JP2016072810A - Signal transmitter, receiver, and radio communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a signal transmitter, a receiver, and a radio communication device that can make signal propagation characteristics excellent.SOLUTION: A signal transmitter in an embodiment includes a first substrate and a second substrate. On the first substrate formed are a first signal input/output unit, a first inductor of which a first end is connected with the first signal input/output unit and its second end is connected to the ground, and a first electrode connected to the first end of the first inductor. On the second substrate, a second electrode arranged opposite to the first electrode, and functioning as a capacitor by capacity coupling with the first electrode, a second inductor of which a first end is connected with the second electrode and its second end is connected to the ground, and a second signal input/output unit connected with the second end of the second inductor are formed. The second substrate is cooled by a cooler.SELECTED DRAWING: Figure 3

Description

  Embodiments described herein relate generally to a signal transmission device, a reception device, and a wireless communication device.

  2. Description of the Related Art Conventionally, a technique is known in which a pair of substrates are arranged to face each other and a signal is propagated in a non-contact manner using coupling between resonators established between the substrates. However, in this case, the signal propagation characteristic may fluctuate greatly due to an error in positioning the substrate to be opposed.

JP 2010-154392 A

  The problem to be solved by the present invention is to provide a signal transmission device, a reception device, and a wireless communication device that can improve signal propagation characteristics.

  The signal transmission device according to the embodiment has a first substrate and a second substrate. The first substrate includes a first signal input / output unit, a first inductor having a first end connected to the first signal input / output unit and a second end connected to the ground, and a first end of the first inductor A first electrode connected to is formed. A second substrate is disposed opposite to the first electrode and is capacitively coupled to the first electrode to function as a capacitor. A first end is connected to the second electrode, and a second end is grounded. A second inductor connected and a second signal input / output unit connected to the second end of the second inductor are formed and cooled by a cooler.

1 is a block diagram illustrating an overall configuration of a wireless communication device 1 according to a first embodiment. 1 is a cross-sectional view illustrating a configuration of a wireless communication device 1 according to a first embodiment. The perspective view which shows the structure of the 1st signal transmission part 24 and the 2nd signal transmission part 30 in the radio | wireless communication apparatus 1 of 1st Embodiment. FIG. 3 is a cross-sectional view illustrating configurations of a first signal transmission unit 24 and a second signal transmission unit 30 in the wireless communication device 1 according to the first embodiment. The circuit diagram which represented the structure of the 1st signal transmission part 24 and the 2nd signal transmission part 30 in the radio | wireless communication apparatus 1 of 1st Embodiment with the concentrated line element. The figure which shows the frequency characteristic of the signal level in the 1st signal transmission part 24 and the 2nd signal transmission part 30 as a distributed constant line shown in FIG. 3 and FIG. The figure which shows the frequency characteristic of the passage signal level calculated by fixing the inductance to the fixed value and changing the capacity | capacitance of a capacitor in the 1st signal transmission part 24 and the 2nd signal transmission part 30 in 1st Embodiment. The perspective view which shows the structure of the 1st signal transmission part 24 and the 2nd signal transmission part 30 in the radio | wireless communication apparatus 1 of 2nd Embodiment. Sectional drawing which shows the structure of the 1st signal transmission part 24 and the 2nd signal transmission part 30 in the radio | wireless communication apparatus 1 of 2nd Embodiment. The circuit diagram which represented the structure of the 1st signal transmission part 24 and the 2nd signal transmission part 30 with the concentrated line element in 2nd Embodiment. The top view which shows the 1st transmission unit 70 and the 2nd transmission unit 80 in the radio | wireless communication apparatus 1 of 3rd Embodiment. The figure which shows the frequency characteristic of the passage signal level calculated by fixing the capacity | capacitance of a capacitor and changing inductance in 3rd Embodiment.

Hereinafter, a signal transmission device, a reception device, and a wireless communication device according to embodiments will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a block diagram illustrating an overall configuration of a wireless communication device 1 according to the first embodiment. The wireless communication device 1 includes a distributor 10, transmission phase shifters 12a, 12b,... 12n (hereinafter collectively referred to as “transmission phase shifter 12”), power amplifiers 14a, 14b, ... 14n (hereinafter collectively referred to as “power amplifier 14”), transmission bandpass filters 16a (BPF), 16b,... 16n (hereinafter collectively referred to as “transmission band”) ), Transmission / reception switchers 18a, 18b,... 18n (hereinafter collectively referred to as “transmission / reception switcher 18”), antenna portions 20a, 20b,. Hereinafter, when collectively referred to as "antenna unit 20"), limiters 22a, 22b, ... 22n (hereinafter collectively referred to as "limiter 22"), first signal transmission unit 24a, 24b,... 24n (hereinafter Are collectively referred to as "first signal transmission unit 24"), reception bandpass filters 26a, 26b, ... 26n (hereinafter collectively referred to as "reception bandpass filter 26"). ), Low noise amplifiers 28a, 28b,... 28n (hereinafter collectively referred to as “low noise amplifier 28”), second signal transmission units 30a, 30b,. (Referred to as “second signal transmission unit 30”), receiving phase shifters 32a, 32b,... 32n (hereinafter collectively referred to as “receiving phase shifter 32”). And a synthesizer 34. The first signal transmission unit 24 and the second signal transmission unit 30 are examples of a “signal transmission device”.
The wireless communication apparatus 1 according to the first embodiment performs communication using an array antenna in which a plurality of antenna units 20 are arranged in a planar shape. The wireless communication device 1 can be applied to either a passive array antenna or an active array antenna.

