JP2015197570A - Manufacturing method of electro-optical device and substrate connection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electro-optical device capable of suppressing heat deterioration of an electro-optical layer due to heat at the time of connection of a wiring board to a terminal of a substrate, and further to provide a substrate connection device.SOLUTION: A region where a terminal 102 and a wiring board 60 overlap with each other via an anisotropic conductive film 70 is pressed from a wiring board 60 side by a pressurization head 250 heated while the other surface 10t side of a first substrate 10 is being supported by a stage 240 when the wiring board 60 is connected to the terminal 102 of the first substrate 10 constituted of a silicon substrate. The stage 240 includes: a metal first stage 210 supporting an electro-optical layer arrangement region 10d of the first substrate 10; a quartz second stage 220 supporting a formation region of the terminal 102 of the first substrate 10; and a quartz third stage 230 supporting the other surface 10t side of the first substrate 10 at a position spaced apart from the second stage 220 between the first stage 210 and the second stage 220.

Description

The present invention relates to a method for manufacturing an electro-optical device in which a wiring board is connected to a terminal of the substrate, and a substrate connecting apparatus used for connecting the terminal of the substrate and the wiring substrate.

As shown in FIG. 12, the electro-optical device 100 is provided with an electro-optical layer 50 on the one surface 10 s side of the first substrate 10, and the electro-optical layer arrangement region 10 provided with the electro-optical layer 50.
The display area 10a is configured by d. Here, when the electro-optical device 100 is a liquid crystal device, the electro-optical layer 50 is a liquid crystal layer, and when the electro-optical device 100 is an organic electroluminescence device, the electro-optical layer 50 is a light emitting layer or the like. In the electro-optical device 100, in the substrate connecting step, the terminal 102 provided between the electro-optical layer arrangement region 10d (display region 10a) and the side surface 10e (substrate side surface) in the one surface 10s side of the first substrate 10. The wiring board 60 is connected to the first board 10 and signals are supplied to the first board 10 through the wiring board 60.

In such a substrate connection process, the terminal 102 and the wiring substrate 60 are overlapped with each other via the anisotropic conductive film 70 by the heated pressure head 250 while the other surface 10t side of the first substrate 10 is supported by the stage 240. The area is pressed from the wiring board 60 side. Here, the stage 240 includes a first stage 210 that supports a region including the display region 10 a on the other surface 10 t side of the first substrate 10, and a region where the terminal 102 is formed at a position away from the first stage 210. The structure provided with the 2nd stage 220 to support is proposed (patent documents 1, 2).
reference).

JP 2001-201727 A Japanese Patent No. 4014481

In the substrate connecting apparatuses described in Patent Documents 1 and 2, for example, if the first stage 210 is made of stainless steel and the second stage 220 is made of quartz, the second stage 220 is more thermally conductive than the first stage 210. Low. Therefore, when the first substrate 10 is a quartz substrate, the terminal 10
While heat is unlikely to escape from the formation region 2 to the second stage 220, heat that travels through the first substrate 10 toward the display region 10 a (electro-optic layer 50) may be released to the first stage 210 side. it can. Therefore, a large temperature difference is generated between the temperature of the anisotropic conductive film 70 and the temperature of the electro-optic layer 50. Therefore, even when the temperature of the anisotropic conductive film 70 reaches 180 ° C., the temperature of the electro-optic layer 50 is 80 ° C. or less, and thus the electro-optic layer 50 can be prevented from being thermally deteriorated.

However, when the first substrate 10 is a semiconductor substrate such as a silicon substrate, the first substrate 1
When the thermal conductivity of 0 itself is high, heat is easily transmitted through the first substrate 10, so that not only the temperature of the anisotropic conductive film 70 is hardly increased, but also the temperature of the anisotropic conductive film 70 Electro-optic layer 50
The difference from the temperature is small. Therefore, when the heating temperature by the pressure head 250 is increased and the temperature of the anisotropic conductive film 70 is increased to 180 ° C., the temperature of the electro-optical layer 50 exceeds 80 ° C., and the electro-optical layer 50 is heated. There is a problem of deterioration.

In view of the above problems, the present invention is based on the heat generated when connecting the wiring board to the terminals of the board.
An object of the present invention is to provide a method of manufacturing an electro-optical device and a substrate connecting device that can suppress thermal degradation of the electro-optical layer.

In order to solve the above-described problem, the present invention provides a first substrate in which a terminal is provided between an electro-optic layer arrangement region in which an electro-optic layer is arranged on one side and a substrate side surface, and is connected to the terminal. In the substrate connecting step of connecting the wiring substrate to the terminal, the electro-optical layer arrangement region of the other surface side of the first substrate overlaps with the terminal. The region is supported by the first stage, and at a position away from the first stage, the second stage whose thermal conductivity is lower than the thermal conductivity of the first stage, among the other surface side of the first substrate, The region where the terminal overlaps is supported, and the thermal conductivity of the first stage is between the first stage and the second stage so as to be separated from the second stage. Less than that of the second stage The conductivity equal to or higher than the third stage,
A region in which the terminal and the wiring board overlap is pressed from the wiring board side by a heated pressure head while the other surface side of the first board is supported.

Further, the present invention is a board connecting apparatus for connecting a wiring board to a terminal provided between an electro-optic layer arrangement region where an electro-optic layer is arranged on one side of a first board and the side of the board, A first stage that supports a region of the other surface side of the first substrate that overlaps the electro-optic layer arrangement region;
Supporting a region overlapping the region where the terminals are provided on the other surface side of the first substrate at a position separated from the first stage, the thermal conductivity is less than the thermal conductivity of the first stage. And supporting the other surface side of the first substrate at a position spaced from the second stage between the first stage and the second stage, and the thermal conductivity of the first stage is Pressurization that heats a third stage that is less than thermal conductivity and equal to or higher than the thermal conductivity of the second stage, and pressurizes a region where the terminal and the wiring board overlap from the wiring board side. And a head.

In the present invention, the second stage has lower thermal conductivity than the first stage. For this reason, it is difficult for heat to escape from the region where the terminals are formed on the first substrate to the second stage, and between the first stage and the second stage, the second stage is disposed at a position away from the second stage. The three stages have lower thermal conductivity than the first stage. For this reason, heat hardly escapes from the region where the terminals are formed on the first substrate to the third stage. On the other hand, the heat that travels through the first substrate toward the electro-optic layer arrangement region can be released to the first stage side. Therefore,
Since the temperature difference between the region where the terminal is formed and the electro-optical layer is large, the temperature of the electro-optical layer is low even if the region where the terminal is formed and the terminal is sufficiently heated. Therefore, it is possible to suppress thermal degradation of the electro-optic layer due to heat generated when connecting the wiring board to the terminals of the board.

The present invention is effective when applied to the case where the first substrate is a semiconductor substrate. When the first substrate is a semiconductor substrate, heat is easily transferred to the electro-optic layer because the semiconductor substrate has high thermal conductivity. However, according to the present invention, since the third stage is provided, the terminal is formed. The temperature difference between the area and the electro-optic layer is large. For this reason, it is possible to suppress thermal degradation of the electro-optic layer due to heat generated when the wiring board is connected to the terminals of the board.

