JP2017008235A - Epoxy resin, and composition thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a novel resin raw material.SOLUTION: The present invention provides a novel bisphenol compound and a novel epoxy resin, and a resin composition comprising them.SELECTED DRAWING: None

Description

  The present invention relates to a novel phenol compound and a novel epoxy resin.

  In recent years, biomass (renewable organic resources obtained from animals and plants) has attracted attention as a carbon neutral resource from the viewpoint of environmental problems. For example, bioethanol production using edible biomass that can also be used as a food such as a sugar raw material or starch raw material can be mentioned. In this case, competition with food is a problem. On the other hand, non-edible biomass has been attracting attention because it does not compete with food. For example, lignocellulosic biomass, which is one of non-edible biomass, includes unused thinned wood, remaining wood from a lumber mill, and wood that is generated when a house is demolished. The use of lignocellulosic biomass is expected from the viewpoint of the environment because it is expected to suppress waste and be used as an energy resource.

  Lignocellulose biomass is composed of cellulose, hemicellulose, and lignin. Lignin is an adhesion molecule that bonds cellulose together. Since the structure is obtained by polymerizing a phenylpropane skeleton, it has attracted attention as a resource for aromatic compounds.

  Epoxy resin compositions are widely used in the fields of electrical and electronic parts, structural materials, adhesives, paints, etc. due to their workability and excellent electrical properties, heat resistance, adhesion, moisture resistance (water resistance), etc. It has been. In such fields, epoxy resins using biomass-derived compounds have been studied. Specifically, Patent Document 1 reports a lignin epoxidized product and a cured product thereof. However, since the lignin extracted from the plant is used as it is, it is a very high molecular weight compound, which may cause a problem in moldability. In addition, it is difficult to provide a high degree of reliability that can withstand the use of electrical and electronic materials.

  Non-patent document 1 reports that homovanillin and homosyringaldehyde are obtained as monomers obtained from lignin. There is no example of using these lignin monomers as bisphenol compounds, and establishment of a production method has been desired.

JP 2006-066237 A

A. Kaiho, M .; Kogo, R.A. Sakai, K .; Saito, T .; Watanabe, Green Chem. 2015, 17, 2780

  An object of the present invention is to provide a novel bisphenol compound and an epoxy resin having a phenylethane skeleton.

The present invention relates to the bisphenol compounds and epoxy resins described below.
(1) A bisphenol compound represented by the general formula [I].

（一般式［Ｉ］中、Ｒ_１およびＲ_２はメトキシ基を示す。ａはＲ_１とＲ_２の置換数であって、０〜３（整数）であり、Ｒ_１とＲ_２の置換数は異なってもよい。ｂとｃは水酸基の置換数であって、１〜３（整数）であり、ｂとｃは異なってもよい。Ｘは４価のリンカーを示す。）

(In the general formula [I], _{R 1} and _{R 2} is .a showing a methoxy group be a number of substituents _{R 1} and _{R 2,} 0-3 (integer), the substitution number of _{R 1} and _{R 2} And b and c are the number of hydroxyl groups, and are 1 to 3 (integer), b and c may be different, and X represents a tetravalent linker.

(2) In the general formula [I], the hydroxy group is at the 4-position of the phenyl group, and R ₁ and R ₂ are at the 3,5-positions of the phenyl group.
(3) In general formula [I], X represents formula [II]

または、式［ＩＩＩ］

Or the formula [III]

で表される前記ビスフェノール化合物。

The said bisphenol compound represented by these.

（一般式［ＩＶ］中、Ｇはグリシジル基を表し、Ｒ_１、Ｒ_２、ａ、ｂ、ｃ及びＸは一般式［Ｉ］と同一である。） (4) An epoxy resin obtained by reacting the bisphenol compound with an epihalohydrin.
(5) An epoxy resin represented by the general formula [IV].

(In the general formula [IV], G represents a glycidyl group, and R ₁ , R _2, a, b, c and X are the same as those in the general formula [I].)

(6) An epoxy resin composition containing an epoxy resin and the bisphenol compound.
(7) The epoxy resin composition further containing a curing agent.
(8) The said epoxy resin composition whose epoxy resin is an epoxy resin obtained by making an epihalohydrin react with the said bisphenol compound.
(9) The said epoxy resin composition whose epoxy resin is an epoxy resin represented by general formula [IV].
(10) The said epoxy resin composition whose epoxy resin is another epoxy resin.
(11) A cured product obtained by curing the epoxy resin composition.

