JP2016119596A - Circulator and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a surface mounting type circulator which is small, achieves high reliability against heat stress, and has high sensitivity.SOLUTION: A circulator has: a circuit board 10; a surface mounting type circulator element 20 having connection terminals 23 connected with a circuit part 12 on the circuit board 10; and a magnetic material 30 disposed between the circuit board 10 and a ferrite plate 21 and including through holes 32 with an inner wall covered by an insulator film 33. The circulator element 20 is formed on the ferrite plate 21 through a spacer 40 by a permanent magnet 50. The connection terminals 23 form a mounting structure in which the connection terminals 23 are connected to the circuit part 12 on the circuit board 10 via the through holes 32 formed in the magnetic material 30.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a surface mount type circulator and a manufacturing method of the circulator, and more particularly to a mounting structure thereof.

  A circulator (CIR: Circulator) is a signal separation device using a ferrite element. When an electromagnetic wave passes through a ferrite element magnetized in the traveling direction of the electromagnetic wave, its plane of polarization rotates clockwise around the traveling axis, but passes through a ferrite element magnetized perpendicularly from bottom to top with respect to the traveling direction. The electromagnetic wave bends its path forward diagonally to the right while keeping the plane of polarization horizontal. Electromagnetic waves are always guided to the right exit regardless of the entrance. For example, when the first pad electrode of the circulator is connected to the antenna, the received radio wave is received by the second pad electrode, and if a signal is transmitted through the third pad electrode, transmission and reception can be performed by the same antenna. it can. Thus, the circulator can be used for signal separation between the antenna, transmitter and receiver. In addition, an isolator (ISO: Isolator) configured to connect a matched load to one port of a circulator and pass high-frequency power in only one direction is also a useful device in radar, like the circulator. In the following description, in the mounting method, the isolator is the same, and the term “circulator” includes the isolator.

  In recent years, there has been a need for a circulator capable of performing batch reflow together with other components on a circuit board in order to reduce the mounting cost and size of a transmission / reception module. Although a structure in which a circulator or an isolator is entirely bonded to a substrate is also conceivable, the ferrite plate which is the main structure of the circulator is a brittle material and has a large difference in linear expansion from the circuit substrate. For example, the linear expansion coefficient of a resin circuit board is 14 ppm, and the ferrite plate is 10 ppm. When the temperature rises, high connection reliability is guaranteed from the thermal stress generated due to the difference in linear expansion coefficient. It becomes difficult.

  As a structure that can relieve the stress caused by the linear expansion difference by separating the ferrite plate from the circuit board and can be miniaturized by forming multiple backside electrodes, multiple connection points on the board mounting surface instead of lead terminals A surface-mount structure having the following has been proposed. The surface mounting structure includes a ball grid array (BGA) structure using solder balls, a pin grid array (PGA) structure using pins, and a column grid array using columns as connection terminals. (CGA: Column Grid Array).

  In order to form a magnetic circuit for obtaining desired electrical characteristics, a circulator has a magnetic body on the opposite side of a permanent magnet that is an external magnetic field source with respect to a ferrite plate, and has a structure that converges an external magnetic field on the ferrite plate. Necessary. Therefore, in the surface mounting structure, a structure in which a magnetic body is mounted on the opposite surface of the circuit board, a structure in which the magnetic body is built in the inner layer of the board, a magnetic body-less structure without the magnetic body, or a ferrite as in Patent Document 1 A structure in which a magnetic body is mounted on a plate has been proposed. The magnetic body-less structure without a magnetic body uses a magnetoplumbite type ferrite made of a magnetoplumbite having a large anisotropic magnetic field for the ferrite plate constituting the circulator.

