JP2016066707A - Light emission module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emission module in which the width of a substrate can be reduced.SOLUTION: A light emission module has a substrate, plural mounting portions arranged on the substrate so as to stand in a line, and plural semiconductor light emission elements each of which is provided to each of the mounting portions. The plural mounting portions contain one or more first mounting portions each of which has a wiring portion provided with the semiconductor light emission element, a first separation portion disposed away from the wiring portion in a predetermined direction intersecting to the arrangement direction of the plural mounting portions, and a second separation portion disposed so as to sandwich the wiring portion between the second separation portion and the first separation portion, and one or more second mounting portions each of which has a wiring portion, a second separation portion disposed in the predetermined direction and a first separation portion disposed so as to sandwich the wiring portion between the first separation portion and the second separation portion, the first mounting portions and the second mounting portions being alternately arranged on the substrate. In each semiconductor light emission element, an anode electrode is connected to the first separation portion, and a cathode electrode is connected to the second separation portion. The wiring portions are electrically connected to one another in parallel by connection members disposed between the plural separation portions and the plural wiring portions provided with the semiconductor light emission elements.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a light emitting module.

  2. Description of the Related Art In recent years, light emitting modules using LEDs (Light Emitting Diodes), which are a type of semiconductor element that emits light when an electric current is passed, have become popular. In a light emitting module using LEDs, a plurality of semiconductor light emitting elements are arranged on a substrate.

JP2012-142165A

  The problem to be solved by the present invention is to provide a light emitting module capable of reducing the width of a substrate.

  A light emitting module according to an embodiment includes a substrate, a plurality of mounting portions arranged in a line on the substrate, and a plurality of semiconductor light emitting elements provided in each of the mounting portions, and the plurality of mountings. And a first spacing portion that is spaced apart from the wiring portion in a predetermined direction intersecting a direction in which the plurality of mounting portions are arranged, and the first spacing portion. One or more first mounting parts having a second spacing part arranged spaced apart from the wiring part at a position sandwiching the wiring part between the spacing part and the wiring part, the wiring part in the predetermined direction The second separation portion disposed away from the wiring portion, and the first separation disposed away from the wiring portion at a position sandwiching the wiring portion between the second separation portion and the second separation portion. One or more second mounting portions having a portion are alternately arranged on the substrate, and the semiconductor Each of the light emitting elements has an anode electrode connected to the first separation portion, a cathode electrode connected to the second separation portion, and the wiring portion including a plurality of separation portions arranged in the predetermined direction. The semiconductor light emitting elements are electrically connected in parallel by connecting members disposed between the plurality of wiring portions provided with the semiconductor light emitting elements.

  According to the light emitting module of the embodiment, an effect that the width of the substrate can be reduced can be expected.

FIG. 1 is a perspective view illustrating an example of a lighting device according to the embodiment. FIG. 2 is a cross-sectional view illustrating an example of a lighting device according to the embodiment. FIG. 3 is a conceptual diagram illustrating an example of an electrical connection relationship of the lighting device according to the embodiment. FIG. 4 is a diagram illustrating an example of the configuration of the light emitting module according to the embodiment. FIG. 5 is a top view illustrating an example of the light emitting unit according to the embodiment. FIG. 6 is a cross-sectional view of the light emitting unit taken along the line AA in FIG. FIG. 7 is an explanatory diagram for explaining a configuration of the light emitting module according to the embodiment. FIG. 8 is a top view illustrating an example of the light emitting unit. FIG. 9 is an explanatory diagram for explaining a configuration of the light emitting module.

  A light emitting module 15 according to an embodiment described below includes a substrate, a plurality of mounting portions arranged in a line on the substrate, and a plurality of semiconductor light emitting elements provided in each of the mounting portions. The mounting portion includes a wiring portion in which the semiconductor light emitting element is provided, a first spacing portion that is spaced apart from the wiring portion in a predetermined direction intersecting a direction in which the plurality of mounting portions are arranged, and a first spacing portion One or more first mounting parts having a second spacing part that is spaced apart from the wiring part at a position sandwiching the wiring part between the wiring part and the wiring part, spaced apart from the wiring part in a predetermined direction One or more second mounting parts having a second spacing part and a first spacing part that is spaced apart from the wiring part at a position sandwiching the wiring part between the second spacing part and the second spacing part. Are alternately arranged on the substrate, and each of the semiconductor light emitting elements has an anode electrode connected to the first separation portion, The sword electrode is connected to the second spaced-apart portion, and the wiring portion is connected in parallel by a connection member disposed between the plurality of spaced-apart portions arranged in a predetermined direction and the plurality of wiring portions provided with the semiconductor light emitting elements. Electrically connected to

