JP2016538522A - Thermostatic container system for use in a chiller - Google Patents

Abstract

In some embodiments, a thermostatic container for use in a refrigeration apparatus is a control vessel that includes one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container, an interior region. An adiabatic section that divides the interior area to form a storage area and a phase change material area within the container; an adiabatic section that includes a conduit between the storage area and the phase change material area; a thermal control device within the conduit; An opening in a portion of the thermal insulation that substantially defines the container, an opening between the phase change material region within the container and the outer surface of the container; and a unidirectional thermal conductor located in the opening, the phase change material It includes a unidirectional heat conductor configured to conduct heat in a direction from the region to the outer surface of the container.

Description

Detailed Description of the Invention

[Outline]
The subject matter of all priority applications is hereby incorporated by reference as long as it does not conflict with this document.

  A thermostatic container for use in a chiller is described herein. In some embodiments, the thermostat for use in a chiller is: one or more of insulation that substantially defines a thermostat container sized and shaped to fit within a storage area of the chiller. A portion, one or more portions of thermal insulation forming an opening on one side of the container and a storage area inside the container distal to the opening; and two or more walls substantially forming a tank, a phase inherent in the container A tank configured to hold change material, the insulation wall such that the first wall of the tank is adjacent to the opening on one side of the container and the second wall of the tank is adjacent to the storage area; One or more walls located within the one or more portions.

  In some embodiments, a thermostatic container for use in a chiller includes one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container, an interior region. A heat insulating partition that divides the inner region to form a storage region and a phase change material region within the container; a heat insulating partition that includes a conduit between the storage region and the phase change material region; a thermal control device in the conduit; An opening in a portion of the insulation material that substantially defines the container, an opening between the phase change material region within the container and the outer surface of the container, a unidirectional thermal conductor located within the opening, the phase change material region to the container A unidirectional heat conductor configured to conduct heat in a direction toward the outer surface of the container; and a heat generating unit including a radiating component adjacent to the outer surface of the container and configured to be located within the cooling device , Unidirectional thermal conductor and thermal Comprising a heat transfer component that is connected.

  In some embodiments, a thermostatic container for use in a cooling device is: a thermostatic container that includes one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container, an interior region. A heat insulating partition that divides the inner region to form a storage region and a phase change material region within the container; a heat insulating partition that includes a conduit between the storage region and the phase change material region; a thermal diode unit in the storage region; A thermal diode unit including heat transfer components located within the conduit; an opening in a portion of the thermal insulation material that substantially defines the container; an opening between the phase change material region within the container and the outer surface of the container; A unidirectional heat conductor located within, a unidirectional heat conductor configured to conduct heat in a direction from the phase change material region to the outer surface of the container; and adjacent to the outer surface of the container; They comprise a heating unit includes a configured radiation components, and unidirectional thermally conductive member thermally connected to and has heat transfer component to be positioned within.

  In some embodiments, the thermal diode unit configured for use in the cooling device is: at least one internal wall configured to be substantially vertical during use of the thermal diode unit; At least one outer wall sized and shaped to match one inner wall, the gap having a gap formed between the at least one inner wall and the at least one outer wall A mesh structure attached to the surface of at least one internal wall adjacent to the gap; at least one internal wall that forms a gas impermeable internal region of the thermal diode unit surrounding the gap; liquid in the gap; One or more sealing devices between one exterior wall; and gas impervious below atmospheric pressure It comprises a gas pressure parts region.

  In some embodiments, a thermostatic container for use in a chiller includes one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container, an interior region. An insulated partition that divides the interior region to form a storage region and a phase change material region within the container and includes a conduit between the storage region and the phase change material region; a thermal control device within the conduit; A first opening in the portion of the insulation substantially defining the container between the phase change material region and the outer surface of the container; so as to conduct heat in a direction from the phase change material region to the outer surface of the container A configured first unidirectional thermal conductor located within the first opening; between a storage area inside the container and the outer surface of the container, within a portion of the insulation substantially defining the container A second opening; and in the direction from the storage area to the outer surface of the container Configured to transfer heat Te, a second unidirectional thermally conductive body located within the second opening.

  In some embodiments, the temperature control extension to the chiller includes: a heat storage unit that includes a container sized and shaped to fit within the refrigerator freezer portion, a cross section of the cooling coil of the chiller A container including an opening having a larger edge dimension; sized to fit within a cooling portion of a cooling device including an upper edge configured to be located adjacent to an exhaust opening of the cooling device A thermal diode unit; and a control unit including a temperature sensor, a controller responsive to the temperature sensor, and a fan responsive to the controller.

  In some embodiments, the temperature control extension to the chiller includes: a thermostatic vessel that includes one or more portions of thermal insulation that substantially define one or more walls of the thermostatic vessel, at least a first A heat insulating partition that divides the interior region into a storage region and a second storage region, a first conduit attached to the first storage region, and a first conduit sized and shaped to be located in the cooling conduit. Both second conduits attached to two storage areas; fits in the first storage area of the thermostatic vessel, including a heat transfer component thermally connected to the upper edge of the first thermal diode unit A first thermal diode unit of a size and shape to be configured, a heat transfer component configured to be located in the first conduit of the thermostatic vessel; thermally connected to the upper edge of the second thermal diode unit Heat transfer A second thermal diode unit sized and shaped to fit within the second storage area of the container, including the part, a heat transfer component configured to be located within the second conduit of the thermostatic container A first control unit including a temperature sensor, a controller responsive to the temperature sensor, and a fan responsive to a controller attached to the first storage area of the thermostatic container; and a second including the temperature sensor A control unit responsive to the temperature sensor, and a fan responsive to the control device attached to the second storage area of the thermostatic container.

  In some embodiments, a method of forming a temperature control extension to a chiller includes: obtaining a measurement of an inner surface of the chiller; removing a thermostat from one or more walls formed from insulation. Forming and forming a thermostatic container including an outer surface configured to reversibly join with an inner surface of the cooling device and a heat sealed inner region; at least one storage region, and at least one phase change material region Attaching at least one insulating partition in the heat-sealed inner region so as to form heat; when a thermostatic container is installed in the cooling device, heat is directed from the heat-sealing inner region to the inner surface of the cooling device Installing at least one unidirectional thermal conductor through one or more walls; and sealing the phase change material within the phase change material region.

  The foregoing summary is merely exemplary and should not be construed as limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features may become apparent by reference to the drawings and the following detailed description.

[Detailed description]
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized and other changes may be made without departing from the spirit or scope of the invention specifics presented herein.

  An embodiment of a thermostatic container for use in a cooling device is described herein. The thermostat described in this document is specified for use in a cooling device. For example, in some embodiments, the thermostatic container is sized, shaped and configured for use in a home cooling room. For example, in some embodiments, the thermostatic container is sized, shaped and configured for use in a household cooling appliance. For example, in some embodiments, the thermostatic container is sized, shaped and configured for use in a commercial cooling room. For example, in some embodiments, the thermostatic container is sized, shaped and configured for use in a medical cooling room. The constant temperature container described herein is configured to provide continued temperature control to at least one storage area within the container while the constant temperature container is present in the cooling device. The constant temperature vessel described herein is designed to provide continued temperature control to at least one storage area within the vessel even when the cooling device is not operating (eg, during a power failure). In particular, it is anticipated that the thermostatic containers described herein may be useful in locations that have an intermittent or variable power supply to a cooling device. For example, in some embodiments, the thermostatic container is configured to maintain an internal storage area indefinitely within a predetermined temperature range while the cooling device has access to power with an average probability of about 10%. obtain. For example, in some embodiments, the thermostatic container is configured to maintain an internal storage area indefinitely within a predetermined temperature range while the cooling device has access to power with an average probability of about 5%. obtain. For example, in some embodiments, the thermostatic container is configured to maintain an internal storage area indefinitely within a predetermined temperature range while the cooling device has access to power with an average probability of about 1%. obtain. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 30 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 50 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 70 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 90 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 110 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 130 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 150 hours. For example, in some embodiments, the thermostatic container can be configured to maintain an internal storage area within a predetermined temperature range for at least 170 hours. Articles that are particularly sensitive to temperature fluctuations can be stored in the storage area of the thermostatic container in order to maintain the article for a long time within a predetermined temperature range even when the power supply to the cooling device is interrupted. For example, in some embodiments, a thermostatic container in a cooling device that is unable to obtain power has a temperature in the internal storage area of the thermostatic container when the ambient external temperature is between −10 ° C. and 43 ° C. Is configured to maintain for a long time. For example, in some embodiments, when the ambient external temperature is below −10 ° C., the thermostatic container in the cooling device that cannot obtain power maintains the temperature of the internal storage area of the thermostatic container for a long time. Configured to do.

  As used herein, “cooling device” refers to an electric device having an internal storage area that is configured to temporarily store material at a temperature below ambient temperature. In general, the cooling device includes a cooling coil and an electrically operated compressor device. In some embodiments, the cooling device is powered from a local autonomous power source. In some embodiments, the cooling device is powered by a solar power generation device. In some embodiments, the thermostatic container is designed for use with a cooling device that is a cooling chamber. The cooling room is generally powered from the city power system. The cooling chamber is generally calibrated to hold articles stored therein in a predetermined temperature range below ambient temperature and above zero. For example, the cooling chamber can be designed to maintain the internal temperature between 1 ° C and 4 ° C. In some embodiments, the thermostatic container is designed for use with a cooling device that is a standard freezer. The freezer is generally powered by the city power system. Freezers are generally calibrated to hold items stored therein in a temperature range below zero and above cryogenic temperatures. The freezer may be designed to maintain an internal temperature of, for example, -23 ° C to -17 ° C, and may be designed to maintain an internal temperature of, for example, -18 ° C to -15 ° C. In some embodiments, the thermostatic container is designed for use with a cooling device that includes both a cooling chamber and a freezing chamber. For example, some cooling devices include a first internal region that operates in the temperature range of the cooling chamber and a second internal region that operates in the temperature range of the freezer.

  In some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range. As used herein, “predetermined temperature range” refers to a range of predetermined temperatures that are desirable in use for the inner storage area of a particular embodiment of the thermostatic container. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range of about 2 ° C to 8 ° C. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range of about 1 ° C to 9 ° C. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range of about −15 ° C. to −25 ° C. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range of about −5 ° C. to −10 ° C. The predetermined temperature range is a stable temperature range in that the inner storage area of the thermostatic container maintains the internal temperature during use of the container.

  For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range for at least 50 hours when power is not available to the cooling device. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range for at least 100 hours when power is not available to the cooling device. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range for at least 150 hours when power is not available to the cooling device. For example, in some embodiments, the thermostatic container is configured to maintain the inner storage area of the thermostatic container within a predetermined temperature range for at least 200 hours when power is not available to the cooling device. In some embodiments, the thermostatic vessel is configured to passively maintain the inner storage area within a predetermined temperature range for an extended period of time when power is not available to the cooling device. In some embodiments, the thermostat vessel maintains an inner storage area within a predetermined temperature range for an extended period of time when power is not available to the cooling device and power is not available to the thermostat vessel. Configured. In some embodiments, the thermostatic container maintains an inner storage area within a predetermined temperature range for an extended period of time when power is not available to the cooling device and minimum power is available to the thermostatic container. Configured to do. For example, in some embodiments, the thermostatic container includes a small battery.

  In some embodiments, the thermostatic container can be easily removed from the inside of the cooling device, and the temperature control of the inner storage area of the thermostatic vessel continues for a period of time outside the cooling device. For example, in some embodiments, the thermostatic container is configured to be moved from the inside of one cooling device to the inside of another cooling device. For example, in some embodiments, the thermostatic container is temporarily removed from the inside of one cooling device and temporarily placed at ambient room temperature while the inner storage area of the thermostatic container is within a predetermined temperature range. Configured to maintain. For example, in some embodiments, the thermostatic vessel may be removed from the cooling device for cleaning or inspection of the cooling device, and the inner storage area of the thermostatic vessel is within a predetermined temperature range while outside the cooling device. Maintained.

  In some embodiments, the thermostatic vessel is not configured for direct removal from the cooling device that is incorporated into a particular model of the cooling device and does not separate the thermostatic vessel from the inside of the cooling device. For example, in some embodiments, the thermostatic container is incorporated into the internal conduit of the cooling device. For example, in some embodiments, the thermostatic vessel is configured to be partially located within a vent duct within the cooling device. For example, in some embodiments, the thermostatic container includes a region surrounding one or more cooling coils of the cooling device. For example, in some embodiments, the thermostatic vessel includes an electrical circuit configured to attach to the electrical system of the cooling device, for example, one or more wires.

  Illustrated with reference to FIG. 1 is an example of a thermostatic container in a cooling device, which may be the background for introducing one or more processes and / or devices described herein. FIG. 1 depicts a cooling device 100 that includes a single cooling region within the cooling device. A single door substantially opens a single cooling area of the cooling device for users outside the device. For illustrative purposes, the door is not shown in FIG. The cooling device 100 includes a number of walls 130 that can be fabricated to include one or more insulations, such as plastic foam insulation. The cooling device 100 includes a set of cooling coils 120. For example, the cooling coil 120 may be an evaporator cooling coil attached to a compressor and condenser coil attached to the rear of the cooling device 100.

  FIG. 1 depicts a thermostatic container 110 in the internal storage area of the cooling device 100. The thermostatic container 110 includes a door 140 having a handle 145 configured to provide access to one or more storage areas within the thermostatic container 110. Since the thermostatic container 110 shown in FIG. 1 is not drawn as being attached to the inside of the cooling device 100, it can be easily removed from the inside of the cooling device 100 by the user.

  The thermostat in FIG. 1 and subsequently depicted is shown using some space around the thermostat for illustrative purposes, but the thermostat is flush with the inner wall of the cooling device. It is generally expected that it can be done. For example, in some embodiments, a thermostatic vessel is a specific model of a cooling device, with the surface on the corresponding outer side of the thermostatic vessel and the corresponding inner side of the cooling device configured to reversibly join together. Can be made to fit clearly inside. In some embodiments, the thermostatic container may be compatible with additional materials to minimize and space between the outside of the thermostatic container and the inside of the cooling device. For example, in some embodiments, the soft foam material can be inserted around the outside of the thermostatic container so that the spacing between the container and the cooling device is filled by the soft foam material. For example, in some embodiments, the thermostatic container can be placed in a cooling device and a foam blow can be placed around the container in the cooling device.

  FIG. 2 illustrates aspects of an embodiment of a thermostatic container 110 within the cooling device 100. The cooling device 100 includes a wall 130 and a set of cooling coils 120. The embodiment of the thermostatic container 110 shown in FIG. 2 is drawn substantially to show its internal structure in a cross-sectional view. An embodiment of the thermostatic container 110 is provided on one side of the thermostatic container 110, one or more portions of the insulation 200 that substantially define the thermostatic container 110 sized and shaped to fit within the storage area of the cooling device 100. It includes one or more portions of thermal insulation 200 that form an opening 250 and a storage region 230 inside the thermostatic container 110 distal to the opening 250. The illustrated embodiment has two walls 210, 240 that substantially form the tank 220, a tank configured to hold phase change material within the thermostat 110, and the tank first wall 210 is isothermal. Two walls 210 located within one or more portions of the insulation 200, such that the second wall 240 of the tank is located adjacent to the storage area 230, adjacent to the opening 250 on one side of the container 110; 240 is included as well. FIG. 2 similarly depicts openings 217 in the first wall 210 of the tank and openings configured to join the removal cover 215. The embodiment shown in FIG. 2 minimizes thermal energy transfer between the opening 205 in the lower surface of the thermostatic container 110, the storage area 230, and the area outside the container, while condensation causes the storage area 230 to dew. The opening 205 is sized and shaped to allow the user to move away from it.

  In some embodiments, the thermostatic container 110 as shown in FIG. 2 is sized and shaped to fit within a refrigerated storage area of a home cooling device. For example, the cooling device 100 may be a household cooling device. In some embodiments, the thermostatic container includes an opening on one side of the container, wherein the opening on one side of the container is adjacent to the cooling unit when the thermostatic container is in the storage area of the cooling device. Installed. For example, the embodiment shown in FIG. 2 includes an opening 250 located adjacent to the cooling coil 120 of the cooling device. In some embodiments, the thermostatic container has an opening on one side of the container, wherein the opening on one side of the container is installed at the upper edge of the thermostatic container when the thermostatic container is positioned for use. Is done. For example, FIG. 2 depicts a container 110 that includes a constant temperature container 110 for use in the cooling device 100, an opening 250 located at the upper edge of the constant temperature container 100. In some embodiments, the thermostatic container includes an opening on one side of the container, wherein the opening on one side of the container substantially includes one side of the thermostatic container. For example, the embodiment of the isothermal container 110 shown in FIG. 2 includes an opening 250 that substantially encompasses the upper side of the container, such that the majority of the upper surface of the container is the opening 250, and is adjacent to the opening 250. The first wall 210 of the tank is exposed.

The thermostatic container includes one or more portions of thermal insulation. In some embodiments, one or more portions of the thermal insulation include one or more portions of vacuum insulation. In some embodiments, one or more portions of the thermal insulation include one or more portions of the airgel. In some embodiments, one or more portions of the thermal insulation include thermal insulation having an R-value of at least 7 ft ² · ° F · h / Btu. In some embodiments, one or more portions of the thermal insulation include thermal insulation having an R-value of at least 7 ft ² · ° F · h / Btu. In some embodiments, one or more portions of the thermal insulation include thermal insulation having an R-value of at least 10 ft ² · ° F · h / Btu. In some embodiments, one or more portions of the thermal insulation include an access opening adjacent to a storage area inside the container; a door configured to substantially join the access opening. For example, FIGS. 1, 6, 8, 15, 17, 22, 30, 32 and 33 include at least one door configured to allow access to an adjacent storage area inside the container. 1 depicts an embodiment of a thermostatic container. The door in the thermostatic container may include at least one thermal insulator.

  In some embodiments, the thermostatic container includes an opening in the lower surface of the container, the opening configured to allow condensed liquid to flow from the inside of the container. For example, FIGS. 2, 3, 4, 5, 7, 9, 10, 11, 12, 16, 18, 20, 21, 23, 24, 25, 26, 27 and 31 show that the condensed liquid is Figure 8 depicts an embodiment of a thermostatic container that includes at least one opening 205 configured to allow flow from the inside. For example, the water can condense inside the storage area of the thermostatic container, and the opening in the lower surface of the container can be positioned to allow the condensed water to flow out of the thermostatic container. The opening configured to allow the condensed liquid to flow from the inside of the container may be installed, for example, with one end at the bottom inside the container and one end at the outside of the container. The opening can be configured to allow minimal heat to flow into the interior of the container, for example, the opening can be formed as a capillary structure. The opening can be configured to allow minimal heat to flow into the interior of the container, for example, the opening can be formed as an elongated tube structure.

  The thermostatic container includes at least one storage area inside the container. In some embodiments, at least one storage area inside the container is placed adjacent to the bottom of the thermostatic container when the thermostatic container is positioned for use. For example, the storage area 230 of the thermostatic container 110 depicted in FIG. 2 is such that the lower surface of the storage area 230 is adjacent to the bottom wall of the container 110 and the upper surface of the storage area 230 is adjacent to the second wall 240 of the tank. It is located at the bottom of the container 110 in a state where it is installed in the container 110. In some embodiments, the thermostatic container includes a tank located above the storage area when the container is positioned for use.

  In some embodiments, at least one storage area inside the container is configured to store material at a temperature substantially between 2 ° C and 8 ° C. For example, in some embodiments, the isothermal container is substantially 2 ° C. while the isothermal container is located within the electric chiller and also when the chiller has no power for a period of less than 100 hours. Designed to maintain a storage area inside the container at a temperature of ~ 8 ° C. In some embodiments, at least one storage area inside the container is configured to store material at a temperature substantially between about 1 ° C. and 9 ° C. In some embodiments, at least one storage area inside the container is configured to store the substance at a temperature substantially between -15C and -25C. In some embodiments, at least one storage area inside the container is configured to store the material at a temperature substantially between about −5 ° C. and −10 ° C. In some embodiments, at least one storage area inside the container is configured to store a pharmaceutical product. For example, the thermostatic container may include at least one storage area configured to store vaccine vials at a temperature substantially between 2 ° C. and 8 ° C., for example, having a suitably sized shelf or divider. In some embodiments, for example, the thermostatic container may include at least one storage area configured to store pharmaceuticals such as antibiotics, antibody therapies, vaccines, chemotherapeutic agents, or antiviral agents. In some embodiments, for example, the thermostatic container may include at least one storage area configured to store medical samples, such as blood, urine, fecal samples, sputum samples, and derivatives thereof.

  In some embodiments, at least one storage area inside the container is sized to include a storage area having a 50 liter (L) capacity. In some embodiments, the at least one storage area inside the container is sized to include a storage area having a capacity of 100 liters (L). In some embodiments, the at least one storage area inside the container is sized to include a storage area having a 150 liter (L) capacity. In some embodiments, at least one storage area inside the container is sized to include a storage area having a 200 liter (L) capacity.

  In some embodiments, the thermostatic container has two or more walls that substantially form a tank, a tank configured to hold phase change material within the container, and the first wall of the tank is on one side of the container. Two or more walls located within one or more portions of the insulation so that the second wall of the tank is located adjacent to the storage area. For example, FIG. 2 shows two walls 210, 240 that substantially form the tank 220, a tank configured to hold the phase change material inside the thermostat 110, the first wall 210 of the tank being the thermostat 110. Two walls 210, 240 located in one or more parts of the insulation 200, so that the second wall 240 of the tank is located adjacent to the storage area 230, adjacent to the opening 250 on one side of the Figure 3 depicts an embodiment of a thermostatic container containing. In some embodiments, the two or more walls that substantially form the tank are fabricated from a thermally conductive material. In some embodiments, the two or more walls that substantially form the tank are fabricated from a material having a thermal conductivity value of at least 50 W / [m · K]. In some embodiments, the two or more walls that substantially form the tank are fabricated from a material having a thermal conductivity value of at least 100 W / [m · K]. In some embodiments, the two or more walls that substantially form the tank are fabricated from a material having a thermal conductivity value of at least 150 W / [m · K]. In some embodiments, the two or more walls that substantially form the tank are fabricated from a material having a thermal conductivity value of at least 200 W / [m · K]. In some embodiments, the two or more walls that substantially form the tank are made from an aluminum material.

  In some embodiments, the thermostatic container is adjacent to two or more walls that substantially form the tank, a tank configured to hold phase change material within the container, an opening on one side of the container. In one or more portions of the insulation, further including an opening in which the first wall of the tank is located adjacent to the opening on one side of the container and the second wall of the tank is located adjacent to the storage area. Two or more walls located at; and a reversible sealing device at the opening. For example, the embodiment shown in FIG. 2 includes an opening 210 in the tank first wall 210, an opening configured to interface with the removal cover 215.

  In some embodiments, the thermostatic container includes two or more walls that substantially form a tank, a tank that is formed to hold phase change material within the container, wherein the tank is substantially formed. Two or more walls are waterproof. For example, some embodiments of a thermostatic container include a tank configured to hold a phase change material that is completely liquid, or some temperature range that is expected to be used. In some embodiments, the thermostatic container includes two or more walls that substantially form a tank, a tank that is formed to hold phase change material within the container, wherein the tank is substantially formed. Two or more walls that do are airtight. For example, some embodiments of the thermostatic container include a tank configured to hold a phase change material that is completely gaseous, or some temperature range that is expected to be used. In some embodiments, the thermostatic container includes two or more walls that substantially form a tank, a tank that is formed to hold phase change material within the container, wherein the tank is substantially formed. The two or more walls that do so are impermeable to solids or semi-solids. For example, some embodiments of the isothermal container include a tank configured to hold a phase change material that is completely solid or semi-solid, or some temperature range that is expected to be used. In some embodiments, for example, the tank includes an internal volume of 20L. In some embodiments, for example, the tank includes an internal volume of 30L.

  In some embodiments, the thermostatic container includes at least one phase change material. As used herein, a “phase change material” is a substance with high latent heat that can store and release thermal energy while the physical phase is changing. The selection of the phase change material for the embodiment includes the latent heat for the substance, the melting point for the substance, the boiling point for the substance, and the substance required to store the amount of thermal energy in the embodiment. Depends on considerations including quantity, substance toxicity, substance cost, and substance flammability. Depending on the embodiment, the phase change material can be solid, liquid, semi-solid or gas in use. For example, in some embodiments, the phase change material comprises water, methanol, ethanol, sodium polyacrylate / polysaccharide material, or salt hydrate. In some embodiments, for example, it is preferred that the phase change material includes a majority of the volume as pure water / ice due to the physical properties of pure water / ice having a melting point of 0 ° C. In some embodiments, for example, the phase change material can be calibrated for a majority of the volume because the melting point of the salt ice can be calibrated below 0 ° C. based on the salt molarity and content in the salt water / salt ice. Is preferred as salt water / salt ice. In some embodiments, for example, the phase change material is configured to freeze below −20 ° C. In some embodiments, for example, the phase change material is configured to freeze at a time between 1 ° C and 3 ° C.

