JP2016166345A - Solvent composition for dissolving synthetic resin - Google Patents
Solvent composition for dissolving synthetic resin Download PDFInfo
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- JP2016166345A JP2016166345A JP2016038902A JP2016038902A JP2016166345A JP 2016166345 A JP2016166345 A JP 2016166345A JP 2016038902 A JP2016038902 A JP 2016038902A JP 2016038902 A JP2016038902 A JP 2016038902A JP 2016166345 A JP2016166345 A JP 2016166345A
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- resin
- solvent composition
- dissolving
- synthetic resin
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- 239000000203 mixture Substances 0.000 title claims abstract description 70
- 239000002904 solvent Substances 0.000 title claims abstract description 67
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 58
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 56
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000007787 solid Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 28
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 24
- 235000011187 glycerol Nutrition 0.000 claims abstract description 20
- 239000003960 organic solvent Substances 0.000 claims abstract description 20
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 19
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 19
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 14
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims abstract description 9
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 9
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 239000003822 epoxy resin Substances 0.000 claims description 39
- 229920000647 polyepoxide Polymers 0.000 claims description 39
- 239000004918 carbon fiber reinforced polymer Substances 0.000 claims description 21
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 18
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 238000004090 dissolution Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000003112 inhibitor Substances 0.000 claims description 9
- 238000001556 precipitation Methods 0.000 claims description 9
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 6
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- 239000001488 sodium phosphate Substances 0.000 claims description 6
- 239000004111 Potassium silicate Substances 0.000 claims description 4
- 239000004115 Sodium Silicate Substances 0.000 claims description 4
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 4
- 235000019353 potassium silicate Nutrition 0.000 claims description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 3
- 229910000397 disodium phosphate Inorganic materials 0.000 claims description 3
- 235000019800 disodium phosphate Nutrition 0.000 claims description 3
- 229910000403 monosodium phosphate Inorganic materials 0.000 claims description 3
- 235000019799 monosodium phosphate Nutrition 0.000 claims description 3
- 235000011118 potassium hydroxide Nutrition 0.000 claims description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 3
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 3
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims description 3
- 235000019801 trisodium phosphate Nutrition 0.000 claims description 3
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 2
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 235000011007 phosphoric acid Nutrition 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 229920000049 Carbon (fiber) Polymers 0.000 description 7
- 239000004917 carbon fiber Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- -1 oligomers Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000011012 sanitization Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 2
- 235000019798 tripotassium phosphate Nutrition 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000011304 carbon pitch Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical group O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 230000002572 peristaltic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001612 separation test Methods 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Detergent Compositions (AREA)
Abstract
Description
本発明は、合成樹脂を含む複合材料又は合成樹脂が付着した固体基材から、合成樹脂を溶解・剥離するための溶剤組成物に関する。 The present invention relates to a solvent composition for dissolving and peeling a synthetic resin from a composite material containing the synthetic resin or a solid substrate to which the synthetic resin is attached.
炭素繊維と合成樹脂の複合材料であるＣＦＲＰは、強くて軽いといった利点から、金属に代わる自動車や航空機の車体軽量化による燃費向上のために用いる新規材料として大いに注目されている。ＣＦＲＰ中の合成樹脂は、一般的にはエポキシ樹脂が採用されている。しかしながら、ＣＦＲＰのリサイクルは、炭素繊維と合成樹脂との分離技術等に高い技術が要求されること等からリサイクル技術が確立されておらず、埋め立て処理されるのが現状である。従って、更なるＣＦＲＰの需要拡大及びＣＦＲＰの環境負荷低減を図るためには、リサイクル技術の確立は必要不可欠な課題である。 CFRP, which is a composite material of carbon fiber and synthetic resin, has attracted much attention as a new material used for improving fuel efficiency by reducing the weight of automobiles and aircrafts instead of metals because of its strength and lightness. In general, an epoxy resin is employed as the synthetic resin in CFRP. However, the recycling of CFRP has not been established because of the high technology required for the separation technology of carbon fiber and synthetic resin, etc., and is currently being landfilled. Therefore, establishment of recycling technology is an indispensable issue in order to further expand the demand for CFRP and reduce the environmental load of CFRP.
エポキシ樹脂とは、高分子内に残存させたエポキシ基で架橋ネットワーク化させることで硬化させることが可能な熱硬化性樹脂の総称である。架橋ネットワーク化前のプレポリマーと硬化剤を混合して、熱硬化処理を行うと製品として完成する。耐水性・耐薬品性・電気絶縁性が高いことから電子回路の基板やＩＣパッケージの封入剤として汎用されるほか接着剤・塗料・積層剤としても利用されている。エポキシ樹脂の多くは２液、即ちプレポリマーと硬化剤を混合し熱処理を加えることで完成するが、このプレポリマーと硬化剤の種類と組み合わせによって物性が多様化するためエポキシ樹脂の溶解は、より困難を極めていた。このため製品に不良が発生した場合、製品からエポキシ樹脂のみを分離して再利用することができなかった。 The epoxy resin is a general term for thermosetting resins that can be cured by forming a crosslinked network with epoxy groups remaining in the polymer. A prepolymer before cross-linking network and a curing agent are mixed and heat-cured to complete the product. Because of its high water resistance, chemical resistance, and electrical insulation, it is widely used as an encapsulant for electronic circuit boards and IC packages, and is also used as an adhesive, paint, and laminating agent. Most of the epoxy resins are completed by mixing two liquids, that is, prepolymer and curing agent, and applying heat treatment, but the physical properties diversify depending on the type and combination of this prepolymer and curing agent. It was extremely difficult. For this reason, when a defect occurs in the product, it is impossible to separate only the epoxy resin from the product and reuse it.
