JP2016157829A - Laser beam damper and laser device including the same - Google Patents

Laser beam damper and laser device including the same Download PDF

Info

Publication number
JP2016157829A
JP2016157829A JP2015034816A JP2015034816A JP2016157829A JP 2016157829 A JP2016157829 A JP 2016157829A JP 2015034816 A JP2015034816 A JP 2015034816A JP 2015034816 A JP2015034816 A JP 2015034816A JP 2016157829 A JP2016157829 A JP 2016157829A
Authority
JP
Japan
Prior art keywords
laser beam
light
beam damper
laser
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015034816A
Other languages
Japanese (ja)
Other versions
JP6578670B2 (en
Inventor
亮祐 西
Ryosuke Nishi
亮祐 西
徳田 勝彦
Katsuhiko Tokuda
勝彦 徳田
守 久光
Mamoru Hisamitsu
守 久光
一智 門倉
Kazutomo Kadokura
一智 門倉
和哉 井上
Kazuya Inoue
和哉 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP2015034816A priority Critical patent/JP6578670B2/en
Publication of JP2016157829A publication Critical patent/JP2016157829A/en
Application granted granted Critical
Publication of JP6578670B2 publication Critical patent/JP6578670B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam damper capable of achieving a long lifetime, reducing return light by confining a laser beam and a laser device including the same.SOLUTION: The laser beam damper for blocking a laser beam includes a beam incident port 11 and a heat conduction member 1 having an annular part 13 formed in an annular shape. At an outer circumferential surface of the annular part 13, a light reflection film for reflecting light is formed. At an inner circumferential surface of the annular part 13, a light absorbing film for absorbing light is formed.SELECTED DRAWING: Figure 1

Description

本発明は、レーザ光を遮断するときに、遮断したレーザ光を吸収するレーザビームダンパー及びこれを用いたレーザ装置に関する。   The present invention relates to a laser beam damper that absorbs a blocked laser beam when the laser beam is blocked, and a laser apparatus using the same.

レーザビームダンパーは、レーザ光を遮断する機能を有し、レーザ装置の安全性確保や光の制御に用いられている。例えば、所望の波長のレーザ光を得るための波長変換装置では、波長変換結晶を透過した後の波長変換されなかった赤外光の処理にレーザビームダンパーが用いられている。   The laser beam damper has a function of blocking laser light and is used for ensuring the safety of the laser device and controlling the light. For example, in a wavelength converter for obtaining laser light having a desired wavelength, a laser beam damper is used for processing infrared light that has not been wavelength-converted after passing through a wavelength conversion crystal.

図6は従来のレーザビームダンパーの一例を示す構成図である。このレーザビームダンパーは、光吸収・熱伝導性に優れた金属材料を用いたビーム吸収部5がヒートシンク6と一体となっている。レーザビームが金属材料を介して熱に変換され、ヒートシンク6で冷却される。ビーム吸収部5は、レーザ光軸に対して所定の角度だけ傾斜させて配置され、より大きな面積でビームを吸収する。   FIG. 6 is a block diagram showing an example of a conventional laser beam damper. In this laser beam damper, a beam absorbing portion 5 using a metal material excellent in light absorption and thermal conductivity is integrated with a heat sink 6. The laser beam is converted into heat through the metal material and cooled by the heat sink 6. The beam absorption unit 5 is arranged to be inclined at a predetermined angle with respect to the laser optical axis, and absorbs the beam with a larger area.

このレーザビームダンパーはレーザ光を熱に変換して排出するため、入射した高出力レーザ光が同じ位置に照射され続けると、レーザ光吸収部材(ビーム吸収部5)は、局所的に非常に高温になる。このため、レーザビームダンパーを繰り返し使用することで、レーザ光吸収部材が著しく劣化し、ダンパーとしての性能が低下する。そこで、ダンパーの長寿命化のために、ビーム入射時にビームを分散させレーザ光吸収部材へのダメージを軽減する必要がある。   Since this laser beam damper converts laser light into heat and emits it, if the incident high-power laser light continues to be irradiated at the same position, the laser light absorbing member (beam absorbing portion 5) is locally very hot. become. For this reason, by repeatedly using the laser beam damper, the laser light absorbing member is remarkably deteriorated, and the performance as a damper is lowered. Therefore, in order to extend the life of the damper, it is necessary to reduce the damage to the laser light absorbing member by dispersing the beam when the beam is incident.

このレーザビームダンパーの課題を解決したものとして、例えば、特許文献1〜4が知られている。特許文献1では、レンズによって対象とするレーザビームのビーム径を広げ、レーザ光吸収部材の消耗を抑制している。また、特許文献4では、複数のレーザ光分岐手段を用いてレーザビームを複数に分け、レーザ光吸収部材の消耗を抑制している。   For example, Patent Documents 1 to 4 are known as solutions for solving the problems of the laser beam damper. In Patent Document 1, the lens diameter of a target laser beam is widened by a lens, and consumption of the laser light absorbing member is suppressed. In Patent Document 4, a plurality of laser beam branching means are used to divide a laser beam into a plurality of parts, thereby suppressing the consumption of the laser beam absorbing member.