  FIG. 3 shows aspects of an embodiment of the thermostatic container 110 for use in the cooling device 100. The embodiment of the thermostatic container 110 shown in FIG. 3 is depicted substantially to show its internal structure in a cross-sectional view. The cooling device 100 includes a number of walls 130 and at least one set of cooling coils 120. For illustrative purposes, the refrigerator door is not shown. The cooling device 100 shown in FIG. 3 includes a single internal storage area. The thermostatic container 110 includes one or more portions of the heat insulating material 200 that substantially define the area of the thermostatic container. One or more portions of the heat insulating material 200 include an opening 250 on one side of the constant temperature container 110 and an opening 250 on the surface of the constant temperature container 100 adjacent to the cooling coil 120. The thermostatic container 110 includes a storage region 230 inside the thermostatic container 110 distal to the opening 250. The opening 205 is configured to allow liquid to flow from the inside of the storage area 230 to a point outside the container with minimal heat transfer to the storage area 230 and is located at the lower surface of the thermostatic container 110.

  The embodiment shown in FIG. 3 includes two walls 210, 240 that substantially form the tank 220, a tank configured to hold phase change material within the thermostat 110, the first of the tank 220. 2 located in one or more portions of the insulation 200 such that the wall 210 is adjacent to the opening 250 on one side of the thermostat 110 and the second wall 240 of the tank is adjacent to the storage area 230. Two walls 210, 240 are included as well. In the embodiment shown in FIG. 3, the first wall 210 of the tank 220 includes a heat transfer component 300. The heat transfer component 300 is configured and installed to facilitate heat transfer from the first wall 210 to the inner region of the cooling device 100. In the embodiment shown in FIG. 3, for example, the first wall 210 of the tank 220 includes a heat transfer component 300 that is a set of fins. The fins are made from a thermally conductive material and are attached to the first wall 210 of the tank 220. For example, the fins can be made from aluminum or copper materials. In some embodiments, the cooling device includes a fan and the heat transfer component is located adjacent to the fan. Increasing the surface area of the heat transfer component increases the possibility for transfer from the heat transfer component.

  FIG. 4 illustrates aspects of the thermal properties of an embodiment of the thermostatic container 110 in use. The embodiment of the thermostatic container 110 shown in FIG. 4 is substantially drawn to show its internal structure in a cross-sectional view. The constant temperature container 110 exists in the internal region of the cooling device 100. The cooling device 100 is made from a wall 130 that surrounds the thermostatic container 110 during use. The thermostatic container 110 includes a large number of portions of a wall and a heat insulating material 200 that substantially form a wall around the container side surface and the bottom. The portion of the heat insulating material 200 that substantially forms the thermostatic container 110 includes an opening 250 corresponding to the upper surface of the thermostatic container 110. The above portion of insulation 200 includes an opening 205 at the bottom of the container that is configured to allow liquid to flow downward while minimizing heat transfer to the container.

  The constant temperature vessel 110 shown in FIG. 4 has two walls 210 and 240 that substantially form the tank 220, a tank configured to hold the phase change material inside the constant temperature vessel 110, the first of the tank 220. One or more of the thermal insulators 200 such that the wall 210 of the tank 220 is adjacent to the opening 250 on one side of the thermostatic container 110 and the second wall 240 of the tank 220 is adjacent to the storage area 230 inside the thermostatic container 110. Two walls 210, 240 located in the portion of Tank 220 contains phase change material. The heat transfer component 300, which is a set of fins, is attached to the first wall 210 of the tank 220 at a position adjacent to the cooling coil 120 of the cooling device 100.

  During the time that the cooling coil 120 of the cooling device is operating, thermal energy or heat can rise through the thermostat 110 and is removed from the cooling device 100 through the operation of a guide mechanism that includes the cooling coil 120 of the cooling device 100. obtain. The thermal energy is continuous along the temperature of the cooling coil of the cooling device and the ambient temperature outside the cooling device, along the temperature gradient between the storage region and the phase change material region, consistent with the characteristics of heat transfer and pointing upwards This is depicted in FIG. 4 as a dotted arrow. Thermal energy travels through the isothermal vessel 110, including the storage area 230, the tank 220, and through the first through the first wall 210 of the tank 220 that matches the thermal gradient present at any given time in these structures. Can do. Heat transfer from the first wall 210 to the area in contact with the cooling device 100 is enhanced through a set of fins attached to the first wall 210. Over time, the removal of thermal energy or heat from the thermostat 110 can result in cooling of the phase change material in the storage area 230 and tank 220 as well as the associated structure of the thermostat 110. This cooling can be limited by the amount of thermal energy removed from the constant temperature vessel 110 by actuation of the cooling coil 120 of the cooling device 100. In a standard cooling chamber, for example, the cooling coil may be operable to cool the inside of the cooling chamber to a temperature between 1 ° C and 4 ° C. Similarly, the structure of the thermostatic container 110 can be cooled to a temperature of 1 ° C. to 4 ° C. with time in the cooling chamber. For example, at a time after the cooling chamber has stopped operating due to power supply stoppage, the storage region 230 in the thermostatic container 110 has a predetermined temperature of 1 ° C. to 4 ° C. for a longer period than the internal region in the cooling chamber. It can maintain its inside in range. For example, the heat insulating material 200 of the thermostatic container 110 may assist in reducing heat leakage between the outer area of the thermostatic container 110 and the storage area 230 inside the thermostatic container 110. In addition, thermal energy, or heat, can naturally move from the storage area 230 to the tank 220 holding the phase change material along a thermal gradient caused during operation of the cooling device. Due to its inherent physical properties, the phase change material is in a temperature range appropriate for a particular embodiment so as to maintain the temperature in the storage region 230 of the thermostatic container 110 within a predetermined temperature range. It can absorb thermal energy or heat.

  FIG. 5 depicts aspects of an embodiment of the thermostatic container 110. The embodiment of the thermostatic container 110 shown in FIG. 5 is drawn substantially to show its internal structure in a cross-sectional view. FIG. 5 depicts a thermostatic container 110 in the cooling device 100. The cooling device 100 includes a wall 130 (for illustrative purposes, a door is not shown). Inside the cooling device 100 is a thermostatic container 110. The thermostatic container 110 includes a heat insulating material 200 that forms the basic structure of the container wall and bottom. The thermostatic container 110 includes an opening 250 on the upper surface of the thermostatic container 110 and an opening 250 substantially corresponding to the upper surface of the thermostatic container 110. The thermostatic container 110 is installed in the cooling device 100 so that the opening 250 is positioned adjacent to the cooling coil 120 of the cooling device 100. The constant temperature vessel 110 is configured to allow condensed liquid to flow away from the storage region 230 while minimizing heat leakage to the narrow opening 205 at the bottom of the constant temperature vessel 110, the storage region 230. The opening 250 is included.

  As shown in FIG. 5, the thermostatic container 110 includes two walls 210 and 240 that substantially form the tank 220, the tank 220 configured to hold phase change material within the thermostatic container 110, the tank One or more of the insulations 200 such that the first wall 210 of 220 is adjacent to the opening 250 on one side of the thermostatic vessel 110 and the second wall 240 of the tank 220 is located on the opposite side of the tank 220. It includes two walls 210, 240 located within the part. Tank 220 contains phase change material. A heat transfer component 300 including a set of fins is attached to the first wall 210 of the tank 220 at a location adjacent to the cooling coil 120 of the cooling device 100.

  In some embodiments, the thermostat 110 includes a phase change material compartment configured to contain a second phase change material. The phase change material compartment is located adjacent and thermally connected to a tank or container holding a first phase change material. For example, the constant temperature vessel 110 shown in FIG. 5 further includes a phase change material compartment 500 configured to hold a second phase change material. The phase change material section 500 is located adjacent to the surface of the second wall 240 of the tank 220 and is located between the surface of the second wall 240 and the storage area 230. Phase change material section 500 includes a second phase change material that has different thermal properties than the phase change material in tank 220. The combination of installation and selection of the second phase change material in phase change material compartment 500 and phase change material in tank 220 is more effective than a single compartment holding a single phase change material. Absorbs thermal energy or heat from the storage area 230. Some embodiments include a tank 220 containing a first phase change material having a freezing point below 0 ° C and a phase holding a second phase change material having a freezing point above 0 ° C. A change material compartment 500 is included. For example, in some embodiments, the tank includes a first phase change material that is water / ice, and the phase change material compartment has a freezing point above 0 ° C. A second phase change material that is a substance is included.

  FIG. 6 shows an embodiment of the thermostatic container 110 in the cooling device 100. The cooling device 100 includes a wall 130 that surrounds the thermostatic container 110. For illustrative purposes, the cooling device 100 is shown without a door. The thermostatic container 110 includes a heat transfer component 300 that is a set of fins mounted on the upper part of the container at a position adjacent to the cooling coil 120 of the cooling device 100. The thermostatic container 110 includes two doors, 140A and 140B, each opening to a storage area within the container. For example, each door can include thermal insulation. For example, each door may be sized and shaped to allow access while minimizing thermal energy transfer between the area outside the container and the storage area accessed by the door. Each door can be configured, for example, to minimize thermal energy transfer between an area outside the container and a storage area accessed by the door. For example, each door may fit snugly with the surrounding area of the container and may be surrounded by a gasket or similar structure. Each door 140A, 140B has a handle 145A, 145B to provide easy access for the container user. Each door 140A, 140B may include visual IDs 600A, 600B, such as letters. For example, a door configured to allow access to the interior area of the size, temperature and storage conditions configured for a vaccine or therapeutic agent may be labeled “medicine”. For example, a door configured to allow access to an inner area of a size, temperature and storage state configured to store a medical sample, such as blood, saliva, urine, feces or tissue, Labeled “Sample”.

  FIG. 7 shows an embodiment of a thermostatic container containing multiple storage areas within the container, each storage area having an associated tank containing phase change material. Associated tanks can include different phase change materials and can be configured to provide different predetermined temperature ranges to each associated storage area. The constant temperature container 110 shown in FIG. 7 exists in the cooling device 100 having the wall 130 of the cooling device 100 surrounding the constant temperature container 110. The embodiment of the thermostatic container 110 shown in FIG. 7 is substantially drawn to show its internal structure in a cross-sectional view. An embodiment of the thermostatic container 110 may be provided on one side of the thermostatic container 110, one or more portions of the insulation 200 that substantially define the thermostatic container 110 sized and shaped to fit within the storage area of the cooling device 100. It includes one or more portions of thermal insulation 200 that form an opening 250. The partition 700 further separates the area inside one or more portions of the insulation into two internal areas. One or more portions of the insulation 200 and the partition 700 coupled to the walls 240A, 240B substantially define two storage areas 230A, 230B inside the thermostatic container 110 distal to the opening 250. The illustrated embodiment similarly includes two first walls 210A, 210B and two second walls 240A, 240B. The combination of one or more portions of the insulation 200 and the partition 700, as well as the combination of the two first walls 210A, 210B, and the two second walls 240A, 240B substantially divide the two tanks 220A, 220B. Form. Each tank is configured to hold the phase change material inside the thermostatic container 110. The heat transfer component 300, which is a set of fins, is attached to the upper surfaces of the first walls 210A and 210B of the tanks 220A and 220B.

  In some embodiments, the thermostatic container includes a number of separate internal storage areas. Some embodiments of the thermostatic container include, for example, two separate storage areas. Some embodiments of the thermostatic container include, for example, three separate storage areas. Some embodiments of the thermostatic container include, for example, four separate storage areas. Each internal storage area is different from the others, using insulation, configuration and associated structures to maintain an internal temperature within a different predetermined temperature range for each separate internal storage area Can be made as For example, the thermostatic container is configured to maintain one inside a predetermined temperature range of 2 ° C. to 8 ° C., and to maintain an inside of a predetermined temperature range of −15 ° C. to −25 ° C. May include two inner storage areas, which is another For example, the thermostatic container is configured to maintain a predetermined temperature range of −5 ° C. to −15 ° C., a first storage area configured to maintain an inside of a predetermined temperature range of 2 ° C. to 8 ° C. Three inner storage areas that are configured to maintain an interior of a second storage area configured and a predetermined temperature range of −15 ° C. to −25 ° C.

  Some embodiments include a storage area configured by a freezing point range of water or a predetermined temperature range below 0 ° C. Embodiments that include a storage area that is configured by a predetermined temperature range in the freezing point range of water can be configured for the freezing point of the ice pack. For example, some embodiments include a storage area of a suitable size, shape and predetermined temperature range for freezing WHO standard ice packs expected for medical applications. For example, some embodiments provide a storage area of an appropriate size, shape and predetermined temperature range for freezing ice blocks, ice trays or ice cubes that can be removed for use outside the thermostatic container. Contains. For example, ice blocks or ice cubes can be removed for medical use.

  The embodiment shown in FIG. 7 includes two storage areas 230A, 230B inside the thermostatic container 110, each two storage areas 230A, 230B being located adjacent to the bottom of the container. The storage areas 230A and 230B are physically and thermally separated in the container by the partition 700. For example, the partition 700 may substantially include a planar portion of insulation that has at least three edges bonded to the inner surface of one or more portions of the insulation 200, and heat seals inside the thermostatic container 110. Is produced. Each storage area 230A, 230B is coupled at the top surface by second walls 240A, 240B of adjacent tanks 220A, 220B. Each storage area 230A, 230B has an associated tank 220A, 220B located directly above the storage area 230A, 230B. In some embodiments, each tank 220A, 220B may include a different phase change material and consequently different thermal properties than the adjacent storage areas 230A, 230B. In some embodiments, each tank 220A, 220B may include the same phase change material and consequently the same thermal properties as adjacent storage areas 230A, 230B. The embodiment shown in FIG. 7 includes two openings 205A, 205B in the lower surface of the thermostatic container 110, while minimizing thermal energy transfer between the storage areas 230A, 230B and the area outside the container. Each of the two openings 205A, 205B is sized and shaped to allow condensation to leave the adjacent storage areas 230A, 230B by gravity.

  FIG. 8 depicts an embodiment of the thermostatic container 110 in the cooling device 100. The cooling device 100 includes a wall 130 that surrounds the thermostatic container 110. For illustrative purposes, the cooling device 100 is shown without a door. The thermostatic container 110 includes a heat transfer component 300 that is a pair of fins at the top of the container at a position adjacent to the cooling coil 120 of the cooling device 100. The thermostatic container 110 includes a single door 140 having a handle 145 that is positioned to open the door 140 and assist the user in accessing the inner storage area of the container.

  FIG. 9 depicts an embodiment of a thermostatic container 110 for use in a cooling device. For example, the thermostatic container 110 can be used in a cooling device in the manner shown in FIG. In some embodiments, the thermostatic container is sized and shaped to fit within a cold storage area of a domestic refrigeration system. In some embodiments, the thermostatic vessel includes an outer surface configured to be positioned adjacent to one or more walls of a cooling region within the cooling device. In some embodiments, the thermostatic container includes one or more outer surfaces configured to reversibly join with one or more inner surfaces of the cooling device. The constant temperature vessel 110 shown in FIG. 9 is configured to fit and operate inside the cooling device, but is depicted without the cooling device. The embodiment of the thermostatic container 110 shown in FIG. 9 is substantially drawn to show its internal structure in a cross-sectional view.

  As shown in FIG. 9, the thermostatic container 110 includes one or more portions of thermal insulation that substantially define one or more walls 200 of the thermostatic container 110. In some embodiments, the walls of the thermostat contain structural material attached to one or more portions of the insulation. In some embodiments, the walls of the thermostatic container are sized and shaped to fit within the storage area of the cooling device. In some embodiments, the wall of the thermostatic container includes a radioactive surface configured to be positioned adjacent to a set of cooling coils. As shown in FIG. 9, the wall 200 of the constant temperature vessel 110 substantially forms an upright rectangular structure having an outer area sized and shaped to fit within the internal storage area of the cooling device. . In the embodiment shown in FIG. 9, the wall 200 of the thermostatic container 110 forms a rectangular structure in which the horizontal height of the container is shorter than the vertical height when positioned for use. In some embodiments, the walls of the thermostatic container form a structure in which the horizontal height of the container is longer than the vertical height when positioned for use. In some embodiments, the walls of the thermostatic container form a non-rectangular shape, such as a cylinder, bowl or oval structure.

  As shown in FIG. 9, the thermostatic container 110 includes an internal region. The thermostatic container 110 includes a heat insulating partition 900 that divides the inner region to form a storage region 920 and a phase change material region 910 inside the container 110, and a conduit 930 between the storage region 920 and the phase change material region 910. Insulating partition wall 900 is included. In some embodiments, the thermal barrier includes one or more portions of thermal insulation. In some embodiments, the thermal barrier is made from the same type of thermal insulation as one or more walls that define a thermostatic container. In some embodiments, the insulating partition is made from a different insulation type than the insulation of the container wall. In some embodiments, the insulating partition is configured such that the phase change material region is located adjacent to at least one outer surface of the thermostatic container and the at least one outer surface is located adjacent to the cooling region.

  Some embodiments of the thermostatic container include: an access opening adjacent to a storage area inside the container; and a door configured to substantially join the access opening. For example, some embodiments include: an opening in at least one of one or more portions of insulation that substantially define one or more walls of the thermostatic vessel; and a door made from the insulation, an access opening; Includes a door configured to substantially join. For example, the door may include edges that are sized and shaped to reversibly join the surface of the access opening. The door is formed and installed for the user to access the contents of at least one storage area in the thermostatic container. For example, a user may collect, add or install material in a storage area through the use of a door. The door is formed, fabricated and installed to minimize heat transfer from the storage area to the area outside the thermostatic container. In some embodiments, the door includes at least one insulation.

  In some embodiments, there is a liner 965 or second container within the phase change material region 910, a liner 965 or second container positioned to receive the phase change material 960. The liner 965, in some embodiments, is made from a thin plastic pouch in the phase change material region 910, a plastic material that is strong and durable enough to accommodate the phase change material 960 used in the embodiment. Can be included. The liner or second container may include sufficient internal spacing for changes in the volume of phase change material during the freeze / thaw cycle in some embodiments. The second container located to contain the phase change material may include a thermally conductive metal container sized and shaped to fit within the phase change material region in some embodiments. For example, in some embodiments, the second container positioned to contain the phase change material is sized to reversibly join a liquid tight aluminum container, the inner surface of the wall of the phase change material region. It may include the outer surface of a container made and formed together. For example, in some embodiments, the second container positioned to contain the phase change material is sized to reversibly join the liquid-tight copper container, the inner surface of the wall of the phase change material region. It may include the outer surface of a container made and formed together. For example, in some embodiments, the second container positioned to contain the phase change material is a liquid tight container made from a thermally conductive plastic, reversibly on the inner surface of the wall of the phase change material region. It may include an outer surface of a container that is sized and formed to be joined. The second container positioned to contain the phase change material, in some embodiments, includes a container sized and shaped to fit within a phase change material region fabricated from a thermally non-conductive material. obtain. For example, in some embodiments, the second container positioned to contain the phase change material may include a liquid tight container made from a thermally non-conductive plastic. In some embodiments, the liner positioned to receive the second container or phase change material can include an airtight container.

  In the illustrated embodiment, there is a thermally conductive divider 935 located within the conduit 930. Thermally conductive partition 935 facilitates thermal energy transfer between phase change material located in phase change material region 910 and conduit 930 while minimizing the possibility of leakage of phase change material into conduit 930. Configured and installed to do. For example, the thermally conductive partition 935 can include a planar structure made from a thermally conductive metal, such as aluminum or copper. For example, the thermally conductive partition 935 can include a mesh structure made from a thermally conductive metal, such as aluminum or copper. For example, the thermally conductive partition 935 can include a mesh structure made from a thermally conductive plastic, such as expanded polytetrafluoroethylene. Some embodiments do not include a partition located within the conduit.

  The constant temperature vessel 110 shown in FIG. 9 includes a thermal control device 940 in a conduit 930. The thermal controller 940 is installed to reversibly enable and inhibit heat transfer between the storage region 920 and the phase change material region 910 through a temperature dependent conduit 930.

  Some embodiments include a passive thermal control device. For example, a passive thermal control device may include a bimetallic element configured to reversibly move the horizontal diameter of the conduit 930 in response to temperature changes in the conduit 930. A passive thermal control device including a bimetallic element can be configured to reversibly move across the diameter of the conduit, depending on the internal temperature in the conduit, and the storage area of the thermostatic container and the phase change material area. Block the heat transfer between the two. A passive thermal control device including a bimetallic element can be configured to reversibly move across the diameter of the conduit, and depending on the internal temperature in the storage area, the storage area of the thermostatic container and the phase change material Block heat transfer between areas. A passive thermal control device including a bimetallic element can be configured to reversibly move across the diameter of the conduit, depending on the internal temperature within the phase change material region and the storage region of the thermostatic vessel. Blocks heat transfer to and from the change material region. For example, a passive thermal control device that includes a bimetallic element can be configured to reversibly move outward at temperatures above about 8 ° C., as well as reversible at temperatures below about 8 ° C. Can be configured to move inwardly. For example, a passive thermal control device that includes a bimetallic element can be configured to reversibly move to an open position for a conduit at temperatures above about 8 ° C., as well as from about 8 ° C. It may be configured to reversibly move to a closed position for the conduit at a lower temperature. For example, a passive thermal control device that includes a bimetallic element, in some embodiments, reversibly suppresses or enables heat flow through the air in the conduit depending on the pop-disk style, thermostat element, set temperature. The pop disc may be configured to be configured.

  Some embodiments include a thermal control device that is operable. For example, an operable thermal control device includes, in some embodiments, a power motor, an electronic temperature sensor, and a battery attached to one or more closure elements located diametrically of the conduit. In some embodiments, the operable thermal control device is configured to be attached to a power source outside the thermostatic container. For example, the power source may include a battery, a solar cell, a generator, or a connection to a city power supply. In some embodiments, the thermal control device includes a temperature sensor; an electronic controller attached to the temperature sensor; and an electronically controlled thermal control unit responsive to the electronic controller.

The constant temperature container 110 shown in FIG. 9 includes a storage area 920. In some embodiments, the storage area may be divided, for example, by the addition of internal walls or other structures within the storage area. In some embodiments, the storage area may comprise a storage structure, such as a shelf, container or other structure. In some embodiments, the storage area may comprise a non-toxic coating or liner on the interior surface of the storage area. In some embodiments, the storage area may comprise an antimicrobial coating or liner, such as a plastic liner containing, for example, antimicrobial and / or antimicrobial agents. In some embodiments, the storage area may be configured to store a pharmaceutical product. For example, the storage area in some embodiments may be sized and shaped to store a second package for a pharmaceutical product, such as a box or packaging material.
In some embodiments, the storage area may be configured for vaccine storage. For example, in some embodiments, the storage area may include a shelf or inner container sized and shaped for storing vaccine vials with or without a second package.

  In some embodiments, the one or more insulation portions include an opening in the lower surface of the container configured to allow condensed liquid to flow out of the interior of the container. The embodiment shown in FIG. 9 is located on the wall 200 of the container 110, with a first end of the small conduit 250 opening into the storage area 920 and a second end opening into the outer surface of the wall 200. It includes an opening in the bottom of the container attached to the small conduit 250. A small conduit is, for example, a thin tube configured to allow condensed liquid to flow out of the interior of the storage area into the area adjacent to the outer surface of the container by gravity and minimize heat transfer through the small conduit. The small conduit is composed of a non-thermally conductive small diameter tube, for example. For example, in some embodiments, the small conduit is comprised of a non-thermally conductive plastic tube. For example, in some embodiments, the small conduit is configured as a tube having a diameter of 1 cm or less. For example, in some embodiments, the small conduit is configured as a tube having a diameter of 0.5 cm or less. For example, in some embodiments, the small conduit is configured as a tube having a diameter of 0.2 cm or less. For example, in some embodiments, the small conduit is configured as a tube having a diameter of 0.1 cm or less. The opening may be located in a relatively low area at the bottom of the storage area, for example a recess in the bottom of the storage area, or in a low part of the slope area.

