JP2016220470A - Power apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power apparatus capable of positioning a terminal of a power semiconductor element while eliminating the need for a positioning jig, and also capable of positioning a body part of the power semiconductor element.SOLUTION: A power apparatus 100 includes: a mold component 1 placed while facing a reverse side 14 toward the power apparatus 100 body, and a front side 11 toward an electronic circuit board 5, a plurality of recesses 15 provided in the reverse side 14 of the mold component 1, and power semiconductor elements 2 placed in respective recesses 15 and abutting against the housing 4. A terminal 23 of the power semiconductor elements 2 is passed through a first hole 18 penetrating the bottom of the recess 15 and connected electrically with the electronic circuit board 5. A body part 21 of the power semiconductor elements 2 is positioned by the recess 15, and the terminal 23 of the power semiconductor elements 2 is positioned by the first hole 18.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power device using a power semiconductor element.

  In recent years, a hybrid vehicle (HV) driven by both an engine and a battery has been developed. In addition, a plug-in hybrid vehicle (PHV) that directly charges a driving battery from an external power source such as a household power source has been developed. The PHV is equipped with a so-called OBC (On Board Charger) that converts the voltage of the external power source into a voltage for charging the driving battery.

  In general, a power device such as an OBC has a plurality of power semiconductor elements. Since power semiconductor elements generate heat when energized during use, heat is dissipated by fixing individual power semiconductor elements to the casing of a power device.

  When assembling a main part of a conventional power device, first, power semiconductor elements are arranged in a housing. At this time, the power semiconductor elements are positioned by arranging the power semiconductor elements between the comb teeth of the comb-shaped jig, and the individual power semiconductor elements are screwed to the casing in the positioned state. Next, the comb jig is extracted from the power semiconductor element. Next, the terminals of the power semiconductor element are soldered through the through holes of the electronic circuit board.

  In the conventional power equipment, since the power semiconductor element rotates when the screw is fastened, there is a problem that the position of the terminal of the power semiconductor element is shifted from the position of the through hole of the electronic circuit board, resulting in an assembly failure. Further, the power semiconductor element meshes with the comb teeth of the jig due to the rotation of the power semiconductor element, and a strong force is required to extract the jig. For this reason, there is a problem that the momentum of extracting the jig is increased, and the jig contacts the terminal of the power semiconductor element and breaks the terminal.

  On the other hand, in the semiconductor device of Patent Document 1, first, a discrete semiconductor terminal is inserted into a through-hole of a resin member, and the discrete semiconductor and the resin member are fixed to the case in the inserted state. Next, by placing the printed circuit board on the case, the discrete semiconductor terminals are inserted into the mounting holes of the printed circuit board. This makes it possible to easily insert the terminals of the discrete semiconductor into the mounting holes of the printed circuit board while eliminating the need for conventional positioning jigs.

JP 2006-135710 A

  The semiconductor device disclosed in Patent Document 1 has a structure in which individual discrete semiconductors are screwed in a state in which discrete semiconductor terminals are inserted into through holes of a resin member. In this structure, although the discrete semiconductor terminal is positioned by the through hole of the resin member, the discrete semiconductor body is not positioned. For this reason, the rotation of the discrete semiconductor due to the fastening of the screws cannot be sufficiently suppressed, and there has been a problem that the terminal is damaged due to a load applied by the rotation.

  In general, by arranging a plurality of power semiconductor elements close to each other, the space in the housing can be effectively used to reduce the size of the power device. However, if the interval between the power semiconductor elements is too narrow, the power semiconductor elements adjacent to each other are electrically conducted and do not operate as designed. In the structure of Patent Document 1, since the main body of the discrete semiconductor is not positioned, there is a problem that the interval between the discrete semiconductors adjacent to each other becomes unstable due to the rotation of the discrete semiconductor.

  The present invention has been made to solve the above-described problems, and can eliminate the need for a positioning jig, can position terminals of a power semiconductor element, and It aims at providing the electric power equipment which can position a main-body part.

