JP2015204313A - Imprint device, plate, and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device that is advantageous to clean a pressurization finger for pressurizing a side surface of a mold.SOLUTION: The present invention relates to an imprint device that molds an imprint material on a substrate with a mold to form a pattern onto the substrate, the imprint device comprising: a holding part that holds the mold; a pressurization finger that pressurizes a side surface of the mold; and a control unit that cleans the pressurization finger while holding a plate for cleaning instead of the mold with the holding part. The holding part has a connection path communicating with a first opening part arranged on a surface of the plate in the holding part side while holing the plate, and allows gas in space around the plate to be exhausted thorough the connection path or the space around the plate to be supplied with gas thorough the connection path.

Description

  The present invention relates to an imprint apparatus, a plate, and an article manufacturing method.

  As miniaturization of semiconductor devices progresses, an imprint apparatus using nanoimprint technology has been put into practical use as a technology that enables mass production of microstructure devices based on design rules on the order of nanometers. The imprint apparatus forms a pattern by pressing a mold (original plate) having a nanoscale uneven structure against a resin (resist) on a substrate such as a wafer or a glass plate.

  In the imprint apparatus, a thermal cycle method or a photocuring method is put to practical use as a resin curing method, but in any case, the process until the mold pattern is transferred to the resin on the substrate is the same. . The imprint apparatus basically includes a mold holding unit that holds (fixes) a mold and a substrate holding unit that holds (fixes) a substrate.

  The pattern formed (transferred) by the imprint apparatus has a width of 10 nm to several tens of nm and is composed of fine lines having a height of several tens of nm. The surface is required to have a flatness of several tens of nm or less. In addition, the substrate and the mold are required to have a flatness (flatness) of several tens of nm or less even in a state of being held by the holding portions. Therefore, it is necessary to prevent particles (foreign matter) having a size of several tens of nanometers or more from being sandwiched between the mold and the mold holding unit or between the substrate and the substrate holding unit.

  Therefore, in the imprint apparatus, it is necessary to periodically clean the mold holding unit, and a technique relating to such cleaning has been proposed (see Patent Document 1). In Patent Document 1, a cleaning plate in which a grindstone material is molded instead of a substrate is held by a substrate holding unit, and the holding surface of the mold holding unit is brought into close contact with the upper surface of the plate so that the substrate holding unit (substrate stage) is attached. Move horizontally. By the friction between the plate held by the substrate holding portion and the holding surface of the mold holding portion, the unevenness of the holding surface and the adhered matter adhering to the holding surface can be removed.

JP 2012-186390 A

  However, in the prior art, the ground pieces and the adhered matter peeled off from the holding surface are scattered as particles by the friction between the cleaning plate and the holding surface of the mold holding portion. Furthermore, when a grinding material is applied to the surface of the cleaning plate, the grinding material is also scattered around as particles. If the particles thus scattered adhere to the mold or the mold holding part again, it causes imprint failure. For example, when such particles adhere to the pattern surface of the mold again, a defect is generated in a pattern formed on the substrate thereafter, and the quality is greatly deteriorated. In recent years, it has been required to clean a pressure finger that deforms the mold (pattern) by pressurizing the side surface of the mold, but when cleaning the pressure finger, it is the same as described above. Problems are likely to arise.

  An object of the present invention is to provide an imprint apparatus that is advantageous in cleaning a pressure finger that pressurizes a side surface of a mold.

  In order to achieve the above object, an imprint apparatus according to one aspect of the present invention is an imprint apparatus for forming a pattern on the substrate by forming an imprint material on the substrate with a mold. A holding unit for holding, a pressure finger for pressing a side surface of the mold, and a control unit for cleaning the pressure finger by holding a cleaning plate in the holding unit instead of the mold. The holding portion includes a connection path communicating with a first opening provided on a surface of the plate on the holding portion side in a state where the plate is held, and a space around the plate via the connection path Or a gas can be supplied to the space around the plate through the connection path.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an imprint apparatus that is advantageous for cleaning a pressure finger that pressurizes a side surface of a mold.

