JP2016170982A

JP2016170982A - Luminaire

Info

Publication number: JP2016170982A
Application number: JP2015050026A
Authority: JP
Inventors: 神田　隆司; Takashi Kanda; 隆司神田; 岡田　敏純; Toshizumi Okada; 敏純岡田
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2015-03-12
Filing date: 2015-03-12
Publication date: 2016-09-23
Anticipated expiration: 2035-03-12
Also published as: JP6459662B2

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire capable of enhancing assembly efficiency.SOLUTION: A luminaire includes: a luminaire body 6 attached to a ceiling 4; a light source substrate 10 supported to the luminaire body 6; an LED 46 mounted on the light source substrate 10; a socket connector 76 mounted on the light source substrate 10, and electrically connected to the LED 46; a circuit board 12 arranged so as to overlap with a part of the light source substrate 10 in a thickness direction; a circuit component 58 mounted on the circuit board 12, and constituting a lighting circuit for lighting the LED 46; and a pin connector 84 mounted on the circuit board 12, and electrically connected to the circuit component 58. The socket connector 76 and the pin connector 84 are fitted to each other in a region 74 where the light source substrate 10 and the circuit board 12 overlaps with each other in the thickness direction.SELECTED DRAWING: Figure 3

Description

本発明は、造営材に取り付けられる照明器具に関する。 The present invention relates to a lighting fixture attached to a construction material.

造営材に取り付けられる照明器具として、例えばシーリングライトが知られている（例えば、特許文献１参照）。従来のシーリングライトは、器具本体と、器具本体を造営材に取り付けるための器具取付部と、器具本体に支持された光源基板及び回路基板を備えている。光源基板には、複数のＬＥＤ（ＬｉｇｈｔＥｍｉｔｔｉｎｇＤｉｏｄｅ）が実装されている。回路基板には、複数のＬＥＤの各々を点灯させるための点灯回路を構成する複数の回路部品が実装されている。 As a lighting fixture attached to the construction material, for example, a ceiling light is known (for example, see Patent Document 1). A conventional ceiling light includes an instrument main body, an instrument attachment portion for attaching the instrument main body to a construction material, and a light source substrate and a circuit board supported by the instrument main body. A plurality of LEDs (Light Emitting Diodes) are mounted on the light source substrate. On the circuit board, a plurality of circuit components constituting a lighting circuit for lighting each of the plurality of LEDs are mounted.

回路基板は、器具取付部の周囲を囲むように器具本体にリング状に配置されている。光源基板は、回路基板の周囲を囲むように器具本体にリング状に配置されている。 The circuit board is arranged in a ring shape on the instrument body so as to surround the periphery of the instrument mounting portion. The light source board is arranged in a ring shape on the instrument body so as to surround the circuit board.

特開２０１２−１４６６６６号公報JP 2012-146666 A

上述した従来のシーリングライトを組み立てる際には、まず、光源基板及び回路基板をそれぞれ器具本体に対して位置決めする位置決め作業を行った後に、光源基板と回路基板とをリード線で接続する配線作業を行う必要がある。しかしながら、このように位置決め作業と配線作業とを別工程で行うことにより、シーリングライトの組み立て工数が増大し、シーリングライトの組み立て効率が低下するという課題が生じる。 When assembling the above-described conventional ceiling light, first, after performing the positioning work for positioning the light source board and the circuit board with respect to the instrument body, the wiring work for connecting the light source board and the circuit board with lead wires is performed. There is a need to do. However, when the positioning operation and the wiring operation are performed in separate steps as described above, there is a problem that the number of steps for assembling the ceiling light increases and the assembly efficiency of the ceiling light decreases.

本発明は、このような課題に鑑みてなされたものであり、組み立て効率を高めることができる照明器具を提供することを目的とする。 This invention is made | formed in view of such a subject, and it aims at providing the lighting fixture which can improve assembly efficiency.

上記課題を解決するために、本発明の一態様に係る照明器具は、造営材に取り付けられる器具本体と、前記器具本体に支持された光源基板と、前記光源基板に実装された光源と、前記光源基板に実装され、前記光源と電気的に接続された第１のコネクタと、前記光源基板の一部と厚み方向に重なるように配置された回路基板と、前記回路基板に実装され、前記光源を点灯させるための点灯回路を構成する回路部品と、前記回路基板に実装され、前記回路部品と電気的に接続された第２のコネクタと、を備え、前記第１のコネクタ及び前記第２のコネクタは、前記光源基板と前記回路基板とが厚み方向に重なった領域で相互に嵌合される。 In order to solve the above-described problem, a lighting fixture according to an aspect of the present invention includes a fixture main body attached to a construction material, a light source substrate supported by the fixture main body, a light source mounted on the light source substrate, A first connector mounted on a light source board and electrically connected to the light source; a circuit board arranged to overlap a part of the light source board in a thickness direction; and mounted on the circuit board, the light source And a second connector mounted on the circuit board and electrically connected to the circuit component, wherein the first connector and the second connector are provided. The connector is fitted to each other in a region where the light source board and the circuit board overlap in the thickness direction.

本発明の一態様に係る照明器具によれば、組み立て効率を高めることができる。 According to the lighting fixture which concerns on 1 aspect of this invention, assembly efficiency can be improved.

実施の形態１に係る照明器具の分解斜視図The exploded perspective view of the lighting fixture which concerns on Embodiment 1 実施の形態１に係る照明器具の一部を拡大して示す断面図Sectional drawing which expands and shows a part of lighting fixture which concerns on Embodiment 1 実施の形態１に係る光源基板及び回路基板を抜き出して示す平面図FIG. 3 is a plan view showing an extracted light source board and circuit board according to the first embodiment. 実施の形態１に係る照明器具の構造を模式的に示した、図３のＩＶ−ＩＶ線による照明器具の断面図Sectional drawing of the lighting fixture by the IV-IV line | wire of FIG. 3 which showed the structure of the lighting fixture which concerns on Embodiment 1 typically 実施の形態１に係る照明器具の構造を模式的に示した、図３のＶ−Ｖ線による照明器具の断面図Sectional drawing of the lighting fixture by the VV line | wire of FIG. 3 which showed the structure of the lighting fixture which concerns on Embodiment 1 typically 実施の形態１に係るソケットコネクタ及びピンコネクタを拡大して示す断面図Sectional drawing which expands and shows the socket connector and pin connector which concern on Embodiment 1. 実施の形態２に係るソケットコネクタ及びピンコネクタを拡大して示す断面図Sectional drawing which expands and shows the socket connector and pin connector which concern on Embodiment 2. 変形例１に係る照明器具の構造を模式的に示した照明器具の断面図Sectional drawing of the lighting fixture which showed the structure of the lighting fixture which concerns on the modification 1 typically 変形例２に係る照明器具の構造を模式的に示した照明器具の断面図Sectional drawing of the lighting fixture which showed the structure of the lighting fixture which concerns on the modification 2 typically 変形例３に係る照明器具の構造を模式的に示した照明器具の断面図Sectional drawing of the lighting fixture which showed the structure of the lighting fixture which concerns on the modification 3 typically 変形例４に係る一対の光源基板及び回路基板を抜き出して示す平面図The top view which extracts and shows a pair of light source board | substrate and circuit board which concern on the modification 4. 変形例５に係る複数の光源基板及び回路基板を抜き出して示す平面図The top view which extracts and shows the several light source board | substrate and circuit board which concern on the modification 5. 変形例６に係る光源基板及び回路基板を作製する手順を説明するための図The figure for demonstrating the procedure which produces the light source board | substrate and circuit board which concern on the modification 6. 変形例６に係る光源基板及び回路基板を作製する手順を説明するための図The figure for demonstrating the procedure which produces the light source board | substrate and circuit board which concern on the modification 6.

以下、本発明の実施の形態について説明する。なお、以下に説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。したがって、以下の実施の形態で示される、数値、形状、材料、構成要素、及び、構成要素の配置位置や接続形態などは、一例であって本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 Embodiments of the present invention will be described below. Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of the components, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

また、各図は模式図であり、必ずしも厳密に図示されたものではない。なお、各図において、実質的に同一の構成に対しては同一の符号を付しており、重複する説明は省略又は簡略化する。 Each figure is a mimetic diagram and is not necessarily illustrated strictly. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description is omitted or simplified.

（実施の形態１）
以下、実施の形態１に係る照明器具２について説明する。 (Embodiment 1)
Hereinafter, the lighting fixture 2 which concerns on Embodiment 1 is demonstrated.

［１−１．照明器具の全体構成］
まず、図１〜図３を参照しながら、実施の形態１に係る照明器具２の全体構成について説明する。図１は、実施の形態１に係る照明器具２の分解斜視図である。図２は、実施の形態１に係る照明器具２の一部を拡大して示す断面図である。図３は、実施の形態１に係る光源基板１０及び回路基板１２を抜き出して示す平面図である。なお、説明の都合上、図２及び図３では、照明器具２の主要な構成要素のみを図示している。 [1-1. Overall configuration of lighting equipment]
First, the whole structure of the lighting fixture 2 which concerns on Embodiment 1 is demonstrated, referring FIGS. 1-3. FIG. 1 is an exploded perspective view of a lighting fixture 2 according to Embodiment 1. FIG. FIG. 2 is an enlarged cross-sectional view illustrating a part of the lighting fixture 2 according to the first embodiment. FIG. 3 is a plan view showing the light source board 10 and the circuit board 12 extracted from the first embodiment. For convenience of explanation, only main components of the lighting fixture 2 are shown in FIGS. 2 and 3.

