JP2016091861A - Method for manufacturing wiring member and method for designing wiring member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring member and a method for designing a wiring member which are less restricted in the shielding member, compared with a configuration in which a shielding member and a ground line are electrically connected without a conductive sheet being interposed.SOLUTION: A method for manufacturing a wiring member comprises: preparing a wiring substrate 4 which covers a plurality of wires 2 including a ground line 2b with an insulating layer 3, and which has an opening portion being formed in the insulating layer 3, the opening portion exposing at least part of the ground line 2b; disposing a conductive sheet 5 on the insulating layer 3 which includes the opening portion of the wiring substrate 4; thermocompression-bonding the conductive sheet 5 to the ground line 2b by moving an upper plate 201 in a thickness direction of the wiring substrate 4; folding a portion of the conductive sheet 5 apart from a location with which the ground line 2b has been or is planned to be thermocompression-bonded, after or before the thermocompression bonding step; and electrically connecting a shielding member 6 to the folded portion of the conductive sheet 5.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing and designing a wiring member.

  Conventionally, when a shield member is provided on a wiring substrate having a plurality of wirings including signal lines and ground lines and an insulating layer covering the plurality of wirings, an opening exposing at least a part of the ground lines is insulated. There is known a wiring member that is provided in a layer and grounds a shield member to a ground line through the opening (see, for example, Patent Documents 1 to 3).

  In Patent Document 1, in a structure in which a shield material is attached to a flexible flat cable having an insulating film on the upper and lower surfaces of a conductor group, an opening is provided in the insulating film so that the conductor is exposed, and exposed through this opening. The structure which electrically connects the conductor and the shield metal of the shielding material by ultrasonic bonding is disclosed.

  Patent Document 2 discloses a method of electrically connecting a shield material to a ground wire by thermally bonding a shield material having a conductive thermal adhesive layer to a ground wire exposed from a covering material of a flat cable with a heated rubber roller. It is disclosed.

  Patent Document 3 discloses a method in which a contact hole is provided in a portion of an insulating film of a flat cable facing a grounding conductor, and the shield film is heat-pressed to the grounding conductor by a hot press roller.

  On the other hand, in a structure in which a conductive tape is wrapped around a shield sheet and wound around a flexible flat cable, a grounding member is provided to hold the flexible flat cable at the position of the conductive tape, and the grounding member is fixed to the sheet metal box. And the method of suppressing the harmonic which is the cause of EMI (Electro Magnetic Interference: Electromagnetic Interference) unnecessary radiation by adjusting the length of a shield sheet is proposed (for example, refer to patent documents 4).

JP 2004-259619 A JP 2002-329425 A Japanese Utility Model Publication No. 04-36722 JP 2013-175375 A

  An object of the present invention is to provide a manufacturing method and a designing method of a wiring member with less restrictions on the shield member as compared with a configuration in which the shield member and the ground line are electrically connected without using a conductive sheet. is there.

[1] preparing a wiring substrate including a plurality of wirings including a ground line, and an insulating layer that covers the plurality of wirings and is formed with an opening that exposes at least a part of the ground line;
Arranging a conductive sheet provided with an insulating layer on one side and a conductive adhesive layer on the other side on the insulating layer including the opening of the wiring substrate;
Thermocompression bonding the conductive adhesive layer of the conductive sheet to the ground line by moving a pressure member in the thickness direction of the wiring substrate;
After or before the step of thermocompression bonding, a step of folding back a portion of the conductive sheet that is thermocompression bonded to the ground wire or a portion that is away from a location that is scheduled to be thermocompression bonded to the ground wire;
And a step of electrically connecting a shield member to the folded portion of the conductive sheet.
[2] The method for manufacturing a wiring member according to [1], wherein the thermocompression bonding step supports the wiring member via an elastic member.
[3] The method for manufacturing a wiring member according to [1], wherein the step of providing the shield member is a step of thermocompression bonding the shield member to the conductive adhesive layer of the conductive sheet using a heating roller. .
[4] A wiring substrate including a plurality of wirings including a ground line, and an insulating layer that covers the plurality of wirings and is formed with an opening that exposes at least a part of the ground line;
An insulating layer is provided on one surface side, and a conductive adhesive layer is provided on the other surface side, and is disposed on the insulating layer including the opening of the wiring substrate in a state where the insulating layers are folded back to face each other. A conductive sheet in which the conductive adhesive layer of the portion that is not folded is electrically connected to the ground line through the opening;
Arranged on the wiring substrate and the conductive sheet, adhered to the conductive adhesive layer of the folded portion of the conductive sheet, and electrically connected to the ground line through the folded portion. A method of manufacturing a plurality of wiring members provided with a shield member,
A method for manufacturing a wiring member, wherein the plurality of wiring members are manufactured such that a length in a longitudinal direction of the wiring substrate of the unfolded portion of the conductive sheet is different between the plurality of wiring members.
[5] The method for manufacturing a wiring member according to [4], wherein the conductive sheet is formed such that a width direction orthogonal to a longitudinal direction of the wiring substrate is equal between the plurality of wiring members.
[6] The method for manufacturing a wiring member according to [4] or [5], wherein the wiring substrate is formed such that a width direction orthogonal to a longitudinal direction of the wiring substrate is equal between the plurality of wiring members. .
[7] A wiring substrate including a plurality of wirings including a ground line, and an insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line;
An insulating layer is provided on one surface side, and a conductive adhesive layer is provided on the other surface side, and is disposed on the insulating layer including the opening of the wiring substrate in a state where the insulating layers are folded back to face each other. A conductive sheet in which the conductive adhesive layer of the portion that is not folded is electrically connected to the ground line through the opening;
Arranged on the wiring substrate and the conductive sheet, adhered to the conductive adhesive layer of the folded portion of the conductive sheet, and electrically connected to the ground line through the folded portion. A shield member, and a wiring member design method comprising:
The size of the conductive sheet that satisfies the standard value required for the electrical equipment on which the wiring member is mounted based on the result of measuring the noise characteristics when the size of the conductive sheet is changed Selecting a process,
A method for designing a wiring member including
[8] The method for designing a wiring member according to [7], further including a step of measuring noise characteristics when the size of the conductive sheet is changed.
[9] A method for manufacturing a wiring member, wherein the wiring member is manufactured using the conductive sheet having a size designed by the method for designing a wiring member according to [7] or [8].

