JP2016206105A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card capable of improving measurement accuracy in measuring an abrasion amount of a needle tip part, and improving reliability.SOLUTION: A probe card includes: a wiring board 10 on a lower surface 10a of which two or more electrode pads 12 are provided; two or more cantilever type probes 2 that have a needle root part 21, an intermediate part 22, a bent part 23 and a needle tip part 24, and in which the needle root part 21 is connected to the electrode pad 12, the intermediate part 22 connects the needle root part 21 and the bent part 23, and the bent part 23 is bent in a direction of separating from the wiring board 10 and then is connected to the needle tip part 24; and a support plate 4 that supports the intermediate part 22 of the probe 2 and is fixed to the wiring board 10. On the lower surface of the support plate 4, a ceramic plate 3 is installed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a probe card. More specifically, a support plate fixed to a wiring board supports two or more cantilever probes, and each probe penetrates two end surfaces of the support plate back to back. Regarding improvements.

  The probe card is an inspection device used for inspecting the electrical characteristics of an electronic circuit formed on a semiconductor wafer, and a number of fine probes that are brought into contact with electrodes on the electronic circuit are provided on a wiring board. The characteristic inspection of the electronic circuit is performed by bringing the semiconductor wafer close to the probe card, bringing the tip of the probe into contact with the electrode on the electronic circuit, and conducting the tester device and the electronic circuit through the probe. This type of characteristic inspection includes, for example, a card holder that holds the probe card with the probe forming surface facing down, a wafer chuck that holds the semiconductor wafer with the circuit forming surface facing up, and moves the wafer chuck up and down. And a prober with a stage to be performed.

  In the cantilever type probe card, two or more probes made of a metal wire are supported by a common support plate. The support plate is fixed to the wiring board, and the probe penetrates from one of the two back-to-back end faces to the other. With such a support plate, each probe is cantilevered, and the positional accuracy of the probe tip and the needle pressure are ensured.

  The probe tip is worn and shortened by repeated use of the probe for characteristic inspection and repeated cleaning for removing oxide films or deposits. If the amount of wear at such a needle tip exceeds a certain range, the support plate may collide with the inspection object during overdrive in characteristic inspection.

  Patent Document 1 discloses a technique for photographing a probe card using a camera attached to a stage and detecting the wear amount of the needle tip portion based on the photographed image. The probe card 3a described in Patent Document 1 is provided with a monitor needle 5a whose tip height is lower than that of the probe needle 4a. The amount of wear of the needle tip is detected by measuring the height of the probe needle tip with reference to the height of the monitor needle tip. Further, the measurement of the tip height is detected based on the focal position of the captured image.

  Further, in Patent Document 2, a wear detection groove 6b for detecting the life is provided at the tip of the probe needle 6a, and the wear amount of the needle tip is detected by the groove cross section appearing on the wear surface of the probe needle 6a. Is disclosed.

JP-A-2005-351807 JP-A-8-37211

  In the conventional inspection system, the wear amount of the needle tip portion is detected by detecting the difference in height between the probe tip portion and the support plate using the photographed image, and the wear amount of the needle tip portion is constant. It is determined whether it is within the range. If this determination result is used, it is possible to prevent the support plate from colliding with the inspection object. However, since the support plate is made of a resin molded body such as an epoxy resin, it is difficult to obtain high smoothness, and it is also difficult to obtain high parallelism with respect to the wiring board. For this reason, the conventional probe card has a problem that the detection value of the height varies greatly depending on where the lower surface of the support plate is measured, and the measurement accuracy of the wear amount is low. Further, by polishing the surface of the resin molded body, the smoothness of the lower surface of the support plate and the parallelism to the wiring board can be increased. However, in the method of increasing the smoothness and parallelism of the lower surface of the support plate by polishing, there is a problem that a hook-like protrusion is formed on the surface of the resin molded body, which becomes an obstacle when performing characteristic inspection.

