JP2016118506A - Radiation detection device, manufacturing method of the same, and radiation imaging system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for fixing a sensor panel to a support member while suppressing deformation of the sensor panel.SOLUTION: A manufacturing method of a radiation detection device includes: a holding step of holding a support member and a sensor panel so that a support surface of the support member and a first surface of the sensor panel face each other and a space is formed at least partially between the support surface and first surface; an injection step of injecting a liquid or gelatinous adhesive into a space between the sensor panel and support member; and a step of curing the adhesive to fix the sensor panel and support member to each other.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a radiation detection apparatus, a manufacturing method thereof, and a radiation imaging system.

  A technique for forming a detection element of a radiation detection apparatus on a semiconductor wafer is known. Since a semiconductor wafer is generally small, a large sensor panel is realized by attaching a plurality of semiconductor wafers on which detection elements are formed to a base such as glass. The sensor panel is stored in a housing and fixed. When the base of the sensor panel of the radiation detection apparatus is formed of glass, it is difficult to directly fix the base to the housing with a screw or the like. Therefore, a method of fixing the base to the support member with an adhesive and fixing the support member to the housing is performed. Patent Document 1 describes a structure in which only the side surface of a base is fixed to a support member with an adhesive.

JP 2013-120551 A

  A structure in which only the side surface of the base is solid on the support member as in Patent Document 1 has insufficient strength. Therefore, a method of fixing the bottom surface of the base to the support member with an adhesive can be considered. For example, the bottom of the base is fixed to the support member by sandwiching a sheet-like adhesive between the base and the support member and pressing the base against the support member. However, the inventors have found that in this method, when the flatness of the upper surface of the support member and the flatness of the bottom surface of the base are different from each other, the sensor panel is fixed to the fixing member in a deformed state. The deformed sensor panel cannot acquire an image correctly, and for example, the image output may change several percent before and after the deformation. An object of some aspects of the present invention is to provide a technique for fixing a sensor panel to a support member while suppressing deformation of the sensor panel.

  In view of the above problems, in some embodiments, a method for manufacturing a radiation detection apparatus is provided, wherein a support surface of a support member and a first surface of a sensor panel face each other, and the support surface and the first surface A holding step of holding the support member and the sensor panel so that a space is formed in at least a part of the space, and a liquid or gel adhesive in the space between the sensor panel and the support member There is provided a manufacturing method including an injection step of injecting and a step of fixing the sensor panel and the support member to each other by curing the adhesive.

  The above means provides a technique for fixing the sensor panel to the support member while suppressing deformation of the sensor panel.

The figure explaining the structure of the radiation detection apparatus of some embodiment of this invention. The figure explaining the supporting member of the radiation detection apparatus of FIG. The figure explaining the manufacturing method of the radiation detection apparatus of FIG. The figure explaining the other manufacturing method of the radiation detection apparatus of FIG. The figure explaining the structure of the radiation imaging system of some embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. Throughout the various embodiments, similar elements are given the same reference numerals, and redundant descriptions are omitted. In addition, each embodiment can be appropriately changed and combined.

  A configuration example of a radiation detection apparatus 100 according to some embodiments of the present invention will be described with reference to FIG. 1A is a plan view of the radiation detection apparatus 100, and FIG. 1B is a cross-sectional view of the radiation detection apparatus 100 taken along the line AA ′ of FIG. 1A. In FIG. 1A, only the side portion of the housing 160 is shown, and only the outline of the scintillator 121 is shown for the scintillator panel 120 so that the positional relationship of the elements of the radiation detection apparatus 100 becomes clear. The radiation exposed toward the subject enters the radiation detection apparatus 100 after being attenuated by the subject. The radiation detection apparatus 100 detects incident radiation and outputs a signal corresponding to the radiation dose. In the following description, radiation includes X-rays, α rays, β rays, and γ rays. The light includes visible light and infrared light.

