JP2015189113A - Extrusion t-die apparatus having film width control function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an extrusion T-die apparatus capable of controlling a molten resin shape after discharge from a die and suppressing a shrinkage phenomenon in a film width direction.SOLUTION: An extrusion T-die apparatus extrudes a molten resin in a film-like shape. The extrusion T-die apparatus at least includes: an infrared radiation sensor that simultaneously measures the width of a molten resin film in a die width direction and the temperature distribution of the molten resin film after discharge from a T-die; and a control unit that controls a temperature inside the T-die referring to a measured value of the width of the molten resin film and a measured value of the temperature distribution of the molten resin film obtained by the infrared radiation sensor.

Description

  The present invention is an apparatus that makes it possible to control the width of a molten resin film after T-die discharge in an extrusion T-die apparatus intended to produce a resin film with an extrusion T-die apparatus.

  Conventionally, a resin film production line by extrusion is used to rotate a screw disposed in a heating cylinder to melt the resin, and supply the molten resin to an extrusion die such as a T die having a slit-shaped opening. A thin resin layer is applied onto a film-like substrate such as paper, metal foil, or resin, cooled and solidified with a roll, and the molded product is wound up by a winding device.

  In the resin film of this molded product, neck-in often occurs, resulting in problems such as poor quality and poor appearance. Neck-in is a phenomenon in which the film width is reduced because the molten resin film extruded from the T die is stretched between the T die extrusion port and the winding device. Neck-in occurs on the edge side of the film. When the width direction is reduced on the end side of the film, the thickness increases accordingly.

  If the thickness exceeds the product specification, the end portion is trimmed and discarded or recycled. For these reasons, neck-in is regarded as a problem as a factor that deteriorates production costs.

  Further, when the product is wound without trimming the end side, there is a problem that the product is wrinkled and the appearance is deteriorated.

  As a neck-in elimination method, the production cost can be suppressed by using an inexpensive raw material different from the original film on the end side of the film. For example, by using a T-die for extrusion molding in which different raw material supply ports are installed at the center and end side of the T die, the original material of the film is flowed to the center side of the T die, and the end side of the T die There is known a method of flowing a raw material different from the center side (for example, Patent Document 1 and Patent Document 2).

  There is also a method for controlling neck temperature distribution and suppressing neck-in (Patent Document 3).

  However, in the method of supplying an inexpensive raw material to the end side of the film using the T-die described in Patent Document 1 or Patent Document 2, the focus is on reducing the cost of the film end portion to be removed. However, the neck-in phenomenon and the edge bead phenomenon cannot be suppressed. For this reason, there has been a problem that the width of a film that can be used as a product is restricted. Further, in the method described in Patent Document 3, since the film temperature distribution after discharge is unknown, if the temperature in the die is too high, there is a possibility of causing a defect in the laminating process after discharge.

Japanese Patent No. 3449960 JP 2009-297945 A JP-A-8-080559

  The present invention has been made in view of the above-mentioned circumstances, and is to provide an extrusion T-die apparatus that enables neck-in to be controlled.

  Invention of Claim 1 of this invention is a manufacturing method of the functional element including the process of transferring ink on a to-be-printed body using printing relief printing, Comprising: After the process of transferring this ink, the said ink is used. A method for producing a functional element, comprising the step of exposing the printing material to a gas containing a vapor of a soluble solvent.

  Invention of Claim 2 of this invention is a manufacturing method of the functional element including the process of transferring ink on a to-be-printed body using printing relief printing, Comprising: The process of transferring this ink, and this transferred ink The method for producing a functional element includes a step of exposing the printing medium to a gas containing a vapor of a solvent capable of dissolving the ink after the step of drying the ink.

  The invention according to claim 3 of the present invention is the method for producing a functional element according to claim 1 or 2, wherein the functional element is an organic electroluminescence element.

  Invention of Claim 4 of this invention is a manufacturing apparatus of a functional element provided with the process of transferring ink on a to-be-printed body using a printing letterpress, Comprising: The gas containing the vapor | steam of the solvent which can dissolve the said ink A device for manufacturing a functional element, comprising means for transferring and placing the printing medium in a chamber filled with the above.

  According to the present invention, the length and temperature distribution in the die width direction (longitudinal direction) of the molten resin film in the vicinity of the discharge port at the tip of the die lip of the extrusion T-die device are measured, and the measurement data is fed back to the control device. It is possible to control neck-in by controlling the width of the molten resin film from after discharge until cooling and solidification while keeping the temperature distribution of the molten resin film within an allowable value range. Moreover, as a by-product effect of the present invention, there is a merit that the correlation between the molten resin film width and the molten resin film temperature distribution can be clarified.

It is an example of the form inside the extrusion T-die apparatus used for this invention. It is an example of the form of the apparatus used for this invention. It is a figure explaining the Example of this invention. It is a figure explaining the Example of this invention.

  Hereinafter, an extrusion T-die apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows an internal structure of a T die 2 that constitutes an extrusion T die apparatus 1 according to the present embodiment. The T die 2 is provided with a molten resin R1 supply port 2a at the top, and the supply port 2a is connected to an adapter (not shown) that supplies the molten resin R1. The T die 2 has a shape elongated in the width direction in accordance with the resin film to be molded. The manifold 3 is formed in a cylindrical shape over the width direction of the T die 2, and the supply port 2 a of the T die 2 is connected to the upper portion of the intermediate portion in the width direction. The lip land 4 is formed on the lower side of the manifold 3 over the width direction of the T die 2. The discharge port 5 is formed at the lower end portion of the T die 2 and is located at the lower end portion of the lip land 4.

