JP2016204596A - Silicone adhesive composition and adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a silicone adhesive providing an adhesive layer excellent in antistatic properties, excellent in adhesiveness to a substrate and less in adhesive residue on an adherend after peeling an adhesive tape or an adhesive film having the adhesive layer from the adherend.SOLUTION: There is provided an addition reaction curable silicone adhesive composition containing (A) addition curable silicone, (B) a compound having at least two unsaturated hydrocarbon groups in a molecule and two (poly)oxyalkylene residues and (C) an ion liquid containing no lithium.SELECTED DRAWING: None

Description

  The present invention relates to a silicone pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape. Specifically, the present invention relates to a silicone pressure-sensitive adhesive composition having excellent antistatic performance and a pressure-sensitive adhesive tape using the same.

  In recent years, electronic devices have become thinner and lighter. Along with this, electronic components mounted in electronic devices are also becoming smaller. Silicone adhesive tapes are widely used as process adhesive tapes because of their high heat resistance and as process transport adhesive tapes because of their good removability.

  However, due to its high electrical insulating property, the silicone pressure-sensitive adhesive causes peeling electrification when peeling thin and small electronic components, and in the worst case, may cause dielectric breakdown of the electronic components. Therefore, development of an antistatic silicone pressure-sensitive adhesive is necessary to prevent peeling electrification.

  For example, Patent Documents 1 and 2 describe an antistatic pressure-sensitive adhesive tape in which the pressure-sensitive adhesive tape base material is antistatic. However, the pressure-sensitive adhesive tape has a problem that the base material that can be used is limited, and in the case where the pressure-sensitive adhesive has electrical insulation, peeling electrification cannot be prevented. Patent Documents 3, 4, and 5 describe antistatic pressure-sensitive adhesive tapes in which an antistatic layer is provided between the pressure-sensitive adhesive layer and the pressure-sensitive adhesive tape substrate. However, the pressure-sensitive adhesive tape is disadvantageous in productivity because the number of steps at the time of manufacturing the pressure-sensitive adhesive tape is increased, and similarly to the above, when the pressure-sensitive adhesive has an electrical insulating property, it is not possible to prevent peeling charging.

  Patent Documents 6, 7, 8, and 9 describe an antistatic pressure-sensitive adhesive tape having an adhesive as an antistatic property, and Patent Document 6 describes a pressure-sensitive adhesive containing carbon black. Document 7 describes an adhesive containing a polyol, and Patent Documents 8 and 9 describe an adhesive in which conductive fine particles are dispersed.

  However, in a pressure-sensitive adhesive containing a polyol, the polyether polyol compound is poorly compatible with the silicone pressure-sensitive adhesive, so that the pressure-sensitive adhesive may become cloudy and the pressure-sensitive adhesive may be separated over time. Furthermore, since it is necessary to add a large amount of the compound, there is a problem that the obtained pressure-sensitive adhesive cannot obtain a desired pressure-sensitive adhesive force. In addition, when the pressure-sensitive adhesive is used to form a pressure-sensitive adhesive tape, the adhesiveness to the tape base material is lowered, and when the pressure-sensitive adhesive tape is peeled off from the adherend, there is a problem that the pressure-sensitive adhesive substance remains on the adherend. . In addition, the pressure-sensitive adhesive compounded with carbon black takes a great burden on the cleaning of the pressure-sensitive adhesive tape device due to carbon during the production of the pressure-sensitive adhesive tape, the appearance of the resulting pressure-sensitive adhesive tape becomes black and opaque, and the surface resistivity is unstable. There is a problem that carbon moves to an adherend such as an element after the adhesive tape is removed after the process is completed. In addition, the pressure-sensitive adhesive containing the conductive fine particles becomes opaque, and the conductive fine particles are separated due to the difference in specific gravity between the pressure-sensitive adhesive composition and the conductive fine particles, so that predetermined performance cannot be obtained.

Patent Document 10 describes a silicone pressure-sensitive adhesive composition containing an ionic conductive antistatic agent that is a lithium salt, and the silicone pressure-sensitive adhesive tape having the pressure-sensitive adhesive composition is excellent in antistatic performance and remains at a high temperature for a long time. It is described that the antistatic performance can be maintained even when exposed. Further, it is described that the antistatic performance is improved by adding the ion conductive antistatic agent in a state dissolved in an organic solvent having an oxyalkylene group. In Patent Document 10, as an organic solvent having an oxyalkylene group,
^{R 3 - (C = O)} -O- (R 4 -O) m -R 5
(In the formula, R ³ is an alkyl group having 1 to 12 carbon atoms, R ⁴ is a polymethylene group having 2 to 8 carbon atoms which may be the same or different, and R ⁵ is a hydrogen atom or 1 carbon atom. And R ^6- (O—R ⁷ ) _n —O— (C═O) —R ⁸ — (C═O) —O— ( R ⁷ _-O) p -R ⁶
(In the formula, R ⁶ may be the same or different, and is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, and R ⁷ and R ⁸ may be the same or different ethylene group or 3 carbon atoms. -12 polymethylene groups, and n and p are the same or different integers from 2 to 50).

Japanese Patent Laid-Open No. 4-216887 JP 2003-306654 A JP-A-63-380 Japanese Patent Laid-Open No. 4-135791 JP-A-6-220408 JP 61-136573 A JP 2005-154491 A JP 2004-091703 A JP 2004-091750 A Japanese Patent No. 5309714

  Since the oxyalkylene solvent described in Patent Document 10 is not compatible with the silicone pressure-sensitive adhesive, the oxyalkylene solvent is separated from the pressure-sensitive adhesive layer after the pressure-sensitive adhesive layer is cured, resulting in poor curability. There are enough problems. Moreover, in the adhesive tape which has this adhesive layer, there exists a problem that base-material adhesiveness worsens with the separated oxyalkylene solvent.

  Moreover, when the lithium salt described in Patent Document 10 is added as an antistatic agent, the resulting adhesive layer has poor adhesion to the substrate. Therefore, when producing a pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer on the tape substrate, it is necessary to use a film having a fluorine-modified silicone release agent layer that is easy to peel off as the release film to be attached on the pressure-sensitive adhesive layer. . Further, when the adhesive tape is affixed to the adherend, there arises a problem that when the adhesive tape is peeled off from the adherend, the adhesive substance remains on the adherend and cannot be removed cleanly.

  Therefore, in view of the above circumstances, the present invention is a silicone pressure-sensitive adhesive that provides a pressure-sensitive adhesive layer excellent in antistatic properties, and has excellent adhesion to a substrate, and is coated with a pressure-sensitive adhesive tape or pressure-sensitive adhesive film that includes the pressure-sensitive adhesive layer. It aims at providing the silicone adhesive with few adhesion residues on a to-be-adhered body after peeling from a body.

  The present inventors have added a compound having two or more unsaturated hydrocarbon groups in one molecule and two (poly) oxyalkylene residues, lithium to an addition-curable silicone pressure-sensitive adhesive composition, and lithium. It has been found that the above-mentioned problems can be solved by blending an ionic liquid not contained, and the present invention has been achieved.

That is, the present invention
An addition reaction curable silicone pressure-sensitive adhesive composition,
(A) addition-curable silicone,
(B) a compound having at least two unsaturated hydrocarbon groups in one molecule and having two (poly) oxyalkylene residues, and (C) an ionic liquid not containing lithium A silicone pressure-sensitive adhesive composition is provided.
Moreover, this invention provides the adhesive tape or adhesive film by which the hardened | cured material layer of the said silicone adhesive composition is laminated | stacked on the at least 1 surface of a sheet-like base material.

  The silicone pressure-sensitive adhesive composition of the present invention is excellent in antistatic performance and gives a pressure-sensitive adhesive layer having excellent adhesion to a substrate. The pressure-sensitive adhesive tape and pressure-sensitive adhesive film having the pressure-sensitive adhesive layer have little adhesive residue on the adherend after peeling off from the adherend and do not contaminate the adherend. Therefore, the pressure-sensitive adhesive tape and pressure-sensitive adhesive film can be suitably used for electronic component masking and in an environment where generation of static electricity is not preferable.

  Hereinafter, the present invention will be described in detail.

  The silicone pressure-sensitive adhesive composition of the present invention is an addition reaction curable silicone composition, and is characterized by containing (B) a (poly) oxyalkylene compound having a specific structure and (C) a specific ionic liquid. The configuration other than the component (B) and the component (C) contained in the addition reaction curable silicone pressure-sensitive adhesive composition is not particularly limited. (A) The addition-curable silicone may be any conventionally known organopolysiloxane, such as alkenyl group-containing organopolysiloxane, silicone resin, and organohydrogenpolysiloxane. Hereinafter, the component (B) and the component (C), which are the features of the present invention, will be described first.

The (B) (poly) oxyalkylene compound (B) component is a compound having at least two unsaturated hydrocarbon groups in one molecule and having two (poly) oxyalkylene residues. One of the characteristics of the (poly) oxyalkylene compound is that it has at least two unsaturated hydrocarbon groups in one molecule. As a result, the (poly) oxyalkylene compound reacts with the organohydrogenpolysiloxane contained in the addition reaction curable silicone pressure-sensitive adhesive composition and can be firmly bonded to the cured product (pressure-sensitive adhesive layer). Thus, the (poly) oxyalkylene compound is not separated from the pressure-sensitive adhesive layer, the adhesion between the substrate and the pressure-sensitive adhesive layer can be improved, and adherend contamination can be reduced.

