JP2016164941A - Manufacturing method of lithographic apparatus, lithographic apparatus, and manufacturing method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology that is advantageous for easily adjusting an optical axis of a measurement part which measures relative positions of a radiation part and a stage.SOLUTION: A lithographic apparatus includes: a base; a stage which is supported on the base, holds a substrate, and may move relative to the base; a chamber storing the base and the stage; a measurement object member fixed to the chamber; and a head part which is supported by the base and used to measure a position of the measurement object member. A manufacturing method of the lithographic apparatus, which forms patterns on substrates, includes: a first step in which the measurement object member is positioned relative to the base by using a positioning member for defining a physical relationship between the base and the measurement object member; a second step in which a measuring shaft of the head part is adjusted relative to the measurement object member positioned in the first step; and a third step in which the base is stored in the chamber after the second step.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lithographic apparatus manufacturing method, a lithographic apparatus, and an article manufacturing method.

  2. Description of the Related Art With the miniaturization and high integration of circuit patterns in semiconductor integrated circuits, lithographic apparatuses (drawing apparatuses) that form patterns on a substrate using a beam such as a charged particle beam have attracted attention. For example, in a drawing apparatus, it is necessary to irradiate a substrate with a charged particle beam in a vacuum. Therefore, as in the drawing apparatus described in Patent Document 1, a stage that can move while holding the substrate can be accommodated in the vacuum chamber.

Japanese Patent No. 4205390

  In a drawing apparatus, in order to form a pattern on a substrate with high accuracy, it is preferable to accurately measure a relative position between an irradiation unit that irradiates the substrate with a charged particle beam and a stage that holds the substrate. Patent Document 1 describes a drawing apparatus that measures the relative position between an irradiation unit and a stage using an interferometer (head unit) supported by the irradiation unit. However, the adjustment of the optical axis (measurement axis) of the interferometer at the time of manufacturing the drawing apparatus having the configuration described in Patent Document 1 is not performed after the stage is accommodated in the vacuum chamber and the irradiation unit is fixed to the vacuum chamber. It can be difficult because it cannot be done.

  Therefore, an object of the present invention is to provide a technique advantageous for adjusting the measurement axis of the head unit.

  In order to achieve the above object, a lithographic apparatus manufacturing method according to an aspect of the present invention is a lithographic apparatus manufacturing method for forming a pattern on a substrate, the lithographic apparatus being supported by a base and the base. A stage that holds the substrate and is movable relative to the base, a chamber that houses the base and the stage, a measurement target member fixed to the chamber, and a measurement target member supported by the base, A head portion for measuring the position of the measurement object, wherein the manufacturing method uses a positioning member for defining a positional relationship between the base and the measurement target member, and uses the positioning member to position the measurement target member with respect to the base. And a second step of adjusting a measurement axis of the head unit with respect to the measurement target member positioned in the first step. , After the second step, characterized in that it comprises a third step of accommodating the base into the chamber.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide a technique advantageous for adjusting the measurement axis of the head unit.

It is the schematic which shows the drawing apparatus of 1st Embodiment. It is a flowchart which shows the manufacturing method of the drawing apparatus which concerns on 1st Embodiment. It is a figure which shows the state which positioned the plate with the positioning member. It is a figure which shows the state which fixed the plate and the irradiation part to the upper wall of the chamber. It is the schematic which shows the drawing apparatus of 2nd Embodiment. It is a flowchart which shows the manufacturing method of the drawing apparatus which concerns on 2nd Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted. In the following embodiments, a drawing apparatus that forms a pattern on a substrate by irradiating the substrate with a charged particle beam (electron beam) as a beam will be described, but the present invention is not limited thereto. For example, the present invention can be applied to a lithography apparatus such as an exposure apparatus that exposes a substrate using light (light beam) as a beam.

