JP2016219488A - Manufacturing method for information acquisition device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an information acquisition device reducing stress received by each functional substrate laminated and improving manufacturing yield.SOLUTION: A manufacturing method for an information acquisition device 100 comprises elements related to information acquisition on any one of a first substrate and a second substrate and includes the steps of: forming a frame-like first resin band 122 as viewed in a plan view between the first substrate and the second substrate; forming a frame-like second resin band 153 as viewed in a plan view between the second substrate and a third substrate; laminating the first substrate, the second substrate and the third substrate; and applying a load on the substrates and adjusting intervals among individual substrates subsequent to the step of laminating the substrates.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing an information acquisition device.

Conventionally, information acquisition devices that optically measure blood sugar levels and the like are known. In such an information acquisition device, it is important to improve the measurement accuracy by arranging a plurality of functional substrates provided in the inside so as to face each other at a uniform interval.
For example, in Patent Document 1, a transparent member is filled and cured inside a sealing material formed in a frame shape between the sensor substrate and the light shielding substrate among the functional substrates in plan view. Thus, an imaging device in which these substrates are bonded together is described.

JP 2014-49614 A

  However, in the imaging device described in Patent Document 1, it is necessary to apply a certain load to the substrates when the functional substrates are bonded together. For example, after the sensor substrate and the light shielding substrate are bonded to each other with a translucent member, when the light shielding substrate and the illumination substrate are bonded together under a load, the sensor substrate that has already been bonded to the light shielding substrate is caused by the load. Due to the stress, the photoelectric conversion element arranged on the sensor substrate may be damaged or the characteristics may fluctuate, which may reduce the manufacturing yield.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example] An information acquisition device manufacturing method according to this application example is an information acquisition device manufacturing method in which an element related to information acquisition is provided on one of a first substrate and a second substrate. A step of forming a frame-shaped first resin band between the first substrate and the second substrate in a plan view; and a frame-shaped first resin band between the second substrate and the third substrate in a plan view. A step of forming two resin bands, a step of laminating the first substrate, the second substrate, and the third substrate, and a step of adjusting a distance between the substrates by applying a load after the laminating step; , Including.

  According to this method, a resin band is formed between each of the first substrate and the second substrate, and the second substrate and the third substrate, and after laminating the substrates, a load is applied to adjust the distance between the substrates. For this reason, the stress applied to each substrate by the load can be dispersed and suppressed. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the elements related to information acquisition, and to improve the manufacturing yield.

  [Application Example] An information acquisition device manufacturing method according to this application example is an information acquisition device manufacturing method in which an element related to information acquisition is provided on one of a first substrate and a second substrate. A step of forming a frame-shaped first resin band between the first substrate and the second substrate in a plan view; and a frame-shaped first resin band between the second substrate and the third substrate in a plan view. A step of forming two resin bands, a step of laminating the first substrate, the second substrate, and the third substrate, and a step of adjusting a distance between the substrates by applying a load after the laminating step; The method includes a step of bonding the first substrate, the second substrate, and the third substrate after the adjusting step.

  According to this method, since the substrates are bonded together after adjusting the distance between the substrates by applying a load, the stress that each substrate receives by bonding is larger than when the substrates are bonded by applying a load. It can be dispersed and suppressed. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the elements related to information acquisition, and to improve the manufacturing yield.

  In the manufacturing method of the information acquisition device according to the application example, the adhesive is filled in a region surrounded by the first resin band before the bonding step, and the adhesive is cured in the bonding step. It is preferable.

  According to this method, since the adhesive is not yet cured in the step of adjusting the interval between the substrates, the adhesive functions as a buffer material. Therefore, compared to the case where the substrates are bonded after the adhesive is cured, the stress received by each substrate due to the load can be dispersed and suppressed.

  In the method for manufacturing the information acquisition device according to the application example, it is preferable that the first resin band has an opening and includes an outer frame resin band surrounding the first resin band.

  According to this method, for example, a translucent filling material in an amount larger than the inner volume surrounded by the first resin band is applied to the inner side of the first resin band, and the interval between the substrates is adjusted by applying a load. In the process of carrying out, it protrudes intentionally from opening of the 1st resin belt. Therefore, it is possible to reliably fill the filling material in the region surrounded by the first substrate, the second substrate, and the first resin band.

  In the manufacturing method of the information acquisition device according to the application example, the first resin band has an opening, and after the adhesive is filled in the region surrounded by the first resin band from the opening, in the bonding step It is preferable to cure the adhesive.

  According to this method, each substrate is bonded after adjusting the interval between the substrates by applying a load, so that each substrate receives by the load compared to the case where the substrates are bonded after the adhesive is cured. The stress can be dispersed and suppressed. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic fluctuation in each substrate and improve the manufacturing yield.

  In the method for manufacturing an information acquisition device according to the application example, the first resin band includes a first gap material having a first diameter and a first adhesive, and the second resin band includes a first gap It is preferable that a two-diameter second gap material and a second adhesive are included.

  According to this method, the first substrate and the second substrate, and the second substrate and the third substrate can be reliably bonded to each other with a constant interval. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in each substrate and improve the manufacturing yield.

  In the method for manufacturing the information acquisition device according to the application example, it is preferable that the first diameter and the second diameter are different in size.

  According to this method, since the first resin band and the second resin band can be formed with different gaps (thicknesses), between the first substrate and the second substrate and between the second substrate and the third substrate. Can be formed at desired intervals.

  In the method for manufacturing the information acquisition device according to the application example, the second substrate includes a light emitting element.

  According to this method, when the distance between the substrates is adjusted by applying a load, the stress that the light emitting element receives due to the load is dispersed and suppressed, thereby reducing the occurrence of defects such as breakage or characteristic variation in the light emitting element. In addition, the manufacturing yield can be improved.

  In the method for manufacturing the information acquisition device according to the application example, it is preferable that the light emitting element is an organic EL element.

  According to this method, the light emitting elements can be arranged freely and with high definition.

  In the method for manufacturing an information acquisition device according to the application example, the first substrate includes a light receiving element.

  According to this method, when the distance between the substrates is adjusted by applying a load, the stress received by the light receiving element is distributed and suppressed to reduce the occurrence of problems such as breakage or characteristic fluctuation in the light receiving element. In addition, the manufacturing yield can be improved.