  In some embodiments, the thermostatic container comprises an opening in a portion of the insulating material that substantially defines the container, the opening being between the phase change material region in the container and the outer surface of the container. For example, the thermostatic container 110 shown in FIG. 9 includes an opening 950 in the upper wall of the container 110. In some embodiments, the opening is located on the top surface of the thermostat if the thermostat is adapted for use in a cooling device. In some embodiments, the opening is sized and shaped substantially corresponding to the outer surface of the unidirectional heat conductor located in the opening. In some embodiments, the opening is configured as an annular structure. In some embodiments, when the container is in a position to be used in a cooling device, the opening is configured in a substantially vertical annular structure. In some embodiments, the insulation substantially defines the container. The openings in the material portion include structures within the openings that form the walls of the openings. In some embodiments, the opening includes, for example, a tube that forms a wall of the opening. Opening 950 substantially corresponds to a small portion of the insulation that defines the container. For example, in certain embodiments, the cross-section of the opening corresponds to 0.5% or less of the total surface area outside the thermostatic container. For example, in certain embodiments, the cross-section of the opening corresponds to 1% or less of the total surface area outside the thermostatic container. For example, in certain embodiments, the cross-section of the opening corresponds to 2% or less of the total surface area outside the thermostatic container. For example, in certain embodiments, the cross-section of the opening corresponds to 3% or less of the total surface area outside the thermostatic container. For example, in certain embodiments, the cross-section of the opening corresponds to 4% or less of the total surface area outside the thermostatic container. For example, in certain embodiments, the cross-section of the opening corresponds to 5% or less of the total surface area outside the thermostatic container. In some embodiments, the opening 950 includes additional insulation, such as one or more rubber gaskets or liners.

  In some embodiments, the thermostatic container comprises a unidirectional heat conductor positioned within the opening and configured to transfer heat from the phase change material region toward the outer surface of the container. For example, the embodiment shown in FIG. 9 includes a unidirectional thermal conductor 970 that passes through an opening 950. The one-way heat conductor 970 shown in FIG. 9 is configured such that the outer surface of the one-way heat conductor 970 is reversibly joined at a position where the one-way heat conductor 970 and the opening 950 are adjacent to each other. In the embodiment shown in FIG. 9, the unidirectional heat conductor 970 has a first end located outside the thermal control vessel 110 and a second end present in the phase change material region 910 and in contact with the phase change material 960. Contains. In some embodiments, the unidirectional heat conductor includes one or more heat conduction units that are thermally connected to an outer surface of the unidirectional heat conductor and located in the phase change material region. The unidirectional heat conductor shown in FIG. 9, for example, is attached to the phase change material region 910 to maximize heat transfer between the phase change material 960 and the unidirectional heat conductor 970. A heat transfer unit 975 in position. For example, as shown in FIG. 9, a unidirectional thermal conductor 970 may traverse a liner 965 or a container 910 in the phase change material region.

“One-way heat conductor”, as used herein, is a structure configured to allow heat transfer in one direction along its long axis and prevent reverse heat transfer along the same long axis. Represents. A unidirectional heat conductor facilitates the transfer of heat in one direction along the length of the unidirectional heat conductor of thermal energy (ie, heat) and reverse direction along the length of the unidirectional heat conductor Designed and implemented to substantially inhibit heat transfer. In some embodiments, for example, the unidirectional heat conductor includes a linear heat pipe device. In some embodiments, for example, the unidirectional thermal conductor includes a thermal diode device. For example, a unidirectional thermal conductor may comprise a hollow tube formed from a thermally conductive material, sealed at both ends, and containing a material in the form of a volatile liquid and a gas. Unidirectional heat conductors are configured such that liquid and gaseous materials are in thermal equilibrium. The unidirectional heat conductor is evacuated during manufacture and then sealed with a gas impermeable sealing device so that all gas in the unidirectional heat conductor is derived from the liquid present.
The vapor pressure in the unidirectional heat conductor is substantially the total vapor pressure of the liquid, and the total vapor pressure of the liquid is substantially equal to the partial pressure of the liquid. In some embodiments, the unidirectional heat conductor achieves heat conduction from the lower end to the higher end by allowing vapor to rise and condense at the condensation end in the unidirectional heat conductor, substantially It can be configured to operate in a vertical position. In some embodiments, the water level of the volatile liquid in the unidirectional heat conductor is not higher than the bottom surface of the insulated container. In some embodiments, the unidirectional heat conductor is located in a storage area of the container whose temperature is controlled when the unidirectional heat conductor is in the expected position in the container. Contains volatile liquids. In some embodiments, for example, the unidirectional heat conductor comprises a liquid comprising R-134A refrigerant, isobutane, water, methanol, ammonia or R-404. In some embodiments, the unidirectional heat conductor is configured as a 1/2 inch diameter copper tube.

  Some embodiments include a unidirectional heat conductor with an elongated structure. For example, the unidirectional heat conductor may comprise a substantially tubular structure. The unidirectional heat conductor can be configured as a substantially linear structure. The unidirectional heat conductor can be configured as a substantially non-linear structure. For example, the unidirectional heat conductor can be configured as a non-linear annular structure. In some embodiments, one or more heat transfer units are attached to the outer surface of the unidirectional heat conductor. For example, one or more planar structures made of a thermally conductive material, such as fin-like structures, are attached to the outer surface of the unidirectional heat conductor and heat between the unidirectional heat conductor and the surrounding area Can be positioned to facilitate movement of Unidirectional heat conductors can be made from thermally conductive metals. For example, the unidirectional thermal conductivity can include copper, aluminum, silver or gold.

  In some embodiments, the unidirectional heat conductor may comprise a substantially elongated structure. For example, the unidirectional heat conductor may comprise a tubular structure. The substantially elongated structure includes a volatile liquid encapsulated with a gas impermeable sealing device. For example, the unidirectional heat conductor may comprise a gas impermeable sealing device that is welded or crimped. In some embodiments, the volatile liquid comprises any one or more of water, ethanol, methanol, or butane. The section of the volatile liquid in the embodiment depends on factors including the evaporation temperature of the volatile liquid in the specific one-way heat conductor in the example and the pressure of the gas in the one-way heat conductor. The interior of the unidirectional heat conductor structure includes a gas pressure below the vapor pressure of the volatile liquid included in the embodiment. When the unidirectional heat conductor is located in a thermostatic container at a substantially vertical position, the vapor of the volatile liquid below the unidirectional heat conductor rises to the top of the unidirectional heat conductor and condenses, resulting in thermal energy. Is moved from the lower part to the upper part of the unidirectional heat conductor.

  In some embodiments, the thermostat does not include a thermal control device that is a valve in the conduit. In some embodiments, the thermostatic container includes a unidirectional heat conductor having a first end located in the storage area of the container and a second end protruding into the phase change material area of the container. Yes. The insulating area of the unidirectional heat conductor is located in the conduit of the thermostatic container. In such an embodiment, the thermostatic container regulates the temperature in the storage area of the container depending on the temperature gradient along the length of the unidirectional heat conductor. For example, a unidirectional heat conductor is a physical property that changes the thermal gradient along the length of the unidirectional heat conductor for a particular embodiment, such as a material used in the manufacture of a unidirectional heat conductor, It is selected based on physical properties such as the liquid inside the unidirectional heat conductor, the length of the unidirectional heat conductor, and the diameter of the unidirectional heat conductor.

  In some embodiments, the thermostatic container comprises a heat dissipating unit adjacent to the outer surface of the container, the heat dissipating unit being configured to be located within the cooling device, and the one-way heat conductor and the thermal Including a heat transfer element connected to the. Some embodiments include a heat dissipation unit that includes a radiating element attached to the outer surface of the thermostatic container. For example, the embodiment shown in FIG. 9 includes a heat dissipation unit 300 on the outer surface of the constant temperature container 110. The heat dissipation unit 300 is thermally connected to the end of the one-way heat conductor 970. Some embodiments include a heat dissipation unit comprising a radiating element comprising a radiating fin structure. For example, the embodiment shown in FIG. 9 has a plurality of fin structures attached to the heat dissipating unit 300 and is positioned to facilitate heat transfer between the heat dissipating unit 300 and adjacent areas in the cooling device. The heat-dissipating unit 300 including the radiating fin is defined.

  In some embodiments, the temperature-controlled container includes a heat dissipation unit that includes a highly thermally conductive material that is thermally connected to a unidirectional heat conductor. For example, a thermostatic container comprising a heat dissipation unit having a heat transport element may comprise a plate made from a thermally conductive material and located between the surface of the heat dissipation unit and the surface of the unidirectional heat conductor. For example, a thermostatic container including a heat radiating unit having a heat transport element includes a crimping or a connector manufactured between a surface of the heat radiating unit and a surface of the unidirectional heat conductor, which is manufactured from a material of the heat conductor. The heat transport element may in some embodiments be made from a thermally conductive material, ie a thermally conductive metal such as copper, aluminum, silver or gold. The heat transport element may in some embodiments be made from a thermally conductive material, i.e. a thermally conductive plastic material.

  In some embodiments, the thermostatic container includes a heat dissipation unit comprising a heat transport element comprising a Peltier device that is thermally connected to a unidirectional heat conductor. The Peltier device is located between the heat dissipation unit and the one-way heat conductor, and can increase heat transport from the one-way heat conductor to the heat dissipation unit. The Peltier device can be connected to a controller and a power source, such as a battery. In addition to the controller and power supply, the Peltier device can be connected to a temperature sensor in the storage area of the thermostatic container. The Peltier device controller may be configured to switch the Peltier device on and off in response to information from the temperature sensor. For example, the controller of the Peltier device may be configured to turn on the Peltier device when a temperature sensor in the storage area indicates a temperature above 7 ° C. For example, the controller of the Peltier device may be configured to turn off the Peltier device when a temperature sensor in the storage area indicates a temperature below 3 ° C.

  FIG. 10 shows an aspect of heat flow through the thermostatic container. The constant temperature vessel 110 shown in FIG. 10 is illustrated with the exception of the cooling device, but is configured to fit and operate with the internal cooling device. The embodiment of the thermostatic container 110 shown in FIG. 10 illustrates the internal structure substantially in cross-section. The isothermal container shown in FIG. 10 includes a thermally insulating partition 900 comprising a wall 200 that substantially defines the container, and a conduit 930 between the storage region 920 and the phase change material region 910. The one-way heat conductor 970 has a first end located in the storage region 920 of the thermostatic vessel 110, a second end located in the phase change material region 960, and an insulating region located in the conduit 930. The region located within conduit 930 of unidirectional heat conductor 970 is configured to reversibly join with the interior surface of conduit 930. Some embodiments include a thermal insulation, such as a thermal insulation foam, that covers the outer surface of the unidirectional thermal conductor 970 in the conduit 930, which thermal insulation around the outer surface of the unidirectional thermal conductor 970. Installed to restrain movement.

  In an embodiment comprising a liner 965 or a second container, such as that shown in FIG. 10, installed to house the phase change material 960 in the phase change material region 910, the liner 965 is a unidirectional heat conductor 970. The second end of the aperture includes an opening so that the phase change material 960 can be present in the wall of the liner 965 without leakage. For example, one or more gaskets can be disposed around the unidirectional thermal conductor 970. In some embodiments, such as those shown in the figures, a plurality of heat transfer units 975 are attached to a unidirectional heat conductor 970 in a phase change material region 910.

  The embodiment shown in FIG. 10 includes an opening 950 in the upper wall of the thermostatic container 110. Opening 950 is sized and positioned such that one or more portions of the cooling coil from the cooling device can pass through opening 950 and be in thermal connection with phase change material 960. When the cooling device is operating, the phase change material 960 is cooled by the cooling coil according to the normal function of the cooling device.

  FIG. 11 illustrates an embodiment of the thermostatic container 110. The constant temperature vessel 110 shown in FIG. 11 is shown with the exception of the cooling device, but is configured to fit and work with the internal cooling device. The embodiment shown in FIG. 11 is shown to illustrate the internal structure in a cross-sectional view. The isothermal container 110 shown in FIG. 11 includes a thermally insulating partition 900 comprising a wall 200 that substantially defines the container, and a conduit 930 between the storage region 920 and the phase change material region 910. The thermostatic container 110 is provided with an opening 205 on the bottom surface of the thermostatic container 110, and the size and shape of the opening 205 removes liquid condensed by gravity from the storage area 920, so that the space between the storage area 230 and the external area of the container is removed. The size and shape of the heat energy transfer is minimized. Thermal controller 940 is located in conduit 930. The thermal control device 940 is located closer to the conduit 930 and inhibits the transfer of thermal energy from the storage area 920 to the interior of the conduit 930.

  The constant temperature vessel 110 shown in FIG. 11 includes a phase change material region 910 that includes a phase change material 960. Phase change material 960 is encapsulated in the phase change material region by liner 965. The one-way heat conductor 970 is located in the lower region of the phase change material region 910, the region that passes through the opening 950 in the upper wall of the thermostat 110, and the upper edge. The upper edge of the unidirectional heat conductor 970 is thermally connected to the heat transfer element 300 located adjacent to the upper surface of the thermostatic container 110.

  The unidirectional heat conductor 970 shown in FIG. 11 illustrates the internal structure for purposes of explanation. The unidirectional heat conductor 970 shown in FIG. 11 is configured as a substantially tubular structure having a substantially straight upper region and a bent lower region. The unidirectional heat conductor 970 includes a volatile liquid 1100 encapsulated within the unidirectional heat conductor 970. The unidirectional heat conductor 970 includes an internal region 1110 that includes a gas having a pressure lower than the vapor pressure of the volatile liquid 1100 under the expected use conditions of the thermostatic container 110. The unidirectional heat conductor 970 includes a mesh structure 1120. In the embodiment shown in FIG. 11, the mesh structure 1120 is a three-dimensional mesh structure. The mesh structure 1120 includes an internal space that is sized and shaped such that the volatile liquid 1100 is drawn into the mesh structure 1120 by capillary action. The mesh structure 1120 is manufactured from a material that has sufficient adhesion with the volatile liquid 1100 that the volatile liquid 1100 is sufficient to be drawn and passed through the mesh structure by capillary action. Mesh structure 1120 is attached to the inner surface of unidirectional thermal conductor 970 in a region located within phase change material region 910 along the length of unidirectional thermal conductor 970. The upper edge of the mesh structure 1120 is at a position that is substantially adjacent to the expected upper surface of the phase change material 960 in the expected use conditions of the thermostat 110. In some embodiments, the upper edge of the mesh structure is lower than the expected top surface of the phase change material 960 in the expected use conditions of the thermostatic container 110.

  In use, the thermostatic container 110 is configured such that the volatile liquid 1100 in the unidirectional heat conductor 970 is sucked along the mesh structure 1120 by capillary action. The positioning of the volatile liquid 1100 within the mesh structure 1200 increases the surface area available for evaporation of the volatile liquid 1100. The volatile liquid then changes to a gaseous form within the interior region 1110. Since the heat transfer element 300 is located in the cooling region of the cooling device, it is expected to transfer heat energy out of the thermostat 110 (see FIG. 11). The effect is to cool the adjacent interior region 1130 of the unidirectional heat conductor 970. Subsequently, the volatile liquid in the form of gas condenses in the adjacent internal region qq30 of the unidirectional heat conductor 970 and participates in the transfer of thermal energy.

FIG. 12 shows an embodiment of the constant temperature container 110. The controlled vessel 110 illustrated in FIG. 12 is shown with the exception of the cooling device, but is configured to fit and operate with the internal cooling device. The temperature controlled container 110 illustrated in FIG. 12 is illustrated to illustrate the internal structure in a substantial cross-sectional view. The temperature conditioned container 110 shown in FIG. 12 includes a thermally insulating partition 900 comprising a wall 200 that substantially defines the container, and a conduit 930 between the storage region 920 and the phase change material region 910. The temperature-adjusted container 110 has an opening 205 on the bottom surface of the temperature-adjusted container 110, and the opening 205 removes liquid condensed by gravity from the storage area 920, and the storage area 230 and the external area of the container A thermal control device 940 that is sized and shaped to minimize the transfer of thermal energy between them is located in the conduit 930. In the embodiment shown in FIG. 12, the thermal control device 940 includes an electronically controlled thermal control unit. For example, in some embodiments, the thermal control device 940 includes a child controlled valve attached to the conduit 930 that is positioned to reversibly inhibit the passage of gas through the conduit 930. ing. A thermal control device 940 shown in FIG. 12 is attached to the electronic controller 1210. The electronic controller 1210 is attached to the temperature sensor 1200 by a wire connector 1230. As shown in FIG. 12, the temperature sensor 1200 is located in the storage area 930, and the temperature sensor is attached to the thermal control device 940. In the embodiment shown in FIG. 12, the temperature sensor 1200 is attached to the side of the storage area 920. In some embodiments, the temperature sensor may be located in the conduit 940. The electronic controller 1210 is configured to control the thermal controller 940 located in the conduit 930 in response to information transmitted from the temperature sensor 1200 via the wire connector 1230. In the embodiment shown in FIG. 12, fan 1220 is attached to electronic controller 1210 and is adjacent to conduit 930. The fan 1220 is reversibly controlled by the electronic controller 1210. For example, the electronic controller 1210 can be configured to turn on the fan 1220 in response to a temperature reading exceeding a threshold. The electronic controller 1210 and the attached module are connected via a wire connector 1260 to a power source 1250, eg, an external power source 1250 as shown in FIG. In some embodiments, the thermostat 110 is connected to a power source for a cooling device around the thermostat 110. The embodiment shown in FIG. 12 also includes a heating element 1240 connected to the electronic controller 1210 via a wire connector 1230. As shown in FIG. 12, the temperature sensor 1200 is located in the storage area 930, and the temperature sensor 1200 is attached to a heating device that includes a heating element 1240 in the storage area 930. The electronic controller 1210 may be configured to turn on the heating element 1240 in response to information transmitted from the temperature sensor 1200 via the wire connector 1230. For example, the electronic controller 1210 can be configured to turn on the heating element 1240 in response to a temperature reading below a threshold. The heating element may be located along the bottom surface of the storage area 920, for example. The heating element may be located, for example, adjacent to the interior surface of the storage area 920.

  FIG. 13 illustrates an embodiment of the thermostatic container 110. The constant temperature vessel 110 shown in FIG. 13 is shown without the cooling device, but is configured to fit and work with the internal cooling device. The temperature controlled container 110 illustrated in FIG. 13 is illustrated to illustrate the internal structure in a substantial cross-sectional view. The isothermal container 110 shown in FIG. 13 includes a thermally insulating partition 900 comprising a wall 200 that substantially defines the container, and a conduit 930 between the storage region 920 and the phase change material region 910. The thermostatic container 110 is provided with an opening 205 on the bottom surface of the thermostatic container 110. The size and shape of the opening 205 removes liquid condensed by gravity from the storage area 920, and the storage area 230 and the container It is sized and shaped to minimize the transfer of thermal energy between the outer regions.

  The embodiment shown in FIG. 13 includes an electronic controller 1210 connected to a temperature sensor 1200 via a wire connector 1230. Fan 1220 is located adjacent to conduit 930 and is operably coupled to electronic controller 1210. The heating element 1240 is operably attached to the electronic controller 1210 via a wire connector 1230. As shown in FIG. 13, the temperature sensor 1200 is attached to a transmission unit including the transmitter 1300 via a wire connector 1260. The transmitter 1300 is configured to transmit the signal 1310 to the temperature conditioned container 110. In some embodiments, the transmission unit 1320 is configured to transmit the signal 1310 via the transmitter 1300 on a regular schedule. For example, the transmission unit 1320 may be configured to transmit the latest information from the attached temperature sensor, for example, every 1 hour, every 8 hours, every 12 hours, or every other day. In some embodiments, the transmission unit 1320 may be configured to transmit the signal 1310 via the transmitter 1300 as needed. For example, the transmission unit 1320 may be configured to send a warning signal when information from the temperature sensor 1200 is above or below a threshold (eg, higher than 7 ° C. or lower than 3 degrees).

  In a situation where the room temperature outside the cooling device is lower than the predetermined temperature range of the thermostatic container, the heating element as illustrated in FIGS. 13 and 14 maintains the lower limit of the predetermined temperature range, Provided to supply heat as needed. For example, some embodiments include a thermostat and an internal heater in a storage area attached to a battery, such as a lithium battery. Some embodiments of the thermostatic container are used in a cooling device that can be used, for example, in intermittent power supplies and environments where the room temperature can be below the lower limit of the predetermined temperature range of the thermostatic container storage area. Configured to do. For example, in some embodiments, the predetermined temperature range of the storage area of the thermostatic container is in the range of 2 ° C. to 8 ° C., and the thermostat attached to the internal heater in the storage area is the temperature in the storage area. Can be configured to heat the storage area when the temperature reaches 2.5 ° C. This can occur, for example, in winter, when the cooling device around the thermostatic container does not have a plurality of stable power sources.

  FIG. 14 illustrates an embodiment of the thermostatic container 110. The constant temperature vessel 110 shown in FIG. 14 is shown without the cooling device, but is configured to fit and operate on the internal cooling device. The temperature conditioned container 110 illustrated in FIG. 14 is illustrated to illustrate the internal structure in a substantial cross-sectional view. The thermostatic container 110 shown in FIG. 14 includes a wall 200 that substantially defines the container, and an insulating partition 900 between the storage area 920 and the phase change material area.

  In the embodiment illustrated in FIG. 14, septum 900 includes a first conduit 1450 and a second conduit 1440. The second heat insulating partition 1470 divides the region below the heat insulating partition 900 into a first storage region 1420 and a second storage region 1430. In the described embodiment, the first storage area 1420 and the second storage area 1430 are located in a side-by-side arrangement. Some embodiments include a first storage area and a second storage area in a tandem arrangement. For example, some embodiments include a second insulating partition that divides an interior region to form a second storage region and a second phase change material region within the container, wherein the second partition Includes a second insulating partition comprising a conduit between the second storage region and the second phase change material region.

  In the embodiment shown in FIG. 14, the septum 900 includes a first conduit 1440 that connects the interior of the first storage region 1420 and the phase change material region 910. First conduit 1440 includes a first thermal controller 1400. Septum 900 also includes a second conduit 1450 that connects the interior of second storage region 1430 and phase change material region 910. The second conduit includes a second thermal controller 1410. In the embodiment illustrated in FIG. 14, the first thermal control device 1400 and the second thermal control device 1410 each operate independently. There is no connection between the first thermal control device 1400 and the second thermal control device 1410 in the embodiment of FIG. In some embodiments, the first thermal controller attached to the first conduit and the second thermal controller attached to the second conduit are controlled by one controller. For example, an electronic controller is operably attached to a first thermal control device and a second thermal control device, and the electronic controller is configured to send a signal to operate the device in a harmonized manner.

  In the embodiment shown in FIG. 14, the first storage region 1420 includes a liner region 1460 for a second storage region, and the liner region 1460 is configured to include a phase change material. In the embodiment shown in FIG. 14, the liner region 1460 includes a retention region at a location adjacent to the interior surface in the first storage region 1420. The liner is configured to contain a quantity of phase change material. In some embodiments, the liner region includes a second phase change material that is different from the phase change material in the phase change material region. The liner region includes and encapsulates phase change material within the liner region. For example, in some embodiments, the liner region is manufactured from a durable plastic material having a sealed seam. For example, in some embodiments, the liner region is manufactured from a metal having a welded seam. In some embodiments, the liner region is made from a thermally conductive material.

  First storage region 1420 and second storage region 1430 are thermally connected to phase change material 910 via conduits 1440 and 1450, respectively. Conduits 1440 and 1450 each independently allow the transfer of thermal energy to phase change material 910. Phase change material region 910 includes a liner 965 that encapsulates phase change material 910. The one-way heat conductor 970 is at a position that passes through the opening 950 at the top of the wall 200 around the thermostatic container 110. The unidirectional heat conductor 970 includes a region passing through the opening 950, and most of the downward region is immersed in the phase change material 960, and its upper surface is connected to the heat transfer element 300.

  FIG. 15 illustrates an aspect of the constant temperature container 110 in the cooling device 100. The cooling device 100 includes a wall 130 around the thermostatic container 110. For illustration purposes, the cooling device 100 is shown without the door. FIG. 15 shows the thermostatic container 100 in the storage area of the cooling device 100. The thermostatic container has an access door 140 with an attached handle 145. Although the access door 140 is shown in a closed position, it can be opened by the user to access the material stored in the storage area of the thermostatic container 110. In some embodiments, one door provides access to multiple storage areas within the thermostatic container (see, eg, FIG. 14).

  The cooling device 100 shown in FIG. 15 includes a cooling coil 120. The thermostatic container 110 includes a first one-way heat conductor 1500 and a second one-way heat conductor 1510. The unidirectional heat conductors 1500 and 1510 pass through openings in the outer wall of the temperature-controlled container 110, respectively. The first unidirectional heat conductor is attached to the cooling coil 120 using an attachment unit 1520. In the embodiment shown in FIG. 15, the thermostatic container 110 includes a second unidirectional heat conductor 1510 attached directly to the cooling coil 120. The first unidirectional heat conductor 1500 and the second unidirectional heat conductor 1510 are independently attached to the cooling coil 120 at different positions of the cooling coil 120.