The distributor 10 distributes the supplied transmission signal, for example, equally, and supplies it to each transmission phase shifter 12. The transmission phase shifter 12 changes the phase of the transmission signal supplied from the distributor 10 to a desired phase and supplies the transmission signal to the power amplifier 14. The amount of phase change by the transmission phase shifter 12 is set for each antenna unit 20. The power amplifier 14 amplifies the amplitude of the transmission signal supplied from the transmission phase shifter 12. The transmission band pass filter 16 suppresses unnecessary signal components from the transmission signal amplified by the power amplifier 14. The transmission signal that has passed through the transmission band-pass filter 16 is supplied to the transmission / reception switch 18.
The distributor 10, the transmission phase shifter 12, the power amplifier 14, and the transmission bandpass filter 16 function as a transmission unit that transmits a transmission signal as a radio wave from the antenna unit 20.

  The transmission / reception switch 18 includes a circulator or a coaxial switch. The transmission / reception switch 18 includes a signal processing system including a limiter 22, a reception band-pass filter 26, a low noise amplifier 28, a reception phase shifter 32, and a combiner 34, a distributor 10, and a transmission phase shift. Switching between the transmitter 12, the power amplifier 14, and the transmission system including the transmission band-pass filter 16.

  The antenna unit 20 radiates radio waves into space in response to the transmission signal supplied from the transmission / reception switch 18. The antenna unit 20 receives a radio wave radiated into space, generates a reception signal, and supplies the reception signal to the transmission / reception switch 18. The received signal is supplied to the limiter 22 via the transmission / reception switch 18.

  The limiter 22 limits the signal level of the reception signal supplied via the transmission / reception switch 18. For example, the limiter 22 limits the signal level when the received signal level is higher than the saturation level of the low-noise amplifier 28 (LNA) at the subsequent stage. The received signal whose signal level is limited is supplied to the first signal transmission unit 24. The first signal transmission unit 24 supplies the reception signal supplied from the limiter 22 to the reception band pass filter 26. The reception band-pass filter 26 suppresses unnecessary signal components included in the reception signal supplied from the first signal transmission unit 24. The low noise amplifier 28 amplifies the amplitude of the reception signal that has passed through the reception band pass filter 26. The low noise amplifier 28 supplies the amplified received signal to the reception phase shifter 32 through the second signal transmission unit 30. The reception phase shifter 32 changes the phase of the reception signal supplied from the second signal transmission unit 30 to a desired phase, and supplies the reception signal whose phase has been changed to the synthesizer 34. The amount of phase change by the reception phase shifter 32 is set for each antenna unit 20.

  The combiner 34 is supplied with received signals from a plurality of receiving phase shifters 32. The synthesizer 34 combines the plurality of received signals and outputs as a received beam.

FIG. 2 is a cross-sectional view illustrating a configuration of the wireless communication device 1 according to the first embodiment.
The wireless communication device 1 includes a vacuum heat insulating container 40, a cooling substrate 44, a transmission / reception substrate 50, antenna elements 52a, 52b,... 52n (hereinafter, collectively referred to as “antenna element 52”), a room temperature signal. Input units 60a, 60b,... 60n (hereinafter collectively referred to as “room temperature side signal input unit 60”), room temperature side signal output units 62a, 62b,. Are referred to as “room temperature side signal output unit 62”), low temperature side signal output units 64a, 64b,... 64n (hereinafter collectively referred to as “low temperature side signal output unit 64”), signals. Processing units 66a, 66b,... 66n (hereinafter collectively referred to as “signal processing unit 66”) and low-temperature side signal input units 68a, 68b,. Is "low temperature side signal input unit 68" With the department.).

  The vacuum heat insulating container 40 is, for example, a box-shaped housing. The vacuum heat insulating container 40 is formed of a material such as copper that shields the inside from external heat. Inside the vacuum heat insulating container 40, the cooling substrate 44 is cooled by a cooler (not shown). Thereby, the internal space 42 of the vacuum heat insulation container 40 is maintained in a low temperature environment (for example, 150K or less). Further, the vacuum heat insulating container 40 maintains the internal space 42 at a pressure close to a vacuum by a vacuum pump (not shown) or the like.