特開平7−24591号公報Japanese Unexamined Patent Publication No. 7-24591 特開平7−27903号公報JP-A-7-27903 特開平10−326931号公報Japanese Patent Laid-Open No. 10-326931 特開2001−317995号公報JP 2001-317995 A 特開2012−243850号公報JP 2012-243850 A

しかしながら、特許文献1,4では、ミラーやレンズなどの光学系が必要であり、特許文献2,3においても、構造が複雑になる。   However, Patent Documents 1 and 4 require an optical system such as a mirror and a lens, and Patent Documents 2 and 3 also have a complicated structure.

また、波長変換装置においては、対象とする赤外光が戻り光として波長変換部などに再入射すると、結晶の温度が上昇し、波長変換効率が低下する。図6に示す従来の手法では、ダンパーによりビームが完全に吸収されておらず、反射を繰り返すことで光がダンパーから出射し、戻り光となる場合がある。戻り光は、波長変換装置において性能劣化の原因となるだけでなく、その他のレーザ装置においても検出器の感度低下などの不良の原因となることが多い。このような課題については、特許文献5に記載されている。このため、戻り光が発生しないように使用済みビームを効果的にダンパー内に閉じ込める必要がある。   In the wavelength conversion device, when the target infrared light reenters the wavelength conversion unit or the like as return light, the temperature of the crystal rises and the wavelength conversion efficiency decreases. In the conventional technique shown in FIG. 6, the beam is not completely absorbed by the damper, and light may be emitted from the damper by being repeatedly reflected, and may become return light. The return light not only causes performance degradation in the wavelength converter, but also often causes defects such as a decrease in detector sensitivity in other laser devices. Such a problem is described in Patent Document 5. For this reason, it is necessary to effectively confine the used beam in the damper so that no return light is generated.

本発明の課題は、長寿命化を実現でき、しかもレーザビームを閉じ込めて戻り光を低減させるレーザビームダンパー及びこれを用いたレーザ装置を提供することにある。   An object of the present invention is to provide a laser beam damper capable of realizing a long lifetime and confining a laser beam to reduce return light, and a laser apparatus using the same.

本発明は、上記課題を解決するために、レーザビームを遮断するレーザビームダンパーであって、ビーム入射口と円環状に形成された円環部とを有する熱伝導部材を有し、前記円環部の外周面には光を反射するための光反射膜が形成され、前記円環部の内周面には光を吸収するための光吸収膜が形成されてなることを特徴とする。   In order to solve the above problems, the present invention is a laser beam damper for blocking a laser beam, and includes a heat conduction member having a beam incident port and an annular portion formed in an annular shape, A light reflecting film for reflecting light is formed on the outer peripheral surface of the portion, and a light absorbing film for absorbing light is formed on the inner peripheral surface of the annular portion.

また、本発明は、レーザビームを遮断するレーザビームダンパーであって、ビーム入射口と螺旋状に形成された螺旋部とを有する熱伝導部材を有し、前記螺旋部の外周面には光を反射するための光反射膜が形成され、前記螺旋部の内周面には光を吸収するための光吸収膜が形成されてなることを特徴とする。   The present invention is also a laser beam damper for blocking a laser beam, comprising a heat conduction member having a beam entrance and a spiral portion formed in a spiral shape, and light is emitted to the outer peripheral surface of the spiral portion. A light reflection film for reflection is formed, and a light absorption film for absorbing light is formed on the inner peripheral surface of the spiral portion.

また、本発明のレーザ装置は、レーザビームダンパーと、レーザ光の基本波を発振する基本波発振器と、前記基本波発振器で発振されたレーザ光の基本波を高調波に変換する波長変換素子と、前記波長変換素子で変換された高調波と基本波とを分離して基本波を前記レーザビームダンパーに出力するセパレータとを備えることを特徴とする。   The laser device of the present invention includes a laser beam damper, a fundamental wave oscillator that oscillates a fundamental wave of laser light, and a wavelength conversion element that converts the fundamental wave of the laser beam oscillated by the fundamental wave oscillator into a harmonic. And a separator that separates the harmonic wave converted by the wavelength conversion element and the fundamental wave and outputs the fundamental wave to the laser beam damper.

本発明によれば、ビームをビーム入射口に入射させることで、ビームは反射を繰り返し、円を描くように進行し続ける。円環部の外周面及び内周面を利用することでビームを拡大することができ、さらにビームの入射方向がビーム吸収面の法線に対して大きな角度をとることができるため、ビームを一部に集中させず分散させて吸収することができる。このため、レーザ光吸収部材における局所的な発熱が抑制される。これにより、レーザ光吸収部材の劣化が抑制されるため、レーザビームダンパーの長寿命化を実現できる。   According to the present invention, when the beam is incident on the beam entrance, the beam repeats reflection and continues to travel in a circle. The beam can be expanded by using the outer peripheral surface and the inner peripheral surface of the annular portion, and the beam incident direction can take a large angle with respect to the normal line of the beam absorption surface. It can be dispersed and absorbed without being concentrated on the part. For this reason, the local heat_generation | fever in a laser beam absorption member is suppressed. Thereby, since the deterioration of the laser light absorbing member is suppressed, the life of the laser beam damper can be extended.