レンズの外周部には、レンズ端面の乱反射光によるゴーストやフレアと言った現象を抑えるために墨が塗られている。かつては実際に和墨が塗られていたが、現在はキャノン化成株式会社製ＧＴシリーズを代表とするレンズ内面反射防止エポキシ系塗料等が多く採用されている。和墨であればある程度水で洗浄することが可能である。しかしながら焼付型塗料の場合、墨除去に非常に困難を要する。この墨を除去することができればレンズ製造工程で発生する不良品の再利用に大いに役立つ。 The outer periphery of the lens is painted with black ink in order to suppress phenomena such as ghost and flare caused by irregularly reflected light on the lens end face. In the past, Japanese ink was actually applied, but at present, a lens inner surface anti-reflective epoxy paint or the like represented by GT series manufactured by Canon Kasei Co., Ltd. is widely used. If Japanese ink is used, it can be washed with water to some extent. However, in the case of a baking type paint, it is very difficult to remove the black ink. If this black ink can be removed, it will greatly contribute to the reuse of defective products generated in the lens manufacturing process.
特許文献１には、プラスチックレンズ成形ガラス型の表面に付着した未反応モノマー、オリゴマー、ポリマー樹脂を洗浄するための洗浄剤組成物が記載されている。未反応モノマー、オリゴマー、ポリマー樹脂とは言い換えると未重合樹脂のことであり、その洗浄は比較的容易である。また、特許文献１に記載の組成物は、水を２０重量％以上含むため洗浄能力が乏しく、さらに沸点が低いため溶剤活性能力を上げるための１００℃以上の加熱試験ができないという問題がある。 Patent Document 1 describes a cleaning composition for cleaning unreacted monomers, oligomers, and polymer resins attached to the surface of a plastic lens-molded glass mold. In other words, unreacted monomers, oligomers, and polymer resins are unpolymerized resins, and their cleaning is relatively easy. Further, the composition described in Patent Document 1 has a problem in that it contains 20% by weight or more of water, so that the cleaning ability is poor, and further, since the boiling point is low, a heating test at 100 ° C. or higher for increasing the solvent activity ability is not possible.
特許文献２には、アルカリ金属化合物、特にアルカリ金属リン酸塩と、有機溶媒、特にモノアルコール類とを含むことを特徴とする炭素材料／酸無水物硬化エポキシ樹脂複合材料の処理液及びそれを用いた分離方法が記載されている。しかし、特許文献２に記載の組成は、触媒であるアルカリ金属リン酸塩がモノアルコール類にほとんど溶解しないため不均一系である。このため有機溶媒と触媒を混合して用時調製する必要があり、取り扱いにくいという問題がある。 Patent Document 2 discloses a carbon material / anhydride cured epoxy resin composite treatment liquid containing an alkali metal compound, particularly an alkali metal phosphate, and an organic solvent, particularly a monoalcohol, and The separation method used is described. However, the composition described in Patent Document 2 is heterogeneous because the alkali metal phosphate as a catalyst hardly dissolves in monoalcohols. For this reason, it is necessary to mix an organic solvent and a catalyst and prepare them at the time of use, and there is a problem that handling is difficult.
このような事情から、溶解・剥離除去が困難であるエポキシ樹脂等の合成樹脂の複合材料又は合成樹脂が付着した固体基材から、合成樹脂を効果的に溶解・剥離するための溶剤組成物が望まれたていた。更に、合成樹脂を加熱溶解・剥離させる際に、１００℃以上の加熱条件下でも容易に適用することができる、高沸点を有し均一系である溶剤組成物が望まれていた。 Under such circumstances, a solvent composition for effectively dissolving and peeling a synthetic resin from a composite material of a synthetic resin such as an epoxy resin that is difficult to dissolve and peel or from a solid substrate to which a synthetic resin is attached. It was desired. Furthermore, there has been a demand for a solvent composition having a high boiling point and a homogeneous system that can be easily applied even under heating conditions of 100 ° C. or higher when the synthetic resin is dissolved and peeled by heating.
本発明者らは、前記の課題を解決すべく鋭意研究を重ねた結果、
（ａ）Ｎ−メチル−２−ピロリドン、ノルマルプロピルブロマイド、γ-ブチロラクトン、モノエタノールアミン、ジエタノールアミン、及びトリエタノールアミンからなる群より選択される有機溶媒３０質量％〜９５質量％、
（ｂ）塩基性無機化合物０．５質量％〜５．０質量％、並びに
（ｃ）グリセリン４．５質量％〜６５質量％からなることを特徴とする、樹脂溶解用溶剤組成物が、特許文献１及び２に開示された組成物と比較して、ＣＦＲＰマトリックスとして使用されるエポキシ樹脂、金属上のエポキシ樹脂やレンズ墨塗りに使用されるエポキシ樹脂の溶解・剥離に対して、優れた溶解・剥離効果を有することを見出し本発明に至った。
As a result of intensive studies to solve the above problems, the present inventors have
(A) 30% by mass to 95% by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine,
(B) A solvent composition for dissolving a resin characterized by comprising 0.5% by mass to 5.0% by mass of a basic inorganic compound and (c) 4.5% by mass to 65% by mass of glycerin. Compared with the compositions disclosed in References 1 and 2, it has excellent dissolution for dissolution and peeling of epoxy resin used as CFRP matrix, epoxy resin on metal and epoxy resin used for lens sanitization -It discovered that it had a peeling effect and came to this invention.
