JP2015188147A - Waveguide and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a waveguide capable of transmitting an electromagnetic wave of a terahertz band without lowering transmission efficiency and being easily manufactured, and also to provide a method of manufacturing the same.SOLUTION: A waveguide 100 includes a laminate L2 composed of an outside metal layer 10, an insulation layer 20 and an inside metal layer 30. Bent parts F1, F2, F3 are provided in the laminate L2. The outside metal layer 10 is cylindrically bent along the bent parts F1, F2, F3 so that the inside metal layer 30 is disposed inside. In this case, the laminate L2 is held in the state bent integrally along the bent parts F1, F2, F3. One end and the other end of a laminate L2 are bonded to each other via an adhesive layer 40. As a result, a hollow waveguide 1 surrounded by the inside metal layer 30 is formed.

Description

  The present invention relates to a waveguide for transmitting an electromagnetic wave having a terahertz band, for example, a frequency of 0.05 THz to 10 THz, and a method for manufacturing the same.

  Terahertz communication using electromagnetic waves in the terahertz band is expected to be applied to various uses such as short-range ultrahigh-speed communication and uncompressed / delayed ultrahigh-definition video transmission. Waveguides are used to transmit terahertz band electromagnetic waves. The waveguide described in Patent Document 1 has a bendable bellows portion, and rectangular tube portions are provided at both ends of the bellows portion.

JP-A-6-326505

  The flexible waveguide of Patent Document 1 is designed to be usable in the 40 GHz band. In order to transmit electromagnetic waves in the terahertz band, it is necessary to make the cross-sectional dimension of the waveguide as extremely small as 1 mm or less. It is extremely difficult to manufacture the waveguide of Patent Document 1 with such dimensions.

  Further, in the waveguide of Patent Document 1, a dielectric is provided in the tube in order to increase the usable frequency band. However, when electromagnetic waves are transmitted through a dielectric, transmission efficiency is reduced due to dielectric loss.

  An object of the present invention is to provide a waveguide that can transmit a terahertz band electromagnetic wave and can be easily manufactured without reducing transmission efficiency, and a method for manufacturing the same.

  (1) A waveguide according to a first invention is a waveguide having a waveguide for transmitting an electromagnetic wave in a terahertz band, and includes a support layer, an insulating layer formed on one surface of the support layer, A conductive layer formed on one surface of the insulating layer, the support layer has higher rigidity than the insulating layer and the conductive layer, and the support layer is bent into a cylindrical shape so that the conductive layer is on the inside As a result, a waveguide surrounded by the conductive layer is formed.

  In this waveguide, an insulating layer is formed on one surface of the support layer, and a conductive layer is formed on one surface of the insulating layer. The support layer is bent into a cylindrical shape so that the conductive layer is on the inside, thereby forming a waveguide surrounded by the conductive layer.

  In this case, the shape and dimensions of the waveguide are maintained by the support layer having higher rigidity than the insulating layer and the conductive layer. Therefore, the shape and dimensions of the waveguide can be easily adjusted by adjusting the bending position and the bending angle of the support layer. Therefore, the dimension of the cross section of the waveguide can be easily set to an extremely small value. As a result, a waveguide capable of transmitting electromagnetic waves in the terahertz band can be easily manufactured.

  In addition, since a hollow waveguide surrounded by the conductive layer is formed, the dielectric loss tangent of the waveguide becomes equal to air. Therefore, a decrease in transmission efficiency due to dielectric loss is prevented.

  (2) A plurality of grooves extending in parallel in one direction may be formed on the other surface of the support layer, and the support layer may be bent along the plurality of grooves to form a waveguide.

  In this case, the support layer can be easily bent. Thereby, the cross section of the waveguide can be easily formed in a predetermined shape and size.

  (3) The support layer may be bent so as to form a rectangular shape on a surface perpendicular to one direction.

  In this case, a waveguide having a rectangular cross section is formed. Therefore, the electromagnetic wave in the terahertz band can be transmitted satisfactorily.

