JP2015230946A - Mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device that does not suffer an effect of thermal expansion and can measure the interval dimension between members with high precision in a process having temperature variation under a long-term operation.SOLUTION: A mounting device has an optical interferometer for branching interference light obtained by the interference between light passed through a mount component 9 and reflected from a substrate 10 and light reflected from the mount component 9 and making the branched light interfere, a detector for detecting the light amount of the light interfering in the optical interferometer, a measuring unit 5 for measuring the interval dimension between the mount component 9 and the substrate 10 from the light amount detected by the detector, a Z-axis driving mechanism 1 for moving the mount component 9 or the substrate 10 so that they relatively approach to each other, and a control device 12 for controlling the Z-axis driving mechanism 1 on the basis of the interval dimension measured by the measuring unit 5. An interval dimension D between members which correspond to the distance between a first detection face 6 of the mount component 9 and a second detection face 7 of the substrate 10 is measured by the optical interferometer under mounting, and the mount component 9 is mounted on the basis of the measured interval dimension.

Description

  The present invention relates to a mounting apparatus for mounting a mounting component on a substrate via a bonding member.

  Conventionally, a laser displacement meter mounted on the side of a mounting machine head measures the distance from the detection surface of the laser displacement meter to the top surface of the substrate, while driving the mounting head while feeding back the measurement results, A mounting device to be mounted was known.

  Hereinafter, a conventional mounting apparatus will be described with reference to FIG.

  The suction tool 102 at the tip of the mounting head 101 has a mechanism capable of sucking and holding the mounting component 104 on the suction surface 103. The mounting head 101 is lowered with respect to the substrate 106 fixed on the stage 105, and a bonding member Implementation is performed via 107.

  At this time, the inter-member spacing dimension is controlled by the method described below. First, as shown in FIG. 9, the distance B between the detection surface 109 of the laser displacement meter 108 and the suction surface 103 of the suction tool 102 is obtained using a reference jig 111 having a reference surface 110 before mounting. That is, the suction surface 103 of the suction tool 102 is brought into contact with the reference surface 110 of the reference jig 111, and the suction surface 103 of the suction tool 102 is in contact with the reference surface 110. The distance B to 110 is measured, and the distance B from the detection surface 109 to the suction surface 103 of the suction tool 102 is obtained.

  Then, as shown in FIG. 8, during mounting, a distance A from the detection surface 109 to the upper surface 113 of the substrate 106 is obtained using a laser displacement meter 108 provided on the side surface of the mounting head 101.

  Assuming that the suction surface 103 of the suction tool 102 and the upper surface 112 of the mounting component 104 coincide with each other, the distance A from the detection surface 109 to the upper surface 113 in the state where the upper surface 112 is sucked and held by the suction surface 103. From the distance B from the detection surface 109 to the suction surface 103, the distance from the suction surface 103 to the upper surface 113, that is, the height C from the upper surface 112 to the upper surface 113 can be calculated by C = A−B. If the thickness E of the mounting component 104 is measured in advance, the inter-member spacing dimension D between the mounting component 104 and the substrate 106 can be obtained by D = CE. When the mounting component 104 is mounted on the substrate 106, the driving of the mounting head 101 in the downward direction is controlled so that the inter-member distance dimension D becomes a preset value. See, for example, US Pat.

JP 2007-157767 A

  However, in the conventional configuration, since the distance B from the detection surface 109 of the laser displacement meter 108 to the suction surface 103 of the suction tool 102 is measured in advance, the temperature rise of the driving unit or the joining member melts during long-time operation. For this reason, the mounting device is affected by the thermal expansion due to the temperature rise. For this reason, as shown in FIGS. 10A and 10B, the distance from the detection surface 109 to the suction surface 103 becomes a distance B ′ different from the distance B, and changes from the result of the preliminary measurement. Become. Therefore, there is a problem that the inter-member distance dimension D is different between the measurement result and the actual value, and cannot be controlled with high accuracy.

  The present invention is mounted while controlling the inter-member spacing dimension with high accuracy without being affected by thermal expansion caused by a temperature rise of the drive unit or a temperature rise due to melting of the joining member during long-time operation. An object of the present invention is to provide a mounting apparatus that can perform the above-described operation.

