JP2016172349A - Thermal processing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal processing machine capable of coping with printing surface processing of various processing sizes, by using only a single attachment.SOLUTION: A porous printing body can be fitted in an optional position on an installation surface (51a) to an attachment (50) for installing the porous printing body (101) being a processing object, and a plurality of detection switches (SW11-SW98) capable of detecting the porous printing body are arranged in a lattice shape. In a reverse surface of the porous printing body, shallow hole fitting parts (106a and 106b) fitted to the detection switches are formed in a corner part of at least two places respectively positioned at a diagonal angle. In a state of installing the porous printing body in the attachment, the detection switches are turned on by fitting the shallow hole fitting parts to the detection switches, and an installation position and a processing size of the porous printing body in the attachment are specified based on the respective positions of the turned-on detection switches.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a thermal processing machine that forms a marking surface on a workpiece such as a stamp.

  A thermal processing machine abuts a thermal head on a processing object such as a porous material, and selectively heat-generates a heat generating element of the thermal head while moving the relative head, thereby providing a desired marking surface on the processing object. It is an apparatus which performs the heat processing to form (for example, refer patent document 1). The stamp is assembled by mounting the porous material processed with the thermal processing machine on the ink impregnated body attached to the holder. In recent years, there is a demand for thermal processing machines that are versatile enough to process stamps with various stamp patterns and sizes according to customer orders and convenient for anyone to process at the store. For this reason, for example, multiple types of attachments suitable for the type of stamp (square, round, etc.) and their processing sizes are prepared in advance, and a dedicated attachment with a porous material is loaded into the thermal processing machine and stamped Has been done.

JP 2014-43092 A

  In the above-described conventional thermal processing machine, it is necessary to prepare a dedicated attachment for each type while it is possible to perform stamping on a processing target of various types and processing sizes (these are called “types” of the processing target). was there. In addition, users (including stamp orderers and salesclerks) need to select an attachment that suits the workpiece to be processed from among a plurality of attachments, which is cumbersome. In addition, there is a possibility that an incorrect attachment is loaded into the processing apparatus.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a thermal processing machine that can cope with stamping processing of various processing sizes using only a single attachment.

  In order to solve the above-described problems, the present invention provides a thermal head having a plurality of heating elements arranged in a line, an attachment on which a workpiece to be formed with a marking surface is installed, and the attachment is carried into the interior. A transfer means for moving the workpiece and the thermal head in contact with each other in a state where they are in contact with each other, and each heating element of the thermal head while controlling the relative movement by the transfer means And a control means for performing a processing process for selectively generating heat to form a marking surface on the processing object, and a surface of the attachment on the side where the processing object is installed is on the surface. A plurality of detection switches that enable the workpiece to be fitted at an arbitrary position and that can detect the workpiece are provided at each intersection position orthogonal to the grid. Is location, it is a thermal processing machine, wherein.

  According to such a thermal processing machine, various types of processing objects can be installed on a single attachment, and versatility is improved. In addition, the object to be processed can be placed at any position on the attachment, and convenience is improved.

  Moreover, shallow hole fitting portions that are respectively fitted to the detection switches are formed at at least two corners located on the diagonal side of the workpiece to be installed on the attachment, and the workpiece The detection switch is turned on when the shallow hole fitting portion is fitted to the detection switch in a state where the detection switch is installed in the attachment, and at least the processing target in the attachment is based on the position of the detection switch that is turned on. The installation position of an object can be specified. Further, the processing size of the processing object can be further specified based on the position of the detection switch that is turned on.

  Further, the thermal processing machine has the shallow hole fitting portion at a corner different from at least two corners where the shallow hole fitting portion is formed on the side of the workpiece to be installed on the attachment. The detection that the deep hole fitting portion is fitted in a state where a deep hole fitting portion that has a deeper hole and is fitted to the detection switch is formed and the workpiece is installed in the attachment. Preferably, the switch off state is maintained.

