JP2016140009A - Electronic component, vibration device, electronic device, and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which stabilizes a temperature of a vibration piece to improve the frequency stability.SOLUTION: An electronic component 100 includes: a vibration piece 20; a plate-like member 40 having a first reflection part 46; a heating body 30; and a container 10 housing the vibration piece 20, the plate-like member 40, and the heating body 30. The plate-like member 40 is disposed between the container 10 and the vibration piece 20. The first reflection part 46 is disposed so as to overlap with the vibration piece 20 in a plan view. An infrared ray reflective index of the first reflection part 46 is larger than an infrared ray reflection index of an area of the container 10 which overlaps with the first reflection part 46 in the plan view.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component, a vibration device, an electronic apparatus, and a moving body.

  A crystal oscillator is known as an electronic component used for a reference frequency signal source such as a communication device or a measuring instrument. In general, a crystal oscillator is required to have a stable output frequency with high accuracy with respect to a temperature change.

  A constant temperature crystal oscillator (OCXO: Oven Controlled Crystal Oscillator) is known as a crystal oscillator that can achieve extremely high frequency stability. OCXO is a crystal resonator housed in a thermostat controlled at a constant temperature.

  For example, Patent Document 1 includes a thermally conductive base, a heater element disposed on the thermally conductive base, and a resonator element (crystal resonator) disposed on the base via a clip. OCXO is disclosed. In the OCXO described in Patent Document 1, the heater element heats the base, and the vibration piece is heated by heat radiation (heat radiation) from the surface of the base or heat conduction through the base and the clip.

Special table 2001-500715 gazette

  In the OCXO of Patent Document 1, as described above, the resonator element can be heated by heat radiation and heat conduction from the substrate heated by the heater element. However, in the OCXO of Patent Document 1, since heat is radiated from the vibrating piece and escapes, there is a possibility that the temperature of the vibrating piece is not stabilized and the frequency stability is lowered.

  One of the objects according to some aspects of the present invention is to provide an electronic component that can stabilize the temperature of the resonator element and improve the frequency stability. Another object of some aspects of the present invention is to provide a vibration device, an electronic apparatus, and a moving body including the electronic component.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The electronic component according to this application example is
A vibrating piece,
A member having a first reflecting portion;
A heating element;
A container in which the resonator element, the member, and the heating element are accommodated;
Including
The member is disposed between the container and the vibrating piece,
The first reflecting portion is disposed so as to overlap the vibrating piece in plan view,
The infrared reflectance of the first reflecting portion is larger than the infrared reflectance of the region of the container overlapping the first reflecting portion in plan view.

  In such an electronic component, since the heat (infrared rays) radiated from the vibrating piece is reflected by the first reflecting portion and returns to the vibrating piece, the temperature of the vibrating piece can be stabilized and the frequency stability can be improved. be able to.

[Application Example 2]
The electronic component according to this application example is
A vibrating piece,
A first electronic element;
A member having a first reflecting portion;
A heating element;
A container in which the resonator element, the first electronic element, the member, and the heating element are accommodated;
Including
The member is disposed between the first electronic element and the vibrating piece,
The first reflecting portion is arranged so as to overlap the vibrating piece in a plan view and to overlap the first electronic element in a plan view,
The infrared reflectance of the first reflecting portion is greater than the infrared reflectance of the first electronic element.

  In such an electronic component, since at least a part of the heat (infrared ray) radiated from the vibrating piece is reflected by the first reflecting portion and returns to the vibrating piece, the temperature of the vibrating piece can be stabilized and the frequency can be stabilized. The degree can be improved.

[Application Example 3]
In the electronic component according to this application example,
The vibrating piece may be disposed within an outer periphery of the first reflecting portion in plan view.

  In such an electronic component, since the resonator element is disposed within the outer periphery of the first reflecting portion in plan view, the heat (infrared ray) radiated from the resonator element is reflected by the first reflecting portion. It can be returned to the resonator element, and the temperature of the resonator element can be made more stable.

[Application Example 4]
In the electronic component according to this application example,
The member has a portion mainly composed of silicon oxide,
The first reflective portion may be made of a metal of any one of Au, Ag, Cu, and Al, or an alloy mainly containing any of Au, Ag, Cu, and Al.

  In such an electronic component, the infrared reflectance of the first reflecting portion can be increased.

[Application Example 5]
In the electronic component according to this application example,
On the surface of the container that faces the surface opposite to the surface on which the member of the vibrating piece is disposed, a second reflecting portion is disposed.
The infrared reflectance of the second reflecting part may be larger than the infrared reflectance of the container.

In such an electronic component, since the heat radiated from the vibrating piece is reflected by the first reflecting portion and the second reflecting portion and returns to the vibrating piece, the temperature of the vibrating piece can be further stabilized, and the frequency stability Can be further improved.

[Application Example 6]
The vibration device according to this application example is
One of the above electronic components,
A second electronic element disposed outside the container;
A wiring board;
A support part for connecting the wiring board and the container;
including.

  Since such a vibration device includes any one of the electronic components described above, the frequency stability can be improved. Further, in such a vibration device, since the wiring board and the container are connected by the support portion, for example, compared to the case where the container is directly connected to the wiring board, the heat escaping from the container can be reduced. it can. Therefore, in such a vibrating device, the temperature of the resonator element can be stabilized and the frequency stability can be improved.

[Application Example 7]
The electronic device according to this application example is
The electronic component according to any of the above, or a vibration device.

  Since such an electronic device includes any one of the electronic components or the vibration device described above, the frequency stability can be improved.

[Application Example 8]
The mobile object according to this application example is
The electronic component according to any of the above, or a vibration device.

  Since such a moving body includes any of the electronic components or the vibration device described above, the frequency stability can be improved.

Sectional drawing which shows the electronic component which concerns on 1st Embodiment typically. The top view which shows typically the electronic component which concerns on 1st Embodiment. Sectional drawing which shows typically the electronic component which concerns on 2nd Embodiment. The top view which shows typically the electronic component which concerns on 2nd Embodiment. Sectional drawing which shows typically the electronic component which concerns on 3rd Embodiment. Sectional drawing which shows typically the vibration device which concerns on 4th Embodiment. The functional block diagram of the electronic device which concerns on 5th Embodiment. The figure which shows an example of the mobile body which concerns on 6th Embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. First Embodiment First, an electronic component according to a first embodiment will be described with reference to the drawings. FIG.
1 is a cross-sectional view schematically showing an electronic component 100 according to a first embodiment. FIG. 2 is a plan view schematically showing the electronic component 100 according to the first embodiment. 1 is a cross-sectional view taken along the line II of FIG. In the following description, the upper side in FIG. 1 is described as “upper”, and the lower side is described as “lower”. Further, the upper surface of each member in FIG. 1 will be described as “upper surface”, and the lower surface will be described as “lower surface”.