  The bisphenol compound of the present invention can be obtained by reacting a 4-hydroxyphenylacetaldehyde derivative with a polyhydric alcohol in the presence of a catalyst.

  Examples of 4-hydroxyphenylacetaldehyde derivatives used in the present invention include 2- (4-hydroxyphenyl) acetaldehyde (formula (1)), homovanillin (formula (2)), homosyringaldehyde (formula (3)), 2 -(4-hydroxyphenyl) acetaldehyde dimethyl acetal (formula (4)), homovanillyl dimethyl acetal (formula (5)), homosyringaldehyde dimethyl acetal (formula (6)), 4- (2-methoxyvinyl ) Phenol (formula (7)), 2-methoxy-4- (2-methoxyvinyl) phenol (formula (8)), 2,6-dimethoxy-4- (2-methoxyvinyl) phenol (formula (9)) 4 -Hydroxyphenylacetaldehyde and the like.

  The polyhydric alcohol used in the present invention is a polyhydric alcohol having 4 or more hydroxyl groups, and specific examples include pentaerythritol or ditrimethylolpropane. Among them, ditrimethylolpropane having good solubility is preferable.

  The tetravalent linker is a structure derived from a polyhydric alcohol used in the present invention. For example, when the polyhydric alcohol is pentaerythritol, which is a tetravalent alcohol, it has the structure of the above formula [II], and when it is ditrimethylolpropane, which is a tetravalent alcohol, it has the structure of the above formula [III].

  The bisphenol compound of the present invention is obtained by a condensation reaction between a 4-hydroxyphenylacetaldehyde derivative and a polyhydric alcohol in the presence of a catalyst. The usage-amount of 4-hydroxyphenylacetaldehyde derivative is 0.25-5.0 mol normally with respect to 1 mol of polyhydric alcohol, Preferably it is 0.03-2.5 mol. When the amount of the 4-hydroxyphenylacetaldehyde derivative used is less than 0.03 mole relative to 1 mole of the compound represented by the polyhydric alcohol, the residual amount of the 4-hydroxyphenylacetaldehyde derivative increases and the heat resistance decreases. It is not preferable, and if it is more than 5.0 mol, there is a possibility of gelation, which is not preferable.

  Examples of the acid catalyst that can be used in the present invention include organic acid catalysts such as toluenesulfonic acid, xylenesulfonic acid, and oxalic acid, inorganic acid catalysts such as hydrochloric acid and sulfuric acid, phosphotungstic acid, silicotungstic acid, and phosphomolybdenum. Preferred examples include, but are not limited to, heteropolyacids such as acid, sodium phosphomolybdate, phosphotungstomolybdic acid, and phosphovanadomolybdic acid. Moreover, these catalysts may be used independently and may use multiple types together. The usage-amount of the catalyst to be used is 0.001-15 mol normally with respect to 1 mol of polyhydric alcohol, Preferably it is 0.002-10 mol.

  In the reaction for obtaining the bisphenol compound of the present invention, a solvent can be used as necessary. The solvent that can be used is not particularly limited as long as it does not have reactivity with the 4-hydroxyphenylacetaldehyde derivative, but alcohols and aprotic polar solvents are easy in that the compound represented by the polyhydric alcohol is easily dissolved. Aromatic hydrocarbons are preferably used as the solvent.

  Specific examples of the solvent that can be used include alcohols such as methanol, ethanol, and isopropyl alcohol, aprotic polar solvents such as dimethyl sulfone, dimethyl sulfoxide, tetrahydrofuran, dioxane, methyl ethyl ketone, and methyl isobutyl ketone, and toluene and xylene. Although aromatic hydrocarbon etc. are mentioned preferably, it is not limited to these. Only one solvent may be used, or two or more solvents may be mixed.

  Although the usage-amount in the case of using a solvent is not restrict | limited in particular, For example, 100-500 mass parts can be used with respect to 1 mol of compounds represented by general formula [I].