According to the first aspect of the present invention, the wiring member manufactured by this manufacturing method has a limitation on the shielding member as compared with the configuration in which the shielding member and the ground line are electrically connected without using the conductive sheet. Less.
According to the invention which concerns on Claim 2, a conductive sheet and a ground wire become easy to be connected because a wiring member deform | transforms and an opening part opens.
According to the invention which concerns on Claim 3, productivity of thermocompression bonding becomes high compared with a thermocompression-bonding press.
According to the inventions according to claims 4 to 6, the wiring member manufactured by the present manufacturing method is compared with the configuration in which the shield member and the ground wire are electrically connected without using the conductive sheet, The restriction of the shield member is reduced. Moreover, the noise standard value requested | required of each electric equipment to which a wiring member is applied can be satisfied, respectively.
According to the invention which concerns on Claim 7, 8, the wiring member designed by this design method and manufactured based on it is the structure which electrically connects a shield member and a ground wire without passing through an electroconductive sheet. In comparison, the shield member is less restricted. Moreover, the noise standard value requested | required of the electric equipment to which the wiring member is applied can be satisfied, respectively.

FIG. 1 is a perspective view illustrating a schematic configuration example of a wiring member according to an embodiment of the present invention and a schematic configuration example of an electronic apparatus to which the wiring member is applied. FIG. 2 is an exploded perspective view of the vicinity of one end of the wiring member. FIG. 3 is a cross-sectional view taken along the line EE shown in FIG. 4A, 4B, and 4C are a cross-sectional view taken along line AA, a cross-sectional view taken along line BB, and a cross-sectional view taken along line CC in FIG. 3, respectively. FIG. 5 is a plan view of the main part of the shield member. FIGS. 6A to 6D are perspective views showing modifications of the conductive sheet. FIG. 7 is a diagram showing a process of thermocompression bonding a conductive sheet to a wiring substrate using a thermocompression press.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, about the component which has the substantially same function, the same code | symbol is attached | subjected and the duplicate description is abbreviate | omitted. It should be noted that the scale and shape of the drawings include portions emphasized for easy understanding of the features of the invention, and are not necessarily the same as the scale and shape of actual members.

[Embodiment]
FIG. 1 is a perspective view illustrating a schematic configuration example of a wiring member according to an embodiment of the present invention and a schematic configuration example of an electronic apparatus to which the wiring member is applied.

  This electronic device 100 electrically connects a first board 110A having a first connector 111A, a second board 110B having a second connector 111B, and the first connector 111A and the second connector 111B. The wiring member 1 which concerns on this Embodiment connected is provided. The number of wiring members 1 is not limited to one and may be two or more.

  Examples of the electronic device 100 include, but are not limited to, a television receiver, an in-vehicle device such as a car navigation device and an audio device, and an image forming device such as a printer and a multifunction device.

  For example, electronic components and a power source are mounted on the first and second substrates 110A and 110B. For example, the wiring member 1 transmits a signal or power having a frequency of 10 MHz to 1 GHz. In the case where the electronic device 100 is an image forming apparatus, for example, CMYK is passed from the controller to the exposure apparatus via four wiring members 1 corresponding to C (cyan), M (magenta), Y (yellow), and K (black). An image writing signal modulated based on the image data of each color is transmitted.

