JP2016154242A5 - - Google Patents

Description

Motor drive device with heat sink for cutting liquid drop countermeasure

  The present invention relates to a motor drive device including a heat sink for cooling a power element.

  In many cases, a motor drive device includes a heat sink composed of a plurality of fins and a blower such as a fan motor in order to cool electronic components such as power elements (see Patent Document 1). FIG. 5 is an external perspective view of a conventional motor driving apparatus. FIG. 6 is a schematic configuration diagram of the inside of a conventional motor driving apparatus. The motor driving device includes a casing composed of a casing part 1, a casing part 2, and a casing part 3.

The motor drive device is installed in a factory or the like in a state where it is mounted on a high power board such as a machine tool. Cutting fluid mist, dust, dust, and the like may be floating in the factory environment around the high-power panel on which the motor drive device is mounted. If the high-power panel is not tightly sealed, outside air containing cutting fluid mist, etc. will enter the high-power panel, and further enter the motor drive unit and adhere to electronic components, causing problems. May occur. In particular, when a fan motor is installed to cool the electronic components of the motor drive device, problems are likely to occur.
For example, a lot of cutting fluid mist or the like may adhere to a portion such as a heat sink where cooling air flows intensively, resulting in water droplets. In some cases, the water drops concentrate on the nearby electronic components from the heat sink, causing a problem.

JP 2005-321287 A

  Conventionally, as a countermeasure against dripping of water droplets, there is a method of preventing inconvenience due to dripping of water droplets by disposing electronic components away from a heat sink or the like to which water droplets easily adhere. However, the arrangement of electronic components is limited, which may make it difficult to consider the arrangement of electronic components at the time of design, or the size of the printed circuit board may increase and the size of the motor drive device may increase. . Further, if the electronic component is arranged away from the heat sink, the pattern becomes longer than necessary, and it is easy to be affected by noise, which may cause a problem.

  Therefore, in order to solve the above-described problems of the prior art, the present invention makes it possible to prevent the cutting fluid mist entering the motor driving device by inclining the end of the heat sink installed in the motor driving device with respect to the horizontal plane. Providing a motor drive device with a heat sink for cutting droplets that can reduce the amount of water droplets adhering to electronic components by controlling the position of the water droplets when they adhere to the heat sink. It is intended to do.

The invention according to claim 1 of the present application includes: a heat sink for cutting droplet countermeasures; an electronic component that is fixed by the heat sink for cutting droplet countermeasures and cooled by the heat sink for cutting droplet countermeasures; And a motor driving device having an electronic component disposed below the countermeasure heat sink, wherein the cutting liquid drop countermeasure heat sink has a vertical lower end inclined with respect to a horizontal plane, and the end. When the imaginary line is extended vertically downward from the lowermost end of the vertical direction of the part, the imaginary line does not intersect with the electronic component disposed below the heat sink for cutting liquid drop countermeasure It is a motor drive device.
According to a second aspect of the present invention, the cutting liquid drip measures heat sink, the ends of the mounting surface opposite of the electronic component to be cooled by the cutting liquid drip countermeasure heat sink, close to or in contact with said housing and Ru motor driving device der according to claim 1, characterized in that are.

  According to the present invention, when the end of the heat sink installed in the motor drive device is inclined with respect to the horizontal plane, when the cutting fluid mist or the like that has entered the motor drive device adheres to the heat sink and becomes water droplets, It is possible to provide a motor driving device including a heat sink for cutting liquid drop prevention that can control the dropping position of the water drop and reduce the adhesion of the water drop to the electronic component.

It is the schematic perspective view and schematic schematic which showed the structure by Embodiment 1 of this invention. It is the schematic perspective view and schematic front view which showed the structure by Embodiment 2 of this invention. It is the schematic perspective view and schematic schematic which showed the structure by Embodiment 3 of this invention. It is the schematic perspective view and schematic side view of a high power board with which a motor drive device is mounted. It is an external appearance perspective view of the motor drive device of a prior art. It is a schematic block diagram inside a motor drive device of a prior art.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, about the structure which is the same as that of a prior art, or similar, it demonstrates using the same code | symbol.