  In the light emitting module 15 according to the embodiment described below, the semiconductor light emitting elements provided in the one or more first mounting parts or the one or more second mounting parts may be electrically connected in parallel.

  A light emitting module 15 according to an embodiment described below includes a long substrate, a plurality of mounting portions provided along the longitudinal direction of the substrate, and a plurality of semiconductor light emitting elements provided in each of the mounting portions. The plurality of mounting portions are provided in a short distance from the first wiring portion on which the first semiconductor light emitting element is mounted and the first wiring portion. A first separation portion connected to the semiconductor light emitting element by a wire and a first separation portion provided so as to sandwich the first wiring portion, and a second separation portion connected to the first semiconductor light emitting element by a wire A first mounting portion composed of a separation portion, a second wiring portion on which the second semiconductor light emitting element is mounted, and a second wiring portion spaced apart from each other in the lateral direction. A second wiring portion is formed by a third spacing portion connected to the second semiconductor light emitting element by a wire, and a third spacing portion. And a second mounting portion configured by a fourth spacing portion connected to the second semiconductor light emitting element by a wire, and the first spacing portion is electrically connected to one potential and the second spacing portion. The second spacing portion is electrically connected to the third spacing portion, the fourth spacing portion is electrically connected to the second wiring portion, and the second wiring portion is the first wiring. The first wiring portion is electrically connected to the other potential.

  Hereinafter, a light emitting module and an illumination device according to an embodiment will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the structure which has the same function in embodiment, and the overlapping description is abbreviate | omitted. Moreover, the light emitting module and the illuminating device described in the following embodiments are merely examples, and do not limit the present invention. Further, the following embodiments may be appropriately combined within a consistent range.

  Hereinafter, a straight tube lamp of an embodiment and a lighting device including a straight tube lamp, for example, a lighting fixture will be described with reference to FIGS.

[Configuration of Lighting Device 1]
FIG. 1 is a perspective view illustrating an example of a lighting device according to the embodiment. FIG. 2 is a cross-sectional view of the illumination device shown in FIG. 1 and 2, reference numeral 1 illustrates a direct-mounting illumination device. The lighting device 1 includes a device main body (apparatus main body) 2, a lighting device 3, a pair of first socket 4a and second socket 4b, a reflecting member 5, and a straight tube lamp that is an example of a light source device. 11 etc.

  The apparatus main body 2 shown in FIG. 2 is made of an elongated metal plate, for example. The apparatus main body 2 extends in the front and back direction of the paper surface depicting FIG. The lighting device 3 is fixed to an intermediate portion in the longitudinal direction of the device body 2. The lighting device 3 receives a commercial AC power source, generates a DC output, and supplies the DC output to a straight tube lamp 11 described later.

  The first socket 4 a and the second socket 4 b are connected to the socket support member and are respectively disposed at both ends in the longitudinal direction of the apparatus main body 2. The 1st socket 4a and the 2nd socket 4b are sockets with which the straight tube | pipe type | mold lamp 11 mentioned later is provided, respectively, for example, respectively, it suits the G13 type 1st nozzle | cap | die 13a and 2nd nozzle | cap | die 13b.

  FIG. 3 is a conceptual diagram illustrating an example of an electrical connection relationship of the lighting device according to the embodiment. As shown in FIG. 3, the first socket 4a and the second socket 4b have a pair of terminal fittings 8 or terminal fittings 9 to which lamp pins 16a and 16b described later are respectively connected. In order to supply power to a straight tube lamp 11 to be described later, the terminal fitting 8 of the first socket 4a is connected to the lighting device 3 via the in-apparatus wiring.

