JP2015210360A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging apparatus that can reduce the size thereof and prevent deformation of a mirror box.SOLUTION: An imaging apparatus 100 includes a lens mount 103, a mirror box unit 202 having a mount attachment base 202c, and an image pickup device unit 204 in order from a subject side with respect to the optical axis direction. The lens mount 103 is connected to the mount attachment base 202c, and the image pickup device unit 204 is connected to the mirror box unit 202; a side-face chassis member 205 and a side-face chassis member 206b are connected to the mount attachment base 202c; a bottom-face chassis member 206a is connected to the side-face chassis member 205 and the side-face chassis member 206b.

Description

  The present invention relates to an imaging apparatus.

  In an interchangeable lens camera such as a single-lens reflex camera, an external force may act on a lens mount part that is a connection part between the camera body and the lens, and the mirror box provided in the camera body may be deformed. When the mirror box is deformed, the distance between the image sensor and the lens mount (hereinafter referred to as “flange back”) changes, and the user cannot focus the lens.

  In order to prevent deformation of the mirror box, a combined body having a desired strength integrally joined by a battery holder unit, a strobe base unit, a side frame unit, and a bottom frame unit arranged so as to surround the mirror box unit. There has been known an imaging device that is configured and a mirror box unit having the combined body and a lens mount portion is fixed to a front cover member (see, for example, Patent Document 1).

JP 2010-243634 A

  However, in the camera of Patent Document 1, it is possible to prevent the mirror box from being deformed by the combined body having a desired strength. However, when the combined body is fixed to the front cover member, the space around the mirror box is lost and imaging is performed. Further downsizing of the device cannot be realized.

  An object of the present invention is to provide an imaging apparatus that can realize downsizing and prevent deformation of a mirror box.

  In order to achieve the above object, an imaging apparatus of the present invention includes a lens mount unit, a mirror box unit having a mount mounting base, and an imaging element unit in order from the subject side in the optical axis direction, and the lens is mounted on the mount mounting base. In the imaging apparatus in which the mount unit is connected and the imaging device unit is connected to the mirror box unit, a first chassis member and a second chassis member are connected to the mount mounting base, and the first chassis member A third chassis member is connected to the chassis member and the second chassis member.

  In order to achieve the above object, an imaging device of the present invention is connected to the mirror box unit via a mirror box unit having a mirror box and an imaging element unit connection portion, a chassis member, and the imaging element unit connection portion. In the imaging apparatus including the image sensor unit in order from the subject side in the optical axis direction, the image sensor unit includes a first beam connecting the mirror box unit and the image sensor unit connection portion, and the first beam is along the optical axis. It is characterized by.

  According to the present invention, downsizing can be realized and deformation of the mirror box can be prevented.

It is a front view of the imaging device concerning an embodiment of the invention. It is a front view of the imaging part which the imaging device of FIG. 1 has. It is a right view of the imaging part of FIG. 2A. It is a disassembled perspective view of the imaging device containing the imaging part of FIG. 2A. It is an enlarged view of the right side fastening part in FIG. 2A. FIG. 4B is a side view of FIG. 4A. FIG. 4B is a perspective view of FIG. 4A. It is sectional drawing which follows the IV-IV line in FIG. 4A. It is a back perspective view showing roughly the composition of the modification of the mirror box unit in Drawing 2A. It is a right view of the mirror box unit of FIG. 5A. It is a left view of the mirror box unit of FIG. 5A. It is a rear view of the mirror box unit of FIG. 5A. It is a top view of the mirror box unit of FIG. 5A. It is a disassembled perspective view of the imaging device containing the mirror box unit of FIG. 5A.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a front view of an imaging apparatus 100 according to an embodiment of the present invention. In FIG. 1, the imaging apparatus 100 includes a lens mount 103 (lens mount portion), a main mirror 108, a front exterior member 113, an upper exterior member 115, and a shutter button 117.

  The lens mount 103 has, for example, a bayonet mechanism, and connects a lens device (not shown) and the imaging device 100. The main mirror 108 is stored in a mirror box 202 described later, and guides a photographing light beam to a focusing screen (not shown). Further, the main mirror 108 is driven by a driving mechanism (not shown), and specifically, is driven to be able to move up and down. When the shutter button 117 is pressed, the main mirror 108 moves to a position where it is retracted from the photographing light beam.