It is the schematic which shows the structure of the imprint apparatus as 1 side surface of this invention. It is the schematic which shows the structure of a pressure finger. It is a figure for demonstrating an imprint process. It is a figure which shows the pattern of a mold from the downward direction. It is a figure which shows an example of a structure of a cleaning plate. It is a figure which shows a mold holding part from the downward direction. It is a figure which shows a cleaning plate from upper direction. It is a figure which shows an example of a structure of a cleaning plate. It is a figure which shows an example of a structure of a cleaning plate. It is a figure which shows a mold holding part from the downward direction. It is a figure which shows the groove | channel as an example of the communicating path formed in a cleaning plate.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

<First Embodiment>
FIG. 1 is a schematic diagram illustrating a configuration of an imprint apparatus 100 according to one aspect of the present invention. The imprint apparatus 100 is a lithography apparatus that forms an imprint material on a substrate with a mold to form a pattern on the substrate. In this embodiment, the imprint apparatus 100 uses a resin as an imprint material, and employs a photocuring method in which the resin is cured by irradiation with ultraviolet rays (UV light) as a resin curing method. . However, the imprint apparatus 100 may cure the resin by irradiation with light in other wavelength ranges, or may employ a thermosetting method in which the resin is cured by other energy, for example, heat.

  The imprint apparatus 100 includes a light source 5, a substrate holding unit 7, a substrate stage 8, a mold holding unit 11, an imprint head 21, a resin supply unit 26, a pressure finger 33, and a cleaning unit 50. Have.

  The substrate holding unit 7 includes a substrate chuck that holds (sucks and holds) the substrate 6 and is disposed on the substrate stage 8. The substrate holding unit 7 moves relative to the mold 20 in accordance with the movement of the substrate stage 8.

  The mold 20 is held by a mold holding unit 11 disposed in an imprint head 21 that can move in the Z-axis direction (up and down). The mold 20 can contact (press) the resin on the substrate 6 according to the vertical movement of the imprint head 21. The mold 20 is made of a material (for example, quartz glass) that is transparent to ultraviolet rays that are light from the light source 5.

  Around the mold 20, a pressure finger 33 that applies pressure to the side surface of the mold 20 is disposed. The pressure finger 33 is configured to press the side surface of the mold 20 at a plurality of points to deform the mold 20 (pattern thereof). In the present embodiment, the pressure finger 33 includes a plurality of fingers 33a to 33n arranged so as to surround the mold 20 having a rectangular shape, as shown in FIG. Each of the fingers 33a to 33n can pressurize the side surface of the mold 20 at a plurality of independent points.

  The imprint process in the imprint apparatus 100 will be described with reference to FIG. As shown in FIGS. 3A and 3B, the substrate 6 held by the substrate holding part 7 is moved in the direction of the arrow and positioned under the mold 20 by the substrate stage 8.

  In the vicinity of the mold 20, a resin supply unit 26 that supplies (applies) the resin 4 on the substrate is disposed. The resin supply unit 26 includes a dispenser having a nozzle that discharges the resin 4 in the form of droplets. The droplet-shaped resin 4 discharged from the resin supply unit 26 lands on the surface of the substrate 6.

  On the lower surface (pattern surface) of the mold 20, a pattern 35 corresponding to the circuit pattern of the semiconductor device and the like is formed. As shown in FIG. 3B, after the relative alignment between the mold 20 supplied with the resin 4 and the substrate 6, the mold 20 is moved down as shown in FIG. It is brought into contact with the resin 4 (contacting with the substrate 6 leaving a gap of several nm). Thereby, the resin 4 is filled in the pattern 35 of the mold 20.

  In a state where the mold 20 and the resin 4 on the substrate are in contact with each other, the resin 4 is cured by irradiating the resin 4 with light from the light source 5 through the mold 20 as shown in FIG. As shown in FIG. 3D, a resin pattern 9 is formed on the substrate 6 by separating the mold 20 from the cured resin 4 on the substrate.

  The imprint apparatus 100 performs the above-described imprint process on the substrate 6 a plurality of times, and manufactures a semiconductor device by superimposing a plurality of patterns. However, since the pattern 35 of the mold 20 is generally distorted due to a manufacturing error when forming the pattern 35 and expansion and contraction due to a temperature change of the mold 20, the pattern formed on the substrate 6 is overlapped. An error occurs in the alignment.