  According to the thermal processing machine according to the present invention, it is possible to process a stamp surface on a processing object having various processing sizes using only a single attachment. In addition, it is possible to specify the installation state, the processing size, and the like of the processing object currently installed in the attachment. Therefore, a thermal processing machine having high versatility and convenience can be provided.

It is an external view of the thermal processing machine by one Embodiment. It is a block diagram which shows schematic structure of the thermal processing machine of FIG. FIG. 2 is a two-side view illustrating a head surface and a side surface of a thermal head provided in the thermal processing machine of FIG. 1. It is a top view, a rear view, and a cross-sectional view of a rectangular porous stamp that is an example of a workpiece. It is the top view and sectional view of an attachment by one embodiment. It is the top view and sectional drawing which show the state by which the porous stamp was installed in the attachment of FIG. It is a top view which shows the example by which various porous stamps were installed in the attachment of FIG. FIG. 6 is a plan view further illustrating an example in which various porous stamps are installed on the attachment of FIG. 5. FIG. 6 is a block diagram illustrating a circuit example for reading data of the detection switch of FIG. 5. It is a figure which illustrates a block data, gradation image data, drive amount data, and a porous material cross section. It is a flowchart which illustrates the stamping process in a thermal processing machine. It is a figure for demonstrating the stamping process operation | movement by a thermal processing machine. It is a top view, a side view, and a sectional view for explaining assembly of a porous stamp.

  FIG. 1 is an external view showing a thermal processing machine 10 according to an embodiment of the present invention. FIG. 2 is a block diagram showing a schematic configuration of the thermal processing machine 10. The thermal processing machine 10 is a device that uses a porous stamp 101 of various types of stamps as an object to be processed, and forms a marking surface on the surface of the porous stamp 101 installed in the attachment 50. More specifically, as will be described later, the thermal processing machine 10 selectively selects each heating element 12a of the thermal head 12 while relatively moving the thermal head 12 and the porous stamp body 101 in contact with each other. The stamping surface is thermally processed line by line on the surface of the porous stamping body 101 by heating and solidifying the porous material. Here, “contact” means that the height position of the thermal head 12 and the height position of the surface of the object to be processed (porous seal body 101) coincide. If the porous material is heated and melted by radiant heat from the thermal head 12, a state where the thermal head 12 and the porous material are opposed to each other with a micro gap is also included in the “contact”. In addition, a state where heat from the thermal head 12 is conducted to the porous material through a resin film or the like is also conceptually included in the “contact”. “Relative movement” may be the movement of the porous printing body 101 while fixing the position of the thermal head 12, or the movement of the thermal head 12 while fixing the position of the porous printing body 101. . In the present specification, the thermal processing machine 10 of the former mode in which the position of the thermal head 12 is fixed and the porous stamp body 101 is moved will be described.

  A porous stamp body 101 which is a stamp face member of a porous stamp is installed on an attachment 50 shown in FIG. Although details will be described later, it is possible to fit the porous stamp body 101 at an arbitrary position on the surface of the attachment 50 where the porous stamp body 101 is installed, and the installation state of the porous stamp body 101 A plurality of detection switches SW11 to SW98 that can detect the above are arranged at each intersection position orthogonal to the grid.

As shown in FIG. 1, a touch panel 21 and a numeric keypad 22 for a user to operate the thermal processing machine 10 are provided on the front surface of the thermal processing machine 10. On the touch panel 21, for example, an operation input screen for the thermal processing machine 10, an operation state of the apparatus (preparation complete, attachment loading, data reading, printing processing, attachment discharge, error, etc.) or a currently installed porous stamp Characters indicating information such as 101 type (type and processing size) are displayed. Although not shown, a communication connector for connecting to a network such as the Internet, a power supply connector, and the like are provided on the back surface of the thermal processing machine 10.
In the thermal processing machine 10, an external personal computer (PC) or a dedicated terminal device (not shown) has a human interface function such as operation input and display and a part of the processing function of the internal control device 11. It may be something that works.