図１に示すように、本実施の形態の照明器具２は、例えば天井４（造営材の一例）に取り付けられるシーリングライトである。照明器具２は、器具本体６、器具取付部８、光源基板１０、回路基板１２、受光部カバー１４、回路カバー１６、光源カバー１８及びグローブ２０を備えている。なお、図１等において、Ｚ軸のマイナス側が天井４側、Ｚ軸のプラス側が床側を表している。 As shown in FIG. 1, the lighting fixture 2 of this Embodiment is a ceiling light attached to the ceiling 4 (an example of a construction material), for example. The lighting fixture 2 includes a fixture body 6, a fixture mounting portion 8, a light source substrate 10, a circuit substrate 12, a light receiving portion cover 14, a circuit cover 16, a light source cover 18, and a globe 20. In FIG. 1 and the like, the minus side of the Z axis represents the ceiling 4 side, and the plus side of the Z axis represents the floor side.

［１−１−１．器具本体］
図１に示すように、器具本体６は、円盤状に形成されており、例えばアルミニウム板又は鋼板等の板金を円盤状にプレス加工することにより形成される。器具本体６の光源基板１０等が配置される面（すなわち、床側の面であって、Ｚ軸のプラス側の面）には、複数のグローブ取付部２２が器具本体６の周方向に間隔を置いて配置されている。なお、器具本体６の光源基板１０等が配置される面には、反射率が高い白色塗料が塗布又は反射性金属材料が蒸着されている。図１及び図２に示すように、器具本体６の中央部には、円形状の開口部２４が形成されている。さらに、器具本体６には、開口部２４の周縁部から光源基板１０側に延びる略円筒状の支持部２６が形成されている。 [1-1-1. Instrument body]
As shown in FIG. 1, the instrument main body 6 is formed in a disk shape, and is formed by, for example, pressing a sheet metal such as an aluminum plate or a steel plate into a disk shape. A plurality of globe mounting portions 22 are spaced in the circumferential direction of the instrument body 6 on the surface of the instrument body 6 on which the light source substrate 10 and the like are disposed (that is, the floor side surface and the Z-axis plus side surface). Is placed. A white paint having a high reflectance is applied or a reflective metal material is deposited on the surface of the instrument body 6 on which the light source substrate 10 and the like are disposed. As shown in FIGS. 1 and 2, a circular opening 24 is formed at the center of the instrument body 6. Furthermore, a substantially cylindrical support portion 26 extending from the peripheral edge of the opening 24 toward the light source substrate 10 is formed in the instrument body 6.

さらに、図１及び図２に示すように、器具本体６は、支持部２６の外周部から器具本体６の径方向外側にリング状に延びる天井取付部２８と、天井取付部２８の外周部から光源基板１０側に立ち上がりながら筒状に延びる筒状部３０と、筒状部３０の先端部からさらに器具本体６の径方向外側にリング状に延びる基板支持部３２とを有している。なお、器具本体６の径方向外側とは、器具本体６の中心から器具本体６の外周部に向かう方向である。器具本体６の天井取付部２８及び基板支持部３２の各々は、ＸＹ平面に対して略平行な平面で形成されている。なお、基板支持部３２の内周部には、複数のネジ孔３４が基板支持部３２の周方向に間隔を置いて形成されている。 Furthermore, as shown in FIGS. 1 and 2, the instrument body 6 includes a ceiling mounting part 28 that extends in a ring shape from the outer peripheral part of the support part 26 to the radially outer side of the instrument main body 6, and an outer peripheral part of the ceiling mounting part 28. A cylindrical portion 30 that extends in a cylindrical shape while standing on the light source substrate 10 side, and a substrate support portion 32 that extends from the distal end portion of the cylindrical portion 30 to a radially outer side of the instrument body 6 in a ring shape. The radially outer side of the instrument body 6 is a direction from the center of the instrument body 6 toward the outer peripheral portion of the instrument body 6. Each of the ceiling mounting portion 28 and the substrate support portion 32 of the instrument body 6 is formed in a plane substantially parallel to the XY plane. A plurality of screw holes 34 are formed in the inner peripheral portion of the substrate support portion 32 at intervals in the circumferential direction of the substrate support portion 32.

［１−１−２．器具取付部］
図２に示すように、器具取付部８は、器具本体６の開口部２４から支持部２６の内部に挿入され、支持部２６の内部に取り付けられている。器具取付部８は、天井４に設置された天井側取付部材３６に着脱自在に取り付けられる。このように器具取付部８が天井側取付部材３６に着脱自在に取り付けられることにより、器具本体６が天井４に取り付けられる。なお、図１に示すように、器具本体６と天井４との間には、器具本体６のぐらつきを抑制するためのクッション部材３８が介在されている。 [1-1-2. Instrument mounting part]
As shown in FIG. 2, the instrument attachment portion 8 is inserted into the support portion 26 from the opening 24 of the instrument body 6 and attached to the support portion 26. The appliance attachment portion 8 is detachably attached to a ceiling side attachment member 36 installed on the ceiling 4. In this way, the fixture body 8 is attached to the ceiling 4 by detachably attaching the fixture mounting portion 8 to the ceiling side mounting member 36. As shown in FIG. 1, a cushion member 38 for suppressing wobbling of the instrument body 6 is interposed between the instrument body 6 and the ceiling 4.

［１−１−３．光源基板］
図１及び図３に示すように、光源基板１０は、リング状に形成されており、中央部に略Ｄ字状の開口部４０を有している。すなわち、開口部４０の周縁部には、光源基板１０の径方向内側に突出する突片４２が形成されている。なお、光源基板１０の径方向内側とは、光源基板１０の外周部から光源基板１０の中心に向かう方向である。光源基板１０の表面（すなわち、器具本体６に対向する側の面と反対側の面）には、配線パターン４４が形成されている。この配線パターン４４には、複数のＬＥＤ４６（光源の一例）が実装されている。複数のＬＥＤ４６は、光源基板１０の周方向に間隔を置いて配置されている。複数のＬＥＤ４６の各々は、例えばＬＥＤチップがパッケージ化されたＬＥＤ素子である。すなわち、光源基板１０の実装構造は、ＬＥＤチップがパッケージ化されたＬＥＤ素子を光源基板１０上に実装したＳＭＤ（ＳｕｒｆａｃｅＭｏｕｎｔＤｅｖｉｃｅ）構造である。なお、光源基板１０には、ネジ５０を挿通するための複数の貫通孔５２が光源基板１０の周方向に間隔を置いて形成されている。 [1-1-3. Light source board]
As shown in FIGS. 1 and 3, the light source substrate 10 is formed in a ring shape, and has a substantially D-shaped opening 40 at the center. That is, a projecting piece 42 that protrudes radially inward of the light source substrate 10 is formed at the peripheral edge of the opening 40. The radially inner side of the light source substrate 10 is a direction from the outer periphery of the light source substrate 10 toward the center of the light source substrate 10. A wiring pattern 44 is formed on the surface of the light source substrate 10 (that is, the surface opposite to the surface facing the instrument body 6). A plurality of LEDs 46 (an example of a light source) are mounted on the wiring pattern 44. The plurality of LEDs 46 are arranged at intervals in the circumferential direction of the light source substrate 10. Each of the plurality of LEDs 46 is, for example, an LED element in which an LED chip is packaged. That is, the mounting structure of the light source substrate 10 is an SMD (Surface Mount Device) structure in which an LED element packaged with LED chips is mounted on the light source substrate 10. In the light source substrate 10, a plurality of through holes 52 for inserting the screws 50 are formed at intervals in the circumferential direction of the light source substrate 10.

光源基板１０は、基板支持部３２に支持され、回路基板１２の周囲を囲むようにリング状に配置されている。この状態では、図２に示すように、光源基板１０の裏面（すなわち、器具本体６に対向する側の面）は、器具本体６の基板支持部３２に面接触するようになる。これにより、複数のＬＥＤ４６の各々からの熱が光源基板１０を介して基板支持部３２に効率良く伝達するようになり、複数のＬＥＤ４６の各々からの熱を器具本体６により効率良く放熱することができる。 The light source board 10 is supported by the board support portion 32 and is arranged in a ring shape so as to surround the circuit board 12. In this state, as shown in FIG. 2, the back surface of the light source substrate 10 (that is, the surface facing the instrument body 6) comes into surface contact with the substrate support portion 32 of the instrument body 6. As a result, heat from each of the plurality of LEDs 46 is efficiently transmitted to the substrate support portion 32 via the light source substrate 10, and heat from each of the plurality of LEDs 46 can be efficiently radiated by the instrument body 6. it can.

［１−１−４．回路基板］
図１及び図３に示すように、回路基板１２は、リング状に形成されており、中央部に円形状の開口部５４を有している。回路基板１２の裏面（すなわち、器具本体６に対向する側の面）には、回路基板１２上の点灯回路から光源基板１０への配線パターン５６が形成されている。この配線パターン５６には、複数の回路部品５８が実装されている。複数の回路部品５８の各々は、複数のＬＥＤ４６の各々を点灯させるための点灯回路等を構成するためのものであり、例えば抵抗素子及びコンデンサ等の電子部品である。なお、複数の回路部品５８は、回路基板１２の表面（すなわち、器具本体６に対向する側の面と反対側の面）にスルーホール実装されるタイプの回路部品５８（後述する図４参照）と、回路基板１２の裏面に表面実装されるタイプの回路部品５８（後述する図５参照）とを含んでいる。 [1-1-4. Circuit board]
As shown in FIGS. 1 and 3, the circuit board 12 is formed in a ring shape and has a circular opening 54 at the center. A wiring pattern 56 from the lighting circuit on the circuit board 12 to the light source board 10 is formed on the back surface of the circuit board 12 (that is, the surface facing the instrument body 6). A plurality of circuit components 58 are mounted on the wiring pattern 56. Each of the plurality of circuit components 58 constitutes a lighting circuit for lighting each of the plurality of LEDs 46, and is an electronic component such as a resistance element and a capacitor, for example. The plurality of circuit components 58 are mounted on the surface of the circuit board 12 (that is, the surface opposite to the surface facing the instrument body 6) through-hole mounting (see FIG. 4 described later). And a circuit component 58 of a type that is surface-mounted on the back surface of the circuit board 12 (see FIG. 5 described later).