また、ビームが円環部を進行し再度ビーム入射口に達したときに、そのビーム進行方向が新規ビーム入射方向と同様の方向となる。このため、円環部を進行するビームがビーム入射口から再度出射することがなくなる。これにより、ビームが閉じ込められ、戻り光を低減できる。   Further, when the beam travels through the annular portion and reaches the beam entrance again, the beam traveling direction becomes the same direction as the new beam incident direction. For this reason, the beam traveling in the annular portion is not emitted again from the beam entrance. Thereby, the beam is confined and the return light can be reduced.

本発明の実施例1のレーザビームダンパーの構成を示す図である。It is a figure which shows the structure of the laser beam damper of Example 1 of this invention. 本発明の実施例1のレーザビームダンパーの外壁部材の詳細な構成を示す図である。It is a figure which shows the detailed structure of the outer wall member of the laser beam damper of Example 1 of this invention. 本発明の実施例2のレーザビームダンパーの断面図である。It is sectional drawing of the laser beam damper of Example 2 of this invention. 本発明の実施例3のレーザビームダンパーの断面図である。It is sectional drawing of the laser beam damper of Example 3 of this invention. 本発明の実施例のレーザビームダンパーを含むレーザ装置の構成図である。It is a block diagram of the laser apparatus containing the laser beam damper of the Example of this invention. 従来のレーザビームダンパーの一例を示す構成図である。It is a block diagram which shows an example of the conventional laser beam damper.

以下、本発明のレーザビームダンパー及びレーザ装置の実施の形態を図面に基づいて詳細に説明する。   Embodiments of a laser beam damper and a laser apparatus according to the present invention will be described below in detail with reference to the drawings.

図1は、実施例1のレーザビームダンパーの構成を示す図である。図1(a)は、レーザビームダンパーの斜視図、図1(b)は、図1(a)に示すレーザビームダンパーの横断面図、図1(c)は、図1(a)に示すレーザビームダンパーの縦断面図である。図2(a)は外壁部材の上面図、図2(b)は外壁部材の斜視図である。   FIG. 1 is a diagram illustrating the configuration of the laser beam damper according to the first embodiment. 1A is a perspective view of the laser beam damper, FIG. 1B is a cross-sectional view of the laser beam damper shown in FIG. 1A, and FIG. 1C is shown in FIG. It is a longitudinal cross-sectional view of a laser beam damper. 2A is a top view of the outer wall member, and FIG. 2B is a perspective view of the outer wall member.

図1に示す実施例1のレーザビームダンパーは、円環部13の外壁となる外壁部材1、円環部の内壁となる円盤型部材2、外壁部材1及び円盤型部材2を覆う蓋部材3、蓋部材3を冷却する冷却用ファン4とを有して構成される。   The laser beam damper according to the first embodiment shown in FIG. 1 includes an outer wall member 1 serving as an outer wall of an annular portion 13, a disk-shaped member 2 serving as an inner wall of the annular portion, an outer wall member 1, and a lid member 3 covering the disk-shaped member 2. And a cooling fan 4 for cooling the lid member 3.

外壁部材1と円盤型部材2とは、熱伝導率が高く、耐熱性に優れた部材からなり、例えば、金属材料からなる。外壁部材1は、本発明の熱伝導部材に対応する。外壁部材1と円盤型部材2と蓋部材3とは、溶接等の方法で接合され、一体化した状態となる。   The outer wall member 1 and the disk-shaped member 2 are made of a member having high thermal conductivity and excellent heat resistance, for example, a metal material. The outer wall member 1 corresponds to the heat conducting member of the present invention. The outer wall member 1, the disk-shaped member 2, and the lid member 3 are joined together by a method such as welding and become an integrated state.

外壁部材1は、図2(a)及び図2(b)に示すように、レーザビームを入射するためのビーム入射口11と円盤型部材2の直径よりも大径の円状の平坦部12を有している。外壁部材1の平坦部12に、円盤型部材2を円状の平坦部12の中心と同心状に配置することにより、図1(b)に示すような円環状の円環部13が形成されている。   As shown in FIGS. 2A and 2B, the outer wall member 1 has a beam entrance 11 for entering a laser beam and a circular flat portion 12 having a diameter larger than the diameter of the disk-shaped member 2. have. By arranging the disk-shaped member 2 concentrically with the center of the circular flat portion 12 on the flat portion 12 of the outer wall member 1, an annular ring portion 13 as shown in FIG. ing.

また、外壁部材1の内側の曲面部分には、光を反射するための光反射膜が形成され、円盤型部材2の曲面部分には光を吸収するための光吸収膜が形成されている。   A light reflection film for reflecting light is formed on the curved surface portion inside the outer wall member 1, and a light absorption film for absorbing light is formed on the curved surface portion of the disk-shaped member 2.