The second feature of the (poly) oxyalkylene compound is that it has two (poly) oxyalkylenes in one molecule. The (poly) oxyalkylene is a structure composed of at least one oxyalkylene group, and is preferably a skeleton composed of two or more oxyalkylene groups. Particularly preferably the two (poly) oxyalkylene residues each _{- (C 2 H 4 O)} m - (C 3 H 6 O) n - may be between skeleton represented by (wherein, m is 0 A real number of ˜20, n is a real number of 0 to 10, and m + n is 1 to 30. The bonding order of C ₂ H ₄ O) and (C ₃ H ₆ O) may be random) . The present invention is characterized by having two (poly) oxyalkylene residues in one molecule. By compounding the compound having the structure with the (C) ionic liquid described later in the silicone pressure-sensitive adhesive composition, the surface resistivity of the silicone pressure-sensitive adhesive layer can be lowered. This is considered to be because oxyalkylene captures ions of the ionic liquid and efficiently moves the ions in the cured product (adhesive layer). The reduction in surface resistivity will be described in more detail. The silicone pressure-sensitive adhesive composition containing no ionic liquid and (poly) oxyalkylene compound is 1E + 15Ω / sq. The silicone pressure-sensitive adhesive composition having a surface resistivity exceeding (1 × 10 ¹⁵ Ω / sq.) And containing only the ionic liquid has a surface resistivity of 1E + 13 to 1E + 14Ω / sq. (1 × 10 ¹³ to 1 × 10 ¹⁴ Ω / sq.), Whereas the silicone pressure-sensitive adhesive composition containing the ionic liquid and the (poly) oxyalkylene compound has a surface resistivity of 1E + 9 to less than 1E + 13 Ω / sq. (1 × 10 ⁹ to less than 1 × 10 ¹³ Ω / sq.), Preferably 1E + 9 to 9.9E + 12 Ω / sq. (1 × 10 ^{9 to} 9.9 × 10 ¹² Ω / sq.), Particularly 1E + 10 to 9.9E + 11 Ω / sq. (1 × 10 ^{10 to} 9.9 × 10 ¹¹ Ω / sq.). The surface resistivity in the present invention is a value measured according to JIS K6911.

  In the silicone pressure-sensitive adhesive composition of the present invention, when the (poly) oxyalkylene compound has only one unsaturated hydrocarbon group, the bond between the (poly) oxyalkylene compound and the pressure-sensitive adhesive layer is not sufficient, and the pressure-sensitive adhesive layer Adhesive substance remains on the adherend after peeling off the adhesive tape having the adhesive layer from the adherend (so-called adhesive residue occurs). The adhesive residue may be generated even if a treatment with a primer or the like is performed to improve the adhesion between the adhesive layer and the substrate, which is not preferable. In addition, when the (poly) oxyalkylene compound having two or more unsaturated hydrocarbon groups has only one (poly) oxyalkylene in one molecule, the surface resistivity of the silicone pressure-sensitive adhesive composition is little. It cannot be lowered, and sufficient antistatic properties cannot be imparted to the pressure-sensitive adhesive layer. An oxyalkylene compound having one unsaturated hydrocarbon group and one (poly) oxyalkylene in one molecule may have good antistatic properties, but only one unsaturated hydrocarbon group. Since it does not have, the adhesiveness of an adhesion layer and a base material is inferior, and is not preferable.

  The unsaturated hydrocarbon group is preferably an alkenyl group having 2 to 12 carbon atoms, preferably 2 to 10 carbon atoms, and a vinyl group and an allyl group are preferable. The (poly) oxyalkylene compound has at least two organic groups having the unsaturated hydrocarbon group in one molecule. The organic group having an unsaturated hydrocarbon group is preferably an aliphatic hydrocarbon group having an unsaturated bond which may have an oxygen atom, particularly 2 to 12 carbon atoms, preferably An alkenyl group-containing aliphatic hydrocarbon group having 2 to 10 carbon atoms and optionally having an oxygen atom is preferred. For example, vinyl group, allyl group, hexenyl group, octenyl group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, acryloxypropyl group, acryloxymethyl group, methacryloxypropyl group, methacryloxymethyl group, cyclohexenylethyl group Vinyloxypropyl group, allyloxy group, and allyloxymethyl group. Among these, an allyl group, a vinyl group, an allyloxy group, and an allyloxymethyl group are preferable, and a vinyl group is preferable from an industrial viewpoint.

  It is preferable that the (poly) oxyalkylene compound hardly evaporates at 130 ° C. or lower at normal pressure. The (poly) oxyalkylene compound that volatilizes at 130 ° C. or lower volatilizes in the step of curing the pressure-sensitive adhesive composition and cannot remain in the cured silicone pressure-sensitive adhesive. Therefore, there is a possibility that a sufficient antistatic effect cannot be given to the cured product.

The (poly) oxyalkylene compound has only to have at least two unsaturated hydrocarbon groups in one molecule and has two (poly) oxyalkylenes, and may be a conventionally known compound. The number of unsaturated hydrocarbon groups is preferably 2 to 4, and particularly preferably 2. Particularly preferably, a (poly) oxyalkylene _{- (C 2 H 4 O)} m - (C 3 H 6 O) n - may have a. The (poly) oxyalkylene compound can be particularly represented by the following formula (1). In the following formula (1), the bonding order of (C ₂ H ₄ O) and (C ₃ H ₆ O) may be random. The following formula (1) may be an average formula.

In the above formula (1), A is a tetravalent hydrocarbon group having 2 to 22 carbon atoms, and R ¹ independently represents a hydrogen atom, an acyl group, or an unsaturated bond having 1 to 12 carbon atoms. A monovalent hydrocarbon group which may have an oxygen atom and at least two of R ¹ have 2 to 12 carbon atoms and an unsaturated bond which may have an oxygen atom Group hydrocarbon group.

In the above formula (1), m ¹ and m ² are each independently a real number from 0 to 20, and n ¹ and n ² are each independently a real number from 0 to 10, provided that m ¹ + n ¹ is not 0, and m ² + n ² is not 0. m ¹ , m ² , n ¹ , and n ² may be average values. , M ¹ + n ¹ is 1-30, m ² + n ² is 1-30, preferably m ¹ + n ¹ is 4-20 and m ² + n ² is 4-20. In particular, m ¹ + n ¹ + m ² + n ² is preferably 40 or less. When the values of m ¹ , m ² , n ¹ , and n ² are larger than the upper limit, the viscosity of the polyoxyalkylene compound increases, so that the dispersibility is deteriorated and mixed uniformly in the silicone pressure-sensitive adhesive composition. Can be difficult.

上記式（２）中、Ａ及びＲ^１は上記の通りであり、ｍ^３及びｍ^４は、互いに独立に、１〜２０の実数であり、好ましくは１〜１０の実数であり、さらに好ましくは２〜１０の実数である。ｍ^３及びｍ^４の数が上記上限値超では、ポリオキシアルキレン化合物の粘度が上昇するため、分散性が悪くなり、シリコーン粘着剤組成物中に均一に混合することが困難になる恐れがある。 In particular, since it is advantageous that a shorter distance between oxygen atoms can effectively move ions, the (poly) oxyalkylene compound has n ¹ and n ² in the above formula (1). It is preferable to have a structure in which both are 0, ie, having only ethylene oxide. The (poly) oxyalkylene compound is represented by the following formula (2).

In the above formula (2), A and R ¹ are as described above, and m ³ and m ⁴ are independently a real number of 1 to 20, preferably a real number of 1 to 10, and more preferably It is a real number from 2 to 10. If the number of m ³ and m ⁴ exceeds the above upper limit, the viscosity of the polyoxyalkylene compound increases, so that the dispersibility is deteriorated and it may be difficult to mix uniformly in the silicone pressure-sensitive adhesive composition. .

In the above formulas (1) and (2), R ^{1 s} independently of each other may have a hydrogen atom, an acyl group, an unsaturated bond having 1 to 12 carbon atoms, or an oxygen atom. It is a valent hydrocarbon group, and at least two of R ¹ are aliphatic hydrocarbon groups having 2 to 12 carbon atoms and having an unsaturated bond that may have an oxygen atom. Examples of the unsaturated aliphatic hydrocarbon group include those described above. In particular, an allyl group, a vinyl group, and an allyloxymethyl group are preferable. Examples of the group other than the unsaturated aliphatic hydrocarbon group include an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and an octyl group; a cycloalkyl group such as a cyclopentyl group and a cyclohexyl group; Aryl groups such as a group, tolyl group and naphthyl group; and aralkyl groups such as a benzyl group, a phenylethyl group and a phenylpropyl group. Those in which some or all of the hydrogen atoms bonded to the carbon atoms of these groups are substituted with halogen atoms such as fluorine, bromine and chlorine, for example, halogenated monovalent hydrocarbons such as trifluoropropyl groups and chloropropyl groups It may be a group, a 3-methacryloxypropyl group, or a 3-glycidyloxypropyl group. Among these, a methyl group is particularly preferable. Examples of the acyl group include an acetyl group, a propionyl group, an acryloyl group, a methacryloyl group, and an octanoyl group. As a group other than the unsaturated aliphatic hydrocarbon group, a hydrogen atom is particularly preferable.

上記式において、ｎは、互いに独立に、炭素数１〜８の整数である。
４価の環状炭化水素基としては、例えば、下記に示される構造が挙げられる。

上記式において、ｎは、互いに独立に、炭素数１〜８の整数である。 In the above formulas (1) and (2), A is a tetravalent hydrocarbon group having 2 to 22 carbon atoms. As the tetravalent hydrocarbon group, a linear or branched aliphatic saturated hydrocarbon group having 2 to 16 carbon atoms, preferably 2 to 8 carbon atoms, or 6 to 22 carbon atoms, preferably A cyclic hydrocarbon group having 6 to 14 carbon atoms which may have a branched chain is preferable. Examples of the tetravalent chain or branched aliphatic saturated hydrocarbon group include the structures shown below.

In the above formula, n is independently an integer of 1 to 8 carbon atoms.
Examples of the tetravalent cyclic hydrocarbon group include the structures shown below.

In the above formula, n is independently an integer of 1 to 8 carbon atoms.

As said (poly) oxyalkylene compound, the compound represented by a following formula is mentioned, for example.

