JP2015194966A - Ic tag housed in instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC tag excellent in housing performance in an instrument and high in reliability.SOLUTION: An IC tag housed in an instrument is housed in a hole formed in a metal housing part that instrument has, and has: an inlay which is provided at a position arranged in the hole of the housing part and has an antenna winding part and an IC chip; a magnetic sheet provided at a position that is arranged on a more depth side than the inlay of the hole of the housing part; a first synthetic resin part provided at a position arranged on the depth side of the hole of the housing part; and a second synthetic resin part provided at a position arranged on an opening side of the hole of the housing part. The magnetic sheet is a magnetic sheet to which degassing processing has been applied.

Description

  The present invention relates to an IC tag stored in a device, and more particularly to an IC tag having a structure suitable for storage in a device.

  Small devices having a function of reading and writing information stored in advance and information to be newly written in a non-contact state are widely used. Such a small device has, for example, an antenna for transmitting / receiving information and an IC chip with a processing circuit for processing information, and a function for transmitting / receiving information stored or to be stored in response to an external inquiry. Have This apparatus can make an antenna and a processing circuit very small, and can be used by attaching to various things. In this specification, a small device having a small antenna and an IC chip and capable of transmitting and receiving information in a non-contact state is referred to as an IC tag.

  Of course, what is generally called an IC tag is included in the IC tag of this specification. In addition, the IC tag of this specification desirably has a function of reading information stored in advance or a function of writing new information, but is not limited to this, and has a function of reading at least stored information. Then, the problems described in the following embodiments can be solved, and an effect can be obtained.

  Since the IC tag is very small and has a relatively simple configuration, there is an advantage that it has a long life. For example, by attaching IC tags to various structures such as bridges and tunnels, various facilities, and various other things, information stored when necessary can be read from the IC tag and new information can be written. it can. This enables various management over a long period of time that has not been possible until now. In the future, various uses will be considered, and the needs will expand.

  The IC tag can be attached to a management object directly managed, for example, various buildings, various facilities, and other objects, but since the IC tag is very small, the IC tag is stored in an easy-to-handle object, It is more convenient in terms of handling and management to attach an object containing an IC tag to a management target. The above-mentioned thing holding an IC tag is not particularly limited, and in the present specification, such a thing will be called an instrument. A device storing an IC tag is not only easier to attach to a management target, but also better in terms of protection of the IC tag. An example of an instrument provided with an IC tag is disclosed in Patent Document 1, for example.

Japanese Patent Laid-Open No. 2006-200736

  Since the appliance containing the IC tag is attached to various management objects including buildings and facilities, the appliance may have various shapes and functions. In addition, it is conceivable that the appliance may be used for a long period of several decades in a harsh natural environment. For this reason, it is desired that the IC tag accommodated in the above-described instrument has excellent storability in the instrument and high reliability.

  An object of the present invention is to provide an IC tag that is excellent in storage property in an instrument and has high reliability.

  A first invention for solving the above-described problem is an IC tag accommodated in a hole formed in a metal housing part included in an instrument, provided at a position arranged in the hole of the housing part, and provided with an antenna. And an inlay having an IC chip, a magnetic sheet provided at a position further to the back of the inlay of the hole of the storage section, and a position to be disposed at the back of the hole of the storage section A first synthetic resin portion and a second synthetic resin portion provided at a position on the opening side of the hole of the storage portion, and the magnetic sheet is degassed. It is the IC tag stored in the instrument characterized by being a magnetic sheet.

  According to a second invention for solving the above-described problem, in the IC tag housed in the instrument of the first invention, the second synthetic resin portion has a synthetic resin film made of a thermoplastic resin as a material by electrostatic coating. The second synthetic resin portion has a lower electrical resistance than that of the first synthetic resin portion. It is an IC tag accommodated in the instrument characterized by having.

  According to a third aspect of the present invention for solving the above problems, in the IC tag housed in the instrument according to one of the first and second aspects, the area of the opening-side surface of the second synthetic resin portion An IC tag housed in an instrument, wherein the second synthetic resin portion has a shape larger than a cross-sectional area parallel to the opening-side surface at a position on the back side from the opening-side surface.

  According to a fourth aspect of the present invention for solving the above-described problem, in the IC tag housed in the instrument according to any one of the first to third aspects of the invention, the second synthetic resin portion is opposite to the opening side surface. A recess is formed on the side, the inlay is disposed inside the recess, and a silicone resin is provided between the bottom surface of the recess and the inner surface of the inlay on the IC tag side. It is an IC tag stored in the instrument.

  According to a fifth invention for solving the above-mentioned problem, in the IC tag housed in the instrument of the fourth invention, the antenna of the inlay is formed by forming a coated thin metal wire into a coil shape, and the IC tag A chip is arranged inside the antenna formed in a coil shape, and the antenna and the IC chip are connected by a connection terminal provided on the first surface of the IC chip, and is formed in the second synthetic resin portion. The concave portion has a diameter larger than the diameter of the coil shape of the antenna, and the coil-shaped antenna is disposed on the bottom surface side of the concave portion of the second synthetic resin portion, and the IC The IC chip is disposed so that the first surface of the chip faces the bottom surface, and the silicone rubber is provided between the first surface of the IC chip and the bottom surface of the recess, 2) The instrument, wherein the magnetic sheet degassed from the inlay of the concave portion of the synthetic resin portion is disposed, and the first synthetic resin portion is made by injection molding. IC tag to be stored.

  According to the present invention, it is possible to obtain an IC tag which is excellent in storage property in an instrument and has high reliability.

It is explanatory drawing which shows the whole structure of the instrument with which this invention was applied. It is explanatory drawing explaining the structure of the tag holding | maintenance part of FIG. FIG. 3A is an enlarged view of a portion 20 in FIG. 2, FIG. 3A shows a desirable shape, and FIG. 3B is an enlarged view showing an undesirable shape. It is explanatory drawing explaining an effect | action of a magnetic sheet. It is explanatory drawing explaining the structure of a magnetic sheet. It is explanatory drawing explaining the manufacturing procedure of IC tag 50, and is explanatory drawing explaining the appropriate quantity of the silicone resin which protects IC chip 72 especially. It is explanatory drawing explaining the manufacture procedure of IC tag 50, and is explanatory drawing explaining especially arrangement | positioning of the inlay 70. FIG. It is explanatory drawing explaining the manufacture procedure of IC tag 50, and is explanatory drawing explaining arrangement | positioning of the magnetic sheet 60 by which the degassing process of the magnetic sheet and the degassing process were carried out especially. It is explanatory drawing explaining the manufacture procedure of IC tag 50, and the attachment procedure to the instrument 10. FIG.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, modes for carrying out the invention (hereinafter referred to as examples) will be described with reference to the drawings. The following embodiments solve various problems required for commercialization and have various effects. These contents not only solve the problems to be solved by the above-described invention and the problems and effects that remain within the scope described in the column of the effects of the invention, but also solve various problems beyond the scope and achieve various effects. Play. These problems and effects will be described in the following description of the embodiments.

  In the drawings for explaining the following embodiments, the same reference numerals may be given to substantially the same configuration, the configuration having the same action, or the substantially the same procedure, and the overlapping description may be omitted.

1. Description of Overall Configuration when the Present Invention is Applied to an Instrument as a Bolt FIG. 1 shows an embodiment to which the present invention is applied, and an example in which the instrument 10 to which the present invention is applied is a bolt. Note the application of the present invention is not limited to the bolt, it can be applied to various devices to be managed. In the present invention, necessary information is stored in an IC tag, and the IC tag is fixed to a management target using an instrument, so that information can be written to the IC tag fixed to the management target when necessary. In addition, information can be read from the IC tag.