  The reaction temperature is usually from 10 to 150 ° C, preferably from 30 to 130 ° C, particularly preferably from 50 ° C to 120 ° C. The reaction time is usually 0.5 to 20 hours, but is not limited to this because the reactivity varies depending on the type of raw material compound.

  After completion of the reaction, the catalyst is quenched by a known method. When an acidic catalyst is used, it may be neutralized with a base or washed with water. Although it does not specifically limit as a basic compound, Metal carbonates, such as metal hydroxides, such as sodium hydroxide, potassium hydroxide, magnesium hydroxide, and calcium hydroxide, sodium carbonate, pentasodium tripolyphosphate, ammonia, potassium carbonate, etc. Preferred examples include phosphates such as sodium phosphate and sodium hydrogen phosphate, basic solids such as ion exchange resins and alumina. At this time, in order to uniformly disperse the base, it is preferable to gradually drop it as an aqueous solution.

  When the bisphenol compound of the present invention is taken out after completion of the reaction, unreacted substances, solvents and the like are removed from the reaction solution under heating and reduced pressure after washing the reaction product with water or without washing with water. In order to efficiently remove unreacted substances, water washing may be performed under steam distillation or basic conditions. When taking out with a crystal | crystallization, a crystal | crystallization is deposited by dripping a reaction liquid in a lot of water.

Next, the epoxy resin of this invention is demonstrated.
The epoxy resin of the present invention can be obtained by reacting the bisphenol compound of the present invention obtained by the above method with epihalohydrin in a solvent and epoxidizing it.

  Preferred examples of the epihalohydrin used in the reaction for obtaining the epoxy resin of the present invention include epichlorohydrin, α-methylepichlorohydrin, β-methylepichlorohydrin, epibromohydrin and the like, and epichlorohydrin which is easily available industrially is particularly preferable. The usage-amount of epihalohydrin is 2-100 mol normally with respect to 1 mol of hydroxyl groups of the bisphenol compound of this invention, Preferably it is 2-8 mol in consideration of economical efficiency. Usually, an epoxy resin is obtained by a reaction in which a bisphenol compound and an epihalohydrin are added in the presence of an alkali metal oxide and then the resulting 1,2-halohydrin ether group is opened to epoxidize.

  Preferred examples of the alkali metal hydroxide that can be used for the epoxidation reaction include sodium hydroxide and potassium hydroxide, and these may be used as they are, or an aqueous solution thereof may be used. When using an aqueous solution, the aqueous solution of the alkali metal hydroxide is continuously added to the reaction system and separated from a mixture of water and epihalohydrin distilled continuously under reduced pressure or normal pressure. Alternatively, water may be removed and only the epihalohydrin is continuously returned to the reaction system. The usage-amount of an alkali metal hydroxide is 0.9-3.0 mol normally with respect to 1 mol of hydroxyl groups, such as the bisphenol compound of this invention, Preferably it is 1.0-2.5 mol, More preferably Is 1.0 to 2.0 mol, particularly preferably 1.0 to 1.3 mol. In addition, in the epoxidation reaction, by using flaky sodium hydroxide in particular, the amount of halogen contained in the epoxy resin obtained can be significantly reduced as compared with using sodium hydroxide as an aqueous solution. Further, the flaky sodium hydroxide is preferably added in portions in the reaction system. By performing divided addition, it is possible to prevent a rapid decrease in the reaction temperature, thereby preventing the formation of 1,3-halohydrin and halomethylene as impurities.

  A catalyst can be used to accelerate the epoxidation reaction. Preferred examples of the catalyst that can be used include quaternary ammonium salts such as tetramethylammonium chloride, tetramethylammonium bromide, trimethylbenzylammonium chloride, and tetraethylammonium chloride. The amount of the quaternary ammonium salt used is usually 0.1 to 15 g, preferably 0.2 to 10 g, per 1 mol of the hydroxyl group of the phenol resin of the present invention.