  As shown in FIGS. 1 and 2, the electronic component 100 includes a container 10, a vibrating piece 20, a heating element 30, and a plate-like member 40 as an example of a member having a first reflecting portion.

  As shown in FIGS. 1 and 2, the container 10 contains a vibrating piece 20, a heating element 30, and a plate-like member 40. The container 10 may house other members that constitute the electronic component 100. The container 10 includes a substrate 12 and a lid 14. In FIG. 2, the lid 14 is not shown for convenience.

  The substrate 12 is, for example, a ceramic package. In the illustrated example, the substrate 12 is a ceramic laminated package formed by forming and laminating ceramic green sheets and then firing them. The substrate 12 has a recess, and the resonator element 20, the heating element 30, and the plate member 40 are accommodated in a space (accommodating chamber) 16 in the recess. In the example shown in the figure, an opening is provided in the upper part of the substrate 12, and the opening 16 is covered with a lid 14 to form a storage chamber 16. The storage chamber 16 is, for example, a reduced pressure atmosphere (vacuum state). Note that the storage chamber 16 may be an inert gas atmosphere such as nitrogen, argon, or helium.

  Although not shown, the substrate 12 is provided with electrodes that are electrically connected to the excitation electrodes 24 a and 24 b of the resonator element 20 and electrodes that are electrically connected to the heating element 30. Although not shown, a power supply terminal, a ground terminal, and other external terminals are provided on the lower surface of the substrate 12, and the power supply terminal, the ground terminal, the heating element 30, and the like are provided inside or on the surface of the substrate 12. Wiring for electrically connecting the electrodes and other external terminals and the wiring for electrically connecting the resonator element 20 are also provided.

  The lid 14 covers the opening of the substrate 12. The shape of the lid 14 is, for example, a plate shape. As the lid 14, for example, a plate member (for example, a ceramic plate) made of the same material as the substrate 12 or a metal plate such as Kovar, 42 alloy, stainless steel, or the like can be used. The lid 14 is connected to the substrate 12 via a connecting member 18 such as a seal ring, low melting point glass, or adhesive.

  The resonator element 20 is mounted (arranged) on the substrate 12. In the illustrated example, the resonator element 20 is disposed on the substrate 12 via a pad (land) 56, the heating element 30, the connection member 52, the plate-like member 40, and the connection member 50. The vibrating piece 20 is connected to the plate-like member 40 by a connecting member 50. In the illustrated example, the resonator element 20 is supported at one point by the connection member 50. The connection member 50 is preferably made of a material having conductivity and high thermal conductivity. The material of the connection member 50 is, for example, silver paste, solder, conductive adhesive (adhesive in which conductive fillers such as metal particles are dispersed in a resin material), or the like.

  The resonator element 20 is an element whose output frequency has temperature characteristics. In the illustrated example, the resonator element 20 includes a quartz substrate 22 and excitation electrodes 24a and 24b. The quartz substrate 22 is, for example, an SC cut quartz substrate having a circular planar shape. The quartz substrate 22 may have a rectangular planar shape.

  The first excitation electrode 24a and the second excitation electrode 24b are provided with the quartz crystal substrate 22 interposed therebetween. The excitation electrodes 24 a and 24 b apply a voltage to the quartz substrate 22 to vibrate the quartz substrate 22.

  The first excitation electrode 24 a is provided on the upper surface of the crystal substrate 22. The planar shape of the first excitation electrode 24a is, for example, a circle. The first excitation electrode 24 a is electrically connected to an electrode (not shown) provided on the substrate 12 through an extraction electrode 25 a provided on the upper surface of the quartz substrate 22 and a bonding wire 60. . In FIG. 2, the bonding wire 60 and bonding wires 62 and 64 described later are not shown for convenience.

  The second excitation electrode 24 b is provided on the lower surface of the crystal substrate 22. The planar shape of the second excitation electrode 24b is the same as the planar shape of the first excitation electrode 24a. The second excitation electrode 24 b includes an extraction electrode 25 b provided on the lower surface of the quartz substrate 22, a connection member 50, a plate-like member 40 (second layer 44), a connection member 52, and a wiring 54 provided on the heating element 30. And an electrode (not shown) provided on the substrate 12 through the bonding wire 62. The planar shape of the first excitation electrode 24a and the second excitation electrode 24b is not limited to a circle, and may be a circle, an ellipse, a rectangle, or a polygon.

  As the excitation electrodes 24a and 24b and the extraction electrodes 25a and 25b, for example, those obtained by laminating chromium and gold in this order from the quartz substrate 22 side are used.

  The heating element 30 is accommodated in the container 10. Thereby, compared with the case where the heat generating body 30 is arrange | positioned outside the container 10, the vibration piece 20 can be heated efficiently and reduction in power consumption can be achieved. Moreover, the apparatus can be reduced in size. The heating element 30 is disposed (mounted) on the substrate 12. In the illustrated example, the heating element 30 is arranged on the upper surface of the fourth layer from the bottom of the seven layers constituting the substrate 12. The heating element 30 is disposed on the substrate 12 via a pad (land) 56. The heating element 30 is electrically connected to an electrode (not shown) provided on the substrate 12 via a bonding wire 64.

  The heating element 30 is, for example, a heating IC. The heat generation IC includes, for example, a heat generation circuit and a temperature sensor. The heating circuit is a circuit that generates heat when a current flows through a resistor. The heat generating circuit may be an element that generates heat when power is input, such as a power transistor. The temperature sensor is installed close to the vibrating piece 20 and outputs a signal corresponding to the temperature. The temperature sensor is composed of, for example, a diode or a thermistor.

  The plate member 40 is disposed between the container 10 and the vibrating piece 20. In the illustrated example, the plate-like member 40 is disposed between the substrate 12 (the inner bottom surface of the substrate 12) and the vibrating piece 20. The plate-like member 40 is disposed so as to face the vibrating piece 20. In the illustrated example, the upper surface of the plate-like member 40 and the lower surface of the resonator element 20 face each other (oppose each other). A gap (gap) is provided between the plate-like member 40 and the resonator element 20, and a connection member 50 is interposed. That is, the plate-like member 40 and the vibrating piece 20 are not in contact with each other. A gap is provided between the plate-like member 40 and the substrate 12 (container 10). That is, the plate-like member 40 and the substrate 12 (container 10) are not in contact.

