JP2016072328A - Electronic controller, and attachment method thereof and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: The peripheral edge 8 of a case lid 3 is abutted against the opening edge 9 of a case inlet 4, a push-out protrusion 11 is formed in the central part of the case lid 3 by being pushed out into the case 1, a recess 10 facing the outside of the case 1 is formed in the push-out protrusion 11, a through-hole 15 is provided in the peripheral wall 14 of the push-out protrusion 11, the case 1, the through-hole 15 and the recess 10 of the push-out protrusion 11 are filled with a potting material 16 in series, a circuit board 2 and an electronic component 5 are embedded in the potting material 16 filling the case 1, and the case lid 3 is secured to the case 1 by hardening of the potting material 16 filling the case 1, the through-hole 15 and the recess 10 of the push-out protrusion 11, in series.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic control device, a method for attaching the electronic control device, and a method for manufacturing the electronic control device.

  Conventionally, as an electronic control device, provided with a case, a circuit board, and a case lid, a case entrance is opened on one end side of the case, an end wall is provided on the other end side, and an electronic component is mounted on the circuit board. There is a case in which a circuit board and an electronic component are accommodated in a case, and a case entrance of the case is covered with a case lid (see, for example, Patent Document 1).

  According to this type of electronic control device, there is an advantage that the case and the case lid can protect the circuit board and the electronic components mounted on the circuit board from water and dust.

  However, in the thing of patent document 1, since the inside of a case is hollow and the case cover is fixed to the case by liquid welding or adhesion | attachment, there exists a problem.

JP 2006-36147 A (see FIG. 2)

<< Problem >> Manufacturing of an electronic control device becomes complicated.
In the thing of patent document 1, since the inside of a case is hollow and the case lid is fixed to the case by welding or adhesion, it is troublesome to seal the case lid and the case, and the manufacture of the electronic control device is complicated. become.

  An object of the present invention is to provide an electronic control device that can simplify the manufacture of the electronic control device, a method for mounting the same, and a method for manufacturing the same.

  The inventors of the present invention, as a result of research, embed a part of the circuit board, the electronic component, and the case lid in the potting material, and fix the case lid to the case by hardening the potting material. Focusing on the fact that the lid and case sealing work can be omitted, the present invention has been achieved.

(Invention of Claim 1)
Invention specific matters of the invention according to claim 1 are as follows.
As illustrated in FIG. 1A, a case (1), a circuit board (2), and a case lid (3) are provided.
A case inlet (4) is opened at one end of the case (1), an end wall (6) is provided at the other end, an electronic component (5) is mounted on the circuit board (2), and the case (1 ) In which the circuit board (2) and the electronic component (5) are housed, and the case entrance (4) of the case (1) is covered with the case lid (3).
As illustrated in FIG. 1A, the peripheral portion (8) of the case lid (3) is brought into contact with the opening edge (9) of the case inlet (4), and the case ( 1) An extruded protrusion (11) pushed out into the inside is formed, and a recessed portion (10) facing outside the case (1) is formed in the extruded protrusion (11), and the peripheral wall of the extruded protrusion (11) (14) is provided with a through hole (15),
As illustrated in FIG. 1A, a potting material (16) is continuously filled in the case (1), the through hole (15), and the recessed portion (10) of the extrusion protrusion (11). The circuit board (2) and the electronic component (5) are embedded in the potting material (16) filled in the case (1), and the inside of the case (1), the through-hole (15), and the extrusion protrusion (11). An electronic control device characterized in that the case lid (3) is fixed to the case (1) by hardening of the potting material (16) filled in series over the recessed portion (10).

(Invention according to claims 2 to 4)
The inventions according to claims 2 and 3 are an electronic control device and a mounting method thereof for efficiently cooling the circuit board (2) and the electronic component (5), and the invention according to claim 4 is potting in a case. The present invention relates to a method for manufacturing an electronic control device that facilitates a material filling operation.

(Invention of Claim 1)
The invention according to claim 1 has the following effects.
<< Effect >> Manufacturing of the electronic control device can be simplified.
As illustrated in FIG. 1A, a potting material (16) is continuously filled in the case (1), the through hole (15), and the recessed portion (10) of the extrusion protrusion (11). The circuit board (2) and the electronic component (5) are embedded in the potting material (16) filled in the case (1), and the inside of the case (1), the through-hole (15), and the extrusion protrusion (11). Since the case lid (3) is fixed to the case (1) by the hardening of the potting material (16) filled in series over the recessed portion (10), the circuit board (2) and the electronic component (5) Not only is the potting material (16) prevented from contact with water and dust, but it is no longer necessary to seal the case lid (3) and the case (1) by welding or bonding. It can be simplified.

