JP2017025222A - Thermosetting silicone resin composition, photocoupler using the same and optical semiconductor device having the photocoupler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a thermosetting silicone resin having excellent heat resistance, flame retardancy, initial transmittance and transmittance after heat treatment; a photocoupler using a cured product of the resin; and an optical semiconductor device having the photocoupler.SOLUTION: There is provided a thermosetting silicone resin composition which comprises (A) 70 to 95 pts.mass of a resinous organopolysiloxane having a weight average molecular weight in terms of polystyrene of 500 to 20000, (B) 5 to 30 pts.mass of an organopolysiloxane having a linear diorganopolysiloxane residue and at least one cyclohexyl group or phenyl group in one molecule, (C) 400 to 1200 pts.mass of an inorganic filler, (D) 0.01 to 10 pts.mass of a curing catalyst and (E) 0.5 to 10 pts.mass of an internal mold release agent, where the inorganic filler as (C) component has a refractive index of 1.35 to 1.60.SELECTED DRAWING: None

Description

  The present invention relates to a thermosetting silicone resin composition, a photocoupler device using the same, and an optical semiconductor device having the photocoupler.

  In recent years, with the increase in communication speed and capacity, the importance of optical system devices is increasing in various fields. Among them, a photocoupler is a device that combines a light emitting element and a light receiving element that converts an input electric signal into light by a light emitting element and transmits the light by transmitting the light to the light receiving element. In photocouplers, it is important to efficiently transmit light from the light-emitting element to the light-receiving element. Therefore, a double structure is used to block light from the outside and to provide moisture resistance reliability and flame resistance. Often has. That is, the light-emitting element is often sealed with a primary sealing resin having light transmission ability, that is, high transparency, and subsequently sealed with a secondary sealing resin having light shielding properties. Conventionally, silicone gel has been used for the primary sealing resin, and epoxy resin has been used for the secondary sealing resin. On the other hand, in recent years, for the purpose of cost reduction and protection of the element from external force, only the periphery of the light receiving element or the light emitting element is sealed with silicone gel, and then an epoxy resin is applied to the primary sealing resin. Yes.

  The efficiency of the photocoupler is expressed by CTR (Current Transfer Ratio) and can be obtained by the ratio of the current of the light emitting element and the electromotive force of the light receiving element. In order to obtain a high CTR value, a high light transmittance with near infrared light in the vicinity of 700 nm to 1,000 nm is necessary.

  Patent Document 1 discloses that an epoxy resin composition excellent in reliability and light transmittance is used for a photocoupler. In order to obtain a high CTR value, it has been shown that reduction of light absorption by a metal material and light scattering by fused spherical silica are important. The fused spherical silica that has been used as an inorganic filler in the past improves the light transmittance of the resin composition by surely increasing the scattering of light. However, since the refractive indexes of the fused silica and the resin component such as an aromatic epoxy resin and a curing agent are greatly different from each other, a resin composition using these cannot obtain sufficient light transmittance.

  Patent Document 2 discloses a material that uses a bisphenol A type epoxy resin and an alicyclic epoxy resin in combination as an epoxy resin composition and uses an acid anhydride as a curing agent in order to obtain high transmittance. According to this, there is a description that colorless transparency and high fluidity can be obtained, but it is composed of only a resin component, has a high water absorption rate, and is inferior in moisture resistance reliability. In addition, there is a problem that the amount of thermal expansion is large and defects due to imbalance of the thermal expansion coefficient with the secondary sealing resin are likely to occur, and it is difficult to solidify and tablet stably.

  Patent Document 3 discloses a material in which the refractive index of the resin component and the inorganic filler is close to obtain high transmittance even if the inorganic filler is contained for moldability and low thermal expansion coefficient. . However, in recent years, the primary sealing resin using a thermosetting epoxy resin as described in Patent Documents 1 to 3 is severely deteriorated due to higher output of the light emitting element and higher usage environment. The value has fallen and satisfactory results are no longer obtained.

  Patent Document 4 exemplifies an addition reaction type silicone component and an inorganic filler having a close refractive index. However, since the addition reaction type silicone component has many methylene chains, the flame retardancy may be insufficient. In addition, many of such addition reaction type silicone components are in the form of gels or rubbers, and if an inorganic filler is contained, the coefficient of thermal expansion decreases, but the amount of decrease is insufficient, and further, it is handled during molding. There is also a problem that becomes complicated.