  Some embodiments include a heat dissipation unit comprising an attachment unit configured for attachment to a cooling coil of a cooling device. The mounting unit is configured to enhance the thermal connection between the unidirectional heat conductor and the cooling coil. For example, in some embodiments, the mounting unit includes a thermally conductive metal that contacts the end of the unidirectional heat conductor and also contacts the cooling coil. For example, in some embodiments, the attachment unit is located in the extension of the radiating unit of the thermostatic container. In some embodiments, the mounting unit is made from a thermally conductive metal, such as aluminum, copper, silver, or gold. In some embodiments, the mounting unit is manufactured from a thermally conductive synthetic material, such as a thermally conductive plastic material. In some embodiments, the mounting unit is manufactured from a thermally expandable material. For example, the mounting unit is made from a thermally expandable metal and is positioned to increase the surface area that the mounting unit contacts the cooling coil when the mounting unit is relatively warm.

  FIG. 16 illustrates aspects of an embodiment of the thermostatic container 110. The constant temperature vessel 110 shown in FIG. 16 is shown without the cooling device for visualization purposes, but is configured to fit and operate with the internal cooling device. The temperature conditioned container 110 illustrated in FIG. 16 is illustrated to illustrate the internal structure in a substantial cross-sectional view. The thermostatic container 110 shown in FIG. 16 includes a wall 200 that substantially defines the container, and a thermal barrier between the storage area 920 and the phase change material area. The opening 205 is located in the wall 200 facing downward, and the opening 205 is configured to allow the condensed liquid to drip from the storage area 920 of the thermostatic container 110. A partition wall 900 made of a heat insulating material bisects the upper part of the inner region of the thermostatic container 110. Septum 900 includes a single conduit 930 that is positioned and configured to thermally connect the interior of storage region 920 and the interior of phase change material region 910. Thermal controller 940 is located within conduit 930 and is configured to reversibly inhibit the transfer of thermal energy along the length of conduit 930. Thermal controller 940 is located in conduit 930 and is configured to reversibly minimize the transfer of thermal energy along the length of conduit 930. The thermally conductive divider 935 is configured to facilitate the transfer of thermal energy between the phase change material in the phase change material region 910 and the conduit and to minimize the possibility of the phase change material leaking into the conduit 930. And the position is determined.

  The constant temperature vessel 110 shown in FIG. 16 includes a region of phase change material region 910 that includes a liner 965 adjacent to the inner surface of phase change material region 910. Liner 965 includes phase change material 960. There are two openings 1600, 1610 located in the upper wall of the thermostatic container 110. The first one-way heat conductor has a lower region located in the phase change material region, a region across the length of the opening 1600, and a region located on the upper surface outside the thermostatic container 110. Similarly, the second unidirectional heat conductor has a lower region located in the phase change material region, a region avoiding the length of the opening 1600, and a region located on the upper surface outside the thermostat 110. ing. Space is shown around the outer surfaces of the first and second unidirectional heat conductors 1500, 1510 and on the surfaces of adjacent conduits 1600, 1610 for illustrative purposes. In some embodiments, the outer surfaces of the first and second unidirectional heat conductors 1500, 1510 and the surfaces of adjacent conduits 1600, 1610 are reversibly joined so that there is minimal space between the surfaces. . In some embodiments, the outer surfaces of the first and second unidirectional thermal conductors 1500, 1510 and the surfaces of adjacent conduits 1600, 1610 are thermally sealed by the addition of a gasket or the like. In the embodiment shown in FIG. 16, the attachment unit 1520 is attached to the uppermost end of the first one-way heat conductor 1500. The attachment unit 1520 is configured to improve the transfer efficiency of thermal energy between the end of the one-way heat conductor and the cooling coil set when the thermostatic container 110 is used in a cooling device.

  FIG. 17 illustrates an embodiment of the temperature-controlled container 110 in the cooling device 100. The cooling device 100 includes a wall 130 around the thermostatic container 110. For illustrative purposes, the cooling device 100 is shown without the door. FIG. 17 shows the thermostatic container 110 in the storage area inside the cooling device 100. The cooling coil 120 of the cooling device 100 is explained in the description of FIG. In some cooling devices, there may be a panel or cover around the cooling coil that needs to be avoided or removed depending on the embodiment. The thermostatic container has an access door 140 with an attached handle 145. Although the access door 140 is shown in a closed position, it can be opened by the user to access the material stored in the storage area of the thermostatic container 110. In some embodiments, one door provides access to multiple storage areas within the thermostatic container (see, eg, FIG. 14). The thermostatic container 110 includes a single unidirectional heat conductor 1500 that protrudes in a substantially vertical upward direction from the upper surface of the thermostatic container 110. The unidirectional heat conductor 1500 is attached to the cooling coil 120 by an attachment unit 1520. The mounting unit 1520 illustrated in the embodiment shown in FIG. 17 is sized and shaped to physically contact the majority of the surface of the cooling coil 120. For example, in some embodiments, the mounting unit is sized and shaped to physically contact the width of the cooling coil set. For example, in some embodiments, the mounting unit is sized and shaped to make physical contact with the length of the cooling coil set. For example, in some embodiments, the mounting unit is sized and shaped to physically contact each loop of the cooling coil set.

  FIG. 18 illustrates an embodiment of the temperature-controlled container 110 in the cooling device 100. The cooling device 100 includes a wall 130 around the thermostatic container 110. For illustrative purposes, the cooling device 100 is shown without the door. FIG. 18 shows the thermostatic container 110 in the storage area inside the cooling device 100. Although the cooling coil 120 of the cooling device 100 is illustrated in the description of FIG. 18, in some embodiments, the illustrated features of the vessel adjacent to the cooling coil are behind the panel or screen of the cooling device 100. .

  The embodiment shown in FIG. 18 includes a portion of one or more insulating materials that substantially define one or more walls 200 of the thermostatic vessel 110 with an interior region. The embodiment includes an insulating partition 900 that divides the interior region and forms a storage region 920 and a phase change material region 910 within the container 110, the insulation partition between the storage region 920 and the phase change material region 910. A conduit 930 is included. Phase change material 960 is located within phase change material region 910. The described thermostatic chamber 110 includes a thermal diode unit 1800 in a storage area 920 that includes a heat transfer element 1850 in a conduit 930. In the described embodiment, the heat transfer element 1850 extends beyond the conduit and into the phase change material region 910. The described embodiments also include an opening 950 in the portion of the insulating material that substantially defines the container 110, the opening 950 from the interior of the phase change material region 910 to the container and the outer surface of the container 110. Between. The embodiment includes a unidirectional heat conductor 1500 located in the opening 950, the unidirectional heat conductor configured to transfer heat in a direction from the phase change material region 910 to the outer surface of the container 110. The Unidirectional heat conductor 1500 includes an attached fin structure. The embodiment includes an attachment unit 1520 between the outer end of the container 110 of the unidirectional heat conductor 1500 and the cooling coil 120 of the cooling device 100. The mounting unit 1520 shown in FIG. 18 is approximately the same width as the phase change material region 910 in the container 110 and forms a thermal connection with most of the loops of the cooling coil.

  The embodiment shown in FIG. 18 includes a thermal diode unit 1800. As used herein, a “thermal diode unit” is configured to contact at least a portion of a storage area of a thermostatic container, substantially equalizing the temperature within the storage area, and the temperature within the storage area may be selected in certain embodiments. The thermostatic container is configured to promote thermal energy or heat transfer outside the storage area when above a permissible upper limit of a predetermined temperature range. The thermal diode unit includes an outer wall and an inner wall, and is positioned so as to have a gap between the inner walls of the outer wall. The thermal diode unit includes an outer wall and an inner wall, and constitutes a gas-impermeable sealing device around a gap between the outer wall and the inner wall, thereby forming a gas-sealed gap in the structure of the thermal diode unit. In some embodiments, the thermal diode unit includes an outer wall having an outer surface that joins one or more substantially vertical inner surfaces of the storage area. In some embodiments, the thermal diode unit is substantially cylindrical, eg, a substantially vertically oriented cylinder. In some embodiments, the thermal diode unit is substantially rectangular. In some embodiments, the thermal diode unit is substantially box-shaped. In some embodiments, the thermal diode unit comprises at least one opening, the opening being in a position to join a storage area door or other opening. In some embodiments, the thermal diode unit includes a bottom region that reversibly joins a bottom surface of the storage region of the thermostatic container. In some embodiments, the thermal diode unit includes a bottom region with an opening configured to drain excess fluid from the bottom region. In some embodiments, the thermal diode unit includes a heat transfer element that extends to the phase change material region of the thermostatic container. The heat transfer element includes an essential internal region in the gap in which the gas of the thermal diode unit is enclosed. The outer wall of the thermal diode unit is manufactured from a thermally conductive material. For example, in some embodiments, the thermal diode unit is manufactured containing aluminum or copper. For example, in some embodiments, the thermal diode unit is manufactured containing a thermally conductive plastic. The thermal diode unit includes an internal region of the thermal diode unit with a gas pressure that does not match the atmospheric pressure surrounding the thermal diode unit. For example, in some embodiments, the thermal diode unit has a gap filled with a gas having a gas pressure lower than the ambient atmospheric pressure. For example, in some embodiments, the thermal diode unit has a gap filled with a gas having a gas pressure higher than the ambient atmospheric pressure. In some embodiments, the thermal diode unit includes a gas-enclosed gap that includes a liquid encapsulated within the gas-enclosed gap. For example, the thermal diode unit can include a volatile liquid. In some embodiments, the thermal diode unit comprises an attached mesh structure on the inner surface of the inner wall of the thermal diode unit, the mesh structure being physically perpendicular to an adjacent surface area of the inner wall. It is in the position that touches. In some embodiments, the mesh structure is attached to the interior surface of the interior wall such that the mesh structure and a majority of the interior surface are thermally connected. In some embodiments, the mesh structure comprises a plurality of internal pores, and the average diameter of the plurality of internal pores is such that the liquid is passed through the top of the mesh structure when the thermal diode unit is in position for use. It is enough to lead to. In some embodiments, the mesh structure comprises a plurality of internal pores, and the average diameter of the plurality of internal pores is less than about 100 microns.

  In some embodiments, a thermal diode unit designed for use in a thermostatic container; at least one internal wall configured to be substantially vertical during use of the thermal diode unit; At least one exterior wall sized and shaped to fit with the one interior wall, the at least one exterior wall having a gap formed between the at least one interior wall and the at least one exterior wall; A mesh structure attached to the surface of the at least one internal wall adjacent to the gap; forming a liquid in the gap; a gas impermeable inner region of the first thermal diode unit surrounding the gap; One or more sealing devices between the at least one inner wall and the at least one outer wall; and Less than atmospheric pressure, containing the gas pressure in the interior region is the gas impermeable. Some embodiments of this document include a gas pressure in the gap that is below the gas partial pressure of the liquid at the expected conditions of use of the thermal diode. In some embodiments, the thermal diode unit includes a bottom wall attached to the lower end of the at least one internal wall during use of the thermal diode unit. In some embodiments, the thermal diode unit further includes a heat transfer element with an interior space adjacent to the gas impermeable interior region of the thermal diode unit. In some embodiments, the thermal diode unit further includes a heat transfer element that is thermally connected to the gas impermeable interior region of the thermal diode unit. In some embodiments, the thermal diode unit further includes a temperature sensor attached to the transmitter and attached to the thermal diode unit.

  FIG. 18 illustrates an embodiment of a thermostatic container 110 comprising a thermal diode unit 1800. A thermal diode unit 1800 shown in FIG. 18 includes a storage compartment comprising an inner wall and an outer wall with a gap between the inner wall and the outer wall. Inside the interior wall is a storage area 1810 with temperature control. In the described embodiment, a substantially flat floor section 1840 is attached to the inner wall at its end to form the lower boundary of the temperature controlled storage area 1810. The floor section 1840 has an opening configured to allow excess liquid, such as condensate, to drain from the temperature controlled storage area 1810. The opening 1860 of the floor section 1840 of the thermal diode unit 1800 has a position and shape to be joined with the opening 205 of the lower wall of the thermostatic container 110.

  The mesh structure 1820 is attached to the inner surface of the inner wall of the thermal diode unit 1800, and the mesh structure faces the gap between the walls of the thermal diode unit 1800 where the gas is sealed. The liquid 1830 is located in the gap in which the gas is sealed. Liquid 1830 has a surface tension sufficient to allow the plurality of pores of mesh structure 1820 to suck up. Due to the combination of the average size of the plurality of pores in the mesh structure and the capillary action of the liquid 1830, the mesh structure is substantially saturated with the liquid 1830 along the length and height in the gap in which the gas is enclosed. . In some embodiments, the mesh structure is a metal foam structure. In some embodiments, the mesh structure is made from paper fibers. In some embodiments, the mesh structure is made from a fabric material. For example, some embodiments include a liquid that is pure water and a mesh structure having pores with an average diameter of 30 microns and a height of 0.3 meters or less. For example, some embodiments include a mesh structure made of copper and having pores with an average diameter of about 44 microns. The mesh structure is attached in contact with the surface of the adjacent wall. For example, in some embodiments, the mesh structure uses one or more of a plurality of welds, a plurality of staples, or a plurality of nails on the wall surface to increase the contacting surface of the mesh structure and the wall surface. Mounted with structure.

  The thermal diode unit 1800 shown in FIG. 18 includes a heat transfer element 1850 located in the conduit 930 of the thermostatic chamber 110. In the described embodiment, the heat transfer element 1850 substantially forms a cylindrical upright structure with an internal gas-enclosed region attached to the gas-enclosed gap in the thermal diode unit. . The heat transfer element 1850 shown in FIG. 18 is in a position that passes through a region located on top of the conduit 930 of the septum 900 and the phase change material region 910 of the vessel 110. In use, the liquid from the gas encapsulated gap can absorb thermal energy or heat through the walls of the thermal diode. The vaporized liquid can rise through the gap in which the gas is sealed and rise into the heat transfer element 1850 and flow into it. When sufficient thermal energy or heat is dissipated through the heat transfer element 1850 to the phase change material 960, the vapor condenses into a liquid at the inner surface of the heat transfer element 850 and drips back to the bottom of the heat transfer element 1850. be able to.

  FIG. 19 illustrates an embodiment of the thermal diode unit 1800. For illustrative purposes, the thermal diode unit 1800 in FIG. 19 is shown independent of the thermostatic container. The thermal diode unit is shown from an oblique viewpoint to explain the features of the thermal diode unit 1800. Although the thermal diode unit 1800 is typically manufactured using an opaque material, for purposes of explanation, FIG. 19 includes an interior view of the thermal diode unit 1800 through solid elements. The thermal diode unit 1800 shown in FIG. 19 is configured in a substantially box shape in which the shapes of the top, bottom, and side surfaces do not have walls that cross the region. The open surface of the thermal diode unit 1800 is located at a position adjacent to the door of the thermostatic container, for example, in the thermostatic container in order to be able to access the internal region of the thermostatic container. The thermal diode unit includes an internal region 1910 that is temperature stabilized. The thermal diode unit 1800 is positioned for use in the storage area of the thermostatic container, and the temperature stabilized internal area 1910 is a predetermined range of temperature stabilized internal areas. Can be used for preservation. For example, in some embodiments, the thermal diode unit is configured to keep a stored medicament, such as a vaccine, in a predetermined temperature range of 2 ° C to 8 ° C. For example, in some embodiments, the thermal diode unit is configured to keep a stored medicament, such as a vaccine, in a predetermined temperature range of 0 ° C to 10 ° C. For example, in some embodiments, the thermal diode unit is configured to keep a stored medicament, such as serum, in a predetermined temperature range of −15 ° C. to −25 ° C.

  In some embodiments illustrated in FIG. 19, the thermal diode unit 1800 includes three outer walls 1900 that are substantially perpendicular to each other. The edges of the outer wall 1900 are sealed together at the junction with the gas impermeable sealing device. For example, in some embodiments, the thermal diode unit is composed of aluminum and the edges of the outer wall are welded together. The thermal diode unit 1800 also includes three inner walls 1930 that are positioned parallel to the corresponding outer walls 1900. The inner walls 1930 are sealed together at the junction with the gas impermeable sealing device. For example, in some embodiments, the thermal diode unit is composed of aluminum and the edges of the inner wall are welded together. The thermal diode unit shown in FIG. 19 includes a lower gas impermeable sealing device that joins the lower edge of the inner wall 1930 and the lower edge of the outer wall 1900. For example, in some embodiments, the thermal diode unit is made of aluminum and the lower gas impermeable sealing device is manufactured from a planar aluminum sheet sized and shaped to be located on the outer and inner walls substantially parallel to each other. The gas impermeable sealing device is welded to the outer and inner walls and corresponding edges of each element. The thermal diode unit shown in FIG. 19 includes an upper gas impermeable sealing device that joins the upper edge of the inner wall 1930 and the upper edge of the outer wall 1900. For example, in some embodiments, the thermal diode unit is constructed of aluminum and the upper gas impermeable sealing device is manufactured from a planar aluminum sheet of a size and shape located on the outer and inner walls substantially parallel to each other. The gas impermeable sealing device is welded to the outer and inner walls and corresponding edges of each element. The thermal diode unit shown in FIG. 19 has a transverse gas impermeable sealing device 1960 that joins the edges of the inner wall 1930, the outer wall 1900, the upper gas impermeable sealing device, and the lower gas impermeable sealing device. Is included. For example, in some embodiments, the thermal diode unit is made of aluminum and the transverse gas impermeable sealing device is manufactured from a planar aluminum sheet of a size and shape that is located on the outer and inner walls substantially parallel to each other. The transverse gas impermeable sealing device is welded to the outer and inner walls and corresponding edges of each element.

  The thermal diode unit 1800 includes a mesh structure 1820 that is attached to the inner surface of the inner wall 1930 and faces the gap 1920 that is filled with gas. The mesh structure includes a pore structure having pores having such a size that the liquid in the gap in which the gas is sealed is sucked up to the height of the mesh structure. The gas encapsulated gap 1920 also includes a gas pressure that allows the liquid to evaporate into its vapor phase in the expected use of the thermal diode 1800. For example, in some embodiments, the gas-filled gap 1920 includes a gas pressure below atmospheric pressure. For example, in some embodiments, the gas enclosed gap 1920 includes a gas pressure above atmospheric pressure.

  FIG. 20 shows an embodiment of the thermostatic container 110 in the cooling device 100. The cooling device 100 includes a wall 130 that surrounds the thermostatic container 110. For illustrative purposes, the cooling device 100 is shown without a door. FIG. 20 shows the thermostatic container 110 inside the storage area of the cooling device 100. In some embodiments, the depicted features of the container adjacent to the cooling coil reside behind the panel or screen of the cooling device 100, but the cooling coil 120 of the cooling device 100 is not illustrated in the description of FIG. It is shown.

  The embodiment shown in FIG. 20 includes a constant temperature vessel 110 that includes one or more portions of thermal insulation that substantially define one or more walls 200 of the constant temperature vessel 110, an interior region. The above embodiments divide the inner region to form a storage region 920 and a phase change material region 910 that reside within the container 110 and include a conduit 930 between the storage region 920 and the change material region 910. 900 is included. Phase change material 960 is located within phase change material region 910. The illustrated thermostatic chamber 110 includes a thermal diode unit 1800 that includes a heat transfer component 1850 in a storage area 920 over a conduit 930. In the illustrated embodiment, the heat transfer component 1850 extends beyond the conduit in the inner region of the phase change material region 910. The distal end of the heat transfer component 1850 is a tubular structure located at an angle with respect to the plane of the main axis of the insulating partition wall 900.

  In the embodiment shown in FIG. 20, the temperature dependent valve 2000 is located in the heat transfer component 1850 at a location adjacent to the insulating partition 900. The temperature dependent valve 2000 is installed and calibrated to reversibly adjust the gas flow within the heat transfer component 1850 in relation to the temperature within the heat transfer component 1850. The temperature dependent valve is installed and configured to allow condensed liquid to flow through the temperature dependent valve from the upper region of the heat transfer component to the lower region of the heat transfer component. In some embodiments, the container has a first valve installed and configured to regulate the thermal gradient from the storage area to the phase change material area, and from the upper area of the heat transfer component to the lower area of the heat transfer component, A second return valve is included and configured to allow condensed liquid to flow through the return valve. In some embodiments, the heat transfer component includes an annular insulating region, eg, at a location adjacent to the insulating partition. For example, in some embodiments, a temperature dependent valve in the heat transfer component opens reversibly when the temperature in the heat transfer component is higher than a predetermined value, or allows greater gas flow. To be calibrated. For example, in some embodiments, the temperature dependent valve in the heat transfer component is calibrated to reversibly open when the temperature in the heat transfer component is above a predetermined value of 6 ° C. For example, in some embodiments, the temperature dependent valve in the heat transfer component is calibrated to reversibly open when the temperature in the heat transfer component is above a predetermined value of 8 ° C. For example, in some embodiments, the temperature dependent valve in the heat transfer component is calibrated to reversibly open when the temperature in the heat transfer component is above a predetermined value of 10 ° C. For example, in some embodiments, a temperature dependent valve in the heat transfer component is reversibly closed when the temperature in the heat transfer component is lower than a predetermined value or regulates greater gas flow. Is calibrated as follows. For example, in some embodiments, the temperature dependent valve in the heat transfer component is calibrated to reversibly open when the temperature in the heat transfer component is below a predetermined value of 4 ° C. For example, in some embodiments, the temperature dependent valve in the heat transfer component is calibrated to reversibly open when the temperature in the heat transfer component is below a predetermined value of 2 ° C. For example, in some embodiments, the temperature dependent valve in the heat transfer component is calibrated to reversibly open when the temperature in the heat transfer component is below a predetermined value of 0 ° C.

  In some embodiments, the temperature dependent valve can reversibly and substantially close the interval across the heat transfer component. For example, in some embodiments, the temperature dependent valve is a solenoid or ball valve. In some embodiments, the temperature dependent valve may be reversibly partially spaced across the heat transfer component. For example, in some embodiments, the temperature dependent valve includes one or more louvers that are positioned to partially close the spacing across the width of the heat transfer component. In some embodiments, the temperature dependent valve is a passive valve, such as a “refrigerant valve”, which is a valve that contains a coolant, and the pressure of the coolant reversibly activates the valve. In some embodiments, the temperature dependent valve is a passive temperature dependent valve that includes a thermally responsive bimetallic element. In some embodiments, the temperature dependent valve is a live temperature dependent valve, such as a solenoid, an electric ball valve, or one or more electric louvers. In embodiments, the temperature dependent valve is an active temperature dependent valve and may be operably attached to a control system that includes elements such as one or more temperature sensors, one or more motors, a power source, and a controller. .

  The illustrated embodiment of FIG. 20 is similar to the opening 950 between the phase change material region 910 inherent in the container and the outer surface of the container 110, which is an opening in a portion of the insulation material that substantially defines the container 110. Is included. Embodiments include a unidirectional thermal conductor 1500 located in the opening 950 and configured to conduct heat in a direction from the phase change material region 910 to the outer surface of the container 110. Unidirectional thermal conductor 1500 includes an attached fin structure. The embodiment also includes a mounting unit 1520 located between the distal end of the unidirectional heat conductor 1500 outside the vessel 110 and the cooling coil 120 of the cooling device 100.

  FIG. 21 shows an embodiment of the thermostatic container 110 in the cooling device 100. The cooling device 100 includes a wall 130 that surrounds the thermostatic container 110. For illustrative purposes, the cooling device 100 is shown without a door. FIG. 21 shows the thermostatic container 110 in the storage area of the cooling device 100. In some embodiments, the drawn features of the container adjacent to the cooling coil reside behind the panel or screen of the cooling device 100, but the cooling coil 120 of the cooling device 100 is shown in the illustration of FIG. It is shown. In some embodiments, the unidirectional thermal conductor 1500 traverses the ventilation duct in the cooling device 100 for connection to the cooling coil 120, as shown in FIG.

  In the embodiment shown in FIG. 21, the temperature dependent valve 2000 is located in the heat transfer component 1850 at a location adjacent to the insulating partition 900. In some embodiments, the temperature dependent valve may include a passive valve that reversibly opens and closes depending on the temperature of the temperature dependent valve. In some embodiments, a temperature dependent valve can be attached to the controller and can be responsive to a temperature sensor. The connection may include a physical connector such as a wire. The connection may include a transmission connection that includes components such as a radio frequency (RF) signal transmitter and receiver. As shown in FIG. 21, the wire connector 2140 is attached between the temperature dependent valve 2000 and the controller 2120. The control device 2120 shown in FIG. 21 is attached to the surface of the insulating partition wall 900 facing the storage area 920 at a position adjacent to the temperature controlled storage area 1810. The battery can be connected to the controller to provide power for operation of the controller. For example, in some embodiments, a lithium ion battery can be attached to the controller. In some embodiments, the controller is attached to the power system for the cooling device. For example, the controller may be operably attached to the cooling system power system using a wire connector. The controller 2120 is attached to the temperature dependent valve 2000 in such a way as to reversibly control the operation of the temperature dependent valve 2000. For example, in some embodiments, the control device is attached using a wire connector to a motorized valve that is configured to reversibly open and close in response to a signal communicated from the control device.