  As shown in FIGS. 1 and 2, the reflecting member 5 has, for example, a metal bottom plate portion 5a, a side plate portion 5b, and an end plate 5c, and has a trough shape with an open upper surface. Yes. The bottom plate part 5a is flat. The side plate portion 5b is bent obliquely upward from both ends in the width direction of the bottom plate portion 5a. The end plate 5c closes the end surface opening formed by the longitudinal ends of the bottom plate portion 5a and the side plate portion 5b. The reflection member 5 covers the main body 2 and each component attached to the main body 2. This state is held by a removable decorative screw 6. The first socket 4a and the second socket 4b protrude through the socket through hole to the lower side of the bottom plate portion 5a.

  The straight tube lamp 11 that is detachably supported by the first socket 4a and the second socket 4b will be described below with reference to FIGS. The straight tube lamp 11 has the same dimensions and outer diameter as the existing fluorescent lamp. The straight tube lamp 11 includes a pipe 12, a first base 13 a attached to both ends of the pipe 12, a second base 13 b, a beam 14, and a light emitting module 15.

  The pipe 12 is made of a translucent resin material, for example, in a long shape. As shown in FIG. 2, the pipe 12 has a pair of convex parts 12a on the inner surface of the upper part in its use state. The first base 13 a is attached to one end in the longitudinal direction of the pipe 12, and the second base 13 b is attached to the other end in the longitudinal direction of the pipe 12. The first base 13a and the second base 13b are detachably connected to the first socket 4a and the second socket 4b, respectively. By this connection, the straight tube lamp 11 supported by the first socket 4 a and the second socket 4 b is disposed directly below the bottom plate portion 5 a of the reflecting member 5. A part of the light emitted from the straight tube lamp 11 to the outside is reflected by the side plate portion 5 b of the reflecting member 5.

  As shown in FIG. 3, the first base 13a has two lamp pins 16a protruding to the outside. These lamp pins 16a are electrically insulated from each other. At the same time, the tip portions of the two lamp pins 16a are bent in an L shape, for example, substantially at right angles so as to be separated from each other. As shown in FIG. 3, the second base 13 b has one lamp pin 16 b that protrudes to the outside. The lamp pin 16b is provided at a columnar shaft portion and a tip portion of the columnar shaft portion, and has a front end portion (not shown) having an elliptical shape or an oval shape. Has a T-shape.

  The lamp pin 16a of the first base 13a is connected to the terminal fitting 8 of the socket 4a, and the lamp pin 16b of the second base 13b is connected to the terminal fitting 9 of the socket 4b. It is mechanically supported by the first socket 4a and the second socket 4b.

  As shown in FIG. 2, the beam 14 is accommodated in the pipe 12. Both ends in the longitudinal direction of the beam 14 are electrically insulated and connected to the first base 13a and the second base 13b. The beam 14 includes, for example, a substrate support portion 14a having a rib shape.

  FIG. 4 is a diagram illustrating an example of the configuration of the light emitting module according to the embodiment. As shown in FIG. 4, in the light emitting module 15, a plurality of light emitting units 54 are arranged side by side in the longitudinal direction of the substrate 21 on a substrate 21 made of, for example, epoxy formed in an elongated and substantially rectangular shape. Various electrical components 57 to 59 such as capacitors and connectors are disposed on the substrate 21. The surface of the substrate 21 is provided with a resist layer whose main component is a synthetic resin having high electrical insulation. This resist layer is, for example, white and functions as a reflective layer having a high light reflectance. The length of the substrate 21 is substantially equal to the total length of the beam 14.

  The light emitting module 15 is accommodated in the pipe 12 together with the beam 14. In this supported state, both end portions of the light emitting module 15 in the width direction are placed on the convex portions 12 a of the pipe 12. Thereby, the light emitting module 15 is disposed substantially horizontally above the maximum width portion in the pipe 12.

[Configuration of Light Emitting Unit 54]
FIG. 5 is a top view illustrating an example of the light emitting unit according to the embodiment. FIG. 6 is a cross-sectional view of the light emitting unit taken along the line AA in FIG. As shown in FIG. 5, the light emitting unit 54 includes a mounting pad 28 (corresponding to an example of a mounting part), an LED 45 (corresponding to an example of a semiconductor light emitting element), and a sealing member 53.