Japanese Patent Laid-Open No. 62-108583 Japanese Patent No. 2970214 JP-A-6-25386 JP 2012-41496 A

  Accordingly, the present invention provides a thermosetting silicone resin composition having excellent heat resistance, flame retardancy, initial transmittance, and transmittance after heat treatment, a photocoupler using the same, and an optical semiconductor device having the photocoupler. The purpose is to do.

  As a result of intensive studies to solve the above problems, the present inventors have found that the following thermosetting silicone resin composition is a resin applicable to photocoupler primary sealing and the like that can achieve the above object. The present invention has been completed.

That is, the present invention
(A) Resinous organopolysiloxane represented by the following average composition formula (1) and having a polystyrene-equivalent weight average molecular weight of 500 to 20,000: 70 to 95 parts by mass,
(CH ₃ ) _a Si (OR ¹ ) _b (OH) _c O _{(4-abc) / 2} (1)
(In the formula, R ¹ represents the same or different organic group having 1 to 4 carbon atoms, and a, b and c are 0.8 ≦ a ≦ 1.5, 0 ≦ b ≦ 0.3, 0.001. ≦ c ≦ 0.5 and 0.801 ≦ a + b + c <2.
(B) It has a linear diorganopolysiloxane residue represented by the following general formula (2), has 0.5 to 10 mol% of silanol group-containing siloxane units with respect to all siloxane units, 1 Organopolysiloxane containing at least one cyclohexyl group or phenyl group in the molecule: 5 to 30 parts by mass (provided that the total of components (A) and (B) is 100 parts by mass),

(In the formula, R ² is a monovalent hydrocarbon group selected from a hydroxyl group, an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, a phenyl group, a vinyl group and an allyl group independently of each other; Indicates an integer.)
(C) Inorganic filler: 400 to 1200 parts by mass,
(D) Curing catalyst: 0.01 to 10 parts by mass, and (E) Internal mold release agent: 0.5 to 10 parts by mass, and the refractive index of the inorganic filler as component (C) is 1.35. The thermosetting silicone resin composition is characterized by being 1.60.
The present invention also provides a photocoupler sealed with the thermosetting silicone resin composition and an optical semiconductor device having the photocoupler.

  According to the present invention, a thermosetting silicone resin composition excellent in heat resistance, flame retardancy, initial transmittance and transmittance after heat treatment, a photocoupler using a cured product of the composition, and the photocoupler An optical semiconductor device having the same can be provided.

  Hereinafter, the present invention will be described in more detail.

(A) Resin-like organopolysiloxane The (A) component organopolysiloxane has the following average composition formula (1)
(CH ₃ ) _a Si (OR ¹ ) _b (OH) _c O _{(4-abc) / 2} (1)
(In the above formula (1), R ¹ is the same or different organic group having 1 to 4 carbon atoms. A, b and c are 0.8 ≦ a ≦ 1.5, 0 ≦ b ≦ 0. 3, 0.001 ≦ c ≦ 0.5 and 0.801 ≦ a + b + c <2.
For example, a resin-like (ie, branched or three-dimensional network structure) organopolysiloxane having a weight average molecular weight in terms of polystyrene of 500 to 20,000 by gel permeation chromatography (GPC) using tetrahydrofuran or the like as a developing solvent A crosslinked structure is formed in the presence of a curing catalyst for condensation reaction, which is siloxane and is a component (D) described later.

  In the above average composition formula (1), a composition containing an organopolysiloxane having a methyl group content a of less than 0.8 has a problem that the cured product is too hard and the crack resistance is poor. It becomes easy and it is not preferable. On the other hand, if a exceeds 1.5, the resulting resinous organopolysiloxane is not preferred because it is difficult to solidify. Preferably, 0.8 ≦ a ≦ 1.2, more preferably 0.9 ≦ a ≦ 1.1.

  In the above average composition formula (1), when b indicating the content of the alkoxy group exceeds 0.3, the molecular weight of the obtained resinous organopolysiloxane tends to be small, and the crack resistance is often lowered. Preferably it is 0.001 <= b <= 0.2, More preferably, it is 0.01 <= b <= 0.1.

  In the above average composition formula (1), when c indicating the content of hydroxyl groups bonded to Si atoms exceeds 0.5, the resulting resinous organopolysiloxane exhibits high hardness due to a condensation reaction during heat curing. On the other hand, it tends to be a cured product having poor crack resistance. On the other hand, when c is less than 0.001, the resulting resinous organopolysiloxane tends to have a high melting point, which may cause problems in workability. Preferably 0.01 ≦ c ≦ 0.3, and more preferably 0.05 ≦ c ≦ 0.2. In order to control the value of c, it is preferable that the complete condensation rate of the raw material alkoxy group is 86 to 96%. If the complete condensation rate is less than 86%, the melting point is low, and if it exceeds 96%, the melting point tends to be too high, which is not preferable.