  In the embodiment shown in FIG. 21, the temperature sensor 2110 is attached to the controller 2120. The temperature sensor 2110 is attached to the surface of the heat insulating partition wall 900 at a position adjacent to the control device 2120. Some embodiments include a controller unit, and modules such as a controller, temperature sensor, storage device, transmitter, and battery unit may be incorporated into a single unit for ease of use. Temperature sensor 2110 may include a transmitter configured to transmit signal 2100. For example, the temperature sensor may include a passive radio frequency (RF) transmitter configured in some embodiments to communicate the most recent temperature reading from the temperature sensor in response to the RF signal. For example, the temperature sensor may include an active transmitter configured in some embodiments to send a signal that includes encoded temperature data, for example, periodically every hour. For example, the temperature sensor may include a Bluetooth device. In the embodiment shown in FIG. 21, the fan unit 2130 is attached to a temperature sensor 2110. For example, the fan unit can be attached with a temperature sensor in a responsive state. For example, the fan unit may be configured to operate when the temperature sensor indicates a temperature value above a predetermined level. For example, the fan unit may be configured not to operate when the temperature sensor indicates a temperature value below a predetermined level. In some embodiments, the fan unit is configured to operate at predetermined time intervals or continuously. In some embodiments, the fan unit is configured to operate for a predetermined period after the door is opened and closed with respect to the thermostatic container and after the door is closed.

  FIG. 22 shows an embodiment of the thermostatic container 110 in the cooling device 100. The view shown in FIG. 22 is a substantial cross-sectional view of the thermostatic container 110 in the cooling device 100. The cooling device 100 is surrounded by a wall 130. The cooling device 100 includes a door 2200 located at the front of the cooling device 100 and configured to be reversibly opened to access the contents inside the cooling device 100. The constant temperature container 110 is located in a storage area in the cooling device 100. The thermostatic container 110 includes one or more portions of thermal insulation 200 that substantially define the walls of the thermostatic container 110. The thermostatic container 110 includes an opening in one or more portions of the heat insulating material 200 at a position adjacent to the door 2200 of the cooling device, and a door 140 configured to reversibly join with the opening. The opening 205 is located at the lower surface of the thermostatic container 110, and the opening allows liquid to flow from the inside of the storage area 920 to a point outside the container with minimal heat transfer to the storage area 920. Configured.

  The thermostatic container 110 includes a heat insulating partition wall 900 that divides an internal area so as to form a storage area 920 and a phase change material area 910 that are inherent in the thermostatic container 110. Insulating partition 900 includes a conduit 930 between storage region 920 and phase change material region 910. Phase change material 960 is placed in phase change material region 910. A thermal control device 940 is installed in the conduit 930. In the illustrated embodiment, the thermal control device 940 is a passive configured to reversibly limit thermal energy flow, or heat, generated from the interior of the storage region 920 to the phase change material region 910. It is a valve.

  The cooling device 100 shown in FIG. 22 includes a set of cooling coils 120. In some embodiments, the cooling device may include a back panel or an inner insulating partition between the cooling coil and the inside of the cooling device. During the installation of some embodiments of the thermostatic container, the panel or insulating partition may be removed or modified to suit the embodiment. The set of cooling coils depicted in FIG. 22 includes a portion that is inside the cooling device and a portion that is outside the cooling device. The set of cooling coils 120 shown in FIG. 22 is part of a vapor compression system and similarly includes a compressor 2270 and an expansion valve 2260. Controller 2210 is connected to a set of cooling coils 120 through compressor 2270. In some embodiments, the cooling device can be, for example, a heat pump-based system.

  In the embodiment shown in FIG. 22, the portion of the thermostatic chamber 110 facing the rear of the thermal insulation 200 includes a first opening 2340 at a location adjacent to the phase change material region 910. The first unidirectional thermal conductor 2220 includes an outer surface positioned beyond the first opening 2340 and configured to reversibly join with an inner surface of the first opening 2340. The first unidirectional thermal conductor 2220 includes a first end located in the phase change material 960 and a second end located to be in thermal connection with the set of cooling coils 120. It is out. A portion of the thermostatic container 110 facing the rear portion of the heat insulating material 200 includes a second opening 2350 at a position adjacent to the storage region 920 of the thermostatic container 110. The second unidirectional thermal conductor 2230 includes an outer surface positioned beyond the second opening 2350 and configured to reversibly join with the inner surface of the second opening 2350. The second unidirectional thermal conductor 2230 includes a first end located within the storage region 930 and a second end located to be in thermal connection with the set of cooling coils 120. Yes.

  FIG. 23 illustrates aspects of an embodiment of the thermostatic container 110 in use. While the controller 2210 of the cooling device 100 is operative to operate the compressor 2270, heat energy, or heat, is absorbed by a set of cooling coils 120 at a location within the cooling device 100 and is external to the cooling device 100. Are radiated outward by a set of cooling coils 120 at a position at In the illustration of FIG. 23, thermal energy, or heat, is shown as a dotted line. Corresponding to the thermal energy transfer in the cooling coil 120, thermal energy is transferred from the “hot” end of both the first unidirectional thermal conductor 2220 and the second unidirectional thermal conductor 2230 to a set. Move to the cooling coil 120. Similarly, during operation of the cooling device, the controller 2210 activates the compressor 2270 while the distal ends of the first unidirectional heat conductor 2220 and the second unidirectional heat conductor 2230 in the thermostatic vessel 110. Is cooled. In some embodiments, during installation of the thermostat vessel, the first compressor of the cooling device is removed and a second compressor is added. In some embodiments, the compressor incorporated in the cooling device is modified and electrically connected to the thermostat during installation of the thermostat. In some embodiments, an automatic temperature regulator incorporated into the cooling device is modified and electrically connected to the thermostat during installation of the thermostat.

  FIG. 24 shows an embodiment similar to that shown in FIG. 22 during a period when the cooling device 100 is not operational, such as when power cannot be supplied. The embodiment shown in FIG. 24 is similar to that shown in FIGS. 22 and 23, with the exception of the cooling device 100 for the time shown in FIG. The compressor 2270 is not operating.

  In some embodiments, operation of the refrigerator compressor during normal operation of the refrigerator functions to remove heat energy, or heat, from the interior of the phase change material region and from the storage region of the thermostatic container. This cools both areas in the thermostatic vessel for a period of time when the cooling device is operational, such as when power is available. If the inside of a set of cooling coils does not actively cool during low power or no power conditions (eg, a power outage), heat transfer through the unidirectional heat conductor is substantially reduced, so The establishment and maintenance of a thermal gradient through the directional heat conductor is eliminated. This lack of heat transfer is shown in FIG. 24 as an “X” mark across the first unidirectional thermal conductor 2220 and the second unidirectional thermal conductor 2230. If the cooling coil becomes inoperable and the interior of the storage area rises to a temperature above a predetermined temperature for operation of the thermostatic container in the insulated partition, the thermal control device opens a gap through a conduit in the insulated partition . This is illustrated in FIG. 24 using the “open” position of the thermal controller 940. Subsequently, thermal energy, or heat (shown as a dotted line in FIG. 24) naturally flows through the conduit from the storage region to the phase change material region, causing cooling of the storage region. Thermal energy, or heat, can be retained within the phase change material within the phase change material region. As a result, the storage area 920 can experience temperature controlled cooling even in the absence of current to the cooling device. In some embodiments, the thermostatic container in the chiller may be configured to maintain an internal temperature below 8 ° C. for at least 3 days in the absence of power to the chiller. In some embodiments, the thermostatic container in the chiller may be configured to maintain an internal temperature below 8 ° C. for at least one week in the absence of power to the chiller. In some embodiments, the thermostatic container in the chiller may be configured to maintain an internal temperature below 8 ° C. for at least 30 days in the absence of power to the chiller.

  FIG. 25 shows an aspect of the constant temperature container 110 inside the cooling device 110. The view shown in FIG. 25 is similar to the previous views of FIGS. The field of view shown in FIG. 25 is similar to the previous FIGS. The thermostatic container 110 includes one or more portions 200 of thermal insulation that substantially define the walls of the thermostatic container 110. The opening 250 is located in the lower surface of the thermostatic container 110 at one or more portions 200 of insulation, and the opening 250 is the smallest from the interior of the storage area 920 to a location that is external to the container. It is configured to allow liquid to flow so that the heat of the heat is transferred to the storage area 920.

  In the embodiment shown in FIG. 25, the back surface of the heat insulating material 100 of the thermostatic container 110 includes a first opening 2340 at a portion adjacent to the phase change material region 910. The first unidirectional heat conductor 2220 is disposed through the first opening 2340, and the unidirectional heat conductor 2220 is configured to be joined in the opposite direction to the inner surface of the first opening 2340. Includes an exterior that is made of. The first unidirectional heat conductor 2220 is thermally connected to the set of cooling coils 120 using the first mounting unit 2500. The mounting unit may comprise, for example, a thermally conductive metal connector disposed between the end of the unidirectional thermal conductor and the surface of the set of cooling coils. The back surface portion of the heat insulating material 200 of the constant temperature container 110 includes a second opening 2350 at a position adjacent to the storage region 920 of the constant temperature container 110. The second unidirectional heat conductor 2230 is disposed through the second opening 2350, and the second unidirectional heat conductor 2230 is bonded in the opposite direction to the inner surface of the second opening 2350. Including an outer surface configured to be as follows. The second unidirectional heat conductor 2220 is thermally connected to the set of cooling coils 120 using the second mounting unit 2510.

  In some embodiments, the thermostatic container 110 includes one or more temperature sensors disposed within the thermostatic container. For example, the thermostatic container may include an electronic temperature sensor. The electronic temperature control sensor can be connected to an electronic control unit, for example. The electronic temperature sensor can be connected to a transmitter, for example. The electronic temperature sensor can be connected to, for example, a circuit configuration system configured to monitor the internal temperature of the thermostatic container. In some embodiments, an electronic temperature sensor disposed inside the thermostatic container may be connected to a control unit integrated with the cooling device. In some embodiments, an electronic temperature sensor disposed inside the thermostatic container may be connected to a control unit that is independent of the cooling device.

  The embodiment shown in FIG. 25 includes a first temperature sensor 2520 disposed within the phase change material region 910 of the container. The constant temperature container 110 may include a second temperature sensor 2530 disposed inside the storage region 920 of the constant temperature container 110. Both the first temperature sensor 2520 and the second temperature sensor 2530 are connected by a wiring connection 2540 to the control unit 2210 of the cooling device 100. The controller 2210 of the cooling device 100 can be configured to operate in accordance with information sent via the wiring connection 2540 from the first temperature sensor 2520 and / or the second temperature sensor, for example.

  FIG. 26 shows aspects of the thermal diode unit 1800 in use within the cooling device 100. The cooling device 100 is generally depicted in cross section. The cooling device 100 is configured to include a refrigeration area 2670 and a refrigeration area 2680. The cooling device 100 includes a refrigerated area door 2200A and a refrigerated area door 2200B that operate independently to make the respective areas available to the user. The cooling device 100 is included between the freezing area 2670 and the refrigeration area 2680. Internal partition plate 2690 includes an opening 2630 that circulates air between refrigeration region 2670 and refrigeration region 2680. The set of cooling coils 120 is disposed so as to have a portion inherent in the refrigeration region 2670. The controller 2210 is connected to a compressor 2270 that is in contact with the set of cooling coils 120. The evaporation valve 2360 is attached to the set of cooling coils 120. In some cooling devices, the panel or internal wall covers the inside of the cooling coil and / or internal opening. Such a panel or internal wall can be changed or removed by the user, for example, to create the configuration shown in FIG.

  In the embodiment shown in FIG. 26, the thermal diode unit is disposed inside the refrigerated region 2680 of the cooling device 100. The thermal diode unit 1800 includes an inner upright wall 2640 and an outer upright wall 2650 having a gas-sealed gap 2660 disposed between the inner upright wall 2640 and the outer upright wall 2650. The liquid 1830 is disposed inside the gas-sealed gap 2660. A substantially flat floor 1840 is attached to the inner upstanding wall 2640 in contact with its end region. The floor 1840 and the inner upright wall 2640 form a boundary for the temperature controlled storage area 1810 inside the thermal diode unit 1800. The mesh structure 1800 is added to the inner surface of the inner wall of the thermal diode unit 1800 and faces the gas measurement gap between the inner upright wall 2640 and the outer upright wall 2650 of the thermal diode unit 1800. . The upper part of the thermal diode unit 1800 is disposed adjacent to the opening 2630 in the internal partition plate 2690 of the cooling device 100.

  In the embodiment shown in FIG. 26, the temperature equalization unit 2600 is attached to the internal partition plate 290 on the surface adjacent to the refrigeration region 2680 of the cooling device 100. The temperature equalizing unit 2600 is disposed adjacent to the opening 2630 in the internal partition plate 2110. The temperature equalizing unit 2600 includes a temperature sensor 2610 and a blower unit 2110. The blower unit 2110 is arranged to facilitate the movement of air through the internal divider plate 2110, thereby transferring heat energy, ie heat, upward from the cooling area 2680 to the freezing area 2670. In some embodiments, the temperature equalization unit is integrated with the cooling device and is controlled by the controller for the cooling device. In some embodiments, the temperature equalization unit operates independently of the controller for the cooling device. For example, the temperature equalization unit can include a battery and a controller, and can be incorporated simultaneously with the thermal diode unit.

  As shown in FIG. 26, the phase change material container 2620 is arranged inside the freezing region 2670 of the cooling device 100. Phase change material container 2620 is configured as a rectangular container arranged to substantially fill refrigeration region 2670. Phase change material container 2620 includes a sidewall, a bottom and a top. The phase change material container 2620 includes an opening in the upper portion, the opening being arranged to allow the interior region of the set of cooling coils 120 to be housed within the phase change material container 2620. And is sized to allow the interior region of the set of cooling coils 120 to be housed within the phase change material container 2620. The phase change material container may be constructed, for example, from a durable material. For example, in some embodiments, the phase change material container is made from a durable plastic material. For example, in some embodiments, the phase change material container is made of a thermally conductive plastic or metal (eg, copper or aluminum). Phase change material 960 is disposed within phase change material container 2620 and is in direct contact with a set of cooling coils 120.

  FIG. 27 shows an aspect of the thermal diode unit 1800 at a position inside the cooling device 100. The thermal diode unit 1800 is placed in the same manner as the embodiment shown in FIG. The embodiment of FIG. 27 is shown generally in cross section. The illustrated embodiment includes a thermal diode unit disposed within the refrigerated region 2680 of the chiller 100. The embodiment includes a phase change material container 2620 inside the refrigeration region 2670. Phase change material container 2620 allows a set of interiors of cooling coil 120 to be disposed within phase change material container 2620 in direct thermal contact with phase change material 960. As such, it includes an aperture that is disposed.

  In the embodiment shown in FIG. 27, the thermal diode unit 1800 includes a heat transfer component 1850. The heat transfer component 1850 is disposed so as to protrude upward from the upper part of the rear wall of the thermal diode unit 1800. Heat transfer component 1850 is arranged to pass through opening 2630 in internal partition plate 2690 of cooling device 100. The upper end of heat transfer component 1850 is in thermal contact with the bottom end of phase change material container 2620 inside refrigerated region 2680.

  FIG. 28 shows aspects of an embodiment of a thermostatic container 110 that is inside the cooling device 100. The cooling device 100 includes a plurality of walls that surround the thermostatic container 110. For illustrative purposes, a cooling device 100 without a door is shown. The cooling device 100 includes an internal partition plate 2690 between the upper refrigeration region 1670 and the lower refrigeration region 2680. Inner partition 2690 is made with an opening 2630 that allows air to circulate between refrigeration zone 2670 and refrigeration zone 2680 during normal operation of cooling device 100. The set of cooling coils 120 is disposed so as to have a portion inherent in the refrigeration region 2670 of the cooling device 100. Although the cooling coil 120 of the cooling device 100 is exposed in the description of FIG. 28, the depicted features of the vessel adjacent to the cooling coil are behind the panel or partition of the cooling device 100. In some embodiments, the panel or divider may be removed or reconfigured during installation of the thermostatic container 110 that is internal to the cooling device 100.

  FIG. 28 shows the thermostatic container 110 inside the internal refrigeration region of the cooling device 100. The thermostatic container 110 includes a front wall 2820 as seen in the field of view of FIG. The front wall 2820 includes one opening on either side of the front wall 2820. The two doors 2800A and 2800B are joined in opposite directions to the respective openings. Each of the doors 2800A, 2800B includes a handle that is arranged to allow the user to open the respective door and use the contents of the thermostatic container 110. The constant temperature container 110 includes a heat transfer component 1850 disposed inside the opening 2630. Phase change material container 2620 is arranged inside refrigeration region 2670 of cooling device 100. The top of heat transfer component 1850 may be in thermal contact with the bottom of phase change material container 1850. For example, the top of the heat transfer component 1850 may be in physical contact with the bottom of the phase change material container. Phase change material 960 substantially fills phase change material container 2620. The attachment unit 1520 is attached to a set of cooling coils 120. The mounting unit 1520 includes a plurality of thermal fins 2830 that protrude into the phase change material container 2620, the thermal fins 2830 between the phase change material within the phase change material container 2620 and the mounting unit 1520. Heat transfer components are provided. For example, in some embodiments, the plurality of thermal fins 2830 can be made from a thermally conductive metal that is welded to a mounting unit 1520 that is made from a thermally conductive metal. For example, in some embodiments, the plurality of thermal fins 2830 and mounting unit 1520 can be made from copper or aluminum.

  FIG. 29 shows aspects of an embodiment of the thermostatic container 110 that is inside the internal storage area of the cooling device 100. The embodiment shown in FIG. 29 is similar to the embodiment of FIG. 28 where the thermostatic container 110 is found inside the internal storage area of the cooling device 100. The description shown in FIG. 29 is roughly a cross section. FIG. 29 depicts that within the thermostatic chamber 110, a substantially upright divider 700 further divides the area inherent in one or more portions of the insulating material 200 into two internal areas. Yes. Each of the interior areas can be utilized during use by one of the two doors, as shown in FIG.

  Each of the internal regions of the thermostatic container 110 shown in FIG. 29 includes thermal diode units 1800A and 1800B. Each of thermal diode units 1800A, 1800B includes heat transfer components 1850A, 1850B protruding upward through opening 2630. Partition plate 700 divides heat transfer components 1850 </ b> A and 1850 </ b> B inside opening 2630. Heat transfer components 1850A, 1850B are thermally connected to phase change material container 2620 at the upper ends of heat transfer components 1850A, 1850B. The thermal diode units 1800A and 1800B include liquids 1830A and 1830B inside gaps in which gas is sealed. In some embodiments, the thermostatic container includes a plurality of thermal diode units, each of which includes the same amount and type of liquid. In some embodiments, the thermostatic container includes a first thermal diode unit that includes a first liquid inside a first gas encapsulated gap, and a second gas encapsulated gap. And a second thermal diode unit containing a second liquid. For example, FIG. 29 depicts a first thermal diode unit 1800A that includes a first liquid 1830A inside the gas-filled gap of the first thermal diode unit. FIG. 29 shows a second thermal diode unit 1800B including the second liquid 1830B inside the gas-sealed gap of the second thermal diode unit. In some embodiments shown in FIG. 29, the thermostatic chamber 110 includes two temperature equalization units 2600A, 2600B, each of which is a surface of the divider plate 700 at a location adjacent to the opening 2630. Has been added. The temperature equalization units 2600A, 2600B may be configured to operate at the same or different temperature ranges.

  Thermal diode units that differ from the plurality of thermal diode units within one embodiment of the thermostatic vessel may be configured to stabilize the temperature of their internal storage areas in different ranges. For example, the thermal diode unit may include different internal liquids, multiple sized holes in their mesh structure, and gas-filled gaps having different internal gas pressures. These changes in particular change the efficiency of heat transfer from the thermal diode unit to the phase change material through the added heat transfer components. The difference in heat transfer results in a thermal diode unit having a different internal predetermined temperature range within one embodiment of the thermostatic container.

  FIG. 30 shows an aspect of an embodiment of a constant temperature container inside the cooling device 100. The cooling device 100 includes a wall 110 that surrounds the thermostatic container 110. For illustrative purposes, a cooling device 100 without a door is shown. The cooling device 100 includes a set of cooling coils 120. For illustration purposes, a set of cooling coils 120 are exposed, but in some embodiments they can be placed behind a panel or obstruction.

  The thermostatic container 110 shown in FIG. 30 includes one or more portions of thermal insulation that substantially define the walls of the thermostatic container 110. The thermostatic container 110 includes a thermally shielded portion 900 that separates the internal region to form a storage region 920 and a phase change material region 910 that reside within the container 100 and is thermally Blocked portion 900 includes a conduit 930 between storage region 920 and phase change material region 910. The thermostatic container 110 includes a heat control device 940 inside the conduit 930. The thermal control device 940 is arranged to reversibly allow and prevent heat transfer through the conduit 930 between the storage region 920 and the phase change material region 910 depending on the temperature. For example, in some embodiments, the thermal controller 940 can be a valve that is filled with coolant and can be configured to change position when a preset temperature is reached.

  The constant temperature container 110 shown in FIG. 30 includes an opening 950 in the portion 200 of insulating material that forms the top wall of the container 110. Unidirectional thermal conductor 970 passes through opening 950. Unidirectional thermal conductor 970 is disposed with a lower end inside phase change material 960 within phase change material region 910 and an upper end on the outer surface of container 110. In the embodiment shown in FIG. 30, the heat spreading unit including the heat transfer component 300 and the thermoelectric unit 3000 is in direct contact with the unidirectional heat conductor 970 and the upper end of the unidirectional heat conductor 970. Is arranged. The thermoelectric unit 3000 is arranged to transmit heat energy away from the unidirectional heat conductor. For example, in some embodiments, the thermoelectric unit may comprise a Peltier element. The wiring connection 3030 connects the thermoelectric unit 3000 to the control unit 3020. In some embodiments, the wiring connection 3030 may pass through, for example, an existing opening 3050 in the wall of the cooling device (eg, an opening configured for a set of cooling coils). The control unit 3020 includes a control unit, an inverse conversion device, a sealed rechargeable battery, and a transmitter. The transmitter is configured to send a signal 3040 in response to the controller. In some embodiments, the transmitter is a mobile phone transmitter. In some embodiments, the transmitter is a Bluetooth® transmitter. In some embodiments, the control unit is an Arduino unit. The control unit 3020 is attached to the photovoltaic unit 3010 disposed adjacent to the outside of the cooling device 100. The embodiment shown in FIG. 30 also includes an electronic temperature sensor 1200 disposed within the storage area 920. The temperature sensor 1200 is connected to the control unit 3020 using a wiring connection 3040. In some embodiments, the control unit 3020 is operatively connected to the compressor of the cooling device 100. In some embodiments, the control unit 3020 is operably connected to the controller of the cooling device 100.

  For example, one embodiment of a thermostatic container is designed to be operable with or without normal power from a power supply network. For example, the thermostat can be operated based on a power supply network when available, and configured to be operated at other times and based on alternative power sources (eg, photovoltaic units). Has been. For example, a thermostatic container can be configured. Operation based on power supply network according to user input is possible, and operation based on alternative power source (eg photovoltaic unit) according to other input (eg solar energy availability) is possible It is comprised so that. Some embodiments include, for example, a photovoltaic unit configured to supply power to a battery. Some embodiments include, for example, a photovoltaic unit that is configured to supply power directly to a thermoelectric unit within the thermostat. Some embodiments include a photovoltaic unit having a 50 watt (W) peak. Some embodiments are configured to utilize energy from different sources, depending on availability and user preferences. For example, some embodiments include a circuit for receiving power from the photovoltaic unit and a controller for directing the received power directly to the thermoelectric unit or to the battery. This part can be commanded by the user via the interface or controlled based on predetermined criteria (eg date and time, external temperature, or temperature information from one or more temperature sensors inside the thermostat) Can be done. Some embodiments include a controller configured to be responsive to the detected condition of the thermostatic container. Some embodiments include circuitry configured to direct power through a 50-200 W surge power converter from a 12 volt (V) battery to power an existing compressor of the chiller. . Some embodiments are configured to supply power to the thermoelectric unit from the sealed battery under the control of the control unit in response to information from the temperature sensor inside the storage area. Yes. For embodiments where the internal storage area of the thermostatic container is in the range of 15 liters (L) to 50L. A 50 W peak photovoltaic unit can maintain a predetermined temperature range of about 2 ° C. to 8 ° C. continuously using 1 hour of maximum output 15 from the photovoltaic cell per 24 hours. . A change monitor can also be provided. In order to extend the life of the battery in use, it is configured to ensure that the battery is not consumed below a preset threshold (eg, 80% of its charge).