  In the probe card 3a described in Patent Document 1, the monitor needle 5a must be provided separately from the probe needle 4a used for characteristic inspection. For this reason, the structure of the probe card may be complicated and the manufacturing cost may increase. Further, in the probe card 6 described in Patent Document 2, the wear detection groove 6b must be processed at the tip of the probe needle 6a. For this reason, manufacture of a probe may become complicated and manufacturing cost may increase. In addition, since foreign matters such as scrub scraps enter the wear detecting groove 6b, there is also a problem that the foreign matters are likely to adhere to the needle tip portion.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a probe card that can improve the measurement accuracy when measuring the wear amount of the needle tip portion and has improved reliability. And

  The probe card according to the first aspect of the present invention has a wiring board on which two or more electrode pads are provided on the lower surface, a needle base portion, an intermediate portion, a bent portion, and a needle tip portion, and the needle base portion is the electrode pad. Two or more cantilever-type probes, wherein the intermediate part connects the needle base part and the bent part, and the bent part is bent in a direction away from the wiring board and connected to the needle tip part, A support plate that supports the intermediate portion of the probe and is fixed to the wiring board, and is configured such that a ceramic plate is disposed on a lower surface of the support plate.

  In this probe card, a support plate that supports an intermediate portion of two or more probes penetrates the intermediate portion from one of the two back-to-back end surfaces to the other, whereby the probe tip portion of each probe is positioned at a desired position. Desired needle pressure can be obtained during overdrive. By arranging the ceramic plate on the lower surface of such a support plate, the smoothness of the lower surface of the ceramic plate and the parallelism with respect to the wiring board can be increased as compared with the resin molded body. For this reason, it is possible to improve the measurement accuracy when measuring the wear amount of the needle tip. Further, by covering part or all of the lower surface of the support plate with the ceramic plate, the measurement accuracy of the wear amount can be improved regardless of the surface state of the support plate.

  The probe card according to the second aspect of the present invention is configured such that, in addition to the above configuration, the ceramic plate is a flat plate and is arranged in parallel with the wiring board. According to such a configuration, the smoothness of the lower surface of the ceramic plate and the parallelism to the wiring substrate can be increased without polishing the lower surface of the ceramic plate.

  The probe card according to the third aspect of the present invention is configured such that, in addition to the above configuration, the ceramic plate has an alignment recess or through-hole on the lower surface. According to such a configuration, the height of the ceramic plate can be measured using the recess or the through hole on the lower surface of the ceramic plate as a reference for the measurement position. Therefore, when analyzing the photographed image and automatically determining the height measurement position, it is possible to specify the position of the recess or the periphery of the through hole using a sufficient luminance difference, so the measurement accuracy of the wear amount Can be improved.

  The probe card according to a fourth aspect of the present invention is configured such that, in addition to the above-described configuration, the ceramic plate has a recess on the lower surface, and a bar-shaped alignment pin extending in the vertical direction is disposed in the recess. According to such a configuration, the height of the ceramic plate can be measured using the alignment pin in the recess as a reference for the measurement position. Therefore, when the captured image is analyzed and the height measurement position is automatically determined, the position of the alignment pin can be specified using a sufficient luminance difference, thereby improving the measurement accuracy of the wear amount. be able to.

  In the probe card according to a fifth aspect of the present invention, in addition to the above configuration, the ceramic plate has a lower surface between the tip of the needle tip and the bent portion at a distance in a direction perpendicular to the wiring board. Is installed. According to such a configuration, when measuring the height of the ceramic plate using a camera that shoots the probe card from below, the distance to the ceramic plate is closer than the distance to the bent portion of the probe. When approaching the lower surface of the plate, the camera can be prevented from contacting the probe.

  In the probe card according to the present invention, since the smoothness of the lower surface of the ceramic plate and the parallelism to the wiring substrate are higher than those of the resin molded body, the measurement accuracy when measuring the wear amount of the needle tip portion can be improved. In addition, by using the measurement result of the wear amount, it is possible to suppress the support plate or the ceramic plate from colliding with the object to be inspected, so that the reliability of the probe card can be improved.

