JP2016166939A - Optical communication device, optical communication module, and manufacturing method for optical communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical communication device manufactured at lower cost and keeping the accuracy of attaching an optical fiber.SOLUTION: An optical communication device is surface-mounted on an optical transceiver 500 including a transceiver-side terminal 504 inputting/outputting electric signals, and a grating coupler 503 inputting/outputting optical signals. The optical communication device includes: an electronic circuit chip 110 including a signal terminal to deal with the transceiver-side terminal 504; a guide chip 120 manufactured using a semiconductor substrate and having a penetration hole 121 penetrating the semiconductor substrate in a thickness direction and letting an optical fiber 140 insert therethrough opposite to the grating coupler 503; and a mold resin portion 130 that holds the guide chip 120 oblique to the electronic circuit chip 110 so that the penetration hole 121 is tilted at an angle at which the light is input or output at the grating coupler 503 in the state that the position of the penetration hole 121 relative to the signal terminal is aligned to the position of the grating coupler 503 relative to the transceiver-side terminal 504.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical communication device, an optical communication module, and a method for manufacturing an optical communication device.

  Conventionally, there is a hybrid integrated optical transceiver including a printed circuit board, an optical CMOS die, an electronic CMOS die, a metal wiring, a light source module, an optical I / O, a wire bond, an optical epoxy, and an optical fiber (for example, paragraph of Patent Document 1). 0026 and FIGS. 2A and 2C).

  The photonics die includes a silicon chip having active and passive optical devices such as waveguides, modulators, photodetectors, grating couplers, taps and couplers (see, for example, paragraph 0028 and FIGS. 2A and 2B of Patent Document 1). 2C). The modulated optical signal is transmitted out of the photonics die through a grating coupler located below the optical I / O (see, for example, paragraph 0034 and FIGS. 2A and 2C of Patent Document 1).

JP 2014-035546 A

  By the way, in the conventional optical transceiver, the optical I / O and the optical fiber are attached in an inclined state with respect to the photonics die. This is because when an optical signal transmitted laterally through a waveguide of a photonics die is diffracted upward by a grating coupler, the optical signal does not change direction vertically but changes direction obliquely. This is because the optical I / O and the optical fiber are attached in accordance with the direction in which the signal changes direction.

  Thus, when the optical fiber is mounted in an inclined state with respect to the photonics die, the angle of the optical fiber is accurately managed in order to reduce the loss of the optical signal between the grating coupler and the optical fiber. It is important to.

  However, in order to attach an optical fiber using only optical I / O, high accuracy is required for the shape of optical I / O, the mounting position of optical I / O, and the like. It was.

  Then, it aims at providing the manufacturing method of the optical communication apparatus, the optical communication module, and the optical communication apparatus which reduced the manufacturing cost, maintaining the attachment precision of an optical fiber.

  An optical communication apparatus according to an embodiment of the present invention is an optical communication apparatus that is surface-mounted on an optical transceiver that includes a transceiver-side terminal that inputs or outputs an electrical signal and a grating coupler that inputs or outputs an optical signal. An electronic circuit chip having a signal terminal corresponding to the transceiver side terminal and a semiconductor substrate, and a guide having a through-hole through which the optical fiber facing the grating coupler is inserted through the semiconductor substrate in the thickness direction. A mold resin portion for holding a chip, the electronic circuit chip and the guide chip, wherein the position of the through hole with respect to the signal terminal is matched with the position of the grating coupler with respect to the transceiver side terminal. The through hole is inclined at an angle at which light is input or output by the coupler. Serial and a mold resin portion for holding tilting the guide tip to the electronic circuit chip.

  It is possible to provide an optical communication device, an optical communication module, and a method for manufacturing the optical communication device that reduce the manufacturing cost while maintaining the optical fiber attachment accuracy.

1 is a cross-sectional view illustrating a state where an optical communication device 100 and an optical communication module 200 according to an embodiment are mounted on an optical transceiver 500. FIG. It is a figure which shows the guide chip | tip 320. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure which shows the manufacturing method of the optical communication apparatus 100 of embodiment in steps. It is a figure explaining the self-alignment effect. It is a figure which shows the optical communication apparatus 100 and the optical communication module 200 of the modification of embodiment.

  Embodiments to which the optical communication device, the optical communication module, and the method for manufacturing the optical communication device of the present invention are applied will be described below.

