JP2016165761A - Processing method for wire-saw, and wire-saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire-saw processing method which improves cutting accuracy by efficiently adjusting bending (tensile force) of a wire, and a wire-saw.SOLUTION: In accordance with the wire-saw processing method, a work piece is pressed by a plurality of parallel wires and while moving a wire in a linear direction of the wire, a slurry is supplied between the wire and the work piece, thereby performing notching processing on the work piece. The wire-saw processing method is characterized in that, the tensile force is measured for each of the wires or for the unit of multiple wires before and behind a pressing position of the wire and the work piece and the tensile force of the wires is adjusted based on adjustment data that are calculated from measurement data of the measured tensile force.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wire saw processing method and a wire saw.

  Conventionally, for example, a processing method using a wire saw as a processing method for cutting a brittle material such as a quartz crystal or a semiconductor ingot and forming a wafer, and a wire saw as a processing apparatus are known. In this processing method and processing apparatus, a processing liquid (slurry) containing abrasive grains between a workpiece and a wire while pressing the workpiece against a plurality of wire rows parallel at a constant pitch and feeding the wire in a linear direction. A plurality of wafers having a constant thickness are simultaneously formed. In this processing method and processing apparatus, a long processing time (for example, 6 to 10 hours) is required. During this time, the cutting conditions such as the thickness of the wafer and the cutting shape are maintained by keeping the cutting conditions such as the wire tension constant. Can be obtained.

  However, it is not easy to keep this cutting condition constant. Especially, when the wire tension varies, the wire bends, which causes the wire to vibrate or sway, thereby reducing the thickness of the cut wafer. In some cases, the wafers may vary or the cutting direction of the wafer may vary.

  In order to deal with such a problem, Patent Document 1 discloses a sensor roller that detects the tension of the wire and the amount of bending of the wire based on the tension detected by the sensor roller, and the amount of bending of the wire based on the detected value. A wire saw provided with a deflection adjusting means for adjusting the angle is disclosed. Specifically, in this apparatus, the workpiece is pressed against several tens or more of wire rows wound around a plurality of multi-groove rollers at a constant pitch. And between the multi-groove roller on one side (wire feeding side) and the workpiece, and between the multi-groove roller on the other side (wire winding side) and the workpiece, the wire row is brought into contact with the wire row. A sensor roller for detecting tension and a deflection adjusting means for adjusting the amount of deflection of the wire row by contacting the wire row are provided.

JP 2001-328057 A

  However, in the wire saw (processing apparatus) and the wire saw processing method of Patent Document 1 described above, a sensor roller that detects the tension of one wire is applied to several tens or more wire rows wound at a constant pitch. The bending adjustment means for adjusting the bending amount of the wire row is in contact with the wire row based on the detection result. Therefore, tension detection and tension adjustment are performed on the entire wire array composed of tens of wires or more, so the tension variation of each wire or the difference in the position wound around the multi-groove roller It was impossible to make adjustments for variations in the tension of the wires, and it was impossible to adjust the tensions of several tens or more wires more evenly.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A wire saw processing method according to this application example is such that a workpiece is pressed against a plurality of parallel wires, and the wire and the workpiece are processed while moving the wire in the line direction of the wire. A wire saw processing method for performing a cutting process on the workpiece by supplying a slurry between the wire and the wire in the wire direction of the pressing position of the wire and the workpiece, Measure the tension of each of the wires or the tension of each of the wires, obtain measurement data from the measured data, and determine the tension of the wire based on the adjustment data obtained from the measurement data. It is characterized by adjusting.

According to this application example, the tension of the wire is measured one by one or a plurality of wires before and after the pressing position between the wire and the workpiece in the wire direction. Then, measurement data is obtained from each measured data, and the wire tension is adjusted for each corresponding wire or a plurality of corresponding wires based on the adjustment data obtained from the measurement data. Can do. Therefore, unlike the conventional adjustment of the entire wire row, the deflection corresponding to one wire or a plurality of wires with respect to the variation in the amount of bending (tension) of the wire caused by the difference in the position where the wire is arranged, etc. The amount (tension) can be adjusted. As a result, variations in the thickness of the cut wafer and variations in the cutting direction (cutting angle) of the wafer can be reduced, and the cutting accuracy can be improved.
In addition, the cutting of the workpiece in the present specification refers to cutting by cutting from the front surface to the back surface of the workpiece, or a portion remaining after cutting to the middle of the workpiece. It includes cutting that is done by removing it.

  Application Example 2 In the wire saw processing method according to the application example described above, the adjustment data is obtained by averaging the data for each of the wires or the data for a plurality of the wires. It is preferably obtained based on the measurement data.

  According to this application example, the adjustment data used for adjusting the deflection amount (tension) of the wire is obtained by averaging a plurality of data to obtain measurement data, and adjusting the deflection amount (tension) for each corresponding wire. Can do. Therefore, the number of adjustment points of the deflection amount (tension) can be reduced without reducing the adjustment accuracy of the deflection amount (tension), and the deflection amount (tension) can be adjusted more efficiently.

  [Application Example 3] In the wire saw processing method according to the application example described above, the measurement data measured before and after the pressing position, from the measurement data measured on the wire feeding side from the pressing position. Based on the obtained adjustment data, the tension of the wire on the wire delivery side is adjusted, and the adjustment data obtained from the measurement data measured on the winding side of the wire from the pressing position. Based on the above, it is preferable that the tension of the wire on the winding side of the wire is adjusted.

  According to this application example, the wire positioned on the wire feeding side with respect to the pressing position where the wire is pressed can be adjusted in the amount of deflection (tension) by the adjustment data on the wire feeding side, and the pressing position On the other hand, the wire located on the winding side of the wire can be adjusted in the amount of deflection (tension) by the adjustment data on the winding side of the wire. As described above, the amount of bending (tension) of the wire can be adjusted on the basis of the corresponding adjustment data before and after the pressing position where the wire is pressed (wire feeding side and winding side). For this reason, adjustments of different bending amounts (tensions) on the wire feeding side and the winding side can be respectively performed. Thereby, the amount of bending (tension) of the wire can be adjusted more precisely.

  [Application Example 4] In the wire saw processing method according to the application example described above, the tension of the wire is adjusted by at least a pair of rollers that are in contact with the wire and are provided so as to sandwich the workpiece. Is preferably carried out by

  According to this application example, the amount of bending of the wire can be easily adjusted by bringing at least a pair of advanceable / retractable rollers provided across the workpiece into contact with the wire with an adjustment amount based on the adjustment data. can do.

