JP2016200394A - Measurement instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an electronic component from jumping out from a holding part.SOLUTION: A measurement instrument includes: a holding part 3 for holding a chip component 100 placed on a groove part 13; a movement mechanism 4 causing prove parts 50a and 50b to be brought into contact with electrodes 101a and 101b of the chip component 100 held by the holding part 3 by moving the prove part 50b to a length direction of the groove part 13; and a cover part 5 for covering a measuring position 13b at which the chip component 100 is located in the groove part 13 when the prove parts 50a and 50b are brought into contact with the electrodes 101a and 101b, respectively. The cover part 5 is constituted to be capable of switching between a first state for opening the measuring position 13b and a second state for covering the measuring position 13b in synchronization with the moving operation of the probe part 50b by the movement mechanism 4 so as to be maintained in the first state in a state in which the probe 50b is located in the initial position, and is switched to the second state when the probe parts 50a and 50b are brought into contact with the electrodes 101a and 101b, respectively.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a measurement jig including a holding unit that holds an electrical component to be measured and a moving mechanism that brings a probe unit into contact with the electrical component.

  As this type of measuring jig, a measuring jig disclosed by the applicant in Patent Document 1 below is known. This measurement jig is configured to include a base and an electrode slide mechanism. The electrode slide mechanism includes a holding base that holds an object to be measured, an electrode plate that functions as a probe, and a fixed electrode support that is fixed to the base, and an electrode plate that supports the electrode plate and a fixed electrode support. A movable electrode support disposed on the base so as to be movable toward and away from the base, and a biasing spring that biases the movable electrode support toward the fixed electrode support. When measuring an object to be measured using this measuring jig, grip the operating knob attached to the movable electrode support, and then support the movable electrode against the biasing force of the biasing spring. Slide the body away from the fixed electrode support. At this time, the distance between the tip of the electrode plate supported by the fixed electrode support and the tip of the electrode plate supported by the movable electrode support is widened. Subsequently, the object to be measured is set on the holding table so as to be positioned between the tip portions of the electrode plates. Next, while maintaining the state where the operation knob is held, the force against the biasing force of the biasing spring is loosened, and the movable electrode support is slid in the direction close to the fixed electrode support. At this time, the tip of each electrode plate is pressed against the electrode of the object to be measured by the biasing force of the biasing spring. Next, the measurement is started.

Japanese Unexamined Patent Publication No. 2014-20819 (page 5-11, FIG. 1-5)

  However, the measurement jig disclosed by the applicant has the following problems to be improved. That is, in this measuring jig, the movable electrode support is biased toward the fixed electrode support by the biasing spring, so that the biasing force acts on the object to be measured and the object to be measured is removed from the holding base. The measurement may be interrupted by jumping out, or the object to be measured may be lost due to jumping out.

  The present invention has been made in view of such a problem to be improved, and a main object of the present invention is to provide a measuring jig that can prevent an electrical component from jumping out of a holding portion.

  In order to achieve the above object, the measurement jig according to claim 1 has a groove portion on which an electric component to be measured can be placed, and a holding portion for holding the electric component placed on the groove portion, Each probe is moved to a pair of contacted parts facing each other in the electrical component held by the holding part by moving the probe to be moved in the length direction of the groove part with at least one of the pair of probe parts as a moving object. A measuring jig provided with a moving mechanism for bringing the respective parts into contact with each other, wherein each of the probe parts comes into contact with the contacted part of the electric part, and a measurement position at which the electric part is located in the groove part. A first cover that opens the measurement position and a second cover that covers the measurement position in conjunction with the moving operation of the probe to be moved by the moving mechanism; And the probe part to be moved is maintained in the first state in a state where the probe to be moved is located at an initial position, and the probe parts come into contact with the contacted parts of the electrical component, respectively. Sometimes it is switched to the second state.

  The measuring jig according to claim 2 is the measuring jig according to claim 1, wherein the cover portion is pivotally supported by a support shaft and is rotated in conjunction with the moving operation. By doing so, the first state and the second state can be switched.

  The measurement jig according to claim 3 is the measurement jig according to claim 1 or 2, wherein the holding portion has a flat bottom surface and the bottom surface has the same depth as the bottom of the groove portion. And a concave portion formed so as to be continuous with a portion of the groove portion excluding the measurement position.