In the present invention, the temperature of the first stage is lower than the temperature of the second stage while pressurizing the region where the terminal and the wiring board overlap with the pressurizing head, and the temperature of the third stage Preferably, the temperature is equal to or lower than the temperature of the second stage, and the temperature of the third stage is equal to or higher than the temperature of the first stage. According to such a configuration, it is possible to suppress thermal degradation of the electro-optic layer due to heat when the wiring board is connected to the terminals of the board.

In the method for manufacturing an electro-optical device according to the present invention, in the substrate connecting step, the pressure head causes the terminal and the terminal to be in contact with a heat dissipation member between the electro-optical layer arrangement region and the terminal. It is preferable to pressurize the area where the wiring board overlaps. Moreover, the board | substrate connection apparatus which concerns on this invention WHEREIN: It is preferable to further have a thermal radiation member contact | abutted between the said electro-optical layer arrangement | positioning area | region and the said terminal among the said one surfaces of a said 1st board | substrate. According to this configuration, heat that is transmitted to the electro-optic layer through the first substrate can be released to the heat radiating member. Therefore, the temperature rise of the electro-optic layer can be suppressed without directly contacting the heat radiating member to the electro-optic layer. In addition, since the heat dissipation member is brought into contact with the first substrate that transmits heat toward the electro-optic layer, and the heat that is transmitted to the electro-optic layer is released to the heat dissipation member, the temperature increase of the electro-optic layer is effectively suppressed. be able to. Therefore, thermal degradation of the electro-optic layer can be suppressed.

In the present invention, it is preferable that the heat radiating member abuts on the one surface of the first substrate in a state of being urged toward the first substrate by the urging member. According to this configuration, since the heat dissipation member does not contact the first substrate with an excessive force, damage to the first substrate can be prevented.
Moreover, since the heat dissipation member is in close contact with the first substrate, the thermal conductivity between the first substrate and the biasing member can be enhanced.

In this invention, it is preferable that the said heat radiating member is hold | maintained at the said pressurization head via the said urging | biasing member. According to this configuration, when the pressure head moves toward the first substrate,
The urging member and the heat radiating member also move in conjunction with the pressure head, and the heat radiating member is urged toward the first substrate by the urging member. Therefore, a driving mechanism for the heat radiating member is unnecessary.

In the present invention, it is preferable that the urging member abuts on the first substrate via a protective sheet. According to such a configuration, even when a wiring or the like is provided between the display region and the terminal on the one surface side of the first substrate, the wiring or the like can be prevented from being damaged by the heat dissipation member.

In the present invention, in the substrate connection step, it is preferable that the electro-optic layer is cooled from the side opposite to the side where the first substrate is located. According to such a configuration, the temperature increase of the electro-optic layer can be further suppressed, so that thermal degradation of the electro-optic layer can be suppressed.

In the present invention, in the substrate connecting step, it is preferable to cool a portion of the stage that overlaps the display area in plan view. According to such a configuration, the temperature increase of the electro-optic layer can be further suppressed, so that thermal degradation of the electro-optic layer can be suppressed.

The present invention is effective when applied to a case where the electro-optical device is a liquid crystal device. The liquid crystal device includes a second substrate disposed on the one surface side of the first substrate via a sealing material, and the electro-optic layer is between the first substrate and the second substrate. It is a liquid crystal layer provided at a position surrounded by the sealing material. For this reason, since the liquid crystal layer is covered with the second substrate on the side opposite to the first substrate, it is difficult to radiate heat from the second substrate side. However, in the present invention, even if the region where the terminals are formed and the region where the terminals are formed is sufficiently heated, the temperature of the electro-optic layer is low. It can suppress that a layer heat-degrades.

It is explanatory drawing of an example of the electro-optical apparatus with which this invention is applied. It is explanatory drawing which shows typically the principal part structure of the board | substrate connection apparatus which concerns on Embodiment 1 of this invention. It is explanatory drawing of the stage used for the board | substrate connection apparatus to which this invention is applied. It is explanatory drawing which shows typically the flow of the heat | fever in the board | substrate connection apparatus which concerns on Embodiment 1 of this invention. It is explanatory drawing which shows typically the principal part structure of the board | substrate connection apparatus which concerns on Embodiment 2 of this invention. In the board | substrate connection apparatus which concerns on Embodiment 2 of this invention, it is explanatory drawing which shows typically the form which connected the pressurization head and the heat radiating member via the biasing member. It is explanatory drawing which shows typically the flow of the heat | fever in the board | substrate connection apparatus which concerns on Embodiment 2 of this invention. It is explanatory drawing which shows typically the principal part structure of the board | substrate connection apparatus which concerns on Embodiment 3 of this invention. It is explanatory drawing which shows typically the principal part structure of the board | substrate connection apparatus which concerns on Embodiment 4 of this invention. It is explanatory drawing which shows typically the principal part structure of the board | substrate connection apparatus which concerns on Embodiment 5 of this invention. It is a schematic block diagram of an example of the projection type display apparatus (electronic device) to which this invention is applied. It is explanatory drawing which shows typically the principal part structure of the board | substrate connection apparatus which concerns on the reference example of this invention.

Embodiments of the present invention will be described below. In the drawings to be referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

[Embodiment 1]
(Configuration of electro-optical device)
FIG. 1 is an explanatory diagram of an example of an electro-optical device 100 to which the present invention is applied.
FIG. 5B is a plan view of the electro-optical device 100 as viewed from the second substrate 20 side along with each component, and a cross-sectional view thereof taken along line HH ′.

The electro-optical device 100 shown in FIGS. 1A and 1B is a liquid crystal device, and the liquid crystal panel 100.
p. In the liquid crystal panel 100p (electro-optical device 100), the first substrate 10 (element substrate) and the second substrate 20 (counter substrate) are bonded together with a sealing material 107 with a predetermined gap therebetween. The two substrates 20 are provided in a frame shape along the outer edge. The sealing material 107 is an adhesive made of a photo-curing resin, a thermosetting resin, or the like, and a gap material 10 such as glass fiber or glass beads for setting the distance between both substrates to a predetermined value.
7a is blended. In the liquid crystal panel 100p, the electro-optic layer 50 made of a liquid crystal layer is disposed in a region surrounded by the sealant 107 between the first substrate 10 and the second substrate 20.
Is provided. Therefore, in this embodiment, the region surrounded by the sealing material 107 is the electro-optical layer arrangement region 10d. The sealing material 107 is formed with a discontinuous portion used as the liquid crystal injection port 107c. The liquid crystal injection port 107c is sealed with a sealing material 107d after the liquid crystal material is injected.