  The radiation detection apparatus 100 includes a sensor panel 110, a scintillator panel 120, a fixing member 130, a support member 140, a fixing member 150, a housing 160, a fastening member 170, and a wiring board 180. The sensor panel 110 includes a plurality of sensor substrates 111, a base 112, and a fixing member 113. The scintillator panel 120 includes a scintillator 121 and a scintillator substrate 122.

  The scintillator 121 converts the radiation incident on the radiation detection apparatus 100 into light having a wavelength that can be detected by the sensor substrate 111 (for example, visible light). The scintillator 121 is held by a scintillator substrate 122, and is formed by evaporating a material on the scintillator substrate 122, for example. The scintillator 121 is formed of a columnar crystal such as CsI: Tl or a granular crystal such as GOS. The scintillator substrate 122 is made of, for example, aC (amorphous carbon), Al (aluminum), resin, or the like. The scintillator panel 120 may further include a moisture-resistant protective film that covers the surface of the scintillator 121 and suppresses intrusion of moisture into the scintillator 121. The moisture-resistant protective film is formed of, for example, polyparaxylylene or hot melt resin.

  The plurality of sensor substrates 111 are fixed to the base 112 in a state of being arranged in a two-dimensional array. Although the radiation detection apparatus 100 includes eight sensor substrates 111 arranged in 2 rows × 4 columns, the arrangement / number of sensor substrates 111 is not limited to this. A wiring board 180 is connected to one side of each sensor board 111. The wiring board 180 may be a flexible wiring board (FPC) or a rigid wiring board.

  Each of the plurality of sensor substrates 111 converts the light converted by the scintillator 121 into an electrical signal. The sensor substrate 111 includes a semiconductor substrate and circuit elements including conversion elements and switch elements formed on the semiconductor substrate. The sensor substrate 111 is, for example, a CMOS sensor, a CCD sensor, an a-Si (amorphous silicon) sensor, an SOI (Silicon on Insulator) sensor, or the like. For example, on each sensor substrate 111, a plurality of pixels having photoelectric conversion elements such as PIN-type and MIS-type photodiodes and switch elements such as TFTs are arranged in a two-dimensional array. Since the sensor substrate 111 may have an existing configuration, a detailed description thereof is omitted.

  As shown in FIG. 1, in the radiation detection apparatus 100 of the present embodiment, a plurality of sensor substrates 111 are spaced apart from each other in order to suppress electrical or mechanical influences that occur when the sensor substrates 111 contact each other. Are arranged. Instead of this, the plurality of sensor substrates 111 may be arranged to be in close contact with each other. The base 112 is made of a material such as a resin such as glass, quartz, or acrylic, a ceramic, or a metal.

  The electrical signals generated by the plurality of sensor boards 111 are transferred to the signal processing unit outside the radiation detection apparatus 100 through the wiring board 180. The signal processing unit generates a radiation image using the electrical signal acquired from the radiation detection apparatus 100. A moving image may be generated by the radiation detection apparatus 100 repeating generation and output of an electrical signal corresponding to the radiation dose.

  The fixing member 113 is sandwiched between the plurality of sensor substrates 111 and the base 112 and is bonded to each of them. Specifically, the fixing member 113 is bonded to each of the bottom surface (surface facing the base 112) of each sensor substrate 111 and the upper surface (surface facing the sensor substrate 111) of the base 112. The plurality of sensor substrates 111 and the base 112 are fixed to each other by the fixing member 130. The base 112 is on the opposite side of the scintillator panel 120 with respect to the plurality of sensor substrates 111. The fixing member 113 may be a sheet-like adhesive. As the fixing member 113, for example, a member in which an adhesive sheet is bonded to an elastic sheet such as an acrylic, silicon, or hot melt resin sheet or a sheet-like polyolefin foam is used.

  The fixing member 130 is sandwiched between the sensor panel 110 and the scintillator panel 120 and is bonded to each of them. Specifically, the fixing member 130 is bonded to each of the bottom surface of the scintillator 121 (surface facing the sensor panel 110) and the top surface of the sensor panel 110 (surface facing the scintillator 121). The sensor panel 110 and the scintillator panel 120 are fixed to each other by the fixing member 130. The fixing member 130 is formed of, for example, an acrylic, silicon, or hot melt resin sheet. The radiation detection apparatus 100 is an indirect radiation detection apparatus in which a sensor panel 110 and a scintillator panel 120 are bonded to each other. The radiation detection apparatus 100 is a direct radiation detection apparatus in which a scintillator is directly deposited on the sensor panel 110. There may be.

