JP2015195140A - Method for manufacturing flexible organic el display device - Google Patents

Method for manufacturing flexible organic el display device Download PDF

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Publication number
JP2015195140A
JP2015195140A JP2014073136A JP2014073136A JP2015195140A JP 2015195140 A JP2015195140 A JP 2015195140A JP 2014073136 A JP2014073136 A JP 2014073136A JP 2014073136 A JP2014073136 A JP 2014073136A JP 2015195140 A JP2015195140 A JP 2015195140A
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Japan
Prior art keywords
metal layer
substrate
layer
transparent substrate
color filter
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JP2014073136A
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Japanese (ja)
Inventor
竜則 坂野
Tatsunori Sakano
竜則 坂野
健太郎 三浦
Kentaro Miura
健太郎 三浦
上田 知正
Tomomasa Ueda
知正 上田
信美 斉藤
Nobumi Saito
信美 斉藤
慎太郎 中野
Shintaro Nakano
慎太郎 中野
雄也 前田
Yuya Maeda
雄也 前田
山口 一
Hajime Yamaguchi
一 山口
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株式会社東芝
Toshiba Corp
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Priority to JP2014073136A priority Critical patent/JP2015195140A/en
Publication of JP2015195140A publication Critical patent/JP2015195140A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3206Multi-colour light emission
    • H01L27/322Multi-colour light emission using colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/003Processes specially adapted for the manufacture or treatment of devices or of parts thereof using a temporary substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0096Substrates
    • H01L51/0097Substrates flexible substrates

Abstract

A flexible organic EL display device that employs a top emission structure and can display a color image is easily manufactured.
[Solution]
In the manufacturing method of the flexible organic EL display device, the laminated structure 2 is irradiated with the laser beam LB from the transparent substrate 21 side, thereby causing delamination between the resin layer 23 and the metal layer 22, and the laminated body 2 a. Separating the laminate 2b from the laminate 2b, oxidizing the metal layer 22 of the laminate 2a to obtain the laminate 2a in which the metal layer 22 is oxidized as a color filter substrate, a metal layer, plastic on the transparent substrate And a step of aligning the substrate and the laminated structure in which the organic EL element is formed and the color filter substrate 2a in a state where the organic EL element and the oxidized metal layer 22 are arranged to face each other.
[Selection] Figure 3

Description

  Embodiments described herein relate generally to a method for manufacturing a flexible organic EL display device.

  2. Description of the Related Art An active matrix driving type organic electroluminescence (EL) display device has a structure in which organic EL elements are provided on a TFT substrate in which pixel circuits each including circuit elements such as thin film transistors (TFTs) are arranged in a matrix. doing. When such a display device adopts a structure (top emission structure) in which light emitted from the light emitting layer is extracted from the side opposite to the TFT substrate, light emitted from the light emitting layer is not blocked by the wiring of the TFT substrate. Therefore, when this structure is employed, a high aperture ratio can be achieved.

  In recent years, organic EL display devices have been required to have long-term reliability and a high degree of freedom in shape, for example, curved display, in addition to demands for large area and light weight. Therefore, a flexible organic EL display device, that is, an organic EL display device using a plastic substrate made of a transparent plastic or the like instead of a glass substrate that is heavy, easily broken, and difficult to increase in area is attracting attention. .

  Such an organic EL display device is obtained by the following method, for example. First, a metal layer and a plastic substrate are sequentially formed on a support substrate such as a glass substrate. Next, a circuit, an organic EL element, and the like are formed on the plastic substrate. Thereafter, the metal layer is irradiated with a laser beam from the support substrate side, and the plastic substrate is peeled off from the metal layer on the support substrate together with the circuit and the organic EL element.

JP 2011-48374 A

  The problem to be solved by the present invention is to facilitate the manufacture of a flexible organic EL display device that employs a top emission structure and can display a color image.