US Pat. No. 8,234,777

  However, mounting a magnetic body on the opposite surface of the circuit board increases the mounting area, and the bonding area for bonding the ferrite plate constituting the circulator to the circuit board is greatly limited by the magnetic body. It will be. Further, if a magnetic material is to be built in the circuit board, the manufacturing cost of the board will increase or the reliability will be deteriorated due to the difference in linear expansion within the circuit board. Furthermore, the magnetic body-less structure causes an adverse effect of the magnetic field on other components or the circuit board. Furthermore, as in Patent Document 1, when a magnetic body is mounted on a ferrite plate, the area occupied by the magnetic body on the ferrite plate cannot be used for bonding to the circuit board. Therefore, there is a problem in that there is a risk in terms of reliability due to a decrease in thermal stress resistance and vibration shock resistance due to a significant decrease in the bonding area. Further, if the magnetic material is made small, there is a problem that a magnetic field cannot be sufficiently applied, an external magnetic field cannot be converged on a ferrite plate, and sufficient sensitivity as a circulator cannot be obtained.

  The present invention has been made in view of the above problems, and an object of the present invention is to obtain a highly sensitive surface-mounted circulator that is small in size and highly reliable against thermal stress.

  In order to solve the above-described problems and achieve the object, the present invention provides a circuit board, a surface mount type circulator comprising a ferrite plate having a plurality of connection terminals connected to a circuit portion on the circuit board, and a circuit. A magnetic body having a through hole disposed between the substrate and the ferrite plate and having an inner wall covered with an insulating film, and the connection terminal is connected to the circuit portion on the circuit board through the through hole; It is characterized by.

  According to the present invention, there is an effect that it is possible to obtain a surface mount type circulator that is small in size and highly reliable with respect to thermal stress and is highly sensitive.

The figure which shows the surface mount type circulator of Embodiment 1 of this invention, (a) is a perspective view, (b) is AA sectional drawing of (a), (c) is BB sectional drawing of (b). (A) And (b) is process sectional drawing which shows the formation process of the circuit board of the surface mount type circulator of Embodiment 1 of this invention (A) to (d) is a process cross-sectional view illustrating a process of forming a circulator element of the surface-mounted circulator according to the first embodiment of the present invention. (A) to (c) is a process cross-sectional view showing a process of forming a magnetic body of the surface-mounted circulator according to the first embodiment of the present invention. (A) to (c) are process cross-sectional views illustrating the assembly process of the surface-mounted circulator according to the first embodiment of the present invention. Sectional drawing of the surface mount type circulator of Embodiment 2 of this invention The principal part expanded sectional view of the surface mount type circulator of Embodiment 2 of the present invention. (A) to (e) are process cross-sectional views illustrating the formation process of the magnetic body of the surface-mounted circulator according to the second embodiment of the present invention. (A)-(c) is process sectional drawing which shows the assembly process of the surface mount type circulator of Embodiment 2 of this invention Sectional drawing which shows the surface mount type circulator of the modification of Embodiment 2 of this invention

  Hereinafter, a circulator according to an embodiment of the present invention and a method of manufacturing the circulator will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In the drawings, the same or similar components are denoted by the same reference numerals. In addition, for easy understanding, even a cross section may not be hatched. In addition, this invention is not limited by this embodiment, In the range which does not deviate from the summary, it can change suitably. In the drawings shown below, the scale of each layer or each member may be different from the actual for easy understanding, and the same applies to the drawings.

Embodiment 1.
1A and 1B are diagrams showing a surface-mounted circulator according to Embodiment 1 of the present invention, FIG. 1A is a perspective view, FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. It is -B sectional drawing. The surface mount type circulator according to the first embodiment includes a circuit board 10, a surface mount type circulator element 20 having a ferrite plate 21 having a plurality of connection terminals 23 connected to a circuit section 12 on the circuit board 10, and a circuit The magnetic body 30 is sandwiched between the substrate 10 and the ferrite plate 21. The connection terminal 23 is connected to the circuit unit 12 on the circuit board 10 through a through hole 32 formed in the magnetic body 30. The inner wall of the through hole 32 is covered with an insulating film 33. The circulator element 20 includes a permanent magnet 50 connected on the ferrite plate 21 via a spacer 40.

