JP2016208435A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a configuration that suppresses intrusion of a foreign substance, unwanted light or noise while making an imaging apparatus thin.SOLUTION: The imaging apparatus comprises: a bending optical system; an imaging flexible board on which an imaging device is mounted; and a main wiring board mounting thereon a card connector to which a memory card for recording a captured image is inserted. In the imaging apparatus, a light-receiving plane of the imaging device and the main board are disposed substantially orthogonally. In the main board, a rear face of the card connector is exposed in a notch and in the card connector, a hole provided on the rear face is exposed from the notch. An overlap part is included through which the imaging device enters the notch. On the flexible board, the card connector and the imaging device are wired and the flexible board is abutted to the card connector, covers the hole of the card connector and is connected with the connector disposed on a rear face of a card connector mounting part.SELECTED DRAWING: Figure 3(c)

Description

  The present invention relates to an imaging device on which a card connector and a flexible wiring board are mounted.

  In recent years, electronic devices have been required to be miniaturized, and there is an imaging apparatus using a bending optical system in which the optical axis of a lens is bent by 90 degrees in order to reduce the thickness. FIG. 6 shows a cross-sectional view of the digital camera when the lens is retracted.

  The exterior is partially omitted. Reference numeral 401 denotes an image sensor, which is mounted on the rigid flex 402. The rigid flex 402 is connected to the main wiring board 403 via the flex portion 402a. A card connector 404 is mounted on the main wiring board 403. A memory card 405 is accommodated in the card connector 404. The lens is composed of a bending optical system.

  In the photographing state, light incident from the first group lens 407 and the second group lens 408 is reflected by the mirror 409. The reflected light is sent to the fourth group lens 410, the fifth group lens 411, and the sixth group lens 412, and reaches the image sensor 402. With such a configuration, the thickness of the optical system is reduced to suppress the overall thickness. Furthermore, in order to reduce the thickness of the imaging device, it is necessary to narrow the space between the main wiring board 403 and the lens groups 410, 411, and 412.

  However, as the width decreases, it becomes difficult to reduce the size because the clearance S between the main wiring board 403 and the image sensor 401 cannot be secured. Further, when the main wiring board 403 is cut out, the bottom surface of the card connector 404 is exposed. Therefore, when the memory card 405 is inserted / removed, there is a possibility that dust may enter from the hole 404a opened in the card connector. When the invading dust adheres to the image sensor 401 and the lens, the foreign matter appears in the photographed image or the image quality deteriorates.

  Examples of methods for preventing the adhesion of foreign substances include the use of an elastic member (Patent Document 1) and the expansion of a flexible wiring board (Patent Document 2).

JP 2008-205723 A JP 2010-154291 A

  However, if the main wiring board 403 is cut away, the memory card contains a memory and an IC, so that noise during writing to the memory card jumps on the imaging signal or light that enters from the outside. There is a concern that light entering the card connector 404 and reflected from the connector leaks into the image sensor 403 and is transferred to the image. In Patent Document 1, no consideration is given to noise. In Patent Document 2, the cost is increased by expanding the flexible wiring.

  In view of the above, an object of the present invention is to provide an imaging apparatus capable of suppressing entry of foreign matter, unnecessary light, and noise while reducing the thickness of the imaging apparatus.

In order to achieve the above object, the present invention provides:
In an imaging apparatus having a bending optical system, an imaging flexible board on which an imaging element is mounted, and a main wiring board on which a card connector into which a memory card for recording a captured image is inserted is mounted, an imaging element light receiving surface and a main The board is arranged substantially orthogonally, the main board has a notch portion where the back surface of the card connector is exposed, and the card connector has a hole provided in the back surface exposed from the notch portion, and the notch portion The flexible board is wired between the card connector and the imaging element, and the flexible board contacts the card connector and covers the card connector hole. The card connector (107) is connected to a connector disposed on the back surface of the mounting portion.