<Effect> High waterproof and anti-vibration function for circuit boards and electronic parts.
As illustrated in FIG. 1A, a potting material (16) is continuously filled in the case (1), the through hole (15), and the recessed portion (10) of the extrusion protrusion (11). Since the circuit board (2) and the electronic component (5) are embedded in the potting material (16) filled in the case (1), moisture and dust travel along the case lid (3) and the circuit board (2 ) And the electronic component (5), and the waterproof and dustproof function for the circuit board (2) and the electronic component (5) is high. Further, the vibration of the case (1) and the case lid (3) is absorbed by the potting material (16), and the vibration-proof function for the circuit board (2) and the electronic component (5) is high.

(Inventions according to claims 2 and 3)
The invention according to claim 2 has the following effects.
<Effect> The circuit board and the electronic component are efficiently cooled.
As illustrated in FIG. 1A, the case lid (3) is a heat sink of the circuit board (2), and the peripheral portion (8) of the case lid (3) not embedded in the potting material (16) is an electron. When it is attached to the device mounting seat (7) as the mounting portion of the control device and the heat of the circuit board (2) is conducted to the device mounting seat (7) through the case lid (3) The heat generated by the circuit board (2) and the electronic component (5) is radiated to the device mounting seat (7) through the case lid (3), so that the circuit board (2) and the electronic component (5) are efficiently cooled. Done.

(Invention of Claim 4)
The invention according to claim 4 has the following effects.
<Effect> The potting material can be easily filled into the case.
As illustrated in FIG. 1 (B), a liquid potting material (16) is injected into the recessed portion (10) in the extrusion projection (11), and the potting material (16) is caused by its own weight from the through hole (15). After flowing into the case (1), the electronic component (5), the circuit board (2), and the recessed portion (10) of the extrusion protrusion (11) are immersed in the potting material (16), and then the potting material (16 ) Is cured, the filling state of the potting material (16) in the case (1) is confirmed by the liquid level height of the potting material (16) in the recessed portion (10), and the potting material (16) is in the case. Failure to overflow from (1) is unlikely to occur, and the potting material (16) can be easily filled into the case (1).

1A and 1B are diagrams illustrating an electronic control device according to an embodiment of the present invention. FIG. 1A is a longitudinal side view showing the electronic control device and its mounting state, and FIG. It is a vertical side view. It is the figure which looked at the electronic controller of Drawing 1 from the case lid side.

  FIGS. 1A and 1B are diagrams illustrating an electronic control unit according to an embodiment of the present invention. In this embodiment, an engine ECU of an industrial diesel engine will be described.

First, an embodiment of an electronic control device will be described.
This electronic control device is an engine ECU. The engine ECU is an abbreviation for an engine electronic control unit, and is a microcomputer having a governor function for controlling the engine speed by adjusting the fuel injection amount and the injection timing of the engine according to operating conditions.
As shown in FIG. 1A, the engine ECU includes a case (1), a circuit board (2), and a case lid (3).
The engine ECU has a case inlet (4) opened at one end of the case (1), an end wall (6) provided at the other end, and an electronic component (5) mounted on the circuit board (2). Then, the circuit board (2) and the electronic component (5) are accommodated in the case (1), and the case inlet (4) of the case (1) is covered with the case lid (3).

Examples of the industrial diesel engine using the engine ECU include engines mounted on agricultural machines and construction machines such as tractors and backhoes.
The electronic control unit may be an ACU. ACU is an abbreviation for post-processing electronic control unit, and is a microcomputer that controls the purification of exhaust gas by adjusting the injection amount and timing of urea water in the urea SCR system according to the exhaust conditions. SCR is an abbreviation for selective catalytic reduction.
As shown in FIG. 1A, the case (1) is a rectangular box made of synthetic resin. The circuit board (2) is provided with a connector (17), the connector (17) is fitted into the notch (18a) of the peripheral wall (18) of the case (1), and the circuit board (2) is attached to the case (1). It is supported. The electronic component (5) includes a central processing unit and a memory. The case lid (3) is a sheet metal plate material provided with an extruded protrusion (11) at the center.

As shown in FIG. 1A, in this electronic control device, the peripheral edge portion (8) of the case lid (3) is brought into contact with the opening edge (9) of the case inlet (4), so that the case lid (3) An extrusion protrusion (11) pushed into the case (1) is formed at the center, and a recess (10) facing the outside of the case (1) is formed in the extrusion protrusion (11). A through hole (15) is provided in the peripheral wall (14) of (11).
As shown in FIG. 1 (A), in this electronic control device, the potting material (16) is formed in the case (1), the through hole (15), and the recessed portion (10) of the pushing projection (11). The circuit board (2) and the electronic component (5) are embedded in the potting material (16) filled in a series and filled in the case (1), and the inside of the case (1) and the through hole (15) are pushed out. The case lid (3) is fixed to the case (1) by hardening of the potting material (16) filled in series over the recessed portion (10) of the portion (11).
As the potting material (16), a curable and heat conductive electrically insulating resin is used.