  The transmission / reception substrate 50 is attached to the upper surface (surface on the + Z direction side) of the vacuum heat insulating container 40. The transmission / reception board 50 includes a distributor 10, a transmission phase shifter 12, a power amplifier 14, a transmission band pass filter 16, a transmission / reception switch 18, a limiter 22, and a reception phase shifter among the configurations shown in FIG. 32 and a synthesizer 34 are provided. The antenna element 52 corresponds to the antenna unit 20 described above. The antenna element 52 supplies a reception signal to the transmission / reception board 50. A transmission signal is supplied to the antenna element 52 from the transmission / reception board 50.

  The room temperature side signal input unit 60 has a planar shape and is attached to a surface of the inner wall surface of the vacuum heat insulating container 40 that faces the cooling substrate 44. The room temperature side signal input unit 60 is connected to the transmission / reception substrate 50 via a signal transmission path (not shown). The low temperature side signal output unit 64 has a planar shape and is formed on the cooling substrate 44 so as to face the normal temperature side signal input unit 60. The room temperature side signal input unit 60 and the low temperature side signal output unit 64 are arranged close enough to be capacitively coupled. The room temperature side signal input unit 60 and the low temperature side signal output unit 64 are supplied with a reception signal from the transmission / reception substrate 50 and supply the supplied reception signal to the signal processing unit 66. The room temperature side signal input unit 60 and the low temperature side signal output unit 64 correspond to the first signal transmission unit 24 described above.

  The signal processing unit 66 is formed on the cooling substrate 44. The signal processing unit 66 includes the reception band-pass filter 26 and the low noise amplifier 28 described above. The reception band-pass filter 26 and the low-noise amplifier 28 are cooled until the cooling substrate 44 is cooled to dissipate heat and become superconductive. The reception band pass filter 26 is, for example, a superconducting filter containing a superconducting material. The low noise amplifier 28 is a low noise amplifier (LNA) operable in a low temperature environment.

  The room temperature side signal output unit 62 has a planar shape and is attached to a surface of the inner wall surface of the vacuum heat insulating container 40 that faces the cooling substrate 44. The room temperature side signal output unit 62 is connected to the transmission / reception substrate 50 via a signal transmission path (not shown). The low temperature side signal input unit 68 has a planar shape and is formed on the cooling substrate 44 so as to face the normal temperature side signal output unit 62. The room temperature side signal output unit 62 and the low temperature side signal input unit 68 are arranged close enough to be capacitively coupled. The room temperature side signal output unit 62 and the low temperature side signal input unit 68 are supplied with a reception signal from the signal processing unit 66 and supply the supplied reception signal to the transmission / reception substrate 50. The room temperature side signal output unit 62 and the low temperature side signal input unit 68 correspond to the second signal transmission unit 30 described above.

FIG. 3 is a perspective view illustrating configurations of the first signal transmission unit 24 and the second signal transmission unit 30 in the wireless communication device 1 according to the first embodiment. FIG. 4 is a cross-sectional view illustrating configurations of the first signal transmission unit 24 and the second signal transmission unit 30 in the wireless communication device 1 according to the first embodiment.
Each of the first signal transmission unit 24 and the second signal transmission unit 30 includes a first transmission unit 70 and a second transmission unit 80. One of the first transmission unit 70 and the second transmission unit 80 is a signal input side, and the other is a signal output side.

The first transmission unit 70 includes a dielectric substrate 72, a signal input / output terminal 74, an inductor element 76, and a capacitor element (first electrode) 78. The dielectric substrate 72 is a planar substrate containing a dielectric material. The signal input / output terminal 74, the inductor element 76, and the capacitor element 78 are metal materials having conductivity. As the conductive material, for example, a metal such as copper, gold, silver or aluminum, a superconductor such as niobium or niobium tin, or a material containing Y-based copper oxide high-temperature superconductivity can be used.
The signal input / output terminal 74, the inductor element 76, and the capacitor element 78 are formed on the lower surface (surface on the −Z direction side) of the dielectric substrate 72 by a technique such as metal etching. As shown in FIG. 4, a ground surface 72 a is formed on the upper surface (surface on the + Z direction side) of the dielectric substrate 72. A ground terminal 76 a is connected to the ground surface 72 a through a connection member that penetrates the dielectric substrate 72. The ground terminal 76 a is also connected to the end of the inductor element 76.

The signal input / output terminal 74 is formed in a thin film shape on the dielectric substrate 72 and is connected to the inductor element 76 and the capacitor element 78.
The inductor element 76 (first inductor) has a first end connected to the signal input / output terminal 74 and a second end connected to the ground terminal 76a.
The inductor element 76 is formed in a meander structure in which a narrow line is folded back a plurality of times in a planar shape. The line width and line length in the inductor element 76 are adjusted so as to have a desired inductance. Generally, the inductance value is increased by reducing the line width of the line. Furthermore, a desired inductance value is realized by increasing the length by folding back such as a spiral shape.
Capacitor element 78 is formed in a thin film on dielectric substrate 72, and is connected to signal input / output terminal 74 and the first end of inductor element 76. The capacitor element 78 is formed to be a plate electrode, and is formed in a so-called patch structure. The area of the capacitor element 78 is adjusted to have a desired capacitor capacity. The capacitance increases as the electrode area increases, and increases as the distance between the electrodes decreases.