  The imaging apparatus 100 includes an imaging unit 116a, the front exterior member 113 covers the subject side in the optical axis direction of the imaging unit 116a (see FIG. 2A), and the upper exterior member 115 covers the upper part of the imaging unit 116a. The front exterior member 113 is connected to a mirror box unit 202 described later via screws 324a, 324b, and 324c (see FIG. 3).

  The shutter button 117 is pressed at the time of shooting, and the imaging apparatus 100 starts the focus adjustment operation and the photometry operation as the shooting preparation operation when the pressing of the shutter button 117 is interrupted halfway (so-called half-press). The exposure operation is started when it is fully pressed (so-called full press).

  2A is a front view of the imaging unit 116a included in the imaging device 100 of FIG. 1, FIG. 2B is a right side view of the imaging unit 116a of FIG. 2A, and FIG. 3 includes the imaging unit 116a of FIG. 2 is an exploded perspective view of the imaging apparatus 100. FIG.

  2A and 2B, the imaging unit 116a includes a lens mount 103, a mirror box unit 202, an imaging element unit 204, a side chassis member 205 (first chassis member), a bottom chassis member 206a (third chassis member), and It has a bottom side chassis member 206 (integrated chassis member) composed of a side chassis member 206b (second chassis member), an electric circuit board 212, a tripod screw 218, and a shutter unit 219. In FIG. 3, the imaging apparatus 100 includes a substrate holding member 307, a pentaprism 310, a battery box unit 311, and a rear exterior member 314.

  The imaging unit 116a includes a lens mount 103, a mirror box unit 202, a shutter unit 219, an imaging element unit 204, and an electric circuit board 212 in order from the subject side in the optical axis direction. The mirror box unit 202 includes a circular mount mounting base 202c (see FIGS. 4A to 4D described later) centered on the optical axis, the mount mounting base 202c is disposed at a position corresponding to the lens mount 103, and A left side fastening portion 202a (first connection portion) and a right side fastening portion 202b (second connection portion) are provided. A side chassis member 205 is connected to the left side fastening portion 202a by a screw 323a, a side chassis member 206b is connected to the right side fastening portion 202b by a screw 323b, and a bottom chassis member 206a is a side chassis by a screw or the like (not shown). It is connected to the member 205 and the side chassis member 206b. That is, the side chassis member 205, the side chassis member 206b, and the bottom chassis member 206a form a “U-shaped” chassis. The bottom chassis member 206a is connected to the bottom of the mirror box unit 202 by screws 320a and 320b.

  Further, in the imaging apparatus 100, each of the side chassis member 205 and the side chassis member 206b is disposed between a plane including the bottom of the imaging apparatus 100 and the optical axis of the imaging apparatus 100 and parallel to the bottom of the imaging apparatus 100. .

  The image sensor unit 204 performs photoelectric conversion of light received through a lens device (not shown) attached to the lens mount 103. An image sensor such as a CMOS, CCD, or CID is used for the image sensor unit 204. The electric circuit board 212 is connected to the board holding member 307 and the battery box unit 311 by screws 325a, 325b, and 325c, and is connected to the image sensor unit 204 via a lead wire, a flexible printed board, etc. (all not shown). . An output signal output by photoelectric conversion performed by the image sensor unit 204 is processed by a processing circuit (not shown) provided on the electric circuit board 212. The electric circuit board 212 may transmit the output signal to another electric board circuit (not shown), and the other electric board circuit may process the output signal.

  The tripod screw 218 is disposed on the bottom chassis member 206a and is used when the imaging device 100 is fixed to the pan head. The shutter unit 219 includes a shutter front curtain (not shown) and a shutter rear curtain (not shown). Before the start of shooting, the shutter front curtain is in a position (hereinafter referred to as “light-shielding position”) that blocks the imaging light beam to the image sensor unit 204 and the rear shutter curtain does not block the imaging light beam to the image sensor unit 204 (hereinafter referred to as “light shielding position”). , Referred to as “exposure position”). When the shutter button 117 is pressed, the shutter front curtain moves from the light shielding position to the exposure position. Next, after the exposure time corresponding to the set shutter speed has elapsed, the shutter rear curtain at the exposure position moves to the light shielding position, and the imaging apparatus 100 completes shooting.