In the electro-optical device 100, each of the first substrate 10 and the second substrate 20 is a quadrangle, and the first substrate 10 includes two side surfaces 10g and 10h (substrate side surfaces) that face each other in the X direction (first direction). Two side surfaces 10e and 10f (substrate side surfaces) facing each other in the Y direction (second direction) are provided. The second substrate 20 includes two side surfaces 20g and 20h that face each other in the X direction, and two side surfaces 20e and 20f that face each other in the Y direction.

A display area 10a including the electro-optic layer 50 is provided as a square area substantially at the center of the electro-optical device 100, and a sealing material 107 is also provided in a substantially square shape corresponding to the shape. The outer side of the display area 10a is a square frame-shaped outer peripheral area 10c.

In this embodiment, the first substrate 10 has a larger planar size than the second substrate 20. For this reason, the first substrate 10 has an overhang region 11 projecting from the side surface 20e of the second substrate 20, and the overhang region 11 is located on one side of the first substrate 10 in the Y direction. And display area 1
It is located between 0a.

Of the one surface 10 s and the other surface 10 t of the first substrate 10, on the side of the one surface 10 s facing the second substrate 20, a plurality of terminals 102 are provided in the overhang region 11 along the side surface 10 e of the first substrate 10. Is formed. Accordingly, the plurality of terminals 102 are provided on one surface 10 s of the first substrate 10.
Are formed between the display region 10a and the side surface 10e. In this embodiment, terminal 1
02 is made of a conductive film such as an ITO film. Further, on one surface 10s of the first substrate 10, a data line driving circuit 101 is formed between the terminal 102 and the display region 10a, and scanning lines are formed along each of the other side surfaces 10g and 10h adjacent to the side surface 10e. A drive circuit 104 is formed.

The terminal 102 is connected to the display region 1 from the edge on the side surface 10e side on the one surface 10s of the first substrate 10.
It is provided at a position separated on the 0a side. A wiring substrate 60 made of a flexible wiring substrate or the like is connected to the terminal 102 by an anisotropic conductive film 70 or the like. Various potentials and various signals are connected to the first substrate 10 from an external control circuit via the wiring substrate 60. Is entered.

On the one surface 10s side of the first substrate 10, pixel electrodes 9a and pixel transistors (not shown) are arranged in a matrix in the display region 10a. Therefore, the display area 10a
Is configured as a pixel electrode arrangement region 10p in which the pixel electrodes 9a are arranged in a matrix. In the first substrate 10 having such a configuration, an alignment film 16 is formed on the upper layer side of the pixel electrode 9a. On the side of one surface 10 s of the first substrate 10, a rectangular frame-shaped peripheral region 1 sandwiched between the display region 10 a and the sealing material 107 in the outer peripheral region 10 c outside the display region 10 a.
A dummy pixel electrode 9b formed simultaneously with the pixel electrode 9a is formed at 0b.

A common electrode 21 is formed on the side of the one surface 20 s facing the first substrate 10 out of the one surface 20 s and the other surface 20 t of the second substrate 20. The common electrode 21 is formed across the plurality of pixels 100a as substantially the entire surface of the second substrate 20 or as a plurality of strip electrodes. In this embodiment, the common electrode 21 is formed on substantially the entire surface of the second substrate 20.

A light shielding layer 29 is formed on the lower side of the common electrode 21 on the one surface 20 s side of the second substrate 20, and an alignment film 26 is laminated on the surface of the common electrode 21. The alignment films 16 and 26 are made of polyimide or an inorganic alignment film. In this embodiment, the alignment films 16 and 26 are made of, for example, SiO _x (x
<2) An obliquely deposited film (inorganic alignment film) such as SiO ₂ , TiO ₂ , MgO, Al ₂ O ₃ , In ₂ O ₃ , Sb ₂ O ₃ , Ta ₂ O _5, etc. The nematic liquid crystal compound having a negative dielectric anisotropy is tilted and vertically aligned. Accordingly, the electro-optical device 100 has a normally black V.
Operates as A mode.

The light shielding layer 29 is formed as a frame portion 29 a extending along the outer peripheral edge of the display area 10 a, and the display area 10 a is defined by the inner peripheral edge of the light shielding layer 29. The light shielding layer 29 is also formed as a black matrix portion 29b that overlaps an inter-pixel region sandwiched between adjacent pixel electrodes 9a. The frame portion 29 a is formed at a position overlapping the dummy pixel electrode 9 b, and the outer peripheral edge of the frame portion 29 a is at a position with a gap between the inner peripheral edge of the sealing material 107. Therefore, the frame portion 29a and the sealing material 107 do not overlap.

In the electro-optical device 100, the one surface 2 of the second substrate 20 is located outside the sealing material 107.
Inter-substrate conduction electrodes 25 are formed at four corners on the 0 s side, and four corner portions (inter-substrate conduction electrode 25) of the second substrate 20 are formed on one surface 10 s side of the first substrate 10. The inter-substrate conduction electrode 19 is formed at a position opposite to. In this embodiment, the inter-substrate conduction electrode 25 is composed of a part of the common electrode 21. A common potential Vcom is applied to the inter-substrate conduction electrode 19. An inter-substrate conducting material 19a containing conductive particles is disposed between the inter-substrate conducting electrode 19 and the inter-substrate conducting electrode 25, and the common electrode 21 of the second substrate 20 is an inter-substrate conducting electrode. 19, electrically connected to the first substrate 10 side via the inter-substrate conductive material 19a and the inter-substrate conductive electrode 25. Therefore, the common electrode 21 is connected to the common potential Vcom from the first substrate 10 side.
Is applied. The sealing material 107 is provided along the outer peripheral edge of the second substrate 20 with substantially the same width dimension, but the inter-substrate conduction electrode 19 is provided in a region overlapping the corner portion of the second substrate 20.
, 25 so as to pass through the inside.

(Configuration of the substrate body 10w, 20w, etc.)
The electro-optical device 100 can be a transmissive liquid crystal device or a reflective liquid crystal device. When the electro-optical device 100 is a transmissive liquid crystal device, a transparent substrate such as a quartz substrate is used for both the substrate body 10w of the first substrate 10 and the substrate body 20w of the second substrate 20. When the electro-optical device 100 is a transmissive liquid crystal device, the pixel electrode 9a and the common electrode 21 are formed of a light-transmitting conductive film such as an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. . In such a transmissive liquid crystal device (electro-optical device 100), for example,
Light incident from the second substrate 20 side is modulated while it is emitted from the first substrate 10 side to display an image.

When the electro-optical device 100 is a reflective liquid crystal device, the common electrode 21 may be an ITO film or an IZO.
The pixel electrode 9a is formed of a reflective conductive film such as an aluminum film. In the reflective liquid crystal device (electro-optical device 100), the first substrate 10
Of the second substrate 20, light incident from the second substrate 20 side is modulated while being reflected by the first substrate 10 and emitted to display an image. Therefore, when the electro-optical device 100 is a reflective liquid crystal device, the substrate body 10w of the first substrate 10 and the substrate body 20w of the second substrate 20 are used.
In either case, a light-transmitting substrate such as a quartz substrate can be used. Further, the electro-optical device 10
When 0 is a reflective liquid crystal device, a translucent substrate such as a quartz substrate is used for the substrate body 20w of the second substrate 20, and a semiconductor substrate such as a silicon substrate is used for the substrate body 10w of the first substrate 10. Can do.