The second transmission unit 80 includes a dielectric substrate 82, a capacitor element (second electrode) 84, an inductor element 86, and a signal input / output terminal 88. The dielectric substrate 82 is a planar substrate containing a dielectric material. The capacitor element 84, the inductor element 86, and the signal input / output terminal 88 are conductive metal materials.
The capacitor element 84, the inductor element 86, and the signal input / output terminal 88 are formed on the upper surface (the surface on the + Z direction side) of the dielectric substrate 82. As shown in FIG. 4, a ground surface 82 a is formed on the lower surface (surface on the −Z direction side) of the dielectric substrate 82. A ground terminal 86a is connected to the ground surface 82a through a connecting member that penetrates the dielectric substrate 82. The ground terminal 86 a is also connected to the end of the inductor element 86. Thus, the first transmission unit 70 and the second transmission unit 80 have a so-called microstrip structure.

The capacitor element 84 (second electrode) is formed in a thin film on the dielectric substrate 82. Capacitor element 84 is connected to signal input / output terminal 88 and the first end of inductor element 86. The capacitor element 84 is formed to be a flat plate electrode, and is formed in a so-called patch structure. The area of the capacitor element 84 is adjusted to have a desired capacitor capacity.
The inductor element 86 (second inductor) is formed in a thin film on the dielectric substrate 82. The inductor element 86 has a first end connected to the signal input / output terminal 88 and a second end connected to the ground terminal 86a. The inductor element 86 is formed as a so-called shunt inductor.
The inductor element 86 is formed on the dielectric substrate 82 by folding a narrow line a plurality of times to form a so-called meander structure. The line width and line length in the inductor element 86 are adjusted to a desired inductor value.
The signal input / output terminal 88 is formed in a thin film on the dielectric substrate 82 and is connected to the inductor element 86 and the capacitor element 84.

  The first transmission unit 70 and the second transmission unit 80 are positioned so as to face each other without contact. That is, the first transmission unit 70 and the second transmission unit 80 are arranged in a distance in the facing direction between the capacitor element 78 and the capacitor element 84 (space gap distance) and in the plane direction between the capacitor element 78 and the capacitor element 84. The positional relationship is adjusted. However, when it is desired to increase the capacitance value, a part of the ground on the back side of the capacitance can be peeled off to increase the capacitive coupling.

  Note that one of the signal input / output terminal 74 and the signal input / output terminal 88 serves as a first signal input / output unit, and the other serves as a second signal input / output unit. Further, the capacitor element and the inductor element in the low-temperature side transmission unit are formed including a superconductor.

FIG. 5 is a circuit diagram in which the configurations of the first signal transmission unit 24 and the second signal transmission unit 30 in the wireless communication device 1 of the first embodiment are represented by concentrated line elements.
The first signal transmission unit 24 and the second signal transmission unit 30 include the first transmission unit 70 and the second transmission unit 80 as described above. The first transmission unit 70 includes a signal input / output terminal 74, a capacitor element 78, an inductor element 76, and a ground terminal 76a. The second transmission unit 80 includes a capacitor element 84, an inductor element 86, a signal input / output terminal 88, and a ground terminal 86a.

  In the first signal transmission unit 24 and the second signal transmission unit 30, the capacitor element 78 and the capacitor element 84 constitute a parallel plate-shaped capacitor C. Capacitor C is connected in series between signal input / output terminal 74 and signal input / output terminal 88. The inductor element 76 is connected between the signal input / output terminal 74 and the ground terminal 76a, and the inductor element 86 is connected between the signal input / output terminal 88 and the ground terminal 86a. As described above, the first signal transmission unit 24 and the second signal transmission unit 30 are LCL π-type circuits and function as high-pass filters.

  FIG. 6 is a diagram illustrating frequency characteristics of signal levels in the first signal transmission unit 24 and the second signal transmission unit 30 as the distributed constant lines illustrated in FIGS. 3 and 4. In FIG. 6, A is a passband characteristic indicating the relationship between the amount of reception signal propagated by the first signal transmission unit 24 and the second signal transmission unit 30 with respect to the frequency of the reception signal. B is a reflection band characteristic indicating the relationship of the reflection amount of the reception signal propagated by the first signal transmission unit 24 and the second signal transmission unit 30 with respect to the frequency of the reception signal. The passband characteristic A and the reflection band characteristic B were obtained as a result of performing an electromagnetic field simulation based on the configurations of the first signal transmission unit 24 and the second signal transmission unit 30 and the frequency of the reception signal.

