JP2015216302A - Coil component and method of manufacturing coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mounting coil component capable of suitably preventing a coil or a winding lead from being broken by a load applied from a circuit board, even if the coil component is made compact, and to provide a method of manufacturing a coil component.SOLUTION: A coil component 100 is surface mounting type, and includes a coil 10, a plurality of terminals 20, and a resin base 40 for embedding the intermediate portion of these terminals 20. The terminal 20 has a mounting terminal 22 including a surface mounting part 21, a ramp 24 rising obliquely upward from the mounting terminal 22, and a binding terminal 26 drooping from the ramp 24 and projecting downward from the base 40 before terminating. The terminal part 14 of the winding lead 12 of the coil 10 is bound to the binding terminal 26 above the surface mounting part 21, and fixed.

Description

  The present invention relates to a surface mount type coil component and a method of manufacturing the coil component.

  Various coil components that are surface-mounted on a circuit board are provided. This type of coil component generally includes a plurality of terminals mounted on a circuit board, and a coil having a terminal end of a winding lead entangled with the terminals.

  Patent Document 1 describes a coil component that includes a drum core around which a coil is wound, a terminal plate to which the drum core is attached, and a plurality of terminals that protrude outward from the side surface of the terminal plate. ing. The base end portion of the terminal protrudes substantially horizontally from the terminal plate, and the terminal has a so-called gull wing shape in which the terminal is bent downward from the base end portion and the distal end is bent substantially horizontally again. The distal end portion of the winding lead extending from the coil is entangled and fixed to the base end portion of the terminal, and the distal end portion of the terminal constitutes a surface mounting portion mounted on the circuit board.

  Patent Document 2 describes a surface mount type coil component in which a terminal is protruded from a lower surface and a side surface of a terminal plate attached to a coil. In this coil component, the end of the winding lead is entangled with the part (wiring terminal) protruding from the lower surface of the terminal board and fixed with solder, and then the part protruding from the side to the side is the bottom and surface of the terminal board. The surface mount terminal is bent twice in an L-shape so as to be uniform.

  In the coil component of Patent Document 1, the terminal portion of the winding lead is entangled with a terminal protruding outward from the side surface of the terminal plate, and the tip of the terminal is used as a surface mounting portion. For this reason, when the end portion of the winding lead is bound and fixed, the terminal is deformed by the load, and it becomes difficult to maintain the flatness of the surface mounting portion. On the other hand, like the coil component of Patent Document 2, the terminal portion of the winding lead is entangled with the portion protruding from the lower surface of the terminal plate of the terminal, and the portion protruding from the side surface is the surface mounting portion. The surface mounting portion is prevented from being deformed by a load when the end portion of the winding lead is bound. In addition, since the portion (wiring terminal) that ties the end of the winding lead and the surface mounting portion are separated by the terminal plate, the coil or winding lead may be disconnected by an impact applied from the circuit board. Reduced.

Japanese Utility Model Publication No. 5-090921 Japanese Utility Model Publication 1-156514

  However, with the recent miniaturization of coil components, the wire of the coil is made thinner and the terminal board (base part) is made thinner. For this reason, also in the coil component of patent document 2, a wire is easy to disconnect easily by the impact loaded from the circuit board mounted, and it is difficult to fully prevent this. The terminal in the coil component of Patent Document 2 rises vertically from the tip portion having the surface mounting portion, and is embedded in the terminal plate (base portion) when bent in the L-shape in the horizontal direction. As a result, the load applied from the circuit board to the surface mounting part of the coil component is transmitted to the terminal board (base part) without being absorbed by the terminal, so that the wiring terminal (entangled terminal) for winding the winding lead This is because the part) is easily displaced to tension and break the winding lead. In particular, the coil component of Patent Document 2 is formed by bending a terminal end of a winding lead to a wiring terminal (binding terminal), and then bending the tip end of the terminal vertically twice to form a gull wing. The terminal may be peeled off from the terminal board (base part) due to the load of. For this reason, the load applied to the surface mounting portion of the coil component is not absorbed by the terminal plate (base portion), and the wiring terminal (binding terminal portion) is easily displaced.

  The present invention has been made in view of the above-described problems, and is a surface-mount type that can suitably prevent the coil or the winding lead from being broken by a load applied from the circuit board even if the coil component is downsized. Coil parts and a method of manufacturing such coil parts.

  According to the present invention, there is provided a surface mount type coil component including a coil, a plurality of terminals, and a resin base portion that embeds an intermediate portion of the terminals, wherein the plurality of terminals are formed by a surface mounting portion. A mounting terminal portion including: an inclined portion that rises obliquely upward from the mounting terminal portion; and a binding terminal portion that hangs down from the inclined portion and projects downward from the base portion and terminates. A coil component is provided in which an end portion of the winding lead is entangled and fixed to the entangled terminal portion above the surface mounting portion.