<First Embodiment>
A drawing apparatus 100 according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram illustrating a drawing apparatus 100 according to the first embodiment. The drawing apparatus 100 includes, for example, an irradiation unit CL that irradiates the substrate W with a charged particle beam (beam) to form a pattern on the substrate W, a stage FS that holds the substrate W and can move on the base, and irradiation It may include a measuring unit PL that measures the relative position between the part CL and the stage FS. Further, the drawing apparatus 100 includes, for example, a CPU, a memory, and the like, and can include a control unit CNT that controls a drawing process on the substrate W (controls each unit of the drawing apparatus 100). In the drawing apparatus 100, it is generally necessary to irradiate the substrate W with a charged particle beam in a vacuum. Therefore, in the drawing apparatus 100 of the first embodiment, the base BS and the stage FS can be accommodated in the chamber VC, and the irradiation unit CL can be supported by the upper wall of the chamber VC. Thereby, the drawing apparatus 100 can irradiate the substrate W with a charged particle beam in a vacuum state by making the inside of the chamber VC into a vacuum state. Here, the chamber VC can be supported by the floor via a mount MT for reducing vibration from the floor on which the drawing apparatus 100 is disposed, for example. In the drawing apparatus 100, an adjustment unit PD that adjusts the position of the base BS with respect to the chamber VC may be provided between the base BS and the bottom wall of the chamber VC. The adjustment unit PD can include, for example, an actuator that can maintain the position of the base BS even after the drawing apparatus 100 is turned off.

  The irradiation unit CL (column) is supported by, for example, the upper wall of the chamber VC, and irradiates the substrate W with a charged particle beam (beam) so as to form a pattern on the substrate W. The irradiation unit CL includes, for example, a charged particle source that emits a charged particle beam, a blanker that switches between irradiation and non-irradiation of the charged particle beam to the substrate W, and a deflector that scans the charged particle beam on the substrate. The substrate W is irradiated with one or a plurality of charged particle beams.

  The stage FS is supported by the base BS. The stage FS is configured to hold the substrate W and be movable with respect to the base BS in a direction parallel to the surface of the substrate W (for example, the XY direction). For example, in the drawing apparatus 100 shown in FIG. 1, a first slider XS and a second slider YS are provided. The first slider XS can move the second slider YS in the X direction on the base, and the second slider YS can move the stage FS in the Y direction on the first slider. Thus, by providing the first slider XS and the second slider YS on the base, the stage FS holding the substrate W can be configured to be movable in the XY directions on the base. Further, the stage FS may have a function of adjusting the position of the substrate W in the Z direction or the θ direction (the rotation direction around the Z axis), a function of correcting the tilt (tilt) of the substrate W, and the like.

  Measuring unit PL (head unit) is supported by base BS. The measurement unit PL irradiates the plate MP (measurement target member) fixed to the chamber VC (or the irradiation unit CL) and the stage FS with light, and reflects the light reflected by the plate MP and the light reflected by the stage FS. Is used to measure the relative position between the irradiation unit CL and the stage FS. In the first embodiment, the measurement unit PL includes a first measurement unit PLY, a second measurement unit PLX, and a third measurement unit PLZ, and each of the first measurement unit PLY, the second measurement unit PLX, and the third measurement unit PLZ. Is supported by the base BS.

  The first measurement unit PLY can include two interferometers that respectively measure the position of the stage FS in the Y direction and two interferometers that respectively measure the position of the plate MP in the Y direction. Each of the two interferometers that measure the position of the stage FS irradiates light (BSY1, BSY2) on the surface on the −Y direction side of the stage FS, and uses the light reflected on the surface to perform the stage in the Y direction. Measure the position of the FS. These two interferometers can be arranged along the Z direction. In addition, each of the two interferometers that measure the position of the plate MP irradiates light (BCY1, BCY2) on the surface on the −Y direction side of the plate MP, and uses the light reflected on the surface in the Y direction. The position of the plate MP is measured. These two interferometers can be arranged along the Z direction. By configuring the first measurement unit PLY as described above, the first measurement unit PLY can measure the position of the stage FS in the Y direction and the ωX direction and the position of the plate MP in the Y direction and the ωX direction, respectively. it can. That is, the first measurement unit PLY can measure the relative position between the irradiation unit CL (plate MP) and the stage FS in the Y direction and the ωX direction.

  The second measurement unit PLX can include three interferometers that respectively measure the position of the stage FS in the X direction and three interferometers that respectively measure the position of the plate MP in the X direction. Each of the three interferometers that measure the position of the stage FS irradiates light (BSX1, BSX2, BSX3) on the surface of the stage FS on the X direction side, and uses the light reflected on the surface in the X direction. The position of the stage FS is measured. In these three interferometers, an interferometer that emits light BSX1 and an interferometer that emits light BSX2 are arranged along the Z direction, and an interferometer that emits light BSX1 and an interferometer that emits light BSX3 are Y. It can arrange | position so that it may align along a direction. In addition, each of the three interferometers that measure the position of the plate MP irradiates light (BCX1, BCX2, BCX3) on the surface on the X direction side of the plate MP, and uses the light reflected on the surface, X The position of the plate MP in the direction is measured. In these three interferometers, an interferometer that emits light BCX1 and an interferometer that emits light BCX2 are arranged along the Z direction, and an interferometer that emits light BCX1 and an interferometer that emits light BCX3 are Y It can arrange | position so that it may align along a direction. By configuring the second measurement unit PLX in this way, the second measurement unit PLX can detect the position of the stage FS in the X direction, the ωY direction, and the ωZ direction, and the position of the plate MP in the X direction, the ωY direction, and the ωZ direction. Can be measured respectively. That is, the second measurement unit PLX can measure the relative position between the irradiation unit CL (plate MP) and the stage FS in the X direction, the ωY direction, and the ωZ direction.

