JP2016188808A - Range sensor and components thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a range sensor that offers good vibration resistance, compactness, light weight, and a long measurement distance, which has been desired since the method involving use of a movable mirror offers a long measurement distance but is difficult to achieve vibration resistance, compactness and light weight, and the method involving irradiating an entire surface with laser light features no movable parts, vibration resistance, compactness and light weight but offers only a short measurement distance.SOLUTION: A range sensor comprises a plurality of two-dimensionally arranged light projection/reception mechanisms, each comprising a light projection element and a light receiving element, and a lens disposed in front thereof. A laser beam projected by a light projection/reception mechanism is reflected by a target object and a portion of the reflection returns to the light projection/reception mechanism, upon which distance to the target object is derived from the travel time. Having such an operation performed by the plurality of light projection/reception mechanisms enables three-dimensional recognition of the target object. A measurable distance is long as the laser beams are respectively projected in specific directions and reach the target object without being diffused. The range sensor has no movable parts and can be made compact and light-weight.SELECTED DRAWING: Figure 1

Description

The range sensor irradiates the object with a laser pulse or the like, measures the time until the reflection returns, and measures the distance to the object. By scanning this laser, two-dimensional or three-dimensional recognition including the distance to the object is possible. An object of the present invention is to provide a scanning range sensor that realizes a new measurement method and to provide a new component for realizing it. Generally called Lidar, it is an abbreviation for Light Detection and Ranging.

  The present technology relates to a range sensor. A range sensor emits laser light (generally lasers are used, but other light sources are also used), receives reflected light from the object, and measures the time it takes to return Measure the distance to the object. This technique is called TOF (abbreviation of Time of Flight) and is a well-known technique. The scanning range sensor recognizes a two-dimensional or three-dimensional space by sequentially performing a series of operations by projecting light, reflecting from an object, receiving light, and measuring time while changing the direction of light projection. To do.

  In recent years, technological development for driving support systems and automatic driving of cars has progressed, and among these, research and development of range sensors are progressing as means for recognizing objects around the car. The prior art documents are listed below.

JP 2005-55226 Scanning type range sensor US6759649 OPTOELECTRONIC DETECTION DEVICE

Title; Development of Next Generation LIDAR Source; R & D Review of Toyota CRDL, Vol.43 No.1 (2012) 7-12 Title: Design and characterization of a 256x64-pixel single-photon imager in CMOS for a MEMS-based laser scanning time-of-flight sensor Source: 21 May 2012 / Vol. 20, No. 11 / OPTICS EXPRESS 11863

There are two types of range sensors. There are a method using a mirror and a method of irradiating the entire surface within a target area without using a mirror.

  In a range sensor using a mirror, collimated laser light is projected to a measurement range while changing the angle of the mirror. When there is an object in the projected direction, the laser beam is reflected from the object. In order to receive the reflected light, the mirror is directed in the projected direction, the reflected light is guided to the light receiving element, and is detected by the light receiving element. By measuring the time until the reflected light returns, it is possible to know the distance from the flight time of the light to the object. This method is shown in FIG.

  Laser light 106 emitted from the laser diode 101 is collimated by the lens 102 and is irradiated onto the object through the mirror 103. The laser beam that reaches the object is reflected in various directions. A part of the reflected laser light reaches the mirror 103. The laser beam 110 that has arrived reaches the light receiving element 105 through the lens 104. The distance to the object is measured by measuring the time until the laser beam returns. By repeating light projection and light reception while rotating the mirror 103 around A-A ′, one-dimensional scanning in the rotation direction can be performed. As a result, two-dimensional information based on distance information from the lateral direction and the object is obtained. Although not described here, it is possible to obtain three-dimensional information including distance information in the vertical direction by changing the angle of the mirror 103 in the vertical direction and by swinging the direction of the laser light left and right and up and down. Become.

  FIG. 4 shows a method of diffusing laser light with a lens without using a mirror. The laser beams 207 and 208 projected from the laser diode 201 are enlarged and irradiated by the lens 202. The laser beams 211, 212, 213, and 214 reflected from a plurality of objects form an image on the light receiving chip 206 through the lens 205. The light receiving chip is composed of a plurality of light receiving elements. The reflected laser light from the object 203 gathers at point B ′, and the reflected laser light from the object 204 gathers at point B. Measure the time it takes for the laser to return, and measure the distance from each object.