  As will be described later, the plate-like member 40 functions as a reflecting portion 46 as an example of a first reflecting portion that reflects heat from the vibrating piece 20 and a heat storage member, and therefore is disposed in the vicinity of the vibrating piece 20. Is desirable. In the illustrated example, only the connection member 50 is disposed between the plate-like member 40 and the vibrating piece 20. That is, the distance between the plate-like member 40 and the vibrating piece 20 is substantially the same as the thickness (height) of the connection member 50. Note that other components such as an electronic element may be disposed between the plate-like member 40 and the vibrating piece 20. That is, the plate-like member 40 may have a function as a mounting plate on which an electronic element or the like is mounted.

  The plate-like member 40 is disposed on the heating element 30 via the connection member 52. The plate member 40 is connected to the heating element 30 by a connecting member 52. In the illustrated example, the plate-like member 40 is supported at one point by the connection member 52. The connection member 52 is preferably made of a material having electrical conductivity and high thermal conductivity. The material of the connection member 52 is, for example, silver paste, solder, conductive adhesive, or the like. The planar shape of the plate-like member 40 is, for example, a circle. In addition, the planar shape of the plate-like member 40 is not particularly limited, and may be a rectangle, a polygon, an ellipse, or the like. Further, in the present embodiment, the plate-like member 40 is used as an example of the member having the first reflecting portion. However, the member having the first reflecting portion only needs to be plate-like in plan view. The three-dimensional shape of the member having a portion is not limited.

  The plate-shaped member 40 has a first layer 42 and a second layer 44. The first layer 42 includes, for example, silicon oxide as a main component. When the first layer 42 has silicon oxide as a main component, the subcomponent may be, for example, a metal or a nonmetal. The first layer 42 is, for example, quartz. When the first layer 42 is made of quartz, the first layer 42 is made of the same material as the quartz substrate 22 of the vibrating piece 20, and the first layer 42 of the plate member 40 and the quartz substrate 22 of the vibrating piece 20 have the same linear expansion coefficient. It will have. Therefore, although not illustrated, for example, even if the vibrating piece 20 is supported on the plate-like member 40 at multiple points, the possibility that the connection between the plate-like member 40 and the vibrating piece 20 is broken when a temperature change occurs is reduced. be able to.

  The second layer 44 is formed on the first layer 42. The second layer 44 can reflect heat (infrared rays) radiated from the vibrating piece 20. In other words, the second layer 44 functions as the reflecting portion 46 that reflects the heat (infrared rays) radiated from the vibrating piece 20 and returns it to the vibrating piece 20. Infrared rays refer to electromagnetic waves having a wavelength of 0.7 μm or more and 1000 μm or less.

  In the illustrated example, the second layer 44 covers the entire surface of the first layer 42, and the second layer disposed on the surface (the upper surface of the first layer 42) 43 a of the first layer 42 facing the vibrating element 20 side. 44 functions as the reflection portion 46. The second layer 44 may be disposed only on the upper surface 43a of the first layer 42. When the first layer 42 is a member transparent to infrared rays, the second layer 44 may be disposed only on the lower surface 43b (the surface opposite to the upper surface 43a) of the first layer 42. . The reflection part 46 and the lower surface of the resonator element 20 face each other (oppose each other).

  The reflecting portion 46 is disposed so as to overlap the vibrating piece 20 in plan view (as viewed from the thickness direction of the vibrating piece 20). The resonator element 20 is disposed within the outer periphery of the reflecting portion 46 in plan view. Note that the vibration piece 20 is disposed within the outer periphery of the reflection portion 46 in a plan view, that the entire outer periphery of the vibration piece 20 is inside the reflection portion 46 in a plan view, A part of the outer periphery overlaps with a part of the outer periphery of the reflecting portion 46 in plan view, and another part of the outer periphery of the vibrating piece 20 is inside the reflecting portion 46 in plan view, and the outer periphery of the vibrating piece 20 In the plan view and the region inside the outer periphery of the resonator element 20 is inside the outer periphery of the reflecting portion 46 (see FIG. 2).

The material of the second layer 44 is preferably a material having a high reflectance with respect to infrared rays. Specifically, the material of the second layer 44 is, for example, Au (0.98), Ag (0.97 to 0.98 (pure polished silver)), Cu (0.93 (industrial polish) Copper)), Al (0.94 to 0.96 (polished surface)), or an alloy mainly composed of Au, Ag, Cu, or Al. In addition, the numerical value in a parenthesis has shown the reflectance with respect to 8-14 micrometers electromagnetic wave of each element. In the case where the material of the second layer 44 is an alloy mainly containing any one of Au, Ag, Cu, and Al, the subcomponent is, for example, a metal other than the main component. The second layer 44 is formed by, for example, plating, sputtering, or vacuum deposition. When the first layer 42 is made of quartz and the second layer 44 is made of Au, Cr or Ni may be used as the underlayer. In other words, the second layer 44 made of Au may be formed on the first layer 42 through a base layer made of Cr or Ni.

  The infrared reflectance of the reflecting portion 46 is larger than the infrared reflectance of the region 13 (region shown by hatching in FIG. 2) of the substrate 12 overlapping the reflecting portion 46 in plan view. In the electronic component 100, at least a part of the infrared rays emitted from the vibrating piece 20 toward the region 13 of the substrate 12 can be reflected by the reflecting portion 46 and returned to the vibrating piece 20. That is, the reflecting portion 46 is disposed between the resonator element 20 and the region 13 of the substrate 12.

  Here, the reflectance of infrared rays is determined by irradiating a measurement object with electromagnetic waves (infrared rays) of a predetermined wavelength, measuring the electromagnetic waves reflected from the measurement objects, and the intensity of the incident electromagnetic waves and the intensity of the reflected electromagnetic waves. It can be measured by taking the ratio. For example, when the measurement object is made of the same material, the reflectance of the measurement object can be obtained by measuring in a plurality of regions with different measurement objects and taking the average. Further, when the measurement target is composed of a plurality of members made of different materials, the reflectance of the measurement target can be obtained by measuring the whole measurement target and taking the average. The measurement of the whole measurement object is performed, for example, by measuring each region by dividing the measurement object at equal intervals. By such a measuring method, the infrared reflectance of the reflecting portion 46 and the infrared reflectance of the region 13 of the substrate 12 can be measured. This infrared reflectance measurement method is the same in the embodiments described later.

