JP2016195208A - Housing for housing substrate and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing for housing a substrate which is easily assembled in a short time, and to provide a manufacturing method of an electronic device.SOLUTION: A housing for housing a substrate of the invention includes: a housing body having frame members connected in a line and a hinge part provided between the adjacent frame members; a connection part which connects the frame members at both ends in the housing body; and a holding part which is provided on an inner surface of at least one of the frame members and holds the substrate. The frame members are formed in a frame shape so as to enclose the substrate in a state where the substrate is held by the holding part and the frame members at both ends are connected by the connection part to house the substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate housing case and an electronic device manufacturing method capable of easily and reliably housing a plurality of substrates, for example.

  As a casing used for an electronic apparatus such as a power supply device, a box-shaped combination of casing members formed of sheet metal is often used. A substrate constituting the electronic device is housed in a housing and connected to an external device via a connector or the like. Further, in an electronic device including a plurality of substrates, a plurality of substrates are accommodated in a housing, and electrical connection between the substrates is performed by a harness or the like.

  Here, Patent Literature 1 discloses a technique for reducing the manufacturing cost by avoiding the consumption of a pressing mold when the casing constituent member is manufactured by pressing. Patent Document 2 discloses a technique for reducing the number of times of tightening a screw for fixing a casing constituent member. Patent Document 3 discloses a technique in which two units constituting a case have the same shape, so that these units can be manufactured with a single mold, and the unit can be configured with a mold having a simple configuration. ing. Furthermore, Patent Document 4 discloses a power supply device box in which the upper case is easily removed.

JP 2014-195021 A JP 2014-195019 A JP 2000-252646 A JP 11-135957 A

  However, there is a problem that as the number of members constituting the housing increases, the time and labor of assembly increases. In any case of Patent Documents 1 to 4, a plurality of casing components are fixed and assembled with screws. For this reason, when manufacturing an electronic device, it takes much time to assemble the casing constituent member together with fixing the substrate in the housing, and it is difficult to reduce the assembly manufacturing time.

  The objective of this invention is providing the manufacturing method of the housing | casing for board | substrate storage which can be assembled easily and in a short time, and an electronic device.

  In order to solve the above-described problems, a substrate storage housing according to the present invention includes a housing body having a plurality of frame members connected in a row and a hinge portion provided between adjacent frame members, and a housing. A substrate having a connection part for connecting frame members at both ends of the body body and a holding part for holding the board provided on the inner surface of at least one of the plurality of frame members, with the board held by the holding part. A plurality of frame members are configured in a frame shape so as to surround the periphery of the frame, and the substrate is stored by connecting the frame members at both ends at connection portions.

  According to such a configuration, since the plurality of frame members connected in a row are rotatably provided by the hinge portion, the plurality of frame members are bent from the hinge portion to form a frame shape, and both ends are connected by the connection portion. By connecting the frame members, a frame-shaped housing can be easily configured. For this reason, when holding the board with the holding part, it is done with the frame members at both ends open, after holding the board, surround the board with multiple frame members, and connect the frame members at both ends with the connection part By doing so, it is possible to easily and quickly form a frame-shaped housing in which the substrate is housed.

  In the substrate housing case of the present invention, the plurality of frame members and the hinge portion may be integrally formed. According to such a configuration, the number of parts of the housing body can be reduced to one, and the assembly time can be shortened.

  In the substrate storage housing of the present invention, the holding unit may hold a plurality of substrates at intervals. According to such a configuration, a plurality of substrates can be accommodated in a casing main body configured in a frame shape.

  In the substrate housing case of the present invention, it is provided on the inner surface of at least one of the plurality of frame members and is fitted with an electrode protruding from each of the plurality of substrates to obtain electrical continuity between the plurality of substrates. You may further provide the board | substrate conduction | electrical_connection part. According to such a configuration, an electrical continuity between a plurality of substrates can be obtained without having to provide a separate wiring such as a harness by fitting the electrodes protruding from each of the plurality of substrates and the inter-substrate conduction portion. Can do.

  In the substrate housing case of the present invention, the holding portion has a plurality of grooves for inserting each of the plurality of substrates, the inter-substrate conduction portion has a U-shaped terminal for sandwiching the electrodes, and the substrate is formed into the groove. The electrode may be fitted to the U-shaped terminal when inserted. According to such a structure, the electrode of a board | substrate is fitted to a U-shaped terminal by inserting each of a some board | substrate in the groove | channel of a holding | maintenance part. Thereby, holding | maintenance of a some board | substrate and electrical continuity between board | substrates can be performed together.