  (4) The support layer, the insulating layer, and the conductive layer each have an end face parallel to one direction, and at least one of the support layer, the insulating layer, and the conductive layer has an adhesive portion that extends parallel to the one direction, The end surfaces of the support layer, the insulating layer, and the conductive layer may be bonded to the bonding portion via the adhesive layer in a state where the support layer is bent so that the waveguide is formed.

  In this case, the shape of the bent support layer can be easily maintained.

(5) The electrical conductivity of the adhesive layer may be 10 ⁵ [S / m] or more.

  In this case, transmission loss of electromagnetic waves caused by the adhesive layer is reduced.

  (6) The support layer may be separated into a plurality of portions so as to be aligned in the direction in which the waveguide extends.

  In this case, the insulating layer and the conductive layer can be bent at the portion where the support layer is separated. This increases the flexibility of the waveguide. Therefore, the transmission direction of electromagnetic waves can be arbitrarily adjusted.

  (7) The insulating layer may be formed of a resin.

  In this case, the flexibility of the insulating layer can be increased. Thereby, the flexibility of the waveguide is improved, and the transmission direction of the electromagnetic wave can be easily adjusted.

  (8) A method for manufacturing a waveguide according to a second aspect of the present invention is a method for manufacturing a waveguide having a waveguide for transmitting electromagnetic waves in the terahertz band, and is lower than the support on one surface of the support layer. A step of forming a rigid insulating layer, a step of forming a conductive layer having rigidity lower than that of the support on one surface of the insulating layer, and a bending of the support layer into a cylindrical shape so that the conductive layer is on the inside. And a step of forming a waveguide surrounded by the conductive layer.

  In this manufacturing method, an insulating layer is formed on one surface of the support layer, and a conductive layer is formed on one surface of the insulating layer. The support layer is bent into a cylindrical shape so that the conductive layer is on the inside, thereby forming a waveguide surrounded by the conductive layer.

  In this case, the shape and dimensions of the waveguide are maintained by the support layer having higher rigidity than the insulating layer and the conductive layer. Therefore, the shape and dimensions of the waveguide can be easily adjusted by adjusting the bending position and the bending angle of the support layer. Therefore, the dimension of the cross section of the waveguide can be easily set to an extremely small value. As a result, a waveguide capable of transmitting electromagnetic waves in the terahertz band can be easily manufactured.

  In addition, since a hollow waveguide surrounded by the conductive layer is formed, the dielectric loss tangent of the waveguide becomes equal to air. Therefore, a decrease in transmission efficiency due to dielectric loss is prevented.

  According to the present invention, it is possible to easily manufacture a waveguide capable of transmitting electromagnetic waves in the terahertz band while preventing a decrease in transmission efficiency.

1 is an external perspective view of a waveguide according to a first embodiment of the present invention. It is sectional drawing of the waveguide of FIG. It is a figure which shows the manufacturing process of the waveguide of FIG. 1 and FIG. It is a figure which shows the manufacturing process of the waveguide of FIG. 1 and FIG. It is a figure which shows the manufacturing process of the waveguide of FIG. 1 and FIG. It is a figure which shows the manufacturing process of the waveguide of FIG. 1 and FIG. It is a figure for demonstrating the other bending example of a laminated body. It is an external appearance perspective view of the waveguide which concerns on the 2nd Embodiment of this invention. FIG. 9 is a schematic plan view of the waveguide of FIG. 8. It is a figure for demonstrating the manufacturing process of the waveguide of FIG. 8 and FIG. FIG. 3 is a cross-sectional view showing a modification of the waveguide of FIGS. 1 and 2. It is sectional drawing of the waveguide in other embodiment. It is sectional drawing of the waveguide which concerns on an Example. It is a figure which shows the simulation result in an Example. It is a figure which shows the simulation result in an Example.