  The reaction temperature is usually 30 to 90 ° C, preferably 35 to 80 ° C. The reaction time is usually 0.5 to 10 hours, preferably 1 to 8 hours. After completion of the reaction, the reaction product is washed with water or without washing with water, and the epihalohydrin, the solvent and the like are removed from the reaction solution under heating and reduced pressure. In order to further reduce the amount of halogen contained in the obtained epoxy resin, the recovered epoxy resin of the present invention is dissolved in a solvent such as toluene or methyl isobutyl ketone, and an alkali metal such as sodium hydroxide or potassium hydroxide. The reaction can be carried out by adding an aqueous solution of hydroxide to ensure ring closure. In this case, the usage-amount of an alkali metal hydroxide is 0.01-0.3 mol normally with respect to 1 mol of hydroxyl groups of the bisphenol compound of this invention, Preferably it is 0.05-0.2 mol. The reaction temperature is usually 50 to 120 ° C., and the reaction time is usually 0.5 to 2 hours.

  After completion of the reaction, the produced salt is removed by filtration, washing with water, and the like, and the solvent is distilled off under heating and reduced pressure to obtain the epoxy resin of the present invention. Moreover, when the epoxy resin of this invention precipitates as a crystal | crystallization, after melt | dissolving the salt produced | generated in a lot of water, you may collect the crystal | crystallization of the epoxy resin of this invention by filtration. The epoxy resin of the present invention thus obtained has a structure in which the hydroxyl group contained in the bisphenol compound of the present invention is glycidylated.

  The epoxy resin of this invention contains what is represented by the following general formula [IV].

（一般式［ＩＶ］中、Ｇはグリシジル基を表し、Ｒ_１、Ｒ_２、ａ、ｂ、ｃ及びＸは一般式［Ｉ］と同一である。）

(In the general formula [IV], G represents a glycidyl group, and R ₁ , R _2, a, b, c and X are the same as those in the general formula [I].)

  Hereinafter, the epoxy resin composition of the present invention will be described. The epoxy resin composition of the present invention contains at least one of the epoxy resin of the present invention and the bisphenol compound of the present invention as an essential component.

  In the epoxy resin composition of the present invention, the bisphenol compound of the present invention can be used in combination with one or more epoxy resins (the epoxy resin of the present invention and other epoxy resins). Moreover, the epoxy resin of this invention can be used in the epoxy resin composition of this invention individually or in combination with another epoxy resin.

  Specific examples of other epoxy resins used in the present invention include novolac type epoxy resins, bisphenol A type epoxy resins, biphenyl type epoxy resins, triphenylmethane type epoxy resins, phenol aralkyl type epoxy resins and the like. Specifically, bisphenol A, bisphenol S, thiodiphenol, fluorene bisphenol, terpene diphenol, 4,4′-biphenol, 2,2′-biphenol, 3,3 ′, 5,5′-tetramethyl- [ 1,1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol (Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetaldehyde Non, o-hydroxyacetophenone, dicyclopentadiene, furfural, 4,4′-bis (chloromethyl) -1,1′-biphenyl, 4,4′-bis (methoxymethyl) -1,1′-biphenyl, 1, Glycidyl ethers derived from polycondensates with 4-bis (chloromethyl) benzene, 1,4-bis (methoxymethyl) benzene and the like, modified products thereof, halogenated bisphenols such as tetrabromobisphenol A, and alcohols , Cycloaliphatic epoxy resin, glycidylamine epoxy resin, glycidyl ester epoxy resin, silsesquioxane epoxy resin (chain structure, cyclic structure, ladder structure, or a mixed structure of at least two of them) Has glycidyl group and / or epoxycyclohexane structure Solid or liquid epoxy resin having an epoxy resin) and the like although not limited thereto.

  The epoxy resin composition of the present invention can also contain a curing agent. One or a plurality of curing agents can be used. Examples of the curing agent that can be used include a phenol resin, a phenol compound, an amine compound, an acid anhydride compound, an amide compound, and a carboxylic acid compound. Specific examples of curing agents that can be used include phenol resins, phenol compounds; bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, terpene diphenol, 4,4'-biphenol, 2,2'-biphenol, 3,3 ', 5,5′-tetramethyl- [1,1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenols (phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, -Hydroxybenzaldehyde, p-hydroxyacetophenone, o-hydroxyacetophenone, dicyclopentadiene, furfural, 4,4'-bis (chloromethyl) -1,1'-biphenyl, 4,4'-bis (methoxymethyl) -1 , 1′-biphenyl, 1,4′-bis (chloromethyl) benzene, polycondensates with 1,4′-bis (methoxymethyl) benzene, and their modified products, and halogenated bisphenols such as tetrabromobisphenol A , Polyphenols such as condensates of terpenes and phenols, and bisphenol compounds of the present invention, but the present invention is not limited thereto. These may be used alone or in combination of two or more.