  As a specific method for storing information, after storing necessary information in the IC tag in advance, the IC tag may be fixed to the management target using an instrument, or the management target may be managed using an instrument. Necessary information may be stored by adding or changing new information to information already stored after the IC tag is fixed. When the management target is large or heavy, the IC tag is first fixed to an article that is easy to transport or handle, rather than the method of fixing the IC tag to the management target itself, and the article with the IC tag fixed is fixed to the management target. This is superior in various respects such as workability.

  In FIG. 1, a tool 10 that is a bolt has a storage portion 12 and a screw portion 14 for storing an inlay 70 that is a combination of an IC chip and an antenna. In this embodiment, the storage portion 12 is a part of the head of a bolt that is the instrument 10. Since the bolt is entirely made of metal, the instrument 10 is entirely made of metal in this example, but the instrument 10 to which the present invention is applied does not need to be entirely made of metal. In the following description, it is assumed that at least the storage portion 12 is made of metal.

  The storage portion 12 of the instrument 10 has a first surface 18 on the opposite side of the screw portion 14, and a hole 16 having an opening in the first surface 18 is formed in the storage portion 12. The inlay 70 is housed in the hole 16 formed in the housing portion 12 while being held inside the IC tag 50. The outer peripheral shape of the hole 16 is circular, for example, and in this case, the outer peripheral shape of the IC tag 50 is also circular. The outer shape of the hole 16 may be a square or rectangle other than a circle, but it is preferable to avoid stress concentration, and a circle or ellipse with no corners is preferred. Moreover, even if it is a square shape or a rectangular shape, it is preferable that the corners have a curved shape. In this embodiment, it has a substantially circular shape with the least concentration of stress. When the outer peripheral shape of the IC tag 50 is circular, not only the productivity is improved, but the shape in which stress is difficult to concentrate is excellent in terms of durability against temperature change and the like.

  In this embodiment, the IC tag 50 has an opening-side surface 58 at the opening portion of the hole 16, and the first surface 18 of the storage portion 12 provided with the opening and the opening-side surface 58 of the IC tag 50. And has a continuously connected shape. For example, the shape formed by whether the first surface 18 and the opening-side surface 58 are continuously connected may be a planar shape, or may be a phase shape in which the central portion of the opening-side surface 58 is slightly raised or slightly depressed. May be. It is important that the meeting portion between the first surface 18 of the storage portion 12 and the opening side surface 58 of the IC tag 50 is smoothly and continuously connected so that it cannot be visually recognized.

  By covering the opening side surface 58 of the IC tag 50 and the first surface 18 located outside the opening of the hole 16 with the synthetic resin coating 30, it is difficult to determine the presence or absence of the IC tag 50 only by looking at the appearance. Become. As described above, in the shape in which the meeting portion between the first surface 18 of the storage portion 12 and the opening side surface 58 of the IC tag 50 is continuously and smoothly connected, the surface of the synthetic resin coating 30 has the second portion of the storage portion 12. The shape of the meeting portion between the first surface 18 and the opening side surface 58 of the IC tag 50 does not appear. Accordingly, when the synthetic resin coating 30 is viewed from the outside, the entire inside of the synthetic resin coating 30 appears to be the first metal surface 18, and the holes 16 are formed or the IC tag 50 is present. I do not understand.

  It is very important in managing the management object that the instrument 10 in which the inlay 70 is stored is fixed to various management objects and the inlay 70 is read out when the stored information is necessary. If the presence of the IC tag 50 is known, the IC tag 50 may be intentionally destroyed. Even if it is not so malicious, it is conceivable that the IC tag 50 is damaged in an interesting manner, and as a result, information cannot be read from the inlay 70. In order to prevent this, it is desirable to make the presence of the IC tag 50 inconspicuous.

  A plurality of appliances 10 with IC tags 50 may be attached to the management object, and furthermore, the appliance 10 having the IC tag 50 and the appliance 10 having no IC tag 50 are each or a plurality of appliances to be managed. It may be attached to an object. For example, when the instrument 10 is a bolt, the bolt having the IC tag 50 and the bolt not having the IC tag 50 have the same shape and the same design so that the external appearance of the bolt is not the same, and a plurality of these bolts are managed. You may make it attach to a target object. This makes it difficult to find the bolt having the IC tag 50 at first glance, and further increases the possibility of not even realizing that the bolt having the IC tag 50 is attached. This reduces the possibility that the bolt having the IC tag 50 is intentionally destroyed. In order for the instrument 10 that is a bolt having the IC tag 50 and the instrument that is a bolt not having the IC tag 50 to be the same in appearance, each appearance must be the same when attached to the management object. Desirably, for this purpose, it is preferable that the meeting portion between the first surface 18 of the storage portion 12 and the opening-side surface 58 of the IC tag 50 is continuously and smoothly connected.

  As described above, when the outer periphery of the IC tag 50 is circular, the hole 16 is easily processed, and the processing accuracy of the hole 16 and the contact portion of the IC tag 50 is improved. Further, the pressure between the outer periphery of the IC tag 50 and the inner surface of the hole 16 can be managed relatively easily, and the continuity of the meeting portion between the first surface 18 of the storage portion 12 and the opening-side surface 58 of the IC tag 50 described above. Is easier to maintain. Furthermore, even if the IC tag 50 is used in the storage unit 12 for many years, it is difficult for the shape to change. This leads to a long life of the instrument 10 having the IC tag 50. For example, when the appliance 10 having the IC tag 50 is used in a building such as a bridge or a tunnel as an example, it is necessary to maintain the IC tag 50 in an operable state for a long period of several decades. On the other hand, the instrument 10 is placed in a severe natural environment such as temperature change, salt damage, and water for a long period of time. In order to keep the IC tag 50 usable for many years under such adverse conditions, the structure of the IC tag 50 is important as described below. The state of contact with the portion 12 and the state of the synthetic resin coating 30 covering them are very important. For this reason, the outer periphery of the IC tag 50 is circular, or the meeting portion between the first surface 18 of the storage portion 12 and the opening side surface 58 of the IC tag 50 is continuously and smoothly connected. However, it is also important from the viewpoint of extending the life of the instrument 10.

  In this embodiment, the contact state between the IC tag 50 and the storage portion 12 and the synthetic resin film 30 covering them are nylon coating, and this nylon coating is formed by electrostatic coating. The coating material for electrostatic coating used for the nylon coating is at a relatively high temperature, for example, 200 ° C. At this temperature, if the solder is not used for the antenna coil terminal portion and the connection terminal of the IC chip, the IC tag 50 The built-in inlay 70 is not damaged. Nylon coating can also withstand high temperatures and withstand harsh natural environments. Nylon coating has a low coefficient of friction and excellent corrosion resistance and wear resistance. Moreover, even if something hits the synthetic resin coating 30, it is difficult to peel off and is excellent in impact resistance. For this reason, even if the instrument 10 is a part used for a building, for example, a bolt, it is possible to reduce damage during transportation or construction. Furthermore, when used outdoors, it may be exposed to ultraviolet rays or the like, but the nylon coating has a property resistant to ultraviolet rays. The nylon coating also has excellent adhesion to the first surface 18 and the opening side surface 58. Thus, the synthetic resin coating 30 made of nylon has excellent characteristics that are not easily deteriorated or damaged even in a severe natural environment for a long period of time. It is also important to adopt a method of connecting the antenna coil terminal and the connection terminal (bump) of the IC chip which is less likely to cause damage to the inlay 70 due to heat during electrostatic coating as described above.