Next, a method for forming a resin film by the extrusion T-die apparatus 1 will be described.
First, the molten resin R1 is supplied to the T die 2 from the supply port 2a. The molten resin R1 flows to the manifold 3, spreads in the width direction of the manifold 3, and flows to the lip land 4 below. And when molten resin R1 passes the lip land 4, it shape | molds in a film form. The molten resin R1 formed into a film in the lip land 4 is discharged from the discharge port 5 to become a molten resin film R2.

  The molten resin film R2 is rolled by the cooling roller 6 shown in FIG. 2 provided below (downstream side) the extrusion T-die apparatus 1, and the cooling roller 6 is rotated at a speed faster than the speed at which the resin film R2 is discharged. ing. The molten resin film R2 is not solidified when discharged from the discharge port 5. The molten resin film R2 is cooled and solidified at the same time as one surface is transferred to the substrate 7 on the cooling roller 6. The molten resin film R2 discharged from the discharge port 5 shrinks in the die longitudinal direction, and the end portion becomes thick. In the process after cooling and solidification, the thickened end portion is trimmed (removed) to provide a resin film having a uniform thickness.

Next, a measurement apparatus for molten resin temperature distribution and film width will be described.
An infrared radiation sensor 8 is installed as a measuring device between the discharge port 5 and the cooling roller 6. The infrared radiation sensor 8 is used for temperature measurement, and it is preferable to use a radiation thermometer having a line measurement function capable of measuring the width direction of the molten resin film at a time. Moreover, the measurement temperature range of the infrared radiation sensor 8 uses what can measure the temperature of the full width of the molten resin film between the discharge outlet 5 and the cooling roller 6. FIG.
In the case of resin, the infrared radiation sensor 8 uses a sensor having a measurement wavelength that matches the absorption wavelength band of the resin species (in the case of temperature measurement, an infrared sensor of 3.43 μm for polyethylene film and 8 μm for polyester film). Use). When measuring a multi-layer resin film, it is preferable to use a sensor that matches the wavelength of the surface-side resin.

Next, a feedback system for molten resin temperature distribution and film width data will be described.
The infrared radiation sensor 8 measures the length and temperature distribution in the film width direction of a predetermined portion of the molten resin film as needed. Data measured by the infrared radiation sensor 8 is sent to the control device 9 as a signal. The control device 9 determines whether or not the measured value has reached the target film width that has been input in advance. If the target film width has been reached, feedback continues. If the target film width has not been reached, the controller 9 issues an instruction to lower the set temperature to each of the heaters 10 provided in a plurality of locations in the die width direction corresponding to the width direction measurement position.

  In addition, the lower limit value of the film temperature distribution is input to the control device 9 in advance. The control device 9 refers to the measurement data of the film temperature distribution, and when the measurement data falls below the lower limit value, the control device 9 reduces the set temperature to the heater 10 even if the film width does not reach the target value. The instruction is stopped and a new instruction to raise the set temperature is issued so as to exceed the lower limit value of the molten resin film temperature distribution.

  The heater 10 may be a part of the manifold or may be configured to cover the entire apparatus including the die lip.

<Example>
A resin film was molded using the extrusion T-die apparatus shown in FIG. The resin used was a commercially available LDPE, which showed a viscosity of 300 (Pa · s) at a shear rate of 100 (l / s) as measured by a rotary E-type viscometer. The extrusion width of the molten resin from the T die is 150 mm. In the width direction of the T-die, five flat heaters are installed so as to be spread at equal intervals. The gap distance between the T die and the cooling roll was 100 mm, and the film width and temperature distribution in the middle (50 mm below the T die extrusion port) were measured in the width direction with an infrared radiation sensor. An infrared radiation sensor having a measurement temperature range of 30 to 300 ° C. and using elemental mercury cadmium telluride was used. The infrared radiation sensor is connected to the control device, and when the control device is turned on, the control device controls the five die heaters based on the measurement value of the infrared radiation sensor. The heater initial setting temperature and the melt film temperature measurement data when the control device is OFF are shown below.

  The melt film width at this time was 50 mm, and shrinkage (neck-in) of 100 mm occurred compared to the extrusion width of 150 mm.

  Next, the lower limit value of the molten resin film temperature distribution shown below was input to the control device.

  Further, the target molten resin film width was input as 150 mm, and the control device was operated as shown in FIG. The heater set temperature when the control device is operating and the molten resin film width / temperature distribution has settled to a steady state and the measurement data of the molten resin film temperature are shown below.

  The melted film width at this time was 80 mm, and the shrinkage of the film width was suppressed by 30 mm compared to when the control device was turned off.

DESCRIPTION OF SYMBOLS 1 ... Extrusion T-die apparatus 2 ... T-die 2a ... Supply port 3 ... Manifold 4 ... Lip land 5 ... Discharge port 6 ... Infrared radiation sensor 9 ... Control device DESCRIPTION OF SYMBOLS 10 ... Heater R1 ... Molten resin R2 ... Molten resin film A, B, C, D, E ... Heater position A ', B', C ', D', E 'in an Example ... Position of molten resin in the examples

Claims (2)

  In an extrusion T-die apparatus for extruding a molten resin into a film, an infrared radiation sensor that simultaneously measures the molten resin film width in the die width direction after the T-die discharge and the molten resin film temperature distribution, and the infrared radiation sensor An extrusion T-die apparatus comprising at least a control device that controls the temperature inside the T-die with reference to the measured value of the molten resin film width and the measured value of the molten resin film temperature distribution. When the target value of the molten resin film width and the allowable value range of the molten resin film temperature distribution are input and set in advance in the control device, and the measured value of the molten resin film width does not reach the target value, the molten resin film The extrusion T-die apparatus according to claim 1, wherein the temperature inside the T-die is controlled so that the temperature distribution falls within the allowable range set by input.