JP2015211078A5 - - Google Patents
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- Publication number
- JP2015211078A5 JP2015211078A5 JP2014090421A JP2014090421A JP2015211078A5 JP 2015211078 A5 JP2015211078 A5 JP 2015211078A5 JP 2014090421 A JP2014090421 A JP 2014090421A JP 2014090421 A JP2014090421 A JP 2014090421A JP 2015211078 A5 JP2015211078 A5 JP 2015211078A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- lead
- hole
- flexible printed
- connection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Claims (2)
前記筐体内に配置され、レーザ光を発振する発光部と、
前記筐体内において前記発光部に接続される第1信号配線及び該第1信号配線の両側にそれぞれ配置された二つの第1グランド配線を含む領域と、前記筐体の一の側壁の外側に位置し、前記二つの第1グランド配線にそれぞれ接続される二つの第2グランド配線、及び前記第1信号配線に接続される第2信号配線を含む領域とを有するフィードスルーと、
前記第2信号配線に接続される第1リードと、
前記第1リードの両側に配置され、前記二つの第2グランド配線の一方及び他方にそれぞれ接続される第2リード及び第3リードと、
表面と前記表面に対向する裏面とを有し、前記第1リードに接続される第1配線を前記表面に有し、前記第2リードおよび前記第3リードと接続される第2配線を前記裏面に有し、前記第1配線及び前記第2配線によってマイクロストリップ線路を形成するフレキシブルプリント配線基板と、
を備え、
前記第1配線は、前記フレキシブルプリント配線基板の一の端部に第1孔が形成され、前記第1孔に前記第1リードを貫通させて接続される第1接続部を有し、
前記第2配線は、前記フレキシブルプリント配線基板の前記一の端部に第2孔及び第3孔が形成され、前記第2孔及び前記第3孔のそれぞれに前記第2リード及び前記第3リードを貫通させて接続される第2接続部及び第3接続部を有し、
前記第2接続部及び前記第3接続部は、前記第1接続部を挟むように配置され、
前記フレキシブルプリント配線基板の前記一の端部において、前記第2配線は、前記第2接続部及び前記第3接続部が互いに繋がり、前記第1接続部を包囲するような形状を有する、半導体光モジュール。 A housing,
A light emitting unit disposed in the housing and emitting laser light;
Said region containing two first ground wiring that is disposed on both sides of the front Symbol first signal line and the first signal wiring connected to the light emitting portion Te casing odor, the outer one of the side walls of the housing A feedthrough having two second ground wirings connected to the two first ground wirings and a region including a second signal wiring connected to the first signal wiring;
A first lead connected to the second signal wiring;
A second lead and a third lead disposed on both sides of the first lead and respectively connected to one and the other of the two second ground wirings;
A first wiring connected to the first lead on the front surface, and a second wiring connected to the second lead and the third lead on the back surface. A flexible printed wiring board that forms a microstrip line with the first wiring and the second wiring;
With
The first wiring has a first connection portion that has a first hole formed at one end of the flexible printed wiring board and is connected to the first hole through the first lead;
The second wiring has a second hole and a third hole formed at the one end of the flexible printed circuit board, and the second lead and the third lead are respectively formed in the second hole and the third hole. Having a second connection part and a third connection part connected through,
The second connection part and the third connection part are arranged so as to sandwich the first connection part,
In the one end of the flexible printed wiring board, the second wiring has a shape such that the second connecting portion and the third connecting portion are connected to each other and surround the first connecting portion. module.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014090421A JP2015211078A (en) | 2014-04-24 | 2014-04-24 | Semiconductor optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014090421A JP2015211078A (en) | 2014-04-24 | 2014-04-24 | Semiconductor optical module |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015211078A JP2015211078A (en) | 2015-11-24 |
JP2015211078A5 true JP2015211078A5 (en) | 2017-06-08 |
Family
ID=54613081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014090421A Pending JP2015211078A (en) | 2014-04-24 | 2014-04-24 | Semiconductor optical module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2015211078A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020137682A1 (en) * | 2018-12-26 | 2020-07-02 | 住友電工デバイス・イノベーション株式会社 | Optical semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4852442B2 (en) * | 2007-02-15 | 2012-01-11 | 日本オプネクスト株式会社 | Optical transmission module |
WO2009113156A1 (en) * | 2008-03-11 | 2009-09-17 | 富士通株式会社 | Connection device and optical device |
US9441944B2 (en) * | 2012-05-16 | 2016-09-13 | Axsun Technologies Llc | Regenerative mode locked laser swept source for OCT medical imaging |
-
2014
- 2014-04-24 JP JP2014090421A patent/JP2015211078A/en active Pending
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