  Preferable phenol resins include phenol aralkyl resins (resins having an aromatic alkylene structure), particularly preferably a structure having at least one selected from phenol, naphthol, and cresol, and the alkylene portion serving as the linker is benzene. A resin characterized by at least one selected from a structure, a biphenyl structure, and a naphthalene structure (specific examples include zylock, naphthol zylock, phenol biphenylene novolak resin, cresol-biphenylene novolak resin, phenol-naphthalene novolak resin, etc.) Is.)

  Examples of amine compounds and amide compounds include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, and nitrogen-containing compounds such as polyamide resins synthesized from linolenic acid and ethylenediamine. It is done.

  Examples of acid anhydride compounds and carboxylic acid compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, and nadic anhydride Hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2,2,1] heptane- Acid anhydrides such as 2,3-dicarboxylic acid anhydride and cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride; addition of various alcohols, carbinol-modified silicone, and the above-mentioned acid anhydrides Examples thereof include carboxylic acid resins obtained by the reaction.

  Other examples include imidazole, trifluoroborane-amine complexes, guanidine derivative compounds, and the like.

  In the present invention, the curing agent is not limited to these. These may be used alone or in combination of two or more.

  In the epoxy resin composition of the present invention, the amount of the curing agent used is preferably 0.7 to 1.2 equivalents relative to 1 equivalent of the epoxy groups of all epoxy resins. When less than 0.7 equivalent or more than 1.2 equivalent with respect to 1 equivalent of epoxy group, curing may be incomplete and good cured properties may not be obtained.

  In the epoxy resin composition of the present invention, a curing accelerator may be used in combination with the curing agent. Specific examples of the curing accelerator include imidazoles such as 2-methylimidazole, 2-ethylimidazole and 2-ethyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, 1,8-diaza-bicyclo ( Tertiary amines such as 5,4,0) undecene-7, phosphines such as triphenylphosphine, quaternary compounds such as tetrabutylammonium salt, triisopropylmethylammonium salt, trimethyldecanylammonium salt, cetyltrimethylammonium salt Quaternary phosphonium salts such as ammonium salt, triphenylbenzyl phosphonium salt, triphenylethyl phosphonium salt, tetrabutyl phosphonium salt and the like (counter ions of quaternary salt are halogen, organic acid ion, Special designations such as hydroxide ions Bur, in particular an organic acid ion, a hydroxide ion.) Include metal compounds such as tin octylate. When using a hardening accelerator, 0.01-5.0 mass parts is preferable with respect to 100 mass parts of epoxy resins.

  The epoxy resin composition of the present invention may contain a phosphorus-containing compound as a flame retardant component. The phosphorus-containing compound may be a reactive type or an additive type. Specific examples of phosphorus-containing compounds include trimethyl phosphate, triethyl phosphate, tricresyl phosphate, trixylylenyl phosphate, cresyl diphenyl phosphate, cresyl-2,6-dixylylenyl phosphate, 1,3-phenylenebis ( Phosphoric acid esters such as dixylylenyl phosphate), 1,4-phenylenebis (dixylylenyl phosphate), 4,4′-biphenyl (dixylylenyl phosphate); 9,10-dihydro-9-oxa Phosphanes such as -10-phosphaphenanthrene-10-oxide, 10 (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide; epoxy resin and active hydrogen of the phosphanes A phosphorus-containing product obtained by reacting with Poxy compounds, red phosphorus and the like can be mentioned, and phosphoric esters, phosphanes or phosphorus-containing epoxy compounds are preferable, and 1,3-phenylenebis (dixylylenyl phosphate), 1,4-phenylenebis (dixylylene). Nyl phosphate), 4,4′-biphenyl (dixylylenyl phosphate) or phosphorus-containing epoxy compounds are particularly preferred. The content of the phosphorus-containing compound is preferably phosphorus-containing compound / total epoxy resin = 0.1 to 0.6 (mass ratio). If it is 0.1 or less, the flame retardancy is insufficient, and if it is 0.6 or more, there is a concern that it may adversely affect the hygroscopicity and dielectric properties of the cured product.