  The plate-like member 40 can store heat. That is, the plate-like member 40 can function as a heat storage member. For example, when the heat capacity of the vibration piece 20 alone and the heat capacity of the vibration piece 20 and the plate-like member 40 connected by the connection member 50 are compared, the vibration piece 20 and the plate-like member 40 are connected by the connection member 50. The heat capacity of what has been increased. Therefore, in the electronic component 100, for example, even when the outside air temperature changes suddenly, the frequency of the vibration piece 20 does not change abruptly as compared with the case where only the vibration piece 20 is accommodated in the container 10. Variations can be reduced.

  The heat capacity of the plate member 40 is, for example, not less than 0.5 times and not more than 2 times the heat capacity of the vibrating piece 20. Thereby, while the plate-shaped member 40 functions as a heat storage member, the rise time (time until the inside of the container 10 becomes a constant temperature) as an oscillator is comparable to the conventional structure (when there is no plate-shaped member). It can be. For example, when the material and the planar shape of the plate-like member 40 (first layer 42) are the same as the material and the planar shape of the resonator element 20 (quartz substrate 22), the thickness of the plate-like member 40 (first layer 42). Is 0.5 to 2 times the thickness of the vibrating piece 20 (quartz substrate 22), so that the heat capacity of the plate member 40 is 0.5 to 2 times the heat capacity of the vibrating piece 20. be able to.

  In the electronic component 100, the heat generated in the heating element 30 is transmitted to the resonator element 20 through the wiring 54, the connection member 52, the plate-like member 40, and the connection member 50 by heat conduction. At this time, the plate-like member 40 is easy to conduct heat because the second layer 44 is made of the metal exemplified above. Thus, the heat generated in the heating element 30 is transmitted to the vibrating piece 20 by heat conduction, and the vibrating piece 20 is heated. In addition, when the second layer 44 of the plate-like member 40 is heated by the heating element 30, the resonator element 20 is also heated by radiation (radiation) from the second layer 44.

  Here, when the vibrating piece 20 is heated, the thermal energy of the vibrating piece 20 is radiated as infrared rays. In the electronic component 100, the infrared rays radiated from the vibrating piece 20 can be reflected by the reflecting portion 46 and returned to the vibrating piece 20 again. Therefore, in the electronic component 100, the influence of the temperature decrease due to the radiation of the vibrating piece 20 can be reduced.

  The electronic component 100 has the following features, for example.

  In the electronic component 100, the plate-like member 40 is disposed between the container 10 (substrate 12) and the vibrating piece 20, and the reflecting portion 46 is disposed so as to overlap the vibrating piece 20 in plan view. The infrared reflectance is larger than the infrared reflectance of the region 13 of the container 10 (substrate 12) that overlaps the reflecting portion 46 in plan view. Therefore, as described above, since at least a part of the heat radiated from the vibrating piece 20 is reflected by the reflecting portion 46 and returns to the vibrating piece 20, for example, the heat (infrared ray) radiated from the vibrating piece 20 is plate-shaped. Compared with the case where the region 13 of the substrate 12 is irradiated without the member 40, the temperature of the resonator element 20 can be stabilized, and the frequency stability can be improved.

  In the electronic component 100, the resonator element 20 is disposed within the outer periphery of the reflecting portion 46 in plan view. Therefore, at least a part of the heat (infrared ray) radiated from the vibrating piece 20 can be returned to the vibrating piece 20 by being reflected by the reflecting portion 46, and the temperature of the vibrating piece 20 can be made more stable. it can.

  As shown in FIG. 1, in the electronic component 100, the heat generated by the heating element 30 is transmitted to the vibrating piece 20 via the connection member 50. Therefore, heat is not easily transmitted to the end portion 26 (the end portion on the free end side) opposite to the side connected by the connection member 50 of the resonator element 20. Further, the end portion 26 of the vibrating piece 20 is not provided with the electrodes 24a, 24b, 25a, 25b, and the quartz substrate 22 is exposed. Therefore, heat is easily radiated from the end portion 26 of the resonator element 20 as compared to the portion where the electrodes 24a, 24b, 25a, and 25b are formed. For this reason, for example, in an electronic component that is not provided with a reflecting portion, the temperature of the end of the vibrating piece tends to decrease, and the temperature distribution of the vibrating piece can be biased. On the other hand, in the electronic component 100, the heat radiated from the end portion 26 of the vibrating piece 20 is reflected by arranging the reflecting portion 46 so as to overlap the end portion 26 of the vibrating piece 20 in plan view. It can be returned to the end portion 26 of the vibrating piece 20. As a result, the temperature drop of the end portion 26 of the vibrating piece 20 can be reduced, and the temperature distribution bias of the vibrating piece 20 can be reduced.

2. Second Embodiment Next, an electronic component according to a second embodiment will be described with reference to the drawings. FIG. 3 is a cross-sectional view schematically showing an electronic component 200 according to the second embodiment. FIG. 4 is a plan view schematically showing the electronic component 200 according to the second embodiment. 3 is a cross-sectional view taken along line III-III in FIG. Hereinafter, in the electronic component 200 according to the second embodiment, members having the same functions as the constituent members of the electronic component 100 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the following description, the upper side in FIG. 3 is described as “upper”, and the lower side is described as “lower”. Also, the upper surface of each member in FIG. 3 will be described as “upper surface”, and the lower surface will be described as “lower surface”.

  As shown in FIGS. 3 and 4, the electronic component 200 includes an electronic element 210 (first electronic element).

  The electronic element 210 is accommodated in the container 10. The electronic element 210 is disposed (mounted) on the substrate 12. In the illustrated example, the electronic element 210 is disposed on the upper surface of the second layer from the bottom of the seven layers constituting the substrate 12. The electronic element 210 is disposed on the inner bottom surface of the concave portion of the substrate 12. The electronic element 210 is connected to the substrate 12 with an adhesive (not shown) or the like. The electronic element 210 has a plurality of electrode pads (not shown) provided on the upper surface of the electronic element 210. Each electrode pad provided on the upper surface of the electronic element 210 and each electrode provided on the substrate 12 are electrically connected via a bonding wire 66.