  Hereinafter, a waveguide and a manufacturing method thereof according to an embodiment of the present invention will be described. In the following description, a frequency band of 0.05 THz to 10 THz is referred to as a terahertz band. The waveguide according to this embodiment can transmit an electromagnetic wave having at least a specific frequency within the terahertz band.

(A) First Embodiment (1) Configuration of Waveguide FIG. 1 is an external perspective view of a waveguide according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the waveguide of FIG. As shown in FIGS. 1 and 2, the waveguide 100 is a cylindrical body having a rectangular cross section, and a waveguide 1 through which electromagnetic waves are transmitted is formed in a space surrounded by the cylindrical body. The waveguide 100 includes a laminated body L2 composed of the outer metal layer 10, the insulating layer 20, and the inner metal layer 30.

  The outer metal layer 10 is made of, for example, stainless steel, the insulating layer 20 is made of, for example, polyimide, and the inner metal layer 30 is made of, for example, copper. An insulating layer 20 is formed on one surface of the outer metal layer 10, and an inner metal layer 30 is formed on one surface of the insulating layer 20. As shown in FIG. 2, the laminated body L2 is provided with bent portions F1, F2, and F3. The outer metal layer 10 is bent into a cylindrical shape along the bent portions F1, F2, and F3 so that the inner metal layer 30 is on the inner side. In this case, the stacked body L2 is held in a state of being integrally bent along the bent portions F1, F2, and F3. One end and the other end of the laminate L2 are bonded to each other via the adhesive layer 40. Thereby, the hollow waveguide 1 surrounded by the inner metal layer 30 is formed.

(2) Manufacturing Method of Waveguide A manufacturing method of the waveguide 100 of FIG. 1 will be described. 3 to 7 are views showing a manufacturing process of the waveguide 100 of FIG. 3 (a), 4 (a) and 5 (a) are plan views of the waveguide 100 in the manufacturing process. 3 (b), FIG. 4 (b), and FIG. 5 (b), FIG. 3 (a), FIG. 4 (a) and FIG. And A3-A3 line cross sections are shown respectively.

  As shown in FIG. 3, by forming an insulating layer 20 made of, for example, polyimide on one surface (the lower surface in FIG. 4) made of, for example, stainless steel, a long laminate L1 is formed. The The insulating layer 20 is formed by lamination or application, for example. The thickness t1 of the outer metal layer 10 is preferably 20 μm or more and 100 μm or less, for example. The thickness t2 of the insulating layer 20 is preferably 1 μm or more and 1000 μm or less, for example.

  The outer metal layer 10 is made of a material that has higher rigidity than the insulating layer 20 and the inner metal layer 30 and can be bent. The material of the outer metal layer 10 is not limited to stainless steel, but may be another metal such as aluminum (Al) or an alloy such as an aluminum alloy. The material of the insulating layer 20 is not limited to polyimide, but may be other resin materials such as epoxy.

  Next, as shown in FIG. 4, a plurality (three in this example) of groove portions C are formed on the surface of the outer metal layer 10 opposite to the insulating layer 20 (upper surface in FIG. 4) by, for example, half etching. Half etching can be performed, for example, by wet etching using a photoresist mask having a predetermined pattern and an iron chloride solution. The plurality of groove portions C are formed at positions corresponding to the bent portions F1, F2, and F3 in FIG. Instead of half etching, a plurality of grooves C may be formed by mechanical processing using, for example, a YAG (yttrium, aluminum, garnet) laser.

  Next, as illustrated in FIG. 5, an inner metal layer 30 made of, for example, copper is formed on one surface (the lower surface in FIG. 5) of the insulating layer 20, thereby forming the stacked body L <b> 2. The inner metal layer 30 is formed by vapor deposition, for example. The thickness t3 of the inner metal layer 30 is preferably not less than 0.2 μm and not more than 1000 μm, for example. The thickness t3 of the inner metal layer 30 is preferably equal to or greater than the thickness at which electromagnetic waves concentrate due to the skin effect. The material of the inner metal layer 30 is not limited to copper, but may be another metal such as gold (Au) or aluminum, an alloy such as a copper alloy or an aluminum alloy, or another conductive material.