本発明の合成樹脂溶剤組成物は、従来の合成樹脂溶解剤よりも高い溶解・剥離効果を有する。本発明は一般的に洗浄困難とされる重合済みの樹脂を洗浄することができる強力な洗浄用樹脂溶解剤であり、例えば、従来の合成樹脂溶解剤では、溶解・剥離が困難であったＣＦＲＰマトリックスとして使用されるエポキシ樹脂、金属上のエポキシ樹脂やレンズ墨塗りに使用されるエポキシ樹脂の溶解・剥離にも効果があった。本発明の合成樹脂溶解溶剤組成物は、触媒となる無機塩基化合物の溶媒としてグリセリンを採用することにより水溶媒では達成できなかった１００℃以上の加熱試験に耐え、かつ均一系の溶液であるため取り扱いが容易である。本発明の合成樹脂溶剤組成物は、安定な単一かつ均一な液相系であるが、コロイドのような分散系ではない。 The synthetic resin solvent composition of the present invention has a higher dissolution / peeling effect than conventional synthetic resin solubilizers. The present invention is a powerful washing resin solubilizer capable of washing a polymerized resin, which is generally considered difficult to wash. For example, CFRP which has been difficult to dissolve and peel off by conventional synthetic resin solubilizers. It was also effective in dissolving and peeling epoxy resin used as a matrix, epoxy resin on metal, and epoxy resin used for lens sanitization. The synthetic resin-dissolving solvent composition of the present invention can withstand a heating test of 100 ° C. or higher, which cannot be achieved with an aqueous solvent, by adopting glycerin as a solvent for an inorganic base compound serving as a catalyst, and is a homogeneous solution. Easy to handle. The synthetic resin solvent composition of the present invention is a stable single and uniform liquid phase system, but is not a dispersion such as a colloid.
本発明は、
（ａ）Ｎ−メチル−２−ピロリドン、ノルマルプロピルブロマイド、γ-ブチロラクトン、モノエタノールアミン、ジエタノールアミン、及びトリエタノールアミンからなる群より選択される有機溶媒３０質量％〜９５質量％、
（ｂ）塩基性無機化合物０．５質量％〜５．０質量％、並びに
（ｃ）グリセリン４．５質量％〜６５質量％からなることを特徴とする樹脂溶解用溶剤組成物に関する。
The present invention
(A) 30% by mass to 95% by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine,
(B) It is related with the solvent composition for resin melt | dissolution characterized by consisting of 0.5 mass%-5.0 mass% of basic inorganic compounds, and (c) 4.5 mass%-65 mass% of glycerol.
本発明は、
（ａ）Ｎ−メチル−２−ピロリドン、ノルマルプロピルブロマイド、γ-ブチロラクトン、モノエタノールアミン、ジエタノールアミン、及びトリエタノールアミンからなる群より選択される有機溶媒３０質量部〜９５質量部、
（ｂ）塩基性無機化合物０．５質量部〜５．０質量部、並びに
（ｃ）グリセリン４．５質量部〜６５質量部
の合計１００質量部に対して、
（ｄ）炭酸ナトリウム、リン酸水素二カリウム、ケイ酸ナトリウム、及びケイ酸カリウムからなる群より選択される成分析出防止剤０．００１質量部〜５．０質量部、並びに
（ｅ）水を０．１質量部〜２０質量部
からなることを特徴とする樹脂溶解用溶剤組成物に関する。
The present invention
(A) 30 to 95 parts by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine;
(B) 0.5 to 5.0 parts by mass of the basic inorganic compound, and (c) 100 parts by mass in total of 4.5 to 65 parts by mass of glycerin,
(D) 0.001 parts by mass to 5.0 parts by mass of a component precipitation inhibitor selected from the group consisting of sodium carbonate, dipotassium hydrogen phosphate, sodium silicate, and potassium silicate, and (e) water. The present invention relates to a resin-dissolving solvent composition comprising 0.1 to 20 parts by mass.
本発明は、（ａ）の有機溶媒が、Ｎ−メチル−２−ピロリドンである、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the above-mentioned solvent composition for dissolving a resin, wherein the organic solvent (a) is N-methyl-2-pyrrolidone.
本発明は、（ｂ）塩基性無機化合物が、水酸化ナトリウム、水酸化カリウム、水酸化アンモニウム、炭酸水素ナトリウム、リン酸二水素ナトリウム、リン酸ニナトリウム、リン酸三ナトリウム、リン酸二水素カリウム、及びリン酸三カリウムからなる群より選択される、前記の樹脂溶解用溶剤組成物に関する。 In the present invention, (b) the basic inorganic compound is sodium hydroxide, potassium hydroxide, ammonium hydroxide, sodium hydrogen carbonate, sodium dihydrogen phosphate, disodium phosphate, trisodium phosphate, potassium dihydrogen phosphate And the solvent composition for dissolving a resin selected from the group consisting of tripotassium phosphate.
本発明は、（ｂ）の塩基性無機化合物が、水酸化カリウムである、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the solvent composition for dissolving a resin, wherein the basic inorganic compound (b) is potassium hydroxide.
本発明は、（ｄ）の成分析出防止剤が、炭酸ナトリウム又はリン酸水素二カリウムである、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the solvent composition for dissolving a resin, wherein the component precipitation inhibitor (d) is sodium carbonate or dipotassium hydrogen phosphate.
本発明は、樹脂がＣＦＲＰからの樹脂である、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the above-mentioned solvent composition for dissolving a resin, wherein the resin is a resin from CFRP.
本発明は、金属上の樹脂の洗浄用である、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the above-mentioned solvent composition for dissolving a resin, which is used for washing a resin on a metal.
本発明は、レンズ上の墨の除去用である、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the above-mentioned solvent composition for dissolving a resin, which is for removing black ink on a lens.
本発明は、樹脂が、エポキシ樹脂である、前記の樹脂溶解用溶剤組成物に関する。 The present invention relates to the solvent composition for dissolving a resin, wherein the resin is an epoxy resin.
本発明は、合成樹脂を含む複合材料又は合成樹脂が付着した固体基材から、合成樹脂を溶解・剥離するための方法であって、前記の溶剤組成物を複合材料または固体基材と接触させる工程を含むことを特徴とする方法に関する。 The present invention relates to a method for dissolving and peeling a synthetic resin from a composite material containing a synthetic resin or a solid substrate to which a synthetic resin is attached, wherein the solvent composition is brought into contact with the composite material or the solid substrate. The present invention relates to a method comprising the steps.