  From the above, in the average composition formula (1), 0.9 ≦ a + b + c ≦ 1.8 is preferable, and 1.0 ≦ a + b + c ≦ 1.5 is more preferable.

In the average composition formula (1), R ¹ is an organic group having 1 to 4 carbon atoms, and examples thereof include alkyl groups such as a methyl group, an ethyl group, and an isopropyl group, and the raw material is easily available. And a methyl group and an isopropyl group are preferable.

The resin-like organopolysiloxane (A) has a weight average molecular weight of 500 to 20,000, preferably 1,000 to 10,000, more preferably 2,000 to 8,000, as converted to polystyrene standards by GPC measurement. It is. If the molecular weight is less than 500, the resulting resinous organopolysiloxane is difficult to solidify, and if the molecular weight exceeds 20,000, the resulting composition has too high a viscosity and fluidity is lowered, resulting in moldability. May get worse.
In the present invention, the weight average molecular weight is measured by GPC under the following measurement conditions.
<Molecular weight measurement conditions>
Developing solvent: Tetrahydrofuran Flow rate: 0.35 mL / min
Detector: RI
Column: TSK-GEL H type (manufactured by Tosoh Corporation)
Column temperature: 40 ° C
Sample injection volume: 5 μL

The component (A) represented by the above average composition formula (1) generally has a Q unit (SiO _4/2 ), a T unit (CH ₃ SiO _3/2 ), and a D unit ((CH ₃ ) ₂ SiO _2/2. ) And M units ((CH ₃ ) ₃ SiO _1/2 ). When the component (A) is represented by this expression, it is preferable that the ratio of the number of moles of the T unit is 70 mol% or more (70 to 100 mol%) with respect to the total number of moles of all siloxane units. More preferably, it is 75 mol% or more (75-100 mol%), and especially preferably 80 mol% or more (80-100 mol%). If the molar ratio of the T unit is less than 70 mol%, the overall balance of hardness, adhesion, appearance, etc. of the resulting cured product may be lost. The balance may be M, D, Q units, and the total molar ratio of these units to all siloxane units is 30 mol% or less (0 to 30 mol%), particularly more than 0 mol% and 30 mol% or less. Therefore, it is preferable that the T unit is less than 100 mol%.

The component (A) represented by the average composition formula (1) can be obtained as a hydrolytic condensate of an organosilane represented by the following general formula (3).
(CH ₃ ) _n SiX _4-n (3)
(In the formula, X represents a halogen atom such as chlorine or an alkoxy group having 1 to 4 carbon atoms, and n is 0, 1, or 2.) In this case, X represents a solid organopoly From the viewpoint of obtaining siloxane, a chlorine atom or a methoxy group is preferable.

  Examples of the silane compound represented by the above formula (3) include organotrichlorosilanes such as methyltrichlorosilane; organotrialkoxysilanes such as methyltrimethoxysilane and methyltriethoxysilane; disilanes such as dimethyldimethoxysilane and dimethyldiethoxysilane. Examples include organodialkoxysilanes; tetrachlorosilanes; tetraalkoxysilanes such as tetramethoxysilane and tetraethoxysilane.

  The hydrolysis and condensation of the silane compound having the hydrolyzable group may be performed by a usual method. Among these, it is preferable to carry out in the presence of an acid catalyst such as acetic acid, hydrochloric acid or sulfuric acid, or an alkali catalyst such as sodium hydroxide, potassium hydroxide or tetramethylammonium hydroxide. Also, for example, when a silane containing a chloro group as a hydrolyzable group is used, a desired hydrolysis condensate having an appropriate molecular weight can be obtained using hydrogen chloride gas and hydrochloric acid generated by addition of water as a catalyst. it can.

  The amount of water used in the hydrolysis and condensation is generally 0 with respect to 1 mol of the total amount of hydrolyzable groups (for example, chloro group) in the silane compound having the hydrolyzable group. .9 to 1.6 mol, preferably 1.0 mol to 1.3 mol. When this addition amount satisfies the range of 0.9 to 1.6 mol, the composition described later is excellent in workability, and the cured product tends to be excellent in toughness.