<Embodiment>
FIG. 1 is a cross-sectional view illustrating a state where the optical communication device 100 and the optical communication module 200 according to the embodiment are mounted on an optical transceiver 500. In FIG. 1, an XYZ coordinate system which is an example of an orthogonal coordinate system is defined as illustrated. Hereinafter, for convenience of explanation, a surface on the Z-axis positive direction side is referred to as an upper surface, and a surface on the Z-axis negative direction side is referred to as a lower surface.

  The optical communication device 100 includes an electronic circuit chip 110, a guide chip 120, and a mold resin portion 130. The optical communication module 200 has a configuration in which an optical fiber 140 is added to the optical communication device 100. In FIG. 1, an optical communication module 200 including the optical communication device 100 is flip-chip mounted (surface mounted) on an optical transceiver 500.

  The optical transceiver 500 uses a semiconductor manufacturing technique on a silicon substrate to form elements necessary as an optical transceiver such as an optical modulator 501, a photodetector 502, a grating coupler 503, a pad 504, a waveguide 505, and the like. Is diced into chips.

  The optical transceiver 500 is an example of an optical semiconductor chip. The grating coupler 503 is an element that is formed in the waveguide 505 and whose refractive index changes periodically. The grating coupler 503 diffracts and outputs an optical signal transmitted through the waveguide 505 in an obliquely upward direction. The pad 504 is an example of a transceiver side terminal.

  The electronic circuit chip 110 includes a driver unit 111, a TIA (Trans Impedance Amplifier) unit 112, and bumps 113. The electronic circuit chip 110 is, for example, a rectangular parallelepiped shape obtained by forming an electronic circuit realized by an LSI (Large Scale Integrated circuit) on a semiconductor substrate such as a silicon substrate using a semiconductor manufacturing technique, and dicing. It is a chip.

  The driver unit 111 generates an electrical signal that drives the optical modulator 501 based on the input electrical signal.

  The TIA unit 112 is a transimpedance amplifier that converts a current signal output from the photodetector into a voltage signal.

  The bump 113 is formed on the lower surface of the electronic circuit chip 110 and is connected to the driver unit 111 and the TIA unit 112. The bump 113 is bonded to the pad 504 of the optical transceiver 500 by a reflow process. Thereby, the driver unit 111 and the TIA unit 112 are connected to the optical modulator 501 and the photodetector 502, respectively. The bump 113 is an example of a signal terminal. Further, the terminals of the electronic circuit chip 110 to which the bumps 113 are connected may be taken as an example of signal terminals.

  The bump 113 is a solder bump such as Sn-Ag (tin silver). If such solder bumps are used, a self-alignment effect due to the surface tension of the solder can be obtained by heating and melting during flip chip mounting. Note that the bump 113 may be provided on the optical transceiver 500 side.

  The guide chip 120 is formed by processing a semiconductor substrate, and here, a mode in which a guide chip is manufactured using a silicon substrate will be described.

  The guide chip 120 has a through hole 121 and a convex part 122. The guide chip 120 has an upper surface 120A and a mounting surface 120B that are not parallel to each other.

  The guide chip 120 has a shape in which the upper surface 120A has an angle (not parallel) to the mounting surface 120B by obliquely cutting the upper surface side of a thin rectangular parallelepiped silicon chip. The mounting surface 120B is a surface that extends in a direction perpendicular to the crystal growth direction.

  Further, the guide chip 120 has a convex portion 122 that protrudes downward (in the crystal growth direction of the silicon chip) from one end of the mounting surface 120B. For this reason, the cross-sectional shape of the guide tip 120 is as shown in FIG.

  The through hole 121 penetrates from the upper surface 120A of the guide chip 120 to the mounting surface 120B in parallel with the crystal growth direction of the silicon chip. The guide chip 120 holds the optical fiber 140 in a state where the distal end 140 </ b> A of the optical fiber 140 is inserted into the through hole 121.

  When such a guide chip 120 is arranged on a plane with the mounting surface 120B on the lower side, since the convex portion 122 is present, the convex portion 122 is a fulcrum on the side where the convex portion 122 is present compared to the side where the convex portion 122 is absent. Are lifted and tilted with respect to the Z axis and the XY plane. The guide chip 120 is held by the mold resin portion 130 while being tilted by the convex portion 122. That is, the guide chip 120 is held by the mold resin portion 130 in a state where it is inclined with respect to the electronic circuit chip 110.

  The reason why the guide chip 120 is inclined with respect to the electronic circuit chip 110 is that the waveguide 505 extends toward the electronic circuit chip 110 with respect to the guide chip 120. Therefore, in the case of the configuration shown in FIG. 1, the guide chip 120 only needs to be inclined in the direction in which the waveguide 505 extends with respect to the guide chip 120.