  As shown in FIG. 5, the mounting pad 28 includes a wiring pad 27, a first spacing pad 26, and a second spacing pad 25. The wiring pad 27 is provided with an LED 45. In the example of FIG. 5, the wiring pad 27 is disposed between the first spacing pad 26 and the second spacing pad 25. The first spacing pad 26 is spaced from the wiring pad 27 in the X direction. The X direction is, for example, the upward direction from the center of the substrate 21 in the short direction. The second spacing pad 25 is disposed away from the wiring pad 27 at a position sandwiching the wiring pad 27 with the first spacing pad 26. In other words, the second spacing pad 25 is disposed away from the wiring pad 27 in the Y direction. The Y direction is, for example, a downward direction from the center of the substrate 21 in the short direction. That is, the Y direction is the direction opposite to the X direction. The wiring pad 27, the first spacing pad 26, and the second spacing pad 25 are made of, for example, copper. Since copper has a low reflectance, the surface thereof is plated with a material having a high reflectance such as silver. Further, a resist layer for preventing silver corrosion is formed on portions excluding the wiring pads 27, the first spacing pads 26, and the second spacing pads 25, and the mounting pads 28 are visually as shown in FIG. Appearance. Since the mounting pad 28 is covered with the sealing member 53, corrosion is suppressed.

  The LED 45 (an example of a semiconductor light emitting element) is provided on the mounting pad 28. Specifically, the LED 45 is provided on the wiring pad 27 as shown in FIGS. 5 and 6. For example, the LED 45 is die-bonded on the wiring pad 27 with an adhesive such as silver paste. The LED 45 is a bare chip, for example, and emits blue light.

  The LED 45 has an anode electrode connected to the first separation pad 26. For example, as shown in FIG. 5, the anode electrode of the LED 45 is wire-bonded to the first spacing pad 26 with a metal wire 51 such as gold. The LED 45 has a cathode electrode connected to the second spacing pad 25. For example, the cathode electrode of the LED 45 is wire-bonded to the second spacing pad 25 by a metal wire 52 such as gold as shown in FIG.

  As shown in FIGS. 5 and 6, the sealing member 53 is provided on the substrate 21 so as to cover the wiring pad 27, the first spacing pad 26, the second spacing pad 25, the LED 45, the wire 51, and the wire 52. It is done. As the sealing member 53, for example, a material obtained by adding a phosphor to a transparent resin having high diffusibility, such as epoxy resin, urea resin, silicon resin, or the like is used. The phosphor is excited by light emitted from the LED 45 and emits light having a color different from the color of light emitted from the LED 45. In this embodiment, a yellow phosphor that is excited by blue light emitted from the LED 45 and emits yellow light that is complementary to the blue light is used. Thereby, the light emitting unit 54 can emit white light as output light.

[Configuration of Light Emitting Module 15]
Here, the configuration of the light emitting module 15 according to the present embodiment will be described in detail with reference to FIG. FIG. 7 is an explanatory diagram for explaining a configuration of the light emitting module 15 according to the embodiment. Specifically, FIG. 7 is a simplified diagram showing the arrangement of the light emitting units 54 by removing the sealing member 53 from the light emitting module 15 shown in FIG.

  As shown in FIG. 7, the light emitting module 15 includes a plurality of mounting pads 28 and a plurality of LEDs 45. The plurality of mounting pads 28 are arranged in a line on the substrate 21. In the example of FIG. 7, twelve mounting pads 28 are arranged on the substrate 21 in a line in a direction orthogonal to the X direction. In FIG. 7, reference numeral 28 is attached to one mounting pad 28, but a portion having a similar shape corresponds to the mounting pad 28.

  The plurality of LEDs 45 are provided on each of the mounting pads 28 as shown in FIG. In FIG. 7, reference numeral 45 is given to one LED 45, but a portion having a similar shape corresponds to the LED 45.