  The board holding member 307 fixes the electric circuit board 212 and the bottom side chassis member 206. For the substrate holding member 307, SUS, aluminum, iron, titanium, magnesium, resin, or the like is used, but it is preferable to use a resin in order to realize weight reduction. The pentaprism 310 guides the subject image formed on the focusing screen to a viewfinder eyepiece (not shown).

  The battery box unit 311 is connected to the side chassis member 205 by screws 322a and 322b in order to improve the overall rigidity of the imaging apparatus 100, and stores a lithium ion battery. The rear exterior member 314 is disposed at a position facing the front exterior member 113 in the imaging unit 116a, and protects the imaging unit 116a together with the front exterior member 113. For the front exterior member 113, the upper exterior member 115, and the rear exterior member 314, a metal such as SUS, aluminum, iron, titanium, or magnesium, or a resin is used. In particular, when improving the rigidity of each exterior member, it is preferable to use a metal, and when realizing the weight reduction of each exterior member, it is preferable to use resin.

  4A is an enlarged view of the right side fastening portion 202b in FIG. 2A, FIG. 4B is a side view of FIG. 4A, FIG. 4C is a perspective view of FIG. 4A, and FIG. 4D is taken along line IV-IV in FIG. It is sectional drawing which follows.

  4A to 4D, the right side fastening portion 202b of the plate-like member is disposed on the side surface of the mount mounting base portion 202c. The thickness of the right side fastening portion 202b is shorter than the length of the mount mounting base portion 202c in the optical axis direction, and there is a corner 402d between the right side fastening portion 202b and the mount mounting base portion 202c (FIG. 4C and FIG. 4). 4D). The left side fastening portion 202a has the same configuration as the right side fastening portion 202b and has the same effect.

  According to the imaging apparatus 100, since the side chassis member 205 and the side chassis member 206b are connected to the bottom chassis member 206a, an external force applied to the mount mounting base 202c via the lens mount 103 is applied to the side chassis member 205 and the side chassis. It is possible to prevent the external force from being applied only to the mirror box unit 202 by dispersing the member 206b from the bottom chassis member 206a, thereby preventing the mirror box unit 202 from being deformed. Further, the components of the imaging device 100 arranged around the mirror box unit 202, for example, the battery holder unit, the strobe base unit, the side frame unit, and the bottom frame unit are not connected to the mirror box unit 202 without being connected to the mirror box unit 202. Therefore, a space can be secured around the mirror box unit 202, and the image pickup apparatus can be further reduced in size by the space.

  Further, according to the imaging apparatus 100, the side chassis member 205 and the side chassis member 206b are connected to the mount mounting base 202c via the left side fastening part 202a and the right side fastening part 202b. The rigidity in the vicinity of 103 can be improved, so that the deformation of the mirror box unit 202 can be prevented.

  In the imaging apparatus 100 described above, each of the side chassis member 205 and the side chassis member 206b is disposed between a plane including the bottom of the imaging apparatus 100 and the optical axis of the imaging apparatus 100 and parallel to the bottom of the imaging apparatus 100. Therefore, as a result, the side chassis member 205 and the side chassis member 206b are reduced in size, and the weight of the camera can be reduced.

  In the imaging apparatus 100 described above, the bottom chassis member 206a and the side chassis member 206b constitute the bottom side chassis member 206. Therefore, the number of parts at the time of assembly can be reduced, and thus the time required for assembling the imaging apparatus can be reduced. Each of the bottom chassis member 206a and the side chassis member 206b may be an independent chassis member, or the side chassis member 205 and the bottom side chassis member 206 may be integrated from the beginning. In particular, the latter can further reduce the number of parts at the time of assembly, thereby further reducing the time required for assembling the imaging apparatus.

  Each chassis member (the bottom chassis member 206a and the side chassis members 205 and 206b) preferably has rigidity to prevent deformation of the mirror box unit 202. For example, the chassis member is made of a metal member such as SUS, aluminum, iron, titanium, and magnesium. It is preferable to become.