The electronic element 210 is, for example, an oscillation IC. The oscillation IC includes, for example, an oscillation circuit and a temperature control circuit.

  The oscillation circuit is a circuit for oscillating the resonator element 20 by being connected to both ends of the resonator element 20 and amplifying the signal output from the resonator element 20 and feeding it back to the resonator element 20. The circuit composed of the resonator element 20 and the oscillation circuit may be various oscillation circuits such as a Pierce oscillation circuit, an inverter type oscillation circuit, a Colpitts oscillation circuit, and a Hartley oscillation circuit.

  The temperature control circuit is a circuit for controlling the amount of current flowing through the resistance of the heat generating circuit based on the output signal (temperature information) of the temperature sensor to keep the resonator element 20 at a constant temperature. For example, when the current temperature determined from the output signal of the temperature sensor is lower than the set reference temperature, the temperature control circuit passes a desired current through the resistor, and the current temperature is higher than the reference temperature. In such a case, control is performed so that no current flows through the resistor. Further, for example, the temperature control circuit may perform control so as to increase or decrease the amount of current flowing through the resistor in accordance with the difference between the current temperature and the reference temperature.

  In the electronic component 200, the reflecting portion 46 is disposed between the electronic element 210 and the vibrating piece 20. The reflecting portion 46 is disposed so as to overlap with the resonator element 20 in plan view and to overlap with the electronic element 210 in plan view. The vibrating piece 20 and the electronic element 210 are disposed within the outer periphery of the reflecting portion 46 in plan view.

  Note that the electronic element 210 is disposed within the outer periphery of the reflecting portion 46 in a plan view when the entire outer periphery of the electronic element 210 is inside the reflecting portion 46 in a plan view. A part of the outer periphery overlaps with a part of the outer periphery of the reflecting part 46 in plan view, and another part of the outer periphery of the electronic element 210 is inside the reflecting part 46 in plan view, and the outer periphery of the electronic element 210 In the plan view and the region inside the outer periphery of the electronic element 210 is inside the outer periphery of the reflecting portion 46 (see FIG. 4).

  In the illustrated example, both the vibrating piece 20 and the electronic element 210 are disposed within the outer periphery of the reflecting portion 46 in plan view, but only the vibrating piece 20 is disposed within the outer periphery of the reflecting portion 46 in plan view. Also good.

  The infrared reflectance of the reflecting portion 46 is larger than the infrared reflectance of the electronic element 210. Here, the infrared reflectance of the electronic element 210 is the reflectance of the infrared ray in a region facing the vibrating piece 20 of the electronic element 210 and overlapping the reflecting portion 46 in plan view.

  The electronic component 200 has the following features, for example.

  In the electronic component 200, the plate-like member 40 is disposed between the electronic element 210 and the vibrating piece 20, and the reflecting portion 46 is disposed so as to overlap the vibrating piece 20 in a plan view and to overlap the electronic element 210 in a plan view. The infrared reflectance of the reflecting portion 46 is larger than the infrared reflectance of the electronic element 210. Therefore, since the heat radiated from the vibrating piece 20 is reflected by the reflecting portion 46 and returns to the vibrating piece 20, for example, compared to the case where the heat (infrared ray) radiated from the vibrating piece 20 is applied to the electronic element 210, The temperature of the resonator element 20 can be stabilized, and the frequency stability can be improved.

  In the electronic component 200, the resonator element 20 is disposed within the outer periphery of the reflecting portion 46 in plan view. Therefore, at least a part of the heat (infrared ray) radiated from the vibrating piece 20 can be returned to the vibrating piece 20 by being reflected by the reflecting portion 46, and the temperature of the vibrating piece 20 can be made more stable. it can.

3. Third Embodiment Next, an electronic component according to a third embodiment will be described with reference to the drawings. FIG. 5 is a cross-sectional view schematically showing an electronic component 300 according to the third embodiment. Hereinafter, in the electronic component 300 according to the third embodiment, members having the same functions as the constituent members of the electronic component 200 according to the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the following description, the upper side in FIG. 5 is described as “upper” and the lower side is described as “lower”. Further, the upper surface of each member in FIG. 5 will be described as “upper surface”, and the lower surface will be described as “lower surface”.

  As shown in FIG. 5, the electronic component 300 includes a second reflecting portion 310 in addition to the reflecting portion 46 (hereinafter, also referred to as “first reflecting portion 46”) configured by the second layer 44 of the plate-like member 40. It is comprised including.

  The second reflecting portion 310 is disposed between the container 10 (the lid 14) and the vibrating piece 20. The second reflecting portion 310 faces the surface of the container 10 facing the upper surface of the vibrating piece 20 (the surface opposite to the surface on which the plate-like member 40 is disposed), that is, in the illustrated example, the lower surface ( It is disposed on the surface defining the storage chamber 16. In the illustrated example, the second reflecting portion 310 is formed on the entire lower surface of the lid 14.

  In the electronic component 300, the resonator element 20 is disposed between the first reflecting portion 46 and the second reflecting portion 310. Gaps are provided between the second reflecting portion 310 and the vibrating piece 20 and between the vibrating piece 20 and the first reflecting portion 46, respectively. The first reflecting portion 46 and the second reflecting portion 310 are disposed facing the vibrating piece 20. That is, in the electronic component 300, the upper surface of the vibrating piece 20 and the second reflecting portion 310 face each other (opposite), and the lower surface of the vibrating piece 20 and the first reflecting portion 46 face each other (oppose each other). ).

  The second reflecting portion 310 is disposed so as to overlap the vibrating piece 20 in plan view. The resonator element 20 is disposed within the outer periphery of the second reflecting portion 310 in plan view. In addition, the vibration piece 20 is disposed within the outer periphery of the second reflection unit 310 in plan view, and the case where the entire outer periphery of the vibration piece 20 is inside the second reflection unit 310 in plan view. A part of the outer periphery of the resonator element 20 overlaps with a part of the outer periphery of the second reflecting part 310 in plan view, and the other part of the outer periphery of the resonator element 20 is inside the second reflecting part 310 in plan view. A case where the entire outer periphery of the resonator element 20 overlaps with the outer periphery of the second reflecting portion 310 in plan view, and a region inside the outer periphery of the resonator element 20 is inside the outer periphery of the second reflecting portion 310, and including.