The plurality of mounting pads 28 include a wiring pad 27 on which the LEDs 45 are provided, a first spacing pad 26 that is spaced apart from the wiring pad 27 in the X direction intersecting the direction in which the plurality of mounting pads 28 are arranged, and the first with one or more first mounting pad 28 ₁ having a second spacing pad 25 that is spaced apart from the wiring pads 27 at positions sandwiching the wiring pads 27 between the spaced pads 26, LED 45 are provided wirings The pad 27 is disposed away from the wiring pad 27 at a position sandwiching the wiring pad 27 between the second spacing pad 25 and the second spacing pad 25 that is spaced from the wiring pad 27 in the X direction. one or more second and mounting pad 28 ₂ having a first spacing pad 26 to be is disposed on the substrate 21 alternately.

In the example of FIG. 7, a plurality of mounting pads 28, one or more first and the mounting pad 28 ₁ in having a second spaced pads 25 in the X direction, one or more having a first spacing pad 26 in the X direction a ₂ second mounting pads 28 are arranged on the substrate 21 alternately. In FIG. 7, reference numerals 27, 26, and 25 are assigned to one wiring pad 27, the first spacing pad 26, and the second spacing pad 25, respectively. This corresponds to the first spacing pad 26 and the second spacing pad 25.

Wherein one or more of the first mounting pad 28 ₁ or one or more second mounting pads 28 ₂ LED 45 provided may be electrically connected in parallel. In the example of FIG. 7, LED 45 provided in the first mounting pad 28 ₁ of the light emitting unit 54a includes a first mounting pad of the first LED 45 mounted is provided on the pad 28 ₁ and the light emitting unit 54c of the light emitting unit 54b 28 is electrically connected in parallel with LED45 provided _1. For example, the first spacing pad 26 of the light emitting unit 54a is electrically connected to the first spacing pad 26 of the light emitting unit 54b, the first spacing pad 26 of the light emitting unit 54c, and the wire 17 or the like. In FIG. 7, reference numeral 17 is attached to one wire 17, but a portion having a similar shape corresponds to the wire 17. The second spacing pad 25 of the light emitting unit 54a is electrically connected to the second spacing pad 25 of the light emitting unit 54b and the second spacing pad 25 of the light emitting unit 54c.

  Thereby, the light emitting unit 54a, the light emitting unit 54b, and the light emitting unit 54c are electrically connected in parallel to form the element group LA1. Similarly, the light emitting unit 54d, the light emitting unit 54e, and the light emitting unit 54f are electrically connected in parallel to form an element group LA2. The light emitting unit 54g, the light emitting unit 54h, and the light emitting unit 54i are electrically connected in parallel to form an element group LA3. The light emitting unit 54j, the light emitting unit 54k, and the light emitting unit 54l are electrically connected in parallel to form an element group LA4. For this reason, each of the element groups LA1 to LA4 is electrically connected in parallel, and therefore has the same potential.

Further, a plurality of mounting pads 28, as shown in FIG. 7, each element group, the first and the mounting pad 28 _1, the second spacing in the X direction in which the first spacing pads 26 are arranged in the X direction a ₂ second mounting pad 28 which pad 25 is disposed is disposed on the substrate 21 alternately. In the example of FIG. 7, ₁ first mounting pad 28 included in the element group LA1, a first spacing pad 26 is arranged in the X direction. ₂ second mounting pads 28 included in the element group LA2, a second spaced pads (Fourth separated portion) in the X direction 25, the first spacing pads (third separation portion) 26 is arranged in the Y-direction Is done. The first mounting pad 28 ₁ included in the element group LA3 includes a first spacing pad 26 is arranged in the X direction. ₂ second mounting pads 28 included in the element group LA4 includes second spacing pads 25 are arranged in the X direction.

  Each of the LEDs 45 has an anode electrode connected to the first separation pad 26. Each of the LEDs 45 has a cathode electrode connected to the second spacing pad 25. Thereby, each of LED45 flows the electric current from a power supply.

  In the example of FIG. 7, all the mounting pads 28 of the light emitting units 54a to 54l are electrically connected by the wire 17B. For this reason, all the mounting pads 28 of the light emitting units 54a to 54l have the same potential.