外壁部材1は、ステンレス鋼又はアルミニウム合金等を母体として、その表面粗さを小さくし、Al,Au,Ag,Pt,Cr等の金属材料又はこれらを主成分とする合金などの反射膜を被覆することで光の反射率を高くする。円盤型部材2は、ステンレス鋼又はアルミニウム合金等の表面に、光吸収膜として、Fe,Cr,Ni,Al,Zn等の金属材料又はこれらを主成分とする合金又はダイアモンドライクカーボン(DLC)等の炭素膜を被覆して、光吸収・熱伝導性を高める。さらに、円盤型部材2の光吸収率を高めるために、表面粗さを大きくするといった方法も例示できる。   The outer wall member 1 is made of stainless steel or aluminum alloy as a base, the surface roughness is reduced, and a metal film such as Al, Au, Ag, Pt, Cr, or a reflective film such as an alloy containing these as a main component is coated. By doing so, the reflectance of light is increased. The disk-shaped member 2 has a surface of stainless steel, aluminum alloy or the like as a light absorption film, a metal material such as Fe, Cr, Ni, Al, Zn, or an alloy or diamond like carbon (DLC) containing these as a main component. The carbon film is coated to improve light absorption and thermal conductivity. Furthermore, in order to increase the light absorption rate of the disk-shaped member 2, a method of increasing the surface roughness can be exemplified.

蓋部材3は、排熱用のヒートシンクからなり、Cu,Al等の熱伝導性に優れた材料が用いられる。この蓋部材3には、冷却を促進させるための空冷用のフィン構造が形成されている。冷却用ファン4は、空冷用のフィンを冷却する。   The lid member 3 is composed of a heat sink for exhaust heat, and a material having excellent thermal conductivity such as Cu or Al is used. The lid member 3 is formed with an air cooling fin structure for promoting cooling. The cooling fan 4 cools the fins for air cooling.

次にこのように構成された実施例1のレーザビームダンパーの動作を説明する。まず、吸収対象のレーザビームは、外壁部材1に形成されたビーム入射口11からレーザビームダンパー内に入射する。入射したビームは、円環部13の接線方向から外壁部材1及び円盤型部材2に当たり、外壁部材1及び円盤型部材2の曲面で反射・吸収される。   Next, the operation of the laser beam damper according to the first embodiment configured as described above will be described. First, a laser beam to be absorbed enters the laser beam damper from a beam entrance 11 formed in the outer wall member 1. The incident beam hits the outer wall member 1 and the disk-shaped member 2 from the tangential direction of the annular portion 13, and is reflected and absorbed by the curved surfaces of the outer wall member 1 and the disk-shaped member 2.

ビームは、外壁部材1及び円盤型部材2に対して円環構造の接線に近い角度で入射するため、ビームが照射される面積が大きくなり、ビームが吸収される場合には、ビームによる部材へのダメージが軽減される。また、ビームが反射される場合には、反射されるビームが曲面により拡大・分散される。即ち、部材へ局所的に熱が集中することを防ぎ、部材の劣化を抑えることができる。   Since the beam is incident on the outer wall member 1 and the disk-shaped member 2 at an angle close to the tangent to the annular structure, the area irradiated with the beam increases, and when the beam is absorbed, the beam is moved to the member. Damage is reduced. When the beam is reflected, the reflected beam is expanded and dispersed by the curved surface. That is, local concentration of heat on the member can be prevented and deterioration of the member can be suppressed.

次に、部材により吸収されず反射されたビームは、別の部材表面に照射され、同様にビームの吸収及び反射が起こる。ビームの吸収及び反射が繰り返されることで、ビームは円を描くように進行しながら強度がゼロになるまで徐々に熱に変換されて吸収される。さらに、円環構造の下では、吸収されなかったビームが円環部13を一周してビーム入射口11に再度、到達した場合でも、そのビームの進行方向は、新規に入射するビームと同様の方向であり、ビーム入射口11から出射してしまうことがない。このため、ビームはダンパー内に閉じ込められ戻り光の発生が抑えられる。   Next, the beam reflected without being absorbed by the member is irradiated to the surface of another member, and absorption and reflection of the beam occur similarly. By repeating the absorption and reflection of the beam, the beam is gradually converted into heat and absorbed until the intensity becomes zero while proceeding in a circular pattern. Further, under the annular structure, even when the unabsorbed beam goes around the annular portion 13 and reaches the beam entrance 11 again, the traveling direction of the beam is the same as that of the newly incident beam. It is a direction and does not exit from the beam entrance 11. For this reason, the beam is confined in the damper, and the generation of return light is suppressed.