  According to the measurement jig of claim 1, the first state in which the measurement position of the groove is opened and the second state that covers the measurement position can be switched in conjunction with the movement of the probe to be moved by the movement mechanism. The cover is configured to be maintained in the first state when the probe to be moved is located at the initial position, and is switched to the second state when each probe part comes into contact with each contacted part of the electrical component. By providing the part, the measurement position can be covered by the cover part when each probe part comes into contact with each contacted part of the electrical component. That is, the cover portion functions as a lid of the groove portion, and the lid can be automatically opened and closed in conjunction with the movement operation of the probe unit to be moved. In this case, the movement of the electric component in the length direction of the groove is restricted by each probe part, and the movement of the electric component above the groove is restricted by the cover part. For this reason, according to this measuring jig, even when a force is applied from each probe part to each contacted part, it is possible to reliably avoid a situation in which the electrical component jumps out of the groove part. Therefore, according to this measuring jig, it is possible to reliably prevent the measurement from being interrupted due to the electric component jumping out of the groove and the loss of the electric component.

  According to the measurement jig of the second aspect, the first state is supported by being pivotally supported by the support shaft and rotating in conjunction with the moving operation of the probe unit to be moved by the moving mechanism. And the second state can be switched between the first state and the second state by moving the cover portion in a direction parallel to the length direction of the groove portion or a direction perpendicular to the length direction of the groove portion. Since the first state and the second state can be switched with a small amount of movement, the cover portion can be sufficiently downsized.

  According to the measurement jig of claim 3, the bottom surface is formed flat and the bottom surface is defined to have the same depth as the bottom of the groove, and is formed so as to be continuous with the portion other than the measurement position in the groove. By configuring the holding portion with the recessed portion formed, the electrical component can be moved from the bottom surface of the recessed portion to the bottom portion of the groove portion while being slid after the electrical component is placed on the bottom surface of the recessed portion. For this reason, according to this measuring jig, even when the electrical component is small, the electrical component can be easily placed in the groove portion, and as a result, the measurement efficiency can be sufficiently improved.

3 is a perspective view of the measuring jig 1 as viewed from the front panel 2a side of the main body 2. FIG. 4 is a perspective view of the measuring jig 1 as viewed from the back panel 2b side of the main body 2. FIG. 2 is a perspective view showing an internal configuration of a measurement jig 1. FIG. 2 is a plan view showing an internal configuration of a measurement jig 1. FIG. It is a perspective view of the state which disassembled the moving mechanism. FIG. 6 is a first explanatory view illustrating the operation of the measurement jig 1. It is the XX sectional view taken on the line in FIG. FIG. 6 is a second explanatory diagram illustrating the operation of the measurement jig 1. FIG. 10 is a third explanatory diagram illustrating the operation of the measurement jig 1. It is the YY sectional view taken on the line in FIG.

  Hereinafter, embodiments of a measuring jig will be described with reference to the accompanying drawings.

  First, the configuration of the measurement jig 1 shown in FIGS. 1 and 2 as an example of the measurement jig will be described with reference to the drawings. As shown in both drawings, the measuring jig 1 includes a main body 2, a holding unit 3, a moving mechanism 4, a cover 5, and probe units 50a and 50b (see FIG. 3; hereinafter, "probe unit 50" unless otherwise distinguished). For example, the measurement target chip component 100 (an example of an electrical component) shown in FIG. 6 is held, and the probe unit 50 can be brought into contact with the held chip component 100. Yes. 3 to 10, the panels 2b to 2f described later in the main body 2 are illustrated in a removed state.

  As shown in FIGS. 1 and 2, the main body 2 is formed in a rectangular parallelepiped box shape, for example, and is configured to accommodate the holding unit 3 and the moving mechanism 4 therein. In addition, a plurality of BNC connectors (BNC plugs) of connection cables for inputting / outputting electric signals between the probe unit 50 and a measuring device (not shown) are connected to the front panel 2a of the main body unit 2 (in this example). Four) BNC connectors 10 (BNC receptacles) are provided.

  As shown in FIGS. 1 and 2, when the chip part 100 is held in the holding part 3 by notching a part of the back panel 2 b and the top panel 2 c in the main body part 2, the chip part 100. An opening 2g for taking in and out is formed. Further, as shown in FIG. 1, the side panel 2 e of the main body 2 is formed with a notch 2 h that protrudes the lever 22 of the component 21 c (see FIG. 3) constituting the moving mechanism 4 to the outside of the main body 2. Has been.