  The power device of the present invention has a mold part in which the back surface is opposed to the casing of the power device body and the surface is opposed to the electronic circuit board, and a plurality of recesses provided on the back surface of the mold component, A power semiconductor element disposed in each recess and abutting against the housing, and the terminals of the power semiconductor element are electrically connected to the electronic circuit board through the first hole that penetrates the bottom of the recess. The power semiconductor element body is positioned by the recess, and the terminals of the power semiconductor element are positioned by the first hole.

  The power device of the present invention eliminates the need for a positioning jig, can position the terminal of the power semiconductor element by the first hole, and the body portion of the power semiconductor element by the recess of the molded part. Can be positioned.

It is a perspective view which shows the state which decomposed | disassembled the principal part of the electric power apparatus which concerns on Embodiment 1 of this invention. It is a perspective view which shows the mold component and power semiconductor device which concern on Embodiment 1 of this invention. It is a top view which shows the state which has arrange | positioned the power semiconductor element to the mold component which concerns on Embodiment 1 of this invention. It is sectional drawing which follows the A-A 'line | wire shown in FIG. It is sectional drawing which shows the other mold components which concern on Embodiment 1 of this invention. It is a top view which shows the state which has arrange | positioned the power semiconductor element to the other mold component which concerns on Embodiment 1 of this invention. It is a perspective view which shows the state which decomposed | disassembled the principal part of the electric power equipment which concerns on Embodiment 2 of this invention. It is a perspective view which shows the mold component and power semiconductor element which concern on Embodiment 2 of this invention.

Embodiment 1 FIG.
FIG. 1 is a perspective view illustrating a state in which a main part of the power device 100 is disassembled. FIG. 2 is a perspective view showing the mold part 1 and the power semiconductor element 2. FIG. 3 is a plan view showing a state in which the power semiconductor element 2 is arranged on the mold part 1. 4 is a cross-sectional view taken along line AA ′ shown in FIG. With reference to FIGS. 1-4, the electric power apparatus 100 of Embodiment 1 is demonstrated.

  In the figure, 1 is a molded part. The molded component 1 is substantially plate-shaped, and a plurality of convex portions 12 are formed on the surface 11. The convex portion 12 is, for example, a snap-fit convex portion that has two substantially semi-cylindrical protrusions that are opposed to each other with a gap therebetween, and that can expand and contract in the radial direction. 1 to 4 show an example in which three convex portions 12 are arranged at the end portion of the mold part 1.

  The mold part 1 has a plurality of second holes 13 therethrough. 1 to 4 show an example in which twelve second holes 13 are provided. As shown in FIG. 4, the second hole 13 has a truncated cone shape that gradually expands from the front surface 11 side to the back surface 14 side of the mold part 1.

  A plurality of recesses 15 are provided on the back surface 14 of the mold part 1. 1 to 4 show an example in which four concave portions 15 are arranged at regular intervals along one side of the mold part 1 and seven concave portions 15 are arranged at regular intervals along the other side facing each other. ing. Three ribs 16 are protruded from the side of each recess 15. At the bottom of each recess 15, one opening 17 is opened and three first holes 18 are formed. As shown in FIG. 4, the first hole portion 18 has a truncated cone shape that gradually expands from the substantially central portion in the height direction of the hole portion toward the surface 11 side of the mold part 1, and the height of the hole portion is high. It has a truncated cone shape that gradually expands from the substantially central portion in the vertical direction toward the back surface 14 side of the molded part 1.

  The power semiconductor element 2 is disposed in each recess 15. The power semiconductor element 2 is, for example, a diode, a transistor, or a MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The main body portion 21 of the power semiconductor element 2 has a threaded hole 22 passing therethrough and communicates with the opening portion 17 in a state assembled to the mold part 1. The power semiconductor element 2 has three terminals 23 and is bent into an L shape.

