JP2016046376A - High frequency module and method of manufacturing high frequency module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a high frequency module that can be miniaturized by increasing the number of take-up of a collective substrate, and to provide a miniaturized high frequency module.SOLUTION: A method of manufacturing a high frequency module has a first step for forming a wiring pattern 1 on a collective substrate 20, a second step for attaching an electronic component 3 and a conductive post 5 on the collective substrate 20, a third step for providing a sealing resin 7 covering the electronic component 3 on the collective substrate 20, a fourth step for forming an antenna pattern 9a on the surface of the sealing resin 7, and a fifth step for cutting and individualizing the collective substrate 20 and sealing resin 7. The conductive post 5 is mounted across the position where the collective substrate 20 is cut, and divided in the individualizing step.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a high-frequency module in which an electronic component or the like is mounted on an insulating substrate cut into individual pieces by cutting an aggregate substrate, and a method for manufacturing the same.

  Conventionally, in a high-frequency module built in a portable device or the like, a method in which a plurality of electronic components including an integrated circuit are mounted on an insulating substrate in a collective substrate state and a patterned antenna is provided on the same insulating substrate is generally used. Is. However, when an antenna or a plurality of electronic components are mounted on an insulating substrate in this way, the mounting area on the insulating substrate becomes very large, leading to an increase in the size of the high-frequency module. In order to solve such a problem, a high frequency module having a structure in which a plurality of electronic components are sealed with a sealing member, an antenna is provided on the surface of the sealing member, and the antenna and the plurality of electronic components are connected with a connection conductor. Has been proposed.

  This type of high-frequency module is disclosed in Patent Document 1. A high-frequency wireless module 900 disclosed in Patent Document 1 is shown in FIG.

  In the high-frequency wireless module 900, electronic components such as an IC 921 and a passive element 922 constituting a wireless transmission / reception function unit are mounted on a module substrate 901, and these are sealed by a sealing member 902 having electrical insulation. Further, a shield electrode 931 is provided inside the sealing member 902. An antenna conductor 903 that can be formed in a planar pattern such as an inverted F-type antenna or a patch antenna is provided on the upper surface of the sealing member 902, and the antenna conductor 903 is connected to the wiring 912 inside the module substrate 901 or sealed by the connection conductor 932. It is electrically connected to the electronic components 912 and 922 embedded in the stop member 902.

  In the high-frequency wireless module 900 configured as described above, since the number of module substrates 901 to be produced in a collective substrate state can be increased, the module shape can be reduced in size.

JP 2007-129304 A

  However, the high frequency module 900 has the following problems. In the high-frequency module 900, as described above, the antenna conductor 903 provided on the upper surface of the sealing member 902 is electrically connected to the electronic components 912 and 922 by the connection conductor 932. However, in order to fill the sealing member 902 after placing the connection conductor 932 on the module substrate 901 in the manufacturing process of the high-frequency module 900, the connection conductor 932 needs to have a thickness to be independent. Therefore, the connection conductor 932 occupies a relatively large area in the high frequency module 900. In particular, as the miniaturization of the high-frequency module 900 is more strongly demanded, the ratio of the area occupied by the connection conductor 932 is increased. For this reason, the high-frequency module 900 is prevented from being downsized.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a method of manufacturing a high-frequency module capable of increasing the number of collective substrates and reducing the size. Another object is to provide a miniaturized high frequency module.

  In order to solve this problem, a method for manufacturing a high-frequency module according to the present invention includes a first step of forming a wiring pattern on a collective substrate, and a second step of attaching an electronic component and a conductive post on the collective substrate. A third step of providing a sealing resin covering the electronic component on the collective substrate; a fourth step of forming an antenna pattern on the surface of the sealing resin; and cutting the collective substrate and the sealing resin. And the conductive post is placed across the position where the collective substrate is cut, and is divided in the step of dividing into pieces. Has characteristics.

  In the method of manufacturing a high-frequency module configured in this way, the conductive posts are divided, and the area occupied by the conductive posts per high-frequency module is reduced, so that the number of collective substrates can be increased. The manufacturing method of the high frequency module which can be reduced and can be provided can be provided.