  As shown in FIGS. 3 and 4, the holding unit 3 includes a pedestal 11 and a holding member 12. The pedestal 11 is attached to the bottom panel 2 d of the main body 2. The holding member 12 is fixed on the base 11. Further, as shown in FIG. 6, a groove portion 13 in which the chip component 100 can be placed is formed on the upper surface of the holding member 12. In this case, the groove 13 has a rectangular cross section as shown in FIG. Further, as shown in FIG. 6, a recess 14 is formed on the upper surface of the holding member 12. In this case, the concave portion 14 is a part of the groove portion 13 excluding the measurement position 13b (see FIG. 9) where the chip component 100 is located in the groove portion 13 when the probe portions 50a and 50b come into contact with the electrodes 101a and 101b of the chip component 100, respectively. It is formed so as to be continuous with a portion (in this example, a portion on the left side in FIG. 6 with respect to the measurement position 13b). As shown in FIG. 7, the recess 14 has a flat bottom surface 14a and a depth to the bottom surface 14a that is the same as the depth to the bottom portion 13a of the groove 13 (that is, the bottom portion 13a The bottom surface 14a is flush with the bottom surface 14a).

  The moving mechanism 4 moves the probe portion 50b in the length direction of the groove portion 13 in the holding portion 3 (the direction of arrow A shown in FIG. 3; hereinafter, also referred to as “A direction”) and holds the holding portion 3 (holding portion). The probe parts 50a, 50b can be brought into contact with the electrodes 101a, 101b (a pair of contacted parts facing each other: see FIG. 9) of the chip component 100 placed in the three groove parts 13). Specifically, as shown in FIGS. 3 to 5, the moving mechanism 4 includes component parts 21 a to 21 h, a lever 22, a bearing 23, and a spring 24.

  As shown in FIGS. 3 to 5, the component 21 a is configured by a rail and extends in a direction orthogonal to the A direction (direction indicated by an arrow B in each drawing: hereinafter also referred to as “B direction”). Thus, the bottom panel 2d of the main body 2 is fixed. The component 21b is disposed on the component 21a and is configured to be slidable in the B direction on the component 21a. The component 21c is disposed on the component 21b and fixed with a screw 60 (see FIG. 5). The component 21c is provided with a lever 22 used for a moving operation for moving the probe portion 50b in the A direction. Further, as shown in FIG. 4, the component 21 c is provided with an inclined portion 31 that is inclined with respect to the B direction (also inclined with respect to the A direction).

  The component 21d is composed of a rail, and is fixed to the bottom panel 2d of the main body 2 so as to extend in the A direction as shown in FIGS. The component 21e is disposed on the component 21d and is configured to be slidable in the A direction on the component 21d. The component 21f is disposed on the component 21e and is fixed by a screw 60 (see FIG. 5). Further, a bearing 23 is rotatably attached to an end portion (left end portion in FIGS. 3 to 5) of the component 21f.

  As shown in FIGS. 3 to 5, the component part 21 g is disposed on the component part 21 e and fixed by a screw 60 (see FIG. 5). The component 21g is configured to hold the probe unit 50b. The component 21h is fixed to the end of the component 21f (the right end in each drawing). Further, as shown in FIG. 4, the component 21h is provided with an inclined portion 32 that is inclined with respect to the B direction (also inclined with respect to the A direction). As an example, the spring 24 is composed of a tension coil spring, and biases the component parts 21e to 21h in the direction in which the probe portions 50a and 50b are close to each other (the direction of the arrow A1 shown in FIG. 4). Act).

  In the moving mechanism 4, as shown in FIG. 4, when the component 21c is located on the front panel 2a side (upper side in the figure) (when the lever 22 of the component 21c is located at the position P1). ), A portion (hereinafter also referred to as “parallel portion 33”) parallel to the B direction on the back panel 2b side of the inclined portion 31 of the component 21c is in contact with the bearing 23 attached to the component 21f. Yes. In this state, the component parts 21e to 21h are located on the side panel 2e side (left side in the figure), and the tip parts of the probe parts 50a and 50b are separated from each other.

  Further, in this moving mechanism 4, as shown in FIG. 8, when the component 21c is located on the rear panel 2b side (lower side in the figure) (the lever 22 of the component 21c is located at the position P2). The tip end side of the inclined portion 31 of the component 21c is in contact with the bearing 23. In this state, the component parts 21e to 21h are located on the side panel 2f side (the right side in the figure), and the tip parts of the probe parts 50a and 50b are close to each other. That is, in the moving mechanism 4, a cam mechanism is configured by the component 21 c and the bearing 23.