  FIG. 4A and FIG. 4B are diagrams showing the pattern 35 of the mold 20 from below. With reference to FIG. 4A and FIG. 4B, correction of the distortion (shape) of the pattern 35 of the mold 20 will be described. As shown in FIG. 4A, the mold 20 is positioned with respect to the substrate 6 with the pattern 35 having distortion. However, as described above, the pressure fingers 33 are arranged around the mold 20. Each of the pressure fingers 33 can apply a pressure of up to 1000 N against the side surface of the mold 20. The mold 20 is generally made of a crystal material such as quartz glass. However, if a pressure of 1000 N is applied, the pattern 35 of the mold 20 can be deformed by several ppm. For example, consider a case where the pattern 35 of the mold 20 is distorted into a barrel shape as shown in FIG. In this case, as shown in FIG. 4B, if the side surface of the mold 20 is pressed by the pressure finger 33 so that the mold 20 is deformed into a pincushion mold, the barrel distortion of the pattern 35 of the mold 20 is caused. It can be corrected.

  Since the pressure finger 33 requires precise drive control of 1 nm or less, the surface of the pressure finger 33 that comes into contact with the mold 20 is precisely finished. Further, if particles (foreign matter) are sandwiched between the pressure finger 33 and the mold 20, a concentrated load is generated when the side surface of the mold 20 is pressed, and the mold 20 may be damaged. Therefore, the pressure finger 33 (the surface that contacts the mold 20) needs to be periodically cleaned.

  Therefore, the imprint apparatus 100 includes a cleaning unit 50 that functions as a control unit that cleans the pressure fingers 33. For example, the cleaning unit 50 includes a transfer mechanism for holding the cleaning plate 1 on the mold holding unit 11 instead of the mold 20, a CPU and a memory for controlling members related to cleaning of the pressure fingers 33, and the like. FIG. 5 is a view showing an example of the configuration of the cleaning plate 1 used for cleaning the pressure finger 33, specifically, the surface of the pressure finger 33 that contacts the mold 20. As shown in FIG. The cleaning plate 1 is, for example, a cleaning plate that has the same external dimensions as the mold 20 and is held (adsorbed) by the mold holding unit 11 instead of the mold 20 when cleaning is performed. The mold holding unit 11 is fixed to the imprint head 21. Accordingly, as the imprint head 21 moves, the cleaning plate 1 and the mold holding unit 11 move together.

  As shown in FIGS. 5 and 6, ribs 12 a and 12 b that support the cleaning plate 1 and the mold 20 are formed in the mold holding unit 11. FIG. 6 is a view showing the mold holding unit 11 from below. Referring to FIG. 6, the ribs 12b are formed in a circumferential shape, and suction paths 22 for sucking and holding the mold 20 and the cleaning plate 1 are formed inside the ribs 12b. The suction path 22 is connected to the first suction device 501 via a connection pipe 24 formed in the imprint head 21. As shown in FIG. 5, the space surrounded by the cleaning plate 1 (or the mold 20) held by the mold holding unit 11 and the ribs 12 b is a closed space 13. Therefore, the cleaning plate 1 (or the mold 20) is sucked (fixed) by lowering the pressure of the closed space 13 below the external pressure by the first suction device 501.

  Here, since the closed space 13 formed by the rib 12b is a closed space that cannot be sucked or exhausted except through the adsorption path 22, the first suction device 501 connected to the connecting pipe 24 is a closed space. Once 13 is brought into the negative pressure state, it is not necessary to continue the suction thereafter. Therefore, the first suction device 501 does not need to be a suction device including an exhaust pump, and can be replaced with a constant pressure container such as a negative pressure tank.

  As shown in FIG. 5, the first opening 2 a is formed on the surface (upper surface) of the cleaning plate 1 held by the mold holding unit 11 on the mold holding unit side, and the second opening 2 b is formed on the side surface of the cleaning plate 1. Is formed. The cleaning plate 1 is formed with a communication path 3 that communicates the first opening 2a and the second opening 2b.