2. Description of Structure of IC Tag 50 FIG. 2 shows an outline of the structure of the IC tag 50. The IC tag 50 includes a first synthetic resin portion 52, a second synthetic resin portion 54, an inlay 70 having an IC chip 72 and an antenna 74 held therein, a magnetic sheet 60, and an IC chip of the inlay 70. And a silicone resin 68 for protecting 72. This figure is a conceptual diagram, and there may be a space filled with air inside, or the silicone resin 68 may be spread thinly. Furthermore, the shape of the first synthetic resin portion 52 and the second synthetic resin portion 54 may be different from the shape shown in the figure.

  In this embodiment, the antenna 74 has an antenna winding portion 75 formed by winding a covered thin wire in a circle, and a lead portion 77 that connects the antenna winding portion 75 to a terminal of the IC chip 72. ing. In addition, the IC chip 72 has a terminal (not shown) for connection to the lead portion 77 described above. As described below, the connection portion between the terminal of the IC chip 72 and the lead portion 77 of the antenna 74 is a structurally weak portion, and has a structure protected by the silicone resin 68. With this structure, the first synthetic resin portion 52 described below is not damaged even under high pressure when injection molding. The lead portion 77 is a thin wire, and the stress of the antenna winding portion 75 is suppressed from being applied to the terminal connection portion of the IC chip 72. For this reason, when the first synthetic resin portion 52 is injection-molded, it is possible to prevent the connection portion between the terminal of the IC chip 72 and the lead portion 77 from being damaged. Further, the antenna winding portion 75 itself has elasticity, and can withstand high pressure when the first synthetic resin portion 52 is injection molded.

  The completed IC tag 50 has a structure in which the inlay 70 and the magnetic sheet 60 are protected by the first synthetic resin portion 52 and the second synthetic resin portion 54, and has high reliability in a harsh natural environment. However, in the manufacturing process, particularly in the injection molding process of the first synthetic resin portion 52, it is preferable that the inlay 70 has a structure that is not easily damaged. Such a problem can be solved by the structure described above.

  In this embodiment, as described above, the outer periphery of the IC tag 50 is circular, and the IC tag 50 is housed in the hole 16 formed in the metal housing portion 12 of the instrument 10. The opening of the hole 16 provided in the storage portion 12 has a diameter larger than the diameter of the antenna winding portion 75. The antenna 74 is configured by a coil manufactured by winding a covered thin wire a plurality of times, and the antenna surface 76, which is a surface around which the thin wire is wound, includes the first surface 18, the opening-side surface 58, and the hole 16. The inlay 70 is disposed so as to be aligned with the opening surface of the opening. Of course, it is very preferable that the antenna surface 76 is in parallel with the first surface 18, the opening-side surface 58, and the opening surface of the opening of the hole 16. Is possible. Hereinafter, the arrangement relationship at such an angle including the parallel arrangement is referred to as an arrangement in which the arrangement is made.

  The magnetic sheet 60 is provided to reduce the influence of the metal around the inlay 70, and the operation of the magnetic sheet 60 will be described below. In this embodiment, a recess 56 is formed in the second synthetic resin portion 54, and an inlay 70 and a magnetic sheet 60 are provided inside the recess 56. Thus, by providing the magnetic sheet 60 further on the back side of the inlay 70, the influence of the metal storage portion 12 having the holes 16 can be reduced. In addition, the structure in which the inlay 70 and the magnetic sheet 60 are provided inside the recess 56 provided in the second synthetic resin portion 54 facilitates the molding of the first synthetic resin portion 52 and improves the productivity of the entire IC tag 50. The production procedure of the IC tag 50 will be described below.

3. Description of Method for Forming Smooth Continuous Synthetic Resin Film 30 To prevent the device 10 from being provided with the IC tag 50 from the appearance alone, it is important to solve the following two problems: is there. Problem 1 is that the opening-side surface 58 of the IC tag 50 and the first surface 18 of the storage unit 12 are smoothly and integrally connected at the meeting part. By setting it as such a shape, the unevenness | corrugation showing the meeting part of the 2nd synthetic resin part 54 and the accommodating part 12 on the surface of the synthetic resin film 30 becomes difficult to appear. Problem 2 is to prevent the difference in the material of the surface to be coated. In this embodiment, the synthetic resin film 30 is formed by electrostatic coating. The coated surfaces are not the same material, but one is a first surface 18 made of a metal material, and the other is an opening side surface 58 made of a resin material. It is preferable to apply a continuous uniform coating on two surfaces to be coated of different materials. Hereinafter, the correspondence between Problem 1 and Problem 2 will be described in order.

3.1 Description of Solution for Problem 1 (1) Response to Occurrence of Indentation 32 in Portion 20 Portion 20 that is the outer periphery of the opening of hole 16 shown in FIG. This is a meeting portion with 12 first surfaces 18. An enlarged view of the portion 20 is shown in FIG. In the manufacture of the IC tag 50 described below, the diameter of the IC tag 50 is slightly larger than the diameter in the depth direction. That is, the second synthetic resin portion 54 is molded so that the area of the opening-side surface 58 is slightly larger than the cross-sectional area of the surface parallel to the opening-side surface 58 located slightly behind. The IC tag 50 having such a shape is inserted into the hole 16 of the storage unit 12. Since the diameter of the IC tag 50 is slightly larger than the inner diameter of the hole 16, the inner surface of the IC tag 50 is always subjected to a pressing force, that is, a pressure P2, against the inner surface of the storage portion 12. Further, as described above, the diameter of the vicinity of the opening side surface 58 of the IC tag 50 is made larger, so that the pressure P1 that is a pressure larger than the pressure P2 acts on the inner surface of the storage portion 12.

  FIG. 3B shows an unfavorable state, and a dent 32 is formed at the meeting portion between the opening-side surface 58 and the first surface 18. The dent 32 may occur immediately after production, or the dent 32 may occur after a certain period when the instrument 10 itself is used for many years even if the dent 32 does not occur immediately after production. There is. Neither of these is preferred. When nylon is used as the synthetic resin coating 30, since nylon is elastic, even if a dent occurs between the opening-side surface 58 and the first surface 18, immediately after that, the nylon is applied to the outer surface of the synthetic resin coating 30. The dent 32 may not appear. However, if there is a dent in the joint between the opening-side surface 58 and the first surface 18, the dent 32 will eventually appear on the surface of the synthetic resin film 30 coating that portion. In order to prevent such a situation from occurring as much as possible, the vicinity of the opening surface 58 of the synthetic resin coating 30 presses the vicinity of the first surface 18 of the storage portion 12 and the side surface of the IC tag 50 on the back side stores the pressure P1. It is preferable to maintain a large state by the pressure P2 that presses the inner surface of the portion 12. Problem 1 can be solved by making the diameter in the vicinity of the opening side surface 58 of the IC tag 50 larger than the diameter on the far side.

(2) Response to temperature change of the instrument 10 The instrument 10 is sufficiently considered to be used under a very severe temperature environment. For this reason, it is preferable to be able to withstand severe temperature changes. Resin materials generally have a higher coefficient of linear thermal expansion than metal materials. In order to cope with the temperature change, it is preferable that the linear thermal expansion coefficient of the resin material is close to the linear thermal expansion coefficient of the metal material. Therefore, it is preferable to mold the first synthetic resin portion 52 and the second synthetic resin portion 54 by mixing carbon such as carbon fiber or graphite powder. In addition, when forming the synthetic resin film 30 by electrostatic coating, it is preferable to reduce the electrical resistance of the 2nd synthetic resin part 54, and to raise the mixing density of carbon further. This will be further described below.