  [Application Example] A method for manufacturing an information acquisition device according to this application example is a method for manufacturing an information acquisition device having a light receiving element on a light receiving substrate, and a frame between the protective substrate and the light emitting substrate in plan view. A plan view between the step of forming a first resin band having a shape, the step of forming the first laminated plate by laminating the protective substrate and the light emitting substrate, and the light shielding substrate and the light receiving substrate. Forming a frame-shaped second resin band, a step of laminating the light-shielding substrate and the light-receiving substrate, and a frame-shaped third resin band in plan view between the condensing substrate and the light-shielding substrate. Forming the second laminated plate by laminating the light receiving substrate, the light shielding substrate, and the light collecting substrate in this order; and forming the first laminated plate and the second laminated plate. A step of forming a frame-shaped fourth resin band in a plan view between the light emitting substrate and the light collecting substrate; A step of laminating one laminated plate and the second laminated plate through the fourth resin strip, a step of adjusting a distance between the substrates by applying a load after the step of laminating, and a step of adjusting And a step of bonding the substrates together.

  According to this method, since the substrates are bonded together after adjusting the distance between the substrates by applying a load, the protective substrate and the light emitting substrate are fixed to each other while the stress received by the substrates is dispersed and suppressed. Can be pasted together with an interval of. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the light receiving element, and to improve the manufacturing yield.

  [Application Example] A method for manufacturing an information acquisition device according to this application example is a method for manufacturing an information acquisition device having a light receiving element on a light receiving substrate, and a frame between the protective substrate and the light emitting substrate in plan view. Forming a first resin strip, a step of applying an adhesive to a region surrounded by the first resin strip, and laminating the protective substrate and the light emitting substrate to form a first laminated plate A step of forming a frame-shaped second resin band between the light shielding substrate and the light receiving substrate in a plan view; a step of laminating the light shielding substrate and the light receiving substrate; A step of forming a frame-shaped third resin band between the light shielding substrate and the light shielding substrate, and the light receiving substrate, the light shielding substrate, and the light collecting substrate are laminated in this order to form a second laminated plate. And after forming the first laminated plate and the second laminated plate, the light emitting substrate and the light collecting substrate Further, in a plan view, a step of forming a frame-shaped fourth resin strip, a step of laminating the first laminated plate and the second laminated plate via the fourth resin strip, and a step of laminating And a step of adjusting the distance between the substrates by applying a load, and a step of bonding the substrates after the adjusting step, wherein the adhesive is cured in the bonding step. And

  According to this method, the adhesive is applied to the region surrounded by the first resin band, and the adhesive is cured after adjusting the distance between the substrates by applying a load. That is, in the step of adjusting the distance between the substrates, the adhesive functions as a buffer material because the adhesive is not yet cured. For this reason, the protective substrate and the light emitting substrate are bonded to each other at a predetermined interval while the stress applied to each substrate by the load is dispersed and suppressed as compared to the case where the substrates are bonded after the adhesive is cured. Can do. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in each substrate and improve the manufacturing yield.

  [Application Example] A method for manufacturing an information acquisition device according to this application example is a method for manufacturing an information acquisition device having a light receiving element on a light receiving substrate, and a frame between the protective substrate and the light emitting substrate in plan view. A plan view between the step of forming a first resin band having a shape, the step of forming the first laminated plate by laminating the protective substrate and the light emitting substrate, and the light shielding substrate and the light receiving substrate. Forming a second resin band having a shape; applying an adhesive to a region surrounded by the second resin band; stacking the light-shielding substrate and the light-receiving substrate; A step of forming a frame-shaped third resin band between the light shielding substrate and the light shielding substrate, and the light receiving substrate, the light shielding substrate, and the light collecting substrate are laminated in this order to form a second laminated plate. And after forming the first laminated plate and the second laminated plate, the light emitting substrate and the light collecting substrate Further, in a plan view, a step of forming a frame-shaped fourth resin strip, a step of laminating the first laminated plate and the second laminated plate via the fourth resin strip, and a step of laminating And a step of adjusting the distance between the substrates by applying a load, and a step of bonding the substrates after the adjusting step, wherein the adhesive is cured in the bonding step. And

  According to this method, the adhesive is filled in the region surrounded by the second resin band, and the adhesive is cured after adjusting the distance between the substrates by applying a load. That is, in the step of adjusting the distance between the substrates, the adhesive functions as a buffer material because the adhesive is not yet cured. For this reason, the protective substrate and the light emitting substrate are bonded to each other at a predetermined interval while dispersing and suppressing the stress received by the light receiving element due to the load, compared to the case where the substrates are bonded after the adhesive is cured. Can do. Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the light receiving element, and to improve the manufacturing yield.

  [Application Example] A method for manufacturing an information acquisition device according to this application example is a method for manufacturing an information acquisition device having a light receiving element on a light receiving substrate, and a frame between the protective substrate and the light emitting substrate in plan view. Forming a first resin strip having a shape, a step of applying a first adhesive to a region surrounded by the first resin strip, and laminating the protective substrate and the light emitting substrate to form a first laminated plate Forming a frame-shaped second resin band between the light-shielding substrate and the light-receiving substrate, and applying a second adhesive to a region surrounded by the second resin band. A step of laminating the light shielding substrate and the light receiving substrate, a step of forming a frame-shaped third resin band in a plan view between the light collecting substrate and the light shielding substrate, and the light receiving substrate. And a step of laminating the light shielding substrate and the light collecting substrate in this order to form a second laminated plate, and the first laminated plate, After forming the second laminated plate, a step of forming a frame-shaped fourth resin band in a plan view between the light emitting substrate and the light collecting substrate, and the first laminated plate and the second laminated plate The step of laminating the laminated plate through the fourth resin strip, the step of adjusting the distance between the substrates by applying a load after the step of laminating, and the step of attaching the substrates after the step of adjusting A step of bonding, and in the step of bonding, the first adhesive and the second adhesive are cured.

  According to this method, the first adhesive and the second adhesive are cured after applying a load to adjust the distance between the substrates. That is, in the step of adjusting the distance between the substrates, the adhesive functions as a buffer material because the adhesive is not yet cured. For this reason, the protective substrate and the light emitting substrate are bonded to each other at a predetermined interval while the stress applied to each substrate by the load is dispersed and suppressed as compared to the case where the substrates are bonded after the adhesive is cured. Can do. As a result, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the light receiving element, and to improve the manufacturing yield.

The schematic perspective view which shows the structure of the information acquisition apparatus which concerns on embodiment. The schematic sectional drawing which shows the structure of an information acquisition apparatus. The flowchart of the manufacturing method of an information acquisition apparatus. (A)-(g) Schematic sectional drawing of the information acquisition apparatus for every main process. (H)-(j) The schematic sectional drawing of the information acquisition apparatus for every main process. The functional block diagram of an information acquisition apparatus. The principal part top view of the information acquisition apparatus which concerns on the modification 1. FIG.

  DESCRIPTION OF EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. The embodiment described below shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. In the following figures, the scale of each layer and each part is described on a scale different from the actual scale so that each layer and each part can be recognized on the drawing for easy understanding. There may be.