  According to the pass band characteristic A, the pass signal level is attenuated in the vicinity of 4 GHz and in the high frequency band near 8 GHz higher than 5 GHz to 6 GHz. According to the reflection band characteristic B, the reflection signal level decreases in the frequency band of 5 GHz to 6 GHz. These changes in the signal level are caused by the influence of the higher-order mode of the received signal and the resonance of each element because the inductor element 76, the capacitor element 78, the capacitor element 84, and the inductor element 86 operate as distributed constant lines.

FIG. 7 shows the frequency characteristic of the passing signal level calculated by fixing the inductance to a constant value and changing the capacitance of the capacitor 92 in the first signal transmission unit 24 and the second signal transmission unit 30 in the first embodiment. FIG.
According to the frequency band A, it can be seen that when the capacitance of the capacitor 92 is 1 pF, the cutoff frequency is on the high frequency band side and the loss of the passing signal level increases. However, when the capacitance of the capacitor 92 is 5 pF to 100 pf, it can be seen that the loss of the pass signal level in the high frequency band is about 0.1 dB than the frequency band of about 1 GHz as in the pass band characteristics B to E. . That is, the cutoff frequencies of the first signal transmission unit 24 and the second signal transmission unit 30 are on the lower frequency side than 1 GHz.

  Therefore, the first signal transmission unit 24 and the second signal transmission unit 30 are capable of receiving the received signal as long as the frequency of the received signal is higher than 1 GHz even if the capacitance of the capacitor 92 changes in the range of 5 pF to 100 pF. The signal propagation characteristics can be maintained well. That is, it can be seen that the first signal transmission unit 24 and the second signal transmission unit 30 have a structure that hardly affects the signal propagation characteristics even if the capacitance of the capacitor 92 changes. For example, even if there is an error in positioning between the first transmission unit 70 and the second transmission unit 80 and there is a deviation in the distance between the capacitor element 78 and the capacitor element 84 or a positioning error in the plane direction, the reception is performed. The signal propagation characteristics of the signal can be maintained well.

  According to the first embodiment described above, the signal input / output terminal 74 (first signal input / output unit), the inductor element 76 having the first end connected to the signal input / output terminal 74 and the second end connected to the ground. (First inductor) and a dielectric substrate 72 (first substrate) on which a capacitor element 78 (first electrode) connected to the first end of the inductor element 76 is formed, and the capacitor element 78 is disposed opposite to the dielectric element 72. A capacitor element 84 (second electrode) that functions as a capacitor by being capacitively coupled to the capacitor element 78, an inductor element 86 (second inductor) having a first end connected to the capacitor element 84 and a second end connected to the ground, and A signal input / output terminal 88 (signal output unit) connected to the second end of the inductor element 86 is formed, and has a dielectric substrate 82 (second substrate) cooled by a cooler. It Accordingly, by transmitting a received signal by using the capacitive coupling of the capacitor, it is possible to maintain a high pass signal level, it is possible to improve the signal propagation characteristics.

  Further, according to the first embodiment, the heat from the dielectric substrate 72 is transferred to the dielectric substrate 82 on the cooling side by making the dielectric substrate 72 and the dielectric substrate 82 non-contact. Can be suppressed.

  Furthermore, according to the first embodiment, the combination of the inductor element 76, the capacitor element 78, the capacitor element 84, and the inductor element 86 functions as a high-pass filter in which a frequency lower than the signal frequency is set as a cutoff frequency. Therefore, the signal quality can be improved.

  Further, according to the first embodiment, the capacitor element and the inductor element on the low temperature side are formed of the superconductor, and the temperature of the dielectric substrate 82 is set to 150K or lower. A conductive state can be obtained, and signal loss can be suppressed.

(Second Embodiment)
Next, the wireless communication device 1 according to the second embodiment will be described. In addition, about the part similar to embodiment mentioned above, the detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.
FIG. 8 is a perspective view illustrating configurations of the first signal transmission unit 24 and the second signal transmission unit 30 in the wireless communication device 1 according to the second embodiment. FIG. 9 is a cross-sectional view illustrating configurations of the first signal transmission unit 24 and the second signal transmission unit 30 in the wireless communication device 1 according to the second embodiment.

  In the first transmission unit 70 according to the second embodiment, ground surfaces 72b and 72c are formed on the surface on which the signal input / output terminal 74, the inductor element 76, and the capacitor element 78 are formed. The ground surfaces 72b and 72c are formed over substantially the entire surface other than the region where the signal input / output terminal 74, the inductor element 76, and the capacitor element 78 are formed. The ground plane 72b is connected to the end of the inductor element 76 on the same plane.

  In the second transmission unit 80 according to the second embodiment, ground surfaces 82b and 82c are formed on the surface on which the capacitor element 84, the inductor element 86, and the signal input / output terminal 88 are formed. The ground surfaces 82b and 82c are formed over substantially the entire surface other than the region where the capacitor element 84, the inductor element 86, and the signal input / output terminal 88 are formed. The ground plane 82b is connected to the end of the inductor element 86 on the same plane.