In the following description, the electro-optical device 100 is a reflective liquid crystal device, a quartz substrate is used for the substrate body 20w of the second substrate 20, and a silicon substrate is used for the substrate body 10w of the first substrate 10. The case is illustrated.

The electro-optical device 100 can be used, for example, as a color display device for electronic devices such as mobile computers and mobile phones. In this case, a color filter (not shown) is formed on the second substrate 20. The electro-optical device 100 can be used as electronic paper. In the electro-optical device 100, a polarizing film, a retardation film, a polarizing plate, and the like are used depending on the type of liquid crystal material used for the electro-optical layer 50 and the normally white mode / normally black mode. Are arranged in a predetermined direction. Furthermore, the electro-optical device 100 can be used as a light valve for RGB in a projection display device (liquid crystal projector) described later. In this case, each of the RGB electro-optical devices 100 receives light of each color separated through RGB color separation dichroic mirrors as projection light, so that no color filter is formed. .

(Configuration of the substrate connecting apparatus 200)
FIG. 2 is an explanatory view schematically showing a main configuration of the substrate connecting apparatus 200 according to Embodiment 1 of the present invention, and shows a state in which the electro-optical device 100 and the substrate connecting apparatus 200 are cut along the Y direction. It is shown schematically. FIG. 3 is an explanatory diagram of the stage 240 used in the substrate connecting apparatus 200 to which the present invention is applied. FIGS. 3A and 3B show the first stage 210 and the second stage 2.
FIG. 6 is an explanatory diagram when the third stage 230 is provided only between the first stage 210 and the first stage 210.
It is explanatory drawing at the time of providing the 3rd stage 230 around.

A substrate connecting apparatus 200 shown in FIG. 2 includes an electro-optic layer 5 on one surface 10 s of the first substrate 10.
0 is an apparatus for connecting the wiring substrate 60 to the terminal 102 provided between the electro-optical layer arrangement region 10d (display region 10a) provided with 0 and the side surface 10e.
Connection to 0 is performed in the state of the liquid crystal panel 100p. The wiring board 60 is a flexible wiring board, and has a structure in which a wiring layer 62 and a solder resist 63 are sequentially laminated on a base film 61 such as polyimide. A portion of the wiring layer 62 exposed from the solder resist 63 is used as a terminal connected to the terminal 102. In this embodiment, the terminal 102 of the first substrate 10 and the wiring substrate 60 are connected by an anisotropic conductive film 70.

The substrate connecting apparatus 200 of this embodiment is a stage 2 that supports the other surface 10t side of the first substrate 10.
40, and a pressure head 250 that heats the region where the terminal 102 and the wiring substrate 60 overlap with the anisotropic conductive film 70 while pressing from the wiring substrate 60 side.
50 is driven up and down by a head driving device (not shown) in a direction approaching and separating from the stage 240 as indicated by an arrow A. The pressure head 250 has a heater 25.
5 is built-in. The heater 255 has a configuration in which a constant current is continuously supplied until the pressure head 250 reaches a set temperature, and a current in accordance with the difference between the current temperature of the pressure head 250 and the set temperature is supplied. ing.

The stage 240 is located on the other surface 10t side of the first substrate 10 in the electro-optic layer arrangement region 10d.
The first stage 210 that supports the overlapping area, and the terminal 102 on the side of the first stage 210
And a second stage 220 that supports a region overlapping the formation region. Second stage 2
While 20 is fixed, the first stage 210 is driven in the vertical direction as indicated by an arrow C by a stage driving device (not shown). Further, the stage driving device is the first
The stage 210 can also be transported in the in-plane direction (direction orthogonal to the thickness direction) of the liquid crystal panel 100p (first substrate 10).

In the stage 240, the first stage 210 and the second stage 220 are separated from each other, and a third stage 230 is provided between the first stage 210 and the second stage 220. The third stage 230 is separated from the second stage 220 and is disposed at a position adjacent to the first stage 210. The width dimension of the second stage 220 and the third stage 230 (Y
(Dimension in the direction) is narrower than that of the first stage 210, and the width dimension (dimension in the Y direction) of the third stage 230 is narrower than that of the second stage 220. In the present embodiment, the third stage is configured to be in contact with the first stage 210, but may be configured to be separated from the first stage 210.

In the present embodiment, as shown in FIG. 3A, the first stage 210 is a square plate shape, and the second stage 220 is a plate shape facing one surface of the first stage 210. The third stage 230 is provided in a plate shape between the first stage 210 and the second stage 220. Further, as shown in FIG. 3B, the third stage 230 includes the first stage 2.
It may be a frame shape surrounding the entire circumference of 10. The third stage 230 may be either a fixed type or a method that moves in conjunction with the first stage 210.

In the stage 240 configured as described above, the thermal conductivity of the second stage 220 is the first value.
It is less than the thermal conductivity of stage 210. In addition, the thermal conductivity of the third stage 230 is less than the thermal conductivity of the first stage 210 and greater than or equal to the thermal conductivity of the second stage 220, and each stage thermal conductivity has the following relationship: Second stage 220 ≦ Third stage 230 <first stage 210
have.

In this embodiment, the first stage 210 is made of a metal such as stainless steel, the second stage 220 is made of quartz, and the third stage 230 is made of quartz, like the second stage 220. The first stage 210 is made of SUS304 (stainless steel) among various stainless steels. In this case, the second stage 220 and the third stage 230 have the same thermal conductivity, but the third stage 230 may have a higher thermal conductivity than the second stage 220.

In this embodiment, the second stage 220 has a built-in heater 225 and can be preheated. The first stage 210 and the third stage 230 may be provided with a preheating heater (not shown).

(Method of manufacturing electro-optical device 100)
In the manufacturing process of the electro-optical device 100 according to this embodiment, after the liquid crystal panel 100p is manufactured, the wiring substrate 60 is connected to the terminal 102 of the first substrate 10 of the liquid crystal panel 100p in the substrate connecting process to form the electro-optical device 100. .

In the substrate connection step, first, the second stage 220 is preheated to a temperature of about 130 ° C. Also, the first stage 210 may be preheated to a temperature of about 130 ° C. At this time, the first stage 210 is waiting above the second stage 220.

Next, the liquid crystal panel 100p is placed on the first stage 210, and the first of the liquid crystal panel 100p is placed.
It is assumed that the other surface 10t of the substrate 10 is supported by the first stage 210. Next, the 1st stage 210 moves and the area | region in which the terminal 102 is formed among the other surfaces 10t of the 1st board | substrate 10 is supported by the 2nd stage 220. FIG. As a result, the first stage 210 is the first substrate 1
Of the other surface 10t side of 0, the region overlapping with the electro-optic layer arrangement region 10d is supported, and the second stage 220 is separated from the first stage 210, and on the other surface 10t side of the first substrate 10, The region overlapping the region where the terminal 102 is provided is supported. Further, the third stage 230 is in a state of supporting the other surface 10t side of the first substrate 10 at a position separated from the second stage 220 between the first stage 210 and the second stage 220. In this embodiment, the first stage 210 supports a region wider than the region overlapping the electro-optical layer arrangement region 10d, and also supports the region overlapping the sealing material 107d and the sealing material 107.
Therefore, the third stage 230 is connected to the sealing material 107d and the sealing material 107 with the terminal 1
A region overlapping with the adjacent region on the 02 side is supported.