  Application Example 5 In the wire saw processing method according to the application example described above, the tension of the wire is adjusted by the roller provided for each of the wires one by one or for each of the plurality of wires. Preferably it is done.

  According to this application example, since the amount of bending (tension) can be adjusted with the corresponding roller for each wire unit whose tension is measured, the amount of bending (tension) of the wire can be adjusted more precisely. it can.

  Application Example 6 In the wire saw processing method according to the application example described above, when the workpiece is tilted at a predetermined angle with respect to the wire direction of the wire, the roller is attached to the workpiece. It is preferable that the wire is inclined with respect to the wire direction at an angle that matches the inclination of the workpiece.

  According to this application example, since the distance between the workpiece and the roller is substantially the same, it is possible to reduce the difference in the amount of bending due to the different lengths of the wires. Thereby, the number of measurement of the tension | tensile_strength of a wire and the number of rollers can be reduced, and it can make it easy to adjust the bending amount of a wire.

  [Application Example 7] The wire saw according to this application example has a plurality of wires provided in parallel to each other so as to be pressed against the workpiece, a tension for each of the wires, or a plurality of the wires. Based on adjustment data obtained from the tension measurement unit provided before and after the pressing position of the wire and the workpiece and the measurement data measured by the tension measurement unit so as to measure each tension And a tension adjusting section for adjusting the tension of the wire.

  According to this application example, the adjustment data is obtained from the measurement data of the tension of each wire measured by the tension measuring unit provided before and after the pressing position between the wire and the workpiece, or each of the plurality of wires. It is done. Based on the adjustment data described above for each corresponding wire or a plurality of corresponding wires by the tension measuring unit provided before and after the pressing position between the wire and the workpiece. The amount of bending (tension) of the wire can be adjusted. In this way, the amount of bending (tension) corresponding to one wire or a plurality of wires is adjusted with respect to the variation in the amount of bending (tension) of the wire caused by the difference in the position of the wire. Can do. As a result, variations in the thickness of the cut wafer and variations in the cutting direction (cutting angle) of the wafer can be reduced, and the cutting accuracy can be improved.

  Application Example 8 In the wire saw according to the application example described above, the tension adjustment unit includes at least a pair of rollers that are in contact with the wire and that are provided to be able to move back and forth with the workpiece interposed therebetween. Is preferred.

  According to this application example, the amount of bending of the wire can be easily adjusted by bringing at least a pair of advanceable / retractable rollers provided across the workpiece into contact with the wire with an adjustment amount based on the adjustment data. can do.

  Application Example 9 In the wire saw according to the application example described above, the roller is provided for each of the wires whose tension is measured, or for each of the plurality of wires whose tension is measured. It is preferable.

  According to this application example, the deflection amount (tension) can be adjusted with the corresponding roller for each wire unit whose tension is measured. Thereby, the amount of bending (tension) of the wire can be adjusted more precisely.

  Application Example 10 In the wire saw according to the application example described above, when the workpiece is disposed at a predetermined angle with respect to the linear direction of the wire, the roller is inclined by the workpiece. It is preferable that the wire is inclined with respect to the linear direction of the wire at an angle adapted to the above.

  According to this application example, the distance between the workpiece and the roller should be substantially the same even when the workpiece is disposed at a predetermined angle with respect to the wire linear direction. Can do. Thereby, the difference in the amount of bending due to the different lengths of the wires can be reduced, and the number of wire tensions measured and the number of rollers can be reduced. Therefore, the adjustment of the amount of bending of the wire can be realized with a simple configuration.

The schematic structure of the wire saw which concerns on Embodiment 1 of this invention is shown, (A) is a front view, (B) is a top view of the AA view of (A). FIG. 3 is a schematic functional block diagram in tension control of the wire saw according to the first embodiment. The graph which shows the deformation | transformation state of the multi-groove roller used for the conventional wire saw, and (A)-(C) shows the deformation | transformation state of sample No1-sample No3. The thickness variation of the cut | disconnected wafer is shown, (A) shows a comparative example, (B) is a graph which shows the wafer cut | disconnected by the processing method of the wire saw which concerns on Embodiment 1. FIG. The top view equivalent to the AA view of FIG. 1 (A) which shows schematic structure of the wire saw which concerns on Embodiment 2. FIG. The top view equivalent to the AA view of FIG. 1 (A) which shows schematic structure of the wire saw which concerns on Embodiment 3. FIG. The top view equivalent to the AA view of FIG. 1 (A) which shows schematic structure of the wire saw which concerns on Embodiment 4. FIG.

  Hereinafter, a wire saw processing method and a wire saw (cutting device) according to an embodiment of the present invention will be described with reference to the accompanying drawings.

(Embodiment 1)
First, a wire saw (cutting device) according to Embodiment 1 of the present invention and a wire saw processing method (wire saw cutting method) using the wire saw will be described with reference to FIGS. FIG. 1: shows schematic structure of the wire saw which concerns on Embodiment 1 of this invention, FIG. 1 (A) is a front view, FIG.1 (B) is a plane of AA view of FIG. 1 (A). FIG. Note that in FIG. 1B, there are structural members that are not shown for the sake of illustration. Moreover, although the code | symbol (for example, w1) of the wires w1-w12 in FIG.1 (B) is described in the representative example, it demonstrates as what is sequentially numbered w1-w12. FIG. 2 is a schematic functional block diagram in the tension control of the wire saw according to the first embodiment. FIG. 3 is a graph showing the deformation state of the multi-groove roller used for the wire saw, and FIGS. 3A to 3C are graphs showing Sample No. 1 to Sample No. 3. FIG. FIG. 4 shows the thickness variation of the wafer cut by the wire saw and the wire saw processing method, and FIG. 4A is a graph showing the thickness variation of the wafer cut by the conventional method shown as a comparative example. B) is a graph showing thickness variations of wafers cut by the wire saw processing method according to Embodiment 1 of the present invention.

(Configuration of wire saw)
The wire saw (cutting device) 10 according to the first embodiment cuts a work piece (cut object), for example, a brittle material such as a raw quartz crystal or a silicon ingot, and cuts it into a thin plate base material (hereinafter referred to as a wafer). Device. In the following description, a quartz crystal is illustrated as an example of a workpiece (a workpiece to be cut). In addition, the cutting of the workpiece is performed by cutting by cutting from the front surface to the back surface of the workpiece, or by removing the remaining part after performing the cutting process to the middle of the workpiece. Includes cutting to do.

