JP2016132747A - Conductive thermal peeling fixing material, method for working component using conductive thermal peeling fixing material, and wire electric discharge working machine used in method for working component using conductive thermal peeling fixing material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive thermal peeling fixing material usable for component working instantaneously after being pasted to a workpiece and the upper and lower surfaces of a worked component and peelable with a heated water system without using an organic solvent after the component machining.SOLUTION: The surface of a conductive base material is provided with a polyion complex resin layer and a conductive thermal expansible adhesive layer in this order.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a conductive heat debonding fixing material used in component processing by a wire electric discharge machine, a method of processing a part using the conductive heat debonding fixing material, and a component using the conductive heat debonding fixing material. The present invention relates to a wire electric discharge machine used for a machining method.

  Conventionally, in part machining using a wire electric discharge machine, a part having a desired shape is cut out from a workpiece that is a metal workpiece, but when a part is cut out from a workpiece by a normal method, a support portion Therefore, processing deviation occurs, and it is necessary to correct such processing deviation by an operation such as polishing after the part is cut out.

  For this reason, for example, a technique has been proposed in which the occurrence of machining deviation is prevented by bonding a metal plate coated with a conductive cyanoacrylate adhesive to the surface of the workpiece and the workpiece (see, for example, Patent Document 1). ).

JP 2001-30223 A

The method using the conductive cyanoacrylate adhesive described in Patent Document 1 is effective in preventing misalignment during processing, but conductivity cannot be obtained until the adhesive containing a powdered metal is cured. Therefore, it takes time until processing becomes possible.
Moreover, when removing a component from a metal plate after processing, it is necessary to immerse in an organic solvent to remove the adhesive. For this reason, when the area of the adhesive applied to the component is large, the time taken for the organic solvent to enter becomes long, and it takes a lot of time to remove the adhesive, which is inefficient. Furthermore, since an organic solvent is used, the influence on the working environment becomes a problem.

  Accordingly, an object of the present invention is to provide a conductive heat which can be used for part processing immediately after being attached to the upper and lower surfaces of a workpiece and a processed part and can be peeled off in a heated water system without using an organic solvent after the part is processed. It is to provide a peeling fixing material.

  In order to achieve the above object, the conductive heat-peeling fixing material according to the present invention is obtained by providing a polyion complex resin layer and a conductive heat-expandable adhesive layer in this order on the surface of a conductive base material.

In addition, the present invention provides a machining of a part that performs wire electric discharge machining by attaching the above-mentioned conductive heat-peeling fixing material to the workpiece and the upper and lower surfaces of the workpiece when the workpiece is temporarily fixed to the workpiece. A method is provided.
Furthermore, this invention provides the wire electric discharge machine used for said part processing method.

  According to the conductive heat debonding fixing material according to the present invention, for example, when a part is temporarily fixed to a work using a wire electric discharge machine, the work is immediately conducted after being attached to the surface of the work and the processed part. Wire electric discharge machining is possible, and after processing, the conductive heat-peeling fixing material can be easily peeled off by an ordinary heat treatment with hot water without using an organic solvent. Moreover, even when the heat peeling force becomes insufficient due to heat sag, the conductive heat peeling fixing material can be easily peeled off by a rust prevention treatment or a rust removal treatment that is normally performed after the heating water treatment.

It is sectional drawing which shows Embodiment 1 of the electroconductive heat peeling fixing material which concerns on this invention. It is sectional drawing which shows the modification of Embodiment 1 of the electroconductive heat peeling fixing material which concerns on this invention. It is the top view which showed the state which affixed the electrically conductive heat peeling fixing material which concerns on this invention on the surface of the workpiece | work temporarily fixed, and the process component. It is sectional drawing when FIG. 3 is cut | disconnected by line AA. It is the schematic which showed the wire electric discharge machine using the electroconductive heat peeling fixing material which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, and examples and comparative examples will also be described. The present invention is not limited to these embodiments and examples.