Next, the wiring substrate 60 is overlapped with the region where the terminal 102 of the first substrate 10 is formed via the anisotropic conductive film 70. At that time, after the anisotropic conductive film 70 is provided on the first substrate 10 side, the wiring substrate 60 is overlaid on the first substrate 10. Alternatively, the anisotropic conductive film 70 may be temporarily fixed to the wiring substrate 60, and then the wiring substrate 60 may be overlaid on the first substrate 10. here,
The wiring substrate 60 is overlaid on the first substrate 10 such that the edge located on the electro-optic layer arrangement region 10d (display region 10a) side of the liquid crystal panel 100p is located on the display region 10a side from the terminal 102. Further, the wiring substrate 60 has a solder resist 63 on one side 10 of the first substrate 10.
It is overlaid on the first substrate 10 so as to overlap about 0.2 mm with respect to s.

Next, the heated pressure head 250 is lowered, and the area where the terminals 102 and the wiring board 60 overlap is pressurized from the wiring board 60 side by the pressure head 250. As a result, the anisotropic conductive film 70 is heated to a temperature of 180 ° C. or higher, for example, 200 ° C., and the resin component of the anisotropic conductive film 70 is melted. Meanwhile, the temperature of the first stage 210 is lower than the temperature of the second stage 220, the temperature of the third stage 230 is lower than the temperature of the second stage 220, and the temperature of the third stage 230 is higher than the temperature of the first stage 210. It is.

Next, the pressure head 250 is raised to separate the pressure head 250 from the wiring board 60,
The resin component of the anisotropic conductive film 70 is solidified. In this way, one side 10 of the first substrate 10
In s, when the wiring substrate 60 is connected to the terminal 102 by the anisotropic conductive film 70, the electro-optical device 100 is obtained. After that, the first stage 210 moves and the electro-optical device 10 is moved.
Zero discharge is performed. Thereafter, the connection process of the wiring board 60 to another liquid crystal panel 100p is executed.

(Operation and main effect of this form)
FIG. 7 is an explanatory diagram schematically showing the flow of heat in the substrate connecting apparatus 200 according to Embodiment 1 of the present invention.

In the electro-optical device 100 of this embodiment, the substrate body 20w of the second substrate 20 is a quartz substrate, and the substrate body 10w of the first substrate 10 is a silicon substrate. In the substrate connecting apparatus 200, the first stage 210 is made of SUS, the second stage 220 is made of quartz, and the third stage 230 is made of quartz.

Here, the thermal conductivity of each material is as follows: Quartz = 1.66 W · m ⁻¹ · K ⁻¹
SUS304 = 16.7 W · m ⁻¹ · K ⁻¹
Silicon = 149W ・ m ⁻¹・ K ⁻¹
Aluminum = 236W ・ m ^-1・ K ^-1
It is. Therefore, the thermal conductivity of each member has the following relationship: third stage 230 ≦ second stage 220 <first stage 210 <first substrate 10
have.

Therefore, when the anisotropic conductive film 70 is heated by the heat from the pressure head 250, the heat of the anisotropic conductive film 70 is transferred to the second stage 220 as indicated by the arrow E1, but the second stage 220 has low thermal conductivity. For this reason, heat hardly escapes from the second stage 220. Further, the heat of the anisotropic conductive film 70 is transmitted to the third stage 230 as indicated by the arrow E5, but the third stage 230 has low thermal conductivity. For this reason, it is difficult for heat to escape from the third stage 230. Accordingly, the second stage 220 and the third stage 230 can suppress the heat radiation from the region where the terminal 102 is formed and the anisotropic conductive film 70, so that the anisotropic conductive film 70 is sufficiently heated. be able to.

Further, the heat of the anisotropic conductive film 70 tends to be transmitted to the electro-optic layer 50 in the display region 10a through the first substrate 10 as indicated by an arrow E3. However, such heat is indicated by an arrow E2. , Escape to the first stage 210 with high thermal conductivity. For this reason, the terminal 1 is applied by the pressure head 250.
While the area where 02 and the wiring board 60 overlap is pressurized, the temperature of the first stage 210 is lower than the temperature of the second stage 220, and the temperature of the third stage 230 is the second stage 22.
The temperature of the third stage 230 is equal to or higher than the temperature of the first stage 210.

In particular, in this embodiment, since the first substrate 10 is a silicon substrate (semiconductor substrate), the thermal conductivity is high. However, in this embodiment, the second stage 220 and the third stage 230 allow the terminal 10 to be connected.
2, heat dissipation from the region where 2 is formed and the anisotropic conductive film 70 is suppressed, and heat to be transmitted to the electro-optic layer 50 is released to the first stage 210.

Accordingly, the region where the terminal 102 is formed, the temperature of the anisotropic conductive film 70, and the electro-optic layer 5
The difference from the temperature of 0 is large. Therefore, the region where the terminal 102 is formed or the anisotropic conductive film 70.
Even if the layer is sufficiently heated, the temperature of the electro-optic layer 50 is low. For example, the anisotropic conductive film 70 is 180.
Even if the electro-optical layer 50 is heated to a temperature equal to or higher than 0 ° C., the temperature of the electro-optical layer 50 does not easily exceed 80 ° C. Therefore, it is possible to suppress thermal degradation of the electro-optic layer 50 due to heat when the wiring substrate 60 is connected to the terminal 102 of the first substrate 10.

In addition, since the electro-optic layer 50 is not easily deteriorated by heat when the wiring board 60 is connected to the terminal 102 of the first substrate 10, the distance between the electro-optic layer arrangement region 10d and the terminal 102 can be reduced. The electro-optical device 100 can be downsized.

[Embodiment 2]
FIG. 5 is an explanatory view schematically showing the configuration of the main part of the substrate connecting apparatus 200 according to Embodiment 2 of the present invention, in which the electro-optical device 100 and the substrate connecting apparatus 200 are cut along the Y direction. It is shown schematically. FIG. 6 is an explanatory view schematically showing a form in which the pressure head 250 and the heat radiating member 280 are connected via the biasing member 290 in the substrate connecting apparatus 200 according to Embodiment 2 of the present invention. FIG. 7 is an explanatory view schematically showing a heat flow in the substrate connecting apparatus 200 according to Embodiment 2 of the present invention. In addition, this form and Embodiment 3 mentioned later,
Since the basic configurations 4 and 5 are the same as those in the first embodiment, common portions are denoted by the same reference numerals and detailed description thereof is omitted.