  Further, in the imaging device 100 described above, the thickness of the right side fastening portion 202b is shorter than the length of the mount attachment base portion 202c in the optical axis direction, and there is a corner 402d between the right side fastening portion 202b and the mount attachment base portion 202c. Since the left side fastening portion 202a has the same configuration as the right side fastening portion 202b, the right side fastening portion 202b is positively deformed at the corner portion 402d when an external force is applied to the lens mount 103. At the same time, the left side fastening portion 202a is actively deformed at the corner (not shown), so that the deformation caused by the external force is almost absorbed and the influence of the external force on the entire mirror box unit 202 can be reduced. .

  5A is a rear perspective view schematically showing a configuration of a modification of the mirror box unit 202 in FIG. 2A, FIG. 5B is a right side view of the mirror box unit 500 in FIG. 5A, and FIG. 5C is a mirror in FIG. 5D is a left side view of the box unit 500, FIG. 5D is a rear view of the mirror box unit 500 of FIG. 5A, FIG. 5E is a top view of the mirror box unit 500 of FIG. 5A, and FIG. 2 is an exploded perspective view of an imaging apparatus 100 including a unit 500. FIG.

  5A to 5E, the mirror box unit 500 includes a mirror box 501, image sensor unit connection portions 520a, 520b, and 520c, chassis member connection portions 521a, 521b, 521c, and 521d, first beams 522a, 522b, and 522c, Second beams 523a, 523b, 523c, and 523d, a third beam 525, and fourth beams 524a, 524b, and 524c are provided.

  In FIG. 6, the imaging apparatus 100 includes an imaging unit 116b. The imaging unit 116b includes a lens mount 103, a mirror box unit 500, a shutter unit 219, a chassis member 608, an imaging element unit 204, and an electric circuit board 212. A mirror chassis unit 500 is provided with a bottom chassis member 206a at the bottom of the mirror box unit 500 in order from the subject side in the optical axis direction.

  The bottom chassis member 206a is connected to the bottom of the mirror box unit 500 by screws 320a and 320b, and the chassis member 608 is connected to the battery box unit 311 by screws 328a and 328b and mirrored by screws 326a, 326b, 326c and 328c. Connected to the box unit 500, the electric circuit board 212 is connected to the battery box unit 311 by screws 325a and 325b and to the chassis member 608 by screws 325d.

  The image sensor unit 204 is connected to the mirror box unit 500 through the image sensor unit connection portions 520a, 520b, and 520c. The first beams 522a, 522b, and 522c connect the mirror box unit 500 and the image sensor unit connection portions 520a, 520b, and 520c, and are arranged along the optical axis. As a result, the external force applied to the mirror box unit 500 via the lens mount 103 is distributed to the first beams 522a, 522b, and 522c, and the external force is prevented from being applied only to the mirror box 501. The deformation of the box 501 can be prevented. In addition, the components of the imaging device arranged around the mirror box unit 500, such as a battery holder unit, a strobe base unit, a side frame unit, and a bottom frame unit, are connected to the mirror box unit without being connected to the mirror box unit 500. Rigidity can be ensured, so that a space can be secured around the mirror box unit 500, and further downsizing of the image pickup apparatus 100 can be realized by the space.

  The chassis member 608 is connected to the mirror box unit 500 via the chassis member connecting portions 521a, 521b, 521c, and 521d. The chassis member connection portions 521a, 521b, and 521c are not directly connected to the image sensor unit connection portions 520a, 520b, and 520c. The second beams 523a, 523b, 523c, and 523d connect the mirror box 501 and the chassis member connecting portions 521a, 521b, 521c, and 521d, and are less rigid than the mirror box 501. As a result, even when an external force is applied to the lens mount 103, the second beams 523a, 523b, 523c, and 523d are deformed before the mirror box 501, thereby reducing the influence of the external force on the mirror box 501.

  Further, the second beams 523c, 523d among the second beams 523a, 523b, 523c, 523d can contribute to the improvement of the rigidity of the mirror box unit 500 by supporting the mirror box 501, particularly the second beam 523a, 523b, 523c, 523d. The greater the moment of each cross section of the beams 523c and 523d, the greater the rigidity of the mirror box unit 500 can be improved. At this time, the cross-sectional secondary moment of the second beam 523d in which there is no adjacent imaging element unit connection portion may be larger than the cross-sectional secondary moment of the second beam 523c adjacent to the imaging element unit connection portion 520c. preferable. As a result, the second beam 523c is preferentially deformed over the second beam 523d, and the deformation of the chassis member connecting portion 521c is prevented from being transmitted to the mirror box unit 500 via the second beam 523c. be able to. Since the second beam 523d has no adjacent image sensor unit connection portion, the deformation of the chassis member connection portion 521d is transmitted to the mirror box unit 500 via the second beam 523d, and the mirror box unit 500 is deformed. Even in this case, deformation of the image sensor unit connection portions 520a, 520b, and 520c can be suppressed.