  In the present embodiment, a nickel plate is used as the magnetic body 30, and a plurality of through holes 32 are opened in advance in a region corresponding to the connection point between the ferrite plate 21 and the circuit board 10 of the magnetic body 30. The entire surface of the magnetic plate 31 including the inner wall is subjected to an insulating process to form an insulating film 33. The insulating film 33 is formed by performing thermal oxidation after forming a plurality of through holes 32 in the magnetic plate 31 made of a nickel plate. The magnetic body 30 with the through-hole 32 is sandwiched and mounted between the circuit board 10 and the ferrite plate 21 when the circulator element 20 is mounted on the surface. 30 is arranged. An ideal structure can be achieved with respect to the positional relationship between the magnetic body 30 and the permanent magnet 50.

  A through hole 32 is previously formed in the magnetic body 30 corresponding to the position of the connection terminal 23 of the circulator element 20, and an insulating film 33 is formed on the entire surface to be electrically insulated. The magnetic body 30 is sandwiched and mounted between the circuit board 10 when the surface-mounted circulator element 20 is mounted. The solder balls as the connection terminals 23 of the circulator element 20 are connected to the circuit section 12 on the circuit board 10 through the through holes 32 of magnetic material. The magnetic body 30 may be bonded in advance to the ferrite plate 21 or the circuit board 10 constituting the circulator element 20 before the circulator element 20 is mounted.

  As the circuit board 10, a resin board such as an epoxy resin, a circuit board 12 formed of a conductor pattern on the surface of an insulating board 11 such as a ceramic board such as alumina ceramic, or a laminated board having a multilayer wiring structure is applied. Is possible.

  The circulator element 20 is obtained by forming a wiring layer 22 by forming a conductor layer such as a gold thin film on a ferrite plate 21 made of YIG and patterning it. Although not shown, the wiring portion 22 includes first to third electrode pads and constitutes three ports. Then, connection terminals 23 made of solder balls are distributed and arranged in regions corresponding to the first to third electrode pads of the wiring portion 22 so as to be connected. Here, the wiring portion 22 includes a rearranged wiring portion (not shown), and the connection terminals 23 are distributed over the entire surface of the ferrite plate 21 on the circuit board 10 side. It may not be distributed over the entire surface. As the ferrite plate 21 used here, in addition to garnet ferrite such as YIG, ferrite such as spinel ferrite such as manganese zinc ferrite, nickel zinc ferrite and copper zinc ferrite can be applied.

  As the magnetic plate 31 used here, a ferromagnetic material composed of a composition such as nickel, stainless steel, iron oxide, chromium oxide, cobalt, or the like is applicable.

  As a connection structure of the circulator element 20 to the circuit board 10, a ball grid array (BGA: Ball Grid Array) structure using connection terminals 23 made of solder balls is used. The BGA uses solder balls two-dimensionally distributed in an array as connection terminals, and may be a BGA including rearranged wirings connected to a circuit pattern on the ferrite plate 21. As the connection structure, in addition to the above connection structure, a pin grid array (PGA) structure using pins, a column grid array (CGA: column grid array) using columns arranged in a grid pattern. Etc. are applicable.

  By adopting the structure of the present embodiment, it is possible to obtain a highly reliable and highly sensitive surface mount circulator. In particular, since the magnetic body 30 can be arranged without interfering with the connection between the circuit board 10 and the circulator element 20, the optimum arrangement can be performed, and desired electrical characteristics can be obtained without impairing the mounting reliability. Can be obtained. Further, other components can be arranged at desired positions, and the magnetic field generated from the permanent magnet 50 can be converged in the vicinity of the circulator element 20, so that the influence of the permanent magnet 50 on the other components and the substrate is reduced during mounting. can do.

  Next, a method for manufacturing the surface-mounted circulator according to the present embodiment will be described. First, as shown in FIG. 2A, an insulating substrate 11 made of an alumina ceramic substrate is prepared as a circuit substrate. Next, a two-layer thin film of chromium and gold is formed on the surface of the insulating substrate 11 by vacuum deposition, and is patterned by photolithography to form a circuit portion 12 as shown in FIG.