さらに、実施例1では、外壁部材1と円盤型部材2とにそれぞれ光反射膜及び光吸収膜を施している。これにより、ビームの熱は外壁部材1の外面に漏れにくくなり、さらに円盤型部材2を介してビーム吸収による熱が冷却用フィン構造を有する蓋部材3へ伝達し易くなり、効率良く冷却できる。   Furthermore, in Example 1, the light reflecting film and the light absorbing film are applied to the outer wall member 1 and the disk-shaped member 2, respectively. This makes it difficult for the heat of the beam to leak to the outer surface of the outer wall member 1, and further facilitates the transfer of heat due to beam absorption to the lid member 3 having the cooling fin structure via the disk-shaped member 2, enabling efficient cooling.

また、実施例1では、外壁部材1と円盤型部材2とにそれぞれ光反射膜・光吸収膜を施したが、例えば、全体のビーム反射率が70%程度になるように一様な表面処理を施す方法も考えられる。この方法では、ビームは円環構造を進行する途中で部材に当たり反射する度に少しずつ吸収される。また、反射が主であるため、光吸収によって一部が大きく劣化することなく、さらなるレーザビームダンパーの長寿命化を図ることができる。   In the first embodiment, the outer wall member 1 and the disk-shaped member 2 are provided with the light reflecting film and the light absorbing film, respectively. For example, uniform surface treatment is performed so that the overall beam reflectivity is about 70%. It is also possible to apply the method. In this method, the beam is absorbed little by little every time it hits the member and reflects while traveling through the annular structure. Further, since reflection is mainly used, it is possible to further extend the life of the laser beam damper without significant deterioration due to light absorption.

このように、実施例1のレーザビームダンパーによれば、ビームをビーム入射口11に入射させることで、ビームは反射を繰り返し、円を描くように進行し続ける。円環部13の外周面及び内周面を利用することでビームを拡大することができ、さらにビームの入射方向がビーム吸収面の法線に対して大きな角度をとることができるため、ビームを一部に集中させず分散させて吸収することができる。このため、レーザ光吸収部材における局所的な発熱が抑制される。これにより、レーザ光吸収部材の劣化が抑制されるため、レーザビームダンパーの長寿命化を実現できる。   As described above, according to the laser beam damper of the first embodiment, when the beam is incident on the beam incident port 11, the beam repeats reflection and continues to progress so as to draw a circle. The beam can be expanded by using the outer peripheral surface and the inner peripheral surface of the annular portion 13, and the incident direction of the beam can take a large angle with respect to the normal line of the beam absorption surface. It can be dispersed and absorbed without being concentrated in a part. For this reason, the local heat_generation | fever in a laser beam absorption member is suppressed. Thereby, since the deterioration of the laser light absorbing member is suppressed, the life of the laser beam damper can be extended.

なお、実施例1では、外壁部材1と円盤型部材2とを組み合わせて円環部13を形成したが、円盤型部材2を削除し、外壁部材1のみに円環部を形成しても良い。   In the first embodiment, the outer wall member 1 and the disk-shaped member 2 are combined to form the annular portion 13. However, the disk-shaped member 2 may be deleted and the annular portion may be formed only on the outer wall member 1. .

図3は、本発明の実施例2のレーザビームダンパーの断面図である。図1に示す実施例1では、外壁部材1と円盤型部材2とを組み合わせて円環部13を形成し、この円環部13が図1(c)の断面図に示すように角型となっていた。   FIG. 3 is a sectional view of the laser beam damper according to the second embodiment of the present invention. In Example 1 shown in FIG. 1, the outer wall member 1 and the disk-shaped member 2 are combined to form an annular portion 13, and the annular portion 13 has a rectangular shape as shown in the sectional view of FIG. It was.

これに対して、実施例2のレーザビームダンパーは、図3に示すように、円盤型部材2を削除し、外壁部材1aと蓋部材3aとからなる。   On the other hand, as shown in FIG. 3, the laser beam damper according to the second embodiment includes the outer wall member 1a and the lid member 3a except for the disk-shaped member 2.

外壁部材1a及び蓋部材3aには、円環状の溝部13a,13bが形成され、外壁部材1aの溝部13aと蓋部材3aの溝部13bとを対向配置させることにより断面が丸い円環構造の円環部が形成されている。円環状の溝部13a,13bは、金属加工用のエンドミルの形状を工夫等して形成されている。   An annular groove 13a, 13b is formed in the outer wall member 1a and the lid member 3a, and an annular ring structure having a round cross section is formed by disposing the groove 13a of the outer wall member 1a and the groove 13b of the lid member 3a to face each other. The part is formed. The annular grooves 13a and 13b are formed by devising the shape of an end mill for metal processing.

断面が丸い円環構造の円環部が形成されているので、曲面を利用したビームの分散によって、光吸収部材の劣化がより低減される。   Since the annular portion having an annular structure with a round cross section is formed, the deterioration of the light absorbing member is further reduced by the dispersion of the beam using the curved surface.

図4は、本発明の実施例3のレーザビームダンパーの断面図である。この断面図は、図1に示す横断面図に相当する。   FIG. 4 is a cross-sectional view of the laser beam damper according to the third embodiment of the present invention. This sectional view corresponds to the transverse sectional view shown in FIG.