  As shown in FIG. 2, in addition to the touch panel 21 and the numeric keypad 22 described above, the control device 11 includes a thermal drive unit 13 that thermally drives the thermal head 12, an elevating mechanism 14 that raises and lowers the thermal head 12, a tray 15, and an attachment. A reading mechanism 18 for reading data from a detection mechanism SW1m, SW2m, SW3m,... Provided on the attachment 50 and a transport mechanism 16 for carrying in and out 50 are connected. FIG. 2 shows detection switches in the m-th column (m is an arbitrary integer). However, the attachment 50 of this embodiment is provided with a total of 72 detection switches SW11 to SW98 of 9 rows × 8 columns shown in FIG. 5, for example, and all the detections are performed by the reading circuit 18 as will be described later. The state (ON / OFF data) of the switches SW11 to SW98 is read, and the data is output to the control device 11.

  Further, the thermal processing machine 10 includes a tray 15 which is a means for placing and transporting the attachment 50, and the transport mechanism 16 provided inside the thermal processing machine 10 can attach and detach the porous stamp body 101 and the attachment 50. It is configured to reciprocate between the discharge position and the internal storage position. The transport mechanism 16 is also means for relatively moving the porous stamp body 101 and the thermal head 12 in a state where they are in contact with each other.

  Here, FIG. 3 is a two-side view showing the head surface and side surfaces of the thermal head 12. As shown in the figure, a plurality of heating elements 12a, 12a,... Are formed on the head surface of the thermal head 12 (the surface that is in contact with the porous stamping body 101 to be stamped) at regular intervals in a line. It is arranged. The arrangement interval of the heating elements 12a and 12a, in other words, the size of one heating element 12a corresponds to the theoretical minimum processing pixel size of the stamping process. The dot density of the heat generating elements 12a in the thermal head 12 can be set to, for example, about 300 dpi (dot / inch). Under the control of the control device 11, the thermal head 12 is made porous by allowing the heat driving means 13 to selectively flow current to each of the heating elements 12a, 12a,. A 1-line marking surface is formed on the marking body 101. In addition, the thermal head 12 is controlled to move to a position where the thermal head 12 approaches and separates from the workpiece by the elevating mechanism 14 under the control of the control device 11.

  Next, FIG. 4A is a plan view of a rectangular porous stamp 101 as an example of the object to be processed, and FIG. 4B is a rear view of the porous stamp 101. FIG. 4C is a cross-sectional view of the porous stamp 101 taken along the line IVc-IVc in FIGS. 4A and 4B. As shown in these drawings, the rectangular porous marking body 101 includes a quadrangular enclosure frame 103, and the ink impregnated body 110 is attached to the recess 103a on the upper surface side of the frame 103. The porous film 102 is stretched on the upper surface of the frame 103 so as to close the recess 103 a in which the ink impregnated body 110 is mounted.

  Here, the “upper surface” or “front surface” refers to the surface on the side where the marking surface is formed, and the “lower surface” or “back surface (back surface)” refers to the surface opposite to the surface on which the marking surface is formed. Refers to the surface on the side of the attachment. The frame 103 having such a shape is molded by, for example, a thermoplastic resin that has a small thermal deformation. Note that the porous stamp body 101 to be processed may be one in which a porous film and a porous material that can be impregnated with ink are preliminarily filled in two layers in the frame 103.

  The material of the porous film 102 is not particularly limited as long as the surface can be heated and melted and solidified by the thermal head 12. As a raw material for the porous material, for example, styrene, vinyl chloride, olefin, polyester, polyamide, and urethane thermoplastic elastomers can be used. In order to obtain porosity, a filler such as starch, sodium chloride, sodium nitrate, calcium carbonate and raw material resin are kneaded with a heating and pressure kneader, a heating roll, etc., cooled to a sheet, and then water or dilute acid The filler is eluted with water. The melting temperature of the porous material produced by this method is the same as that of the raw material resin. Moreover, the melting temperature of the porous material can be adjusted by adding subcomponents such as pigments, dyes, and inorganic substances to the resin. The melting temperature of the porous material according to the present embodiment is 70 ° C to 120 ° C.

