JP2015216336A - Chip electronic component and manufacturing method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip electronic component and a manufacturing method for the same that can minutely control an inductance value as a target even when coil conductors of the same design are provided.SOLUTION: A chip electronic component has a magnetic body having a coil conductor and an internal core part existing inside the coil conductor, a first capacitance determining part that has a through-hole at the center thereof and adjusts the volume of the internal core portion, the coil conductor being disposed on at least one surface of the first capacitance determining part, a second capacitance determining part that covers the coil conductor and adjusts the volume of the internal core portion, and an external electrode that is disposed on at least one surface of the magnetic body and is connected to the coil conductor. The first capacitance determining part adjusts the area of the through-hole to adjust the volume of the internal core part, and the second capacitance determining part adjusts the coating thickness at the internal core part side to adjust the volume of the internal core part. A method of manufacturing the chip electronic component is also provided.

Description

The present invention relates to a chip electronic component and a manufacturing method thereof.

An inductor, which is one of chip electronic components, has an inductance that varies depending on a magnetic path area inside the coil conductor through which a magnetic flux induced by the coil conductor passes.

A conventional multilayer inductor has a structure in which a coil-shaped conductor pattern is formed on a plurality of magnetic sheets, and a plurality of magnetic sheets on which the conductor patterns are formed are stacked. The conductor patterns are sequentially connected via via electrodes formed on the magnetic sheets, and overlap in the stacking direction to form a spiral coil. At this time, in the case of the multilayer inductor, the magnetic path area inside the coil conductor was adjusted by changing the conductor pattern.

The conventional wound inductor has a structure in which a coil is wound around a magnetic core, and the internal magnetic path area is adjusted by adjusting the size of the magnetic core, thereby adjusting the inductance.

The thin-film inductor is formed by forming a coil-shaped conductor pattern on an insulating substrate by plating, forming an insulating film covering the coil conductor to prevent contact with a magnetic material, and then upper and lower portions of the insulating substrate. A magnetic material sheet is laminated and pressure-bonded to the substrate.

In the case of a thin film type inductor, conventionally, it has been necessary to redesign the coil conductor and the like as a whole in order to realize a target inductance. When redesigning to realize the target inductance, there is a problem that man-hours and lead time increase rapidly.

Japanese Patent Laid-Open No. 2005-210010 JP 2008-166455 A

According to one embodiment of the present invention, a chip electronic component capable of finely controlling a target inductance value even when having a coil conductor of the same design by adjusting the volume of an inner core portion, and a manufacturing method thereof The purpose is to provide.

According to an embodiment of the present invention, a step of forming a coil conductor on at least one surface of the first capacity determining unit, forming a through hole in the center of the first capacity determining unit, and a second capacitor covering the coil conductor. Forming a determining portion; forming a magnetic body having an inner core portion inside the coil conductor by laminating and crimping a magnetic layer on the upper and lower portions of the coil conductor; and Forming an external electrode on at least one surface of the magnetic body so as to be connected to the coil conductor, and adjusting the area of the through-hole formed in the center of the first capacitance determining unit Adjusting the volume of the inner core part by adjusting the volume of the inner core part by adjusting the inner core part side covering thickness that covers the inner core part side of the coil conductor of the second capacitance determining part; Chip electric Method for manufacturing a component is provided.

The inner core portion is filled with a magnetic material, and the volume of the magnetic material filled in the coil conductor can be adjusted by adjusting the volume of the inner core portion.

The second capacity determining unit may be formed such that an upper coating thickness that covers an upper portion of the coil conductor is different from an inner core portion-side coating thickness that covers the inner core portion side of the coil conductor.

The second capacity determining unit has an upper coating thickness that covers the upper portion of the coil conductor as a, and an inner core portion side coating thickness that covers the inner core portion side of the coil conductor as 0.01. It can be formed to satisfy ≦ a / b ≦ 50.

The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, the uppermost covering thickness of the inner core part side covering part, the lowermost covering thickness, Can be formed differently.