  FIG. 31 shows an aspect of an embodiment of the thermostatic container 110 disposed inside the cooling device 100. The cooling device 100 includes a plurality of walls 130 and a set of cooling coils 120. For illustration purposes, the cooling device 100 is shown without a door. The thermostatic container 110 includes a door 140 having a handle 145 configured to provide a passage to one or more storage areas inherent in the thermostatic container 110.

  The door 140 of the thermostatic container 110 shown in FIG. 31 includes a user interface 3120. For example, in some embodiments, the user interface includes an LED display configured to depict temperature readings from one or more temperature sensors disposed within the storage area of the thermostatic container. It is out. For example, in some embodiments, the user interface displays an LED display configured to depict usage information for the thermostatic container (eg, a time interval from the last time the container door was opened). Contains. For example, in some embodiments, the user interface includes an LED display that is configured such that the storage area of the thermostatic container also depicts inventory data about the contents. The user interface 3120 is connected to a control unit 3100 disposed adjacent to the outside of the cooling device through an opening 3050 in the wall 130 of the cooling device 100. FIG. 31 shows that the user interface 3120 is connected to the control unit 3100 via a wiring connection 3110 through the opening 2050. In some embodiments, the control unit 3100 includes one or more of a battery, a controller, a storage device, and / or a transmitter. In some embodiments, the control unit 3100 is operably connected to the compressor of the cooling device 100. In some embodiments, the control unit 3100 is operably connected to the controller of the cooling device 100. In some embodiments, the control unit 3100 is operably connected to a power source for the cooling device 100.

  In the embodiment shown in FIG. 31, control unit 3100 includes a transmitter configured to send signal 3135 to remote device 3140. The control unit 3100 is also configured to receive a signal 3130 from the remote device 3140. The remote device is operated by a user. In some embodiments, the remote device is a monitoring device specialized for a particular purpose that is specifically configured for use with a thermostatic container. In some embodiments, the remote device is a general purpose device configured for use with a thermostatic container. For example, the remote device includes a mobile phone device configured to send signals to and receive signals from the control unit. Examples of the signal sent and received by the control unit include an electromagnetic wave or a Bluetooth (registered trademark) signal. The control unit 3100 may comprise a wireless transmitter and a wireless receiver. The control unit 3100 may include, for example, a Bluetooth (registered trademark) transceiver.

  Although user 3150 is shown / depicted here as the single figure shown, unless otherwise noted, those skilled in the art will recognize that user 3150 is a human user, a robot user (eg, an entire computer) and It will be readily appreciated that virtually any combination of these (eg, a user may be assisted by the intermediary of one or more robots). Those skilled in the art will readily understand that the same may apply to “caller” and other terms to which presence is directed, unless such terms are used herein, unless otherwise specified. .

  FIG. 32 shows an embodiment of the thermostatic container 110. As shown in FIG. 32, the thermostatic container 110 is disposed inside the cooling device 100. For illustration purposes, the cooling device 100 is shown without a door. The thermostatic container 110 includes a door 140 disposed within the thermostatic container 110 to provide use for the user. The door 140 includes a communication unit 3240 that is added to the outside of the door 140. The communication unit 3240 is operably attached to one or more sensors inside the storage area of the thermostatic container 110. For example, in some embodiments, the communication unit 3240 is operatively connected to one or more of a temperature sensor, a data logger, an inventory list controller, or a plurality thereof. In the embodiment shown in FIG. 32, the communication unit 3240 is connected to one or more sensors using a wiring connection 3245. The communication unit 3240 includes one or more of a transmitter, a receiver, a memory, and a user interface. In some embodiments, the communication unit 3240 includes the transceiver of the device 100. In some embodiments, the control unit 3100 is operably connected to a power source for the cooling device.

  In some embodiments shown in FIG. 32, the control unit 3100 includes a transmitter configured to send a signal 3135 to the remote device 3140. The control unit 3100 is configured to transmit a signal 3135 from the remote device 3140. The remote device is operated by a user 3150. In some embodiments, the remote device is specialized for a special purpose that is specifically configured for use with a thermostatic container. In some embodiments, the remote device is a general purpose device configured for use with a thermostatic container. For example, the remote device may include a mobile phone device that is configured to send and receive signals to the control unit. The signal sent and received by the control unit may include, for example, an electromagnetic wave or a Bluetooth signal. The control unit 3100 can include, for example, a wireless transceiver. The control unit 3100 may include, for example, a Bluetooth (registered trademark) transceiver.

  Although user 3150 is shown / depicted here as the single figure shown, unless otherwise noted, those skilled in the art will recognize that user 3150 is a human user, a robot user (eg, an entire computer) and It will be readily appreciated that virtually any combination of these (eg, a user may be assisted by the intermediary of one or more robots). Those skilled in the art will readily understand that the same may apply to “caller” and other terms to which presence is directed, unless such terms are used herein, unless otherwise specified. .

  FIG. 32 illustrates one embodiment of the thermostatic container 110. As shown in FIG. 32, the thermostatic container 110 is disposed inside the cooling device 100. For illustration purposes, the cooling device 100 is shown without a door. The thermostatic container 110 includes a door 140 disposed within the thermostatic container 110 to provide use for the user. The door 140 includes a communication unit 3240 that is attached to the door 140. The communication unit 3240 is operably attached to one or more sensors inside the storage area of the thermostatic container 110. For example, in some embodiments, the communication unit 3240 is operatively connected to one or more of a temperature sensor, a data logger, an inventory list controller, or a plurality thereof. In the embodiment shown in FIG. 32, the communication unit 3240 is connected to one or more sensors using a wiring connection 3245. The communication unit 3240 includes one or more of a transmitter, a receiver, a memory, and a user interface. In some embodiments, the communication unit 3240 includes a mobile phone signal transceiver. The signal 3235 is sent from the communication unit 3240 to the cellular tower 3220, for example. The cellular tower continuously sends a signal 3215 to the mobile phone device 3200 operated by the user 3150. Mobile phone device 3200 may comprise a mobile phone connected to a wireless cellular network. User 3150 may operate mobile phone device 3200 to send signals 3210 for cellular tower 3220 and cellular network to the mobile phone. Cellular tower 3220 may send signal 3230 to communication unit 3240. For example, the signal includes a state inquiry signal or a control signal for the thermostatic container 110.

  In some embodiments, the thermostatic container includes a communication unit configured to send a signal in response to a predetermined condition, for example, as detected by a sensor attached to the thermostatic container. It is out. For example, in some embodiments, the communication unit can be configured to send a signal in response to a sensed temperature within the storage area of the thermostatic container. For example, in some embodiments, the communication unit may be configured to signal in response to elapsed time (eg, after 24 hours have elapsed). For example, in some embodiments, the communication unit may be configured to signal in response to a resupply of power in the cooling device. In some embodiments, the communication unit includes a power saving setting for use when minimal power is available. In some embodiments, the communication unit includes a visible indicator (eg, LED). In some embodiments, the communication unit includes a camera configured to capture an image when the thermostat door is opened.

  In some embodiments, a method for forming a temperature-controlled extension in a cooling device obtains a measurement of the inner surface of the cooling device; And (2) forming a thermostatic container from one or more walls formed of an insulating material; and having a thermally sealed inner region; Adding at least one storage region to the interior of the inner region being formed to form at least one storage region and at least one phase change material region; the thermostatic vessel is disposed within the cooling device Sometimes, at least one unidirectional heat conductor is disposed through the one or more walls such that heat is conducted from the thermally sealed inner region to the inner region of the cooling device. When, as well as include encapsulating the phase change material inside said phase change material region.

  In some embodiments, a method of forming a temperature-controlled extension in a cooling device includes obtaining a measurement of an inner surface of the cooling device, wherein obtaining the measurement value includes: Receiving the manufacturer's data for the cooling device. In some embodiments, a method for forming a temperature-controlled extension in a cooling device includes obtaining a CAD file inside the cooling device. In some embodiments, a method of forming a temperature-controlled extension in a cooling device includes obtaining the internal 3-D model of the cooling device. In some embodiments, a method for forming a temperature-controlled extension in a cooling device includes obtaining a digital image of the interior of the cooling device. In some embodiments, a method of forming a temperature-controlled extension in a cooling device includes the step of forming a thermostatic container to seal the one or more walls with a thermally non-conductive material. Is included. In some embodiments, the method of forming the temperature-controlled extension in the cooling device is at least one thermally isolated inside one or more thermally sealed interior regions. Adding a portion includes enclosing one or more thermally shielded portions on the inner surface of the one or more walls. In some embodiments, a method of forming a temperature-controlled extension in a cooling device includes arranging at least one unidirectional heat conductor through the one or more walls for the cooling device. This includes the case of referring to the manufacturer's data. In some embodiments, a method of forming a temperature-controlled extension in a cooling device includes placing a phase change material within the phase change material region and placing the phase change material within the phase change material region. Including enclosing the phase change material within a container.

  In some embodiments, the method of installing the temperature controlled extension in the cooling device includes: a second set of cooling coils in the cooling device; and a first set of cooling coils in the cooling device. Includes exchanges. For example, in one embodiment, the first set of cooling coils in the cooling device is configured to maximize the conduction of thermal energy (eg, heat) in the air. The second set of cooling coils is configured, for example, to maximize heat conduction in the phase change material typical of one embodiment. For example, the second set of cooling coils includes thicker fins having a wider pitch than the first set of cooling coils in one embodiment. The second set of cooling coils can be made of, for example, aluminum or copper.

  In some embodiments, the method of installing the temperature-controlled extension within the cooling device includes work performed in the original factory where the cooling device is manufactured. For example, a manufacturer may, in some embodiments, incorporate a thermostatic container into a model cooling device before the cooling device is shipped to a retailer, distributor or direct consumer. For example, the thermostatic container can be sized and shaped for a particular use with a particular model of cooling device. For example, the thermostatic container can be added to the inside of the cooling device by the manufacturer of the cooling device. In some embodiments, the chiller manufacturer may modify the manufacturing process of certain models of chillers to include a thermostatic container within some units. For example, the manufacturer may choose not to install internal shelves, panels or similar structures in the unit in order to better fit the thermostatic container within the unit. For example, in some embodiments, a manufacturer may use the outer wall of a cooling device without using internal structures (eg, panels, insulation and shelves) that are typically attached to the interior of the cooling device. In addition, the thermostatic container can be directly attached to the inside of the outer wall of the cooling device. For example, in some embodiments, the manufacturer may use the outer wall of the cooling device and be made to a specific size and shape for the thermostatic container without the typical internal insulation of the cooling device. The thermostatic container can be directly attached to the inside of the outer wall of the cooling device using a heat insulating material (for example, a heat insulating material blown out between the outer surface of the thermostatic vessel and the inner surface of the cooling device). .

  In some embodiments, the installation of the temperature-controlled extension within the cooling device includes work performed in the original factory where the cooling device is manufactured. For example, a cooling device may be retrofitted into a thermostatic container having an appropriate size and shape in some embodiments by a distributor, retailer or purchaser of the cooling device. For example, a user may place several embodiments of a thermostatic container inside a cooling device with minimal effort. For example, in some embodiments, a distributor may retrofit several units of a model cooling device in a warehouse or distribution center.

  Aspects of the subject matter described in this specification are set forth in the following numbered clauses.

  1. In some embodiments, the thermostat for use in the chiller is: (1) substantially defining a thermostat container of a size and shape to fit within the storage area of the chiller; and (2) an opening in one side of the thermostatic container, and one or more portions of thermal insulation forming a storage area inherent in the container, distal to the opening; and (1) in the container A tank configured to hold the phase change material to be retained, and (2) the first wall of the tank is adjacent to an opening on one side of the container, the second of the tank Including two or more walls disposed within one or more portions of the thermal insulation, such that the wall is disposed adjacent to the storage area.

  2. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 are of a size and shape to fit within the cooling storage area of a domestic cooling device.

  3. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include the case where one or more portions of the insulation include one or more portions of vacuum insulation. .

4). Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include a thermal insulation material in which one or more portions of the thermal insulation material have an R value of at least 5 ft ² ° F · h / Btu. Contains.

5. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include a thermal insulation material in which one or more portions of the thermal insulation material have an R value of at least 7 ft ² · ° F · h / Btu. Contains.

6). Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include a thermal insulation in which one or more portions of the thermal insulation have an R value of at least 10 ft ² · ° F · h / Btu. Contains.

  7). Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include an access opening in which one or more portions of insulation are adjacent to a storage area inside the container, and the access opening substantially. Includes a door configured to be joined.

  8). In some embodiments of the thermostatic container for use within the cooling device of paragraph 7, the door includes at least one insulation.

  9. Some embodiments of the isothermal container for use in the cooling device of paragraph 1 are configured such that one or more portions of the insulation allow the condensed liquid to flow from the inside of the container. Including an opening in the lower surface of the container.

  10. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 are such that when the thermostatic container is in the storage area of the cooling device, the opening on one side of the container is adjacent to the cooling unit. Includes cases where it is located.

  11. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 are such that when the thermostatic container is positioned for use, the opening on one side of the container is positioned at the upper edge of the thermostatic container Is included.

  12 Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include the case where the opening on one side of the container substantially encompasses one side of the thermostatic container.

  13. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 are such that when the thermostatic container is positioned for use, the storage area inside the container is positioned adjacent to the bottom of the thermostatic container. Includes cases.

  14 Some embodiments of the isothermal container for use in the cooling device of paragraph 1 are such that the storage area inside the container is configured to store material at a temperature substantially between 2 ° C and 8 ° C. Is included.

  15. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 are configured such that a storage area inside the container stores a pharmaceutical product.

  16. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include a tank that substantially forms two or more walls made from a thermally conductive material.

  17. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 have two or more walls that substantially form a tank having a thermal conductivity value of at least 50 W / [m · K]. Manufactured from materials that have.

  18. Some embodiments of the isothermal container for use in the cooling device of paragraph 1 have two or more walls that substantially form a tank having a thermal conductivity value of at least 100 W / [m · K]. Manufactured from materials that have.

  19. Some embodiments of the isothermal container for use in the cooling device of paragraph 1 have two or more walls that substantially form a tank having a thermal conductivity value of at least 150 W / [m · K]. Manufactured from materials that have.

  20. Some embodiments of the isothermal container for use in the cooling device of paragraph 1 have two or more walls that substantially form a tank having a thermal conductivity value of at least 200 W / [m · K]. Manufactured from materials that have.

  21. In some embodiments of the isothermal container for use in the cooling device of paragraph 1, two or more walls that substantially form a tank are made from an aluminum material.

  22. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 include an opening in which two or more walls that substantially form a tank are located adjacent to an opening on one side of the container; And a reversible sealing device at the opening.

  23. In some embodiments of the thermostatic container for use in the cooling device of paragraph 1, two or more walls that substantially form a tank are waterproof.

  24. Some embodiments of the isothermal container for use in the cooling device of paragraph 1 are hermetically sealed with two or more walls that substantially form a tank.

  25. In some embodiments of the thermostatic container for use in the cooling device of paragraph 1, the tank is located above the storage area when the container is positioned for use.

  26. Some embodiments of the thermostatic container for use in the cooling device of paragraph 1 are further openings in the lower surface of the thermostatic container that provide thermal energy transfer between the storage area and the area outside the container. It includes the opening of a size and shape that allows condensation to leave the storage area by gravity while minimizing.

  27. Some embodiments of a thermostatic container for use in a cooling device include: one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container including an interior region; A thermally insulating partition that divides an interior region to form a storage region and a phase change material region, the insulation partition including a conduit between the storage region and the phase change material region; a thermal control device in the conduit An opening within a portion of the thermal insulation material that substantially defines the container, the opening between the phase change material region within the container and the outer surface of the container; a unidirectional thermal conductor located within the opening; The unidirectional heat conductor configured to conduct heat in a direction from the phase change material region to the outer surface of the container; and a heat generating unit adjacent to the outer surface of the container, wherein the heat generating unit is located in the cooling device. Does not contain any radiating parts configured It contains the heating unit, and unidirectional thermally conductive member thermally connected to and has heat transfer component.

  28. In some embodiments of the constant temperature container for use in the cooling device of paragraph 27, the constant temperature container is sized and shaped to fit within a cooling storage area of a domestic cooling device.

  29. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the one or more portions of insulation include: one or more portions of vacuum insulation.

30. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, one or more portions of the insulation are: insulation having an R value of at least 5 ft ² ° F · h / Btu. Contains.

31. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, one or more portions of the insulation are: insulation having an R value of at least 7 ft ² · ° F · h / Btu. Contains.

32. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, one or more portions of the insulation are: insulation having an R value of at least 10 ft ² · ° F · h / Btu. Contains.

  33. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, one or more portions of the insulation are: an access opening adjacent to a storage area inside the container; and substantially with the access opening Includes a door configured to be joined.

  34. In some embodiments of the thermostatic container for use in the cooling device of paragraph 33, the door includes at least one insulation.

  35. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, one or more portions of the insulation are configured to: allow condensed liquid to flow from inside the container. Including an opening in the lower surface of the container.

  36. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, one or more portions of the thermal insulation are: located adjacent to one or more walls of the cooling region in the cooling device. Including an outer surface configured as such.

  37. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the walls of the thermostatic container are: one configured to reversibly join with one or more internal surfaces of the cooling device. The above outer surface is included.

  38. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the wall of the thermostatic container includes: a structural material attached to one or more portions of the insulation.

  39. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the walls of the thermostatic container are sized and shaped to fit within the storage area of the cooling device.

  40. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the wall of the thermostatic container includes a radioactive surface configured to be positioned adjacent to a set of cooling coils. .

  41. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the thermal barrier comprises: one or more portions of thermal insulation.

  42. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the insulating partition is located such that the phase change material region is adjacent to at least one outer surface of the thermostatic container, and the at least one outer surface. Is configured to be positioned adjacent to the cooling region.

  43. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the thermal control device in the conduit includes: a passive thermal control device.

  44. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the thermal controller in the conduit is: a temperature sensor; an electronic controller attached to the temperature sensor; and responsive to the electronic controller Includes an electronically controlled thermal control unit.

  45. In some embodiments of a thermostatic container for use in the cooling device of paragraph 27, when the container is for use in the cooling device, the opening within the portion of the insulation material that substantially defines the container is: Located on the top surface of the thermostatic container.

  46. In some embodiments of a thermostatic container for use in the cooling device of paragraph 27, the opening within the portion of the insulation material that substantially defines the container is: of a unidirectional heat conductor located within the opening. An opening is sized and shaped to substantially correspond to the outer surface.

  47. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the unidirectional heat conductor includes: a heat pipe device.

  48. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the unidirectional thermal conductor includes: a thermal diode device.

  49. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the unidirectional heat conductor is located in: a phase change material region and is thermally coupled to the outer surface of the unidirectional heat conductor. It includes one or more heat transfer units connected.

  50. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the heating unit includes: a radiating component attached to the outer surface of the thermostatic container.

  51. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the heat generating unit includes: a radiating component that includes a radioactive fin structure.

  52. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the heat generating unit comprises: a heat transfer component comprising a highly thermally conductive material that is thermally connected to a unidirectional thermal conductor Is included.

  53. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the heating unit includes: a heat transfer component including a Peltier element that is thermally connected to the unidirectional thermal conductor. It is out.

  54. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the heating unit includes: a mounting unit configured to attach to the cooling coil of the cooling device.

  55. In some embodiments of the thermostatic container for use in the cooling device of paragraph 54, the heat generating unit with the mounting unit includes a mounting unit made from a thermally expandable material.

  56. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, the heat transfer component of the heat generating unit is a thermoelectric unit positioned to move thermal energy away from the unidirectional heat conductor. A temperature sensor located within the storage area; a photovoltaic unit configured to be located outside the cooling device; an inverse conversion device attached to the photovoltaic unit; attached to the inverse conversion device Sealed battery; transmitter attached to the battery; and control device, temperature sensor, sealed battery and transmitter attached to the thermoelectric unit, and send operation signal to the thermoelectric unit in response to input from the temperature sensor A controller configured to transmit an operation signal to the machine.

  57. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27: further comprising a temperature sensor located in the storage area and attached to a thermal control device in the conduit.

  58. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27: further comprising a temperature sensor located in the storage area and attached to a heating device in the storage area.

  59. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27: further comprising a temperature sensor located in the storage area and attached to the transmission device.

  60. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27: further comprising a temperature sensor located in the storage area and attached to a controller for the cooling device.

  61. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27, further comprising a liner region configured to contain phase change material for the storage region.

  62. In some embodiments of the thermostatic container for use in the cooling device of paragraph 27: dividing the inner region to form a second storage region and a second phase change material region inherent in the container; and It further includes a second insulating partition that includes a conduit between the second storage region and the second phase change material region.

  63. In some embodiments of the thermostatic container for use in the cooling device of paragraph 62, it further includes a liner region configured to contain phase change material for the second storage region.

  64. In some embodiments of the isothermal container for use in the cooling device of paragraph 62: a second opening in a portion of the thermal insulation material that substantially defines the container, the phase change material region inherent in the container. Said second opening between the container and the outer surface of the container; a second unidirectional thermal conductor located in the second opening, conducting heat in a direction from the phase change material region to the outer surface of the container A second heat generating unit comprising: the second unidirectional heat conductor configured as described above; and a radiating component configured to be located in the storage area of the cooling device adjacent to the outer surface of the container And a heat transfer component that is thermally connected to the second unidirectional thermal conductor.

  65. Some embodiments of a thermostatic container for use in a chiller include one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container including an interior region; An insulating partition that divides the interior region to form a storage region and a phase change material region, the insulation partition including a conduit between the storage region and the phase change material region; a thermal diode in the storage region A thermal diode unit including a heat transfer component located within the conduit; an opening within a portion of the insulation substantially defining the container, the phase change material region within the container and the container The opening between the outer surface; a unidirectional heat conductor located within the opening, the unidirectional heat conductor configured to conduct heat in a direction from the phase change material region to the outer surface of the container ; And A heat generating unit adjacent to the outer surface of the container, the heat generating unit including a radiating component configured to be located in a cooling device, and heat transfer thermally connected to a unidirectional heat conductor Contains parts.

  66. The thermostatic container of paragraph 65 is, in some embodiments, sized and shaped for the thermostatic container to fit within a cold storage area of a home cooling device.

  67. The thermostatic container of paragraph 65, in some embodiments, includes one or more portions of insulation: one or more portions of vacuum insulation.

68. The thermostatic container of paragraph 65 includes, in some embodiments, one or more portions of the thermal insulation: thermal insulation having an R value of at least 5 ft ² · ° F · h / Btu.

69. The thermostatic container of paragraph 65 includes, in some embodiments, one or more portions of the thermal insulation: thermal insulation having an R value of at least 7 ft ² · ° F · h / Btu.

70. The thermostatic container of paragraph 65 includes, in some embodiments, one or more portions of insulation having an insulation having an R value of at least 10 ft ² · ° F · h / Btu.

  71. The thermostatic container of paragraph 65 is, in some embodiments, one or more portions of insulation: an access opening adjacent to a storage area inherent in the container; and a door configured to substantially join the access opening. Is included.

  72. The thermostatic container of paragraph 71, in some embodiments, the door includes at least one insulation.

  73. The thermostatic container of paragraph 65, in some embodiments, includes one or more portions of insulation: an opening configured to allow liquid condensed on the bottom surface of the container to flow from the inside of the container. Yes.

  74. The thermostatic container of paragraph 65 includes, in some embodiments, an outer surface configured such that one or more portions of the insulation are located adjacent to one or more walls of the cooling region in the cooling device. Yes.

  75. The thermostatic container of paragraph 65, in some embodiments, includes one or more outer surfaces configured such that the walls of the thermostatic container: reversibly join with one or more internal surfaces of the cooling device.

  76. The thermostatic container of paragraph 65, in some embodiments, includes a structural material wherein the walls of the thermostatic container are attached to one or more portions of the insulation.

  77. The thermostatic container of paragraph 65 is sized and shaped in some embodiments to fit the wall of the thermostatic container within the storage area of the cooling device.

  78. The thermostatic container of paragraph 65, in some embodiments, includes a radioactive surface configured such that the walls of the thermostatic container are located adjacent to a set of cooling coils.

  79. The thermostatic container of paragraph 65, in some embodiments, includes a thermal barrier: one or more portions of thermal insulation.