[Embodiment]
<Configuration of information acquisition device>
FIG. 1 is a schematic perspective view illustrating a configuration of an information acquisition device according to an embodiment. FIG. 2 is a schematic cross-sectional view showing the structure of the information acquisition device. As shown in FIG. 1, the information acquisition device 100 irradiates a human body M (blood vessel) with light, converts reflected light from the human body M (hereinafter referred to as test light RL) into an electrical signal, and converts the blood sugar level. It is a blood glucose level sensor that measures optically. With reference to FIG. 1 and FIG. 2, the information acquisition apparatus 100 of this embodiment is demonstrated.

The information acquisition device 100 includes a protective substrate 110, a light emitting substrate 120, a light collecting substrate 130, a light shielding substrate 140, and a light receiving substrate 150. Each of these substrates is plate-shaped, and a light-shielding substrate 150, a light-shielding substrate 140, a light-collecting substrate 130, a light-emitting substrate 120, and a protective substrate 110 are laminated in this order to form a laminate. Yes.
In the following description, a laminated body in which the protective substrate 110 and the light emitting substrate 120 are laminated is referred to as a first laminated plate 170, and a laminated body in which the light collecting substrate 130, the light shielding substrate 140, and the light receiving substrate 150 are laminated. This is referred to as a laminate 180.

In the present embodiment, the first substrate, the second substrate, and the third substrate of the present invention correspond to the protective substrate 110, the light emitting substrate 120, and the light collecting substrate 130, respectively. In the present embodiment, the element related to information acquisition according to the present invention corresponds to the light emitting element 121 or the light receiving element 152 (see FIG. 2).
In the following description, viewing from the protective substrate 110 side along the stacking direction (thickness direction) of the stack is referred to as a plan view.

(Protective board)
As shown in FIG. 2, the protective substrate 110 is a translucent substrate formed of, for example, glass or plastic. Hereinafter, the light-transmitting substrate refers to a substrate formed of glass, quartz, resin (plastic), or the like, and the light-transmitting property means that at least the transmittance of light emitted from the light emitting substrate 120 at a typical wavelength is 85. % Or more.
In the protective substrate 110, a human body M (for example, a finger) is disposed so as to contact the surface 110a opposite to the light emitting substrate 120.

(Light emitting substrate)
The light emitting substrate 120 includes a light emitting element 121. The light emitting element 121 is formed in a matrix on the surface 120a of the light emitting substrate 120 on the protective substrate 110 side, and emits near-infrared light IL having a wavelength in the range of 700 nm to 2000 nm to the protective substrate 110 side. The human body M arranged on 110a is illuminated uniformly.

  The light emitting element 121 is an organic EL (Electro Luminescence) element, for example, and has a light emitting functional layer sandwiched between an anode and a cathode, although not shown. By using an organic EL element as the light-emitting element 121, the light-emitting element 121 can be freely and precisely arranged on the light-emitting substrate 120.

(First resin strip)
A first resin band 122 is provided between the protective substrate 110 and the light emitting substrate 120. The first resin band 122 is formed in a frame shape in plan view along the outer periphery of the light emitting substrate 120. The first resin strip 122 is formed of an adhesive (resin) including a 10 μm gap material (not shown) in order to keep a uniform distance between the protective substrate 110 and the light emitting substrate 120, that is, approximately 10 μm. Yes.

  The gap material is, for example, a plastic sphere having a uniform particle size for keeping the interval between the substrates arranged across the resin band constant. The gap material included in each resin band may have the same size or may be different for each resin band.

  That is, the gap material is selected in accordance with the interval between the substrates arranged with the resin band interposed therebetween. Specifically, as described above, the first resin band 122 includes a 10 μm (first diameter) gap material (first gap material), and the second resin band 153 described later includes 100 μm. A (second gap) gap material (second gap material) is included.

  A sealing layer 111 is formed in a region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 so that moisture or the like does not enter the light emitting element 121. The sealing layer 111 is formed of a translucent resin, and for example, a thermosetting epoxy resin or an acrylic resin is used.

  The light emitting substrate 120 is disposed to face the protective substrate 110 with the sealing layer 111 interposed therebetween. Note that the light-emitting substrate 120 may have a structure in which the light-emitting element 121 is sealed by the protective substrate 110 without the sealing layer 111 interposed therebetween.

  In order to guide the inspection light RL that reflects inside the illuminated human body M and enters the light emitting substrate 120 to the light collecting substrate 130, a light transmitting portion 123 is formed between the adjacent light emitting elements 121. .

(Condensing substrate)
The condensing substrate 130 includes a translucent substrate 131 and a plurality of condensing lenses 132. The condenser lens 132 is provided on the surface 131 a of the substrate 131 on the light shielding substrate 140 side. The condenser lens 132 can be formed by using a reflow method, an area gradation mask method, a microlens method, a molding method, or the like.

The light emitting substrate 120 and the condensing substrate 130 are bonded so that the optical center P of the condensing lens 132 is positioned on the optical axis of the inspection light RL that passes through the light emitting substrate 120. In other words, the arrangement interval of the light transmitting portions 123 in the light emitting substrate 120 and the arrangement interval of the condensing lenses 132 in the condensing substrate 130 are substantially the same.
The light emitting substrate 120 and the condensing substrate 130 are bonded so that the convex lens surface 132c of the condensing lens 132 faces the light shielding substrate 140 side.

(4th resin strip)
A fourth resin band 133 is provided between the light emitting substrate 120 and the light collecting substrate 130. The fourth resin strip 133 is formed in a frame shape in plan view along the outer periphery of the light collecting substrate 130. The fourth resin band 133 is formed of an adhesive (resin) including a 10 μm gap material (not shown) in order to keep a uniform distance between the light emitting substrate 120 and the light collecting substrate 130, that is, approximately 10 μm. ing.

  The light emitting substrate 120 and the condensing substrate 130 are disposed to face each other with a light transmitting layer 125 formed in a region surrounded by the fourth resin band 133. The translucent layer 125 is a space and is a vacuum layer or an air layer. Note that the region surrounded by the fourth resin band 133 is not limited to a vacuum layer or an air layer, and is filled with a light-transmitting resin having a refractive index similar to that of the light-emitting substrate 120 and the light-condensing substrate 130. May be. As a result, reflection at the interface between the light emitting substrate 120 and the condensing substrate 130 can be reduced, so that stray light hardly occurs.

(Light shielding substrate)
The light shielding substrate 140 includes a light transmitting substrate 141 and a light shielding layer 142 in which pinholes 143 are formed. The light shielding layer 142 is provided on the surface 141 a of the substrate 141 on the light receiving substrate 150 side. The light shielding layer 142 is formed using, for example, a metal film such as a light shielding metal such as Cr or an alloy thereof, or a resin film including a light absorbing material capable of absorbing at least near-infrared light IL.