  The first transmission unit 70 and the second transmission unit 80 have a coplanar structure in which the ground surfaces 72b, 72c, 82b, and 82c and the signal line pattern are formed on the same surface. Therefore, the ground surface 72b and the ground surface 82b, and the ground surface 72c and the ground surface 82c are arranged to face each other with a space gap therebetween.

FIG. 10 is a circuit diagram in which the configurations of the first signal transmission unit 24 and the second signal transmission unit 30 are represented by concentrated line elements in the second embodiment.
According to FIG. 10, between the first transmission unit 70 and the second transmission unit 80, in addition to the capacitor C1 in which the capacitor element 78 and the capacitor element 84 are capacitively coupled, the ground planes 72b and 72c and the ground A capacitor C2 is formed in which the surfaces 82b and 82c are capacitively coupled.

According to the second embodiment described above, the ground surfaces 72b and 72c (first ground surface) in which the inductor element 76 is connected to the surface on which the signal input / output terminal 74, the inductor element 76, and the capacitor element 78 are formed. Are formed, and ground surfaces 82b and 82c (second ground surfaces) to which the inductor element 86 is connected are formed on the surface on which the signal input / output terminal 88, the inductor element 86, and the capacitor element 84 are formed. As a result, many of the regions where the dielectric substrate 72 and the dielectric substrate 82 face each other can be covered with the metal pattern. For example, when alumina is used as the dielectric, its emissivity is 10 times or more that of metal. Therefore, considering heat insulation, it is better to minimize the exposure of the dielectric at the portion facing the low temperature side. As a result, heat radiation from the room temperature side substrate to the low temperature side substrate can be suppressed.
In addition, according to the second embodiment, the inductor element 76 and the ground surfaces 72b and 72c are formed on the same surface, and the inductor element 86 and the ground surfaces 82b and 82c are formed on the same surface. Thereby, the inductor element 76 and the inductor element 86 can be easily connected to the ground. For example, according to the second embodiment, the inductor element is formed on the cooling substrate 44, and it is not necessary to connect the ground to the cooling substrate 44 through the substrate. be able to.
Further, according to the second embodiment, various effects similar to those of the first embodiment can be achieved.

(Third embodiment)
Next, the wireless communication device 1 according to the third embodiment will be described. In addition, about the part similar to embodiment mentioned above, the detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.
FIG. 11 is a top view illustrating the first transmission unit 70 and the second transmission unit 80 in the wireless communication apparatus 1 according to the third embodiment. The first transmission unit 70 and the second transmission unit 80 in the third embodiment have an adjustment mechanism capable of adjusting the inductance. The adjustment mechanism is a plurality of switches 103 as shown in FIG.
Inductor elements 76 and 86 have connection terminals 101 and 102 formed at the turning point of line 100 that is formed by being folded over a plurality of times. The switch 103 is provided for each connection terminal 102.

  As shown in FIG. 11B, the switch 103 includes connection terminals 103a and 103b and a movable portion 103c. The connection terminal 103a is connected to the line 101a through one end 102a of the connection terminal 102. The other end 102b of the connection terminal 102 is connected to the line 101b turned back from the line 101a. The connection terminal 103b is connected to the ground plane G. The movable portion 103c switches the electrical state between the connection terminal 103a and the connection terminal 103b between a conductive state and a non-conductive state.

The movable part 103c switches the connection terminal 103a and the connection terminal 103b to the non-conductive state, and causes the line 100a and the line 100b to be conductive. Accordingly, the switch 103 electrically connects the line 100a and the line 100b.
The movable portion 103c switches the connection terminal 103a and the connection terminal 103b to the conductive state, and connects the line 100a to the ground plane G. Thereby, the switch 103 electrically cuts off the line 100a and the line 100b, and as a result, the line 100a is terminated at the connection terminal 103b.
The movable unit 103c is controlled by a control unit (not shown) and switches the electrical state between the connection terminal 103a and the connection terminal 103b. The control unit supplies a current to a coil (not shown) to generate a magnetic field to open / close the movable unit 103c. Note that the adjustment mechanism desirably adjusts the inductance based on the coupling capacitance between the electrodes constituting the capacitance. In addition to a method of physically turning on and off, for example, MEMS (Micro Electro Mechanical Systems), the switch may be configured to be electrically turned on and off by a diode switch or the like. In the case of this configuration, the adjustment mechanism can switch the switch at high speed by electric control.

  FIG. 12 is a diagram illustrating frequency characteristics of the passing signal level calculated by fixing the capacitance of the capacitor 92 and changing the inductance in the third embodiment. This frequency characteristic was obtained by fixing the capacitance of the capacitor 92 to 1 pF. The passband characteristic B indicates the signal pass level when the inductance is not adjusted. The passband characteristic A indicates the signal pass level when the inductance is adjusted.