  Further, according to the present invention, a plurality of terminals each including a mounting terminal portion including a surface mounting portion, an inclined portion rising obliquely upward from the mounting terminal portion, and a binding terminal portion hanging down from the inclined portion and terminating. A step of preparing a terminal, a step of placing the surface mounting portion of the mounting terminal portion on a first mold and loading a plurality of the terminals into the first die, and a second mold. Sliding along the first mold to bring the second mold into contact with the inclined portion of the terminal and surrounding the plurality of terminals with the second mold; and Molten resin is injected into the gap defined by the mold and the second mold, and the terminal is embedded across the inclined portion and the binding terminal portion, and the binding terminal portion protrudes downward. A step of molding a resin base portion so that the coil held by the base portion A step of fixing the end portion of the wire lead to the binding terminal portion above the surface mounting portion, and irradiating the binding terminal portion with a laser to melt the binding terminal portion; Forming a lump part including at least a part of the end portion of the wire lead.

  According to the above invention, since the inclined portion rises obliquely upward from the mounting terminal portion, the load applied to the mounting terminal portion from the circuit board acts obliquely on the inclined portion to bend and deform the inclined portion. Thereby, since the load from the circuit board is absorbed by the inclined portion, the displacement of the binding terminal portion is suppressed. And since the end part of the winding lead of the coil is bound and fixed to the terminal part above the surface mounting part, the end part of the winding lead may interfere with the circuit board and receive a load. Absent.

  According to the coil component and the manufacturing method thereof of the present invention, even if the coil component is downsized, it is possible to suitably prevent the coil or the winding lead from being broken by the load applied from the circuit board.

(A) is a front view which shows the state by which the coil component concerning embodiment of this invention is mounted in the circuit board, (b) is a front view which shows the terminal structure which removed the core part from the coil component. It is a disassembled perspective view of a coil component. It is a perspective view of a terminal. (A) is a schematic diagram which shows a 1st process and a 2nd process, (b) is a schematic diagram which shows a 3rd process. It is a schematic diagram which shows the detail of a 3rd process. (A) is a schematic diagram which shows a mode that the base part shape | molded by the 4th process is removed from a 1st metal mold | die, (b) is a schematic diagram which shows a 5th process and a 6th process.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing, corresponding constituent elements are denoted by common reference numerals, and redundant description is omitted as appropriate.

  In the present specification, the side on which the mounting surface 210 to which the coil component 100 is bonded is referred to as the upper side with reference to the circuit board 200 on which the coil component 100 is mounted. Conversely, with the coil component 100 as a reference, the side on which the surface mounting portion 21 to be bonded to the mounting surface 210 is formed is referred to as a lower side. However, this is defined for convenience in order to briefly explain the relative relationship between the components, and does not necessarily coincide with the upper and lower directions in the direction of gravity when the coil component 100 is manufactured or used. In addition, the “surface” in the present specification means a substantially flat shape and does not require a geometrically perfect plane.

  FIG. 1A is a front view showing a state in which the coil component 100 according to the embodiment of the present invention is mounted on the circuit board 200. FIG.1 (b) is a front view which shows the terminal structure 90 which removed the core part 50 (refer FIG. 2) from the coil component 100 of this embodiment. FIG. 2 is an exploded perspective view of the coil component 100 of the present embodiment.

First, an outline of the present embodiment will be described.
The coil component 100 according to the present embodiment is a surface mount type, and includes a coil 10, a plurality of terminals 20, and a resin base portion 40 that embeds an intermediate portion of these terminals 20.
The plurality of terminals 20 includes a mounting terminal portion 22 including a surface mounting portion 21, an inclined portion 24 that rises obliquely upward from the mounting terminal portion 22, and hangs down from the inclined portion 24 and projects downward from the base portion 40 to terminate. Each of which has a binding terminal portion 26 to be connected. The end portion 14 of the winding lead 12 of the coil 10 is entangled and fixed to the terminal portion 26 above the surface mounting portion 21.

  Next, the coil component 100 of this embodiment will be described in detail.

  The coil component 100 is an electronic component including the coil 10, and specifically includes a transformer, an inductance element, a choke coil, and the like. Among these, the coil component 100 of the present embodiment is a transformer in which a plurality of coils 10 are wound around the winding shaft portion 42 of the bobbin 46.

  As shown in FIG. 2, the coil component 100 of the present embodiment is provided with four terminals 20 projecting in total, four on the outer side from the opposite side surfaces of the base portion 40.

  The base portion 40 is made of an insulating resin material. Specifically, a thermosetting resin such as a phenol resin or an epoxy resin can be exemplified, but a heat-resistant thermoplastic resin may be used.

  The terminal 20 is made of a metal material. Specifically, a bar or plate made of a highly elastic metal material such as phosphor bronze or copper-clad steel wire can be used.

  The base portion 40 of this embodiment is formed by integrally forming a bobbin 46 and a terminal holding portion 48. The bobbin 46 and the terminal holding part 48 are excellent in adhesiveness by using the same kind of resin material. However, the bobbin 46 and the terminal holding part 48 may be made of different materials.

  The terminal holding portion 48 is a portion of the base portion 40 that embeds the inclined portion 24 of the terminal 20. As shown in FIG. 1B, an inclined surface 49 that is inclined outward and downward is provided at the lower portion of the terminal holding portion 48. The inclined portion 24 of the terminal 20 protrudes from the inclined surface 49. The normal direction of the inclined surface 49 substantially coincides with the protruding direction of the inclined portion 24 of the terminal 20. By forming the inclined surface 49 below the terminal holding portion 48, the accessibility of the terminal 20 to the mounting terminal portion 22 is improved, and the mounting work on the mounting surface 210 (see FIG. 1A) of the circuit board 200 is performed. Can be done accurately.

