JP2016183276A - Adhesive composition and adhesive tape - Google Patents

Adhesive composition and adhesive tape Download PDF

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JP2016183276A
JP2016183276A JP2015064695A JP2015064695A JP2016183276A JP 2016183276 A JP2016183276 A JP 2016183276A JP 2015064695 A JP2015064695 A JP 2015064695A JP 2015064695 A JP2015064695 A JP 2015064695A JP 2016183276 A JP2016183276 A JP 2016183276A
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pressure
sensitive adhesive
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adhesive tape
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JP6511314B2 (en
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徳之 内田
Noriyuki Uchida
徳之 内田
真理子 赤羽
Mariko Akabane
真理子 赤羽
渡辺 重一
Juichi Watanabe
重一 渡辺
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Sekisui Chemical Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an adhesive composition capable of exhibiting a high adhesive strength and moderate tackiness, which can suitably be used in areas for fixing electronic equipment components or fixing vehicle components, and to provide an adhesive tape using the adhesive composition.SOLUTION: An adhesive composition contains a (meth)acrylic copolymer obtained by co-polymerizing a monomer mixture containing a (meth)acrylic acid ester monomer, an amide group-containing monomer, and a hydroxyl group-containing monomer, in which the monomer mixture has an incorporation amount of the amide group-containing monomer of 20 wt.% or more, as well as has an incorporation amount of the hydroxyl group-containing monomer of 0.01 to 0.3 wt.%.SELECTED DRAWING: None

Description

本発明は、電子機器部品固定用途や車輌部品固定用途に好適に用いることができる、高い粘着力と適度なタック性とを発揮できる粘着剤組成物、及び、該粘着剤組成物を用いた粘着テープに関する。 The present invention is a pressure-sensitive adhesive composition capable of exhibiting high adhesive strength and appropriate tackiness, and a pressure-sensitive adhesive using the pressure-sensitive adhesive composition, which can be suitably used for electronic device component fixing applications and vehicle component fixing applications. Regarding tape.

画像表示装置又は入力装置を搭載した携帯電子機器(例えば、携帯電話、携帯情報端末等)においては、組み立てのために両面粘着テープが用いられている。具体的には、例えば、携帯電子機器の表面を保護するためのカバーパネルをタッチパネルモジュール又はディスプレイパネルモジュールに接着したり、タッチパネルモジュールとディスプレイパネルモジュールとを接着したり、タッチパネルモジュールと筐体を接着したりするために両面粘着テープが用いられている。このような両面粘着テープは、例えば、額縁状等の形状に打ち抜かれ、表示画面の周辺に配置されるようにして用いられる(例えば、特許文献1、2)。また、車輌部品(例えば、車載用パネル)を車両本体に固定する用途にも両面粘着テープが用いられている。 In a portable electronic device (for example, a mobile phone, a portable information terminal, etc.) equipped with an image display device or an input device, a double-sided adhesive tape is used for assembly. Specifically, for example, a cover panel for protecting the surface of the portable electronic device is bonded to the touch panel module or the display panel module, the touch panel module and the display panel module are bonded, or the touch panel module and the housing are bonded. Double-sided pressure-sensitive adhesive tape is used for this purpose. Such a double-sided pressure-sensitive adhesive tape is used, for example, by being punched into a frame shape or the like and arranged around the display screen (for example, Patent Documents 1 and 2). In addition, double-sided adhesive tape is also used for fixing vehicle parts (for example, a vehicle-mounted panel) to a vehicle body.

近年の大型の携帯電子機器における部品の接着固定、車輌部品の接着固定等の用途においては、重量の大きな部品又は部材を貼り合わせる必要があり、両面粘着テープにかかる負荷が大きくなっている。また、特に近年の携帯電子機器では、表示画面の周辺を狭くしてより広い画面を確保する、いわゆる狭額縁化が進んでおり、狭額縁化した携帯電子機器では画面の周辺部の幅が極めて狭いため、接着面積が狭くとも確実に部材を固定できる高い粘着力とが求められている。
一方、電子機器部品固定用途に用いるために粘着テープを額縁状等の形状に打ち抜くためには、粘着剤層のタック性が適度な範囲にあることが要求される。粘着剤層のタック性が高すぎると、打ち抜いた後に残余の部分を除く操作(カス上げ操作)が困難となる。粘着剤層のタック性が低すぎると、打ち抜き時のセパレーターの差し替え操作が困難となる。
In applications such as adhesive bonding of parts and adhesive fixation of vehicle parts in recent large portable electronic devices, it is necessary to bond heavy parts or members, and the load on the double-sided adhesive tape is increasing. In particular, in recent portable electronic devices, the so-called narrower frame, in which the periphery of the display screen is narrowed to secure a wider screen, is progressing, and the width of the peripheral part of the screen is extremely small in the narrowed framed portable electronic device. Because of the narrowness, there is a demand for high adhesive strength that can reliably fix the member even if the bonding area is small.
On the other hand, in order to punch the adhesive tape into a frame shape or the like for use in fixing electronic equipment parts, it is required that the tackiness of the adhesive layer is in an appropriate range. If the tackiness of the pressure-sensitive adhesive layer is too high, it becomes difficult to remove the remaining portion after punching (a residue raising operation). If the tackiness of the pressure-sensitive adhesive layer is too low, it is difficult to replace the separator at the time of punching.

粘着剤組成物の粘着力とタック性を調節する方法としては、粘着付与樹脂を配合することが知られている。しかしながら、粘着付与樹脂を少量加えると、タック性は加工に適切な範囲に調整できるものの、粘着力が不充分となる。粘着付与樹脂の配合量を増やしていくと、タック性が加工に適切な範囲から急激に外れてしまうにもかかわらず、粘着力はなお不充分である。そこで、電子機器部品固定用途や車輌部品固定用途に好適に用いることができる、高い粘着力と適度なタック性とを発揮できる粘着剤組成物が求められていた。 As a method for adjusting the adhesive strength and tackiness of the pressure-sensitive adhesive composition, it is known to add a tackifier resin. However, when a small amount of tackifying resin is added, the tackiness can be adjusted to an appropriate range for processing, but the adhesive strength becomes insufficient. When the amount of tackifying resin is increased, the tackiness is still insufficient even though the tackiness is suddenly deviated from the range suitable for processing. Therefore, there has been a demand for a pressure-sensitive adhesive composition that can be suitably used for electronic device component fixing applications and vehicle component fixing applications and that can exhibit high adhesive strength and appropriate tackiness.

特開2009−242541号公報JP 2009-242541 A 特開2009−258274号公報JP 2009-258274 A

本発明は、上記現状に鑑み、電子機器部品固定用途や車輌部品固定用途に好適に用いることができる、高い粘着力と適度なタック性とを発揮できる粘着剤組成物、及び、該粘着剤組成物を用いた粘着テープを提供することを目的とする。 In view of the above situation, the present invention is a pressure-sensitive adhesive composition that can be suitably used for electronic device component fixing applications and vehicle component fixing applications, and can exhibit high adhesive strength and appropriate tackiness, and the pressure-sensitive adhesive composition. It aims at providing the adhesive tape using a thing.