  In the method using a mirror typified by FIG. 3, the laser beam is collimated and irradiated onto the object. Since it is a parallel beam, the intensity of the laser beam received by the object does not change even when it is far away. However, since the reflected laser light reflected from the object is reflected in various directions, the laser light reaching the mirror 103 and the lens 104 is a part thereof. The laser light reaching the lens 104 decreases in inverse proportion to the square of the distance to the object. On the other hand, from the viewpoint of safety, there is an upper limit on the intensity of the laser beam, so the measurement distance of this type of range sensor is generally about several tens of meters to several hundreds of meters. However, the rotating mirror is a precision mechanical part and is not suitable for mounting in a car with severe vibration. In addition, there are drawbacks such as an increase in the size of the device and a limited installation location.

The method of diffusing laser light represented by FIG. 4 with a lens has an advantage that there is no mechanical part. Further, since this method can emit laser light on the entire surface, there is an advantage that it is possible to easily acquire three-dimensional information consisting of up / down / left / right and distance. However, since the laser beam is irradiated on the entire upper, lower, left and right surfaces, the laser beam received by each object decreases as the distance to the object increases. Therefore, the distance that this type of range sensor can measure is short. Generally, it is about several tens of meters.

  The present invention eliminates the problem of the mechanical part and realizes a long measurement distance.

  One laser diode and a light receiving element corresponding to the laser diode have a light projecting / receiving function, and this function is arranged in a matrix in a planar manner. A lens is arranged at the tip of the lens to form a range sensor. Laser light projected from one light projecting / receiving function is projected through a lens. When there is an object in the path, the object is reflected from the path, and a part of the reflected laser light returns to the original light projecting and receiving function according to the principle of “reverse light”. The flight time of light can be measured from the time difference between light projection and light reception. The distance from the flight time to the object can be measured.

  In this range sensor, the laser light projected from the lens is parallel light or close to parallel light, so the laser light applied to the object has the same intensity as the conventional range sensor using a mirror. It is. Therefore, the measurable distance is the same as the range sensor using the conventional mirror.

  The light projecting / receiving function is arranged in a matrix. By selectively operating these light projecting and receiving functions, laser light can be projected in any direction. Therefore, the object in the direction to be observed can be recognized three-dimensionally.

  The range sensor of the present invention can be miniaturized because the measuring distance is long and there is no mechanical part such as a motor. And since it can be comprised with the semiconductor chip which mounts the light projection light reception function which consists of a lens and a semiconductor, manufacture is possible at low cost.

  Since there is no mechanical part, it can be used in poor environments such as vibration. By reducing the size, restrictions on the mounting location will be eased and it will be usable in many places. Because it is cheap, it can be used for consumer purposes.

The range sensor of the present invention. The structure of a laser diode and a light receiving element for realizing the present invention. Conventional Example 1 Range sensor using a mirror. Conventional Example 2 A range sensor that uses two lenses for light projection and light reception. The top view which shows operation | movement of the light receiving element of this invention. Timing diagram showing the method of measuring the flight time of light of the present invention Timing diagram showing a method of measuring a short distance measurement object of the present invention Timing diagram showing another method of measuring the flight time of light of the present invention The arrangement method and the selective drive method of the laser diode of this invention. 1 is a structural diagram of a laser diode of the present invention and an element for driving the laser diode. The circuit diagram which showed the drive method of the laser diode of this invention. FIG. 3 is a structural diagram of a laser diode array when the laser diode of the present invention is made larger than a hole of a light receiving element. FIG. 6 is a structural diagram showing another method for measuring a short distance measurement object according to the present invention. A structure using a variable mirror for light projection according to the present invention. The range sensor which performs the light projection and light reception of this invention with each lens.

The best mode is described in the first example.