  The wiring member 1 is configured to electrically connect a wiring base 4 in which a plurality of wirings are covered with an insulating layer, a shield member 6 that covers the wiring base 4, and a ground line and the shield member 6 among the plurality of wirings of the wiring base 4. And a conductive sheet to be connected later. In addition, the wiring member 1 is provided with terminal portions 20a and 20b in which a plurality of wirings 2 are exposed at both ends in the longitudinal direction D. The terminal portions 20a and 20b at both ends are electrically connected to the first connector 111A provided on the first substrate 110A and the second connector 111B provided on the second substrate 110B, respectively.

  Here, the “wiring member” has a flat plate-like long shape, covers a plurality of wires with an insulating layer, and has flexibility in which the wires are exposed as terminal portions at both ends in the longitudinal direction D. Say. The “end portion” refers to a portion of the wiring member 1 where the terminal portions 20a and 20b are present. The wiring member includes a flexible flat cable (FFC), a flexible printed wiring board (FPC) in which an element is mounted on a substrate, and the like. The “conductive sheet” refers to a sheet having a thickness smaller than the width and length and having conductivity. In the conductive sheet, a metal layer is formed on one surface of the insulating layer, and a conductive adhesive layer is formed on the metal layer, an insulating layer or a conductive adhesive layer is not provided, only the metal layer Is included. The “shield member” means a member having a function of shielding noise radiated from the wiring to the outside and noise entering the wiring from the outside. Shield members include those in which a metal layer is formed on one surface of an insulating layer and an adhesive layer is formed on the metal layer, those that do not have an insulating layer or an adhesive layer, and those that consist only of a metal layer It is.

  FIG. 2 is an exploded perspective view of the vicinity of one end of the wiring member 1. FIG. 3 is a cross-sectional view taken along the line EE shown in FIG. 4A, 4B, and 4C are a cross-sectional view taken along line AA, a cross-sectional view taken along line BB, and a cross-sectional view taken along line CC in FIG. 3, respectively.

  As shown in FIG. 2, in the wiring member 1, the conductive sheet 5 is arranged in a region in the vicinity of the end (for example, a region in which the distance between the end is equal to or less than ¼ of the total length in the longitudinal direction D). ing. In addition, the area | region where the electroconductive sheet 5 is arrange | positioned may be areas other than the area | region of the edge part vicinity.

(Configuration of wiring substrate)
The wiring substrate 4 includes a plurality of wirings 2 including the ground lines 2b, and an insulating layer 3 that covers the plurality of wirings 2 and has openings that expose at least a part of the ground lines 2b. Specifically, the wiring substrate 4 includes a plurality of wirings 2 arranged in parallel at regular intervals, and an insulating layer 3 that covers the plurality of wirings 2.

  The wiring 2 includes a signal line 2a and a ground line 2b. The number of ground lines 2b is two in the figure, but may be one or three or more. The number of wirings 2 is six in the figure, but is not limited to six. The wiring 2 is made of, for example, a flat conductor having a rectangular cross section, but may have another shape such as a circular cross section. A flat-plate conductor is preferable for achieving electrical connection with the conductive sheet 5. As the wiring 2, for example, copper plated with gold can be used.

  The wiring substrate 4 has a plurality of wirings 2 arranged on one surface of the insulating layer 3a with an adhesive layer, and is pressed with a heating roll so that the plurality of wirings 2 are sandwiched between the pair of insulating layers 3a and 3b with an adhesive layer. Formed with. For example, polyester terephthalate (PET) can be used for the insulating layers 3a and 3b. As shown in FIG. 2, a groove 30 exposing the ground line 2b is formed in the upper insulating layer 3b along the longitudinal direction D.

  The groove 30 is an example of an opening, and may be a hole such as a long hole or a circle. The number of openings may be one for one ground line 2b, but may be one for each region near the end, and a plurality of openings may be provided along the longitudinal direction D in the region near the terminal portion. It may be formed. The position of the opening may be a region other than the region near the end.

(Construction of conductive sheet)
The conductive sheet 5 is provided with an insulating layer 50 on one surface side and a conductive adhesive layer 52 on the other surface side, and the grooves 30 of the wiring substrate 4 are formed in a state of being folded back so that the insulating layers 50 face each other. A portion of the conductive adhesive layer 52 that is disposed on the insulating layer 3 that is not folded back is electrically connected to the ground line 2 b through the groove 30.

  Specifically, the conductive sheet 5 includes an insulating layer 50, a metal layer 51 provided on the insulating layer 50, and a conductive adhesive layer 52 provided on the metal layer 51.

  As shown in FIG. 2, the conductive sheet 5 includes a wiring substrate including a groove 30 in a state in which the folded portion 5 b is folded so that the insulating layer 50 faces the base portion 5 a located on the wiring substrate 4 side. 4 is disposed on the surface of the insulating layer 3b with the adhesive layer. Then, as shown in FIG. 4, by pressing the contact portions 5 c at two positions facing the ground line 2 b of the base portion 5 a and the periphery thereof with a thermocompression press, as shown in FIG. The conductive adhesive layer 52 is pushed into the groove 30, and the conductive adhesive layer 52 is thermocompression bonded to the ground wire 2b to be electrically connected.