  According to the embodiment, the first transparent substrate, the first metal layer formed on the first transparent substrate, the first plastic substrate formed on the first metal layer, and formed on the first plastic substrate. Forming a first laminated structure provided with a first alignment mark so as to face the first transparent substrate with at least the first metal layer interposed therebetween, and a second transparent substrate A resin layer formed on the second transparent substrate; a second metal layer formed on the resin layer; a color filter layer formed on the second metal layer; and a color filter layer formed on the color filter layer. Forming a second laminated structure provided with a second alignment mark so as to face at least the second transparent substrate with at least the resin layer interposed therebetween; and , By irradiating a laser beam from the second transparent substrate side, delamination occurs between the resin layer and the second metal layer, and the second metal layer, the color filter layer, and the second Obtaining a first laminate including a plastic substrate and provided with the second alignment mark, and separating the first laminate from the second laminate provided with the second transparent substrate and the resin layer; Oxidizing the second metal layer of the first laminate to obtain the first laminate obtained by oxidizing the second metal layer as a color filter substrate; the first laminate structure and the color filter substrate; And aligning with respect to each other using the first and second alignment marks in a state where the organic EL element and the oxidized second metal layer face each other. Bonding the first laminated structure and the color filter substrate, and then irradiating the first laminated structure with a laser beam from the first transparent substrate side, thereby the first plastic substrate and the first Delamination occurs between the metal layer and the third laminate including the first plastic substrate, the organic EL element, and the color filter substrate, and the first transparent substrate and the first metal layer. And a method of manufacturing a flexible organic EL display device including a step of separating from the fourth laminate.

Sectional drawing which shows schematically an example of the 1st laminated structure which concerns on embodiment. Sectional drawing which shows schematically an example of the 2nd laminated structure which concerns on embodiment. Sectional drawing which shows roughly an example of the delamination produced in the 2nd laminated structure of FIG. FIG. 3 is a cross-sectional view schematically illustrating an example of a color filter substrate according to the embodiment. Sectional drawing which shows roughly an example of the 3rd laminated structure obtained by bonding the 1st laminated structure of FIG. 1 and the color filter substrate of FIG. Sectional drawing which shows roughly an example of the delamination produced in the 3rd laminated structure of FIG.

  Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the component which exhibits the same or similar function through all drawings, and the overlapping description is abbreviate | omitted.

  The organic EL display device manufactured by the method described here is a flexible organic EL display device that can display a color image and employs a top emission structure and an active matrix driving method. In this method, first, a first laminated structure 1 shown in FIG. 1 and a second laminated structure 2 shown in FIG. 2 are prepared.

  As shown in FIG. 1, the first laminated structure 1 includes a first transparent substrate 11, a first metal layer 12, a first plastic substrate 13, a circuit layer 14, a light emitting element layer 15, and a first alignment mark 17. Yes.

  The first transparent substrate 11 plays a role of supporting part or all of the layers included in the final product in the manufacturing process of the flexible organic EL display device. The first transparent substrate 11 is not included in the flexible organic EL display device that is the final product.

  The first transparent substrate 11 is harder than the first plastic substrate 13. The first transparent substrate 11 is, for example, a glass substrate or a plastic substrate that is harder than the first plastic substrate 13.

  The first metal layer 12 is formed on the first transparent substrate 11. The first metal layer 12 exhibits a higher absorptance with respect to a laser beam to be described later than the first transparent substrate 11 and the first plastic substrate.

  The first metal layer 12 is made of, for example, a single metal or an alloy. As a material of the first metal layer 12, for example, aluminum, gallium, indium, titanium, molybdenum, tungsten, zinc, or a combination thereof can be used.

  The thickness of the first metal layer 12 is, for example, in the range of 10 nm to 300 nm. When the first metal layer 12 is thin, it becomes difficult to cause the first metal layer 12 to absorb the laser beam with high efficiency. On the other hand, if the first metal layer 12 is too thin, the laser beam may pass through the first metal layer 12, and the laser beam may enter the device side, possibly causing damage to the element.

  The first plastic substrate 13 is formed on the first metal layer 12. The first plastic substrate 13 serves as a flexible substrate in the flexible organic EL display device that is the final product.