  As shown in FIG. 1, the wire saw 10 according to the first embodiment includes multi-groove rollers 11, 12, and 18 that wind the wire w in parallel, and tension measuring units C <b> 1 to C <b> 12 and C <b> 21 to detect the tension of the wire w. C32, tension adjusting sections 30 and 31 for adjusting the tension of the wire w, a feeder 15 for mounting and fixing the quartz raw stones 16 and 17 and wire winding drums 21 and 22 are provided. In the following description, the starting end side of the wire w from the position where the wire w (wire row described below) and the quartz raw stones 16 and 17 come into contact is the front side or the wire delivery side, and the wire w (described below). The end side of the wire w from the position at which the crystal line 16 and 17 abuts on the rear side or the winding side of the wire will be described. In addition, as shown in FIG. 2, the wire saw 10 according to the first embodiment includes a control unit 200 (sends data detected by the tension measurement units C1 to C12 and C21 to C32 to the tension adjustment units 30 and 31 as adjustment data. (Not shown in FIG. 1).

  As shown in FIG. 2, the control unit 200 having a function of tension control (tension adjustment) of the wire w includes a detection data acquisition unit 130, a detection control unit 140, a calculation unit 150, a tension control unit 160, and the like. It has. The detection data acquisition unit 130 acquires the data detected by the tension measurement units C <b> 1 to C <b> 12 and C <b> 21 to C <b> 32 based on an instruction from the detection control unit 140 and transmits the data to the calculation unit 150. The calculation unit 150 calculates the detection data sent from the detection data acquisition unit 130 based on an instruction from the detection control unit 140 and creates adjustment data of the tension adjustment units 30 and 31. The tension control unit 160 instructs the tension adjustment units 30 and 31 on the adjustment amount (pressing amount) based on the adjustment data sent from the calculation unit 150.

  Returning to FIG. The multi-groove rollers 11, 12, 18 having the same configuration are arranged with their axes parallel to each other, and ring-shaped grooves 13, 14 (multi-groove rollers 18) provided at a constant pitch on the surface of a substantially cylindrical roller. , And the wire w is wound around the ring-shaped grooves 13 and 14 (not shown in the multi-groove roller 18). The multi-groove rollers 11, 12, 18 are continuously rotated by a rotation mechanism (not shown). In addition, the wire w wound around the multi-groove rollers 11, 12, 18 may be one or plural, and the number is not limited. In this embodiment, one wire w fed out is sequentially wound around the adjacent ring-shaped grooves 13 and 14 (not shown in the multi-groove roller 18), and the wires w1, w2, w3,. Twelve wires w12 of w12 are wound around the multi-groove rollers 11, 12, 18 to form a wire array arranged in parallel.

  The starting end side (IN side) of the wire w is wound around the wire winding drum 21 via the tension adjusting unit 30. The wire winding drum 21 can adjust the winding force of the wire w by a voltage applied to, for example, a torque motor (not shown) and can reciprocate the wire w. The tension of the wire w between the multi-groove roller 11 and the wire take-up drum 21 and between the multi-groove roller 11 and the multi-groove roller 18 is a winding force by the torque motor of the wire take-up drum 21 and tension adjustment. Adjusted by the unit 30 and kept constant.

  Similarly, the terminal end side (OUT side) of the wire is wound around the wire winding drum 22 via the tension adjusting unit 31. For example, the wire winding drum 22 can adjust the winding force of the wire w by a voltage applied to a torque motor (not shown) and can reciprocate the wire w. The tension of the wire w between the multi-groove roller 12 and the wire take-up drum 22 and between the multi-groove roller 12 and the multi-groove roller 18 is the winding force by the torque motor of the wire take-up drum 22 and the tension adjustment. Adjusted by the unit 31 and kept constant.

  The wire w1-w12 faces the wire row arranged in parallel between the multi-groove rollers 11 and 12, and in the lower part in FIG. 1A (opposite to the side where the multi-groove rollers 11, 12, 18 are provided) On the side, a feeder 15 is provided that is movable along a direction (vertical direction in FIG. 1A) orthogonal to the arrangement direction of the wire rows. On the upper surface of the feeder 15, quartz raw stones 16 and 17 are fixed as workpieces (cut objects). Then, while supplying the slurry (not shown) between the wire w to be fed and the quartz raw stones 16 and 17, the quartz raw stones 16 and 17 are cut by pressing the quartz raw stones 16 and 17 against the wire row, A quartz wafer is formed. The above-mentioned slurry means a fluid (mud) in which abrasive grains are suspended in a solution.

  A roller tension sensor (a tension sensor for measuring the tension of each of the wires w1 to w12 on the delivery side between the raw quartz crystal 16 located on the multigroove roller 11 side and the multi-groove roller 11 and individually contacting each wire w1 to w12. There are provided tension measuring sections C1 to C12 including an unillustrated). Similarly, between the quartz raw stone 17 positioned on the multi-groove roller 12 side and the multi-groove roller 12, the wires w1 to w12 are individually brought into contact with each other, and the tension for each of the winding-side wires w1 to w12 is set. Tension measuring units C21 to C32 including a tension sensor (not shown) for measurement are provided. Although the tension measuring units C1 to C12 and the tension measuring units C21 to C32 are not shown in the figure, for example, the above-described roller tension sensor and the roller tension sensor are attached, and the pressing force of the wires w1 to w12 via the roller tension sensor And a load sensor for measuring the tension (deflection amount) for each of the wires w1 to w12.

  A tension adjusting unit 30 is provided on the opposite side of the multi-groove roller 11 from the side where the tension measuring units C1 to C12 are disposed. The tension adjusting unit 30 is opposed to the multi-groove roller 11 and has a guide roller 19 disposed with its axes parallel to each other, and a reciprocating roller disposed between the multi-groove roller 11 and the guide roller 19. Adjustment rollers R1 to R12 are provided. Adjustable rollers R1 to R12 that can freely advance and retreat are individually in contact with the wires w1 to w12 on the delivery side, and the tension for each of the wires w1 to w12 on the delivery side is equal to the tension measuring units C1 to C12 corresponding to the wires w1 to w12. It is possible to adjust based on the detection result. Specifically, for example, by moving the adjustment roller R1 and pressing the wire w1 based on the adjustment data obtained from the detection results (data and measurement data) of the tension measurement unit C1 that measures the tension of the wire w1. The tension of the wire w1 on the delivery side is adjusted. Similarly, the tension measuring unit C2 and the adjustment roller R2 corresponding to the wire w2 are moved to adjust the tension of the wire w2 on the delivery side. Thereafter, the tension of the wire w3 to the wire w12 on the delivery side is adjusted by the tension measurement unit C3 to the tension measurement unit C12 and the adjustment roller R3 to the adjustment roller R12 corresponding to each wire from the wire w3 to the wire w12.