  The bobbin 46 includes a hollow winding shaft portion 42, flanges 44 formed at both ends of the winding shaft portion 42, and a partition wall portion 45 formed at an intermediate portion of the winding shaft portion 42. In the bobbin 46 of the present embodiment, two partition walls 45 are formed around the winding shaft portion 42 in a flange shape. The winding shaft part 42 is separated into two places by a partition wall part 45, and different coils 10 are wound around each winding shaft part 42. The coil 10 is formed by winding a wire, and a partial length in the vicinity of both ends of the wire is drawn from the winding shaft portion 42. Such a length region is referred to as a winding lead 12. The winding lead 12 is pulled out from the winding shaft portion 42 along the inner surface of the flange portion 44, and its end portion 14 is fixed by being entangled with a bobbin 46 that protrudes downward below the base portion 40. The winding axis direction AX of the winding shaft portion 42 in the bobbin 46 of the present embodiment is the horizontal direction (the left-right direction in each drawing of FIG. 1), and is orthogonal to the extending direction of the binding terminal portion 26 (FIG. 1). (See (b)).

  That is, the base portion 40 (bobbin 46) of the present embodiment has a winding shaft portion 42 having a winding axis direction AX in a direction orthogonal to the binding terminal portion 26 and a large diameter formed at both ends of the winding shaft portion 42. And the flange portion 44. Then, the coil 10 is wound around the winding shaft portion 42, and the winding lead 12 is drawn out to the outer side of the winding shaft direction AX from the flange portion 44 and is fixed to the winding terminal portion 26.

  The winding lead 12 of the coil 10 wound around the winding shaft portion 42 is pulled out from the coil 10 in a direction orthogonal to the winding shaft direction AX, and the end portion 14 is entangled with the terminal portion 26. For this reason, when the tangled terminal portion 26 is inclined and deformed outwardly due to an external force or gravitational acceleration being applied to the coil component 100, the end portion 14 of the winding lead 12 is pulled outward in the winding axis direction AX. And get nervous. However, as described below, according to the coil component 100 of the present embodiment, the inclination deformation of the binding terminal portion 26 is suppressed due to the presence of the inclined portion 24.

  The terminal 20 includes an inclined portion 24 that rises obliquely upward from the mounting terminal portion 22, and a binding terminal portion 26 that hangs down from the inclined portion 24 and projects downward from the base portion 40 and terminates. The mounting terminal portion 22 extends horizontally or substantially horizontally, and the lower surface of the mounting terminal portion 22 constitutes a surface mounting portion 21. The surface mounting portion 21 is a flat surface mounted on the mounting surface 210 of the circuit board 200, and the surface mounting portions 21 of a plurality of (in this embodiment, eight) terminals 20 are located on the same plane. .

  FIG. 3 is a perspective view of the terminal 20. The inclined portion 24 rises obliquely upward from the mounting terminal portion 22 with an obtuse inclination angle φ. The inclination angle φ is an angle at which the thickness centers C of the surface mounting portion 21 and the inclined portion 24 intersect each other. The inclination angle φ is more than 90 degrees and less than 180 degrees, but is preferably 120 degrees or more and 160 degrees or less.

  The base end portion 25 corresponding to the upper end of the inclined portion 24 is embedded in the terminal holding portion 48 of the base portion 40 as shown in FIG. In other words, the inclined portion 24 protrudes outward from the base portion 40 toward the obliquely downward direction from the base end portion 25 embedded in the base portion 40. The binding terminal portion 26 hangs downward from the base end portion 25 of the inclined portion 24. The bending angle θ, which is an angle at which the thickness centers C of the inclined portion 24 and the binding terminal portion 26 intersect each other, is an acute angle. The bending angle θ can be 20 degrees or more and 60 degrees or less.

  The terminal 20 is made of a metal material having a spring property. When a load in the horizontal direction is applied to the inclined portion 24, the inclined portion 24 is bent and deformed with respect to the binding terminal portion 26 to change the bending angle θ.

  In the terminal 20 of the present embodiment, the extending direction of the binding terminal portion 26 coincides with the normal direction of the surface mounting portion 21 of the terminal 20, and the bending angle θ is a complementary angle of the inclination angle φ. However, instead of the present embodiment, the binding terminal portion 26 may be inclined obliquely with respect to the surface mounting portion 21. In addition, the base end portion 25 of the terminal 20 of the present embodiment is a bent portion and does not substantially have a dimension in the extending direction of the terminal 20, and the inclined portion 24 and the binding terminal portion 26 are adjacent to each other. doing. The inclined portion 24 and the binding terminal portion 26 are bent in an inverted V shape. However, instead of the present embodiment, the base end portion 25 may have a portion extending in the horizontal direction by a predetermined length.

  The base portion 40 (terminal holding portion 48) embeds the terminal 20 across the inclined portion 24 and the binding terminal portion 26. The base part 40 is provided above the surface mounting part 21. That is, the lowest point of the base part 40 is located above the surface mounting part 21.

  Of the base portion 40, the lower edges of the flange portion 44 and the partition wall portion 45 correspond to the lowest point of the base portion 40. The lower edges of the flange portion 44 and the partition wall portion 45 have the same height as the upper surface of the mounting terminal portion 22, in other words, are positioned above the surface mounting portion 21 by the thickness dimension of the mounting terminal portion 22.