Embodiment 1 FIG. <Conductive heat release fixing material>
The conductive thermal peeling fixing material 10 according to Embodiment 1 of the conductive thermal peeling fixing material according to the present invention shown in FIG. 1 has a polyion complex resin layer 2 and a pressure-sensitive adhesive layer 3 on the surface of the conductive substrate 1. It has a structure in which a metal foil 5 having a conductive pressure-sensitive adhesive layer 6 coated with a thermally expandable microcapsule 4 is attached to the back surface of the pressure-sensitive adhesive layer 3.

  Note that the pressure-sensitive adhesive layer 3 and the metal foil 5 are not essential, and even if they are not present, they have electrical conductivity immediately after being attached to the surface of the workpiece and the processed part, and can be subjected to wire electric discharge machining. Without using a solvent, the conductive heat-peeling fixing material can be easily peeled off by heat treatment with warm water that is usually performed. However, the presence of the pressure-sensitive adhesive layer 3 can prevent the displacement more strongly, and the presence of the metal foil 5 can further improve the conductivity of the conductive heat-peeling fixing material and avoid a discharge short-circuit state.

In addition, the conductive heat-peeling fixing material 10 shown in FIG. 1 uses the insulating adhesive layer 3, but instead of the conductive adhesive layer 31 as shown in the modification of FIG. It may be used.
3 and 4 are a plan view and a cross-sectional view, respectively, showing a state in which the conductive heat-peeling fixing materials 10 and 11 are attached to a work 99 when the parts are processed by the wire electric discharge machine shown in FIG. It is shown by.

  In this state, the wire gap 98 is formed on the workpiece 99 in the wire electric discharge machining process, and the part 100 is cut out. On the way, when the wire gap 98 is incomplete, the remaining part causes the part 100 to be cut off. This is a temporarily fixed state supported by the workpiece 99. The conductive heat-peeling fixing materials 10 and 11 are each attached with the thermally expandable microcapsule 4 on both the upper and lower surfaces of the workpiece 99 and the component 100.

  As will be described later, the wire electric discharge machine processes the workpiece 99 and the conductive heat-peeling fixing materials 10 and 11 with the discharge wire 103 stretched from the delivery unit 101 to the winding unit 102 shown in FIG. .

The conductive heat-peeling fixing materials 10 and 11 are in a state in which a connection portion remains between the workpiece 99 and the processed component 100 (particularly fixed state) when the component is processed by the wire electric discharge machine. The workpiece 99 and the processed component 100 are fixed to the surface and the bottom surface of the component 100 so as to be supported by one conductive heat-peeling fixing material 10, 11 so as not to protrude from the cut surface.
It should be noted that parts not necessary for the description are omitted, and some parts are illustrated in an enlarged or reduced form for easy explanation.

Here, each component of the electroconductive heat peeling fixing material 10 and 11 in this Embodiment is demonstrated.
(Substrate 1)
It is important that the base material 1 has a rigidity that does not cause deformation due to the load of the cut-out component by wire electric discharge machining. The substrate 1 may be a metal plate such as copper, aluminum, copper alloy, tungsten, nickel, or a rigid body imparted with conductivity by plating or the like.

In order to improve the adhesion of the surface of the substrate 1 to the polyion complex resin layer 2 formed on the surface, chemical treatment such as ozone exposure, plasma treatment, silane coupling agent, self-assembled monolayer formation, or the like Physical treatment can be applied.
The thickness of the substrate 1 is not particularly limited and can be appropriately determined as long as the load of the processed component 100 cut out from the workpiece 99 can be supported. However, the accuracy of wire electric discharge machining decreases as the distance between the nozzle and the workpiece increases. Therefore, the thickness is preferably 5 mm or less.

(Polyion complex resin layer 2)
By providing the polyion complex resin layer 2 between the base material 1 and the pressure-sensitive adhesive layer 3, the base material 1 and the pressure-sensitive adhesive layer 3 are peeled off by being immersed in an acidic or basic liquid after processing. I can do it.