  On the other hand, as shown in FIG. 6, ribs 12a are formed in the mold holding part 11 so as to surround the ribs 12b. As shown in FIG. 5, a connection path 23 communicating with the communication path 3 (the first opening 2 a and the second opening 2 b) is formed between the rib 12 b and the rib 12 a independently of the suction path 22. Has been. The connection path 23 is connected to a second suction device (exhaust unit) 502 via a connection pipe 25 formed in the imprint head 21. The second suction device 502 lowers the internal pressure of the connection path 23 to be lower than the external pressure, so that the periphery of the second opening 2b, that is, the cleaning plate, is connected via the communication path 3, the connection path 23, and the connection pipe 25. The space around 1 can be sucked (exhausted).

  When cleaning the pressure finger 33, the surface of the pressure finger 33 that contacts the mold 20, in this embodiment, the pressure pad 34 and the side surface of the cleaning plate 1 are slid and friction is applied to the pressure pad 33. The deposit | attachment adhering to 34 is removed. Therefore, particles generated (scattered) by sliding the pressure pad 34 and the side surface of the cleaning plate 1 may mainly adhere to the pressure pad 34, the cleaning plate 1 and their peripheral members. . Therefore, the vicinity (the space around the cleaning plate 1) where many particles are present is sucked through the connection path 23 (and the communication path 3 provided in the cleaning plate 1) provided in the mold holding unit 11. Thereby, particles present in the space around the cleaning plate 1 can be collected (removed).

  As shown in FIG. 7, a plurality of second openings 2 b are formed on each side surface of the cleaning plate 1. Each of the plurality of second openings 2 b communicates with a corresponding first opening 2 a formed circumferentially on the upper surface of the cleaning plate 1 via the communication path 3. Since the 1st opening 2a is formed in the area | region between the rib 12b formed in the mold holding | maintenance part 11, and the rib 12a (refer FIG. 6), all the 2nd openings 2b are the communication path 3, the connection path 23 and the connecting pipe 25 are sucked by the second suction device 502. Here, FIG. 7 is a view showing the cleaning plate 1 from above.

  Further, the opening sucked by the second suction device 502 is not limited to the second opening 2 b formed on the side surface of the cleaning plate 1. The cleaning plate 1 can clean not only the pressure pad 34 of the pressure finger 33 but also the mold holder 11. As shown in FIG. 1, the cleaning plate 1 is in contact with the ribs 12 a and 12 b of the mold holding unit 11. Therefore, if the cleaning plate 1 is moved relative to the mold holding unit 11 while the mold holding unit 11 holds the cleaning plate 1, the deposits attached to the ribs 12 a and 12 b are also removed. Can do. In other words, the deposits attached to the ribs 12a and 12b due to the friction between the mold holding part 11 and the upper surface of the cleaning plate 1 can be removed. Since the deposits removed from the ribs 12a and 12b scatter around as particles, there are many particles in the vicinity of the upper surface of the cleaning plate 1.

  Therefore, as shown in FIG. 8, the cleaning plate 1 is provided with the second opening 2 a on the side surface, and communicates with the communication path 3 on the upper surface (the region between the first opening 2 a and the outer periphery of the cleaning plate 1). A third opening 2c may be provided. Accordingly, it is possible to suck the vicinity of the upper surface of the cleaning plate 1 where many particles exist through the third opening 2c (communication path 3), and the particles can be collected (removed). FIG. 8 is a diagram illustrating an example of the configuration of the cleaning plate 1.

  However, the particles attached to the surrounding members of the cleaning plate 1 may be firmly attached to the surrounding members due to static electricity caused by friction or the like. There is a possibility that such particles cannot be collected by simply sucking around the cleaning plate 1.

  Therefore, as shown in FIG. 5, the second suction device 502 is configured to be switchable with a gas supply device (gas supply unit) 503. The gas supply device 503 is connected to the communication path 3 via the connection pipe 25 and the connection path 23. Before performing cleaning using the cleaning plate 1, the gas supply device 503 supplies gas (pressurized gas) to the space around the cleaning plate 1 through the connection pipe 25, the connection path 23, and the communication path 3. . Thereby, the gas from the gas supply device 503 is ejected from the second opening 2b (and the third opening 2c), and the particles adhering to the members around the cleaning plate 1 can be peeled off. Such particles are collected (removed) by suctioning the space around the cleaning plate 1 (in the vicinity of the second opening 2b and the third opening 2c) by the second suction device 502.