  ADVANTAGE OF THE INVENTION According to this invention, provision of the imaging device which can suppress the penetration | invasion of a foreign material, unnecessary light, and noise can be implement | achieved, reducing the thickness of an imaging device.

1 is an exploded front perspective view of an image pickup apparatus according to the present embodiment. Exploded rear perspective view of the imaging apparatus according to the present embodiment Rear view of the main wiring board 106 according to the present embodiment Connection diagram of main wiring board and imaging rigid flex according to this example Front view of imaging device AA sectional view of an imaging device The enlarged view of the imaging rigid-flex arrangement | positioning part of the AA cross section of an imaging device Layer configuration diagram of imaging rigid flex according to this example Wiring perspective view of imaging rigid flex according to this example Wiring perspective view of imaging rigid flex according to this example Wiring perspective view of imaging rigid flex according to this example Wiring perspective view of imaging rigid flex according to this example Sectional drawing of the imaging device concerning a prior art example

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1A is a front exploded perspective view of an imaging apparatus excluding a part of an exterior of the imaging apparatus having a bending optical system in the present invention, and FIG. 1B is a rear exploded perspective view.

  Reference numeral 101 denotes a lens barrel that holds a lens. A battery box 102 holds a battery. Reference numeral 103 denotes a flash unit that emits light during flash photography. A power button 104 and a release button 105 are arranged on the upper part of the imaging apparatus. A liquid crystal panel 127 is disposed on the back side. A card connector 107 that houses a memory card 118 that stores captured images is mounted on the main wiring board 106. Reference numeral 108 denotes an engine, which is an IC that drives the image pickup apparatus and performs image processing. The captured image is processed in the engine 108 and written to the memory card 118. Reference numeral 109 denotes a main chassis, which holds the main wiring board 106. A lens group is arranged on the back side of the main chassis 109. In order to prevent unnecessary reflection of light, a black coating is applied to the back side of the main chassis 109.

  Reference numeral 110 denotes an imaging rigid flex, on which an imaging element 111 is mounted. The lens barrel 101 has a bending optical system, and the image sensor 111 is arranged orthogonal to the subject. The imaging rigid flex 110 has an imaging element mounting portion 110a which is a rigid portion, and a connector mounting portion 110b on which an inter-board connector plug 112 for connecting to the main wiring board 106 is mounted. The imaging rigid flex 110 includes a flex part 110c that connects the image sensor mounting part 110a and the connector mounting part 110b. The board-to-board connector plug 112 is fitted with the board-to-board connector receptacle 113 mounted on the main wiring board 106. The image signal captured from the image sensor 111 is sent to the engine 108 on the main wiring board 106 via the imaging rigid flex 110. Reference numeral 114 denotes a sensor plate to which the image sensor 111 is bonded. The sensor plate 114 is adjusted so that the light receiving surface of the image sensor 111 is orthogonal to the optical axis by adjusting the fastening method of the three screw stops 115a, 115b, and 115c. Reference numeral 116 denotes a low-pass filter, and reference numeral 117 denotes a sensor rubber bush that suppresses light shielding on the image sensor and entry of foreign matter.

  FIG. 2A shows a rear view of the main wiring board 106. FIG. 2B shows a diagram in which the main wiring board 106 and the imaging rigid flex 110 are connected.

  The main wiring board 106 is provided with a notch 106a in order to prevent interference with the image sensor 111 when assembled. Therefore, the back surface of the card connector 107 is exposed, and the card connector holes 107a and 107b are exposed to the image sensor 111 side. The hole portion 107 a is a relief portion for a contact terminal in the card connector 107, and the hole portion 107 b is a spring relief hole for a spring portion for detecting whether or not writing to the memory card 118 is possible. For this reason, every time the memory card 118 is inserted or removed, there is a possibility that foreign matter adhering to the memory card may enter the lens barrel. Therefore, the hole portions 107a and 107b are closed by rolling the flexible portion 110c of the imaging flexible wiring board 110 toward the card connector 107 side.

