JP2016100188A - Panel sealing wire rod - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL panel and a panel sealing wire rod, which can bond peripheries of a support substrate and a sealing substrate with each other by a simple task.SOLUTION: A panel sealing wire rod 9 is composed of a long metal wire 21 which generates heat by energization, a conductive thin film 23 which coats an outer surface of the metal wire 21 and a sealing glass member 25 which coats an outer surface of the conductive thin film 23. A support substrate 3 and a sealing substrate 7 are bonded via the sealing glass member 25 by energizing the metal wire 21 to cause the metal wire 21 to generate heat and melting the sealing glass member 25 by the generated heat and subsequently cooling the sealing glass member 25.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a panel sealing wire and an organic EL panel using the same.

  Conventionally, an organic EL panel obtained by arranging an organic EL element between a support substrate and a sealing substrate and bonding the peripheral portions of the support substrate and the sealing substrate to each other is known (for example, Patent Documents). 1). Thereby, the organic EL element is disposed inside the organic EL panel.

JP 2013-8484 A

  However, in the organic EL panel described in Patent Document 1, since the peripheral portions of the support substrate and the sealing substrate are bonded together with an adhesive, there is a problem that the bonding operation is troublesome.

  Therefore, an object of the present invention is to provide an organic EL panel and a panel sealing wire capable of joining the peripheral portions of a support substrate and a sealing substrate with a simple operation.

  The panel sealing wire according to the present invention has electrical conductivity, a heat generating member that generates heat by energization, a sealing glass member that melts by the heat of the heat generating member, and these heat generating member and sealing glass member. And a conductive member disposed adjacent to each other, and is disposed between the joined body and the joined body, and is a panel sealing wire that joins the joined body and the joined body. The heat generating member generates heat by energization, and the glass member is melted by this heat so that the bonded body and the bonded body are bonded.

  Further, an organic EL panel according to the present invention includes a plate-like support substrate that is a bonded body, a sealing substrate that is a bonded body that is spaced apart from the support substrate in the thickness direction, and these An organic EL element disposed between the support substrate and the sealing substrate, a panel sealing wire disposed along the periphery of the support substrate and the sealing substrate, and joining the support substrate and the sealing substrate; The supporting substrate and the sealing substrate are bonded together by energizing the heat generating member in the panel sealing wire to generate heat, melting the sealing glass member with this heat, and then cooling.

  According to the panel sealing wire and the organic EL panel according to the present invention, the heat generating member generates heat by energization, and the sealing glass member is melted by this heat, thereby joining the support substrate and the sealing substrate. Can do. Thus, the support substrate and the sealing substrate can be efficiently joined by a simple operation of energizing the heat generating member.

1 is a perspective view showing an organic EL panel according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of FIG. 1. It is sectional drawing by the AA line of FIG. (A) shows the state before pressurizing the support substrate and the sealing substrate, and (b) shows the state after pressurizing the support substrate and the sealing substrate. It is a disassembled perspective view which shows the principal part of FIG. It is sectional drawing in the peripheral part of the organic electroluminescent panel which concerns on the 2nd Embodiment of this invention. (A) shows the state before pressurizing the support substrate and the sealing substrate, and (b) shows the state after pressurizing the support substrate and the sealing substrate. It is sectional drawing in the peripheral part of the organic electroluminescent panel which concerns on the 3rd Embodiment of this invention. (A) shows the state before pressurizing the support substrate and the sealing substrate, and (b) shows the state after pressurizing the support substrate and the sealing substrate. It is sectional drawing in the peripheral part of the organic electroluminescent panel which concerns on the 4th Embodiment of this invention. (A) shows the state before pressurizing the support substrate and the sealing substrate, and (b) shows the state after pressurizing the support substrate and the sealing substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First embodiment]
First, the organic EL panel 1 according to the first embodiment of the present invention will be described.

  As shown in FIGS. 1 to 4, the organic EL panel 1 includes a plate-like support substrate 3 (joined body) disposed on the lower side, and an organic EL element 5 disposed on the support substrate 3. The first and second panel sealing members for bonding the sealing substrate 7 (bonded body) disposed on the organic EL element 5 and the peripheral portions of the supporting substrate 3 and the sealing substrate 7 to each other. Wire rods 9 and 11. The support substrate 3, the organic EL element 5, and the sealing substrate 7 are all formed in a flat plate having a rectangular shape in plan view.

