may be used.

  Reference numeral 350 denotes a flexible substrate on which a plurality of detection electrodes 150 are arranged. The flexible substrate 350 is fixed to the base member 310, and is connected to the capacitance sensor IC 120 mounted on the substrate 340 by the connecting portion 350a. When a human body comes into contact with the surface of the rotation operation member 300, the capacitance sensor IC 120 detects the capacitance through the electrodes provided on the flexible substrate 350. As shown in FIG. 5, four detection electrodes 150a, b, c, and d are provided, corresponding to inputs in the upper, right, lower, and left directions, respectively. Note that the number of electrodes is not limited to four, and it is possible to detect the position touched by the photographer more finely by increasing the number as the capacitance sensor IC 120 allows.

  Reference numeral 351 denotes a dial sealing member. It is made of a material having high water repellency, and prevents water droplets from entering through the gap between the rotation operation member 300 and the base member 310.

  Reference numeral 370 denotes a push button. It is used in conjunction with the operation of the rotation operation member 300, and is used such as selection of an operation menu by the rotation operation member 300 and determination by the push button 370.

  Hereinafter, the structure of the operation unit 140 will be described with reference to FIG.

  FIG. 6 is a cross-sectional view of the operation unit 140. FIG. 6 shows a cross section passing through the center of the ball member 311.

  As described above, the present invention is configured to detect the electrostatic capacitance of the rotating body 330 positioned between the substrate 300 and the conductor 320 in order to detect the rotating operation of the rotating operation member 300. In this configuration, the detected capacitance is determined by the distance between the substrate 340 and the conductor 320, and the volume and relative dielectric constant of the dielectric located therebetween.

  The conductor 380 is at the ground potential as described above, and is disposed between the ball member 311 and the spring member 312 and the position where the conductor 320 is fixed.

  7A and 7B are cross-sectional views of a substrate 340 on which the ground potential conductor 320, the rotating body 330, and the detection electrode 130 are arranged. 7A is a cross-sectional view at a timing when the rotating body 330 exists between the conductor 320 and the substrate 340, and FIG. 7B is a timing at which the rotating body 330 does not exist between the conductor 320 and the substrate 340. FIG.

In FIG. 7A, the distance between the conductor 320 and the rotating body 330 is d1, the distance between the rotating body 330 and the substrate 340 is d2, and the thickness of the rotating body 330 is d3. Further, when the areas of the detection electrodes 130a, b, and c are Sa, Sb, and Sc, the capacitance values Ca, Cb, and Cc detected by the detection electrodes are as shown in Expressions 1 to 3, respectively.

In Equations 1 to 3, ε0 represents the dielectric constant in vacuum, εr1 represents the relative dielectric constant in air, and εr2 represents the relative dielectric constant of the rotating body 330. From Equations 1 to 3, the capacitance d value is maximized by configuring the distances d1 and d2 to be equal.

On the other hand, in the state of FIG. 7B, the capacitance values Ca ′, Cb ′, and Cc ′ detected by the respective detection electrodes are expressed by Equations 4 to 6.

As described with reference to FIG. 4, the operation unit 140 detects the rotation direction based on the capacitance change between the state illustrated in FIG. 7A and the state illustrated in FIG. Therefore, the detection sensitivity is better as the capacitance change amount in FIGS. 7A and 7B is larger.

  FIG. 7C shows a change in capacitance when the thickness (d3) of the rotating body 330 is changed under the condition where d1 and d2 are constant. The capacitance change in FIG. 7C represents how the difference value between the states in FIG. 7A and FIG. 7B changes depending on the thickness of d3. The curve of the capacitance change curve in FIG. 7C changes depending on the relative dielectric constant of the rotating body 330, but has a maximum value. Therefore, after determining d1 and d2 and determining the relative permittivity of the rotator 330, a configuration with better detection sensitivity can be realized by selecting d3 in the vicinity where the capacitance change value becomes the maximum value. Can do.