  The position where the optical fiber 140 is inserted into the through hole 121 is set so that the tip of the optical fiber 140 abuts the grating coupler 503 in a state where the optical communication device 100 is mounted on the optical transceiver 500 as shown in FIG. Is done.

  The mold resin portion 130 is a mold resin portion that holds the electronic circuit chip 110 and the guide chip 120. The mold resin part 130 holds the guide chip 120 while being inclined with respect to the electronic circuit chip 110. The upper surface 130A of the mold resin portion 130 is flush with the upper surface 110A of the electronic circuit chip 110 and the upper surface 120A of the guide chip 120. Such a configuration is obtained by scraping and flattening the upper surfaces of the electronic circuit chip 110, the guide chip 120, and the mold resin portion 130 by back grinding.

  The guide chip 120 is held with respect to the electronic circuit chip 110 so that the position of the through hole 121 with respect to the bump 113 of the electronic circuit chip 110 matches the position of the grating coupler 503 with respect to the pad 504 in the state held by the mold resin portion 130. Is set.

  The electronic circuit chip 110 is held by the mold resin portion 130 so that the upper surface 110A is parallel to the upper surface 500A of the optical transceiver 500. On the other hand, the guide chip 120 is held by the mold resin portion 130 in an inclined state with respect to the electronic circuit chip 110 so that the through hole 121 faces the extending direction of the optical fiber 140.

  Although only a part of the waveguide 505 included in the optical transceiver 500 is shown in FIG. 1, the waveguide 505 is located below the grating coupler 503 and extends in the X-axis direction. The waveguide 505 is an optical signal transmission path that connects the grating coupler 503 on the right side in FIG. 1 and an optical element such as the photodetector 502 on the left side in FIG.

  Light transmitted in the X-axis positive direction within the waveguide 505, diffracted by the grating coupler 503, and incident on the optical fiber 140 is not diffracted perpendicularly from the waveguide 505 in the Z-axis positive direction. For example, the light is diffracted in a direction inclined from about 8 degrees to about 12 degrees in the positive direction of the X axis.

  For this reason, the guide chip 120 is tilted according to the angle of the light diffracted by the grating coupler 503 into the optical fiber 140. This is to reduce light loss between the grating coupler 503 and the optical fiber 140.

  If the optical fiber 140 is tilted at the above-described angle with respect to the grating coupler 503, the optical loss is similarly reduced when an optical signal enters the grating coupler 503 from the optical fiber 140. The angle at which the guide tip 120 is inclined in this way is referred to as an inclination angle. As an example, the inclination angle is represented by an angle at which the central axis of the through hole 121 is inclined with respect to the Z axis.

  In the optical communication apparatus 100 according to the embodiment, the guide chip 120 is held on the mold resin portion 130 in a state where the guide chip 120 is inclined with respect to the electronic circuit chip 110 by the angle of diffracted light, and the bump 113 of the electronic circuit chip 110 is padded by reflow processing. By joining to 504, the optical fiber 140 and the grating coupler 503 can be positioned. Further, by positioning, the optical fiber 140 and the grating coupler 503 are coupled with high accuracy.

  The guide chip 120 is made of a semiconductor chip, and is positioned with the electronic circuit chip 110 by the mold resin portion 130. Further, since the bump 113 and the pad 504 are joined by a reflow process, the alignment of the optical fiber 140 and the grating coupler 503 is performed with high accuracy by the self-alignment effect due to the surface tension of the solder.

  In the embodiment, the optical communication apparatus 100 and the optical communication module 200 that can position the optical fiber 140 and the grating coupler 503 with high positioning accuracy and low cost are provided.

  Next, a method for manufacturing the optical communication device 100 and the optical communication module 200 will be described.

  FIG. 2 is a view showing the guide tip 320. The guide chip 320 is used for producing the guide chip 120 shown in FIG.

  The guide chip 320 has a hole portion 321 and a convex portion 322. The guide chip 320 has an upper surface 320A and a mounting surface 320B. Although a method for manufacturing the guide chip 320 will be described later, the guide chip 320 is realized by a silicon chip obtained by dicing a silicon substrate.

  The mounting surface 320B is a surface corresponding to the mounting surface 120B of the guide chip 120 shown in FIG. The hole 321 becomes the through hole 121 shown in FIG. 1 by cutting the upper surface 320A side by back drilling. The convex part 322 is the same as the convex part 122 shown in FIG.