  The housing for housing a substrate according to the present invention has a connector-side coil disposed to face a substrate-side coil provided on each of a plurality of substrates, and is non-contact between the substrate-side coil and the connector-side coil. You may further provide the electromagnetic connector which transmits / receives a signal and communicates between several board | substrates. According to such a configuration, a communication path between a plurality of substrates can be easily configured by an electromagnetic connector that can send and receive signals without contact.

  An electronic device manufacturing method according to the present invention is a method for manufacturing an electronic device using the above-described substrate housing, wherein the frame members at both ends of the substrate housing are opened in the recesses provided in the jig. A plurality of frame members are formed in a frame shape so as to surround the periphery of the substrate, and the frame members on both ends are connected to each other at the connection portion. And a storing step.

  According to such a configuration, the substrate housing is disposed in the recess of the jig, and the frame members at both ends are held in an open state. Then, after holding the substrate in the holding portion in this state, a plurality of frame members are configured in a frame shape so as to surround the substrate, and the frame members at both ends are connected to each other by the connection portions. Can be manufactured easily and in a short time.

  In the electronic device manufacturing method of the present invention, in the step of holding the substrate, a plurality of substrates may be held at intervals in the holding portion. According to such a configuration, a plurality of substrates can be accommodated in a casing main body configured in a frame shape.

  In the method for manufacturing an electronic device of the present invention, a step of disposing the frame members at both ends of the housing for housing the substrate in the recessed portion provided in the jig, and a step of holding a plurality of substrates in the holding portion, A process of obtaining electrical continuity between the plurality of substrates by fitting the electrodes and the substrate-to-substrate conducting portions, and a plurality of frame members configured in a frame shape so as to surround the plurality of substrates, and the frames at both ends And a step of connecting the members with each other through a connecting portion and storing the substrate.

  According to such a configuration, an electrical continuity between the plurality of substrates can be obtained without having to provide a separate wiring such as a harness by fitting the electrodes protruding from each of the plurality of substrates and the inter-substrate conduction portion. Electronic equipment can be manufactured.

  In the method for manufacturing an electronic device according to the present invention, a step of disposing the frame members at both ends of the substrate housing case in an open state in a recess provided in the jig, and a plurality of grooves in each of the plurality of grooves of the holding portion. Inserting each of the boards, fitting the electrodes and U-shaped terminals, and configuring a plurality of frame members in a frame shape so as to surround the plurality of boards, and connecting the frame members at both ends at the connection portion And a step of storing the substrate.

  According to such a structure, the electrode of a board | substrate is fitted to a U-shaped terminal by inserting each of a some board | substrate in the groove | channel of a holding | maintenance part. Thereby, holding | maintenance of a some board | substrate and electrical conduction between board | substrates can be performed together, and an electronic device can be manufactured.

  In the method for manufacturing an electronic device of the present invention, a step of disposing the frame members at both ends of the housing for housing the substrate in the recessed portion provided in the jig, and a step of holding a plurality of substrates in the holding portion, The step of attaching the electromagnetic connector so that the board side coil and the connector side coil are arranged to face each other, and a plurality of frame members are formed in a frame shape so as to surround the plurality of boards, and the frame members at both ends are connected to each other. And connecting and storing the substrate.

  According to such a configuration, an electronic device having a communication path between a plurality of substrates can be easily manufactured by an electromagnetic connector capable of transmitting and receiving signals without contact.

(A) And (b) is a perspective view which shows the example of the electronic device using the housing | casing for board | substrate storage which concerns on 1st Embodiment. (A)-(c) is a schematic diagram which shows the example of arrangement | positioning of the board | substrate in a housing | casing main body. (A) And (b) is a schematic diagram which shows the example of attachment of a radiation fin. (A) And (b) is a schematic diagram which shows the example of the processus | protrusion for providing a clearance gap. (A) And (b) is a schematic diagram which illustrates the bus-bar which concerns on 2nd Embodiment. It is a perspective view which shows the example of attachment of an electrode. (A) And (b) is a perspective view which shows the example of the electromagnetic connector which concerns on 3rd Embodiment. It is a circuit diagram which shows an example of an electromagnetic connector and a communication circuit. (A)-(d) is sectional drawing which illustrates the manufacturing method of the electronic device which concerns on 4th Embodiment. (A)-(e) is a schematic diagram which illustrates another manufacturing method.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same members are denoted by the same reference numerals, and the description of the members once described is omitted as appropriate.