The second capacity determination unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and the inner core part side covering part gradually increases in thickness from the lower part toward the upper part. Can be formed.

The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and c is a coating thickness of a lowermost part of the inner core part side covering part, and the inner core part side When the coating thickness of the uppermost part of the coating portion is d, it can be formed so as to satisfy 0.01 ≦ c / d ≦ 50.

The second capacity determining unit can be formed so that the coating thickness on the inner core side of the coil conductor satisfies 10 μm to 200 μm.

According to another embodiment of the present invention, a magnetic body having a coil conductor and an inner core portion existing inside the coil conductor, the coil conductor is disposed on at least one surface, and a through hole is provided in the center. A first capacity determining section for determining the volume of the inner core section; a second capacity determining section for covering the coil conductor and determining the volume of the inner core section; and at least one surface of the magnetic body. An external electrode connected to the coil conductor, wherein the first capacity determining unit determines a volume of the inner core part according to an area of the through hole, and the second capacity determining unit is There is provided a chip electronic component that determines the volume of the inner core part according to the inner core part side coating thickness covering the inner core part side.

The inner core portion may be filled with a magnetic material, and the volume of the magnetic material filled in the coil conductor may be determined according to the volume of the inner core portion.

The second capacity determining unit may be provided such that an upper coating thickness that covers an upper portion of the coil conductor and an inner core portion-side coating thickness that covers the inner core portion side of the coil conductor are different.

The second capacity determining unit has an upper coating thickness that covers the upper portion of the coil conductor as a, and an inner core portion side coating thickness that covers the inner core portion side of the coil conductor as 0.01. <= A / b <= 50 can be satisfy | filled.

The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, the uppermost covering thickness of the inner core part side covering part, the lowermost covering thickness, Can be provided differently.

The second capacity determination unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and the inner core part side covering part gradually increases in thickness from the lower part toward the upper part. Can be formed as follows.

The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and c is a coating thickness of a lowermost part of the inner core part side covering part, and the inner core part side When the coating thickness of the uppermost part of the coating part is d, 0.01 ≦ c / d ≦ 50 can be satisfied.

The second capacity determining unit may be provided such that a coating thickness on the inner core side of the coil conductor satisfies 10 μm to 200 μm.

According to the chip electronic component and the manufacturing method thereof according to an embodiment of the present invention, by adjusting the volume of the inner core portion, the target inductance value can be finely controlled even when the coil conductor has the same design. Can do.

Thereby, the redesign man-hour for realizing the target inductance can be reduced and the productivity can be maximized.

It is the schematic perspective view shown so that the coil conductor of the chip electronic component by one Embodiment of this invention might appear. It is sectional drawing along the I-I 'line of FIG. FIG. 2b is a schematic plan view of a chip electronic component according to the embodiment of the present invention of FIG. 2a. It is sectional drawing of the LT direction of the chip electronic component by one Embodiment of this invention. FIG. 3b is a schematic plan view of the chip electronic component according to the embodiment of the present invention of FIG. 3a. It is sectional drawing of the LT direction of the chip electronic component by other one Embodiment of this invention. It is sectional drawing of the LT direction of the chip electronic component by other one Embodiment of this invention. It is process drawing which showed the manufacturing method of the chip electronic component by one Embodiment of this invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description.

Chip electronic component Hereinafter, a chip electronic component according to an embodiment of the present invention will be described using a thin film inductor as an example, but the present invention is not limited thereto.

FIG. 1 is a schematic perspective view showing a coil conductor of a chip electronic component according to an embodiment of the present invention.

Referring to FIG. 1, a thin film inductor 100 used for a power supply line of a power supply circuit is disclosed as an example of a chip electronic component. In addition to the chip inductor, the chip electronic component can be appropriately applied to a chip bead, a chip filter, and the like.

The thin film inductor 100 includes a magnetic body 50 in which the coil conductor 40 is embedded, and external electrodes 80 disposed on both end surfaces of the magnetic body 50 so as to be connected to the coil conductor 40. it can.