  Furthermore, you may add antioxidant to the epoxy resin composition of this invention as needed. Antioxidants that can be used include phenol-based, sulfur-based, and phosphorus-based antioxidants. Antioxidants can be used alone or in combination of two or more. The usage-amount of antioxidant is 0.008-1 mass part normally with respect to 100 mass parts with respect to the resin component in the curable resin composition of this invention, Preferably it is 0.01-0.5 mass part. It is.

Examples of the antioxidant include a phenol-based antioxidant, a sulfur-based antioxidant, and a phosphorus-based antioxidant.
Specific examples of phenolic antioxidants include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-β- (3 , 5-di-t-butyl-4-hydroxyphenyl) propionate, isooctyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, 2,4-bis- (n-octylthio)- Monophenols such as 6- (4-hydroxy-3,5-di-t-butylanilino) -1,3,5-triazine, 2,4-bis [(octylthio) methyl] -o-cresol; 2′-methylenebis (4-methyl-6-tert-butylphenol), 2,2′-methylenebis (4-ethyl-6-tert-butylphenol), 4,4′-thiobis (3-methyl) -6-tert-butylphenol), 4,4'-butylidenebis (3-methyl-6-tert-butylphenol), triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) Propionate], 1,6-hexanediol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], N, N′-hexamethylenebis (3,5-di-t- Butyl-4-hydroxy-hydrocinnamamide), 2,2-thio-diethylenebis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 3,5-di-t- Butyl-4-hydroxybenzyl phosphonate-diethyl ester, 3,9-bis [1,1-dimethyl-2- {β- (3-t-butyl-4-hydroxy-5-methyl Enyl) propionyloxy} ethyl] 2,4,8,10-tetraoxaspiro [5,5] undecane, bisphenols such as bis (3,5-di-t-butyl-4-hydroxybenzylsulfonate) calcium 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2,4,6-tris (3,5-di-t- Butyl-4-hydroxybenzyl) benzene, tetrakis- [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate] methane, bis [3,3′-bis- (4 '-Hydroxy-3'-t-butylphenyl) butyric acid] glycol ester, tris- (3,5-di-t-butyl-4-hydroxybenzyl) -isocyanurate, 1 , 3,5-tris (3 ′, 5′-di-t-butyl-4′-hydroxybenzyl) -S-triazine-2,4,6- (1H, 3H, 5H) trione, tocophenol, etc. Molecular type phenols are exemplified.

  Specific examples of the sulfur-based antioxidant include dilauryl-3,3′-thiodipropionate, dimyristyl-3,3′-thiodipropionate, distearyl-3,3′-thiodipropionate, and the like. .

  Specific examples of phosphorus antioxidants include triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris (nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris (2,4-di-t- Butylphenyl) phosphite, cyclic neopentanetetrayl bis (octadecyl) phosphite, cyclic neopentanetetraylbi (2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbi (2,4 -Di-t-butyl-4-methylphenyl) phosphite, bis [2-t-butyl-6-methyl-4- {2- (octadecyloxycarbonyl) ethyl} phenyl] hydrogen phosphite, etc. 9,10-dihydro 9-oxa-10-phosphaphenanthrene-10-oxide, 10- (3,5-di-tert-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10 -Oxaphosphaphenanthrene oxides such as 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide are exemplified.

  These antioxidants can be used alone, but two or more of them may be used in combination. In the present invention, a phosphorus-based antioxidant is particularly preferable.

  Furthermore, you may add a light stabilizer to the epoxy resin composition of this invention as needed. As the light stabilizer, hindered amine-based light stabilizers, particularly HALS and the like are suitable. HALS is not particularly limited, but representative examples include dibutylamine, 1,3,5-triazine, N, N′-bis (2,2,6,6-tetramethyl-4- Polycondensate of piperidyl-1,6-hexamethylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine, dimethyl-1- (2-hydroxyethyl) -4-hydroxy succinate -2,2,6,6-tetramethylpiperidine polycondensate, poly [{6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}], bis (1,2,2, 6,6-pentamethyl-4- Peridyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] butyl malonate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl) sebacate, 2- (3,5-di -T-butyl-4-hydroxybenzyl) -2-n-butylmalonate bis (1,2,2,6,6-pentamethyl-4-piperidyl), etc. Only one HALS is used. Two or more types may be used in combination.