  In order to solve this problem, the high-frequency module of the present invention includes a rectangular insulating substrate, a wiring pattern provided on the insulating substrate, an electronic component provided on the insulating substrate, and the insulation. A conductive post provided on a substrate; a sealing resin that covers the electronic component and the wiring pattern; and an antenna pattern provided on the sealing resin. It is connected to the electronic component via a post and the wiring pattern, the conductive post is provided at the center of one side of the insulating substrate, and the side surface of the conductive post is exposed, It has the characteristics.

  The high-frequency module configured in this manner has a small area occupied by a conductive post provided at the center of one side of the insulating substrate. Therefore, a miniaturized high frequency module can be obtained.

  In order to solve this problem, the high-frequency module of the present invention includes a rectangular insulating substrate, a wiring pattern provided on the insulating substrate, an electronic component provided on the insulating substrate, and the insulation. A conductive post provided on a substrate; a sealing resin that covers the electronic component and the wiring pattern; and an antenna pattern provided on the sealing resin. It is connected to the electronic component via a post and the wiring pattern, the conductive post is provided at one corner of the insulating substrate, and the side surface of the conductive post is exposed. Have

  In the high-frequency module configured as described above, the area occupied by the conductive posts provided at one corner of the insulating substrate is further reduced. Therefore, a more miniaturized high frequency module can be obtained.

  In the method of manufacturing a high frequency module according to the present invention, since the conductive posts are divided and the area occupied by the conductive posts per high frequency module is reduced, the number of collective substrates can be increased, and the size can be reduced. It is possible to provide a method of manufacturing a high-frequency module that can be realized. In the high-frequency module of the present invention, the area occupied by the conductive post provided in the center of one side of the insulating substrate is small. Therefore, a miniaturized high frequency module can be obtained. In the high frequency module of the present invention, the area occupied by the conductive posts provided at one corner of the insulating substrate is further reduced. Therefore, a more miniaturized high frequency module can be obtained.

It is a top view of the assembly board in connection with the manufacturing method of the high frequency module of this invention. It is a perspective view before the cutting | disconnection in connection with the manufacturing method of 1st Embodiment. It is a top view before the cutting | disconnection in connection with the manufacturing method of 1st Embodiment. It is explanatory drawing in connection with the manufacturing method and 1st process of 1st Embodiment. It is explanatory drawing in connection with the manufacturing method and 2nd process of 1st Embodiment. It is explanatory drawing in connection with the manufacturing method and 3rd process of 1st Embodiment. It is explanatory drawing in connection with the manufacturing method and 4th process of 1st Embodiment. It is explanatory drawing in connection with the manufacturing method and 5th process of 1st Embodiment. It is explanatory drawing of the high frequency module manufactured with the manufacturing method of 1st Embodiment. It is a perspective view before the cutting | disconnection in connection with the manufacturing method of 2nd Embodiment. It is a top view before the cutting | disconnection concerning the manufacturing method of 2nd Embodiment. It is explanatory drawing of the high frequency module manufactured with the manufacturing method of 2nd Embodiment. It is a perspective view before the cutting | disconnection in connection with the manufacturing method of 3rd Embodiment. It is a top view before the cutting | disconnection concerning the manufacturing method of 3rd Embodiment. It is explanatory drawing of the high frequency module manufactured with the manufacturing method of 3rd Embodiment. It is sectional drawing in connection with the structure of the high frequency wireless module which concerns on a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification, unless otherwise specified, the X1 side of each drawing is described as the right side, the X2 side as the left side, the Y1 side as the back side, the Y2 side as the near side, the Z1 side as the upper side, and the Z2 side as the lower side. To do.

[First embodiment]
First, the manufacturing method of the high frequency module 100 which is the manufacturing method of 1st Embodiment of this invention is demonstrated using FIG. 1 thru | or FIG.

  FIG. 1 is a plan view showing a collective substrate 20 used in the method for manufacturing the high-frequency module 100. Note that the plan view of the collective substrate 20 used in the method for manufacturing the high-frequency module 200 and the high-frequency module 300 described below is also the same as the plan view of the collective substrate 20 shown in FIG. 2 is a perspective view of a state before cutting the collective substrate 20 related to the method for manufacturing the high-frequency module 100, and FIG. 3 is a plan view of the collective substrate 20 related to the method for manufacturing the high-frequency module 100 before cutting. is there. 4 is an explanatory diagram related to the manufacturing method and the first step of the high-frequency module 100, FIG. 5 is an explanatory diagram related to the second step, and FIG. 6 is an explanatory diagram related to the third step. 7 is an explanatory diagram related to the fourth step, and FIG. 8 is an explanatory diagram related to the fifth step. 4 to 8, a plan view is shown in (a) and a side view is shown in (b).