  In the polyion complex resin, the polycationic resin and the polyanionic resin react with each other's ionic components, and ionic crosslinking proceeds, resulting in poor water solubility or insolubilization. This polyion complex resin can be dissolved by reversibly dissociating ionic crosslinks with an acidic or basic liquid. In addition, in the case of wire electric discharge machining, since the insulating property is required for the machining fluid, neutral ion exchange water treated with an ion exchange resin is used, and ionic crosslinking is dissociated during machining. Absent.

  The polyion complex resin layer 2 can be appropriately selected from known polycations and polyanions. For example, examples of the polycation include polyallylamine hydrochloride having a quaternary amine in the molecule, and cationized cellulose. Examples of the polyanion include polyacrylic acid, polystyrene sulfonic acid, polyacrylic acid copolymer, and polystyrene sulfonic acid copolymer.

  The polyion complex resin layer 2 is formed, for example, by repeating the steps of alternately immersing, drying, and washing the base material in polar solvent solutions of polycation and polyanion. For example, after immersing the substrate in an aqueous solution of polycation, the coating film is naturally dried. Then, after immersing the base material in which the polycation film | membrane was formed in the aqueous solution of a polyanion, natural drying is performed and it wash | cleans with ion-exchange water, The polyion complex resin layer 2 can be formed.

  The concentration of the solution at this time is preferably 0.001% by mass or more and 1% by weight or less with respect to the amount of the solvent. When the concentration of the solution is less than 0.001% by mass, precipitation is likely to occur when the resin comes into contact with a resin forming a polyion complex, and the concentration of the solution becomes unstable. Although the concentration of the solution may exceed 1% by weight, since the formation of the polyion complex occurs with the polymer that forms the ion pair, the thickness of the polyion complex resin layer does not increase even if the concentration of the solution is increased. There is no increase.

  Although depending on the type of resin, when the concentration of the solution exceeds 1% by weight, the viscosity increases, and the film thickness formed during dip coating is not preferable. For this reason, when the concentration of the solution is 0.001% by mass or more and 1% by weight or less, an appropriate film thickness is formed, and even when resin precipitation occurs due to the formation of a polyion complex, Film formation can be performed.

  It is preferable that the mol% of the cationic monomer and the anionic monomer in the polymer chain of the polycation and the polyanion used for forming the polyion complex resin layer 2 is 5 mol% or more. When the mol% of the cationic monomer and the anionic monomer in the polymer chain is smaller than 5 mol%, a sufficient crosslinking rate cannot be obtained for imparting insolubility to water, and wire electric discharge machining. Since the dissolution or swelling of the polyion complex resin layer 2 proceeds during immersion in the machining fluid of the machine, displacement due to deformation accompanying the peeling or swelling of the base material 1 occurs, and the machining accuracy decreases, which is not preferable.

  The polar solvent for dissolving the polycation and the polyanion used in the polyion complex resin layer 2 can be appropriately selected from known solvents. For example, a pure solvent such as ion-exchanged water, distilled water, tetrahydrofuran, dimethyl sulfoxide, acetonitrile, dimethylformamide, or a mixed solvent as long as necessary may be used.

(Adhesive layer 3)
For the pressure-sensitive adhesive layer 3 according to the present embodiment, a double-sided tape having a base material such as PET or metal foil is used in order to suppress shear deformation due to stress on the fixing material generated when the workpiece is cut by wire electric discharge machining. It is preferable. At this time, when a double-sided tape such as a non-woven fabric base material or a base material is used, deformation is likely to occur and processing accuracy is lowered, which is not preferable.

  As the thickness of the pressure-sensitive adhesive layer 3, as the thickness increases, the processing accuracy is reduced due to shear deformation. Therefore, the thickness of the adhesive layer 3 is 0.5 mm or less and only the thickness of the adhesive excluding the base material. Is preferably 0.2 mm or less.