本発明の溶剤組成物は、（ａ）有機溶媒３０質量％〜９５質量％、好ましくは、４０質量％〜９０質量％、更に好ましくは、５０質量％〜８５質量％含む。 The solvent composition of the present invention contains (a) 30% by mass to 95% by mass of an organic solvent, preferably 40% by mass to 90% by mass, and more preferably 50% by mass to 85% by mass.
本発明に用いる（ａ）有機溶媒としては、Ｎ−メチル−２−ピロリドン、ノルマルプロピルブロマイド、γ-ブチロラクトン、モノエタノールアミン、ジエタノールアミン、及びトリエタノールアミンが挙げられ、Ｎ−メチル−２−ピロリドンが特に好ましい。これらは単独で使用しても、数種類を混合して使用してもよい。 Examples of the organic solvent (a) used in the present invention include N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine, and N-methyl-2-pyrrolidone is Particularly preferred. These may be used alone or in combination of several kinds.
本発明の溶剤組成物は、（ｂ）塩基性無機化合物０．５質量％〜５．０質量％、好ましくは、１．０質量％〜４．５質量％、更に好ましくは、１．５質量％〜４．２質量％を含む。 The solvent composition of the present invention comprises (b) a basic inorganic compound of 0.5% by mass to 5.0% by mass, preferably 1.0% by mass to 4.5% by mass, and more preferably 1.5% by mass. % To 4.2% by mass.
本発明に用いる（ｂ）塩基性無機化合物としては、水酸化ナトリウム、水酸化カリウム、水酸化アンモニウム、炭酸水素ナトリウム、リン酸二水素ナトリウム、リン酸ニナトリウム、リン酸三ナトリウム、リン酸二水素カリウム、及びリン酸三カリウムが挙げられ、水酸化カリウムが特に好ましい。これらは単独で使用しても、数種類を混合して使用してもよい。 As the basic inorganic compound (b) used in the present invention, sodium hydroxide, potassium hydroxide, ammonium hydroxide, sodium hydrogen carbonate, sodium dihydrogen phosphate, disodium phosphate, trisodium phosphate, dihydrogen phosphate Potassium and tripotassium phosphate are mentioned, and potassium hydroxide is particularly preferable. These may be used alone or in combination of several kinds.
本発明の溶剤組成物は、（ｃ）グリセリン４．５質量％〜６５質量％、好ましくは、１０質量％〜６０質量％、更に好ましくは、１５質量％〜５５質量％を含む。グリセリンとして、日本薬局方グリセリンを用いてもよい。 The solvent composition of the present invention contains (c) glycerin 4.5 mass% to 65 mass%, preferably 10 mass% to 60 mass%, and more preferably 15 mass% to 55 mass%. As glycerin, Japanese Pharmacopoeia glycerin may be used.
本発明において、固体基材上付着した合成樹脂には、硬化性樹脂のほかに、硬化性樹脂に配合される添加剤を含む硬化性樹脂が含まれる。 In the present invention, the synthetic resin adhering to the solid substrate includes a curable resin containing an additive blended with the curable resin in addition to the curable resin.
本発明において、合成樹脂としては、エポキシ樹脂が挙げられる。 In the present invention, the synthetic resin includes an epoxy resin.
また、合成樹脂に配合される添加剤としては、合成樹脂に通常用いられている添加剤であれば、特に限定されるものではなく、硬化剤、硬化促進剤、充填剤、乳化剤、発泡剤、安定剤、可塑剤、滑剤、難燃剤、難燃助剤、帯電防止剤、着色剤、帯電性付与剤、褶動性改良剤、耐衝撃性改良剤、及び反応希釈剤が挙げられる。 Moreover, as an additive mix | blended with a synthetic resin, if it is an additive normally used for a synthetic resin, it will not specifically limit, A hardening | curing agent, a hardening accelerator, a filler, an emulsifier, a foaming agent, Stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, charge imparting agents, peristaltic modifiers, impact modifiers, and reaction diluents.
エポキシ樹脂としては、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂、多価アルコールのポリグリシジルエーテル、多塩基酸のポリグリシジルエステル、３，４−エポキシシクロヘキシル−３’，４’−エポキシシクロヘキサンカルボキシレート、ビニルシクロヘキセンジエポキシド、クレゾールノボラック型エポキシ樹脂、及びヒダントイン環を有するエポキシ樹脂が挙げられる。エポキシ樹脂に配合される添加剤としては、硬化剤、硬化促進剤、充填剤、安定剤、可塑剤、滑剤、難燃剤、難燃助剤、帯電防止剤、着色剤、帯電性付与剤、褶動性改良剤、耐
衝撃性改良剤、及び反応希釈剤等の添加剤が挙げられる。
Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, polyglycidyl ether of polyhydric alcohol, polyglycidyl ester of polybasic acid, 3,4-epoxycyclohexyl-3 ′, 4 Examples include '-epoxycyclohexanecarboxylate, vinylcyclohexene diepoxide, cresol novolac type epoxy resin, and epoxy resin having a hydantoin ring. Additives blended in the epoxy resin include curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, charge imparting agents, cocoons Examples thereof include additives such as a mobility improver, an impact resistance improver, and a reaction diluent.
エポキシ樹脂硬化剤としては、エポキシ樹脂の硬化剤として通常使用されているものであればいずれであってもよく、例えばフェノールノボラック、ビフェノール型ノボラック、及びビスフェノールＡ型ノボラック等のノボラック、無水フタル酸、無水ピロメリット酸、及び無水ベンゾフェノンテトラカルボン酸等の酸無水物、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、メタフェニレンジアミン、及びヘキサメチレンテトラミン等のアミン類、並びにポリアミドアミン等のアミド樹脂等が挙げられる。硬化促進剤としては、例えば第三級アミン類又は有機リン化合物が挙げられる。 The epoxy resin curing agent may be any one as long as it is usually used as a curing agent for epoxy resins. For example, novolak such as phenol novolak, biphenol type novolak, and bisphenol A type novolak, phthalic anhydride, Examples thereof include acid anhydrides such as pyromellitic anhydride and benzophenone tetracarboxylic anhydride, amines such as diaminodiphenylmethane, diaminodiphenylsulfone, metaphenylenediamine, and hexamethylenetetramine, and amide resins such as polyamideamine. Examples of the curing accelerator include tertiary amines or organic phosphorus compounds.