  Each recess 15 has a quadrangular shape that matches the shape of the main body 21, and has an outer shape slightly larger than that of the main body 21. When the power semiconductor element 2 is pushed into the recess 15, the ribs 16 are crushed so that the main body 21 is held in the recess 15. The interval between the adjacent recesses 15 is set to a value that electrically insulates the power semiconductor element 2. That is, the main body 21 of the power semiconductor element 2 is positioned by the recess 15.

  The first holes 18 are arranged in accordance with the positions of the terminals 23, and the respective terminals 23 are passed through the first holes 18. That is, the terminal 23 of the power semiconductor element 2 is positioned by the first hole 18. The length of the terminal 23 protruding from the surface 11 of the molded part 1 is set to a value smaller than the height of the convex portion 12. An element unit 3 is constituted by the mold component 1 and the power semiconductor element 2.

  The housing 4 has a substantially rectangular parallelepiped box shape, and at least one of the six surfaces is open. A cooling pipe portion 41 that communicates with the outside of the housing 4 is formed inside the housing 4. The cooling pipe portion 41 cools the housing 4 by flowing cooling water through the pipe. The cooling pipe portion 41 is formed with a flat portion 42 facing the opening of the housing 4.

  In the housing 4, an electronic component 43 such as a transformer is accommodated separately from the power semiconductor element 2 disposed in the molded component 1. The electronic component 43 has a plurality of terminals 44 extending toward the opening of the housing 4. 1 to 4 show an example in which two electronic components 43 are accommodated and a total of twelve terminals 44 are provided.

  The element unit 3 is a screw (not shown) that passes through the screw hole 22 of the power semiconductor element 2 and the opening 17 of the mold part 1 in a state where the terminal 44 of the electronic part 43 is passed through the second hole 13 of the mold part 1. It is being fixed to the plane part 42 by. At this time, the back surface 14 of the mold part 1 is fixed to the housing 4 in a state where the back surface 14 faces the housing 4 and the main body 21 of the power semiconductor element 2 is in contact with the flat surface 42. Thereby, heat generated by energization of the power semiconductor element 2 can be radiated to the housing 4. Further, the length of the terminal 44 protruding from the surface 11 of the molded part 1 is set to a value smaller than the height of the convex portion 12.

  The electronic circuit board 5 is disposed so as to face the surface 11 of the molded part 1. The electronic circuit board 5 has a plurality of first through holes 51 arranged in accordance with the positions of the first holes 18. The tip of the terminal 23 of the power semiconductor element 2 is soldered in a state of passing through the first through hole 51. In addition, the electronic circuit board 5 has a plurality of second through holes 52 arranged in accordance with the positions of the second holes 13. The tip of the terminal 44 of the electronic component 43 is soldered in a state where it passes through the second through hole 52.

  A hole 53 and a notch 54 are provided at the end of the electronic circuit board 5. The electronic circuit board 5 is positioned with respect to the element unit 3 by fitting the convex part 12 of the mold part 1 into the hole part 53 or the notch part 54, respectively. In this way, the power device 100 is configured.

  The power device 100 is mounted on, for example, a PHV vehicle. The power device 100 performs the function of converting the voltage of the external power source into the voltage for charging the PHV driving battery using the power semiconductor element 2 and the electronic component 43 mounted on the electronic circuit board 5. . That is, the power device 100 constitutes an OBC.

Next, an assembling method and effects of main parts of the power device 100 will be described.
First, the element unit 3 is assembled by passing the terminal 23 of the power semiconductor element 2 through the first hole 18 of the molded part 1 and pushing the main body 21 into the recess 15. At this time, the first hole portion 18 has a truncated cone shape that gradually expands from the central portion toward the back surface 14 side of the mold component 1, and thus serves as a guide for inviting the terminal 23 of the power semiconductor element 2. As a result, damage such as breakage of the terminal 23 can be prevented. In addition, since the outer shape of the recess 15 is slightly larger than the main body 21, variations in the package size of the power semiconductor element 2 can be absorbed. Further, since the rib 16 in the recess 15 is crushed to hold the power semiconductor element 2, the power semiconductor element 2 is dropped from the recess 15 with the back surface 14 of the mold part 1 vertically downward as shown in FIG. Can be prevented.