It is the figure which showed one structural example of the probe card 1 by embodiment of this invention. It is sectional drawing which showed the cut surface at the time of cut | disconnecting the probe card 1 of FIG. 1 by the AA cutting line. It is explanatory drawing which showed typically the example of a structure of the prober 100 provided with the camera 110 which image | photographs the probe card 1 of FIG. 1 from the downward direction. It is the figure which showed an example of operation | movement of the prober 100 of FIG. It is the figure which showed an example of the picked-up image image | photographed with the camera 110 of FIG.

  Embodiments of the present invention will be described below with reference to the drawings. In this specification, for convenience, the normal direction of the wiring board will be described as the vertical direction, but the posture of the probe card according to the present invention is not limited.

<Probe card 1>
FIG. 1 is a diagram showing a configuration example of a probe card 1 according to an embodiment of the present invention, and shows a cantilever type probe card 1. (A) in the drawing shows the lower surface of the probe card 1, and (b) shows a case where the probe card 1 is viewed from the horizontal direction. FIG. 2 is a cross-sectional view showing a cut surface when the probe card 1 of FIG. 1 is cut along an AA cutting line.

  The probe card 1 includes two or more probes 2, a ceramic plate 3, a support plate 4, a pedestal plate 5, a reinforcing plate 6, and a wiring board 10, and has an opening 7 for alignment. The opening 7 is a substantially rectangular through-hole used for confirming the position of the probe tip when the position of the probe card 1 is aligned with the position of the inspection object, and is formed in the center of the probe card 1. The

  In addition, two probe rows 20 are formed on the probe card 1. The probe row 20 is composed of two or more probes 2 arranged so that the probe tips are positioned on a straight line. One probe row 20 is disposed on the right side of the center of the opening 7 with respect to the paper surface, and the other probe row 20 is disposed on the left side of the center of the opening 7.

  The wiring board 10 is a probe board on which the probe 2 is disposed, and two or more electrode pads 12 for connecting to the probe 2 are provided on the lower surface 10a. The electrode pad 12 is provided for each probe 2.

  The wiring board 10 is a circular printed board held by a prober described later, and two or more external terminals 11 for connection to a tester device (not shown) are provided on the upper surface 10b. The external terminal 11 is disposed on the outer peripheral edge of the wiring board 10. The external terminal 11 and the electrode pad 12 are electrically connected via a wiring pattern, a through hole, or the like. The wiring board 10 is provided with a through hole 13 for arranging the base plate 5. The through hole 13 has a substantially rectangular shape.

  The probe 2 is a cantilever type probe constituted by a metal wire, and includes a needle base portion 21, an intermediate portion 22, a bent portion 23, and a needle tip portion 24. The needle base portion 21 is a fixed portion connected to the electrode pad 12 of the wiring board 10. The intermediate portion 22 is a beam portion that connects the needle base portion 21 and the bent portion 23. The bent portion 23 is bent in a direction away from the wiring substrate 10 and connected to the needle tip portion 24. The needle tip portion 24 is a contact portion that is brought into contact with an inspection object.

  The reinforcing plate 6 is a reinforcing member for reinforcing the wiring board 10. The reinforcing plate 6 is a metal flat plate and is disposed on the upper surface 10 b of the wiring board 10. The reinforcing plate 6 is provided with a through hole 61 constituting the opening 7.

  The base plate 5 is a member for supporting the support plate 4. The pedestal plate 5 is composed of an annular plate member, is disposed in the through hole 13 of the wiring board 10, and is fixed to the reinforcing plate 6. The base plate 5 is attached to the lower surface of the reinforcing plate 6 exposed from the through hole 13 of the wiring board 10. The inner peripheral surface 51 of the base plate 5 constitutes the opening 7. For example, the base plate 5 is formed of a ceramic material.

  The support plate 4 is a common support member that supports the intermediate portion 22 of the two or more probes 2, and is fixed to the wiring board 10. The support plate 4 is annular and is formed of a resin molded body formed on the lower surface of the base plate 5. For example, the support plate 4 is formed of a resin material having electrical insulation properties such as an epoxy resin. Therefore, the support plate 4 is fixed to the wiring board 10 via the base plate 5 and the reinforcing plate 6. The support plate 4 covers the entire lower surface of the base plate 5. Further, the inner end face 4 b of the support plate 4 constitutes the opening 7.