As shown in FIG. 1 (A), in this electronic control device, the electronic component (5) is mounted on the surface (2a) of the circuit board (2) facing the end wall (6) of the case (1), and pushed out. The protruding end portion (12) of the protruding portion (11) is bonded to the back surface (2b) of the circuit board (2), the case lid (3) is used as a heat sink, and the case lid (not embedded in the potting material (16)) The peripheral part (8) of 3) is an attachment part of the electronic control unit.
The projecting end portion (12) of the extrusion projecting portion (11) is bonded with heat conductive silicon applied to the back surface (2b) of the circuit board (2). A bolt insertion hole (19) is provided in the peripheral portion (8) of the case lid (3), and a nut (20) is welded to the inner surface of the peripheral portion (8) of the case lid (3).

Next, an embodiment of an electronic control device mounting method will be described.
As shown in FIG. 1 (A), the peripheral portion (8) of the case lid (3) serving as a heat radiating portion is attached to the device mounting seat (7), and the heat of the circuit board (2) serves as a heat sink. Heat is radiated to the device mounting seat (7) via (3).
The device mounting seat (7) is a support substrate accommodated in the hood of the engine-equipped machine.
The bolt (21) inserted into the bolt insertion hole (19) from the lower side of the device mounting seat (7) is screwed into the nut (20), and the electronic control device is mounted on the device mounting seat (7).

Next, a method for manufacturing the electronic control device will be described.
As shown in FIG. 1B, the electronic component (5) and the circuit board (2) are accommodated in the case (1) from the case entrance (4), and the case entrance (4) is placed from the upper side to the case lid (3). The peripheral edge (8) of the case lid (3) is placed on the opening edge (9) of the case inlet (4).
As shown in FIG. 1 (B), the liquid potting material (16) is injected into the recessed portion (10) in the extrusion protrusion (11), and the potting material (16) is loaded from the through hole (15) with its own weight. (1) After flowing into the electronic component (5), the circuit board (2), and the recessed portion (10) of the protruding projection (11) in the potting material (16), the potting material (16) Is cured.

(1) Case
(2) Circuit board
(2a) Surface
(2b) Back side
(3) Case lid
(4) Case entrance
(5) Electronic components
(6) End wall
(7) Device mounting seat
(8) Perimeter
(9) Opening edge
(10) Recessed part
(11) Extrusion protrusion
(12) Protruding end
(14) Perimeter wall
(15) Through hole
(16) Potting material

Claims (4)

A case (1), a circuit board (2) and a case lid (3);
A case inlet (4) is opened at one end of the case (1), an end wall (6) is provided at the other end, an electronic component (5) is mounted on the circuit board (2), and the case (1 ) In which the circuit board (2) and the electronic component (5) are housed, and the case entrance (4) of the case (1) is covered with the case lid (3).
The peripheral edge (8) of the case lid (3) is brought into contact with the opening edge (9) of the case inlet (4), and an extruded protrusion (pushed out into the case (1) at the center of the case lid (3) ( 11) is formed, a recessed portion (10) facing the outside of the case (1) is formed in the extruded protrusion (11), and a through hole (15) is provided in the peripheral wall (14) of the extruded protrusion (11). And
A potting material (16) is continuously filled in the case (1), the through hole (15), and the recessed portion (10) of the extrusion protrusion (11), and the potting material filled in the case (1). The circuit board (2) and the electronic component (5) are embedded in (16), and are continuously formed in the case (1), the through hole (15), and the recessed portion (10) of the extrusion protrusion (11). An electronic control device, wherein the case lid (3) is fixed to the case (1) by hardening of the filled potting material (16). The electronic control device according to claim 1,
The electronic component (5) is mounted on the surface (2a) of the circuit board (2) facing the end wall (6) of the case (1), and the protruding end part (12) of the extrusion protrusion (11) is the circuit board ( 2) Bonded to the back surface (2b), the case lid (3) is used as a heat sink for the circuit board (2), and the peripheral portion (8) of the case lid (3) not embedded in the potting material (16) An electronic control device characterized in that the electronic control device is a mounting portion of the control device. An electronic control device mounting method according to claim 2,
The peripheral portion (8) of the case lid (3) is attached in contact with the device mounting seat (7), and the heat of the circuit board (2) is conducted to the device mounting seat (7) through the case lid (3). An electronic control device mounting method characterized by that. A method of manufacturing an electronic control device according to claim 1 or 2,
The electronic component (5) and the circuit board (2) are accommodated in the case (1) from the case inlet (4), the case inlet (4) is covered with the case lid (3) from above, and the case lid (3) The peripheral edge (8) is placed on the opening edge (9) of the case inlet (4),
The liquid potting material (16) is injected into the upper recessed portion (10) in the extrusion protrusion (11), and the potting material (16) flows into the case (1) from the through hole (15) by its own weight, After the electronic component (5), the circuit board (2), and the recessed portion (10) of the extrusion protrusion (11) are immersed in the potting material (16), the potting material (16) is cured. A method for manufacturing an electronic control device.

Images