  Furthermore, a binder resin can also be mix | blended with the epoxy resin composition of this invention as needed. Examples of the binder resin include butyral resins, acetal resins, acrylic resins, epoxy-nylon resins, NBR-phenol resins, epoxy-NBR resins, polyamide resins, polyimide resins, and silicone resins. However, it is not limited to these. The blending amount of the binder resin is preferably in a range that does not impair the flame retardancy and heat resistance of the cured product, and is usually 0.05 to 50 parts by mass, preferably 0.05 to 20 parts per 100 parts by mass of the resin component. A mass part is used as needed.

  If necessary, an inorganic filler can be added to the epoxy resin composition of the present invention. Examples of inorganic fillers include crystalline silica, fused silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, boron nitride, zirconia, fosterite, steatite, spinel, titania, talc, and the like. Preferred examples include, but are not limited to, beads made of spheroids. These may be used alone or in combination of two or more. As the content of these inorganic fillers, an amount occupying 0 to 95% by mass in the resin composition of the present invention is used. Furthermore, the resin composition of the present invention includes various compounding agents such as a silane coupling agent, a release agent such as stearic acid, palmitic acid, zinc stearate, and calcium stearate, a surfactant, a dye, a pigment, and an ultraviolet absorber. Various thermosetting resins can be added.

  The epoxy resin composition of this invention is obtained by mixing each component uniformly.

  The epoxy resin composition of the present invention can be easily made into a cured product by a method similar to a conventionally known method. For example, the bisphenol compound of the present invention, an epoxy resin, and if necessary, a curing agent, a curing accelerator, a phosphorus-containing compound, a binder resin, an inorganic filler, and a compounding agent are uniformly used using an extruder, a kneader, a roll, etc. Mix thoroughly until the resin composition is obtained, potting the resin composition, melting (without melting if liquid), molding using a casting or transfer molding machine, and further at 80-200 ° C. The cured product of the present invention can be obtained by heating for 2 to 10 hours.

  Moreover, the epoxy resin composition of the present invention is dissolved in a solvent such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone as necessary to obtain a curable resin composition varnish. A prepreg obtained by impregnating a base material such as glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber, paper, etc., and drying by heating is subjected to hot press molding to thereby provide the curable resin composition of the present invention. A cured product of A can be obtained. In this case, the solvent occupies 10 to 70% by mass, preferably 15 to 70% by mass in the mixture of the curable resin composition of the present invention and the solvent. Moreover, if it is a liquid composition, the epoxy resin hardened | cured material which contains a carbon fiber by the RTM system as it is can also be obtained as it is.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples. The following materials, processing details, processing procedures, and the like can be changed as appropriate without departing from the spirit of the present invention. In the synthesis examples, examples, and comparative examples, “part” means “part by mass”.
The epoxy equivalent was measured under the following conditions.
-Epoxy equivalent Measured by the method described in JIS K-7236, the unit is g / eq. It is.
・ DSC
Suggested scanning calorimeter: TA-instruments DSC Q-2000

Example 1
(Methoxymethyl) triphenylphosphonium chloride (8.44 g) was weighed into a flask purged with nitrogen, and THF (53 ml) was added. The reaction solution was cooled in an ice bath and potassium tert-butoxide (4.6 g) was added. After stirring for 10 minutes, syringaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd., 3.0 g) dissolved in THF was added dropwise. The reaction temperature was returned to room temperature, and after stirring for 30 minutes, an aqueous ammonium chloride solution was added. After the aqueous layer was extracted three times with ethyl acetate, the organic layer was washed with brine and dried over magnesium sulfate. After removing magnesium sulfate by filtration, the solvent was distilled off with an evaporator. The composition organism was purified by column chromatography (silica gel / hexane-ethyl acetate). In a flask equipped with a thermometer, stirrer, condenser and Dean-Stark apparatus, the product (2.8 g), ditrimethylolpropane (1.68 g) dissolved in methanol, p-toluenesulfonic acid (20 mg), toluene (75 ml) was charged, and the reaction was performed at 70 ° C. for 1.5 hours while bubbling nitrogen. Methanol produced during this time was distilled out of the system. After completion of the reaction, the temperature in the system was lowered to room temperature, and water was added. The aqueous layer was then extracted three times with ethyl acetate, and the combined organic layers were dehydrated with magnesium sulfate. Magnesium sulfate was removed by filtration, and the solvent was distilled off under reduced pressure to obtain a composition organism. The component organism was purified by column chromatography (silica gel / hexane-ethyl acetate) to obtain the desired bisphenol compound (2.7 g).