  The intermediate part 22 of each probe 2 penetrates from one of the two back-to-back end faces of the support plate 4 to the other. That is, the intermediate portion 22 of each probe 2 penetrates from the outer end surface 4 a of the support plate 4 to the inner end surface 4 b. Accordingly, a part of the intermediate portion 22 of each probe 2 is covered with the resin molded body.

  When the intermediate portion 22 penetrates the support plate 4 in this manner, each probe 2 is cantilevered by the support plate 4 and the needle tip portion 24 is positioned at a desired position, and a desired needle is used during overdrive. Pressure is obtained. That is, the probe tip 24 of each probe 2 is defined by the support plate 4 in terms of the two-dimensional position in the board surface relative to the wiring board 10 and the height from the board surface.

  The ceramic plate 3 is a plate member disposed on the lower surface of the support plate 4 and is formed of a ceramic material. That is, the ceramic plate 3 is composed of a sintered body obtained by baking and solidifying an inorganic material. Ceramic materials include semiconductors such as silicon and inorganic compounds such as carbides, nitrides or borides. Further, the lower surface 3 a of the ceramic plate 3 is disposed above the tip of the needle tip portion 24.

  The ceramic plate 3 is an annular flat plate and is disposed in parallel with the wiring board 10. The ceramic plate 3 covers the entire lower surface of the support plate 4. The inner end surface 3 b of the ceramic plate 3 constitutes the opening 7. The ceramic plate 3 has a recess 31 on the lower surface 3 a, and a bar-shaped alignment pin 32 extending in the vertical direction is disposed in the recess 31.

  The recess 31 is a bottomed hole that is recessed upward. The alignment pin 32 is a member used as a reference for focusing when measuring the height of the lower surface 3 a of the ceramic plate 3, and is arranged at the center of the recess 31. The alignment pin 32 is made of a material different from the ceramic plate 3, for example, a metal material.

  In this example, four concave portions 31 are provided on the lower surface 3a of the ceramic plate 3, and alignment pins 32 are respectively disposed. The recesses 31 are respectively arranged at the corners of the ceramic plate 3.

  The support plate 4 is formed with a convex portion 41 protruding from the lower surface. The ceramic plate 3 is positioned in the substrate plane by accommodating the convex portion 41 of the support plate 4 in the concave portion 33 formed on the upper surface.

  In this example, four convex portions 41 are formed on the lower surface of the support plate 4 and are respectively accommodated in the concave portions 33 of the ceramic plate 3. Each alignment pin 32 penetrates the ceramic plate 3, the upper end abuts on the convex portion 41 of the support plate 4, and the lower end portion is exposed from the concave portion 33.

  The lower surface 3 a of the ceramic plate 3 is disposed below the bent portion 23 of the probe 2. Each probe 2 belonging to the probe row 20 on the right side of the paper has a right end connected to the electrode pad 12 as a needle base 21 and a left end protruding from the lower surface 3 a of the ceramic plate 3 as a tip of the needle tip 24. On the other hand, each probe 2 belonging to the probe row 20 on the left side of the paper has a left end connected to the electrode pad 12 as a needle base 21 and a right end protruding from the lower surface 3 a of the ceramic plate 3 as a tip of the needle tip 24.

  Here, the vertical distance between the tip of the probe tip 24 of the probe 2 and the lower surface 3a of the ceramic plate 3 is referred to as a protruding height h. The protrusion height h is measured by photographing the probe card 1 using a camera attached to the prober stage and analyzing the photographed image. The amount of wear of the needle tip portion 24 is obtained based on the protrusion height h.

<Prober 100>
FIG. 3 is an explanatory view schematically showing a configuration example of a prober 100 including a camera 110 that photographs the probe card 1 of FIG. 1 from below. FIG. 4 is a diagram showing an example of the operation of the prober 100 of FIG. (A) in the drawing shows a case where the needle tip portion 24 of the probe 2 is photographed using the camera 110, and (b) shows a case where the alignment pin 32 of the ceramic plate 3 is photographed. Yes.