  A pinhole 143 is formed in the light shielding layer 142 so as to correspond to the light transmitting portion 123 of the light emitting substrate 120, the condensing lens 132 of the light condensing substrate 130, and the light receiving element 152 of the light receiving substrate 150 described later. The light transmitting portion 123, the condensing lens 132, the pinhole 143, and the light receiving element 152 are arranged in a matrix in a plan view.

  The inspection light RL reflected from the human body M passes through the light transmitting portion 123, the condenser lens 132, and the pinhole 143 and enters the light receiving element 152. In other words, the pinhole 143 is arranged so that light other than the inspection light RL is shielded by the light shielding layer 142.

(3rd resin strip)
A third resin band 144 is provided between the light collecting substrate 130 and the light shielding substrate 140. The third resin strip 144 is formed in a frame shape in plan view along the outer periphery of the light shielding substrate 140. The third resin band 144 is formed of an adhesive (resin) including a 10 μm gap material (not shown) in order to keep a uniform distance between the light collecting substrate 130 and the light shielding substrate 140, that is, approximately 10 μm. ing.

  The condensing substrate 130 and the light-shielding substrate 140 are disposed to face each other with a light-transmitting layer 135 formed in a region surrounded by the third resin band 144. The translucent layer 135 is a space and is a vacuum layer or an air layer.

(Light receiving substrate)
The light receiving substrate 150 includes a substrate 151 and a light receiving element 152. As the substrate 151, for example, a glass epoxy substrate or a ceramic substrate on which the light receiving element 152 can be mounted, a semiconductor substrate on which the light receiving element 152 can be directly formed, or the like can be used. The substrate 151 includes an electric circuit (not shown) to which the light receiving element 152 is connected.

  A plurality of light receiving elements 152 are provided on the surface 151 a of the substrate 151 on the light shielding substrate 140 side, and are arranged at positions corresponding to the pinholes 143 of the light shielding substrate 140. The light receiving element 152 is an image sensor for light IL in the near infrared region, and for example, a CMOS sensor or a CCD sensor can be used.

  It is known that the sensitivity of the sensor used as the light receiving element 152 varies depending on the wavelength of light. For example, a CMOS sensor has higher sensitivity to visible light than sensitivity to near-infrared light IL.

  When the CMOS sensor receives not only near-infrared light IL (inspection light RL) but also visible light, it is output as noise from the CMOS sensor. Therefore, for example, a filter that cuts light in the visible light wavelength range (400 nm to 700 nm) may be disposed at a position corresponding to the light transmitting portion 123 of the light emitting substrate 120 and the pinhole 143 of the light shielding substrate 140.

(Second resin band)
A second resin band 153 is provided between the light shielding substrate 140 and the light receiving substrate 150. The second resin band 153 is formed in a frame shape in plan view along the outer periphery of the light receiving substrate 150. The second resin band 153 is formed of an adhesive (resin) including a gap material (not shown) of 100 μm in order to keep a uniform distance between the light shielding substrate 140 and the light receiving substrate 150, that is, approximately 100 μm. Yes.

  The light shielding substrate 140 and the light receiving substrate 150 are disposed to face each other with a light-transmitting adhesive layer 154 formed in a region surrounded by the second resin band 153. The adhesive layer 154 is a liquid resin that forms the optical layer, for example, a thermosetting epoxy resin, and has a thickness of approximately 100 μm.

In the present embodiment, the members constituting each of the light shielding substrates 140 are selected so that the refractive index of the substrate 141 and the refractive index of the adhesive layer 154 are substantially the same. For example, the substrate 141 of the light shielding substrate 140 is a quartz glass substrate (refractive index 1.53), and the adhesive layer 154 is an epoxy resin (refractive index 1.55).
By so doing, interface reflection based on the difference in refractive index can be suppressed at the boundary (interface) between the substrate 141 and the adhesive layer 154.

<Inspection light detection method>
Next, a method for detecting the inspection light RL illustrated by broken lines in FIG. 2 will be described.
As shown in FIG. 2, the optical axis of the inspection light RL coincides with an imaginary line connecting the center P of the condensing lens 132 and the center Q of the pinhole 143, and is parallel to the stacking direction. The inspection light RL passes through the light transmitting portion 123 of the light emitting substrate 120 along the optical axis, is collected by the condenser lens 132 of the light collecting substrate 130, and passes through the pinhole 143 of the light shielding substrate 140. Thereafter, the inspection light RL enters the light receiving element 152 of the light receiving substrate 150.

  The condenser lens 132 is a convex lens, and the inspection light RL collected by the condenser lens 132 forms an image on the light receiving surface of the light receiving element 152. In other words, the light incident on the condenser lens 132 from the protective substrate 110 side travels along the optical axis and enters the light receiving element 152.

  That is, the information acquisition device 100 optically detects information (inspection light RL) from the human body M incident on the condenser lens 132 from the light emitting substrate 120 side by the light receiving element 152, and detects a detected value, for example, a specific wavelength. It is possible to measure with high accuracy by converting the transmittance, absorption rate, and the like in an electric signal.

  With the light shielding substrate 140 and the light receiving substrate 150 facing each other at an interval of approximately 100 μm, the opening size of the pinhole 143 is such that the inspection light RL condensed by the condenser lens 132 can pass through the pinhole 143. It is the smallest dimension.

  As shown in FIG. 2, among the plurality of condenser lenses 132, a condenser lens 132a and a condenser lens 132b adjacent to the condenser lens 132a are arranged. At this time, blood glucose levels such as light traveling from the condensing lens 132b toward the light receiving element 152 corresponding to the condensing lens 132a and light traveling in an oblique direction with respect to the optical axis of the test light RL are measured. Unnecessary light (not shown) becomes detection noise of the light receiving element 152.

  Therefore, unnecessary light is reflected or shielded by the light shielding layer 142 of the light shielding substrate 140, and the incidence to the light receiving element 152 is suppressed. By blocking unnecessary light, the light receiving element 152 can acquire highly accurate information with small detection noise.

  As described above, in order to shield unnecessary light and selectively allow the inspection light RL to be incident on the light receiving element 152, the light shielding substrate 140 and the light receiving substrate 150 are spaced apart from each other by an interval greater than the arrangement pitch of the light receiving elements 152, for example, It is important to dispose them uniformly at intervals of 100 μm or more.