  A bisphenol compound (2.7 g), epichlorohydrin (70.2 g), and tetraethylammonium chloride (10 mg) obtained in Example 1 while purging nitrogen in a flask equipped with a stirrer, a reflux condenser, and a stirring device. , Water (175 mg) was added, and the temperature was raised to 90 ° C. Subsequently, 30% aqueous sodium hydroxide solution (1.32 g) was added, and the reaction was further performed at 60 ° C. for 30 minutes, 75 ° C. for 30 minutes, and 90 ° C. for 30 minutes. After completion of the reaction, washing was performed, and the solvent of the organic layer was distilled off. Methyl isobutyl ketone (50 ml) was added to the residue to dissolve it, and the temperature was raised to 75 ° C. A 30% aqueous sodium hydroxide solution (60 mg) was added with stirring, and the reaction was carried out for 2 hours. Thereafter, the organic layer was washed with water, and the epoxy resin (2.8 g) of the present invention was obtained by distilling off the solvent such as methyl isobutyl ketone from the obtained organic layer using a rotary evaporator. The epoxy equivalent of the obtained epoxy resin was 372 g / eq.

Examples 2-3
The same operation as in Example 1 was performed except that syringaldehyde was changed as shown in Table 1.

  The epoxy resin obtained in Examples 1 to 3 and a phenol novolak resin (H-1 manufactured by Meiwa Kasei Co., Ltd., hydroxyl group equivalent: 103 g / eq.) Were mixed at a ratio of 1: 1 and dissolved in methyl ethyl ketone. After adding 1 wt% of triphenylphosphine, the solvent was dried at 110 ° C. for 10 minutes, and the glass transition temperature of the cured product was measured with a suggested scanning calorimeter. The results are shown in Table 1.

注）
シリンガアルデヒド：東京化成工業(株)製
バニリン：関東化学(株)製鹿特級
４−ヒドロキシフェニルアセトアルデヒド：和光純薬工業(株)製特級

note)
Syringaldehyde: Tokyo Chemical Industry Co., Ltd. Vanillin: Kanto Chemical Co., Ltd. Deer Special Grade 4-Hydroxyphenylacetaldehyde: Wako Pure Chemical Industries, Ltd. Special Grade

  From the above, it has been shown that the bisphenol compound of the present invention is useful as a resin raw material, and the epoxy resin of the present invention is also cured by phenol novolac, so that it is clear that it is useful as a raw material for chemical industrial products. .

Claims (9)

Bisphenol compound represented by the general formula [I].

In general formula [I], R ₁ and R ₂ represent a methoxy group. a is the number of substitutions of R ₁ and R ₂ and is 0 to 3 (integer), and the number of substitutions of R ₁ and R ₂ may be different. b and c are the number of hydroxyl substitutions and are 1 to 3 (integer), and b and c may be different. X represents a tetravalent linker. The bisphenol compound according to claim 1, wherein, in the general formula [I], the hydroxy group is at the 4-position of the phenyl group, and R ₁ and R ₂ are at the 3,5-positions of the phenyl group. In general formula [I], X represents formula [II].

Or the formula [III]

The bisphenol compound of Claim 1 represented by these. The epoxy resin obtained by making epihalohydrin react with the bisphenol compound of Claims 1-3. An epoxy resin represented by the general formula [IV].

(In the general formula [IV], G represents a glycidyl group, and R ₁ , R _2, a, b, c and X are the same as those in the general formula [I].) The epoxy resin composition containing an epoxy resin and the bisphenol compound of Claims 1-3. Furthermore, the epoxy resin composition of Claim 6 containing a hardening | curing agent. The epoxy resin composition according to claim 6, wherein the epoxy resin is the epoxy resin according to claim 4. Hardened | cured material obtained by hardening | curing the epoxy resin composition of any one of Claims 6-8.