本発明は、(メタ)アクリル酸エステルモノマー、アミド基含有モノマー及び水酸基含有モノマーを含有するモノマー混合物を共重合してなる(メタ)アクリル共重合体を含有し、前記モノマー混合物は、前記アミド基含有モノマーの配合量が20重量%以上、かつ、前記水酸基含有モノマーの配合量が0.01〜0.3重量%である粘着剤組成物である。
以下に本発明を詳述する。
The present invention contains a (meth) acrylic copolymer obtained by copolymerizing a monomer mixture containing a (meth) acrylic acid ester monomer, an amide group-containing monomer and a hydroxyl group-containing monomer, and the monomer mixture contains the amide group The pressure-sensitive adhesive composition has a compounding amount of the containing monomer of 20% by weight or more and a compounding amount of the hydroxyl group-containing monomer of 0.01 to 0.3% by weight.
The present invention is described in detail below.

本発明者らは、鋭意検討の結果、(メタ)アクリル酸エステルモノマー、アミド基含有モノマー及び水酸基含有モノマーを含有するモノマー混合物を共重合してなる(メタ)アクリル共重合体を含有する粘着剤組成物において、アミド基含有モノマー及び水酸基含有モノマーの配合量を一定の範囲とすることにより、高い粘着力と適度なタック性とを発揮できることを見出し、本発明を完成した。 As a result of intensive studies, the present inventors have found that a pressure-sensitive adhesive contains a (meth) acrylic copolymer obtained by copolymerizing a monomer mixture containing a (meth) acrylic acid ester monomer, an amide group-containing monomer and a hydroxyl group-containing monomer. In the composition, the present inventors have found that a high adhesive force and an appropriate tackiness can be exhibited by setting the blending amounts of the amide group-containing monomer and the hydroxyl group-containing monomer within a certain range, thereby completing the present invention.

本発明の粘着剤組成物は、(メタ)アクリル酸エステルモノマー、アミド基含有モノマー及び水酸基含有モノマーを含有するモノマー混合物を共重合してなる(メタ)アクリル共重合体を含有する。
上記(メタ)アクリル酸エステルモノマーとしては、例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n−プロピル、(メタ)アクリル酸イソプロピル、(メタ)アクリル酸ブチル、(メタ)アクリル酸2−エチルヘキシル、(メタ)アクリル酸トリデシル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸t−ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸イソボルニル、(メタ)アクリル酸n−オクチル、(メタ)アクリル酸n−ノニル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ベンジル、(メタ)アクリル酸フェノキシエチル等が挙げられる。これらの(メタ)アクリル酸エステルモノマーは単独で用いてもよく、2種以上を併用してもよい。
The pressure-sensitive adhesive composition of the present invention contains a (meth) acrylic copolymer obtained by copolymerizing a monomer mixture containing a (meth) acrylic acid ester monomer, an amide group-containing monomer and a hydroxyl group-containing monomer.
Examples of the (meth) acrylate monomer include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, (Meth) acrylic acid 2-ethylhexyl, (meth) acrylic acid tridecyl, (meth) acrylic acid stearyl, (meth) acrylic acid isobutyl, (meth) acrylic acid t-butyl, (meth) acrylic acid cyclohexyl, (meth) acrylic Isobornyl acid, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, methoxyethyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate Etc. These (meth) acrylic acid ester monomers may be used alone or in combination of two or more.

上記アミド基含有モノマーとしては、例えば、ジメチルアクリルアミド、ジエチルアクリルアミド、イソプロピルアクリルアミド、t−ブチルアクリルアミド、メトキシメチルアクリルアミド、ブトキシメチルアクリルアミド等が挙げられる。これらのアミド基含有モノマーは単独で用いてもよく、2種以上を併用してもよい。なかでも、特に高い粘着力と適度なタック性とを両立できることから、ジメチルアクリルアミド又はジエチルアクリルアミドが好適である。 Examples of the amide group-containing monomer include dimethylacrylamide, diethylacrylamide, isopropylacrylamide, t-butylacrylamide, methoxymethylacrylamide, and butoxymethylacrylamide. These amide group-containing monomers may be used alone or in combination of two or more. Among these, dimethylacrylamide or diethylacrylamide is preferable because it can achieve both high adhesive strength and appropriate tackiness.

上記モノマー混合物中における上記アミド基含有モノマーの配合量は20重量%以上である。上記アミド基含有モノマーの配合量を20重量%以上とすることにより、粘着剤組成物は、高い粘着力と適度なタック性とを発揮することができる。上記アミド基含有モノマーの配合量の好ましい下限は21重量%、より好ましい下限は22重量%である。
上記アミド基含有モノマーの配合量の上限は特に限定されないが、多すぎるとタック性を損なう可能性があることから、30重量%以下であることが好ましい。
The amount of the amide group-containing monomer in the monomer mixture is 20% by weight or more. By setting the blending amount of the amide group-containing monomer to 20% by weight or more, the pressure-sensitive adhesive composition can exhibit high adhesive force and appropriate tackiness. A preferable lower limit of the amount of the amide group-containing monomer is 21% by weight, and a more preferable lower limit is 22% by weight.
The upper limit of the amount of the amide group-containing monomer is not particularly limited, but if it is too large, the tackiness may be impaired, and therefore it is preferably 30% by weight or less.

上記水酸基含有モノマーとしては、例えば、(メタ)アクリル酸2−ヒドロキシエチル、(メタ)アクリル酸2−ヒドロキシプロピル、(メタ)アクリル酸4−ヒドロキシブチル等が挙げられる。これらの水酸基含有モノマーは単独で用いてもよく、2種以上を併用してもよい。なかでも、特に高い粘着力と適度なタック性とを両立できることから、アクリル酸2−ヒドロキシエチルが好適である。 Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and the like. These hydroxyl group-containing monomers may be used alone or in combination of two or more. Among these, 2-hydroxyethyl acrylate is preferable because it can achieve both particularly high adhesive strength and appropriate tackiness.

上記モノマー混合物中における上記水酸基含有モノマーの配合量の下限は0.01重量%、上限は0.3重量%である。上記水酸基含有モノマーの配合量をこの範囲内とすることにより、粘着剤組成物は、高い粘着力と適度なタック性とを発揮することができる。上記アミ水酸基含有モノマーの配合量の好ましい下限は0.05重量%、好ましい上限は0.2重量%である。 The lower limit of the amount of the hydroxyl group-containing monomer in the monomer mixture is 0.01% by weight, and the upper limit is 0.3% by weight. By making the compounding quantity of the said hydroxyl-containing monomer in this range, the adhesive composition can exhibit high adhesive force and appropriate tackiness. A preferred lower limit of the amount of the amyl hydroxyl group-containing monomer is 0.05% by weight, and a preferred upper limit is 0.2% by weight.