  Moreover, like the modification of FIG. 2, when the electroconductive adhesive layer 31 is used instead of the adhesive layer 3, the adhesive layer 3 that was an insulator layer becomes a conductor layer. The occurrence of arc discharge with the wire electric discharge electrode (wire) is suppressed, and the workability is improved. As a method for forming the conductive pressure-sensitive adhesive layer 31, a conductive metal foil double-sided tape in which a conductive pressure-sensitive adhesive is applied to the upper and lower surfaces of the metal foil can be used.

(Conductive thermal expansion adhesive layer 6, 4)
The conductive thermally expandable adhesive layer formed by the thermally expandable microcapsule 4 and the conductive adhesive layer 6 shown in FIGS. 1 and 2 includes at least an adhesive for imparting adhesiveness, and a thermal expandability. Thermally expandable microcapsules for imparting Therefore, for example, after the conductive heat-peeling fixing material is applied to an adherend such as a metal workpiece and processed, the heat-expandable adhesive layer is heated to expand the foaming agent such as the heat-expandable microcapsule 4. As a result, the heat-expandable pressure-sensitive adhesive layer expands, and this expansion reduces the contact area between the heat-expandable pressure-sensitive adhesive layer and the adherend (work), and reduces the adhesive force due to the conductive heat-expandable pressure-sensitive adhesive layer. Thus, the conductive thermal peeling fixing materials 10 and 11 can be easily peeled off from the adherend.

  The thermally expandable microcapsule 4 can be appropriately selected from known thermally expandable microcapsules. For example, a microcapsule in which a substance that easily vaporizes and expands by heating, such as isobutane, propane, and pentane, is included in an elastic shell. The shell is often formed of a thermoplastic resin. Examples of the material forming the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, and polyvinylidene chloride, depending on the thermal expansion start temperature of the thermally expandable microcapsule. Are appropriately selected.

As the thermally expandable microcapsule 4, the trade name “Matsumoto Microsphere” (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), the trade name “Kureha Microsphere” (manufactured by Kureha Co., Ltd.), and the trade name “Advancel” ( There are commercial products such as Sekisui Chemical Co., Ltd.).
Moreover, since the thermally expandable microcapsule 4 acts as a resistor during wire electric discharge machining, conductivity may be imparted to the surface by a method such as metal vapor deposition or electroless plating.

In order to efficiently reduce the adhesive force of the heat-expandable pressure-sensitive adhesive layer by heat treatment, it is preferable to have a strength capable of volume expansion until the volume expansion coefficient becomes 3 times or more.
The heat treatment temperature can be appropriately selected according to the volume expansion temperature of the thermally expandable microcapsule. However, when the temperature is too high, deformation due to the thermal expansion of the material used for the workpiece 99 occurs. It is preferably 60 ° C. or higher because it may have a volume expansion due to storage stability or heat generation during processing.

  The particle size (average particle system) of the thermally expandable microcapsule 4 can be appropriately selected according to the thickness of the thermally expandable adhesive layer. When the average particle diameter of the heat-expandable microcapsule is larger than the thickness of the heat-expandable pressure-sensitive adhesive layer, the pressure-sensitive adhesive cannot reach the work surface, and sufficient adhesive force cannot be obtained.

  The coating amount of the thermally expandable microcapsule 4 is preferably 0.0005 gram / square centimeter or more and 0.05 gram / square centimeter or less. When the coating amount of the heat-expandable microcapsule is less than 0.0005 g / square centimeter, the peeling force during heating is not sufficiently achieved. Further, when the coating amount of the thermally expandable microcapsule is larger than 0.05 g / square centimeter, the surface resistance value in the wire electric discharge machining becomes large, and the volume expansion of the thermally expandable microcapsule is caused by the heat generation resistance during the machining. Is not preferable.

(Metal foil 5)
The metal foil 5 is used to ensure electrical conductivity between the workpiece 99 and the machined part 100 during wire electric discharge machining. The metal foil 5 can be appropriately selected from conductive materials. For example, copper foil or aluminum foil is preferable from the viewpoint of availability and versatility.
The thickness of the metal foil is not particularly limited and can be appropriately determined, but is preferably 0.001 mm or more and 0.3 mm or less from the viewpoint of workability.