  As shown in FIG. 1, in the method for manufacturing a high-frequency module of the present invention, a collective substrate 20 is prepared. On the collective substrate 20, a plurality of rectangular insulating substrates 11, which are partitioned by a plurality of vertical cutting lines 21 and a plurality of horizontal cutting lines 22, are formed in a lattice shape. Thereafter, electronic circuits corresponding to the plurality of insulating substrates 11 are collectively provided to form a plurality of high-frequency modules. The method for manufacturing a high-frequency module according to the present invention is a method for obtaining a high-frequency module by cutting the collective substrate 20 with the vertical cutting line 21 and the horizontal cutting line 22 as the center line and dividing them into pieces.

  The method for manufacturing the high-frequency module 100 is a method for manufacturing the high-frequency module 100 by using two adjacent insulating substrates 11 in the collective substrate 20 as a set. This description will be made on any two adjacent insulating substrates 11 in the collective substrate 20. The manufacturing method is the same for other insulating substrates 11 in the collective substrate 20.

  In the state before the collective substrate 20 is cut in the manufacturing method of the high-frequency module 100, as shown in FIG. 3, the wiring patterns 1 are formed on the two adjacent insulating substrates 11 in the collective substrate 20, respectively. As shown in FIG. 3, a plurality of electronic components 3 constituting an electronic circuit in the high-frequency module 100 are attached. The wiring pattern 1 and the electronic component 3 are sealed with a sealing resin 7. On the sealing resin 7, a meander-shaped antenna pattern 9a that is an antenna element of the antenna 9 constituting the electronic circuit in the high-frequency module 100 is formed.

  As shown in FIGS. 2 and 3, the conductive post 5 is attached across the two insulating substrates 11 in the center of the adjacent sides of the two insulating substrates 11. The conductive post 5 is connected to the wiring pattern 1 by the two insulating substrates 11, and is connected to one end of the antenna pattern 9 a on the sealing resin 7. Therefore, the electronic component 3 on the insulating substrate 11 is connected to the antenna pattern 9 a on the sealing resin 7 via the conductive post 5. That is, the conductive post 5 is shared by the electronic circuits formed on the two insulating substrates 11.

  As can be seen from FIG. 3, the conductive posts 5 are shared by the electronic circuits formed on the two insulating substrates 11 to obtain two identical high-frequency modules 100, and the respective wiring patterns on the two insulating substrates 11. 1, the electronic component 3 and the antenna pattern 9a are arranged point-symmetrically with the conductive post 5 as a center point. The two high-frequency modules 100 are manufactured by subsequently cutting the two insulating substrates 11. In each of the two insulating substrates 11, the conductive post 5 becomes half the size of the original conductive post 5 after the insulating substrate 11 is cut.

  Next, each manufacturing process in the manufacturing method of the high frequency module 100 is demonstrated.

  In the first step of the method of manufacturing the high-frequency module 100, a plurality of wiring patterns 1 are formed on the collective substrate 20, as shown in FIGS. 4 (a) and 4 (b). The wiring pattern 1 is provided to connect the plurality of electronic components 3 and the conductive posts 5 that are disposed thereafter, and is formed by printing a conductive metal such as a copper foil. In addition, the connection electrodes 1 a and the connection electrodes 1 b are disposed at the places where the electronic components 3 and the conductive posts 5 are placed at both ends of each wiring pattern 1.

  In the second step of the method for manufacturing the high-frequency module 100, as shown in FIGS. 5A and 5B, the electronic component 3 and the conductive post 5 are attached on the collective substrate 20. The electronic component 3 includes an integrated circuit incorporating a high-frequency circuit that is a main part of an electronic circuit mounted on the high-frequency module 100, and passive components such as resistors and capacitors. The electronic component 3 is placed on the connection electrode 1a shown in FIGS. 4 (a) and 4 (b).