図２に示すように、回路基板１２は、後述するようにして光源基板１０に固定されており、器具取付部８の周囲を囲むようにリング状に配置されている。図３に示すように、回路基板１２は、Ｚ軸方向において光源基板１０よりも器具本体６側に配置される。また、回路基板１２は、回路基板１２の表面側における外周部の一部と光源基板１０の突片４２（すなわち、光源基板１０の裏面側における内周部の一部）とが厚み方向（Ｚ軸方向）に重なるように配置されている。なお、光源基板１０と回路基板１２とが厚み方向に重なった領域７４は、図３において網掛け模様を付した領域である。 As shown in FIG. 2, the circuit board 12 is fixed to the light source board 10 as described later, and is arranged in a ring shape so as to surround the periphery of the fixture mounting portion 8. As shown in FIG. 3, the circuit board 12 is disposed closer to the instrument body 6 than the light source board 10 in the Z-axis direction. In the circuit board 12, a part of the outer peripheral part on the surface side of the circuit board 12 and a protruding piece 42 of the light source board 10 (that is, a part of the inner peripheral part on the back side of the light source board 10) are in the thickness direction (Z (Axial direction). The region 74 where the light source substrate 10 and the circuit substrate 12 overlap in the thickness direction is a region with a hatched pattern in FIG.

［１−１−５．受光部カバー］
図１に示すように、受光部カバー１４は、回路基板１２上のリモコン受信部（図示せず）及び常夜灯（図示せず）を覆うように配置された、透光性を有するカバーである。なお、リモコン受信部は、リモコン（図示せず）からのリモコン信号を受信するためのものであり、回路基板１２の表面に（すなわち、回路基板１２のＺ軸のプラス側に）実装されている。常夜灯は、ＬＥＤで構成され、回路基板１２の表面に実装されている。受光部カバー１４は、リモコン信号及び常夜灯からの光を透過する機能を有している。 [1-1-5. Receiver section]
As shown in FIG. 1, the light receiving unit cover 14 is a light-transmitting cover that is disposed so as to cover a remote control receiving unit (not shown) and a nightlight (not shown) on the circuit board 12. The remote control receiving unit is for receiving a remote control signal from a remote control (not shown), and is mounted on the surface of the circuit board 12 (that is, on the positive side of the Z-axis of the circuit board 12). . The night light is composed of LEDs and is mounted on the surface of the circuit board 12. The light receiving unit cover 14 has a function of transmitting a remote control signal and light from the nightlight.

［１−１−６．回路カバー］
図１及び図２に示すように、回路カバー１６は、回路基板１２の表面を覆うためのものであり、例えば金属等の不燃性を有し且つ不透明な材料で形成されている。回路カバー１６は、リング状に形成されており、器具取付部８の周囲を囲み且つ回路基板１２の表面を覆うようにして、光源基板１０の表面に支持されている。さらに、回路カバー１６は、回路基板１２の表面を覆い、且つ、光源基板１０と回路基板１２とが厚み方向に重なった領域７４を覆っている。なお、回路カバー１６の外周部には、ネジ５０を挿通するための複数の貫通孔６２が回路カバー１６の周方向に間隔を置いて形成されている。 [1-1-6. Circuit cover]
As shown in FIGS. 1 and 2, the circuit cover 16 is for covering the surface of the circuit board 12, and is formed of a nonflammable material such as metal and an opaque material. The circuit cover 16 is formed in a ring shape, and is supported on the surface of the light source substrate 10 so as to surround the instrument mounting portion 8 and cover the surface of the circuit substrate 12. Further, the circuit cover 16 covers the surface of the circuit board 12 and covers a region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction. A plurality of through holes 62 for inserting the screws 50 are formed in the outer periphery of the circuit cover 16 at intervals in the circumferential direction of the circuit cover 16.

また、回路カバー１６の受光部カバー１４と重なる部分を切り欠くことにより、受光部カバー１４が回路カバー１６の側面に保持されるようになる。なお、上述したリモコン受信部及び常夜灯が照明器具２に搭載されない場合には、上記の切り欠きは省略してもよい。 Further, the light receiving unit cover 14 is held on the side surface of the circuit cover 16 by cutting out a portion of the circuit cover 16 that overlaps the light receiving unit cover 14. In addition, when the remote control receiver and the nightlight described above are not mounted on the lighting fixture 2, the above cutout may be omitted.

［１−１−７．光源カバー］
図１及び図２に示すように、光源カバー１８は、光源基板１０を覆うためのものであり、透光性を有する（例えば透明の）樹脂等で形成されている。光源カバー１８は、リング状に形成されており、回路カバー１６の周囲を囲み且つ光源基板１０の表面を覆うようにして、光源基板１０の表面に支持されている。なお、光源カバー１８の内周部には、ネジ５０を挿通するための複数の貫通孔６４が光源カバー１８の周方向に間隔を置いて形成されている。 [1-1-7. Light source cover]
As shown in FIGS. 1 and 2, the light source cover 18 is for covering the light source substrate 10 and is formed of a light-transmitting (for example, transparent) resin or the like. The light source cover 18 is formed in a ring shape, and is supported on the surface of the light source substrate 10 so as to surround the circuit cover 16 and cover the surface of the light source substrate 10. A plurality of through holes 64 for inserting the screws 50 are formed in the inner peripheral portion of the light source cover 18 at intervals in the circumferential direction of the light source cover 18.

図１に示すように、複数のネジ５０の各々は、光源カバー１８の貫通孔６４、回路カバー１６の貫通孔６２、光源基板１０の貫通孔５２を通して器具本体６のネジ孔３４に螺着される。これにより、光源カバー１８、回路カバー１６及び光源基板１０が複数のネジ５０によって器具本体６に固定される。 As shown in FIG. 1, each of the plurality of screws 50 is screwed into the screw hole 34 of the instrument body 6 through the through hole 64 of the light source cover 18, the through hole 62 of the circuit cover 16, and the through hole 52 of the light source substrate 10. The Thereby, the light source cover 18, the circuit cover 16, and the light source substrate 10 are fixed to the instrument body 6 by the plurality of screws 50.

［１−１−８．グローブ］
グローブ２０は、器具本体６全体を覆うためのものであり、透光性を有する（例えば乳白色の）樹脂で形成されている。グローブ２０の開口部（図示せず）には、複数の突起（図示せず）が形成されている。これらの複数の突起をそれぞれ器具本体６の複数のグローブ取付部２２に係合させることにより、グローブ２０が器具本体６に着脱自在に取り付けられる。 [1-1-8. Globe]
The globe 20 is for covering the entire instrument body 6 and is formed of a translucent (for example, milky white) resin. A plurality of protrusions (not shown) are formed in the opening (not shown) of the globe 20. By engaging these plurality of protrusions with the plurality of globe attaching portions 22 of the instrument body 6, the globe 20 is detachably attached to the instrument body 6.

［１−２．光源基板と回路基板との固定］
次に、図３及び図４を参照しながら、光源基板１０と回路基板１２とを相互に固定する構成について説明する。図４は、実施の形態１に係る照明器具２の構造を模式的に示した、図３のＩＶ−ＩＶ線による照明器具２の断面図である。なお、説明の都合上、図４では、照明器具２の主要な構成要素のみを図示している。 [1-2. Fixing of light source board and circuit board]
Next, a configuration for fixing the light source board 10 and the circuit board 12 to each other will be described with reference to FIGS. 3 and 4. FIG. 4 is a cross-sectional view of the lighting fixture 2 taken along the line IV-IV in FIG. 3 schematically showing the structure of the lighting fixture 2 according to the first embodiment. For convenience of explanation, FIG. 4 shows only main components of the lighting fixture 2.

図４に示すように、光源基板１０の突片４２には、ネジ６６（固定部材の一例）を挿通するための貫通孔６８が形成されている。また、回路基板１２の外周部における貫通孔６８に対応する部位には、ネジ６６を挿通するための貫通孔７０が形成されている。 As shown in FIG. 4, a through hole 68 for inserting a screw 66 (an example of a fixing member) is formed in the protruding piece 42 of the light source substrate 10. Further, a through hole 70 for inserting a screw 66 is formed in a portion corresponding to the through hole 68 in the outer peripheral portion of the circuit board 12.

ネジ６６が光源基板１０の貫通孔６８及び回路基板１２の貫通孔７０にそれぞれ挿入され、且つ、ネジ６６の先端部にナット７２（固定部材の一例）が螺着されることにより、光源基板１０と回路基板１２とが相互に固定される。すなわち、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で、光源基板１０と回路基板１２とがネジ６６及びナット７２によって相互に固定される。 The screws 66 are inserted into the through holes 68 of the light source board 10 and the through holes 70 of the circuit board 12, respectively, and a nut 72 (an example of a fixing member) is screwed to the distal end portion of the screws 66, whereby the light source board 10. And the circuit board 12 are fixed to each other. That is, the light source board 10 and the circuit board 12 are fixed to each other by the screw 66 and the nut 72 in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction.