  Similarly, a tension adjusting unit 31 is provided on the side opposite to the side where the tension measuring units C21 to C32 are arranged with respect to the multi-groove roller 12. The tension adjusting unit 31 is opposed to the multi-groove roller 12 and has a guide roller 20 disposed with its axes parallel to each other, and a retractable roller disposed between the multi-groove roller 12 and the guide roller 20. Adjusting rollers R21 to R32 are provided.

  In other words, the tension measuring units C1 to C12, the tension measuring units C21 to C32, and the adjusting roller R1 of the tension adjusting unit 30 before and after the pressing position where the wires w1 to w12 come into contact with the quartz raw stones 16 and 17, respectively. -R12 and the adjustment rollers R21-R32 of the tension adjusting unit 31 are arranged in pairs. The adjustment rollers R1 to R12 of the tension adjustment unit 30 and the adjustment rollers R21 to R32 of the tension adjustment unit 31 may be arranged in at least a pair, and other configurations, for example, two or more pairs, or one (for example, One may be arranged on the front side and a plurality may be arranged on the other side (for example, the rear side).

  The adjustable rollers R21 to R32 which can freely advance and retract individually contact the winding-side wires w1 to w12, and the tension measuring units C21 corresponding to the wires w1 to w12 are set to the tensions of the winding-side wires w1 to w12. It can adjust based on the detection result of ~ C32. Specifically, for example, the adjustment roller R21 is moved based on the adjustment data obtained from the detection result (data and measurement data) of the tension measurement unit C21 that measures the tension of the wire w1, and the wire w1 is wound by pressing the wire w1. Adjust the tension of the wire w1 on the take side. Similarly, the corresponding tension measuring unit C22 and the adjustment roller R22 are moved to the wire w2, and the tension of the wire w2 on the winding side is adjusted. Thereafter, the tension of the wire w3 to the wire w12 on the winding side is adjusted by the tension measurement unit C23 to the tension measurement unit C32 and the adjustment roller R23 to the adjustment roller R32 corresponding to each wire from the wire w3 to the wire w12.

  In this way, the tension measuring units C1 to C12 or the tension measuring units C21 to C32 are provided before and after the pressing positions of the wire rows (wires w1 to w12) and the quartz raw stones 16 and 17, which are workpieces, and the wire w1. Measure the tension of .about.w12 one by one. And based on the adjustment data obtained from the measurement data calculated | required from the data measured by the tension measurement parts C1-C12 or the tension measurement parts C21-C32, respectively, corresponding adjustment roller R1-R12 or adjustment roller R21-R32 The tension of the wires w1 to w12 can be adjusted one by one. Therefore, even if variations in the amount of bending (tension) of the wires w1 to w12 occur due to differences in the positions where the wires w1 to w12 are arranged, the amount of bending (tension) corresponding to each of the wires w1 to w12 is different. Adjustment can be performed, and variations in the thickness of the cut wafer and variations in the cutting direction (cutting angle) of the wafer can be reduced. That is, it becomes possible to improve the cutting accuracy of the crystal wafer. In particular, in quartz wafers, the resonance frequency depends on the cut thickness, and the amount of change in the resonance frequency with temperature (frequency temperature characteristics) depends on the cutting angle. Therefore, by using a quartz wafer formed using the wire saw 10 having the above-described configuration, the characteristics of the quartz element can be stabilized and improved.

(Wire saw processing method)
Next, a wire saw processing method (workpiece cutting method) using the above-described wire saw 10 will be described. In addition, about the structure of the wire saw 10, it demonstrates using the same code | symbol, referring the same drawing as the above-mentioned. Moreover, also about a workpiece, the example using the quartz raw stones 16 and 17 as a workpiece (cut object) is shown similarly to the above-mentioned.

  The multi-groove rollers 11 and 12 are fixed to the upper surface of the feeder 15 that can move along a direction orthogonal to the arrangement direction of the wire row at a position facing the wire row in which the wires w1 to w12 are arranged in parallel. Further, the quartz raw stones 16 and 17 are arranged as work pieces (cut objects). Then, the feeder 15 is moved (lifted) while supplying slurry (not shown) between the wire w to be fed and the quartz raw stones 16 and 17, and the quartz raw stones 16 and 17 are pressed against the wire rows through the slurry. At this time, the wire w is sequentially sent out from the wire winding drum 21 on the start end side by adjusting the winding force between the wire winding drum 21 on the start end side and the wire winding drum 22 on the end side. Is wound around the wire winding drum 22 on the end side. Therefore, the wire in the portion in contact with the quartz raw stones 16 and 17 is also pressed against the quartz raw stones 16 and 17 while being sequentially fed.

  Since the wires w1 to w12 on the delivery side are fed while receiving resistance pressed against the quartz raw stones 16 and 17, the multi-groove roller 11 and the quartz raw stone 16 are caused by a change in resistance pressed against the quartz raw stones 16 and 17. It becomes easy to produce bending (decrease in tension) between. Similarly, the wires w1 to w12 on the winding side are bent (reduced in tension) between the multi-groove roller 12 and the quartz raw stone 17 due to a change in resistance pressed against the quartz raw stones 16 and 17, for example. It tends to occur. When such bending (decrease in tension) of each of the wires w1 to w12 occurs, each of the wires w1 to w12 is not only in the linear direction (moving direction) but also in a direction orthogonal to the linear direction (moving direction) (for example, the wire w1 ~ W12 arrangement direction). Due to such wobbles of the wires w1 to w12, the cutting allowance increases, or the ring-shaped grooves 13 and 14 of the multi-groove rollers 11 and 12 are cut in different directions, resulting in the arrangement position of the wires. Inconveniences such as fluctuations occur, leading to a reduction in cutting accuracy.