  The first plastic substrate 13 is made of a plastic such as a heat resistant polymer. As this plastic, for example, polyimide, aramid, cycloolefin, polyamideimide, polycarbonate, PMMA (polymethyl methacrylate), liquid crystal polymer, polyethersulfone, acrylic resin, and epoxy resin can be used.

  The thickness of the first plastic substrate 13 is, for example, in the range of 0.5 μm to 100 μm. If the first plastic substrate 13 is thin, the strength of the organic EL display device may be insufficient. If the first plastic substrate 13 is thick, the flexibility of the organic EL display device may be insufficient.

  The surface of the first plastic substrate 13 may be covered with a barrier layer made of an inorganic compound such as silicon oxide or silicon nitride, for example. The barrier layer prevents mass transfer from the first plastic substrate 13 to the circuit layer 14. Further, a resin layer as a planarizing film may be provided on the barrier layer.

  The circuit layer 14 is formed on the first plastic substrate 13. The circuit layer 14 controls the supply of power to an organic EL element (not shown). The circuit layer 14 includes various wirings such as a power supply line, a scanning signal line, and a video signal line, an interlayer insulating film that electrically insulates these wirings from each other, and a thin film transistor used as a circuit element, for example, a driving element or a switching element. And a capacitor. Prior to the formation of the circuit layer 14, if contact holes are provided in the planarization film, the barrier layer, and the first plastic substrate 13, the wiring and the external circuit are electrically connected via the contact holes. Can be connected.

  The light emitting element layer 15 is formed on the circuit layer 14. The light emitting element layer 15 includes a first electrode, a partition, an organic layer, a second electrode, and a sealing layer. The first electrode, the organic material layer, and the second electrode constitute an organic EL element, for example, an organic EL element that emits white light.

  The first electrode is formed on the circuit layer 14. The first electrodes are arranged corresponding to the pixels. These first electrodes are electrically insulated from each other. Each first electrode is electrically connected to a power supply line via one or more thin film transistors. The first electrode is, for example, an anode.

  The first electrode is, for example, a reflective layer including a metal layer. The first electrode may be a transparent conductive layer. In this case, typically, a reflective layer is provided between the first electrode and the first plastic substrate 13.

  The partition wall is an insulating layer formed on the circuit layer 14. The partition wall is opened at the position of the first electrode.

  The organic layer includes a light emitting layer. The organic layer is a layer other than the light emitting layer, for example, a charge transport layer such as a hole transport layer and an electron transport layer, a charge injection layer such as a hole injection layer and an electron injection layer, and a hole block layer and an electron block layer. And a charge blocking layer.

  The second electrode is formed on the first electrode and the partition wall. The second electrode is typically a continuous film and serves as a common electrode.

  The second electrode is, for example, a cathode. The second electrode has visible light permeability. The light generated in the organic layer is transmitted through the second electrode and used for display.

  The sealing layer is formed on the second electrode. The sealing layer plays a role of preventing moisture and the like from entering the organic EL element. As a material for the sealing layer, for example, silicon nitride, silicon oxide, or parylene can be used.

  The first alignment mark 17 faces the first metal layer 12 with the first plastic substrate 13 interposed therebetween. Here, the first alignment mark 17 is provided between the first plastic substrate 13 and the light emitting element layer 15. In this case, if the first alignment mark 17 is made of, for example, the same material as the wiring included in the circuit layer 14, it can be formed simultaneously with the formation of the wiring in the process of forming the wiring. In this case, as a material of the first alignment mark 17, for example, aluminum, copper, molybdenum, tantalum, titanium, tungsten, or a combination thereof can be used.

  On the sealing layer, a barrier film in which a barrier film is provided on a resin film may be attached via an adhesive. When the barrier film is used, in addition to improving the sealing ability, it is possible to suppress the organic EL element from being damaged during peeling.

  As shown in FIG. 2, the second laminated structure 2 includes a second transparent substrate 21, a resin layer 23, a second metal layer 22, a color filter layer 24, and a second alignment mark 27.

  The second transparent substrate 21 is harder than a second plastic substrate 26 described later. The second transparent substrate 21 is, for example, a glass substrate or a hard plastic substrate compared to the second plastic substrate 26.