Further, for example, when a region in which the light shielding substrate 140 is disposed obliquely with respect to the light receiving substrate 150 is generated due to warpage of the substrate, the inspection light RL that has passed through the pinhole 143 is incident on the light receiving element 152 in this region. There is a problem that it is not incident sufficiently.
In order to reduce such inconvenience, it is preferable that the interval between the light-shielding substrate 140 and the light-receiving substrate 150 is opposed to each other with an accuracy of ± 5% or less, for example.

<Manufacturing method of information acquisition device>
FIG. 3 is a flowchart showing a method for manufacturing the information acquisition device. FIG. 4A to FIG. 4G and FIG. 5H to FIG. 5J are schematic cross-sectional views of the information acquisition device for each main process. Hereinafter, an outline of a method for manufacturing the information acquisition device 100 according to the present embodiment will be described with reference to FIGS.

  As shown in FIG. 3, the manufacturing method of the information acquisition device 100 according to the present embodiment is a process (step) of forming a frame-shaped first resin band 122 between the protective substrate 110 and the light emitting substrate 120 in a plan view. S1), a step of applying the first adhesive to the region surrounded by the first resin band 122 (step S2), the protective substrate 110 and the light emitting substrate 120 are laminated, and the first laminated plate 170 (FIG. 2). Step) (step S3).

  In addition, the manufacturing method of the information acquisition device 100 according to the present embodiment includes the step of forming the frame-shaped second resin band 153 in a plan view between the light shielding substrate 140 and the light receiving substrate 150 (Step S4), The step of applying the second adhesive to the region surrounded by the two resin bands 153 (step S5), the step of stacking the light shielding substrate 140 and the light receiving substrate 150 (step S6), the light collecting substrate 130 and the light shielding substrate. The step of forming a frame-shaped third resin band 144 (step S7), and the light receiving substrate 150, the light shielding substrate 140, and the light collecting substrate 130 in this order are stacked in this order in the plan view between the second and 140. Forming a laminated plate 180 (see FIG. 2) (step S8).

  Moreover, the manufacturing method of the information acquisition device 100 of the present embodiment includes the step of forming the frame-shaped fourth resin band 133 in a plan view between the light emitting substrate 120 and the light collecting substrate 130 (step S9), A step of laminating the first laminated plate 170 and the second laminated plate 180 via the fourth resin strip 133 (step S10), a step of adjusting the distance between the substrates by applying a load (step S11), and a first A step of curing the adhesive and the second adhesive and bonding the substrates together (step S12).

From the step of forming the first resin strip 122 (step S1) to the step of forming the first laminated plate 170 (step S3) and the step of forming the second resin strip 153 (step S4), the second You may advance in parallel to the process (step S8) which forms the laminated board 180. FIG.
Below, the detail of each process of the manufacturing method of the information acquisition apparatus 100 is demonstrated.

(Step S1) Step of Forming First Resin Belt FIG. 4A is a diagram showing a state after the first resin strip 122 is formed. As shown in FIG. 4A, the UV curable resin 12 is applied in a frame shape in plan view along the outer shape of the light emitting substrate 120 using a dispenser on the light emitting substrate 120 including the light emitting element 121.

  The UV curable resin 12 includes a high viscosity UV curable epoxy resin having a viscosity of approximately 600,000 cP, and a gap material having a size (outer diameter) of 10 μm, for example, dispersed therein. Therefore, even if the UV curable resin 12 is formed to a thickness of 10 μm or more, a change in shape (change in thickness) can be suppressed.

  Specifically, the thickness (length in the stacking direction) of the UV curable resin 12 is approximately 14 μm, pressed in step S11 described later, cured in step S12, and first resin strip 122 having a thickness of approximately 10 μm. It becomes.

(Step S <b> 2) Step of Applying First Adhesive FIG. 4B is a diagram illustrating a state after the adhesive 11 is applied to the region surrounded by the first resin band 122. As shown in FIG. 4B, the thermosetting adhesive 11 is applied to the region surrounded by the first resin band 122 on the light emitting substrate 120 using a dispenser.

  Since the adhesive 11 has a low viscosity, specifically, approximately 300 cP, the adhesive 11 flows and spreads on the surface of the light emitting substrate 120 by the surface tension and the own weight of the adhesive 11. The adhesive 11 is a translucent liquid resin that forms an optical layer, for example, an epoxy resin, is pressed in step S11, is cured in step S12, and becomes a sealing layer 111 having a thickness of approximately 10 μm. .

(Step S3) Step of Forming First Laminate Plate FIG. 4C is a diagram showing a state after the first laminate plate 170 is formed. As shown in FIG. 4C, the protective substrate 110 and the light emitting substrate 120 are laminated to form the first laminated plate 170.
Specifically, the protective substrate 110 is laminated to be opposed to the light emitting substrate 120 via the first resin band 122 so as to cover the light emitting element 121. Thereby, the adhesive 11 is filled between the protective substrate 110 and the light emitting substrate 120.

(Step S4) Step of Forming Second Resin Band FIG. 4D is a diagram showing a state after the second resin band 153 is formed. As shown in FIG. 4D, a UV curable resin is formed on the light receiving substrate 150 including the light receiving element 152 in a frame shape in plan view along the outer shape of the light receiving substrate 150 using a dispenser as in step S1. 12 is applied. The thickness (length in the stacking direction) of the UV curable resin 12 is approximately 140 μm, is pressed in step S11 described later, is cured in step S12, and becomes a second resin band 153 having a thickness of approximately 100 μm.

(Step S <b> 5) Step of Applying Second Adhesive FIG. 4E is a diagram illustrating a state after the adhesive 13 is applied to the region surrounded by the second resin band 153. As shown in FIG. 4E, the thermosetting adhesive 13 is applied to the region surrounded by the second resin band 153 on the light receiving substrate 150 using a dispenser in the same manner as in step S2. Since the adhesive 13 has a low viscosity, specifically, approximately 300 cP, the adhesive 13 flows and spreads on the surface of the light receiving substrate 150 by the surface tension and the own weight of the adhesive 13.

  The adhesive 13 is a translucent liquid resin that forms an optical layer, for example, an epoxy resin, and is pressed in step S11 and cured in step S12 to form an adhesive layer 154 having a thickness of approximately 100 μm. The adhesive 13 may be the same material as the adhesive 11 described above or may be different.

(Step S6) Step of Laminating Light-shielding Substrate and Light-Receiving Substrate FIG. 4F shows a state after the light-shielding substrate 140 and the light-receiving substrate 150 are laminated. As shown in FIG. 4F, the light shielding substrate 140 provided with the pinhole 143 and the light receiving substrate 150 are laminated.
Specifically, the surface of the light shielding substrate 140 on the side of the light shielding layer 142 and the surface 151a of the light receiving substrate 150 on which the light receiving element 152 is provided are arranged to face each other at a predetermined interval, and the light shielding substrate 140 is subjected to vacuum or atmospheric pressure. And the light receiving substrate 150 are stacked via the second resin band 153. As a result, the adhesive 13 is filled between the light shielding substrate 140 and the light receiving substrate 150 that are arranged to face each other.