  The prober 100 is an inspection device that connects two or more electrodes on the semiconductor wafer 102 to the probe 2 of the probe card 1 and connects an electronic circuit to a tester device. The prober 100 includes a wafer chuck 101 that holds a semiconductor wafer 102 with a circuit formation surface facing upward, a movable stage 103 that moves the wafer chuck 101 in the vertical direction, the horizontal direction, and the front-rear direction, and the probe card 1. It is comprised with the camera 110 which image | photographs from the downward direction. The camera 110 is attached to the movable stage 103 with the shooting direction facing upward, and moves with the movable stage 103 in the up-down direction, the left-right direction, or the front-rear direction.

  The probe card 1 is held horizontally by the prober 100 with the surface on which the probe 2 is formed facing downward. Further, the prober 100 is provided with a tester head 200 connected to the tester device, and an interface ring 300 that connects the tester head 200 and the probe card 1. The external terminal 11 of the probe card 1 is connected to the tester head 200 via the interface ring 300.

  When performing characteristic inspection on the electronic circuit on the semiconductor wafer 102, the movable stage 103 moves directly below the probe card 1. The probe card 1 is positioned in the horizontal plane by confirming the position of the probe tip 24 of the probe 2 and the position of the electrode on the electronic circuit through the opening 7 of the probe card 1 and the horizontal plane at the tip of the probe tip 24. This is done by matching the position within the electrode to the position of the electrode.

  Further, in order to absorb variations in the height of the needle tip portion 24 or the electrode, a process of bringing the semiconductor wafer 102 closer to the probe card 1 from a state where the probe tip and the electrode start to contact, so-called overdrive, Done by raising.

  When photographing the needle tip portion 24 of the probe 2, the movable stage 103 moves in the horizontal plane to a position where the camera 110 faces the needle tip portion 24. The captured image is acquired in a state where the movable stage 103 is raised to a predetermined position and the camera 110 is brought close to the tip of the needle tip portion 24 ((a) of FIG. 4).

  In addition, the tip height of the needle tip portion 24 is obtained based on the vertical position of the movable stage 103 and the focal length of the camera 110 in a state where the tip surface of the needle tip portion 24 is focused. For example, the vertical distance h 1 from the lower surface of the wiring board 10 to the tip of the needle tip portion 24 is obtained as the tip height of the needle tip portion 24.

  When photographing the alignment pin 32 of the ceramic plate 3, the movable stage 103 moves in the horizontal plane to a position where the camera 110 faces the alignment pin 32. The captured image is acquired in a state where the movable stage 103 is raised to a predetermined position and the camera 110 is brought close to the ceramic plate 3 ((b) of FIG. 4).

  Further, the tip height of the alignment pin 32 is obtained based on the vertical position of the movable stage 103 and the focal length of the camera 110 in a state where the tip surface of the alignment pin 32 is focused. For example, the vertical distance h <b> 2 from the lower surface of the wiring board 10 to the tip of the alignment pin 32 is obtained as the tip height of the alignment pin 32.

  In this probe card 1, concave portions 31 and alignment pins 32 are arranged at four locations on the lower surface 3 a of the ceramic plate 3. When the wear amount of the needle tip portion 24 is obtained, values obtained by averaging the distances h2 for the alignment pins 32 arranged at four locations are used. By such an averaging process, the influence of the warp and inclination of the ceramic plate 3 can be suppressed, and the measurement accuracy of the wear amount is increased.

  The protrusion height h described above is derived by h = (h1−h2). Further, the wear amount of the needle tip portion 24 is obtained from the difference between the measured value of the protrusion height h and the design value. In this prober 100, the wear amount of the needle tip portion 24 is compared with a predetermined determination threshold value to determine whether or not the wear amount of the needle tip portion 24 is within a certain range, and the user is determined according to the determination result. Notification is performed. For example, if the amount of wear exceeds the determination threshold, a user notification is made to notify the user to that effect. Further, the life management of the probe card 1 is performed based on the wear amount of the needle tip portion 24.