  In the coil component 100 of the present embodiment, unlike the device of Patent Document 2, the base portion 40 (terminal holding portion 48) is entangled and embeds not only the terminal portion 26 but also the inclined portion 24. Therefore, the bending angle θ between the inclined portion 24 and the binding terminal portion 26 is held by the base portion 40. Accordingly, the base end portion 25 of the inclined portion 24 where stress concentration is likely to occur is protected by the base portion 40, and even if a load is applied from the circuit board 200 to the surface mounting portion 21, the base end portion of the inclined portion 24. The bending angle θ at 25 does not substantially change. For this reason, it is possible to prevent the winding terminal portion 26 from being inclined and deformed and causing the winding lead 12 to be tensioned and broken. Further, since the base portion 40 is provided above the surface mounting portion 21, the base portion 40 does not receive a load directly from the circuit board 200.

  Note that a load applied from the circuit board 200 to the surface mounting portion 21 means that an external force or gravitational acceleration acts on the circuit board 200 or the coil component 100 and the surface mounting portion 21 of the coil component 100 and the circuit board 200 are mounted. It means that a load exceeding the weight of the coil component 100 is generated between the surface 210 and the surface 210.

  As shown in FIG. 2, the core part 50 of this embodiment is what is called an EE core which consists of a pair of magnetic material which makes an E shape by the top view. The core part 50 can be made of ferrite as an example. The core part 50 is provided with a rod-shaped insertion part 52 and outer frame parts 54 projecting on both sides thereof. An opening 47 is formed through the bobbin 46 of the base portion 40 along the winding axis direction AX. The opening 47 passes through the winding shaft part 42, the flange part 44 and the partition wall part 45. The insertion portion 52 of the core portion 50 is inserted through the opening 47 as indicated by the alternate long and short dash line. The pair of core portions 50 are abutted against each other between the insertion portions 52 and the outer frame portions 54 and constitute a closed magnetic path of magnetic flux generated by the coil 10. The pair of core portions 50 are fixed to each other with an adhesive tape (not shown). Moreover, you may fix together a pair of core part 50 and the base part 40 with this adhesive tape. Instead of this embodiment, the core part 50 may be a so-called EI core in which a pair of E-shaped and I-shaped magnetic materials are combined.

  In FIG. 2, the mode in which the coil 10 is exposed is illustrated for explanation, but the present invention is not limited to this. A cover member (not shown) that houses and covers the coil 10 and the bobbin 46 may be mounted, or the coil 10 and the bobbin 46 may be sealed with a resin material.

  As shown in FIG. 1 and FIG. 2, the binding terminal portion 26 has a massive portion 27 that encloses at least a part of the end portion 14 of the winding lead 12. The binding terminal portion 26 and the block portion 27 are made of the same material, and the block portion 27 is formed at the lower end of the binding terminal portion 26 or near the lower end. In FIG. 3, the block 27 is not shown. Note that the lump portion 27 includes at least a part of the end portion 14 of the winding lead 12 when the wire diameter of the winding lead 12 extends over a part of the length region near the end of the winding lead 12. This means that the part or the whole is embedded in the massive part 27.

  The shape of the massive portion 27 is not particularly limited, but may be a spherical shape having a larger diameter than the thickness of the portion of the binding terminal portion 26 excluding the massive portion 27. The lump portion 27 can be formed by irradiating the binding terminal portion 26 with a laser L (see FIG. 6) and melting it, as will be described in a manufacturing method described later. By forming the block portion 27 at the lower end of the binding terminal portion 26, even if the binding terminal portion 26 interferes with the circuit board 200, the large-diameter block portion 27 comes into contact with the circuit board 200. Damage to the circuit board 200 is prevented. Further, since the lump portion 27 includes the end portion 14 of the winding lead 12, even if the lump portion 27 contacts the circuit board 200, the winding lead 12 is physically protected to prevent disconnection. Is done.

  The binding terminal portion 26 (the block portion 27) terminates above the surface mounting portion 21. For this reason, the mounting terminal portion 22 of the terminal 20 receives a load from the circuit board 200 in the direction perpendicular to the surface when the coil component 100 is mounted or in an environment where the product is used. Even so, the binding terminal portion 26 does not interfere with the circuit board 200.

  It should be noted that the various components of the coil component 100 of the present invention need not be individually independent. A plurality of components are formed as one member, a component is formed of a plurality of members, one component is a part of another component, and one component is And a part of other components are allowed to overlap.

(Production method)
Hereinafter, a method for manufacturing the coil component 100 of the present embodiment (hereinafter sometimes referred to as the present method) will be described. Fig.4 (a) is a schematic diagram which shows a 1st process and a 2nd process. FIG. 4B is a schematic diagram showing the third step. FIG. 5 is a schematic diagram showing details of the third step. FIG. 6A is a schematic diagram showing how the base portion 40 molded in the fourth step is removed from the first mold 110. FIG. 6B is a schematic diagram showing the fifth step and the sixth step.

  Hereinafter, although this method is demonstrated using a some process, the order of the description does not necessarily limit the order and timing which perform each process. For this reason, the order of the plurality of steps of the present method can be changed within a range that does not hinder the contents, and some or all of the execution timings of the plurality of steps may overlap each other.