[First Embodiment]
FIGS. 1A and 1B are perspective views illustrating examples of an electronic apparatus using the substrate housing case according to the first embodiment. FIG. 1A shows the entire electronic device 1 and FIG. 1B shows a state in which the substrate housing 10 is opened.

  The substrate storage housing 10 according to the present embodiment includes a housing body 20, a connection unit 30, and a holding unit 40. The housing body 20 includes a plurality of frame members 21 connected in a row and a hinge portion 22 provided between adjacent frame members 21. In the example shown in FIG. 1, four frame members 21 </ b> A, 21 </ b> B, 21 </ b> C, and 21 </ b> D are connected in a row through the hinge portion 22. The frame-shaped housing body 20 is configured by bending the four frame members 21A, 21B, 21C, and 21D by approximately 90 degrees with respect to the adjacent portions by the hinge portion 22.

  A folded piece 23 is provided at each edge of the plurality of frame members 21. By providing the folded piece 23, the strength of the frame member 21 is increased. The folded piece 23 is also used as a part of a holding unit 40 described later.

  The connecting portion 30 is a portion that connects the frame members 21 at both ends of the plurality of frame members 21. In the example shown in FIG. 1, the connection portion 30 is provided between the frame member 21A and the frame member 21D arranged at both ends of the four frame members 21A, 21B, 21C, and 21D. If the frame members 21A and 21D at both ends are connected by the connecting portion 30 in a state where the four frame members 21A, 21B, 21C, and 21D are configured in a frame shape, the frame shape of the housing body 20 is maintained.

  The connecting part 30 securely connects the frame members 21A and 21D at both ends, for example, by fitting the concave part and the convex part. In a state before the casing body 20 is configured in a frame shape, the frame members 21A and 21D at both ends are open as shown in FIG. On the other hand, when the casing body 20 is configured in a frame shape, the frame members 21A and 21D at both ends are connected by the connecting portion 30 as shown in FIG.

  The connection part 30 may be provided so that attachment or detachment is possible as needed. Thereby, when maintenance is needed after assembly, the housing body 20 can be easily opened. Moreover, the connection part 30 may not be easily opened when it is once fitted as required. Thereby, the inside can be reliably protected after assembling.

  The holding portion 40 is provided on the inner surface of at least one of the plurality of frame members 21. The holding unit 40 is a part that holds the substrate PB in the housing body 20. The holding portion 40 is provided with a groove 41, and the substrate PB is inserted into the groove 41. In the example shown in FIG. 1, the holding portion 40 is provided on the inner surface of the frame member 21 </ b> B. For example, a plurality of holding units 40 are provided for one substrate PB.

  The holding unit 40 may be provided so as to hold the plurality of substrates PB at intervals. That is, the holding part 40 and the groove | channel 41 may be provided corresponding to each of each board | substrate PB. In the example shown in FIG. 1, two substrates PB <b> 1 and PB <b> 2 are held by the holding unit 40. In a state where the two substrates PB1 and PB2 are held by the holding unit 40, the four frame members 21A, 21B, 21C, and 21D are configured in a frame shape so as to surround the substrates PB1 and PB2, and the frames at both ends are formed. The members 21 </ b> A and 21 </ b> D are connected by the connection part 30. As a result, the two substrates PB1 and PB2 are accommodated in the casing body 20 configured in a frame shape.

  If each of the two substrates PB1 and PB2 is arranged close to the edge side (the folded piece 23 side) of the frame member 21, these substrates PB1 and PB2 serve as a side surface of the housing.

  In the present embodiment, it is desirable that the plurality of frame members 21 and the hinge portion 22 in the housing body 20 are integrally formed. In addition, it is more desirable that the connection part 30 and the holding part 40 are integrally formed together with the plurality of frame members 21 and the hinge part 22.

  The housing body 20, the connection part 30, and the holding part 40 are integrally formed of, for example, plastic. For example, polypropylene is used as the plastic. By integrally molding the housing body 20, the connection part 30, and the holding part 40 by plastic injection molding, an increase in the number of parts is suppressed. The hinge portion 22 is formed thinner than the thickness of the frame member 21. Thereby, even if it is integral molding, the frame member 21 can be bent by the hinge portion 22.

  As the substrate PB, an aluminum substrate may be used in addition to the glass epoxy substrate. The aluminum substrate has a wiring pattern formed on one surface of an aluminum plate via an insulating layer, for example. The aluminum substrate has high heat dissipation. As shown in FIG. 1, when an aluminum substrate is used as the substrates PB1 and PB2 exposed from the side surface of the housing, the electronic device 1 is excellent in heat dissipation.