上記モノマー混合物は、必要に応じて、(メタ)アクリル酸、イタコン酸、無水マレイン酸、クロトン酸、マレイン酸、フマル酸、酢酸ビニル等の他のモノマーを含有してもよい。 The monomer mixture may contain other monomers such as (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, fumaric acid, and vinyl acetate as necessary.

上記(メタ)アクリル共重合体は、重量平均分子量(Mw)の下限が40万、好ましい上限が150万である。上記重量平均分子量(Mw)が40万以上の(メタ)アクリル共重合体を用いることにより、特に高い粘着力を有する粘着剤組成物を得ることができる。上記重量平均分子量(Mw)が150万を超えると、高粘度となって取り扱い性に劣ることがある。上記重量平均分子量(Mw)のより好ましい下限は60万、より好ましい上限は100万である。
なお、重量平均分子量(Mw)とは、GPC(Gel Permeation Chromatography:ゲルパーミエーションクロマトグラフィ)による標準ポリスチレン換算の重量平均分子量である。
The lower limit of the weight average molecular weight (Mw) of the (meth) acrylic copolymer is 400,000, and the preferable upper limit is 1,500,000. By using a (meth) acrylic copolymer having a weight average molecular weight (Mw) of 400,000 or more, a pressure-sensitive adhesive composition having particularly high adhesive strength can be obtained. When the said weight average molecular weight (Mw) exceeds 1,500,000, it may become high viscosity and it may be inferior to handleability. The minimum with said more preferable weight average molecular weight (Mw) is 600,000, and a more preferable upper limit is 1 million.
In addition, a weight average molecular weight (Mw) is a weight average molecular weight of standard polystyrene conversion by GPC (Gel Permeation Chromatography: gel permeation chromatography).

上記モノマー混合物を共重合して上記(メタ)アクリル共重合体を得るには、上記モノマー混合物を、重合開始剤の存在下にてラジカル反応させればよい。上記モノマー混合物をラジカル反応させる方法、即ち、重合方法としては、従来公知の方法が用いられ、例えば、溶液重合(沸点重合又は定温重合)、乳化重合、懸濁重合、塊状重合等が挙げられる。この際の重合開始剤、重合温度等の重合条件を調整することにより、得られる共重合体の重量平均分子量等を調整することができる。 In order to copolymerize the monomer mixture to obtain the (meth) acrylic copolymer, the monomer mixture may be radically reacted in the presence of a polymerization initiator. As a method of radical reaction of the monomer mixture, that is, a polymerization method, a conventionally known method is used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like. By adjusting the polymerization conditions such as the polymerization initiator and the polymerization temperature at this time, the weight average molecular weight and the like of the resulting copolymer can be adjusted.

上記重合開始剤は特に限定されず、例えば、有機過酸化物、アゾ化合物等が挙げられる。上記有機過酸化物として、例えば、1,1−ビス(t−ヘキシルパーオキシ)−3,3,5−トリメチルシクロヘキサン、t−ヘキシルパーオキシピバレート、t−ブチルパーオキシピバレート、2,5−ジメチル−2,5−ビス(2−エチルヘキサノイルパーオキシ)ヘキサン、t−ヘキシルパーオキシ−2−エチルヘキサノエート、t−ブチルパーオキシ−2−エチルヘキサノエート、t−ブチルパーオキシイソブチレート、t−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート、t−ブチルパーオキシラウレート等が挙げられる。上記アゾ化合物として、例えば、アゾビスイソブチロニトリル、アゾビスシクロヘキサンカルボニトリル等が挙げられる。これらの重合開始剤は単独で用いてもよいし、2種以上を併用してもよい。 The said polymerization initiator is not specifically limited, For example, an organic peroxide, an azo compound, etc. are mentioned. Examples of the organic peroxide include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5 -Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Examples include isobutyrate, t-butylperoxy-3,5,5-trimethylhexanoate, and t-butylperoxylaurate. Examples of the azo compound include azobisisobutyronitrile and azobiscyclohexanecarbonitrile. These polymerization initiators may be used alone or in combination of two or more.

本発明の粘着剤組成物は、本発明の効果を阻害しない範囲で、更に粘着付与樹脂を含有してもよい。
上記粘着付与樹脂としては、例えば、ロジンエステル系樹脂、水添ロジン系樹脂、テルペン系樹脂、テルペンフェノール系樹脂、クマロンインデン系樹脂、脂環族飽和炭化水素系樹脂、C5系石油樹脂、C9系石油樹脂、C5−C9共重合系石油樹脂等が挙げられる。これらの粘着付与樹脂は単独で用いてもよいし、2種以上を併用してもよい。なかでも、テルペンフェノール系樹脂及びロジン系樹脂からなる群より選択される少ないとも1種が好適である。
The pressure-sensitive adhesive composition of the present invention may further contain a tackifying resin as long as the effects of the present invention are not impaired.
Examples of the tackifier resins include rosin ester resins, hydrogenated rosin resins, terpene resins, terpene phenol resins, coumarone indene resins, alicyclic saturated hydrocarbon resins, C5 petroleum resins, C9. Based petroleum resin, C5-C9 copolymerized petroleum resin and the like. These tackifying resins may be used alone or in combination of two or more. Among these, at least one selected from the group consisting of terpene phenol resins and rosin resins is preferred.

上記粘着付与樹脂の含有量は特に限定されないが、上記(メタ)アクリル共重合体100重量部に対する好ましい下限は2重量部、好ましい上限は30重量部である。上記粘着付与樹脂の含有量が2重量部未満であると、充分な粘着力向上効果が得られないことがある。上記粘着付与樹脂の含有量が30重量部を超えると、上記粘着剤組成物が硬くなって、粘着力又はタックが低下することがある。上記粘着付与樹脂の含有量のより好ましい下限は5重量部、より好ましい上限は15重量部である。 Although content of the said tackifying resin is not specifically limited, The preferable minimum with respect to 100 weight part of said (meth) acryl copolymers is 2 weight part, and a preferable upper limit is 30 weight part. If the content of the tackifying resin is less than 2 parts by weight, a sufficient effect of improving the adhesive strength may not be obtained. When content of the said tackifying resin exceeds 30 weight part, the said adhesive composition may become hard and adhesive force or tack may fall. The minimum with more preferable content of the said tackifying resin is 5 weight part, and a more preferable upper limit is 15 weight part.

本発明の粘着剤組成物は、更に、架橋剤を含有してもよい。架橋剤を含有することにより、本発明の粘着剤組成物を用いて粘着テープの粘着剤層を形成したときに、その弾性率やゲル分率を調整することができる。
上記架橋剤は特に限定されず、例えば、イソシアネート系架橋剤、アジリジン系架橋剤、エポキシ系架橋剤、金属キレート型架橋剤等が挙げられる。なかでも、イソシアネート系架橋剤が好ましい。
上記架橋剤の添加量は、上記(メタ)アクリル共重合体100重量部に対して0.01〜10重量部が好ましく、0.1〜3重量部がより好ましい。
The pressure-sensitive adhesive composition of the present invention may further contain a crosslinking agent. By containing a crosslinking agent, when the adhesive layer of an adhesive tape is formed using the adhesive composition of this invention, the elasticity modulus and gel fraction can be adjusted.
The said crosslinking agent is not specifically limited, For example, an isocyanate type crosslinking agent, an aziridine type crosslinking agent, an epoxy-type crosslinking agent, a metal chelate type crosslinking agent etc. are mentioned. Of these, isocyanate-based crosslinking agents are preferred.
The addition amount of the crosslinking agent is preferably 0.01 to 10 parts by weight, and more preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the (meth) acrylic copolymer.