  The method for electrically connecting the conductive sheet 5 to the ground wire 2b is not limited to thermocompression bonding, and other methods such as a method using a heating roller or ultrasonic bonding may be used. Ultrasonic bonding is an effective method when the conductive sheet 5 consists of only a metal layer or a metal layer and a conductive adhesive layer. Moreover, you may provide the protrusion which enters into the groove | channel 30 in the press surface of the upper plate of a thermocompression-bonding press. Thereby, the conductive adhesive layer 52 of the conductive sheet 5 is easily pushed into the groove 30, and the electrical connection with the ground line 2 b becomes more reliable.

  Compared to the configuration in which the shield member 6 is directly connected to the wiring substrate 4 without the conductive sheet 5 interposed therebetween, the conductive sheet 5 has the same characteristics as the shield member 6 and the ground wire 2b. It is preferable to use one having a characteristic that the electrical resistance between them is suppressed. For example, the conductive sheet 5 is preferably thinner than the shield member 6. In addition, the metal layer 51 of the conductive sheet 5 is preferably more ductile than the metal layer 61 of the shield member 6 and is thinner than the metal layer 61 of the shield member 6.

  Specifically, the total thickness of the conductive sheet 5 is about 30 μm, which is thinner than the shield member 6 in the present embodiment. For example, PET having a thickness of about 10 μm can be used for the insulating layer 50 of the conductive sheet 5. The metal layer 51 is made of, for example, silver or the like having higher ductility than the metal layer 61 of the shield member 6. The metal layer 51 may be thinner than the metal layer 61 of the shield member 6, for example, about 0.1 μm and having a surface resistance of about 200 mΩ / □. As the conductive adhesive layer 52, for example, a polyester thermoplastic resin mixed with silver-coated copper powder and having a thickness of approximately 20 μm can be used. The adhesive strength of the conductive adhesive layer 52 can be, for example, about 4 N / cm (vs. PET).

  Although the number of the conductive sheets 5 and the position in the longitudinal direction D are not particularly limited, it is preferable that the conductive sheet 5 is provided at the end in the longitudinal direction D of the ground wire 2b in the wiring substrate 4, preferably at both ends. Since the shield member 6 can be grounded at a position close to the ground of the electronic device 100 as compared with a region other than the region near the end of the wiring substrate 4, for example, the central portion, a higher shielding effect can be obtained. I can expect.

(Configuration of shield member)
The shield member 6 is disposed on the wiring substrate 4 and the conductive sheet 5 and adhered to the conductive adhesive layer 52 of the folded portion of the conductive sheet 5, and is electrically connected to the ground line 2b through the folded portion. Connected.

  Specifically, the shield member 6 includes an insulating layer 60, a metal layer 61 provided on one surface of the insulating layer 60, and an insulating adhesive layer 62 partially provided on the surface of the metal layer 61. Prepare. For example, PET having a thickness of about 10 to 20 μm can be used for the insulating layer 60. For example, aluminum having a thickness of about 10 to 20 μm can be used for the metal layer 61. For the insulating adhesive layer 62, for example, a thermosetting adhesive having a thickness of about 10 to 20 μm can be used.

  The shield member 6 is provided so as to cover the periphery of the wiring substrate 4 excluding the terminal portion and the conductive sheet 5, and is adhered to the conductive adhesive layer 52 of the folded portion 5b of the conductive sheet 5, and the folded portion 5b and the base portion. It is electrically connected to the ground line 2b via 5a.

  FIG. 5 is a main part plan view of the shield member 6. The insulating adhesive layer 62 of the shield member 6 includes a plurality of parallel line patterns 620 extending in a direction intersecting the longitudinal direction D. That is, the insulating adhesive layer 62 is a repeated pattern in which the line pattern 620 is repeated in the width direction orthogonal to the longitudinal direction D. This pattern may be a repetitive pattern other than that shown in FIG. 5 because it is sufficient that electrical conduction can be obtained when the shield member 6 is attached to the folded portion 5b of the conductive sheet 5. For example, it may be a plurality of line patterns parallel to each other extending in the longitudinal direction D, or may be a dot pattern composed of dots having a size that does not cover all the folded portions 5b, or another repeating pattern. Furthermore, the pattern need not be repeated as long as electrical continuity can be obtained.

  By using a plurality of line patterns 620 extending in the direction crossing the longitudinal direction D as the insulating adhesive layer 62, the region of the metal layer 61 where the line pattern 620 is not provided becomes the conductive adhesive layer 52 of the conductive sheet 5. The metal layer 61 of the shield member 6 can be electrically connected to the ground line 2b by contact. Further, accurate positioning with respect to the folded portion 5b when the shield member 6 is affixed becomes unnecessary. Further, the shield characteristics are stabilized by bringing the shield member 6 into close contact with the wiring substrate 4 by the insulating adhesive layer 62.

(Design method for wiring members)
Next, an example of a wiring member design method will be described.