Alternatively, the metal foil 5 may be a conductive metal foil tape or a conductive metal foil double-sided tape in which a conductive adhesive is applied on either side in advance.
The metal foil 5 or the metal foil surface of the conductive metal foil tape may be subjected to physical treatment by polishing in order to improve adhesion with various adhesive layers formed on the substrate 1.

  As the adhesive used in the conductive metal foil tape or the double-sided conductive metal foil tape, the adhesive is made of a non-thermosetting resin that does not constrain the volume expansion of the thermally expandable microcapsules as much as possible when heated. What the filler was disperse | distributed is preferable. As such an adhesive, for example, a known adhesive such as a rubber adhesive, an acrylic adhesive, a styrene-butadiene adhesive, a silicone adhesive, and a polyester adhesive can be used. Further, as the conductive filler, a conductive material such as carbon black, metal fine powder, metal oxide, or metal fiber, or glass or resin powder that has been subjected to metal surface treatment by plating or the like can be used.

Embodiment 2. FIG. <Part machining method by wire discharge and wire electric discharge machine>
FIG. 5 shows an example of a machining process using a wire electric discharge machine. The electric discharge machining method using an electric discharge wire is not particularly limited, and is a known technique or a wire electric discharge machining apparatus that is available for general use. Can be processed as appropriate. As the discharge wire 103, a generally available wire such as a brass wire or a covered wire can be used.

  Usually, the discharge wire 103 is always held between the sending unit 101 that sends out the discharge wire 103 and the discharge wire 103 sent out from the sending unit 101 in a state without loosening by an automatic wire feeder. Has been. In the automatic wire feeding device, the delivery unit 101 and the winding unit 102 are designed to be simultaneously movable in a direction (arrow direction in FIG. 5) orthogonal to the delivery direction of the discharge wire 103.

  In general, the sending unit 101 is disposed directly above the winding unit 102. The direction in which the sending unit 101 and the winding unit 102 can move simultaneously (the arrow direction in FIG. 5) is the machining process direction by wire electric discharge machining. In addition, the electric discharge machining process is performed in an insulating liquid such as water or oil. During this process, the insulating liquid is fed from the delivery unit 101 and the winding unit 102 along the electric discharge wire 103. Is injected.

(Processing conditions for workpiece 99)
The machining conditions of the workpiece 99 can be appropriately selected within the range of 50V or more and 300V or less of the machining voltage of the wire electric discharge machine according to the required machining roughness. At this time, the lower the machining voltage is, the smaller the machining roughness is and the machining accuracy is improved. However, when the machining voltage is less than 50V, the workpiece can be machined, but it is not preferable because the discharge is less likely to occur stably and the workability is lowered. Further, when the machining voltage is higher than 300V, the machining roughness increases, which is not preferable.

(Processing of workpiece 99)
A voltage is applied between the discharge wire 103 and the workpiece 99 (not shown), and discharge occurs. This discharge becomes an arc discharge that passes through the shortest distance between the discharge wire 103 and the workpiece 99, and the thermal energy accompanying the generation of the arc discharge dissolves the discharge wire 103 and the workpiece 99, and at the same time, the surrounding water is rapidly heated and vaporized. In order to expand instantaneously, an explosion occurs locally, and the melted portion is blown away by this explosion. Then, water flows from the surroundings into the space where the explosion occurred, and the dissolved part is removed as fine powder into the water. Further, the discharge wire 103 and the workpiece 99 are also cooled by water, and a recess (wire gap 98) is formed. When such a phenomenon occurs continuously, the workpiece is cut along the moving direction of the wire.

(Heating method)
The heat treatment for peeling the conductive heat-peeling fixing materials 10 and 11 from the work 99 has a large heat capacity of the work 99, and when a hot-air dryer, an air dryer or the like is used, the heat of the thermally expandable microcapsule 4 is increased. Since it is difficult to reach the expansion start temperature, it is preferably immersed in warm water and heated. However, in heating with warm water, the adhesive used in the thermally expandable adhesive layer is deformed by the effect of heat, and sufficient peeling force may not be obtained only by the volume expansion of the thermally expandable microcapsules. After removing the base material 1, it is necessary to apply a load to remove the cut-out part from the work 99.