  The conductive post 5 is formed of a conductive metal or the like, and both ends thereof are electrically connected. The conductive post 5 has a prismatic shape or a cylindrical shape. The conductive post 5 is placed on the connection electrode 1b formed at the center of the adjacent sides of the two insulating substrates 11 shown in FIGS. 4 (a) and 4 (b). Therefore, the conductive post 5 is placed across the position where the collective substrate 20 is cut. Thereafter, the electronic component 3 and the conductive post 5 are attached to the connection electrode 1a and the connection electrode 1b by reflow soldering. As a result, one end of the conductive post 5 is connected to the electronic component 3 through the wiring pattern 1.

  As described above, the electronic component 3 and the conductive post 5 are placed on the connection electrode 1a and the connection electrode 1b and then attached by reflow soldering. However, the reflow applied to the insulating substrate 11 at the time of placement and attachment is performed. Must be stable and self-supporting on the solder. That is, it is required not to fall down due to the vibration of the mounting equipment during mounting, the vibration during transportation, or the wind or vibration of the reflow furnace. In particular, since the conductive post 5 has a columnar shape that is taller than the electronic component 3, it is easy to fall down. Therefore, a predetermined mounting area for self-supporting is required on the mounting surface of the conductive post 5 having a prismatic shape or a cylindrical shape. Further, the mounting area of the conductive post 5 is not related to the area of the insulating substrate 11. That is, even if the area of the insulating substrate 11 is reduced, the necessary mounting area of the conductive posts 5 does not change.

  As described above, a predetermined mounting area for self-supporting is required on the mounting surface of the conductive post 5. In the method of manufacturing the high-frequency module 100, the conductive post 5 is shared by the two insulating substrates 11. By doing so, the area of the region of the conductive post 5 on one insulating substrate 11 can be halved as compared with the conventional manufacturing method.

  In the third step of the method for manufacturing the high-frequency module 100, as shown in FIGS. 6A and 6B, the sealing resin 7 that covers the electronic component 3 is provided on the collective substrate 20. That is, resin sealing is performed on the electronic component 3 on the collective substrate 20. Resin sealing is performed by hardening the periphery of the electronic component 3 in order to protect the electronic circuit in the high-frequency module 100 from external factors such as impact, temperature, and humidity. A thermosetting resin is used as the sealing resin 7. Resin sealing is performed by putting the collective substrate 20 to which the electronic component 3 and the conductive post 5 are attached into a predetermined mold, pouring the resin into the mold while melting it with heat, and hardening it. As a result of the resin sealing, most of the wiring pattern 1, the electronic component 3, and the conductive post 5 are covered with the sealing resin 7. However, as shown in FIG. It is exposed from the sealing resin 7.

  When the thickness of the aggregate substrate 20 of the high-frequency module 100 that is required to be thin is 0.3 mm and the thickness of the resin is 0.7 mm, for example, the head of the conductive post 5 is exposed from the sealing resin 7. In order to make the thickness 0.1 mm, the height of the conductive post 5 may be 0.8 mm. As a result, the thickness of the high frequency module 100 can be reduced to 1.1 mm.

  In the fourth step of the method for manufacturing the high-frequency module 100, the antenna pattern 9a is formed on the upper surface of the sealing resin 7, as shown in FIGS. 7 (a) and 7 (b). The antenna pattern 9 a is formed by printing a conductive metal on the upper surface of the sealing resin 7. The antenna pattern 9 a is printed on the surface of the sealing resin 7, and the antenna pattern 9 a is connected to the head of the conductive post 5 exposed from the sealing resin 7. As shown in FIG. 7A, the antenna pattern 9a is formed point-symmetrically with the conductive post 5 at the center of the two insulating substrates 11 as the center. In the method of manufacturing the high-frequency module 100, the antenna 9 is a monopole antenna having a meander-shaped antenna pattern 9a. However, other antennas such as an inverted F antenna may be used.

  In the fifth step of the method of manufacturing the high-frequency module 100, as shown in FIGS. 8A and 8B, the collective substrate 20 and the sealing resin 7 are cut into individual pieces. In the fifth step, cutting is performed along the vertical cutting lines 21 and the horizontal cutting lines 22 of the collective substrate 20 shown in FIG. At this time, the conductive posts 5 are simultaneously divided in the step of separating the collective substrate 20 into the insulating substrate 11, and become the divided conductive posts 5a.