The method includes first to sixth steps.
As shown in FIG. 4A, a plurality of terminals 20 are prepared in the first step. As described above, the terminal 20 includes the mounting terminal portion 22 including the surface mounting portion 21, the inclined portion 24 that rises obliquely upward from the mounting terminal portion 22, and the binding terminal portion 26 that hangs down from the inclined portion 24 and terminates. And each.
In the second step, the surface mounting portion 21 of the mounting terminal portion 22 is placed on the first mold 110 and a plurality of terminals 20 are loaded into the first mold 110.
In the third step, the second mold 120 is slid along the first mold 110 to bring the second mold 120 into contact with the inclined portion 24 of the terminal 20 as shown in FIG. The periphery of the book terminal 20 is surrounded by the second mold 120.
In the fourth step, molten resin is injected into the gap 130 defined by the first mold 110 and the second mold 120, and the terminal 20 is embedded across the inclined portion 24 and the tangled terminal portion 26. The resin base portion 40 is formed so that the binding terminal portion 26 protrudes downward. A terminal structure 90 including the molded base portion 40 is shown in FIG.
As shown in FIG. 6B, in the fifth step, the terminal portion 14 of the winding lead 12 of the coil 10 held by the base portion 40 (bobbin 46) is bound above the surface mounting portion 21. 26 and fix.
In the sixth step, the binding terminal portion 26 is irradiated with the laser L to melt the binding terminal portion 26, and the massive portion 27 including at least a part of the end portion 14 of the winding lead 12 (FIG. 1B). Reference).

  Next, this method will be described in more detail.

  In the first step, the terminal 20 is formed. The terminal 20 is formed by cutting and pressing a metal plate, bending the mounting terminal portion 22 and the inclined portion 24 at an inclination angle φ and bending the base end portion 25 at an acute angle as shown in FIG. The part 24 and the binding terminal part 26 are bent at a bending angle θ. Although the terminal 20 of this embodiment is a uniform width dimension and thickness dimension from the mounting terminal part 22 to the binding terminal part 26, it is not restricted to this. The mounting terminal portion 22 and the binding terminal portion 26 may be narrow, and the inclined portion 24 may be wider than these.

  The mounting terminal portion 22 and the binding terminal portion 26 of the terminal 20 are preferably formed sufficiently longer than the finished state shown in FIG.

A long concave groove 114 corresponding to the width dimension and the thickness dimension of the mounting terminal portion 22 is formed on the upper surface 112 of the first mold 110. That is, the depth dimension of the concave groove 114 (vertical dimension in FIG. 4A) is substantially equal to the thickness dimension of the mounting terminal portion 22, and the width dimension of the concave groove 114 (the depth dimension in FIG. 4) is the mounting terminal portion 22. Is approximately equal to the width dimension.
The upper surface 112 of the first mold 110 is formed with a recessed hole 116 into which the binding terminal portion 26 can be inserted. The depth dimension of the recessed hole 116 is equal to or greater than the length dimension of the binding terminal portion 26. In order to prevent molten resin (not shown) from flowing in the state in which the binding terminal portion 26 is inserted into the concave hole 116, the concave hole 116 preferably has an opening size for inserting the binding terminal portion 26 into a fit.
The concave grooves 114 and the concave holes 116 are formed corresponding to a plurality of (eight in the present embodiment) terminals 20, respectively. By forming the binding terminal portion 26 longer than the finished length in the first step, the binding terminal portion 26 can be inserted into the recessed hole 116 to a sufficient depth and the terminal 20 can be stably held. .

  The second mold 120 slides along the upper surface 112 of the first mold 110 so as to freely advance and retract in the extending direction of the concave groove 114. The second mold 120 includes a lower surface 122 that slides on the upper surface 112, and an upright surface 124 that stands at a predetermined angle from the lower surface 122. The standing surface 124 of the present embodiment stands upright with respect to the lower surface 122. A recessed portion 126 is provided at the lower portion of the elevation surface 124. The recessed portion 126 is a female mold that forms the finished surface of the inclined surface 49 (see FIG. 1B) of the terminal holding portion 48. A protrusion 128 that protrudes toward the vertical surface 124 is formed inside the recess 126.

  In this method, a pair of second molds 120 having the same shape are used facing each other. The pair of second molds 120 slides with respect to the upper surface 112 of the first mold 110 with the rising surfaces 124 facing inward. The second mold 120 has a width dimension (depth dimension in FIG. 4A) that includes at least a plurality of terminals 20 (four on one side in this embodiment) arranged in parallel on one side of the bobbin 46. Have.

  In the second step, the mounting terminal portion 22 is fitted into the concave groove 114, the tangled terminal portion 26 is fitted into the concave hole 116, and the terminal 20 is loaded into the first mold 110. As a result, the upper surface of the mounting terminal portion 22 is flush with the upper surface 112. As a result, the lower surface 122 of the second mold 120 can slide along the upper surface 112 without interfering with the mounting terminal portion 22.

  In the third step, as shown by the arrow in FIG. 4A, the second mold 120 is slid in the extending direction of the mounting terminal portion 22 with the second mold 120 in contact with the upper surface 112 of the first mold 110. Let At this time, a female-shaped third mold 132 corresponding to the bobbin 46 (see FIG. 1B) is further arranged in the first mold 110. As a result, as shown in FIG. 4B, a gap 130 defined by the first mold 110 and the second mold 120 is formed.