(1) Measurement of noise characteristics First, the noise characteristics when the size of the conductive sheet 5 is changed are measured. This is because, as will be described later, when a conductive member is provided at the end of the wiring member, a suppressing effect can be expected especially at a frequency corresponding to the size of the conductive member. The size of the conductive sheet 5 is, for example, the length of the diagonal line of the base portion 5a. The noise characteristic may be a noise characteristic of the wiring member 1 alone or may be a noise characteristic in a state of being incorporated in an electronic device. In addition, the magnitude | size of the electroconductive sheet 5 may be the length of the longitudinal direction D of the base part 5a, or the area of the base part 5a.

(2) Selection of Size of Conductive Sheet Next, the size of the conductive sheet 5 that satisfies the noise standard value required for the electronic device on which the wiring member 1 is mounted is selected from the measurement result. If the noise standard value can be satisfied only by optimizing the shield member 6, the size of the conductive sheet 5 is arbitrary, but there is noise of a specific frequency that cannot be suppressed only by optimizing the shield member 6. In this case, the noise standard value can be easily satisfied by using the conductive sheet 5 having a size corresponding to the frequency.

(Manufacturing method of wiring member)
Next, an example of a method for manufacturing the wiring member 1 will be described.

(1) Formation of wiring substrate First, an insulating layer 3a with an adhesive layer in which a plurality of wirings 2 are formed by opening a notch by punching out a region corresponding to an end of the insulating layer 3b with an adhesive layer, and The insulating layer 3b with an adhesive layer covering the plurality of wirings 2 is joined by a heating roller. Next, the portion of the insulating layer 3b covering the ground line 2b is peeled along the longitudinal direction D. In this way, the wiring substrate 4 is formed.

(2) Arrangement of Conductive Sheet Next, the conductive sheet 5 having a size selected in the wiring member design method is prepared.

  Next, the prepared conductive sheet 5 is disposed in the vicinity of the terminal portions 20a and 20b. Next, the region including the contact portion 5c is bonded to the surface of the insulating layer 3b by thermocompression bonding under conditions of a temperature of 120 °, a pressure of 0.5 to 1 MPa, and a time of 5 to 10 seconds. The layer 52 is brought into contact with the ground line 2b to be electrically connected. Next, the folded portion 5b is formed by folding back the portion of the conductive sheet 5 opposite to the terminal portions 20a and 20b. In addition, when the folding | returning part 5b is a magnitude | size which does not cover all the contact parts 5c, after forming the folding | returning part 5b, you may thermocompress the contact part 5c which is not covered. In order to maintain the folded state, an adhesive member such as a double-sided tape may be applied to the folded portion 5b on the insulating layer 50 side so that the folded portion 5b does not return to its original state.

(3) Covering with shielding member The whole of the wiring substrate 4 on which the conductive sheet 5 is arranged except for the terminal portions 20a and 20b is covered with the shielding member 6, and the shielding member 6 is covered with the conductive sheet 5 and the wiring board by a heating roller Join the material 4. The wiring member 1 is formed as described above.

  When a plurality of wiring members 1 are manufactured, the size of the conductive sheet 5 may be varied according to the noise characteristics required for the mounted electronic device.

(Operations and effects of the present embodiment)
(1) Reduction of connection impedance between conductive sheet and ground wire When a sheet-like member is thermocompression bonded to a wiring member such as an FFC, a heating roller is generally used (for example, JP-A-2002-329425). (See paragraph [0038] of Japanese Laid-Open Patent Publication No. 2004, FIG. 5 (d) of Japanese Utility Model Laid-Open No. 04-36722). For this reason, even in the structure of the present embodiment in which a conductive sheet is interposed between the wiring substrate and the shield member, the heating roller is used and the conductive sheet is disposed on the wiring substrate, or Furthermore, the method of thermocompression bonding in the state which has arrange | positioned the shield member on the electroconductive sheet can be considered.

  However, in the case of a heating roller, pressure is applied while the wiring member and the heating roller are moved relatively, so that the pressure applied to the conductive sheet changes in accordance with the relative movement, resulting in a conductive shape in the uneven shape of the opening. Since the adhesive sheet is difficult to follow sufficiently and it is difficult to obtain a desired adhesion state (connection impedance), a higher shielding effect cannot be obtained.

  Therefore, in this embodiment, when the conductive sheet 5 is thermally bonded, by using a press machine or the like that can apply pressure in a stationary state, the conductive sheet is thermocompression bonded using a heating roller. As compared with the above, the connection impedance between the conductive sheet 5 and the ground line 2b is easily reduced.

(2) Suppressing deterioration of noise characteristics In wiring members mounted on electronic equipment, noise with a frequency corresponding to the harmonic component of the signal waveform to be transmitted is likely to occur. Therefore, a shield structure that can be expected to reduce noise at these specific frequencies is desired. As such a structure, for example, as shown in JP2013-175375A, a shield member and a conductive tape are wound around an end of a wiring substrate, and the wiring substrate is held at the position of the conductive tape. A method is conceivable in which a conductive holding member is provided and a structure in which the holding member is fixed to a sheet metal box is adopted, and the length of the shield member is set to a length corresponding to a specific frequency to be suppressed.