In order to achieve the above object, one aspect of the present invention provides a mounting apparatus for mounting a component held by a mounting head on a mounting surface.
An optical interferometer that branches the interference light that is transmitted through the component and reflected by the mounting surface and the light reflected by the component interferes, and interferes with the branched light;
A detector for detecting the amount of light interfered with the optical interferometer;
From the amount of light detected by the detector, a measurement unit that measures the distance between the component and the mounting surface,
A drive unit that moves the member or the mounting surface so as to relatively approach each other;
Provided is a mounting apparatus including a control unit that controls the drive unit based on the interval dimension measured by the measurement unit.

  As described above, according to the mounting device of the above aspect, the heat of the mounting device due to the temperature rise of the drive unit during long-time operation or the temperature rise due to melting of the joining member in joining of the joining member (for example, solder) Without being affected by the expansion, the distance between the members can be measured with high accuracy, and mounting can be performed while controlling the distance between the members with high accuracy.

The block diagram of the component mounting apparatus in one Embodiment of this invention Configuration diagram of the measurement unit in the embodiment of the present invention Configuration diagram of an optical interferometer in an embodiment of the present invention Diagram showing transmission characteristics of etalon Explanatory drawing which shows the mounting flow (at the time of a fall) of a component and a board | substrate using the component mounting apparatus in embodiment of this invention Explanatory drawing which shows the mounting flow (at the time of a joining member contact and space | interval dimension maintenance) of the components and the board | substrate using the component mounting apparatus in embodiment of this invention Explanatory drawing which shows the mounting flow (at the time of raising and cooling) of a component and a board | substrate using the component mounting apparatus in embodiment of this invention. Explanatory drawing of the interference signal obtained by the measurement part in embodiment of this invention Interfering signal diagram without differential detector Interfering signal diagram with differential detector Configuration diagram for explaining a component mounting apparatus in a conventional example Explanatory drawing when obtaining the difference in height between the holding surface of the suction tool and the detection surface of the laser displacement meter with the reference jig in the conventional example FIG. 5A is a configuration diagram illustrating a conventional component mounting apparatus when the room temperature is normal and FIG. 5B is a thermal expansion of the mounting apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is a configuration diagram of a mounting apparatus according to an embodiment of the present invention.

  The component mounting apparatus according to this embodiment of the present invention includes a stage 8, a glass suction tool 4, a mounting head 3, a Z-axis drive mechanism 1, and a control device 12.

  The stage 8 is fixing the board | substrate 10 with which the joining member 11 was formed in the surface (mounting surface).

  The glass suction tool 4 functions as an example of a suction tool that can suck the mounting component 9 on which the bonding member 11 is formed and functions as a component to the suction surface 13.

  As for the mounting head 3, the glass suction tool 4 is mounted in the lower end.

  The Z-axis drive mechanism 1 functions as an example of an elevating drive device or a drive unit used for driving the mounting head 3.

  The control device 12 includes an operation control unit 12b that functions as an example of a control unit that controls driving of the Z-axis drive mechanism 1, and an interval size calculation unit 12a. The mounting head 3 is lowered with respect to the substrate 10 fixed on the stage 8 and mounting is performed via the joining member 11. Here, the inter-member spacing dimension (gap distance) between the lower surface of the mounting component 9 and the upper surface of the substrate 10 is D.

  The mounting head 3 includes a displacement measuring mechanism 2 that measures the displacement of the mounting head 3 in the Z-axis direction (vertical direction). The displacement measuring mechanism 2 is composed of, for example, an optical laser encoder or a linear sensor, and as will be described later, the difference between the position X at the time when the peak is detected and the position Y after that (when the peak is passed). Measure the displacement.

  The glass suction tool 4 mounted on the lower end of the mounting head 3 can hold the upper surface of the mounting component 9 by suction with the suction surface 13 that is the lower end surface of the mounting head 3. Adsorption and adsorption release operations in the glass adsorption tool 4, that is, on / off of a vacuum suction device (not shown), or opening and closing of a pipe line between the vacuum suction device and the suction hole of the suction surface 13 by a control device This is performed under the control of No. 12.

  In the present embodiment, the glass suction tool 4 capable of transmitting the laser beam (measurement light) of the measurement unit 5 is described as an example of the suction tool, but is not limited thereto. For example, a suction tool that does not transmit laser light may be applied, and the mounting part 9 may be irradiated with the laser light from the measurement unit 5 through a suction hole of the suction tool or a separately processed hole.