  Specifically, the wiring pads 27 are electrically connected in parallel by connecting members arranged between a plurality of spaced pads arranged in a predetermined direction and a plurality of wiring pads provided with the LEDs 45. In the example of FIG. 7, the wiring pads 27 included in the element group LA1 are connection members disposed between the first spacing pads 26 disposed in the X direction and the plurality of wiring pads 27 provided with the LEDs 45. They are electrically connected in parallel by a certain wire 17. The wiring pads 27 included in the element group LA2 are connected in parallel by the wires 17 that are connecting members arranged between the second spacing pads 25 arranged in the X direction and the plurality of wiring pads 27 provided with the LEDs 45. Electrically connected.

In other words, in the light emitting module 15, a plurality of mounting pads 28 are provided along the longitudinal direction of the substrate 21. The plurality of LEDs 45 are provided on each of the mounting pads 28. The plurality of mounting pads 28 are provided in a short distance from the first wiring pad 27 on which the first LED 45 is mounted and the first wiring pad 27, and are connected to the first LED 45 with wires. The first spacing pad 26 and the second spacing pad 25 provided so as to sandwich the first wiring pad 27 between the first spacing pad 26 and connected to the first LED 45 by a wire. the first and the mounting pads 28 ₁ that is configured, the second wiring pad 27 second LED45 are mounted, spaced from each other in the lateral direction with respect to the second wiring pad 27, the second A fourth separation pad 26 is provided to sandwich the second wiring pad 27 between the third separation pad 26 connected to the LED 45 by a wire and the third separation pad 26, and connected to the second LED 45 by a wire. And a second pad composed of the pad 25. With the mounting pads 28 _2. The first spacing pad 26 is electrically connected to one potential, the second spacing pad 25 is electrically connected to the third spacing pad 26, and the fourth spacing pad 25 is the second wiring pad 25. The second wiring pad 27 is electrically connected to the first wiring pad 27, and the first wiring pad 27 is electrically connected to the other potential.

  As a result, the light emitting module 15 can reduce the area of the substrate 21 where the wires 17 are wired, so that the width of the substrate 21 can be reduced. For example, since the light emitting module 15 connects all the wiring pads 27 between the first spacing pad 26 and the second spacing pad 25, all the wiring pads 27 are connected to the first spacing pad 26 and the second spacing pad 26. Compared with the case where wiring is performed outside the spacing pad 25, the substrate 21 can be narrowed.

  Further, since the light emitting module 15 can reduce the area of the substrate 21 where the wires are wired, the number of LEDs 45 can be increased. For example, in the light emitting module 15, the first spacing pad 26 and the second spacing pad 15 are compared with the case where all the wiring pads 27 are wired outside the first spacing pad 26 and the second spacing pad 25. Therefore, the number of LEDs 45 can be increased without changing the size of the substrate 21.

  In the example of FIG. 7, the first spacing pads 26 of the light emitting units 54a to 54c that are electrically connected in parallel are connected to a positive power source that is a positive electrode of the power source. The wiring pads 27 of the light emitting units 54a to 54l that are electrically connected in parallel are connected to a negative power source that is a negative electrode of the power source. Thereby, since an electric current can be sent through the light emitting units 54a to 54l, the LED 45 can be turned on and a wire 117D to be described later can be deleted, so that the width of the substrate 21 can be reduced or the width of the substrate 21 is left as it is. Can increase the mounting area.

  Next, the light emitting module 151 to be compared will be described with reference to FIGS. FIG. 8 is a top view illustrating an example of the light emitting unit 154 included in the light emitting module 151. As shown in FIG. 8, the light emitting unit 154 does not have the second spacing pad 25 as compared with the light emitting unit 54. That is, the light emitting unit 154 has only one separation pad. The cathode electrode of the LED 45 is wire-bonded to the wiring pad 27 with a metal wire 52 such as gold.

  FIG. 9 is an explanatory diagram for explaining the configuration of the light emitting module 151. In the example of FIG. 9, the light emitting module 151 includes light emitting units 154 a to 154 l provided on the substrate 21. Each of the light emitting units 154 a to 154 l has a mounting pad 28. Each of the mounting pads 28 includes a first spacing pad 26 and a wiring pad 27.

  In addition, the mounting pad 28 included in the light emitting units 154a to 154l has the first separation pad 26 arranged in the X direction. That is, all the mounting pads 28 are arranged in the same direction.