  As described above, in the substrate housing case 10 according to the present embodiment, the frame-type case body 20 can be configured without using a fastening member such as a screw separately. Accordingly, preparation and management of fastening parts, preparation of tools for attaching fastening parts, handling management (torque management, calibration of torque meter, etc.), installation work, and the like are not required. In particular, since screw tightening work is not required, work defects such as screw loosening, forgetting to tighten, and screw crushing do not occur. Furthermore, tapping of screw holes is unnecessary, and a tapping tool is also unnecessary. By eliminating the need for fastening members such as screws, it is possible to significantly reduce work man-hours and costs.

  2A to 2C are schematic views showing examples of arrangement of the substrates in the housing body. 2A is a perspective view showing a state where the housing body 20 is opened, and FIGS. 2B and 2C are cross-sectional views of the electronic apparatus 1. FIG.

  As shown in FIG. 2A, the substrates PB1 and PB2 are inserted into the groove 41 of the holding portion 40 provided on the inner surface of the frame member 21B. When the substrates PB1 and PB2 are respectively held by the holding unit 40, the substrates PB1 and PB2 are arranged substantially in parallel at a predetermined interval. When the substrates PB1 and PB2 are arranged close to the folded piece 23 side, a groove 41 may be formed between the holding portion 40 and the folded piece 23.

  2B shows an example in which two substrates PB1 and PB2 are arranged on the housing body 20. FIG. Each of the substrates PB1 and PB2 is inserted into a groove 41 provided between the holding portion 40 and the folded piece 23. The groove 41 is provided with a taper that becomes narrower from the opening side to the back side. As a result, the substrate PB can be easily inserted into the groove 41, and the holding force is gradually increased by the insertion so that the substrate PB can be reliably fixed.

  2C shows an example in which four substrates PB1, PB2, PB3, and PB4 are arranged on the housing body 20. As shown in FIG. The holding unit 40 is provided corresponding to the number of substrates PB to be stored. When the four substrates PB1, PB2, PB3, and PB4 are accommodated, the substrates PB1, PB2, PB3, and PB4 are inserted into the grooves 41 of the holding portions 40 that are provided correspondingly. By holding the plurality of substrates PB by the holding unit, a predetermined interval is provided between the substrates PB in the housing body 20. Thereby, sufficient heat dissipation is ensured.

  In the example shown in FIGS. 2B and 2C, the holding portions 40 are provided on each of the inner surface of the frame member 21B and the inner surface of the frame member 21D with respect to one substrate PB. Thereby, the board | substrate PB can be hold | maintained up and down. In addition, the holding | maintenance part 40 should just be provided in the inner surface of at least any one of the some frame member 21, and may be provided in the inner surface of all the frame members 21. FIG.

  FIGS. 3A and 3B are schematic views showing an example of attachment of the radiation fins. 3A shows a perspective view of the electronic apparatus 1 provided with the heat radiation fins FB, and FIG. 3B shows a cross-sectional view. In order to further improve the heat dissipation of the electronic device 1, heat dissipation fins FB may be provided. The radiating fins FB are attached so as to be in close contact with the substrate PB constituting the side surface of the casing.

  The heat radiating fins FB are inserted between the substrate PB and the folded pieces 23 constituting the side surface of the housing. That is, a fastening member such as a screw is not required to attach the heat radiation fin FB. If necessary, heat radiation grease may be applied between the substrate PB and the heat radiation fin FB.

  4A and 4B are schematic views showing examples of protrusions for providing a gap. 4A shows a perspective view of the substrate housing case 10 provided with the protrusions 24, and FIG. 4B shows a front view showing an example in which two electronic devices 1 are arranged. .

  The protrusion 24 is provided outside the folded piece 23. In the example shown in FIG. 4A, two protrusions 24 are provided at a predetermined interval on one folded piece 23. As shown in FIG. 4B, when the two electronic devices 1 are disposed adjacent to each other, the protrusions 24 come into contact with each other. Thereby, a gap of at least twice the height of the protrusion 24 is ensured between the two electronic devices 1. This gap creates a space for air to flow between the two electronic devices 1, and the heat dissipation effect can be enhanced even when the two electronic devices 1 are arranged adjacent to each other.

  In addition, by making the shape of the protrusion 24 into an arc shape, when the electronic device 1 is slid and stored in a rack or the like, the adjacent protrusions 24 come into smooth contact with each other and are easily stored.