  The amount of the component (B) in the silicone pressure-sensitive adhesive composition is preferably an amount that is 0.27 to 3.3 parts by mass with respect to 100 parts by mass in total of the addition-curable silicone contained in the silicone pressure-sensitive adhesive composition. Is an amount of 0.3 to 3 parts by mass, most preferably an amount of 0.6 to 1.8 parts by mass. When the amount of component (B) is less than the above lower limit, the effect of imparting antistatic properties is insufficient. Moreover, when there is more quantity of (B) component than the said upper limit, there exists a possibility that the adhesive force of a silicone adhesive composition may fall, sclerosis | hardenability may worsen, and the adhesiveness to a base material may worsen. The addition-curable silicone is a siloxane contained in conventionally known silicone pressure-sensitive adhesive compositions such as alkenyl group-containing organopolysiloxane, organohydrogenpolysiloxane, and silicone resin. The blending amount of the component (B) is the total number of SiH groups contained in the silicone pressure-sensitive adhesive composition relative to the total number of unsaturated hydrocarbon groups contained in the component (B) and the silicone pressure-sensitive adhesive composition. The amount is such that the ratio is 1-20, preferably 1-15. Thereby, (B) component can be firmly couple | bonded with the adhesion layer and the adhesive residue mentioned above can be prevented.

(C) Ionic liquid An ionic liquid is a salt composed of an anion and a cation, and is represented by Z ⁺ Y ⁻ (Z is a cation and Y is an anion). As the component (C) in the present invention, those known as ionic liquids can be used. The ionic liquid is generally a normal temperature molten salt, but may be a normal temperature solid salt known as an ionic liquid. The ionic liquid functions as an antistatic agent that moves ions in a cured product (adhesive layer) obtained by curing the silicone composition of the present invention to lower the surface resistivity. As the antistatic agent, Patent Document 10 describes a lithium salt. However, when the silicone pressure-sensitive adhesive composition contains lithium, corrosion of the adherend to which the obtained pressure-sensitive adhesive layer adheres is increased, and even if a primer or the like is used, adhesion to the substrate is insufficient, and When the pressure-sensitive adhesive tape obtained from the pressure-sensitive adhesive composition is peeled from the adherend, the adhesive substance remains on the adherend. The lithium salt may, for _{example, LiBF 4, LiClO 4, LiPF} 6, LiAsF 6, LiSbF 6, LiSO 3 CF 3, LiN (SO 2 CF 3) 2, LiSO 3 C 4 F 9, LiC (SO 2 CF 3) ₃ and LiB (C ₆ H ₅ ) ₄ . Some of these are known as ionic liquids. Therefore, the component (C) of the present invention is an ionic liquid containing no lithium.

The ionic liquid of the present invention is preferably at least one selected from the group consisting of quaternary ammonium salts, quaternary phosphonium salts, imidazolium salts, pyridinium salts, and pyrrolidinium salts. That is, the cation (Z ⁺ ) is an ionic liquid selected from a quaternary ammonium cation, a quaternary phosphonium cation, an imidazolium cation, a pyridinium cation, and a pyrrolidinium cation. Particularly preferred is a quaternary ammonium salt. The anion (Y ⁻ ) of these ionic liquids is not particularly limited and may be any known ionic liquid.

Examples of the anion (Y ⁻ ) include halide ions, cyanide ions, dicyanoamine anions, trifluoromethanesulfonate ions, nonafluorobutanesulfonate ions, tetrafluoroethanesulfonate ions, lactate anions, salicylate ions, and thiosalicylate ions. , Dibutyl phosphate ion, acetate ion, hexafluoroantimonate ion, hydrogen sulfate ion, sulfate ion, octyl sulfonate ion, tetrachloroaluminate ion, thiocyanate ion, tris (trifluoromethylsulfonyl) methide ion, amino acetate ion, amino Propionate ion, diethyl phosphate ion, dimethyl phosphate ion, ethyl sulfate ion, methyl sulfate ion, hydroxide ion, bis (trimethylpentyl) phosphinic acid ON, decanoate ion, trifluoroacetate ion, ferrate ion, tetrafluoroborate ion, hexafluorophosphate ion, sulfonylamide, butanesulfonate ion, methylsulfonate ion, ethylsulfonate ion, bis (trifluoromethyl Sulfonyl) imide anion, bis (trifluoroethylsulfonyl) imide anion, and bis (pentafluoroethylsulfonyl) imide anion. Among these, bis (trifluoromethylsulfonyl) imide anion is preferable.

As said ionic liquid, the salt shown below is mentioned, for example.
Butyltrimethylammonium bis (trifluoromethanesulfonyl) imide,
Ethyldimethylpropylammonium bis (trifluoromethanesulfonyl) imide,
2-hydroxymethyl-trimethylammonium L-(+)-lactate,
Methyltrioctylammonium bis (trifluoromethanesulfonyl) imide,
Methyl trioctyl ammonium thiosalicylate,
Tetrabutylammonium nonafluorobutanesulfonate,
Tetraethylammonium trifluoromethanesulfonate,
Tetraheptylammonium chloride,
Tributylmethylammonium dibutyl phosphate,
Tributylmethylammonium methylsulfate,
Triethylmethylammonium dibutyl phosphate,
Tris (2-hydroxyethyl) methylammonium methylsulfate,
1-allyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide,
1-allyl-3-methylimidazolium bromide,
1-allyl-3-methylimidazolium chloride,
1-allyl-3-methylimidazolium dicyanamide,
1-allyl-3-methylimidazolium iodide,
1-benzyl-3-methylimidazolium chloride,
1-benzyl-3-methylimidazolium hexafluorophosphate,
1-benzyl-3-methylimidazolium tetrafluoroborate,
1,3-bis (cyanomethyl) imidazolium bis (trifluoromethanesulfonyl) imide,
1,3-bis (cyanomethyl) imidazolium chloride,
1,3-bis (cyanomethyl) imidazolium bis (trifluoromethanesulfonyl) imide,
1,3-bis (cyanopropyl) imidazolium chloride,
1-butyl-2,3-dimethylimidazolium chloride,
1-butyl-2,3-dimethylimidazolium hexafluorophosphate,
1-butyl-2,3-dimethylimidazolium tetrafluoroborate,
4- (3-butyl-1-imidazolio) -1-butanesulfonate,
1-butyl-3-methylimidazolium acetate,
1-butyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide,
1-butyl-3-methylimidazolium bromide,
1-butyl-3-methylimidazolium chloride,
1-butyl-3-methylimidazolium dibutyl phosphate,
1-butyl-3-methylimidazolium dicyanamide,
1-butyl-3-methylimidazolium hexafluoroantimony salt,
1-butyl-3-methylimidazolium hexafluorophosphate,
1-butyl-3-methylimidazolium hydrogen sulfate,
1-butyl-3-methylimidazolium iodide,
1-butyl-3-methylimidazolium methanesulfonate,
1-butyl-3-methylimidazolium nitrate,
1-butyl-3-methylimidazolium octyl sulfate,
1-butyl-3-methylimidazolium tetrachloroaluminum,
1-butyl-3-methylimidazolium tetrafluoroborate,
1-butyl-3-methylimidazolium thiocyanate,
1-butyl-3-methylimidazolium trifluoroacetate,
1-butyl-3-methylimidazolium trifluoromethanesulfonate,
1- (3-cyanopropyl) -3-methylimidazolium bis (trifluorometallsulfonyl) amide,
1- (3-cyanopropyl) -3-methylimidazolium dicyanamide,
1-decyl-3-methylimidazolium chloride,
1-decyl-3-methylimidazolium tetrafluoroborate,
1,3-diethoxyimidazolium bis (trifluoromethanesulfonyl) imide,
1,3-diethoxyimidazolium hexafluorophosphate,
1,3-didihydroxyimidazolium bis (trifluoromethanesulfonyl) imide,
1,3-dihydroxy-2-methylimidazolium bis (trifluoromethanesulfonyl) imide,
1,3-dimethoxyimidazolium bis (trifluoromethanesulfonyl) imide,
1,3-dimethoxyimidazolium hexafluorophosphate,
1,3-dimethoxy-2-methylimidazolium bis (trifluoromethylsulfonyl) imide,
1,3-dimethoxy-2-methylimidazolium hexafluorophosphate,
1,3-dimethylimidazolium dimethyl phosphate,
1,3-dimethylimidazolium methanesulfonate,
1,3-dimethylimidazolium methyl sulfate,
1,2-dimethyl-3-propylimidazolium bis (trifluoromethanesulfonyl) imide,
1,2-dimethyl-3-propylimidazolium tris (trifluoromethylsulfonyl) methide,
1-dodecyl-3-methylimidazolium iodide,
1-ethyl-2,3-dimethylimidazolium chloride,
1-ethyl-2,3-dimethylimidazolium hexafluorophosphate,
1-ethyl-2,3-dimethylimidazolium tetrafluoroborate,
1-ethyl-2,3-dimethylimidazolium trifluoromethanesulfonate,
1-ethyl-3-methylimidazolium acetate,
1-ethyl-3-methylimidazolium aminoacetate,
1-ethyl-3-methylimidazolium (S) -2-aminopropionate,
1-ethyl-3-methylimidazolium bis (pentafluoroethylsulfonyl) imide,
1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide,
1-ethyl-3-methylimidazolium bromide,
1-ethyl-3-methylimidazolium chloride,
1-ethyl-3-methylimidazolium dibutyl phosphate,
1-ethyl-3-methylimidazolium dicyanamide,
1-ethyl-3-methylimidazolium diethyl phosphate,
1-ethyl-3-methylimidazolium dimethyl phosphate,
1-ethyl-3-methylimidazolium ethyl sulfate,
1-ethyl-3-methylimidazolium hexafluorophosphate,
1-ethyl-3-methylimidazolium hydrogen sulfate,
1-ethyl-3-methylimidazolium hydroxide solution,
1-ethyl-3-methylimidazolium iodide,
1-ethyl-3-methylimidazolium L-(+)-lactate,
1-ethyl-3-methylimidazolium methyl sulfate,
1-ethyl-3-methylimidazolium nitrate,
1-ethyl-3-methylimidazolium tetrachloroaluminum,
1-ethyl-3-methylimidazolium tetrafluoroborate,
1-ethyl-3-methylimidazolium 1,1,2,2-tetrafluoroethanesulfonate,
1-ethyl-3-methylimidazolium thiocyanate,
1-ethyl-3-methylimidazolium trifluoromethanesulfonate,
1-hexyl-3-methylimidazolium chloride,
1-hexyl-3-methylimidazolium hexafluorophosphate,
1-hexyl-3-methylimidazolium iodide,
1-hexyl-3-methylimidazolium tetrafluoroborate,
1-hexyl-3-methylimidazolium trifluoromethanesulfonate,
1- (2-hydroxyethyl) -3-methylimidazolium dicyanamide,
1-methylimidazolium chloride,
1-methylimidazolium hydrogen sulfate,
1-methyl-3-octylimidazolium chloride,
1-methyl-3-octylimidazolium hexafluorophosphate,
1-methyl-3-octylimidazolium tetrafluoroborate,
1-methyl-3-octylimidazolium trifluoromethanesulfonate,
1-methyl-3-propylimidazolium iodide,
1-propyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide,
1,2,3-trimethylimidazolium methylsulfate,
1,2,3-trimethylimidazolium trifluoromethanesulfonate,
Tetrabutylphosphonium methanesulfonate,
Tributylmethylphosphonium dibutyl phosphate,
Tributylmethylphosphonium methylsulfate,
Triethylmethylphosphonium dibutyl phosphate,
Trihexyl tetradecylphosphonium bis (trifluoromethylsulfonyl) amide,
Trihexyltetradecylphosphonium bis (2,4,4-trimethylpentyl) phosphinate,
Trihexyl tetradecylphosphonium bromide,
Trihexyl tetradecylphosphonium chloride,
Trihexyl tetradecylphosphonium decanoate,
Trihexyl tetradecylphosphonium dicyanamide,
3- (triphenylphosphinate) propane-1-sulfonate,
1-butyl-4-methylpyridinium bromide,
1-butyl-4-methylpyridinium chloride,
1-butyl-4-methylpyridinium hexafluorophosphate,
1-butyl-4-methylpyridinium iodide,
1-butyl-4-methylpyridinium tetrafluoroborate,
1-butylpyridinium bromide,
1- (3-cyanopropyl) pyridinium chloride,
1-ethylpyridinium tetrafluoroborate,
3-methyl-1-propylpyridinium bis (trifluoromethylsulfol) imide,
1-butyl-1-methylpyrrolidinium bis (trifluoromethanesulfonyl) imide,
1-butyl-1-methylpyrrolidinium bromide,
1-butyl-1-methylpyrrolidinium dicyanamide,
1-butyl-1-methylpyrrolidinium hexafluorophosphate,
1-butyl-1-methylpyrrolidinium iodide,
1-butyl-1-methylpyrrolidinium tetrafluoroborate,
1-butyl-1-methylpyrrolidinium trifluoromethanesulfonate,
1-ethyl-1-methylpyrrolidinium bis (trifluoromethanesulfonyl) imide,
1-ethyl-1-methylpyrrolidinium bromide,
1-ethyl-1-methylpyrrolidinium hexafluorophosphate,
1-ethyl-1-methylpyrrolidinium tetrafluoroborate,
1-butyl-1-methylpiperidinium bis (trifluoromethanesulfonyl) imide,
1-butyl-1-methylpiperidinium hexafluorophosphate,
1-butyl-1-methylpiperidinium tetrafluoroborate,
Triethylsulfonium bis (trifluoromethanesulfonyl) imide,
1-ethyl-3-methylimidazolium methanesulfonate,
Methyl-tri-n-butylammonium methyl sulfate,
1,2,4-trimethylpyrazolium methyl sulfate,
1-ethyl-2,3-dimethylimidazolium ethyl sulfate,
Methyl imidazolium chloride,
Methyl imidazolium hydrogen sulfate,
1-ethyl-3-methylimidazolium tetrachloroaluminum,
1-ethyl-3-methylimidazolium ethyl sulfate,
1-butyl-3-methylimidazolium methyl sulfate,
Choline acetate,
Choline salicylic acid,
Methyltrioctylammonium hexafluorophosphate,
Tetrabutylphosphonium bis (trifluoromethanesulfonyl) imide,
Tributyldodecylphosphonium bis (trifluoromethanesulfonyl) imide,
Trimethylhexylammonium bis (trifluoromethanesulfonyl) imide,
Trimethylpropylammonium bis (trifluoromethanesulfonyl) imide,
1-octyl-4-methylpyridinium bis (trifluoromethanesulfonyl) imide,
1-hexyl-4-methylpyridinium hexafluorophosphate,
1-hexyl-4-methylpyridinium bis (trifluoromethanesulfonyl) imide,
1,2-dimethyl-3-propylimidazolium iodide,
1-ethyl-3-methylimidazolium trifluoroacetate,
1-butyl-3-methylimidazolium tetrachloroiron (III),
1-methyl-1-propylpiperidinium bis (trifluoromethanesulfonyl) imide,
1-butylimidazolium bis (trifluoromethanesulfonyl) imide,
1-butyl-3-methylpyridinium bis (trifluoromethanesulfonyl) imide,
1-butyl-4-methylpyridinium bis (trifluoromethanesulfonyl) imide,
1-methyl-1-pyrrolidinium bis (trifluoromethanesulfonyl) imide,
1-butyl-1-methylpyrrolidinium bis (trifluoromethanesulfonyl) imide,
1-butyl-1-methylpyrrolidinium chloride,
1-methyl-3-propylimidazolium bis (trifluoromethanesulfonyl) imide,
1-hexyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide,
1-butyl-2,3-dimethylimidazolium bis (trifluoromethanesulfonyl) imide,
1,2-dimethyl-3-propylimidazolium bis (trifluoromethanesulfonyl) imide,
1-methyl-3-octylimidazolium tetrafluoroborate,
1- (3-hydroxypropyl) -3-methylimidazolium tetrafluoroborate,
1-butylpyridinium hexafluorophosphate,
1-butyl-3-methylpyridinium hexafluorophosphate,
1-butylpyridinium tetrafluoroborate,
1-butyl-3-methylpyridinium tetrafluoroborate,
1-butylpyridinium chloride,
Tributylmethylammonium bis (trifluoromethanesulfonyl) imide,
Tetrabutylammonium hexafluorophosphate,
Tetrabutylammonium bromide,
Tetrapentylammonium bromide,
Tetrabutylphosphonium hexafluorophosphate and tributylmethylphosphonium iodide.