  The silane compound having a hydrolyzable group is usually preferably used after being hydrolyzed in an organic solvent such as alcohols, ketones, esters, cellosolves, and aromatic compounds. Specifically, for example, alcohols such as methanol, ethanol, isopropyl alcohol, isobutyl alcohol, n-butanol, and 2-butanol, or aromatic compounds such as toluene and xylene are preferable, and the resulting composition has excellent curability and yield. In view of the excellent toughness of the resulting cured product, isopropyl alcohol, toluene, or a combination of isopropyl alcohol and toluene is more preferable.

  The reaction temperature for hydrolysis and condensation is preferably 10 to 120 ° C, more preferably 20 to 80 ° C. When the reaction temperature is within this range, a solid hydrolysis condensate that is difficult to gel and can be used in the next step is obtained.

(B) Organopolysiloxane The thermosetting silicone resin composition of the present invention has a linear diorganopolysiloxane residue represented by the following formula (2) as a component (B) for stress relaxation and crack resistance improvement. Having a silanol group-containing siloxane unit of 0.5 to 10 mol% based on the total siloxane units, and containing at least one, preferably two or more cyclohexyl groups or phenyl groups in one molecule. An organopolysiloxane characterized by

In the above formula (2), R ² is a group independently selected from a hydroxyl group, an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, a phenyl group, a vinyl group, and an allyl group. R ² is preferably a methyl group or a phenyl group. m is an integer of 5 to 50, preferably 8 to 40, more preferably 10 to 35. When m is less than 5, the obtained cured product tends to have poor crack resistance, and the device including the cured product may be warped. On the other hand, when m exceeds 50, the mechanical strength of the obtained cured product tends to be insufficient.

Component (B), in addition to the D unit represented by the above formula ^{_{(2) (R 2 2 SiO}} 2/2), D units not corresponding to the above formula _{(2) (R 2 SiO 2/2} ), and M Units (R ₃ SiO _1/2 ) and / or T units (RSiO _3/2 ) may be included. The molar ratio of D unit: M unit: T unit is 90 to 24:75 to 9:50 to 1, particularly 70 to 28:70 to 20:10 to 2 (however, the total of these units is 100). It is preferable from a cured | curing material characteristic. Here, R represents a hydroxyl group, a methyl group, an ethyl group, a propyl group, a cyclohexyl group, a phenyl group, a vinyl group or an allyl group. In addition to these, the component (B) may contain Q units (SiO _4/2 ). The organopolysiloxane of component (B) includes D unit (R ² ₂ SiO _2/2 ) of formula (2), D unit (R ₂ SiO _2/2 ) not corresponding to formula (2), M unit (R ₃ SiO _1/2 ) and / or T units (RSiO _3/2 ) contain at least one cyclohexyl group or phenyl group in one molecule.

  Preferably 30 mol% or more (for example, 30 to 90 mol%), particularly 50 mol% or more (for example, 50 to 80 mol%) in the organopolysiloxane of component (B) is a general formula ( It is preferable to form a linear diorganopolysiloxane structure represented by 2). Moreover, it is preferable that the polystyrene conversion weight average molecular weights by the gel permeation chromatography (GPC) of (B) component are 3,000-100,000, More preferably, it is 10,000-100,000. When the molecular weight is within this range, the component (B) is solid or semi-solid, which is preferable from the viewpoint of workability and curability of the resulting composition.

  The component (B) can be synthesized by combining the compounds used as raw materials for each of the above units in the resulting polymer so as to have a required molar ratio, for example, hydrolysis and condensation in the presence of an acid. .

Here, the raw material of the T unit (RSiO _3/2 ) corresponds to trichlorosilanes such as methyltrichlorosilane, ethyltrichlorosilane, propyltrichlorosilane, phenyltrichlorosilane, and cyclohexyltrichlorosilane, and the respective trichlorosilanes. Examples include alkoxysilanes such as trimethoxysilanes.

As a raw material for the D unit (R ² ₂ SiO _2/2 ) that forms the linear diorganopolysiloxane residue of the above formula (2),

(Here, an integer (average value) of m = 3 to 48, an integer (average value) of n = 0 to 48, and m + n is 3 to 48 (average value, and each repeating unit is a block even if it is a block) Or the like))) and the like.