(Step S7) Step of Forming Third Resin Band FIG. 4G is a diagram showing a state after the third resin band 144 is formed. As shown in FIG. 4G, the UV curable resin 12 is applied on the light shielding substrate 140 in a frame shape in plan view along the outer shape of the light shielding substrate 140 using a dispenser in the same manner as in step S1.

  The thickness (length in the stacking direction) of the UV curable resin 12 is approximately 14 μm, is pressed in step S11 described later, is cured in step S12, and becomes a third resin strip 144 having a thickness of approximately 10 μm.

(Step S8) Step of Forming Second Laminate Plate FIG. 5 (h) is a diagram showing a state after the second laminate plate 180 is formed. As shown in FIG. 5H, the second laminated plate 180 is formed by laminating the light collecting substrate 130 and the light shielding substrate 140 at a predetermined interval. Specifically, the surface 131a of the condensing substrate 130 provided with the condensing lens 132 and the surface 141b opposite to the surface 141a of the light shielding substrate 140 provided with the light shielding layer 142 are under vacuum or atmospheric pressure. They are arranged opposite to each other via the third resin band 144. As a result, the translucent layer 135 is formed in a region surrounded by the light collecting substrate 130, the light shielding substrate 140, and the third resin strip 144.

(Step S9) Step of Forming Fourth Resin Band FIG. 5 (i) is a diagram showing a state after the fourth resin band 133 is formed. As shown in FIG. 5 (i), the UV curable resin 12 is applied on the light collecting substrate 130 in a frame shape in plan view along the outer shape of the light collecting substrate 130 using a dispenser in the same manner as in step S1. .

  The thickness (length in the stacking direction) of the UV curable resin 12 is approximately 14 μm, is pressed in step S11 described later, is cured in step S12, and becomes a fourth resin band 133 having a thickness of approximately 10 μm.

(Step S10) Step of Laminating First Laminate and Second Laminate FIG. 5 (j) is a diagram showing a state after the first laminate 170 and the second laminate 180 are laminated. As shown in FIG. 5 (j), the first laminated plate 170 and the second laminated plate 180 are laminated via the fourth resin band 133.

(Step S11) Step of Adjusting the Interval of Each Substrate While applying a load while reducing the atmosphere, the interval between each substrate (protective substrate 110, light emitting substrate 120, condensing substrate 130, light shielding substrate 140, light receiving substrate 150) is adjusted. adjust. That is, each substrate is pressed and compressed to the size of the gap material included in the UV curable resin 12.

  Specifically, the distance between the protective substrate 110 and the light emitting substrate 120, the distance between the light emitting substrate 120 and the light collecting substrate 130, and the distance between the light collecting substrate 130 and the light shielding substrate 140 are each compressed from 14 μm to 10 μm. The interval between the light shielding substrate 140 and the light receiving substrate 150 is compressed from 140 μm to 100 μm.

(Step S12) A process of bonding the substrates When the atmosphere is changed from the reduced pressure state to the atmospheric pressure, a pressure corresponding to the pressure difference between the pressure in the reduced pressure atmosphere (negative pressure) and the atmospheric pressure acts uniformly. Utilizing this action, the UV curable resin 12 compressed by changing the atmosphere from a reduced pressure state to an atmospheric pressure is cured by irradiating with UV, and the substrates are bonded together.

  That is, the first resin band 122, the second resin band 153, the third resin band 144, and the fourth resin band 133 are formed and adjusted by irradiating the UV curable resin 12 with UV. The interval between the substrates is fixed. Specifically, the distance between the protective substrate 110 and the light emitting substrate 120, the distance between the light emitting substrate 120 and the light collecting substrate 130, and the distance between the light collecting substrate 130 and the light shielding substrate 140 are fixed to 10 μm, respectively. The distance between the light receiving substrate 150 and the light receiving substrate 150 is fixed to 100 μm.

Next, heat treatment is performed to cure the adhesive 11 to form the sealing layer 111, and to cure the adhesive 13 to form the adhesive layer 154. Note that this heat treatment may be omitted and the adhesive 11 and the adhesive 13 may not be cured.
Thus, a laminated body is formed by bonding the substrates, and the information acquisition device 100 is completed.

As described above, according to the method for manufacturing the information acquisition device 100 according to the present embodiment, the following effects can be obtained.
(1) Since a resin band is formed between the substrates and the intervals between the substrates are adjusted by applying a load after laminating the substrates, the stress applied to the substrates by the load can be dispersed and suppressed. . Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the light emitting element 121 and the condenser lens 132 related to information acquisition, and to improve the manufacturing yield.

  (2) The area surrounded by the first resin band 122 is filled with the adhesive 11, the area surrounded by the second resin band 153 is filled with the adhesive 13, and a load is applied to adjust the distance between the substrates. After that, the adhesive 11 and the adhesive 13 are cured. That is, in the step of adjusting the distance between the substrates (step S11), since the adhesive 11 and the adhesive 13 are not yet cured, the adhesive 11 and the adhesive 13 function as a cushioning material.

  Therefore, the protective substrate 110 and the light emitting substrate 120 are bonded at a predetermined interval while dispersing and suppressing the stress applied to each substrate by the load, compared to the case where the substrates are bonded after the adhesive is cured. Can be matched. As a result, it is possible to reduce the occurrence of defects such as breakage or characteristic fluctuation in each substrate and improve the manufacturing yield.

  The first substrate, the second substrate, and the third substrate of the present invention have been described as corresponding to the protective substrate 110, the light emitting substrate 120, and the light collecting substrate 130, respectively, but are not limited thereto. For example, the first substrate, the second substrate, and the third substrate of the present invention may correspond to the light receiving substrate 150, the light shielding substrate 140, and the light collecting substrate 130, respectively.

In this way, resin bands are formed between the light collecting substrate 130 and the light shielding substrate 140 and between the light shielding substrate 140 and the light receiving substrate 150, and after laminating the substrates, a load is applied so that the distance between the substrates is increased. adjust. Therefore, the stress received by each substrate due to the load can be dispersed and suppressed.
Therefore, it is possible to reduce the occurrence of defects such as breakage or characteristic variation in the condenser lens 132, the pinhole 143, and the light receiving element 152 related to information acquisition, and to improve the manufacturing yield.