  Further, the gas supply device 503 may include an ionizer and supply a gas including ions for performing static elimination to the space around the cleaning plate 1. By cleaning the charged particles adhering to the members around the cleaning plate 1 by spraying a gas charged to the opposite charge and removing the charge, the adhesion of the particles is reduced, so that cleaning can be performed effectively. it can.

<Second Embodiment>
FIG. 9 is a diagram illustrating an example of the configuration of the cleaning plate 1. Referring to FIG. 9, the communication path 3 formed in the cleaning plate 1 is filled with a porous member 10. On the other hand, a rib 12c is formed in the mold holding part 11 so as to surround the rib 12a. Further, a first connection path 23a connected to the communication path 3 is formed between the rib 12c and the rib 12b, and a second connection path 23b connected to the communication path 3 is formed between the rib 12b and the rib 12a. Is formed. The first connection path 23 a is connected to the liquid supply device 901 via a first connection pipe 25 a formed in the imprint head 21. The second connection path 23 b is connected to the liquid recovery apparatus 902 via a second connection pipe 25 b formed in the imprint head 21.

  When cleaning the pressure finger 33, the liquid (cleaning liquid) is supplied from the liquid supply device 901 to the porous member 10 filled in the communication path 3 through the first connection pipe 25a and the first connection path 23a. Then, the pressure pad 34 is cleaned. At this time, the pressure pad 34 and the cleaning plate 1 (porous member 10) may be slid together. As a result, it is possible to wash away the adhering matter adhering to the pressure pad 34. The liquid supplied from the liquid supply device 901 to the porous member 10 (that is, the liquid containing the deposits washed away from the pressure pad 34 as particles) passes through the second connection path 23b and the second connection pipe 25b. The liquid is recovered by the liquid recovery device 902. Thus, cleaning can be performed more effectively by simultaneously supplying and collecting the liquid to the communication path 3 (porous member 10).

<Third Embodiment>
In the first embodiment, the region between the rib 12b and the rib 12a formed in the mold holding part 11 is one ring-shaped region. However, the region between the rib 12b and the rib 12a may be divided into a plurality of blocks by the rib 12d as shown in FIG. By providing a suction device, a liquid supply device, and a liquid recovery device for each of the blocks thus divided, the cleaning by each block can be controlled independently. In other words, particles existing around the cleaning plate 1 through the communication path 3 of each block can be collected independently. As a result, it is possible to improve the degree of freedom of cleaning, such as performing only cleaning by one block and not performing cleaning by the other three blocks.

  So far, the communication path 3 formed in the cleaning plate 1 has been described as a hole formed in the cleaning plate 1, but the communication path 3 is not limited to the hole. For example, as shown in FIGS. 11A and 11B, a groove 17 that extends over the upper surface and side surfaces of the cleaning plate 1 may be formed as the communication path 3. FIG. 11B shows a cross section of the groove 17 as the communication path 3. Referring to FIG. 11B, a part of the groove 17 is connected to a connection path 23 formed in the mold holding part 11b. As described above, the connection path 23 is connected to the second suction device 502 via the connection pipe 25. Accordingly, the space around the cleaning plate 1 can be sucked through the groove 17, the connection path 23, and the connection pipe 25. Further, even if the groove 17 is filled with a porous member, the space around the cleaning plate 1 can be sucked in the same manner.

  Thus, in the imprint apparatus 100, particles existing around the cleaning plate 1 can be removed. However, the second suction device 502 (suction unit), the liquid supply device 901 (liquid supply unit), and the liquid recovery device 902 (liquid recovery unit) are not necessarily configured on the imprint apparatus side. Although it has been described that the cleaning plate 1 has the same outer dimensions as the mold 20, the outer dimensions of the mold 20 are, for example, 150 mm square and a thickness of several mm. Accordingly, the second suction device 502, the liquid supply device 901, the liquid recovery device 902, and the like can be configured inside the cleaning plate 1. In other words, the cleaning plate 1 may incorporate a decompression unit for decompressing the communication path 3. Further, if the cleaning plate 1 is configured with an outer dimension larger than that of the mold 20 as long as it does not interfere with surrounding members, a larger apparatus can be configured inside the cleaning plate 1.