  As shown in FIG. 6, the outer metal layer 10 is bent along the bent portions F1 to F3 so that the inner metal layer 30 is on the inner side. The bending angle of the outer metal layer 10 at each of the bent portions F1 to F3 is approximately 90 °. In this state, one end and the other end of the laminate L2 are bonded to each other by the adhesive layer 40. In this example, the end surfaces of the outer metal layer 10, the insulating layer 20, and the inner metal layer 30 at one end of the laminate L2 are bonded to one surface of the inner metal layer 30 at the other end of the laminate L2. In this case, one surface of the inner metal layer 30 at the other end of the multilayer body L2 corresponds to an adhesive portion.

The adhesive layer 40 preferably has conductivity. The conductivity of the adhesive layer 40 is preferably 10 ³ [S / m] or more, and more preferably 10 ⁵ [S / m] or more. As a material for the adhesive layer 40, for example, a pressure-sensitive adhesive containing a conductive filler is used.

  Thereby, the waveguide 100 of FIG. 1 and FIG. 2 is completed. The dimension in the width direction inside the waveguide 100 (the dimension in the width direction of the waveguide 1) D1 (FIG. 2) is preferably 30 μm or more and 5700 μm or less. The dimension in the thickness direction inside the waveguide 100 (the dimension in the thickness direction of the waveguide 1) D2 (FIG. 2) is preferably 30 μm or more and 5700 μm or less.

(3) Other bending examples The bending position of the outer metal layer 10 is not limited to the above example. FIG. 7 is a view for explaining another bending example of the outer metal layer 10. Regarding the example of FIG. 7, differences from the example of FIGS. 1 and 2 will be described. In the example of FIG. 7, the outer metal layer 10 is bent along the bent portions F1a, F2a, F3a, and F4a so that the inner metal layer 30 is on the inner side. The bending angle of the outer metal layer 10 in each of the bent portions F1a to F4a is approximately 90 °. In this state, one end surface and the other end surface of the outer metal layer 10, the insulating layer 20, and the inner metal layer 30 are bonded to each other by the adhesive layer 40. In this case, the other end surfaces of the outer metal layer 10, the insulating layer 20, and the inner metal layer 30 correspond to the bonding portion.

(4) Effect In the first embodiment, the laminated body L2 including the outer metal layer 10, the insulating layer 20, and the inner metal layer 30 is formed, and the outer metal layer 10 is cylindrical so that the inner metal layer 30 is on the inner side. The waveguide 1 surrounded by the inner metal layer 30 is formed by being bent into a shape. In this case, the shape and dimensions of the waveguide 1 are maintained by the outer metal layer 10 having higher rigidity than the insulating layer 20 and the inner metal layer 30. Therefore, the shape and dimension of the waveguide 1 can be easily adjusted by adjusting the bending position and the bending angle of the outer metal layer 10. Therefore, the dimension of the cross section of the waveguide 1 can be easily set to an extremely small value. As a result, the waveguide 100 capable of transmitting electromagnetic waves in the terahertz band can be easily manufactured.

  In the present embodiment, a plurality of groove portions C are formed on the other surface of the outer metal layer 10, and the outer metal layer 10 is bent along the plurality of groove portions C. Thereby, the outer side metal layer 10 can be bent easily. Thereby, the cross section of the waveguide 1 can be easily formed in a predetermined shape and size.

  Moreover, in this Embodiment, the one end part and other end part of the laminated body L2 are mutually adhere | attached through the adhesive bond layer 40 which has electroconductivity. Thereby, the shape of the laminated body L2 can be easily maintained, suppressing the increase in the transmission loss of the electromagnetic waves resulting from the adhesive bond layer 40.

(B) Second Embodiment (1) Configuration of Waveguide FIG. 8 is an external perspective view of a waveguide according to a second embodiment of the present invention. FIG. 9 is a schematic plan view of the waveguide of FIG. The difference between the waveguide 100a of FIGS. 8 and 9 from the waveguide 100 of FIGS. 1 and 2 will be described.