  Among these, an ionic liquid in which the anion is a bis (trifluoromethylsulfonyl) imide anion is particularly preferable. By having a bis (trifluoromethylsulfonyl) imide anion, the inhibition of curing of the addition-curable silicone pressure-sensitive adhesive becomes difficult to occur.

Furthermore, a salt composed of a quaternary ammonium cation and a bis (trifluoromethylsulfonyl) imide anion is preferable, and the most difficult inhibition of curing occurs. Examples of the ionic liquid include the salts shown below.
Butyltrimethylammonium bis (trifluoromethanesulfonyl) imide,
Ethyldimethylpropylammonium bis (trifluoromethanesulfonyl) imide,
Methyltrioctylammonium bis (trifluoromethanesulfonyl) imide,
Trimethylhexylammonium bis (trifluoromethanesulfonyl) imide,
Trimethylpropylammonium bis (trifluoromethanesulfonyl) imide and tributylmethylammonium bis (trifluoromethanesulfonyl) imide.

  The ionic liquid may be blended into the silicone pressure-sensitive adhesive composition as it is, or may be blended in a state diluted in advance with an organic solvent or dispersed in silicone oil to form a paste. It is not limited.

  The amount of component (C) may be 0.003 to 1.5 parts by mass, preferably 0.006 to 1.2 parts per 100 parts by mass of the addition-curable silicone in the silicone pressure-sensitive adhesive composition. It is a mass part, More preferably, it is 0.06-1.2 mass part, Most preferably, it is 0.06-0.6 mass part. When the amount of component (C) is less than the lower limit, the effect of imparting antistatic properties becomes insufficient. When the amount of the component (C) is larger than the above upper limit, there may be a problem that the adhesive strength of the silicone pressure-sensitive adhesive composition is lowered, the curability is deteriorated, and the adhesion with the substrate is deteriorated.

Addition reaction curable silicone pressure-sensitive adhesive composition The components other than the components (B) and (C) contained in the addition reaction curable silicone pressure-sensitive adhesive composition of the present invention are conventionally known addition reaction curable silicones as described above. What is necessary is just a component contained in an adhesive composition. For example, (A) addition-curable silicone is the following components (a) to (c) and further includes the following components (d) and (e).
(A) a linear diorganopolysiloxane having two or more alkenyl groups in one molecule, (b) containing R ⁴ ₃ SiO _0.5 units and SiO ₂ units, and R ⁴ ₃ SiO _0.5 units / Polysiloxane having a molar ratio of SiO ₂ units of 0.6 to 1.7 (R ⁴ is a monovalent hydrocarbon group having 1 to 10 carbon atoms)
(C) Organopolysiloxane containing two or more SiH groups in one molecule (d) Reaction control agent as an optional component (e) Addition reaction catalyst

Hereinafter, the components (a) to (e) will be described in more detail.
(A) Alkenyl group-containing linear diorganopolysiloxane The alkenyl group-containing linear diorganopolysiloxane is not particularly limited as long as it has two or more alkenyl groups in one molecule.

  The diorganopolysiloxane may be oily or raw rubbery. The viscosity of the oily diorganopolysiloxane is preferably 1000 mPa · s or more, particularly 10,000 mPa · s or more at 25 ° C. If the viscosity is less than the above lower limit, the curability of the pressure-sensitive adhesive composition is lowered or the cohesive force (holding force of the substrate) is lowered, which is not suitable. The viscosity of the raw rubber diorganopolysiloxane is preferably 100,000 mPa · s or less at 25 ° C. when dissolved in toluene so as to have a concentration of 30%. If it exceeds 100,000 mPa · s, the composition becomes too viscous, so that stirring during the production of the composition becomes difficult. The viscosity can be measured using a BM type rotational viscometer. The diorganopolysiloxane may be used in combination of two or more.

上記式中、Ｒ^２は、互いに独立に、脂肪族不飽和結合を有さない１価炭化水素基であり、Ｘはアルケニル基含有有機基であり、ａは０〜３の整数であり、好ましくは１であり、ｐは０以上の整数であり、ｑは１００以上の整数であり、但しａとｐは同時に０にならない。ｐ＋ｑは、上記ジオルガノポリシロキサンの２５℃における粘度が１，０００ｍＰａ・ｓ以上となる値である。 The alkenyl group-containing linear diorganopolysiloxane is represented, for example, by the following formula (3) or (4).