  The third measurement unit PLZ can include an interferometer that measures a relative position between the stage FS and the plate MP in the Z direction. The interferometer emits light (ZS, ZC) to the surface on the Z direction side of the stage FS and the surface on the −Z direction side of the plate MP via the beam splitter BD, and the light reflected by these surfaces. Is used to measure the relative position of the stage FS and the plate MP in the Z direction. That is, the third measurement unit PLZ can measure the relative position between the irradiation unit CL (plate MP) and the stage FS in the Z direction.

  In the drawing apparatus 100 configured as described above, in order to accurately measure the relative position between the irradiation unit CL and the stage FS, the optical axis (measurement axis) of the measurement unit PL (interferometer) is used when the drawing apparatus 100 is manufactured. Can be adjusted. However, it is difficult to adjust the optical axis of the measurement unit PL after accommodating the base BS and the stage FS in the chamber VC and fixing the plate MP to the chamber VC in terms of space in the chamber. Therefore, it is preferable to adjust the optical axis of the measurement unit PL before accommodating the base BS and the stage FS in the chamber VC. On the other hand, since the plate MP is not positioned with respect to the base BS before the base BS and the stage FS are accommodated in the chamber VC, the optical axis of the measuring unit PL is adjusted when the plate MP is not positioned. I can't. Therefore, in the drawing apparatus 100 of the first embodiment, the plate MP is positioned with respect to the base BS by the positioning member KB before the base BS and the stage FS are accommodated in the chamber VC. Then, the optical axis of the measuring part PL with respect to the plate MP positioned by the positioning member KB is adjusted.

  Below, the manufacturing method of the drawing apparatus 100 which concerns on 1st Embodiment is demonstrated, referring FIG. FIG. 2 is a flowchart showing a method for manufacturing the drawing apparatus 100. Here, below, the optical axis of the measurement unit PL is adjusted before the base BS and the stage FS are accommodated in the chamber VC (steps S101 to S103) using the plate MP that is actually fixed to the irradiation unit CL. An example to be performed will be described. However, the present invention is not limited to this. For example, when adjusting the optical axis of the measurement unit PL, a temporary plate that has a surface irradiated with light from the measurement unit PL and is lighter than the plate MP is used instead of the plate MP. You may use for. Thus, by using a temporary plate that is lighter than the plate MP, it is possible to reduce the distortion of the base BS due to the weight of the plate MP while adjusting the optical axis of the measurement unit PL.

  In S101, before the base BS and the stage FS are accommodated in the chamber VC, the optical axis of the measuring unit PL (the position of the stage FS is measured so that the incident angle of light from the measuring unit PL with respect to the stage FS is within an allowable range. To adjust the optical axis of the interferometer. For example, when the surface of the stage FS that reflects light from the first measurement unit PLY is arranged perpendicular to the Y direction and the stage FS is moved in the Y direction, the change in the received light intensity in the first measurement unit PL is The optical axis of the first measurement unit PLY is adjusted so as to be within the allowable range. In addition, when the surface of the stage FS that reflects the light from the second measurement unit PLX is arranged perpendicular to the X direction and the stage FS is moved in the X direction, the change in the received light intensity in the second measurement unit PLX is The optical axis of the second measurement unit PLX is adjusted so as to be within the allowable range. Similarly, the change in the received light intensity in the third measurement unit PLZ when the surface of the stage FS that reflects the light from the third measurement unit PLZ is arranged parallel to the XY direction and the stage FS is moved in the Z direction. Is adjusted within the allowable range, the optical axis of the third measurement unit PLZ is adjusted.