  Here, the shape change of the ring-shaped grooves 13 and 14 of the multi-groove rollers 11 and 12 caused by the change in the bending (tension) of the wire w will be described with reference to FIG. FIG. 3 shows a deformed state of the ring-shaped groove in the multi-groove roller (corresponding to multi-groove rollers 11 and 12) used in the conventional wire saw, and FIGS. 3 (A) to 3 (C) are obtained from sample No1. It is a graph which shows the deformation | transformation state of sample No3. In the figure, the state before use is indicated by a two-dot chain line, and the state after use is indicated by a solid line. In the same figure, the vertical axis indicates the depth of the groove, the horizontal axis indicates the distance from the end of the multi-groove roller, and the shape of the groove provided there is schematically represented.

  In the multi-groove roller of sample No. 1 shown in FIG. 3 (A), a significant deformation having a different deformation state from the other grooves is observed in the plurality of grooves positioned in the range of D1 in the drawing. Further, in the multi-groove roller of sample No. 3 shown in FIG. 3C, the groove located in the range D2 in the figure and the plurality of grooves located in the range D3 in the figure are different in deformation state from the other grooves. Deformation is seen. In addition, in the multi-groove roller of sample No. 2 shown in FIG. Thus, it turns out that the ring-shaped groove | channel of a multi-groove roller is a different deformation | transformation state for each multi-groove roller by performing a wire saw process, or a deformation | transformation state changes with the ring-shaped groove | channel parallel.

  In order to reduce such bending (decrease in tension) of the wires w1 to w12, in this processing method, a tension measuring unit that detects individual bending (tension) for each of the wires w1 to w12 on the sending side on the sending side. Based on the detection results of C1 to C12, the deflection (tension) for each of the wires w1 to w12 is adjusted by the adjustment rollers R1 to R12 as one of a pair of rollers that can be advanced and retracted individually. Moreover, based on the detection result of the tension | tensile_strength measurement parts C21-C32 which detects individual bending (tension | tensile_strength) for every wire w1-w12 by the side of winding, as the other of a pair of roller which can move forward / backward individually The bending (tension) for each of the wires w1 to w12 is adjusted by the adjustment rollers R21 to R32.

  Specifically, for example, by moving the adjustment roller R1 and pressing the wire w1 based on the adjustment data obtained from the detection results (data and measurement data) of the tension measurement unit C1 that measures the tension of the wire w1. The tension of the wire w1 on the delivery side is adjusted. Similarly, the tension measuring unit C2 and the adjustment roller R2 corresponding to the adjacent wire w2 are moved to adjust the tension of the wire w2 on the delivery side. Thereafter, the tension of the wires w3 to w12 on the delivery side is adjusted by the tension measuring units C3 to C12 and the adjustment rollers R3 to R12 corresponding to the wires w3 to w12.

  Similarly, for example, by moving the adjustment roller R21 and pressing the wire w1 based on the adjustment data obtained from the detection result (data and measurement data) of the tension measurement unit C21 that measures the tension of the wire w1. The tension of the wire w1 on the winding side is adjusted. Similarly, the tension measuring unit C22 and the adjustment roller R22 corresponding to the adjacent wire w2 are moved to adjust the tension of the wire w2 on the winding side. Thereafter, the tension of the wires w3 to w12 on the winding side is adjusted by the tension measuring units C23 to C32 and the adjustment rollers R23 to R32 corresponding to each wire from the wire w3 to the wire w12.

  As described above, the tension measuring units C1 to C12 or the tension measuring units C21 to C32 are provided before and after the pressing positions of the wire rows (wires w1 to w12) and the quartz raw stones 16 and 17 that are the workpieces, and the wires Based on the adjustment data obtained from the measurement data obtained from the data obtained by measuring the tensions of w1 to w12 one by one, the corresponding one wire w1 by the tension measurement units C1 to C12 or the tension measurement units C21 to C32 The tension of ~ w12 can be adjusted.

  Further, the adjustment rollers R1 to R12 and the adjustment roller R21 as at least a pair of advanceable and retreatable rollers provided by sandwiching the quartz raw stones 16 and 17 as workpieces in the linear direction (movement direction) of the wires w1 to w12. The amount of bending of the wires w1 to w12 can be easily adjusted by bringing ~ R32 into contact with the wires w1 to w12 with an adjustment amount based on the adjustment data.

  As described above, the amount of deflection (tension) of the wires w1 to w12 is adjusted based on the corresponding adjustment data before and after the pressing position where the wires w1 to w12 are pressed against the quartz raw stones 16 and 17, respectively. Therefore, it is possible to adjust different deflection amounts (tensions) on the sending side and the winding side of the wires w1 to w12, respectively. Thereby, adjustment of the bending amount (tension | tensile_strength) of wire w1-w12 can be performed still more precisely.

  In this way, by cutting the quartz raw stones 16 and 17 while reducing the bending (decrease in tension) of the wires w1 to w12, Problems caused by shake can be reduced. Specifically, due to the wobbles of the wires w1 to w12, the cutting allowance increases, or the ring-shaped grooves 13 and 14 of the multi-groove rollers 11 and 12 are cut in different directions, resulting in the arrangement of the wires. Inconveniences such as variations in position can be reduced.

  Here, the measurement result of the thickness variation of the cut quartz wafer, which can be shown as an index of the improved cutting accuracy, will be described with reference to FIG. FIG. 4 shows the thickness variation of the cut crystal wafer, FIG. 4 (A) shows the result of a conventional method as a comparative example, and FIG. 4 (B) shows the wire saw processing method according to the first embodiment. It is a graph which shows the cut wafer. FIG. 4A shows a variation in thickness (TH) between two quartz wafers as a comparative example. FIG. 4B shows variations in thickness (TH) in four crystal wafers cut by the wire saw processing method according to the first embodiment.

  As shown in FIG. 4A, the measurement result of the thickness of the quartz wafer in the comparative example shows that the difference between the minimum value and the maximum value of the thickness is large, and the variation in thickness is also large. On the other hand, as shown in FIG. 4B, the measurement result of the thickness of the crystal wafer cut by the wire saw processing method according to the first embodiment is between the minimum value and the maximum value of the thickness. It can be seen that the difference is small and the variation in thickness is small. Thus, it turns out that the variation in the thickness of the crystal wafer cut | disconnected by the processing method of the wire saw which concerns on Embodiment 1 is small.