  The resin layer 23 is formed on the second transparent substrate 21. The resin layer 23 plays a role of promoting delamination described later. As the material of the resin layer 23, for example, the same material as described above for the first plastic substrate 13 can be used.

  The second metal layer 22 is formed on the resin layer 23. The second metal layer 22 exhibits higher absorptance with respect to a laser beam to be described later, compared to the second transparent substrate 21 and the resin layer 23.

  The second metal layer 22 contains a metal and, when oxidized, increases the transmittance for visible light. Typically, the second metal layer 22 becomes colorless by oxidation.

  The second metal layer 22 is made of, for example, a single metal or an alloy. As a material of the second metal layer 22, for example, titanium, aluminum, gallium, indium, titanium, molybdenum, tungsten, zinc, or a combination thereof can be used.

  The thickness of the second metal layer 22 is, for example, in the range of 10 nm to 300 nm. When the second metal layer 22 is thin, it is difficult to cause the second metal layer 22 to absorb the laser beam with high efficiency. When the second metal layer 22 is thick, it becomes difficult to oxidize the whole.

  The color filter layer 24 is formed on the second metal layer 22. The color filter layer 24 includes, for example, a blue colored layer, a green colored layer, a red colored layer, and a black matrix.

  The second alignment mark 27 faces the second metal layer 22. Here, the second alignment mark 27 is provided between the second metal layer 22 and the color filter layer 24. In this case, for example, if the second alignment mark 27 is made of the same material as the black matrix included in the color filter layer 24, the second alignment mark 27 can be formed simultaneously with the formation of the black matrix in the step of forming the color filter layer 24. it can.

  The second laminated structure 2 further includes a second plastic substrate 26 (not shown in FIG. 2) shown in FIG. The second plastic substrate 26 is formed on the color filter layer 24. The second plastic substrate 26 serves as a flexible substrate in the flexible organic EL display device that is the final product.

  The second plastic substrate 26 is made of a plastic such as a heat resistant polymer. As this plastic, for example, aramid, cycloolefin, polyamideimide, polycarbonate, PMMA (polymethyl methacrylate), polyethersulfone, acrylic resin, and epoxy resin can be used. In addition, when the polyimide layer exists in the optical path until the light emitted from the organic EL element reaches the observer, there may be a problem of coloring or retardation due to the polyimide layer. When the above-described materials are used, these problems do not occur.

  The thickness of the second plastic substrate is, for example, in the same range as described above for the first plastic substrate 13. If the second plastic substrate is thin, the strength of the organic EL display device may be insufficient. If the second plastic substrate is thick, the flexibility of the organic EL display device may be insufficient.

  The second laminated structure 2 is irradiated with a laser beam to cause delamination between the second metal layer 22 and the resin layer 23. Specifically, as shown in FIG. 3, the second laminated structure 2 is irradiated with a laser beam LB from the second transparent substrate 21 side, and delamination is performed between the resin layer 23 and the second metal layer 22. Cause it to occur. Specifically, the laser beam LB is scanned over the entire surface of the second metal layer 22 while converging on the position of the second metal layer 22 (the beam waist is positioned on the second metal layer 22). Accordingly, the second laminated structure 2 includes the laminated body 2a including the second metal layer 22, the color filter layer 24, the second plastic substrate 26, and the alignment mark 27, and the second transparent substrate 21 and the resin layer 23. It isolate | separates into the laminated body 2b.

  Here, the reason why the above delamination occurs due to laser beam irradiation will be described. Here, as an example, the second transparent substrate 21 is made of glass, and the resin layer 23 is made of polyimide resin.

  The polyimide resin is a heat-resistant polymer having an imide group in its structure, as represented by polyamideimide, polybenzimidazole, polyimide ester, polyetherimide, polysiloxaneimide and the like. The polyimide resin can be obtained by reacting diamine and acid anhydride in the presence of a solvent to obtain a polyamic acid resin solution that is a precursor of the polyimide resin, and then imidizing the polyamic acid.