[Second Embodiment]
FIGS. 5A and 5B are schematic views illustrating a bus bar according to the second embodiment. FIG. 5A illustrates a schematic view illustrating the relationship between the bus bar 50 and the substrate, and FIG. 5B illustrates an enlarged view illustrating the connection between the electrode 55 and the bus bar 50. 5A and 5B, the substrate housing 10 is omitted for convenience of explanation.

  The bus bar 50 is a board-to-board conduction part for obtaining electrical conduction between the plurality of boards PB. The bus bar 50 is provided on the inner surface of at least one of the plurality of frame members 21 and is fitted to the electrode 55 protruding from each of the substrates PB to obtain conduction between the substrates PB. When the plurality of substrates PB are arranged substantially in parallel at a predetermined interval, the bus bar 50 is arranged so as to straddle the plurality of substrates PB. The bus bar 50 is made of a metal such as phosphor bronze, stainless steel, iron or copper. The electrode 55 is made of, for example, pure copper or a plate bent product.

  The bus bar 50 is provided with a hole (not shown), and the convex portion provided on the inner surface of the frame member 21 is fitted into the hole provided in the bus bar 50 and then fixed by deforming the head of the convex portion. The The fixing of the bus bar 50 is not limited to this. For example, the bus bar 50 may be hooked and fixed to a claw (not shown) provided on the inner surface of the frame member 21.

  The bus bar 50 is provided with a clip-shaped U-shaped terminal 51, and the electrode 55 of the substrate PB is inserted into the U-shaped terminal 51. Here, it is desirable that the electrode 55 of the substrate PB is fitted to the U-shaped terminal 51 of the bus bar 50 when the substrate PB is inserted into the groove 41 of the holding portion 40. As a result, the connection to the bus bar 50 is completed while holding the substrate PB.

  One bus bar 50 is provided with a plurality of U-shaped terminals 51 at an equal pitch. In addition, by providing the shape of the bus bar 50 symmetrically in the left-right direction and in the front-rear direction, the configuration of the mold can be simplified, and the bus bar 50 can be assembled regardless of the directionality.

FIG. 6 is a perspective view showing an example of electrode attachment.
The electrode 55 to be fitted to the U-shaped terminal 51 of the bus bar 50 needs to be attached at an accurate position on the surface of the substrate PB. The electrode 55 is soldered to the land L of the substrate PB. In this embodiment, as an example, four lands L are arranged at predetermined intervals of 2 × 2 in length and width, and the electrodes 55 are soldered on the lands L.

For example, copper is used as the material of the electrode 55. The electrode 55 has a flange portion 55b on the substrate PB side, and a line-shaped recess 55a is formed on the back surface of the flange portion 55b. By arranging the concave portions 55a in accordance with the gaps between the lands L and soldering, the attracting force of the solder to the electrodes 55 is evenly distributed to both sides centered on the concave portions 55a, and the centers of the four lands L are accurately set. An electrode 55 can be attached to the substrate.
If the four lands L are arranged 2 × 2 in length and width, it is possible to work the solder attracting force in a balanced manner in the front / rear and left / right directions, so that the electrode 55 can be mounted on the center of the four lands L with high accuracy. is there.
The land L may be n × n in the vertical and horizontal directions (n is an integer of 3 or more), and the shape of one land L may be a shape other than a rectangle (circular, triangular, hexagonal, etc.).

  If the electrode 55 protruding from the board PB and the U-shaped terminal 51 of the bus bar 50 are fitted in this way, electrical conduction between the plurality of boards PB is performed without providing a separate wiring such as a harness. be able to. For this reason, the board PB can be inserted into the groove 41 of the holding portion 40 of the board housing case 10 and the connection by fitting the bus bar 50 and the electrode 55 can be performed, and the assembly time can be shortened.

  In particular, since the harness is unnecessary, preparation and management of the harness, harness handling work, harness processing tool, calibration of the harness processing tool, and the like become unnecessary. In particular, since the harness handling work is not required, work defects such as removal of the pins of the harness, incorrect insertion, and partial disconnection of the connector do not occur. Further, since there is no harness handling work, it is possible to significantly reduce work man-hours and costs.

[Third Embodiment]
FIGS. 7A and 7B are perspective views showing an example of an electromagnetic connector according to the third embodiment. FIG. 7A shows a perspective view of the electronic apparatus 1 to which the electromagnetic connector 60 is attached, and FIG. 7B shows an enlarged view of a place where the electromagnetic connector 60 is attached.