  As shown in FIG. 2, a plurality of plate-like terminals 13 are arranged on the periphery of the support substrate 3 at a predetermined interval. As shown in FIG. 3, the terminal 13 is fitted in the groove of the support substrate 3, and the upper surface of the terminal 13 is set flush with the upper surface of the support substrate 3.

  The organic EL element 5 is formed to have an outer dimension smaller than that of the support substrate 3 and the sealing substrate 7. As shown in FIG. 3, the anode 14 disposed on the lower side and the anode 14 are disposed on the anode 14. The organic light emitting layer 15 and the cathode 17 disposed on the organic light emitting layer 15 are integrally formed in a three-layer structure.

  As shown in FIG. 2, the sealing substrate 7 is provided with a plurality of plate-like terminals 19 at predetermined intervals on the periphery.

  As shown in FIGS. 1 and 2, two panel sealing wires 9 and 11 are disposed over the entire periphery of the peripheral edge of the support substrate 3 and the sealing substrate 7. Specifically, the panel sealing wires 9 and 11 include a first panel sealing wire 9 disposed on the left side in FIGS. 1 and 2 and a second panel sealing wire 11 disposed on the right side. It is. The first panel sealing wire 9 and the second panel sealing wire 11 are each formed in an L shape in plan view. When these first panel sealing wire 9 and second panel sealing wire 11 are combined, they are formed in a square shape in plan view.

  Here, the configuration of the panel sealing wires 9 and 11 according to the first embodiment will be described with reference to FIGS.

  The panel sealing wire 9 includes a heat generating member that is a long metal wire 21 having a circular cross section (that is, a cylindrical shape) disposed on the center side in the radial direction, and a conductive material that covers the outer surface of the metal wire 21. The conductive member is a thin film 23 and a sealing glass member 25 covering the outer surface of the conductive thin film 23.

  The long metal wire 21 serving as the heat generating member has electrical conductivity, for example, a nichrome wire can be adopted, and the diameter is, for example, about 180 μm. Since the metal wire 21 has a predetermined resistance value, it generates heat when energized. The exothermic temperature is about 600 ° C., for example.

  The conductive thin film 23 that is the conductive member is obtained by, for example, plating the outer surface of the metal wire 21 with a conductive metal such as copper or nickel.

  The sealing glass member 25 is a low-melting glass, and is deformed by being softened and melted at about 600 ° C., for example. The outer diameter of the sealing glass member 25 is, for example, 300 μm. The sealing glass member 25 can be coated on the outer surface of the conductive thin film 23 by immersing the metal wire 21 plated with the conductive thin film 23 in the molten glass and then pulling it up as it is.

  Next, a procedure for assembling the organic EL panel 1 will be described with reference to FIG.

  First, as shown in FIG. 3A, the organic EL element 5 is placed on the support substrate 3. At this time, since the anode 14 of the organic EL element 5 is disposed on the terminal 13 of the support substrate 3, both are in a conductive state. Further, the outer diameter dimension of the panel sealing wire 9 is set to be slightly larger than the thickness dimension of the organic EL element 5. Therefore, when the sealing substrate 7 is placed from the upper side, the lower surface of the sealing substrate 7 comes into contact with the panel sealing wire 9 and is lifted from the organic EL element 5.

  Next, when a current is passed through the metal wire 21 which is a heat generating member constituting the panel sealing wire 9, the metal wire 21 generates heat. This heat is transmitted to the sealing glass member 25 through the conductive thin film 23. Then, the sealing glass member 25 is softened and melted by heat and becomes deformable.

  In this state, as shown in FIG. 3B, when the sealing substrate 7 is pressed downward with a load P, the sealing glass member 25 is deformed and swells in an elliptical shape in the lateral direction. However, the metal wire 21 and the conductive thin film 23 are hardly deformed. Therefore, the thickness of the sealing glass member 25 becomes zero at the upper end and the lower end, and becomes the maximum at the left and right side ends in the horizontal direction. Then, when the deformed sealing glass member 25 is cooled, the peripheral portions of the support substrate 3 and the sealing substrate 7 are bonded together via the sealing glass member 25.