［１−３．光源基板と回路基板との電気的接続］
次に、図３、図５及び図６を参照しながら、光源基板１０と回路基板１２とを電気的に接続する構成について説明する。図５は、実施の形態１に係る照明器具２の構造を模式的に示した、図３のＶ−Ｖ線による照明器具２の断面図である。図６は、実施の形態１に係るソケットコネクタ７６及びピンコネクタ８４を拡大して示す断面図である。なお、説明の都合上、図５では、照明器具２の主要な構成要素のみを図示している。 [1-3. Electrical connection between light source board and circuit board]
Next, a configuration for electrically connecting the light source board 10 and the circuit board 12 will be described with reference to FIGS. 3, 5, and 6. FIG. 5 is a cross-sectional view of the lighting fixture 2 taken along the line V-V in FIG. 3 schematically showing the structure of the lighting fixture 2 according to the first embodiment. FIG. 6 is an enlarged sectional view showing the socket connector 76 and the pin connector 84 according to the first embodiment. For convenience of explanation, FIG. 5 shows only main components of the lighting fixture 2.

図３、図５及び図６に示すように、光源基板１０の突片４２に形成された配線パターン４４には、メスコネクタである一対のソケットコネクタ７６（第１のコネクタの一例）が実装（表面実装）されている。ソケットコネクタ７６は、樹脂で形成されたコネクタ本体７８と、コネクタ本体７８に形成されたメス型端子８０とを有している。ソケットコネクタ７６は、メス型端子８０と光源基板１０に形成されたスルーホール８２とが合致するように配置されている。メス型端子８０は、配線パターン４４を介してＬＥＤ４６に電気的に接続されている。 As shown in FIGS. 3, 5, and 6, a pair of socket connectors 76 (an example of a first connector) that is a female connector is mounted on the wiring pattern 44 formed on the protruding piece 42 of the light source substrate 10 ( Surface mount). The socket connector 76 has a connector main body 78 formed of resin and a female terminal 80 formed on the connector main body 78. The socket connector 76 is disposed so that the female terminal 80 and the through hole 82 formed in the light source substrate 10 match. The female terminal 80 is electrically connected to the LED 46 through the wiring pattern 44.

図３、図５及び図６に示すように、回路基板１２の外周部に形成された配線パターン５６には、オスコネクタである一対のピンコネクタ８４（第２のコネクタの一例）が実装（スルーホール実装）されている。ピンコネクタ８４は、樹脂で形成されたコネクタ本体８６と、コネクタ本体８６から光源基板１０側に延びるオス型端子８８と、コネクタ本体８６から器具本体６側に延びるリード９０とを有している。リード９０は、回路基板１２に形成されたスルーホール９２に挿入され、且つ、配線パターン５６にはんだ付けされている。これにより、オス型端子８８は、配線パターン５６を介して回路部品５８に電気的に接続されている。 As shown in FIGS. 3, 5, and 6, a pair of pin connectors 84 (an example of a second connector) that is a male connector is mounted on the wiring pattern 56 formed on the outer peripheral portion of the circuit board 12 (through connector). Hall mounting). The pin connector 84 has a connector main body 86 made of resin, a male terminal 88 extending from the connector main body 86 toward the light source substrate 10, and a lead 90 extending from the connector main body 86 toward the instrument main body 6. The lead 90 is inserted into a through hole 92 formed in the circuit board 12 and soldered to the wiring pattern 56. As a result, the male terminal 88 is electrically connected to the circuit component 58 via the wiring pattern 56.

ピンコネクタ８４のオス型端子８８は、光源基板１０のスルーホール８２に挿入され、且つ、ソケットコネクタ７６のメス型端子８０に着脱自在に嵌合される。これにより、ソケットコネクタ７６及びピンコネクタ８４は、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で相互に嵌合される。 The male terminal 88 of the pin connector 84 is inserted into the through hole 82 of the light source substrate 10 and is detachably fitted to the female terminal 80 of the socket connector 76. Thereby, the socket connector 76 and the pin connector 84 are fitted to each other in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction.

［１−４．効果等］
上述したように、本実施の形態の照明器具２は、天井４に取り付けられる器具本体６と、器具本体６に支持された光源基板１０と、光源基板１０に実装されたＬＥＤ４６と、光源基板１０に実装され、ＬＥＤ４６と電気的に接続されたソケットコネクタ７６と、光源基板１０の一部と厚み方向に重なるように配置された回路基板１２と、回路基板１２に実装され、ＬＥＤ４６を点灯させるための点灯回路を構成する回路部品５８と、回路基板１２に実装され、回路部品５８と電気的に接続されたピンコネクタ８４とを備える。ソケットコネクタ７６及びピンコネクタ８４は、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で相互に嵌合される。 [1-4. Effect]
As described above, the lighting fixture 2 according to the present embodiment includes the fixture main body 6 attached to the ceiling 4, the light source substrate 10 supported by the fixture main body 6, the LED 46 mounted on the light source substrate 10, and the light source substrate 10. The socket connector 76 that is mounted on the LED 46 and electrically connected to the LED 46, the circuit board 12 that is disposed so as to overlap a part of the light source board 10 in the thickness direction, and the LED 46 that is mounted on the circuit board 12 and illuminates the LED 46. And a pin connector 84 mounted on the circuit board 12 and electrically connected to the circuit component 58. The socket connector 76 and the pin connector 84 are fitted to each other in a region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction.

この構成によれば、光源基板１０と回路基板１２とが厚み方向に重なった領域７４でソケットコネクタ７６及びピンコネクタ８４を相互に嵌合する。これにより、照明器具２を組み立てる際に、光源基板１０及び回路基板１２をそれぞれ器具本体６に対して位置決めする位置決め作業と、光源基板１０と回路基板１２とを電気的に接続する配線作業とを同時に行うことができる。その結果、照明器具２の組み立て工数が低減するので、照明器具２の組み立て効率を高めることができる。 According to this configuration, the socket connector 76 and the pin connector 84 are fitted to each other in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction. Thereby, when the lighting fixture 2 is assembled, the positioning work for positioning the light source board 10 and the circuit board 12 with respect to the fixture body 6 and the wiring work for electrically connecting the light source board 10 and the circuit board 12 are performed. Can be done simultaneously. As a result, since the man-hours for assembling the lighting fixture 2 are reduced, the assembly efficiency of the lighting fixture 2 can be increased.

さらに、第１のコネクタ及び第２のコネクタの一方はピンコネクタ８４であり、第１のコネクタ及び第２のコネクタの他方は、ピンコネクタ８４と嵌合されるソケットコネクタ７６である。 Furthermore, one of the first connector and the second connector is a pin connector 84, and the other of the first connector and the second connector is a socket connector 76 that is fitted to the pin connector 84.

この構成によれば、ソケットコネクタ７６及びピンコネクタ８４を相互に嵌合することにより、光源基板１０と回路基板１２とを電気的に接続する配線作業を容易に行うことができる。 According to this configuration, the wiring work for electrically connecting the light source board 10 and the circuit board 12 can be easily performed by fitting the socket connector 76 and the pin connector 84 together.

さらに、照明器具２は、さらに、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で、光源基板１０と回路基板１２とを相互に固定するネジ６６及びナット７２を備える。 Furthermore, the luminaire 2 further includes a screw 66 and a nut 72 that fix the light source board 10 and the circuit board 12 to each other in a region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction.

この構成によれば、相互に嵌合されたソケットコネクタ７６及びピンコネクタ８４の近傍で、光源基板１０と回路基板１２とが相互に固定される。これにより、ネジ６６及びナット７２を締め付けた際に、ソケットコネクタ７６及びピンコネクタ８４の各々に応力が加わるのを抑制することができる。さらに、光源基板１０と回路基板１２とが重なった領域７４で、光源基板１０と回路基板１２とが相互に固定される。これにより、光源基板１０及び回路基板１２の寸法誤差及び経年変化による変形等に起因して、ソケットコネクタ７６及びピンコネクタ８４の各々に応力が加わるのを抑制することができる。 According to this configuration, the light source board 10 and the circuit board 12 are fixed to each other in the vicinity of the socket connector 76 and the pin connector 84 fitted to each other. Thereby, when the screw 66 and the nut 72 are tightened, it is possible to suppress the stress from being applied to each of the socket connector 76 and the pin connector 84. Further, the light source board 10 and the circuit board 12 are fixed to each other in a region 74 where the light source board 10 and the circuit board 12 overlap. Thereby, it is possible to suppress stress from being applied to each of the socket connector 76 and the pin connector 84 due to dimensional errors of the light source substrate 10 and the circuit substrate 12 and deformation due to secular change.

さらに、照明器具２は、さらに、器具本体６を天井４に取り付けるための器具取付部８を備える。回路基板１２は、器具取付部８の周囲を囲むようにリング状に配置される。光源基板１０は、回路基板１２の周囲を囲むようにリング状に配置され、且つ、回路基板１２の外周部の一部と光源基板１０の内周部の一部とが厚み方向に重なるように配置されている。 Furthermore, the lighting fixture 2 further includes a fixture mounting portion 8 for mounting the fixture body 6 to the ceiling 4. The circuit board 12 is arranged in a ring shape so as to surround the periphery of the instrument mounting portion 8. The light source board 10 is arranged in a ring shape so as to surround the circuit board 12, and a part of the outer peripheral part of the circuit board 12 and a part of the inner peripheral part of the light source board 10 overlap in the thickness direction. Has been placed.

この構成によれば、照明器具２を例えばシーリングライトとして用いることができる。 According to this structure, the lighting fixture 2 can be used as a ceiling light, for example.