5 also includes a first stage 210 made of metal, a second stage 220 made of quartz, and a third stage 230 made of quartz. ing. The substrate connecting apparatus 200 of this embodiment is configured with respect to the pressure head 250 and the wiring board 6.
A heat dissipating member 280 is provided at a position adjacent to the side opposite to the side where 0 is located. The heat radiating member 280 is driven up and down by a heat radiating member driving device (not shown) in a direction approaching and separating from the stage 240 as indicated by an arrow B. The heat dissipating member 280 is the first
It consists of a member with higher thermal conductivity than the substrate 10, for example, a metal plate member. In this embodiment, the heat dissipation member 280 is made of an aluminum plate member.

In addition, as shown in FIG. 6, the heat radiating member 280, the pressure head 250, and the biasing member 290 such as a coil spring are connected, and the heat radiating member 280 and the pressure head 250 may be driven integrally. In any case, the heat radiating member 280 is interlocked with the pressure head 250 and the stage 2
It is driven in a direction toward 40 and a direction away from it.

In the form shown in FIG. 6A, the urging member 290 is disposed between the support member 251 protruding from the pressure head 250 and the heat radiating member 280, and the heat radiating member 280 is disposed on the first substrate 10.
The timing at which the pressure head 250 abuts and the timing at which the pressure head 250 abuts on the wiring board 60 are simultaneous. On the other hand, in the form shown in FIG. 6B, the heat radiation member 280 is positioned below the form shown in FIG. For this reason, after the heat dissipation member 280 contacts the first substrate 10,
The pressure head 250 contacts the wiring board 60.

In the board connecting device 200 configured as described above, the heat radiating member 280 is formed in the board connecting process.
Then, the pressure head 250 is lowered, and the heat radiating member 280 is brought into contact with 12 between the electro-optic layer arrangement region 10d (display region 10a) and the terminal 102 in the one surface 10s of the first substrate 10;
In this state, a region where the terminal 102 and the wiring board 60 overlap is pressurized from the wiring board 60 side by the heated pressure head 250. At this time, the timing at which the heat dissipation member 280 contacts the first substrate 10 and the timing at which the pressure head 250 contacts the wiring substrate 60 may be simultaneous, or the heat dissipation member 280 contacts the first substrate 10. Timing and pressure head 25
The timing at which 0 contacts the wiring board 60 may be shifted. For example, the pressure head 250 may contact the wiring substrate 60 after the heat dissipation member 280 contacts the first substrate 10, or after the pressure head 250 contacts the wiring substrate 60, 1 substrate 10 with heat dissipation member 28
The structure which 0 contacts may be sufficient.

In this embodiment, the wiring substrate 60 has an edge located on the display area 10a side of the liquid crystal panel 100p located on the display area 10a side from the terminal 102. In the liquid crystal panel 100p, a sealing material 107d is provided on the side surface 20e of the second substrate 20. Accordingly, the heat dissipation member 280 displays the sealing material 107d and the wiring substrate 60 in the space 12 between the electro-optic layer arrangement region 10d (display region 10a) and the terminal 102 with respect to the one surface 10s of the first substrate 10. Region 10
It abuts on the region sandwiched between the a-side edge.

Next, the heat dissipating member 280 and the pressure head 250 are raised to separate the heat dissipating member 280 from the first substrate 10, and the pressure head 250 is separated from the wiring substrate 60. Solidify. At this time, the timing at which the heat dissipation member 280 is separated from the first substrate 10 and the timing at which the pressure head 250 is separated from the wiring substrate 60 may be simultaneous, or the heat dissipation member 280 is separated from the first substrate 10. Timing and pressure head 25
The timing at which 0 is separated from the wiring board 60 may be shifted. For example, the first substrate 10
After the heat radiation member 280 is separated from the wiring board 60, the pressure head 250 may be separated from the wiring board 60. After the pressure head 250 is separated from the wiring board 60, the heat radiation member 280 is separated from the first substrate 10. The structure which separates may be sufficient.

As described above, in the present embodiment, the second stage 220 and the third stage 230 suppress the heat radiation from the region where the terminal 102 is formed and the anisotropic conductive film 70, and the heat to be transmitted to the electro-optic layer 50. Since it escapes to the 1st stage 210, there exists an effect similar to Embodiment 1. FIG. In this embodiment, the heat radiation member 280 is brought into contact with 12 between the electro-optic layer arrangement region 10 d (display region 10 a) and the terminal 102 in the one surface 10 s of the first substrate 10. Therefore, as shown in FIG. 7, the heat of the anisotropic conductive film 70 is generated by the first substrate 1 as indicated by the arrow E3.
The heat radiating member 280 is in contact with the one surface 10 s of the first substrate 10 between the terminal 102 and the display region 10 a. For this reason, the heat to be transmitted to the electro-optic layer 50 through the first substrate 10 escapes to the heat radiating member 280 and is radiated before being transmitted to the electro-optic layer 50 as indicated by an arrow E4.

Accordingly, the temperature increase of the electro-optic layer 50 can be suppressed without directly contacting the heat radiating member 280 with the electro-optic layer 50. Also, the first substrate 1 that conducts heat toward the electro-optic layer 50
The heat dissipating member 280 is brought into contact with 0 and the heat to be transmitted to the electro-optic layer 50 is dissipated.
Therefore, the temperature increase of the electro-optic layer 50 can be effectively suppressed. In particular, in this embodiment, since the first substrate 10 is a silicon substrate (semiconductor substrate), the thermal conductivity is high. In this embodiment, the heat dissipation member 280 is provided on the first substrate 10 that conducts heat toward the electro-optic layer 50. The heat to be transferred to the electro-optic layer 50 by the contact is released to the heat radiating member 280. For this reason, the temperature rise of the electro-optic layer 50 can be reliably suppressed. Therefore, even if the anisotropic conductive film 70 is heated to a temperature of 180 ° C. or higher, the temperature of the electro-optical layer 50 can be prevented from exceeding 80 ° C., so that thermal degradation of the electro-optical layer 50 is suppressed. can do.

Further, as described with reference to FIG. 6, when the heat radiating member 280 is urged toward the first substrate 10 by the urging member 290, the heat radiating member 280 exerts an excessive force on the first substrate 10. Since it does not contact, damage to the first substrate 10 can be prevented. Further, the heat dissipating member 280 is the first.
Since it adheres to the substrate 10, the thermal conductivity between the first substrate 10 and the heat dissipation member 280 can be increased. Therefore, since the temperature rise of the electro-optical layer 50 can be suppressed, thermal degradation of the electro-optical layer 50 can be suppressed. Further, as described with reference to FIG. 6, when the heat radiating member 280 is held by the pressure head 250 via the biasing member 290, the pressure head 250 moves toward the first substrate 10. At this time, the urging member 290 and the heat radiating member 280 also move in conjunction with the pressure head 250, and the heat radiating member 280 is urged toward the first substrate 10 by the urging member 290. Therefore, a driving mechanism for the heat radiating member 280 is unnecessary.