  Next, the terminal 44 of the electronic component 43 previously accommodated in the housing 4 is passed through the second hole 13 of the molded component 1. At this time, since the second hole portion 13 has a shape that gradually expands from the front surface 11 side to the back surface 14 side of the mold component 1, it serves as a guide for inviting the terminal 44 of the electronic component 43. As a result, damage such as breakage of the terminal 44 can be prevented.

  Next, the element unit 3 is screwed to the housing 4. At this time, since the terminal 23 of the power semiconductor element 2 is positioned by the first hole 18 and the main body 21 of the power semiconductor element 2 is positioned by the recess 15, the power semiconductor accompanying the fastening of the screw The rotation of the element 2 can be suppressed. As a result, the terminal 23 can be prevented from being damaged by the rotation of the power semiconductor element 2, and the insulation interval between the power semiconductor elements 2 adjacent to each other can be maintained.

  Next, the convex part 12 of the mold part 1 is fitted into the hole 53 and the notch 54 of the electronic circuit board 5, and the terminal 23 of the power semiconductor element 2 is passed through the first through hole 51 of the electronic circuit board 5. The terminal 44 of the electronic component 43 is passed through the second through hole 52. At this time, since the electronic circuit board 5 is positioned with respect to the mold component 1 by the fitting of the convex portion 12, damage such as breakage of the terminals 23 and 44 can be prevented.

  Next, the tips of the terminals 23 and 44 are soldered to the electronic circuit board 5. As a result, the terminals 23 and 44 are electrically connected to the electronic circuit board 5, and the power semiconductor element 2 and the electronic component 43 are mounted on the electronic circuit board 5. At this time, in particular, when the distance between the electronic circuit board 5 and the element unit 3 is small, the molten solder flows down to the surface 11 of the molded part 1 through the terminal 23 of the power semiconductor element 2, and the terminal along the surface 11 is soldered. 23 may be electrically connected. On the other hand, by forming the first hole portion 18 into a truncated cone shape that gradually spreads from the central portion toward the surface 11 of the mold part 1, a solder receiving portion that receives the solder that has flowed down is formed, and the gap between the terminals 23 is intended. It is possible to prevent conduction.

  Note that the power device 100 may be one in which the element unit 3 is screwed to the housing 4 after the electronic circuit board 5 is disposed. The electronic circuit board 5 has a plurality of third through holes 55 arranged in accordance with the positions of the screw holes 22 of the power semiconductor element 2, and screws are fastened to the third through holes 55 through a tool such as a screwdriver. can do. When the electronic circuit board 5 is disposed after the element unit 3 is screwed to the housing 4, the third through hole 55 of the electronic circuit board 5 is not necessary.

  The number of power semiconductor elements 2 is not limited to eleven. Any number of power semiconductor elements 2 may be used depending on the function and performance of the power device 100. Similarly, the number of electronic components 43 is not limited to two, and any number of electronic components 43 may be used. Further, the number of the terminals 44 of the electronic component 43 is not limited to 12, and the number of the second holes 13 is not limited to 12.

  Further, the structure for holding the power semiconductor element 2 in the recess 15 is not limited to the rib 16. For example, instead of the ribs 16, claw portions that are provided on both side portions of the concave portion 15 and hook the terminals 23 of the power semiconductor element 2 may be provided.

  Further, as shown in FIG. 5, the first hole portion 18 does not have to have a truncated cone shape that gradually spreads from the central portion toward the surface 11 of the molded part 1. In particular, when the distance between the electronic circuit board 5 and the element unit 3 is sufficiently large, the possibility that the melted solder flows down to the surface 11 of the molded part 1 is low, and the solder receiving portion is unnecessary. In this case, the shape of the molded part 1 can be simplified and can be molded more easily.

  Moreover, the convex part 12 of the molded component 1 is not limited to a snap-fit shape. Any shape that fits into the hole 53 or the notch 54 may be used. For example, a cylindrical boss may be erected on the surface 11 of the molded part.