さらに、照明器具２は、さらに、光源基板１０を覆うように配置され、透光性を有する光源カバー１８と、回路基板１２を覆うように配置された不透明の回路カバー１６とを備える。回路カバー１６は、光源基板１０と回路基板１２とが厚み方向に重なった領域７４を覆う。 Further, the lighting fixture 2 further includes a light source cover 18 that is disposed so as to cover the light source substrate 10 and has a light transmitting property, and an opaque circuit cover 16 that is disposed so as to cover the circuit substrate 12. The circuit cover 16 covers a region 74 where the light source substrate 10 and the circuit substrate 12 overlap in the thickness direction.

この構成によれば、光源基板１０と回路基板１２とが厚み方向に重なった領域７４に配置されたソケットコネクタ７６及びピンコネクタ８４等がグローブ２０を通してユーザの目に触れるのを抑制することができ、照明器具２の美観を保つことができる。 According to this configuration, the socket connector 76 and the pin connector 84 arranged in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction can be prevented from touching the user's eyes through the globe 20. The aesthetics of the lighting fixture 2 can be maintained.

（実施の形態２）
次に、図７を参照しながら、実施の形態２に係る照明器具の構成について説明する。図７は、実施の形態２に係るソケットコネクタ７６Ａ及びピンコネクタ８４Ａを拡大して示す断面図である。なお、以下に示す実施の形態及び各変形例において、上記実施の形態１と同一の構成要素には同一の符号を付して、その説明を省略する。 (Embodiment 2)
Next, the configuration of the lighting apparatus according to Embodiment 2 will be described with reference to FIG. FIG. 7 is an enlarged cross-sectional view of the socket connector 76A and the pin connector 84A according to the second embodiment. In the following embodiments and modifications, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

図７に示すように、本実施の形態の照明器具では、ソケットコネクタ７６Ａ（第２のコネクタの一例）及びピンコネクタ８４Ａ（第１のコネクタの一例）の配置が上記実施の形態１と逆になっている。すなわち、ソケットコネクタ７６Ａは回路基板１２の配線パターン５６に実装（スルーホール実装）され、ピンコネクタ８４Ａは光源基板１０の配線パターン４４に実装（表面実装）されている。このような構成であっても、上記実施の形態１と同様の効果を得ることができる。 As shown in FIG. 7, in the lighting apparatus of the present embodiment, the arrangement of the socket connector 76A (an example of the second connector) and the pin connector 84A (an example of the first connector) is opposite to that of the first embodiment. It has become. That is, the socket connector 76A is mounted on the wiring pattern 56 of the circuit board 12 (through-hole mounting), and the pin connector 84A is mounted on the wiring pattern 44 of the light source board 10 (surface mounting). Even if it is such a structure, the effect similar to the said Embodiment 1 can be acquired.

（変形例１）
次に、図８を参照しながら、変形例１に係る照明器具２Ｂの構成について説明する。図８は、変形例１に係る照明器具２Ｂの構造を模式的に示した照明器具２Ｂの断面図である。 (Modification 1)
Next, the structure of the lighting fixture 2B which concerns on the modification 1 is demonstrated, referring FIG. FIG. 8 is a cross-sectional view of the lighting fixture 2B schematically showing the structure of the lighting fixture 2B according to the first modification.

図８に示すように、本変形例の照明器具２Ｂでは、器具本体６Ｂの構成が上記実施の形態１と異なり、且つ、光源基板１０と回路基板１２とを相互に固定する構成が上記実施の形態１と異なっている。 As shown in FIG. 8, in the lighting fixture 2B of the present modification, the configuration of the fixture main body 6B is different from that of the first embodiment, and the configuration in which the light source board 10 and the circuit board 12 are fixed to each other is as described above. Different from Form 1.

具体的には、器具本体６Ｂは、天井支持部２８Ｂ、第１の基板支持部３２Ｂ、第２の基板支持部９４、第１の筒状部９６及び第２の筒状部９８を有している。第１の筒状部９６は、天井取付部２８Ｂの外周部から光源基板１０側に立ち上がりながら筒状に延びている。第２の基板支持部９４は、第１の筒状部９６の先端部からさらに器具本体６Ｂの径方向外側にリング状に延びている。第２の基板支持部９４には、ネジ６６を螺着するためのネジ孔１００が形成されている。第２の筒状部９８は、第２の基板支持部９４の外周部から光源基板１０側に立ち上がりながら筒状に延びている。第１の基板支持部３２Ｂは、第２の筒状部９８の先端部からさらに器具本体６Ｂの径方向外側にリング状に延びている。天井取付部２８Ｂ、第１の基板支持部３２Ｂ及び第２の基板支持部９４の各々は、ＸＹ平面に対して略平行な平面で形成されている。 Specifically, the instrument body 6B includes a ceiling support portion 28B, a first substrate support portion 32B, a second substrate support portion 94, a first tubular portion 96, and a second tubular portion 98. Yes. The first cylindrical portion 96 extends in a cylindrical shape while rising from the outer peripheral portion of the ceiling mounting portion 28B toward the light source substrate 10 side. The second substrate support portion 94 extends in a ring shape from the distal end portion of the first tubular portion 96 to the radially outer side of the instrument main body 6B. A screw hole 100 for screwing the screw 66 is formed in the second substrate support portion 94. The second cylindrical portion 98 extends in a cylindrical shape while rising from the outer peripheral portion of the second substrate support portion 94 toward the light source substrate 10 side. The first substrate support portion 32B extends in a ring shape from the distal end portion of the second cylindrical portion 98 further outward in the radial direction of the instrument body 6B. Each of the ceiling mounting portion 28B, the first substrate support portion 32B, and the second substrate support portion 94 is formed in a plane substantially parallel to the XY plane.

図８に示すように、回路基板１２の外周部は、第２の基板支持部９４に支持されている。すなわち、回路基板１２の裏面における外周部は、第２の基板支持部９４に面接触している。この状態で、ネジ６６が光源基板１０の貫通孔６８及び回路基板１２の貫通孔７０にそれぞれ挿入され、且つ、第２の基板支持部９４のネジ孔１００に螺着されることにより、光源基板１０と回路基板１２と器具本体６Ｂとが相互に固定される。すなわち、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で、光源基板１０と回路基板１２と器具本体６Ｂとがネジ６６によって相互に固定される。 As shown in FIG. 8, the outer periphery of the circuit board 12 is supported by the second board support part 94. That is, the outer peripheral portion on the back surface of the circuit board 12 is in surface contact with the second substrate support portion 94. In this state, the screws 66 are respectively inserted into the through holes 68 of the light source substrate 10 and the through holes 70 of the circuit board 12 and screwed into the screw holes 100 of the second substrate support portion 94, whereby the light source substrate. 10, the circuit board 12, and the instrument body 6B are fixed to each other. That is, in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction, the light source board 10, the circuit board 12, and the instrument body 6 B are fixed to each other by the screws 66.

上述したように、ネジ６６は、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で、光源基板１０と回路基板１２と器具本体６Ｂとを相互に固定する。 As described above, the screw 66 fixes the light source board 10, the circuit board 12, and the instrument body 6B to each other in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction.

この構成によれば、照明器具２Ｂを組み立てる際に、光源基板１０と回路基板１２とを相互に固定する固定作業と、光源基板１０及び回路基板１２を器具本体６Ｂに固定する固定作業とを同時に行うことができる。その結果、照明器具２Ｂの組み立て効率をより一層高めることができる。 According to this configuration, when assembling the lighting fixture 2B, the fixing operation for fixing the light source board 10 and the circuit board 12 to each other and the fixing operation for fixing the light source board 10 and the circuit board 12 to the fixture body 6B are performed simultaneously. It can be carried out. As a result, the assembly efficiency of the lighting fixture 2B can be further increased.

（変形例２）
次に、図９を参照しながら、変形例２に係る照明器具２Ｃの構成について説明する。図９は、変形例２に係る照明器具２Ｃの構造を模式的に示した照明器具２Ｃの断面図である。 (Modification 2)
Next, the configuration of a lighting fixture 2C according to Modification 2 will be described with reference to FIG. FIG. 9 is a cross-sectional view of a lighting fixture 2C schematically showing the structure of the lighting fixture 2C according to the second modification.

図９に示すように、本変形例の照明器具２Ｃでは、器具本体６Ｃの構成が上記変形例１と異なり、且つ、光源基板１０と回路基板１２とを相互に固定する構成が上記変形例１と異なっている。 As shown in FIG. 9, in the lighting fixture 2C of the present modification, the configuration of the fixture body 6C is different from that of the first modification, and the configuration in which the light source board 10 and the circuit board 12 are fixed to each other is the first modification. Is different.

具体的には、器具本体６Ｃの第１の基板支持部３２Ｂと第２の基板支持部９４ＣとのＺ軸方向における配置間隔は、上記変形例１における配置間隔よりも大きくなっている。さらに、第２の基板支持部９４Ｃには、回路基板１２の周方向にリング状に延びる保持部１０２が取り付けられている。保持部１０２は、例えば樹脂等の絶縁材料で形成されており、ネジ孔１０４を有している。回路基板１２は、保持部１０２を介して第２の基板支持部９４Ｃに支持されている。 Specifically, the arrangement interval in the Z-axis direction between the first substrate support portion 32B and the second substrate support portion 94C of the instrument body 6C is larger than the arrangement interval in the first modification. Furthermore, a holding portion 102 extending in a ring shape in the circumferential direction of the circuit board 12 is attached to the second substrate support portion 94C. The holding part 102 is made of an insulating material such as resin and has a screw hole 104. The circuit board 12 is supported by the second board support part 94 C via the holding part 102.