本発明の粘着剤組成物からなる粘着剤層を有する粘着テープもまた、本発明の1つである。
上記粘着テープは、基材を有しないノンサポートテープであってもよく、基材の一方の面に粘着剤層を有する片面粘着テープであってもよく、基材の両面に粘着剤層を有する両面粘着テープであってもよい。
The pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition of the present invention is also one aspect of the present invention.
The pressure-sensitive adhesive tape may be a non-support tape having no base material, may be a single-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on one side of the base material, and has a pressure-sensitive adhesive layer on both sides of the base material. A double-sided adhesive tape may be used.

上記基材としては特に限定されないが、例えば、ポリエステルフィルム、ポリオレフィン発泡体、ゴム系エラストマー、アクリル系エラストマー及びウレタン系エラストマーからなる群より選択される少なくとも1種を含有する単層又は多層構造の基材が好適である。 The substrate is not particularly limited. For example, a base having a single layer or a multilayer structure containing at least one selected from the group consisting of a polyester film, a polyolefin foam, a rubber elastomer, an acrylic elastomer, and a urethane elastomer. A material is preferred.

上記粘着剤層は、動的粘弾性測定から求められる23℃におけるせん断貯蔵弾性率G’の好ましい下限が9×10Pa、好ましい上限が2×10Paである。上記せん断貯蔵弾性率G’が9×10Pa未満であると、上記粘着剤層が柔らかくなりすぎて、粘着力が低下することがある。上記せん断貯蔵弾性率G’が2×10Paを超えると、上記粘着剤層が硬くなりすぎて、粘着テープが剥がれやすくなることがある。上記せん断貯蔵弾性率G’のより好ましい下限は9.5×10Pa、より好ましい上限は1.5×10Paである。
なお、23℃におけるせん断貯蔵弾性率G’は、動的粘弾性測定装置(例えば、アイティー計測制御社製のDVA−200)を用いて、周波数10Hz、昇温速度3℃/minで−40℃から140℃まで測定を行いことにより求めることができる。
The said adhesive layer has a preferable minimum of 9 * 10 < 5 > Pa and a preferable upper limit of 2 * 10 < 6 > Pa of the shear storage modulus G 'in 23 degreeC calculated | required from a dynamic viscoelasticity measurement. When the shear storage elastic modulus G ′ is less than 9 × 10 5 Pa, the pressure-sensitive adhesive layer may be too soft and the adhesive force may be reduced. When the shear storage elastic modulus G ′ exceeds 2 × 10 6 Pa, the pressure-sensitive adhesive layer may become too hard and the pressure-sensitive adhesive tape may be easily peeled off. A more preferable lower limit of the shear storage modulus G ′ is 9.5 × 10 5 Pa, and a more preferable upper limit is 1.5 × 10 6 Pa.
The shear storage modulus G ′ at 23 ° C. is −40 at a frequency of 10 Hz and a temperature increase rate of 3 ° C./min using a dynamic viscoelasticity measuring apparatus (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.). It can be determined by measuring from ℃ to 140 ℃.

上記粘着剤層は、損失正接tanδが極大値を示す温度の好ましい下限が10℃、好ましい上限が23℃である。上記損失正接tanδが極大値を示す温度がこの範囲内にあると、高い粘着力と適切なタック性を両立させやすい。上記損失正接tanδが極大値を示す温度のより好ましい下限は14℃、より好ましい上限は20℃である。
なお、上記損失正接tanδが極大値を示す温度は、動的粘弾性測定装置(例えば、アイティー計測制御社製、DVA−200)を用いて測定することができる。
The pressure-sensitive adhesive layer has a preferable lower limit of 10 ° C. and a preferable upper limit of 23 ° C. at which the loss tangent tan δ exhibits a maximum value. When the temperature at which the loss tangent tan δ exhibits the maximum value is within this range, it is easy to achieve both high adhesive force and appropriate tackiness. The more preferable lower limit of the temperature at which the loss tangent tan δ exhibits the maximum value is 14 ° C, and the more preferable upper limit is 20 ° C.
The temperature at which the loss tangent tan δ exhibits a maximum value can be measured using a dynamic viscoelasticity measuring apparatus (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.).

上記粘着剤層は、ゲル分率の好ましい下限が25重量%、好ましい上限が70重量%である。上記ゲル分率が25重量%未満であると、上記粘着剤層が柔らかくなりすぎて、粘着力やタック性が低下することがある。上記ゲル分率が70重量%を超えると、上記粘着剤層の架橋密度が高くなりすぎて、粘着テープが剥がれやすくなることがある。上記ゲル分率のより好ましい下限は40重量%、より好ましい上限は60重量%である。
なお、ゲル分率は、次のようにして測定される。まず、粘着テープを50mm×100mmの平面長方形状に裁断して試験片を作製し、試験片を酢酸エチル中に23℃にて24時間浸漬した後、酢酸エチルから取り出して、110℃の条件下で1時間乾燥させる。乾燥後の試験片の重量を測定し、下記式(1)を用いてゲル分率を算出する。なお、試験片には、粘着剤層を保護するための離型フィルムは積層されていないものとする。
ゲル分率(重量%)=100×(W2−W0)/(W1−W0) (1)
(W0:基材の重量、W1:浸漬前の試験片の重量、W2:浸漬、乾燥後の試験片の重量)
The pressure-sensitive adhesive layer has a preferred lower limit of the gel fraction of 25% by weight and a preferred upper limit of 70% by weight. If the gel fraction is less than 25% by weight, the pressure-sensitive adhesive layer may become too soft, and the adhesive strength and tackiness may decrease. If the gel fraction exceeds 70% by weight, the pressure-sensitive adhesive layer may have too high a crosslinking density, and the pressure-sensitive adhesive tape may be easily peeled off. A more preferable lower limit of the gel fraction is 40% by weight, and a more preferable upper limit is 60% by weight.
The gel fraction is measured as follows. First, the adhesive tape was cut into a flat rectangular shape of 50 mm × 100 mm to prepare a test piece. After the test piece was immersed in ethyl acetate at 23 ° C. for 24 hours, the test piece was taken out from ethyl acetate and subjected to a condition of 110 ° C. For 1 hour. The weight of the test piece after drying is measured, and the gel fraction is calculated using the following formula (1). In addition, the release film for protecting an adhesive layer shall not be laminated | stacked on the test piece.
Gel fraction (% by weight) = 100 × (W2-W0) / (W1-W0) (1)
(W0: weight of substrate, W1: weight of test piece before immersion, W2: weight of test piece after immersion and drying)

上記粘着剤層の厚みは特に限定されないが、好ましい下限は10μm、好ましい上限は100μmである。上記粘着剤層の厚みが10μm未満であると、粘着テープの粘着力が低下することがある。上記粘着剤層の厚みが100μmを超えると、粘着テープのリワーク性又は再剥離性が損なわれることがある。 Although the thickness of the said adhesive layer is not specifically limited, A preferable minimum is 10 micrometers and a preferable upper limit is 100 micrometers. When the thickness of the pressure-sensitive adhesive layer is less than 10 μm, the adhesive strength of the pressure-sensitive adhesive tape may be reduced. When the thickness of the pressure-sensitive adhesive layer exceeds 100 μm, the reworkability or removability of the pressure-sensitive adhesive tape may be impaired.