  The electromagnetic connector 60 is a wiring member for performing non-contact communication between the plurality of substrates PB. The electromagnetic connector 60 includes a connector-side coil 62 that is disposed to face the substrate-side coil 61 provided on each of the plurality of substrates PB.

  The board side coil 61 is formed as a wiring pattern in a portion near the edge of the board PB. The electromagnetic connector 60 includes a support portion 601 disposed so as to straddle the plurality of substrates PB, and an extending portion 602 extending from the support portion 601 along the surface of the substrate PB. The extending portion 602 is provided at a position facing the board-side coil 61 when the electromagnetic connector 60 is disposed so as to straddle the plurality of boards PB. Therefore, by providing the connector side coil 62 in the extending portion 602, the connector side coil 62 and the board side coil 61 are arranged to face each other at a predetermined interval.

  The electromagnetic connector 60 is fixed by being inserted into a recess (not shown) provided at the end of the substrate PB. By providing the electromagnetic connector 60 with a recess (not shown), the recesses are engaged and aligned. The electromagnetic connector 60 may be attached to the inner surface of the frame member 21D. Thereby, when the frame member 21D is closed to form a frame shape, the electromagnetic connector 60 is arranged at a predetermined position.

  For non-contact communication between the board side coil 61 and the connector side coil 62, for example, an electromagnetic induction method is used. For this reason, the board | substrate side coil 61 and the connector side coil 62 are arrange | positioned at the space | interval which can transmit / receive a signal by electromagnetic induction.

FIG. 8 is a circuit diagram illustrating an example of an electromagnetic connector and a communication circuit.
A plurality of connector-side coils 62 provided in the electromagnetic connector 60 are connected in series to form a closed circuit. On the other hand, the board side coil 61 is connected to the communication circuit 65 provided on each board PB. The board side coil 61 and the connector side coil 62 are arranged to face each other at a predetermined interval. An iron core may be disposed between the board side coil 61 and the connector side coil 62. A signal output from a certain communication circuit 65 is transmitted to the board-side coil 61 connected to the communication circuit 65, and is transmitted to the connector-side coil 62 facing the board-side coil 61. Then, the signal transmitted to the electromagnetic connector 60 is transmitted from the other connector side coil 62 to the other communication circuit 65 via the other board side coil 61.

  Here, the communication method using the electromagnetic connector 60 is, for example, a carrier wave of 10 MHz, a baud rate of 9600 bps, a modulation method OOK (On Off Keying), and half-duplex serial communication. As a result, addresses, commands, data, and the like are transmitted and received in byte units.

  By using the electromagnetic connector 60 that can perform such non-contact signal transmission / reception, a communication path between the plurality of substrates PB can be easily configured, and the assembly is performed as compared with the case of using a contact type connector. Time can be shortened.

[Fourth Embodiment]
9A to 9D are cross-sectional views illustrating a method for manufacturing an electronic device according to the fourth embodiment.
The method for manufacturing the electronic device 1 according to the present embodiment is a method for manufacturing the electronic device 1 using the substrate housing 10 described above.

  First, as shown in FIG. 9A, a jig 90 having a recess 90a is prepared. Then, the substrate housing 10 is disposed in the recess 90 a of the jig 90. That is, the frame member 21B is disposed along the bottom of the recess 90a, and the frame members 21A and 21C adjacent to the frame member 21B are disposed so as to stand substantially 90 degrees along the side surface of the recess 90a. The frame member 21D facing the frame member 21B is opened. Thereby, the frame members 21A, 21B, and 21C are disposed in a concave shape along the inner surface of the recess 90a.

  Next, as illustrated in FIG. 9B, the substrate PB is inserted into the concave mold constituted by the frame members 21 </ b> A, 21 </ b> B, and 21 </ b> C and is held by the holding unit 40. The holding part 40 is provided on the inner surface of the frame member 21B, for example. The substrate PB is inserted into the groove 41 of the holding unit 40. When the bus bar 50 is provided on the inner surface of the frame member 21B, the electrode 55 of the board PB is fitted to the U-shaped terminal 51 of the bus bar 50 together with the insertion of the board PB. When storing a plurality of substrates PB, the same insertion of the substrates PB is repeated.

  Next, as shown in FIG. 9C, the electromagnetic connector 60 is attached. The electromagnetic connector 60 is disposed above the plurality of substrates PB so as to straddle them. In addition, when the electromagnetic connector 60 is unnecessary, it is not necessary to perform this process.