  The material of the second reflecting part 310 is preferably a material having a high reflectance with respect to infrared rays. Specifically, as the material of the second reflecting portion 310, for example, the material exemplified as the material of the first reflecting portion 46 can be used. The second reflecting portion 310 is formed by, for example, plating, sputtering, or vacuum deposition. The second reflecting portion 310 may be, for example, a gold plating film formed by plating the lid 14 with gold.

  The infrared reflectance of the second reflecting portion 310 is larger than the infrared reflectance of the lid 14. Here, the infrared reflectance of the lid 14 is the reflectance of the infrared ray in the region of the lid 14 facing the vibrating piece 20 (the lower surface of the lid 14) and overlapping the second reflecting portion 310 in plan view. .

  In the electronic component 300, at least a part of infrared rays emitted from the vibrating piece 20 can be reflected by the first reflecting portion 46 and the second reflecting portion 310 and returned to the vibrating piece 20 again. Therefore, in the electronic component 300, the influence of the temperature drop due to the radiation of the vibrating piece 20 can be further reduced.

  The electronic component 300 has the following features, for example.

  In the electronic component 300, the second reflecting portion 310 is disposed on the lower surface of the lid 14, and the infrared reflectance of the second reflecting portion 310 is larger than the infrared reflectance of the lid 14. Therefore, at least a part of the heat radiated from the vibrating piece 20 is reflected by the second reflecting portion 310 and returns to the vibrating piece 20, so that the lid 14 is irradiated with heat (infrared rays) radiated from the vibrating piece 20, for example. Compared to the case, the temperature of the resonator element 20 can be stabilized, and the frequency stability can be improved.

  Further, in the electronic component 300, since the resonator element 20 is disposed between the first reflecting portion 46 and the second reflecting portion 310, for example, when only the first reflecting portion 46 is disposed (see FIGS. 1 and 3). ), The temperature of the resonator element 20 can be made more stable, and the frequency stability can be further improved.

4). Fourth Embodiment Next, a vibrating device according to a fourth embodiment will be described with reference to the drawings. FIG. 6 is a cross-sectional view schematically showing a vibrating device 400 according to the fourth embodiment.

  Hereinafter, an example in which the vibration device 400 is an oven-controlled crystal oscillator (OCXO) will be described, but the vibration device according to the present invention is another type of vibration device including a resonator element, a heating element, a container, and a plate-like member. For example, an oscillator other than OCXO, an inertial sensor (acceleration sensor, gyro sensor, etc.) that is a sensor for detecting a physical quantity, a force sensor (tilt sensor), or the like may be used.

  The vibration device 400 includes the electronic component according to the present invention. Below, a vibration device provided with the electronic component 200 is demonstrated as an electronic component which concerns on this invention. As shown in FIG. 6, the vibration device 400 includes an electronic component 200 including a container 10 (hereinafter also referred to as “first container 10”), a second container 410, a support portion (lead frame) 420, and an electronic element. 430 (second electronic element). In the following description, the upper side in FIG. 6 is described as “upper” and the lower side is described as “lower”. Moreover, the upper surface of each member in FIG. 6 will be described as “upper surface”, and the lower surface will be described as “lower surface”.

  The second container 410 accommodates the electronic component 200, the support part 420, and the electronic element 430. In the illustrated example, the second container 410 includes a wiring board 412 and a cap 414. In the space 416 formed by the cap 414 that is put on the wiring board 412, the electronic component 200, the support portion 420, and An electronic element 430 is accommodated. The space 416 inside the second container 410 is, for example, a reduced pressure atmosphere (vacuum state). Note that the space 416 may be an inert gas atmosphere such as nitrogen, argon, or helium. The space 416 may not be hermetically sealed.

  The material of the wiring board 412 is, for example, glass epoxy resin, ceramics, or the like. External connection terminals (not shown) are provided on the lower surface of the wiring board 412. The external connection terminals are electrically connected to the electronic component 200 and the electronic element 430 through wiring (not shown) provided on the wiring board 412 and a support portion (lead frame) 420.

  The cap 414 is connected to the wiring substrate 412 by a connection member (not shown) such as solder. The material of the cap 414 is preferably a material having a low thermal conductivity. For example, an iron-based alloy having a low thermal conductivity such as 42 alloy (iron-nickel alloy) plated with nickel can be used. Note that as the material of the cap 414, resin, other metals, or the like may be used.

  The support part (lead frame) 420 supports the first container 10 (electronic component 200). The electronic component 200 is disposed on the wiring board 412 via the support part 420. That is, the electronic component 200 is not in contact with the wiring board 412.

  The support part 420 also functions as a wiring for electrically connecting the electronic component 200 and the electronic element 430 and an external connection terminal provided on the wiring board 412. As a material of the support part 420, a material having conductivity and low thermal conductivity is desirable. For example, the support 420 may be made of a nickel alloy plated iron alloy having a low thermal conductivity such as 42 alloy (iron nickel alloy). Note that other metal may be used as the support portion 420.

  The electronic element 430 is disposed outside the first container 10. The electronic element 430 is disposed on the lower surface of the electronic component 200 (the lower surface of the substrate 12). Thereby, even when the outside air temperature changes rapidly, the influence can be reduced, and the temperature of the electronic element 430 can be stabilized. In the illustrated example, the vibration device 400 includes a plurality of electronic elements 430.

  The electronic element 430 is a circuit component that constitutes a circuit (an oscillation circuit, a temperature control circuit, etc.) together with the electronic element 210 accommodated in the first container 10. Specifically, the electronic element 430 is a resistance element, a capacitor element, an inductor element, or the like. Although not illustrated, the electronic element 430 may be disposed on the wiring substrate 412.

  For example, the vibration device 400 has the following features.

  Since the vibration device 400 includes the electronic component 200, the frequency stability can be improved.

  In the vibration device 400, the support unit 420 connects the wiring substrate 412 and the first container 10. Therefore, in the vibration device 400, for example, the heat escaping from the first container 10 can be reduced as compared with the case where the first container 10 is directly connected to the wiring board 412. Therefore, the temperature of the resonator element 20 and the electronic element 210 accommodated in the first container 10 can be stabilized, and the frequency stability can be improved.

5. Fifth Embodiment Next, an electronic apparatus according to a fifth embodiment will be described with reference to the drawings. FIG. 7 is a functional block diagram of an electronic apparatus according to the fifth embodiment.

  The electronic device 1000 includes an electronic component according to the present invention. Here, as shown in FIG. 7, the case where the electronic component 200 is used as an electronic component according to the present invention will be described.