  Moreover, the shape of the recessed part 15 should just be a thing which can position the main-body part 21 of the power semiconductor element 2, and is not limited to the shape surrounding the power semiconductor element 2 shown in FIG.2 and FIG.3. For example, as shown in FIG. 6, it may have a shape that contacts only a part of both side portions of the main body portion 21.

  Moreover, the electric power apparatus 100 is not limited to OBC. For example, a step-down / step-down converter that converts a voltage between a driving battery and an auxiliary battery mounted on a vehicle, a so-called SDC (Super Down Converter) may be used. Or the apparatus which integrated OBC and SDC may be sufficient. The power device 100 is not limited to a vehicle-mounted device, and can be used for any device that uses the power semiconductor element 2.

  As described above, the power device 100 according to the first embodiment includes the molded component 1 in which the back surface 14 faces the housing 4 of the power device 100 main body and the front surface 11 faces the electronic circuit board 5. The plurality of recesses 15 provided on the back surface 14 of the mold part 1 and the power semiconductor element 2 disposed in each recess 15 and in contact with the housing 4 are provided. The terminal 23 of the power semiconductor element 2 is passed through the first hole 18 penetrating the bottom of the recess 15 and is electrically connected to the electronic circuit board 5. The terminal 23 of the power semiconductor element 2 can be positioned by the first hole 18, and the main body 21 of the power semiconductor element 2 can be positioned by the recess 15. As a result, it is possible to suppress the rotation of the main body 21 due to the fastening of the screw, prevent the terminal 23 from being damaged, and maintain the insulation interval between the adjacent power semiconductor elements 2.

  Further, the recess 15 is provided with a rib 16 for holding the power semiconductor element 2. Due to the structure in which the rib 16 is crushed and holds the power semiconductor element 2, the outer shape of the recess 15 can be made larger than that of the main body portion 21 to absorb variations in the package size of the power semiconductor element 2. Further, it is possible to prevent the power semiconductor element 2 from falling out of the recess 15 in a state where the back surface 14 of the molded part 1 is vertically downward when the power device 100 is assembled.

  The molded component 1 also has a second hole 13 through which the terminal 44 of the electronic component 43 accommodated in the housing 4 is passed. The terminal 44 of the electronic component 43 can be positioned with higher accuracy by the second hole 13, and damage such as breakage of the terminal 44 can be prevented.

  Further, a convex portion 12 is provided on the surface 11 of the mold part 1. The electronic circuit board 5 is positioned by fitting the convex part 12 into the hole 53 or the notch part 54 provided in the electronic circuit board 5. By positioning the electronic circuit board 5 with respect to the molded part 1, it is possible to prevent damage such as breakage of the terminals 23 and 44.

  The first hole 18 has a truncated cone shape that gradually expands from the center toward the surface 11 side of the mold part 1. By forming the receiving portion of the solder that has flowed down through the terminal 23 of the power semiconductor element 2, it is possible to prevent unintentional conduction between the terminals 23 due to the solder along the surface 11.

Embodiment 2. FIG.
FIG. 7 is a perspective view illustrating a state in which a main part of the power device 100 is disassembled. FIG. 8 is a perspective view showing the mold part 1 and the power semiconductor element 2. With reference to FIG.7 and FIG.8, the electric power apparatus 100 corresponding to the assembly method different from Embodiment 1 is demonstrated. 7 and 8, the same components as those of the power device 100 of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 7, the electronic circuit board 5 has a plurality of third through holes 55 arranged in accordance with the positions of the screw holes 22 of the power semiconductor element 2.

  As shown in FIG. 8, the recess 15 of the molded part 1 does not have the rib 16 shown in FIGS. 1 to 6. Similarly to the example shown in FIG. 5, the first hole 18 of the mold part 1 has only a truncated cone shape that gradually spreads from the center toward the back surface 14 of the mold part 1. It does not have the shape of a truncated cone that gradually expands toward the surface 11 of 1. In this way, the power device 100 is configured.