[Embodiment 3]
FIG. 8 is an explanatory view schematically showing a main configuration of the substrate connecting apparatus 200 according to Embodiment 3 of the present invention, and shows a state in which the electro-optical device 100 and the substrate connecting apparatus 200 are cut along the Y direction. It is shown schematically.

In the first embodiment, the heat radiating member 280 is in direct contact with the one surface 10 s of the first substrate 10. However, in the present embodiment, as shown in FIG. 8, the heat radiating member 280 is first through the protective sheet 270. The substrate 10 is in contact with one surface 10s. In this embodiment, the protective sheet 270 is an elastic sheet such as a resin sheet. Other configurations are the same as those of the second embodiment.

According to this embodiment, the display region 10 a and the terminal 102 are provided on the one surface 10 s side of the first substrate 10.
Even when a wiring or the like is provided between them, the wiring and the like can be prevented from being damaged by the heat dissipation member 280.

[Embodiment 4]
FIG. 9 is an explanatory view schematically showing the main configuration of the substrate connecting apparatus 200 according to Embodiment 4 of the present invention, and shows a state in which the electro-optical device 100 and the substrate connecting apparatus 200 are cut along the Y direction. It is shown schematically.

In the first embodiment, forced cooling is not performed on the second substrate 20 side. However, in this embodiment, as shown in FIG. 9, the electro-optic layer 50 is formed from the side opposite to the side where the first substrate 10 is located. Force cooling. More specifically, as indicated by an arrow G, cooling gas such as cooling air is blown from the nozzle 260 to the other surface 20t of the second substrate 20. In this embodiment, the cooling gas is blown obliquely from the side opposite to the side on which the terminals 102 are located on the other surface 20t of the second substrate 20. Other configurations are the same as those of the second embodiment.

In this embodiment, the electro-optic layer 50 is forcibly cooled from the side opposite to the side where the first substrate 10 is located. For this reason, since the temperature rise of the electro-optic layer 50 can be further suppressed, thermal degradation of the electro-optic layer 50 can be suppressed. Note that this embodiment may be applied to the first embodiment. Further, as forced cooling from the side opposite to the side where the first substrate 10 is located, in addition to blowing cooling gas, a cooling member provided with a Bertier element or a cooling member in which a refrigerant flows inside is provided on the second substrate 20. You may contact | abut.

[Embodiment 5]
FIG. 10 is an explanatory view schematically showing the main configuration of the substrate connecting apparatus 200 according to Embodiment 5 of the present invention, and shows a state in which the electro-optical device 100 and the substrate connecting apparatus 200 are cut along the Y direction. It is shown schematically.

In the first embodiment, the forced cooling is not performed on the stage 240. However, in the present embodiment, as shown in FIG. 10, the portion of the stage 240 that overlaps the display area 10a in a plan view is forcibly cooled. More specifically, the first stage 210 is provided with a hole 215 and the hole 2
15 is forcibly cooled by flowing a refrigerant, forcibly cooled by a cooling member provided with a Bertier element, or forcibly cooled by a cooling member through which a refrigerant flows. Other configurations are the same as those of the second embodiment.

In the present embodiment, the portion of the stage 240 that overlaps the display region 10a in plan view is forcibly cooled, so that the temperature increase of the electro-optic layer 50 can be further suppressed. Therefore, thermal degradation of the electro-optic layer 50 can be suppressed. Note that this embodiment may be applied to Embodiments 1 and 4.

[Configuration example of other electro-optical device]
In the above embodiment, the substrates are connected using the anisotropic conductive film, but the present invention may be applied when using the anisotropic conductive paste. Further, the present invention may be applied to the case where the substrates are connected using low melting point solder.

In the above embodiment, the liquid crystal injection port 107c of the sealing material 107 is sealed with the sealing material 107d. However, the sealing material 107 does not have the liquid crystal injection port 107c, and the display region 10a and the terminal 102 are provided.
The present invention may be applied when the sealing material 107d is not provided between the two. Further, the connection of the substrates may be performed in a state where dust-proof glass or the like is attached to the other surface 20t of the second substrate 20.

In the above embodiment, the electro-optical device 100 is a reflective liquid crystal device. However, the present invention may be applied when the electro-optical device 100 is a transmissive liquid crystal device. Further, the present invention may be applied when the electro-optical device 100 is an organic electroluminescence device. In this case, the electro-optical layer 50 is a light emitting layer or the like.

[Example of mounting on electronic devices]
(Configuration example of a projection display device)
FIG. 11 is a schematic configuration diagram of an example of a projection display device (electronic device) to which the present invention is applied.
A projection display device 1000 shown in FIG. 11 includes a light source unit 1021 that generates light source light, and a light source unit 1.
The color separation light guide optical system 1023 that separates the light source light emitted from 021 into three color lights of red light R, green light G, and blue light B, and each color emitted from the color separation light guide optical system 1023 And a light modulator 1025 illuminated by the light source light. In addition, the projection display device 1000
Includes a cross dichroic prism 1027 (combining optical system) that combines the image light of each color emitted from the light modulation unit 1025, and a projection optical system 1029 that projects the image light that has passed through the cross dichroic prism 1027 onto a screen (not shown). It has. In this embodiment, the plurality of electro-optical devices 100 (reflection type liquid crystal device) and the cross dichroic prism 1027 (light combining optical system) constituting the light modulation unit 1025 constitute an optical unit 1200.

In the projection display apparatus 1000, the light source unit 1021 includes a light source 1021a, a pair of fly-eye optical systems 1021d and 1021e, a polarization conversion member 1021g, and a superimposing lens 1021i. In the present embodiment, the light source unit 1021 includes a reflector 1021f having a paraboloid and emits parallel light. Fly's eye optical system 1021d, 10
21e is composed of a plurality of element lenses arranged in a matrix in a plane orthogonal to the system optical axis, and the light source light is divided by these element lenses to be individually condensed and diverged. The polarization conversion member 1021g converts the light source light emitted from the fly-eye optical system 1021e into, for example, only a p-polarized component parallel to the drawing, and supplies it to the optical path downstream optical system. The superimposing lens 1021i allows the plurality of electro-optical devices 100 provided in the light modulation unit 1025 to be uniformly superimposed and illuminated by appropriately converging the light source light that has passed through the polarization conversion member 1021g as a whole.

The color separation light guide optical system 1023 includes a cross dichroic mirror 1023a, a dichroic mirror 1023b, and reflection mirrors 1023j and 1023k. In the color separation light guide optical system 1023, the substantially white light source light from the light source unit 1021 enters the cross dichroic mirror 1023a. The red light R reflected by one of the first dichroic mirrors 1031a constituting the cross dichroic mirror 1023a is reflected by the reflecting mirror 1023j, passes through the dichroic mirror 1023b, and transmits the incident side polarizing plate 1037r and p-polarized light. The electro-optical device 100 (red liquid crystal panel 100 for red) remains p-polarized light via the wire grid polarizing plate 1032r that reflects s-polarized light and the optical compensation plate 1039r.
R).