  The porosity and pore diameter of the porous membrane 102 can be adjusted by the particle size of the dissolved substance to be kneaded and the content thereof. The porosity of the porous membrane 102 according to the present embodiment is 50% to 80%, and the pore diameter is 1 μm to 20 μm. The porous membrane 102 may have a two-layer structure, and the porosity of the lower layer (rear surface side) may be 50 μm to 100 μm. The porous stamped body 101, which is an object for the stamping process, is created by thermally bonding the porous film 102 to the peripheral edge (front end surface) of the front opening of the frame 103.

  Further, when the thermal head 12 is directly brought into contact with the surface of the porous stamp 101 and the heating element 12a is driven, the heated and melted porous material is welded to the thermal head 12, causing an increase in frictional force and a plate making failure. There is an inconvenience. In order to solve these problems, a resin film (not shown) may be interposed between the porous stamp body 101 and the thermal head 12. Such a resin film is required to have heat resistance having a higher melting point than the porous material used for the porous stamp 101 and low friction and smoothness that does not cause wrinkles on the printing surface. Is done. As this resin film, for example, a polyfilm such as cellophane, acetate, polyvinyl chloride, polyethylene, polypropylene, polyester, polyethylene terephthalate, polytetrafluoroethylene, or polyimide can be used. By interposing such a resin film, in addition to preventing wrinkles generated in the porous material, the influence of residual heat remaining in the thermal head 12 can be reduced.

  In particular, as shown in FIG. 4B, shallow holes are fitted into two corners on the diagonal of the quadrilateral on the back side of the porous stamp 101, that is, the side installed on the attachment 50. Portions 106a and 106b are formed. Similarly, deep hole fitting portions 107a and 107b are formed at two corners on the diagonal line different from the shallow hole fitting portions 106a and 106b on the back side of the porous stamp body 101. The shallow hole fitting portions 106a and 106b are detection switches SWnm of the attachment 50 (where n is an integer of 1 to 9, for example, indicating a detection switch of the nth row, and m is a detection of the mth column) It is a relatively shallow hole 106ah, 106bh enough to turn on the fitted detection switch SWnm in a state in which the switch is fitted, for example, an integer of 1 to 8 indicating a switch. On the other hand, the deep hole fitting portions 107a and 107b have relatively deep holes 107ah and 107bh that can maintain the OFF state of the fitted detection switch SWnm even when fitted to the detection switch SWnm. The distance between the hole 106ah of the shallow hole fitting portion 106a and the hole 107bh of the deep hole fitting portion 107b in the horizontal width direction of the porous stamp 101, and the hole 106ah and deep hole of the shallow hole fitting portion 106a in the vertical width direction. The distance between the fitting portion 107a and the hole 107ah is an integral multiple of the pitch of detection switches SW11 to S98 (see, for example, FIG. 5) described below.

  With reference to FIG. 5, the attachment 50 and the detection switches SW11 to SW98 provided in the attachment 50 will be described in more detail. Here, the “conveying direction” of the attachment 50 of the present embodiment refers to the vertical direction in FIG. In particular, the upper direction in FIG. 5 may be referred to as a “loading direction” in which the attachment 50 is directed toward the inside of the thermal processing machine 10, and the “downward direction” in which the attachment 50 is directed outward from the thermal processing machine 10 in FIG. There is.

  As shown in FIG. 5A, the main body of the attachment 50 is formed with a printing body installation part 51 having a flat installation surface at a position recessed with respect to the upper surface 50a. A plurality of detection switches SW11 that can fit the porous stamp body 101 at an arbitrary position on the installation surface 51a and can detect the porous stamp body 101 on the installation surface 51a of the stamp body installation unit 51. ... To SW98 are arranged at the respective intersection positions orthogonal to the grid pattern. As shown in FIG. 5B, for example, one detection switch SW91 includes a cylindrical portion 61 protruding from the installation surface 51a and a movable piece 62 that moves up and down in the cylindrical portion 61. The movable piece 62 is always urged upward by a spring 63. In the detection switch SW91, the micro switch 64 is normally off, and when the movable piece 62 is pushed downward against the urging force of the spring 63, the base end portion of the moved movable piece 62 turns on the micro switch 64. It is configured as follows. The other detection switches have the same structure as the detection switch SW91.