In the above formula, R ^{2 s} are each independently a monovalent hydrocarbon group having no aliphatic unsaturated bond, X is an alkenyl group-containing organic group, a is an integer of 0 to 3, Is 1, p is an integer of 0 or more, q is an integer of 100 or more, provided that a and p are not 0 at the same time. p + q is a value at which the viscosity of the diorganopolysiloxane at 25 ° C. is 1,000 mPa · s or more.

R ² is preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms, and having no aliphatic unsaturated bond. Examples thereof include alkyl groups such as methyl group, ethyl group, propyl group, and butyl group; cycloalkyl groups such as cyclohexyl group; and aryl groups such as phenyl group and tolyl group. In particular, a methyl group or a phenyl group is preferable.

  X is preferably an alkenyl group-containing organic group having 2 to 10 carbon atoms. For example, vinyl group, allyl group, hexenyl group, octenyl group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, acryloxypropyl group, acryloxymethyl group, methacryloxypropyl group, methacryloxymethyl group, cyclohexenylethyl group , And vinyloxypropyl groups. Among these, a vinyl group is preferable from an industrial viewpoint.

(B) Organopolysiloxane containing M units and Q units The organopolysiloxane is an organopolysiloxane having R ⁴ ₃ SiO _0.5 units and SiO ₂ units, and conventionally known ones can be used. The organopolysiloxane contains R ⁴ ₃ SiO _0.5 units and SiO ₂ units in a molar ratio of R ⁴ ₃ SiO _0.5 units / SiO ₂ units: 0.6 to 1.7, preferably 0.7 to It is good to contain in 1.3. R ⁴ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples include those exemplified for R ² above. When the molar ratio of R ⁴ ₃ SiO _0.5 unit / SiO ₂ unit is less than the above lower limit value, the pressure-sensitive adhesive force and tack of the resulting pressure-sensitive adhesive layer may be reduced. The adhesive force and holding power of the agent layer may be reduced. The organopolysiloxane may have an OH group. In that case, the content of OH groups is preferably 4.0% by mass or less based on the total mass of the organopolysiloxane. If the OH group exceeds the above upper limit, the curability of the pressure-sensitive adhesive may be lowered, which is not preferable.

Two or more kinds of the organopolysiloxane may be used in combination. Further, within a range not to impair the characteristics of the present invention may have ^R 4 _{SiO 1.5} units and / or ^R ₄ 2 SiO units.

  The component (a) and the component (b) may be simply mixed and used. When the organopolysiloxane represented by the above formula (4) is contained as the component (a), the component (a) and You may use as a condensation reaction product obtained by making (b) component react previously. The condensation reaction may be performed by dissolving a mixture of the components (a) and (b) in a solvent such as toluene and using an alkaline catalyst at room temperature or under reflux.

  The mass ratio of the components (a) and (b) may be 20/80 to 100/0, and preferably 30/70 to 95/5. When the amount of the component (a) is less than the lower limit value, the adhesive force and holding force of the obtained pressure-sensitive adhesive layer are lowered.

(C) Organohydrogenpolysiloxane The organohydrogenpolysiloxane is a crosslinking agent and has at least 2, preferably 3 or more hydrogen atoms bonded to silicon atoms in one molecule. The organohydrogenpolysiloxane may be linear, branched, or cyclic. The organohydrogenpolysiloxane preferably has a viscosity of 1 to 5,000 mPa · s at 25 ° C., more preferably 5 to 500 mPa · s. The viscosity can be measured using a BM type rotational viscometer. Conventionally known organohydrogenpolysiloxanes can be used.

式中、Ｒ^３は炭素数１〜１０の１価炭化水素基であり、ｂは０または１であり、ｒ及びｓは整数であり、該オルガノハイドロジェンポリシロキサンの２５℃における粘度が１〜５、０００ｍＰａ・ｓ、好ましくは５〜５００ｍＰａ・ｓとなる値である。ｔは２以上の整数であり、ｖは０以上の整数であり、かつｔ＋ｖ≧３であり、好ましくは８≧ｔ＋ｖ≧３である。オルガノハイドロジェンポリシロキサンは２種以上の混合物であってもよい。 Examples of the organohydrogenpolysiloxane include linear siloxane represented by the following formula (6) and cyclic siloxane represented by the following formula (7).

In the formula, R ³ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, b is 0 or 1, r and s are integers, and the viscosity of the organohydrogenpolysiloxane at 25 ° C. is 1 to The value is 5,000 mPa · s, preferably 5 to 500 mPa · s. t is an integer of 2 or more, v is an integer of 0 or more, and t + v ≧ 3, and preferably 8 ≧ t + v ≧ 3. The organohydrogenpolysiloxane may be a mixture of two or more.

R ³ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms. For example, alkyl groups such as methyl group, ethyl group, propyl group, and butyl group; cycloalkyl groups such as cyclohexyl group; and aryl groups such as phenyl group and tolyl group; and alkenyl groups such as vinyl group and allyl group. It is done. In particular, a methyl group or a phenyl group is preferable.

  The amount of the organohydrogenpolysiloxane is preferably such that the ratio of the number of SiH groups in the component (c) to the number of alkenyl groups in the component (a) is 1 to 20, particularly preferably 1 to 15. Is the amount. If it is less than the said lower limit, since the crosslinking density of the hardened | cured material obtained will become low, there exists a possibility that the force in which an adhesive layer hold | maintains a base material may become low. If the above upper limit is exceeded, the crosslink density of the resulting cured product becomes too high, and the adhesive layer may not have sufficient adhesive strength and tack. Moreover, when the said upper limit is exceeded, the usable time of an adhesive composition (treatment liquid) may become short. Moreover, since the silicone adhesive composition of this invention contains the (poly) oxyalkylene compound (B) which has an unsaturated hydrocarbon group as above-mentioned, (B) component and (a) component have unsaturated The ratio of the number of SiH groups in the component (c) to the total number of hydrocarbon groups is 1 to 20, preferably 1 to 15. Thereby, (B) component can be firmly couple | bonded with the adhesion layer and the adhesive residue mentioned above can be prevented.

(D) Reaction Control Agent The silicone pressure-sensitive adhesive composition can contain a reaction control agent as an optional component. The reaction control agent functions to prevent the composition from thickening or gelling before being heated and cured when the silicone pressure-sensitive adhesive composition is prepared and applied to the substrate. A known reaction control agent can be used. For example, 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 1-ethynylcyclohexanol, 3-methyl- 3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1-trimethylsiloxycyclohexane, bis (2 , 2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane and 1,1,3,3-tetramethyl-1 , 3-divinyldisiloxane and the like.

  The amount of the reaction control agent may be 0 to 8 parts by mass, preferably 0.01 to 8 parts by mass, and more particularly 0.05 to 100 parts by mass in total of the components (a) and (b). ˜2 parts by mass are preferred. If the amount of the reaction control agent exceeds the above upper limit, curability may be lowered.

(E) Addition reaction catalyst The addition reaction catalyst is a catalyst for the addition reaction of the components (a) and (B) and the component (c), which may be a conventionally known catalyst, and uses a platinum group metal catalyst. It is preferable to do. Examples of the platinum group metal catalyst include platinum, palladium, rhodium, and ruthenium catalysts. Of these, platinum-based catalysts are particularly preferably used. Examples of the platinum-based catalyst include chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reaction product of chloroplatinic acid and alcohol, a reaction product of chloroplatinic acid and an olefin compound, and chloroplatinic acid and a vinyl group-containing siloxane. And reactants. In particular, from the viewpoint of storage stability, a reaction product of chloroplatinic acid and an olefin compound and a reaction product of chloroplatinic acid and a vinyl group-containing siloxane are preferable.

  The addition amount of the catalyst may be a catalyst amount. The catalyst amount is an effective amount for causing the addition reaction of the component (a) and the component (B) with the component (c). In particular, the platinum group metal content is preferably 1 to 5,000 ppm, more preferably 5 to 1,000 ppm, based on the total mass parts of the components (a), (B) and (b). If it is less than the said lower limit, the sclerosis | hardenability of a silicone adhesive composition will fall, and the hardened | cured material obtained will have a low crosslinking density, and the force (adhesion strength) holding a base material may fall. If the above upper limit is exceeded, the usable time of the treatment bath may be shortened.

  The silicone pressure-sensitive adhesive composition of the present invention can also be obtained by adding the component (B) and the component (C) to a commercially available addition reaction curable silicone pressure-sensitive adhesive composition. Examples of the commercially available addition-curable silicone pressure-sensitive adhesives include KR-3700, KR-3701, KR-3704, X-40-3237, and KR-3706 (manufactured by Shin-Etsu Chemical Co., Ltd.). When the component (B) and the component (C) are added to the commercially available silicone pressure-sensitive adhesive composition, the ratio of the total number of SiH groups and the total number of unsaturated hydrocarbon groups contained in the silicone pressure-sensitive adhesive composition is as described above. May not be within range. In such a case, the ratio may be adjusted by further adding organohydrogenpolysiloxane as the component (c) described above.

  The silicone pressure-sensitive adhesive composition of the present invention may further contain an organic solvent in order to lower the viscosity during coating. Examples of the organic solvent include aromatic solvents such as toluene and xylene, aliphatic solvents such as hexane, octane and isoparaffin, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ester solvents such as ethyl acetate and isobutyl acetate, An ether solvent such as diisopropyl ether or 1,4-dioxane, or a mixed solvent thereof is used.

  In the present invention, ion conductive substances other than the above components (excluding lithium salts) and other organic polymer antistatic agents are used in combination as long as the performance of the silicone pressure-sensitive adhesive composition is not impaired. You can also

  In addition to the above-described components, optional components can be further added to the silicone pressure-sensitive adhesive composition of the present invention. For example, non-reactive polyorganosiloxanes such as polydimethylsiloxane and polydimethyldiphenylsiloxane; antioxidants such as phenol, quinone, amine, phosphorus, phosphite, sulfur and thioether; triazole, Examples thereof include light stabilizers such as benzophenone; flame retardants such as phosphate ester, halogen, phosphorus, and antimony; and antistatic agents such as cation activator, anion activator, and nonionic activator.