(Embodiment 1)
FIG. 1 is a diagram illustrating an internal structure of the motor drive device 17 according to the first embodiment. The motor driving device 17 includes a housing that includes the housing component 1, the housing component 2, and the housing component 3. A fan motor 4 is attached to the housing part 3 in the motor driving device 17. A heat sink 12 is attached in the vicinity of the fan motor 4. A printed circuit board 7 is provided along the housing part 1. A power element 6 is attached to the printed circuit board 7. Further, the power device 6, the heat sink 12 for cooling power element 6 itself is fixed. And the electronic components 8, 9, 10, and 11 are arrange | positioned in the lower part in a housing.

  In the first embodiment, the end of the heat sink 12 for cooling the power element 6 mounted on the printed circuit board 7 is inclined with respect to the vertical direction of the mounting surface with the power element 6. That is, when the motor drive device 17 is installed in the high power board 16, the lower end of the heat sink 12 in the vertical direction is inclined with respect to the horizontal plane.

In a state where the motor drive device 17 is installed in the high power board 16, the end of the heat sink 12 installed in the motor drive device 17 is inclined with respect to the horizontal plane. Water droplets such as cutting fluid adhering to 12 are dropped on the side surface of the casing of the housing component 1 of the motor drive device 17 so as not to drop on the electronic components 8, 9, 10, 11 mounted on the ground side from the heat sink 12. be able to.

  A position where a water droplet drops from the heat sink 12 vertically downward will be described. The motor drive device 17 is mounted in the high-power panel 16 with the electronic components 8, 9, 10, and 11 positioned on the lower side in the vertical direction with respect to the heat sink 12. This state is referred to as a normal use state of the motor drive device 17. In the posture of the motor drive device 17 in a normal use state, the end of the heat sink 12 (the lower end in the vertical direction) facing the ground of the heat sink 12 attached in the housing of the motor drive device 17 is in a horizontal plane. It is inclined with respect to it. When the imaginary line is extended vertically downward from the lowermost vertical end of the end inclined with respect to the horizontal plane of the heat sink 12, the imaginary line is not resistant to cutting fluid or the like, Does not intersect with 9, 10, 11 This prevents the cutting fluid dripped from the lowermost end of the heat sink 12 in the vertical direction (actually, the region including the lowermost end and the vicinity thereof) from dropping onto the electronic components 8, 9, 10, 11. it can. In addition, the parts that are not resistant to the cutting fluid and the like are conceivable parts in which live parts such as chip resistance and IC are exposed and problems such as short circuit and disconnection are likely to occur due to the cutting fluid and the like.

  By bringing the heat sink 12 and the casing side surface of the housing component 1 close to or in contact with each other, water droplets flow from the heat sink 12 to the housing side surface, and the electronic components 8, 9, 10, 11 mounted on the ground side from the heat sink 12 are driven by the motor. Adhesion to other devices mounted on the ground side than the device 17 can be reduced.

  Here, the ground side will be supplementarily described. The meaning of “the electronic components 8, 9, 10, 11 mounted on the ground side from the heat sink 12” means that the motor driving device 17 having the heat sink 12 is installed in the high voltage board 16 in a normal posture. This means that the electronic components 8, 9, 10, and 11 are positioned on the lower side in the vertical direction with respect to the position of the heat sink 12. The same applies to other embodiments.

  The heat sink 12 may be an extruded product, a caulked product in which a thin fin is caulked to obtain a heat radiation area, or a joined product in which a thin fin is joined to the heat receiving material by brazing or soldering. Although considered, it is not limited to these. The heat sink 12 may be made of aluminum, an aluminum alloy, or a metal having a high thermal conductivity such as copper or a copper alloy, but is not limited thereto.