  In the present embodiment, the adhesive 11 is filled between the protective substrate 110 and the light-emitting substrate 120, and the adhesive 13 is filled between the light-shielding substrate 140 and the light-receiving substrate 150 and cured to cure the information acquisition device 100. Although the method of manufacturing is demonstrated, it is not limited to this. That is, the adhesive 11 is filled between the protective substrate 110 and the light emitting substrate 120, but the adhesive may not be filled between the light shielding substrate 140 and the light receiving substrate 150.

  Further, the adhesive 13 is filled between the light shielding substrate 140 and the light receiving substrate 150, but the adhesive may not be filled between the protective substrate 110 and the light emitting substrate 120. Further, the adhesive may not be filled between the protective substrate 110 and the light emitting substrate 120 and between the light shielding substrate 140 and the light receiving substrate 150.

<Inspection device>
FIG. 6 is a functional block diagram of the inspection apparatus. As illustrated in FIG. 6, the inspection apparatus 160 to which the information acquisition device 100 described above is applied includes, in addition to the information acquisition device 100, a control unit 161, a storage unit 162, an output unit 163, a display unit 164, And a communication unit 165.

  As described above, the information acquisition device 100 includes the light emitting substrate 120 and the light receiving substrate 150. The light emitting substrate 120 and the light receiving substrate 150 are electrically connected to the control unit 161, respectively.

  The controller 161 drives the light emitting substrate 120 to emit near-infrared light IL. The near-infrared light IL propagates and scatters inside the human body M. That is, the inspection device 160 is configured to be able to receive a part of the near-infrared light IL scattered inside the human body M as the inspection light RL by the light receiving substrate 150.

  The control unit 161 causes the storage unit 162 to store information on the inspection light RL received by the light receiving substrate 150. The storage unit 162 may be a removable memory. Further, the control unit 161 causes the output unit 163 to process the information on the inspection light RL. The output unit 163 converts the information of the inspection light RL into blood vessel image information and outputs it, or converts it into information on the content of a specific component in blood, for example, a blood glucose level, and outputs it.

  The control unit 161 causes the display unit 164 to display converted blood vessel image information, information on characteristic components in the blood, etc., information such as a program stored in advance in the storage unit 162, and information such as the current time. It can be displayed on the display unit 164. Further, these pieces of information can be transmitted from the communication unit 165 to another information processing apparatus (not shown).

  The control unit 161 can receive information such as a program from another information processing apparatus via the communication unit 165 and store the information in the storage unit 162. The communication unit 165 may be a wired communication unit that is connected to another information processing apparatus by wire, or may be a wireless communication unit such as Bluetooth (registered trademark).

  For example, a pulse meter, a pulse oximeter, or the like in the medical or health field can be provided as the inspection device 160 equipped with the information acquisition device 100.

  In addition to the blood glucose level sensor, the information acquisition device 100 can also be applied to an image reading device (imaging device) such as an image sensor, an image scanner, a copying machine, a facsimile, or a barcode reader. When applied to an image reading apparatus, it is preferable to use visible light instead of near infrared light as near infrared light IL and inspection light RL.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. An electronic device to which the manufacturing method is applied is also included in the technical scope of the present invention. Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1)
FIG. 7 is a main part plan view of the information acquisition device according to the first modification. As shown in FIG. 7, the information acquisition device 200 includes an outer frame resin band 202 that surrounds the first resin band 122.

  The outer frame resin band 202 is formed so as to be closed in a substantially rectangular frame shape in plan view along the outer periphery of the light emitting substrate 120 (protective substrate 110). The first resin band 122 is disposed inside the outer frame resin band 202, is formed in a substantially square frame shape in plan view, and has an opening 201 in a part thereof.

  Further, a part 14 of the adhesive filled in the region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 intentionally protrudes from the opening 201.

  The opening 201 is provided on the side of the first resin band 122 on the longer side from the outer frame resin band 202 to the first resin band 122. This is because the side where the distance from the outer frame resin band 202 to the first resin band 122 is longer is on the light emitting substrate 120 than the side where the distance from the outer frame resin band 202 to the first resin band 122 is shorter. This is because there is room in the space outside the first resin strip 122.

  Therefore, when the part 14 of the adhesive protrudes from the opening 201, it is difficult to reach the outer frame resin band 202, and it is difficult to protrude outward from the outer frame resin band 202. The length of the opening 201 is 3 mm to 5 mm.

  The opening 201 allows the space surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 to communicate with the outer space. In other words, when the protective substrate 110 and the light emitting substrate 120 are bonded to each other, the opening 201 is filled in a region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 and a part of the adhesive remaining. 14 is a hole for protruding 14 to the outside of the first resin band 122.

  In order to fill the area surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 with the adhesive 11, the adhesive 11 is bonded to the area surrounded by the first resin band 122 on the light emitting substrate 120 using a dispenser. Agent 11 is applied. At that time, an amount of the adhesive 11 larger than the volume of the region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 is applied to the inside of the first resin band 122.

  Thereafter, the adhesive 11 is intentionally protruded from the opening 201 of the first resin strip 122 in the step of adjusting the interval between the substrates by applying a load. In this way, the adhesive 11 can be reliably filled in a region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122.

  In addition, since the outer frame resin band 202 is provided outside the first resin band 122, a part of the adhesive 14 protruding from the opening 201 can be stored inside the outer frame resin band 202. . For this reason, it is possible to reduce problems caused by a part 14 of the adhesive coming into contact with the external connection terminals 203 arranged on the outer side of the outer frame resin band 202, and to improve the manufacturing yield.

(Modification 2)
The opening 201 is not limited to being provided in the first resin band 122 but may be provided in the second resin band 153. In this way, as in the first modification, the region surrounded by the light shielding substrate 140, the light receiving substrate 150, and the second resin band 153 can be reliably filled with an adhesive (not shown).

(Modification 3)
In the above embodiment, when the first resin strip 122 has the opening 201, the functional substrates are stacked and the interval is adjusted, and then the protective substrate 110, the light emitting substrate 120, and the first resin strip 122 are used. It is preferable to cure the adhesive 11 in the step of filling the enclosed region with the adhesive 11 from the opening 201 and then bonding the substrates together.

  In this case, in the step of adjusting the distance between the substrates, the region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122 is not yet filled with the adhesive 11. A space formed in a region surrounded by the protective substrate 110, the light emitting substrate 120, and the first resin band 122, for example, an air layer functions as a buffer material. Therefore, in the step of adjusting the distance between the substrates, the stress received by each substrate can be absorbed and suppressed in this space.

  DESCRIPTION OF SYMBOLS 11 ... Adhesive, 13 ... Adhesive, 100 ... Information acquisition apparatus, 110 ... Protective substrate, 120 ... Light emitting substrate, 121 ... Light emitting element, 122 ... First resin belt, 130 ... Light collecting substrate, 133 ... Fourth resin belt , 140: light shielding substrate, 144: third resin band, 150: light receiving substrate, 152 ... light receiving element, 153: second resin band, 170 ... first laminated plate, 180 ... second laminated plate, 201 ... opening, 202 ... Outer frame resin strip.