  The silicone pressure-sensitive adhesive composition of the present invention is prepared by mixing and dissolving the above-described components. The preparation method may follow a conventionally known method. Mixing may be performed by adding the components (B) and (C) to a mixture in which components other than the components (B) and (C) described above are mixed in advance, or all components. May be mixed in one step. In particular, the components (a) to (d) described above are first mixed, the components (B) and (C) are added to the mixture, and optionally the component (c) is further added so as to be uniform. The silicone pressure-sensitive adhesive composition of the present invention is prepared by mixing, then adding an addition reaction catalyst, and optionally adding a solvent and mixing.

  An adhesive tape or an adhesive film having an adhesive layer can be obtained by applying the silicone adhesive composition to various sheet-like substrates and curing them under predetermined conditions. The substrate on which the silicone pressure-sensitive adhesive composition is applied is not particularly limited. For example, polyester, polytetrafluoroethylene, polyimide, polyphenylene sulfide, polyamide, polyether ether ketone, polycarbonate, polystyrene, polypropylene, polyethylene, polyvinyl chloride and other plastic films; aluminum foil, copper foil and other metal foils; Japanese paper, synthetic Paper, paper such as polyethylene laminated paper; cloth; glass fiber; and sheet-like substrates such as composite substrates formed by laminating a plurality of these. In order to improve the adhesion between the silicone pressure-sensitive adhesive layer and these substrates, the substrate may be previously subjected to primer treatment, corona treatment, etching treatment, or plasma treatment.

The pressure-sensitive adhesive layer (cured product) obtained from the silicone pressure-sensitive adhesive composition of the present invention has a low surface resistivity and excellent antistatic properties. The surface resistivity may be in any range as long as it can be applied as an antistatic application, but preferably 1E + 9 to less than 1E + 13 Ω / sq. (1 × 10 ⁹ to less than 1 × 10 ¹³ Ω / sq.), More preferably 1E + 9 to 9.9E + 12 Ω / sq. (1 × 10 ^{9 to} 9.9 × 10 ¹² Ω / sq.), And further 1E + 9 to less than 1E + 12 Ω / sq. (1 × 10 ⁹ to less than 1 × 10 ¹² Ω / sq.), Particularly 1E + 10 to 9.9E + 11 Ω / sq. An adhesive layer having (1 × 10 ^{10 to} 9.9 × 10 ¹¹ Ω / sq.) Can be provided. The surface resistivity in the present invention is a value measured according to JIS K6911.

  The method for applying the silicone pressure-sensitive adhesive composition may follow a conventionally known method. For example, a comma coater, lip coater, roll coater, die coater, knife coater, blade coater, rod coater, kiss coater, gravure coater, screen coating, dip coating, and cast coating can be used. The coating amount of the composition is preferably such that the thickness of the pressure-sensitive adhesive layer after curing is 2 to 200 μm, particularly 3 to 100 μm. The curing conditions for the composition are not particularly limited, and may be 30 to 5 minutes at 80 to 150 ° C.

  The manufacturing method of an adhesive tape should just follow a conventionally well-known method. For example, as described above, the pressure-sensitive adhesive composition can be directly applied to a substrate and cured for production. In addition, the adhesive composition is applied to a release film or release paper on which release coating has been applied, and after curing, the adhesive layer surface of the film is bonded to the substrate (so-called transfer method). You can also.

  The adhesive tape of the present invention has excellent antistatic properties as described above, and no adhesive residue is produced when the adhesive tape is peeled off from the adherend. Therefore, it can be suitably used for various substrates as an antistatic pressure-sensitive adhesive tape. The adherend to which the adhesive tape of the present invention is applied is not particularly limited. For example, metals such as stainless steel, copper and iron; these metals whose surfaces are plated or rust-proofed; ceramics such as glass and ceramics A resin such as polytetrafluoroethylene, polyimide, epoxy resin, novolac resin, and a substrate formed by combining a plurality of these resins.

  EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated in detail, this invention is not restrict | limited to the following Example.

・ポリシロキサン（ｃ２）：下記式で表されるオルガノハイドロジェンポリシロキサン

Each component used in the following Examples and Comparative Examples is as follows. In the following, the viscosity is a value at 25 ° C. measured using a Brookfield rotational viscometer (BM type viscometer).
(A) Addition-curing type silicone ・ Polysiloxane (a1): Vinyl group-containing polydimethylsiloxane blocked with dimethylvinylsilyl groups (SiMe ₂ Vi groups) at both ends of the molecular chain A viscosity of 27,000 mPa · s in a 30% toluene solution And having a vinyl group content of 0.075 mol%. Polysiloxane (a2): vinyl group-containing polydimethylsiloxane 30% toluene solution in which both ends of the molecular chain are blocked with dimethylvinylsilyl groups (SiMe ₂ Vi groups) And a vinyl group content of 0.15 mol%. Polysiloxane (b): polysiloxane consisting of _0.5 units of Me ₃ SiO and ₂ units of SiO ₂ (Me ₃ SiO _{0. 5} units / SiO ₂ units = 0.82) of 60% solution polysiloxane (c1): the following formula Organohydrogenpolysiloxane is

Polysiloxane (c2): organohydrogenpolysiloxane represented by the following formula

式中、ｍ及びｎの値は、（ｍ，ｎ）＝（２，０）、（８，０）、（１２，０）、（１８，０）、（０，８）、（６，２）のいずれかである。各実施例及び比較例で使用した（Ｂ）成分のｍ及びｎの値を表中に記載する。 (B) Component: Polyoxyalkylene compound represented by the following formula:

In the formula, the values of m and n are (m, n) = (2,0), (8,0), (12,0), (18,0), (0,8), (6,2 ) The values of m and n of the component (B) used in each example and comparative example are described in the table.

Component (C) Ionic liquid A: Trimethylpropylammonium-bis (trifluoromethanesulfonyl) imide Ionic liquid B: Butyltrimethylammonium-bis (trifluoromethylsulfonyl) imide Ionic liquid C: Ethyldimethylpropylammonium-bis (trifluoromethylsulfonyl) ) Imide

式中、ｍ及びｎの値は、（ｍ，ｎ）＝（２２，０）、（０，１２）のいずれかである。各比較例で使用したポリオキシアルキレン化合物のｍ及びｎの値を表中に記載する。 Polyoxyalkylene compound for comparative example (1): polyoxyalkylene compound represented by the following formula

In the formula, the values of m and n are either (m, n) = (22, 0) or (0, 12). The values of m and n of the polyoxyalkylene compound used in each comparative example are shown in the table.

Polyoxyalkylene compound for comparative example (2): polyoxyalkylene represented by the following formula (a) or (b), having one unsaturated hydrocarbon group and one polyoxyalkylene in one molecule compound _{(a) CH 2 = CH-} CH 2 -O- (C 2 H 4 O) 4 -H
_{(B) CH 2 = CH-} CH 2 -O- (C 2 H 4 O) 8 -CH 3

Polyoxyalkylene compound for comparative example (3): polyoxyalkylene having one polyoxyalkylene and two unsaturated hydrocarbon groups in one molecule represented by the following formula (c) or (d) compound _{(c) CH 2 = CH-} CH 2 -O- (C 2 H 4 O) 8 -CH 2 -CH = CH 2
_{(D) CH 2 = CH-} CH 2 -O- (C 2 H 4 O) 16 -CH 2 -CH = CH 2

Polyoxyalkylene compound for comparative example (4): Polyoxyalkylene compound having two polyoxyalkylenes in one molecule represented by the following formula (e) and not containing an unsaturated hydrocarbon group

Lithium salt for comparative example: lithium-bis (trifluoromethanesulfonyl) imide

[Preparation Example 1]
Preparation of silicone pressure-sensitive adhesive composition (α) Polysiloxane (a1) 40 parts by mass, polysiloxane (b) 83.3 parts by mass, polysiloxane (c1) 0.4 parts by mass, and toluene 33.3 parts by mass To a solution obtained by mixing parts, 0.2 parts by mass of 1-ethynylcyclohexanol was added and mixed to obtain a mixture having a siloxane content of about 60% by mass (based on the number of alkenyl groups in the component (a2) ( c1) The ratio of the number of SiH groups in the component was 15. The (poly) oxyalkylene compound shown in the following table, the ionic liquid or lithium salt shown in the table, and the polysiloxane (c2) are added to 100 parts by mass of the mixture in the composition and addition amount (parts by mass) shown in the table. And stirred to be uniform. To 100 parts by mass of the mixture, 50 parts by mass of toluene was added and further mixed to prepare a mixture having a siloxane content of about 40% by mass. Furthermore, a reaction product (complex) of chloroplatinic acid and vinyl group-containing siloxane was added so that the mass of platinum atoms was 250 ppm with respect to the total mass of the components (a) and (b), and the mixture was sufficiently stirred and mixed. Thus, a silicone pressure-sensitive adhesive composition (α) was obtained. The polysiloxane (c2) was added in such an amount that the ratio of the number of SiH groups in the polysiloxane (c2) to the number of alkenyl groups in the component (B) or the polyoxyalkylene compound for comparative example was 1. Is.

[Preparation Example 2]
Preparation of silicone adhesive composition (β) 95 parts by mass of polysiloxane (a2), 8.3 parts by mass of polysiloxane (b), 0.6 parts by mass of polysiloxane (c1), and 33.3 parts by mass of toluene To a solution obtained by mixing parts, 0.2 parts by mass of 1-ethynylcyclohexanol was added and mixed to obtain a mixture having a siloxane content of about 60% by mass (based on the number of alkenyl groups in the component (a2) ( c1) The ratio of the number of SiH groups in the component was 5. The (poly) oxyalkylene compound shown in the following table, the ionic liquid or lithium salt shown in the table, and the polysiloxane (c2) are added to 100 parts by mass of the mixture in the composition and addition amount (parts by mass) shown in the table. And stirred to be uniform. To 100 parts by mass of the mixture, 50 parts by mass of toluene was added and further mixed to prepare a mixture having a siloxane content of about 40% by mass. Furthermore, a reaction product (complex) of chloroplatinic acid and vinyl group-containing siloxane was added so that the mass of platinum atoms was 250 ppm with respect to the total mass of the components (a) and (b), and the mixture was sufficiently stirred and mixed. Thus, a silicone pressure-sensitive adhesive composition (β) was obtained. The polysiloxane (c2) was added in such an amount that the ratio of the number of SiH groups in the polysiloxane (c2) to the number of alkenyl groups in the component (B) or the polyoxyalkylene compound for comparative example was 1. Is.