  Further, the third beam 525 connects the second beam 523c and the second beam 523d. As a result, the load applied to the second beam 523c can be distributed to the second beam 523d, and thus the apparent rigidity of the second beam 523c can be improved.

  The fourth beams 524a, 524b, and 524c connect the mirror box 501 and the first beams 522a, 522b, and 522c. Thereby, it is possible to suppress the first beams 522a, 522b, and 522c from being twisted by the moment about the optical axis applied to the mirror box unit 500, and thus the moment of the external force applied via the lens mount 103. The deformation of the mirror box unit 500 due to the

  Note that the first beams 522a, 522b, and 522c and the fourth beams 524a, 524b, and 524c are preferably disposed closer to the subject in the optical axis direction than the second beams 523a, 523b, 523c, and 523d. Thereby, the rigidity with respect to the external force applied via the lens mount 103 can be improved, and thus deformation of the mirror box unit 500 due to the external force can be prevented.

  While the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

100 Imaging device 103 Lens mount 202, 500 Mirror box unit 202c Mount mounting base 204 Image sensor unit 205 Side chassis member 206a Bottom chassis member 206b Side chassis member 501 Mirror box 520a, 520b, 520c Image sensor unit connection 521a, 521b, 521c , 521d Chassis member connection portion 522a, 522b, 522c First beam 523a, 523b, 523c, 523d Second beam 525 Third beam 524a, 524b, 524c Fourth beam 608 Chassis member

Claims (11)

A lens mount unit, a mirror box unit having a mount mounting base, and an image sensor unit are sequentially provided from the subject side in the optical axis direction. The lens mount unit is connected to the mount mounting base, and the image sensor is connected to the mirror box unit. In the imaging device to which the unit is connected,
A first chassis member and a second chassis member are connected to the mount mounting base, and a third chassis member is connected to the first chassis member and the second chassis member. Imaging device.   The imaging apparatus according to claim 1, further comprising an integrated chassis member in which the second chassis member and the third chassis member are integrated.   The imaging apparatus according to claim 2, wherein the integrated chassis member and the first chassis member are further integrated.   Each of the first chassis member and the second chassis member is disposed between a bottom portion of the imaging device and a plane parallel to the bottom portion including an optical axis of the imaging device. Item 4. The imaging device according to any one of Items 1 to 3. The mount mounting base portion includes a first connection portion to which the first chassis member is connected, and a second connection portion to which the second chassis member is connected.
Each of the first connection portion and the second connection portion is a plate-like member disposed on a side surface of the mount mounting base portion,
The thickness of each of the first connection part and the second connection part is shorter than the length of the mount mounting base part in the optical axis direction, and the thickness of each of the first connection part and the second connection part is The imaging apparatus according to any one of claims 1 to 4, further comprising a corner portion between the mount mounting base portion. Image pickup comprising a mirror box unit having a mirror box and an image sensor unit connection part, a chassis member, and an image sensor unit connected to the mirror box unit via the image sensor unit connection part in order from the subject side in the optical axis direction In the device
Comprising a first beam connecting the mirror box unit and the imaging element unit connection portion;
The imaging apparatus according to claim 1, wherein the first beam is along an optical axis. The mirror box unit has a chassis member connecting portion for connecting to the chassis member,
The imaging apparatus according to claim 6, further comprising a second beam that connects the mirror box and the chassis member connecting portion and has a rigidity smaller than that of the mirror box. There are a plurality of the second beams,
The cross-sectional secondary moment of one of the second beams adjacent to the image sensor unit connection portion is smaller than that of the other second beams away from the image sensor unit connection portion. The imaging device described.   The imaging apparatus according to claim 8, further comprising a third beam that connects the one second beam and the other second beam.   The imaging apparatus according to claim 6, further comprising a fourth beam connecting the mirror box and the first beam.   The imaging apparatus according to claim 10, wherein the first beam and the fourth beam are disposed closer to the subject side in the optical axis direction than the second beam.