(Fixing material-base material removal method)
In order to remove the fixing materials 10 and 11 from the base material 1 after the heat peeling treatment, the polyion complex resin layer is immersed in an acidic or basic liquid such as an aqueous derusting agent or an antirust agent. Dissociation of the polycation resin and the polyanion resin proceeds, and the fixing material and the pressure-sensitive adhesive layer can be peeled off.

(Work 99)
The workpiece 99 used for wire electric discharge machining can be appropriately selected from conductive materials. For example, steel materials, cemented carbide, non-ferrous alloys, diamond sintered materials, and the like can be given.

Hereinafter, the embodiments of the present invention will be described more specifically based on examples, but the present invention is not limited to these examples.
[Example 1]
As the base material 1, the surface treatment was performed by immersing in a 1 mM ethanol solution of 3-mercapto-1-propanesulfonic acid soda (trade name “3-MPS soda”, manufactured by Asahi Chemical Industry Co., Ltd.) for 12 hours. After immersing and drying in a 0.1% by weight aqueous solution of polyallylamine hydrochloride (trade name “PAS-H-5L”, manufactured by Nitto Bo Medical Co., Ltd.) as a polycation using a copper plate, polystyrene sulfonate soda as a polyanion After immersing and drying in a 0.1% by weight aqueous solution (trade name “PS-100”, manufactured by Tosoh Organic Chemical Co., Ltd.), washing with ion-exchanged water was performed to form a polyion complex resin layer.

  A double-sided tape (trade name “VR-5300H”, manufactured by Nitto Denko Corporation) was attached as a pressure-sensitive adhesive layer 3 to the surface of the copper plate on which the polyion complex resin layer 2 was formed. Next, a conductive metal foil tape (trade name “CU-35C”, manufactured by 3M Corporation) is applied as the metal foil layer 5 and the conductive adhesive layer 6 to the adhesive surface, and heat is applied to the adhesive surface of the conductive metal foil tape. The expandable microcapsule 4 (trade name “F-30”, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.) was applied at a coating amount of 0.001 gram / square centimeter to obtain a conductive thermal peeling fixing material.

Next, using a commercially available wire electric discharge machine (trade name “PA05S”, manufactured by Mitsubishi Electric Corp.), as shown in FIGS. 10 and 11 were pasted and wire electric discharge machining (machining condition: machining voltage 60 V, machining speed 1 mm / min) was performed. At this time, it was possible to process the conductive thermal peeling fixing materials 10 and 11 without peeling from the adherend during the processing.
Next, the workpiece 99 and the part 100 after processing were immersed in warm water heated to 80 ° C. for 1 minute to perform peeling. At this time, peeling was confirmed at the place where the upper and lower surfaces of the processed parts were adhered, but peeling on the workpiece surface could not be confirmed.

  Subsequently, the workpiece | work and components after warm water heating were immersed in the rust removal agent (brand name "KC-12", Nihon Mecha Chemical Co., Ltd. product), and ultrasonic cleaning was performed for 30 seconds. At this time, the base material 1 used for the conductive heat-peeling fixing materials 10 and 11 was peeled off, and the processed parts could be peeled by pressing the processed parts from the surface of the conductive heat-peeling fixing material.

[Example 2]
As the base material 1, the surface treatment was performed by immersing in a 1 mM ethanol solution of 3-mercapto-1-propanesulfonic acid soda (trade name “3-MPS soda”, manufactured by Asahi Chemical Industry Co., Ltd.) for 12 hours. After immersing and drying in a 0.1% by weight aqueous solution of polyallylamine hydrochloride (trade name “PAS-H-5L”, manufactured by Nitto Bo Medical Co., Ltd.) as a polycation using a copper plate, polystyrene sulfonate soda as a polyanion A polyion complex resin layer 2 was formed by immersing and drying in a 0.1% by weight aqueous solution (trade name “PS-100”, manufactured by Tosoh Organic Chemical Co., Ltd.), followed by washing with ion-exchanged water.