  Next, the measurement unit 5 that measures the inter-member distance dimension D will be described with reference to FIG. In the measurement unit 5, the measurement light is emitted from the low coherence light source 14. The measurement light emitted from the low coherence light source 14 enters the optical fiber 15 and is guided to the optical fiber 17 by the optical circulator 16. The measurement light transmitted through the optical fiber 17 becomes convergent light by the condensing optical system 18, passes through the glass suction tool 4, and is irradiated onto the mounting component 9. The measurement light is transmitted through the transparent mounting component 9, partially reflected by the first detection surface 6, which is the back surface (the upper surface in FIG. 2) of the mounting component 9, and the rest is transmitted. The measurement light that has passed through the first detection surface 6 is reflected by the second detection surface 7 that is the surface (mounting surface) of the substrate 10 and passes through the mounting component 9 again. The measurement light reflected by the first detection surface 6 and the measurement light reflected by the second detection surface 7 are incident on the optical fiber 17 again by the condensing optical system 18. At this time, the measurement light reflected by the first detection surface 6 and the measurement light reflected by the second detection surface 7 are in accordance with the distance (distance dimension D) between the first detection surface 6 and the second detection surface 7. have a finger in the pie. The measurement light transmitted through the optical fiber 17 is guided to another optical fiber 19 by the optical circulator 16. The measurement light transmitted through the optical fiber 19 is branched into two by the optical fiber coupler 20. Of the measurement light branched by the optical fiber coupler 20, one measurement light is incident on the optical fiber 21, passes through the attenuator 22, and is a differential detector 23 as an example of a detector that detects the amount of transmitted light. Is incident on. In this manner, the optical fiber coupler 20 branches the interference light (measurement light reflected by the first detection surface 6 and measurement light reflected by the second detection surface 7), and the optical interferometer 25 and the differential detector 23 are branched. The transmission optical system 50 is configured by making it incident on. The differential detector 23 is an optical element that takes a difference between the light directly incident from the transmission optical system 50 and the light interfered by the optical interferometer 25. Of the measurement light branched by the optical fiber coupler 20, the other measurement light enters the optical interferometer 25 through the optical fiber 24, and the measurement light transmitted through the optical interferometer 25 passes through the optical fiber 26. The light enters the differential detector 23. Each of the measurement lights incident on the differential detector 23 is converted into a voltage from the amount of the incident measurement light, and is converted from voltage analog data to digital data by the AD conversion board 27. 12 is input.

  The interval size calculation unit 12a of the control device 12 of FIG. 1 is based on the light amount (specifically, digital data converted by the AD conversion board 27) detected by the differential detector 23 of FIG. Measure dimension D. Based on the measured inter-member spacing dimension D, the operation controller 12b controls the operation of the mounting head 3 via the Z-axis drive mechanism 1. Here, the interval size calculation unit 12 a is provided in the control device 12, but may be provided in the measurement unit 5.

  Here, the low coherence light source 14 is, for example, a super luminescence diode (SLD) or the like, and selects a wavelength that transmits the mounting component 9. For example, as the measurement light used for the MEMS sensor or the like, a wavelength of 1.1 μm or more, which has a high transmittance of the silicon substrate, is desirable. In addition, the measurement light used for a lens or glass substrate for a camera or video camera is preferably a wavelength that transmits an antireflection film or an IR cut filter and can ensure a certain degree of reflectance. A wavelength of 1.2 μm or more is desirable.

  In addition, the two measurement lights input to the differential detector 23 are set to have almost the same amount of light on average, the branching ratio of the optical fiber coupler 20 is selected based on the transmittance of the optical interferometer 25, and the attenuator 22 finely selects it. Make adjustments.

  Next, the configuration of the optical interferometer 25 is shown in FIG. In the optical interferometer 25, the measurement light emitted from the optical fiber 24 is converted into substantially parallel light by the lens 28, passes through the etalon 29, and enters the optical fiber 26 through the lens 30. The etalon 29 can be switched to the etalon 29 having a different distance dimension (air distance dimension) F between the two reflecting surfaces by the switching mechanism 31. Switching by the switching mechanism 31 can be performed manually or automatically by the control device 12 based on the mounting component 9 or the substrate 10 of FIG.