The magnetic body 50 is not limited as long as it is a material that has the appearance of the thin-film inductor 100 and exhibits magnetic properties, but can be formed by filling with ferrite or a metallic soft magnetic material, for example.

As the ferrite, known ferrites such as Mn—Zn ferrite, Ni—Zn ferrite, Ni—Zn—Cu ferrite, Mn—Mg ferrite, Ba ferrite and Li ferrite can be used.

Moreover, as said metal type soft magnetic material, the alloy containing any one or more selected from the group which consists of Fe, Si, Cr, Al, and Ni can be used. For example, Fe—Si—B—Cr amorphous metal particles can be used, but the present invention is not limited thereto.

The particle diameter of the metal-based soft magnetic material is 0.1 μm to 30 μm, and may be included in a form dispersed on a polymer such as an epoxy resin or a polyimide.

The magnetic body 50 may have a hexahedral shape. In order to clearly describe the embodiments of the present invention, hexahedral directions are defined. L, W, and T shown in FIG. 1 indicate a length direction, a width direction, and a thickness direction, respectively.

Inside the coil conductor 40, there can be an inner core portion 55 filled with a magnetic material such as ferrite or a metallic soft magnetic material. By including the inner core portion 55 filled with a magnetic material, inductance (Inductance, Ls) can be improved.

The coil conductor 40 may be disposed on at least one surface of the first capacity determining unit 20.

The first capacitance determining unit 20 includes a first surface and a second surface facing each other, a first coil conductor 41 having a coil-shaped pattern is disposed on the first surface, and a coil-shaped pattern is formed on the second surface. A second coil conductor 42 having a pattern may be disposed.

The first and second coil conductors 41 and 42 may be formed in a spiral pattern. Further, the first coil conductor 41 and the second coil conductor 42 can be electrically connected via via electrodes (not shown) formed in the first capacitance determining unit 20.

The coil conductor 40 and the via electrode can be formed containing a metal having excellent electrical conductivity. For example, the coil conductor 40 and the via electrode are made of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt). Or an alloy thereof.

The first capacity determining unit 20 is not particularly limited as long as it can support and insulate the first and second coil conductors 41 and 42. For example, a polypropylene glycol (PPG) substrate, a ferrite substrate, Alternatively, it can be formed of a metal-based soft magnetic substrate.

2a is a sectional view taken along line II ′ of FIG. 1, FIG. 2b is a schematic plan view of a chip electronic component according to an embodiment of the present invention of FIG. 2a, and FIG. 3a is an embodiment of the present invention. FIG. 3B is a schematic cross-sectional view of the chip electronic component according to the embodiment of the present invention of FIG. 3A.

Referring to FIGS. 2 a, 2 b, 3 a, and 3 b, a through hole 70 is provided at the center of the first capacity determining unit 20, and the volume of the inner core part 55 is set according to the area of the through hole 70. Can be determined.

Further, since the inner core portion 55 is filled with a magnetic material, the volume of the magnetic material filled in the coil conductor 40 can be adjusted by adjusting the volume of the inner core portion 55.

Therefore, by adjusting the area of the through hole 70 of the first capacity determining unit 20 and determining the volume of the inner core unit 55, the target inductance (Ls) can be reduced even when the coil conductor 40 has the same design. It can be finely controlled.

The thin-film inductor 100 according to the embodiment of FIGS. 2A and 2B can increase the volume of the inner core portion 55 and increase the inductance (Ls) by forming the through hole 70 with a large area.

On the other hand, the thin-film inductor 100 according to the embodiment of FIGS. 3A and 3B can reduce the volume of the inner core portion 55 and realize a lower inductance (Ls) by forming the through hole 70 with a small area. it can.

The through-hole 70 can be easily adjusted to a desired area by using a process such as drilling, laser, sandblasting, punching, or the like. Therefore, the target inductance (Ls) can be finely controlled by easily adjusting the area of the through hole 70 of the first capacity determining unit 20 without redesigning the coil conductor or the like.