本発明において、固体基材上に付着した合成樹脂の硬化物には、合成樹脂の硬化反応が促進することにより硬化する硬化物のほかに、反応希釈剤等の合成樹脂に配合された添加剤が揮発し、粘度が上昇するによって固化した固化物も含まれる。 In the present invention, the cured product of the synthetic resin attached on the solid substrate has an additive blended in the synthetic resin, such as a reaction diluent, in addition to the cured product that is cured by promoting the curing reaction of the synthetic resin. Volatilized and solidified by solidifying as the viscosity increases.
本発明の溶剤組成物を用いて処理される固体基材上として、合成樹脂を取り扱うために用いられる装置、例えば、容器、混合機、成形機、貯蔵タンク、加工機、混合槽、注型機、注入機、コーティング装置及び封入機；並びに、合成樹脂の加工物、例えばエポキシ樹脂の加工物（例えば電子部品、配管部品及び自動車部品など）が挙げられる。 Equipment used for handling synthetic resins as a solid substrate treated with the solvent composition of the present invention, such as containers, mixers, molding machines, storage tanks, processing machines, mixing tanks, casting machines Injection machine, coating device and sealing machine; and synthetic resin workpieces such as epoxy resin workpieces (eg electronic parts, piping parts and automobile parts).
合成樹脂を取り扱うために用いられる装置には、樹脂成分の充填及び混合、硬化成型などの樹脂の加工工程、及び装置の処理を繰り返して使用されるものが含まれる。また、注型器及び容器等は、一般に、原料成分の注入、硬化成型及び処理を繰り返して使用される。 Apparatuses used for handling synthetic resins include those that are used by repeating resin processing steps such as filling and mixing of resin components, curing molding, and apparatus processing. Moreover, a casting machine, a container, etc. are generally used by repeating injection | pouring of a raw material component, hardening molding, and a process.
合成樹脂の加工物、例えばエポキシ樹脂の加工物は、加工物の成型の際に用いられたエポキシ樹脂以外の素材を再利用する目的で用いられる物が含まれる。具体的には、これらエポキシ樹脂の加工物に不良が発生した場合、エポキシ樹脂以外の素材を、エポキシ樹脂の硬化物から分離して再利用する。 The processed product of synthetic resin, for example, the processed product of epoxy resin, includes those used for the purpose of reusing materials other than the epoxy resin used in molding the processed product. Specifically, when a defect occurs in a processed product of these epoxy resins, a material other than the epoxy resin is separated from the cured epoxy resin and reused.
このような素材として、例えば、ステンレス等の各種金属部品がある。すなわち、自動車や家庭電化製品、事務用スチール家具等の塗装材料としてエポキシ樹脂塗料が用いられる。 Examples of such a material include various metal parts such as stainless steel. That is, an epoxy resin paint is used as a coating material for automobiles, home appliances, office steel furniture, and the like.
本発明の溶剤組成物は、合成樹脂を含む複合材料又は合成樹脂が付着した固体基材上から、該合成樹脂又は付着した合成樹脂を、溶解除去又は剥離除去して、固体基材上を処理するために用いられる。 The solvent composition of the present invention treats the solid substrate by dissolving or removing the synthetic resin or the attached synthetic resin from the composite material containing the synthetic resin or the solid substrate to which the synthetic resin is attached. Used to do.
本発明の溶剤組成物は、
（ａ）Ｎ−メチル−２−ピロリドン、ノルマルプロピルブロマイド、γ-ブチロラクトン、モノエタノールアミン、ジエタノールアミン、及びトリエタノールアミンからなる群より選択される有機溶媒３０質量％〜９５質量％、
（ｂ）塩基性無機化合物０．５質量％〜５．０質量％、並びに
（ｃ）グリセリン４．５質量％〜６５質量％からなり、より好ましくは、
（ａ）有機溶媒４０質量％〜９０質量％、
（ｂ）塩基性無機化合物１．０質量％〜４．５質量％、並びに
（ｃ）グリセリン１０質量％〜６０質量％、
からなり、更に好ましくは、
（ａ）有機溶媒５０質量％〜８５質量％、
（ｂ）塩基性無機化合物１．５質量％〜４．２質量％、並びに
（ｃ）グリセリン１５質量％〜５５質量％からなることを特徴とする。
このような範囲であれば、合成樹脂に対する溶解・剥離力も高く、なおかつ、溶剤組成物は均一であり、しいては、固体基材上に対する浸透力が高くなり、処理時間が短くなる点で良好である。
The solvent composition of the present invention is
(A) 30% by mass to 95% by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine,
(B) a basic inorganic compound consisting of 0.5 mass% to 5.0 mass%, and (c) glycerin 4.5 mass% to 65 mass%, more preferably,
(A) 40% by mass to 90% by mass of an organic solvent,
(B) 1.0% to 4.5% by weight of a basic inorganic compound, and (c) 10% to 60% by weight of glycerin,
More preferably,
(A) 50% by mass to 85% by mass of an organic solvent,
(B) It consists of 1.5 mass%-4.2 mass% of basic inorganic compounds, and (c) 15 mass%-55 mass% of glycerol.
Within such a range, the dissolution / peeling power with respect to the synthetic resin is high, and the solvent composition is uniform, which is good in that the penetrating power on the solid substrate is high and the processing time is shortened. It is.