  On the surface of the copper plate on which the polyion complex resin layer 2 is formed, a conductive metal foil double-sided tape (trade name “AL-25DC”, manufactured by 3M Company) is used as the pressure-sensitive adhesive layer 3, the metal foil layer 5, and the conductive pressure-sensitive adhesive layer 6. ), And a thermally expandable microcapsule (trade name “F-30”, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.) is applied to the adhesive surface of the conductive metal foil double-sided tape at a coating amount of 0.001 gram / square centimeter, Conductive heat release fixing materials 10 and 11 were obtained.

  Next, using a commercially available wire electric discharge machine, the conductive heat-peeling fixing materials 10 and 11 are affixed to the upper and lower surfaces (see FIG. 4) of the workpiece 99 and the component 100 being processed, and the processing conditions are the same as those in the first embodiment. Then, wire electric discharge machining was performed. At this time, it was possible to process the conductive thermal peeling fixing materials 10 and 11 without peeling from the adherend during the processing.

  Next, the workpiece 99 and the part 100 after processing were immersed in warm water heated to 80 ° C. for 1 minute to perform peeling. At this time, peeling was confirmed at the place where the upper and lower surfaces of the processed parts were adhered, but peeling on the workpiece surface could not be confirmed.

  Subsequently, the workpiece | work and components after warm water heating were immersed in the rust removal agent (brand name "KC-12", Nihon Mecha Chemical Co., Ltd. product), and ultrasonic cleaning was performed for 30 seconds. At this time, the base material used for the conductive heat-peeling fixing material was peeled off, and the processed component could be peeled by pressing the processed part from the surface of the conductive heat-peeling fixing material.

[Example 3]
As a polycation used for forming the polyion complex resin layer, O- [2-hydroxy-3- (trimethylammonio) propyl] hydroxyethylcellulose (trade name “Kachinal HC-200”, manufactured by Toho Chemical Industry Co., Ltd.) Except having used 0.1 weight% aqueous solution, it carried out similarly to Example 1, and obtained the electroconductive heat-peeling fixing materials 10 and 11.

  Next, using a commercially available wire electric discharge machine, conductive heat-peeling fixing materials 10 and 11 were attached to the upper and lower surfaces of the component being processed, and wire electric discharge machining was performed under the same processing conditions as in Example 1. At this time, it was possible to process the conductive thermal peeling fixing materials 10 and 11 without peeling from the adherend during the processing.

  Next, the workpiece 99 and the part 100 after processing were immersed in warm water heated to 80 ° C. for 1 minute to perform peeling. At this time, peeling was confirmed at the place where the upper and lower surfaces of the processed component 100 were adhered, but peeling on the workpiece surface could not be confirmed.

  Next, the workpiece 99 and the part 100 after heated with hot water were immersed in a rust remover (trade name “KC-12”, manufactured by Nippon Mecha Chemical Co., Ltd.) and subjected to ultrasonic cleaning for 30 seconds. At this time, the base material 1 used for the conductive heat-peeling fixing materials 10 and 11 was peeled off, and the processed parts could be peeled by pressing the processed parts from the surface of the conductive heat-peeling fixing material.

(Comparative Example 1)
A conductive heat-peeling fixing material was obtained in the same manner as in Example 1 except that no polycation was used and no washing with ion-exchanged water was performed.
Next, using a commercially available wire electric discharge machine, conductive heat-peeling fixing materials are pasted on the upper and lower surfaces of the workpiece and parts being processed (temporarily fixed), and wire electric discharge machining is performed under the same processing conditions as in Example 1. Carried out. At this time, the base material was peeled off from the conductive heat-peeling fixing material in the middle of processing, resulting in misalignment of the parts being processed, and could not be processed due to a short circuit.