  For example, polyphenylene sulfide (hereinafter referred to as PPS) may be used as the material of the first synthetic resin portion 52 and the second synthetic resin portion 54 so that the instrument 10 may be placed in a harsh natural environment. preferable. PPS is very stable at 200 ° C. or less, and is less deteriorated even when used for many years. Moreover, if it is 200 degrees C or less, high rigidity is maintained also with respect to a big temperature change, and high intensity | strength is maintained. It also has excellent impact strength. The fluidity at the time of injection molding is also good. However, since the PPS material has a larger coefficient of linear thermal expansion than the metal material that is the material of the storage unit 12, it is preferable to add carbon to lower the coefficient of linear thermal expansion as described above.

  Even if there is a difference in linear thermal expansion coefficient between the metal material constituting the storage part 12 and the first synthetic resin part 52 or the second synthetic resin part 54, the difference is within the predetermined range. 2 and FIG. 3 can be absorbed by the pressure P1 and the pressure P2 shown in FIG. 3, and it is possible to prevent the depression 32 shown in FIG.

3.2 Explanation of Solution to Problem 2 (1) Explanation of Generation of Synthetic Resin Coating 30 It is possible to paint on objects to be painted in various shapes by atomizing a paint such as nylon and spraying it on the surface to be painted. It is. In this case, the atomized paint scatters in various directions as well as the object to be coated. Electrostatic coating is performed to efficiently collect the atomized paint on the surface of the object to be coated. In electrostatic coating, fine particles of paint are negatively charged, and a positive high voltage is applied to the surface to be coated. The sprayed paint in the atomized state is guided to electric lines of force based on the electric field between the surface to be coated and the sprayer of the electrostatic coating machine to form a synthetic resin film 30 on the surface to be coated. When the state of the lines of electric force based on the electric field between the surface to be coated and the sprayer of the electrostatic coating machine changes, the state such as the thickness of the formed synthetic resin film 30 changes. For example, when the density of electric lines of force changes between the first surface 18 of the storage portion 12 and the opening-side surface 58 of the second synthetic resin portion 54, the amount of negatively charged paint particles adhering to the surface to be coated changes. When the change in the amount of adhesion is large, the thickness of the synthetic resin coating 30 changes at the boundary between the first surface 18 of the storage portion 12 and the opening-side surface 58 of the second synthetic resin portion 54, and the presence of the IC tag 50 appears on the appearance. appear.

(2) Explanation of Solution for Problem 2 In this embodiment, by reducing the resistance value of the second synthetic resin portion 54, the difference in the density of lines of electric force between the first surface 18 and the opening-side surface 58 is reduced, The difference between the state of the synthetic resin film 30 on the surface of the first surface 18 and the state of the synthetic resin film 30 on the surface of the opening-side surface 58 is reduced. The resistance of the second synthetic resin portion 54 having a cross-sectional area of 1 cm 2 and a length of 1 cm is set to 1 kΩ or less, preferably about 10Ω. As a method of reducing the resistance value in this way, the proportion of carbon fiber or graphite powder mixed when the resin material is PPS is increased. Incidentally, in the first synthetic resin portion 52, carbon fiber or graphite powder is mixed with PPS which is the first synthetic resin portion 52 resin material in order to make the linear thermal expansion coefficient close to the metal material of the storage portion 12, but the carbon fiber or graphite powder is mixed with the first synthetic resin portion 52. The mixed first synthetic resin portion 52 has a cross-sectional area of 1 square centimeter and a resistance value of 1 centimeter in length of about 1 MΩ to 10 KΩ. In order to lower the resistance value with respect to the mixing ratio of carbon fiber or graphite powder to PPS for lowering the linear thermal expansion coefficient, more carbon fiber or graphite powder is mixed into PPS.

  As described above, the ratio of carbon fiber or graphite powder mixed in PPS is increased, and the resistance value of 1 cm in length and 1 cm in cross section of the second synthetic resin portion 54 is set to 1 kΩ or less, preferably 100Ω or less. Further, by setting the resistance to about 10Ω, the difference in electric field between the first surface 18 of the storage portion 12 made of a metal material and the opening-side surface 58 of the second synthetic resin portion 54 made of PPS, that is, the line of electric force It is possible to reduce the density difference and to form the substantially uniform synthetic resin coating 30 on the first surface 18 and the opening-side surface 58.

  It is not preferable to further reduce the resistance value of the second synthetic resin portion 54 because the characteristics of the resin material of the second synthetic resin portion 54 are deteriorated. In addition, the adverse effect on the propagation of radio waves between the antenna 74 of the built-in inlay 70 and the external transmission / reception device is increased, resulting in a new failure. For example, an eddy current due to an electromagnetic wave that is a transmission / reception radio wave becomes large, and the electromagnetic wave cannot propagate. As a result, electromagnetic waves from the external transmission / reception device do not enter the IC tag 50, and communication between the antenna 74 and the external transmission / reception device cannot be performed.

4). Other effects of the IC tag 50 In this embodiment, the adhesion between the opening-side surface 58 and the synthetic resin film 30 formed by electrostatic coating is good, and the instrument 10 can be placed in a severe natural environment for many years. , Less likely to peel. If the synthetic resin coating 30 is peeled off, moisture may adhere to the peeled portion, and the electrical resistance value of the opening-side surface 58 may become very small. If the electrical resistance value of the opening-side surface 58 becomes very small, a phenomenon that electromagnetic waves are prevented from entering occurs, and as a result, communication between the antenna 74 and an external transmission / reception device becomes difficult. Since the synthetic resin coating 30 is made of nylon, even if the instrument 10 is placed in a harsh natural environment, the synthetic resin coating 30 hardly peels off from the opening-side surface 58, and the antenna 74 and the external transmission / reception device as described above. Communication failure with

  The adhesion between the first synthetic resin portion 52 and the second synthetic resin portion 54 is very good. For this reason, even if the instrument 10 is used under a severe natural environment for many years, almost no moisture enters from the contact surface between the first synthetic resin portion 52 and the second synthetic resin portion 54. If moisture enters the inside, the antenna 74 and the IC chip 72 may be damaged. Furthermore, not only that, even if the antenna 74 and the IC chip 72 are not damaged, a surface with low electrical resistance may be generated. In this case, communication failure between the antenna 74 and the external transmission / reception device may occur. That is, there is a possibility that the surface of low electrical resistance acts to shield radio waves. In the present embodiment, by using PPS for the first synthetic resin portion 52, and by using PPS for the first synthetic resin portion 52 and the second synthetic resin portion 54, a good adhesion structure is maintained. Intrusion of moisture or the like hardly occurs, and the above-described problems can be solved.

5. Description of Magnetic Sheet 60 (1) Description of Structure and Action of Magnetic Sheet 60 FIG. 4 is an explanatory view for explaining the action of the magnetic sheet 60, and FIG. 5 is an explanatory view for explaining an example of the structure of the magnetic sheet 60. It is. In FIG. 4, the description of the first synthetic resin portion 52 and the second synthetic resin portion 54 is omitted to avoid complication.