  Note that the gap 130 is defined by the first mold 110 and the second mold 120 is closed by a plurality of surfaces including at least a plane or a curved surface of the first mold 110 and the second mold 120, respectively. Or a substantially closed void 130 is formed. In the present embodiment, the upper surface 112 of the first mold 110, the surface of the recessed portion 126 (see FIG. 4A) and the upright surface 124 of the second mold 120, and the third mold 132 are gaps. The part 130 is partitioned. In the gap 130, the inclined portion 24 of the terminal 20 and a part of the upper side of the binding terminal portion 26 are exposed.

  In the fourth step, molten resin is injected into the gap portion 130, the terminal 20 is embedded with the molten resin across the inclined portion 24 and the terminal portion 26 to form the terminal holding portion 48, and the bobbin 46 is Mold. Since the lower end portion of the binding terminal portion 26 is inserted into the recessed hole 116, it protrudes downward from the molten resin. By curing the molten resin, the bobbin 46 and the terminal holding portion 48 are integrally formed to form the base portion 40. In addition, when it replaces with this embodiment and the bobbin 46 and the terminal holding | maintenance part 48 are shape | molded with a dissimilar material, you may perform injection | pouring and hardening of molten resin in a 4th process in multiple times. In this case, a boundary surface 43 may be formed between the terminal holding portion 48 and the bobbin 46 (see FIG. 6A).

  Here, in the step (third step) in which the second mold 120 (projection portion 128) is brought into contact with the inclined portion 24 of the terminal 20, the inclined portion 24 in a part or all of the plurality of terminals 20 is changed to the first portion. The two molds 120 may be elastically biased toward the binding terminal portion 26 (see FIG. 5). As a result, the bending angle θ at the biased terminal 20 slightly decreases. And in the process (4th process) which shape | molds the base part 40, you may inject | pour molten resin into the space | gap part 130 in the state in which the inclination part 24 was elastically biased.

  Thereby, in the coil component 100 of the present embodiment, the angle (bending angle θ) between the inclined portion 24 and the tangled terminal portion 26 formed by the inclined portion 24 of some or all of the plurality of terminals 20 is determined. You may be embedded in the base part 40 in the state elastically biased in the direction to reduce.

  As shown in FIG. 5, the second mold 120 is slid so that the protruding portion 128 first contacts the inclined portion 24 of the plurality of terminals 20 (illustrated by a broken line), and an arrow indicates As shown, the second mold 120 may be further advanced. And it is good to stop the advance of the 2nd metal mold | die 120 in the position where the projection part 128 contact | abutted favorably with respect to the inclination part 24 in all the terminals 20. FIG. Thereby, the inclination angle of the inclined portion 24 in the plurality of terminals 20 is made common.

That is, the bending angle θ and the inclination angle φ (see FIG. 3) in the terminal 20 prepared in the first process may have a predetermined variation with respect to the design value. Specifically, when the inclination angle φ formed by the mounting terminal portion 22 and the inclined portion 24 is larger than the design value, the inclined portions 24 are not aligned among the plurality of terminals 20 and are not matched, and the bending angle θ is predetermined. Smaller than the value. Therefore, as described above, the inclined portion 24 is entangled with the projection 128 of the second mold 120 and elastically biased toward the terminal portion 26, and the terminal holding portion 48 is resin-molded in this state, A desired finished shape of the inclined portion 24 can be realized.
Further, when the coil component 100 receives a load directly above the surface from the circuit board 200, the inclined portion 24 is pushed up together with the mounting terminal portion 22, and the terminal 20 is deformed in a direction in which the inclined angle φ is widened. At this time, since the inclined portion 24 is biased in advance toward the binding terminal portion 26, the stress caused by the deformation is canceled, so the load on the binding terminal portion 26 is reduced.

  After the base portion 40 is formed in the fourth step, as shown in FIG. 6 (a), the pair of second molds 120 are slid in a direction in which they are separated from each other, and the terminal structure 90 after forming is formed into the first metal mold. Remove upward from the mold 110.

  In the fifth step, as shown in FIG. 6B, the mounting terminal portion 22 is cut into a predetermined length by the cutting blade 140 to separate and remove the cut piece 23. Further, the coil 10 is formed by winding a wire around the winding shaft portion 42 of the base portion 40, and further, the terminal portion 26 is obtained by connecting the terminal portion 14 of the winding lead 12 that is a part of the wire drawn from the coil 10. Fix it by tying it. The winding lead 12 is drawn downward from the winding shaft portion 42 along the inner surface of the flange portion 44, and is wound around the binding terminal portion 26 substantially without slack. The end portion 14 of the winding lead 12 is preferably fixed in the vicinity of the upper end of the exposed portion of the binding terminal portion 26 protruding downward from the base portion 40. In the fifth step, the excess length of the lower end portion of the binding terminal portion 26 may be cut off. Specifically, the binding terminal portion 26 is arranged so that the lower end of the binding terminal portion 26 terminates above the mounting terminal portion 22 of the surface mounting portion 21 so that the binding terminal portion 26 does not contact the circuit board 200. It is good to cut and isolate | separate and remove the cut piece 28. FIG. However, the binding terminal portion 26 is melted by irradiation with a laser L, which will be described later, and a lump portion 27 is formed, and the length of the binding terminal portion 26 is slightly reduced. Therefore, in anticipation of such a reduced length, in the fifth step, the binding terminal portion 26 may be cut with a length such that the lower end of the binding terminal portion 26 is positioned slightly below the mounting terminal portion 22. . In the first step, when preparing the terminal 20 that has been previously shaped to a predetermined length so that the length of the binding terminal portion 26 is equal to the finished dimension, the lower portion of the binding terminal portion 26 is prepared in the fifth step. The above-described process of cutting is unnecessary.