  The shape of the high-frequency module 100 becomes a rectangular shape by being singulated, but since the manufacturing method of the high-frequency module 100 is a method of manufacturing two insulating substrates 11 as one set, the singulated shape is The planar shape may be a square shape or a rectangular shape.

  Thus, in the method for manufacturing the high frequency module 100 of the present invention, the conductive posts 5 are divided and the area occupied by the conductive posts 5 per unit of the high frequency module 100 is reduced. It is possible to provide a method for manufacturing the high-frequency module 100 that can increase the number of components and can be miniaturized.

  Next, the high-frequency module 100 manufactured by the manufacturing method according to the first embodiment of the present invention will be described with reference to FIG.

  FIG. 9A and FIG. 9B show the high frequency module 100 manufactured by the method for manufacturing the high frequency module 100 of the present invention. FIG. 9A is a perspective view of the high-frequency module 100, and FIG. 9B is a plan view of the high-frequency module 100.

  As shown in FIGS. 9A and 9B, the high-frequency module 100 is provided with a rectangular insulating substrate 11, a wiring pattern 1 provided on the insulating substrate 11, and the insulating substrate 11. The electronic component 3, the divided conductive posts 5a provided on the insulating substrate 11, the sealing resin 7 covering the electronic component 3 and the wiring pattern 1, and the antenna pattern 9a provided on the sealing resin 7 And. The antenna pattern 9 a is connected to the electronic component 3 through the divided conductive posts 5 a and the wiring pattern 1. The shape of the high-frequency module 100 may be not only a square shape in plan view but also a rectangular shape.

  Since the high-frequency module 100 is manufactured by the above-described manufacturing method of the high-frequency module 100, the divided conductive post 5 a is provided at the center of one side of the insulating substrate 11. Accordingly, the area of the divided conductive posts 5 a on the insulating substrate 11 is half the mounting area required for one conductive post 5.

  Further, since the divided conductive posts 5a are divided along one side of the insulating substrate 11 at the time of manufacture, the side surfaces thereof are exposed. Since the side surfaces of the divided conductive posts 5a are exposed, the inspection probe can be applied from the side of the high-frequency module 100 when the high-frequency module 100 is subjected to performance inspection. Therefore, the performance inspection of the high frequency module 100 can be easily performed.

  Thus, in the high frequency module 100, the area occupied by the divided conductive posts 5a provided at the center of one side of the insulating substrate 11 is small. Therefore, the miniaturized high frequency module 100 can be obtained.

[Second Embodiment]
Next, the manufacturing method of the high frequency module 200 which is the manufacturing method of 2nd Embodiment of this invention is demonstrated using FIG.10 and FIG.11.

  FIG. 10 is a perspective view of a state before cutting the collective substrate 20 related to the method for manufacturing the high frequency module 200, and FIG. 11 is a plan view of the collective substrate 20 related to the method for manufacturing the high frequency module 200 before cutting. is there.

  In the method of manufacturing the high-frequency module 200, a set of four insulating substrates 11 adjacent to each other around the intersection of the vertical cutting line 21 and the horizontal cutting line 22 shown in FIG. This is a manufacturing method for manufacturing the high-frequency module 200. This description will be made on any four adjacent insulating substrates 11 in the collective substrate 20. The manufacturing method is the same for the other plurality of insulating substrates 11 in the aggregate substrate 20.

  In the state before the collective substrate 20 is cut in the method of manufacturing the high-frequency module 200, as shown in FIG. 11, the wiring patterns 1 are formed on the four insulating substrates 11 in the collective substrate 20, respectively. As shown in FIG. 2, a plurality of electronic components 3 constituting an electronic circuit in the high-frequency module 200 are attached. The wiring pattern 1 and the electronic component 3 are sealed with a sealing resin 7. On the sealing resin 7, an antenna pattern 9a which is an antenna element of the antenna 9 constituting the electronic circuit in the high frequency module 200 is formed.