  The guide chip 320 is square in plan view as shown in FIG. 2A, and the length of one side is 500 μm. The depth of the hole 321 is 125 μm, and the diameter is set to 125 μm according to the diameter of the optical fiber 140. Four holes 321 are formed at a pitch of 250 μm. The height of the convex part 322 is 66 μm and the width is 30 μm.

  Note that these values are merely examples, but when the guide tip 320 having such a size is used, the guide tip 120 having an inclination angle of 8 degrees can be manufactured.

  3 to 20 are diagrams illustrating the method of manufacturing the optical communication device 100 according to the embodiment in stages. FIG. 21 is a diagram illustrating the self-alignment effect. FIG. 22 is a diagram illustrating an optical communication device 100 and an optical communication module 200 according to a modification of the embodiment.

  3A, FIG. 4A, FIG. 5A, FIG. 6A, FIG. 7A, FIG. 8A, FIG. 9A, FIG. 10A, and FIG. (A) is a plan view, FIG. 3 (B), FIG. 4 (B), FIG. 5 (B), FIG. 6 (B), FIG. 7 (B), FIG. 8 (B), FIG. FIGS. 10B and 11B are cross-sectional views.

First, for example, a SiO ₂ (silicon dioxide) film 310 is formed to a thickness of 100 nm on a silicon substrate 300 to be a guide chip 320 (see FIG. 2) by, for example, a CVD (Chemical Vapor Deposition) method (FIG. 3). ).

Next, a photoresist is applied on the SiO ₂ film 310, and an exposure process and a development process are performed to form a photoresist pattern 311 (FIG. 4).

Next, the SiO ₂ film 310 is etched by a reactive ion etching (RIE) method using, for example, CF ₄ (tetrafluoromethane) gas, and then the photoresist pattern 311 is removed. An SiO ₂ mask 310A for forming the portion 322 (see FIG. 2) is formed (FIG. 5).

Next, by using the SiO ₂ mask 310A, the silicon substrate 300 is etched by 66 μm by RIE using, for example, HBr (hydrogen bromide) gas, and then the SiO ₂ mask 310A is removed by, for example, wet etching or the like. Protrusions 322 are formed on the surface of the silicon substrate 300 (FIG. 6).

Next, for example, a SiO ₂ film 313 is formed to a thickness of 100 nm on the silicon substrate 300 and the projections 322 by, for example, a CVD method (FIG. 7), a photoresist is applied on the SiO ₂ film 313, exposure processing, By performing development processing, a photoresist pattern 314 is formed (FIG. 8). Holes 314A are formed in the photoresist pattern 314 at positions where holes 321 (see FIG. 2) will be formed later. The hole 314A penetrates the photoresist pattern 314.

Next, for example, the SiO ₂ film 313 is etched by RIE using CF ₄ gas, and then the photoresist pattern 314 is removed, thereby forming a SiO ₂ mask 313A for forming the hole 321 in the guide chip 320. (FIG. 9). In the SiO ₂ mask 313A, a hole 313B is formed at a position where a hole 321 (see FIG. 2) is formed later. The hole 313B penetrates the SiO ₂ mask 313A.

Next, using the SiO ₂ mask 313A, for example, HBr gas is used to etch the silicon substrate 300 by 125 μm by the RIE method, thereby forming a hole 321 from the surface of the silicon substrate 300 (FIG. 10). The hole 321 does not penetrate the silicon substrate 300.

  Here, a mode in which the hole 321 that does not penetrate the silicon substrate 300 is described, but a hole that penetrates the silicon substrate 300 may be formed instead of the hole 321.

Next, the SiO ₂ mask 313A is removed by, for example, wet etching, and the silicon substrate 300 is diced to 500 μm square, whereby the guide chip 320 shown in FIG. 11 is obtained.

  Next, a process of forming the mold resin portion 130 (see FIG. 1) by performing insert molding on the electronic circuit chip 110 and the guide chip 120 (see FIG. 1) will be described.

  First, for example, an adhesive sheet 401 is attached on a support substrate 400 made of stainless steel, for example, and the electronic circuit chip 110 is attached to the adhesive sheet 401 at a predetermined position. At this time, the bump lower electrode 113A of the electronic circuit chip 110 is positioned on the lower surface.

  As the bump lower electrode 113A, for example, an Al (aluminum) bump lower electrode (Under Bump Metal (UBM)) can be used.

Next, for example, using a microdispenser or the like, an amount of photoresist 402 that covers the surface of the guide chip 320 (for example, about 0.03 mm ³ ) is applied to a place where the guide chip 320 is disposed (FIG. 12).