  Here, each etalon 29 is an optical element in which the first reflecting surface 32 and the second reflecting surface 33 are fixed apart by a certain distance (air interval dimension F). Usually, an etalon is used for wavelength selection and is often used with a high finesse (= FSR (free spectral region) / FWHM (full width at half maximum)) as shown in FIG. 4, but here, an etalon with a low finesse is used. . Low finesse can be realized by setting the reflectivity of the first reflecting surface 32 and the second reflecting surface 33 in FIG. 3 to be low, or by using a mirror having low surface accuracy. The air gap dimension F is set equal to the target inter-member gap dimension (target value) G. The target value G is a distance between the component and the substrate when the component is fixed on the substrate. Thereby, the influence of the reflected light from places other than the area | region which measures the space | interval dimension D between members is suppressed, without being influenced by heat, and the space | interval dimension D between members can be measured with high precision. That is, the optical interferometer 25 is configured so that the optical path length difference of the branched light is the same distance (target value G) as the target inter-member distance dimension between the mounting component 9 and the second detection surface 7. The

However, the air gap dimension F may be set slightly larger than the target inter-member gap dimension (target value G). For example, at the position X in FIG. 6 (an explanatory diagram of the interference signal obtained by the measurement unit 5), only the left half of the interference signal can be obtained, and it cannot be determined whether the position X is the peak of the interference signal. On the other hand, when the intensity of the interference signal decreases past the position X, it can be understood that the position X is the peak of the interference signal. In this case, if there is no allowance for the inter-member spacing dimension D, the components and the board will approach more than necessary, so the air spacing dimension F is set slightly larger than the target value G. Specifically, the inventors have determined that the air interval dimension F should be made larger than the target value G by a value equal to or less than the total value width ± (2ln2 / π) × (λc ² / Δλ) of the interference signal. Has been found. However, λc is the center wavelength of the low-coherence light source 14, and Δλ is a half-value width. More specifically, the half value width of the interference signal (7.5 μm in the example described later) is set as the value to be increased.

と表されるため、反射率Ｒは６５％以下となる。 Here, as an example, a low finesse etalon refers to an etalon with a finesse of 7 or less. The low finesse etalon can be realized by setting the reflectance of the first reflecting surface 32 and the second reflecting surface 33 to be lower than that of the mirror. If finesse is fn, and the reflectance of each of the first reflecting surface 32 and the second reflecting surface 33 is R,

Therefore, the reflectance R is 65% or less.

  Next, a mounting flow in the case where the mounting component 9 and the substrate 10 are mounted via solder bumps as an example of the bonding member 11 will be described with reference to FIGS. 5A to 5C. However, the mounting component 9 may be a general semiconductor chip such as an IC chip or a MEMS sensor. The substrate 10 may be a wiring substrate in which a wiring pattern is formed on a substrate made of an IC chip or a ceramic and an organic material. The following mounting operation is performed under the control of the control device 12.

  First, the board | substrate 10 with which the joining member 11 was formed is fixed to the stage 8 hold | maintained at 120-160 degreeC, for example. On the other hand, the mounting component 9 on which the bonding member 11 is formed is suction-held by the glass suction tool 4 provided on the mounting head 3 held at 250 to 350 ° C.

  Next, the mounting head 3 holding the mounting component 9 by suction is aligned with the substrate 10 fixed on the stage 8.

  Next, in order to mount the mounting component 9 on the substrate 10 under the control of the control device 12, first, the mounting head 3 is attached to the substrate 10 fixed on the stage 8 by the Z-axis drive mechanism 1. Descent (see FIG. 5A). At this time, under the control of the control device 12, the measuring unit 5 also measures the inter-member distance dimension D. Then, when the inter-member spacing dimension D and the air spacing dimension F (FIG. 3) of the etalon 29 are close, the Z-axis drive mechanism 1 is driven at a constant speed by the operation control unit 12b of the control device 12, thereby FIG. An interference signal such as

  1 is based on the measurement result information (specifically, digital data converted by the AD conversion board 27) input from the measurement unit 5, the envelope of the interference signal (see FIG. 1). 6) and the position X of the displacement measuring mechanism 2 at the time when the peak is detected is stored. This position X is a position where the inter-member spacing dimension D and the air spacing dimension F coincide, and the air spacing dimension F is preset as the target value G. Therefore, the inter-member spacing dimension D is measured with high accuracy. Is done. For example, if the target value G is 220 μm and the air gap dimension F of the etalon 29 is 220 μm, the distance D between the members is reduced by lowering the mounting head 3 by the Z-axis drive mechanism 1, and eventually the position X The interference signal shows a peak, and this position is detected as a position where the inter-member spacing dimension D is 220 μm. However, when the position X is reached, it is not known whether or not the detected interference signal is a peak. Therefore, at the position Y where the mounting head 3 is further lowered, for example, the position Y where the inter-member distance dimension D is 210 μm, the position X It can be seen from the interval size calculation unit 12a that the interference signal detected in step 1 is a peak. Since the difference between the position X and the position Y can be calculated by 10 μm and the interval size calculation unit 12 a based on the measurement information from the displacement measurement mechanism 2, the mounting head 3 is moved to the position X of 10 μm back from the operation control unit 12 b of the control device 12. By stopping by control, the inter-member distance dimension D can be set to the target value G = 220 μm.