  However, when the length of the shield member itself is set to a length corresponding to the specific frequency to be suppressed, an optimal noise suppression effect can be expected for a specific frequency component, but the length of the shield member itself changes. As a result, there is a concern that noise characteristics deteriorate at frequencies other than the specific frequency.

  Therefore, in the present embodiment, not only the shield member 6 but also the size of the conductive sheet 5 is changed, so that not only a noise reduction effect can be expected at a specific frequency, but also the length of the shield member 6 itself is increased. Compared with the case where it changes, the deterioration of the noise characteristic in frequencies other than a specific frequency can be suppressed.

  Moreover, if the wiring member 1 scheduled to be mounted on the electronic device is provided by another person with a plurality of wiring members 1 having different sizes of the conductive sheet 5, the size of the conductive sheet 5 is different by itself. The design of the wiring member 1 is easier than preparing a plurality of wiring members 1.

(Modification of shield member)
If the shield member 6 can be disposed in a state of being close to the wiring base material 4 without using an adhesive by covering the periphery of the wiring base material 4, the shield member 6 having no adhesive layer is used. Also good. Further, the shield member 6 may be provided only on the side where the conductive sheet 5 is provided. The shield member 6 preferably covers the entire wiring substrate 4 except for the periphery of the terminal portions 20 and 20b of the wiring substrate 4, but has a configuration covering only the periphery of the wiring substrate 4, for example, an end portion. It may be provided only in the vicinity region, or may be provided in a region other than the region near the end. Further, a conductive adhesive layer may be formed on the entire surface of the metal layer 61 or partially as an adhesive layer.

(Modification of conductive sheet)
6A to 6D are perspective views showing modifications of the conductive sheet 5. As shown in FIG. 6A, the conductive sheet 5 may have a folded portion 5b on the terminal portion 20a side. The same applies to one terminal portion 20b. Moreover, as shown in FIG.6 (b), the electroconductive sheet 5 may provide the folding | returning part 5b in the both ends side of the longitudinal direction D, respectively. Moreover, as shown in FIG.6 (c), the electroconductive sheet 5 may be arrange | positioned in the direction orthogonal to the longitudinal direction D, and the folding | returning part 5b may be provided in both ends, respectively. Moreover, as shown in FIG.6 (d), the electroconductive sheet 5 may make the folding | returning part 5b the same magnitude | size as the base 5a.

  If the entire conductive sheet 5 is covered with the shield member 6, noise can be suppressed as compared with a case where only a part is covered. Therefore, the entire conductive sheet 5 is preferably covered with the shield member 6. Since the portion where the conductive sheet 5 and the shield member 6 overlap functions as a double shield, the entire conductive sheet 5 may not be covered with the shield member 6.

  Any of the sides of the conductive sheet 5 may be folded, but the folding from the one terminal portion 20a, 20b side toward the other terminal portion 20b, 20a side is when there are a plurality of ground lines. However, it is preferable because the grounding to each ground line can be surely taken.

  The amount of folding of the conductive sheet 5 is also arbitrary, but the contact area between the shield member 6 and the ground wire 2b increases when the base portion 5a on the side following the opening is wider than the folding portion 5b. This is preferable because the impedance between the member 6 and the ground line 2b can be easily reduced.

  A sample corresponding to this embodiment was manufactured as a sample of the example. That is, the wiring substrate 4 used was a structure in which the copper surface was gold-plated and sandwiched between insulating layers 3a and 3b made of PET with an adhesive layer. The insulating layer 50 of the conductive sheet 5 uses a PET sheet, the conductive adhesive layer 52 uses a polyester-based thermoplastic resin mixed with silver-coated copper powder, and the metal layer 51 has a thickness of silver. Used was about 0.1 μm. The shield member 6 was a 15 μm thick PET sheet as the insulating layer 60, 15 μm thick aluminum was used as the metal layer 61, and 15 μm thick was used as the insulating adhesive layer 62.

  The conductive sheet 5 was bonded to the wiring substrate 4 with a thermocompression press shown in FIG. 7, and the shield member 6 was attached with a heating roller. The thermocompression pressing machine 200 includes an upper plate 201, a lower plate 202, and an elastic member 203 disposed on the lower plate 202. The elastic member 203 is preferably a sponge having a hardness of about 30, for example.

(Environmental testing)
The wiring substrate 4 is disposed on the elastic member 203, the conductive sheet 5 is disposed on the wiring substrate 4, the upper plate 201 is heated to 98 ° C. or 110 ° C., and the lower plate 202 is predetermined. While heating to a temperature (for example, 100 ° C. to 110 ° C.), the upper plate 201 was pressed downward at a predetermined pressure (for example, 0.35 Mpa) for a predetermined time (for example, 2 seconds). Five samples were produced as described above, and the resistance value between the ground wire and the shield member before and after the environmental test (temperature 55 ° C., humidity 95% RH) was measured. The results are shown in Table 1.