実施例3のレーザビームダンパーは、円盤型部材2を削除し、外壁部材1bと図3に示す蓋部材3aとからなる。   The laser beam damper according to the third embodiment includes an outer wall member 1b and a lid member 3a shown in FIG.

外壁部材1bは、図4に示すように、ビーム入射口11と螺旋状に形成された螺旋部14を有し、螺旋部14の外周面には光を反射するための光反射膜が形成され、螺旋部14の内周面には光を吸収するための光吸収膜が形成されてなる。   As shown in FIG. 4, the outer wall member 1 b has a spiral portion 14 formed in a spiral shape with the beam incident port 11, and a light reflecting film for reflecting light is formed on the outer peripheral surface of the spiral portion 14. A light absorption film for absorbing light is formed on the inner peripheral surface of the spiral portion 14.

このような構成によれば、より長いレーザ光吸収経路を確保でき、レーザ光吸収部材の劣化が抑えられ、レーザビームダンパーの長寿命化を図ることができる。また、同時にレーザ光の戻り光をより大きく低減できる。   According to such a configuration, a longer laser light absorption path can be secured, deterioration of the laser light absorbing member can be suppressed, and the life of the laser beam damper can be extended. At the same time, the return light of the laser beam can be greatly reduced.

図5は、本発明の実施例のレーザビームダンパーを含むレーザ装置の構成図である。レーザ装置は、基本波発振器21、レンズ22、波長変換素子23、レンズ24、セパレータ25、レーザビームダンパー26を備えている。   FIG. 5 is a configuration diagram of a laser apparatus including a laser beam damper according to an embodiment of the present invention. The laser device includes a fundamental wave oscillator 21, a lens 22, a wavelength conversion element 23, a lens 24, a separator 25, and a laser beam damper 26.

基本波発振器21は、レーザ光の基本波を発振し、基本波をレンズ22を介して波長変換素子23に出力する。波長変換素子23は、基本波発振器21で発振されたレーザ光の基本波を高調波に変換して、高調波及び波長変換できなかった基本波をセパレータ25に出力する。   The fundamental wave oscillator 21 oscillates the fundamental wave of the laser beam and outputs the fundamental wave to the wavelength conversion element 23 via the lens 22. The wavelength conversion element 23 converts the fundamental wave of the laser light oscillated by the fundamental wave oscillator 21 into a harmonic wave, and outputs the harmonic wave and the fundamental wave that could not be wavelength-converted to the separator 25.

セパレータ25は、波長変換素子23で変換された高調波と波長変換できなかった基本波とを分離して基本波をレーザビームダンパー26に出力する。レーザビームダンパー26は、実施例1乃至3のレーザビームダンパーであり、セパレータ25からの基本波を吸収する。   The separator 25 separates the harmonic wave converted by the wavelength conversion element 23 from the fundamental wave that could not be wavelength-converted, and outputs the fundamental wave to the laser beam damper 26. The laser beam damper 26 is the laser beam damper of the first to third embodiments, and absorbs the fundamental wave from the separator 25.

このように実施例1乃至3のレーザビームダンパーをレーザ装置に適用することができ、実施例1乃至3のレーザビームダンパーの効果が得られる。   As described above, the laser beam dampers of the first to third embodiments can be applied to the laser apparatus, and the effects of the laser beam dampers of the first to third embodiments can be obtained.

1 外壁部材
2 円盤型部材
3 蓋部材
4 冷却用ファン
5 ビーム吸収部
6 ヒートシンク
11 ビーム入射口
12 平坦部
13 円環部
14 螺旋部
21 基本波発振器
22,24 レンズ
23 波長変換素子
25 セパレータ
26 レーザビームダンパー
DESCRIPTION OF SYMBOLS 1 Outer wall member 2 Disk type member 3 Cover member 4 Cooling fan 5 Beam absorption part 6 Heat sink 11 Beam entrance 12 Flat part 13 Ring part 14 Spiral part 21 Fundamental wave oscillators 22 and 24 Lens
23 Wavelength conversion element 25 Separator 26 Laser beam damper

Claims (11)