  Thus, according to the wire saw processing method (workpiece cutting method) using the wire saw 10 according to the first embodiment, the wires w1 to w12 depend on the positions where the wires w1 to w12 are arranged. Even if the amount of bending (tension) varies, the amount of bending (tension) corresponding to each of the wires w1 to w12 can be adjusted, and the thickness of the cut wafer varies, Variations in the cutting direction (cutting angle) can be reduced. That is, it becomes possible to improve the cutting accuracy of the crystal wafer. In particular, in quartz wafers, the resonance frequency depends on the cut thickness, and the amount of change in the resonance frequency with temperature (frequency temperature characteristics) depends on the cutting angle. Therefore, by using a quartz wafer formed using the wire saw 10 having the above-described configuration, the characteristics of the quartz element can be stabilized and improved.

  The adjustment data for moving the adjustment rollers R1 to R12 and the adjustment rollers R21 to R32 is, as described above, the data for the wires w1 to w12 of the tension measurement units C1 to C12 and the tension measurement units C21 to C32 as measurement data. It may be used as it is, or an average value using a plurality of data for each of the wires w1 to w12 may be calculated and used as measurement data.

  In this way, according to the adjustment data obtained from the measurement data obtained by averaging a plurality of data, the deflection amount (tension) of the corresponding wires w1 to w12 is adjusted. ) Can be reduced without reducing the adjustment accuracy, and the amount of deflection (tension) can be adjusted more efficiently.

(Embodiment 2)
Next, the configuration of the wire saw according to the second embodiment will be described with reference to FIG. FIG. 5 shows a schematic configuration of the wire saw according to the second embodiment of the present invention, and is a plan view corresponding to the AA view of FIG. In addition, although the code | symbol (for example, w1) of the wires w1-w12 in FIG. 5 is described by the representative example, it demonstrates as what is sequentially numbered w1-w12. Further, in the configuration of the wire saw according to the second embodiment and the wire saw processing method using the wire saw, the same configurations as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The description of these parts will be omitted, and different parts will be mainly described.

  As shown in FIG. 5, the wire saw 50 according to the second embodiment is different in the configurations of the tension measuring units C1 to C12 and C21 to C32 and the tension adjusting units 30 and 31 of the first embodiment. The tension measuring units C51 to C54 in the wire saw 50 according to the second embodiment are provided between the quartz raw stone 16 and the multi-groove roller 11 located on the multi-groove roller 11 side, as in the first embodiment. Each of the tension measuring units C51 to C54 includes, for example, a roller tension sensor that comes into contact with the wires w1 to w3 on the delivery side and measures the tension of each of the three wires on the delivery side. Specifically, for example, the tension measuring unit C51 is in contact with the wires w1 to w3, and for example, the tension measuring unit C54 is in contact with the wires w10 to w12.

  Similarly, between the quartz crystal 17 positioned on the multi-groove roller 12 side and the multi-groove roller 12, for example, abuts on the winding-side wires w <b> 1 to w <b> 3, and tensions for each of the three winding-side wires. There are provided tension measuring sections C71 to C74 including a tension sensor for measuring. Specifically, for example, the tension measuring unit C71 is in contact with the wires w1 to w3, and for example, the tension measuring unit C74 is in contact with the wires w10 to w12.

  Although the tension measuring units C51 to C54 and the tension measuring units C71 to C74 are not shown, for example, the above-described roller tension sensor and the roller tension sensor are attached, and the pressing force for each of the three wires via the roller tension sensor. And a load sensor that measures the tension (deflection amount) of each of the three wires.

  Similar to the first embodiment, the tension adjusting unit 30 is provided on the opposite side of the multi-groove roller 11 from the side where the tension measuring units C51 to C54 are disposed. The tension adjusting unit 30 is disposed between the multi-groove roller 11 and the guide roller 19, and the guide roller 19 (not shown in FIG. 5, see FIG. 1) disposed opposite the multi-groove roller 11. Advancing and retracting adjusting rollers R51 to R54 are provided. Three of the wires w1 to w12 on the delivery side abut each of the adjustable rollers R51 to R54 that can be moved forward and backward, and the tension is adjusted based on the detection results in the tension measuring units C51 to C54 of the corresponding three wires. can do.

  Specifically, for example, the adjustment roller R51 is moved based on the adjustment data obtained from the detection result (data and measurement data) of the tension measurement unit C51 that measures the three tensions of the wires w1 to w3 on the delivery side. The tension of the wires w1 to w3 on the delivery side is adjusted by pressing the wires w1 to w3 on the delivery side. Similarly, for example, the corresponding tension measuring unit C54 and the adjustment roller R54 are moved to the wires w10 to w12 on the delivery side, and the tensions of the wires w10 to w12 on the delivery side are adjusted. Similarly, for the wires w4 to w9 on the delivery side, the wires w4 to w6 on the delivery side and the wires w7 to w7 on the delivery side are adjusted by the corresponding adjustment rollers R52 and R53 three by three based on the detection results of the corresponding tension measuring units C52 and 53. Adjust the tension for each w9.

  Similarly, a tension adjusting unit 31 is provided on the side opposite to the side where the tension measuring units C71 to C74 are arranged with respect to the multi-groove roller 12. The tension adjusting unit 31 is disposed between the multi-groove roller 12 and the guide roller 20, and the guide roller 20 (not shown in FIG. 5, refer to FIG. 1) disposed opposite the multi-groove roller 12. Advancing and retracting adjustment rollers R71 to R74 are provided. Retractable adjustment rollers R71 to R74 are in contact with three of the winding-side wires w1 to w12, respectively, and the tension is determined based on the detection results of the corresponding three tension measuring units C71 to C74. Can be adjusted.

  Specifically, for example, the adjustment roller R71 is moved based on the adjustment data obtained from the detection result (data and measurement data) of the tension measurement unit C71 that measures the three tensions of the winding-side wires w1 to w3. The tensions of the winding-side wires w1 to w3 are adjusted by pressing the winding-side wires w1 to w3. Similarly, for example, the tension measuring unit C74 and the adjustment roller R74 corresponding to the winding-side wires w10 to w12 are moved to adjust the tension of the winding-side wires w10 to w12. Similarly, the winding-side wires w4 to w9 are also wound on the winding-side wires w4 to w6 by the adjusting rollers R72 and R73 corresponding to the windings on the basis of the detection results of the corresponding tension measuring units C72 and 73. Adjust the tension for each of w7 to w9.