  In the waveguide 100a according to the present embodiment, a plurality of slits SL are formed in the outer metal layer 10, whereby the outer metal layer 10 is separated into a plurality of regions 10a. Each slit SL is formed along a plane perpendicular to a direction DR in which the waveguide 1 extends (hereinafter referred to as a waveguide direction) DR. In the present example, the plurality of slits SL have the same width and are formed at equal intervals in the waveguide direction DR. Thereby, the plurality of regions 10a have the same width in the waveguide direction DR and are arranged at equal intervals.

(2) Manufacturing Method of Waveguide The difference between the manufacturing process of the waveguide 100a of FIGS. 8 and 9 from the example of FIGS. FIG. 10 is a diagram for explaining a manufacturing process of the waveguide 100a of FIGS. FIG. 10A is a plan view of the waveguide 100a in the manufacturing process. FIG. 10B shows a cross section taken along line A4-A4 of FIG. 10A, and FIG. 10C shows a cross section taken along line A5-A5 of FIG. 10A.

  First, as in the steps of FIGS. 3 and 4, the insulating layer 20 is formed on one surface of the outer metal layer 10, and a plurality of grooves C are formed on the other surface of the outer metal layer 10. Subsequently, as shown in FIG. 10, a plurality of slits SL are formed in the outer metal layer 10 perpendicularly to the groove C and at equal intervals. Thereby, the outer metal layer 10 is separated into a plurality of regions 10a. The plurality of slits SL may be formed by half-etching similarly to the groove C, or may be formed by mechanical processing using a YAG laser or the like.

  The width of each slit SL is preferably 100 μm or more and 10,000 μm or less. The interval between adjacent slits SL is preferably 50 μm or more and 1000 μm or less.

  Thereafter, as in the steps of FIGS. 5 and 6, the inner metal layer 30 is formed on one surface of the insulating layer 20, the outer metal layer 10 is bent along the bent portions F1 to F3, and the laminate L2. One end portion and the other end portion of each are bonded to each other by the adhesive layer 40. Thereby, the waveguide 100a of FIGS. 8 and 9 is completed.

  In addition, the bending position of the outer metal layer 10 is not limited to the example of FIG. 8 and FIG. The outer metal layer 10 may be bent as in the example of FIG. 7, or the outer metal layer 10 may be bent at other positions.

(3) Effect Also in the second embodiment, the waveguide 1 surrounded by the inner metal layer 30 is formed by bending the outer metal layer 10 as in the first embodiment. . Therefore, the shape and dimension of the waveguide 1 can be easily adjusted by adjusting the bending position and the bending angle of the outer metal layer 10. Therefore, the dimension of the cross section of the waveguide 1 can be easily set to an extremely small value. As a result, the waveguide 100a capable of transmitting electromagnetic waves in the terahertz band can be easily manufactured.

  In the present embodiment, the outer metal layer 10 is separated into a plurality of regions 10a, so that the waveguide 100a can be bent easily. Thereby, the transmission direction of electromagnetic waves can be adjusted arbitrarily.

(4) Other examples of slits In the example of FIGS. 8 and 9, the plurality of slits SL are formed along the plane perpendicular to the waveguide direction DR and at equal intervals. The angle is not limited to this. If the waveguide 100a can be bent in a desired direction, the plurality of slits SL may be formed along a surface inclined with respect to the waveguide direction DR, or spiral around the waveguide direction DR. May be formed. Further, the interval between the slits SL may not be constant.

(C) Other Modifications FIGS. 11 and 12 are cross-sectional views showing modifications of the waveguide 100. The waveguide 100a shown in FIGS. 8 and 9 can be modified similarly to the example shown in FIG. 11 or FIG.

  In the waveguide 100 of FIG. 11, both end surfaces of the laminated body L2 are provided so as to be inclined toward the center. In this case, the one end surface and the other end surface of the outer metal layer 10, the insulating layer 20, and the inner metal layer 30 can be easily bonded.