  Here, since the outer diameter dimension of the conductive thin film 23 is set to be the same as the thickness dimension of the organic EL element 5, when the sealing substrate 7 is pressed, the conductive thin film 23 contacts the terminal 13. As a result, the conductive thin film 23 is electrically connected to the anode 14 of the organic EL element 5 through the terminal 13 and becomes conductive. The conductive thin film 23 and the terminal 13 at the end portions 9a and 11a of the first panel sealing wire 9 and the second panel sealing wire 11 shown in FIG. Connected.

  Below, the effect by 1st Embodiment is demonstrated.

(1) The panel sealing wires 9 and 11 according to the first embodiment have electrical conductivity, a metal wire 21 (heat generating member) that generates heat by energization, and a sealing that melts by the heat of the metal wire 21 A glass substrate 25; and a conductive thin film 23 (conductive member) disposed in proximity to the heat generating member and the sealing glass member 25, and a support substrate 3 (joined body) and a sealing substrate 7 (bonded body). The supporting substrate 3 and the sealing substrate 7 are bonded to each other.

  According to the panel sealing wires 9 and 11 having the above-described configuration, the metal wire 21 generates heat when energized, and the glass member 25 is softened and melted by this heat, so that the support substrate 3 and the sealing substrate 7 And can be joined. Thus, the support substrate 3 and the sealing substrate 7 can be efficiently joined by a simple operation of energizing the metal wire 21.

  In addition to the sealing glass member 25, the panel sealing wires 9 and 11 also have a conductive thin film 23 (conductive member), so that the two operations of panel sealing and electrode routing are performed simultaneously. Can do.

  Furthermore, if the thickness of the sealing glass member 25 is appropriately changed, a desired bonding area can be adjusted.

  In addition, as shown in FIGS. 1 and 2, the end portions 9 a and 11 a can be arranged at positions protruding from the support substrate 3 and the sealing substrate 7, so that the electrodes can be easily taken out.

(2) In the panel sealing wires 9 and 11 according to the first embodiment, the heat generating member is a long metal wire 21, and the conductive member is a conductive material that covers the outer surface of the metal wire 21. The sealing glass member 25 is a thin film 23 and covers the outer surface of the conductive thin film 23.

  As described above, the panel sealing wires 9 and 11 can combine the metal wire 21 as a heat generating member, the sealing glass member 25 as a sealing material, and the conductive thin film 23 as an electrode into one wire. And efficient.

(3) The organic EL panel 1 includes a plate-shaped support substrate 3 that is a bonded body, a sealing substrate 7 that is a bonded body that is spaced apart from the support substrate 3 in the thickness direction, and these The organic EL element 5 disposed between the support substrate 3 and the sealing substrate 7, and the support substrate 3 and the sealing substrate 7 are disposed along the periphery of the sealing substrate 7. Panel sealing wires 9 and 11 to be joined. As a result, the support substrate can be obtained by a simple operation of energizing the metal wires 21 (heat generating members) in the panel sealing wires 9 and 11 to generate heat, melting the sealing glass member 25 with this heat, and then cooling. 3 and the sealing substrate 7 can be joined.

[Second Embodiment]
Next, a second embodiment of the present invention will be described, but the same reference numerals are given to the parts having the same structure as the first embodiment described above, and the description will be omitted.

  As shown in FIG. 5A, in the organic EL panel 101 according to the second embodiment, the panel sealing wire 109 that joins the peripheral portions of the support substrate 3 and the sealing substrate 7 is a heating member, a sealing member. It consists of a stop glass member and a conductive member.

  The heat generating member is a long metal wire 21 and has the same material and shape as those of the first embodiment.

  The sealing glass member 25 covers the outer surface of the metal wire 21 and has the same material and shape as in the first embodiment.

  The conductive member is a long conducting wire 123 and is formed to have the same diameter as the metal wire 21 of the heat generating member. In addition, the conductive member is disposed in the vicinity of the heat generating member covered with the sealing glass member 25. Specifically, the conductive wire 123 that is a conductive member is in contact with the sealing glass member 25.

  A procedure for joining the peripheral portions of the support substrate 3 and the sealing substrate 7 according to the second embodiment will be described.

  When a current is passed through the metal wire 21 that is a heat generating member constituting the panel sealing wire 109, the metal wire 21 generates heat. This heat is transmitted to the sealing glass member 25 on the outer peripheral side. Then, the sealing glass member 25 is softened and melted by heat and becomes deformable.