  Next, as shown in FIG. 3A, a YIG plate is prepared as a ferrite plate 21 for forming the circulator element 20. Next, a multilayer thin film such as a Cu—Ni—Au film is formed on the surface of the ferrite plate 21 by vacuum deposition, and is patterned by photolithography to form a wiring portion 22 as shown in FIG. The wiring portion 22 is not limited to a multilayer thin film, and may be a single layer film such as a nickel film or another multilayer thin film. Then, as shown in FIG. 3C, the connection terminals 23 made of solder balls are arranged on the wiring portion 22, and the connection terminals 23 are soldered to the wiring portion 22 by heating. After that, as shown in FIG. 3D, the permanent magnet 50 is fixed through the spacer 40. As the spacer 40, an insulating adhesive is used.

  Next, as shown in FIG. 4A, a nickel plate is prepared as the magnetic plate 31 for forming the magnetic body 30. Next, as shown in FIG. 4B, through holes 32 are formed in the magnetic plate 31 by etching. Then, an insulating film 33 made of a nickel oxide film is formed on the surface by thermal oxidation, and a magnetic body 30 is formed as shown in FIG.

  After forming the circuit board 10, the circulator element 20, and the magnetic body 30 as described above, a mounting process is performed. First, as shown in FIG. 5A, the magnetic body 30 is bonded to the circuit board 10 with an insulating adhesive after being aligned with the circuit portion 12. Thereafter, as shown in FIG. 5 (b), the circulator element 20 is temporarily connected by positioning so that the solder ball as the connection terminal 23 enters the position of the through hole 32 of the magnetic body 30. Then, heat treatment for solder reflow is performed, and the connection terminals 23 are connected to the circuit portion 12 on the circuit board 10 as shown in FIG.

  In the method of the present embodiment, the solder balls can be easily aligned using the through hole 32 as a reference position, and high-precision mounting is easily realized. Moreover, since it can connect in a batch reflow process, manufacturing workability | operativity is favorable.

  In particular, the BGA structure is used in the present embodiment, and in the BGA structure, the through hole 32 that is a perforated hole can also be used as a positioning jig for mounting the ball on the ferrite plate 21, that is, the connection terminal 23. As a result, the mounting workability is improved and the cost for manufacturing the parts can be reduced. The permanent magnet 50, the spacer 40, and the ferrite plate 21 are joined by a joining method such as adhesion, and the spacer 40 has a role of electrical insulation between the permanent magnet 50 and the ferrite plate 21. The spacer 40 may be replaced with an insulating material such as a sheet adhesive or a filler-containing non-conductive adhesive.

Embodiment 2. FIG.
FIG. 6 is a cross-sectional view showing a surface-mounted circulator according to the second embodiment. In the present embodiment, the magnetic body 130 is mounted as an intermediate board provided with connection wiring inside the ferrite plate 21 and the circuit board 10. In the magnetic body 130, a conductor layer is wired on the surface and inside so as to be electrically connected to the circuit board 10 on the first main surface 130A and the ferrite plate 21 on the second main surface 130B, and the through conductor portion 136 is provided inside. The provided through-hole 132 is provided.

  In the present embodiment, as shown in an enlarged cross-sectional view of the main part of the surface-mounted circulator in FIG. 7, the magnetic body 130 includes the first wiring part 134 formed on the first main surface 130A on the circuit board 10 side, and And a second wiring portion 135 formed on the second main surface 130B on the ferrite plate 21 side. Then, a through conductor portion 136 formed in the plurality of through holes 132 is provided, and the first wiring portion 134 and the second wiring portion 135 are electrically connected via the through conductor portion 136 to constitute a wiring board. ing. The connection terminal 23 formed in the wiring part 22 on the ferrite plate 21 is connected to the second wiring part 135. The first wiring part 134 on the circuit board 10 side is connected to the circuit board 10 via an anisotropic conductive film (ACF) 60 as a board connection terminal.