According to the passband characteristic B, it can be seen that the loss of the pass signal level increases in the frequency band from around 3 GHz to the low frequency side. On the other hand, according to the passband characteristic A, it is understood that the loss of the pass signal level near 3 GHz is reduced by adjusting the inductance.
As described above, the adjustment mechanism can adjust the cutoff frequency of the high-pass filter so as to pass the signal component on the low frequency side of the received signal by adjusting the length of the line 100 in the inductor elements 76 and 86 to be short.

  According to the third embodiment described above, the inductor element 76 or the inductor element 86 is accompanied by the adjustment mechanism (switch 103) for adjusting the inductance, so that even if the value of the capacitor fluctuates, the high-pass filter Signal loss can be suppressed by adjusting the cutoff frequency. For example, there may be a positioning error between the first transmission unit 70 and the second transmission unit 80, the capacitor value changes, the cutoff frequency is greatly shifted, and the passage loss or reflection characteristics may deteriorate. Even in this case, according to the third embodiment, the inductance can be adjusted to suppress the deterioration of the characteristics.

  In the third embodiment, the inductance is adjusted by adjusting the line lengths of the inductor element 76 and the inductor element 86 by the switch 103, but the present invention is not limited to this. For example, a three-dimensional variable inductor element that can be mounted on a substrate may be used.

  According to at least one embodiment described above, the signal input / output terminal 74 (first signal input / output unit), the inductor element 76 having the first end connected to the signal input / output terminal 74 and the second end connected to the ground. (First inductor) and a dielectric substrate 72 (first substrate) on which a capacitor element (first electrode) connected to the first end of the inductor element 76 is formed, and disposed opposite to the capacitor element 78; A capacitor element 84 (second electrode) that functions as a capacitor by being capacitively coupled to the capacitor element 78, an inductor element 86 (second inductor) having a first end connected to the capacitor element 84 and a second end connected to the ground, and an inductor A dielectric substrate 82 (second substrate) formed with a signal input / output terminal 88 (signal output unit) connected to the second end of the element 86 and cooled by a cooler. , By having, by transmitting the received signal by using the capacitive coupling of the capacitor, it is possible to maintain a high pass signal level, it is possible to improve the signal propagation characteristics.

  Furthermore, according to the embodiment, the antenna unit 20 that receives radio waves and generates a signal, the limiter 22 that adjusts the level of the signal generated by the antenna unit 20, and the signal input / output from which the signal is supplied from the limiter 22 Dielectric body including terminal 74, inductor element 76 having a first end connected to signal input / output terminal 74 and a second end connected to ground, and capacitor element 78 connected to the first end of inductor element 76 Capacitor element 84 disposed opposite substrate 72, capacitor element 78 and capacitively coupled to capacitor element 78 to function as a capacitor, and inductor having a first end connected to capacitor element 84 and a second end connected to ground An element 86 and a signal input / output terminal 88 connected to the second end of the inductor element 86 are formed, and the dielectric base is cooled by a cooler. 82, a signal transmission path (24, 30) having a signal processing section (26, 28) provided in the vacuum heat insulating container 40 and processing a signal transmitted by the signal transmission path (24, 30), Since the receiving phase shifter 32 controls the phase of the signal supplied from the signal processing unit (26, 28), the received signal is transmitted using the capacitive coupling of the capacitor, so that the passing signal level is increased. Therefore, the signal propagation characteristics of the received signal can be improved.