  The step of forming the wiring pattern 1 on the collective substrate 20, the step of attaching the electronic component 3 and the conductive post 5 on the collective substrate 20, and the sealing resin 7 covering the electronic component 3 on the collective substrate 20 The step of providing, the step of forming the antenna pattern 9a on the surface of the sealing resin 7, and the step of cutting the collective substrate 20 and the sealing resin 7 into pieces are equivalent to the manufacturing steps of the high-frequency module 100. .

  As shown in FIGS. 10 and 11, the conductive posts 5 are attached across the four insulating substrates 11 at the center of the four insulating substrates 11. The conductive post 5 is connected to the wiring pattern 1 by each of the four insulating substrates 11 and is connected to one end of the antenna pattern 9 a on the sealing resin 7. Therefore, the electronic component 3 on the insulating substrate 11 is connected to the antenna pattern 9 a on the sealing resin 7 via the conductive post 5. That is, the conductive post 5 is shared by the electronic circuits formed on the four insulating substrates 11.

  As can be seen from FIG. 11, the conductive posts 5 are shared by the electronic circuits formed on the four insulating substrates 11 to obtain four identical high-frequency modules 200. The electronic component 3 and the antenna pattern 9a are disposed rotationally symmetrically with the conductive post 5 as a center point. The four high-frequency modules 200 are manufactured by subsequently cutting the four insulating substrates 11. In each of the four insulating substrates 11, the conductive posts 5 are ¼ of the size of the original conductive posts 5 after the insulating substrate 11 is cut.

  The shape of the high-frequency module 200 that is required to be miniaturized becomes a rectangular shape by being separated into individual pieces. Unlike the method of manufacturing the high-frequency module 100, the method of manufacturing the high-frequency module 200 includes four insulating substrates 11. Since it is a method of manufacturing as one set, the individualized shape is not a rectangular shape in plan view but a square shape.

  Thus, in the method for manufacturing the high-frequency module 200 of the present invention, the conductive posts 5 are provided at the center of the four insulating substrates 11 that are connected to each other and have a square shape in plan view. Is then cut, the area of the region occupied by the conductive posts 5 in each of the four insulating substrates 11 becomes 1/4 with respect to the original mounting area of the conductive posts 5. That is, the conductive posts 5 are divided, and the area occupied by the conductive posts 5 per unit of the high-frequency module 200 becomes smaller. Therefore, it is possible to provide a method of manufacturing the high-frequency module 200 that can increase the number of collective substrates 20 and further reduce the size.

  Next, the high frequency module 200 manufactured by the manufacturing method of 2nd Embodiment of this invention is demonstrated using FIG.

  The high-frequency module 200 is shown in FIGS. 12 (a) and 12 (b). FIG. 12A is a perspective view of the high-frequency module 200, and FIG. 12B is a plan view of the high-frequency module 200.

  As shown in FIGS. 12A and 12B, the high-frequency module 200 is provided on the rectangular insulating substrate 11, the wiring pattern 1 provided on the insulating substrate 11, and the insulating substrate 11. An electronic component 3, a conductive post 5 provided on the insulating substrate 11, a sealing resin 7 covering the electronic component 3 and the wiring pattern 1, and an antenna pattern 9a provided on the sealing resin 7. I have. The antenna pattern 9 a is connected to the electronic component 3 through the conductive post 5 and the wiring pattern 1. The shape of the high-frequency module 200 is a square shape in plan view.

  Since the conductive post 5 is manufactured by the method for manufacturing the high-frequency module 200 described above, the conductive post 5 is provided at one corner of the insulating substrate 11. Further, since the conductive posts 5 are divided at the corners of the respective insulating substrates 11 at the time of manufacture, the conductive posts 5 become divided conductive posts 5b, and the side surfaces thereof are exposed in two directions. Further, since the area of the divided conductive posts 5b on the insulating substrate 11 is an area obtained by dividing one conductive post 5 into four, it is ¼ of the mounting area of the conductive posts 5. It is a size.

  As described above, in the high-frequency module 200, the area occupied by the conductive posts 5 provided at one corner of the insulating substrate 11 becomes smaller. Therefore, the miniaturized high frequency module 200 can be obtained.

[Third embodiment]
Next, the manufacturing method of the high frequency module 300 which is the manufacturing method of 3rd Embodiment of this invention is demonstrated using FIG.13 and FIG.14.