  The antenna winding portion 75 of the inlay 70 is disposed so that the antenna surface 76 is aligned with the synthetic resin coating 30, and the longitudinal surface of the magnetic sheet 60 is further with respect to the synthetic resin coating 30 and the antenna surface 76. The magnetic sheets 60 are arranged so as to be arranged side by side. Note that the side-by-side arrangement is an arrangement state within an angle range of several tens of degrees with respect to the parallel state including the parallel arrangement as defined above. When the antenna 104 of the external transmission / reception device 102 is brought close to the synthetic resin coating 30 and energy such as radio waves is propagated, the propagation energy propagates toward the antenna winding portion 75 of the inlay 70, and the propagation energy E2 that is a part of the propagation energy. Reaches the antenna winding portion 75, and information can be exchanged between the antenna 104 and the antenna 74. The propagation energy E1 is the propagation energy that does not reach the inner antenna 74 of the propagation energy transmitted from the antenna 104.

  If the magnetic sheet 60 is not provided, an eddy current flows in the storage portion 12 surrounding the periphery of the antenna 74 based on the propagation energy from the antenna 104, particularly in the storage portion 12 existing behind the hole 16, and the eddy current As a result, an electromagnetic wave in a direction that cancels the propagation energy of the antenna 104 is generated. In other words, there is a state in which there is a large propagation resistance that acts to prevent propagation of propagation energy from the antenna 104. It is considered that this propagation resistance tends to increase as the depth of the hole 16 increases. For this reason, if the magnetic sheet 60 is not provided, the energy irradiated by the antenna 104 of the external transmission / reception device 102 is only propagated as the propagation energy E1, and the propagation energy E2 does not exist. It becomes difficult to exchange information. This description is a conceptual explanation, and the propagation energy E2 is not completely lost, but the state changes depending on various conditions, and the exchange of information is adversely affected.

  By providing the magnetic sheet 60, electromagnetic waves in a direction that cancels the propagation energy E2 due to the generation of eddy currents in the storage portion 12, particularly the back surface of the storage portion 12, is suppressed or absorbed. As a result, it is possible to reduce the propagation resistance that prevents the propagation of the propagation energy described above between the antenna 104 and the magnetic sheet 60. In the present embodiment, the hole 16 of the storage portion 12 is formed in a shape in which the length of the width L2 is longer than the length of the depth L1. With such a shape, transmission / reception between the external transmission / reception device 102 and the inlay 70 becomes easier.

  Further, the shape of the antenna winding portion 75 is many times longer in the width L2 direction than in the depth L1 direction. Further, the IC chip 72 is provided inside the antenna winding portion 75 and can be arranged within the range of the length of the antenna winding portion 75 in the depth L1 direction in the depth L1 direction. In the IC tag 50, the inlay 70 and the magnetic sheet 60 are arranged side by side in the depth L1 direction. However, the length of the inlay 70 and the magnetic sheet 60 in the depth L1 direction is much larger than the length in the width L2 direction. Since it is short, the depth L1 of the IC tag 50 can be made shorter than the width L2, and the influence of the metal material of the storage portion 12 can be reduced. Further, the length in the radial direction of the magnetic sheet 60 can be made larger than the length in the depth direction at the position where the magnetic sheet 60 is arranged, and the effect of the magnetic sheet 60 is further exhibited.

  FIG. 5 shows an example of the structure of the magnetic sheet 60. For example, a magnetic material 64 is kneaded into a rubber-like base material 62 in the magnetic sheet 60. The magnetic material 64 is, for example, ferrite powder, and attenuates electromagnetic waves to be transmitted by absorbing electromagnetic energy. FIG. 5 shows an example, in which iron powder is kneaded into a rubber-like base material 62 so that reflected waves on the front and back surfaces of the magnetic sheet 60 are in opposite phases, thereby attenuating electromagnetic waves to be transmitted. There may be. In the magnetic sheet 60, rubber is used as the main material of the rubber-like base material 62. For example, silicone rubber can be used as the rubber.

(2) Description of Problems and Solutions by Providing Magnetic Sheet 60 Magnetic sheet 60 is mainly made of rubber as described above, and magnetic material such as magnetic material 64 or metal material is kneaded into rubber-like base material 62, for example. It is out. When the magnetic sheet 60 is used, gas is generated when the magnetic sheet 60 reaches a temperature of about 150 ° C., and the gas is released from the magnetic sheet 60. In the manufacturing process of the instrument 10, as described with reference to FIGS. 1 and 2, the IC tag 50 is stored in the hole 16 formed in the storage unit 12, and the opening-side surface 58 of the IC tag 50 and the first of the storage unit 12 are stored. A synthetic resin film 30 is formed on one surface 18 by electrostatic coating. For example, nylon, which is a material for forming the synthetic resin film 30, is heated to 200 ° C. or higher, and the heated atomized coating material forms an integral film on the opening-side surface 58 and the first surface 18. The temperature of the magnetic sheet 60 provided in the IC tag 50 rises to 150 ° C. or more, and gas is ejected from the rubber-like substrate 62 of the magnetic sheet 60. When the temperature of the magnetic sheet 60 reaches 150 ° C. or higher, the release of gas from the rubber-like base material 62 increases rapidly. For this reason, the internal pressure of the IC tag 50 rises abnormally. The walls of the first synthetic resin portion 52 and the second synthetic resin portion 54 that surround the inlay 70 and the magnetic sheet 60 cannot withstand the increase in the internal pressure. 2 The connecting surface of the synthetic resin portion 54 is broken.

  In order to prevent the release of gas from the magnetic sheet 60 in the process of forming the synthetic resin coating 30, in this embodiment, the magnetic sheet 60 is heated to about 200 ° C. in order to prevent degassing (so-called emptying) as described below. The magnetic sheet 60 is used after baking and degassing. The magnetic material 64 or iron powder that acts importantly in the magnetic sheet 60 is not deteriorated by the degassing process, and even after the rubber-like base material 62 releases the gas, from the viewpoint of the action of the magnetic sheet 60 described above. There is no problem.

6). Description of IC Tag 50 Manufacturing Procedure and IC Tag 50 Mounting Procedure (1) Description of Dropping Silicone Resin 68 and Protection of IC Chip 72 Manufacturing Procedure of IC Tag 50 and IC Tag 50 Using FIGS. The procedure regarding the attachment to the storage part 12 of the instrument 10 is demonstrated. FIGS. 6 and 7 are explanatory diagrams for explaining a procedure relating to protection of the IC chip 72 of the inlay 70, particularly protection of the connection portion between the lead portion 77 of the antenna winding portion 75 and the terminal of the IC chip 72. In Step 200 shown in FIG. 6, the second synthetic resin portion 54 is made by injection molding. As described above, the opening-side surface 58 of the second synthetic resin portion 54 is formed by synthetic electrostatic coating together with the first surface 18 of the storage portion 12 after the IC tag 50 is attached to the storage portion 12 of the instrument 10. Since the coating 30 is molded, it is necessary to reduce the electrical resistance value of the second synthetic resin portion 54. For example, it is more preferable that the synthetic resin portion 54 has a cross-sectional area of 1 square centimeter and a resistance value of 1 centimeter in length is 1 kΩ or less, preferably 100 Ω or less, and more preferably about 10 Ω. In this embodiment, PPS is used as the resin material of the second synthetic resin portion 54, and the resistance value is lowered as described above by mixing carbon fiber or graphite powder with this PPS.