  1 and 2 show a first embodiment. FIG. 2 is a plan view and a cross-sectional view of a light projecting / receiving component in which the light projecting / receiving function is arranged in a matrix. FIG. 1 shows a range sensor composed of a light projecting / receiving component and a lens.

  The light receiving chip 301 shown in the sectional view of FIG. 2 includes a plurality of light receiving elements 303 and a plurality of light projecting holes 302. Although not shown here, an amplifier that amplifies a weak signal from a light receiving element, a measuring instrument that measures time, a converter that converts analog to digital, and a specific light receiving element among many light receiving elements are activated. A circuit such as a selector is mounted. For these circuits, for example, existing techniques shown in Non-Patent Document 1 and Non-Patent Document 2 can be used. As a light receiving element, SPAD (Single Photon Avalanche Diode) is generally used. These circuits and SPAD are formed on a silicon substrate.

  The light projecting chip 304 includes a plurality of laser diodes 305. The laser diode 305 is disposed so as to coincide with the light projection hole 302 of the light receiving chip 301. Since the laser diode 305 is made of a compound semiconductor such as gallium and arsenic, it is difficult to form the laser diode 305 and the light receiving element 303 on the same substrate. Therefore, the laser diode 305 and the light receiving element 303 are divided into two chips in order to manufacture each with a suitable material. The light receiving chip 301 and the light projecting chip 304 are stacked to form a light projecting / receiving component 306.

  Next, the plan view of FIG. 2 will be described. When laser light is projected from the laser diode 308, the light is received by the light receiving element group 307 including the light receiving elements 311, 312, 313, 314, 315 and 316. When laser light is projected from the diode 321, the light is received by the light receiving element group 322 including the light receiving elements 314, 313, 323, 324, 325, and 326.

  In this embodiment, six light receiving elements are arranged around one laser diode, and the light receiving elements can be used as a group of adjacent light receiving elements. It is not limited to examples.

FIG. 1 shows a range sensor composed of a light projecting / receiving component and a lens. Further, for the purpose of explanation, an object whose distance is to be measured is shown.

Laser light is projected from point D of the light projecting / receiving component 306. The projected laser light reaches the object 404 by following paths 405 (solid line), 406 (solid line), and 409 (solid line), 410 (solid line). Here, the distance from the lens to the objects 403 and 404 is written several times as large as the size of the lens 402, but in reality, the diameter of the lens 402 is several millimeters to several centimeters, whereas the lens 402 The distance between the objects 403 and 404 is several meters to several hundred meters. Therefore, the path 406 and the path 410 are almost parallel. Part of the laser light reflected from the object follows the same path as when it came and returns to the projected point D. The laser light projected in this way is a substantially parallel light beam, and the laser light reaching the object does not become weak even if the distance is long. As described above, the range sensor including the light projecting / receiving component 306 and the lens 402 can realize a measurement distance equivalent to that of the range sensor using a mirror, while having a simple structure without a mechanical part.

  Here, although the light receiving element is arranged around the laser diode, the reflected laser light may return only to the laser diode and may not return to the surrounding light receiving element. This can be dealt with by appropriately selecting the focal length of the range sensor.

  FIG. 5 is a plan view of a light projecting / receiving component in the second embodiment.

  When the light is emitted from the laser diode 501, the light is received by the light receiving element group 531 including the light receiving elements 511, 152, 513, 514, 515, and 516, but a problem such as defocusing occurs. In some cases, the reflected laser beam returns to a wider range than the element group 531. In this case, light is received by the light receiving element group 532 including the light receiving elements 517, 518, 519, 520, 521, and 522 in a wider range.

  In addition, there is a method of activating a wide range of light receiving elements such as the light receiving element group 532 from the beginning and determining the light receiving elements used for calculating the flight time based on the intensity of the received laser light. Since there are a plurality of light receiving elements, it can be used in various ways.

  6 and 7 show the timing of projecting and receiving laser light in the third embodiment.

  FIG. 6 shows a waveform 601 of laser light projected from the laser diode and a waveform 602 of laser light received by the light receiving element. Moreover, the case where a target object exists in the place of 7.5 meters from a range sensor is shown.