  The holes 106ah and 106bh of the shallow hole fitting portions 106a and 106b and the holes 107ah and 107bh of the deep hole fitting portions 107a and 107b on the back surface of the porous stamp 101 are the cylindrical portions of the detection switches SW11 to SW98. 61 has a diameter that can be inserted and fitted. That is, in the porous stamped body 101, the shallow hole fitting portions 106a and 106b and the deep hole fitting portions 107a and 107b are fitted into any of the detection switches SW11 to SW98 of the attachment 50. It can be stably installed at an arbitrary position.

  FIG. 6A is a plan view showing a state in which the porous stamp body 101 is installed at the center of the end portion in the carry-out direction of the stamp installation section 51 of the attachment 50 as an example. Moreover, FIG.6 (b) is sectional drawing at the time of cut | disconnecting by the VIb-VIb line | wire of Fig.6 (a). In a state where the porous stamp body 101 is installed at the position shown in FIG. 6A of the attachment 50, the shallow hole fitting portions 106a and 106b are fitted into the detection switches SW92 and SW87, so that these detection switches SW92 and SW87 is turned on. That is, the bottoms of the holes 106ah and 106bh of the shallow hole fitting portions 106a and 106b move the movable pieces 62 of the detection switches SW92 and SW87 downward, and these microswitches 64 are turned on. On the other hand, the holes 107ah and 107bh of the deep hole fitting portions 107a and 107b are formed deeper than the holes 106ah and 106bh of the shallow hole fitting portions 106a and 106b. Therefore, even if the deep hole fitting portions 107a and 107b are fitted to the detection switches SW82 and SW97, the movable pieces 62 of the detection switches SW82 and SW97 do not contact the bottom portions of the holes 107ah and 107bh, and the off state is maintained. Is done.

  The porous mark on the installation surface 51a of the attachment 50 is based on the positions of the detection switches SW92 and SW87 that are turned on when the shallow hole fitting portions 106a and 106b located on the diagonal of the porous mark body 101 are fitted. The installation position of the body 101 can be specified. Further, the processing size of the stylized porous stamp 101 can be specified based on the diagonal line D connecting the positions of the detection switches SW92 and SW87 that are turned on. Further, based on the information on the installation position and processing size of the porous stamp 101 identified from the positions of the detection switches SW92 and SW87 that are turned on, the processing start position and processing end position of the stamp surface of the porous stamp 101 are also determined. Can be identified.

  In addition, although there is a certain limitation between the area of the installation surface 51a of the attachment 50 and the size of the workpiece to be installed, they are within an allowable range, for example, FIGS. 7A and 7B and FIG. As shown in FIG. 3C, porous stamps 101, 101 ′, and 101 ″ having various processing sizes can be installed at arbitrary vertical and horizontal positions. Further, as illustrated in FIG. 8A, not only can one porous stamp body 101 be installed at an arbitrary position on the installation surface 51a of the attachment 50, but also a plurality of porous materials as illustrated in FIG. 8B. The stamps 101, 101, 101 can be installed on the installation surface 51a at the same time. Further, as illustrated in FIG. 8C, a plurality of porous stamps 101 and 101 '' 'having different sizes can be simultaneously installed on the installation surface 51a.

  Next, the operation of each control means provided in the thermal processing machine 10 will be described.

(Switch data reading means)
The control device 11 of the thermal processing machine 10 may individually read on / off switch signals from the detection switches SW11 to S98. For example, as shown in the block diagram of FIG. A configuration may be adopted in which the on / off data of SW11 to SW98 is read by a scan method.

  For example, according to the embodiment of the scanning method of FIG. 9, in the step in which the control device 11 reads the states of the detection switches SW11 to SW98, the reading circuit 18 corresponds to the number of rows n of the detection switches SW11 to SW98. A typical scan signal is output to the switching circuit 71. Each time the switching circuit 71 receives a scan signal (n = 1, 2,..., 9), the switching circuit 71 sequentially supplies current to the detection switches SWn1, SWn2,. That is, when the first (n = 1) scan signal is output, the switching circuit 71 supplies current only to the detection switches SW11 to SW18 in the first row, and the second (n = 2). When the scan signal is output, the switching circuit 71 switches the output destination repeatedly for the number of rows (n = 9) so as to supply current only to the detection switches SW21 to SW28 in the second row.