本発明の粘着テープは、粘着テープの総厚み(基材と粘着剤層の厚みの合計)の好ましい下限が100μm、好ましい上限が400μmである。粘着テープの総厚みが100μm未満であると、粘着テープの粘着力が低下することがある。粘着テープの総厚みが400μmを超えると、携帯電子機器を構成する部品の接着固定、車載部品の接着固定等の用途に適さなくなることがある。粘着テープの総厚みのより好ましい下限は150μm、より好ましい上限は300μmである。 In the pressure-sensitive adhesive tape of the present invention, the preferable lower limit of the total thickness of the pressure-sensitive adhesive tape (the total thickness of the base material and the pressure-sensitive adhesive layer) is 100 μm, and the preferable upper limit is 400 μm. If the total thickness of the adhesive tape is less than 100 μm, the adhesive strength of the adhesive tape may be reduced. If the total thickness of the pressure-sensitive adhesive tape exceeds 400 μm, it may not be suitable for applications such as adhesive fixing of parts constituting mobile electronic devices and adhesive fixing of in-vehicle parts. A more preferable lower limit of the total thickness of the pressure-sensitive adhesive tape is 150 μm, and a more preferable upper limit is 300 μm.

本発明の粘着テープの製造方法として、例えば粘着テープが両面粘着テープの場合には、以下のような方法が挙げられる。
まず、上記(メタ)アクリル共重合体と、必要に応じて架橋剤や粘着付与樹脂等に溶剤を加えて粘着剤Aの溶液を作製して、この粘着剤Aの溶液を基材の表面に塗布し、溶液中の溶剤を完全に乾燥除去して粘着剤層Aを形成する。次に、形成された粘着剤層Aの上に離型フィルムをその離型処理面が粘着剤層Aに対向した状態に重ね合わせる。
次いで、上記離型フィルムとは別の離型フィルムを用意し、この離型フィルムの離型処理面に粘着剤Bの溶液を塗布し、溶液中の溶剤を完全に乾燥除去することにより、離型フィルムの表面に粘着剤層Bが形成された積層フィルムを作製する。得られた積層フィルムを粘着剤層Aが形成された基材の裏面に、粘着剤層Bが基材の裏面に対向した状態に重ね合わせて積層体を作製する。そして、上記積層体をゴムローラ等によって加圧することによって、基材の両面に粘着剤層を有し、かつ、該粘着剤層の表面が離型フィルムで覆われた両面粘着テープを得ることができる。
As a manufacturing method of the adhesive tape of this invention, when an adhesive tape is a double-sided adhesive tape, the following methods are mentioned, for example.
First, a solution of the pressure-sensitive adhesive A is prepared by adding a solvent to the (meth) acrylic copolymer and, if necessary, a crosslinking agent or a tackifier resin, and the solution of the pressure-sensitive adhesive A is applied to the surface of the substrate. The adhesive layer A is formed by coating and completely removing the solvent in the solution by drying. Next, the release film is superimposed on the pressure-sensitive adhesive layer A so that the release treatment surface faces the pressure-sensitive adhesive layer A.
Next, a release film different from the above release film is prepared, the adhesive B solution is applied to the release treatment surface of the release film, and the solvent in the solution is completely removed by drying, thereby releasing the release film. A laminated film in which the pressure-sensitive adhesive layer B is formed on the surface of the mold film is produced. The obtained laminated film is laminated on the back surface of the base material on which the pressure-sensitive adhesive layer A is formed, with the pressure-sensitive adhesive layer B facing the back surface of the base material to produce a laminate. Then, by pressing the laminate with a rubber roller or the like, it is possible to obtain a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on both surfaces of the base material and having the surface of the pressure-sensitive adhesive layer covered with a release film. .

また、同様の要領で積層フィルムを2組作製し、これらの積層フィルムを基材の両面のそれぞれに、積層フィルムの粘着剤層を基材に対向させた状態に重ね合わせて積層体を作製し、この積層体をゴムローラ等によって加圧することによって、基材の両面に粘着剤層を有し、かつ、該粘着剤層の表面が離型フィルムで覆われた両面粘着テープを得てもよい。 In addition, two sets of laminated films are produced in the same manner, and a laminated body is produced by superposing these laminated films on both sides of the base material with the adhesive layer of the laminated film facing the base material. The laminate may be pressed with a rubber roller or the like to obtain a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on both surfaces of the substrate and having the surface of the pressure-sensitive adhesive layer covered with a release film.

本発明の粘着テープの用途は特に限定されないが、電子機器部品の固定や車載部品の固定に特に好適に用いることができる。具体的には、大型の携帯電子機器における電子機器部品の接着固定、車載部品(例えば、車載用パネル)の接着固定等に、本発明の粘着テープを用いることができる。
これらの用途における本発明の粘着テープの形状は特に限定されないが、長方形、額縁状、円形、楕円形、ドーナツ型等が挙げられる。
Although the use of the adhesive tape of this invention is not specifically limited, It can use especially suitably for fixation of electronic equipment components, and fixation of vehicle-mounted components. Specifically, the pressure-sensitive adhesive tape of the present invention can be used for adhesive fixing of electronic device parts in large-sized portable electronic devices, adhesive fixing of in-vehicle components (for example, in-vehicle panels), and the like.
The shape of the pressure-sensitive adhesive tape of the present invention in these applications is not particularly limited, and examples thereof include a rectangle, a frame shape, a circle, an ellipse, and a donut shape.

本発明の粘着テープは、適度なタック性を有することから、1mm以下の狭い線幅であっても、打ち抜いた後に残余の部分を除く操作(カス上げ操作)が容易であり、かつ、打ち抜き時のセパレーターの差し替え操作も容易である。更に、1mm以下の狭い線幅であっても高い粘着力を発揮して、電子機器部品の固定や車載部品の固定に特に好適に用いることができる。 Since the pressure-sensitive adhesive tape of the present invention has an appropriate tackiness, even if it is a narrow line width of 1 mm or less, an operation for removing the remaining portion after punching (scrap raising operation) is easy, and at the time of punching It is easy to replace the separator. Furthermore, even if it is a narrow line width of 1 mm or less, it exhibits a high adhesive force and can be particularly suitably used for fixing electronic device parts and in-vehicle parts.