In addition, as raw materials for M units, D units, etc., monolithic materials such as Me ₂ PhSiCl, Me ₂ ViSiCl, Ph ₂ MeSiCl, Ph ₂ ViSiCl, Me ₂ SiCl ₂ , MeEtSiCl ₂ , ViMeSiCl _2, Ph ₂ SiCl ₂ , PhMeSiCl _2, etc. Alternatively, dichlorosilanes and mono- or dialkoxysilanes such as mono- or dimethoxysilanes corresponding to each of these chlorosilanes can be exemplified. Here, Me represents a methyl group, Et represents an ethyl group, Ph represents a phenyl group, and Vi represents a vinyl group.

  (B) component can be obtained by combining these raw material compounds at a predetermined molar ratio and reacting them, for example, as follows. Phenylmethyldichlorosilane, phenyltrichlorosilane, 21-terminal chlorodimethylsilicone oil having 21 Si atoms, and toluene are added and mixed, and the mixed silane is dropped into the liquid, and co-hydrolyzed at 30 to 50 ° C. for 1 hour. Then, after aging at 50 ° C. for 1 hour, water is added for washing, followed by azeotropic dehydration and polymerization at 25 to 40 ° C. using ammonia or the like as a catalyst, followed by filtration and vacuum stripping.

The component (B) includes a siloxane unit having a silanol group. The (B) component organopolysiloxane usually contains about 0.5 to 10 mol%, preferably about 1 to 5 mol% of such silanol group-containing siloxane units with respect to the total siloxane units. Examples of the silanol group-containing siloxane units include R (HO) SiO _2/2 units, R (HO) ₂ SiO _1/2 units, and R ₂ (HO) SiO _1/2 units (where R Are the aforementioned groups other than hydroxyl groups). Since the organopolysiloxane contains a silanol group, it undergoes a condensation reaction with the resinous polyorganosiloxane of the component (A) containing the hydroxyl group represented by the above formula (1).

  The amount of component (B) is preferably such that the mass ratio of component (A) to component (B) is in the range of 95: 5 to 70:30, more preferably in the range of 90:10 to 80:20. is there. When the blending amount of the component (B) is too small, the effect of improving the continuous moldability of the resulting composition is small, and it becomes difficult to achieve low warpage and crack resistance in the resulting cured product. On the other hand, if the amount of component (B) is large, the viscosity of the resulting composition tends to increase, which may hinder molding.

(C) Inorganic filler An inorganic filler is blended in the thermosetting silicone resin composition of the present invention. Examples of such inorganic fillers are usually silicas such as fused silica and crystalline silica, alumina, silicon nitride, aluminum nitride, boron nitride, antimony trioxide, potassium titanate, glass particles, glass fibers, etc. What is mix | blended with an epoxy resin composition is mentioned. Among them, since the light extraction efficiency is better when the refractive index of the silicone resin and the inorganic filler is closer, the inorganic filling with a refractive index of 1.35 to 1.60, more preferably 1.40 to 1.55. It is preferable to use a material. Spherical silica and glass particles are desirable from the viewpoint of fluidity, and crushed silica and glass fibers are preferable from the viewpoint of reinforcement. In particular, from the viewpoint of moldability, fluidity, burrs, and transmittance, fused spherical silica is preferable.
In the present invention, the refractive index is a value measured at a temperature of 25 ° C. and a wavelength of 589.3 nm by an Abbe refractometer by a method based on JIS K 0062: 1992.

The average particle size of the inorganic filler is preferably 5 to 40 μm, particularly preferably 7 to 35 μm. When the average particle size is less than 5 μm, the viscosity is greatly increased, not only the fluidity is decreased, but also the transmittance is decreased. If the average particle size is larger than 40 μm, very many burrs are generated. Those having an average particle diameter of 5 to 40 μm are commercially available or can be produced by known methods. In order to make the silicone resin composition highly fluid, it is preferable to use a combination of a fine region of 0.1 to 3 μm, a medium particle size region of 4 to 8 μm, and a coarse region of 10 to 50 μm. The average particle size is one calculated as a cumulative weight average value D _{50 (or} median diameter) in particle size distribution measurement by laser diffraction method.

  (C) The compounding quantity of the inorganic filler which is a component is 300-1200 mass parts with respect to 100 mass parts of sum total of (A) and (B) component, Especially 400-1000 mass parts is preferable. If it is less than 300 parts by mass, sufficient strength may not be obtained. If it exceeds 1200 parts by mass, unfilled defects due to thickening and flexibility will be lost, resulting in defects such as peeling in the element. There is a case. In addition, it is preferable to contain the compounding quantity of the inorganic filler which is this (C) component in 10-92 mass% of the whole composition, especially 50-88 mass%.