  At the same time, a set / reset signal is input to the latch circuit 72 in synchronization with the scan signal. That is, when the first (n = 1) scan signal is output, the latch circuit 72 captures (latches) information of the detection switches SW11 to SW18 in the first row and outputs the information to the reading circuit 18. When the scan signal falls, the information captured by the latch circuit 72 is reset, and when the next second (n = 2) scan signal is output, the detection switches SW21 to SW28 in the second row are similarly set. Information is latched and output to the reading circuit 18. As described above, the reading circuit 18 scans from the first row to the ninth row, and reads the on / off data indicating the states of all the detection switches SW11 to SW98.

(Processing object identification means)
The processing object specifying means provided in the control device 11 is based on the positions of the detection switches SWnm and SWn′m ′ in which the porous stamp 101 is installed and turned on in the attachment 50, and the porous surface on the installation surface 51a of the attachment 50. The installation position of the marking body 101 is specified. Further, the processing object specifying means specifies the type and processing size of the stylized porous stamp 101 based on the diagonal line D connecting the positions of the detection switches SWnm and SWn′m ′ that are turned on.

(Tone correction means)
The stamp image data loaded to the control device 11 is stored in a binary (monochrome) bitmap format. For example, a so-called “black” pixel value corresponding to a printing portion (printing portion) of a stamp is “1”, and a so-called “white” pixel value corresponding to a non-printing portion (non-printing portion) is “0”. Is. This binary block data representing the stamp pattern to be processed is referred to as “monochrome image data”. The basic operation of the marking surface processing in the thermal processing machine 10 is to selectively heat-generate the heating elements 12a, 12a,... By heating and melting and solidifying, a non-printing part in which the porosity is lost is formed on the surface of the porous stamping body 101. Therefore, basically, the control device 11 can process the stamp surface by performing on / off control according to the monochrome image data.

  However, in the simple on / off control according to such binary monochrome image data, the residual heat accumulated in the thermal head 12 at the edge position of the non-printed part is conducted to the area of the neighboring printed part. There is a problem. As a result, a part of the porosity (ink permeability) of the outline portion of the print is lost, and there is a case where the print outline becomes narrower or deforms than the original image data. In order to prevent such deformation of printing, in the present embodiment, the control device 11 includes gradation correction means for correcting monochrome image data to gradation image data having gradation of, for example, 8 bits (256 gradations). I have.

  For example, as shown in FIG. 10, the gradation correction unit has a pixel value stepped at a boundary region (a region where black and white values are reversed) between a printing portion (printing portion) and a non-printing portion (non-printing portion) of monochrome image data. Gradation image data corrected so as to change monotonically is created. The “monotonic change” here includes a case where the gradation image data is corrected nonlinearly based on the monochrome image data.

(Driving amount conversion means)
The driving amount conversion means provided in the control device 11 converts the corrected gradation image data for each line into driving amount data of each heating element of the thermal head 12. At this time, when calculating the drive amount of the heat generating element, the drive amount conversion means may consider a non-linear correlation characteristic between the drive amount of the heat generating element and the porosity (ink permeability).

Here, the permeation ratio of the ink, which is an index for quantitatively indicating the porosity, is set to 1 (100%) as the porosity of the initial porous material before heat processing, and the heating element is driven with the maximum driving amount Dqmax. It can be defined as a ratio when the porosity of the porous material after heat processing is normalized as 0 (0%). Since the porous material slightly shrinks and changes its thermal conductivity and the like as it is heated and melted, the driving amount of the heating element and the ink penetration ratio are not necessarily proportional. Therefore, it is preferable to previously store in the storage means of the control device 11 nonlinear correlation characteristic data between the driving amount of the heating element and the ink permeation ratio measured in advance through experiments or the like.
Note that the above-described gradation correction unit may create gradation image data in consideration of the above-described nonlinear correlation characteristic between the driving amount of the heating element and the ink penetration ratio.