  The electronic device 1000 further includes a CPU (Central Processing Unit) 1020, an operation unit 1030, a ROM (Read Only Memory) 1040, a RAM (Random Access Memory) 1050, a communication unit 1060, and a display unit 1070. Note that the electronic device of the present embodiment may have a configuration in which some of the components (each unit) in FIG. 7 are omitted or changed, or other components are added.

  The electronic component 200 generates an oscillation signal based on the oscillation of the resonator element heated by the heating element. This oscillation signal is output to the CPU 1020.

The CPU 1020 follows the programs stored in the ROM 1040 and the electronic component 2
Various calculation processes and control processes are performed using the oscillation signal input from 00 as a clock signal. Specifically, the CPU 1020 performs various processes according to operation signals from the operation unit 1030, processes for controlling the communication unit 1060 to perform data communication with an external device, and displays various types of information on the display unit 1070. The process of transmitting the display signal is performed.

  The operation unit 1030 is an input device including operation keys, button switches, and the like, and outputs an operation signal corresponding to an operation by the user to the CPU 1020.

  The ROM 1040 stores programs, data, and the like for the CPU 1020 to perform various calculation processes and control processes.

  The RAM 1050 is used as a work area of the CPU 1020, and temporarily stores programs and data read from the ROM 1040, data input from the operation unit 1030, calculation results executed by the CPU 1020 according to various programs, and the like.

  The communication unit 1060 performs various controls for establishing data communication between the CPU 1020 and the external device.

  The display unit 1070 is a display device configured by an LCD (Liquid Crystal Display) or the like, and displays various information based on a display signal input from the CPU 1020. The display unit 1070 may be provided with a touch panel that functions as the operation unit 1030.

  Since the electronic device 1000 includes the electronic component 200, the electronic device 1000 can have high frequency stability.

  Various electronic devices can be considered as such an electronic device 1000, for example, personal computers (for example, mobile personal computers, laptop personal computers, tablet personal computers), mobile terminals such as smartphones and mobile phones, Digital cameras, inkjet discharge devices (for example, inkjet printers), storage area network devices such as routers and switches, local area network devices, mobile terminal base station devices, televisions, video cameras, video recorders, car navigation devices, real time Clock devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game machines, game controllers, word processors, word processors Station, video phone, TV monitor for crime prevention, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various types Measurement equipment, instruments (for example, vehicle, aircraft, ship instruments), flight simulator, head mounted display, motion trace, motion tracking, motion controller, PDR (pedestrian position measurement), and the like.

  In addition, as an example of the electronic apparatus 1000 according to the present embodiment, the electronic component 200 described above is used as a reference signal source, a voltage variable oscillator (VCO), or the like, for example, a terminal base that performs wired or wireless communication with a terminal. A transmission device that functions as a station device or the like can be used. Since the electronic device 1000 can improve the frequency stability by including the electronic component 200, the electronic device 1000 can be applied to a transmission device for which high performance and high reliability that can be used for a communication base station, for example, are desired. it can.

6). Sixth Embodiment Next, a moving body according to a sixth embodiment will be described with reference to the drawings. FIG. 8 is a diagram (top view) illustrating an example of a moving object according to the sixth embodiment.

  The moving body 1100 includes an electronic component according to the present invention. Here, a case where an electronic component 200 is used as an electronic component according to the present invention as shown in FIG. 8 will be described.

  The moving body 1100 further includes controllers 1120, 1130, 1140 that perform various controls such as an engine system, a brake system, and a keyless entry system, a battery 1150, and a backup battery 1160. Note that the mobile body of the present embodiment may have a configuration in which some of the components (each unit) in FIG. 8 are omitted or other components are added.

  The electronic component 200 generates an oscillation signal based on the oscillation of the resonator element heated by the heating element. This oscillation signal is output from the electronic component 200 to the controllers 1120, 1130, and 1140, and is used as, for example, a clock signal.

  The battery 1150 supplies power to the electronic component 100 and the controllers 1120, 1130, 1140. The backup battery 1160 supplies power to the electronic component 200 and the controllers 1120, 1130, and 1140 when the output voltage of the battery 1150 falls below a threshold value.

  Since the moving body 1100 includes the electronic component 200, it can have high frequency stability.

  As such a moving body 1100, various moving bodies are conceivable, and examples thereof include automobiles (including electric automobiles), airplanes such as jets and helicopters, ships, rockets, and artificial satellites.

7). Modifications The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the present invention.

(1) First Modification For example, in each of the above embodiments, the vibration piece 20 has been described as an example of a vibration piece using an SC cut quartz substrate. However, in the electronic component according to the present invention, the vibration piece is: It is not limited to the one using the SC cut quartz substrate, but may be one using another quartz substrate such as an AT cut quartz substrate. Further, the quartz substrate may be, for example, a mesa type in which the central portion (thick portion) is thicker than the peripheral portion and this central portion is a vibrating portion. In the electronic component according to the present invention, the resonator element may be a SAW (Surface Acoustic Wave) resonator or a MEMS (Micro Electro Mechanical Systems) vibrator. In addition to quartz, piezoelectric single crystals such as lithium tantalate and lithium niobate, piezoelectric materials such as piezoelectric ceramics such as lead zirconate titanate, and silicon semiconductor materials are used as the substrate material for the resonator element. You can also. Further, as a vibrating piece excitation means, one based on a piezoelectric effect may be used, or electrostatic driving using a Coulomb force may be performed. Further, the vibration piece may be an element for detecting a physical quantity, for example, an element for an inertial sensor (acceleration sensor, gyro sensor, etc.) or a force sensor (tilt sensor, etc.).

(2) Second Modification For example, in each of the above-described embodiments, an example in which the plate-like member 40 has a two-layer structure including the first layer 42 and the second layer 44 has been described, for example, as shown in FIG. In the electronic component according to the present invention, the number of layers of the plate-like member is not particularly limited, and the plate-like member may be a single layer or may be three or more layers.

  For example, when the plate-like member is a single layer, the material of the plate-like member is preferably a material having a high reflectance with respect to infrared rays, for example, any one of Au, Ag, Cu, Al, or Au, It is an alloy mainly containing any one of Ag, Cu, and Al. That is, the plate-like member may be a plate made of these metals or an alloy plate containing these metals as a main component.