本発明によれば、電子機器部品固定用途や車輌部品固定用途に好適に用いることができる、高い粘着力と適度なタック性とを発揮できる粘着剤組成物、及び、該粘着剤組成物を用いた粘着テープを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the adhesive composition which can be used suitably for an electronic equipment component fixation use or a vehicle component fixation use, and can exhibit high adhesive force and appropriate tackiness, and this adhesive composition are used. The adhesive tape which had been can be provided.

粘着テープのPUSH粘着力の評価方法を説明する模式図である。It is a schematic diagram explaining the evaluation method of PUSH adhesive strength of an adhesive tape.

以下に実施例を挙げて本発明の態様を更に詳しく説明するが、本発明はこれら実施例にのみ限定されるものではない。 Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

<(メタ)アクリル共重合体の調製>
(1)(メタ)アクリル共重合体(A)の調製
温度計、攪拌機、冷却管を備えた反応器に、(メタ)アクリル酸エステルモノマーとしてアクリル酸ブチル76.9重量部、アミド基含有モノマーとしてジメチルアクリルアミド20重量部、水酸基含有モノマーとしてアクリル酸2−ヒドロキシエチル0.1重量部、その他のモノマーとしてアクリル酸3重量部と、酢酸エチル80重量部を加え、窒素置換した後、反応器を加熱して還流を開始した。続いて、上記反応器内に、重合開始剤としてアゾビスイソブチロニトリル(AIBN)0.1重量部を添加した。70℃、5時間還流させて、(メタ)アクリル共重合体(A)の溶液を得た。
得られた(メタ)アクリル共重合体(A)について、カラムとしてWater社製「2690 Separations Model」を用いてGPC法により重量平均分子量を測定したところ68万であった。
<Preparation of (meth) acrylic copolymer>
(1) Preparation of (meth) acrylic copolymer (A) In a reactor equipped with a thermometer, stirrer, and condenser, 76.9 parts by weight of butyl acrylate as a (meth) acrylic acid ester monomer, an amide group-containing monomer After adding 20 parts by weight of dimethylacrylamide, 0.1 part by weight of 2-hydroxyethyl acrylate as a hydroxyl group-containing monomer, 3 parts by weight of acrylic acid and 80 parts by weight of ethyl acetate as other monomers, and replacing the nitrogen, Heating was started to reflux. Subsequently, 0.1 part by weight of azobisisobutyronitrile (AIBN) was added as a polymerization initiator in the reactor. The solution was refluxed at 70 ° C. for 5 hours to obtain a solution of (meth) acrylic copolymer (A).
The obtained (meth) acrylic copolymer (A) was measured to have a weight average molecular weight of 680,000 by GPC method using “2690 Separations Model” manufactured by Water Co. as a column.

(2)(メタ)アクリル共重合体(B)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル46.9重量部とアクリル酸2−エチルヘキシル30重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(B)を得た。得られた(メタ)アクリル共重合体(B)の重量平均分子量は80万であった。
(2) Preparation of (meth) acrylic copolymer (B) (meth) acrylic copolymer except that (meth) acrylic acid ester monomer was changed to 46.9 parts by weight of butyl acrylate and 30 parts by weight of 2-ethylhexyl acrylate. A (meth) acrylic copolymer (B) was obtained by the same method as the polymer (A). The weight average molecular weight of the obtained (meth) acrylic copolymer (B) was 800,000.

(3)(メタ)アクリル共重合体(C)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル16.9重量部とアクリル酸2−エチルヘキシル55重量部に、アミド基含有モノマーをジメチルアクリルアミド25重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(C)を得た。得られた(メタ)アクリル共重合体(C)の重量平均分子量は45万であった。
(3) Preparation of (meth) acrylic copolymer (C) (Meth) acrylic acid ester monomer is 16.9 parts by weight of butyl acrylate and 55 parts by weight of 2-ethylhexyl acrylate, and amide group-containing monomer is dimethylacrylamide 25 A (meth) acrylic copolymer (C) was obtained in the same manner as the (meth) acrylic copolymer (A) except that the amount was changed to parts by weight. The weight average molecular weight of the obtained (meth) acrylic copolymer (C) was 450,000.

(4)(メタ)アクリル共重合体(D)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル46.9重量部とアクリル酸2−エチルヘキシル30重量部に、アミド基含有モノマーをジメチルアクリルアミド10重量部とジエチルアクリルアミド10重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(D)を得た。得られた(メタ)アクリル共重合体(D)の重量平均分子量は84万であった。
(4) Preparation of (meth) acrylic copolymer (D) (Meth) acrylic acid ester monomer is 46.9 parts by weight of butyl acrylate and 30 parts by weight of 2-ethylhexyl acrylate, and amide group-containing monomer is dimethylacrylamide 10 A (meth) acrylic copolymer (D) was obtained in the same manner as the (meth) acrylic copolymer (A) except that the amount was changed to 10 parts by weight and 10 parts by weight of diethylacrylamide. The weight average molecular weight of the obtained (meth) acrylic copolymer (D) was 840,000.

(5)(メタ)アクリル共重合体(E)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル16.9重量部とアクリル酸2−エチルヘキシル55重量部に、アミド基含有モノマーをジエチルアクリルアミド25重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(E)を得た。得られた(メタ)アクリル共重合体(E)の重量平均分子量は77万であった。
(5) Preparation of (meth) acrylic copolymer (E) (Meth) acrylic acid ester monomer is 16.9 parts by weight of butyl acrylate and 55 parts by weight of 2-ethylhexyl acrylate, and amide group-containing monomer is diethylacrylamide 25. A (meth) acrylic copolymer (E) was obtained in the same manner as the (meth) acrylic copolymer (A) except that the amount was changed to parts by weight. The weight average molecular weight of the obtained (meth) acrylic copolymer (E) was 770,000.

(6)(メタ)アクリル共重合体(F)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル76.8重量部に、水酸基含有モノマーをアクリル酸2−ヒドロキシエチル0.2重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(F)を得た。得られた(メタ)アクリル共重合体(F)の重量平均分子量は84万であった。
(6) Preparation of (meth) acrylic copolymer (F) The (meth) acrylic acid ester monomer was changed to 76.8 parts by weight of butyl acrylate, and the hydroxyl group-containing monomer was changed to 0.2 parts by weight of 2-hydroxyethyl acrylate. A (meth) acrylic copolymer (F) was obtained in the same manner as the (meth) acrylic copolymer (A) except that. The weight average molecular weight of the obtained (meth) acrylic copolymer (F) was 840,000.