  In the subsequent manufacturing procedure, carbon such as carbon fiber or graphite powder is used to reduce the linear thermal expansion coefficient of the first synthetic resin portion 52, which also uses PPS as a material, to the linear thermal expansion coefficient of the metal housing portion 12. However, more carbon is mixed in the second synthetic resin portion 54 than for adjusting the linear thermal expansion coefficient of the first synthetic resin portion 52, and it is integrated and uniform with the first surface 18 of the storage portion 12. A simple synthetic resin film 30 is formed on the opening-side surface 58.

  The second synthetic resin portion 54 made by injection molding has an opening-side surface 58. As described with reference to FIGS. 3A and 3B, the diameter of the opening-side surface 58 is the same. The shape is such that the diameter gradually decreases with increasing distance from the opening-side surface 58. As shown in FIGS. 6 to 9, in this embodiment, the second synthetic resin portion 54 has a large diameter portion 55, and the radius of the opening-side surface 58 is the largest in the large diameter portion 55, as shown in FIGS. 6 to 8. As described, the radius of the opening-side surface 58 is made larger by the length L3 than the radius of the opposite surface of the opening-side surface 58. Further, as the distance from the opening side surface 58 increases, the radius of the large diameter portion 55 of the opening side surface 58 gradually decreases, and the large diameter portion 55 ends at a position away from the opening side surface 58 by a predetermined distance. After the end of the large diameter portion 55, the radius of the second synthetic resin portion 54 is constant until reaching the opposite surface of the opening side surface 58.

  Since the outer peripheral surface of the second synthetic resin portion 54 is formed so that the increase in radius L3 at the large diameter portion 55 gradually decreases smoothly, when the IC tag 50 is inserted into the hole 16 of the storage portion 12 The insertion work is performed smoothly. In addition, it is possible to solve the problem that a large stress is generated between the hole 16 of the storage portion 12 and the outer periphery of the second synthetic resin portion 54 during the insertion operation, and the outer surface of the large diameter portion 55 is damaged. Further, it may be considered that the IC tag 50 is transported to another manufacturing factory after being manufactured, and is incorporated into the instrument 10 there. Thus, when the IC tag 50 is transported without being incorporated, if the large-diameter portion 55 of the second synthetic resin portion 54 has a shape that changes abruptly more than necessary, It becomes easy to be damaged by contact with each other. The present embodiment has a shape that can solve such a problem, and the inclination accompanying the change in the diameter of the large diameter portion 55 is 45 degrees or less. Further, if the inclination is 30 degrees or less, it is more preferable for solving the above problem.

  The second synthetic resin portion 54 made by injection molding is provided with a recess 56 for accommodating the inlay 70 and the magnetic sheet 60. In step 202, the first synthetic resin portion 52 is formed by the following injection molding. In order to alleviate the influence of the injection pressure at the time, a liquid silicone resin, in this embodiment, a liquid silicone rubber, is dropped at a position where the IC chip 72 of the inlay 70 is disposed. The dropped silicone resin 68 is raised due to surface tension. The supply amount of the silicone resin 68 is such that the silicone resin 68 is held between the IC chip 72 and the second synthetic resin portion 54 by surface tension as shown in the figure with the silicone resin 68 dropped on the inner surface 57 of the recess 56. The appropriate amount is appropriate. If the supply amount of the silicone resin 68 is large, the silicone resin 68 spreads in various directions due to the injection pressure when the first synthetic resin portion 52 is injection molded. For example, the adhesiveness of the joint portion between the second synthetic resin portion 54 and the first synthetic resin portion 52 is impaired by entering the joint surface between the second synthetic resin portion 54 and the first synthetic resin portion 52, and the like. There is a possibility of failure. Therefore, it is desirable to minimize the amount of silicone resin 68.

  Next, in step 204, as shown in FIG. 7, the inlay 70 is disposed inside the concave portion 56 of the second synthetic resin portion 54. The inlay 70 has an antenna 74 and an IC chip 72. The surface having the terminals of the IC chip 72 is disposed in the liquid silicone resin 68 portion, and the antenna coil constituting the antenna 74 has an opening-side surface 58. Are arranged so as to be arranged side by side. After the arrangement as shown in FIG. 7, the silicone resin 68 is cured by heating in step 206. The silicone resin 68 is made of, for example, silicone rubber, has elasticity even after being cured by heating, and has an effect of absorbing an impact. In step 204, since the silicone resin 68 is in a liquid state, the IC chip 72 can appropriately enter the silicone resin 68. Thereafter, in step 206, the silicone resin 68 is cured, so that the IC chip 72 has an appropriate elasticity. It will be in the state fixed by the cured silicone resin 68 which has property.

  The lead part 77 of the antenna 74 is connected to the terminal of the IC chip 72, and the connection part between the terminal of the IC chip 72 and the lead part 77 is mechanically fragile. In step 204, the terminal surface of the IC chip 72 is covered with the silicone resin 68, and then the silicone resin 68 is cured in step 206, whereby the terminal surface of the IC chip 72 is protected by the elastic silicone rubber. Become. With this structure, the terminal surface of the IC chip 72, particularly the connection portion of the terminal of the IC chip 72 can be protected from the pressure of the injection molding of the first synthetic resin portion 52. Further, the lead portion 77 is a thin wire that is easily deformed, and the stress applied to the connection portion of the terminal of the IC chip 72 via the lead portion 77 is greatly reduced.

(2) Description of Degassing Process of Magnetic Sheet and Arrangement of Degassed Magnetic Sheet 60 Next, the magnetic sheet 60 is disposed in the recess 56. As described above, the rubber-like substrate 62 is used as the main material. If the commercially available magnetic sheet is used as it is, for example, when the synthetic resin film 30 is formed, the rubber-like base material 62 is heated to 150 ° C. or more, and a large amount of gas is ejected. A commercially available magnetic sheet is heated and degassed in step 212 shown in FIG. 8 to generate the magnetic sheet 60, and the magnetic sheet 60 degassed in step 214 is placed in the recess 56 of the second synthetic resin portion 54. . The magnetic sheet 60 is arranged on the back side of the antenna 74 so as to be arranged with respect to the opening-side surface 58 and the antenna winding portion 75 of the antenna 74. By disposing the magnetic sheet 60 in this way, it is possible to reduce the failure of the metallic housing 12 with respect to transmission / reception between the antenna 74 and the external transmission / reception device 102.

(3) Description of procedure from formation of first synthetic resin portion 52 to formation of synthetic resin coating 30 First synthetic resin portion 52 is molded by injection molding in step 216 shown in FIG. A space 130 is formed by the mold 122 and the mold 124, and heat-melted resin is injected and injected into the space 130 from the passage 132. The material is PPS mixed with carbon fibers or carbon particles, and the heating temperature is about 150 ° C., for example. PPS is excellent in fluidity and adhesiveness as compared with other materials, but, like a general thermoplastic resin, the resin temperature is high because the resin temperature is maintained at 150 ° C. or less, and high-pressure filling is performed. For this reason, the resin injected into the space 130 from the passage 132 enters the concave portion 56 of the second synthetic resin portion 54 with high pressure. Since the IC chip 72 of the inlay 70 is held by the highly elastic silicone resin 68, the impact applied to the IC chip 72 is absorbed by the silicone resin 68, and the connection portion including the terminals of the IC chip 72, particularly the IC chip 72, is injected. Protected from pressure.

  Although it is expected that the silicone resin 68 will be crushed and spread widely due to the injection pressure, the amount of the silicone resin 68 is suppressed to a small value, so that there is an adverse effect such as staying in the recess 56 of the second synthetic resin portion 54. There is nothing.