  The fixing member 150 is sandwiched between the base 112 and the support member 140 and is bonded to each of them. Specifically, the fixing member 150 is bonded to each of the upper surface of the support member 140 (surface facing the base 112) and the bottom surface of the base 112 (surface facing the support member 140). Hereinafter, the upper surface of the support member 140 is referred to as a support surface. The base 112 and the support member 140 are fixed to each other by the fixing member 150. The support member 140 is made of a metal material such as Al (aluminum) or SUS (stainless steel). The material of the support member 140 and the material of the base 112 are different from each other. The fixing member 150 is obtained by curing a liquid or gel adhesive. The support member 140 is fixed to the housing 160 by a fastening member 170 including screws and the like.

  Next, the details of the shape of the support member 140 will be described with reference to FIG. The flatness of the support surface of the support member 140 is 0.5 mm or more. The flatness of a surface is defined, for example, by JIS, where all points on the surface are in two planes parallel to the representative plane of the surface, and the distance between the planes is the minimum. Is the distance between the two surfaces. In the example of FIG. 2, a distance 202 between two parallel planes 201a and 201b sandwiching the support surface of the support member 140 represents the flatness of the support surface. The support surface of the support member 140 includes a flat region 140a and a region 140b inclined with respect to the region 140a. The region 140a being flat means that the flatness of the region 140a is equal to or less than a predetermined threshold (for example, 0.5 mm or less). The region 140b is inclined so as to reduce the thickness of the support member 140 as it approaches the side surface of the support member 140. As a result, the thickness of the region 140a and the thickness of the region 140b are different from each other. The thickness of the region 140a may be an average value of the thickness of each part of the region 140a, and the same applies to the thickness of the region 140b. The support surface of the support member 140 of the present embodiment has a region 140a inside thereof and a region 140b on the outer periphery thereof. The region 140b may be located on all sides of the support surface of the support member 140 and may surround the entire circumference of the region 140a. Alternatively, the region 140b may be located on a part of the support surface of the support member 140, and the region 140a may extend on the other side. The support surface region 140 a of the support member 140 is parallel to the bottom surface of the base 112, and the support surface region 140 b of the support member 140 is not parallel to the bottom surface of the base 112.

  In the present embodiment, the flatness of the bottom surface of the base 112 and the flatness of the support surface of the support member 140 are different from each other. Specifically, the flatness of the support surface of the support member 140 is greater than the flatness of the bottom surface of the base 112. For example, the flatness of the bottom surface of the base 112 is 0.0 mm or more and 0.5 mm or less, and the flatness of the support surface of the support member 140 is 0.5 mm or more and 10.0 mm or less.

  With reference to FIG. 3, the example of the manufacturing method of the radiation detection apparatus 100 is demonstrated. First, as shown in FIG. 3A, a structure 301 in which the sensor panel 110 and the scintillator panel 120 are fixed to each other by a fixing member 130 is prepared. The sensor panel 110 is formed by fixing a plurality of sensor substrates 111 to the base 112 using a fixing member 113. The scintillator panel 120 is formed by depositing the scintillator 121 on the scintillator substrate 122. The structure 301 is formed by fixing the sensor panel 110 and the scintillator panel 120 thus formed to each other by a fixing member 130.

  Subsequently, as illustrated in FIG. 3B, the support member 140 is held by the support base 302, and the structural body 301 is disposed on the support member 140. The structure 301 is held by a suspension device (not shown), and is held so that the bottom surface of the base 112 and the support surface of the support member 140 face each other. As shown in FIG. 3B, the bottom surface of the base 112 and the support surface of the support member 140 may be separated from each other. Instead, a part of the bottom surface of the base 112 and a part of the support surface of the support member 140 (for example, the region 140a) may be in contact with each other.