  In this state, as shown in FIG. 5B, when the sealing substrate 7 is pressed downward with a load P, the sealing glass member 25 is deformed and swells in the lateral direction. Then, when the deformed sealing glass member 25 is cooled, the peripheral portions of the support substrate 3 and the sealing substrate 7 are bonded together via the sealing glass member 25.

  Below, the effect by 2nd Embodiment is demonstrated.

(1) In the panel sealing wire 109 according to the second embodiment, the heat generating member is a long metal wire 21, the conductive member is a long conductive wire 123, and the sealing glass The member 25 covers the outer surface of the metal wire 21, and the conductive wire 123 is in contact with the sealing glass member 25 that covers the outer surface of the metal wire 21.

  Thus, since the sealing glass member 25 covers the outer surface of the metal wire 21, the heat of the metal wire 21 is directly transmitted to the sealing glass member 25. Therefore, the sealing glass member 25 can be efficiently softened and melted.

[Third embodiment]
Next, a third embodiment of the present invention will be described. Parts having the same structure as those of the first and second embodiments described above are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 6A, in the organic EL panel 201 according to the third embodiment, the panel sealing wire 209 that joins the peripheral portions of the support substrate 3 and the sealing substrate 7 is a heating member, a sealing member. It consists of a stop glass member and a conductive member.

  The heat generating member is a long metal wire 21 and has the same material and shape as those of the first and second embodiments.

  The conductive member is a long conducting wire 123 and is formed to have the same diameter as the metal wire 21 of the heat generating member.

  The sealing glass member 25 covers the outer surface of the conducting wire 123. The metal wire 21 is in contact with a sealing glass member 25 that covers the outer surface of the conducting wire 123.

  A procedure for joining the peripheral portions of the support substrate 3 and the sealing substrate 7 according to the third embodiment will be described.

  When a current is passed through the metal wire 21 that is a heat generating member constituting the panel sealing wire 209, the metal wire 21 generates heat. Here, since the metal wire 21 is in contact with the sealing glass member 25 covering the outer surface of the conducting wire 123, the heat of the metal wire 21 is transmitted to the sealing glass member 25. Then, the sealing glass member 25 is softened and melted by heat and becomes deformable.

  In this state, as shown in FIG. 6B, when the sealing substrate 7 is pressed downward with a load P, the sealing glass member 25 is deformed and swells in the lateral direction. Then, when the deformed sealing glass member 25 is cooled, the peripheral portions of the support substrate 3 and the sealing substrate 7 are bonded together via the sealing glass member 25.

  Below, the effect by 3rd Embodiment is demonstrated.

(1) In the panel sealing wire 209 according to the third embodiment, the heat generating member is a long metal wire 21, the conductive member is a long conductive wire 123, and the sealing glass. The member 25 covers the outer surface of the conductive wire 123, and the metal wire 21 is in contact with the sealing glass member 25 that covers the outer surface of the conductive wire 123.

  Thus, since the conducting wire 123 which is a conductive member has a larger cross-sectional area than the conductive thin film 23 according to the first embodiment, a larger current can flow than the conductive thin film 23.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described, but the same reference numerals are given to the parts having the same structure as the first to third embodiments described above, and the description will be omitted.

  As shown in FIG. 7A, in the organic EL panel 301 according to the fourth embodiment, the panel sealing wire 309 that joins the peripheral portions of the support substrate 3 and the sealing substrate 7 is a heating member, a sealing member. It consists of a stop glass member and a conductive member.

  The heat generating member is a long metal wire 21 and has the same material and shape as those of the first to third embodiments.

  The sealing glass member is a long glass rod 125 and is disposed in contact with the metal wire 21.

  The conductive member is a long conductive wire 123 and is disposed in proximity to the glass rod 125. The conducting wire 123 is formed to have the same diameter as the metal wire 21 that is a heat generating member. Specifically, the conductive wire 123 that is a conductive member is disposed in contact with the glass rod 125. In addition, the outer diameter of the glass rod 125 which is a sealing glass member is formed larger than the metal wire 21 of a heat generating member and the conducting wire 123 which is a conductive member.

  A procedure for joining the peripheral portions of the support substrate 3 and the sealing substrate 7 according to the fourth embodiment will be described.