  In the example of FIG. 12A, the waveguide 100 has a triangular cross section. In this case, the outer metal layer 10 is bent along the bent portions F <b> 1 b and F <b> 2 b, and one end and the other end of the stacked body L <b> 2 are bonded via the adhesive layer 40. In the example of FIG. 12B, the waveguide 100 has a pentagonal cross section. In this case, the outer metal layer 10 is bent along the bent portions F1c, F2c, F3c, and F4c, and one end and the other end of the multilayer body L2 are bonded via the adhesive layer 40. In the example of FIG. 12C, the waveguide 100 has a circular cross section. In this case, the outer metal layer 10 is bent into a circular shape, and one end and the other end of the multilayer body L <b> 2 are bonded via the adhesive layer 40.

  Thus, the waveguides 100 and 100a may have a polygonal cross section other than a rectangle, or may have a circular cross section, or may have a cross section of another shape.

  Moreover, in the said embodiment, although the groove part C is formed in the position of the outer side metal layer 10 corresponding to a bending part, this invention is not limited to this. If the outer metal layer 10 can be bent, a perforation may be formed at a position corresponding to the bent portion instead of the groove portion, or only a mark by ink or the like may be attached, or whatever May not be provided.

  Moreover, in the said embodiment, although the one end part and other end part of the laminated body L2 are adhere | attached through the adhesive bond layer 40, the shape of the laminated body L2 is hold | maintained, but this invention is not limited to this. . The one end part and the other end part of the laminated body L2 may be joined by other methods such as fusion. Moreover, if the shape of the laminated body L2 can be maintained, the laminated body L2 may not be bonded and bonded in a state where the outer metal layer 10 is bent.

(D) Correspondence between each component of claim and each part of embodiment The following describes an example of a correspondence between each component of the claim and each part of the embodiment. It is not limited.

  In the above embodiment, the outer metal layer 10 is an example of a support layer, the insulating layer 20 is an example of an insulating layer, the inner metal layer 30 is an example of a conductive layer, and the waveguide 1 is an example of a waveguide. It is.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

(E) Examples The presence / absence of the adhesive layer 40 and the relationship between the conductivity level and the transmission efficiency of electromagnetic waves were analyzed by simulation. FIG. 13 is a cross-sectional view of the waveguide 100 according to the embodiment. FIG. 13A illustrates the waveguide 100 according to the first to fifth embodiments, and FIG. 13B illustrates the waveguide 100 according to the sixth embodiment.

As illustrated in FIG. 13A, the waveguide 100 according to the first to fifth embodiments has the same configuration as the waveguide 100 illustrated in FIGS. 1 and 2. The thickness t1 of the outer metal layer 10 was 50 μm, the thickness t2 of the insulating layer 20 was 25 μm, and the thickness t3 of the inner metal layer 30 was 16 μm. Further, the dimension D1 in the width direction of the waveguide 1 was set to 864 μm, and the dimension D2 in the thickness direction of the waveguide 1 was set to 432 μm. The material of the outer metal layer 10 was stainless steel, and the electrical conductivity was 1.1 × 10 ⁶ [S / m]. The material of the inner metal layer 30 was copper, and its conductivity was 5.9 × 10 ⁷ [S / m].

The conductivity of the adhesive layer 40 in Example 1 is 10 ³ [S / m], the conductivity of the adhesive layer 40 in Example 2 is 10 ⁴ [S / m], and the adhesive layer 40 in Example 3 is used. conductivity of the ¹⁰ 5 [S / m], the conductivity of the adhesive layer 40 in example 4 and ¹⁰ 6 [S / m], the conductivity of the adhesive layer 40 in example 5 ¹⁰ 7 [S / M].