(7)(メタ)アクリル共重合体(G)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル36.9重量部とアクリル酸2−エチルヘキシル30重量部に、アミド基含有モノマーをジメチルアクリルアミド30重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(G)を得た。得られた(メタ)アクリル共重合体(G)の重量平均分子量は65万であった。
(7) Preparation of (meth) acrylic copolymer (G) 36.9 parts by weight of (meth) acrylic acid ester monomer and 30 parts by weight of 2-ethylhexyl acrylate and dimethylacrylamide 30 as the amide group-containing monomer A (meth) acrylic copolymer (G) was obtained in the same manner as the (meth) acrylic copolymer (A) except that the amount was changed to parts by weight. The weight average molecular weight of the obtained (meth) acrylic copolymer (G) was 650,000.

(8)(メタ)アクリル共重合体(H)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル96.9重量部に変更し、アミド基含有モノマーを使用しなかった以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(H)を得た。得られた(メタ)アクリル共重合体(H)の重量平均分子量は89万であった。
(8) Preparation of (meth) acrylic copolymer (H) (meth) acrylic except that (meth) acrylic acid ester monomer was changed to 96.9 parts by weight of butyl acrylate and no amide group-containing monomer was used. A (meth) acrylic copolymer (H) was obtained by the same method as for the copolymer (A). The weight average molecular weight of the obtained (meth) acrylic copolymer (H) was 890,000.

(9)(メタ)アクリル共重合体(I)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル81.9重量部とアクリル酸2−エチルヘキシル15重量部に変更し、アミド基含有モノマーを使用しなかった以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(I)を得た。得られた(メタ)アクリル共重合体(I)の重量平均分子量は70万であった。
(9) Preparation of (meth) acrylic copolymer (I) The (meth) acrylic acid ester monomer was changed to 81.9 parts by weight of butyl acrylate and 15 parts by weight of 2-ethylhexyl acrylate, and an amide group-containing monomer was used. A (meth) acrylic copolymer (I) was obtained in the same manner as the (meth) acrylic copolymer (A) except that it was not. The obtained (meth) acrylic copolymer (I) had a weight average molecular weight of 700,000.

(10)(メタ)アクリル共重合体(J)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル76.9重量部とアクリル酸2−エチルヘキシル5重量部に、アミド基含有モノマーをジメチルアクリルアミド15重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(J)を得た。得られた(メタ)アクリル共重合体(J)の重量平均分子量は85万であった。
(10) Preparation of (meth) acrylic copolymer (J) 76.9 parts by weight of (meth) acrylic acid ester monomer and 5 parts by weight of 2-ethylhexyl acrylate are used, and amide group-containing monomer is dimethylacrylamide 15 A (meth) acrylic copolymer (J) was obtained in the same manner as the (meth) acrylic copolymer (A) except that the amount was changed to parts by weight. The weight average molecular weight of the obtained (meth) acrylic copolymer (J) was 850,000.

(11)(メタ)アクリル共重合体(K)の調製
(メタ)アクリル酸エステルモノマーをアクリル酸ブチル76.5重量部に、水酸基含有モノマーをアクリル酸2−ヒドロキシエチル0.5重量部に変更した以外は(メタ)アクリル共重合体(A)と同様の方法により(メタ)アクリル共重合体(K)を得た。得られた(メタ)アクリル共重合体(K)の重量平均分子量は82万であった。
(11) Preparation of (meth) acrylic copolymer (K) The (meth) acrylic acid ester monomer is changed to 76.5 parts by weight of butyl acrylate, and the hydroxyl group-containing monomer is changed to 0.5 parts by weight of 2-hydroxyethyl acrylate. A (meth) acrylic copolymer (K) was obtained in the same manner as the (meth) acrylic copolymer (A) except that. The weight average molecular weight of the obtained (meth) acrylic copolymer (K) was 820,000.

(実施例1)
得られた(メタ)アクリル共重合体(A)の溶液に含まれる(メタ)アクリル共重合体(A)の固形分100重量部に対して、イソシアネート系架橋剤(日本ポリウレタン社製 商品名「コロネートL45」)0.8重量部を添加し、攪拌して、粘着剤組成物を得た。
Example 1
For 100 parts by weight of the solid content of the (meth) acrylic copolymer (A) contained in the solution of the obtained (meth) acrylic copolymer (A), an isocyanate-based crosslinking agent (trade name “manufactured by Nippon Polyurethane Co., Ltd.” Coronate L45 ") 0.8 part by weight was added and stirred to obtain an adhesive composition.

離型紙を用意し、この離型紙の離型処理面に粘着剤組成物を塗布し、100℃で5分間乾燥させることにより、厚み50μmの粘着剤層を形成した。この粘着剤層を、ポリエチレン発泡体(発泡倍率2.5倍)からなる厚さ200μmの基材の表面と貼り合わせた。次いで、同様の要領で、この基材の反対の表面にも上記と同じ粘着剤層を貼り合わせた。これにより、離型紙で覆われた両面粘着テープを得た。
得られた両面粘着テープの粘着剤層のゲル分率は55%、23℃におけるせん断貯蔵弾性率G’は7.6×10Pa、tanδ極大値の温度は14℃であった。
A release paper was prepared, the pressure-sensitive adhesive composition was applied to the release-treated surface of this release paper, and dried at 100 ° C. for 5 minutes to form a pressure-sensitive adhesive layer having a thickness of 50 μm. This pressure-sensitive adhesive layer was bonded to the surface of a 200 μm thick substrate made of polyethylene foam (foaming ratio 2.5 times). Next, in the same manner, the same pressure-sensitive adhesive layer as above was bonded to the opposite surface of the substrate. This obtained the double-sided adhesive tape covered with the release paper.
The gel fraction of the pressure-sensitive adhesive layer of the obtained double-sided pressure-sensitive adhesive tape was 55%, the shear storage modulus G ′ at 23 ° C. was 7.6 × 10 5 Pa, and the temperature of the tan δ maximum value was 14 ° C.

(実施例2〜12、比較例1〜6)
組成を表1、2に示したようにした以外は実施例1と同様にして両面粘着テープを得た。
(Examples 2 to 12, Comparative Examples 1 to 6)
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the composition was as shown in Tables 1 and 2.

<評価>
実施例、比較例で得られた両面粘着テープについて以下の評価を行った。結果を表1、2に示した。
<Evaluation>
The following evaluation was performed about the double-sided adhesive tape obtained by the Example and the comparative example. The results are shown in Tables 1 and 2.