  As shown in FIG. 9, the cover portion 5 is a member that covers the measurement position 13b of the groove portion 13 where the chip component 100 is located when the probe portions 50a and 50b are in contact with the electrodes 101a and 101b of the chip component 100, respectively. The holding part 3 is disposed on the upper surface of the holding member 12. In this case, the cover portion 5 is pivotable along a plane parallel to the bottom panel 2d by being pivotally supported by a support shaft 5a (see FIG. 3) arranged in a direction orthogonal to the bottom panel 2d. It is configured. Moreover, the cover part 5 is urged | biased by the direction which rotates clockwise in planar view by the spring (For example, the torsion coil spring pivotally supported by the spindle 5a) outside a figure. In addition, the cover unit 5 includes a first state (a state illustrated in FIG. 6) in which the measurement position 13b is opened in conjunction with the movement operation of the probe unit 50b (the probe unit to be moved) by the movement mechanism 4, and the measurement position 13b. Is switched to the second state (the state shown in FIG. 9) covering the. Specifically, the probe unit 50b is maintained in the first state when the probe unit 50b is located at the initial position (the state shown in FIGS. 4 and 6), and the probe units 50a and 50b are respectively connected to the electrodes 101a and 101b of the chip component 100. When contacted (shown in FIG. 9), the state is switched to the second state.

  As an example, the probe parts 50a and 50b are probe parts for measuring the amount to be measured by the four-terminal method, and are arranged in a cylindrical first probe (not shown) and the first probe. Each probe comprises a rod-like second probe (not shown) that can be moved minutely in the length direction via an urging member. Further, in this measuring jig 1, as shown in FIGS. 3 and 4, the probe unit 50a is fixed to the fixed base 51, and the probe unit 50b (the probe to be moved) is held by the component 21g of the moving mechanism 4. Thus, it is moved in the A direction (the length direction of the groove 13). That is, only one of the probe parts 50a and 50b is configured to be movable in the A direction.

  Next, a method for measuring the measured amount of the chip component 100 using the measuring jig 1 will be described with reference to the drawings.

  First, a BNC connector (BNC plug) of a connection cable (not shown) is connected to the BNC connector 10 disposed on the front panel 2a of the main body 2 in the measurement jig 1, and the measurement device and measurement outside the figure are measured. The jig 1 is connected. Next, as shown in FIG. 4, the lever 22 of the component 21c in the moving mechanism 4 is positioned at the position P1. In this case, since the component parts 21e to 21h in the moving mechanism 4 are urged by the spring 24 in the direction of the arrow A1 shown in the figure (the direction toward the side panel 2f), the bearing 23 attached to the component part 21f. Is in contact with the parallel portion 33 of the component 21c.

  In this state, the component parts 21e to 21h are located on the side panel 2e side (left side in FIG. 4), the probe part 50b is located at the initial position, and the tip parts of the probe parts 50a and 50b are separated from each other. Further, in this state, as shown in FIG. 4, the cover portion 5 is in the first state in which the measurement position 13 b of the groove portion 13 formed in the holding member 12 of the holding portion 3 is opened. Further, the inclined portion 32 of the component 21h abuts on the outer peripheral portion of the cover portion 5 to restrict the clockwise rotation of the cover portion 5 due to the urging force of a spring (not shown). For this reason, the cover part 5 is maintained in the first state.

  Subsequently, the chip component 100 is set in the groove 13 of the holding unit 3. Specifically, first, as shown in FIG. 6, the chip component 100 is placed on the bottom surface 14 a of the recess 14 formed in the holding member 12. Next, the chip component 100 is moved from the concave portion 14 to the groove portion 13 by pushing the chip component 100 using a bar or the like. In this case, since the bottom surface 14a of the concave portion 14 and the bottom portion 13a of the groove portion 13 are flush with each other (see FIG. 7), smooth movement can be achieved by sliding the chip component 100 from the bottom surface 14a to the bottom portion 13a. It is possible to do. Note that a plurality of chip components 100 to be measured can be placed on the bottom surface 14a of the recess 14 and the chip components 100 can be moved to the groove 13 one by one each time measurement is performed. That is, the recess 14 can be used as a standby place for the chip component 100 to be moved to the groove 13.