ネジ６６が光源基板１０の貫通孔６８及び回路基板１２の貫通孔７０にそれぞれ挿入され、且つ、保持部１０２のネジ孔１０４に螺着されることにより、光源基板１０と回路基板１２と保持部１０２とが相互に固定される。すなわち、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で、光源基板１０と回路基板１２と保持部１０２とがネジ６６によって相互に固定される。なお、第１の基板支持部３２Ｂの光源基板１０が面接触する面と、保持部１０２の回路基板１２が面接触する面との間隔Ｗは、回路基板１２の厚みと略同一である。 The screws 66 are inserted into the through holes 68 of the light source board 10 and the through holes 70 of the circuit board 12 and are screwed into the screw holes 104 of the holding section 102, whereby the light source board 10, the circuit board 12, and the holding section. 102 are fixed to each other. That is, the light source board 10, the circuit board 12, and the holding portion 102 are fixed to each other by the screws 66 in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction. Note that the interval W between the surface of the first substrate support portion 32 B that is in surface contact with the light source substrate 10 and the surface of the holding portion 102 that is in surface contact with the circuit substrate 12 is substantially the same as the thickness of the circuit substrate 12.

上述したように、照明器具２Ｃは、さらに、回路基板１２を保持するための保持部１０２を備える。器具本体６Ｃは、光源基板１０を支持する第１の基板支持部３２Ｂと、保持部１０２を介して回路基板１２を支持する第２の基板支持部９４Ｃとを有する。第１の基板支持部３２Ｂの光源基板１０が接触する面と、保持部１０２の回路基板１２が接触する面との間隔Ｗは、回路基板１２の厚みと略同一である。 As described above, the lighting fixture 2 C further includes the holding unit 102 for holding the circuit board 12. The instrument body 6 C includes a first substrate support portion 32 B that supports the light source substrate 10, and a second substrate support portion 94 C that supports the circuit substrate 12 via the holding portion 102. The distance W between the surface of the first substrate support portion 32B that contacts the light source substrate 10 and the surface of the holding portion 102 that contacts the circuit substrate 12 is substantially the same as the thickness of the circuit substrate 12.

この構成によれば、照明器具２Ｃを組み立てる際に、まず、回路基板１２を、保持部１０２を介して第２の基板支持部９４Ｃに支持させた後に、光源基板１０を第１の基板支持部３２Ｂに支持させる。これにより、光源基板１０及び回路基板１２の器具本体６Ｃに対するＺ軸方向における位置決めを容易に行うことができる。その結果、光源基板１０と回路基板１２との電気的接続を確保しながら、光源基板１０の裏面を第１の基板支持部３２Ｂに面接触させることができる。 According to this configuration, when the lighting fixture 2C is assembled, first, the circuit board 12 is supported by the second board support part 94C via the holding part 102, and then the light source board 10 is moved to the first board support part. 32B is supported. Thereby, the positioning in the Z-axis direction with respect to the instrument main body 6C of the light source board | substrate 10 and the circuit board 12 can be performed easily. As a result, the back surface of the light source substrate 10 can be brought into surface contact with the first substrate support portion 32B while securing the electrical connection between the light source substrate 10 and the circuit substrate 12.

なお、本変形例では、保持部１０２をリング状に形成したが、これに限定されず、例えばブロック状の保持部１０２を複数個、回路基板１２の周方向に間隔を置いて配置してもよい。 In this modification, the holding portion 102 is formed in a ring shape. However, the present invention is not limited to this. For example, a plurality of block-like holding portions 102 may be arranged at intervals in the circumferential direction of the circuit board 12. Good.

（変形例３）
次に、図１０を参照しながら、変形例３に係る照明器具２Ｄの構成について説明する。図１０は、変形例３に係る照明器具２Ｄの構造を模式的に示した照明器具２Ｄの断面図である。 (Modification 3)
Next, the configuration of a lighting fixture 2D according to Modification 3 will be described with reference to FIG. FIG. 10 is a cross-sectional view of a lighting fixture 2D schematically showing the structure of the lighting fixture 2D according to Modification 3.

図１０に示すように、本変形例の照明器具２Ｄでは、光源基板１０と回路基板１２との位置関係が上記実施の形態１と異なっている。具体的には、回路基板１２は、Ｚ軸方向において光源基板１０に対して器具本体６Ｄと反対側に配置され、且つ、回路基板１２の裏面側における外周部の一部と光源基板１０の突片４２（すなわち、光源基板１０の表面側における内周部の一部）とが厚み方向に重なるように配置されている。 As shown in FIG. 10, in the lighting fixture 2D of this modification, the positional relationship between the light source board 10 and the circuit board 12 is different from that of the first embodiment. Specifically, the circuit board 12 is arranged on the side opposite to the instrument body 6D with respect to the light source board 10 in the Z-axis direction, and a part of the outer peripheral portion on the back side of the circuit board 12 and the projection of the light source board 10 are arranged. It arrange | positions so that the piece 42 (namely, a part of inner peripheral part in the surface side of the light source board | substrate 10) may overlap with the thickness direction.

この状態で、ネジ６６が回路基板１２の貫通孔７０及び光源基板１０の貫通孔６８にそれぞれ挿入され、且つ、基板支持部３２Ｄに形成されたネジ孔１０６に螺着されることにより、光源基板１０と回路基板１２と器具本体６Ｄとが相互に固定される。すなわち、光源基板１０と回路基板１２とが厚み方向に重なった領域７４で、光源基板１０と回路基板１２と器具本体６Ｄとがネジ６６によって相互に固定される。 In this state, the screws 66 are respectively inserted into the through holes 70 of the circuit board 12 and the through holes 68 of the light source board 10 and screwed into the screw holes 106 formed in the board support portion 32D. 10, the circuit board 12, and the instrument body 6D are fixed to each other. That is, in the region 74 where the light source board 10 and the circuit board 12 overlap in the thickness direction, the light source board 10, the circuit board 12, and the instrument body 6 D are fixed to each other by the screws 66.

照明器具２Ｄを組み立てる際には、まず、光源基板１０を基板支持部３２Ｄに支持させた後に、回路基板１２を光源基板１０上に支持させる。これにより、ネジ６６で光源基板１０と回路基板１２と器具本体６Ｄとを相互に固定する際に、回路基板１２を保持しておくための部材を省略することができる。 When assembling the lighting fixture 2D, first, the light source substrate 10 is supported by the substrate support portion 32D, and then the circuit board 12 is supported on the light source substrate 10. Thereby, when fixing the light source board | substrate 10, the circuit board 12, and the instrument main body 6D mutually with the screw | thread 66, the member for hold | maintaining the circuit board 12 can be abbreviate | omitted.

（変形例４）
次に、図１１を参照しながら、変形例４に係る照明器具の構成について説明する。図１１は、変形例４に係る一対の光源基板１０Ｅ及び回路基板１２Ｅを抜き出して示す平面図である。 (Modification 4)
Next, the structure of the lighting fixture which concerns on the modification 4 is demonstrated, referring FIG. FIG. 11 is a plan view showing a pair of light source boards 10E and a circuit board 12E according to the fourth modification.

図１１に示すように、本変形例の照明器具では、上記実施の形態１で説明した光源基板１０が一対の光源基板１０Ｅに分割されている。一対の光源基板１０Ｅの各々は半リング状に形成されている。一対の光源基板１０Ｅの各々の内周部４０Ｅの周縁部には、光源基板１０Ｅの径方向内側に突出する突片４２Ｅが形成されている。 As shown in FIG. 11, in the lighting fixture of the present modification, the light source substrate 10 described in the first embodiment is divided into a pair of light source substrates 10E. Each of the pair of light source substrates 10E is formed in a semi-ring shape. A protruding piece 42E is formed on the inner peripheral portion 40E of each of the pair of light source substrates 10E so as to protrude radially inward of the light source substrate 10E.

一対の光源基板１０Ｅは、回路基板１２Ｅの周囲を囲むようにリング状に並んで配置されている。なお、一対の光源基板１０Ｅは、略同一平面上に配置されている。回路基板１２Ｅは、回路基板１２Ｅの表面側における外周部の一部と一対の光源基板１０Ｅの各々の突片４２Ｅ（すなわち、一対の光源基板１０Ｅの各々の裏面側における内周部４０Ｅの一部）とが厚み方向に重なるように配置されている。これにより、光源基板１０Ｅと回路基板１２Ｅとが厚み方向に重なった領域７４Ｅで、光源基板１０Ｅと回路基板１２Ｅとがネジ６６及びナット７２（図４参照）によって相互に固定され、且つ、ソケットコネクタ７６及びピンコネクタ８４が相互に嵌合される。 The pair of light source boards 10E are arranged in a ring shape so as to surround the circuit board 12E. Note that the pair of light source substrates 10E are disposed on substantially the same plane. The circuit board 12E includes a part of the outer peripheral part on the front surface side of the circuit board 12E and the protruding pieces 42E of each of the pair of light source boards 10E (that is, part of the inner peripheral part 40E on the back side of each of the pair of light source boards 10E). ) And are overlapped in the thickness direction. Thus, in the region 74E where the light source board 10E and the circuit board 12E overlap in the thickness direction, the light source board 10E and the circuit board 12E are fixed to each other by the screw 66 and the nut 72 (see FIG. 4), and the socket connector 76 and pin connector 84 are fitted together.