(Embodiment 2)
FIG. 2 is a diagram illustrating an internal structure of the motor driving device 17 according to the second embodiment. In the second embodiment, a plurality of heat sinks 12 and 14 are mounted on the power elements in order to cool the plurality of power elements 6 and 13 mounted on the printed circuit board 7, and the end portions of the heat sinks 12 and 14 are the power elements 6 and 14. 13 is inclined with respect to the vertical direction of the mounting surface. As a result, in the state where the motor drive device 17 is installed on the high-power panel 16 in a normal posture, the lower ends of the heat sinks 12 and 14 in the vertical direction are inclined with respect to the horizontal plane, as in the first embodiment. The lower end portion of the upper heat sink 12 may be horizontal with respect to the horizontal plane, and the heat sink 12 and the heat sink 14 may be close to or in contact with each other.

When a plurality of heat sinks 12, 14 are arranged vertically and mounted on the printed circuit board 7 via the power elements 6, 13, water drops that have flowed down from the upper heat sink 12 flow to the lower heat sink 14, and the lower heat sink 14 The adhesion to the electronic components 8, 9, 10, and 11 mounted on the ground side can be reduced. In addition, by bringing the heat sinks 12 and 14 and the housing side surfaces of the housing component 1 close to or in contact with each other, water droplets flow from the heat sinks 12 and 14 to the housing side surfaces of the housing component 1 and are mounted on the ground side from the heat sinks 12 and 14. Adhesion to the electronic components 8, 9, 10, and 11 can be reduced.

(Embodiment 3)
FIG. 3 is a diagram illustrating an internal structure of the motor driving device 17 according to the third embodiment. In the third embodiment, the end of the heat sink 15 for cooling the power element 6 mounted on the printed circuit board 7 is inclined in two directions with respect to the horizontal plane, and the apex of the inclination is located in the middle of the end side.
By shifting the top of the slope of the end of the heat sink 15 from the position of the electronic components 8, 9, 10, 11 mounted on the ground side, water droplets dripping from the heat sink 15 are transferred to the electronic components 8, 9, 10, 11. Adhesion can be reduced. Thus, the top of the inclination of the heat sink 15 can be determined freely.

(Embodiment 4)
FIG. 4 is a diagram for explaining an embodiment in which a part of the casing of the motor drive device is in contact with the high power board. In the fourth embodiment, a portion of the casing component 2 of the motor driving device 17 and the high power board 16 are in contact with each other, so that water droplets flowing out of the heat sink 12 are transmitted through the casing component 1 of the motor driving device 17 and are encased. By flowing to the body part 2 through the casing part 2 and flowing to the high power board 16, and flowing down through the high power board 16, water droplets adhere to the electronic device 18 mounted on the ground side of the motor drive device 17. Can be reduced.

DESCRIPTION OF SYMBOLS 1 Case component 2 Case component 3 Case component 4 Fan motor 5 Heat sink 6 Power element 7 Printed circuit board 8 Electronic component 9 Electronic component 10 Electronic component 11 Electronic component 12 Heat sink 13 Power element 14 Heat sink 15 Heat sink 16 Strong electric board 17 Motor drive Device 18 Electronic equipment

Claims (2)

A heat sink for cutting droplet countermeasures, an electronic component to which the heat sink for cutting droplet countermeasures is fixed and cooled by the heat sink for cutting droplet countermeasures, and an electronic device disposed below the heat sink for cutting fluid countermeasures A motor drive device having a component,
The heat sink for measures against cutting droplets is:
When the lower end of the vertical direction is inclined with respect to the horizontal plane, and the imaginary line is extended vertically downward from the lowermost end in the vertical direction of the end, the imaginary line falls below the cutting droplet. A motor driving device characterized by not intersecting with the electronic component disposed below the countermeasure heat sink . Claims wherein the cutting liquid drip measures heat sink, the ends of the mounting surface opposite of the electronic component to be cooled by the cutting liquid drip countermeasure heat sink, characterized in that in proximity to or in contact with said housing Item 2. The motor drive device according to Item 1.