  Subsequently, as shown in FIG. 8, the lever 22 of the component 21c is moved to the back panel 2b side of the main body 2 to be positioned at the position P2. At this time, the inclined portion 31 of the component 21c moves in the direction of the arrow B1 (direction toward the rear panel 2b) shown in the figure, and accordingly, the contact portion between the bearing 23 and the component 21c is a parallel portion. It moves from 33 to the inclined part 31, and then moves along the inclined part 31 in the direction of the arrow A1. Thereby, the component parts 21e-21h move to the direction of arrow A1, and the probe part 50b currently hold | maintained at the component part 21g is moved to the direction of arrow A1, ie, the direction close | similar to the probe part 50a. As a result, as shown in FIG. 9, the probe parts 50a and 50b are in contact with the electrodes 101a and 101b of the chip component 100, respectively.

  On the other hand, as shown in FIG. 8, the inclined portion 32 of the component 21h and the cover 5 are separated (the contact state is released) as the components 21e to 21h move to the arrow A1. At this time, the cover 5 is rotated clockwise by the urging force of the spring not shown in the figure, and is switched to the second state covering the measurement position 13b of the groove 13 in the holding part 3 as shown in FIG. In this second state, as shown in FIG. 10, since the upper part of the measurement position 13b is covered with the cover part 5, even if force is applied from the probe parts 50a, 50b to the electrodes 101a, 101b, the chip component 100 is applied. Can be reliably prevented from jumping out of the groove 13 (measurement position 13b).

  Subsequently, the measurement device is operated to measure the amount to be measured for the chip component 100. In this case, since the chip component 100 is prevented from jumping out of the groove 13, the measured amount of the chip component 100 can be reliably measured.

  Next, the chip component 100 for which measurement has been completed is taken out from the groove 13. At this time, as shown in FIG. 4, the lever 22 is moved to the front panel 2a side of the main body 2 to be positioned at the position P1. At this time, as shown in the figure, the inclined portion 31 of the component 21c moves in the direction of the arrow B2 (direction toward the front panel 2a) shown in the figure, and accordingly, the bearing 23 and the component 21a The contact portion moves along the inclined portion 31 in the direction of the arrow A2, and then moves from the inclined portion 31 to the parallel portion 33.

  As a result, the component parts 21e to 21h move in the direction of the arrow A2 shown in FIG. 4, and the probe portion 50b held by the component part 21g is moved in the direction of the arrow A2, that is, away from the probe portion 50a. Then, as shown in FIG. 6, the contact of the probe parts 50a and 50b with the electrodes 101a and 101b of the chip component 100 is released. Further, as shown in FIG. 4, the inclined part 32 of the component part 21 h abuts on the outer peripheral part of the cover part 5 by the movement of the component part 21 h, and the cover part 5 is rotated counterclockwise. The cover unit 5 is switched from the second state to the first state. Next, the chip component 100 is taken out from the opened measurement position 13b. Thus, the measurement of the measured amount for the chip component 100 is completed.

  As described above, according to the measuring jig 1, the first state in which the measurement position 13b of the groove 13 is opened and the second state in which the measurement position 13b is covered in conjunction with the movement of the probe unit 50b by the moving mechanism 4. And the probe portion 50b is maintained in the first state when the probe portion 50b is located at the initial position, and the probe portions 50a and 50b are in contact with the electrodes 101a and 101b of the chip component 100, respectively. By providing the cover part 5 that can be switched to the two states, the measurement position 13b can be covered by the cover part 5 when the probe parts 50a and 50b come into contact with the electrodes 101a and 101b of the chip component 100. That is, the cover part 5 functions as a cover of the groove part 13, and can automatically open and close the cover in conjunction with the movement operation of the probe part 50b. In this case, the movement of the chip part 100 in the A direction (the length direction of the groove part 13) is restricted by the probe parts 50a and 50b, and the movement of the chip part 100 above the groove part 13 is restricted by the cover part 5. For this reason, according to this measuring jig 1, even if force is applied to the electrodes 101a and 101b from the probe portions 50a and 50b, it is possible to reliably avoid the situation where the chip component 100 jumps out of the groove portion 13. Therefore, according to this measuring jig 1, it is possible to reliably prevent interruption of measurement due to the chip component 100 jumping out of the groove 13 and loss of the chip component 100.

  Further, according to the measuring jig 1, the first state and the second state are supported by being pivotally supported by the support shaft 5a and rotating in conjunction with the moving operation of the probe unit 50b by the moving mechanism 4. Since the cover portion 5 is configured to be switchable between the states, the cover portion 5 is moved in a direction parallel to the length direction (A direction) of the groove portion 13 or a direction orthogonal to the length direction of the groove portion 13 to thereby change the first state. Compared to the configuration for switching between the state and the second state, the first state and the second state can be switched with a small amount of movement, and thus the cover portion 5 can be sufficiently downsized.