  The light emitting units 154a to 154c are electrically connected in parallel to form the element group LA11. The light emitting units 154d to 154f are electrically connected in parallel to form the element group LA12. The element group LA11 is electrically connected in series with the element group LA12 via the wire 117A. The light emitting units 154g to 154i are electrically connected in parallel to form an element group LA13. The element group LA13 is electrically connected in series with the element group LA12 via the wire 117B. The light emitting units 154j to 154l are electrically connected in parallel to form an element group LA14. The element group LA14 is electrically connected in series with the element group LA13 via the wire 117C.

  That is, in the light emitting module 151, the element groups LA11 to LA14 are connected in series by wires 117A to 117C wired between the element groups. For this reason, in the light emitting module 151, it is difficult to electrically connect all the mounting pads 28 in a straight line between the first spacing pads 26 and the wiring pads 27 like the light emitting module 15.

  Therefore, the mounting pads 28 of the light emitting units 154j to 154l are electrically connected to the negative power source via the wires 117D wired outside the center of the substrate 21 as compared with the wires 17B of the light emitting module 15. ing. Accordingly, the light emitting module 151 has a larger area used for wiring in the substrate 21 than the light emitting module 15. For this reason, it is difficult for the light emitting module 151 to reduce the width of the substrate as compared with the light emitting module 15. In other words, since the light emitting module 15 can reduce the area of the substrate 21 where the wires 17 are wired, compared to the light emitting module 151, the width of the substrate 21 can be reduced.

  In addition, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

15 Light-Emitting Module 17B Wire 21 Substrate 25 Second Spacing Pad 26 First Spacing Pad 27 Wiring Pad 28 Mounting Pad 45 LED

Claims (3)

A substrate;
A plurality of mounting portions arranged in a line on the substrate;
A plurality of semiconductor light emitting elements provided in each of the mounting parts;
Comprising
The plurality of mounting units are:
A wiring portion in which the semiconductor light emitting element is provided, a first spacing portion that is spaced apart from the wiring portion in a predetermined direction intersecting a direction in which the plurality of mounting portions are arranged, and the first spacing portion One or more first mounting parts having a second spacing part that is spaced apart from the wiring part at a position sandwiching the wiring part between the wiring part, the wiring part, and the wiring part in the predetermined direction The second spacing portion disposed at a distance and the first spacing portion disposed at a position sandwiching the wiring portion between the second spacing portion and the second spacing portion. One or more second mounting portions are alternately arranged on the substrate,
Each of the semiconductor light emitting elements is
An anode electrode is connected to the first spacing portion, a cathode electrode is connected to the second spacing portion,
The wiring part is
Electrically connected in parallel by connecting members disposed between the plurality of spaced-apart portions disposed in the predetermined direction and the plurality of wiring portions provided with the semiconductor light-emitting elements;
A light emitting module characterized by that. The semiconductor light emitting elements provided in the one or more first mounting parts or the one or more second mounting parts are electrically connected in parallel.
The light-emitting module according to claim 1. A long substrate;
A plurality of mounting portions provided in plural along the longitudinal direction of the substrate;
A plurality of semiconductor light emitting elements provided in each of the mounting parts;
Comprising
The plurality of mounting units are:
A first wiring portion on which the first semiconductor light emitting element is mounted, and a first wiring portion that is spaced apart from the first wiring portion in the short direction and connected to the first semiconductor light emitting element by a wire. The first spacing portion and the first spacing portion are provided so as to sandwich the first wiring portion, and the second spacing portion is connected to the first semiconductor light emitting element with a wire. A first mounting part;
A second wiring portion on which the second semiconductor light emitting element is mounted, and a second wiring portion provided in a short-side direction with respect to the second wiring portion, and connected to the second semiconductor light emitting element by a wire 3, and a fourth spacing portion provided so as to sandwich the second wiring portion between the third spacing portion and the third spacing portion, and connected to the second semiconductor light emitting element by a wire. A second mounting part;
Have
The first spacing portion is electrically connected to one potential, the second spacing portion is electrically connected to the third spacing portion, and the fourth spacing portion is the second wiring portion. Wherein the second wiring portion is electrically connected to the first wiring portion, and the first wiring portion is electrically connected to the other potential. Light emitting module.

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