(D) Curing catalyst The curing catalyst of the component (D) is a condensation catalyst for use in curing the thermosetting organopolysiloxane that is the components (A) and (B), and the components (A) and (B). Selected in consideration of the stability of the coating, the hardness of the coating, non-yellowing, curability and the like. Specifically, for example, basic compounds such as trimethylbenzylammonium hydroxide, tetramethylammonium hydroxide, n-hexylamine, tributylamine, diazabicycloundecene (DBU), dicyandiamide, p-toluenesulfonic acid, Acidic compounds such as trichloroacetic acid, organic acid zinc, Lewis acid catalyst, organoaluminum compound, organic titanium compound, etc. are preferably used, specifically zinc benzoate, zinc octylate, zinc p-tert-butylbenzoate. , Zinc laurate, zinc stearate, aluminum chloride, aluminum perchlorate, aluminum phosphate, aluminum triisopropoxide, aluminum acetylacetonate, ethyl acetoacetate aluminum di (normal butyrate), aluminum Arm -n- butoxy diethyl acetoacetate, tetrabutyl titanate, tetraisopropyl titanate, tin octylate, cobalt naphthenate, organometallic condensation catalyst, such as naphthenate, tin and the like. Among these, use of zinc benzoate is preferable.

  The blending amount of the curing catalyst is preferably 0.01 to 10 parts by mass, particularly preferably 0.1 to 1.6 parts by mass with respect to 100 parts by mass in total of the organopolysiloxanes of the components (A) and (B). Part. When the blending amount satisfies such a range, the resulting silicone resin composition has good curability and becomes stable.

(E) Internal mold release agent An internal mold release agent is mix | blended with the silicone resin composition of this invention. (E) A component is mix | blended in order to improve the mold release property at the time of shaping | molding, and it adds so that it may contain 0.2-5.0 mass% with respect to the whole composition. Examples of the internal mold release agent include natural wax, acid wax, polyethylene wax, and synthetic wax such as fatty acid wax, among which calcium stearate or stearate having a melting point of 120 to 140 ° C. is preferably used. .

In the present invention, the following optional components can be blended in addition to the above components.
(F) Coupling agent In the thermosetting silicone resin composition of the present invention, the bonding strength between the resin and the inorganic filler is increased, the adhesion between the inorganic filler and the resin component is improved, and the strength of the molded product is increased. , Coupling agents such as silane coupling agents and titanate coupling agents can be blended to improve adhesion strength with the epoxy resin for secondary sealing and prevent light attenuation. .

  Examples of such a coupling agent include epoxy functions such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. It is preferable to use a mercapto functional alkoxysilane such as a functional alkoxysilane or γ-mercaptopropyltrimethoxysilane. The amount of the coupling agent used for the surface treatment and the surface treatment method are not particularly limited, but the resin discolors when left at 150 ° C. or more like an amine-based silane coupling agent. Is less preferred.

  Component (F) may be added in an amount of 0.1 to 8.0% by weight, preferably 0.5 to 6.0% by weight, based on the sum of components (A) and (B). If it is less than 0.1% by weight, the effect of enhancing the adhesion to the base material or the secondary sealing resin cannot be expected, and if it exceeds 8.0% by weight, the viscosity is extremely lowered, causing voids. there is a possibility.

Other Additives Various additives can be further blended in the thermosetting silicone resin composition of the present invention as necessary. For example, additives such as silicone powder, silicone oil, thermoplastic resin, thermoplastic elastomer, organic synthetic rubber, light stabilizer, etc. may be added and blended within the range not impairing the effects of the present invention for the purpose of improving the properties of the resin. it can.

Manufacturing method of thermosetting silicone composition As a manufacturing method of the thermosetting silicone composition of the present invention, a silicone resin, an inorganic filler, a curing catalyst, an internal release agent, and other additives are blended at a predetermined composition ratio. The mixture is sufficiently uniformly mixed by a mixer, etc., and then subjected to a melt mixing process using a hot roll, a kneader, an extruder, etc., then cooled and solidified, and pulverized to an appropriate size to obtain a thermosetting silicone resin composition. It can be a molding material. The cured product of the silicone resin composition of the present invention has a linear expansion coefficient at a temperature exceeding the glass transition temperature of 30 ppm / K or less, preferably 25 ppm / K or less.