  In the sixth step, the lower end portion of the binding terminal portion 26 is irradiated with the laser L using the irradiation device 150. The type of the laser L is not particularly limited, and a solid-state laser such as a YAG laser, a semiconductor laser, or a gas laser such as a carbon dioxide gas laser may be used. The laser L is applied to the binding terminal portions 26 of the plurality of terminals 20 once or a plurality of times. As a result, the binding terminal portion 26 is melted to form a lump portion 27 (see FIG. 1B), and the end portion 14 of the wound winding lead 12 is included in the lump portion 27.

  In this method, all the binding terminal portions 26 protrude downward from the base portion 40, and the protruding directions of all the binding terminal portions 26 are the same. For this reason, it is possible to irradiate any of the binding terminal portions 26 with the laser L from below the base portion 40. In other words, since the irradiation surface of the laser L is shared, the handling property of the irradiation device 150 is good.

  As a result, the terminal structure 90 shown in FIG. 1B is formed. As described above, the coil component 100 according to the present embodiment is formed by arbitrarily accommodating the coil 10 and the bobbin 46 with a cover member (not shown), and further mounting and fixing the core portion 50 on the base portion 40.

  According to the method described above, instead of forming the mounting terminal portion 22 by bending the terminal 20 after resin-molding the base portion 40, the terminal 20 previously formed in a predetermined shape is embedded in the molten resin. The stress applied to the binding terminal portion 26 is reduced. Furthermore, by forming the inclined portion 24 on the terminal 20, even if a shocking load is applied to the mounting terminal portion 22 in the usage environment during and after mounting, the inclined portion 24 absorbs this. . For this reason, stress is not substantially transmitted to the binding terminal portion 26 and the end portion 14 of the winding lead 12 fixed thereto, and the coil and the winding lead 12 can be protected.

  In this method, the first to sixth steps are exemplified in this order, but the present invention is not limited to this. For example, you may perform a 1st process and a 2nd process simultaneously. Specifically, the terminal 20 may be bent into a predetermined shape with the terminal 20 loaded in the first mold 110. In addition, after performing the fifth step and the sixth step, the third step and the fourth step may be performed. That is, a wire is wound around a pre-formed bobbin 46, the winding lead 12 is entangled and fixed to the terminal portion 26, and the lump portion 27 is formed by the laser L as necessary. The terminal holding part 48 (base part 40) may be molded by being loaded into one mold 110.

  The present invention is not limited to the above-described embodiment, and includes various modifications and improvements as long as the object of the present invention is achieved.

  For example, in the coil component 100 of the present embodiment, all the terminals 20 have the same shape, and an example is illustrated in which the terminal portion 20 protrudes outward from both opposing sides (left and right sides in FIG. 1). Is not limited to this. The terminals 20 may be arranged radially around the entire circumference of the base portion 40, and the shape of some of the terminals 20 may be different from the shape of the other terminals 20.

  Further, in the present embodiment, the winding axis direction AX (see FIG. 1B) of the winding shaft portion 42 is a horizontal direction and is illustrated as being orthogonal to the extending direction of the binding terminal portion 26. It is not limited to this. The coil component 100 may have a so-called drum core shape. In this case, the winding axis direction AX of the winding shaft portion 42 may be parallel or substantially parallel to the extending direction of the binding terminal portion 26.