  Further, in the prober 100, the needle tip 24 of the probe 2 is photographed and the tip height of the needle tip 24 is obtained from the photographed image, and the alignment pin 32 of the ceramic plate 3 is photographed and the alignment pin 32 is photographed from the photographed image. The processing for obtaining the tip height of the is automatically performed.

  FIG. 5 is a diagram illustrating an example of the captured images 111 and 112 captured by the camera 110 of FIG. (A) in the figure shows a photographed image 111 obtained by photographing the tip end surface 241 of the needle tip 24, and (b) shows a photographed image 112 obtained by photographing the tip end face 32a of the alignment pin 32. Yes.

  In the photographed image 111, a plurality of front end surfaces 241 are arranged on a straight line, and the front end surface 241 is drawn as a high luminance region having higher luminance than the surroundings. That is, since the needle tip portion 24 of the probe 2 is disposed in the opening 7 of the probe card 1, the brightness difference is sufficiently large between the tip surface 241 of the needle tip portion 24 and the background other than the tip surface, High contrast. By utilizing such a luminance difference, the position of the tip of the needle tip can be automatically specified.

  In the photographed image 112, the tip end surface 32a of the alignment pin 32 is drawn as a high luminance region having a higher luminance than the surroundings. That is, since the alignment pin 32 is made of a metal material different from that of the ceramic plate 3, the brightness difference is sufficiently large and the contrast is high between the tip surface 32a and the background other than the tip surface.

  By utilizing such a luminance difference, the position of the tip of the alignment pin can be automatically specified. Further, by providing the alignment pin 32 to increase the contrast of the captured image 112, it is possible to reduce an error when measuring the height of the ceramic plate 3.

  According to the present embodiment, by disposing the ceramic plate 3 on the lower surface of the support plate 4, the smoothness of the ceramic plate lower surface 3 a and the parallelism with respect to the wiring substrate 10 can be improved as compared with the resin molded body. . The smoothness referred to here is flatness or flatness indicating the surface accuracy of the ceramic plate lower surface 3a, and can identify warpage, undulation or unevenness of the lower surface 3a.

  For this reason, the measurement accuracy at the time of measuring the abrasion amount of the needle tip part 24 can be improved. Further, by covering the entire lower surface of the support plate 4 with the ceramic plate 3, the measurement accuracy of the wear amount can be improved regardless of the height measurement position and regardless of the surface state of the support plate 4.

  Further, since the ceramic plate 3 is a flat plate, the smoothness of the ceramic plate lower surface 3a and the parallelism to the wiring board 10 can be increased without polishing the lower surface 3a of the ceramic plate 3. Further, the height of the ceramic plate 3 can be measured using the alignment pin 32 in the recess 31 as a reference for the measurement position. Therefore, when the photographed image 112 is analyzed and the height measurement position is automatically determined, the position of the alignment pin 32 can be specified using a sufficient luminance difference. Can be improved.

  For example, if a part of the lower surface of the support plate 4 is exposed, it is an obstacle to specify the height measurement position by analyzing the captured image due to the influence of shading due to the unevenness of the surface of the support plate 4. On the other hand, in the probe card 1 according to the present embodiment, since the ceramic plate 3 covers the entire lower surface of the support plate 4, the height measurement position is accurately specified, and the wear amount measurement accuracy is high.

  The reference surface to be compared with the tip of the needle tip 24 at the time of height measurement is formed by the ceramic plate 3 that is smooth and parallel to the wiring board 10. With such a configuration, the accuracy of measurement of the wear amount can be remarkably improved as compared with the prior art, and the reference surface can be prevented from colliding with the inspection object. In addition to this, by further providing an alignment pin or a recess in the ceramic plate 3 serving as a reference surface, one point in the reference surface can be clearly defined as an object to be photographed, so that the measurement accuracy can be further improved. it can.