  Next, as illustrated in FIG. 9D, the frame member 21 </ b> D is closed and the frame member 21 </ b> D and the frame member 21 </ b> A are connected by the connection portion 30. Here, when the bus bar 50 is attached to the inner surface of the frame member 21D, the U-shaped terminal 51 of the bus bar 50 is fitted with the electrode 55 of the substrate PB when the frame member 21D is closed. If the bus bar 50 is provided on the open end side of the frame member 21D, the position of the bus bar 50 can be easily grasped from the open end side when the frame member 21D is closed, and reliable and easy fitting with the electrode 55 is performed. Can do.

  The electronic device 1 is completed by closing the frame member 21 </ b> D and connecting the frame member 21 </ b> A to the frame member 21 </ b> A through the connection portion 30. By forming the frame-shaped housing body 20 with the integrally formed frame members 21A, 21B, 21C, and 21D, it is possible to assemble the electronic device 1 with a small number of steps without using additional fastening parts such as screws. Become.

10A to 10E are schematic views illustrating other manufacturing methods.
Also in other manufacturing methods, the electronic apparatus 1 is manufactured using the board | substrate housing | casing housing | casing 10 demonstrated previously.

  First, as shown in FIG. 10A, the frame member 21A, 21B, 21C and 21D is opened, and the jig 95 is arranged. FIG. 10B shows a plan view of the state in which the jig 95 is disposed as viewed from above. The jig 95 has a back surface portion 951 and side surface portions 952 and 953. Each of the side surface portions 952 and 953 is connected to both ends of the back surface portion 951. The back surface portion 951 is a member that keeps the distance between the side surface portions 952 and 953 constant. The side surface portions 952 and 953 are provided with a groove 95a serving as a guide for inserting the substrate PB. Further, the side surface portion 952 is provided with a concave portion 95b that does not interfere with a component PT1 (see FIG. 10C) that protrudes outward from the substrate PB when the substrate PB is inserted. Further, a similar concave portion 95b is also provided in the side surface portion 953 as necessary.

  When such a jig 95 is disposed, the side surface portion 952 is disposed on the frame member 21A, and the side surface portion 953 is disposed on the frame member 21C. At this time, the jig 95 is positioned so that the frame member 21 </ b> B fits between the side surface portions 952 and 953.

  Next, as shown in FIG. 10C, the substrate PB is inserted into the groove 95a of the jig 95, and the substrate PB is inserted into the groove 41 of the holding portion 40 provided in the frame member 21B using the groove 95a as a guide. . At this time, the component PT1 protruding outward from the substrate PB enters the recess 95b of the side surface portion 952, and thus does not interfere with the jig 95. Further, when there is a part PT2 protruding from the substrate PB, it enters into the concave portion 95b of the side surface portion 953, so that it does not interfere with the jig 95.

  When the bus bar 50 is provided on the inner surface of the frame member 21B, the electrode 55 of the board PB is fitted to the U-shaped terminal 51 of the bus bar 50 together with the insertion of the board PB. When storing a plurality of substrates PB, the same insertion of the substrates PB is repeated. Moreover, after inserting the board | substrate PB, the electromagnetic connector 60 is attached as needed.

  Next, the jig 95 is removed, and as shown in FIG. 10D, the frame members 21A and 21C are erected to cover the end portion of the substrate PB. At this time, the component PT1 protruding outward from the substrate PB is passed through the hole h1 provided in the frame member 21A, and the component PT2 is passed through the hole h2 provided in the frame member 21C.

  Next, as shown in FIG. 10E, the frame member 21 </ b> D is closed and the frame member 21 </ b> D and the frame member 21 </ b> A are connected by the connection portion 30. Here, when the bus bar 50 is attached to the inner surface of the frame member 21D, the U-shaped terminal 51 of the bus bar 50 is fitted with the electrode 55 of the substrate PB when the frame member 21D is closed.

  The electronic device 1 is completed by closing the frame member 21 </ b> D and connecting the frame member 21 </ b> A to the frame member 21 </ b> A through the connection portion 30. In this manufacturing method, even if there are parts PT1 and PT2 projecting outward from the substrate PB, the frame-shaped housing body 20 can be constituted by the integrally formed frame members 21A, 21B, 21C and 21D. Further, similarly to the manufacturing method described above, it is possible to assemble the electronic device 1 with a small number of steps without separately using fastening parts such as screws.

  As described above, according to the substrate housing case 10 and the method for manufacturing the electronic device 1 according to the embodiment, the electronic device 1 can be assembled easily and in a short time.