  The antenna winding portion 75 of the inlay 70 is formed by winding a covered thin wire and has a structure in which stress is easily dispersed. Therefore, such a structure is difficult to cause damage due to injection molding. The antenna winding portion 75 may be slightly deformed by the injection pressure, but the arrangement relationship of the antenna winding portion 75 can maintain the arrangement state arranged with respect to the opening-side surface 58, which becomes an obstacle to transmission and reception. There is no. The magnetic sheet 60 may be slightly deformed by the injection pressure, but the arrangement state is similarly maintained with respect to the antenna 74 and the opening-side surface 58. Therefore, adverse effects on transmission / reception between the antenna 74 and the antenna 104 of the external transmission / reception apparatus 102 hardly occur.

  When the IC tag 50 is completed in step 216, the IC tag 50 is assembled in the hole 16 of the storage portion 12 in step 218, and the opening-side surface 58 is painted by electrostatic coating to open the first surface 18 of the storage portion 12 and the opening side of the IC tag 50. A synthetic resin coating 30 made of nylon that covers the surface 58 integrally and smoothly is formed. Since the diameter of the opening-side surface 58 of the second synthetic resin portion 54 is made larger than the others as shown in FIGS. 6 to 9, the IC tag 50 is incorporated into the hole 16 of the storage portion 12. After that, even if the years pass, the dent 32 as shown in FIG. Over the years, the smooth appearance of the synthetic resin film 30 that integrally covers the first surface 18 of the storage portion 12 and the opening-side surface 58 of the second synthetic resin portion 54 is maintained.

  In the present embodiment, the IC tag 50 is incorporated into the hole 16 of the instrument 10 after the IC tag 50 is completed, and the synthetic resin coating 30 is formed. However, after the IC tag 50 is completed, the IC tag 50 may be incorporated into the instrument 10 in another manufacturing process through a distribution process.

7). Explanation of the effects associated with the shape and configuration of the IC tag 50 Various effects have been described in the explanation of the embodiments. Further, effects based on the shape and the like of the IC tag 50 will be described.
(1) Effects of the external appearance of the IC tag 50 due to the circular structure As described above, the external appearance shape of the IC tag 50 in the radial direction is circular in this embodiment, and the hole 16 of the metal housing portion 12 into which the IC tag 50 is incorporated. The inner diameter is also circular. In order to form a synthetic resin film 30 that is integral and continuous with the first surface 18 of the storage portion 12 and the opening-side surface 58 of the second synthetic resin portion 54, the first surface 18 of the storage portion 12 and the second synthetic resin portion It is desirable that the opening side surface 58 of 54 is smoothly connected integrally at the meeting part. Moreover, it is desirable that this shape state is maintained even if it is used for a long time. By making the external appearance shape of the IC tag 50 in the radial direction and the outer periphery of the hole 16 of the storage portion 12 circular, partial concentration of stress between the outer periphery of the hole 16 and the outer surface of the IC tag 50 can be suppressed. Even when used for a long period of time, the shape relationship between the opening-side surface 58 and the first surface 18 is well maintained at the meeting portion. For this reason, the outer surface of the synthetic resin coating 30 is also maintained in a good state.

(2) Effect of a shallow shape in the depth direction and a wide shape in the radial direction The hole 16 formed in the housing portion 12 and the IC tag 50 incorporated in the hole 16 are shallow in the depth direction, and the hole is formed from the opening side surface 58 of the IC tag 50. The depth to the bottom surface of 16 is, for example, 5 mm or less. What is housed inside the first synthetic resin portion 52 and the second synthetic resin portion 54 is an inlay 70 and a magnetic sheet 60 in this embodiment, and the depth direction can be shortened in the configuration of this embodiment. In the present embodiment, the storage portion 12 is made of a metal material and is provided with the magnetic sheet 60. However, in order to reduce communication failure due to eddy current, it is desirable to arrange the inlay 70 as shallow as possible. With the structure shown in FIG. 2, the position of the inlay 70 can be made shallower.

  When incorporating the IC tag 50 into the instrument 10, it is natural that processing can be facilitated by making the mounting hole 16 shallow, but by reducing the length of the IC tag 50 in the depth direction, the IC in the depth direction can be reduced. The difference between the change in length due to the temperature change of the tag 50 and the change in length due to the depth direction of the metal storage portion 12 is reduced. As described above, it is desired to avoid as much as possible a step at the boundary surface between the opening-side surface 58 and the first surface 18. By reducing the deviation caused by the temperature change between the depth dimension of the IC tag 50 and the depth dimension of the hole 16 of the storage portion 12, the shift at the meeting portion between the first surface 18 and the opening side surface 58 is reduced, and the synthesis is performed. It becomes easy to be within the absorption range by the elasticity of the resin coating 30. Further, the stress on the synthetic resin coating 30 is reduced, and the durability is increased.

  Although the radial dimension of the IC tag 50 is larger than the depth direction, the actual diameter dimension is very small, for example, 15 mm or less. A resin-made IC tag 50 is incorporated in the metal housing portion 12, and when the radial dimension is increased, a failure due to a difference in material is likely to occur. For example, even if the difference in coefficient of linear thermal expansion is variously adjusted, the difference does not occur completely. On the other hand, the appliance 10 may be used for many years in a harsh natural environment. For this reason, when the dimension of the diameter of the IC tag 50 is increased, the change of the pressing state shown as the pressing P1 and the pressing P2 in FIG. 2 is increased, and smooth integration at the meeting portion of the opening side surface 58 and the first surface 18 is performed. Therefore, the dent 32 described in FIG. 3B is likely to occur.

  As another problem, when the synthetic resin film 30 is formed by electrostatic coating, the charged atomized paint moves along the electric field state, that is, the electric lines of force, between the surface to be coated and the paint spraying portion. As the area of the opening-side surface 58 to be applied increases, the coating state changes more greatly. For example, due to the influence of the electrical resistance of the second synthetic resin portion 54, the density of the electric field lines at the center of the opening-side surface 58 decreases and the synthetic resin coating 30 at the center of the opening-side surface 58 becomes thin. It becomes easy. Of course, such a change depends on the electric resistance of the second synthetic resin portion 54. For example, when the area of the opening-side surface 58 is increased, it is desirable to make the electric resistance of the second synthetic resin portion 54 smaller. The effect of differences due to In this embodiment, the outer shape of the IC tag 50 depends on the diameter of the antenna winding portion 75. The diameter of the antenna winding portion 75 is actually very small. If the IC tag 50 has a diameter of 15 mm, the antenna winding portion 75 can be sufficiently accommodated therein. Actually, the diameter of the IC tag 50 can be further reduced.

(3) Effect of storing the inlay 70 and the magnetic sheet 60 in the concave portion 56 of the second synthetic resin portion 54 having the opening-side surface 58 In this embodiment, the second synthetic resin portion 54 has the opening-side surface 58 on which the synthetic resin coating 30 is coated. A recess 56 is formed in the second synthetic resin portion 54, and the inlay 70 and the magnetic sheet 60 are accommodated in the recess 56. For this reason, the distance between the opening-side surface 58 and the antenna 74 of the inlay 70 can be shortened. The inlay 70 itself does not hold a power supply, but receives radio waves from the outside, exchanges information with the external transmission / reception apparatus 102 using the energy of the received radio waves, processes information, Store new information. Therefore, the distance that can be transmitted and received is short. In addition, although the magnetic sheet 60 is provided, the reception energy received by the antenna 74 rapidly decreases as the antenna 74 goes deeper into the hole 16 due to the influence of the metal housing portion 12. For this reason, it is desirable to arrange the antenna 74 close to the opening-side surface 58.