上述したように、照明器具は、さらに、器具本体６（図１参照）を天井４（図１参照）に取り付けるための器具取付部８（図１参照）を備える。光源基板１０Ｅは一対設けられ、回路基板１２Ｅは、器具取付部８の周囲を囲むようにリング状に配置される。一対の光源基板１０Ｅは、回路基板１２Ｅの周囲を囲むようにリング状に並んで配置され、且つ、回路基板１２Ｅの外周部の一部と一対の光源基板１０Ｅの各々の内周部の一部とが厚み方向に重なるように配置されている。 As described above, the lighting fixture further includes the fixture mounting portion 8 (see FIG. 1) for mounting the fixture body 6 (see FIG. 1) to the ceiling 4 (see FIG. 1). A pair of light source boards 10E are provided, and the circuit board 12E is arranged in a ring shape so as to surround the periphery of the fixture mounting portion 8. The pair of light source boards 10E are arranged in a ring shape so as to surround the periphery of the circuit board 12E, and a part of the outer peripheral part of the circuit board 12E and a part of the inner peripheral part of each of the pair of light source boards 10E. Are arranged so as to overlap each other in the thickness direction.

この構成によれば、一対の光源基板１０Ｅの各々は、ソケットコネクタ７６及びピンコネクタ８４を介して回路基板１２Ｅと電気的に接続される。これにより、一対の光源基板１０Ｅを厚み方向に重ねる必要がなく、一対の光源基板１０Ｅを略同一平面上に配置することができる。その結果、一対の光源基板１０Ｅの各々を基板支持部３２（図２参照）に面接触させることができ、高い放熱効果を得ることができる。 According to this configuration, each of the pair of light source boards 10E is electrically connected to the circuit board 12E via the socket connector 76 and the pin connector 84. Accordingly, it is not necessary to overlap the pair of light source substrates 10E in the thickness direction, and the pair of light source substrates 10E can be arranged on substantially the same plane. As a result, each of the pair of light source substrates 10E can be brought into surface contact with the substrate support portion 32 (see FIG. 2), and a high heat dissipation effect can be obtained.

さらに、一方の光源基板１０Ｅの配線パターン４４は、回路基板１２Ｅの配線パターン５７を介して、他方の光源基板１０Ｅの配線パターン４４と電気的に接続される。これにより、一対の光源基板１０Ｅ間を電気的に接続するためのリード線等を省略することができる。 Furthermore, the wiring pattern 44 of one light source board 10E is electrically connected to the wiring pattern 44 of the other light source board 10E via the wiring pattern 57 of the circuit board 12E. Thereby, the lead wire etc. for electrically connecting between a pair of light source substrates 10E can be omitted.

（変形例５）
次に、図１２を参照しながら、変形例５に係る照明器具の構成について説明する。図１２は、変形例５に係る複数の光源基板１０Ｆ及び回路基板１２Ｆを抜き出して示す平面図である。 (Modification 5)
Next, the structure of the lighting fixture which concerns on the modification 5 is demonstrated, referring FIG. FIG. 12 is a plan view showing a plurality of light source boards 10F and circuit boards 12F according to Modification 5.

図１２に示すように、本変形例の照明器具では、上記実施の形態１で説明した光源基板１０が複数（本変形例では４個）の光源基板１０Ｆに分割されている。複数の光源基板１０Ｆの各々は略扇形状に形成されている。複数の光源基板１０Ｆの各々の内周部４０Ｆの周縁部には、光源基板１０Ｆの径方向内側に突出する突片４２Ｆが形成されている。 As shown in FIG. 12, in the lighting fixture of the present modification, the light source substrate 10 described in the first embodiment is divided into a plurality of (four in the present modification) light source substrates 10F. Each of the plurality of light source substrates 10F is formed in a substantially fan shape. Projection pieces 42F projecting radially inward of the light source substrate 10F are formed on the periphery of the inner peripheral portion 40F of each of the plurality of light source substrates 10F.

複数の光源基板１０Ｆは、回路基板１２Ｆの周囲を囲むようにリング状に並んで配置されている。なお、複数の光源基板１０Ｆは、略同一平面上に配置されている。回路基板１２Ｆは、回路基板１２Ｆの表面側における外周部の一部と複数の光源基板１０Ｆの各々の突片４２Ｆ（すなわち、複数の光源基板１０Ｆの各々の裏面側における内周部４０Ｆの一部）とが厚み方向に重なるように配置されている。これにより、光源基板１０Ｆと回路基板１２Ｆとが重なった領域７４Ｆで、光源基板１０Ｆと回路基板１２Ｆとがネジ６６及びナット７２（図４参照）によって相互に固定され、且つ、ソケットコネクタ７６及びピンコネクタ８４が相互に嵌合される。さらに、隣接する一対の光源基板１０Ｆの一方の配線パターン４４は、回路基板１２Ｆの配線パターン５７を介して、一対の光源基板１０Ｆの他方の光源基板１０Ｆの配線パターン４４と電気的に接続される。したがって、本変形例においても、上記変形例４と同様の効果を得ることができる。 The plurality of light source boards 10F are arranged in a ring shape so as to surround the circuit board 12F. The plurality of light source substrates 10F are arranged on substantially the same plane. The circuit board 12F includes a part of the outer peripheral part on the front surface side of the circuit board 12F and the protruding pieces 42F of each of the plurality of light source boards 10F (that is, a part of the inner peripheral part 40F on the back surface side of each of the plurality of light source boards 10F). ) And are overlapped in the thickness direction. Thus, in the region 74F where the light source board 10F and the circuit board 12F overlap, the light source board 10F and the circuit board 12F are fixed to each other by the screw 66 and the nut 72 (see FIG. 4), and the socket connector 76 and the pin Connectors 84 are mated together. Furthermore, one wiring pattern 44 of a pair of adjacent light source boards 10F is electrically connected to the wiring pattern 44 of the other light source board 10F of the pair of light source boards 10F via the wiring pattern 57 of the circuit board 12F. . Therefore, also in this modification, the same effect as that of Modification 4 can be obtained.

（変形例６）
次に、図１３及び図１４を参照しながら、変形例６に係る照明器具の構成について説明する。図１３及び図１４はそれぞれ、変形例６に係る光源基板１０Ｇ及び回路基板１２Ｇを作製する手順を説明するための図である。 (Modification 6)
Next, the structure of the lighting fixture which concerns on the modification 6 is demonstrated, referring FIG.13 and FIG.14. FIG. 13 and FIG. 14 are diagrams for explaining a procedure of manufacturing the light source substrate 10G and the circuit substrate 12G according to the modification example 6, respectively.

本変形例では、以下の手順で、１枚の正方形状の基板１０８から光源基板１０Ｇ及び回路基板１２Ｇをそれぞれ作製することができる。まず、図１３に示すように、基板１０８にプレス加工を施すことにより、基板１０８に３個の切り込み１１０，１１２，１１４を形成する。 In this modification, the light source substrate 10G and the circuit substrate 12G can be respectively produced from one square substrate 108 by the following procedure. First, as shown in FIG. 13, three cuts 110, 112, and 114 are formed in the substrate 108 by pressing the substrate 108.

切り込み１１０は、基板１０８の各辺に接する円形状に形成されている。切り込み１１２は、切り込み１１０と同心円状に形成され、切り込み１１０の直径よりも小さい直径を有する円形状に形成されている。切り込み１１４は、切り込み１１０と切り込み１１２との間に配置され、円弧状の第１の部分１１４ａ及びコの字状の第２の部分１１４ｂを有している。 The notch 110 is formed in a circular shape in contact with each side of the substrate 108. The notch 112 is formed concentrically with the notch 110 and is formed in a circular shape having a diameter smaller than the diameter of the notch 110. The notch 114 is disposed between the notch 110 and the notch 112, and has an arc-shaped first portion 114a and a U-shaped second portion 114b.

基板１０８に切り込み１１０，１１４を形成し、基板１０８の外周部の不要な部分１１６を除去することにより、図１４に示すように、リング状の光源基板１０Ｇが作製される。このようにして作製された光源基板１０Ｇの開口部には、上述した第２の部分１１４ｂに対応して突片４２Ｇが形成される。次いで、光源基板１０Ｇの表面に配線パターン４４（図３参照）を形成した後に、この配線パターン４４に複数のＬＥＤ４６（図３参照）を実装する。 By forming the notches 110 and 114 in the substrate 108 and removing the unnecessary portion 116 on the outer periphery of the substrate 108, a ring-shaped light source substrate 10G is produced as shown in FIG. In the opening of the light source substrate 10G thus manufactured, the projecting piece 42G is formed corresponding to the second portion 114b described above. Next, after forming a wiring pattern 44 (see FIG. 3) on the surface of the light source substrate 10G, a plurality of LEDs 46 (see FIG. 3) are mounted on the wiring pattern 44.

一方、基板１０８に切り込み１１２，１１４を形成し、基板１０８の中央部の不要な部分１１８を除去することにより、図１４に示すように、リング状の回路基板１２Ｇが作製される。このようにして作製された回路基板１２Ｇの外周部には、上述した第２の部分１１４ｂに対応して凹部１２０が形成される。次いで、回路基板１２Ｇの裏面に配線パターン（図示せず）を形成した後に、この配線パターンに複数の回路部品（図示せず）を実装する。 On the other hand, by forming the notches 112 and 114 in the substrate 108 and removing the unnecessary portion 118 at the center of the substrate 108, a ring-shaped circuit substrate 12G is produced as shown in FIG. A concave portion 120 is formed on the outer peripheral portion of the circuit board 12G thus manufactured, corresponding to the second portion 114b described above. Next, after forming a wiring pattern (not shown) on the back surface of the circuit board 12G, a plurality of circuit components (not shown) are mounted on the wiring pattern.