  When a current is passed through the metal wire 21 which is a heat generating member constituting the panel sealing wire, the metal wire 21 generates heat. Here, since the metal wire 21 is in contact with the glass rod 125 which is a sealing glass member, the heat of the metal wire 21 is transmitted to the glass rod 125. Then, the glass rod 125 is softened and melted by heat and becomes deformable.

  In this state, as shown in FIG. 7B, when the sealing substrate 7 is pressed downward with a load P, the glass rod 125 is deformed and swells in the lateral direction. When the deformed glass rod 125 is cooled, the peripheral portions of the support substrate 3 and the sealing substrate 7 are bonded to each other via the glass rod 125.

  Below, the effect by 4th Embodiment is demonstrated.

(1) In the panel sealing wire 309 according to the fourth embodiment, the heat generating member is a long metal wire 21, and the sealing glass member is a long glass rod 125. Arranged in contact with the metal wire 21, the conductive member is a long conductive wire 123, which is arranged in proximity to the glass rod 125.

  Thus, since the elongate glass rod 125 is applied as the sealing glass member, it is not necessary to cover the heat generating member or the conductive member. For this reason, the operation | work which produces the wire 309 for panel sealing can be simplified. In addition, since the thickness of the glass rod 125 may be changed when the bonding strength is appropriately changed, the bonding strength can be easily changed.

1 Organic EL panel 3 Support substrate (joint)
7 Sealing substrate (bonded body)
9, 11, 109, 209, 309 Panel sealing wire 21 Metal wire (heating member)
23 Conductive thin film (conductive member)
25 Sealing glass member 123 Conductor (conductive member)
125 glass rod (sealing glass member)

The present invention relates to a panel sealing wire .

Therefore, an object of the present invention is to provide a panel sealing wire capable of joining the peripheral portions of a supporting substrate and a sealing substrate with a simple operation.

According to the panel sealing wire according to the present invention, the heating member generates heat by energization, and the sealing glass member is melted by this heat, whereby the bonded body and the bonded body can be bonded . Thus, the joined body and the joined body can be efficiently joined by a simple operation of energizing the heat generating member.

Claims (6)

A heat generating member that has electrical conductivity and generates heat when energized, a sealing glass member that is melted by the heat of the heat generating member, and a conductive member that is disposed in proximity to the heat generating member and the sealing glass member, Prepared,
A wire rod for panel sealing that is disposed between the joined body and the joined body, and joins the joined body and the joined body,
A panel sealing wire, wherein the heat generating member generates heat when energized and the glass member is melted by the heat so that the bonded body and the bonded body are bonded. The wire for panel sealing according to claim 1,
The heating member is a long metal wire,
The conductive member is a conductive thin film that covers the outer surface of the metal wire,
The sealing glass member covers an outer surface of the conductive thin film, and is a panel sealing wire. The wire for panel sealing according to claim 1,
The heating member is a long metal wire,
The sealing glass member covers the outer surface of the metal wire,
The conductive member is a long conductive wire, and is disposed in the vicinity of a heat generating member covered with the glass member. The wire for panel sealing according to claim 1,
The heating member is a long metal wire,
The conductive member is a long conducting wire,
The sealing glass member covers the outer surface of the conducting wire,
The said metal wire is contact | abutting to the sealing glass member which coat | covered the outer surface of conducting wire, The panel sealing wire characterized by the above-mentioned. The wire for panel sealing according to claim 1,
The heating member is a long metal wire,
The sealing glass member is a long glass rod, arranged in contact with the metal wire,
The panel sealing wire according to claim 1, wherein the conductive member is a long conducting wire and is disposed close to the glass rod. An organic EL panel using the panel sealing wire according to any one of claims 1 to 5,
A plate-like support substrate that is a joined body; and
A sealing substrate, which is an object to be joined, disposed apart from the support substrate in the thickness direction;
An organic EL element disposed between the support substrate and the sealing substrate;
A panel sealing wire disposed along the periphery of the support substrate and the sealing substrate and joining the support substrate and the sealing substrate; and
An organic material characterized in that a heating substrate in the panel sealing wire is energized to generate heat, the sealing glass member is melted with this heat, and then cooled to join the support substrate and the sealing substrate. EL panel.

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