  As shown in FIG. 13B, in Example 6, the adhesive layer 40 is not provided, and the outer metal layer 10, the insulating layer 20, and the inner metal layer 30 are each provided in an endless cylindrical shape. Except for these points, the waveguide 100 according to the sixth embodiment has the same configuration as the waveguide 100 of the first to fifth embodiments. The configuration of the sixth embodiment is a virtual configuration on simulation.

  In the waveguide 100 of Examples 1 to 6, the transmission characteristics when the terahertz band electromagnetic wave was transmitted were obtained by simulation. 14 and 15 are diagrams showing simulation results in Examples 1 to 6. FIG. In FIG. 14, the horizontal axis represents the frequency [THz] of the electromagnetic wave, and the vertical axis represents the transmission loss [dB / mm]. In FIG. 15, the horizontal axis indicates the conductivity [S / m] of the adhesive layer 40, and the vertical axis indicates the transmission loss [dB / mm].

As shown in FIG. 14 and FIG. 15, it was found that the higher the conductivity of the adhesive layer 40, the smaller the transmission loss. In Example 4 and Example 5 in which the electrical conductivity of the adhesive layer 40 is 10 ⁶ [S / m] or more, it can be seen that the transmission loss is substantially the same as in Example 6 in which the adhesive layer 40 is not provided. It was.

As shown in FIG. 15, when the frequency of the electromagnetic wave is low, the difference in the transmission loss of the electromagnetic wave due to the difference in the conductivity of the adhesive layer 40 is large. In Examples 3 to 5 in which the conductivity of the adhesive layer 40 is 10 ⁵ [S / m] or more, the adhesive layer is used even when the frequency of the electromagnetic wave is 0.22 [THz] or 0.25 [THz]. The difference in transmission loss with the sixth embodiment in which 40 is not provided is small. Therefore, it was found that the electrical conductivity of the adhesive layer 40 is preferably 10 ⁵ [S / m] or more.

  The present invention can be used for transmission of electromagnetic waves having a frequency in the terahertz band.

DESCRIPTION OF SYMBOLS 1 Waveguide 10 Outer metal layer 20 Insulating layer 30 Inner metal layer 40 Adhesive layer 100 Waveguide C Groove part SL Slit

Claims (8)

A waveguide having a waveguide for transmitting electromagnetic waves in the terahertz band,
A support layer;
An insulating layer formed on one surface of the support layer;
A conductive layer formed on one surface of the insulating layer,
The support layer has higher rigidity than the insulating layer and the conductive layer,
A waveguide in which the waveguide surrounded by the conductive layer is formed by bending the support layer into a cylindrical shape so that the conductive layer is on the inside. A plurality of grooves extending in parallel in one direction are formed on the other surface of the support layer,
The waveguide according to claim 1, wherein the waveguide is formed by bending the support layer along the plurality of grooves. The waveguide according to claim 2, wherein the support layer is bent so as to form a rectangular shape on a plane perpendicular to the one direction. The support layer, the insulating layer, and the conductive layer each have an end face parallel to one direction,
At least one of the support layer, the insulating layer, and the conductive layer has an adhesive portion extending in parallel with the one direction;
In a state where the support layer is bent so that the waveguide is formed, the end surfaces of the support layer, the insulating layer, and the conductive layer are bonded to the bonding portion via an adhesive layer. The waveguide according to any one of claims 1 to 3. The waveguide according to claim 4, wherein the adhesive layer has a conductivity of 10 ⁵ [S / m] or more. The waveguide according to any one of claims 1 to 5, wherein the support layer is separated into a plurality of portions so as to be aligned in a direction in which the waveguide extends. The waveguide according to any one of claims 1 to 6, wherein the insulating layer is formed of a resin. A method of manufacturing a waveguide having a waveguide for transmitting electromagnetic waves in a terahertz band,
Forming an insulating layer having rigidity lower than that of the support on one surface of the support layer;
Forming a conductive layer having a lower rigidity than the support on one surface of the insulating layer;
Forming the waveguide surrounded by the conductive layer by bending the support layer into a cylindrical shape so that the conductive layer is on the inside.

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