  Further, when the plate-shaped member has three or more layers, for example, among the layers constituting the plate-shaped member, the layer arranged closest to the vibration piece functions as the reflecting portion. Therefore, it is desirable that the material of the layer arranged closest to the vibrating piece is a material having a high reflectance with respect to infrared rays. For example, any one of Au, Ag, Cu, and Al, or Au, Ag, Cu, Al It is an alloy which has either of these as a main component. Furthermore, the upper surface 43 a and the lower surface 43 b of the plate member 40 may have irregularities in the thickness direction (vertical direction) of the plate member 40.

(3) Third Modification For example, in each of the above-described embodiments, the example in which the first layer 42 of the plate-like member 40 is quartz has been described. However, in the electronic component according to the present invention, the material of the first layer is quartz. Without limitation, for example, a semiconductor crystal such as ceramics, resin, metal, glass, or silicon, or a piezoelectric crystal such as lithium tantalate or lithium niobate may be used. For example, when the first layer is ceramic, the first layer is made of the same material as the substrate (ceramic package) on which the plate-like member is mounted, and the first layer and the substrate have the same linear expansion coefficient. Therefore, for example, even if the plate member is supported at multiple points on the substrate, it is possible to reduce the possibility that the connection between the plate member and the substrate is broken when a temperature change occurs. The material of the first layer may be a material (for example, Kovar) having a linear expansion coefficient close to that of the substrate (ceramic package). In such a case, the same effect can be obtained.

(4) Fourth Modification For example, in each of the above-described embodiments, as shown in FIG. 1, for example, the first excitation electrode 24a of the resonator element 20 is connected to the electrode (on the substrate 12 via the extraction electrode 25a and the bonding wire 60) The second excitation electrode 24b is electrically connected to the extraction electrode 25b, the connection member 50, the plate-like member 40 (second layer 44), the connection member 52, the wiring 54, and the bonding wire 62. The example in which the electrodes (not shown) on the substrate 12 are electrically connected has been described. In the electronic component according to the present invention, the second excitation electrode may be electrically connected to the electrode on the substrate via the extraction electrode and the bonding wire, similarly to the first excitation electrode. In this case, the connecting member connecting the heating element and the plate-like member, and the connecting member connecting the plate-like member and the vibrating piece are mechanically arranged so that heat generated in the heating element is transmitted to the vibrating piece. What is necessary is just to have the function to connect, and it does not need to have the function to connect electrically.

(5) Fifth Modification For example, in each of the above-described embodiments, the example in which the plate-like member 40 is disposed on the heating element 30 as shown in FIG. 1 has been described. However, the electronic component according to the present invention is described. Then, if the plate-like member is arranged between the container (first container) and the vibrating piece, for example, it may be arranged on the substrate (ceramic package) of the container containing the vibrating piece and the plate-like member. Good.

(6) Sixth Modification For example, in each of the above-described embodiments, the heat generated by the heating element 30 is vibrated through the wiring 54, the connecting member 52, the plate-like member 40, and the connecting member 50 by heat conduction. Although the example transmitted to the piece 20 has been described, in the electronic component according to the present invention, the heat path is not particularly limited as long as the heating element can be accommodated in the container (first container) to heat the vibrating piece. Further, the heating element may heat the vibration piece by heat conduction, may heat the vibration piece by radiation, or may heat the vibration piece by both heat conduction and radiation.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 10 ... 1st container, 12 ... Board | substrate, 13 ... Area | region, 14 ... Lid, 16 ... Storage chamber, 18 ... Connection member, 20 ... Vibrating piece, 22 ... Quartz substrate, 24a ... 1st excitation electrode, 24b ... 2nd excitation Electrode, 25a ... extraction electrode, 25b ... extraction electrode, 26 ... end, 30 ... heating element, 40 ... plate member, 42 ... first layer, 43a ... upper surface, 43b ... lower surface, 44 ... second layer, 46 ... First reflective portion 50... Connection member 52. Connection member 54. Wiring 56. Pad (land) 60, 62, 64, 66 Bonding wire 100, 200 Electronic component 210 210 Electronic element 300 DESCRIPTION OF SYMBOLS ... Electronic component, 310 ... 2nd reflection part, 400 ... Vibration device, 410 ... 2nd container, 412 ... Wiring board, 414 ... Cap, 416 ... Space, 420 ... Support part, 430 ... Electronic element, 1000 ... Electronic device, 1020 ... CPU 1030 ... the operating unit, 1040 ... ROM, 1050 ... RAM, 1060 ... communication unit, 1070 ... the display unit, 1100 ... mobile, 1120,1130,1140 ... controller, 1150 ... battery, 1160 ... backup battery

Claims (8)

A vibrating piece,
A member having a first reflecting portion;
A heating element;
A container in which the resonator element, the member, and the heating element are accommodated;
Including
The member is disposed between the container and the vibrating piece,
The first reflecting portion is disposed so as to overlap the vibrating piece in plan view,
An electronic component in which the infrared reflectance of the first reflecting portion is larger than the infrared reflectance of the region of the container overlapping the first reflecting portion in plan view. A vibrating piece,
A first electronic element;
A member having a first reflecting portion;
A heating element;
A container in which the resonator element, the first electronic element, the member, and the heating element are accommodated;
Including
The member is disposed between the first electronic element and the vibrating piece,
The first reflecting portion is arranged so as to overlap the vibrating piece in a plan view and to overlap the first electronic element in a plan view,
An electronic component, wherein the infrared reflectance of the first reflecting portion is greater than the infrared reflectance of the first electronic element. In claim 1 or 2,
The vibration piece is an electronic component that is disposed within an outer periphery of the first reflecting portion in plan view. In any one of Claims 1 thru | or 3,
The member has a portion mainly composed of silicon oxide,
The first reflecting part is an electronic component made of a metal of any one of Au, Ag, Cu, and Al, or an alloy mainly containing any of Au, Ag, Cu, and Al. In any one of Claims 1 thru | or 4,
On the surface of the container that faces the surface opposite to the surface on which the member of the vibrating piece is disposed, a second reflecting portion is disposed.
An electronic component in which the infrared reflectance of the second reflecting portion is larger than the infrared reflectance of the container. The electronic component according to any one of claims 1 to 5,
A second electronic element disposed outside the container;
A wiring board;
A support part for connecting the wiring board and the container;
Including vibration devices.   An electronic apparatus comprising the electronic component according to claim 1 or the vibration device according to claim 6.   A moving body comprising the electronic component according to claim 1 or the vibration device according to claim 6.

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