JP2016189412A5 - - Google Patents
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- JP2016189412A5 JP2016189412A5 JP2015069225A JP2015069225A JP2016189412A5 JP 2016189412 A5 JP2016189412 A5 JP 2016189412A5 JP 2015069225 A JP2015069225 A JP 2015069225A JP 2015069225 A JP2015069225 A JP 2015069225A JP 2016189412 A5 JP2016189412 A5 JP 2016189412A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- sheet
- conductive sheet
- conductive material
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims 7
- 230000001070 adhesive Effects 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N N#B Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- 238000002441 X-ray diffraction Methods 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 2
- 230000001678 irradiating Effects 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Claims (9)
前記凹部の十点平均粗さRzJISが、前記伝導性物質の平均長径の1/3以上且つ前記伝導性シートの厚みの1/2以下である伝導性シートの製造方法であって、
バインダーと、平均アスペクト比が10〜3000の伝導性物質とを含んでなる伝導性シート原反の片面もしくは両面を、凸部を有する部材に接触させる接触工程と、
前記凸部を有する部材と前記伝導性シート原反と剥離させる剥離工程を含むことを特徴とする伝導性シートの製造方法。 A method for producing a conductive sheet having a concave portion comprising a binder and a conductive material having an average aspect ratio of 10 to 3000 ,
The ten-point average roughness RzJIS of the concave portion is a method for producing a conductive sheet that is 1/3 or more of the average major axis of the conductive material and 1/2 or less of the thickness of the conductive sheet,
A contact step in which one side or both sides of a conductive sheet original fabric comprising a binder and a conductive material having an average aspect ratio of 10 to 3000 are brought into contact with a member having a convex portion;
The manufacturing method of the conductive sheet characterized by including the peeling process made to peel from the member which has the said convex part, and the said conductive sheet original fabric.
伝導性接着シートの厚み方向にX線を照射して得られるX線回折図において、窒化ホウ素の配向度(<100>面と<002>面の回折ピークの強度比(I<100>/I<002>)が0.015以上であることを特徴とする請求項5記載の伝導性接着シート。 The conductive material is boron nitride;
In the X-ray diffraction diagram obtained by irradiating X-rays in the thickness direction of the conductive adhesive sheet, the degree of orientation of boron nitride (ratio of diffraction peaks between <100> plane and <002> plane (I <100> / I <002>) is 0.015 or more, The conductive adhesive sheet according to claim 5 .
伝導性接着シートの厚み方向にX線を照射して得られるX線回折図において、アルミナの配向度(<110>面と<006>面の回折ピーク強度比(I<110>/I<006>)が5以上であることを特徴とする請求項5記載の伝導性接着シート。 The conductive material is alumina;
In the X-ray diffraction diagram obtained by irradiating X-rays in the thickness direction of the conductive adhesive sheet, the degree of orientation of alumina (diffraction peak intensity ratio between <110> plane and <006> plane (I <110> / I <006) conductive adhesive sheet according to claim 5, wherein a>) is 5 or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015069225A JP6451451B2 (en) | 2015-03-30 | 2015-03-30 | Manufacturing method of conductive sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015069225A JP6451451B2 (en) | 2015-03-30 | 2015-03-30 | Manufacturing method of conductive sheet |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016189412A JP2016189412A (en) | 2016-11-04 |
JP2016189412A5 true JP2016189412A5 (en) | 2018-02-08 |
JP6451451B2 JP6451451B2 (en) | 2019-01-16 |
Family
ID=57240020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015069225A Active JP6451451B2 (en) | 2015-03-30 | 2015-03-30 | Manufacturing method of conductive sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6451451B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019057546A (en) | 2017-09-19 | 2019-04-11 | 東芝メモリ株式会社 | Semiconductor memory device |
CN116323193A (en) * | 2020-11-04 | 2023-06-23 | 琳得科株式会社 | Adhesive film, adhesive film with support sheet, and structure |
KR20230098130A (en) * | 2020-11-04 | 2023-07-03 | 린텍 가부시키가이샤 | Method for manufacturing an adhesive film, a cured body, and a structure including an adhesive film and a support sheet |
JP6999054B1 (en) | 2021-02-10 | 2022-01-18 | デクセリアルズ株式会社 | Supply form of heat conductive sheet and heat conductive sheet |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02166755A (en) * | 1988-12-21 | 1990-06-27 | Nec Corp | Heat transfer sheet |
JP2002194232A (en) * | 2000-12-26 | 2002-07-10 | Sekisui Chem Co Ltd | Thermally conductive material |
JP3985650B2 (en) * | 2002-10-04 | 2007-10-03 | 松下電器産業株式会社 | Heat dissipation substrate and manufacturing method thereof |
JP5738652B2 (en) * | 2011-03-30 | 2015-06-24 | 日東電工株式会社 | Method for producing thermal conductive sheet and thermal conductive sheet |
JP2013053294A (en) * | 2011-08-09 | 2013-03-21 | Sekisui Chem Co Ltd | Connection structure |
JP6023474B2 (en) * | 2012-06-08 | 2016-11-09 | デンカ株式会社 | Thermally conductive insulating sheet, metal base substrate and circuit board, and manufacturing method thereof |
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2015
- 2015-03-30 JP JP2015069225A patent/JP6451451B2/en active Active
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