  Next, the guide chip 320 is attached to the adhesive sheet 401 so that the photoresist 402 enters the hole 321 with the mounting surface 320B of the guide chip 320 and the convex part 322 facing downward (FIG. 13).

  Note that the electronic circuit chip 110 and the guide chip 320 are attached to the adhesive sheet 401 by accurately positioning using a flip chip mounting mounter.

  Next, insert molding is performed, the mold resin composition is supplied onto the adhesive sheet 401 so as to cover the upper surface and side surfaces of the electronic circuit chip 110 and the guide chip 320, and the mold resin composition is cured by heat treatment. By this insert molding, a mold resin portion 330 in which the electronic circuit chip 110 and the guide chip 320 are embedded on the support substrate 400 is obtained (FIG. 14). The mold resin part 330 is a resin substrate.

  Next, the mold resin part 330 is removed from the adhesive sheet 401 and the support substrate 400, and the photoresist 402 remaining inside the hole part 321 of the guide chip 320 is removed.

  Then, on the mounting surface side of the electronic circuit chip 110, the guide chip 320, and the mold resin portion 330 held by the mold resin portion 330, for example, Ti / Cu (titanium / Copper) seed layer 113C is formed to a thickness of 100 nm and 250 nm, for example, by sputtering (FIG. 15). The Ti / Cu seed layer 113C is also formed on the Al bump lower electrode 113A.

  Next, a photoresist is applied on the Ti / Cu seed layer 113C, and an exposure process and a development process are performed to form a resist pattern 403 used when forming solder bumps 113B (see FIG. 17) later (FIG. 16). ).

  Next, for example, by electrolytic plating, for example, Ni / Sn—Ag plating layers are formed to have a thickness of 5 μm and 10 μm, respectively, thereby forming solder bumps 113B (FIG. 17). A laminated body of the bump lower electrode 113A, the Ti / Cu seed layer 113C, and the solder bump 113B is the same bump 113 as the bump 113 shown in FIG.

  Next, the resist pattern 403 is peeled off, and the Ti / Cu seed layer 113C (seed layer) exposed on the portions other than the bumps 113 on the mounting surface of the electronic circuit chip 110, the guide chip 320, and the mold resin portion 330 is wetted. It is removed by an etching process.

  Further, heat treatment is then performed to form hemispherical bumps 113 (solder bumps) (FIG. 18).

  Next, the side opposite to the mounting surface of the electronic circuit chip 110, the guide chip 320, and the mold resin portion 330 is cut by back grinding until the hole 321 of the guide chip 320 penetrates (FIG. 19). Thereby, the guide chip 320 and the mold resin part 330 shown in FIG. 18 become the guide chip 120 and the mold resin part 130 shown in FIG. 1, respectively. The hole 321 of the guide chip 320 becomes the through hole 121.

  The substrate including the electronic circuit chip 110, the guide chip 120, and the mold resin portion 130 thus obtained is diced to an appropriate size, so that the electronic circuit chip 110 and the guide chip 120 are integrated by the mold resin portion 130. The substrate type optical communication device 100 held in the substrate is obtained.

  The optical communication device 100 of the embodiment can be manufactured by the manufacturing process as described above.

  As shown in FIG. 20, the substrate-type optical communication device 100 is separately flip-chip bonded to an optical transceiver 500 to align the grating coupler 503 formed in the optical transceiver 500 and the through hole 121 of the guide chip 120. Is completed.

  As described above, the substrate on which the electronic circuit chip 110 and the guide chip 120 are integrated is flip-chip mounted on the optical transceiver 500, and the optical fiber 140 is inserted into the through hole 121 of the guide chip 120 so that the position can be easily increased. The coupling between the optical fiber 140 and the grating coupler 503 can be realized with high accuracy.

  The electronic circuit chip 110 and the guide chip 120 are formed by the mold resin portion 130 in a state where the positions of the bumps 113 and the through holes 121 are accurately determined so that the positions correspond to the positional relationship between the pads 504 and the grating coupler 503. Is retained. Further, the guide chip 120 is held by the mold resin portion 130 in a state in which the electronic circuit chip 110 is inclined at an angle that matches the angle at which light is input / output by the grating coupler 503.

  For this reason, the optical fiber 140 and the grating coupler 503 having a high positioning accuracy as described above can be easily realized by the optical communication device 100 including the electronic circuit chip 110 and the guide chip 120 held by the mold resin portion 130. can do.