  As described above, the tension measuring units C51 to C54 or the tension measuring units C71 to C74 are provided before and after the pressing positions of the wire rows (wires w1 to w12) and the quartz raw stones 16 and 17 which are the workpieces, and the wire w1. Measure the tension of ~ w12 in triplicate. And the tension | tensile_strength measurement part C51-C54 or tension | tensile_strength measurement part C71-C74 can adjust the tension | tensile_strength of every three corresponding wires w1-w12 based on the adjustment data calculated | required from the measured data, respectively. Therefore, similarly to the first embodiment, it is possible to reduce the variation in the thickness of the cut wafer and the variation in the cutting direction (cutting angle) of the wafer. That is, it becomes possible to improve the cutting accuracy of the crystal wafer.

  In addition, the number of placement of the tension measuring units for adjusting the deflection amount (tension) can be reduced without reducing the adjustment accuracy of the deflection amount (tension), and the deflection amount (tension) can be adjusted more efficiently. Can do.

(Embodiment 3)
Next, the configuration of the wire saw according to the third embodiment will be described with reference to FIG. FIG. 6 shows a schematic configuration of a wire saw according to Embodiment 3 of the present invention, and is a plan view corresponding to the AA view of FIG. In addition, although the code | symbol (for example, w1) of the wires w1-w12 in FIG. 6 is described by the representative example, it demonstrates as what is sequentially numbered w1-w12. Moreover, in the structure of the wire saw which concerns on Embodiment 3, and the wire saw processing method by a wire saw, about the structure similar to the above-mentioned Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted, and the same of a wire saw processing method The description of these parts will be omitted, and different parts will be mainly described.

  As shown in FIG. 6, the wire saw 80 according to the third embodiment is different from the first embodiment in the configuration of the tension adjusting units 30 and 31. Since the tension measuring units C1 to C12 on the sending side and the tension measuring units C21 to C32 on the winding side in the wire saw 80 according to the third embodiment are the same as those in the first embodiment, detailed description thereof is omitted. The measuring units C1 to C12 and the tension measuring units C21 to C32 abut on the wires w1 to w12 individually and measure the tension for each of the wires w1 to w12.

  Similar to the first embodiment, the tension adjusting unit 30 is provided on the opposite side of the multi-groove roller 11 from the side where the tension measuring units C1 to C12 are disposed. The tension adjusting unit 30 is disposed between the multi-groove roller 11 and the guide roller 19, and the guide roller 19 (not shown in FIG. 6, see FIG. 1) disposed opposite the multi-groove roller 11. Advancing and retracting adjusting rollers R51 to R54 are provided.

  Adjustable rollers R51 to R54 which can freely advance and retreat are in contact with three of the wires w1 to w12 on the delivery side, respectively, and the detection results (data of three wires) in the tension measuring units C1 to C12 of three corresponding wires. Can be adjusted based on adjustment data based on measurement data obtained by averaging. Specifically, for example, the adjustment data obtained from the measurement data obtained by averaging the three detection results (data) detected by the tension measurement units C1, C2, and C3 that are in contact with each of the wires w1 to w3 on the delivery side. Based on this, the tension of the wires w1 to w3 on the delivery side is adjusted by moving the adjustment roller R51 and pressing the wires w1 to w3 on the delivery side.

  Similarly, for example, the wires w10 to w12 on the delivery side are based on adjustment data obtained from measurement data obtained by averaging the three detection results (data) detected by the corresponding tension measurement units C10, C11, and C12. The adjustment roller R54 is moved to adjust the tension of the wires w10 to w12 on the delivery side. Similarly, for the wires w4 to w9 on the delivery side, the wires w4 to w6 on the delivery side and the wires w7 to w7 on the delivery side are adjusted by the corresponding adjustment rollers R52 and R53 three by three based on the detection results of the corresponding tension measuring units C4 to C9. The tension for each w9 can be adjusted.

  Similarly, a tension adjusting unit 31 is provided on the side opposite to the side where the tension measuring units C21 to C32 are arranged with respect to the multi-groove roller 12. The tension adjusting unit 31 is disposed between the multi-groove roller 12 and the guide roller 20, and the guide roller 20 (not shown in FIG. 6, see FIG. 1) disposed opposite the multi-groove roller 12. Advancing and retracting adjustment rollers R71 to R74 are provided.

  The retractable adjustment rollers R71 to R74 are in contact with three of the winding-side wires w1 to w12, respectively, and the detection results in the corresponding three tension measuring units C21 to C32 (data of three wires) ) Can be adjusted based on the adjustment data obtained from the averaged measurement data. Specifically, for example, adjustment data obtained from measurement data obtained by averaging three detection results (data) detected by the tension measurement units C21, C22, and C23 that are in contact with the winding-side wires w1 to w3, respectively. Based on the above, the tension of the winding-side wires w1 to w3 is adjusted by moving the adjustment roller R71 and pressing the winding-side wires w1 to w3.

  Similarly, for example, the winding-side wires w10 to w12 are based on adjustment data obtained from measurement data obtained by averaging three detection results (data) detected by the corresponding tension measurement units C30, C31, and C32. Then, the adjustment roller R74 is moved to adjust the tension of the wires w10 to w12 on the winding side. Similarly, also on the winding-side wires w4 to w9, the winding-side wires w4 to w6 and the wires are wound by the adjustment rollers R72 and R73 corresponding to the three on the basis of the detection results of the corresponding tension measuring units C24 to C29. The tension for each of w7 to w9 can be adjusted.

  In this way, the tension measuring units C1 to C12 or the tension measuring units C21 to C32 are provided before and after the pressing positions of the wire rows (wires w1 to w12) and the quartz raw stones 16 and 17, which are workpieces, and the wire w1. Measure the tension every ~ w12. Based on the adjustment data obtained from the measurement data obtained by averaging the data measured by the tension measuring units C1 to C12 or the tension measuring units C21 to C32 for each of a plurality of wires (three in this embodiment). The tension of the corresponding three wires w1 to w12 can be adjusted by the corresponding adjusting rollers R51 to R54 or the adjusting rollers R71 to 74. Therefore, similarly to the first embodiment, it is possible to reduce the variation in the thickness of the cut wafer and the variation in the cutting direction (cutting angle) of the wafer. That is, it becomes possible to improve the cutting accuracy of the crystal wafer.

  Moreover, the adjustment data used for adjustment of the bending amount (tension) of the wires w1 to w12 is acquired from the measurement data obtained by averaging a plurality of data, and the bending amount (tension) of each of the wires w1 to w12 corresponding thereto is obtained. Since the adjustment is performed, the adjustment amount of the deflection amount (tension) can be reduced without reducing the adjustment accuracy of the deflection amount (tension), and the deflection amount (tension) can be adjusted more efficiently.