  The recess 56 formed in the second synthetic resin portion 54 has a depth dimension shorter than a radial dimension. As described above, the energy received by the antenna 74 of the magnetic sheet 60 is increased by shortening the depth dimension of the recess 56. On the other hand, the larger the radial dimension of the recess 56, the easier it is for electromagnetic waves from the outside to reach the antenna 74, and transmission / reception between the inlay 70 and the external transmission / reception device 102 becomes easier.

(4) Effect obtained by smoothly increasing the large-diameter portion 55 of the second synthetic resin portion 54 shown in FIGS. 6 to 9 As shown in FIGS. 6 to 9, the opening-side surface 58 of the second synthetic resin portion 54 The large-diameter portion 55 is formed so that the outer shape of the portion becomes large. The large-diameter portion 55 is for preventing the formation of the dent 32 shown in FIG. 3B as described above. In the present embodiment, the large-diameter portion 55 has a structure in which the bulge in the radial direction is smooth, that is, a structure that prevents the outer shape from increasing more rapidly, and the outer shape gradually increases. For example, the angle in the increasing direction of the large diameter portion 55 shown in FIG. 6 is an angle smaller than 45 degrees. When the IC tag 50 is assembled into the hole 16 of the storage unit 12 in step 218 shown in FIG. 9, the IC tag 50 is inserted from the side having a small outer shape, so that the IC tag 50 can be easily assembled. Furthermore, the angle in the increasing direction of the large diameter portion 55 is, for example, an angle smaller than 45 degrees, preferably an angle of 30 degrees or less, and the change from the pressure P2 to the pressure P1 shown in FIG. 2 is smoothly performed. For this reason, the outer peripheral portion of the opening-side surface 58 is hardly damaged. If the diameter of the outer peripheral portion of the opening side surface 58 is abruptly increased, there is a high possibility that the outer peripheral portion of the opening side surface 58 is damaged when the IC tag 50 is assembled.

8). Effects of covering the entire head of the instrument 10 with the synthetic resin coating 30 In this embodiment, the synthetic resin coating 30 is not limited to the opening side surface 58 and the first surface 18 of the IC tag 50 as shown in FIG. Covers the entire head of The synthetic resin film 30 is nylon in the present embodiment, and is resistant to ultraviolet rays and is less deteriorated even when the instrument 10 is used outdoors. The synthetic resin coating 30 made of nylon is excellent in wear resistance and excellent in impact resistance. By covering the entire head of the instrument 10 with the nylon coating having such excellent properties, the IC tag 50 is always protected during transportation of the instrument 10 or in use of the instrument 10. Furthermore, by providing the synthetic resin film 30 to the side surface of the head of the instrument 10 and further to the back side of the head, the synthetic resin film 30 is hardly peeled off. Further, the presence of the IC tag 50 becomes more difficult to understand from the appearance.

  When the instrument 10 is used in a harsh natural environment, it is desirable to make it less susceptible to salt damage as well as the weather. By coating the synthetic resin film 30 so as to reach the back side of the head of the instrument 10, the IC tag 50 can be more reliably protected from the influence of salt damage. In particular, nylon coating has little deterioration and is optimal for solving such problems. When the nylon coating is formed by electrostatic coating, the nylon coating is excellent in heat fusion with the surface to be coated, and the opening-side surface 58 of the second synthetic resin portion 54 having the IC tag 50 and the storage portion 12. It becomes easier to form a smooth and continuous protective film on the first surface 18, and there is an effect that it is possible to further improve the reliability of using the IC tag 50 for a long period of time.

  For example, since the instrument 10 in which the IC tag 50 is stored is attached to a place where a general person cannot approach, there may be a person who thinks that the fact that the IC tag 50 is stored in the instrument 10 is not affected at all. . However, the device 10 storing the IC tag 50 is not manufactured in a place where the general person cannot access, but various people touch the process of making and transporting the device 10 storing the IC tag 50 and the work site. There is a good chance that this will happen. For this reason, it is preferable that the IC tag 50 is not clearly stored in the instrument 10 even if the instrument 10 is finally used in a place where a person cannot enter.

  DESCRIPTION OF SYMBOLS 10 ... Instrument, 12 ... Storage part, 14 ... Screw part, 16 ... Hole, 18 ... First surface, 30 ... Synthetic resin film, 50 ... IC tag, 52 ... 1st synthetic resin part, 54 ... 2nd synthetic resin part, 55 ... Large diameter part, 56 ... Recessed part, 57 ... Inner surface, 58 ... Opening side surface, 60 ... Magnetic sheet, 62 ... rubber base, 64 ... magnetic material, 68 ... silicone resin, 70 ... inlay, 72 ... IC chip, 74 ... antenna, 75 ... Antenna winding part, 77 ... Lead part, 102 ... External transmission / reception device, 104 ... Antenna, 122 ... Mold, 124 ... Mold, 130 ... Space, 132 ... aisle.

Claims (5)

An IC tag stored in a hole formed in a metal storage portion of the instrument,
An inlay provided at a position to be disposed in the hole of the storage unit, and having an antenna and an IC chip;
A magnetic sheet provided at a position that is disposed further back than the inlay of the hole of the storage portion;
A first synthetic resin portion provided at a position arranged on the back side of the hole of the storage portion;
A second synthetic resin portion provided at a position arranged on the opening side of the hole of the storage portion,
An IC tag accommodated in an instrument, wherein the magnetic sheet is a degassed magnetic sheet. In the IC tag accommodated in the instrument according to claim 1,
The second synthetic resin portion has an opening side surface for forming a synthetic resin film made of a thermoplastic resin by electrostatic coating on the surface thereof at a position where the second synthetic resin portion is disposed on the opening side of the hole of the storage portion. Have
The IC tag housed in an instrument, wherein the second synthetic resin portion has a value of electrical resistance lower than that of the first synthetic resin portion. In the IC tag accommodated in the instrument according to claim 1 or 2,
The second synthetic resin portion has a shape in which the area of the opening-side surface of the second synthetic resin portion is larger than the cross-sectional area parallel to the opening-side surface at a position deeper than the opening-side surface. IC tag housed in a featured instrument. In the IC tag accommodated in the instrument according to any one of claims 1 to 3,
The second synthetic resin part has a recess formed on the opposite side of the opening side surface,
An IC tag accommodated in an instrument, wherein the inlay is disposed inside the recess, and a silicone resin is provided between a bottom surface of the recess and an inner surface of the inlay on the IC tag side. In the IC tag accommodated in the instrument according to claim 4,
The antenna of the inlay is made by forming a coated thin metal wire into a coil shape, and the IC chip is disposed inside the antenna formed in a coil shape and provided on the first surface of the IC chip. The antenna and the IC chip are connected at the connection terminals provided,
The concave portion formed in the second synthetic resin portion has a diameter larger than that of the coil shape of the antenna, and the coil-shaped antenna is formed on the bottom surface of the concave portion of the second synthetic resin portion. The IC chip is disposed so that the first surface of the IC chip faces the bottom surface, and the silicone is disposed between the first surface of the IC chip and the bottom surface of the recess. Rubber is provided,
The magnetic sheet degassed from the inlay of the concave portion of the second synthetic resin portion is disposed,
An IC tag accommodated in an instrument, wherein the first synthetic resin portion is made by injection molding.

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