(Processing control means)
Next, the stamp surface processing by the processing control means provided in the control device 11 will be described. Here, FIG. 11 is a flowchart illustrating the stamp surface processing by the processing control means. FIG. 12 is a diagram for explaining the stamping operation of the thermal processing machine 10. The processing control means includes a conveyance control means, a lift control means and a heat generation drive control means which will be described next.

  First, a user (including a stamp orderer, a sales clerk, etc.) installs a porous stamp 101 for processing a stamp surface at an arbitrary position of the attachment 50. When the discharge operation of the tray 15 is performed via the touch panel 21 or the like (step S11), the transfer control unit controls the transfer mechanism 16 to transfer the tray 15 to the discharge position shown in FIG. (Step S12). Then, the user loads the attachment 50 in which the porous stamp body 101 is installed on the discharged tray 15. The user may install the porous stamp 101 on the attachment 50 after the attachment 50 is loaded on the tray 15, or the porous stamp 101 on the attachment 50 already loaded on the tray 15. May be installed.

  And when carrying-in operation is performed via the touch panel 21 etc. (step S13), a conveyance control means will control the conveyance mechanism 16, and will start carrying-in operation | movement of the attachment 50. FIG. In the carry-in process of carrying the attachment 50 in the direction of the origin, for example, the switch data reading means of the control device 11 changes the state of the detection switches SW11 to 98 via the read circuit 18 at the carry-in position shown in FIG. The indicated on / off data is read (step S15).

  In the next step S16, the installation state of the porous stamp 101 on the attachment 50 is inspected from the on / off data from the detection switches SW11 to 98 read by the switch data reading means described above. When the control device 11 recognizes that at least two detection switches among the detection switches SW11 to 98 are in the on state, the control device 11 determines that the porous stamp body 101 is correctly installed on the attachment 50 (step S16: YES). ). When all of the detection switches SW11 to SW98 are off, or when one or an odd number of detection switches are on, the porous stamp 101 is not installed on the attachment 50 or is installed correctly. It is determined that it has not been performed (step S16: NO). In that case, an error is displayed on the touch panel 21 or the like (step S17), and the tray 15 is returned to the discharge position (step S12). Thereby, the user can be prompted to install the porous stamp 101 on the attachment 50.

  In the next step S18, the processing object specifying means described above specifies the installation position and type of the porous stamp 101 based on the positions of the detection switches SWnm and SWn'm 'in the on state. Further, the processing object specifying unit specifies the processing size of the porous stamp 101 based on the length of the diagonal line connecting the positions of the detection switches SWnm and SWn′m ′ in the on state.

  The information specified in step S18 may be displayed on the touch panel 21 of the thermal processing machine 10 or the like. In the subsequent step S19, the consistency between the type information of the stamp image data loaded on the thermal processing machine 10 and the type information specified from the detection switches SWnm and SWn'm 'is determined. If these pieces of information are not consistent (step S19: NO), an error is displayed on the touch panel 21 or the like (step S20), and the tray 15 is returned to the discharge position (step S12). This can prompt the user to redo the operation. As described above, before starting the processing, a mismatch between the porous stamp 101 and the image data of the stamp surface can be found, and erroneous installation of the porous stamp 101 or a processing operation error can be prevented in advance.

  The transport control means further carries in the tray 15, and at the innermost position shown in FIG. 12C, the end of the attachment 50 turns on the origin sensor 19, thereby detecting the origin in the transport (step S21). ). And the conveyance control means once stops the carrying-in operation of the attachment 50 at the origin position (step S22).

  Next, the processing control means determines the processing start position of the stamping surface and the heating height position based on the specified installation position of the porous stamped body 101 and the type information with which consistency is obtained (step S23). ). And a conveyance control means controls the conveyance mechanism 16, and conveys the porous stamping body 101 to a process start position (step S24). After the porous stamp body 101 is conveyed to the processing start position, the elevation control means controls the elevation mechanism 14 to lower the thermal head 12 to the heating height position (step S25). As shown in FIG. 12D, at this stage, the thermal head 12 contacts the processing start position surface of the porous stamp 101.

