JP2016189412A5 - - Google Patents

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JP2016189412A5
JP2016189412A5 JP2015069225A JP2015069225A JP2016189412A5 JP 2016189412 A5 JP2016189412 A5 JP 2016189412A5 JP 2015069225 A JP2015069225 A JP 2015069225A JP 2015069225 A JP2015069225 A JP 2015069225A JP 2016189412 A5 JP2016189412 A5 JP 2016189412A5
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Prior art keywords
conductive
sheet
conductive sheet
conductive material
adhesive sheet
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JP2015069225A
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Japanese (ja)
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JP2016189412A (en
JP6451451B2 (en
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Priority claimed from JP2015069225A external-priority patent/JP6451451B2/en
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Claims (9)

バインダーと、平均アスペクト比が10〜3000の伝導性物質とを含んでなる凹部を有する伝導性シートの製造方法であって、
前記凹部の十点平均粗さRzJISが、前記伝導性物質の平均長径の1/3以上且つ前記伝導性シートの厚みの1/2以下である伝導性シートの製造方法であって、
バインダーと、平均アスペクト比が10〜3000の伝導性物質とを含んでなる伝導性シート原反の片面もしくは両面を、凸部を有する部材に接触させる接触工程と、
前記凸部を有する部材と前記伝導性シート原反と剥離させる剥離工程を含むことを特徴とする伝導性シートの製造方法。
A method for producing a conductive sheet having a concave portion comprising a binder and a conductive material having an average aspect ratio of 10 to 3000 ,
The ten-point average roughness RzJIS of the concave portion is a method for producing a conductive sheet that is 1/3 or more of the average major axis of the conductive material and 1/2 or less of the thickness of the conductive sheet,
A contact step in which one side or both sides of a conductive sheet original fabric comprising a binder and a conductive material having an average aspect ratio of 10 to 3000 are brought into contact with a member having a convex portion;
The manufacturing method of the conductive sheet characterized by including the peeling process made to peel from the member which has the said convex part, and the said conductive sheet original fabric.
伝導性物質が、熱伝導性物質である請求項1記載の伝導性シートの製造方法。   The method for producing a conductive sheet according to claim 1, wherein the conductive material is a heat conductive material. さらに、剥離工程に、伝導性シートの凹部を充填材料で充填する充填工程を含む、請求項1または2記載の伝導性シートの製造方法。   Furthermore, the manufacturing method of the conductive sheet of Claim 1 or 2 including the filling process which fills the recessed part of a conductive sheet with a filling material in a peeling process. 請求項1〜3いずれか記載の伝導性シートの製造方法で製造されてなる伝導性シート。   The conductive sheet manufactured with the manufacturing method of the conductive sheet in any one of Claims 1-3. 請求項4記載の伝導性シートを加圧してなる、伝導性接着シート。   A conductive adhesive sheet obtained by pressurizing the conductive sheet according to claim 4. 伝導性物質が、窒化ホウ素であり、
伝導性接着シートの厚み方向にX線を照射して得られるX線回折図において、窒化ホウ素の配向度(<100>面と<002>面の回折ピークの強度比(I<100>/I<002>)が0.015以上であることを特徴とする請求項5記載の伝導性接着シート。
The conductive material is boron nitride;
In the X-ray diffraction diagram obtained by irradiating X-rays in the thickness direction of the conductive adhesive sheet, the degree of orientation of boron nitride (ratio of diffraction peaks between <100> plane and <002> plane (I <100> / I <002>) is 0.015 or more, The conductive adhesive sheet according to claim 5 .
伝導性物質が、アルミナであり、
伝導性接着シートの厚み方向にX線を照射して得られるX線回折図において、アルミナの配向度(<110>面と<006>面の回折ピーク強度比(I<110>/I<006>)が5以上であることを特徴とする請求項5記載の伝導性接着シート。
The conductive material is alumina;
In the X-ray diffraction diagram obtained by irradiating X-rays in the thickness direction of the conductive adhesive sheet, the degree of orientation of alumina (diffraction peak intensity ratio between <110> plane and <006> plane (I <110> / I <006) conductive adhesive sheet according to claim 5, wherein a>) is 5 or more.
請求項〜7いずれか記載の伝導性接着シートと、発熱部材と積層してなる積層体。 A conductive adhesive sheet according to claim 5-7, wherein any one, formed by laminating a heat-generating member laminate. 発熱部材が、電子部品である請求項記載の積層体。 The laminate according to claim 8 , wherein the heat generating member is an electronic component.
JP2015069225A 2015-03-30 2015-03-30 Manufacturing method of conductive sheet Active JP6451451B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015069225A JP6451451B2 (en) 2015-03-30 2015-03-30 Manufacturing method of conductive sheet

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Application Number Priority Date Filing Date Title
JP2015069225A JP6451451B2 (en) 2015-03-30 2015-03-30 Manufacturing method of conductive sheet

Publications (3)

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JP2016189412A JP2016189412A (en) 2016-11-04
JP2016189412A5 true JP2016189412A5 (en) 2018-02-08
JP6451451B2 JP6451451B2 (en) 2019-01-16

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019057546A (en) 2017-09-19 2019-04-11 東芝メモリ株式会社 Semiconductor memory device
CN116323193A (en) * 2020-11-04 2023-06-23 琳得科株式会社 Adhesive film, adhesive film with support sheet, and structure
KR20230098130A (en) * 2020-11-04 2023-07-03 린텍 가부시키가이샤 Method for manufacturing an adhesive film, a cured body, and a structure including an adhesive film and a support sheet
JP6999054B1 (en) 2021-02-10 2022-01-18 デクセリアルズ株式会社 Supply form of heat conductive sheet and heat conductive sheet

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02166755A (en) * 1988-12-21 1990-06-27 Nec Corp Heat transfer sheet
JP2002194232A (en) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd Thermally conductive material
JP3985650B2 (en) * 2002-10-04 2007-10-03 松下電器産業株式会社 Heat dissipation substrate and manufacturing method thereof
JP5738652B2 (en) * 2011-03-30 2015-06-24 日東電工株式会社 Method for producing thermal conductive sheet and thermal conductive sheet
JP2013053294A (en) * 2011-08-09 2013-03-21 Sekisui Chem Co Ltd Connection structure
JP6023474B2 (en) * 2012-06-08 2016-11-09 デンカ株式会社 Thermally conductive insulating sheet, metal base substrate and circuit board, and manufacturing method thereof

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