  By adopting the mounting structure as shown in FIG. 6, the linear expansion difference between the ferrite plate 21 and the circuit board 10 can be further mitigated while ensuring the merit of the first embodiment, and the surface insulation treatment of the magnetic body 30 is unnecessary. It becomes a structure.

  Next, a method for manufacturing the surface-mounted circulator according to the present embodiment will be described. A significant difference from the first embodiment is the manufacturing process of the magnetic body 130. In the present embodiment, a manufacturing process of the magnetic body 130 will be described. As shown in FIG. 8A, an iron oxide substrate is prepared as a magnetic plate 131 for forming the magnetic body 130. 130A corresponds to the first main surface of the magnetic material, and 130B corresponds to the second main surface of the magnetic material. Next, a through-hole 132 that penetrates from the first main surface 131A of the magnetic plate 131 to the second main surface 131B is formed in the magnetic plate 131 by etching. Thereafter, as shown in FIG. 8B, it is immersed in a solder resist, dried and cured, and an insulating film 133 made of a resin film is formed. Then, as shown in FIG. 8C, the second wiring part 135 is formed on the second main surface 131B of the magnetic plate 131 by vacuum deposition and photolithography. At this time, a through conductor portion 136 is formed in the through hole 132. Further, as shown in FIG. 8D, a first wiring part 134 is formed on the first main surface 131A of the magnetic body 131 by vacuum deposition and photolithography. Note that the insulating film 133 is not limited to a resin film, and may be an oxide film formed by thermal oxidation. By forming a uniform oxide film by thermal oxidation, a dense and highly reliable insulating film can be formed. .

  Then, as shown in FIG. 8 (e), solder balls that are connection terminals 23 of the circulator element 20 formed in the same manner as in the first embodiment are arranged in alignment with the second wiring part 135, Temporarily fix the magnetic body 130 with solder paste.

  The circuit board 10 is also formed in the same manner as in the first embodiment.

  After forming the circulator element 20 on which the circuit board 10 and the magnetic body 130 are mounted as described above, a mounting process is performed. First, as shown in FIG. 9A, an anisotropic conductive film 60 is arranged on the circuit board 10, and as shown in FIG. 9B, the circulator element 20 with the magnetic body 130 is further formed thereon. And temporarily connect. Thereafter, as shown in FIG. 9C, heat treatment for solder reflow is performed to connect the connection terminal 23 to the second wiring part 135 on the magnetic body 130 and to connect the first wiring part 134 to the circuit board 10. The circuit part 12 is connected via an anisotropic conductive film 60. The first wiring part 134 of the first main surface 131A of the magnetic plate 131 and the second wiring part 135 of the second main surface 131B are connected via a through conductor part 136. The entire surface of the magnetic plate 131 including the inner wall of the through hole 132 is covered with an insulating film 133.

  As described above, in the present embodiment, in the case where the ferrite plate 21 is designed to be enlarged depending on the frequency band of the product to which the circulator element 20 is applied, the heat generated due to the difference in linear expansion from the circuit board 10. It is effective when applied when the reliability required by stress cannot be satisfied. In addition, by using an anisotropic conductive film, underfill filling is unnecessary, and connection workability is good.

  The connection structure between the magnetic body 130 and the ferrite plate 21 and the magnetic body 130 and the circuit board 10 may be different from or different from that of the first embodiment. In addition to BGA, PGA, and CGA, the magnetic body 130 and the ferrite plate 21 may be connected by an anisotropic conductive material such as ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste).

  In addition to the anisotropic conductive film, an anisotropic conductive material such as ACF or ACP can be used between the circuit board 10 and the magnetic body 130 in addition to the BGA, PGA, and CGA.

  Further, since the magnetic body 130 is covered with the insulating film 133, the magnetic body 130 can be bonded to the circuit board 10, and the magnetic body 130 and the circuit board 10 can be brought into close contact with each other. Can be realized.