  In S102, the positioning member KB for positioning the plate MP is fixed to the base BS, and the plate MP is positioned by the positioning member KB fixed to the base BS (first step). For example, as shown in FIG. 1, the base BS has a reference member RB for defining a position on the base where the positioning member KB is to be arranged, that is, for positioning the positioning member KB with respect to the base B. The reference member RB includes a reference plane (YZ plane) for defining the position of the positioning member KB in the X direction, a reference plane (ZX plane) for defining the position in the Y direction, and the Z direction. A reference plane (XY plane) for defining the position is provided. Then, the positioning member KB is fixed to the base BS in a state where the positioning member KB is pressed against the reference surfaces of the reference member RB. Thereby, the positioning member KB can be disposed at a desired position on the base. Further, as shown in FIG. 3, the plate MP is positioned with respect to the base BS by pressing the plate MP against the positioning member KB fixed to the base BS, and the plate MP is fixed to the positioning member KB.

  In S103, the optical axis of the measurement unit PL (the optical axis of the interferometer for measuring the position of the plate MP) is adjusted so that the incident angle of light from the measurement unit PL with respect to the positioned plate MP is within an allowable range. (Second step). For example, the optical axis of the first measurement unit PLY (light emitted from the first measurement unit PLY is set so that the incident angle of the light with respect to the surface of the plate MP that reflects the light from the first measurement unit PLY falls within an allowable range. ) Direction. At this time, it is preferable to adjust the optical axis of the first measurement unit PLY so that the light from the first measurement unit PLY is perpendicularly incident on the surface of the plate MP. Further, the optical axis of the second measurement unit PLX is adjusted so that the incident angle of the light with respect to the surface of the plate MP that reflects the light from the second measurement unit PLX falls within an allowable range. Similarly, the optical axis of the third measurement unit PLZ is adjusted so that the incident angle of the light with respect to the surface of the plate MP reflecting the light from the third measurement unit PLZ falls within an allowable range.

  In S104, the base BS and the stage FS are accommodated in the chamber VC (third step). At this time, when the temporary plate is used in S101 to S103, the base BS and the stage FS are accommodated in the chamber VC with the temporary plate removed. Further, the base BS and the stage FS may be accommodated in the chamber VC with the plate MP removed. In this case, after the base BS and the stage FS are accommodated in the chamber VC, the plate MP can be attached by being positioned by the positioning member KB (for example, pressed against the positioning member KB). In S105, as shown in FIG. 4, the irradiation part CL is positioned with respect to the plate MP, and the plate MP and the irradiation part CL are fixed to the upper wall of the chamber VC (fourth step). In S106, the positioning member KB is removed from the chamber VC (fifth step).

  As described above, in the method of manufacturing the drawing apparatus 100 according to the first embodiment, the plate MP is positioned with respect to the base BS using the positioning member KB before the base BS and the stage FS are accommodated in the chamber VC. Thereby, even before the base BS and the stage FS are accommodated in the chamber VC, or before the plate MP and the irradiation unit CL are fixed to the chamber VC, the measurement for measuring the relative position between the irradiation unit CL and the stage FS. The optical axis of the part PL can be adjusted.

  Here, when the plate MP is fixed to the chamber VC in S105, the relative position between the base BS and the plate MP may be slightly shifted. Therefore, after fixing the plate MP to the chamber VC and removing the positioning member KB from the chamber VC, the relative position is adjusted by the adjusting unit PD so that the incident angle of light from the measuring unit PL with respect to the plate MP is within an allowable range. Good. For example, the relative position may be adjusted by the adjustment unit PD so that the received light intensity in the measurement unit PL is within an allowable range, and preferably the received light intensity is maximized.

Second Embodiment
As shown in FIG. 5, the drawing apparatus 200 according to the second embodiment is further provided with a second measurement unit DT that measures the relative position between the plate MP and the base BS. The second measurement unit DT can be disposed on the base, for example. And in the manufacturing method of the drawing apparatus 200 of 2nd Embodiment, after accommodating base BS in the chamber VC, based on the measurement result by 2nd measurement part DT, without using positioning member KB, base BS and plate MP, Is adjusted by the adjustment unit PD. Below, the manufacturing method of the drawing apparatus 200 which concerns on 2nd Embodiment is demonstrated, referring FIG. FIG. 6 is a flowchart showing a method for manufacturing the drawing apparatus 200 according to the second embodiment. Here, steps S201 to S203 in the flowchart of FIG. 6 are the same as steps S101 to S103 in the flowchart of FIG. In S202 (first step), in addition to positioning the plate MP by the positioning member KB, the relative position between the plate MP and the base BS is adjusted in a state where the optical axis of the head portion PL is adjusted. 2 Measured by the measurement unit DT.