レーザビームを遮断するレーザビームダンパーであって、
ビーム入射口と円環状に形成された円環部とを有する熱伝導部材を有することを特徴とするレーザビームダンパー。
A laser beam damper for blocking the laser beam,
A laser beam damper comprising a heat conducting member having a beam entrance and an annular portion formed in an annular shape.
レーザビームを遮断するレーザビームダンパーであって、
ビーム入射口と螺旋状に形成された螺旋部を有する熱伝導部材を有することを特徴とするレーザビームダンパー。
A laser beam damper for blocking the laser beam,
A laser beam damper, comprising: a heat conduction member having a beam entrance and a spiral portion formed in a spiral shape.
前記円環部表面に光を反射するための光反射膜又は光を吸収するための光吸収膜が一様に形成されてなることを特徴とする請求項1記載のレーザビームダンパー。   2. The laser beam damper according to claim 1, wherein a light reflecting film for reflecting light or a light absorbing film for absorbing light is uniformly formed on the surface of the annular portion. 前記螺旋部表面に光を反射するための光反射膜又は光を吸収するための光吸収膜が一様に形成されてなることを特徴とする請求項2記載のレーザビームダンパー。   3. The laser beam damper according to claim 2, wherein a light reflecting film for reflecting light or a light absorbing film for absorbing light is uniformly formed on the surface of the spiral portion. 前記円環部の外周面には光を反射するための光反射膜が形成され、前記円環部の内周面には光を吸収するための光吸収膜が形成されてなることを特徴とする請求項1記載のレーザビームダンパー。   A light reflecting film for reflecting light is formed on the outer peripheral surface of the annular portion, and a light absorbing film for absorbing light is formed on the inner peripheral surface of the annular portion. The laser beam damper according to claim 1. 円盤型部材と、前記円盤型部材及び前記熱伝導部材を覆う蓋部材とを有し、
前記熱伝導部材は、前記円盤型部材の径よりも大径の円状の平坦部を有し、前記円環部は、前記熱伝導部材の前記平坦部に前記円盤型部材を同心状に配置することにより形成されることを特徴とする請求項1記載のレーザビームダンパー。
A disk-shaped member, and a lid member that covers the disk-shaped member and the heat conducting member,
The heat conductive member has a circular flat portion having a diameter larger than the diameter of the disk-shaped member, and the circular ring portion concentrically arranges the disk-shaped member on the flat portion of the heat conductive member. The laser beam damper according to claim 1, wherein the laser beam damper is formed.
前記熱伝導部材を覆う蓋部材を有し、
前記熱伝導部材及び前記蓋部材には、円環状の溝部が形成され、
前記円環部は、前記熱伝導部材の前記溝部と前記蓋部材の前記溝部とを対向配置させることにより形成されることを特徴とする請求項2記載のレーザビームダンパー。
A lid member covering the heat conducting member;
An annular groove is formed in the heat conducting member and the lid member,
3. The laser beam damper according to claim 2, wherein the annular portion is formed by arranging the groove portion of the heat conducting member and the groove portion of the lid member to face each other.
前記光反射膜は、Al,Au,Ag,Pt,Cr又はこれらを主成分とする合金のいずれかで形成されることを特徴とする請求項1乃至請求項7のいずれか1項記載のレーザビームダンパー。   The laser according to claim 1, wherein the light reflecting film is formed of any one of Al, Au, Ag, Pt, Cr, or an alloy containing these as a main component. Beam damper. 前記光吸収膜は、Fe,Cr,Ni,Al,Zn又はこれらを主成分とする合金のいずれかで形成されることを特徴とする請求項1乃至請求項7のいずれか1項記載のレーザビームダンパー。   The laser according to claim 1, wherein the light absorption film is formed of any one of Fe, Cr, Ni, Al, Zn, or an alloy containing these as a main component. Beam damper. 前記光吸収膜は、炭素膜で形成されることを特徴とする請求項1乃至請求項7のいずれか1項記載のレーザビームダンパー。   The laser beam damper according to claim 1, wherein the light absorption film is formed of a carbon film. 請求項1乃至請求項10のいずれか1項に記載されたレーザビームダンパーと、
レーザ光の基本波を発振する基本波発振器と、
前記基本波発振器で発振されたレーザ光の基本波を高調波に変換する波長変換素子と、
前記波長変換素子で変換された高調波と基本波とを分離して基本波を前記レーザビームダンパーに出力するセパレータと、
を備えることを特徴とするレーザ装置。
The laser beam damper according to any one of claims 1 to 10,
A fundamental oscillator that oscillates the fundamental wave of the laser beam;
A wavelength conversion element that converts the fundamental wave of the laser light oscillated by the fundamental wave oscillator into a harmonic, and
A separator that separates the harmonic wave and the fundamental wave converted by the wavelength conversion element and outputs the fundamental wave to the laser beam damper;
A laser device comprising:
JP2015034816A 2015-02-25 2015-02-25 Laser beam damper and laser apparatus using the same Expired - Fee Related JP6578670B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015034816A JP6578670B2 (en) 2015-02-25 2015-02-25 Laser beam damper and laser apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015034816A JP6578670B2 (en) 2015-02-25 2015-02-25 Laser beam damper and laser apparatus using the same

Publications (2)

Publication Number Publication Date
JP2016157829A true JP2016157829A (en) 2016-09-01
JP6578670B2 JP6578670B2 (en) 2019-09-25

Family

ID=56826348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015034816A Expired - Fee Related JP6578670B2 (en) 2015-02-25 2015-02-25 Laser beam damper and laser apparatus using the same

Country Status (1)

Country Link
JP (1) JP6578670B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101854654B1 (en) * 2016-09-21 2018-05-04 한국원자력연구원 Laser beam dumper
JP2019175886A (en) * 2018-03-26 2019-10-10 ファナック株式会社 Fiber laser apparatus