本発明の溶剤組成物は、
（ａ）Ｎ−メチル−２−ピロリドン、ノルマルプロピルブロマイド、γ-ブチロラクトン、モノエタノールアミン、ジエタノールアミン、及びトリエタノールアミンからなる群より選択される有機溶媒３０質量部〜９５質量部、
（ｂ）塩基性無機化合物０．５質量部〜５．０質量部、並びに
（ｃ）グリセリン４．５質量部〜６５質量部
の合計１００質量部に対して、
（ｄ）炭酸ナトリウム、リン酸水素二カリウム、ケイ酸ナトリウム、及びケイ酸カリウムからなる群より選択される成分析出防止剤０．００１質量部〜５．０質量部、並びに
（ｅ）水を０．１質量部〜２０質量部、好ましくは、
（ｄ）成分析出防止剤を０．００５質量部〜４．０質量部、並びに
（ｅ）水を０．５質量部〜１０質量部を含み、更に好ましくは、
（ｄ）成分析出防止剤を０．００７質量部〜３．０質量部、並びに
（ｅ）水を０．９質量部〜５．０質量部からなることを特徴とする。
このような範囲であれば、合成樹脂に対する溶解・剥離力も高く、なおかつ、溶剤組成物は均一であり、しいては、固体基材上に対する浸透力が高くなり、処理時間が短くなる点で良好である。
The solvent composition of the present invention is
(A) 30 to 95 parts by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine;
(B) 0.5 to 5.0 parts by mass of the basic inorganic compound, and (c) 100 parts by mass in total of 4.5 to 65 parts by mass of glycerin,
(D) 0.001 parts by mass to 5.0 parts by mass of a component precipitation inhibitor selected from the group consisting of sodium carbonate, dipotassium hydrogen phosphate, sodium silicate, and potassium silicate, and (e) water. 0.1 to 20 parts by weight, preferably
(D) 0.005 parts by mass to 4.0 parts by mass of the component precipitation inhibitor, and (e) 0.5 parts by mass to 10 parts by mass of water, more preferably
(D) 0.007 to 3.0 parts by mass of component precipitation inhibitor, and (e) 0.9 to 5.0 parts by mass of water.
Within such a range, the dissolution / peeling power with respect to the synthetic resin is high, and the solvent composition is uniform, which is good in that the penetrating power on the solid substrate is high and the processing time is shortened. It is.
本発明の樹脂溶剤組成物は、合成樹脂を含む複合材料、例えばＣＦＲＰからのエポキシ樹脂を溶解・剥離に用いることができる。すなわち、エポキシバインダーＣＦＲＰから、エポキシ樹脂と炭素繊維を乖離するための乖離剤として用いることができる。ＣＦＲＰからの樹脂を溶解・剥離に用いる場合には、好ましくは、
（ａ）有機溶媒５０質量％〜８５質量％、
（ｂ）塩基性無機化合物１．５質量％〜４．２質量％、及び
（ｃ）グリセリン１５質量％〜５５質量％からなる溶剤組成物；又は
（ａ）有機溶媒５０質量部〜８５質量部、
（ｂ）塩基性無機化合物１．５質量部〜４．２質量部、及び
（ｃ）グリセリン１５質量部〜５５質量部
の合計１００質量部に対して、
（ｄ）炭酸ナトリウム、リン酸水素二カリウム、ケイ酸ナトリウム、及びケイ酸カリウムからなる群より選択される成分析出防止剤０．００７質量部〜３．０質量部、及び
（ｅ）水を０．９質量部〜５．０質量部からなる溶剤組成物である。
In the resin solvent composition of the present invention, a composite material containing a synthetic resin, for example, an epoxy resin from CFRP can be used for dissolution and peeling. That is, it can be used as a separating agent for separating the epoxy resin and the carbon fiber from the epoxy binder CFRP. When using resin from CFRP for dissolution / peeling,
(A) 50% by mass to 85% by mass of an organic solvent,
(B) a basic inorganic compound of 1.5% by mass to 4.2% by mass, and (c) a solvent composition comprising 15% by mass to 55% by mass of glycerin; or (a) 50% by mass to 85% by mass of an organic solvent. ,
(B) For a total of 100 parts by mass of 1.5 to 4.2 parts by mass of the basic inorganic compound and (c) 15 to 55 parts by mass of glycerin,
(D) 0.007 parts by mass to 3.0 parts by mass of a component precipitation inhibitor selected from the group consisting of sodium carbonate, dipotassium hydrogen phosphate, sodium silicate, and potassium silicate; and (e) water. It is a solvent composition which consists of 0.9 mass part-5.0 mass parts.
ＣＦＲＰの炭素繊維としては、ＰＡＮ系炭素繊維、ピッチ系炭素繊維が挙げられる。 Examples of CFRP carbon fibers include PAN-based carbon fibers and pitch-based carbon fibers.
ＣＦＲＰからの樹脂としては、エポキシ樹脂が挙げられる。 An example of a resin from CFRP is an epoxy resin.
本発明の溶剤組成物は、レンズ上の墨の除去に用いることができる。すなわち、墨塗りのレンズから、墨とレンズを乖離するためのするための乖離剤として用いることができる。レンズ上の墨の除去に用いる場合には、好ましくは、
（ａ）有機溶媒５０質量％〜８５質量％、
（ｂ）塩基性無機化合物１．５質量％〜４．２質量％、
（ｃ）グリセリン１５質量％〜５５質量％からなる溶剤組成物である。
The solvent composition of the present invention can be used for removing black on the lens. That is, it can be used as a detaching agent for separating the ink and the lens from the sanitized lens. When used for removing black on the lens, preferably,
(A) 50% by mass to 85% by mass of an organic solvent,
(B) 1.5% by mass to 4.2% by mass of a basic inorganic compound,
(C) A solvent composition composed of 15% by mass to 55% by mass of glycerin.