  In the next step S26, the heat generation drive control means performs PWM control of the heat drive means 13 in accordance with the drive amount data for one line, and selectively heats the heat generating elements 12a, 12a,. As a result, the porous stamped body 101 is thermally processed for only one line. In step S27, the transport control unit controls the transport mechanism 16 to move the porous stamp body 101 by one line width in the unloading direction (the arrow direction in FIG. 12D). By repeating the processing of step S26 and step S27, the porous stamped body 101 is stamped line by line. Then, when the processing of the final line is completed at the determination in step S28 (FIG. 12E), the lift control means controls the lift mechanism 14 to raise the thermal head 12 to the standby position, and the transport control means moves to the transport mechanism. 16 is controlled to convey the tray 15 to the discharge position (step S29).

  The user can take out the attachment 50 from the discharged tray 15 and obtain the porous stamped body 101 with the stamped surface processed. The user may obtain the processed porous stamp 101 in a state where the attachment 50 is loaded on the tray 15, that is, without removing the attachment 50 from the tray 15. Then, as shown in FIG. 13, by impregnating the ink impregnated body 110 attached to the porous stamp body 101 with the ink and attaching the holder 112, the user has a porous surface having a unique marking surface pattern according to the order. The stamp 100 can be assembled.

DESCRIPTION OF SYMBOLS 11 Control apparatus 12 Thermal head 12a Heating element 13 Thermal drive means 14 Lifting mechanism 15 Tray 16 Conveying mechanism 18 Reading circuit 19 Origin sensor 21 Touch panel 22 Numeric keypad 50 Attachment 51 Printing body installation part 51a Installation surface 61 Cylindrical part 62 Movable piece 63 Spring 64 Microswitch 71 Switching circuit 72 Latch circuit 100 Porous seal 101 Porous stamp 102 Porous membrane 103 Frames 106a and 106b Shallow hole fitting portions 107a and 107b Deep hole fitting portion 110 Ink impregnated body 112 Holder D Porous seal Body diagonal SW11-SW98 detection switch

Claims (5)

A thermal head having a plurality of heating elements arranged in a line;
An attachment on which an object to be processed on which a stamp surface is formed is installed;
Conveying means for carrying the attachment into the interior, and relatively moving the object to be processed and the thermal head placed in the attachment in contact with each other;
Control means for selectively performing heat generation on each heat generating element of the thermal head while controlling the relative movement by the conveying means, and performing processing to form a stamp on the object to be processed,
A plurality of detection switches that allow the workpiece to be fitted at an arbitrary position on the surface of the attachment on the side on which the workpiece is installed and detect the workpiece. A thermal processing machine, wherein the thermal processing machine is arranged at each intersection position orthogonal to the grid pattern. Shallow hole fitting portions that are respectively fitted to the detection switches are formed in at least two corners located on the diagonal side of the workpiece to be installed on the attachment,
The detection switch is turned on when the shallow hole fitting portion is fitted to the detection switch in a state where the object to be processed is installed on the attachment, and at least the attachment is based on the position of the detection switch that is turned on. The thermal processing machine of Claim 1 in which the installation position of the said process target object in is specified.   The thermal processing machine according to claim 2, wherein a processing size of the processing object is further specified based on a position of the detection switch that is turned on. At a corner different from at least two corners where the shallow hole fitting portion is formed on the side of the workpiece to be installed on the attachment, there is a hole deeper than the shallow hole fitting portion. A deep hole fitting portion to be fitted to the detection switch is formed,
4. The thermal processing machine according to claim 2, wherein in a state where the object to be processed is installed on the attachment, an off state of the detection switch into which the deep hole fitting portion is fitted is maintained. The thermal processing machine according to any one of claims 1 to 4, wherein a plurality of processing objects having the same or different processing sizes can be simultaneously installed on the attachment.

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