  Further, when the height of the ceramic plate 3 is measured using the camera 110 that captures the probe card 1 from below, the distance to the ceramic plate 3 is closer than the distance to the bent portion 23 of the probe 2. It is possible to prevent the camera 110 from contacting the probe 2 when approaching the lower surface 3 a of the ceramic plate 3.

  In the present embodiment, an example in which the ceramic plate 3 is a flat plate has been described. However, the present invention does not limit the configuration of the ceramic plate 3 to this. For example, even if the ceramic plate 3 is not a flat plate but warps, swells, or has unevenness on the upper surface of the ceramic plate 3, the lower surface 3a of the ceramic plate 3 is flat when attached to the support plate 4, and What is necessary is just to be parallel to the wiring board 10. Further, if the lower surface 3a of the ceramic plate 3 is warped, wavy or uneven, the lower surface 3a may be processed flat by surface polishing and processed parallel to the wiring board 10. .

  In the present embodiment, an example in which the recess 31 and the alignment pin 32 are provided on the lower surface 3a of the ceramic plate 3 has been described. However, in the present invention, the ceramic plate 3 has the recess 31 and the alignment pin 32. It can also be applied to a probe card 1 that does not. When the lower surface 3a of the ceramic plate 3 is flat and has neither the concave portion 31 nor the alignment pin 32, the height of the ceramic plate 3 is measured with the position in the horizontal plane specified in advance as the measurement position.

  Further, the present invention can also be applied to the probe card 1 in which only the recess 31 is provided on the lower surface 3 a of the ceramic plate 3 and the alignment pin 32 is not provided. The present invention can also be applied to the probe card 1 in which the ceramic plate 3 has an alignment through hole on the lower surface 3a. By providing a recess 31 for alignment on the lower surface 3a of the ceramic plate 3 or by providing an alignment through hole that penetrates the ceramic plate 3, the height of the ceramic plate 3 can be increased with the recess 31 or the through hole as a reference for the measurement position. Can be measured. Therefore, when analyzing the captured image and automatically determining the height measurement position, the position of the recess 31 or the peripheral edge of the through hole can be specified using a sufficient luminance difference. Accuracy can be improved.

  Further, in the present embodiment, the example in which the alignment pin 32 is formed separately from the ceramic plate 3 and is configured by a separate member has been described, but the present invention is based on the configuration of the alignment pin 32. It is not limited. For example, the alignment pin 32 may be formed integrally with the ceramic plate 3. The alignment pin 32 may be made of the same material as the ceramic plate 3.

DESCRIPTION OF SYMBOLS 1 Probe card 10 Wiring board 11 External terminal 12 Electrode pad 2 Probe 20 Probe row 21 Needle base part 22 Intermediate part 23 Bending part 24 Needle tip part 3 Ceramic plate 31 Recess 32 Alignment pin 33 Recess 4 Support plate 41 Protrusion 5 Base plate 6 Reinforcing plate 7 Opening portion 100 Prober 101 Wafer chuck 102 Semiconductor wafer 103 Movable stage 110 Cameras 111 and 112 Photographed image h Projection height

Claims (5)

A wiring board having two or more electrode pads provided on the lower surface;
A needle base portion, an intermediate portion, a bent portion, and a needle tip portion; the needle base portion is connected to the electrode pad; the intermediate portion connects the needle base portion and the bent portion; Two or more cantilever-type probes bent in a direction away from the wiring board and connected to the needle tip,
A support plate that supports the intermediate portion of the probe and is fixed to the wiring board;
A probe card, wherein a ceramic plate is installed on the lower surface of the support plate.   The probe card according to claim 1, wherein the ceramic plate is a flat plate and is disposed in parallel with the wiring board.   The probe card according to claim 1, wherein the ceramic plate has a concave portion or a through hole for alignment on a lower surface.   The probe card according to claim 1, wherein the ceramic plate has a recess on a lower surface, and a bar-shaped alignment pin extending in the vertical direction is disposed in the recess.   The ceramic plate is installed such that a lower surface thereof is located between a tip of the needle tip portion and the bent portion at a distance in a direction perpendicular to the wiring board. The probe card according to any one of the above.

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