  FIG. 13 is a perspective view of a state before cutting the collective substrate 20 related to the method of manufacturing the high frequency module 300, and FIG. 14 is a plan view of the collective substrate 20 related to the method of manufacturing the high frequency module 300 before cutting. is there.

  The manufacturing method of the high frequency module 300 is a manufacturing method in which the conductive posts 5 are placed at all points where the vertical cutting lines 21 and the horizontal cutting lines 22 shown in FIG.

  In the state before the collective substrate 20 is cut in the method of manufacturing the high-frequency module 300, the wiring patterns 1 are formed on all the insulating substrates 11 in the collective substrate 20 as shown in FIG. As shown in FIGS. 13 and 14, a plurality of electronic components 3 constituting an electronic circuit in the high-frequency module 300 are attached. The wiring pattern 1 and the electronic component 3 are sealed with a sealing resin 7. On the sealing resin 7, an antenna pattern 9a which is an antenna element of the antenna 9 constituting the electronic circuit in the high frequency module 300 is formed. All the wiring patterns 1, the electronic components 3, and the antenna patterns 9 a are arranged in the same direction on the collective substrate 20, so that each of them, like the high-frequency module 100 or the high-frequency module 200, serves as a contrast. The arrangement is not correct.

  The step of forming the wiring pattern 1 on the collective substrate 20, the step of attaching the electronic component 3 and the conductive post 5 on the collective substrate 20, and the sealing resin 7 covering the electronic component 3 on the collective substrate 20 The step of providing, the step of forming the antenna pattern 9a on the surface of the sealing resin 7, and the step of cutting the collective substrate 20 and the sealing resin 7 into pieces are equivalent to the manufacturing steps of the high-frequency module 100. .

  As shown in FIGS. 13 and 14, the conductive posts 5 are attached to the four corners of all the insulating substrates 11 in the collective substrate 20. The conductive posts 5 are provided at the four corners of all the insulating substrates 11, but the wiring pattern 1 and the antenna pattern 9 a provided on one insulating substrate 11 are provided at the four corners of the insulating substrate 11. The inner right side is connected to only one conductive post 5 on the back side (X1 side and Y1 side). Accordingly, the other three conductive posts 5 other than one conductive post 5 on the right side (the X1 side and the Y1 side) are connected to the wiring pattern 1 and the antenna pattern 9a in one insulating substrate 11. Not connected. Therefore, the conductive post 5 is not shared with each electronic circuit formed on the individual insulating substrate 11. Individual high frequency modules 300 are manufactured by cutting the collective substrate 20 for each insulating substrate 11.

  Since there is no wiring pattern on the part to be cut of the collective substrate 20 shown in FIG. 1, that is, on the vertical cut line 21 and the horizontal cut line 22, generally, the collective substrate 20 is likely to be warped. . However, since the conductive posts 5 are formed at the intersections of the vertical cutting lines 21 and the horizontal cutting lines 22 in the portion to be cut of the collective substrate 20, warpage of the collective substrate 20 is generated. Can be suppressed.

  The shape of the high-frequency module 300 becomes a rectangular shape by being separated into individual pieces. However, since the manufacturing method of the high-frequency module 300 is a manufacturing method in which each individual insulating substrate 11 is treated equally, It may be a square shape in plan view or a rectangular shape.

  As described above, in the method for manufacturing the high-frequency module 300 of the present invention, the conductive posts 5 are formed at the points where the vertical cutting lines 21 and the horizontal cutting lines 22 intersect in the portion to be cut of the collective substrate 20. Therefore, warpage in the collective substrate 20 can be suppressed.

  Next, the high frequency module 300 manufactured by the manufacturing method of 3rd Embodiment of this invention is demonstrated using FIG.

  The high-frequency module 300 is shown in FIGS. 15 (a) and 15 (b). FIG. 15A is a perspective view of the high-frequency module 300, and FIG. 15B is a plan view of the high-frequency module 200.