  FIG. 3A shows a front view of the imaging apparatus. FIG. 3B is a cross-sectional view taken along the line AA of the imaging apparatus. FIG. 3C is a partially enlarged view showing scooping of the imaging rigid flex of the AA cross section.

  Reference numeral 119 denotes a first group lens, 120 denotes a second group lens, and 121 denotes a mirror prism for bending light incident from the first group lens 119 side by 90 degrees. At the time of shooting, the mirror prism 121 moves to the back side of the second group lens 120 and reflects light to the third group lens 122. Reference numeral 123 denotes a 4-group lens, and 124 denotes a 5-group lens. The fifth group lens 124 is held by a fifth group lens holder 125. The image pickup device 111 is disposed so as to overlap the dimension L in the thickness direction of the substrate at the cutout portion 106 a of the main wiring substrate 106. Thereby, since the main wiring board 106 can be brought close to the imaging element side 111 side, the thickness of the entire imaging apparatus can be reduced.

  An image signal obtained by the image pickup device 111 is sent from the image pickup device mounting portion 110a to the main wiring board 106 through the flexible portion 110c by connection of the inter-board connectors 112 and 113 of the connector mounting portion 110b. The flexible portion 110c that protrudes from the image sensor mounting portion 110a is bent 90 degrees with respect to the image sensor mounting portion 110a, is routed along the main wiring board 106, and is exposed from the main wiring board cutout portion 106a. It contacts the back surface of 107.

  At this time, the holes 107a and 107b provided in the flexible part 110c card connector 107 are closed. Further, due to the waist of the flexible portion 110c, the flexible portion 110c is biased toward the card connector 107, and the degree of adhesion between the flexible portion 110c and the card connector 107 is increased. Thereby, even when the camera body is impacted or when the tilt of the image sensor 111 is adjusted, the flexible portion 110c follows to suppress the intrusion of foreign matter and the invasion of unnecessary rays from the back surface of the card connector 107. it can. In addition, since the length of the imaging rigid flex can be configured to be short, it is less susceptible to noise and the substrate cost can be kept low.

  The substrate size of the image sensor mounting portion 110a on the flexible portion 110c side is minimized, and the outer shape of the image sensor 111 protrudes from the image sensor mounting portion 110a. Thereby, a space for bending the flexible portion 110c can be taken, and disconnection due to a decrease in the curvature R is prevented. An image sensor holder 126 holds the image sensor 111 and the low-pass filter 116. The board-to-board connector mounting part 110c suppresses the side connected to the flexible part of the board-to-board connector mounting part 110c by the 126a of the image sensor holder 126 so that the connector does not come off due to the waist of the flexible part. When the board-to-board connector is fitted, the flexible portion 110c overlaps the main chassis 109 with a dimension D. As a result, unnecessary light and foreign matter are prevented from directly entering the lens placement portion and the image sensor 111 side.

  Reference numeral 111 b denotes an effective pixel area of the image sensor 111. The image sensor 111 does not receive light at the front surface of the light receiving surface but receives light only at a part of the effective pixel region 111b and converts it into an image signal. The placement of the connector for turning the imaging rigid flex 110 and connecting to the main wiring board 106 is overlapped with the outer shape of the imaging element 111 and at the same time, the effective pixel region 111b is used using a non-overlapping region. . Thereby, the imaging rigid flexible board 110 and the main wiring board 106 can be connected without increasing the thickness of the main body. Further, even when the imaging rigid flex 110 is arranged at a position where it appears in the captured image when outputting the image, a necessary image may be cut out by image processing.

  FIG. 4 shows a layer configuration of the imaging rigid flex 110.