  The moisture permeability of the transparent substrate 21 and the second metal layer 22 with respect to the solvent and water contained in the polyamic acid solution is the adhesion between the resin layer 23 and the transparent substrate 21 and the second metal layer 22, in other words, peeling. Affects sex. That is, a part of the water generated by imidization of the organic solvent or polyamic acid contained in the polyamic acid solution remains in the resin layer 23. When the moisture permeability of the layer adjacent to the resin layer is low, the organic solvent or water remaining in the resin layer 23 concentrates in the vicinity of the interface with the adjacent layer, thereby reducing the adhesion between the resin layer and the adjacent layer. .

  The second transparent substrate 21 and the second metal layer 22 have low moisture permeability. Therefore, in the second laminated structure 2, the adhesion between the resin layer 23 and the transparent substrate 21 and the adhesion between the resin layer 23 and the second metal layer 22 are both low.

  However, the second metal layer 22 absorbs the laser beam LB with higher efficiency than the second transparent substrate 21, the resin layer, and 23. Further, here, the laser beam LB is converged to the position of the second metal layer 22 (the beam waist is positioned on the second metal layer 22). Therefore, the interface between the resin layer 23 and the second metal layer 22 is heated to a higher temperature than the interface between the resin layer 23 and the transparent substrate 21, and the organic solvent and water contained in the resin layer 23 are Vaporization occurs mainly in the vicinity of the interface between the resin layer 23 and the second metal layer 22. As a result, delamination does not occur between the second transparent substrate 21 and the resin layer 23 but occurs between the resin layer 23 and the second metal layer 22.

  As the laser beam LB, a parallel beam may be used instead of the convergent beam. However, using the convergent beam can more reliably prevent delamination between the second transparent substrate 21 and the resin layer 23. In addition, when a convergent beam is used, only a small area can be heated, so that there is little damage to the color filter layer and the like.

  After separating the stacked body 2a from the stacked body 2b as described above, the second metal layer 22 of the stacked body 2a is oxidized to form a metal oxide layer 22 'shown in FIG. The second metal layer 22 is oxidized by, for example, a method of heating by light (laser annealing, heating by infrared rays, flash lamp annealing), a method of oxidizing by heating (annealing by oven, annealing by furnace), or a method of heating by current ( Using Joule heat).

  The metal oxide layer 22 ′ has a higher transmittance for visible light than the second metal layer 22. Therefore, the laminate 2a can be used as a color filter substrate. The metal oxide layer 22 ′ serves as a protective layer for protecting the color filter layer 24 and a barrier layer for suppressing mass transfer between the layers.

  Next, the first laminated structure 1 shown in FIG. 1 and the color filter substrate 2a shown in FIG. 4 are arranged so that the organic EL element faces the color filter substrate 2a. For example, the first laminated structure 1 and the color filter substrate 2a are arranged so that the organic EL element faces the metal oxide layer 22 '.

  Subsequently, in this state, the first alignment mark 17 and the second alignment mark 27 are used to align each other. Specifically, in a state where the color filter substrate 2a and the color filter substrate 2a are arranged so as to face each other, they are illuminated from the color filter substrate 2a side and imaged from the color filter substrate 2a side. Since the color filter substrate 2a does not include the second metal layer 22 having a low transmittance, the illumination and imaging are not hindered. Therefore, alignment with high accuracy is possible.

  Thereafter, as shown in FIG. 5, the aligned first laminated structure 1 and the color filter substrate 2a are bonded together. Thereby, the third laminated structure 3 is obtained.

  For this bonding, for example, an adhesive is used. In this case, an adhesive layer is provided in advance on at least one facing surface of the first laminated structure 1 and the color filter substrate 2a. Here, as an example, a photocurable or thermosetting resin having tackiness is used as the adhesive. Further, the curing of the photocurable or thermosetting resin is performed after the delamination described later is finished.

  Next, as shown in FIG. 6, the first laminated structure LB is irradiated with the laser beam LB from the first transparent substrate 11 side to cause delamination between the first plastic substrate 13 and the first metal layer 12. . Specifically, the laser beam LB is scanned over the entire surface of the first metal layer 12. The laser beam LB used here may be a convergent beam or a parallel beam. When a convergent beam is used as the laser beam LB, the laser beam LB is converged at the position of the first metal layer 12 (the beam waist is positioned at the first metal layer 12).