  Subsequently, as illustrated in FIG. 3C, the sealing member 303 is disposed so as to surround the space between the bottom surface of the base 112 and the support surface of the support member 140. Thereafter, a liquid or gel adhesive 304 is injected into the space formed by the base 112, the support member 140 and the sealing member 303. Thereafter, the adhesive 304 is cured. Curing of the adhesive 304 may be performed by natural drying, or may be performed by irradiation with ultraviolet rays or heating. The cured adhesive 304 is the fixing member 150 in FIG. Thereafter, the sealing member 303 and the support base 302 are removed, and the support member 140 is attached to the housing 160 with the fastening member 170, whereby the radiation detection apparatus 100 is completed.

  When fixing the support member 140 to the structure 301, when the support member 140 is pressed against the structure 301, due to the difference between the flatness of the bottom surface of the base 112 and the flatness of the support surface of the support member 140, The structure 301 may be deformed. When the structure 301 is deformed, the charge signal obtained by the radiation detection apparatus 100 varies accordingly. In this embodiment, since the structure 301 and the support member 140 are fixed to each other by injecting a liquid or gel adhesive, the flatness of the bottom surface of the base 112 and the plane of the support surface of the support member 140 are fixed. Deformation of the structure 301 due to the difference from the degree is suppressed. For example, the flatness of the bottom surface of the base 112 is maintained at 0.5 mm or less.

  With reference to FIG. 4, another example of the manufacturing method of the radiation detection apparatus 100 will be described. First, as shown in FIG. 4A, a structure 301 is prepared. This process is the same as the process of the manufacturing method described in FIG. Subsequently, as illustrated in FIG. 4B, the support member 140 is disposed on the support base 302. Then, the sheet-like adhesive member 401 is disposed on the support surface region 140a of the support member 140, and the structure 301 is disposed thereon. The structural body 301 is held by a suspension device (not shown), and is arranged such that the bottom surface of the base 112 and the support surface of the support member 140 face each other. The adhesive member 401 covers the region 140a of the support surface of the support member 140 and does not cover the region 140b. That is, the adhesive member 401 covers only a flat portion of the support surface of the support member 140. The adhesive member 401 is a member in which an adhesive sheet is bonded to an elastic sheet such as an acrylic, silicon, or hot melt resin sheet or a sheet-like polyolefin foam.

  Subsequently, as illustrated in FIG. 4C, the sealing member 303 is disposed so as to surround the space between the bottom surface of the base 112 and the support surface of the support member 140. Thereafter, a liquid or gel adhesive 402 is injected into the space formed by the base 112, the support member 140, the adhesive member 401, and the sealing member 303. Thereafter, the adhesive 402 is cured. Curing of the adhesive 402 may be performed by natural drying, or may be performed by irradiation with ultraviolet rays or heating. The hardened adhesive 402 and the adhesive member 401 become the fixing member 150 in FIG. Thereafter, the sealing member 303 and the support base 302 are removed, and the support member 140 is attached to the housing 160 with the fastening member 170, whereby the radiation detection apparatus 100 is completed. The material of the fixing member 150 of the radiation detection apparatus 100 manufactured by the method of FIG. 4 includes the portion between the region 140a and the base 112 of the support member 140, the region 140b of the support member 140, and the base 112. It is different from each other in the part in between. In the manufacturing method of FIG. 4, the sheet-like adhesive member 401 is used for bonding only the flat region 140a of the support surface of the support member 140, and the liquid or gel-like adhesive 402 is used for bonding the other region 140b. To do. Therefore, even in the manufacturing method of FIG. 4, the deformation of the structural body 301 due to the difference between the flatness of the bottom surface of the base 112 and the flatness of the support surface of the support member 140 is suppressed.