(1)PUSH粘着力の評価
図1に、両面粘着テープのPUSH粘着力の評価方法を説明する模式図を示す。得られた両面粘着テープを外径が幅46mm、長さ61mm、内径が幅44mm、長さ59mmに打ち抜き、幅1mmの枠状の試験片を作製した。次いで、図1(a)に示すように、中央部分に幅38mm、長さ50mmの四角い穴のあいた厚さ2mmのポリカーボネート板3に対して離型紙を剥がした試験片1を四角い穴がほぼ中央に位置するように貼り付けた後、試験片1の上面から幅55mm、長さ65mm、厚さ1mmのポリカーボネート板2を試験片1がほぼ中央に位置するように貼り付け、試験装置を組み立てた。
その後、試験装置の上面に位置するポリカーボネート板側から5kgfの圧力を10秒間加えて上下に位置するポリカーボネート板と試験片とを圧着し、常温で24時間放置した。
(1) Evaluation of PUSH adhesive strength FIG. 1 is a schematic diagram illustrating an evaluation method of PUSH adhesive strength of a double-sided adhesive tape. The obtained double-sided adhesive tape was punched into an outer diameter of 46 mm, a length of 61 mm, an inner diameter of 44 mm, and a length of 59 mm to produce a frame-shaped test piece having a width of 1 mm. Next, as shown in FIG. 1 (a), the square hole is approximately in the center of the test piece 1 from which the release paper has been peeled off from the polycarbonate plate 3 having a thickness of 38 mm and a square hole having a width of 50 mm and a thickness of 2 mm. After being pasted so that the test piece 1 is positioned, a polycarbonate plate 2 having a width of 55 mm, a length of 65 mm, and a thickness of 1 mm is pasted from the upper surface of the test piece 1 so that the test piece 1 is located substantially in the center, and the test apparatus was assembled. .
Thereafter, a pressure of 5 kgf was applied for 10 seconds from the side of the polycarbonate plate positioned on the upper surface of the test apparatus, and the polycarbonate plate positioned on the upper and lower sides and the test piece were pressed and left at room temperature for 24 hours.

図1(b)に示すように、作製した試験装置を裏返して支持台に固定し、四角い穴を通して10mm/minの速度でゆっくりと荷重4をかけていき、荷重により試験片とポリカーボネート板が剥がれた時の荷重の値を測定した。
得られた測定値をもとに、以下の基準によりPUSH粘着力を判定した。
◎:剥離時の荷重が100N以上
○:剥離時の荷重が90N以上、100N未満
×:剥離時の荷重が90N未満
As shown in FIG. 1 (b), the prepared test apparatus is turned over and fixed to a support base, and a load 4 is slowly applied through a square hole at a speed of 10 mm / min, and the test piece and the polycarbonate plate are peeled off by the load. The load value was measured.
Based on the obtained measurement value, PUSH adhesive strength was determined according to the following criteria.
A: The load at the time of peeling is 100 N or more. O: The load at the time of peeling is 90 N or more and less than 100 N. X: The load at the time of peeling is less than 90 N.

(2)プローブタックの評価
両面粘着テープを25mm×75mmの平面形状を有するように切断した。切断された両面テープ粘着テープの一方の離型紙を剥離し、粘着剤層を露出させた。次いで、2mm厚のSUS板上に、両面粘着テープの露出した面を貼り合わせた。更に、両面粘着テープのもう一方の離型紙を剥離し、粘着剤層を露出させた。暴露した粘着面に10mm角の金属片を接触させ、その時の抵抗力(N/10mm□)をストログラフにより測定して、これをプローブタックとした。
得られた測定値をもとに、以下の基準によりプローブタックを判定した。
○:プローブタックが7N/cmを超えて、10N/cm以下
△:プローブタックが5N/cmを超えて、7N/cm以下
×:プローブタックが5N/cm以下、又は、10N/cmを超える
(2) Evaluation of probe tack The double-sided adhesive tape was cut so as to have a planar shape of 25 mm × 75 mm. One release paper of the cut double-sided adhesive tape was peeled off to expose the adhesive layer. Next, the exposed surface of the double-sided adhesive tape was bonded onto a 2 mm thick SUS plate. Furthermore, the other release paper of the double-sided pressure-sensitive adhesive tape was peeled off to expose the pressure-sensitive adhesive layer. A 10 mm square metal piece was brought into contact with the exposed adhesive surface, and the resistance (N / 10 mm □) at that time was measured by a strograph, and this was used as a probe tack.
Based on the measured values, probe tack was determined according to the following criteria.
○: probe tack is exceeded 7N / cm 2, 10N / cm 2 or less △: probe tack greater than the 5N / cm 2, 7N / cm 2 or less ×: probe tack 5N / cm 2 or less, or, 10 N / Cm 2

Figure 2016183276
Figure 2016183276

Figure 2016183276
Figure 2016183276

本発明によれば、電子機器部品固定用途や車輌部品固定用途に好適に用いることができる、高い粘着力と適度なタック性とを発揮できる粘着剤組成物、及び、該粘着剤組成物を用いた粘着テープを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the adhesive composition which can be used suitably for an electronic equipment component fixation use or a vehicle component fixation use, and can exhibit high adhesive force and appropriate tackiness, and this adhesive composition are used. The adhesive tape which had been can be provided.

1 両面粘着テープ試験片(枠状)
2 ポリカーボネート板
3 ポリカーボネート板
4 荷重
1 Double-sided adhesive tape test piece (frame shape)
2 Polycarbonate plate 3 Polycarbonate plate 4 Load

Claims (7)

(メタ)アクリル酸エステルモノマー、アミド基含有モノマー及び水酸基含有モノマーを含有するモノマー混合物を共重合してなる(メタ)アクリル共重合体を含有し、
前記モノマー混合物は、前記アミド基含有モノマーの配合量が20重量%以上、かつ、前記水酸基含有モノマーの配合量が0.01〜0.3重量%である
ことを特徴とする粘着剤組成物。
A (meth) acrylic copolymer obtained by copolymerizing a monomer mixture containing a (meth) acrylic acid ester monomer, an amide group-containing monomer and a hydroxyl group-containing monomer,
The pressure-sensitive adhesive composition, wherein the monomer mixture contains 20% by weight or more of the amide group-containing monomer and 0.01 to 0.3% by weight of the hydroxyl group-containing monomer.
アミド基含有モノマーは、ジメチルアクリルアミド又はジエチルアクリルアミドを含有することを特徴とする請求項1記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to claim 1, wherein the amide group-containing monomer contains dimethylacrylamide or diethylacrylamide. 請求項1又は2記載の粘着剤組成物からなる粘着剤層を有することを特徴とする粘着テープ。 A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition according to claim 1. 粘着剤層は、23℃におけるせん断貯蔵弾性率が9×10〜2×10Paであることを特徴とする請求項3記載の粘着テープ。 4. The pressure-sensitive adhesive tape according to claim 3, wherein the pressure-sensitive adhesive layer has a shear storage modulus at 23 ° C. of 9 × 10 5 to 2 × 10 6 Pa. 線幅が1mm以下であることを特徴とする請求項3又は4記載の粘着テープ。 The pressure-sensitive adhesive tape according to claim 3 or 4, wherein the line width is 1 mm or less. 電子機器部品固定用途に用いられることを特徴とする請求項3、4又は5記載の粘着テープ。 The pressure-sensitive adhesive tape according to claim 3, 4 or 5, wherein the pressure-sensitive adhesive tape is used for fixing an electronic device part. 車輌部品固定用途に用いられることを特徴とする請求項3、4又は5記載の粘着テープ。

6. The pressure-sensitive adhesive tape according to claim 3, 4 or 5, wherein the pressure-sensitive adhesive tape is used for fixing vehicle parts.

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