  Furthermore, according to the embodiment, a plurality of antenna units 20, a plurality of transmission units (12, 14, 16, 18) connected to each of the antenna units 20 and supplying a transmission signal to the antenna unit 20, and a transmission signal Is connected to each of the antenna unit 20 and the limiter 22 that adjusts the level of the reception signal generated by the antenna unit 20 and the signal input to which the reception signal is supplied from the limiter 22. Dielectric body in which an output terminal 74, an inductor element 76 having a first end connected to the signal input / output terminal 74 and a second end connected to the ground, and a capacitor element 78 connected to the first end of the inductor element 76 are formed. Capacitor element 84 disposed opposite substrate 72 and inductor element 76 and capacitively coupled to capacitor element 78 to function as a capacitor; An inductor element 86 having a first end connected to the data element 84 and a second end connected to the ground, and a signal input / output terminal 88 connected to the second end of the inductor element 86 are formed, and the vacuum cooled by the cooler A signal transmission path (24, 30) having a second transmission unit 80 formed on a dielectric substrate 82 disposed in the heat insulation container 40, and a signal transmission path (24 30), a signal processing unit (26, 28) for processing the received signal transmitted by the signal processing unit (30), and a receiving phase shifter 32 for controlling the phase of the received signal supplied from the signal processing unit (26, 28). Having a plurality of receiving units and a synthesizer 34 that synthesizes a plurality of received signals supplied from the plurality of receiving units. Keep high Bets can be, it is possible to improve the signal propagation characteristics of the received signal.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Wireless communication apparatus, 10 ... Distributor, 12, 12a, 12b, ... 12n ... Phase shifter for transmission, 18, 18a, 18b, ... 18n ... Transmission / reception switcher, 20, 20a, 20b, ... .. 20n: Antenna unit, 22, 22a, 22b,... 22n ... Limiter, 24 ... First signal transmission unit, 24, 24a, 24b,... 24n ... First signal transmission unit, 26, 26a, 26b ,..., 26n, reception bandpass filters, 28, 28a, 28b,... 28n, low noise amplifiers, 30, 30a, 30b,... 30n, second signal transmission units, 32, 32a, 32b,. ... 32n ... phase shifter for reception, 34 ... synthesizer, 40 ... vacuum insulation container, 44 ... cooling substrate, 52, 52a, 52b, ... 52n ... antenna element, 60, 60a, 60b, ... 60n ... Room temperature side signal input part, 2, 62a, 62b,... 62n ... normal temperature side signal output unit, 64, 64a, 64b, ... 64n ... low temperature side signal output unit, 66, 66a, 66b, ... 66n ... signal processing unit, 68 , 68a, 68b,... 68n ... low-temperature side signal input unit, 70 ... first transmission unit, 72, 82 ... dielectric substrate, 72a, 72b, 72c, 82b, 82c ... ground plane, 74, 88 ... signal Input / output terminals, 76, 86 ... inductor elements, 76a ... ground terminals, 78, 84 ... capacitor elements, 80 ... second transmission unit, 82a, 82b, 82c ... ground plane, 103 ... switch

Claims (8)

A first signal input / output unit; a first inductor having a first end connected to the first signal input / output unit and a second end connected to ground; and a first inductor connected to a first end of the first inductor. A first substrate on which an electrode is formed;
A second electrode disposed opposite to the first electrode and capacitively coupled to the first electrode to function as a capacitor; a second inductor having a first end connected to the second electrode and a second end connected to the ground And a second substrate formed with a second signal input / output unit connected to the second end of the second inductor and cooled by a cooler,
A signal transmission device. The combination of the first inductor, the capacitor, and the second inductor has a cutoff frequency that is lower than the frequency of the signal supplied to the first signal input / output unit or the second signal input / output unit. Function as a high-pass filter,
The signal transmission device according to claim 1. The first inductor or the second inductor is accompanied by an adjustment mechanism for adjusting inductance.
The signal transmission device according to claim 2. The adjusting mechanism adjusts an inductance based on a coupling capacity of the capacitor;
The signal transmission device according to claim 3. A first ground plane to which the first inductor is connected is formed on a surface of the first substrate on which the first signal input / output unit, the first inductor, and the first electrode are formed;
A second ground plane connected to the second inductor is formed on a surface of the second substrate on which the second signal input / output unit, the second inductor, and the second electrode are formed;
The signal transmission device according to claim 1. The second electrode and the second inductor are formed of a superconductor, and are cooled by the cooler so that the temperature of the second substrate is 150K or less;
The signal transmission device according to claim 1. An antenna unit that receives a radio wave and generates a signal;
A limiter for adjusting the level of the signal generated by the antenna unit;
A first signal input / output unit; a first inductor having a first end connected to the first signal input / output unit and a second end connected to ground; and a first inductor connected to a first end of the first inductor. A first substrate on which an electrode is formed, a second electrode disposed opposite to the first electrode, capacitively coupled to the first electrode and functioning as a capacitor, and a first end connected to the second electrode; A signal transmission unit having a second inductor having two ends connected to ground, and a second substrate formed with a second signal input / output unit connected to the second end of the second inductor and cooled by a cooler When,
A signal processing unit that is provided in the vacuum heat insulating container and processes a signal transmitted by the signal transmission unit;
And a phase shifter for controlling a phase of the signal supplied from the signal processing unit. A plurality of antenna units;
A plurality of transmission units connected to each of the antenna units and supplying a transmission signal to the antenna unit;
A distributor for distributing a transmission signal to each of the transmission units;
A limiter that is connected to each of the antenna units and adjusts a level of a reception signal generated by the antenna unit, a first signal input / output unit to which a reception signal is supplied from the limiter, and the first signal input / output A first inductor having a first end connected to the first portion and a second end connected to the ground, a first substrate formed with a first electrode connected to the first end of the first inductor, and the first electrode, A second electrode disposed oppositely and capacitively coupled to the first electrode to function as a capacitor; a second inductor having a first end connected to the second electrode and a second end connected to ground; and the second A signal transmission unit having a second signal input / output unit connected to the second end of the inductor and having a second substrate cooled by a cooler; and the signal transmission unit provided in the vacuum heat insulating container; By transmission A plurality of receiver having a signal processing unit for processing the received signal, and a phase shifter for controlling the phase of the received signal supplied from the signal processing unit which,
A combiner that combines a plurality of received signals supplied from the plurality of receiving units;
A wireless communication device.

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