The coil conductor 40 may be covered with the second capacity determining unit 30.

The second capacity determination unit 30 is not particularly limited as long as it is an insulating material that can prevent the occurrence of leakage current due to contact between the coil conductor 40 and the magnetic body, but is formed of, for example, an epoxy resin or the like. Can do.

The volume of the inner core portion 55 can be determined according to the coating thickness of the second capacitance determining portion 30 on the inner core portion side of the coil conductor 40.

Therefore, even if it has the coil conductor 40 of the same design by adjusting the coating thickness by the side of the inner core part of the coil conductor 40 of the 2nd capacity | capacitance determination part 30 and determining the volume of the inner core part 55, even if it has the coil conductor 40 of the same design, It is possible to finely control the inductance (Ls).

FIG. 4 is a cross-sectional view in the LT direction of a chip electronic component according to another embodiment of the present invention.

Referring to FIG. 4, the second capacitance is determined so that the upper coating thickness a covering the upper portion of the coil conductor 40 and the inner core portion side coating thickness b covering the inner core portion side of the coil conductor 40 are different. By forming the portion 30, the volume of the inner core portion 55 can be determined.

The upper covering thickness a of the coil conductor 40 is formed only to the extent that the coil conductor 40 is sufficiently insulated, and the inner core portion side covering thickness b of the coil conductor 40 is set according to the target inductance (Ls). It can be formed by adjusting.

As shown in FIG. 4, the volume of the inner core portion 55 decreases as the inner core portion side coating thickness b of the coil conductor 40 is made thicker than the upper coating thickness a of the coil conductor 40, and the lower inductance ( Ls) is realized.

The second capacitance determining unit 30 may be provided such that the inner core portion side coating thickness b of the coil conductor 40 satisfies 10 μm to 200 μm. The target inductance (Ls) can be finely controlled by adjusting the inner core portion side coating thickness b to a range of 10 μm to 200 μm.

The second capacity determining unit 30 may be provided such that the upper covering thickness a of the coil conductor 40 and the inner core portion side covering thickness b of the coil conductor 40 satisfy 0.01 ≦ a / b ≦ 50. . By adjusting a / b in the range of 0.01 to 50, the target inductance (Ls) can be finely controlled.

FIG. 5 is a cross-sectional view in the LT direction of a chip electronic component according to another embodiment of the present invention.

Referring to FIG. 5, the second capacity determination unit 30 may include an inner core part side covering part 35 that covers the inner core part side of the coil conductor 40. By forming the second capacity determining unit 30 so that the lowermost coating thickness c and the uppermost coating thickness d of the inner core portion side coating portion 35 are different, the volume of the inner core portion 55 is reduced. Can be determined.

The inner core portion side covering portion 35 may have a shape in which the covering thickness gradually increases from the lower portion toward the upper portion. At this time, the degree of gradually increasing thickness from the bottom to the top can be adjusted according to the target inductance (Ls).

The inner core portion side covering portion 35 of the second capacity determining portion 30 is provided so that the lowermost covering thickness c and the uppermost covering thickness d satisfy 0.01 ≦ c / d ≦ 50. it can. By adjusting c / d within the range of 0.01 to 50, the target inductance (Ls) can be finely controlled.

One end of the first coil conductor 41 and one end of the second coil conductor 42 can be exposed at opposite end surfaces of the magnetic body 50, respectively. Further, external electrodes 80 are formed on both end surfaces of the magnetic body 50 so as to be connected to the lead portions of the first and second coil conductors 41 and 42 exposed on both end surfaces of the magnetic body 50, respectively. Can.

The external electrode 80 may be formed on both end surfaces of the magnetic body 50 and extend to the upper and lower surfaces in the thickness direction and / or both side surfaces in the width direction.

The external electrode 80 can be formed by containing a metal having excellent electrical conductivity. For example, nickel (Ni), copper (Cu), tin (Sn), or silver (Ag) alone or These alloys can be formed.