  In S204, the positioning member KB is removed from the base BS, and the base BS and the stage FS are accommodated in the chamber VC. Here, when the temporary plate is used in S201 to S203, the base BS and the stage FS are accommodated in the chamber VC with the temporary plate removed. Further, the base BS and the stage FS may be accommodated in the chamber VC with the plate MP removed. In S205, with the positioning member KB removed from the base BS, the irradiation unit CL (or the plate MP if the plate MP is removed in advance as described above) is fixed to the upper wall of the chamber VC (the sixth). Process). In S206, the relative position between the base BS and the plate MP is adjusted by the adjustment unit PD based on the measurement result by the second measurement unit DT in the step of S202 (second step) (seventh step). For example, the second measurement unit DT is caused to measure the relative position between the base BS and the plate MP, and the adjustment unit PD is controlled so that the relative position measured by the second measurement unit DT approaches the measurement result in the process of S202. To do. Thereby, the positional relationship between the base BS and the plate MP accommodated in the chamber VC can be brought close to the positional relationship between the base BS and the plate MP when the optical axis of the measuring unit PL is adjusted. That is, the incident angle of the light from the measurement unit PL with respect to the plate MP can be within an allowable range.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article of the present embodiment includes a step of forming a latent image pattern on the photosensitive agent applied to the substrate using the above-described lithography apparatus (drawing apparatus) (a step of drawing on the substrate), and a latent image formed in such a step. Processing (for example, developing) the substrate on which the image pattern is formed. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method. Note that the lithography apparatus is not limited to an apparatus that performs pattern formation (patterning) on a substrate using a beam (such as charged particle beam or EUV light), and may be an imprint apparatus. In that case, the above-described development process can be replaced with a known etching process for removing the remaining film in the formed resist pattern or another known process.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

CL: irradiation unit, MP: plate, FS: stage, BS: base, VC: chamber, PL: measurement unit, 100: drawing device

Claims (10)

A method for manufacturing a lithographic apparatus for forming a pattern on a substrate, comprising:
The lithographic apparatus comprises:
Base and
A stage supported by the base and movable relative to the base while holding the substrate;
A chamber containing the base and the stage;
A measurement target member fixed to the chamber;
A head portion supported by the base and measuring the position of the measurement target member,
The manufacturing method includes:
A first step of positioning the measurement target member with respect to the base using a positioning member for defining a positional relationship between the base and the measurement target member;
A second step of adjusting a measurement axis of the head unit with respect to the measurement target member positioned in the first step;
A third step of accommodating the base in the chamber after the second step;
The manufacturing method characterized by including. The lithographic apparatus includes an irradiation unit that irradiates the substrate with a beam for forming the pattern;
The manufacturing method includes:
The manufacturing method according to claim 1, further comprising a fourth step of positioning the irradiation unit with respect to the positioning member and fixing the irradiation unit to the chamber after the third step.   The manufacturing method according to claim 2, further comprising a fifth step of removing the positioning member from the chamber after the fourth step.   The manufacturing method according to any one of claims 1 to 3, wherein the manufacturing method includes a step of adjusting a measurement axis of the head unit with respect to the stage before the third step. . The base has a reference member for positioning the positioning member;
The manufacturing method according to any one of claims 1 to 4, wherein the first step includes a step of positioning and fixing the positioning member with respect to the reference member.   The manufacturing method according to claim 1, wherein in the third step, the base is accommodated in the chamber with the measurement target member removed. The lithography apparatus includes a measurement unit that measures a relative position between the measurement target member and the base, and an adjustment unit that adjusts the position of the base with respect to the chamber,
The second step causes the measurement unit to measure the relative position in a state where the measurement axis of the head unit is adjusted,
The manufacturing method includes:
After the third step, a sixth step of fixing the measurement target member or a measurement target member instead thereof to the chamber in a state where the positioning member is removed;
After the sixth step, based on the measurement result in the second step, a seventh step for adjusting by the adjustment unit;
The manufacturing method of Claim 1 characterized by the above-mentioned. A lithographic apparatus for forming a pattern on a substrate,
Base and
A stage supported by the base and movable relative to the base while holding the substrate;
An irradiation unit for irradiating the substrate with a beam for forming the pattern;
A chamber that houses the base and the stage and supports the irradiation unit;
A measurement target member fixed to the irradiation unit;
A head unit supported by the base for measuring the position of the measurement target member;
Including
The lithographic apparatus, wherein the base includes a reference member for positioning the measurement target member.   The lithographic apparatus according to claim 8, wherein the reference member includes a reference surface for positioning a positioning member for positioning the measurement target member with respect to the base. Forming a pattern on a substrate using the lithographic apparatus according to claim 8,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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