Claims (14)

A method of manufacturing an information acquisition device including an element related to information acquisition on one of a first substrate and a second substrate,
Forming a frame-shaped first resin band in a plan view between the first substrate and the second substrate;
Forming a frame-shaped second resin band in a plan view between the second substrate and the third substrate;
Laminating the first substrate, the second substrate and the third substrate;
And a step of adjusting a distance between the substrates by applying a load after the step of laminating. A method of manufacturing an information acquisition device including an element related to information acquisition on one of a first substrate and a second substrate,
Forming a frame-shaped first resin band in a plan view between the first substrate and the second substrate;
Forming a frame-shaped second resin band in a plan view between the second substrate and the third substrate;
Laminating the first substrate, the second substrate and the third substrate;
After the step of laminating, a step of applying a load to adjust the distance between the substrates,
A method for manufacturing an information acquisition device, comprising the step of bonding the first substrate, the second substrate, and the third substrate after the adjusting step.   The information acquisition according to claim 2, wherein an adhesive is filled in a region surrounded by the first resin band before the bonding step, and the adhesive is cured in the bonding step. Device manufacturing method.   The information acquisition device according to any one of claims 1 to 3, wherein the first resin strip has an opening and is provided with an outer frame resin strip surrounding the first resin strip. Manufacturing method.   The first resin strip has an opening, and the adhesive is cured in the bonding step after filling an adhesive into a region surrounded by the first resin strip from the opening. The manufacturing method of the information acquisition apparatus as described in any one of 4 to 4.   The first resin band includes a first gap material having a first diameter and a first adhesive, and the second resin band includes a second gap material having a second diameter and a second adhesive. The method for manufacturing an information acquisition device according to any one of claims 2 to 5, wherein the information acquisition device is included.   The method for manufacturing an information acquisition device according to claim 6, wherein the first diameter and the second diameter are different in size.   The method for manufacturing an information acquisition device according to any one of claims 1 to 7, wherein the second substrate includes a light emitting element.   The method of manufacturing an information acquisition device according to claim 8, wherein the light emitting element is an organic EL element.   The method for manufacturing an information acquisition apparatus according to claim 1, wherein the first substrate includes a light receiving element. A method for manufacturing an information acquisition device including a light receiving element on a light receiving substrate,
Forming a frame-shaped first resin band in a plan view between the protective substrate and the light emitting substrate;
Laminating the protective substrate and the light emitting substrate to form a first laminate;
Forming a frame-shaped second resin band in a plan view between the light shielding substrate and the light receiving substrate;
Laminating the light shielding substrate and the light receiving substrate;
Forming a frame-shaped third resin band in a plan view between the light collecting substrate and the light shielding substrate;
A step of laminating the light receiving substrate, the light shielding substrate, and the light collecting substrate in this order to form a second laminated plate;
Forming a fourth resin band having a frame shape in plan view between the light emitting substrate and the light collecting substrate after forming the first laminated plate and the second laminated plate;
Laminating the first laminate and the second laminate via the fourth resin strip;
After the step of laminating, a step of applying a load to adjust the distance between the substrates,
And a step of bonding the substrates together after the adjusting step. A method for manufacturing an information acquisition device including a light receiving element on a light receiving substrate,
Forming a frame-shaped first resin band in a plan view between the protective substrate and the light emitting substrate;
Applying an adhesive to a region surrounded by the first resin strip;
Laminating the protective substrate and the light emitting substrate to form a first laminate;
Forming a frame-shaped second resin band in a plan view between the light shielding substrate and the light receiving substrate;
Laminating the light shielding substrate and the light receiving substrate;
Forming a frame-shaped third resin band in a plan view between the light collecting substrate and the light shielding substrate;
A step of laminating the light receiving substrate, the light shielding substrate, and the light collecting substrate in this order to form a second laminated plate;
Forming a fourth resin band having a frame shape in plan view between the light emitting substrate and the light collecting substrate after forming the first laminated plate and the second laminated plate;
Laminating the first laminate and the second laminate via the fourth resin strip;
After the step of laminating, a step of applying a load to adjust the distance between the substrates,
After the step of adjusting, the step of bonding the substrates,
In the bonding step, the adhesive is cured, and a method for manufacturing an information acquisition device. A method for manufacturing an information acquisition device including a light receiving element on a light receiving substrate,
Forming a frame-shaped first resin band in a plan view between the protective substrate and the light emitting substrate;
Laminating the protective substrate and the light emitting substrate to form a first laminate;
Forming a frame-shaped second resin band in a plan view between the light shielding substrate and the light receiving substrate;
Applying an adhesive to a region surrounded by the second resin band;
Laminating the light shielding substrate and the light receiving substrate;
Forming a frame-shaped third resin band in a plan view between the light collecting substrate and the light shielding substrate;
A step of laminating the light receiving substrate, the light shielding substrate, and the light collecting substrate in this order to form a second laminated plate;
Forming a fourth resin band having a frame shape in plan view between the light emitting substrate and the light collecting substrate after forming the first laminated plate and the second laminated plate;
Laminating the first laminate and the second laminate via the fourth resin strip;
After the step of laminating, a step of applying a load to adjust the distance between the substrates,
After the step of adjusting, the step of bonding the substrates,
In the bonding step, the adhesive is cured, and a method for manufacturing an information acquisition device. A method for manufacturing an information acquisition device including a light receiving element on a light receiving substrate,
Forming a frame-shaped first resin band in a plan view between the protective substrate and the light emitting substrate;
Applying a first adhesive to a region surrounded by the first resin band;
Laminating the protective substrate and the light emitting substrate to form a first laminate;
Forming a frame-shaped second resin band in a plan view between the light shielding substrate and the light receiving substrate;
Applying a second adhesive to a region surrounded by the second resin band;
Laminating the light shielding substrate and the light receiving substrate;
Forming a frame-shaped third resin band in a plan view between the light collecting substrate and the light shielding substrate;
A step of laminating the light receiving substrate, the light shielding substrate, and the light collecting substrate in this order to form a second laminated plate;
Forming a fourth resin band having a frame shape in plan view between the light emitting substrate and the light collecting substrate after forming the first laminated plate and the second laminated plate;
Laminating the first laminate and the second laminate via the fourth resin strip;
After the step of laminating, a step of applying a load to adjust the distance between the substrates,
After the step of adjusting, the step of bonding the substrates,
In the bonding step, the first adhesive and the second adhesive are cured.

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