  A laser light pulse is projected at 0 ns (t0). Since the pulse width is 10 ns, the projection is finished at 10 ns (t1). Thereafter, the light receiving element is activated in 20 ns (t2). At the time of 50 ns (t3), the light receiving element receives the reflected laser beam. The range sensor measures distance from a flight time of 50 ns. That is, since the speed of light is 0.3 meters / 1 ns, the flight distance is 15 meters. Since this is a round-trip distance, the distance to the object can be recognized as half that of 7.5 meters.

  FIG. 7 shows a waveform 701 of laser light projected from the laser diode and a waveform 702 of laser light received by the light receiving element. When the distance to the object is short, that is, here, a timing diagram in the case of 0.9 meter is shown.

  The light receiving element is activated at 0 ns (t0). Laser light is projected at 10 ns (t1). Since the distance to the object is 0.9 meters, the round-trip flight time is 6 ns, and reflected light comes at 16 ns (t2). At this time, the laser diode is being projected. Since it is next to the light receiving element, it directly receives strong laser light emitted by the laser diode, and therefore the light receiving element cannot distinguish between direct laser light from the laser diode and reflected laser light.

  FIG. 8 shows a fourth embodiment, which provides a method for measuring the flight time of laser light.

FIG. 8 is a timing diagram of light projection and light reception in the light projecting / receiving component. See also FIG.

  Consider the method of measuring the flight time in FIG. Here, it takes time until a light emitting instruction is issued from a control circuit not shown and light is emitted. In addition, it takes time until light is received and taken out as an electrical signal. In actual measurement, it is necessary to correct these times. Such correction is troublesome, and there are problems such as lowering the accuracy of measurement time. The fourth embodiment is intended to solve this problem.

  Please refer to FIG. Here, the light is emitted from the laser diode 308, and the reflected laser light is received by the six light receiving element groups 307. In the fourth embodiment, the light receiving element 331 that is not used is used for knowing the light emitting time of the laser diode.

  This operation will be described with reference to FIG. First, the light receiving element 331 is activated (t0). Thereafter, light is emitted from the laser diode 308 (t1). Since the light receiving element 331 has already been activated, the laser light projected at this time is received. Since the distance between the laser diode 308 and the light receiving element 331 is several millimeters or less, the flight time of the laser light during this period is 0.00003 ns or less and can be ignored. Accordingly, the time when the light receiving element 331 receives light is considered to be the time when the laser beam is projected, and there is no problem. After the light projection is completed, the light receiving element group 307 is activated (t3). The light receiving element group 307 receives the reflected laser beam at 60 ns (t4). The light receiving elements 331 and the light receiving elements of the light receiving element group 307 cause a delay from light reception to amplification and conversion into an electrical signal. However, these light receiving elements are made of the same circuit and have the same delay time. Therefore, (t4). From the time difference between t1 and t4, the flight time of the laser beam can be measured and the distance to the object can be recognized.

  The advantage of this method is that it is not necessary to take into account the time from the laser diode to the light projection and the time from the light reception of the light receiving element to the electric signal in the measurement of the flight time of the laser light. At the same time as the design becomes simple, the variation between parts can be eliminated, so the measurement accuracy is improved.

  This time, in order to know the light projection time, a light receiving element not used at that time was used, but a dedicated light receiving element may be provided. Since the intensity of the laser beam received at the time of light projection is stronger than the reflected light, it is possible to take special measures for receiving this laser beam.

  A seventh embodiment will be described with reference to FIG.

  Each diode on the laser diode matrix needs to emit light selectively. FIG. 9 shows a method for realizing this. Laser diodes are arranged in a matrix, and anodes are connected to common column selection lines 910, 911, and 912. The cathodes are connected to a common row selection line 913, 914, 915. Normally, the row selection lines 913, 914 and 915 are applied to 3V, and the column selection lines 910, 911 and 912 are applied to minus 3V. All laser diodes do not operate because they are negatively biased to minus 6V. Here, a case where the laser diode 905 is to emit light is considered. For this purpose, the column wiring 911 is applied to 2V and the row wiring 914 is applied to minus 2V. The laser diode 905 emits light because it is applied to 4V. The laser diodes 901, 903, 907, and 909 do not emit light because they are reverse bias of minus 6V. Since the laser diodes 902, 904, 906, and 908 have a reverse bias of minus 1 V, they do not emit light. In this way, the target laser diode emits light.