  The imaging / imaging rigid flex 110 has a four-layer rigid portion, and includes a first conductor layer L1 to a fourth conductor layer L4. It has a layer structure in which two double-sided flexible wiring boards are bonded together, and conductor layers L1 and L2 are bonded to a base material B12 made of polyimide. A solder resist R1 is applied on the conductor layer L1. A cover lay film C23 made of polyimide is attached to the reverse surface of the conductor layer L2 with a laminated adhesive A2. Similarly, the conductor layers L3 and L4 are affixed to the base material B34, and are further affixed by the coverlay film C23 on the conductor layer L3 side and the laminated adhesive A3, and the solder resist R4 is applied to the conductor layer L4 side. Yes. The inter-board connector plug 112 is mounted on the conductor layer L1 side, and the image sensor 110 is mounted on the conductor layer L4 side. The flexible part is drawn from the second and third layers and connected to the rigid part. The connection between the layers is made through through holes TH1 and TH2.

  The wiring perspective views of the imaging rigid flex 110 are shown in FIGS. 5A to 5D from the first layer to the fourth layer, respectively. Reference numeral 301 denotes a 7-pair differential wiring group. The wiring from the image sensor 110 to the inter-board connector plug 112 is provided. The imaging signal is transferred by differential wiring. The differential wiring uses a pair of differential wirings for one signal. Each pair has an opposite phase signal, and the signal can be detected by looking at the difference. The differential impedance of the differential wiring is controlled to be 100Ω. Since the distance between the ground pattern and the differential signal, the dielectric constant of the substrate, etc. differ depending on the layer to be wired, the ground pattern can be made into a mesh shape with some copper foil removed, or the distance from the ground pattern can be adjusted in the thickness direction Impedance control is performed.

  The portions where the L1 and L4 of the rigid portions 110a and 110b are wired have the adjacent layer as a ground plane. When wiring to L2 and L3 of the rigid parts 110a and 110b, a ground solid is not put in a layer adjacent to the inner layer side, and L1 and L4 are ground solid. When wiring the flexible portion 110c, a ground mesh pattern 302 is placed on the back surface. In this way, the impedance is controlled by the distance from the ground pattern or the density of the mesh pattern.

  Reference numeral 303 denotes a control signal group, to which settings of imaging element parameters, drive modes, clock signals, and the like are wired. Reference numeral 304 denotes a power supply wiring group, which is a wiring for supplying power necessary for driving the image sensor. The differential wiring group 301 and the control signal group 303 are wired so as not to overlap with the card connector holes 107a and 107b.

  The imaging rigid flex 110 has more ground patterns because more ground patterns are more advantageous against noise. Since the L2 ground pattern 305 and the L3 ground pattern 306 of the flexible portion 110c need to be bent at the time of assembly by the flexible portion 110c, the waist of the flexible is reduced by inserting a mesh. However, the ground patterns 307 and 308 in the flexible part 110c have a solid ground without mesh. The ground planes 307 and 308 are respectively provided at positions where the holes 107a and 107b exposed on the back surface of the card connector 107 are closed during assembly.

  When unnecessary light incident from the gap of the battery lid enters through the hole portions 107a and 107b of the card connector 107, it passes through the flexible portion made of polyimide in the mesh state. However, it is possible to prevent transmission by making a solid copper foil. Further, since it is not necessary to perform silk printing or the like for preventing light from being transmitted, the cost is reduced. The ground patterns 307 and 308 are biased in parallel to the card connector 107 during assembly so as not to come to the bent portion. A mesh pattern is formed at a location corresponding to the bent portion. Further, unnecessary radiation from the IC built in the memory card 118 can also be suppressed.

  When the mesh is also inserted into the ground patterns 307 and 308, the mesh pattern is placed with the pitch of the mesh shifted so that the ground pattern with the mesh does not overlap on the front and back of L2 and L3. It is better not to. By doing so, even if a mesh is contained in L2 and L3, it is possible to prevent light from entering by the pattern of either L2 or L3. At this time, the meshes of the ground patterns 307 and 308 are made dense to eliminate gaps between the front and back meshes, and the other ground patterns 305 are made coarse. As a result, the card connector hole portion where the noise easily jumps in can be prevented at the time of assembling and tilt adjustment, and the noise can be prevented from entering by the mesh ground pattern with few gaps.