The following tests were performed on each obtained silicone pressure-sensitive adhesive composition.
The curable silicone pressure-sensitive adhesive composition was applied to a polyimide film having a thickness of 25 μm and a 110 mm square using an applicator so that the thickness after curing was 30 μm, and then heated and cured at 130 ° C. for 5 minutes. An adhesive sheet was prepared. This adhesive sheet was bonded to the surface of SUS304 polished with # 280 sandpaper, then reciprocated once with a 2 kg roller, adhered, and then the adhesive sheet was peeled off to evaluate curability. When the adhesive sheet is peeled off, if no adhesive substance remains on the SUS surface (that is, the adhesive substance does not migrate to the adherend because the curing has been sufficiently completed), it is evaluated as OK, and it adheres to the SUS surface. The case where the agent remained (that is, the curing was insufficient and the adhesive substance transferred to the adherend) was evaluated as NG.

After applying the antistatic silicone pressure-sensitive adhesive composition solution to the substrate with a thickness of 25 μm and a 110 mm square polyimide film using an applicator so that the thickness after curing is 30 μm, 130 ° C., 5 minutes A pressure-sensitive adhesive sheet was prepared by heating and curing under the above conditions. After sticking the adhesive sheet on the surface of SUS304 polished with # 280 sandpaper, it was reciprocated once with a 2 kg roller and adhered. The pressure-sensitive adhesive sheet was peeled from the SUS surface, and the adhesion between the pressure-sensitive adhesive and the base material (polyimide film) was evaluated. The case where the pressure-sensitive adhesive was lifted from the base material or peeled off from the base material and transferred to the SUS surface was evaluated as NG, and the case where the pressure-sensitive adhesive was not lifted from the base material and no pressure-sensitive adhesive remained on the SUS surface was evaluated as OK. . In addition, about the composition whose result was NG in the said sclerosis | hardenability test, since the adhesiveness with a base material is naturally bad also in this test, the adhesiveness test was not performed (it shows with "-" in a table | surface). ).

The surface resistivity silicone adhesive composition solution was applied to a polyimide film having a thickness of 25 μm and a 110 mm square using an applicator so that the thickness after curing was 30 μm, and then heated at 130 ° C. for 5 minutes. Cured to create an adhesive sheet. The surface resistivity of this pressure-sensitive adhesive sheet was measured based on JIS-K6911 using Hiresta UP MCT-UP450 (manufactured by Dia Instruments Co., Ltd.) and the applied voltage was 500V. The surface resistivity is 1E + 9-5E + 9Ω / sq. (1 × 10 ^{9 to} 5 × 10 ⁹ Ω / sq.) Is the first half of the ninth power, 5E + 9 to 9.9E + 9 Ω / sq. The case of (over 5 × 10 ^{9 to} 9.9 × 10 ⁹ Ω / sq.) Is described in the table as the latter half of the ninth power.
Hereinafter, similarly, it described in the table | surface as follows.
1E + 10-5E + 10Ω / sq. (1 × 10 ^{10 to} 5 × 10 ¹⁰ Ω / sq.): The first half of the 10th power,
5E + 10 to 9.9E + 10Ω / sq. (From 5 × 10 ^{10 to} 9.9 × 10 ¹⁰ Ω / sq.): The latter half of the 10th power,
1E + 11 to 5E + 11Ω / sq. (1 × 10 ^{11 to} 5 × 10 ¹¹ Ω / sq.): The first half of the eleventh power,
More than 5E + 11 to 9.9E + 11Ω / sq. (From 5 × 10 ^{11 to} 9.9 × 10 ¹¹ Ω / sq.): 11th power of the second half,
1E + 12-5E + 12Ω / sq. (1 × 10 ^{12 to} 5 × 10 ¹² Ω / sq.): The first half of the 12th power,
From 5E + 12 to 9.9E + 12Ω / sq. (> 5 × 10 ^{12 to} 9.9 × 10 ¹² Ω / sq.): Latter half of the 12th power,
1E + 13-5E + 13Ω / sq. (1 × 10 ^{13 to} 5 × 10 ¹³ Ω / sq.): The first half of the 13th power,
From 5E + 13 to 9.9E + 13Ω / sq. (> 5 × 10 ^{13 to} 9.9 × 10 ¹³ Ω / sq.): Latter half of the 13th power,
1E + 14 to 5E + 14Ω / sq. (1 × 10 ^{14 to} 5 × 10 ¹⁴ Ω / sq.): The first half of the 14th power,
5E + 14 to 9.9E + 14Ω / sq. (5 × 10 ^{14 to} 9.9 × 10 ¹⁴ Ω / sq.): The latter half of the 14th power,
1E + 15Ω / sq. Above (1 × 10 ¹⁵ Ω / sq. Or higher): 15th power or higher

  The results of evaluating the silicone pressure-sensitive adhesive composition α by changing the composition of the oxyalkylene compound and the ionic liquid are shown in Tables 1 to 14 below. The results of evaluating the silicone pressure-sensitive adhesive composition β by changing the composition of the oxyalkylene compound and the ionic liquid are shown in Tables 15 to 28 below. Further, the silicone pressure-sensitive adhesive compositions α and β were evaluated using the polyoxyalkylene compound represented by the above formula (e) having no unsaturated hydrocarbon group instead of the component (B). Tables 29 and 30 show.

Silicone adhesive composition α
In Examples 1 to 4 and Comparative Examples 1 and 2, a polyoxyalkylene compound (m = 2, n = 0) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 1 below.

Silicone adhesive composition α
In Examples 5 to 8 and Comparative Examples 3 and 4, a polyoxyalkylene compound (m = 8, n = 0) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 2 below.

Silicone adhesive composition α
In Examples 9 to 12 and Comparative Examples 5 and 6, the polyoxyalkylene compound (m = 12, n = 0) and the ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 3 below.

Silicone adhesive composition α
In Examples 13 to 16 and Comparative Examples 7 and 8, a polyoxyalkylene compound (m = 18, n = 0) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 4 below.

Silicone adhesive composition α
In Examples 17 to 20 and Comparative Examples 9 and 10, a polyoxyalkylene compound (m = 0, n = 8) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. Moreover, in Examples 21-23, the polyoxyalkylene compound (m = 6, n = 2) and the ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 5 below.

Silicone adhesive composition α
In Examples 24-27 and Comparative Examples 11 and 12, a polyoxyalkylene compound (m = 2, n = 0) was used, and ionic liquid B was used. In Examples 28 to 31 and Comparative Examples 13 and 14, a polyoxyalkylene compound (m = 8, n = 0) was used, and ionic liquid B was used. The amount of polyoxyalkylene compound added was changed. The results are shown in Table 6 below.

Silicone adhesive composition α
In Examples 32-35 and Comparative Examples 15 and 16, a polyoxyalkylene compound (m = 2, n = 0) was used, and ionic liquid C was used. In Examples 36 to 39 and Comparative Examples 17 and 18, a polyoxyalkylene compound (m = 8, n = 0) was used, and ionic liquid C was used. The amount of polyoxyalkylene compound added was changed. The results are shown in Table 7 below.

Silicone adhesive composition α
In Examples 40 to 47, the amount of ionic liquid A was 0.01 parts by mass, and in Examples 48 to 55, the amount of ionic liquid A was 2 parts by mass. The results are shown in Table 8 below.

Silicone adhesive composition α
In Comparative Examples 19 to 27, the amount of the ionic liquid A was 3 parts by mass. In Comparative Examples 28 to 30, no ionic liquid was used. The results are shown in Table 9 below.

Silicone adhesive composition α
In Comparative Examples 31 to 34, no polyoxyalkylene compound was blended. In Comparative Example 35, a polyoxyalkylene compound and an ionic liquid were not blended. The results are shown in Table 10 below.

Silicone adhesive composition α
In Comparative Examples 36 to 46, lithium salt was used instead of the component (C). The results are shown in Table 11 below.

Silicone adhesive composition α
In Comparative Examples 47 and 48, a polyoxyalkylene compound (m = 0, n = 12) was used. In Comparative Example 49 and Comparative Example 50, a polyoxyalkylene compound (m = 22, n = 0) was used. The results are shown in Table 12 below.

Silicone adhesive composition α
In Comparative Examples 51 to 56, the polyoxyalkylene compound (a) or (b) having only one unsaturated hydrocarbon group and only one polyoxyalkylene in one molecule was used. The results are shown in Table 13 below.

Silicone adhesive composition α
In Comparative Examples 57 to 56, the polyoxyalkylene compound (c) or (d) having only one polyoxyalkylene in one molecule was used. The results are shown in Table 14 below.

Silicone adhesive composition β
In Examples 56 to 59 and Comparative Examples 63 and 64, a polyoxyalkylene compound (m = 2, n = 0) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 15 below.

Silicone adhesive composition β
In Examples 60 to 63 and Comparative Examples 65 and 66, a polyoxyalkylene compound (m = 8, n = 0) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 16 below.

Silicone adhesive composition β
In Examples 64-67 and Comparative Examples 67 and 68, the polyoxyalkylene compound (m = 12, n = 0) and the ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 17 below.

Silicone adhesive composition β
In Examples 68 to 71 and Comparative Examples 69 and 70, the polyoxyalkylene compound (m = 18, n = 0) and the ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 18 below.