  The electronic circuit chip 110 and the guide chip 120 may be aligned using, for example, a flip-chip mounting mounter, and the positional relationship between the electronic circuit chip 110 and the guide chip 120 is held by the mold resin portion 130. The alignment structure can be realized at low cost.

  This means that the cost for realizing the coupling structure can be greatly reduced as compared with the conventional structure in which the optical I / O and the optical fiber are attached to the photonics die in a tilted state.

  Therefore, according to the embodiment, it is possible to provide an optical communication device 100, an optical communication module 200, and a method for manufacturing the optical communication device 100 that reduce the manufacturing cost while maintaining the mounting accuracy of the optical fiber 140.

  Further, in the present embodiment, the pad 504 of the optical transceiver 500 is a non-solder electrode constructed by, for example, a Cu / Ni / Au plating laminate. The non-solder type pad 504 is joined to a bump 113 as a solder bump.

  By using the non-solder type pad 504 in this way, when the bump 113 (solder bump including Sn-Ag solder) formed on the electronic circuit chip 110 side melts and comes into contact, the surface tension of the bump 113 causes the contact. A self-alignment effect attracted to the pad 504 of the optical transceiver 500 is obtained. Due to this self-alignment effect, high positional accuracy of the bump 113 and the pad 504 can be obtained.

  For example, as shown in FIG. 21A, even if the positions of the bump 113 and the pad 504 are misaligned, the self-alignment effect that is attracted to the pad 504 of the optical transceiver 500 by the surface tension of the bump 113 results in FIG. As shown, the positions are aligned.

  In this embodiment, the bump 113 as the solder bump is provided on the electronic circuit chip 110 and the non-solder pad 504 is used for the optical transceiver 500.

  Moreover, even if both are solder-type bumps, the self-alignment effect can be obtained. Therefore, it may be selected as appropriate in consideration of desired alignment accuracy and material restrictions.

  Thus, according to the embodiment, a self-alignment effect that is attracted to the pad 504 of the optical transceiver 500 by the surface tension of the bump 113 as a solder bump can be obtained. For this reason, in addition to the high positioning accuracy by positioning the electronic circuit chip 110 and the guide chip 120 with the mold resin part 130, the high positional accuracy of the bump 113 and the pad 504 by the self-alignment effect is obtained. As a result, a coupling structure between the optical fiber 140 and the grating coupler 503 can be realized with higher positioning accuracy.

  In the present embodiment, the optical fiber 140 has no protective structure such as a ferrule as shown in FIG. 1. However, for example, as shown in FIG. It may be inserted into the through hole 121. In such a case, the optical fiber 140 inserted into the through hole 121 along the Z-axis direction is inserted into the through hole 121 obliquely while buckling. For this reason, it is not necessary to polish the end face of the fiber ferrule 150 obliquely.

  In general, when the end surface of the fiber ferrule is obliquely polished, the cost of the polishing process is generated. However, in this embodiment, it is not necessary to polish the end surface of the fiber ferrule 150 obliquely, so that the cost can be reduced. it can.

  In the above description, the configuration in which the convex portion 122 of the guide chip 120 is disposed on the electronic circuit chip 110 side has been described. This is because the waveguide 505 extends toward the electronic circuit chip 110 with respect to the guide chip 120.

  Therefore, when the waveguide 505 extends from the Y-axis positive direction side of the guide chip 120 to the guide chip 120, the guide chip 120 may be tilted with the convex portion 122 positioned on the Y-axis positive direction side.

  Further, when the waveguide 505 extends from the Y-axis negative direction side of the guide chip 120 to the guide chip 120, the guide chip 120 may be inclined with the convex portion 122 positioned on the Y-axis negative direction side.

  When the waveguide 505 extends from the other direction with respect to the guide chip 120, the guide chip 120 may be inclined with the convex portion 122 positioned on the direction side.

  In the above description, the guide tip 120 is inclined using the convex portion 122. For example, when insert molding is performed, the guide tip 120 is inclined using a spacer or the like instead of the convex portion 122. You may let them. In such a case, the guide tip 120 may not include the convex portion 122.

  In the above description, the optical communication device 100 and the optical communication module 200 functioning as an optical transceiver have been described as examples. However, even when the optical communication device 100 and the optical communication module 200 are an optical transmission device that does not have a reception function or an optical reception device that does not have a transmission function, the above-described structure can be similarly applied.

  Further, the optical communication device 100 and the optical communication module 200 may have a plurality of channels, or may be optical transceivers capable of wavelength division multiplexing communication including a multiplexer, a demultiplexer, and the like. Further, materials such as a substrate, a resin material, and a bump can be appropriately changed.