  In addition, although this Embodiment and its modification were demonstrated above, this invention is not limited to these examples. For example, although the quadrangular frame shape is configured by the four frame members 21A, 21B, 21C, and 21D as the substrate housing case 10, the frame shape other than the quadrangular shape (for example, hexagonal or octagonal) is formed by the plurality of frame members 21. May be configured. Further, those in which those skilled in the art appropriately added, deleted, and changed the design of each of the above-described embodiments or other examples, or combinations of the features of each embodiment as appropriate are also included in the present invention. As long as the gist is provided, it is included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Electronic device 10 ... Board housing | casing housing | casing 20 ... Main body 21,21A, 21B, 21C, 21D ... Frame member 22 ... Hinge part 23 ... Folding piece 24 ... Protrusion 30 ... Connection part 40 ... Holding part 41 ... Groove DESCRIPTION OF SYMBOLS 50 ... Bus bar 51 ... U-shaped terminal 55 ... Electrode 60 ... Electromagnetic connector 61 ... Substrate side coil 62 ... Connector side coil 90 ... Jig 90a ... Recess PB, PB1, PB2, PB3, PB4 ... Substrate

Claims (11)

A housing body having a plurality of frame members connected in a row, and a hinge portion provided between the adjacent frame members;
A connecting portion for connecting the frame members at both ends of the housing body;
A holding portion that is provided on an inner surface of at least one of the plurality of frame members and holds the substrate;
With
The plurality of frame members are configured in a frame shape so as to surround the substrate in a state where the substrate is held by the holding portion, and the frame members at both ends are connected by the connecting portion to store the substrate. A housing for storing a board characterized by the above.   The substrate housing case according to claim 1, wherein the plurality of frame members and the hinge portion are integrally formed.   3. The substrate housing case according to claim 1, wherein the holding unit holds a plurality of substrates at intervals.   An inter-substrate conducting portion that is provided on at least one inner surface of the plurality of frame members and that fits with an electrode protruding from each of the plurality of substrates to obtain electrical continuity between the plurality of substrates. The substrate storage case according to claim 3. The holding portion has a plurality of grooves for inserting each of the plurality of substrates.
The inter-substrate conduction portion has a U-shaped terminal that sandwiches the electrode,
5. The substrate housing case according to claim 4, wherein the electrode is fitted into the U-shaped terminal when the substrate is inserted into the groove.   A connector-side coil disposed opposite to the substrate-side coil provided on each of the plurality of substrates; 6. The substrate housing case according to claim 3, further comprising an electromagnetic connector that performs communication between the substrates. It is a manufacturing method of the electronic device using the housing | casing for board | substrate storage as described in any one of Claims 1-6,
Placing the frame members at both ends of the substrate housing in an open state in a recess provided in a jig; and
Holding the substrate in the holding portion;
The plurality of frame members are configured in a frame shape so as to surround the periphery of the substrate, the step of storing the substrate by connecting the frame members at both ends at the connection portion, and
A method for manufacturing an electronic apparatus, comprising:   8. The method of manufacturing an electronic device according to claim 7, wherein in the step of holding the substrate, the plurality of substrates are held at intervals in the holding portion. A method of manufacturing an electronic device using the substrate storage case according to claim 4,
Placing the frame members at both ends of the substrate housing in an open state in a recess provided in a jig; and
Holding the plurality of substrates in the holding unit;
Fitting the electrode and the inter-substrate conduction part to obtain electrical continuity between the plurality of substrates;
Configuring the plurality of frame members in a frame shape so as to surround the plurality of substrates, storing the substrates by connecting the frame members at both ends at the connection portions;
A method for manufacturing an electronic apparatus, comprising: A method for manufacturing an electronic device using the substrate storage case according to claim 5,
Placing the frame members at both ends of the substrate housing in an open state in a recess provided in a jig; and
Inserting each of the plurality of substrates into each of the plurality of grooves of the holding portion, and fitting the electrode and the U-shaped terminal;
Configuring the plurality of frame members in a frame shape so as to surround the plurality of substrates, storing the substrates by connecting the frame members at both ends at the connection portions;
A method for manufacturing an electronic apparatus, comprising: A method of manufacturing an electronic device using the substrate storage case according to claim 6,
Placing the frame members at both ends of the substrate housing in an open state in a recess provided in a jig; and
Holding the plurality of substrates in the holding unit;
Attaching the electromagnetic connector so as to face the substrate side coil and the connector side coil;
Configuring the plurality of frame members in a frame shape so as to surround the plurality of substrates, storing the substrates by connecting the frame members at both ends at the connection portions;
A method for manufacturing an electronic apparatus, comprising:

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