Chip Electronic Component Manufacturing Method FIG. 6 is a process diagram illustrating a chip electronic component manufacturing method according to an embodiment of the present invention.

Referring to FIG. 6, first, the coil conductor 40 may be formed on at least one surface of the first capacitance determining unit 20, and the through hole 70 may be formed in the center of the first capacitance determining unit 20.

The first capacity determining unit 20 is not particularly limited as long as it can support and insulate the first and second coil conductors 41 and 42. For example, a polypropylene glycol (PPG) substrate, a ferrite substrate, Alternatively, it can be formed of a metal-based soft magnetic substrate.

Examples of the method of forming the coil conductor 40 include an electroplating method, but are not limited thereto. The coil conductor 40 can be formed by containing a metal having excellent electrical conductivity. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof can be used.

After forming a hole in a part of the first capacitance determining unit 20, a via electrode (not shown) can be formed by filling a conductive material. The first coil conductor 41 formed on the first surface of the first capacitance determination unit 20 and the second coil conductor 42 formed on the second surface of the first capacitance determination unit 20 are electrically connected via the via electrode. Can be linked.

By adjusting the area of the through hole 70 formed in the center of the first capacity determining unit 20, the volume of the inner core unit 55 formed in the coil conductor 40 can be adjusted.

Further, since the inner core portion 55 is filled with a magnetic material, the volume of the magnetic material filled in the coil conductor 40 can be adjusted by adjusting the volume of the inner core portion 55.

Therefore, by adjusting the area of the through hole 70 of the first capacity determining unit 20 and determining the volume of the inner core unit 55, the target inductance (Ls) can be reduced even when the coil conductor 40 has the same design. It can be finely controlled.

When the area of the through hole 70 is increased, the volume of the inner core portion 55 is increased, and thereby a higher inductance (Ls) can be realized.

Moreover, when the area of the through-hole 70 is made small, the volume of the inner core portion 55 is reduced, whereby a lower inductance (Ls) can be realized.

The through-hole 70 can be easily adjusted to a desired area by using a process such as drilling, laser, sandblasting, punching, or the like. Therefore, the target inductance (Ls) can be finely controlled by easily adjusting the area of the through hole 70 of the first capacity determining unit 20 without redesigning the coil conductor or the like.

Next, the second capacity determining unit 30 that covers the coil conductor 40 can be formed.

The second capacity determining unit 30 may be formed by a known method such as a screen printing method, a photo resist (PR) exposure, a process using development, or a spray coating process. Not limited to.

The second capacity determining unit 30 is not particularly limited as long as it is an insulating material that can prevent generation of leakage current due to contact between the coil conductor 40 and the magnetic body, but may be formed of, for example, an epoxy resin or the like. it can.

By adjusting the inner core portion side coating thickness of the coil conductor 40 of the second capacitance determining unit 30, the volume of the inner core portion 55 formed inside the coil conductor 40 can be adjusted.

Accordingly, by adjusting the coating thickness on the inner core portion side of the second capacity determining unit 30 to adjust the volume of the inner core portion 55, even when the coil conductor 40 has the same design, the target inductance ( Ls) can be finely controlled.

The second capacitance determining unit 30 is formed so that the upper coating thickness a covering the upper portion of the coil conductor 40 and the inner core portion side coating thickness b covering the inner core portion side of the coil conductor 40 are different. Thus, the volume of the inner core portion 55 can be adjusted.

The upper covering thickness a of the coil conductor 40 is formed only to the extent that the coil conductor 40 is sufficiently insulated, and the inner core portion side covering thickness b of the coil conductor 40 is set according to the target inductance (Ls). It can be formed by adjusting.

As the inner core portion side coating thickness b of the coil conductor 40 is formed thicker than the upper coating thickness a of the coil conductor 40, the volume of the inner core portion 55 is reduced and a lower inductance (Ls) is realized. become.