  Further, according to the measuring jig 1, the bottom surface 14a is formed flat and the bottom surface 14a is defined to have the same depth as the bottom portion 13a of the groove portion 13 and is continuous with a portion of the groove portion 13 excluding the measurement position 13b. Since the holding portion 3 is configured to include the recess 14 formed as described above, after the chip component 100 is placed on the bottom surface 14 a of the recess 14, the chip component 100 is placed on the bottom portion 13 a of the groove portion 13 from the bottom surface 14 a of the recess 14. Can be moved while sliding. For this reason, according to this measuring jig 1, even when the chip component 100 is small, the chip component 100 can be easily placed in the groove portion 13, and as a result, the measurement efficiency can be sufficiently improved. Can do.

  The configuration of the measurement jig is not limited to the above configuration. For example, although the configuration example in which the probe unit 50a is fixed and only the probe unit 50b is moved in the A direction has been described above, a configuration in which both the probe units 50a and 50b are moved in the A direction may be employed.

  Further, the example in which the cover portion 5 is configured to be rotatable along a plane parallel to the bottom panel 2d has been described above. For example, the cover portion 5 is pivotally supported on a support shaft parallel to the bottom panel 2d, and the support shaft is the center. The cover portion that can be rotated so as to increase or decrease the inclination angle with respect to the bottom panel 2d is in a first state in which the measurement position 13b is opened when the inclination angle of the cover portion is 90 ° or more, and the inclination angle of the cover portion It is also possible to adopt a configuration in which the second state covering the measurement position 13b is obtained when is 0 °.

  Further, the configuration example in which the cover unit 5 is rotated in conjunction with the moving operation of the probe unit 50b by the moving mechanism 4 to switch between the first state and the second state has been described above. Then, the cover 5 is moved in a direction parallel to the A direction (the length direction of the groove 13), a B direction (a direction orthogonal to the A direction), and a direction inclined with respect to the A direction or the B direction. A configuration that switches between the first state and the second state can also be employed.

  In addition, the example using the probe unit 50 for the four-terminal method provided with the first probe and the second probe has been described above. However, the configuration using the probe unit (probe for the two-terminal method) configured by a single probe is used. It can also be adopted.

  Further, the moving mechanism 4 moves the probe portion 50b (components 21e to 21h) in a direction in which the probe portions 50a and 50b come close to each other by the urging force (the urging force in the pulling direction) of the spring 24 constituted by the tension coil spring. As described above, the moving mechanism 4 can be configured to move the probe portion 50b in this direction by the urging force (the urging force in the pressing direction) of the compression coil spring. Further, the moving mechanism 4 is configured to move the probe portion 50b in a direction in which the probe portions 50a and 50b are close to each other by an urging force of a spring other than the coil spring (for example, a leaf spring) or an urging force of an elastic material such as rubber. You can also.

DESCRIPTION OF SYMBOLS 1 Measuring jig 3 Holding part 4 Moving mechanism 5 Cover part 5a Support shaft 50a, 50b Probe part 12 Holding member 13 Groove part 13a Bottom part 13b Measurement position 14 Recessed part 14a Bottom face 100 Chip parts 101a, 101b electrode

Claims (3)

A holding part for holding the electric part placed on the groove part and having a groove part on which the electric part to be measured can be placed, and at least one of the pair of probe parts in the length direction of the groove part. A measuring jig comprising: a moving mechanism for moving the probe to be moved to bring the probe parts into contact with a pair of opposed contact parts of the electrical component held by the holding part; ,
A cover portion that covers a measurement position where the electrical component is located in the groove when the probe portions come into contact with the contacted portion of the electrical component;
The cover unit is configured to be able to switch between a first state in which the measurement position is opened and a second state in which the measurement position is covered in conjunction with a movement operation of the probe to be moved by the movement mechanism, Measurement that is maintained in the first state when the probe to be moved is located at the initial position, and is switched to the second state when the probe parts come into contact with the contacted parts of the electrical component. Jig.   2. The cover portion is rotatably supported by a support shaft, and is configured to be able to switch between the first state and the second state by rotating in conjunction with the moving operation. The measuring jig described.   The holding portion includes a concave portion formed so that the bottom surface is formed flat and the bottom surface is defined to have the same depth as the bottom portion of the groove portion and is continuous with a portion other than the measurement position in the groove portion. The measuring jig according to claim 1 or 2.

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