Molding method of sealing material The most common molding method of the primary sealing material for photocouplers shown in the present invention includes a transfer molding method and a compression molding method. In the transfer molding method, using a transfer molding machine, the molding pressure is 5 to 20 N / mm ² , the molding temperature is 120 to 190 ° C., the molding time is 60 to 500 seconds, and the molding temperature is 150 to 185 ° C., and the molding time is 30 to 180 seconds. It is preferable. In the compression molding method, a compression molding machine is used, and the molding temperature is preferably 120 to 190 ° C., the molding time is 30 to 600 seconds, and the molding temperature is preferably 130 to 160 ° C. and the molding time is 120 to 300 seconds. Further, in any molding method, post-curing may be performed at 150 to 185 ° C. for 0.5 to 20 hours.

  EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.

The raw materials used in Examples and Comparative Examples are shown below.
In the present invention, the weight average molecular weight is measured by GPC under the following measurement conditions.
<Molecular weight measurement conditions>
Developing solvent: Tetrahydrofuran Flow rate: 0.35 mL / min
Detector: RI
Column: TSK-GEL H type (manufactured by Tosoh Corporation)
Column temperature: 40 ° C
Sample injection volume: 5 μL

(A) Synthesis of resinous organopolysiloxane [Synthesis Example 1]
100 parts by mass of methyltrichlorosilane and 200 parts by mass of toluene were placed in a 1 L flask, and a mixed liquid of 8 parts by mass of water and 60 parts by mass of isopropyl alcohol was added dropwise to the solution under ice cooling. The solution was added dropwise over 5 hours at an internal temperature of -5 to 0 ° C, then heated and stirred at reflux temperature for 20 minutes. Then, the liquid mixture was cooled to room temperature, 12 parts by mass of water was added dropwise at 30 ° C. or lower in 30 minutes, and the mixture was stirred for 20 minutes. After 25 parts by mass of water was added dropwise thereto, the resulting reaction mixture was stirred in the range of 40 to 45 ° C. for 60 minutes. Thereafter, 200 parts by mass of water was added to the reaction mixture to separate the organic layer. The organic layer was washed until neutral, then subjected to azeotropic dehydration, filtration, and stripping under reduced pressure to give a colorless and transparent solid represented by the following average formula (A-1) (melting point 76 ° C., weight average molecular weight 3 , 060, refractive index 1.43), 36.0 parts by mass of a resinous organopolysiloxane (A-1) was obtained.
(CH ₃ ) _1.0 Si (OC ₃ H ₇ ) _0.07 (OH) _0.10 O _1.4 (A-1)

(B) Synthesis of organopolysiloxane [Synthesis Example 2]
Phenylmethyldichlorosilane 100 g (4.4 mol%), phenyltrichlorosilane 2,100 g (83.2 mol%), dimethylpolysiloxane oil 2,400 g (12.4 mol%) of chloroblocked at both ends with 21 Si atoms ), 3,000 g of toluene, and the above silane mixed in 11,000 g of water was added dropwise and co-hydrolyzed in the range of 30 to 50 ° C. for 1 hour. Thereafter, after aging at 30 ° C. for 1 hour, water was added for washing, followed by azeotropic dehydration, filtration, and stripping under reduced pressure to obtain a colorless and transparent product (organosiloxane (B-1)). The siloxane (B-1) had a melt viscosity of 5 Pa · s at 150 ° C. using an ICI cone plate, a weight average molecular weight of 50,000, and a refractive index of 1.49.
[(Me ₂ SiO) ₂₁ ] _0.124 (PhMeSiO) _0.044 (PhSiO _1.5 ) _0.832 (B-1)

(C) Inorganic filler (C-1): fused spherical silica (trade name: RS-8225 / 53C, average 10 μm, refractive index, 1.46, manufactured by Tatsumori)
(C-2): Glass filler (trade name: CF0093, average 10 μm, refractive index 1.50, manufactured by Nippon Frit Co., Ltd.)

(D) Curing catalyst (D-1): Zinc benzoate (Wako Pure Chemical Industries, Ltd.)
(D-2): 2-phenylimidazole (trade name: 2PZ, manufactured by Shikoku Chemicals Co., Ltd.)

(E) Internal mold release agent (E-1): Ester wax (trade name: Kao Wax 220, manufactured by Kao Corporation)
(E-2): Carnauba wax (trade name: F1-100, manufactured by Dainichi Chemical Industry Co., Ltd.)

(F) Coupling agent (F-1): 3-mercaptopropyltrimethoxysilane (trade name: KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.)
(F-2): 3-Glycidoxypropyltrimethoxysilane (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.)