(Comparative Example 2)
A conductive heat-peeling fixing material was obtained in the same manner as in Example 1 except that no polyanion was used and no washing with ion-exchanged water was performed.
Next, using a commercially available wire electric discharge machine, conductive heat-peeling fixing materials were attached to the upper and lower surfaces of the workpiece and parts being processed, and wire electric discharge machining was performed under the same processing conditions as in Example 1. At this time, the base material was peeled off from the conductive heat-peeling fixing material in the middle of processing, resulting in misalignment of the parts being processed, and could not be processed due to a short circuit.

(Comparative Example 3)
A conductive heat-peeling fixing material was obtained in the same manner as in Example 1 except that the heat-expandable microcapsule 4 was not used.
Next, using a commercially available wire electric discharge machine, conductive heat-peeling fixing materials were attached to the upper and lower surfaces of the part being processed, and wire electric discharge machining was performed under the same processing conditions as in Example 1. At this time, the conductive heat-peeling fixing material could be processed without being peeled off from the adherend during the processing.

Next, the workpiece and parts after processing were immersed in warm water heated to 80 ° C. for 1 minute to perform peeling. At this time, the peeling of the conductive heat-peeling fixing material from the adherend could not be confirmed.
Subsequently, the workpiece | work and components after warm water heating were immersed in the rust removal agent (brand name "KC-12", Nihon Mecha Chemical Co., Ltd. product), and ultrasonic cleaning was performed for 30 seconds. At this time, the base material used for the conductive heat-peeling fixing material was peeled off. However, even if the processed part was pressed from the surface of the conductive heat-peeling fixing material, the processed part could not be peeled off.

  As described above, when the conductive heat-peeling fixing material of the present invention is used, the adherend can be held with sufficient adhesive force during processing, and after the heat treatment, the substrate is washed with an aqueous rust remover. It was confirmed that the adherend could be easily peeled by peeling the material.

  10, 11 Conductive heat release fixing material, 1 base material, 2 polyion complex resin layer, 3 adhesive layer, 31 conductive adhesive layer, 4 thermally expandable microcapsule, 5 metal foil, 6 conductive adhesive layer, 98 Wire gap, 99 Workpiece, 100 Processed part, 101 Delivery part, 102 Winding part, 103 Discharge wire.

Claims (8)

A conductive heat-peeling fixing material in which a polyion complex resin layer and a conductive heat-expandable adhesive layer are provided in this order on the surface of a conductive substrate. The conductive heat-peeling fixing material according to claim 1, wherein a pressure-sensitive adhesive layer and a metal foil are provided between the polyion complex resin layer and the conductive heat-expandable pressure-sensitive adhesive layer. The conductive heat-expandable pressure-sensitive adhesive layer is attached to the upper and lower surfaces of the workpiece and the workpiece when the workpiece is temporarily fixed to the workpiece in wire electric discharge machining. The conductive thermal debonding fixing material described in 1. The conductive thermal exfoliation fixing according to claim 3, wherein the conductive thermal expandable adhesive layer is composed of a conductive adhesive layer on the polyion complex resin layer side and a thermally expandable microcapsule on the workpiece side. Wood. The conductive heat-peeling fixing material according to claim 2, wherein the pressure-sensitive adhesive layer is an insulating pressure-sensitive adhesive layer or a conductive pressure-sensitive adhesive layer. When the conductive heat-peeling fixing material according to any one of claims 1 to 5 is processed by temporarily fixing a processed part to the workpiece, the electric discharge machining is performed by attaching the processed part to the upper and lower surfaces of the workpiece and the processed part. A processing method for a part using a conductive heat debonding fixing material. The processing method of the components using the electroconductive heat-peeling fixing material according to claim 6, wherein the workpiece and the processed component are immersed in warm water after processing and then immersed in a rust preventive or derusting agent. The wire electric discharge machine used for the processing method of the components using the electroconductive heat peeling fixing material used for the processing method of the components of Claim 6 or 7.

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