レンズとしては、ガラスレンズの複合レンズが挙げられる。好ましくはタブレット型、トリプレット型レンズが挙げられる。 As the lens, a compound lens of a glass lens can be mentioned. A tablet type and a triplet type lens are preferable.
レンズ上の塗料としては、エポキシ樹脂系の塗料が挙げられる。 Examples of the paint on the lens include an epoxy resin-based paint.
本発明の溶剤組成物は、原料成分である有機溶媒、グリセリン、及び無機塩基化合物を混合することにより製造することができる。本発明の溶剤組成物は、更に、成分析出防止剤及び水を加えてもよい。本発明の溶剤組成物に用いる原料成分は、市販のものを用いることができる。 The solvent composition of this invention can be manufactured by mixing the organic solvent which is a raw material component, glycerol, and an inorganic base compound. The solvent composition of the present invention may further contain a component precipitation inhibitor and water. A commercially available thing can be used for the raw material component used for the solvent composition of this invention.
本発明において、合成樹脂を含む複合材料又は合成樹脂が付着した固体基材を処理する方法は、本発明の溶剤組成物を、前記固体基材と接触させる工程を含む。本発明において、本発明の溶剤組成物を前記固体基材に接触させる工程において、前記固体基材上に付着した合成樹脂は、前記固体基材から溶解除去されるか、又は剥離除去される。本発明において、合成樹脂が付着した前記固体基材上を処理するための方法は、本発明の溶剤組成物を前記固体基材に接触させる工程において、合成樹脂が前記固体基材上から剥離することが好ましい。 In the present invention, a method for treating a composite material containing a synthetic resin or a solid substrate to which a synthetic resin is attached includes a step of bringing the solvent composition of the present invention into contact with the solid substrate. In the present invention, in the step of bringing the solvent composition of the present invention into contact with the solid substrate, the synthetic resin adhering to the solid substrate is dissolved and removed from the solid substrate or peeled off. In the present invention, the method for treating the solid substrate to which the synthetic resin is attached is the method in which the synthetic resin peels from the solid substrate in the step of bringing the solvent composition of the present invention into contact with the solid substrate. It is preferable.
本発明の溶剤組成物と、前記合成樹脂が付着した固体基材とを接触させるための方法としては、特に制限はなく、本発明の溶剤組成物への前記固体基材の浸漬、溶剤組成物を含浸したウエスまたはスポンジによる前記固体基材上の拭き取りが好ましく、浸漬による方法がより好ましい。 The method for bringing the solvent composition of the present invention into contact with the solid substrate to which the synthetic resin is attached is not particularly limited, and the solid composition is immersed in the solvent composition of the present invention. Wiping on the solid substrate with a cloth or sponge impregnated with is preferable, and a method by immersion is more preferable.
本発明において、本発明の溶剤組成物及び固体基材の接触時間に相当する処理時間は、固体基材に付着した合成樹脂を溶解・剥離除去できる時間であれば特に制限されない。 In the present invention, the treatment time corresponding to the contact time between the solvent composition of the present invention and the solid substrate is not particularly limited as long as the synthetic resin adhering to the solid substrate can be dissolved and peeled off.
本発明において処理温度は、２０〜１９０℃、好ましくは２０〜１２０℃である。このような温度において、より高温で処理することにより溶解・剥離効果を上昇させることができる。 In this invention, process temperature is 20-190 degreeC, Preferably it is 20-120 degreeC. At such a temperature, the dissolution / peeling effect can be increased by processing at a higher temperature.
以下、本発明を実施例及び比較例により更に詳細に説明するが、本発明はこれら実施例により限定されるものではない。 EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited by these Examples.
実施例１〜３及び比較例１〜３ Examples 1-3 and Comparative Examples 1-3
実施例１〜３及び比較例１〜３の溶剤組成物を、表１で示される組成で各成分を混合することにより調製した。グリセリンとして、日本薬局方グリセリンを用いた。 The solvent compositions of Examples 1 to 3 and Comparative Examples 1 to 3 were prepared by mixing each component with the composition shown in Table 1. As glycerin, Japanese Pharmacopoeia glycerin was used.
試験例１ エポキシバインダーＣＦＲＰの炭素繊維乖離試験 Test Example 1 Carbon fiber separation test of epoxy binder CFRP
ＰＡＮ系ＣＦＲＰ織物タイプの板材（東邦テナックス株式会社：型番ＱＦＵ１３５−７Ｕ６１Ａ）を、１５ｍｍ角にカットした（ＣＦＲＰ試験片）。ガラスビーカー（１００ｍｌ）に、表１の実施例１〜３及び比較例１〜３の溶剤組成物を４０ｍｌ及びＣＦＲＰ試験片を入れた。そして、ガラスビーカーを実験用小型ホットプレート（製造元：アズワン株式会社、名称：ECONOMY HOT PLATE，型番：ＥＨＰ-１７０）上において、１２０℃で８時間加熱放置した。その後、ＣＦＲＰ試験片を取り出してエポキシ樹脂が剥離除去できているかを目視により判定した。 A PAN-based CFRP fabric type plate (Toho Tenax Co., Ltd .: model number QFU135-7U61A) was cut into 15 mm squares (CFRP test piece). In a glass beaker (100 ml), 40 ml of the solvent compositions of Examples 1 to 3 and Comparative Examples 1 to 3 in Table 1 and a CFRP test piece were placed. Then, the glass beaker was left to stand at 120 ° C. for 8 hours on a small experimental hot plate (manufacturer: ASONE CORPORATION, name: ECONOMY HOT PLATE, model number: EHP-170). Then, the CFRP test piece was taken out and it was visually determined whether the epoxy resin could be peeled and removed.
試験例１の結果を表１に示す。 The results of Test Example 1 are shown in Table 1.