Next, a method for assembling the main part of the power device 100 will be described.
First, the element unit 3 is assembled by disposing the power semiconductor element 2 in the recess 15 in a state where the back surface 14 of the mold part 1 is vertically upward. At this time, since the back surface 14 faces vertically upward, the power semiconductor element 2 does not fall off from the recess 15 due to its own weight, and a rib in the recess 15 is not necessary.

  Next, with the back surface 14 facing vertically upward, the convex portion 12 of the mold component 1 is fitted into the hole portion 53 and the notch portion 54 of the electronic circuit board 5, and the terminal 23 of the power semiconductor element 2 is connected to the first through hole. Go through 51. In this state, the tip of the terminal 23 is soldered by a so-called “flow method”. At this time, soldering is performed by the flow method with the back surface 14 vertically upward, so that the melted solder does not flow down to the surface 11 of the molded part 1 along the terminals 23. For this reason, the solder receiving part of the 1st hole 18 is unnecessary.

  Next, the member in which the element unit 3 and the electronic circuit board 5 are integrated is turned over, and the terminal 44 of the electronic component 43 previously accommodated in the housing 4 is passed through the second hole 13 and the second through hole 52. Next, the element unit 3 is screwed to the flat portion 42 of the housing 4. At this time, a screw is fastened to the third through hole 55 of the electronic circuit board 5 through a tool such as a screwdriver. Next, the tip of the terminal 44 of the electronic component 43 is soldered to the electronic circuit board 5.

  As described above, the power device 100 according to the second embodiment can correspond to an assembly method in which the element unit 3 and the electronic circuit board 5 are assembled first and attached to the housing 4 later. By arbitrarily selecting either the assembly method of the first embodiment or the assembly method of the second embodiment, the manufacturing facility of the electric power device 100 can be effectively used. Further, the mold part 1 of the second embodiment has a simpler shape than the mold part 1 of the first embodiment, and can be molded more easily.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

  DESCRIPTION OF SYMBOLS 1 Mold component, 2 Power semiconductor element, 3 Element unit, 4 Case, 5 Electronic circuit board, 11 Front surface, 12 Convex part, 13 2nd hole part, 14 Back surface, 15 Concave part, 16 Rib, 17 Opening part, 18 1st hole part, 21 body part, 22 screw hole, 23 terminal, 41 cooling pipe part, 42 plane part, 43 electronic component, 44 terminal, 51 1st through hole, 52 2nd through hole, 53 hole part, 54 cut Notch part, 55 3rd through-hole, 100 electric power equipment.

Claims (8)

A mold component in which the back surface is opposed to the casing of the power device body, and the front surface is opposed to the electronic circuit board;
A plurality of recesses provided on the back surface of the mold part;
A power semiconductor element disposed in each of the recesses and in contact with the housing,
The terminal of the power semiconductor element is passed through a first hole that penetrates the bottom of the recess and is electrically connected to the electronic circuit board,
The main body of the power semiconductor element is positioned by the recess, and the terminal of the power semiconductor element is positioned by the first hole.   The power device according to claim 1, wherein a rib for holding the power semiconductor element is provided in the recess. The mold component has a second hole through which a terminal of an electronic component housed in the housing is passed,
The power device according to claim 1, wherein the terminal of the electronic component is positioned by the second hole. Protruding portions are provided on the surface of the mold component,
The power device according to claim 1, wherein the electronic circuit board is positioned by fitting the convex portion into a hole or a notch provided in the electronic circuit board.   The power device according to claim 1, wherein the recess has a shape surrounding the power semiconductor element.   The power device according to claim 1, wherein the recess has a shape in contact with both side portions of the power semiconductor element.   2. The power device according to claim 1, wherein the first hole portion has a shape that gradually expands from a central portion toward a surface side of the mold part.   The vehicle-mounted charger which is mounted in the vehicle driven with a battery and converts the voltage of an external power supply into the voltage for the charge of the said battery, The any one of Claims 1-7 characterized by the above-mentioned. Power equipment.

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