  80. The thermostatic container of paragraph 65 is configured in some embodiments such that the phase change material region is positioned adjacent to at least one outer surface of the thermostatic container and at least one outer surface is positioned adjacent to the cooling region. Thus, a heat insulation partition is comprised.

  81. The constant temperature vessel of paragraph 65 is in some embodiments attached to a surface where the thermal diode unit is: a number of walls surrounding an inner space including a surface located adjacent to the storage area; One or more sealed joints between a plurality of walls surrounding the inner spacing; and a liquid within the inner spacing;

  82. The constant temperature vessel of paragraph 81 is, in some embodiments, the multiple walls of the thermal diode unit are made from a thermally conductive material.

  83. The constant temperature vessel of paragraph 81 includes, in some embodiments, one or more external walls in which multiple walls of the thermal diode unit are configured to reversibly join with one or more walls of the storage area. It is out.

  84. The constant temperature vessel of paragraph 81 has a gas pressure where the inner spacing of the thermal diode units is less than atmospheric pressure in some embodiments.

  85. The constant temperature container of paragraph 81, in some embodiments, has a mesh structure: a three-dimensional mesh structure.

  86. The constant temperature vessel of paragraph 81 includes, in some embodiments: a substantially planar bottom unit for a thermal diode unit.

  87. The thermostat of paragraph 81 includes, in some embodiments, a heat transfer component positioned such that the thermal diode unit extends into the phase change material region of the thermostat.

  88. The thermostatic container of paragraph 65, in some embodiments, when the container is for use in a cooling device, an opening in a portion of the insulation that substantially defines the container is located on the top surface of the thermostatic container.

  89. The thermostatic container of paragraph 65 is, in some embodiments, such that the opening in the portion of the insulation material that substantially defines the container substantially corresponds to the outer surface of the unidirectional heat conductor located within the opening. Includes openings of size and shape.

  90. The thermostatic container of paragraph 65 includes, in some embodiments, a unidirectional thermal conductor: a heat pipe device.

  91. The thermostatic container of paragraph 65 includes, in some embodiments, a unidirectional thermal conductor: a thermal diode device.

  92. The thermostatic container of paragraph 65, in some embodiments, includes one or more unidirectional thermal conductors: located in the phase change material region and thermally connected to an outer surface of the unidirectional thermal conductor. Includes heat transfer unit.

  93. The thermostatic container of paragraph 65, in some embodiments, includes a heat generating unit: a radiating component attached to the outer surface of the thermostatic container.

  94. The thermostatic container of paragraph 65 includes, in some embodiments, a radiating component in which the heating unit includes: a radioactive fin structure.

  95. The thermostatic container of paragraph 65, in some embodiments, includes a heat transfer component wherein the heat generating unit includes: a high thermal conductivity material that is thermally connected to the unidirectional thermal conductor.

  96. The thermostatic container of paragraph 65 includes, in some embodiments, a heat transfer component in which the heat generating unit includes: a Peltier element that is thermally connected to the unidirectional heat conductor.

  97. The thermostatic container of paragraph 65 includes, in some embodiments, a mounting unit configured such that the heating unit is attached to the cooling coil of the cooling device.

  98. The mounting unit of paragraph 97 includes in some embodiments: a mounting unit made from a thermally expandable material.

  99. The thermostatic container of paragraph 65, in some embodiments, includes a thermoelectric unit in which the heat transfer component of the heating unit is positioned to transfer thermal energy away from the unidirectional heat conductor, and is located within the storage area. A temperature sensor; a photovoltaic unit configured to be located outside the cooling device; an inverse converter attached to the photovoltaic unit; a sealed battery attached to the inverter; a transmission attached to the battery And a control device attached to the thermoelectric unit, a temperature sensor, a sealed battery and a transmitter, configured to send an operation signal to the thermoelectric unit in response to an input from the temperature sensor and to send an operation signal to the transmitter Further includes a control device.

  100. The thermostatic container of paragraph 65 further includes, in some embodiments: a temperature sensor located in the storage area, a temperature sensor attached to the data logger device.

  101. The thermostatic container of paragraph 65 further includes, in some embodiments: a temperature sensor located in the storage area, a temperature sensor attached to a heating device in the storage area.

  102. The thermostatic container of paragraph 65 further includes, in some embodiments: a temperature sensor located within the storage area, a temperature sensor attached to the transmission device.

  103. The thermostatic container of paragraph 65 further includes, in some embodiments: a temperature sensor located in the storage area, a temperature sensor attached to a controller for the cooling device.

  104. The thermostatic container of paragraph 65 further includes, in some embodiments: a liner region for a storage region, a liner region configured to contain phase change material.

  105. The thermostatic container of paragraph 65 is in some embodiments: a second insulating partition that divides the interior region to form a second storage region and a second phase change material region that are inherent in the container, a second storage. It further includes a second insulating partition that includes a conduit between the region and the second phase change material region.

  106. In some embodiments, the thermostatic container of paragraph 105 further includes: a liner region for the second storage region, a liner region configured to contain the phase change material.

  107. In some embodiments, the thermostatic container of paragraph 105 is: a second opening in a portion of the thermal insulation that substantially defines the container, between the phase change material region inherent in the container and the outer surface of the container. A second unidirectional heat conductor located within the second opening and configured to conduct heat in a direction from the phase change material region to the outer surface of the container. Two unidirectional heat conductors; and a second heat generating unit including a radiating component configured to be adjacent to the outer surface of the container and located in a storage area of the cooling device; and a second unidirectional And a heat transfer component thermally connected to the conductive heat conductor.

  108. Some embodiments comprising a thermal diode unit configured for use in a thermostatic container include: a diode unit configured for use in a thermostatic container, at least one inner wall and at least one outer wall At least one outer wall sized and shaped to match at least one inner wall with a gap formed therebetween; a mesh structure attached to the surface of at least one inner wall adjacent to the gap; One or more sealing devices between at least one inner wall and at least one outer wall forming a gas impermeable inner region of the thermal diode unit surrounding the gap; and a gas less than atmospheric pressure Contains the gas pressure in the interior region that is impermeable.

  109. In some embodiments, the thermal diode unit of paragraph 108 includes a thermal diode unit configured as a box shape.

  110. In some embodiments, the thermal diode unit of paragraph 108 includes a thermal diode unit configured as a substantially upright cylinder.

  111. In some embodiments, the thermal diode unit of paragraph 108 is a thermal diode unit that is sized and shaped to fit within the storage area of the cooling device.

  112. In some embodiments, the thermal diode unit of paragraph 108 has at least one outer wall substantially defining the outside of the thermal diode unit.

  113. In some embodiments, the thermal diode unit of paragraph 108 has at least one internal wall made from a thermally conductive metal.

  114. In some embodiments, the thermal diode unit of paragraph 108 includes at least one outer surface wherein at least one inner wall substantially defines a temperature stable region.

  115. In some embodiments, the thermal diode unit of paragraph 108 is configured such that when the thermal diode unit is positioned for use, the mesh structure is: a number of interiors of an average size sufficient to direct liquid to the upper edge of the mesh structure. Contains holes.

  116. In some embodiments, the thermal diode unit of paragraph 108 includes a plurality of internal holes with a mesh structure: average size less than about 100 microns.

  117. In some embodiments, the thermal diode unit of paragraph 108 has a mesh structure attached to most surfaces of the inner wall.

  118. In some embodiments, the thermal diode unit of paragraph 108 has a mesh structure attached to the surface of the inner wall by a thermal connection between the mesh structure and most surfaces.

  119. In some embodiments, the thermal diode unit of paragraph 108 has a gas pressure in an interior region that is gas impermeable that is less than atmospheric pressure: the gas partial pressure of the liquid under the expected conditions of use of the thermal diode Contain less gas pressure.

  120. In some embodiments, the thermal diode unit of paragraph 108 further includes: a bottom wall attached to at least one internal wall at the lower edge when the thermal diode unit is positioned for use.

  121. In some embodiments, the thermal diode unit of paragraph 108 further includes: a heat transfer component that includes an inner spacing adjacent to the gas impermeable inner region of the thermal diode unit.

  122. In some embodiments, the thermal diode unit of paragraph 108 further includes: a heat transfer component that is in thermal communication with the gas impermeable inner region of the thermal diode unit.

  123. In some embodiments, the thermal diode unit of paragraph 108 further includes: a temperature sensor attached to the thermal diode unit and attached to the transmission device.

  124. Some embodiments of a thermostatic container for use in a cooling device include: one or more portions of thermal insulation that substantially define one or more walls of the thermostatic container, including an interior region; An insulating partition that divides the interior region to form a storage region and a phase change material region therein, the insulation partition including a conduit between the storage region and the phase change material region; A thermal control device; a first opening in a portion of the insulation material that substantially defines the container, the opening between the phase change material region within the container and the outer surface of the container; located in the first opening A first unidirectional heat conductor configured to conduct heat in a direction from the phase change material region to an outer surface of the container; heat insulation substantially defining the container A second opening in a portion of the material, the storage area inside the container; Said opening between the outer surface of the vessel; and a second unidirectional heat conductor located in the second opening, configured to conduct heat in a direction from the storage area to the outer surface of the container The unidirectional heat conductor is included.

  125. Some embodiments that include the thermostatic container of paragraph 124 are sized and shaped for the thermostatic container to fit within a refrigerated storage area of a home cooling device.

  126. In some embodiments, the thermostatic container of paragraph 124 includes one or more portions of insulation: one or more portions of vacuum insulation.

127. In some embodiments, the thermostatic container of paragraph 124 includes a thermal insulation in which one or more portions of the thermal insulation have an R value of at least 5 ft ² · ° F · h / Btu.

128. In some embodiments, the thermostatic container of paragraph 124 includes a thermal insulation in which one or more portions of the thermal insulation have an R value of at least 7 ft ² · ° F · h / Btu.

129. In some embodiments, the thermostatic container of paragraph 124 includes a thermal insulation in which one or more portions of the thermal insulation have an R value of at least 10 ft ² · ° F · h / Btu.

  130. In some embodiments, the thermostatic container of paragraph 124 is configured such that one or more portions of the thermal insulation are: an access opening adjacent to a storage area inherent in the container; and an access opening substantially. Includes doors.

  131. In some embodiments, the door of paragraph 130 includes: at least one insulation.

  132. In some embodiments, the thermostatic container of paragraph 124 includes an opening in the lower surface of the container that is configured to allow one or more portions of the insulation: condensed liquid to flow from the inside of the container. Contains.

  133. In some embodiments, the thermostatic container of paragraph 124 includes an outer surface configured such that one or more portions of insulation are located adjacent to one or more walls of a cooling region in the cooling device. It is out.

  134. In some embodiments, the thermostatic container of paragraph 124 includes one or more outer surfaces configured such that the walls of the thermostatic container: reversibly join with one or more internal surfaces of the cooling device.

  135. In some embodiments, the thermostatic container of paragraph 124 includes a structural material in which the walls of the thermostatic container are attached to one or more portions of the insulation.

  136. In some embodiments, the thermostatic container of paragraph 124 is sized and shaped so that the walls of the thermostatic container fit within the cooling storage area of the chiller.

  137. In some embodiments, the thermostatic container of paragraph 124 includes a surface configured such that the wall of the thermostatic container is located adjacent to a set of cooling coils.

  138. In some embodiments, the thermostatic container of paragraph 124 includes a thermal barrier: one or more portions of thermal insulation.

  139. In some embodiments, the thermostatic container of paragraph 124 is configured with an insulating partition such that the phase change material region is located above the storage region.

  140. In some embodiments, the thermostatic container of paragraph 124 includes a thermal control device in the conduit: a passive thermal control device.

  141. In some embodiments, the constant temperature vessel of paragraph 124 includes a thermal control device in the conduit: a temperature sensor; an electronic control device attached to the temperature sensor; and an electronically controlled thermal control unit responsive to the electronic control device. It is out.

  142. In some embodiments, when the thermostatic container of paragraph 124 is for use in a cooling device, the first opening in the portion of the insulation that substantially defines the container is adjacent to the set of cooling coils. Located on one side of the thermostatic container.

  143. In some embodiments, the thermostatic container of paragraph 124 includes a first unidirectional thermal conductor in which a first opening in a portion of the thermal insulation material that substantially defines the container is located within the first opening. A first opening of a size and shape substantially corresponding to the outer surface of the first opening.

  144. In some embodiments, the thermostatic container of paragraph 124 includes a first unidirectional thermal conductor: a heat pipe device.

  145. In some embodiments, the thermostatic container of paragraph 124 includes a first unidirectional thermal conductor: a thermal diode device.

  146. In some embodiments, the thermostatic vessel of paragraph 124 includes a first unidirectional thermal conductor: thermally connected to an outer surface of the first unidirectional thermal conductor, and in the phase change material region. Including one or more heat transfer units.

  147. In some embodiments, the thermostatic container of paragraph 124 includes a mounting unit configured such that the first unidirectional thermal conductor is attached to the cooling coil of the cooling device.

  148. In some embodiments, the thermostatic container of paragraph 124 is such that the mounting unit is made from a thermally expandable material.

  149. In some embodiments, when the thermostatic container of paragraph 124 is for use in a cooling device, a second opening in the portion of the insulation that substantially defines the container is adjacent to the set of cooling coils. Located on one side of the thermostatic container.

  150. In some embodiments, the thermostatic container of paragraph 124 includes a second unidirectional thermal conductor in which the second opening in the portion of the insulation that substantially defines the container is located within the first opening. A second opening of a size and shape substantially corresponding to the outer surface of the second opening.

  151. In some embodiments, the thermostatic container of paragraph 124 includes a second unidirectional heat conductor: a heat pipe device.

  152. In some embodiments, the thermostatic container of paragraph 124 includes a second unidirectional thermal conductor: a thermal diode device.

  153. In some embodiments, the thermostatic container of paragraph 124 includes a second unidirectional thermal conductor: 1 that is thermally connected to an outer surface of the second unidirectional thermal conductor and located within the storage area. Contains one or more heat transfer units.

  154. In some embodiments, the thermostatic container of paragraph 124 includes a mounting unit configured such that the second unidirectional heat conductor is attached to the cooling coil of the cooling device.

  155. In some embodiments, the thermostatic container of paragraph 154 includes an attachment unit wherein the attachment unit is made from: a thermally expandable material.

  156. In some embodiments, the thermostatic container of paragraph 124 further includes: a temperature sensor located in the storage area and attached to a thermal control device in the conduit.

  157. In some embodiments, the thermostatic container of paragraph 124 further includes: a temperature sensor located in the storage area and attached to a heating device in the storage area.

  158. In some embodiments, the thermostatic container of paragraph 124 further includes: a temperature sensor located in the storage area and attached to the transmission device.

  159. In some embodiments, the thermostatic container of paragraph 124 further includes: a temperature sensor located in the storage area and attached to a controller for the cooling device.

  160. In some embodiments, the thermostatic container of paragraph 124 further includes: a liner region configured to contain a phase change material for the storage region.

  161. In some embodiments, the thermostatic container of paragraph 124 includes: dividing the inner region to form a second storage region and a second phase change material region inherent in the container, the second storage region and the second storage region A second insulating partition including a second conduit between the phase change material region.

  162. In some embodiments, the thermostatic container of paragraph 161 further includes: a liner region configured to contain a phase change material for the second storage region.

  163. In some embodiments, the thermostatic container of paragraph 161 includes: a second phase change material region inherent in the container that is present in a portion of the insulation substantially defining the container and the outer surface of the container. And a third unidirectional heat conductor positioned within the third opening and configured to conduct heat in a direction from the phase change material region to the outer surface of the container.

  164. In some embodiments, the temperature control extension to the chiller includes: a heat storage unit that includes a container sized and shaped to fit within the refrigeration portion of the chiller, from a cross-section of the cooling coil of the chiller A container including an opening having a larger edge dimension; a thermal diode unit sized and shaped to fit within the cooling portion of the cooling device and located adjacent to the exhaust opening of the cooling device A thermal diode unit including an upper edge configured to; and a control unit including a temperature sensor, a controller responsive to the temperature sensor, and a fan responsive to the controller.

  165. In some embodiments of the temperature control extension to the cooling device of paragraph 164, the heat storage unit includes a single opening having an edge dimension that is larger than the cross-section of the cooling coil of the cooling device.

  166. In some embodiments of the temperature control extension to the cooling device of paragraph 164, the container of the heat storage unit includes: a liquid impermeable container.

  167. Some embodiments of the temperature control extension to the cooling device of paragraph 164 include a container of the thermal storage unit: a phase change material that substantially fills the container.

  168. Some embodiments of the temperature control extension to the cooling device of paragraph 164 include: a thermal diode unit: at least one internal wall configured to be substantially vertical during use of the thermal diode unit; at least one At least one outer wall sized and shaped to match the at least one inner wall, with a gap formed between the inner wall and the at least one outer wall, configured to be located in the cooling portion of the cooling device An outer wall including an outer surface to be applied; a mesh structure attached to a surface of at least one inner wall adjacent to the gap; a liquid in the gap; a liquid in the gap; a gas-impermeable of the thermal diode unit surrounding the gap One or more sealing devices between at least one inner wall and at least one outer wall forming an inner region; and the atmosphere It includes gas pressure within the interior region is smaller gas impermeable than.

  169. In some embodiments of the temperature control extension to the cooling device of paragraph 164, the thermal diode unit is made from a thermally conductive material.

  170. In some embodiments of the temperature control extension to the cooling device of paragraph 164, the thermal diode unit includes a mesh structure, multiple internal holes, attached to the surface of at least one internal wall adjacent to the gap. When the mesh structure, thermal diode unit is positioned for use, it contains a number of internal holes of an average size sufficient to direct liquid to the upper edge of the mesh structure.

  171. Some embodiments of the temperature control extension to the cooling device of paragraph 164 include a thermal diode unit: a bottom wall attached to at least one internal wall at the lower edge when the thermal diode unit is positioned for use Is included.

  172. Some embodiments of the temperature control extension to the cooling device of paragraph 164 include a thermal diode unit: a heat transfer component that is thermally connected to the thermal diode unit, located adjacent to an upper edge of the thermal diode unit Including a heat transfer unit.

  173. In some embodiments of the temperature control extension to the cooling device of paragraph 164, the control unit includes: a transmission device.

  174. In some embodiments of the temperature control extension to the cooling device of paragraph 164, the control unit includes: a battery.

  175. In some embodiments, the temperature control extension to the chiller includes: a thermostatic vessel that includes one or more portions of insulation that substantially define one or more walls of the thermostatic vessel, at least a first Insulating section dividing internal region into storage region and second storage region, first conduit attached to first storage region, second conduit attached to second storage region, venting conduit of cooling device Both a first conduit and a second conduit sized and shaped to be located within a first thermal diode unit sized and shaped to fit within a first storage area of a thermostatic container, The first thermal diode unit thermostat comprising a heat transfer component configured to be located in the first conduit of the thermostat vessel, thermally coupled to the upper edge of the first thermal diode unit Container; Heng A second thermal diode unit sized and shaped to fit within the second storage area of the container, the second thermal diode unit being thermally connected to the upper edge of the second thermal diode unit. A second thermal diode unit including a heat transfer component configured to be located in two conduits; a first control unit including a temperature sensor; a controller responsive to the temperature sensor; and a thermostatic vessel And a fan responsive to a controller attached to the first storage area.

  176. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, are sized and shaped so that the thermostatic container fits within the cooling storage area of the domestic cooling device.

  177. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include one or more portions of insulation: one or more portions of vacuum insulation.

178. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include one or more portions of the insulation: an insulation having an R value of at least 5 ft ² ° F · h / Btu. Contains.

179. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include one or more portions of the insulation: an insulation having an R value of at least 7 ft ² ° F · h / Btu. Contains.

180. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include one or more portions of the insulation: an insulation having an R value of at least 10 ft ² · ° F · h / Btu. Contains.

  181. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include one or more portions of insulation: an access opening adjacent to a first storage area inherent in the container; and an access opening And includes a door configured to be substantially joined to the door.

  182. In some embodiments of the temperature control extension to the cooling device, such as in paragraph 181, the door includes at least one insulation.

  183. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include one or more portions of insulation: an access opening adjacent to a second storage area inherent in the container; and an access opening And includes a door configured to be substantially joined to the door.

  184. In some embodiments of the temperature control extension to the cooling device, such as in paragraph 183, the door includes at least one insulation.

  185. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, are configured to allow one or more portions of the insulation: to allow condensed liquid to flow from inside the container. Including an opening in the lower surface of the container.

  186. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, have one or more portions of insulation: located adjacent to one or more walls of the cooling region in the cooling device. Including an outer surface configured as such.

  187. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, are one in which the walls of the thermostatic vessel are: reversibly joined to one or more internal surfaces of the cooling device. The above outer surface is included.

  188. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, include a structural material wherein the walls of the thermostatic vessel are attached to one or more portions of the insulation.

  189. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, are sized and shaped so that the walls of the thermostatic container fit within the cooling storage area of the cooling device.

  190. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, are configured such that the first thermal diode unit is substantially vertical during use of the first thermal diode unit. At least one internal wall; at least one external wall sized and shaped to match the at least one internal wall, the gap formed between the at least one internal wall and the at least one external wall At least one outer wall having a mesh structure attached to a surface of at least one inner wall adjacent to the gap; forming a liquid impermeable interior; a gas impermeable inner region of the first thermal diode unit surrounding the gap One or more sealing devices between at least one inner wall and at least one outer wall; and less than atmospheric pressure Includes gas pressure within the interior region is gas impermeable.

  191. In some embodiments of the temperature control extension to the cooling device as in paragraph 190, at least one internal wall of the first thermal diode unit is made from a thermally conductive metal.

  192. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 190, have a mesh structure: multiple internal holes, when the thermal diode unit is positioned for use, liquid to the upper edge of the mesh structure It contains a large number of internal holes of an average size sufficient to guide the

  193. In some embodiments of the temperature control extension to the cooling device, such as in paragraph 190, the mesh structure includes: multiple internal holes, multiple internal holes with an average dimension of less than about 100 microns.

  194. Some embodiments of the temperature control extension to the cooling device as in paragraph 190, the mesh structure is attached to the surface of the inner wall by a thermal connection between the mesh structure and most of the surface. Yes.

  195. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 175, are configured such that the second thermal diode unit is: substantially vertical during use of the second thermal diode unit. At least one inner wall; at least one outer wall sized and shaped to fit with at least one inner wall having a gap formed between at least one inner wall and at least one outer wall; A mesh structure attached to the surface of at least one internal wall adjacent to the liquid; liquid in the gap; one or more sealing devices between at least one internal wall and at least one external wall; and less than atmospheric pressure It contains the gas pressure in the interior region that is gas impermeable.

  196. In some embodiments of the temperature control extension to the cooling device as in paragraph 195, at least one internal wall of the second thermal diode unit is made from a thermally conductive metal.

  197. Some embodiments of the temperature control extension to the cooling device, such as in paragraph 195, have a mesh structure: multiple internal holes, liquid to the upper edge of the mesh structure when the thermal diode unit is positioned for use. It contains a large number of internal holes of sufficient average size to guide.

  198. In some embodiments of the temperature control extension to the cooling device, such as in paragraph 195, the mesh structure includes: multiple internal holes, multiple internal holes with an average size of less than about 100 microns.

  199. Some embodiments of the temperature control extension to the cooling device as in paragraph 195, the mesh structure is attached to the surface of the internal wall by a thermal connection between the mesh structure and most of the surface. Yes.

  200. In some embodiments of the temperature control extension to the cooling device as in paragraph 175, the first control unit includes: a transmission unit.

  201. In some embodiments of the temperature control extension to the cooling device as in paragraph 175, the second control unit includes: a transmission unit.

  202. Some embodiments of the temperature control extension to the chiller as in paragraph 175 are: attached to a thermally conductive accessory and a thermally conductive accessory configured to attach to a cooling coil of the chiller A mounting unit that includes a number of heat-transmitting protrusions; and a heat storage unit that includes a liquid-impervious container sized and shaped to fit within the freezer portion of the refrigeration unit; mounted on a heat-conducting accessory It further includes a container including a number of openings configured to receive a number of heat transmissive protrusions.

  203. Some embodiments of a method for forming a temperature control extension to a chiller include obtaining measurements of the inner surface of the chiller; forming a thermostatic vessel from one or more walls formed from insulation. Forming an isothermal vessel that includes an outer surface configured to reversibly join with an inner surface of the cooling device and a heat sealed inner region; forming at least one storage region and at least one phase change material region Installing at least one insulating partition in the heat-sealed inner region; so that when a thermostatic container is installed in the cooling device, heat is directed from the heat-sealed inner region to the inner surface of the cooling device; Installing at least one unidirectional thermal conductor through one or more walls; and sealing the phase change material within the phase change material region.