  Here, for the sake of explanation, voltage is shown. However, when light is emitted in the forward direction of the diode, the internal resistance of the diode is low.

  10 and 11 show a sixth embodiment. 2 shows a second method of driving individual laser diodes on a light emitting chip. FIG. 10 shows the structure, and FIG. 11 shows the circuit.

  The laser diode is generally made of a compound semiconductor, and the drive circuit is generally made of silicon. Therefore, separately, as shown in FIG. 10, the driving chip 1001 made of silicon is disposed between the light receiving element chip 304 and the light projecting chip 1003. The drive chip 1001 is provided with a light projection hole 1002 for allowing laser light to pass therethrough. Existing assembly techniques such as solder balls 1005 can be applied to the connection between the driving circuit on the driving chip 1001 and the diode on the light projecting chip 1003.

  A circuit of the driving circuit is shown in FIG. There are a plurality of column selection lines 1101 and a plurality of row selection lines 1102. At each intersection, there are an AND circuit 1103, a timing circuit, and a drive circuit 1104. There are also power lines and signal lines for timing circuits, but they are not shown here. The drive circuit 1104 is connected to the anode and cathode of the laser diode. The target timing circuit and the drive circuit are operated by the column selection line and the row selection line, and a current is supplied to the target laser diode at a target time to emit light.

  FIG. 12 shows a seventh embodiment.

  As shown in FIG. 12, the laser light projection hole 302 formed in the light receiving chip is small. On the other hand, in order to obtain powerful laser light, the area of the laser diode should be large. Accordingly, as shown in FIG. 12, a laser diode 1202 larger than the hole 302 is formed, and a lens 1203 for guiding the laser light projected here to the hole 302 is formed on the laser diode 1202. As a result, a more powerful laser beam can be projected, and a farther object can be measured.

  FIG. 13 shows an eighth embodiment. In the eighth embodiment, in order to measure an object at a short distance, a function of projecting a laser beam for a short distance is added.

  FIG. 13 shows a laser die auto 1301 for projecting light and a lens 1302 for diffusing laser light over the entire surface in addition to the first embodiment in order to measure an object at a short distance. It is. When the object is close, in the first embodiment, the reflected light returns before the light projection ends, and the direct light from the laser diode cannot be distinguished from the reflected light. Therefore, in order to avoid this direct light, in addition to the first embodiment, a laser die auto 1301 for projecting light, a lens 1302 for diffusing the laser light over the entire surface, and a cover 1303 covering this are provided. Is.

  FIG. 14 shows a ninth embodiment.

  In the method shown in the first embodiment, the area of each laser diode is limited, and the output of the laser diode is also limited. The ninth embodiment shows a method for projecting strong laser light.

  An embodiment will be described with reference to FIG. A single laser diode 1401, a lens 1402, and a variable mirror 1403 are disposed on the back surface of the light receiving element chip 301. Further, although not shown here, a lens 402 is arranged as in FIG. The laser light projected from the laser diode 1401 follows the laser light path 1104, the laser light path 1105, and the laser light path 1106, and reaches the hole 302 of the light receiving element chip 301. Furthermore, it reaches the lens 402 ahead. Here, since the hole 302 is small, it is necessary to devise such as focusing on the position of the hole so that the laser light projected from the laser diode passes through the small hole 302.

  In this embodiment, since there is no size restriction on the laser diode, it is possible to project a strong laser beam, so that there is an advantage that even a far object can be measured.

FIG. 15 shows a tenth embodiment.

  The projector 1501 includes a projector chip 1502 and a lens 1503. The light projecting chip 1502 includes a plurality of light projecting elements that can selectively emit light in a plane. The light receiver 1504 includes a light receiving chip 1505 and a lens 1506, and has the same shape as the projector. The difference is that the light receiving chip 1505 of the same size is replaced in place of the light projecting chip 1502. The light receiving chip has a plurality of light receiving elements which can be selectively activated arranged on a plane. A laser diode is generally used as the light projecting element. The projector 1501 and the light receiver 1504 form a range sensor.