The above embodiment includes the following technical idea.
(1) A surface-mounting coil component including a coil, a plurality of terminals, and a resin base portion embedding an intermediate portion of the terminals, wherein the plurality of terminals include a surface mounting portion. A coil portion of the coil, each including a terminal portion, an inclined portion that rises obliquely upward from the mounting terminal portion, and a binding terminal portion that hangs down from the inclined portion and projects downward from the base portion and terminates A coil component in which a terminal end portion of a lead is entangled and fixed to the binding terminal portion above the surface mounting portion.
(2) The coil component according to (1), wherein the binding terminal portion includes a lump portion of the same material that includes at least a part of the end portion of the winding lead.
(3) The above-mentioned (1) or (2), wherein the base portion embeds the terminal across the inclined portion and the binding terminal portion and is provided above the surface mounting portion. Coil parts.
(4) The base portion includes a winding shaft portion having a direction perpendicular to the binding terminal portion as a winding shaft direction, and large diameter flange portions formed at both ends of the winding shaft portion, The coil is wound around the winding shaft portion, and the winding lead is drawn out to the outer side in the winding shaft direction from the flange portion, and is fixed by being wound around the binding terminal portion (3) Coil parts as described in.
(5) The coil component according to any one of (1) to (4), wherein the binding terminal portion terminates above the surface mounting portion.
(6) In a state in which the inclined portion in the terminal of some or all of the plurality is elastically urged in a direction to reduce an angle formed by the inclined portion and the binding terminal portion. The coil component according to any one of (1) to (5), which is embedded in a base portion.
(7) Prepare a plurality of terminals each including a mounting terminal part including a surface mounting part, an inclined part rising obliquely upward from the mounting terminal part, and a binding terminal part hanging down from the inclined part and terminating. A step of placing the surface mounting portion of the mounting terminal portion on the first mold and loading a plurality of the terminals into the first mold, and a second mold as the first mold. And the second mold is brought into contact with the inclined portion of the terminal and the periphery of the plurality of terminals is surrounded by the second mold, and the first mold and the first A molten resin is injected into the gap defined by the two molds, and the terminal is embedded across the inclined portion and the binding terminal portion, and the resin is made to project the binding terminal portion downward. Forming the base portion of the coil and the end of the winding lead of the coil held by the base portion A step of fixing the binding terminal portion above the surface mounting portion and fixing the binding terminal portion, irradiating the binding terminal portion with a laser to melt the binding terminal portion, and the end of the winding lead Forming a lump part including at least a part of the part.
(8) In the step of bringing the second mold into contact with the inclined portion of the terminal, the inclined portion of the terminal in some or all of the plurality of terminals is bound by the second mold. In the step of elastically urging toward the terminal portion and forming the base portion, the molten resin is injected into the gap portion in a state where the inclined portion is elastically urged. The manufacturing method of the coil component as described in (7).

DESCRIPTION OF SYMBOLS 10 Coil 12 Winding lead 14 Terminal part 20 Terminal 21 Surface mounting part 22 Mounting terminal part 23, 28 Cutting piece 24 Inclination part 25 Base end part 26 Binding terminal part 27 Lump part 40 Base part 42 Winding axis part 43 Boundary surface 44 ４５ part 45 partition part 46 bobbin 47 opening part 48 terminal holding part 49 inclined surface 50 core part 52 insertion part 54 outer frame part 90 terminal structure 100 coil component 110 first mold 112 upper surface 114 concave groove 116 concave hole 120 second gold Mold 122 Lower surface 124 Elevated surface 126 Recessed portion 128 Protruding portion 130 Gap portion 132 Third die 140 Cutting blade 150 Irradiation device 200 Circuit board 210 Mounting surface θ Bending angle φ Inclination angle AX Winding axis direction C Thickness center L Laser

Claims (8)

A surface mount type coil component comprising a coil, a plurality of terminals, and a resin base portion embedding an intermediate portion of the terminals,
The plurality of terminals include a mounting terminal portion including a surface mounting portion, an inclined portion that rises obliquely upward from the mounting terminal portion, and a binding terminal that hangs down from the inclined portion and projects downward from the base portion to terminate. Each of which has
A coil component in which an end portion of a winding lead of the coil is fixed by being entangled with the binding terminal portion above the surface mounting portion.   2. The coil component according to claim 1, wherein the binding terminal portion includes a lump portion of the same material that includes at least a part of the end portion of the winding lead.   The coil component according to claim 1, wherein the base portion embeds the terminal across the inclined portion and the binding terminal portion and is provided above the surface mounting portion. The base portion has a winding shaft portion whose winding direction is a direction orthogonal to the binding terminal portion, and a large-diameter collar portion formed at both ends of the winding shaft portion,
The coil is wound around the winding shaft portion, and the winding lead is drawn out to the outer side in the winding shaft direction from the flange portion, and is fixed by being wound around the binding terminal portion. Coil parts as described in.   The coil component according to any one of claims 1 to 4, wherein the binding terminal portion terminates above the surface mounting portion.   The inclined portion of some or all of the plurality of terminals is elastically biased toward the base portion in a direction that reduces an angle formed by the inclined portion and the binding terminal portion. The coil component according to any one of claims 1 to 5, wherein the coil component is embedded. Preparing a plurality of terminals each including a mounting terminal portion including a surface mounting portion, an inclined portion that rises obliquely upward from the mounting terminal portion, and a binding terminal portion that hangs down and terminates from the inclined portion; ,
Placing the surface mounting portion of the mounting terminal portion on a first mold and loading a plurality of the terminals into the first mold; and
Sliding the second mold along the first mold, bringing the second mold into contact with the inclined portion of the terminal and surrounding the plurality of terminals with the second mold When,
Molten resin is injected into a gap defined by the first mold and the second mold, and the terminal is embedded across the inclined portion and the entangled terminal portion, and the entangled terminal portion is Forming a resin base so as to protrude downward;
A step of fixing the end portion of the winding lead of the coil held in the base portion to the binding terminal portion above the surface mounting portion and fixing the winding lead portion;
Irradiating the binding terminal portion with a laser to melt the binding terminal portion, and forming a block portion including at least a part of the end portion of the winding lead; and
The manufacturing method of the coil components containing this. In the step of bringing the second mold into contact with the inclined portion of the terminal, the inclined portion of the terminal in some or all of the plurality of terminals is connected to the binding terminal portion by the second mold. Elastically biased toward the
The method for manufacturing a coil component according to claim 7, wherein, in the step of forming the base portion, the molten resin is injected into the gap portion in a state where the inclined portion is elastically biased.

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