The optical communication device, the optical communication module, and the method of manufacturing the optical communication device according to the exemplary embodiments of the present invention have been described above. However, the present invention is limited to the specifically disclosed embodiments. Rather, various modifications and changes can be made without departing from the scope of the claims.
Regarding the above embodiment, the following additional notes are disclosed.
(Appendix 1)
An optical communication device that is surface-mounted on an optical transceiver having a transceiver-side terminal that inputs or outputs an electrical signal and a grating coupler that inputs or outputs an optical signal,
An electronic circuit chip having a signal terminal corresponding to the transceiver side terminal;
A guide chip made of a semiconductor substrate, penetrating the semiconductor substrate in the thickness direction, and having a through hole through which an optical fiber facing the grating coupler is inserted;
A mold resin portion for holding the electronic circuit chip and the guide chip, wherein the position of the through hole with respect to the signal terminal is adjusted to the position of the grating coupler with respect to the transceiver side terminal; An optical communication device comprising: a mold resin portion that tilts and holds the guide chip with respect to the electronic circuit chip so that the through hole is inclined at an angle at which the through hole is input or output.
(Appendix 2)
The surface opposite to the mounting surface of the electronic circuit chip, the surface opposite to the mounting surface of the guide chip, and the surface opposite to the mounting surface of the mold resin portion are flush with each other. The optical communication device according to 1.
(Appendix 3)
The guide chip has a protrusion protruding from the mounting surface at an end of the mounting surface of the guide chip,
The guide chip is disposed such that the convex portion is located on a side where a waveguide of the optical transceiver connected to the grating coupler extends.
The optical communication device according to appendix 1 or 2, wherein a height of the convex portion protruding from the mounting surface defines an inclination angle at which the guide chip is held by the mold resin portion.
(Appendix 4)
4. The optical communication device according to claim 1, wherein the electronic circuit chip further includes a solder bump or a pad disposed on the signal terminal. 5.
(Appendix 5)
The optical communication device according to appendix 4, wherein the pad is joined to the transceiver side terminal by solder.
(Appendix 6)
An optical communication device that is surface-mounted on an optical transceiver having a transceiver-side terminal that inputs or outputs an electrical signal and a grating coupler that inputs or outputs an optical signal,
An electronic circuit chip having a signal terminal corresponding to the transceiver side terminal;
A guide chip made of a semiconductor substrate, penetrating the semiconductor substrate in the thickness direction, and having a through hole through which an optical fiber facing the grating coupler is inserted;
A mold resin portion for holding the electronic circuit chip and the guide chip, wherein the position of the through hole with respect to the signal terminal is adjusted to the position of the grating coupler with respect to the transceiver side terminal; A mold resin portion that holds the guide chip tilted with respect to the electronic circuit chip so that the through hole is inclined at an angle at which the input or output is performed;
An optical communication module, comprising: an optical fiber inserted into the through hole.
(Appendix 7)
The optical communication module according to appendix 6, further comprising a ferrule that fixes the optical fiber to the guide chip.
(Appendix 8)
A method of manufacturing an optical communication device mounted on an optical transceiver having a transceiver side terminal for inputting or outputting an electrical signal and a grating coupler for inputting or outputting an optical signal,
Forming a guide chip having the hole by forming a hole having an opening diameter corresponding to the thickness of the optical fiber and a predetermined depth in the semiconductor substrate;
A step of mounting an electronic circuit chip having a signal terminal corresponding to the transceiver side terminal and the guide chip on a support substrate, wherein the position of the hole with respect to the signal terminal is determined by the position of the grating coupler with respect to the transceiver side terminal; The guide chip is tilted with respect to the electronic circuit chip and mounted on the support substrate so that the hole is inclined at an angle at which light is input or output by the grating coupler. Mounting a circuit chip on the support substrate;
Molding the electronic circuit chip and the guide chip mounted on the support substrate, and forming a mold resin portion for holding the electronic circuit chip and the guide chip;
Cutting the opposite side of the mold resin portion, the electronic circuit chip, and the guide chip mounted on the support substrate with a back grind until the hole portion penetrates. Method.
(Appendix 9)
The step of forming the guide chip is a step of further forming a protrusion protruding from the mounting surface at an end of the mounting surface of the guide chip,
In the step of mounting the electronic circuit chip and the guide chip on a support substrate, the convex portion disposed on the side where the waveguide of the optical transceiver connected to the grating coupler extends extends into contact with the support substrate. The method of manufacturing an optical communication device according to appendix 8, wherein the guide tip is tilted by:

DESCRIPTION OF SYMBOLS 100 Optical communication apparatus 110 Electronic circuit chip 111 Driver part 112 TIA part 113 Bump 120 Guide chip 120A Upper surface 120B Mounting surface 121 Through-hole 122 Convex part 130 Mold resin part 140 Optical fiber 200 Optical communication module 320 Guide chip 321 Hole part 322 Convex part 500 Optical Transceiver 501 Optical Modulator 502 Photodetector 503 Grating Coupler 504 Pad 505 Waveguide

Claims (8)

An optical communication device that is surface-mounted on an optical transceiver having a transceiver-side terminal that inputs or outputs an electrical signal and a grating coupler that inputs or outputs an optical signal,
An electronic circuit chip having a signal terminal corresponding to the transceiver side terminal;
A guide chip made of a semiconductor substrate, penetrating the semiconductor substrate in the thickness direction, and having a through hole through which an optical fiber facing the grating coupler is inserted;
A mold resin portion for holding the electronic circuit chip and the guide chip, wherein the position of the through hole with respect to the signal terminal is adjusted to the position of the grating coupler with respect to the transceiver side terminal; An optical communication device comprising: a mold resin portion that tilts and holds the guide chip with respect to the electronic circuit chip so that the through hole is inclined at an angle at which the through hole is input or output.   The surface opposite to the mounting surface of the electronic circuit chip, the surface opposite to the mounting surface of the guide chip, and the surface opposite to the mounting surface of the mold resin portion are flush with each other. Item 4. The optical communication device according to Item 1. The guide chip has a protrusion protruding from the mounting surface at an end of the mounting surface of the guide chip,
The guide chip is disposed such that the convex portion is located on a side where a waveguide of the optical transceiver connected to the grating coupler extends.
3. The optical communication device according to claim 1, wherein a height of the convex portion protruding from the mounting surface defines an inclination angle at which the guide chip is held by the mold resin portion.   4. The optical communication device according to claim 1, wherein the electronic circuit chip further includes a solder bump or a pad disposed on the signal terminal. 5. An optical communication device that is surface-mounted on an optical transceiver having a transceiver-side terminal that inputs or outputs an electrical signal and a grating coupler that inputs or outputs an optical signal,
An electronic circuit chip having a signal terminal corresponding to the transceiver side terminal;
A guide chip made of a semiconductor substrate, penetrating the semiconductor substrate in the thickness direction, and having a through hole through which an optical fiber facing the grating coupler is inserted;
A mold resin portion for holding the electronic circuit chip and the guide chip, wherein the position of the through hole with respect to the signal terminal is adjusted to the position of the grating coupler with respect to the transceiver side terminal; A mold resin portion that holds the guide chip tilted with respect to the electronic circuit chip so that the through hole is inclined at an angle at which the input or output is performed;
An optical communication module, comprising: an optical fiber inserted into the through hole.   The optical communication module according to claim 5, further comprising a ferrule that fixes the optical fiber to the guide chip. A method of manufacturing an optical communication device mounted on an optical transceiver having a transceiver side terminal for inputting or outputting an electrical signal and a grating coupler for inputting or outputting an optical signal,
Forming a guide chip having the hole by forming a hole having an opening diameter corresponding to the thickness of the optical fiber and a predetermined depth in the semiconductor substrate;
A step of mounting an electronic circuit chip having a signal terminal corresponding to the transceiver side terminal and the guide chip on a support substrate, wherein the position of the hole with respect to the signal terminal is determined by the position of the grating coupler with respect to the transceiver side terminal; The guide chip is tilted with respect to the electronic circuit chip and mounted on the support substrate so that the hole is inclined at an angle at which light is input or output by the grating coupler. Mounting a circuit chip on the support substrate;
Molding the electronic circuit chip and the guide chip mounted on the support substrate, and forming a mold resin portion for holding the electronic circuit chip and the guide chip;
Cutting the opposite side of the mold resin part, the electronic circuit chip, and the guide chip mounted on the support substrate with a back grind until the hole part penetrates. Method. The step of forming the guide chip is a step of further forming a protrusion protruding from the mounting surface at an end of the mounting surface of the guide chip,
In the step of mounting the electronic circuit chip and the guide chip on a support substrate, the convex portion disposed on the side where the waveguide of the optical transceiver connected to the grating coupler extends extends into contact with the support substrate. The method of manufacturing an optical communication device according to claim 7, wherein the guide tip is tilted by the step.

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