  Next, the mounting component 9 is heated with respect to the substrate 10 between the mounting head 3 and the stage 8 and held for 3 to 5 seconds, for example, to melt the joining member 11, and then the mounting head 3 is moved to 120 to 160, for example. Cool to 0 ° C. (see FIG. 5B).

  Next, under the control of the operation control unit 12b of the control device 12, the suction by the glass suction tool 4 is released and the mounting component 9 is separated from the glass suction tool 4, and then the Z-axis drive mechanism 1 is driven and controlled by the mounting head. 3 is raised (see FIG. 5C).

  Further, when mounting an object (part or board) having a different target value G of the inter-member spacing dimension D, an etalon 29 according to each target value is mounted, and the etalon 29 is switched by the switching mechanism 31 (FIG. 3). Switch.

Next, the measurement operation of the inter-member distance dimension D by the measurement unit 5 will be described with reference to FIGS. The measurement light emitted from the condensing optical system 18 is irradiated between the optical path (I) reflected by the first detection surface 6 and the optical path (II) reflected by the second detection surface 7 between the members. An optical path length difference twice as large as the interval dimension D occurs. In addition, as an optical path when passing through the optical interferometer 25, an optical path (III) that directly passes through the first reflecting surface 32 and the second reflecting surface 33 of the optical interferometer 25 and enters the optical fiber 26, and the first There is an optical path (IV) that is transmitted through the reflecting surface 32 once, reflected by the second reflecting surface 33, reflected again by the first reflecting surface 32, then transmitted through the second reflecting surface and incident on the optical fiber 26, Between these two optical paths (III) and (IV), there is an optical path length difference twice as large as the air gap dimension F of the etalon 29. Double interference may occur such that interference occurs between the optical path (I) and the optical path (II), and further, interference occurs between the optical path (III) and the optical path (IV). When the inter-member spacing dimension D and the air spacing dimension F of the etalon 29 are sufficiently close, the light passing through the optical path (I) and the optical path (IV) and the light passing through the optical path (II) and the optical path (III) Since the optical path length differences are almost the same, these two lights interfere with each other, and the intensity of the interference signal reaches a peak. The range in which the interference signal can be obtained is determined by the wavelength and wavelength width of the low-coherence light source 14, the wavelength distribution is a Gaussian distribution, the center wavelength is λc, and the half-value width of the wavelength is Δλ. Is (2ln2 / π) × (λc ² / Δλ). For example, when the low-coherence light source 14 having the center wavelength λc = 1.3 μm and the half width Δλ = 0.1 μm is used, the half width Δl of the envelope in the interference signal is about 7.5 μm. For this reason, for example, even if there is light reflected by the internal structure of the mounting component 9, and there is a reflective surface other than the surface number of several μm to ten and several μm of the first detection surface 6, no interference signal can be obtained. The effect can be removed. For this reason, the inter-member spacing dimension D can be measured with high accuracy.

  The low coherence light source 14 is a light source having a coherence length of about several tens to one hundred and several tens of μm, and is, for example, a super luminescence diode (SLD), an ASE light source, or a light emitting diode (LED).

  In a situation where double interference occurs such that interference occurs between the optical path (I) and the optical path (II) and further interference occurs between the optical path (III) and the optical path (IV), light that does not contribute to interference, For example, the light passes through the optical path (I) and the optical path (III), or the light passes through the optical path (II) and the optical path (IV), and the reflected light from the multiple reflected light or other surfaces. As in 7A, it is necessary to detect a weak interference signal included in light other than the interference signal. Even if this is detected as it is, a signal with sufficient resolution cannot be obtained when AD conversion is performed by the AD conversion board 27. On the other hand, it is better to obtain only the interference signal by subtracting the intensity of the non-interference component branched by the optical fiber coupler 20 by the differential detector 23 as in the configuration of the present embodiment. As a result, only the interference signal can be obtained as shown in FIG. 7B, and therefore, when the AD conversion is performed by the AD conversion board 27, the interference signal can be detected with high resolution.