  The radiation imaging system SYS according to some embodiments will be described with reference to FIG. The radiation imaging system SYS is used as, for example, a radiological diagnostic apparatus. The radiation imaging system SYS includes each component shown in FIG. The radiation detection device DTC is fixed to one end of the C-arm ARM, and the radiation source SRC is fixed to the other end. The radiation detection apparatus DTC is, for example, the radiation detection apparatus 100 described above. The subject is located between the radiation detection apparatus DTC and the radiation source SRC. As the C-arm ARM rotates according to an instruction from the control device CTL, the angle of radiation irradiated from the radiation source SRC to the subject changes. Thereby, three-dimensional radiography is performed. The signal generated by the radiation detection device DTC is transferred to the control device CTL through the communication cable CMU. The control device CTL generates a three-dimensional radiation image based on this signal and displays it on the display unit DPL.

110 sensor panel, 111 sensor substrate, 112 base, 113 fixing member, 140 supporting member, 150 fixing member, 304 adhesive

Claims (16)

A method for manufacturing a radiation detection apparatus, comprising:
The support surface of the support member and the first surface of the sensor panel are opposed to each other, and the support member and the sensor panel are held so that a space is formed at least between the support surface and the first surface. Holding process to
An injection step of injecting a liquid or gel adhesive into the space between the sensor panel and the support member;
And a step of fixing the sensor panel and the support member to each other by curing the adhesive.   The manufacturing method according to claim 1, wherein the flatness of the first surface of the sensor panel and the flatness of the support surface of the support member are different from each other. The support surface of the support member includes a first region and a second region inclined with respect to the first region,
In the holding step, the support member and the sensor panel are held such that the first surface of the sensor panel and the first region of the support surface are parallel to each other,
3. The manufacturing method according to claim 1, wherein in the injection step, the adhesive is injected at least between the second region of the support surface and the sensor panel.   The manufacturing method according to claim 3, wherein in the injection step, the adhesive is further injected between the first region of the support surface and the sensor panel.   The manufacturing method according to claim 3, further comprising a step of disposing a sheet-like adhesive member between the first region of the support surface and the first surface of the sensor panel.   The manufacturing method according to claim 1, further comprising a step of arranging a scintillator so as to overlap the sensor panel.   The manufacturing method according to any one of claims 1 to 6, wherein the flatness of the support surface is 0.5 mm or more. The sensor panel includes a plurality of sensor substrates and a base on which the plurality of sensor substrates are fixed to one surface,
The said 1st surface of the said sensor panel is a surface on the opposite side to the surface to which these sensor substrates were fixed among the said bases, The any one of Claim 1 thru | or 7 characterized by the above-mentioned. Production method.   The manufacturing method according to claim 1, further comprising a step of attaching the support member to the casing using a fastening member. A sensor panel having a first surface;
A support member having a support surface at a position facing the first surface of the sensor panel;
A fixing member bonded to each of the first surface of the sensor panel and the support surface of the support member;
The support surface of the support member includes a first region parallel to the first surface of the sensor panel, and a second region inclined with respect to the first region,
The fixing member includes a first portion between the first region of the support surface and the sensor panel, and a second portion between the second region of the support surface and the sensor panel. ,
Radiation satisfying at least one of a difference between the material of the first part and the material of the second part and the difference between the thickness of the first part and the thickness of the second part Detection device.   The radiation detection apparatus according to claim 10, wherein the flatness of the first surface of the sensor panel and the flatness of the support surface of the support member are different from each other.   The radiation detection apparatus according to claim 10 or 11, wherein the flatness of the support surface of the support member is 0.5 mm or more. The sensor panel includes a plurality of sensor substrates and a base on which the plurality of sensor substrates are fixed to one surface,
The said 1st surface of the said sensor panel is a surface on the opposite side to the surface to which these sensor substrates were fixed among the said bases, The Claim 1 characterized by the above-mentioned. Radiation detection device. A housing,
The radiation detection apparatus according to claim 10, further comprising a fastening member that fixes the support member to the housing.   The radiation detection apparatus according to claim 10, further comprising a scintillator at a position overlapping the sensor panel. The radiation detection apparatus according to any one of claims 10 to 15,
A radiation imaging system comprising: signal processing means for processing a signal obtained by the radiation detection apparatus.