  As shown in FIGS. 15A and 15B, the high-frequency module 300 is provided on the rectangular insulating substrate 11, the wiring pattern 1 provided on the insulating substrate 11, and the insulating substrate 11. An electronic component 3, a conductive post 5 provided on the insulating substrate 11, a sealing resin 7 covering the electronic component 3 and the wiring pattern 1, and an antenna pattern 9a provided on the sealing resin 7. I have. The antenna pattern 9a is connected to the electronic component 3 via the conductive post 5 and the wiring pattern 1 on the right side on the back side (Y1 side on the X1 side). The shape of the high-frequency module 300 is a square shape or a rectangular shape in plan view.

  Since the conductive post 5 is manufactured by the method for manufacturing the high-frequency module 300 described above, the conductive post 5 is divided and provided at each of the four corners of the insulating substrate 11. The conductive posts 5 provided at the four corners of the insulating substrate 11, respectively, are divided conductive posts 5b connected to the wiring pattern 1 and the antenna pattern 9a, and three divided portions that are not connected anywhere else. Conductive post 5c. Since the divided conductive posts 5b and the divided conductive posts 5c are divided at the corners of the respective insulating substrates 11 at the time of manufacture, their side surfaces are exposed in two directions.

  The area of each region on the insulating substrate 11 of the divided conductive posts 5b or the divided conductive posts 5c at the corners of all the insulating substrates 11 is the mounting area of one conductive post 5 4 The area is divided into two. The one divided conductive post 5b and the three divided conductive posts 5c are located at four corners of the insulating substrate 11, respectively. The electronic component 3 is not provided. Therefore, the conductive posts 5b and the conductive posts 5c do not affect the arrangement of the wiring pattern 1 and the electronic component 3 in the high frequency module 300. The divided conductive posts 5c may be used for a ground pattern in an electronic circuit formed in the high frequency module 300.

  As described above, in the method of manufacturing a high frequency module according to the present invention, the conductive posts are divided, and the area occupied by the conductive posts per high frequency module is reduced. The manufacturing method of the high frequency module which can be made small and can be reduced can be provided. In the high-frequency module of the present invention, the area occupied by the conductive post provided in the center of one side of the insulating substrate is small. Therefore, a miniaturized high frequency module can be obtained. In the high frequency module of the present invention, the area occupied by the conductive posts provided at one corner of the insulating substrate is further reduced. Therefore, a more miniaturized high frequency module can be obtained.

  The present invention is not limited to the description of the above embodiment, and can be implemented with appropriate modifications in a mode in which the effect is exhibited.

DESCRIPTION OF SYMBOLS 1 Wiring pattern 1a Connection electrode 1b Connection electrode 3 Electronic component 5 Conductive post 5a The divided conductive post 5b The divided conductive post 5c The divided conductive post 7 Sealing resin 9 Antenna 9a Antenna pattern 11 Insulating substrate 20 Collective substrate 21 Vertical cutting line 22 Horizontal cutting line 100 High frequency module 200 High frequency module 300 High frequency module

Claims (3)

A first step of forming a wiring pattern on the aggregate substrate;
A second step of attaching an electronic component and a conductive post on the aggregate substrate;
A third step of providing a sealing resin covering the electronic component on the collective substrate;
A fourth step of forming an antenna pattern on the surface of the sealing resin;
And a fifth step of cutting the collective substrate and the sealing resin into pieces,
The method of manufacturing a high-frequency module, wherein the conductive post is placed across a position where the collective substrate is cut, and is divided in the step of dividing into pieces. A rectangular insulating substrate;
A wiring pattern provided on the insulating substrate;
Electronic components provided on the insulating substrate;
A conductive post provided on the insulating substrate;
A sealing resin that covers the electronic component and the wiring pattern;
An antenna pattern provided on the sealing resin,
The antenna pattern is connected to the electronic component via the conductive post and the wiring pattern,
The high-frequency module according to claim 1, wherein the conductive post is provided at a center of one side of the insulating substrate, and a side surface of the conductive post is exposed. A rectangular insulating substrate;
A wiring pattern provided on the insulating substrate;
Electronic components provided on the insulating substrate;
A conductive post provided on the insulating substrate;
A sealing resin that covers the electronic component and the wiring pattern;
An antenna pattern provided on the sealing resin,
The antenna pattern is connected to the electronic component via the conductive post and the wiring pattern,
The conductive post is provided at one corner of the insulating substrate, and a side face of the conductive post is exposed.

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