  Further, as the optical interferometer 25, besides using the etalon 29 for transmission, it is possible to use a Michelson interferometer, a step mirror, and an etalon for reflection. However, since they are used for reflection, positioning or fixing when the interferometer is switched by the switching mechanism 31 must be performed with very high accuracy. On the other hand, by using the low-finesse etalon 29 for transmission, measurement can be performed with high accuracy without being affected by the inclination and positioning of the etalon 29. Since the finesse is low, the amount of light transmitted through the etalon 29 and incident on the differential detector 23 can be increased.

  As described above, under the control of the control device 12, the driving operation of the Z-axis drive mechanism 1 of the mounting device and the detection operation of the interference signal by the measuring unit 5 are combined to directly set the inter-member distance dimension D during mounting. By measuring, it is possible to mount without being affected by the thermal expansion of the mounting device due to the thickness of the mounting component 9 and the temperature rise of the driving part such as the Z-axis driving mechanism 1 in the long-time driving. Become.

  In addition, an interferometer using a low finesse etalon 29 is employed in the measurement unit 5, and light reflected between the mounting component 9 and the substrate 10 is caused to interfere with the reflected light from the inside of the mounting component 9. The measurement can be performed with high accuracy without being affected by the positioning error of the switching mechanism 31.

  In addition, this invention is not limited to the said embodiment, It can implement in another various aspect.

  For example, since the mounting component 9 or the second detection surface 7 of the substrate 10 may be moved so as to approach relatively, the stage 8 is provided with a Z-axis driving mechanism instead of the Z-axis driving mechanism 1, and the mounting head 3 may be fixed.

  Note that mounting means, for example, an action of attaching the MEMS element to the substrate via a bonding member (for example, a solder bump) or an action of attaching optical glass to the image sensor chip via an adhesive resin.

  In addition, the effect which each has can be show | played by combining embodiment or arbitrary modifications of the said embodiment or modification suitably.

  The mounting device according to the present invention measures the inter-member spacing dimension with high accuracy without being affected by the thermal expansion of the mounting device and the thickness variation of the member in a process in which the temperature of the mounting device is driven for a long time. Mounting control is possible. For example, when positioning the distance between the lenses of the camera lens with high accuracy, or the distance between the members between the capacitive MEMS acceleration sensor and the ASIC is mounted with an error of several microns. It can also be applied to

DESCRIPTION OF SYMBOLS 1 Z-axis drive mechanism 2 Displacement measurement mechanism 3 Mounting head 4 Glass suction tool 5 Measuring part 6 First detection surface 7 Second detection surface 8 Stage 9 Mounting component 10 Board | substrate 11 Joining member 12 Control apparatus 12a Space | interval dimension calculation part 12b Operation control Part 13 Suction surface 14 Low coherence light source 15 Optical fiber 16 Optical circulator 17 Optical fiber 18 Condensing optical system 19 Optical fiber 20 Optical fiber coupler 21 Optical fiber 22 Attenuator 23 Differential detector 24 Optical fiber 25 Optical interferometer 26 Optical fiber 27 AD conversion board 28 Lens 29 Etalon 30 Lens 31 Switching mechanism 32 First reflecting surface 33 Second reflecting surface 50 Transmission optical system D Spacing dimension F Air spacing dimension G Target value

Claims (4)

In a mounting device that mounts the components held by the mounting head on the mounting surface,
An optical interferometer that branches the interference light that is transmitted through the component and reflected by the mounting surface and the light reflected by the component interferes, and interferes with the branched light;
A detector for detecting the amount of light interfered with the optical interferometer;
From the amount of light detected by the detector, a measurement unit that measures the distance between the component and the mounting surface,
A drive unit for moving the component or the mounting surface relatively close to each other;
A mounting apparatus, comprising: a control unit that controls the drive unit based on the interval dimension measured by the measurement unit.   The mounting apparatus according to claim 1, wherein the optical interferometer is configured such that an optical path length difference of the branched light is equal to a target distance between the component and the mounting surface.   The mounting apparatus according to claim 2, wherein the optical interferometer is an etalon in which the first reflecting surface and the second reflecting surface are fixed apart by a distance equal to the target distance. A transmission optical system for branching the interference light and making it incident on the optical interferometer and the detector;
The mounting device according to claim 1, wherein the detector is a differential detector that takes a difference between light directly incident from the transmission optical system and light interfered by the optical interferometer.

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