Further, the green light G reflected by the first dichroic mirror 1031a is reflected by the reflection mirror 10.
23j, then reflected by the dichroic mirror 1023b, and incident-side polarizing plate 1037g, which transmits p-polarized light while reflecting s-polarized light.
032g and the optical compensator 1039g, the electro-optical device 100 (
The light enters the green liquid crystal panel 100G).

On the other hand, the blue light B reflected by the other second dichroic mirror 1031b constituting the cross dichroic mirror 1023a is reflected by the reflection mirror 1023k,
Incident-side polarizing plate 1037b transmits the p-polarized light while reflecting the s-polarized light through the wire grid polarizing plate 1032b and the optical compensation plate 1039b.
00 (incident on the blue liquid crystal panel 100B). Optical compensation plates 1039r, 1039
g and 1039b optically compensate the characteristics of the liquid crystal layer by adjusting the polarization state of the incident light and the outgoing light to the electro-optical device 100.

In the projection display apparatus 1000 configured as described above, the optical compensation plates 1039r and 1039g
Each of the three colors of light incident through 1039b is modulated in each electro-optical device 100. At this time, of the modulated light emitted from the electro-optical device 100, the s-polarized component light is reflected by the wire grid polarizers 1032r, 1032g, and 1032b, and the exit-side polarizer 1038 is reflected.
The light enters the cross dichroic prism 1027 through r, 1038 g, and 1038 b. The cross dichroic prism 1027 includes a first dielectric multilayer film 10 that intersects in an X shape.
27a and a second dielectric multilayer film 1027b are formed, and one first dielectric multilayer film 1 is formed.
027a reflects red light R, and the other second dielectric multilayer film 1027b reflects blue light B. Therefore, the three colors of light are combined by the cross dichroic prism 1027 and emitted to the projection optical system 1029. The projection optical system 1029 projects the color image light combined by the cross dichroic prism 1027 onto a screen (not shown) at a desired magnification.

(Other projection display devices)
For the projection display device, an LED light source that emits light of each color is used as the light source unit, and the color light emitted from the LED light source is supplied to another electro-optical device (liquid crystal device). It may be configured.

(Other electronic devices)
As for the electro-optical device 100 to which the present invention is applied, in addition to the electronic devices described above, mobile phones, personal digital assistants (PDAs), digital cameras, liquid crystal televisions, car navigation devices, video phones, POS terminals In addition, it may be used as a direct-view display device in an electronic device such as a device provided with a touch panel.

9a ... Pixel electrode, 10 ... First substrate, 10a ... Display area, 10d ... Electro-optical layer arrangement area, 10e-10h ... Side face of the first substrate, 10s ... One side of the first substrate, 10t ..The other side of the first substrate, 10w ..Substrate body, 11 ..Extended region, 12 ..Between display region and terminal, 20 ..Second substrate, 20 w ..Substrate body, 50 ..Electricity Optical layer, 60 ... wiring board,
70 .. Anisotropic conductive film, 100 ... Electro-optical device, 100p ... Liquid crystal panel, 102 ...
Terminal 200, substrate connection device 210, first stage, 215, hole for forced cooling of first stage, 220, second stage, 225, second stage heater, 230
-Third stage, 240-Stage, 250-Pressure head, 251-Support member, 2
55 .... Pressure head heater, 260 ... Nozzle, 270 ... Protective sheet, 280 ...
Heat dissipation member, 290 ... Biasing member, 1000 ... Projection type display device, 1200 ... Optical unit

Claims (12)

Manufacture of an electro-optical device having a first substrate provided with a terminal between an electro-optical layer arrangement region in which an electro-optical layer is arranged on one surface side and a side surface of the substrate, and a wiring substrate connected to the terminal A method,
In the board connecting step of connecting the wiring board to the terminal, a position of the other surface side of the first board that overlaps with the electro-optic layer arrangement area is supported by the first stage and is separated from the first stage. And supporting the region overlapping the region where the terminal is provided on the other surface side of the first substrate by the second stage having a thermal conductivity lower than the thermal conductivity of the first stage.
At a position spaced from the second stage between the first stage and the second stage, the thermal conductivity is less than the thermal conductivity of the first stage and is equal to or equal to the thermal conductivity of the second stage. With the above third stage supporting the other side of the first substrate,
A method for manufacturing an electro-optical device, wherein a region where the terminal and the wiring board overlap is pressed from the wiring board side by a heated pressure head. The method of manufacturing an electro-optical device according to claim 1, wherein the first substrate is a semiconductor substrate. While the area where the terminal and the wiring board overlap is pressed by the pressing head, the temperature of the first stage is lower than the temperature of the second stage, and the temperature of the third stage is the first 3. The method of manufacturing an electro-optical device according to claim 1, wherein the temperature of the third stage is equal to or lower than the temperature of the second stage, and the temperature of the third stage is equal to or higher than the temperature of the first stage. In the substrate connection step, a region where the terminal and the wiring substrate overlap is pressed by the pressure head with a heat dissipation member in contact with the electro-optical layer arrangement region and the terminal. The method of manufacturing an electro-optical device according to claim 1. 5. The method of manufacturing an electro-optical device according to claim 4, wherein the heat radiating member is in contact with the one surface of the first substrate while being urged toward the first substrate by the urging member. . 6. The method of manufacturing an electro-optical device according to claim 5, wherein the heat radiating member is held by the pressure head via the biasing member. The method of manufacturing an electro-optical device according to claim 4, wherein the heat radiating member is in contact with the first substrate via a protective sheet. 8. The method of manufacturing an electro-optical device according to claim 1, wherein, in the substrate connecting step, the electro-optical layer is cooled from a side opposite to a side where the first substrate is located. . The said board | substrate connection process cools a said 1st stage, The 1st thru | or 8 characterized by the above-mentioned.
The method of manufacturing an electro-optical device according to any one of the above. A second substrate disposed on one side of the first substrate via a sealant;
10. The liquid crystal layer according to claim 1, wherein the electro-optical layer is a liquid crystal layer provided at a position surrounded by the sealing material between the first substrate and the second substrate. A method for manufacturing an electro-optical device according to one item. A board connection device for connecting a wiring board to a terminal provided between an electro-optic layer arrangement area where a electro-optic layer is arranged on one side of a first board and the side of the board,
A first supporting the region overlapping the electro-optic layer arrangement region on the other surface side of the first substrate.
Stage,
Supporting a region overlapping the region where the terminals are provided on the other surface side of the first substrate at a position separated from the first stage, the thermal conductivity is less than the thermal conductivity of the first stage. And the second stage of
Supporting the other surface side of the first substrate at a position spaced from the second stage between the first stage and the second stage, the thermal conductivity is less than the thermal conductivity of the first stage, A third stage equal to or greater than the thermal conductivity of the second stage;
A pressure head that heats the region where the terminal and the wiring board overlap while pressing from the wiring board side;
A board connecting apparatus comprising: The board connecting device according to claim 11, further comprising a heat dissipating member that abuts between the electro-optic layer arrangement region and the terminal among the one surface of the first board.

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