The second capacitance determining unit 30 may be provided such that the inner core portion side coating thickness b of the coil conductor 40 satisfies 10 μm to 200 μm. The target inductance (Ls) can be finely controlled by adjusting the inner core portion side coating thickness b to a range of 10 μm to 200 μm.

The second capacity determining unit 30 may be provided such that the upper covering thickness a of the coil conductor 40 and the inner core portion side covering thickness b of the coil conductor 40 satisfy 0.01 ≦ a / b ≦ 50. . By adjusting a / b in the range of 0.01 to 50, the target inductance (Ls) can be finely controlled.

The second capacity determination unit 30 can include an inner core part side covering part 35 that covers the inner core part side of the coil conductor 40. By forming the second capacity determining unit 30 so that the lowermost coating thickness c and the uppermost coating thickness d of the inner core portion side coating portion 35 are different, the volume of the inner core portion 55 is reduced. Can be adjusted.

The inner core portion side covering portion 35 may have a shape in which the covering thickness gradually increases from the lower portion toward the upper portion. At this time, the degree of gradually increasing thickness from the bottom to the top can be adjusted according to the target inductance (Ls).

The inner core portion side covering portion 35 of the second capacity determining portion 30 is provided so that the lowermost covering thickness c and the uppermost covering thickness d satisfy 0.01 ≦ c / d ≦ 50. it can. By adjusting c / d within the range of 0.01 to 50, the target inductance (Ls) can be finely controlled.

Thereafter, the magnetic body is provided with the inner core portion 55 inside the coil conductor 40 by laminating and press-bonding magnetic layers on the upper and lower portions of the first capacitance determining unit 20 where the coil conductor 40 is formed. 50 can be formed.

The magnetic body 50 can be formed by laminating the magnetic layers and pressing them by a laminating method or an isostatic pressing method.

At this time, the volume of the inner core part 55 to be formed is adjusted according to the area of the through hole 70 of the first capacity determining part 20 and / or the inner core part side covering thickness of the second capacity determining part 30. be able to. Thereby, various inductances (Ls) can be realized.

Subsequently, the external electrode 80 can be formed on at least one surface of the magnetic body 50 so as to be connected to the coil conductor 40.

One end of the first coil conductor 41 and one end of the second coil conductor 42 can be exposed at opposite end surfaces of the magnetic body 50, respectively. Further, external electrodes 80 are formed on both end surfaces of the magnetic body 50 so as to be connected to the lead portions of the first and second coil conductors 41 and 42 exposed on both end surfaces of the magnetic body 50, respectively. be able to.

The external electrode 80 can be formed using a paste containing a metal having excellent electrical conductivity. For example, nickel (Ni), copper (Cu), tin (Sn), or silver (Ag) is used. It can be formed of a conductive paste containing alone or an alloy thereof.

As a method for forming the external electrode 80, not only a printing method but also a dipping method can be used depending on the shape of the external electrode 80.

In addition, the description of the same parts as those of the chip electronic component according to the embodiment of the present invention is omitted.

The embodiment of the present invention has been described in detail above, but the scope of the present invention is not limited to this, and various modifications and variations can be made without departing from the technical idea of the present invention described in the claims. It will be apparent to those having ordinary knowledge in the art.

DESCRIPTION OF SYMBOLS 100 Thin film type inductor 20 1st capacity | capacitance determination part 30 2nd capacity | capacitance determination part 35 Inner core part side coating | coated part 40 Coil conductor 41 1st coil conductor 42 2nd coil conductor 50 Magnetic body 55 Internal core part 70 Through-hole 80 External electrode

Claims (16)