(G) Epoxy resin (G-1): Tris (2,3-epoxypropyl) isocyanurate (trade name TEPIC-s: manufactured by Nissan Chemical Co., Ltd.)
(G-2): Orthocresol novolac type epoxy resin (trade name: EOCN-1020-55, manufactured by Nippon Kayaku Co., Ltd.)
(G-3): Dicyclopentadiene type epoxy resin (trade name: Epicron HP-7200, manufactured by DIC Corporation)

(H) Phenolic resin (H-1): Novolac type phenolic resin (trade name: TD-2131, manufactured by DIC Corporation)

[Examples 1-2, Comparative Examples 1-8]
The composition (parts by mass) shown in Tables 1 and 2 was produced with a two-roll hot roll, cooled and pulverized to obtain a thermosetting silicone and an epoxy resin composition. The following properties were measured for these compositions. The results are shown in Tables 1 and 2.

Spiral flow value A mold conforming to the EMMI standard was used under the conditions of a molding temperature of 175 ° C., a molding pressure of 6.9 N / mm ² , and a molding time of 120 seconds.

Light transmittance, heat resistance test Under the conditions of a molding temperature of 175 ° C., a molding pressure of 6.9 N / mm ² and a molding time of 120 seconds, a cured product having a side of 50 mm × thickness of 0.35 mm is prepared, and 180 ° C. × 4 hours. Was subjected to secondary curing, and light transmittance at 740 nm was measured using an X-lite 8200 manufactured by SDG Co., Ltd. Thereafter, heat treatment was performed at 175 ° C. for 300 hours, and the light transmittance at 740 nm was measured using X-lite 8200 manufactured by SDG Co., Ltd. in the same manner.

Flame Retardancy Test Based on UL-94 standard, a 1/8 inch thick plate was molded under the conditions of a molding temperature of 175 ° C, a molding pressure of 6.9 N / mm ² , and a molding time of 120 seconds, and then posted at 180 ° C for 4 hours. Cure. The flame retardancy of the post-cured specimen was confirmed.

  As shown in Table 1, the thermosetting silicone resin of the present invention has a high transmittance in the initial state and hardly changes from the initial state permeability after the heat treatment in the heat resistance test. It was found to have excellent resistance to discoloration such as coloring due to deterioration. Further, since it has high heat resistance and flame retardancy, it has been found useful, for example, as a photocoupler primary sealing resin.

  On the other hand, as shown in Table 2, since the thermosetting epoxy resin has a large difference in refractive index from the inorganic filler, not only the initial transmittance is low, but also the heat resistance is low and the flame retardancy is poor. It was found that the silicone resin of the present application is superior to the epoxy resin as the primary sealing resin.

Claims (5)

(A) Resinous organopolysiloxane represented by the following average composition formula (1) and having a polystyrene-equivalent weight average molecular weight of 500 to 20,000: 70 to 95 parts by mass,
(CH ₃ ) _a Si (OR ¹ ) _b (OH) _c O _{(4-abc) / 2} (1)
(In the formula, R ¹ represents the same or different organic group having 1 to 4 carbon atoms, and a, b and c are 0.8 ≦ a ≦ 1.5, 0 ≦ b ≦ 0.3, 0.001. ≦ c ≦ 0.5 and 0.801 ≦ a + b + c <2.
(B) It has a linear diorganopolysiloxane residue represented by the following general formula (2), has 0.5 to 10 mol% of silanol group-containing siloxane units with respect to all siloxane units, 1 Organopolysiloxane containing at least one cyclohexyl group or phenyl group in the molecule: 5 to 30 parts by mass (provided that the total of components (A) and (B) is 100 parts by mass),

(In the formula, R ² is a monovalent hydrocarbon group selected from a hydroxyl group, an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, a phenyl group, a vinyl group and an allyl group independently of each other; Indicates an integer.)
(C) Inorganic filler: 300 to 1200 parts by mass,
(D) Curing catalyst: 0.01 to 10 parts by mass and (E) Internal mold release agent: 0.5 to 10 parts by mass are essential components, and the refractive index of the inorganic filler as component (C) is 1. A thermosetting silicone resin composition, which is 35 to 1.60.   The thermosetting silicone resin composition of Claim 1 in which the inorganic filler of the said (C) component contains at least 1 of the group which consists of a silica, a glass particle, and glass fiber.   The thermosetting silicone resin composition according to claim 1 or 2, wherein the curing catalyst of component (D) is an organometallic condensation catalyst.   A photocoupler sealed with the thermosetting silicone resin composition according to claim 1. An optical semiconductor device comprising the photocoupler according to claim 4.