  Further, as long as the rotating body 330 is positioned between the substrate 340 and the conductor 320, the detected capacitance does not change even if the rotating body 330 moves slightly in the direction of the rotation axis. For this reason, even when the position of the rotating body 330 changes due to rattling when operating the rotation operation member 300, the electrostatic capacitance detection result is not affected, and the rotation operation of the operation member 300 can be detected stably. It becomes possible.

  Further, as described above, the mounting portions 340 a, b, and c of the substrate 340 and the mounting portions 320 a, b, and c of the conductor 320 are fixed to the same location (fixed portions 310 a, b, and c) of the base member 310. For this reason, when an external force is applied to the rotation operation member 300, the external force via the base member 310 is similarly transmitted to the substrate 340 and the conductor 320, and the substrate 340 and the external force 320 are similarly deformed. That is, even when an external force is applied, a change in the distance between the substrate 340 and the conductor 320 can be suppressed, the detected capacitance can be stabilized, and the reliability of detecting the rotational operation with respect to the external force can be improved.

  Further, as shown in FIG. 8, the attachment portions 320a, 320b, and 320c of the conductor 320 are arranged at a position away from the ring-shaped basic surface 320g by a predetermined distance D1. (FIG. 8A is a diagram in which the conductor 320 is observed from the direction of the rotation axis of the rotary operation member 300, and FIG. 8B is a diagram in which FIG. The distance between the substrate 340 and the conductor 320 that greatly affects the electrostatic capacity is determined by this distance D1. For this reason, when only the height D1 of the mounting portions 320a, 320b, 320c of the conductor 320 is managed at the time of manufacturing the parts, it is possible to suppress the variation in capacitance between the individual imaging devices. Further, the attachment portions 320 a, b, and c of the conductor 320 are provided substantially evenly with respect to the rotation axis of the rotation operation member 300. As a result, the sensitivity of the height dimension D1 of the mounting portions 320a, b, and c with respect to the distance between the basic surface 320g and the substrate 340 can be made equal, and the difficulty in manufacturing parts can be reduced.

  Next, suppression of the secondary discharge generated voltage due to electrostatic noise in this embodiment will be described with reference to FIG.

  FIG. 9 is a simplified cross-sectional view of the ball member 311, the spring member 312, the conductor 320, the conductor 380, the rotating body 330, and the substrate 340 from the components of the operation unit 140. FIG. 9A illustrates a configuration in which the conductor 380 is not disposed, and FIG. 9B illustrates the conductor 380 according to the present embodiment between the ball member 311 and the spring member 312 and the conductor 320. A configuration in which a conductor 380 is disposed is illustrated.

  In FIG. 9A, when static noise is generated in the vicinity of the ball member 311 and the spring member 312, the ball member 311 that is a floating metal and the conductor 320 disposed in the vicinity of the spring member 312 are two. A secondary discharge may occur. Assuming that a capacitor is constituted by the ball member 311, which is a floating metal, and the spring member 312 and the conductor 320, the voltage V 1 generated at that time can be expressed by Equation 7. At this time, the area of the ball member 311 and the spring member 312 is S, and the distance from the conductor 320 is d4. Further, the charge amount of electrostatic noise is Q, and the dielectric constant of the air layer between the ball member 311 and the spring member 312 and the conductor 320 is ε4.

When the secondary discharge occurs, the generated voltage is V1 expressed by Expression 7, and depending on the magnitude of the generated voltage V1, the electric components such as the IC 120 mounted on the substrate 340 are affected, and imaging is performed. There is a possibility of causing malfunction or destruction of the device 100.

  Next, the case where the conductor 380 is disposed between the ball member 311 and the spring member 312 and the conductor 320 as shown in FIG.

  When static noise is generated in the vicinity of the ball member 311 and the spring member 312, secondary discharge may occur to the ball member 311 that is a floating metal and the conductor 380 disposed in the vicinity from the spring member 312. is there. Assuming that a capacitor is constituted by the ball member 311, which is a floating metal, and the spring member 312 and the conductor 380, the voltage V 2 generated at that time can be expressed by Expression 8. At this time, the area of the ball member 311 and the spring member 312 is S, and the distance from the conductor 380 is d5. Further, the charge amount of electrostatic noise is Q, and the dielectric constant of the air layer between the ball member 311 and the spring member 312 and the conductor 380 is ε4.