  The resistance value between the ground wire and the shield member after the environmental test was about 3 to 5 Ω higher than the resistance value before the environmental test, and met the target value.

(Average resistance value and standard deviation)
The wiring substrate 4 is disposed on the elastic member 203, the conductive sheet 5 is disposed on the wiring substrate 4, and the upper plate 201 and the lower plate 202 are set at a predetermined temperature (for example, 100 ° C. to 110 ° C.). While being heated, the upper plate 201 was pressed downward at a predetermined pressure (for example, 0.35 MPa) for a predetermined time (for example, 2 seconds).

Five samples were produced as described above, and the resistance value between the ground wire and the shield member was measured. The measurement results are shown in Table 2.

(Comparative example)
In the comparative example, there was no conductive tape, and the shield member with the adhesive layer was directly connected to the ground line 2b of the wiring substrate 4 using a heating roller.

Eight samples were prepared and the resistance value between the ground wire and the shield member was measured, and the measurement results are shown in Table 3.

(Noise measurement result)
The sample of the comparative example and the sample of the present example were each mounted on a printer, and noise measurement was performed with the printer operated. The results are shown in Table 4. Table 4 shows the measurement results for the VCCI standard value, and shows the margin for the VCCI noise standard value at a frequency (near 220 MHz) having the smallest margin (margin) in the measurement frequency band. The standard value represents a margin with respect to the QP value (quasi-peak value / Quasi-peak), and 220 MHz is a frequency corresponding to the fourth harmonic of the fundamental frequency transmitted to the FFC.

(Evaluation results)
As for the resistance, both the average value and the standard deviation (variation) of the resistance value in this example are significantly improved as compared with the comparative example. As for noise, in the comparative example, there was only a margin of 2.8 dB with respect to the standard value, but in this embodiment, a margin of 7.5 dB can be secured.

  The embodiments of the present invention are not limited to the above-described embodiments, and various modifications and implementations are possible without departing from the scope of the present invention.

  In addition, it is possible to omit some of the constituent elements of the above-described embodiment within the scope not changing the gist of the present invention, and in the flow of the above-described embodiment, addition, deletion, change, replacement, etc. of steps are possible. Is possible.

DESCRIPTION OF SYMBOLS 1 ... Wiring member, 2 ... Wiring, 2a ... Signal line, 2b ... Ground line,
3, 3a, 3b ... insulating layer with adhesive layer, 4 ... wiring substrate, 5 ... conductive sheet, 5a ... base,
5b ... folded portion, 5c ... contact portion, 6 ... shield member, 20a, 20b ... terminal portion,
30 ... groove, 50 ... insulating layer, 51 ... metal layer, 52 ... conductive adhesive layer, 60 ... insulating layer,
61 ... Metal layer, 62 ... Insulating adhesive layer, 100 ... Electronic device, 110A ... First substrate,
110B ... second substrate, 111A ... first connector, 111B ... second connector,
200 ... Thermocompression press machine, 201 ... Upper plate, 202 ... Lower plate,
203 ... elastic member, 620 ... line pattern

[1] A step of preparing a wiring substrate including a plurality of wirings including a ground line, and a first insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line. When,
Disposing a conductive sheet provided with a second insulating layer on one side and a conductive adhesive layer on the other side on the first insulating layer including the opening of the wiring substrate. When,
Thermocompression bonding the conductive adhesive layer of the conductive sheet to the ground line by moving a pressure member in the thickness direction of the wiring substrate;
After or before the step of thermocompression bonding, a step of folding back a portion of the conductive sheet that is thermocompression bonded to the ground wire or a portion that is away from a location that is scheduled to be thermocompression bonded to the ground wire;
And a step of electrically connecting a shield member to the folded portion of the conductive sheet.
[2] a step of the thermal compression bonding, to support the wiring substrate via the elastic member, the manufacturing method of the wiring member according to [1].
[3] The wiring according to [1], wherein the step of electrically connecting the shield member is a step of thermocompression bonding the shield member to the conductive adhesive layer of the conductive sheet using a heating roller. Manufacturing method of member.
[4] A wiring substrate including a plurality of wirings including a ground line, and a first insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line;
A second insulating layer is provided on one surface side, and a conductive adhesive layer is provided on the other surface side, and the opening of the wiring substrate is included in a state where the second insulating layers are folded back to face each other. A conductive sheet disposed on the first insulating layer and electrically connected to the ground line through the opening, the conductive adhesive layer of the unfolded portion;
Arranged on the wiring substrate and the conductive sheet, adhered to the conductive adhesive layer of the folded portion of the conductive sheet, and electrically connected to the ground line through the folded portion. A method of manufacturing a plurality of wiring members provided with a shield member,
A method for manufacturing a wiring member, wherein the plurality of wiring members are manufactured such that a length in a longitudinal direction of the wiring substrate of the unfolded portion of the conductive sheet is different between the plurality of wiring members.
[5] The method for manufacturing a wiring member according to [4], wherein the conductive sheet is formed such that a width direction orthogonal to a longitudinal direction of the wiring substrate is equal between the plurality of wiring members.
[6] The method for manufacturing a wiring member according to [4] or [5], wherein the wiring substrate is formed such that a width direction orthogonal to a longitudinal direction of the wiring substrate is equal between the plurality of wiring members. .
[7] A wiring substrate including a plurality of wirings including a ground line, and a first insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line;
A second insulating layer is provided on one surface side, and a conductive adhesive layer is provided on the other surface side, and the opening of the wiring substrate is included in a state where the second insulating layers are folded back to face each other. A conductive sheet disposed on the first insulating layer and electrically connected to the ground line through the opening, the conductive adhesive layer of the unfolded portion;
Arranged on the wiring substrate and the conductive sheet, adhered to the conductive adhesive layer of the folded portion of the conductive sheet, and electrically connected to the ground line through the folded portion. A shield member, and a wiring member design method comprising:
The size of the conductive sheet that satisfies the standard value required for the electrical equipment on which the wiring member is mounted based on the result of measuring the noise characteristics when the size of the conductive sheet is changed Selecting a process,
A method for designing a wiring member including
[8] The method for designing a wiring member according to [7], further including a step of measuring noise characteristics when the size of the conductive sheet is changed.
[9] A method for manufacturing a wiring member, wherein the wiring member is manufactured using the conductive sheet having a size designed by the method for designing a wiring member according to [7] or [8].