  However, in this embodiment, since the anisotropic conductive film is used for the connection between the magnetic body 130 and the circuit board 10, it is not necessary to form an insulating film on the surface on the circuit board 10 side. When a silicon oxide film or the like formed by a CVD (Chemical Vapor Deposition) method is used as the insulating film 133, workability is improved because it is only necessary to form a film on one side.

  Furthermore, the connection between the magnetic body 130 and the ferrite plate 21 is facilitated by joining the circulator 20 made of the ferrite plate 21 and the circuit board 10 with the magnetic body 130 as an intermediate substrate.

Modified example.
In the second embodiment, the ACF is used for the connection between the magnetic body 130 and the circuit board 10. However, as a modification of the second embodiment of the present invention, the connection structure between the magnetic body 130 and the circuit board 10 is a BGA connection. This configuration is also effective. FIG. 10 shows a case where the connection structure of the magnetic body 130 and the ferrite plate 21 and the magnetic body 130 and the circuit board 10 is a BGA connection as a modification of the second embodiment.

  In the second embodiment, the circuit board 10 and the magnetic body 130 are constituted by the anisotropic conductive film 60. However, in the present embodiment, as shown in FIG. The only difference is the use of. The board connection terminal 13 is formed on a circuit board. Since others are the same as those of the second embodiment, description thereof is omitted here.

  At the time of mounting, the board connection terminals 13 made of solder balls are aligned and temporarily fixed on the circuit portion 12 of the circuit board 10. On the other hand, the circulator element 20 is arranged on the magnetic body 130, and the solder balls as the connection terminals 23 of the circulator element 20 are aligned with the second wiring part 135 on the magnetic body 130 and temporarily connected with solder paste. Thereafter, the first wiring part 134 of the magnetic body 130 and the board connection terminal 13 made of solder balls of the circuit board 10 are aligned and temporarily connected. Then, heat treatment for solder reflow is performed to connect the connection terminal 23 to the second wiring part 135 on the magnetic body 130 and to connect the first wiring part 134 to the circuit part 12 on the circuit board 10 via the board connection terminal 13. Connect.

  In this embodiment, since solder balls are used instead of the anisotropic conductive film, the distance from the circuit board 10 is increased and the bonding area is reduced as compared with the second embodiment. For this reason, it is possible to suppress warping or deformation of the magnetic body 130 due to the heat of the circuit board 10 and to obtain a highly reliable circulator.

  The board connection terminals 13 made of solder balls are formed on the circuit board 10, but may be formed on the magnetic body 130. The board connection terminals 13 are not limited to solder balls, and may be mounted using other surface mounting members or mounting members other than the surface mounting members.

  As described above, according to the first and second embodiments, it is not necessary to mount a carrier on a circuit board facing a circuit board or to incorporate a board for forming a magnetic circuit, so that it is possible to reduce the mounting occupation area and cost. . In addition, since the external magnetic field concentrates on the ferrite plate, the influence of the external magnetic field on other components and the substrate can be reduced. In addition, it can be mounted without affecting the joint structure between the ferrite plate and the circuit board, and the magnetic material can be distributed over the entire surface of the ferrite plate, and the output characteristics of the circulator are also good. Become.

  In each of the above embodiments, BGA is used for inter-substrate connection, but it is needless to say that other surface mounting methods such as PGA, CGA, and ACF may be used without being limited to BGA. Further, in each of the above embodiments, the board-to-board connection is performed by the BGA using the solder ball. However, when the solder ball is not used, a solder layer is formed on each terminal or wiring portion, and the solder is melted in the reflow process. This makes it possible to easily make a batch connection.