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121838U (en) * 1977-03-04 1978-09-28
US4439860A (en) * 1981-08-11 1984-03-27 The United States Of America As Represented By The United States Department Of Energy Optical pumping in a whispering mode optical waveguide
JPS62284310A (en) * 1986-06-03 1987-12-10 Asahi Glass Co Ltd Optical waveguide
JP2001244537A (en) * 2000-03-01 2001-09-07 Mitsubishi Electric Corp Laser system
JP2002505012A (en) * 1997-06-11 2002-02-12 ブックハム テクノロジー ピーエルシー Integrated light absorber
JP2002267859A (en) * 2001-03-13 2002-09-18 Toshiba Corp Optical waveguide and method for manufacturing the same
JP2003185984A (en) * 2001-12-18 2003-07-03 Kyocera Corp Optical variable attenuator
JP2005516253A (en) * 2002-01-29 2005-06-02 キネティック リミテッド Optical circuit manufacturing method and apparatus
JP2006520489A (en) * 2003-03-15 2006-09-07 キネテイツク・リミテツド Variable optical attenuator with hollow core waveguide
JP2007500369A (en) * 2003-07-26 2007-01-11 キネティック リミテッド Variable optical attenuator
US20090080084A1 (en) * 2007-09-24 2009-03-26 Pang H Yang Beam dump for a very-high-intensity laser beam
JP2009175176A (en) * 2008-01-21 2009-08-06 Japan Aviation Electronics Industry Ltd Optical device
US20140133795A1 (en) * 2012-11-13 2014-05-15 Infinera Corporation Scattering device on an arrayed waveguide grating

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121838U (en) * 1977-03-04 1978-09-28
US4439860A (en) * 1981-08-11 1984-03-27 The United States Of America As Represented By The United States Department Of Energy Optical pumping in a whispering mode optical waveguide
JPS62284310A (en) * 1986-06-03 1987-12-10 Asahi Glass Co Ltd Optical waveguide
JP2002505012A (en) * 1997-06-11 2002-02-12 ブックハム テクノロジー ピーエルシー Integrated light absorber
JP2001244537A (en) * 2000-03-01 2001-09-07 Mitsubishi Electric Corp Laser system
JP2002267859A (en) * 2001-03-13 2002-09-18 Toshiba Corp Optical waveguide and method for manufacturing the same
JP2003185984A (en) * 2001-12-18 2003-07-03 Kyocera Corp Optical variable attenuator
JP2005516253A (en) * 2002-01-29 2005-06-02 キネティック リミテッド Optical circuit manufacturing method and apparatus
JP2006520489A (en) * 2003-03-15 2006-09-07 キネテイツク・リミテツド Variable optical attenuator with hollow core waveguide
JP2007500369A (en) * 2003-07-26 2007-01-11 キネティック リミテッド Variable optical attenuator
US20090080084A1 (en) * 2007-09-24 2009-03-26 Pang H Yang Beam dump for a very-high-intensity laser beam
JP2009175176A (en) * 2008-01-21 2009-08-06 Japan Aviation Electronics Industry Ltd Optical device
US20140133795A1 (en) * 2012-11-13 2014-05-15 Infinera Corporation Scattering device on an arrayed waveguide grating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101854654B1 (en) * 2016-09-21 2018-05-04 한국원자력연구원 Laser beam dumper
JP2019175886A (en) * 2018-03-26 2019-10-10 ファナック株式会社 Fiber laser apparatus

Also Published As

Publication number Publication date
JP6578670B2 (en) 2019-09-25

Similar Documents

Publication Publication Date Title
TWI507805B (en) Wavelength converting device
JP6547270B2 (en) Light source device and image projector having the light source device
JPH07297467A (en) Laser device
JP2011082298A (en) Laser beam absorbing device, and solid-state laser device including the same
JP6578670B2 (en) Laser beam damper and laser apparatus using the same
JP6215860B2 (en) Optical absorber that absorbs light beam
JP2018101089A (en) Light source device and projection type display device
JP5949872B2 (en) Fluorescent light source device
JP2007531918A (en) Aperture stop assembly for high power laser beams
JPH05335662A (en) Solid-state laser device
JP2004082166A (en) Laser emitting barrel for optical fiber
JP2658961B2 (en) Solid-state laser device
TWI786057B (en) laser device
JP2005332989A (en) Laser oscillator
US3566300A (en) Optical means for production of laser emission
JP2000349372A (en) Gas laser beam absorber
JP6885423B2 (en) A light source device and an image projection device having this light source device
JP2004179412A (en) Semiconductor laser excitation solid state laser device and its manufacturing method
JPH0466288A (en) Laser beam machine
JPH0482281A (en) Solid laser oscillator
JP2007250800A (en) Laser device
JP2010161304A (en) Laser oscillation device
JP4141862B2 (en) Laser equipment
JPS6262321A (en) Laser light absorber
JP2019133119A (en) Diffraction element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170602

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180517

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180626

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180823

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180831

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190514

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190708

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190730

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190812

R151 Written notification of patent or utility model registration

Ref document number: 6578670

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

LAPS Cancellation because of no payment of annual fees