上述した光源基板１０Ｇ及び回路基板１２Ｇを器具本体６（図１参照）に配置する際には、図１４に示すように、光源基板１０Ｇの突片４２Ｇと、回路基板１２Ｇの外周部のうち凹部１１０が形成されていない部位とが厚み方向に重なるように、光源基板１０Ｇ及び回路基板１２Ｇの各々の向きを調節する。 When the light source board 10G and the circuit board 12G are arranged on the instrument body 6 (see FIG. 1), as shown in FIG. 14, the protrusion 42G of the light source board 10G and the concave portion of the outer peripheral portion of the circuit board 12G. The direction of each of the light source substrate 10G and the circuit substrate 12G is adjusted so that the portion where the 110 is not formed overlaps in the thickness direction.

なお、正方形状の基板１０８を光源基板１０Ｇと回路基板１２Ｇとに分断する前に、光源基板１０Ｇの配線パターン及び回路基板１２Ｇの配線パターンを基板１０８上に一括して形成しておいてもよい。光源基板１０Ｇと回路基板１２Ｇとでは、配線パターンの配置が表裏に分かれているため、光源基板１０Ｇ及び回路基板１２Ｇの一方を表裏反転させて使用できるように各配線パターンを設計すればよい。これにより、光源基板１０Ｇ及び回路基板１２Ｇの各配線パターンを基板１０８上に一括して形成することができる。 Note that the wiring pattern of the light source substrate 10G and the wiring pattern of the circuit substrate 12G may be collectively formed on the substrate 108 before dividing the square substrate 108 into the light source substrate 10G and the circuit substrate 12G. . Since the light source substrate 10G and the circuit board 12G have the wiring patterns arranged on the front and back sides, each wiring pattern may be designed so that one of the light source substrate 10G and the circuit board 12G can be used upside down. Thereby, each wiring pattern of the light source board | substrate 10G and the circuit board 12G can be collectively formed on the board | substrate 108. FIG.

（他の変形例等）
以上、本発明について実施の形態１及び２並びに変形例１〜６に基づいて説明したが、本発明は、上記各実施の形態及び各変形例に限定されるものではない。例えば、上記各実施の形態及び各変形例を適宜組み合わせてもよい。 (Other variations)
As mentioned above, although this invention was demonstrated based on Embodiment 1 and 2 and the modifications 1-6, this invention is not limited to said each embodiment and each modification. For example, you may combine each said embodiment and each modification suitably.

例えば、上記各実施の形態等では、照明器具２（２Ｂ，２Ｃ，２Ｄ）が取り付けられる造営材が天井４である場合について説明したが、これに限定されず、造営材を例えば鉄柱等で構成してもよい。この場合、照明器具２（２Ｂ，２Ｃ，２Ｄ）は、例えば防犯灯等で構成される。 For example, in each of the above-described embodiments, the case where the construction material to which the lighting fixtures 2 (2B, 2C, 2D) are attached is the ceiling 4, but is not limited thereto, and the construction material is composed of, for example, a steel pillar May be. In this case, the lighting fixture 2 (2B, 2C, 2D) is comprised by a crime prevention light etc., for example.

例えば、上記各実施の形態等では、光源基板１０（１０Ｅ，１０Ｆ，１０Ｇ）の裏面を基板支持部３２（第１の基板支持部３２Ｂ）に面接触させるようにしたが、これに限定されず、光源基板１０（１０Ｅ，１０Ｆ，１０Ｇ）と基板支持部３２（第１の基板支持部３２Ｂ）との間に熱伝導シート又はシリコングリス等を介在させてもよい。 For example, in each of the above-described embodiments, the back surface of the light source substrate 10 (10E, 10F, 10G) is brought into surface contact with the substrate support portion 32 (first substrate support portion 32B), but is not limited thereto. A heat conductive sheet or silicon grease may be interposed between the light source substrate 10 (10E, 10F, 10G) and the substrate support portion 32 (first substrate support portion 32B).

例えば、上記各実施の形態等では、光源基板１０（１０Ｅ，１０Ｆ，１０Ｇ）と回路基板１２（１２Ｅ，１２Ｆ，１２Ｇ）とを相互に固定する固定部材がネジ６６及びナット７２である場合について説明したが、これに限定されず、例えば固定部材をリベット又はボルト等で構成してもよい。 For example, in each of the above-described embodiments, the case where the fixing member that fixes the light source substrate 10 (10E, 10F, 10G) and the circuit substrate 12 (12E, 12F, 12G) to each other is the screw 66 and the nut 72 will be described. However, it is not limited to this, For example, you may comprise a fixing member with a rivet or a volt | bolt.

上記各実施の形態等では、光源基板１０（１０Ｅ，１０Ｆ，１０Ｇ）の実装構造をＳＭＤ構造としたが、これに限定されず、例えばＬＥＤチップを光源基板１０（１０Ｅ，１０Ｆ，１０Ｇ）に直接実装したＣＯＢ（ＣｈｉｐＯｎＢｏａｒｄ）構造であってもよい。 In each of the above embodiments, the mounting structure of the light source substrate 10 (10E, 10F, 10G) is the SMD structure. However, the present invention is not limited to this. For example, the LED chip is directly attached to the light source substrate 10 (10E, 10F, 10G). A mounted COB (Chip On Board) structure may be used.

その他、上記実施の形態に対して当業者が思い付く各種変形を施して得られる形態や、本発明の趣旨を逸脱しない範囲で各実施の形態における構成要素及び機能を任意に組み合わせることで実現される形態も本発明に含まれる。 In addition, it is realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present invention, or the form obtained by making various modifications conceived by those skilled in the art to the above embodiment. Forms are also included in the present invention.

２，２Ｂ，２Ｃ，２Ｄ照明器具
４天井（造営材）
６，６Ｂ，６Ｃ，６Ｄ器具本体
８器具取付部
１０，１０Ｅ，１０Ｆ，１０Ｇ光源基板
１２，１２Ｅ，１２Ｆ，１２Ｇ回路基板
１６回路カバー
１８光源カバー
３２Ｂ第１の基板支持部
４６ＬＥＤ（光源）
５８回路部品
６６ネジ（固定部材）
７２ナット（固定部材）
７４，７４Ｅ，７４Ｆ領域
７６ソケットコネクタ（第１のコネクタ）
７６Ａソケットコネクタ（第２のコネクタ）
８４ピンコネクタ（第２のコネクタ）
８４Ａピンコネクタ（第１のコネクタ）
９４第２の基板支持部
１０２保持部 2,2B, 2C, 2D Lighting equipment 4 Ceiling (construction material)
6, 6B, 6C, 6D Instrument body 8 Instrument mounting part 10, 10E, 10F, 10G Light source board 12, 12E, 12F, 12G Circuit board 16 Circuit cover 18 Light source cover 32B First board support part 46 LED (light source)
58 Circuit component 66 Screw (fixing member)
72 Nut (fixing member)
74, 74E, 74F area 76 socket connector (first connector)
76A Socket connector (second connector)
84 pin connector (second connector)
84A pin connector (first connector)
94 2nd board | substrate support part 102 holding | maintenance part

Claims

An instrument body attached to the construction material;
A light source substrate supported by the instrument body;
A light source mounted on the light source substrate;
A first connector mounted on the light source substrate and electrically connected to the light source;
A circuit board disposed so as to overlap a part of the light source board in the thickness direction;
Circuit components mounted on the circuit board and constituting a lighting circuit for lighting the light source,
A second connector mounted on the circuit board and electrically connected to the circuit component;
The said 1st connector and the said 2nd connector are mutually fitted in the area | region where the said light source board and the said circuit board overlapped in the thickness direction.

One of the first connector and the second connector is a pin connector;
The lighting fixture according to claim 1, wherein the other of the first connector and the second connector is a socket connector fitted to the pin connector.

The said lighting fixture is further equipped with the fixing member which fixes the said light source board and the said circuit board mutually in the said area | region where the said light source board and the said circuit board overlapped in the thickness direction. lighting equipment.

The lighting fixture according to claim 3, wherein the fixing member fixes the light source substrate, the circuit board, and the fixture main body to each other in the region where the light source substrate and the circuit board overlap in the thickness direction.

The lighting apparatus further includes a holding unit for holding the circuit board,
The instrument body is
A first substrate support for supporting the light source substrate;
A second board support part for supporting the circuit board via the holding part,
The distance between the surface of the first substrate support portion that contacts the light source substrate and the surface of the holding portion that contacts the circuit substrate is substantially the same as the thickness of the circuit substrate. Lighting fixtures.

The lighting fixture further includes a fixture mounting portion for mounting the fixture body to the construction material,
The circuit board is arranged in a ring shape so as to surround the periphery of the instrument mounting portion,
The light source board is disposed in a ring shape so as to surround the circuit board, and a part of the outer peripheral part of the circuit board and a part of the inner peripheral part of the light source board overlap in the thickness direction. It is arrange | positioned. The lighting fixture of any one of Claims 1-5.

The lighting fixture further includes a fixture mounting portion for mounting the fixture body to the construction material,
A plurality of the light source substrates are provided,
The circuit board is arranged in a ring shape so as to surround the periphery of the instrument mounting portion,
The plurality of light source boards are arranged in a ring shape so as to surround the periphery of the circuit board, and a part of the outer peripheral part of the circuit board and a part of the inner peripheral part of each of the plurality of light source boards The lighting fixture of any one of Claims 1-5 arrange | positioned so that may overlap with the thickness direction.

The lighting apparatus further includes:
A light source cover disposed to cover the light source substrate and having translucency;
An opaque circuit cover disposed to cover the circuit board,
The lighting apparatus according to claim 1, wherein the circuit cover covers the region where the light source substrate and the circuit substrate overlap each other in the thickness direction.