  The laser light projected from the point E of the light projecting element reaches the lens 1503 through the paths 1507 and 1508. The lens projects these laser beams in one direction. When there is an object in that direction, the laser light is reflected from the object. Part of the irradiated laser light reaches the lens 1506 of the light receiver and gathers at a point E ′ of the light receiving chip 1505. Since the laser beams 1509, 1510, 1511 and 1512 are parallel, the point E of the light projecting chip 1502 and the point E ′ of the light receiving chip 1505 are at the same position. At the time of light projection, since the position where the light reaches in the light receiving chip is known, the light receiving element at that position can be activated in advance, and the distance from the flight time of the light to the target can be known.

  Here, the projector and the light receiver have been described as having the same shape, but need not necessarily have the same shape. It is only necessary that the path of the laser beam for projection and reception is the same depending on the selection of the lens.

  In the conventional example, the laser diode 201 is a single laser diode, and the lens diffuses the laser emitted from one point of the laser diode widely. The laser diode of the present invention has a difference in that a plurality of laser diodes can be selectively emitted. The lens is also for projecting the laser projected from the laser diode in a certain direction. Thus, laser diodes are different and lens functions are also different. In the present invention, the laser projection direction is changed by selecting the laser that emits light on the projection chip.

Since the laser projection according to the invention is parallel light or near parallel light, the laser light reaching a far object is strong and the measurement distance is long. In addition, there are no mechanical parts and vibration resistance.

  This technology can recognize the position and outline of a surrounding object three-dimensionally. And since there are no movable parts, it is strong in vibration, small in volume, light and low power.

  Possible applications include mounting on a car, recognizing objects around the car, and preventing collisions. Cars are vibrant and large sensors can affect the car design, thus avoiding these problems.

  As a second application, it can be installed in a drone. The drone flies while recognizing the surrounding environment. The light range sensor according to the present invention is suitable for a flying drone.

  The third application is considered to be deployed in factories. Factories often have many mechanical facilities and vibration, and the installation location is often limited. A small range sensor that is resistant to vibration and suitable for such a place is suitable.

  As a fourth use, it can be considered to be used in consumer life. The range sensor of the present invention has a small number of parts, and the cost of semiconductors is reduced due to the mass production effect. It is also used in the consumer sector, where low-cost demands are strong.

DESCRIPTION OF SYMBOLS 101 Laser diode 102 Lens 103 Mirror 104 Lens 105 Light receiving element 106-111 Laser light 201 Laser diode 202 Lens 203 Laser diode 204 Lens 205 Laser diode 206 Lens 207 Lens 208 Laser diode 209 Lens 210-218 Laser light 301 Light receiving chip 302 Light projection Hole 303 Light receiving element 304 Light emitting chip 305 Laser diode 306 Light emitting / receiving component 307 Light receiving element group 308 Laser diode 1504 Light receiver 1505 Light receiving chip 1506 Lens 1507-1514 Laser light

311-316 Light receiving element 321 Laser diode 322 Light receiving element group
323-326 Light receiving element 331 Light receiving element
401 Range sensor 402 Lens 403 Object 404 Object 405-412 Laser light
501 Laser diode 511-522 Light receiving element 531 Light receiving element group 532 Light receiving element group 601 Laser light waveform 602 Laser light waveform 603 Light receiving element activation time 701 Laser light waveform 702 Laser light waveform 703 Light receiving element activation time 801 Laser Light waveform 802 Laser light waveform 803 Laser light waveform 804 Light receiving element activation time 805 Light receiving element activation time 901-909 Light receiving element 910-912 Column selection line 913-915 Row selection line 1001 Driving chip 1002 Light emitting hole 1003 Projection chip 1004 Laser diode 1005 Solder ball 1101 Column selection line 1102 Row selection line 1103 AND circuit 1104 Timing circuit / drive circuit 1105 Laser diode 1201 Projection chip 1202 Laser diode 12 3 lens 1301 laser diode 1302 lens 1303 cover 1304 target 1305 target 1311-1314 laser 1321-1328 laser 1401 laser diode 1402 lens 1403 variable mirror 1404-1406 laser beam

