JP2016213298A5 - Imaging device - Google Patents

Imaging device Download PDF

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Publication number
JP2016213298A5
JP2016213298A5 JP2015094847A JP2015094847A JP2016213298A5 JP 2016213298 A5 JP2016213298 A5 JP 2016213298A5 JP 2015094847 A JP2015094847 A JP 2015094847A JP 2015094847 A JP2015094847 A JP 2015094847A JP 2016213298 A5 JP2016213298 A5 JP 2016213298A5
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JP
Japan
Prior art keywords
transistor
circuit
photoelectric conversion
conversion element
imaging device
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JP2015094847A
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Japanese (ja)
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JP2016213298A (en
JP6499006B2 (en
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Publication date
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Priority to JP2015094847A priority Critical patent/JP6499006B2/en
Priority claimed from JP2015094847A external-priority patent/JP6499006B2/en
Publication of JP2016213298A publication Critical patent/JP2016213298A/en
Publication of JP2016213298A5 publication Critical patent/JP2016213298A5/en
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Publication of JP6499006B2 publication Critical patent/JP6499006B2/en
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Claims (2)

光電変換素子と、酸化物半導体をチャネル形成領域に有する第1のトランジスタと、を有する画素回路と、
前記画素回路を駆動する駆動回路と、
前記画素回路で得られるアナログ電圧をデジタル値の第1の信号に変換するアナログデジタル変換回路と、
前記第1の信号を処理し、第2の信号に変換する画像処理回路と、を有し、
前記画像処理回路は、記憶回路を有し、
前記記憶回路は、酸化物半導体をチャネル形成領域に有する第2のトランジスタを有し、
前記駆動回路が有する第3のトランジスタと、前記アナログデジタル変換回路とが有する第4のトランジスタとは、シリコンをチャネル形成領域に有し、
前記第1のトランジスタと前記第2のトランジスタとは、前記第3のトランジスタ上及び前記第4のトランジスタ上に位置し、
前記光電変換素子は、前記第1のトランジスタ上と前記第2のトランジスタ上に位置し、
前記光電変換素子は、前記第1のトランジスタと前記第2のトランジスタのそれぞれと重なる、撮像装置。
A pixel circuit including a photoelectric conversion element and a first transistor including an oxide semiconductor in a channel formation region ;
A drive circuit for driving the pixel circuit ;
An analog-to-digital conversion circuit that converts an analog voltage obtained by the pixel circuit into a digital first signal ;
An image processing circuit that processes the first signal and converts it into a second signal ;
The image processing circuit includes a storage circuit,
The memory circuit includes a second transistor including an oxide semiconductor in a channel formation region,
The third transistor included in the driver circuit and the fourth transistor included in the analog-digital conversion circuit include silicon in a channel formation region,
The first transistor and the second transistor are located on the third transistor and the fourth transistor,
The photoelectric conversion element is located on the first transistor and the second transistor,
The imaging device , wherein the photoelectric conversion element overlaps each of the first transistor and the second transistor .
請求項1において、
前記第2のトランジスタと前記光電変換素子との間、前記第2のトランジスタと前記第1のトランジスタとの間にシールド層が設けられる、撮像装置。
In claim 1,
An imaging device, wherein a shield layer is provided between the second transistor and the photoelectric conversion element, and between the second transistor and the first transistor .
JP2015094847A 2015-05-07 2015-05-07 Imaging device Expired - Fee Related JP6499006B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015094847A JP6499006B2 (en) 2015-05-07 2015-05-07 Imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015094847A JP6499006B2 (en) 2015-05-07 2015-05-07 Imaging device

Publications (3)

Publication Number Publication Date
JP2016213298A JP2016213298A (en) 2016-12-15
JP2016213298A5 true JP2016213298A5 (en) 2018-06-21
JP6499006B2 JP6499006B2 (en) 2019-04-10

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Family Applications (1)

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JP2015094847A Expired - Fee Related JP6499006B2 (en) 2015-05-07 2015-05-07 Imaging device

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JP (1) JP6499006B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110100311B (en) * 2016-12-27 2023-06-27 夏普株式会社 Image pickup panel and method for manufacturing the same
WO2019102296A1 (en) * 2017-11-23 2019-05-31 株式会社半導体エネルギー研究所 Imaging device and electronic device
KR20210021463A (en) * 2018-06-21 2021-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging device, operation method thereof, and electronic device
CN113330555A (en) * 2019-01-29 2021-08-31 株式会社半导体能源研究所 Imaging device and electronic apparatus
JP7407416B2 (en) 2019-11-26 2024-01-04 パナソニックIpマネジメント株式会社 Imaging device and camera
JP7377082B2 (en) * 2019-11-29 2023-11-09 株式会社ジャパンディスプレイ Detection device and method for manufacturing the detection device
JPWO2021161134A1 (en) * 2020-02-14 2021-08-19
CN117480611A (en) * 2021-06-17 2024-01-30 株式会社半导体能源研究所 Image pickup device and electronic apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103566A (en) * 2006-10-19 2008-05-01 Toshiba Corp Solid-state image pickup device
JP4891308B2 (en) * 2008-12-17 2012-03-07 キヤノン株式会社 Solid-state imaging device and imaging system using solid-state imaging device
CN104485341A (en) * 2009-11-06 2015-04-01 株式会社半导体能源研究所 Semiconductor device
US9431545B2 (en) * 2011-09-23 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9236408B2 (en) * 2012-04-25 2016-01-12 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor device including photodiode

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