Forming a coil conductor on at least one surface of the first capacitance determining portion and forming a through hole in the center of the first capacitance determining portion;
Forming a second capacitance determining unit covering the coil conductor;
Forming a magnetic body having an inner core portion inside the coil conductor by laminating and crimping a magnetic layer on top and bottom of the coil conductor; and
Forming an external electrode on at least one surface of the magnetic body to be connected to the coil conductor,
The volume of the inner core portion is adjusted by adjusting the area of the through hole formed in the center of the first capacitance determining portion, and the inner core portion side of the coil conductor of the second capacitance determining portion is covered. A method of manufacturing a chip electronic component, wherein the volume of the inner core part is adjusted by adjusting the inner core part side coating thickness. 2. The chip electronic component according to claim 1, wherein the inner core portion is filled with a magnetic material, and the volume of the magnetic material filled in the coil conductor is adjusted by adjusting a volume of the inner core portion. Production method. The said 2nd capacity | capacitance determination part is formed so that the upper coating thickness which coat | covers the upper part of the said coil conductor, and the inner core part side coating thickness which coat | covers the inner core part side of the said coil conductor may differ. The manufacturing method of the chip electronic component as described in 2. The second capacity determining unit has an upper coating thickness that covers the upper portion of the coil conductor as a, and an inner core portion side coating thickness that covers the inner core portion side of the coil conductor as 0.01. The method for manufacturing a chip electronic component according to claim 1, wherein the chip electronic component is formed so as to satisfy ≦ a / b ≦ 50. The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and an uppermost covering thickness of the inner core part side covering part, a lowermost covering thickness, The method of manufacturing a chip electronic component according to claim 1, wherein the chip electronic components are formed to be different from each other. The second capacity determination unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and the inner core part side covering part gradually increases in thickness from the lower part toward the upper part. The method of manufacturing a chip electronic component according to claim 1, formed as described above. The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and c is a coating thickness of a lowermost part of the inner core part side covering part, and the inner core part side 2. The method for manufacturing a chip electronic component according to claim 1, wherein the thickness is formed so as to satisfy 0.01 ≦ c / d ≦ 50, where d is the thickness of the uppermost portion of the covering portion. 2. The method for manufacturing a chip electronic component according to claim 1, wherein the second capacitance determining unit is formed so that a coating thickness on an inner core side of the coil conductor satisfies 10 μm to 200 μm. A magnetic body having a coil conductor and an inner core portion existing inside the coil conductor;
The coil conductor is disposed on at least one surface, a through hole is provided in the center, and a first capacity determining unit that determines a volume of the inner core unit;
A second capacity determining unit that covers the coil conductor and determines a volume of the inner core unit;
An external electrode disposed on at least one surface of the magnetic body and connected to the coil conductor;
The first capacity determining unit determines the volume of the inner core part according to the area of the through hole, and the second capacity determining unit is an inner core part side covering thickness that covers the inner core part side of the coil conductor. A chip electronic component that determines the volume of the inner core part according to the above. The chip electronic component according to claim 9, wherein the inner core portion is filled with a magnetic material, and a volume of the magnetic material filled in the coil conductor is determined according to a volume of the inner core portion. The second capacity determining unit is provided so that an upper coating thickness covering an upper portion of the coil conductor and an inner core portion side coating thickness covering an inner core portion side of the coil conductor are different from each other. The chip electronic component as described in. The second capacity determining unit has an upper coating thickness that covers the upper portion of the coil conductor as a, and an inner core portion side coating thickness that covers the inner core portion side of the coil conductor as 0.01. The chip electronic component according to claim 9, wherein ≦ a / b ≦ 50 is satisfied. The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and an uppermost covering thickness of the inner core part side covering part, a lowermost covering thickness, The chip electronic component according to claim 9, wherein the chip electronic components are provided differently. The second capacity determination unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and the inner core part side covering part gradually increases in thickness from the lower part toward the upper part. The chip electronic component according to claim 9. The second capacity determining unit includes an inner core part side covering part that covers the inner core part side of the coil conductor, and c is a coating thickness of a lowermost part of the inner core part side covering part, and the inner core part side 10. The chip electronic component according to claim 9, wherein 0.01 ≦ c / d ≦ 50 is satisfied, where d is a coating thickness of the uppermost portion of the coating portion. 10. The chip electronic component according to claim 9, wherein the second capacitance determining unit is provided such that a coating thickness on the inner core side of the coil conductor satisfies 10 μm to 200 μm.

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