  As a result, the third laminated structure 3 is divided into the first plastic substrate 13, the circuit layer 14, the light emitting element layer 15, the metal oxide layer 22 ′ (not shown in FIG. 6), the color filter layer 24, the second plastic substrate 26, the first The laminate 3a including the first alignment mark 17 and the second alignment mark 27 and the laminate 3b including the first transparent substrate 11 and the first metal layer 12 are separated.

  Next, the photocurable or thermosetting resin is cured. An adhesive layer formed by curing a photocurable or thermosetting resin exhibits high barrier properties.

  The reason for curing the photocurable or thermosetting resin at this stage is to avoid stress concentration on the organic EL element when delamination occurs. The organic EL element has low adhesion between layers, and when the stress is concentrated, the film peels off. The organic EL element in which film peeling has occurred does not emit light and thus becomes a dark spot. If the photo-curing or thermosetting resin is cured at this stage, the possibility of a dark spot occurring can be kept low.

  Then, a resin film is affixed on the 1st plastic substrate 13 as needed. Thereby, an organic EL element etc. are pinched | interposed with this resin film and a barrier film, and it is set as a structure strong against a bending. As described above, the flexible organic EL display device is obtained.

  For example, an infrared laser beam, a XeCl excimer laser beam, or a YAG: THG laser beam can be used as the laser beam LB irradiated on the first stacked structure 1 and the laser beam LB irradiated on the second stacked structure 2. . Among these, it is preferable to use an infrared laser beam.

  The center wavelength of the XeCl excimer laser beam is 308 nm, and the center wavelength of the YAG: THG laser beam is 355 nm. That is, the center wavelength of these laser beams is in a wavelength region where polyimide exhibits a high absorption rate. However, the XeCl excimer laser and the YAG: THG laser have high apparatus cost and running cost. Further, it is desirable that the laser beam LB with which the second laminated structure 2 is irradiated is less absorbed by the resin layer 23.

  Infrared lasers, for example, infrared fiber lasers, have lower apparatus costs and running costs than XeCl excimer lasers and YAG: THG lasers. An infrared laser beam is less absorbed by polyimide.

  As is clear from the above description, in the method according to the embodiment, delamination can be generated with relatively low energy by using the first metal layer 12 and the second metal layer 22. In addition, since the resin layer 23 provided for causing delamination is not included in the final product, this does not adversely affect the display. The second metal layer 22 is oxidized to form a metal oxide layer 22 ′ having a higher visible light transmittance. Accordingly, the first stacked structure 1 and the color filter are used with the use of the second metal layer 22. Positioning with the substrate 2a does not become difficult, and the display is not adversely affected. Therefore, according to this method, it becomes easy to manufacture a flexible organic EL display device that employs a top emission structure and can display a color image.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

  DESCRIPTION OF SYMBOLS 1 ... 1st laminated structure 1, 2 ... 2nd laminated structure, 2a ... laminated body, 2b ... laminated body, 3 ... 3rd laminated structure, 3a ... laminated body, 3b ... laminated body, 11 ... 1st transparent substrate, 12 DESCRIPTION OF SYMBOLS 1st metal layer, 13 ... 1st plastic substrate, 14 ... Circuit layer, 15 ... Light emitting element layer, 17 ... 1st alignment mark, 21 ... 2nd transparent substrate, 22 ... 2nd metal layer, 22 '... Metal oxidation Material layer, 23 ... resin layer, 24 ... color filter layer, 26 ... second plastic substrate, 27 ... second alignment mark, LB ... laser beam.