  At this time, as shown in FIG. 9, the relationship between the distance between the ball member 311 and the spring member 312 which are floating metals and the grounded grounded conductor 320 or 380 is d4> d5. From this, when static noise is generated in the vicinity of the ball member 311 and the spring member 312, secondary discharge of the ball member 311 and the spring member 312 to the conductor 320 or the conductor 380 disposed in the vicinity is performed. The voltage relationship is V1> V2. Compared to the configuration of FIG. 9A, in the configuration of FIG. 9B, the voltage generated when secondary discharge occurs is smaller. Therefore, it is possible to reduce the influence on electrical components such as the IC 120 mounted on the substrate 340, and it is possible to suppress the occurrence rate of malfunction or destruction of the imaging device 100.

  Further, as shown in FIG. 6, the conductor 380 is arranged closer to the user operation unit 140 than the conductor 320, so that the electrostatic capacity caused by the rotation of the rotating pair 330 arranged between the conductor 320 and the substrate 340. It has no effect on change detection.

  By adopting such a configuration, it is difficult to directly ground the ball member 311 and the spring member 312 that are floating metals, and when secondary discharge due to electrostatic noise may occur, By reducing the voltage fluctuation due to the secondary discharge, it is possible to suppress the occurrence rate of malfunction and destruction phenomenon of the electronic device.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

100 imaging device, 120 capacitance sensor IC, 130 detection electrode, 140 operation unit,
160 CPU, 300 rotation operation member, 310 base member, 320 conductor,
330 rotating body, 340 substrate, 350 flexible substrate, 380 conductor

Claims (8)

An operation member (300) capable of rotating operation;
A holding member (310) for rotatably holding the operation member (300);
Non-grounded floating metals (311 312) disposed between the operating member (300) and the holding member (310);
A first ground member (320) fixed to the holding member (310) and grounded;
A rotating body (330) fixed to the operating member (300) and integrally rotating;
A rotation detection board (340) for detecting the rotation operation;
The rotating body (330) is disposed between the rotation detection board (340) and the first ground member (320),
An electronic apparatus comprising a second ground member (380) disposed between the floating metal (311 and 312) and the first ground member (320).   The electronic apparatus according to claim 1, wherein the first ground member (320) and the rotation detection board (340) are electrically connected to each other at a position fixed to the holding member (310).   The second ground member (380) is fixed to the holding member (310) and grounded except at a place where the first ground member (320) and the rotation detection board (340) are fixed. The electronic device according to claim 1, wherein the electronic device is characterized by the following.   The electronic device according to any one of claims 1 to 3, wherein the rotating body (330) is a substance having a relative dielectric constant higher than that of air. An operation member (300) capable of rotating operation;
A holding member (310) for rotatably holding the operation member (300);
Non-grounded floating metals (311 312) disposed between the operating member (300) and the holding member (310);
A first ground member (320) fixed to the holding member (310) and grounded;
A rotating body (330) fixed to the operating member (300) and integrally rotating;
A rotation detection board (340) for detecting the rotation operation;
The rotating body (330) is disposed between the rotation detection board (340) and the first ground member (320),
An image pickup apparatus, wherein a second ground member (380) is disposed between the floating metal (311 312) and the first ground member (320).   The imaging apparatus according to claim 5, wherein the first ground member (320) and the rotation detection substrate (340) are electrically connected to each other at a position fixed to the holding member (310).   The second ground member (380) is fixed to the holding member (310) and grounded except at a place where the first ground member (320) and the rotation detection board (340) are fixed. The imaging device according to claim 5 or 6, wherein the imaging device is characterized.   The imaging device according to any one of claims 5 to 7, wherein the rotating body (330) is a substance having a relative dielectric constant higher than that of air.