  In this embodiment, the mesh shape is a square shape, but a circular shape or a rhombus shape may be used. In this embodiment, the imaging rigid flex has a rigid portion and a flex portion, but a flexible wiring board may be used. A rigid board is attached to the place where you want to give rigidity to the board, and a rigid part is formed at the place to be bent, and a flexible part is formed without attaching a reinforcing board, so you can do it with a flexible wiring board without using rigid flexible It is possible.

  As described above, the main board 106 on which the card connector 107 is mounted is cut out, the image pickup device 111 is overlapped with the cutout portion, and the image pickup rigid flexible circuit is wound between the card connector 107 and the image pickup device 111 to thereby store the memory. It is possible to prevent noise from the card and intrusion of unnecessary light and foreign matter from the holes 107a and 107b on the back surface of the card connector. Further, the effect can be enhanced by putting a solid ground at a position corresponding to the card connector hole 107a, 107b in the ground pattern of the flexible portion 110c of the imaging rigid flexible 110.

106 main wiring board, 107 card connector, 109 main chassis,
110 imaging rigid flexible, 111 imaging device, 112 board-to-board connector plug,
113 board-to-board connector receptacle, 118 memory card, 301 differential wiring group,
307,308 Ground pattern

Claims (6)

A main mounted with a bending optical system (101), an imaging flexible substrate (110) on which an imaging element (111) is mounted, and a card connector (107) into which a memory card (118) for recording a captured image is inserted. In an imaging device having a wiring board (106),
The light-receiving surface of the image sensor (111) and the main board are arranged orthogonally, the main board (106) has a notch (106a) and the back side of the card connector (107) is exposed, and the card connector (107) is on the back side. The provided hole portions (107a, 107b) are exposed from the notch portion (106a), and have an overlap portion (L) into which the image sensor (111) enters the notch portion (106a). The flexible substrate (110) is wired between the card connector (107) and the image pickup device (111), and the flexible substrate (111) contacts the card connector (107) and the card connector hole ( 107a and 107b) and connected to the connector (113) disposed on the back surface of the card connector (107) mounting portion. Imaging device, characterized in that. The connector (113) for connecting the imaging flexible wiring board (110) and the main wiring board (106) is disposed so as to overlap the imaging element (111) outer shape in the thickness direction of the imaging device and has an effective pixel area. The imaging apparatus according to claim 1, wherein (111b) is disposed at a position that is avoided. The flexible wiring board (110) has a second hard board part (110b) for connecting the first hard board part (110a) on which the image sensor (111) is mounted and the main wiring board (106). The first hard board part (110a) and the second hard board part (110b) are connected by the flexible board part (110c).
A ground pattern (305, 307, 308) is wired on the flexible board part (110c), and a ground solid is provided at a position corresponding to the card connector hole part (107a, 107b) contacting the card connector (107). The imaging device according to claim 1 or 2, wherein the surface (307, 308) is disposed, and a mesh pattern from which a part of the ground pattern is removed is disposed at other locations. An imaging signal (301), a control signal (303), and a power source (304) of the imaging device are wired to the flexible board portion (110c), and the flexible board portion (110c) is wired to avoid the card connector hole portions (107a and 107b). The imaging apparatus according to any one of claims 1 to 3, wherein the imaging apparatus is characterized. The flexible wiring board (110) has a second hard board part (110b) for connecting the first hard board part (110a) on which the image sensor (111) is mounted and the main wiring board (106). The first hard board part (110a) and the second hard board part (110b) are connected by the flexible board part (110c).
A mesh ground pattern provided with pattern removal is wired on the flexible substrate portion (110c), and a portion of the mesh corresponding to the card connector hole portion (107a, 107b) contacting the card connector (107) is provided. The punching is small, and the mesh pattern of the ground pattern is made large at other locations, and the holes of the mesh are not arranged at the same position on the front and back sides. The imaging device according to claim 4. The main chassis (109) for holding the main wiring board (106) has the second hard board part (110b) and an overlap part (D). The imaging device according to any one of the above.