Claims (9)

Preparing a wiring substrate having a plurality of wirings including a ground line, and an insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line; and
Arranging a conductive sheet provided with an insulating layer on one side and a conductive adhesive layer on the other side on the insulating layer including the opening of the wiring substrate;
Thermocompression bonding the conductive adhesive layer of the conductive sheet to the ground line by moving a pressure member in the thickness direction of the wiring substrate;
After or before the step of thermocompression bonding, a step of folding back a portion of the conductive sheet that is thermocompression bonded to the ground wire or a portion that is away from a location that is scheduled to be thermocompression bonded to the ground wire;
And a step of electrically connecting a shield member to the folded portion of the conductive sheet.   The method of manufacturing a wiring member according to claim 1, wherein the thermocompression bonding step supports the wiring member via an elastic member.   The method of manufacturing a wiring member according to claim 1, wherein the step of providing the shield member is a step of thermocompression bonding the shield member to the conductive adhesive layer of the conductive sheet using a heating roller. A wiring substrate including a plurality of wirings including a ground line, and an insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line;
An insulating layer is provided on one surface side, and a conductive adhesive layer is provided on the other surface side, and is disposed on the insulating layer including the opening of the wiring substrate in a state where the insulating layers are folded back to face each other. A conductive sheet in which the conductive adhesive layer of the portion that is not folded is electrically connected to the ground line through the opening;
Arranged on the wiring substrate and the conductive sheet, adhered to the conductive adhesive layer of the folded portion of the conductive sheet, and electrically connected to the ground line through the folded portion. A method of manufacturing a plurality of wiring members provided with a shield member,
A method for manufacturing a wiring member, wherein the plurality of wiring members are manufactured such that a length in a longitudinal direction of the wiring substrate of the unfolded portion of the conductive sheet is different between the plurality of wiring members.   5. The method for manufacturing a wiring member according to claim 4, wherein the conductive sheet is formed such that a width direction orthogonal to a longitudinal direction of the wiring substrate is equal between the plurality of wiring members.   The method for manufacturing a wiring member according to claim 4, wherein the wiring base material is formed with the same width direction perpendicular to the longitudinal direction of the wiring base material between the plurality of wiring members. A wiring substrate including a plurality of wirings including a ground line, and an insulating layer that covers the plurality of wirings and has an opening that exposes at least a part of the ground line;
An insulating layer is provided on one surface side, and a conductive adhesive layer is provided on the other surface side, and is disposed on the insulating layer including the opening of the wiring substrate in a state where the insulating layers are folded back to face each other. A conductive sheet in which the conductive adhesive layer of the portion that is not folded is electrically connected to the ground line through the opening;
Arranged on the wiring substrate and the conductive sheet, adhered to the conductive adhesive layer of the folded portion of the conductive sheet, and electrically connected to the ground line through the folded portion. A shield member, and a wiring member design method comprising:
The size of the conductive sheet that satisfies the standard value required for the electrical equipment on which the wiring member is mounted based on the result of measuring the noise characteristics when the size of the conductive sheet is changed Selecting a process,
A method for designing a wiring member including   The wiring member design method according to claim 7, further comprising a step of measuring a noise characteristic when the size of the conductive sheet is changed. The manufacturing method of the wiring member which manufactures the said wiring member using the said electroconductive sheet of the magnitude | size designed with the designing method of the wiring member of Claim 7 or 8.

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