Claims (18)

  A light projecting / receiving component characterized in that a plurality of light projecting / receiving functions comprising a light projecting element and a light receiving element are arranged on a plane, and these light projecting / receiving functions can be selectively activated.   The light projecting / receiving component according to claim 1 and a lens, and measuring the flight time of light from the time of light projected from the light projecting / receiving function and the time of light received by the light projecting / receiving function, to the object reflecting the light A range sensor characterized in that two-dimensional or three-dimensional information including the distance to an object is obtained by measuring the distance of the object and performing these operations with a plurality of light projecting and receiving functions.   2. The light receiving and receiving component according to claim 1, wherein the light to be projected is a laser beam.   The light projecting / receiving component is composed of two stacked light receiving chips and a light projecting chip. The upper light receiving chip has a plurality of light receiving elements, a light projecting hole is provided in a portion where the light projecting elements are disposed, and a lower part. 2. The light projecting / receiving component according to claim 1, wherein a plurality of light projecting elements are arranged on the light projecting chip, and the positions of the light projecting elements coincide with the light projecting holes of the upper light receiving chip.   5. The light projecting / receiving component according to claim 4, wherein the upper light receiving chip chip is made of a silicon semiconductor, and the lower light projecting chip is made of a compound semiconductor.   The light projecting / receiving component according to claim 1, wherein the light projecting / receiving function includes a single light projecting element and a plurality of light receiving elements.   7. The light projecting / receiving component having a plurality of light projecting / receiving functions composed of a single light projecting element and a plurality of light receiving elements, wherein the light receiving element can be shared with an adjacent light projecting / receiving function. Light emitting and receiving parts.   8. The light projecting / receiving component according to claim 7, wherein in the light projecting / receiving function comprising the one light projecting element and a plurality of light receiving elements, the light receiving element to be activated is changed as necessary.   2. The light projecting / receiving component according to claim 1, wherein in the light projecting / receiving function, the light receiving element is activated after the light projecting of the light projecting element is completed.   The light projecting / receiving component according to claim 1, wherein in the light projecting / receiving function, a time difference between the end of light projection and the end of light reception is measured.   In the lower light emitting chip in which a plurality of light projecting elements are arranged, laser diodes are arranged in a matrix as the light projecting elements, a plurality of column selection lines and a plurality of row selection lines are provided, and an anode is used as a column selection line. The target laser diode is caused to emit light by connecting the line selection line to a row selection line, the ratio selection laser diode is reverse-biased, and only the selected laser diode is forward-biased. Light receiving parts.   5. The light projecting / receiving component comprising a light receiving chip and a light projecting chip, wherein a drive chip for driving the light projecting element is disposed between the upper light receiving chip and the lower light projecting chip. Light receiving parts.   In the lower semiconductor chip in which a plurality of light projecting elements are arranged, a light projecting element larger than the light projecting hole of the upper semiconductor chip is formed, and a mechanism for guiding emitted light to the light projecting hole is provided. Item 5. The light receiving / receiving component according to Item 4.   3. The range sensor according to claim 2, wherein a light projecting element and a lens for projecting light to the front surface are added to the outside of the range sensor comprising a light projecting / receiving part and a lens.   3. The range sensor according to claim 2, wherein a light projecting element, a lens, and a variable mirror are used instead of the semiconductor chip below the light projecting / receiving component, and light is projected into each light projecting hole.   It consists of a light projecting chip and a lens. The light projecting chip has a plurality of light emitting elements that can selectively emit light in a plane and selectively emits light by selectively emitting light from the light projecting elements. The projector that made it possible.   17. A light receiving device comprising a light receiving chip and a lens, wherein the light receiving chip includes a plurality of light receiving elements that can be selectively activated on a plane, and selectively activates the light receiving elements based on information from a projector. Range sensor made by combining with the described projector.   18. The range sensor according to claim 17, wherein the light paths of the projector and the receiver are similar.

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