(Embodiment 4)
Next, the configuration of the wire saw according to the fourth embodiment will be described with reference to FIG. FIG. 7: is a top view which shows schematic structure of the wire saw which concerns on Embodiment 4 of this invention, and is equivalent to the AA view of FIG. 1 (A). In addition, although the code | symbol (for example, w1) of the wires w1-w12 in FIG. 7 is described in the representative example, it demonstrates as what is sequentially numbered w1-w12. Moreover, in the structure of the wire saw which concerns on Embodiment 4, and the wire saw processing method by a wire saw, about the structure similar to the above-mentioned Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted, and the same as the wire saw processing method The description of these parts will be omitted, and different parts will be mainly described.

  As shown in FIG. 7, the basic configuration of the wire saw 120 according to the fourth embodiment is the same as that of the first embodiment. In the wire saw 120 according to the fourth embodiment, the quartz raw stones 16a and 17a that are workpieces have a predetermined inclination angle θ1 with respect to the linear direction (movement direction) of the wires w1 to w12 constituting the wire row. The quartz crystal 16a and 17a are cut at an angle. Along with this, the wire saw 120 is made of a quartz crystal in which the tension measuring units C81 to C92, C101 to C112 and the adjusting rollers R81 to R92 and R101 to R112 constituting the tension adjusting units 30 and 31 are tilted at an inclination angle θ1. It differs from the first embodiment in that it is inclined and arranged with the inclination angles θ2 and θ3 of the same angle as the inclination angle θ1 in the same direction as the inclination directions of 16a and 17a.

  As described above, when the quartz raw stones 16a and 17a, which are workpieces, are arranged and cut at a predetermined inclination angle θ1 with respect to the linear direction of the wire, they correspond to the quartz raw stones 16a and 17a, respectively. The distances L1, L2, L3, and L4 between the tension measuring units C81 to C92 and C101 to C112 can be made substantially the same. Further, the distances L5, L6, L7, and L8 between the tension measuring units C81 to C92 and C101 to C112 and the corresponding adjustment rollers R81 to R92 and R101 to R112 can be made substantially the same. Therefore, the distances between the cutting positions of the quartz raw stones 16a and 17a and the corresponding adjustment rollers R81 to R92 and R101 to R112 can be made substantially the same. Thereby, the difference in the bending amount (tension) due to the different lengths of the wires w1 to w12 between the cutting positions of the quartz raw stones 16a and 17a and the corresponding adjustment rollers R81 to R92 and R101 to R112, respectively, is reduced. It is possible to improve the tension adjustment accuracy.

  Moreover, since the difference in the amount of bending (tension) due to the different lengths of the wires w1 to w12 can be reduced as described above, in this embodiment, the tension measuring unit provided for each of the wires w1 to w12. It becomes possible to set it as the structure which reduced C81-C92, C101-C112 and adjustment roller R81-R92, R101-R112. Therefore, it becomes possible to adjust the amount of deflection (tension) of the wires w1 to w12 with a simple configuration, which can contribute to cost reduction of the apparatus.

  10, 50, 80, 120 ... wire saw, 11, 12, 18 ... multi-groove roller, 13, 14 ... ring-shaped groove, 15 ... feeder, 16, 17 ... rough crystal as workpiece, 19, 20 ... guide Roller, 21, 22 ... Wire winding drum, 30, 31 ... Tension adjustment unit, 130 ... Detection data acquisition unit, 140 ... Detection control unit, 150 ... Calculation unit, 160 ... Tension control unit, 200 ... Control unit, C1 C12: tension measuring unit, C21-C32 ... tension measuring unit, R1-R12 ... adjusting roller as a roller, R21-R32 ... adjusting roller as a roller, w (w1-w12) ... wire.

Claims (10)

Cutting the workpiece by supplying slurry between the wire and the workpiece while pressing the workpiece against a plurality of parallel wires and moving the wire in the linear direction of the wire A wire saw processing method for processing,
Measure the tension of each wire, or the tension of each of a plurality of wires, before and after the wire in the wire direction of the pressed position of the wire and the workpiece,
A method for processing a wire saw, wherein measurement data is obtained from the measured data, and tension of the wire is adjusted based on adjustment data obtained from the measurement data. The adjustment data is
The wire saw according to claim 1, wherein the wire saw is obtained based on the measurement data obtained by averaging the data for each of the wires or the data for each of the plurality of wires. Processing method. Of the measurement data measured before and after the pressing position,
Based on the adjustment data obtained from the measurement data measured on the wire delivery side from the pressing position, the tension of the wire on the wire delivery side is adjusted,
The tension of the wire on the winding side of the wire is adjusted based on the adjustment data obtained from the measurement data measured on the winding side of the wire from the pressing position. The processing method of the wire saw of Claim 1 or Claim 2. Adjustment of the tension of the wire
The wire saw according to any one of claims 1 to 3, wherein the wire saw is performed by at least a pair of rollers that are in contact with the wire and are provided so as to sandwich the workpiece. Processing method. Adjustment of the tension of the wire
The method of processing a wire saw according to claim 4, wherein the processing is performed by the roller provided for each of the wires one by one or for each of the plurality of wires.   When performing the cutting process by inclining the workpiece at a predetermined angle with respect to the wire direction of the wire, the roller is aligned with the inclination of the workpiece with respect to the wire direction. The wire saw processing method according to claim 4 or 5, wherein the wire saw is disposed at an angle. A plurality of wires provided in parallel so as to press against the workpiece;
A tension measuring unit provided before and after the pressing position of the wire and the workpiece so as to measure the tension of each wire or the tension of each of the plurality of wires,
A wire saw comprising: a tension adjustment unit that adjusts the tension of the wire based on adjustment data obtained from measurement data measured by the tension measurement unit. The tension adjusting unit is
The wire saw according to claim 7, further comprising at least a pair of rollers that are in contact with the wire and are provided so as to sandwich the workpiece.   The wire saw according to claim 8, wherein the roller is provided for each of the wires whose tension is measured or for each of the plurality of wires whose tension is measured. . When the workpiece is disposed at a predetermined angle with respect to the wire direction of the wire,
The wire saw according to claim 8 or 9, wherein the roller is disposed to be inclined with respect to a linear direction of the wire at an angle according to an inclination of the workpiece.

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