  Moreover, in each said embodiment, although the permanent magnet 50 was mounted on the circulator 20 via the spacer 40, the permanent magnet 50 may be separately mounted | worn with the installation housing | casing side.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

DESCRIPTION OF SYMBOLS 10 Circuit board, 11 Insulating board, 12 Circuit part, 13 Board connection terminal, 20 Circulator element, 21 Ferrite board, 22 Wiring part, 23 Connection terminal, 30, 130 Magnetic body, 31 Magnetic board, 32 Through-hole, 33 Insulation 40, spacer, 50 permanent magnet, 60 anisotropic conductive film, 130A first main surface, 130B second main surface, 131 magnetic plate, 132 through hole, 133 insulating film, 134 first wiring portion, 135 second wiring Part, 136 through conductor part.

Claims (12)

A circuit board;
A circulator element comprising a ferrite plate having a plurality of connection terminals connected to a circuit portion on the circuit board;
A magnetic body having a through hole disposed between the circuit board and the ferrite plate and having an inner wall covered with an insulating film;
The circulator, wherein the connection terminal is connected to the circuit portion on the circuit board through the through hole. The magnetic body is composed of a magnetic plate having a plurality of through holes,
The circulator according to claim 1, wherein the entire surface of the magnetic plate including the inner wall of the through hole is covered with an insulating film. The plurality of through holes are formed corresponding to the arrangement positions of the connection terminals,
The circulator according to claim 2, wherein one connection terminal is arranged for each through hole. The connection terminal is a ball grid array in which a plurality of solder balls are arranged,
The plurality of through holes are formed corresponding to the arrangement positions of the solder balls,
The circulator according to claim 3, wherein one solder ball is arranged for each through hole. The magnetic body includes a first wiring portion formed on a first main surface on the circuit board side, a second wiring portion formed on a second main surface on the ferrite plate side, and the plurality of through holes. A wiring board made of a magnetic plate having a through conductor portion formed therein, and wherein the first wiring portion and the second wiring portion are electrically connected via the through conductor portion,
The connection terminal on the ferrite plate is connected to the second wiring portion,
The circulator according to claim 2, wherein the first wiring portion on the ferrite plate is connected to the circuit board via a board connection terminal formed on the circuit board.   The circulator according to claim 5, wherein the substrate connection terminal is an anisotropic conductive film.   The permanent magnet is mounted on the first main surface of the ferrite plate, and the magnetic body is disposed on the second main surface opposite to the first main surface. The circulator according to any one of claims. Forming a circuit board having a circuit portion;
Forming a magnetic body having a through hole whose inner wall is covered with an insulating film;
Disposing the magnetic body on the circuit board;
A surface-mounting type circulator element comprising a ferrite plate having a plurality of connection terminals, the connection terminals being aligned in the through hole, aligned, and the step of arranging the ferrite plate;
And a reflow process for heating the circuit board and connecting the connection terminal to the circuit part. The step of forming the magnetic body includes
Drilling a plurality of through holes in the magnetic body;
The method of manufacturing a circulator according to claim 8, further comprising: forming an insulating film on the surface of the magnetic body including the through hole. The step of arranging the ferrite plate includes:
The circulator manufacturing method according to claim 9, further comprising a step of aligning and temporarily connecting the connection terminals so that one connection terminal is arranged for each through-hole. The connection terminal is a ball grid array in which a plurality of solder balls are arranged,
The plurality of through holes are formed corresponding to the arrangement positions of the solder balls,
The circulator manufacturing method according to claim 10, wherein one solder ball is arranged for each through hole. The step of forming the magnetic body includes
Drilling a plurality of through holes in the magnetic body;
Forming an insulating film on the surface of the magnetic material;
Forming a first wiring portion on the first main surface on the circuit board side;
Forming a second wiring portion on the second main surface on the ferrite plate side;
Forming a through conductor portion in the plurality of through holes, and forming a wiring board in which the first wiring portion and the second wiring portion are electrically connected via the through conductor portion;
The step of arranging the ferrite plate includes:
While positioning the connection terminal on the ferrite plate to the second wiring portion,
The method for manufacturing a circulator according to claim 9, comprising a step of positioning a substrate connection terminal connected to the first wiring portion on the ferrite plate in a circuit portion formed on the circuit board. .

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