Silicone adhesive composition β
In Examples 72 to 75 and Comparative Examples 71 and 72, a polyoxyalkylene compound (m = 0, n = 8) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. In Examples 76 to 78, a polyoxyalkylene compound (m = 6, n = 2) and ionic liquid A were used, and the addition amount of the polyoxyalkylene compound was changed. The results are shown in Table 19 below.

Silicone adhesive composition β
In Examples 79 to 82 and Comparative Examples 73 and 74, a polyoxyalkylene compound (m = 2, n = 0) was used, and ionic liquid B was used. In Examples 83 to 86 and Comparative Examples 75 and 76, a polyoxyalkylene compound (m = 8, n = 0) was used, and ionic liquid B was used. The amount of polyoxyalkylene compound added was changed. The results are shown in Table 20 below.

Silicone adhesive composition β
In Examples 87 to 90 and Comparative Examples 77 and 78, a polyoxyalkylene compound (m = 2, n = 0) was used, and ionic liquid C was used. In Examples 91-94 and Comparative Examples 79 and 80, polyoxyalkylene compounds (m = 8, n = 0) were used, and ionic liquid C was used. The amount of polyoxyalkylene compound added was changed. The results are shown in Table 21 below.

Silicone adhesive composition β
In Examples 95-102, the amount of ionic liquid A was 0.01 parts by mass, and in Examples 103-110, the amount of ionic liquid A was 2 parts by mass. The results are shown in Table 22 below.

Silicone adhesive composition β
In Comparative Examples 81-89, the amount of the ionic liquid A was 3 parts by mass. In Comparative Examples 90 to 92, no ionic liquid was used. The results are shown in Table 23 below.

Silicone adhesive composition β
In Comparative Examples 93 to 96, no polyoxyalkylene compound was blended. In Comparative Example 97, no polyoxyalkylene compound and ionic liquid were blended. The results are shown in Table 24 below.

Silicone adhesive composition β
In Comparative Examples 98 to 108, lithium salt was used instead of the component (C). The results are shown in Table 25 below.

Silicone adhesive composition β
In Comparative Examples 109 and 110, a polyoxyalkylene compound (m = 0, n = 12) was used. In Comparative Example 111 and Comparative Example 112, a polyoxyalkylene compound (m = 22, n = 0) was used. The results are shown in Table 26 below.

Silicone adhesive composition β
In Comparative Examples 113 to 118, the polyoxyalkylene compound (a) or (b) having only one unsaturated hydrocarbon group and only one polyoxyalkylene in one molecule was used. The results are shown in Table 27 below.

Silicone adhesive composition β
In Comparative Examples 119 to 124, the polyoxyalkylene compound (c) or (d) having only one polyoxyalkylene in one molecule was used. The results are shown in Table 28 below.

In Comparative Examples 125 to 132, for the silicone pressure-sensitive adhesive composition α, a polyoxyalkylene compound (e) having two polyoxyalkylenes in one molecule and having no unsaturated group was used. The results are shown in Table 29 below.

Silicone adhesive composition β
In Comparative Examples 133-140, the polyoxyalkylene compound (e) having two polyoxyalkylenes in one molecule and no unsaturated group was used for the silicone pressure-sensitive adhesive composition β. The results are shown in Table 30 below.

As shown in Table 11 and Table 25 above, the silicone pressure-sensitive adhesive composition containing a lithium salt has poor adhesion to the base material, and causes adhesive residue on the adherend. On the other hand, the pressure-sensitive adhesive composition containing the ionic liquid and the oxyalkylene compound of the present invention has good adhesion to the substrate and does not cause adhesive residue on the adherend. Moreover, as shown in Table 10 and Table 24, the cured product of the silicone pressure-sensitive adhesive composition containing no ionic liquid and oxyalkylene compound has a surface resistivity of 15th power or higher: 1E + 15Ω / sq. Or ^{(. 1 × 10 15 Ω /} sq or more) and high cured product of a composition containing only ionic liquids containing no oxyalkylene compound surface resistivity 13 square half: 1E + 13~5E + 13Ω / sq . (1 × 10 ^{13 to} 5 × 10 ¹³ Ω / sq.) And the degree of decrease in surface resistivity is low. On the other hand, as shown in the examples, the cured products of the compositions containing the combination of the oxyalkylene compound of the present invention and the ionic liquid all have a surface resistivity of the first 10th to the 12th power: 1E + 10 to 9.9E + 12Ω / sq. . (1 × 10 ^{10 to} 9.9 × 10 ¹² Ω / sq.), Low surface resistivity, and excellent antistatic properties.

  As shown in Tables 29 and 30, the composition containing an oxyalkylene compound having no unsaturated hydrocarbon group is inferior in curability. This is because the compatibility between the oxyalkylene compound and the silicone composition is not good. Further, as shown in Table 13 and Table 27, the cured product of the composition containing an oxyalkylene compound having only one polyoxyalkylene and only one unsaturated hydrocarbon group has a low surface resistivity, but a substrate. Poor adhesion. As shown in Table 14 and Table 28, the cured product of the composition containing an oxyalkylene compound having only one polyoxyalkylene and two unsaturated hydrocarbon groups has good substrate adhesion but has a surface resistivity. high. On the other hand, the pressure-sensitive adhesive composition containing the oxyalkylene compound of the present invention has good adhesion to the substrate and low surface resistivity. That is, it is important to have two polyoxyalkylenes and two unsaturated hydrocarbon groups in order to provide an adhesive layer having excellent antistatic properties and excellent substrate adhesion.

  The silicone pressure-sensitive adhesive composition of the present invention provides a pressure-sensitive adhesive layer having excellent antistatic performance and excellent adhesion to various substrates. The pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer can be suitably used for electronic component masking, and in an environment where generation of static electricity is not preferable.

Claims (13)

An addition reaction curable silicone pressure-sensitive adhesive composition,
(A) addition-curable silicone,
(B) a compound having at least two unsaturated hydrocarbon groups in one molecule and having two (poly) oxyalkylene residues, and (C) an ionic liquid not containing lithium A silicone pressure-sensitive adhesive composition. Two (poly) oxyalkylene residues each _{- (C 2 H 4 O)} m - (C 3 H 6 O) n - represented by (wherein, m is a real number of 0 to 20, n is _2. A silicone adhesive according to claim 1, which is a real number of 0 to 10, m + n is 1 to 30, and the bonding order of (C ₂ H ₄ O) and (C ₃ H ₆ O) may be random). Agent composition. The silicone pressure-sensitive adhesive composition according to claim 2, wherein the component (B) is represented by the following formula (1).

(In the formula, A is a tetravalent hydrocarbon group having 2 to 22 carbon atoms, and R ¹ , independently of each other, has a hydrogen atom, an acyl group, or an unsaturated bond having 1 to 12 carbon atoms. A monovalent hydrocarbon group which may have an oxygen atom, and at least two of R ¹ are aliphatic hydrocarbons having 2 to 12 carbon atoms and an unsaturated bond which may have an oxygen atom Each of m ¹ and m ² is independently a real number of 0 to 20, and n ¹ and n ² are independently of each other a real number of 0 to 10, provided that m ¹ + n ¹ is 0 In addition, m ² + n ² is not 0, and the bonding order of (C ₂ H ₄ O) and (C ₃ H ₆ O) may be random). The silicone pressure-sensitive adhesive composition according to claim 3, wherein the component (B) is represented by the following formula (2).

(A and R ¹ are as described above, and m ³ and m ⁴ are each independently a real number of 1 to 20)   (C) The ionic liquid is at least one selected from the group consisting of a quaternary ammonium salt, a quaternary phosphonium salt, an imidazolium salt, a pyridinium salt, and a pyrrolidinium salt. The silicone pressure-sensitive adhesive composition according to item.   The silicone pressure-sensitive adhesive composition according to claim 5, wherein the ionic liquid is a quaternary ammonium salt composed of a quaternary ammonium cation and a bis (trifluoromethylsulfonyl) imide anion.   In formula (1) or (2), A is a chain or branched aliphatic saturated hydrocarbon group having 2 to 16 carbon atoms or a cyclic hydrocarbon group having 6 to 22 carbon atoms. The silicone adhesive composition of any one of -6.   (A) The amount of the component (B) is 0.27 to 3.3 parts by mass and the amount of the component (C) is 0.003 to 1.5 parts by mass with respect to a total of 100 parts by mass of the addition-curable silicone. The silicone pressure-sensitive adhesive composition according to claim 1, which is a part. (A) Addition-curable silicone is the following components (a) to (c),
(A) 20 to 100 parts by mass of a linear diorganopolysiloxane having two or more alkenyl groups in one molecule,
_^(B) (R 4) has a _{3 SiO 0.5} units and SiO ₂ ^units, Oruganopori molar ratio of _(R 4) _{3 SiO 0.5} units / SiO ₂ units is 0.6 to 1.7 Siloxane (R ⁴ is a monovalent hydrocarbon group having 1 to 10 carbon atoms) 0 to 80 parts by mass, provided that the total mass of component (a) and component (b) is 100 parts by mass, and (c) one molecule Organohydrogenpolysiloxane having two or more SiH groups in it
The amount that the ratio of the number of SiH groups of the component (c) to the total number of unsaturated hydrocarbon groups of the component (a) and the component (B) is 1 to 20
And (d) a reaction control agent (a) 0 to 8 parts by mass with respect to a total of 100 parts by mass of the component and (b) component, and (e) an addition reaction catalyst.
The component (B) is included in an amount of 0.27 to 3.3 parts by mass with respect to a total of 100 parts by mass of the components (a), (b) and (c), and the component (C) is the above ( The silicone pressure-sensitive adhesive composition according to any one of claims 1 to 8, which is contained in an amount of 0.003 to 1.5 parts by mass with respect to 100 parts by mass in total of components a), (b) and (c). object.   Furthermore, the silicone adhesive composition of any one of Claims 1-9 containing an organic solvent.   Hardened | cured material of the silicone adhesive composition of any one of Claims 1-10.   The adhesive tape which has a sheet-like base material and the layer which consists of a hardened | cured material of Claim 11 laminated | stacked on the at least 1 surface of this base material.   The adhesive film which has a sheet-like base material and the layer which consists of a hardened | cured material of Claim 11 laminated | stacked on the at least 1 surface of this base material.