  A method for manufacturing a device (semiconductor device, magnetic storage medium, liquid crystal display element, etc.) as an article will be described. Such a manufacturing method includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate, etc.) using the imprint apparatus 100. The manufacturing method further includes a step of processing the substrate on which the pattern is formed. The processing step may include a step of removing the remaining film of the pattern. Further, it may include other known steps such as a step of etching the substrate using the pattern as a mask. The method for manufacturing an article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 100: Imprint apparatus 11: Mold holding part 33: Pressure finger 50: Cleaning part 2a: 1st opening 23: Connection path

Claims (15)

An imprint apparatus for forming a pattern on the substrate by forming an imprint material on the substrate with a mold,
A holding part for holding the mold;
A pressure finger for pressing the side surface of the mold;
A control unit for cleaning the pressure finger by holding a cleaning plate in the holding unit instead of the mold,
The holding portion includes a connection path that communicates with a first opening provided on a surface of the plate on the holding portion side in a state where the plate is held;
An imprint apparatus, wherein the space around the plate can be exhausted via the connection path, or gas can be supplied to the space around the plate via the connection path. The holding part includes a suction path for sucking and holding the mold and the plate,
The imprint apparatus according to claim 1, wherein the connection path is formed independently of the suction path. The connection path communicates with a communication path that communicates the first opening and a second opening provided on a side surface of the plate in a state where the plate is held;
The imprint apparatus according to claim 1, further comprising an exhaust unit that is connected to the connection path and exhausts a space around the plate through the connection path and the communication path. The connection path communicates with a communication path that communicates the first opening and a second opening provided on a side surface of the plate in a state where the plate is held;
4. The apparatus according to claim 1, further comprising a gas supply unit that is connected to the connection path and supplies gas to a space around the plate via the connection path and the communication path. The imprint apparatus described in 1.   The imprint apparatus according to claim 4, wherein the gas includes ions for performing charge removal in the space. The connection path communicates with a third opening provided in a region between the first opening and the outer periphery of the plate on the surface of the holding part side of the plate in a state where the plate is held;
The imprint apparatus according to claim 1, wherein the control unit cleans the holding unit in addition to the pressure finger. An imprint apparatus for forming a pattern on the substrate by forming an imprint material on the substrate with a mold,
A holding part for holding the mold;
A pressure finger for pressing the side surface of the mold;
A control unit for cleaning the pressure finger by holding a cleaning plate in the holding unit instead of the mold,
The holding portion communicates with a communication path that communicates a first opening provided on a surface of the plate on the holding portion side and a second opening provided on a side surface of the plate in a state where the plate is held. Including connections,
An imprint apparatus, wherein a liquid can be supplied to the communication path via the connection path and the liquid supplied to the communication path via the connection path can be recovered. The connection path includes a first connection path and a second connection path communicating with the communication path,
A liquid supply unit connected to the first connection path and supplying the liquid via the first connection path;
The imprint apparatus according to claim 7, further comprising: a liquid recovery unit that is connected to the second connection path and recovers the liquid via the second connection path.   The imprint apparatus according to claim 3, further comprising a porous member filled in the communication path. In the imprint apparatus which has a holding part which holds a mold, and a pressure finger which pressurizes the side of the mold, and forms a pattern on the substrate by forming an imprint material on the substrate with the mold, A cleaning plate that is held by the holding portion instead of the mold when cleaning the pressure finger,
A first opening that is provided on a surface of the plate on the holding unit side and communicates with a connection path provided in the holding unit while being held by the holding unit;
The plate characterized by being capable of exhausting the space around the plate through the connection path or supplying gas to the space around the plate through the connection path. A second opening provided on a side surface of the plate;
The plate according to claim 10, further comprising a communication path that communicates the first opening and the second opening.   The plate according to claim 11, wherein the communication path includes a hole formed in the plate.   The plate according to claim 11, wherein the communication path includes a groove formed on a surface of the plate on the holding portion side and the side surface of the plate.   The plate according to claim 11, wherein the plate includes a decompression unit that decompresses the communication path. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 9,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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