Claims (7)

  1. A first transparent substrate, a first metal layer formed on the first transparent substrate, a first plastic substrate formed on the first metal layer, and an organic EL element formed on the first plastic substrate Forming a first laminated structure provided with a first alignment mark so as to face the first transparent substrate with at least the first metal layer interposed therebetween;
    A second transparent substrate; a resin layer formed on the second transparent substrate; a second metal layer formed on the resin layer; a color filter layer formed on the second metal layer; and the color filter layer Forming a second laminated structure including a second plastic substrate formed thereon, and having a second alignment mark so as to face at least the second transparent substrate with the resin layer interposed therebetween;
    By irradiating the second laminated structure with a laser beam from the second transparent substrate side, delamination occurs between the resin layer and the second metal layer, and the second metal layer, the collar A first laminate including a filter layer and the second plastic substrate and provided with the second alignment mark is obtained, and the first laminate is provided with the second transparent substrate and the resin layer. Separating from the laminate,
    Oxidizing the second metal layer of the first laminate to obtain the first laminate obtained by oxidizing the second metal layer as a color filter substrate;
    The first laminated structure and the color filter substrate are arranged with respect to each other using the first and second alignment marks in a state where the organic EL element and the oxidized second metal layer face each other. The process of aligning and
    Bonding the aligned first laminated structure and the color filter substrate;
    Thereafter, a laser beam is irradiated onto the first laminated structure from the first transparent substrate side, thereby causing delamination between the first plastic substrate and the first metal layer, and thereby the first plastic substrate. And a step of separating the third laminate including the organic EL element and the color filter substrate from the fourth laminate including the first transparent substrate and the first metal layer. Manufacturing method.
  2.   The manufacturing method according to claim 1, wherein the second stacked structure is irradiated with the laser beam so as to converge at a position of the second metal layer 22.
  3.   The manufacturing method according to claim 1, wherein the laser beam applied to the first stacked structure and the laser beam applied to the second stacked structure are infrared laser beams.
  4.   4. The manufacturing method according to claim 1, wherein the material of the second metal layer is at least one selected from the group consisting of titanium, aluminum, gallium, indium, molybdenum, tungsten, and zinc.
  5.   The material of the second plastic substrate is at least one selected from the group consisting of aramid, cycloolefin, polyamideimide, polycarbonate, polymethyl methacrylate, polyethersulfone, acrylic resin, and epoxy resin. The manufacturing method of any one of Claims 1.
  6.   The manufacturing method according to claim 1, wherein a material of the first plastic substrate and a material of the resin layer are polyimide.
  7. A step of aligning the first laminated structure and the color filter substrate with respect to each other;
    The first laminated structure includes a first transparent substrate, a first metal layer formed on the first transparent substrate, a first plastic substrate formed on the first metal layer, and on the first plastic substrate. A first alignment mark is provided so as to face the first transparent substrate with at least the first metal layer interposed between the organic EL elements formed,
    The color filter substrate includes a second transparent substrate, a resin layer formed on the second transparent substrate, a second metal layer formed on the resin layer, and a color filter layer formed on the second metal layer. And a second plastic substrate formed on the color filter layer, and forming a second laminated structure provided with a second alignment mark so as to face the second transparent substrate with at least the resin layer interposed therebetween Then, by irradiating the second laminated structure with a laser beam from the second transparent substrate side, delamination occurs between the resin layer and the second metal layer, and the second metal layer, A first laminated body including the color filter layer and the second plastic substrate and provided with the second alignment mark is obtained, and the first laminated body is formed of the second transparent substrate and the resin layer. Separated from the second stack was example, can be obtained by oxidizing the second metal layer of the first laminate, the second metal layer is a first laminate is oxidized,
    The first laminated structure and the color filter substrate are aligned using the first and second alignment marks in a state where the organic EL element and the oxidized second metal layer are arranged to face each other. Steps to be performed,
    Bonding the aligned first laminated structure and the color filter substrate;
    Thereafter, a laser beam is irradiated onto the first laminated structure from the first transparent substrate side, thereby causing delamination between the first plastic substrate and the first metal layer, and thereby the first plastic substrate. And a step of separating the third laminate including the organic EL element and the color filter substrate from the fourth laminate including the first transparent substrate and the first metal layer. Manufacturing method.
JP2014073136A 2014-03-31 2014-03-31 Method for manufacturing flexible organic el display device Pending JP2015195140A (en)

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