  204. In some embodiments of the method of forming the temperature control extension to the cooling device of paragraph 203, obtaining the measurement of the inner surface of the device includes: approving product data for the cooling device.

  205. In some embodiments of the method of forming the temperature control extension to the cooling device of paragraph 203, forming the thermostatic vessel includes: sealing one or more walls with a thermally non-conductive material.

  206. In some embodiments of the method of forming the temperature control extension to the cooling device of paragraph 203, the attachment of the at least one insulating partition to the heat sealed interior region is: at least 1 on the interior surface of the one or more walls. Includes sealing two thermal barriers.

  207. In some embodiments of the method of forming a temperature control extension to a cooling device of paragraph 203, the installation of at least one unidirectional thermal conductor includes: referencing product data relating to the cooling device. Yes.

  208. In some embodiments of the method of forming a temperature control extension to the cooling device of paragraph 203, sealing of the phase change material in the phase change material region is: phase in a vessel placed in the phase change material region. Includes sealing change material.

  In some implementations described herein, logic and similar implementations may include computer programs or other control structures. An electronic circuit may have one or more paths of current configured and arranged, for example, to perform various functions described herein. In some implementations, one or more media may be device detectable when such media retains or conveys device detectable instructions that are executable to function as described herein. It can be configured to effect implementation. In some variations, for example, implementation may include existing software or firmware, or gate array or program, such as by receiving or transmitting one or more instructions in relation to one or more operations described herein. Possible hardware updates or changes may be included. Alternatively, or in addition, in some variations, implementations may include dedicated hardware, software, firmware components, and / or general purpose components that would otherwise run the dedicated components. The specification or other implementation may be transmitted by one or more examples of the tangible transmission medium described in this document, optionally transmitted by packet transmission or otherwise through multiple distributed media. The

  Alternatively or additionally, implementation may enable, induce, coordinate, require, or otherwise perform the execution of special purpose instruction sequences, or one or more occurrences of substantially any functional action described herein. If not, it can include triggering the circuit to cause. In some variations, the operable or other logical description of this document can be expressed as source code, compiled, or otherwise invoked as an executable instruction sequence. For example, in some contexts, implementation may be provided in whole or in part by source code, such as C ++, or other code sequences. In other implementations, implementation of source or other code using commercially available techniques and / or techniques in the art is performed by first implementing techniques described in a high-level description language (eg, C or C ++ programming language, The program language implementation is then converted to a logic-synthesizable language implementation, a hardware description language implementation, a hardware design simulation implementation, and / or such a similar form of representation). Can / can be implemented / translated / converted. For example, some or all logical expressions (eg, computer programming language implementations) may be Verilog-type hardware descriptions (eg, hardware description language (HDL) and / or very high speed integrated circuit hardware description language (VHDL)). Or it can appear as other circuit models used to cause physical implementation with hardware (eg, application specific integrated circuits). Those skilled in the art will recognize how, in view of these teachings, obtain, configure, and optimize suitable transmission or computing elements, material supplies, actuators, or other structures. Let's go.

  In embodiments, some portions of the subject matter described herein may be implemented via application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), digital signal processors (DSPs), or other integration schemes. Can be implemented. However, some aspects of the embodiments disclosed herein, in part or in whole, may be implemented as one or more computer programs that operate on one or more computers (eg, one or more that operate on one or more computer systems). As one or more programs that operate on one or more processors (eg, one or more programs that operate on one or more microprocessors), as firmware, or virtually any combination thereof. It can be equally implemented in an integrated circuit, and designing a circuit and / or writing code for software and / or firmware can be well within the skill of one of ordinary skill in the art in view of this disclosure. In addition, aspects of the subject matter described in this document can be provided as program products in a variety of forms, and exemplary embodiments of the subject matter described herein actually do the distribution. This applies regardless of the particular type of signal bearing medium used. Examples of signal bearing media include, but are not limited to: floppy disk, hard disk drive, compact disk (CD), digital video disk (DVD), digital tape, computer memory, etc. Recordable media such as; and digital and / or analog communication media (eg, fiber optic cables, waveguides, wired communication links, wireless communication links (eg, transmitters, receivers, transfer logic, receive capability logic, etc.), etc. ) And other transmission media.

  In a general sense, the various embodiments described herein include a wide range of electrical components, such as hardware, software, firmware, and / or virtually any combination thereof; and rigid bodies, springs or torsion bodies. Individually and / or collectively by various types of electromechanical systems having a wide range of components that can impart mechanical force or motion, such as hydraulics, electromagnetic drives, and / or virtually any combination thereof Can be implemented.

  As a result, an “electromechanical system” as used herein refers to an electrical circuit operably coupled to a transducer (eg, actuator, motor, piezoelectric single crystal, microelectromechanical system (MEMS), etc.), at least An electrical circuit having one separate electrical circuit, an electrical circuit having at least one integrated circuit, an electrical circuit having at least one application specific integrated circuit, a computer program (eg, processes and / or apparatus described herein) A general purpose computer configured by a computer program that at least partially executes a computer, or a microprocessor configured by a computer program that at least partially executes the processes and / or apparatus described herein. Forming electrical circuit An electrical circuit that forms a memory device (eg, a form of memory (eg, random access, flash, read-only, etc.), an electrical circuit that forms a communication device (eg, a modem, a communication switch, an optoelectronic device, etc.), and / or These include any non-electrical analogs such as, but not limited to, optical or other analogs (eg, graphene based circuits). Examples of electromechanical systems include various home appliance systems, medical devices, as well as other systems such as motorized transport systems, factory automation systems, security systems, and / or communication / calculation systems. It is not limited. The electric machine used herein is not necessarily limited to a system having both electric and mechanical operation, unless the background dictates another method.

  In a general sense, the various aspects described herein that may be implemented individually and / or collectively by a wide range of hardware, software, firmware, and / or any combination thereof are described as “electrical circuits”. Can be regarded as consisting of various types of As a result, as used herein, an “electrical circuit” includes an electrical circuit having at least one separate electrical circuit, an electrical circuit having at least one integrated circuit, an electrical circuit having at least one application specific integrated circuit, and a computer program (E.g., a general purpose computer configured with a computer program that at least partially executes the steps and / or apparatus described herein, or a computer that at least partially executes the steps and / or apparatus described herein. An electrical circuit forming a general purpose computer configured by a microprocessor configured by a program, an electrical circuit forming a memory device (eg, a form of memory (eg, random access, flash, read only, etc.), and / or Device (for example, a modem, communications switch, optical-electrical equipment, etc.), but contains the electrical circuitry forming a not limited thereto. The subject matter described in this document may be implemented in analog or electronic fashion or some combination thereof.

  At least a portion of the devices and / or processes described herein may be integrated into the image processing system. A typical image processing system typically includes one or more system unit enclosures, a video display, a memory such as volatile or non-volatile memory, a processor such as a microprocessor or digital signal processor, a computing entity such as an operating system, a driver Application programs, one or more interaction devices (eg touchpads, touch screens, antennas, etc.), feedback loops and motor controls (eg feedback for detection of lens position and / or velocity; desired focus The control system generally includes a motor control for moving / distorting the lens for application). The image processing system may be implemented utilizing suitable commercially available components, such as are typically found in digital still systems and / or digital motion systems.

  At least a portion of the devices and / or processes described herein may be integrated into the data processing system. A data processing system can contain one or more system units, a video display, a memory such as volatile or non-volatile memory, a processor such as a microprocessor or digital signal processor, a computing entity such as an operating system, a driver, a graphical user interface And application programs, one or more interaction devices (eg touchpads, touch screens, antennas, etc.), and / or feedback loops and motor controls (eg feedback for position and / or velocity detection; configuration; A control system is generally included, including motor control for moving and / or adjusting parts and / or quantities. The data processing system may be implemented utilizing suitable commercially available components found generally in data computing / communication and / or network computing / communication systems and the like.

  The components (e.g., workings), devices, objects, and accompanying discussions described herein can be used as examples for conceptual clarity and various shape modifications are envisioned. As a result, the specific examples and accompanying discussion used in this document are intended to be representative of a more general classification. In general, the use of a particular sample is intended to be representative of that classification, and certain components (eg, work), devices, and objects that are not included should not be construed restrictively. .

  The subject matter described in this document sometimes indicates different components contained therein, or different components connected to other different components. It will be appreciated that the structure so depicted is merely exemplary and that many other structures that perform the same functionality can be implemented. In conceptual intent, any arrangement of components that perform the same functionality are effectively “associated” to perform the desired functionality. Thus, any two components combined herein that perform a particular functionality can be recognized as “related” to each other so that the desired functionality is performed, regardless of structure or intermediate components. Similarly, any two related components may also be considered as “operably connected” or “operably linked” to each other to perform the desired functionality and are related. Any two possible components may also be considered “operably connectable” to each other to perform the desired functionality. Particular examples of being able to be operatively coupled are physically joinable and / or physically interacting components, and / or wirelessly interactable and / or wirelessly interacting components, And / or include components that interact logically and / or logically interact with each other.

  In some examples, one or more components may be referred to herein as, for example, “configured (“ configured to ”“ configured by ”“ configurable to ”)”, “being operable (“ operable to operational to ”). "" "" Adapted / adaptable "" "able to" "" conformable to "" can be referred to as ")" "adapted / adaptable" "able to" "conformable to". These terms (e.g., "configured") generally encompass active and / or inactive and / or standby components unless context demands.

  For purposes of this application, “cloud” computing can be understood as described in the cloud computing literature. For example, cloud computing can be a method or system that delivers computer capabilities or storage capabilities as a business. A “cloud” includes one or more clients, applications, platforms, infrastructures, and / or servers, one or more that provide or assist in sending computer or storage capabilities, including but not limited to It may represent hardware and / or software. A cloud may represent one or more hardware and / or software associated with a client, application, platform, infrastructure, and / or server. For example, cloud and cloud computing are one or more computers, processors, storage media, routers, switches, modems, virtual machines (eg, virtual servers), data centers, operating systems, middleware, firmware, hardware backends , Software back end, and / or software application. A cloud may represent a private cloud, a public cloud, a hybrid cloud, and / or a community cloud. A cloud can be a shared pool of configured computing resources that can be public, private, semi-private, distributed, scalable, flexible, temporary, virtual, and / or physical. A cloud or cloud service may be sent over one or more types of networks, such as mobile communication networks and the Internet.

  As used herein, a cloud or cloud service is an infrastructure-as-a-service (“IaaS”), platform-as-a-service (“PaaS”), software-as-a-service (“SaaS”). ), And / or desktop-as-a-service ("DaaS"). As a non-limiting example, an IaaS can be, for example, one or more virtual server instantiations that can start, stop, access, and / or configure virtual servers and / or storage centers (eg, one or more virtual server instantiations). Providing processor, storage space, and / or network resources on demand (eg, EMC and Rackspace). PaaS can include, for example, one or more software and / or development tools provided in the infrastructure (eg, computing platforms and / or solution stacks, eg, Microsoft, where clients can create software interfaces and applications). Azure). SaaS can include, for example, software provided by a service provider and accessible over a network (eg, software for applications and / or data where software applications can be stored on the network, eg, Google Apps). , SalesForce). DaaS may include, for example, providing desktops, applications, data, and / or services to users over a network (eg, multi-application framework, framework applications, application-related data, and / or applications) And / or providing data-related services over the network (e.g., Citrix). The foregoing is intended as exemplary of the types of systems and / or methods referred to herein as “cloud” or “cloud computing” and should be understood as being complete or exhaustive is not.

While specific embodiments of the subject matter described herein have been illustrated and described, modifications and changes can be made without departing from the subject matter described herein and its extended embodiments. Accordingly, the appended claims are to include within their scope all such changes and modifications as fall within the true spirit and scope of the subject matter described herein. In general, the language used herein, particularly in the appended claims (eg, the body of the appended claims), is generally intended to be “open” language (eg, “includes” The word “has” should be interpreted as “including but not limited to” and the word “having” should be interpreted as “at least having”. Yes, the word “including” should be interpreted as “including but not limited to”). In addition, if a specific number of statements in an introduced claim is intended, such intention is expressly stated in the claim and, unless there is such explicit statement, There is no such intention. To assist in understanding, in order to introduce claim recitations in the accompanying claims below,
Introductory expressions such as “at least one” and “one or more” may be used. However, even if the same claim contains the introductory expression “one or more” or “at least one” and an indefinite article such as “a” or “an”, the indefinite article “a” or “ The introduction of a claim statement by “an” should not be construed as including the limitation of a particular claim, including the description of such introduced claim, to a claim containing only one such description. Not (eg, “a” and / or “an” should normally be taken to mean “at least one” or “one or more”). The same is true for the use of definite articles used to introduce claim recitations. Further, even if the specific number of statements introduced in the claims is explicitly stated, such a statement should usually be interpreted to mean at least the stated number ( For example, when only “two descriptions” are described without using a modifier, it usually means that the descriptions include at least two or two or more). Further, when a similar expression format is used for “at least one of A, B, C, etc.”, generally such a sentence structure is not limited, but “A, B, and C A system having at least one of "a system having only A, a system having only B, a system having only C, a system having both A and B, a system having both A and C, and B and C" And / or a system having both A, B, and C. When a similar expression format is used for “at least one of A, B, C, etc.”, generally, such a sentence structure is not limited, but “of A, B, or C "A system having at least one of" includes a system having only A, a system having only B, a system having only C, a system having both A and B, a system having both A and C, and both B and C It is intended to include systems having and / or systems having both A, B and C. Ordinarily, disjunctive language and / or expressions that suggest two or more alternative terms, whether they appear in the specification, claims, or drawings, are consistent with the context. In consideration of the possibility of including one of a plurality of words, the possibility of including one of a plurality of words, or the possibility of including both of a plurality of words It should be understood that there is. For example, the expression “A or B” is generally understood to include the possibility of being “A”, the possibility of being “B”, or the possibility of being “A and B”.

  With respect to the appended claims, the actions recited in the claims may generally be performed in any order. Further, although various operational flows are shown as a series of flows, the various operations may be performed in an order different from the illustrated order, or may be performed simultaneously. Examples of such other orders may include overlapping, alternating, intermittent, reordering, incrementing, preparing, adding, simultaneous, reverse, or various other orders as long as they are consistent with the context. Further, language such as “in response”, “related to”, or other past tense adjectives is not generally intended to exclude such variations unless they conflict with the context.

  All US patents, US patent application publications, US patent applications, foreign patents, foreign patent application publications, and non-patent publications referred to herein are hereby incorporated by reference to the extent they do not conflict with this document.

  While various aspects and embodiments are disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and should not be intended to be limiting, with the true scope and spirit set forth in the following claims.

It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device, and shows the heat transfer in the device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of a thermostat container. It is the schematic of a thermostat container. It is the schematic of a thermostat container. It is the schematic of a thermostat container. It is the schematic of a thermostat container. It is the schematic of a thermostat container. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of a thermostat container. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of a thermal diode apparatus. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device, and shows the heat transfer in the device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device. It is the schematic of the thermostat container and remote communication apparatus in use in a cooling device. It is the schematic of the thermostat container in use in a cooling device.

Claims (25)

A thermostatic container for use in a cooling device,
(1) substantially defines a thermostatic container of a size and shape to fit within the storage area of the cooling device, and (2) an opening on one side of the thermostatic container, and far from the opening One or more portions of thermal insulation forming a storage area inherent in the container; and (1) substantially comprising a tank configured to hold phase change material inherent in the container And (2) the first wall of the tank is adjacent to the opening on one side of the container, and the second wall of the tank is disposed adjacent to the storage area. Thus, a thermostatic container for use in a cooling device comprising two or more walls disposed within one or more portions of the insulation. One or more portions of insulation that substantially define one or more walls of the thermostatic container with an interior region;
A thermally isolated, separated internal region to form a storage region and a phase change material region inherent in the container, and including a conduit between the storage region and the phase change material region; Partition wall;
A thermal control device within the conduit;
An opening within the portion of the insulation substantially defining the container and between the phase change material region inherent in the container and the outer surface of the container;
A unidirectional heat conductor configured to conduct heat in a direction from the phase change material to the outer surface of the container and disposed within the opening; and disposed within the cooling device. A heat dissipating member configured as described above, and a heat transfer unit thermally connected to the unidirectional heat conductor, and a heat distribution unit adjacent to the outer surface of the container. , Constant temperature container for use in cooling devices.   3. The thermal control device within the conduit comprises a temperature sensor; an electronic control device attached to the temperature sensor; and an electronically controlled thermal control unit responsive to the electronic control device. The thermostatic container described.   The thermostatic container according to claim 2, wherein the unidirectional heat conductor includes a heat pipe device.   The thermostatic container according to claim 2, wherein the heat generating unit includes a heat transfer component including a Peltier element thermally connected to the unidirectional heat conductor. One or more portions of thermal insulation that substantially define one or more walls of the thermostatic container with an interior region;
The insulating partition separating the inner region to form a storage region and a phase change material region inherent in the container and including a conduit between the storage region and the phase change material region;
A thermal diode unit located inside the storage area, located inside the conduit;
An opening between the phase change material region inherent in the container and the outer surface of the container and within the portion of the insulation that substantially defines the container;
A unidirectional heat conductor configured to conduct heat in a direction from the phase change material region to the outer surface of the container and disposed within the opening; and disposed within the cooling device. A heat-dissipating member configured to be configured, and a heat transfer component that is thermally connected to the unidirectional heat conductor, and a heat-generating unit adjacent to the outer surface of the container. A thermostatic container for use in a cooling device.   The thermostatic container according to claim 6, wherein the unidirectional heat conductor includes a heat pipe device. The heat transfer component of the heat generating unit includes a thermoelectric unit configured to transmit heat energy away from the unidirectional heat conductor;
A temperature sensor disposed within the storage area;
A photovoltaic unit configured to be disposed outside the cooling device;
An inverse converter attached to the photovoltaic unit;
A sealed battery attached to the inverse converter;
A transmitter attached to the battery; and configured to send an operation signal to the transmitter so as to send an operation signal to the thermoelectric unit in response to an output from the temperature sensor, and the thermoelectric unit The thermostatic container according to claim 6, further comprising the control device attached to the temperature sensor, the sealed battery, and the transmitter.   The temperature control vessel according to claim 6, further comprising the temperature sensor attached to a control device for the cooling device and arranged inside the storage area. At least one internal wall configured to be substantially vertical during use of the thermal diode unit;
At least one external wall sized and shaped to align with the at least one internal wall, with a gap formed between the at least one internal wall and the at least one external wall At least one exterior wall;
A mesh structure attached to the surface of the at least one internal wall adjacent to the gap;
Liquid in the gap;
One or more sealing devices between the at least one inner wall and the at least one outer wall forming a gas impermeable inner region of the thermal diode unit surrounding the gap; And a thermal diode unit configured for use in a thermostatic container with a gas pressure less than atmospheric pressure inside an interior region that is gas impermeable. One or more portions of thermal insulation that substantially define one or more walls of the thermostatic container and have an interior region;
The insulating partition separating the inner region to form a storage region and a phase change material region inherent in the container and including a conduit between the storage region and the phase change material region;
A heat control device inside the conduit;
A first opening, between the phase change material region inherent in the container and the outer surface of the container, in the portion of the insulation that substantially defines the container;
A unidirectional thermal conductor configured to conduct heat in a direction from the phase change material region to the outer surface of the container and disposed within the first opening;
A second opening located between the storage area inside the container and the outer surface of the container and within the portion of the insulation substantially defining the container; and from the storage area to the container For use in a cooling device, configured to conduct heat in a direction to the outer surface, and comprising a second unidirectional heat conductor disposed within the second opening Constant temperature container.   12. The thermal control device in the conduit comprises a temperature sensor; an electronic control device attached to the temperature sensor; and an electronically controlled thermal control unit responsive to the electronic control device. Constant temperature container.   The constant temperature container according to claim 11, wherein the first unidirectional heat conductor includes a heat pipe device.   The constant temperature container according to claim 11, wherein the first unidirectional heat conductor comprises a thermal diode device.   The constant temperature container according to claim 11, wherein the second unidirectional heat conductor includes a heat pipe device.   The constant temperature container according to claim 11, wherein the second unidirectional heat conductor comprises a thermal diode device.   The thermostatic container according to claim 11, further comprising a temperature sensor attached to the thermal control device in the conduit and disposed inside the storage area.   The internal region is separated to form a second storage region inherent in the storage region and a second phase change material region inside the container, and the second storage region and the second phase change. The thermostatic container of claim 11, further comprising a second insulating partition that includes a second conduit between the material regions. A container sized and shaped to fit inside the refrigeration section of the cooling device, the container having an opening having a larger edge dimension than the cross section of the cooling coil of the cooling device; A heat storage unit;
A thermal diode unit of a size and shape compatible with the interior of the refrigeration section of the cooling device, having an upper end configured to be disposed adjacent to the exhaust opening of the cooling device; and a temperature sensor, An additional part of the temperature control to the cooling device, comprising a control device responsive to the temperature sensor and a control unit comprising a fan responsive to the control device. The thermal diode unit is
At least one internal wall configured to be substantially vertical during use of the thermal diode unit;
It has a gap formed between the at least one inner wall and the at least one outer wall, and has an outer surface configured to be disposed inside the refrigeration unit of the cooling device. Said at least one outer wall that is sized and shaped to be compatible with said at least one inner wall, said at least one outer wall;
A mesh structure attached to the surface of the at least one internal wall adjacent to the gap;
A liquid inside the gap;
One or more sealing devices between the at least one inner wall and the at least one outer wall forming a gas impermeable inner region of the thermal diode unit surrounding the gap; 20. An additional part of the temperature control to the cooling device according to claim 19, comprising a gas pressure inside the internal region which is impermeable to gas and less than atmospheric pressure. One or more portions of thermal insulation that substantially define one or more walls of the thermostatic container, thermally dividing the interior region into at least a first storage area and a second storage area of the thermostatic container; A partition that is separated, a first conduit attached to the first storage area, a second conduit attached to the second storage area, the first conduit and the second conduit A thermostatic container, both of which are sized and shaped to be placed inside the venting conduit of the cooling device;
A first thermal diode unit of a size and shape aligned with the interior of the first storage area of the thermostatic container, the first thermal diode unit being connected to an upper end of the first thermal diode unit; A first thermal diode comprising a thermally connected thermostat container heat transfer component, the heat transfer component configured to be disposed within the first conduit of the thermostat vessel Unit thermostat;
A second thermal diode unit sized and shaped to fit within the second storage area of the thermostatic container, wherein the second thermal diode unit is the second thermal diode unit of the second thermal diode unit; A thermostat container heat transfer component thermally connected to the upper end, and a second thermal diode unit thermostat container;
A first control unit comprising a temperature sensor, a control device responsive to the temperature sensor, and a fan responsive to the control device attached to the first storage area of the thermostatic container; and a temperature sensor, Temperature to the cooling device comprising a control device responsive to a temperature sensor and a second control unit comprising a fan responsive to the control device attached to the second storage area of the thermostat vessel Additional part of control. The first thermal diode unit is
At least one internal wall configured to be substantially vertical during use of the first thermal diode unit;
At least one outer wall sized and shaped to match the at least one inner wall having a gap formed between the at least one inner wall and the at least one outer wall;
A mesh structure attached to the surface of the at least one internal wall adjacent to the gap;
A liquid inside the gap;
One or more between the at least one inner wall and the at least one outer wall forming a gas impermeable inner region of the first thermal diode unit surrounding the gap The thermostatic container according to claim 21, comprising a sealing device; and a gas pressure less than atmospheric pressure inside the gas impermeable inner region. A thermally conductive fixture configured for attachment to a cooling coil of the cooling device, and a fixture comprising a plurality of heat transfer protrusions attached to the thermally conductive fixture; and A heat storage unit comprising a container that does not allow liquid to penetrate and is sized and shaped to align with the freezing part of the cooling device, the container being attached to the thermally conductive fixture. 24. The temperature control extension to the cooling device of claim 21, further comprising a heat storage unit, comprising a plurality of openings configured to receive the heat transfer protrusions. Obtaining measurements of the inner surface of the cooling device;
A thermostatic container having an outer surface configured to coincide with the inner surface and the thermally sealed inner region of the cooling device is formed from one or more walls formed from a heat insulating material. about;
Adding at least one insulating partition within the thermally sealed inner region to form at least one storage region and at least one phase change material region;
The one or more walls such that when the thermostatic container is installed inside the cooling device, heat is conducted from the thermally sealed inner region to the inner surface of the cooling device. Disposing at least one unidirectional thermal conductor through the substrate; and encapsulating the phase change material within the phase change material region to form a temperature control extension in the cooling device .   25. The method of claim 24, wherein obtaining the measurement of the internal surface includes accepting manufacturer data regarding the cooling device.

Images