○：ＣＦＲＰ試験片が、積層構造を乖離させ、さらに織物小片にまで乖離した。
×：ＣＦＲＰ試験片が、積層構造までしか乖離しなかった、または変化が無かった。
○: The CFRP test piece dissociated the laminated structure, and further dissociated into a woven fabric piece.
X: The CFRP test piece was separated only up to the laminated structure, or there was no change.
本発明の好ましい含有量の溶剤組成物である実施例１〜３の溶剤組成物を用いた場合は、エポキシバインダーＣＦＰＲからのエポキシ樹脂、すなわち合成樹脂を含む複合材料からの合成樹脂に対して優れた溶解・剥離効果を示した。 When the solvent composition of Examples 1 to 3 which is a solvent composition having a preferable content of the present invention is used, it is superior to an epoxy resin from an epoxy binder CFPR, that is, a synthetic resin from a composite material including a synthetic resin. It showed a dissolution / peeling effect.
実施例１、４、５及び比較例４〜７ Examples 1, 4, 5 and Comparative Examples 4-7
実施例１、４、５及び比較例４〜７の溶剤組成物を、表２で示される組成で各成分を混合することにより調製した。 The solvent compositions of Examples 1, 4, 5 and Comparative Examples 4-7 were prepared by mixing each component with the composition shown in Table 2.
試験例２ レンズ墨塗りの墨除去試験 Test Example 2 Black ink removal test for lens ink
（２−１）墨塗りレンズの作製
エポキシ樹脂組成物として、キャノン化成社製のＧＴ−７を用いた。レンズはキャノン社製一眼レフレンズを用いた。
(2-1) Preparation of blackened lens GT-7 made by Canon Kasei Co., Ltd. was used as the epoxy resin composition. The lens used was a Canon single lens reflex lens.
（２−２）墨塗りレンズの処理
ガラスビーカー（１００ｍｌ）に、表２の実施例１、４、５及び比較例４〜７の溶剤組成物４０ｍｌ及びキャノン化成社製ＧＴ-７が付着した墨塗りレンズを入れた。そして、ガラスビーカーを実験用小型ホットプレート（メーカー名：アズワン株式会社、型番ＥＨＰ-１７０）上において、８０℃で１時間加熱放置した。その後、レンズを取り出してエポキシ樹脂が剥離除去できているかを目視により判定した。
(2-2) Blacked lens treatment Black ink in which 40 ml of the solvent composition of Examples 1, 4, 5 and Comparative Examples 4 to 7 in Table 2 and GT-7 manufactured by Canon Kasei Co., Ltd. adhered to a glass beaker (100 ml). I put a painted lens. Then, the glass beaker was left to stand at 80 ° C. for 1 hour on a small experimental hot plate (manufacturer: ASONE CORPORATION, model number EHP-170). Thereafter, the lens was taken out, and it was visually determined whether the epoxy resin was peeled and removed.
試験例２の結果を表２に示す。 The results of Test Example 2 are shown in Table 2.
○：墨は完全除去できた。
△：墨は一部除去できたが完全除去に至らなかった。
×：墨はまったく除去できなかった。
○: The ink was completely removed.
Δ: Some of the ink was removed but not completely removed.
X: The ink could not be removed at all.
本発明の好ましい含有量の溶剤組成物である実施例１〜３の溶剤組成物を用いた場合は、レンズ上の墨、すなわち、固体基材上の合成樹脂に対して優れた溶解・剥離効果を示した。 When the solvent composition of Examples 1 to 3 which is a solvent composition having a preferable content of the present invention is used, it has an excellent dissolution / peeling effect with respect to black on the lens, that is, synthetic resin on the solid substrate showed that.
本発明は、広範囲な合成樹脂を含む複合材料又は合成樹脂が付着した固体基材から、合成樹脂を良好に溶解・剥離することができる。 The present invention can satisfactorily dissolve and peel a synthetic resin from a composite material containing a wide range of synthetic resins or a solid substrate to which a synthetic resin is attached.
Claims (11)
（ｂ）塩基性無機化合物０．５質量％〜５．０質量％、並びに
（ｃ）グリセリン４．５質量％〜６５質量％からなることを特徴とする樹脂溶解用溶剤組成物。 (A) 30% by mass to 95% by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine,
(B) 0.5% by mass to 5.0% by mass of a basic inorganic compound, and (c) 4.5% by mass to 65% by mass of glycerin.
（ｂ）塩基性無機化合物０．５質量部〜５．０質量部、並びに
（ｃ）グリセリン４．５質量部〜６５質量部
の合計１００質量部に対して、
（ｄ）炭酸ナトリウム、リン酸水素二カリウム、ケイ酸ナトリウム、及びケイ酸カリウムからなる群より選択される成分析出防止剤０．００１質量部〜５．０質量部、並びに
（ｅ）水を０．１質量部〜２０質量部
からなることを特徴とする樹脂溶解用溶剤組成物。 (A) 30 to 95 parts by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine;
(B) 0.5 to 5.0 parts by mass of the basic inorganic compound, and (c) 100 parts by mass in total of 4.5 to 65 parts by mass of glycerin,
(D) 0.001 parts by mass to 5.0 parts by mass of a component precipitation inhibitor selected from the group consisting of sodium carbonate, dipotassium hydrogen phosphate, sodium silicate, and potassium silicate, and (e) water. A solvent composition for dissolving a resin, comprising 0.1 to 20 parts by mass.
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| WO2021235488A1 (en) * | 2020-05-20 | 2021-11-25 | 藤森工業株式会社 | Separation and recovery method and separation and recovery apparatus |
| JP7565708B2 (en) | 2020-05-20 | 2024-10-11 | 藤森工業株式会社 | Separation and recovery method and separation and recovery device |
| CN118421413A (en) * | 2024-04-25 | 2024-08-02 | 达高工业技术研究院(广州)有限公司 | Deburring composition and preparation method and application thereof |
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